Electronic device

Abstract

The application provides an electronic device, the electronic device comprising a conducting assembly and a sensing device, the conducting assembly comprising a lens and a conducting member, the sensing device being arranged on one side of the lens in a direction orthogonal to an optical axis of the lens, the lens and the sensing device being arranged on the same side of the conducting member; wherein the conducting member has a first reflecting surface and a second reflecting surface; light from the lens is incident on the first reflecting surface, the light reflected at the first reflecting surface being at least partially conducted to the second reflecting surface via the conducting member, and the light reflected at the second reflecting surface at least partially passing through the conducting member to reach the sensing device. The electronic device provided by the application can reduce the space occupied by the conducting assembly and the sensing device in the electronic device by arranging the lens and the sensing device on the same side of the conducting member.

Description

Technical Field

[0001] This application relates to the technical field of electronic device structures, specifically to an electronic device. Background Technology

[0002] With the increasing intelligence of mobile phones and other electronic devices, lens modules have become a basic configuration, enabling them to easily perform image acquisition functions. Based on further user needs, the demand for telephoto lenses in mobile phones and other electronic devices is becoming increasingly prominent. However, telephoto lenses typically occupy a large amount of space, which is detrimental to the overall device layout. Summary of the Invention

[0003] This application provides an electronic device that, while achieving a telephoto design, helps to reduce the space occupied and compress the thickness of the electronic device.

[0004] An electronic device, the electronic device comprising:

[0005] The housing has a hole formed through the surface of the housing;

[0006] A sensing device is disposed on one side of the hole in a direction orthogonal to the axis of the hole; and

[0007] A conductive assembly, comprising a lens and a conductive element, wherein the lens is disposed opposite to the aperture, and the lens and the sensing device are disposed on the same side of the conductive element;

[0008] The conductive element has a first reflective surface, a second reflective surface, and a third reflective surface disposed between the first reflective surface and the second reflective surface. The third reflective surface is disposed on the side of the conductive element closer to the lens. Light from outside the electronic device is guided to the lens through the aperture. Light from the lens is incident on the first reflective surface. At least a portion of the light reflected at the first reflective surface is incident on the third reflective surface. At least a portion of the light reflected at the third reflective surface is incident on the second reflective surface. At least a portion of the light reflected at the second reflective surface passes through the third reflective surface to reach the sensing device.

[0009] The aforementioned electronic device, by incorporating a first, second, and third reflecting surface within the conductive component to achieve triple reflection of light, facilitates the extension of the light transmission path within the component, thereby enabling the implementation of a telephoto design. Simultaneously, the triple reflection of the conductive component folds the light path along its thickness, aligning the lens with the aperture. With the sensing device and lens positioned on the same side of the conductive component, at least some dimensions of the sensing device and lens overlap along the optical axis, rather than deflecting the light path along the length and width plane of the electronic device. This reduces the thickness of the electronic device while avoiding excessive length and width dimensions, promoting miniaturization and thinner designs. Furthermore, the placement of the conductive component along the light path between the lens and the sensing device reduces the focusing distance during focusing, thus minimizing the space occupied by the focusing distance within the electronic device, further contributing to its thinner design. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 These are schematic diagrams of the structure of electronic devices in some embodiments of this application.

[0013] Figure 2 yes Figure 1 A schematic diagram showing the structural breakdown of the electronic device in the embodiment.

[0014] Figure 3 This is a partial structural diagram of an electronic device in some embodiments of this application.

[0015] Figure 4 This is a partial structural schematic diagram of an electronic device in some other embodiments of this application.

[0016] Figure 5 This is a schematic diagram of the conduction path of the conduction component in some embodiments of this application.

[0017] Figure 6 This is a schematic diagram of the conduction path of the conduction component in some other embodiments of this application.

[0018] Figure 7 This is a partial structural diagram of an electronic device in some embodiments of this application.

[0019] Figure 8 This is a partial structural schematic diagram of an electronic device in some other embodiments of this application.

[0020] Figure 9 These are schematic block diagrams of the electronic devices in other embodiments of this application. Detailed Implementation

[0021] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0022] As used herein, "electronic device" refers to, but is not limited to, a device capable of receiving and / or transmitting communication signals connected via any one or more of the following connection methods:

[0023] (1) Via wired connection, such as via Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, or direct cable connection;

[0024] (2) Via wireless interface, such as cellular network, wireless local area network (WLAN), digital television network such as DVB-H network, satellite network, AM-FM broadcast transmitter.

[0025] An electronic device configured to communicate via a wireless interface can be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0026] (1) Satellite phone or cellular phone;

[0027] (2) A Personal Communications System (PCS) terminal that can combine cellular radio telephone with data processing, fax and data communication capabilities;

[0028] (3) Radio telephone, pager, Internet / intranet access, web browser, notepad, calendar, personal digital assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0029] (4) Conventional above-knee and / or palm-sized receivers;

[0030] (5) Conventional knee-mounted and / or handheld wireless telephone transceivers, etc.

[0031] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0032] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0033] As used herein, “electronic device” (or simply “terminal”) includes, but is not limited to, means configured to receive / transmit communication signals via a wired connection (such as via a Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), Digital Cable, Direct Cable Connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, Wireless Local Area Network (WLAN), Digital Television Network such as DVB-H, Satellite Network, AM-FM Broadcast Transmitter, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a “wireless communication terminal,” a “wireless terminal,” or a “mobile terminal.” Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephone with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, notebooks, calendars, and / or Global Positioning System (GPS) receivers; and conventional laptop and / or handheld receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

[0034] It should be noted that the electronic devices in this application mainly refer to electronic devices with lens components, such as those that utilize lens components to achieve image acquisition functions. Specifically, the electronic devices in this application can be smart devices with lens components, such as tablet computers, mobile phones, cameras, personal computers, laptops, in-vehicle devices, and wearable devices.

[0035] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the electronic device 100 in some embodiments of this application. Figure 2 yes Figure 1 The embodiment shows a structurally disassembled schematic diagram of the electronic device 100. The electronic device 100 can be a mobile phone, tablet computer, laptop computer, wearable device, or other similar device. In this embodiment, a mobile phone is used as an example for illustrative explanation.

[0036] The electronic device 100 may include a display screen 10 and a housing 20. The display screen 10 and the housing 20 are connected and enclose a receiving space 101. This receiving space 101 can be used to house structural components such as a conductive component 30, a sensing device 40, a motherboard 50, and a battery (not shown), enabling the electronic device 100 to perform corresponding functions. The display screen 10, sensing device 40, and other structural components can be electrically connected to the motherboard 50 and battery via a flexible printed circuit (FPC), allowing them to receive power from the battery and execute corresponding instructions and interact with the motherboard 50 under its control.

[0037] The display screen 10 provides image display functionality for the electronic device 100. The display screen 10 may include a transparent cover, a touch panel, and a display panel stacked sequentially. The surface of the transparent cover may be smooth and flat to facilitate touch operations such as clicking, swiping, and pressing. The transparent cover may be made of a rigid material such as glass, or a flexible material such as polyimide (PI) or colorless polyimide (CPI). The touch panel is positioned between the transparent cover and the display panel to respond to user touch operations and convert the corresponding touch operations into electrical signals that are transmitted to the processor of the electronic device 100, enabling the electronic device 100 to react accordingly. The display panel is primarily used to display images and can also serve as an interactive interface to instruct the user to perform the aforementioned touch operations on the transparent cover. The display panel may use an OLED (Organic Light-Emitting Diode) or LCD (Liquid Crystal Display) to achieve the image display function of the electronic device 100. In this embodiment, the transparent cover, touch panel, and display panel can be bonded together using adhesives such as OCA (OpticallyClear Adhesive) and PSA (Pressure Sensitive Adhesive).

[0038] The housing 20 can be used to install various electronic components required for the electronic device 100, and the housing 20 and the display screen 10 can together form an accommodating space 101. The accommodating space 101 can be used to install electronic components required for the electronic device 100, such as sensors, microphones, speakers, flashlights, circuit boards, and batteries, to achieve functions such as voice communication, audio playback, and lighting. It is understood that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0039] In one embodiment, the housing 20 generally includes a middle frame 21 and a cover plate 22. The display screen 10 is connected to one side of the middle frame 21, and the cover plate 22 is connected to the other opposite side of the middle frame 21. That is, the display screen 10 and the cover plate 22 can be respectively covered on opposite sides of the middle frame 21 and form an accommodating space 101.

[0040] The housing 20 may have a hole 102 extending through its surface, allowing external information (such as external light or sound) to be guided to the conductive component 30 via the hole 102. In other words, the hole 102 is configured to guide external information to the conductive component 30, and then transmit it to the sensing device 40. The sensing device 40 can convert the received information into an electrical signal for transmission within the electronic device 100.

[0041] Understandably, the sensing device 40 can be a sensor device that converts external analog information from the electronic device 100 into electronic signals. For example, the sensing device 40 can convert optical images into electronic signals, and it can be a device equipped with one or more sensors, such as a CCD (Charge-coupled Device), CMOS (Complementary Metal Oxide Semiconductor), and CIS (CMOS Image Sensor). As another example, the sensing device 40 can convert sound signals into electronic signals, and it can be a device equipped with a microphone.

[0042] Optionally, the hole 102 can be formed on and through the cover plate 22, and the conductive component 30 can receive light / sound information entering through the hole 102. Of course, in other embodiments, the hole 102 can be formed on the middle frame 21 or in the joint area between the middle frame 21 and the cover plate 22.

[0043] in, Figure 2 The X, Y, and Z directions of the electronic device 100 are defined for later description. The X direction can be understood as the extension direction of the longer side of the electronic device 100, the Y direction as the extension direction of the shorter side of the electronic device 100, and the Z direction as the thickness direction of the electronic device 100. It is understood that the terms "longer side" and "shorter side" are relative and can be switched in some scenarios. The XY plane is roughly parallel to the display surface of the display screen 10, or roughly defines the display surface of the display screen 10. The Z direction is generally orthogonal to the XY plane.

[0044] Please see Figure 3 , Figure 3 This is a partial structural schematic diagram of an electronic device 100 in some embodiments of this application. The conductive component 30 and the sensing device 40 are housed in the accommodating space of the electronic device 100 and are configured to collect external light information or external sound information of the electronic device 100.

[0045] When the sensing device 40 is an optical sensor (e.g., an image sensor), i.e., when the sensing device 40 is configured to receive light signals, the conducting component 30 is configured to guide the light signals entering the electronic device 100 through the aperture 102 to the sensing device 40. When the sensing device 40 is an acoustic sensor (e.g., a microphone), i.e., when the sensing device 40 is configured to receive sound signals, the conducting component 30 is configured to guide the sound signals entering the electronic device 100 through the aperture 102 to the sensing device 40.

[0046] Furthermore, the conductive component 30 forms an information channel for guiding information propagation, one end of which is connected to the aperture 102 and the other end is connected to the sensing device 40. That is, the information channel is configured to guide information entering the electronic device 100 through the aperture 102 to the sensing device 40. External information is guided from the aperture 102 to the conductive component 30, and the direction of information propagation is changed by the conductive component 30 to reach the sensing device 40.

[0047] Understandably, when the conductive component 30 is configured to conduct light information, the aperture 102 can guide light carrying light signals to the conductive component 30, and the conductive component 30 can form an optical channel to guide the light to the sensing device 40. When the conductive component 30 is configured to conduct sound information, the aperture 102 can guide sound waves carrying sound information to the conductive component 30, and the conductive component 30 can form an acoustic channel to guide the sound waves to the sensing device 40.

[0048] The following description uses a conductive component 30 configured to conduct light information as an example. The conductive component 30 generally includes a lens group 31 and a conductive element 32. The lens group 31 is positioned corresponding to the aperture 102 and configured to collect external light from the electronic device 100 under the guidance of the aperture 102. The lens group 31 and the conductive element 32 cooperate to form an optical channel for guiding light propagation. One end of this optical channel is connected to the aperture 102, and the other end is connected to the sensing device 40. That is, the optical channel is configured to guide light entering the housing 20 through the aperture 102 to the sensing device 40. External light enters the lens group 31 through the aperture 102 and is transformed into parallel light by the lens group 31 before entering the conductive element 32. The light incident on the conductive element 32 is folded and then enters the sensing device 40 in parallel. That is, the light incident from the lens group 31 onto the first reflecting surface 321 is parallel to and opposite in direction to the light reflected from the second reflecting surface 322 to the sensing device 40.

[0049] Understandably, when the conductive component 30 is configured for light propagation, the conductive element 32 can be a triangular prism, a quadrilateral prism, etc. When the conductive component 30 is configured for sound propagation, the conductive component 30 can be a structural component with a sound propagation channel, that is, the conductive component 30 can have a sound cavity for sound wave propagation and a sound inlet and a sound outlet connecting the sound cavity. The sound inlet connects to the hole 102, and the sound outlet connects to the sensing device 40. It should be noted that although the embodiments of this application mainly use the conductive component 30 for light propagation as an example for illustrative purposes, the technical solutions of the conductive component 30 for sound propagation directly derived by those skilled in the art based on the technical solutions in the embodiments of this application should be understood as being within the scope of protection of this application.

[0050] In other words, when the transmission assembly 30 is configured for light propagation, the transmission assembly 30 includes a lens group 31 and a conductor 32. The lens group 31 is disposed opposite to the aperture 102, for example, directly opposite the aperture 102, and the conductor 32 is disposed on the side of the lens group 31 away from the aperture 102. When the transmission assembly 30 is configured for sound propagation, the transmission assembly 30 may include a conductor 32, which has a sound cavity for sound wave propagation and an inlet and an outlet communicating with the sound cavity. The inlet communicates with the aperture 102, and the outlet communicates with the sensing device 40. The sensing device 40 is disposed on one side of the aperture 102 in a direction orthogonal to the axis of the aperture 102, and the aperture 102 and the sensing device 40 are disposed on the same side of the conductor 32.

[0051] Specifically, the lens group 31 has an optical axis L. Optionally, the optical axis L is substantially parallel to the axis of the aperture 102. Preferably, the optical axis L is collinear with the axis of the aperture 102. The sensing device 40 is disposed on one side of the lens group 31 in a direction orthogonal to the optical axis L, and the conductive member 32 and the lens group 31 are spaced apart along the extension direction of the optical axis. That is, the lens group 31 and the sensing device 40 are arranged side by side in a direction orthogonal to the optical axis L. Further, the lens group 31 generally includes an entrance surface 31a and an exit surface 31b disposed opposite to each other, and the sensing device 40 has a sensing surface 40a corresponding to the exit surface 31b. External light enters the lens group 31 from the entrance surface 31a and exits through the exit surface 31b to reach the conductive member 32. The light is folded and transmitted through the conductive member 32 to reach the sensing surface 40a of the sensing device 40. The light incident from the light-emitting surface 31b onto the conductive element 32 is substantially parallel to the light incident from the conductive element 32 onto the sensing surface 40a. Optionally, the light-incoming surface 31a and the light-emitting surface 31b of the lens group 31 are spaced apart along the Z direction, i.e., the light-emitting surface 31b is located between the light-incoming surface 31a and the conductive element 32. The sensing surface 40a of the sensing device is positioned adjacent to the light-emitting surface 31b, i.e., near the conductive element 32.

[0052] The conductive element 32 has a first reflecting surface 321 and a second reflecting surface 322. The first reflecting surface 321 is disposed opposite to the lens group 31, and the second reflecting surface 322 is disposed opposite to the sensing device 40. Optionally, the first reflecting surface 321 is disposed opposite to the light-emitting surface 31b of the lens group 31, so that light from the lens group 31 can be incident on the first reflecting surface 321. The second reflecting surface 322 is disposed opposite to the sensing surface 40a of the sensing device 40, so that light reflected by the second reflecting surface 322 can reach the sensing surface 40a of the sensing device 40.

[0053] Furthermore, the lens group 31 and the sensing device 40 are located on the same side of the conductor 32. Light from the lens group 31 is incident on the first reflecting surface 321. The light reflected at the first reflecting surface 321 is at least partially conducted through the conductor 32 to the second reflecting surface 322. The light reflected at the second reflecting surface 322 passes through the conductor 32 to reach the sensing device 40.

[0054] Specifically, in the Z direction, the lens group 31 and the sensing device 40 are located above the conductor 32, that is, the lens group 31 is located directly above the first reflecting surface 321, and the sensing device 40 is located directly above the second reflecting surface 322. Light emitted from the light-emitting surface 31b of the lens group 31 can reach the first reflecting surface 321 and be reflected by the first reflecting surface 321 to be folded and transmitted in the conductor 32. Furthermore, the light reflected by the first reflecting surface 321 is at least partially transmitted to the second reflecting surface 322, and reflected at the second reflecting surface 322 to be transmitted to the sensing surface 40a of the sensing device 40.

[0055] Lens group 31 may include at least one lens (e.g., a convex lens), such as Figure 3 As shown, the lens group 31 generally includes a first lens 311, a second lens 312, a third lens 313, and a fourth lens 314 arranged sequentially at intervals. The first lens 311 is positioned close to the aperture 102, and the fourth lens 314 is positioned away from the aperture 102 relative to the first lens 311. That is, light entering the housing 20 from the aperture 102 passes sequentially through the first lens 311, the second lens 312, the third lens 313, and the fourth lens 314 before entering the conductor 32. Optionally, the optical axes of the first lens 311, the second lens 312, the third lens 313, and the fourth lens 314 are collinear, approximately corresponding to the optical axis L of the lens group 31. It should be understood that those skilled in the art can reasonably configure the number, shape, and distribution of the lenses in the lens group 31 according to actual needs.

[0056] The first lens 311 can be made of glass and formed by grinding, and is mainly used to correct aberrations and eliminate temperature drift. The second lens 312, the third lens 313, and the fourth lens 314 can be made of plastic and formed by injection molding, and are mainly used to correct aberrations. It should be understood that this embodiment only exemplifies the materials and processing methods of the above lenses, but is not limited thereto, and those skilled in the art can flexibly choose according to actual needs.

[0057] It is understood that the electronic device provided in this application embodiment, by placing the lens group and the sensing device on the same side of the conductive member, can reduce the overall space occupied by the conductive component and the sensing device in the thickness direction of the electronic device, and can also reduce the focusing stroke of the electronic device.

[0058] Specifically, based on the fact that the lens group and the sensing device are located on the same side of the transmission element, which is different from the technical solution where the lens group and the sensing device are located on opposite sides of the transmission element, optical focusing can be achieved by moving the transmission element during the optical focusing process. Moreover, this focusing solution can reduce the focusing stroke by about half compared to the focusing solution of moving the lens group or the sensing device.

[0059] Understandably, when the conductive component is used to conduct sound wave information, a sound cavity for sound wave conduction and an inlet and an outlet connecting the sound cavity are formed on the conductive component. The inlet connects to a hole, and the outlet connects to a sensing device. The sensing device is disposed on one side of the hole in an axis orthogonal to the hole, and the hole and the sensing device are disposed on the same side of the conductive component. A first reflecting surface is disposed opposite to the hole, and a second reflecting surface is disposed opposite to the sensing device. External information of the electronic device (e.g., sound wave information) can be guided to the first reflecting surface through the hole. The information reflected at the first reflecting surface is at least partially conducted to the second reflecting surface through the conductive component, and the information reflected at the second reflecting surface at least partially passes through the conductive component to reach the sensing device.

[0060] Of course, in other embodiments, when the conductive component is used to conduct optical information, the conductive component may only include a conductive element, that is, the lens group can be omitted, and the conductive element forms an optical channel for light propagation. Specifically, the aperture and the sensing device are located on the same side of the conductive element, the light-inlet end of the conductive element is opposite to the aperture, and the light-outlet end of the conductive element is opposite to the sensing device. Optical information from outside the electronic device is guided to the first reflective surface through the aperture, the optical information reflected at the first reflective surface is at least partially conducted to the second reflective surface through the conductive element, and the optical information reflected at the second reflective surface at least partially passes through the conductive element to reach the sensing device.

[0061] In one embodiment, the conductive member 32 further has a third reflective surface 323 disposed between the first reflective surface 321 and the second reflective surface 322. Light reflected at the first reflective surface 321 is at least partially incident on the third reflective surface 323, light reflected at the third reflective surface 323 is at least partially incident on the second reflective surface 322, and light reflected at the second reflective surface 322 passes through the third reflective surface 323 to reach the sensing device 40. Specifically, the third reflective surface 323 is disposed on the side of the conductive member 32 near the lens group 31, and is located directly below the lens group 31 and the sensing device 40 along the Z-direction. Optionally, the plane containing the third reflective surface 323 is substantially parallel to the XY plane and is spaced apart from the light-emitting surface 31b and the sensing surface 40a, respectively.

[0062] In one embodiment, the projection of the first reflecting surface 321 onto the plane containing the third reflecting surface 323 has a first width W1 in a first direction, and the projection of the lens group 31 onto the plane containing the third reflecting surface 323 has a second width W2 in the first direction. The first width W1 is not less than the second width W2. The projection of the second reflecting surface 322 onto the plane containing the third reflecting surface 323 has a third width W3 in the first direction, and the projection of the sensing surface 40a of the sensing device 40 onto the plane containing the third reflecting surface 323 has a fourth width W4 in the first direction. The third width W3 is not less than the fourth width W4. The first direction can be a direction orthogonal to the optical axis L; in other words, the first direction can be the arrangement direction of the lens group 31 and the sensing device 40, i.e., the first direction can be the arrangement direction of the lens group 31 and the sensing device 40 in the XY plane.

[0063] To further illustrate the advantages of the above embodiments of this application in reducing the overall space occupied by the conductive components and sensing device, as well as the focusing stroke, this application further introduces comparative embodiments for further explanation. Please refer to... Figure 4 , Figure 4 This is a partial structural schematic diagram of an electronic device 200 in some other embodiments of this application. The electronic device 200 generally includes a conductive component 60 and a sensing device 40. The conductive component 60 generally includes a lens group 61 and a conductive element 62, with the lens group 61 and the sensing device 40 disposed on opposite sides of the conductive element 62. For relevant technical features of the lens group 61 and the sensing device 40, please refer to the lens group 31 and the sensing device 40 in the foregoing embodiments. The conductive element 32 can be a triangular prism, and the conductive element 62 can be a parallelogram prism.

[0064] The conductive element 62 generally includes a first reflective surface 621 and a second reflective surface 622 disposed opposite to each other, and a third reflective surface 623 and a fourth reflective surface 624 disposed between the first reflective surface 621 and the second reflective surface 622. The first reflective surface 621 and the second reflective surface 622 are opposite to and parallel to each other, as are the third reflective surface 623 and the fourth reflective surface 624. The first reflective surface 621 is disposed opposite to the light-emitting surface of the lens group 61, and the second reflective surface 622 is disposed opposite to the sensing surface of the sensing device 40. Light from the lens group 61 is incident on the first reflective surface 621, and at least a portion of the light reflected at the first reflective surface 621 is incident on the third reflective surface 623. At least a portion of the light reflected at the third reflective surface 623 is incident on the fourth reflective surface 624, and at least a portion of the light reflected at the fourth reflective surface 624 is incident on the second reflective surface 622. At least a portion of the light reflected at the second reflective surface 622 passes through the fourth reflective surface 624 and reaches the sensing device 40.

[0065] Comparing electronic devices 100 and 200, it can be seen that light incident from lens group 31 onto the conductor 32 undergoes three reflections and folds within the conductor 32 before exiting the conductor 32 to reach the sensing device 40; light incident from lens group 61 onto the conductor 62 undergoes four reflections and folds within the conductor 62 before exiting the conductor 62 to reach the sensing device 40. The back focal length of the lens group in the transmission component can be defined as the path length of light after exiting the lens group to reach the sensing device.

[0066] See also Figure 5 and Figure 6 , Figure 5 This is a schematic diagram of the conduction path of the conduction component 30 in some embodiments of this application. Figure 6This is a schematic diagram of the conduction path of the conduction component 60 in some other embodiments of this application. The widths of lens group 31 and lens group 61 in the same direction on the XY plane are defined as the second width W2 (W2 may not exceed 10mm). The relationship between the first width W1, the second width W2, and the third width W3 is defined as: W1=W2=W3. The light reflection angle θ of the conduction element 32 and the conduction element 62 is defined as 30°. The distance between the light-emitting surface of lens group 31 and the conduction element 32, the distance between the light-emitting surface of lens group 61 and the conduction element 62, the distance between the conduction element 32 and the sensing surface of the sensing device 40, and the distance between the conduction element 62 and the sensing surface of the sensing device 40 are all defined as the distance J0. Based on the above parameters, the path length J1 of the light emitted from the lens group 31 in the conduction component 30 of the electronic device 100 to the sensing device 40 is calculated as J1=2J0+3W2 / √3. The path length J2 of light emitted from lens group 61 in the light transmission component 60 of electronic device 200 to the sensing device 40 is J2 = 2J0 + 5W2 / √3. That is, for the light transmission component 32 and the light transmission component 62, the light transmission path in the light transmission component 62 is longer, which makes the back focal length of lens group 62 relatively longer.

[0067] After multiple tests, it was found that the transmission component 30 is generally suitable for lens group 31 with a magnification of 2-4 times (equivalent focal length of approximately 40-90mm); the transmission component 60 is generally suitable for lens group 61 with a magnification of 3-10 times (equivalent focal length of approximately 65-200mm).

[0068] Further comparison of electronic devices 100 and 200 reveals the following: In electronic device 100, the space occupied by the conductive component 30 and the sensing device 40 (taking the thickness in the Z direction as an example) is approximately the sum of the lens group 31, the conductive component 32, and J0. In electronic device 200, the space occupied by the conductive component 30 and the sensing device 40 (taking the thickness in the Z direction as an example) is approximately the sum of the lens group 31, the conductive component 32, the sensing device 40, and 2J0. Clearly, the technical solution in electronic device 100 has a significant advantage in space utilization.

[0069] Furthermore, during focusing, the electronic device 100 can achieve focusing not only by moving the lens group 61 and / or the sensing device 40, but also by moving the transmission element 32. In contrast, the electronic device 200 can only achieve focusing by moving the lens group 61 and / or the sensing device 40. Clearly, the electronic device 100 offers greater flexibility in choosing a focusing method, and in the focusing solution using the transmission element 32, the focusing distance is equivalent to half the distance of moving the lens group or the sensing device, thus reducing the focusing travel.

[0070] See again Figure 5 and Figure 6 In the electronic device 100, the lens group 31 has a first height h1 along its optical axis, which generally does not exceed 8 mm, for example, it can not exceed 6 mm. The conductive member 32 has a second height h2 between the surface / line away from the lens group 31 and the light-emitting surface of the lens group 31, which generally does not exceed 5 mm, for example, it can not exceed 4 mm. Therefore, it can be concluded that in the electronic device 100, the height h = h1 + h2 (occupying the height space of the electronic device 100) of the conductive component 30 and the sensing device 40 along the optical axis of the lens group 31 generally does not exceed 13 mm, for example, it can not exceed 10 mm.

[0071] In electronic device 200, lens assembly 61 has a first height H1 along its optical axis, which generally does not exceed 8 mm, for example, it can not exceed 6 mm. The conductive member 62 has a second height H2 between its surface / line away from lens assembly 61 and the light-emitting surface of lens assembly 61, which generally does not exceed 5 mm, for example, it can not exceed 4 mm. The conductive member 62 has a third height H3 between its surface / line away from lens assembly 61 and sensing device 40, which generally does not exceed 2 mm, for example, it can not exceed 1 mm. Therefore, in electronic device 200, the height H = H1 + H2 + H3 (occupying the height space of electronic device 100) of the conductive member 60 and sensing device 40 along the optical axis of lens assembly 61 generally does not exceed 15 mm, for example, it can not exceed 11 mm.

[0072] In other words, comparing electronic device 100 and electronic device 200, under the condition that all components are of equal thickness, the conductive components and sensing devices in electronic device 200 occupy a larger height space of the electronic device along the optical axis of the lens group.

[0073] To further illustrate the structural and performance differences between electronic devices 100 and 200, please refer to Table 1, which is a performance comparison table of electronic devices 100 and 200.

[0074] Table 1: Performance Comparison Table between Electronic Device 100 and Electronic Device 200

[0075]

[0076] As can be seen from the table above, electronic device 100 has certain advantages over electronic device 200 in terms of overall space occupation and optical performance.

[0077] Of course, in other embodiments, information from the lens group 31 (e.g., light or sound information) is incident on the first reflecting surface 321, and the information reflected at the first reflecting surface 321 is at least partially directly incident on the second reflecting surface 322. That is, the information reflected at the first reflecting surface 321 can be directly transmitted to the second reflecting surface 322 without passing through the third reflecting surface 323, and the light reflected at the second reflecting surface 322 can reach the sensing device 40. For example, taking a reflection angle θ of 45° for the conductive member 32 as an example, the information from the lens group 31 is directly reflected at the first reflecting surface 321 to the second reflecting surface 322, and then reflected at the second reflecting surface 322 to the sensing device 40.

[0078] Please see Figure 7 and Figure 8 , Figure 7 This is a partial structural schematic diagram of the electronic device 100 in some embodiments of this application. Figure 8 This is a partial structural schematic diagram of an electronic device 300 in some other embodiments of this application. The electronic device 300 generally includes a conductive component 70 and a sensing device 40. The conductive component 70 generally includes a lens group 71 and a conductive element 72, with the lens group 71 and the sensing device 40 disposed on opposite sides of the conductive element 72. For relevant technical features of the lens group 71 and the sensing device 40, please refer to the lens group 31 and the sensing device 40 in the foregoing embodiments.

[0079] like Figure 7 As shown, the conductive element 32 can be a prism, meaning that the conductive element 32 generally includes a first wall 32a, a second wall 32b, and a third wall 32c connected sequentially. The first wall 32a, the second wall 32b, and the third wall 32c enclose the information transmission channel of the conductive element 32. Specifically, the first wall 32a is positioned opposite to the aperture 102 / lens group 31, the second wall 32b is positioned opposite to the sensing device 40, and the third wall 32c is located on the side of the first wall 32a and the second wall 32b closest to the sensing device 40. That is, the first wall 32a and the second wall 32b constitute the sidewalls of the prism, and the third wall 32c constitutes the bottom wall of the prism.

[0080] In this embodiment, the first wall 32a is inclined relative to the third wall 32c, and the second wall 32b is also inclined relative to the third wall 32c. The included angle between the first wall 32a and the third wall 32c is substantially the same as the included angle between the second wall 32b and the third wall 32c. For example, the included angle generally does not exceed 45°, and preferably, the included angle can be 30°. In one embodiment, the surface of the first wall 32a near the third wall 32c forms at least a first reflective surface, the surface of the second wall 32b near the third wall 32c forms at least a second reflective surface, and the surface of the third wall 32c near both the first wall 32a and the second wall 32b forms at least a third reflective surface.

[0081] Furthermore, the first, second, and third reflecting surfaces can be smooth planes to facilitate the reflection of the aforementioned information. For example, the first reflecting surface can be formed on the surface of the first wall 32a by plating with metal materials such as aluminum or silver; the second reflecting surface can be formed on the surface of the second wall 32b by plating with metal materials such as aluminum or silver; and the third reflecting surface can be formed on the surface of the third wall 32c by plating with metal materials such as aluminum or silver. It is understandable that plating these surfaces with metal materials such as aluminum or silver can enable the reflecting surfaces to have a good specular reflection effect.

[0082] like Figure 8 As shown, the conductive element 72 can be a trapezoidal prism, meaning that the conductive element 72 generally includes a first wall 72a and a second wall 72b arranged opposite each other, and a third wall 72c and a fourth wall 72d arranged opposite each other. The first wall 72a, the second wall 72b, the third wall 72c, and the fourth wall 72d enclose the information transmission channel of the conductive element 72. Specifically, the first wall 72a is arranged opposite to the aperture 102 / lens group 31, and the second wall 72b is arranged opposite to the sensing device 40. The first wall 72a and the second wall 72b are located between the third wall 72c and the fourth wall 72d, that is, the third wall 72c and the fourth wall 72d are located between the first wall 72a and the second wall 72b. The third wall 72c is located between the fourth wall 72d and the sensing device 40. The third wall 72c and the fourth wall 72d are arranged substantially parallel, and the first wall 72a and the second wall 72b are inclined relative to the third wall 72c and the fourth wall 72d. The first wall 72a and the second wall 72b form the waist of the trapezoidal prism, and the third wall 72c and the fourth wall 72d form the lower base and the upper base of the trapezoidal prism, respectively. The projection of the fourth wall 72d onto the third wall 72c covers a portion of the third wall 72c but does not extend beyond it.

[0083] In this embodiment, the first wall 72a is inclined relative to the third wall 72c, and the second wall 72b is also inclined relative to the third wall 72c. The included angle between the first wall 72a and the third wall 72c is substantially the same as the included angle between the second wall 72b and the third wall 72c. For example, the included angle generally does not exceed 45°, and preferably, the included angle can be 30°. In one embodiment, the surface of the first wall 72a near the third wall 72c at least partially forms the first reflective surface, the surface of the second wall 72b near the third wall 72c at least partially forms the second reflective surface, and the surface of the third wall 72c near both the first wall 72a and the second wall 72b at least partially forms the third reflective surface.

[0084] Furthermore, the first, second, and third reflecting surfaces can be smooth planes to facilitate the reflection of the aforementioned information. For example, the first reflecting surface can be formed on the surface of the first wall 72a by plating with metal materials such as aluminum or silver; the second reflecting surface can be formed on the surface of the second wall 72b by plating with metal materials such as aluminum or silver; and the third reflecting surface can be formed on the surface of the third wall 72c by plating with metal materials such as aluminum or silver. It is understandable that plating these surfaces with metal materials such as aluminum or silver can enable the reflecting surfaces to have a good specular reflection effect.

[0085] Comparing the conductive element 32 and the conductive element 72, it can be seen that the height of the conductive element 72 in the optical axis direction of the lens group, i.e. the Z direction of the electronic device, is less than the corresponding height of the conductive element 32. This can further optimize the layout space occupied by the conductive components and the sensing device.

[0086] In one embodiment, the conductive element can be made of glass and manufactured using a cold-working process to extend the optical path. Of course, in other embodiments, the conductive element can also be made of other materials or manufactured using other processes to achieve the effect of extending the optical path. Further, the first and second reflective surfaces can be formed by coating a dielectric film to achieve specular reflection, and the third reflective surface can be formed by depositing an anti-reflection film, so that light rays from the side of the third reflective surface near the lens group can be transmitted through the third reflective surface, and light rays from the side of the third reflective surface away from the lens group can achieve total internal reflection on the third reflective surface.

[0087] In one embodiment, the conductive element is exemplified by a prism. The conductive element may comprise a single integral prism or a combination of multiple prisms. Optionally, the conductive element may connect two prisms together by optical bonding, and the prism bonding method may provide aperture screen printing to reduce or mitigate stray light.

[0088] It should be noted that the terms "first," "second," and "third" in the embodiments of this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," or "third" may explicitly or implicitly include at least one of those features.

[0089] The electronic device provided in this application embodiment can reduce the space occupied by the transmission component and the sensing device in the electronic device by placing the lens group and the sensing device on the same side of the transmission component, and can reduce the focusing stroke of the electronic device when focusing by moving the transmission component.

[0090] Additionally, this application also provides an electronic device. Please refer to [link / reference]. Figure 9 , Figure 9 This is a schematic block diagram of the structure of an electronic device 900 in some other embodiments of this application.

[0091] The electronic device may be, for example, a mobile electronic device, which may include: a memory 901, a processor (Central Processing Unit, CPU) 902, a circuit board (not shown), a power supply circuit, and a microphone 913. The circuit board is housed within the space enclosed by the housing; the CPU 902 and the memory 901 are mounted on the circuit board; the power supply circuit supplies power to the various circuits or devices of the electronic device; the memory 901 stores executable program code; the CPU 902 reads the executable program code stored in the memory 901 to run a computer program corresponding to the executable program code, thereby recognizing the aforementioned identification information to achieve unlocking and wake-up functions.

[0092] The electronic device may also include: a peripheral interface 903, an RF (Radio Frequency) circuit 905, an audio circuit 906, a speaker 911, a power management chip 908, other input / output (I / O) subsystem input / control devices, a touch screen 912, other input / control devices 910, and an external port 904. These components communicate via one or more communication buses or signal lines 907. The touch screen 912 may be the display screen 10 in the aforementioned embodiments.

[0093] The memory 901 can be accessed by the CPU 902, peripheral interface 903, etc. The memory 901 may include high-speed random access memory, and may also include non-volatile memory, such as one or more disk storage devices, flash memory devices, or other volatile solid-state storage devices. The peripheral interface 903 can connect the device's input and output peripherals to the CPU 902 and the memory 901.

[0094] The I / O subsystem 909 can connect input / output peripherals on the device, such as the touchscreen 912 and other input / control devices 910, to the peripheral interface 903. The I / O subsystem 909 may include a display controller 9091 and one or more input controllers 9092 for controlling other input / control devices 910. The one or more input controllers 9092 receive or send electrical signals to other input / control devices 910, which may include physical buttons (press buttons, rocker buttons, etc.), dial pads, slide switches, joysticks, and click wheels. It is worth noting that the input controllers 9092 can be connected to any of the following: a keyboard, an infrared port, a USB interface, and a pointing device such as a mouse.

[0095] The touchscreen 912 is an input and output interface between the user's electronic device and the user, displaying visual output to the user. The visual output can include graphics, text, icons, videos, etc.

[0096] The display controller 9091 in the I / O subsystem 909 receives or sends electrical signals to the touchscreen 912. The touchscreen 912 detects touches on the touchscreen, and the display controller 9091 converts the detected touches into interactions with user interface objects displayed on the touchscreen 912, thus realizing human-computer interaction. The user interface objects displayed on the touchscreen 912 can be icons for running games, icons for connecting to a corresponding network, etc.

[0097] The RF circuit 905 is primarily used to establish communication between the mobile phone and the wireless network (i.e., the network side), enabling the mobile phone to receive and send data with the wireless network. Examples include sending and receiving SMS messages and emails. Specifically, the RF circuit 905 receives and transmits RF signals, also known as electromagnetic signals. The RF circuit 905 converts electrical signals into electromagnetic signals or vice versa, and uses these electromagnetic signals to communicate with the communication network and other devices. The RF circuit 905 may include known circuits for performing these functions, including but not limited to antenna systems, RF transceivers, one or more amplifiers, tuners, one or more oscillators, digital signal processors, CODEC (Coder-Coder) chipsets, Subscriber Identity Modules (SIMs), etc.

[0098] The audio circuit 906 is mainly used to receive audio data from the peripheral interface 903, convert the audio data into electrical signals, and send the electrical signals to the speaker 911. The speaker 911 is used to convert the voice signals received by the mobile phone from the wireless network via the RF circuit 905 back into sound and play the sound to the user. The power management chip 908 is used to provide power and manage the power supply for the CPU 902, the I / O subsystem, and the hardware connected to the peripheral interface.

[0099] It should be noted that the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to those processes, methods, products, or setups.

[0100] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0101] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An electronic device, comprising: The electronic device comprises: a housing provided with a hole formed through a surface of the housing; a sensing device provided on one side of the hole in a direction orthogonal to an axis of the hole; and a conducting assembly comprising a lens group and a conducting member, the lens group being a long-focus lens group, the lens group being provided opposite the hole, the lens group and the sensing device being provided on the same side of the conducting member; wherein the conducting member has a first reflecting surface, a second reflecting surface, and a third reflecting surface provided between the first reflecting surface and the second reflecting surface, the third reflecting surface being provided on a side of the conducting member close to the lens group, light outside the electronic device being guided to the lens group via the hole, light from the lens group being incident on the first reflecting surface through the third reflecting surface, light reflected at the first reflecting surface being at least partially incident on the third reflecting surface, light reflected at the third reflecting surface being at least partially incident on the second reflecting surface, and light reflected at the second reflecting surface being at least partially transmitted through the third reflecting surface to reach the sensing device; the first reflecting surface and the second reflecting surface are provided with a film layer to form specular reflection, an included angle between the first reflecting surface and the third reflecting surface is less than 45°, and an included angle between the second reflecting surface and the third reflecting surface is less than 45°, and a height between a surface or a line of the conducting member away from the lens group and an exit surface of the lens group is not more than 5 mm.

2. The electronic device of claim 1, wherein, In a direction orthogonal to the axis of the hole, the lens group and the sensing device are provided side by side.

3. The electronic device of claim 1, wherein, Light incident on the first reflecting surface from the lens group is parallel to and opposite in direction to light reflected from the second reflecting surface to the sensing device.

4. The electronic device of claim 1, wherein, The first reflecting surface is formed by aluminizing or silvering a surface of a first wall of the conducting member, and the second reflecting surface is formed by aluminizing or silvering a surface of a second wall of the conducting member.

5. The electronic device of claim 1, wherein, The third reflecting surface is provided with an anti-reflection film to improve the transmittance of light on the third reflecting surface close to the lens group.

6. The electronic device of claim 1, wherein, The conducting member is configured to be movable relative to the lens group along an optical axis direction of the lens group to achieve focusing.

7. The electronic device of claim 1, wherein, At least one of the lens group and the sensing device is configured to be movable relative to the conducting member along the optical axis direction of the lens group to achieve focusing.

8. The electronic device of claim 1, wherein, A projection of the first reflecting surface on the third reflecting surface has a first width in a direction orthogonal to the optical axis of the lens group, and a projection of the lens group on the third reflecting surface has a second width in the direction orthogonal to the optical axis of the lens group, wherein the first width is not less than the second width.

9. The electronic device of claim 1, wherein, A projection of the second reflecting surface on the third reflecting surface has a third width in the direction orthogonal to the optical axis of the lens group, and a projection of the sensing device on the third reflecting surface has a fourth width in the direction orthogonal to the optical axis of the lens group, wherein the third width is not less than the fourth width.

10. The electronic device of claim 1, wherein, An optical axis of the lens group is collinear with an axis of the hole, and a height of the conducting assembly and the sensing device in the direction along the optical axis of the lens group is not more than 13 mm.

11. The electronic device of claim 10, wherein, The height of the lens group in the direction of the optical axis of the lens group is not more than 8 mm.

12. The electronic device of claim 1, wherein, The distance between the conducting member and the sensing device is not more than 2 mm.

13. The electronic device of claim 1, wherein, The conducting member comprises a first wall, a second wall and a third wall connected in sequence, the first wall is arranged opposite to the lens group, and the second wall is arranged opposite to the sensing device; wherein the first reflecting surface is formed on the first wall, the second reflecting surface is formed on the second wall, and the third reflecting surface is formed on the third wall.

14. The electronic device of claim 13, wherein, The included angle between the first wall and the third wall and the included angle between the second wall and the third wall are greater than or equal to 30° and less than 45°.

15. The electronic device of claim 13, wherein, The included angle between the first wall and the third wall and the included angle between the second wall and the third wall are greater than or equal to 25° and less than or equal to 35°.

16. The electronic device of claim 1, wherein, The conducting member comprises a first wall and a second wall arranged opposite to each other, and a third wall and a fourth wall arranged opposite to each other, the third wall and the fourth wall are arranged between the first wall and the second wall, the projection of the fourth wall on the third wall covers part of the third wall and does not exceed the third wall, the first wall is arranged opposite to the lens group, and the second wall is arranged opposite to the sensing device. The first reflecting surface is formed on the first wall, the second reflecting surface is formed on the second wall, the third wall is located between the fourth wall and the sensing device, and the third reflecting surface is formed on the third wall.

17. The electronic device of claim 16, wherein, The third wall and the fourth wall are arranged parallel to each other, the first wall and the second wall are arranged inclined to the third wall and the fourth wall, and the included angle between the first wall and the third wall and the included angle between the second wall and the third wall are less than 45°.

18. The electronic device of claim 1, wherein, The electronic device comprises a display screen, the shell is connected with the display screen and forms a containing space, the shell comprises a middle frame and a cover plate, the display screen and the cover plate are respectively arranged on opposite sides of the middle frame, the hole is arranged on the cover plate and communicates with the containing space, and the conducting assembly and the sensing device are arranged in the containing space.

19. The electronic device of claim 1, wherein, The lens group comprises a first lens, a second lens, a third lens and a fourth lens arranged in sequence, the fourth lens is arranged away from the hole relative to the first lens, the first lens is made of glass and is processed by grinding, and the second lens, the third lens and the fourth lens are made of plastic and are processed by injection molding.

20. The electronic device of claim 1, wherein, The conducting member comprises two prismically bonded prisms, and an aperture silk screen is arranged at the bonding position of the two prisms.

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