Semiconductor humidity control device and battery pack including the same

Abstract

The present application relates to a semiconductor dehumidification device, a semiconductor wafer, a condensing member, a heat dissipating member, a condensed water collecting device and a controller, which are configured to: control a current to flow through the semiconductor wafer in a first direction to make the semiconductor dehumidification device enter a dehumidification mode in which water vapor in ambient air is condensed and collected in the condensed water collecting device when humidity in an external environment where a device housing is located is higher than a first humidity threshold value and / or a difference between an actual temperature and a dew point temperature is lower than a first temperature difference threshold value; and control the current to flow through the semiconductor wafer in a second direction to make the semiconductor dehumidification device enter a dehumidification mode in which condensed water is heated to be vaporized and discharged out of the device housing and further out of an external environment via a vent when humidity in the external environment where the device housing is located is lower than a second humidity threshold value and / or the difference between the actual temperature and the dew point temperature is higher than a second temperature difference threshold value. The present application also relates to a battery pack comprising the semiconductor dehumidification device.

Description

Technical Field

[0001] This invention relates to the field of humidity control devices, and more specifically, to a semiconductor humidity control device for humidity control within a battery pack and a battery pack including the semiconductor humidity control device, particularly for battery packs used in pure electric vehicles. Background Technology

[0002] Condensation in battery packs, especially those of battery electric vehicles (BEVs), is a common problem faced by all original equipment manufacturers (OEMs). In low-latitude regions like Guangzhou, relative humidity and cloud cover can reach 90% or higher in summer. Moist air exchanges with the air inside the battery pack through vents, eventually filling the pack with the same humid air. When the weather is hot, the internal cooling system of the battery pack activates to maintain optimal battery performance, especially during fast charging. Water-cooling systems often operate at high power to ensure the power output of fast charging. These measurements create safe conditions for the battery, but if the surface temperature of the battery or cooling plates cools to the dew point under high ambient humidity, the risk of condensation can still arise.

[0003] Once moisture in the air condenses on copper rods or any electronic or electrical equipment, it affects the creepage distance, leading to safety issues or interfering with normal battery operation. To avoid condensation, a common solution is to reduce or decrease cooling power so that the battery temperature doesn't drop below the dew point. However, this strategy also limits charging power, so drivers need to spend more time charging their vehicles. Another solution is to place a humidity-regulating sheet inside the battery pack. Made from natural plant fibers and polymer materials, this sheet is designed to balance humidity; it absorbs moisture from the air in high-humidity environments and desorbs it when the ambient humidity falls below its design equilibrium value. These humidity-regulating sheets are widely used by battery suppliers like CATL, but they also face challenges due to their short lifespan of only 5-6 years. Summary of the Invention

[0004] The purpose of this invention is to address some or all of the aforementioned defects and / or other deficiencies in the prior art. In particular, this invention provides a semiconductor dehumidification device and a battery pack including the semiconductor dehumidification device. This semiconductor dehumidification device is particularly suitable for dehumidification within battery packs and has a long service life.

[0005] Therefore, according to one aspect of the present invention, a semiconductor humidity control device is provided, comprising:

[0006] The device housing has a vent and a heat dissipation opening;

[0007] A semiconductor wafer disposed within the device housing has a first side and a second side opposite to the first side, wherein the semiconductor wafer is configured such that when current flows through it in a first direction, its first side forms a cold end and its second side forms a hot end, and when current flows through it in a second direction opposite to the first direction, its first side forms a hot end and its second side forms a cold end.

[0008] A condenser is disposed within the housing of the device and is thermally attached to a first side of the semiconductor wafer, such that water vapor in the ambient air can condense on the condenser when the first side acts as a cold end.

[0009] A heat sink, at least partially disposed within the device housing, is thermally attached to a second side of the semiconductor wafer, wherein the heat sink can release heat to the outside of the device housing via the heat dissipation opening;

[0010] A condensate collection device disposed within the housing of the device, which communicates with the condenser element to receive condensate from the condenser element, wherein the positions of the condensate collection device and the condenser element are determined such that the condenser element can transfer heat with the condensate collected in the condensate collection device to vaporize the condensate; and

[0011] The controller is configured to: when the humidity in the external environment where the device housing is located is higher than a first humidity threshold and / or the difference between the actual temperature and the dew point temperature is lower than a first temperature difference threshold, control current flows through the semiconductor chip in the first direction, so that the semiconductor dehumidification device enters a dehumidification mode in which water vapor in the ambient air is condensed and collected in the condensate collection device; and when the humidity in the external environment where the device housing is located is lower than a second humidity threshold and / or the difference between the actual temperature and the dew point temperature is higher than a second temperature difference threshold, control current flows through the semiconductor chip in the second direction, so that the semiconductor dehumidification device enters a dehumidification mode in which the condensate is heated and vaporized, discharged from the device housing through the vent, and then discharged from the external environment through the vent structure of the external environment.

[0012] Preferably, the condensate collection device includes a collection container and a regenerable moisture-absorbing material located within the collection container, the moisture-absorbing material being selected to absorb the condensate in the dehumidification mode and to release the condensate as water vapor in the dehumidification mode.

[0013] Preferably, the semiconductor wafer, the heat sink, the condenser, and the condensate collection device are all arranged vertically, and the condensate collection device is connected to the condenser near its lower end. The condenser includes: a U-shaped plate comprising a middle plate and two end plates at its lateral ends, the two end plates extending in a direction away from the semiconductor wafer; the middle plate having a first side attached to a first side of the semiconductor wafer and a second side opposite to the first side; and a guide portion disposed on the second side of the middle plate, the guide portion being configured to guide condensate on the condenser toward the lower end and thus toward the condensate collection device.

[0014] Preferably, the flow guide includes a plurality of ridges extending from the second side of the intermediate plate in a direction away from the first side. The plurality of ridges extend vertically between the lower end and the upper end parallel to the two end plates and are laterally spaced from each other, such that the plurality of ridges together with the two end plates form a fin-like structure.

[0015] Preferably, the collection container includes a rectangular bottom, U-shaped sidewalls extending vertically upward from three adjacent sides of the rectangular bottom, and a plurality of rectangular strips extending parallel to the rectangular bottom from the middle wall of the U-shaped sidewalls toward their opposite sides near the top. The plurality of rectangular strips are distributed along the length of the middle wall defined by the two end walls of the U-shaped sidewalls and are spaced apart from each other, thereby forming a grid-like structure at the top of the collection container. The condenser and the condensate collection device are arranged to be embedded within each other, with the condenser integrally resting on the condensate collection device. The U-shaped plate is placed on the rectangular bottom, and each end plate of the U-shaped plate overlaps with a corresponding end wall of the U-shaped sidewall, such that the U-shaped plate and the U-shaped sidewall together define a cylindrical sidewall with a generally rectangular cross-section, wherein the plurality of rectangular bars of the grid-like structure and the plurality of ridges of the fin-like structure are arranged alternately such that each rectangular bar is inserted between two adjacent ridges, wherein there is a gap between each rectangular bar and each adjacent ridge, the gap allowing condensate and water vapor to enter and exit the interior of the collection container, but preventing the passage of the moisture-absorbing material in the collection container.

[0016] Preferably, the semiconductor humidity control device further includes at least one of the following: a fan located within the device housing between the vent and the condenser; a temperature sensor attached to a first side of the condenser for detecting the temperature of the condenser surface; and a temperature and humidity sensor disposed outside the device housing.

[0017] Preferably, the controller is further configured to calculate the dew point temperature in the external environment based on the temperature and humidity measurements received from the temperature and humidity sensor, and to calculate the difference between the dew point temperature and the actual temperature in real time.

[0018] Preferably, the controller includes a main control module and a power control module communicatively connected to the main control module, wherein the controller is further configured to enable the main control module to establish a temperature and humidity correlation model based on temperature and humidity measurements received from the temperature and humidity sensor in the external environment and temperature measurements received from the temperature sensor on the surface of the condenser, and to enable the power control module to control the power of the semiconductor chip and thus the temperature of the condenser surface in a closed loop based on the temperature and humidity correlation model.

[0019] Preferably, the controller is further configured to enable the power control module to control the power of the fan motor in an open-loop manner based on the temperature and humidity correlation model.

[0020] Preferably, the first humidity threshold is 70%, more preferably 50%.

[0021] Preferably, the first temperature difference threshold is 5°C.

[0022] Preferably, the second humidity threshold is 35%.

[0023] Preferably, the second temperature difference threshold is 15°C.

[0024] According to another aspect of the present invention, a battery pack is provided, comprising: a battery pack housing having a vent valve on at least a portion thereof that allows gas but prevents liquid and solid from entering or exiting the battery pack housing; a battery management system located within the battery pack housing; a battery module; and the aforementioned semiconductor humidity control device located within the battery pack housing.

[0025] The semiconductor humidity control device and the battery pack including the semiconductor humidity control device of the present invention can achieve the following technical effects:

[0026] When the humidity in the external environment where the housing is located, such as the battery pack, is higher than a first humidity threshold and / or the difference between the actual temperature and the dew point temperature is lower than a first temperature difference threshold, current flows through the semiconductor chip in the first direction to put the semiconductor humidity control device into dehumidification mode. And when the humidity in the external environment where the housing is located is lower than a second humidity threshold and / or the difference between the actual temperature and the dew point temperature is higher than a second temperature difference threshold, current flows through the semiconductor chip in the opposite second direction to put the semiconductor humidity control device into dehumidification mode. The condensate stored in the condensate collection device is then discharged out of the housing in the form of water vapor through the vent of the device housing and then discharged out of the battery pack through, for example, the vent valve on the battery pack housing, thereby achieving a dehumidification effect on the external environment where the semiconductor humidity control device is located, such as the battery pack.

[0027] Furthermore, since the condensate collected by the condensate collection device has already been discharged in the form of water vapor in the dehumidification mode, the condensate collection device can be repeatedly regenerated and continue to collect condensate in the next dehumidification mode, which greatly extends the service life of the semiconductor dehumidification device.

[0028] Furthermore, this invention fully utilizes the venting valves, such as semi-permeable membranes, within the battery pack housing itself to discharge condensate as water vapor outside the battery pack during dehumidification mode. This fully leverages the permeability of the battery pack housing itself to complete the dehumidification process. Therefore, the semiconductor dehumidification device of this invention is particularly suitable for continuous dehumidification of battery packs, especially those in pure electric vehicles. Attached Figure Description

[0029] The objects, advantages, and features of the invention will become more apparent in the following detailed description of embodiments of the invention, given by way of non-limiting example with reference to the accompanying drawings, wherein:

[0030] Figure 1 A schematic diagram of a battery pack according to an exemplary embodiment of the present invention is shown.

[0031] Figure 2a A schematic diagram of a semiconductor humidity control device according to an exemplary embodiment of the present invention is shown;

[0032] Figure 2b It shows Figure 2a The left external view of the semiconductor humidity control device shown;

[0033] Figure 3 It shows Figure 2a A schematic diagram of the semiconductor wafer in the semiconductor humidity control device shown;

[0034] Figure 4 It shows Figure 2a A schematic diagram of the condenser in the semiconductor humidity control device shown;

[0035] Figure 5 It shows Figure 2a A schematic diagram of the condensate collection device in the semiconductor humidity control device shown;

[0036] Figure 6 A perspective view of the assembled condenser unit and condensate collection device is shown;

[0037] Figures 7a to 7c The front view, left view, and top view of the assembled condenser and condensate collection device are shown respectively.

[0038] Figure 8 It shows Figure 2a A top view of one embodiment of the heat sink in the semiconductor dehumidification device shown;

[0039] Figure 9 A flowchart illustrating how the controller of a semiconductor dehumidification device according to an exemplary embodiment of the present invention switches between a dehumidification mode and a dehumidification mode is shown;

[0040] Figure 10 A flowchart illustrating how the controller of a semiconductor humidity control device according to an exemplary embodiment of the present invention performs closed-loop control of the power of a semiconductor chip and open-loop control of the power of a fan motor is shown; and

[0041] Figure 11 A control flowchart illustrating a battery pack including a semiconductor humidity control device according to an exemplary embodiment of the present invention is shown. Detailed Implementation

[0042] The following description, with reference to the accompanying drawings, describes a semiconductor humidity control device and a battery pack including the semiconductor humidity control device according to embodiments of the present invention. In the following description, numerous specific details are set forth to enable those skilled in the art to gain a more complete understanding of the invention. However, it will be apparent to those skilled in the art that implementation of the invention may not include some of these specific details. Furthermore, it should be understood that the invention is not limited to the specific embodiments described. Rather, the invention can be conceived to be practiced with any combination of the following features and elements, regardless of whether they relate to different embodiments. Therefore, unless expressly set forth in the claims, the following features, embodiments, and advantages are illustrative only and should not be construed as elements or limitations of the claims.

[0043] Figure 1A battery pack 2000 according to an embodiment of the present invention is shown, comprising a battery pack housing 2100, a battery management system (BMS) 2200 located within the battery pack housing 2100, a power module / battery module 2300, a communication module, and a semiconductor humidity control device 1000 located within the battery pack housing 2100. The battery pack housing 2100 has at least one vent valve 2110 on at least a portion thereof, for example on one of its sidewalls, which allows gases to pass through but prevents liquids and solids from entering or exiting the battery pack housing 2100. The vent valve 2110 is, for example, in the form of a semi-permeable membrane. Preferably, the semi-permeable membrane may be made of expanded polytetrafluoroethylene (e-PTFE).

[0044] Despite Figure 1 In the illustrated embodiment, the vent valve 2110 is disposed on one of the battery pack housings 2100 (in Figure 1 On the left side wall (in the middle), and there are two of them, but it should be understood that the vent valves 2110 can be set at any suitable location on the battery pack housing 2100, and their number can vary, as long as they can enable gas communication between the inside of the battery pack and the external environment.

[0045] Preferably, such as Figure 1 As shown, the semiconductor humidity control device 1000 is disposed inside the battery pack housing 2100 near one of the vent valves 2110. Preferably, the position of the semiconductor humidity control device 1000 within the battery pack housing 2100 is determined such that the semiconductor humidity control device 1000 can directly contact the battery pack housing 2100. More preferably, the semiconductor humidity control device 1000 is thermally bonded to the inner wall of the battery pack housing 2100 using thermally conductive adhesive 2400 to improve the thermal conductivity between the semiconductor humidity control device 1000 and the battery pack housing 2100, thereby facilitating heat release.

[0046] It should be understood that, depending on the design and arrangement of different types of battery packs, the position of the semiconductor humidity control device 1000 within the battery pack housing 2100, such as its distance from any other component within the battery pack 2000, such as a vent valve, can vary, as long as the size of the battery pack meets the installation space requirements of the semiconductor humidity control device 1000.

[0047] Furthermore, despite Figure 1 As shown, the semiconductor humidity control device 1000 is bonded to the inner wall of the battery pack housing 2100 using thermally conductive adhesive 2400. However, it should be understood that any suitable connection mechanism can be used to connect the semiconductor humidity control device 1000 to the battery pack housing 2100. Other suitable connection mechanisms include, but are not limited to, screw connection mechanisms, hook and loop connection mechanisms, riveting connection mechanisms, etc.

[0048] like Figure 2a and2b As shown, preferably, in this embodiment, the semiconductor humidity control device 1000 includes a device housing 1100, which has a vent 1110 and a heat dissipation opening 1120. The vent 1110 is, for example, in the form of an air intake grille, a hole in a perforated plate, or a single opening. Preferably, the device housing 1100 may be, for example, in a generally cuboid shape, and preferably has rounded corners. Preferably, the vent 1110 and the heat dissipation opening 1120 may be respectively provided on two opposite sides of the device housing 1100. However, it should be understood that the shape of the device housing 1100 is not limited to a generally cuboid shape; it may also be any other suitable shape, such as a cube, an oval, a sphere, etc.

[0049] In this embodiment, the semiconductor humidity control device 1000 may further include the following components:

[0050] - A semiconductor plate 1200 disposed within a device housing 1100 has a first side and a second side opposite to the first side, wherein the semiconductor plate 1200 is configured such that when current flows through it in a first direction, its first side forms a cold end and its second side forms a hot end, and when current flows through it in a second direction opposite to the first direction, its first side forms a hot end and its second side forms a cold end.

[0051] - A condenser 1300 disposed within the device housing 1100 is thermally attached to a first side of the semiconductor wafer 1200, such that water vapor in the ambient air can condense on the condenser 1300 when the first side acts as a cold end. The condenser 1300 can be attached to the semiconductor wafer 1200, for example, by means of thermally conductive adhesive 1920.

[0052] A heat sink 1400, at least partially disposed within the device housing 1100, is thermally attached to the second side of the semiconductor wafer 1200. The heat sink 1400 dissipates heat to the outside of the device housing 1100 via a heat dissipation opening 1120. Preferably, the heat sink 1400 is inserted into the heat dissipation opening 1120 in a matching manner, with a portion extending beyond the heat dissipation opening 1120 and thus outside the device housing 1100. Figure 2a and 2b Preferably, the heat sink 1400 can be bonded to the semiconductor chip 1200 using thermally conductive adhesive 1920;

[0053] A condensate collection device 1500, installed within the housing 1100, is connected to a condenser 1300 to receive condensate from the condenser 1300. The positions of the condensate collection device 1500 and the condenser 1300 are determined such that the condenser 1300 can transfer heat with the condensate collected in the condensate collection device 1500, causing the condensate to vaporize.

[0054] - Controller 1600, configured to:

[0055] When the humidity in the external environment where the device housing 1100 is located (in this case, the internal environment of the battery pack) is higher than a first humidity threshold and / or the difference between the actual temperature and the dew point temperature is lower than a first temperature difference threshold, a control current flows through the semiconductor chip 1200 in a first direction, causing the semiconductor humidity control device 1000 to enter a dehumidification mode in which water vapor in the ambient air is condensed and collected in the condensate collection device 1500; and

[0056] When the humidity in the external environment where the device housing 1100 is located is lower than the second humidity threshold and / or the difference between the actual temperature and the dew point temperature is higher than the second temperature difference threshold, the control current flows through the semiconductor chip 1200 in the second direction, so that the condensate in the semiconductor humidity control device 1000 is heated and vaporized, and discharged outside the device housing 1100 through the vent 1110 and then discharged outside the external environment in the dehumidification mode.

[0057] As an example, preferably, the first humidity threshold is in the range of about 75% to about 48%, more preferably about 70%, and more preferably about 50%. The second humidity threshold is preferably in the range of about 30% to about 38%, and more preferably about 35%. Generally speaking, a safe humidity level below 50% ensures that condensation will not occur at most battery operating temperatures. Furthermore, controlling the second humidity threshold at about 35% ensures that the humidity inside the battery pack will not exceed 50% due to excessive fluctuations after dehumidification.

[0058] Furthermore, the first temperature difference threshold is preferably in the range of about 4°C to about 6°C, more preferably about 5°C. The second temperature difference threshold is preferably in the range of about 8°C to about 15°C, more preferably about 15°C or about 10°C.

[0059] In this embodiment, when the humidity in the battery pack where the device housing 1100 is located is higher than a first humidity threshold, such as 70% or 50%, and / or the difference between the actual temperature and the dew point temperature is lower than a first temperature difference threshold, such as 5°C, it is determined that there is a risk of condensation in the battery pack. At this time, the control current flows through the semiconductor chip 1200 in the first direction, so that the semiconductor humidity control device 1000 enters the dehumidification mode in which water vapor in the ambient air is condensed and collected in the condensate collection device 1500, so as to reduce the humidity in the battery pack and increase the temperature in the battery pack. When the humidity in the battery pack is lower than a second humidity threshold (e.g., 35%) and / or the difference between the actual temperature and the dew point temperature is higher than a second temperature difference threshold (e.g., 15°C), it is determined that the humidity in the battery pack after dehumidification will not exceed the first humidity threshold due to excessive fluctuations. At this time, the control current flows through the semiconductor chip 1200 in the second direction, so that the condensate in the semiconductor humidity control device 1000 is heated and vaporized, and discharged outside the device housing 1100 through the vent 1110, and then discharged outside the battery pack. This dehumidification mode ensures that even when the condensate in the condensate collection device is discharged in the form of steam in the dehumidification mode, the humidity in the battery pack will not be higher than the first humidity threshold and / or the temperature difference will be lower than the first temperature difference threshold. In this way, the condensate in the condensate collection device can be discharged in the form of water vapor, or even emptied, so that it can continue to collect condensate in the next dehumidification mode in an even empty state without causing condensate overflow.

[0060] Preferably, such as Figure 2a As shown, the semiconductor humidity control device 1000 may further include a fan 1700 located within the device housing 1100 between the vent and the condenser 1300. The fan 1700 may include a motor 1710 and at least two blades 1720 distributed around the motor 1710. The fan 1700 may be arranged directly opposite the vent 1110 and the condenser 1300 on the device housing 1100 to achieve forced convection of gas between the interior of the device housing 1100 and the internal environment of the battery pack in which it is located. Of course, the position of the fan 1700 can be varied, as long as it can achieve convection of gas between the interior of the device housing 1100 and the internal environment of the battery pack in which it is located.

[0061] Preferably, such as Figure 2aAs shown, the semiconductor humidity control device 1000 may further include a temperature sensor 1910 attached to the first side of the condenser 1300 for detecting the surface temperature of the condenser 1300, also known as the cold end temperature. The temperature sensor 1910 is, for example, in the form of an NTC temperature probe, which can be attached to the surface of the first side of the condenser 1300, and is preferably positioned at the upper end of the first side of the condenser 1300 to reduce obstruction to the flow of condensate. The temperature sensor 1910 can transmit the surface temperature of the condenser 1300 to the controller 1600 in real time, so that the controller 1600 can adjust the temperature of the condenser surface based on the received real-time temperature, for example, by adjusting the power of the semiconductor chip 1200 in real time.

[0062] Preferably, such as Figure 2a As shown, the semiconductor humidity control device 1000 may further include a temperature and humidity sensor 1800 disposed outside the device housing 1100, for detecting the temperature and humidity within the external environment (in this case, the internal environment of the battery pack) where the semiconductor humidity control device 1000 is located. The temperature and humidity sensor 1800 may be attached to the outer surface of the device housing 1100 or may be at least partially embedded in the thickness of the device housing 1100. Alternatively, the temperature and humidity sensor 1800 may not be disposed on the device housing 1100, but may be disposed at any other suitable location within the battery pack, as long as it can detect the temperature and humidity within the battery pack and transmit the detected temperature and humidity to the controller 1600 of the semiconductor humidity control device 1000; all of these fall within the scope of protection of this invention.

[0063] like Figure 3 As shown, in a specific embodiment, preferably, the semiconductor chip 1200 is formed by stacking a large number of N-type and P-type semiconductor particles. The N-type semiconductor particles and the P-type semiconductor particles are interconnected by a general conductor 1210 (usually copper, aluminum or other metal conductor) to form a complete circuit. Finally, they are sandwiched between the first ceramic chip 1220 and the second ceramic chip 1230 like a sandwich, wherein the two ceramic chips are insulated and have good thermal conductivity.

[0064] During operation, when the current flows in the first direction ( Figure 3 When current flows through the circuit in a clockwise direction (as shown in the middle), the first ceramic plate 1220 forms a cold end and the second ceramic plate 1230 forms a hot end (i.e., the Peltier effect), and when the current flows in a second direction opposite to the first direction (as shown in the middle), the first ceramic plate 1220 forms a cold end and the second ceramic plate 1230 forms a hot end (i.e., the Peltier effect), the second ceramic plate 1230 forms Figure 3 When the current flows through the circuit in a counterclockwise direction, the first ceramic plate 1220 is formed as the hot end and the second ceramic plate 1230 is formed as the cold end. In this case, the condenser 1300 is attached to the first ceramic plate 1220 and the heat sink 1400 is attached to the second ceramic plate 1230.

[0065] like Figure 1 The semiconductor chip 1200, heat sink 1400, condenser 1300 and condensate collection device 1500 shown can all be arranged vertically, and the condensate collection device 1500 can be connected to the condenser 1300 near the lower end of the condenser 1300, so that the condensate can flow from the condenser 1300 to the condensate collection device 1500 under its own gravity.

[0066] Preferably, such as Figure 4 As shown, the condenser 1300 includes a U-shaped plate and a flow guide. Preferably, the U-shaped plate may include an intermediate plate 1310 and two end plates 1320 at its lateral ends, the two end plates 1320 extending in a direction away from the semiconductor wafer 1200. The intermediate plate 1310 has a first side attached to a first side of the semiconductor wafer 1200 and a second side opposite to the first side. The two end plates 1320 may be integrally formed with the intermediate plate 1310 or may be formed separately from the intermediate plate 1310 and then connected to the intermediate plate 1310 by a suitable connection method such as screw connection, adhesive connection, etc., as long as they can form the final U-shaped plate. Furthermore, the flow guide is provided on the second side of the intermediate plate 1310 and is preferably configured to guide condensate on the condenser 1300 toward its lower end and thus toward the condensate collection device 1500, thereby increasing the rate at which condensate flows into the condensate collection device 1500.

[0067] In a specific example, preferably, such as Figure 4 As shown, the flow guide may include a plurality of ridges 1330 extending from the second side of the intermediate plate 1310 in a direction away from the first side. These ridges 1330 extend vertically between the lower and upper ends, parallel to the two end plates 1320, and are laterally spaced from each other. The ridges 1330, together with the two end plates 1320, form a fin-like structure, thus creating flow channels between each end plate 1320 and its adjacent ridge 1330, and between two adjacent ridges 1330, to guide condensate into the condensate collection device 1500. Clearly, this flow guide not only serves to guide the flow but also increases the condensation area when in contact with air, thereby further improving condensation efficiency and achieving better dehumidification.

[0068] It is conceivable that the plurality of ridges 1330 can be as follows: Figure 4 It can extend along the entire height of the intermediate plate 1310 as shown, or it can extend along only a portion of the height of the intermediate plate 1310 (not shown), as long as it can achieve the function of guiding the flow.

[0069] Furthermore, despite Figure 4The diagram shows the flow guide in the form of multiple ridges 1330, but it should be understood that the flow guide may also take any other suitable form other than ridges 1330 or fin-like structures, and it should also be understood that the multiple ridges 1330 may also be inclined relative to the vertical plane, that is, they may not be parallel to the two end plates 1320, as long as they can achieve the flow guiding function.

[0070] Preferably, such as Figure 5 As shown, the condensate collection device 1500 may include a collection container and a regenerable moisture-absorbing material 1550 located within the collection container. The moisture-absorbing material 1550 is selected to absorb the condensate in the dehumidification mode and release the condensate as water vapor in the dehumidification mode. The moisture-absorbing material 1550 may be one or more of the following: a reversible desiccant, bentonite, silica aerogel, carbon molecular sieve, carbon aerogel adsorbent, and water-absorbing resin. The moisture-absorbing material 1550 may be granular or have other structures.

[0071] In this way, when in dehumidification mode, the liquid nuclei of condensate on the condenser increase and merge. Under the influence of gravity, they gradually increase in size and exceed the static friction between them and the condenser surface. Water droplets will flow down the surface of the condenser under the influence of gravity and be collected by the condensate collection device below. They will be absorbed by the moisture-absorbing material in the collection container, making the moisture-absorbing material damp. At the same time, this prevents condensate from existing freely in the collection container, thus preventing condensate from accidentally flowing out of the collection container.

[0072] When in dehumidification mode, the condenser becomes the hot end and heats the surrounding moisture-absorbing material, causing the moisture absorbed by the material to evaporate back into the air, thus drying and regenerating the material for repeated use.

[0073] In one example, such as Figure 5 As shown, the collection container may include a rectangular base 1510, U-shaped sidewalls extending vertically upward from three adjacent sides of the rectangular base 1510, and a plurality of rectangular strips 1540 extending parallel to the rectangular base 1510 from the middle wall 1520 of the U-shaped sidewalls toward their opposite sides near the top. The plurality of rectangular strips 1540 are distributed along the length of the middle wall 1520 defined by the two end walls 1530 of the U-shaped sidewalls and are spaced apart from each other, thereby forming a grid-like structure at the top of the collection container. Preferably, the two rectangular strips 1540 at each end may also be spaced apart from their respective end walls 1530, and the spacing between adjacent rectangular strips 1540 and between rectangular strips 1540 and end walls 1530 is preferably equal.

[0074] It should be understood that the collection container can also be of any other suitable shape and structure, as long as it can be installed in conjunction with the condenser 1300, receive and collect condensate therein, and allow gases such as water vapor to exit from it. For example, the condensate collection device 1500 can also consist of controllable mechanical components such as valves and a water tank. In dehumidification mode, the one-way valve can open inward to allow condensate to flow into the water tank for storage, while in dehumidification mode, the one-way valve can open outward to release water vapor.

[0075] In one example, when assembled, the condenser 1300 and the condensate collection device 1500 are arranged to be embedded in each other, wherein the condenser 1300 rests entirely on the rectangular bottom 1510 of the condensate collection device 1500, and each end plate 1320 of the U-shaped plate overlaps with a corresponding end wall 1530 of the U-shaped sidewall, such that the U-shaped plate and the U-shaped sidewall together define a cylindrical sidewall having a generally rectangular cross-section, wherein a plurality of rectangular bars 1540 of a grid-like structure are alternately arranged with a plurality of ridges 1330 of a fin-like structure, such that each rectangular bar 1540 is inserted between two corresponding adjacent ridges 1330, wherein a small gap exists between each rectangular bar 1540 and each adjacent ridge 1330. Figure 7c This gap allows condensate and water vapor to enter and exit the collection container, but prevents the moisture-absorbing material 1550 in the collection container from passing through it. This allows condensate droplets and water vapor to enter or leave the collection container through the gap, and prevents the moisture-absorbing material 1550 from leaving the gap, thereby keeping the moisture-absorbing material 1550 and the condensate it absorbs inside the collection container.

[0076] For example, in an alternative embodiment, the condensate collection device 1500 may further include a container wall arranged opposite to the intermediate wall 1520, such that it can form a cylindrical sidewall with a rectangular cross-section. In this case, when assembled, the condenser 1300 rests entirely on the rectangular bottom 1510 of the condensate collection device 1500 and the intermediate plate 1310 is entirely located inside the collection container, and similarly, each end plate 1320 of the U-shaped plate overlaps with a corresponding end wall 1530 of the U-shaped sidewall.

[0077] like Figure 8 As shown, the heat sink 1400 may include, for example, a plate-shaped body 1410 attached to the second side of the semiconductor wafer 1200, and preferably may also include fins 1420 on the side of the plate-shaped body 1410 facing away from the semiconductor wafer 1200, for example, which may extend at least partially from the heat dissipation opening to the outside of the device housing 1100 to accelerate heat dissipation.

[0078] Preferably, such as Figure 9As shown, the controller 1600 is also configured to calculate the dew point temperature in the external environment based on the temperature and humidity measurements received by the temperature and humidity sensor 1800 in the external environment (in this case, the internal environment of the battery pack), and to calculate the difference between the dew point temperature and the actual temperature in real time.

[0079] As an example, the controller 1600 can calculate the dew point temperature based on the following formula:

[0080] T 露点 = (237.7*D) / (17.27-D) Equation 1

[0081] D=17.27*T / (237.7+RH)+ln(RH / 100) Formula 2

[0082] Where RH is the humidity measurement value, T is the temperature measurement value, and T 露点 This is the dew point temperature.

[0083] Furthermore, the inventors surprisingly discovered that the dehumidification efficiency of the semiconductor dehumidification device 1000 is strongly correlated with the cold-end temperature. Therefore, preferably, as... Figures 10 to 11 As shown, the controller 1600 may include a main control module and a power control module communicatively connected to the main control module. The controller 1600 is further configured to enable the main control module to establish a temperature and humidity correlation model based on the temperature and humidity measurements received from the temperature and humidity sensor 1800 in the external environment and the temperature measurements received from the temperature sensor 1910 on the surface of the condenser 1300. The controller 1600 also enables the power control module to control the power of the semiconductor chip 1200 and thus the surface temperature / cold end temperature of the condenser 1300 in a closed loop based on the temperature and humidity correlation model.

[0084] Furthermore, the inventors surprisingly discovered that the dehumidification efficiency of the semiconductor dehumidification device 1000 is strongly correlated with wind speed. Therefore, preferably, as... Figures 10 to 11 As shown, the controller 1600 is also configured to enable the power control module to control the power / input current, voltage / speed of the motor 1710 of the fan 1700 in an open-loop manner based on a temperature and humidity correlation model.

[0085] As an example, the main control module can establish a temperature and humidity correlation model based on the measured values ​​of temperature and humidity inside the battery pack received from the temperature and humidity sensor 1800 and the measured value of temperature on the surface of the condenser 1300 received from the temperature sensor 1910, according to the following formula:

[0086]

[0087]

[0088] Where J is the condensation rate, ΔT is the minimum subcooling required for condensation, and T is the minimum subcooling required for condensation. s This is the temperature of the battery pack received by the main control module.

[0089] The minimum subcooling ΔT required for condensation can be calculated using Equation 4, and the temperature of the condenser surface can be controlled based on the calculated ΔT value: T 冷凝件 =T s -ΔT. For example... Figure 10 and 11 As shown, by controlling the temperature of the condenser 1300, it can maintain the minimum temperature required for condensation in certain operating modes, such as when the humidity has reached the set humidity but the user wants it to stay on to prevent the humidity from rising.

[0090] Equation 2 can calculate the condensation rate J. This equation can be coupled with the evaporation formula discussed further below to give the estimated time to reach the set humidity or the adjustment power, etc.

[0091] Furthermore, as an example, the main control module can use the following formula to adjust the power of the fan 1700 motor 1710:

[0092] g h = Θ A (x s - x) Equation 5

[0093] in,

[0094] g h =Evaporation rate per hour (kg / h)

[0095] Θ = (a + bv) = Wind speed influence constant (kg / m) 2 h)

[0096] v = wind speed (m / s)

[0097] A = Liquid surface area (m²) 2 )

[0098] x s =Saturated absolute humidity (kg / kg) (the amount of water in kilograms of dry air)

[0099] x = Current absolute humidity (kg / kg) (the amount of water in kilograms of dry air)

[0100] The two constants a and b required for Θ need to be determined experimentally, which will then establish the relationship between wind speed and evaporation rate during dehumidification operation. By comparing the evaporation rate and condensation rate J, optimal dehumidification efficiency can be achieved by adjusting the fan speed (1700 rpm) and semiconductor power.

[0101] In a specific example, such as Figure 9As shown, the main control module receives the temperature and humidity inside the battery pack from the temperature and humidity sensor 1800, and calculates the dew point temperature T based on equations 1 and 2 above. 露点 The main control module calculates the difference between the dew point temperature and the actual temperature, compares this difference with a first temperature difference threshold (e.g., 5°C) and a second temperature difference threshold (e.g., 15°C), and / or compares the measured humidity with a first humidity threshold and a second humidity threshold. When the actual temperature difference is less than the first temperature difference threshold (e.g., 5°C) and / or when the measured humidity (RH) is greater than the first humidity threshold (e.g., 70% or 50%), the main control module controls the semiconductor humidity control device 1000 to enter dehumidification mode. When the temperature difference is greater than the second temperature difference threshold (e.g., 15°C) and / or when the measured humidity (RH) is less than the second humidity threshold (e.g., 35%), the main control module controls the semiconductor humidity control device 1000 to enter dehumidification mode.

[0102] As a preferred embodiment, such as Figure 10 and 11 As shown, the power of semiconductor chip 1200 and the power of motor 1710 of fan 1700 are adjusted as follows:

[0103] - The 1800 battery pack temperature and humidity sensor collects the ambient temperature and humidity inside the battery pack, transmits the data to the main control module, and the main control module processes the data to generate control signals for the power control module.

[0104] - The main control module calculates the power required by the semiconductor chip 1200 and the fan 1700 based on the known temperature and humidity signals.

[0105] The power control module receives commands from the main control module and adjusts the power / input voltage and current of the semiconductor chip 1200 and the motor 1710 of the fan 1700.

[0106] - Semiconductor chip 1200 creates a cold end that causes water vapor in the air to condense.

[0107] - Temperature sensor 1910 of condenser 1300 collects the cold end temperature of condenser 1300, i.e. semiconductor chip 1200, and transmits it to the main control module for processing and calculation of the optimal power of semiconductor chip 1200 or fan 1700 motor.

[0108] - The battery management system connects to the main control module through a power module / battery module and a communication module. The power module performs boost / buck conversion, and the communication module performs corresponding analog-to-digital conversion.

[0109] In summary, the semiconductor humidity control device 1000 and the battery pack including the semiconductor humidity control device 1000 of the present invention can achieve the following technical effects:

[0110] When the humidity in the external environment where the housing is located, such as the battery pack, is higher than a first humidity threshold and / or the difference between the actual temperature and the dew point temperature is lower than a first temperature difference threshold, current flows through the semiconductor chip 1200 in the first direction to put the semiconductor humidity control device 1000 into dehumidification mode. And when the humidity in the external environment where the housing is located is lower than a second humidity threshold and / or the difference between the actual temperature and the dew point temperature is higher than a second temperature difference threshold, current flows through the semiconductor chip 1200 in the opposite second direction to put the semiconductor humidity control device 1000 into dehumidification mode, thereby discharging the condensate stored in the condensate collection device 1500 as water vapor through the vent 1110 of the device housing 1100 and then through a vent valve on, for example, the battery pack housing to the outside of the battery pack, thereby achieving a dehumidification effect on the external environment where the semiconductor humidity control device 1000 is located, such as inside the battery pack.

[0111] Furthermore, since the condensate collected by the condensate collection device 1500 has already been discharged as water vapor in the dehumidification mode, the condensate collection device 1500 can be repeatedly regenerated and continue to collect condensate in the next dehumidification mode. Therefore, the semiconductor dehumidification device 1000 of the present invention is particularly suitable for continuous dehumidification of battery packs in pure electric vehicles.

[0112] Although the above embodiments are described with reference to a battery pack, it should be understood that the semiconductor dehumidification device 1000 of the present invention can be used in other external environments to dehumidify the external environment in which it is located.

[0113] Furthermore, in this document, the term "comprising" does not exclude other elements or steps. A single unit or step can perform the function of multiple features recited in the claims. The mere fact that specific measures are recited in mutually different dependent claims does not imply that a combination of these measures cannot be used advantageously. Terms such as "about," "approximately," etc., used in conjunction with attributes or values ​​also explicitly define the attribute or the value, respectively. The term "about" in the context of a given numerical value or range refers, for example, to a value or range within 20%, 10%, 5%, or 2% of the given value or range.

[0114] The embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the claims. It should be understood that various modifications or variations that will be obvious to those skilled in the art are within the spirit and scope of this application and the appended claims.

[0115] It will be clear that various different variations and / or modifications and / or combinations of the various embodiments of the invention described above are obvious to those skilled in the art without departing from the scope of the invention as defined by the appended claims.

Claims

1. A semiconductor dehumidification device (1000), comprising: a device housing (1100) having a vent (1110) and a heat dissipation opening (1120); a semiconductor sheet (1200) disposed within the device housing (1100) and having a first side and a second side opposite the first side, wherein the semiconductor sheet (1200) is configured such that when an electric current is passed therethrough in a first direction, the first side thereof forms a cold end and the second side thereof forms a hot end, and when an electric current is passed therethrough in a second direction opposite the first direction, the first side thereof forms a hot end and the second side thereof forms a cold end; a condensing member (1300) disposed within the device housing (1100) and thermally conductively attached to the first side of the semiconductor sheet (1200) such that when the first side acts as a cold end, water vapor in ambient air can condense on the condensing member (1300); a heat dissipating member (1400) disposed at least partially within the device housing (1100) and thermally conductively attached to the second side of the semiconductor sheet (1200), wherein the heat dissipating member (1400) is capable of releasing heat to outside of the device housing (1100) via the heat dissipation opening (1120); a condensed water collection device (1500) disposed within the device housing (1100) and in communication with the condensing member (1300) to receive condensed water from the condensing member (1300), the condensed water collection device (1500) being positioned relative to the condensing member (1300) such that the condensing member (1300) is in thermal communication with condensed water collected in the condensed water collection device (1500) to cause the condensed water to vaporize; and a controller (1600) configured to: control the electric current to pass through the semiconductor sheet (1200) in the first direction when the humidity in an external environment in which the device housing (1100) is located is higher than a first humidity threshold and / or the difference between an actual temperature and a dew point temperature is lower than a first temperature difference threshold, to cause the semiconductor dehumidification device (1000) to enter a dehumidification mode in which water vapor in ambient air condenses and is collected in the condensed water collection device (1500); and control the electric current to pass through the semiconductor sheet (1200) in the second direction when the humidity in the external environment in which the device housing (1100) is located is lower than a second humidity threshold and / or the difference between the actual temperature and the dew point temperature is higher than a second temperature difference threshold, to cause the semiconductor dehumidification device (1000) to enter a dehumidification mode in which the condensed water is heated to vaporize and is discharged out of the device housing (1100) via the vent (1110) and further out of the external environment via a venting structure of the external environment. The condensed water collection device (1500) includes a collection container and a regenerable moisture absorbing material (1550) located within the collection container, the moisture absorbing material (1550) being selected to absorb the condensed water in the dehumidification mode and to release the condensed water in the form of water vapor in the dehumidification mode.

2. The semiconductor humidity regulating device (1000) according to claim 1, wherein ​ 3. The semiconductor humidity regulating device (1000) according to claim 2, wherein The semiconductor sheet (1200), the heat dissipating member (1400), the condensing member (1300) and the condensed water collecting device (1500) are all vertically arranged, and the condensed water collecting device (1500) is communicated to the condensing member (1300) near the lower end of the condensing member (1300), wherein the condensing member (1300) comprises: a U-shaped plate comprising a middle plate (1310) and two end plates (1320) at two lateral ends of the middle plate (1310), the two end plates (1320) extending out in a direction away from the semiconductor sheet (1200), the middle plate (1310) having a first side face attached to a first side of the semiconductor sheet (1200) and a second side face opposite to the first side face; and a flow guiding portion provided on the second side face of the middle plate (1310), the flow guiding portion being configured to guide the condensed water on the condensing member (1300) towards the lower end and thus towards the condensed water collecting device (1500).

4. The semiconductor humidity regulating device (1000) according to claim 3, wherein The flow guiding portion comprises a plurality of ridge portions (1330) extending from the second side face of the middle plate (1310) in a direction away from the first side face, the plurality of ridge portions (1330) extending vertically between the lower end and the upper end of the condensing member parallel to the two end plates (1320) and laterally spaced apart from each other, such that the plurality of ridge portions (1330) together with the two end plates (1320) form a fin-like structure.

5. The semiconductor humidity regulating device (1000) according to claim 4, wherein The collecting container comprises a rectangular bottom (1510), U-shaped side walls vertically extending from three adjacent sides of the rectangular bottom (1510), and a plurality of rectangular bars (1540) extending out from a middle wall (1520) of the U-shaped side walls towards opposite sides thereof parallel to the rectangular bottom (1510) near a top end, the plurality of rectangular bars (1540) being distributed along a length of the middle wall (1520) defined by two end walls (1530) of the U-shaped side walls and spaced apart from each other, thereby forming a top of the collecting container in a form of a lattice-like structure, wherein the condensing member (1300) and the condensed water collecting device (1500) are arranged to be embedded into each other, wherein the condensing member (1300) rests on the rectangular bottom (1510) of the condensed water collecting device (1500) as a whole, and each end plate (1320) of the U-shaped plate overlaps with a corresponding one end wall (1530) of the U-shaped side wall with each other, so that the U-shaped plate and the U-shaped side wall together define a cylindrical side wall with a substantially rectangular cross section, wherein the plurality of rectangular bars (1540) of the grid-like structure are arranged alternately with the plurality of ridges (1330) of the fin-like structure, so that each rectangular bar (1540) is inserted between two corresponding adjacent ridges (1330), wherein there is a gap between each rectangular bar (1540) and each adjacent ridge (1330), which allows condensed water and water vapor to pass through the gap to the inside of the collecting container, but prevents the hygroscopic material (1550) in the collecting container from passing through the gap.

6. The semiconductor dehumidification device (1000) according to any one of claims 1 to 5, further comprising: a fan (1700) located within the device housing (1100) between the vent and the condensing member (1300); a temperature sensor (1910) attached to the first side of the condensing member (1300) for detecting the temperature of the surface of the condensing member (1300); and a temperature and humidity sensor (1800) disposed outside the device housing (1100). The controller (1600) is further configured to calculate the dew point temperature in the external environment based on the measurements of the temperature and humidity in the external environment received from the temperature and humidity sensor (1800), and to calculate the difference between the dew point temperature and the actual temperature in real time.

7. The semiconductor humidity regulating device (1000) according to claim 6, wherein The controller (1600) comprises a master module and a power control module communicatively connected to the master module, wherein the controller (1600) is further configured to cause the master module to establish a temperature and humidity correlation model based on the measurements of the temperature and humidity in the external environment received from the temperature and humidity sensor (1800) and the measurements of the temperature of the surface of the condensing member (1300) received from the temperature sensor (1910), and to cause the power control module to control the power of the semiconductor chip (1200) and thus the temperature of the surface of the condensing member (1300) based on the temperature and humidity correlation model in a closed loop.

8. The semiconductor humidity regulating device (1000) according to claim 6, wherein The controller (1600) is further configured to cause the power control module to control the power of the motor (1710) of the fan (1700) based on the temperature and humidity correlation model in an open loop.

9. The semiconductor humidity regulating device (1000) according to claim 8, wherein 10. The semiconductor dehumidification device (1000) according to claim 1, wherein: the first humidity threshold is 50%; the first temperature difference threshold is 5°C; the second humidity threshold is 35%; and / or the second temperature difference threshold is 15°C.

11. A battery pack (2000), comprising: ​ a battery pack housing (2100) having a breather valve (2110) allowing gas but not liquid and solid to pass into and out of the battery pack housing at least on a portion thereof; a battery management system (2200) located within the battery pack housing; a battery module (2300); and a semiconductor humidity control device (1000) according to any one of claims 1 to 10 located within the battery pack housing (2100). ​

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