Sensor displacement assembly for camera module

Abstract

The invention relates to a sensor displacement assembly for a camera module. The invention relates to a camera. The camera includes an optical assembly having one or more lenses defining an optical axis. The camera also includes an image sensor and a housing forming an outer wall of the camera. The camera further includes an actuator assembly that moves the image sensor relative to the optical assembly. Further, the camera includes a base that is a static component of the camera, where the base includes a base facing in a direction parallel to the optical axis and away from the optical assembly. The camera also includes a flexure attached to the base, the flexure suspending the image sensor from the base and allowing movement of the image sensor effected by the actuator assembly. In some cases, the base does not extend between the flexure and the housing.

Description

Background Art Technical Field

[0001] The present disclosure generally relates to sensor-shift camera modules for actuation of image sensors.

[0002] Related technical description

[0003] The advent of small mobile multi-purpose devices such as smart phones and tablet or slate devices has led to a need for high-resolution, small-form-factor cameras to be integrated into the devices. Some cameras may incorporate an optical image stabilization (OIS) mechanism that can sense and react to external stimuli / disturbances by adjusting the position of the optical lens and / or image sensor on the X-axis and / or Y-axis in an attempt to compensate for undesirable movement of the lens. In addition, some cameras may incorporate an autofocus (AF) mechanism by which the focus of an object can be adjusted so that the object plane in front of the camera is focused at the image plane to be captured by the image sensor. In some such AF mechanisms, the optical lens and / or image sensor moves along the optical axis of the camera as a single rigid body to refocus the camera. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Figure 1 Components of an example camera having an actuator module or assembly are illustrated, according to at least some embodiments, which can be used, for example, to provide autofocus and / or optical image stabilization via image sensor movement in a small form factor camera. Figure 1 A top view of the exterior of the camera is shown.

[0005] Figure 2A and Figure 2B Components of an example camera having an actuator module or assembly are illustrated, according to at least some embodiments, which can be used, for example, to provide autofocus and / or optical image stabilization via image sensor movement in a small form factor camera. Figure 2A A cross-sectional view of the camera through the AA plane is shown. Figure 2B An exploded view of the camera is shown.

[0006] Figure 3 and Figure 4 Components of another example camera having an actuator module or assembly that can be used, for example, to provide autofocus and / or optical image stabilization via image sensor movement in a small form factor camera, according to at least some embodiments are illustrated. Figure 3 A cross-sectional view of the camera through the AA plane is shown. Figure 4 An exploded view of the camera is shown.

[0007] Figure 5 and Figure 6Components of another example camera having an actuator module or assembly that can be used, for example, to provide autofocus and / or optical image stabilization via image sensor movement in a small form factor camera in accordance with at least some embodiments are illustrated. Figure 5 A cross-sectional view of the camera through the AA plane is shown. Figure 6 An exploded view of the camera is shown.

[0008] Figure 7 Illustrated Figure 2A and Figure 2B The camera shown is Figure 3 and Figure 4 Cross-sectional comparison between the cameras shown.

[0009] Figure 8 Illustrated Figure 2A and Figure 2B The camera shown is Figure 5 and Figure 6 Cross-sectional comparison between the cameras shown.

[0010] Fig. 9 A schematic diagram illustrating an example device that may include a camera according to some embodiments.

[0011] Fig.10 Illustrated is a schematic block diagram of an example computing device, referred to as a computer system, that may include or host embodiments of a camera in accordance with some embodiments.

[0012] This specification includes references to "one embodiment" or "an embodiment." The appearance of the phrase "in one embodiment" or "in an embodiment" does not necessarily refer to the same embodiment. The particular features, structures or characteristics may be combined in any suitable manner consistent with the present disclosure.

[0013] The term "comprising" is open ended. As used in the appended claims, the term does not exclude additional structures or steps. Consider the following cited claim: "an apparatus comprising one or more processor units..." Such a claim does not exclude the apparatus from including additional components (e.g., a network interface unit, a graphics circuit, etc.).

[0014] "Configured to", various units, circuits or other components may be described or described as "configured to" perform one or more tasks. In such contexts, "configured to" is used to imply a structure (e.g., a circuit) that performs the one or more tasks during operation by indicating that the unit / circuit / component includes the structure. In this way, the unit / circuit / component is said to be configured to perform the task even when the specified unit / circuit / component is currently inoperable (e.g., not turned on). The units / circuits / components used with the "configured to" language include hardware-e.g., circuits, memories storing executable program instructions to implement operations, etc. The reference to a unit / circuit / component "configured to" perform one or more tasks is explicitly intended not to invoke the sixth paragraph of 35 U.S.C. §112 for the unit / circuit / component. In addition, "configured to" may include a general structure (e.g., a general circuit) manipulated by software and / or firmware (e.g., an FPGA or a general processor executing software) to operate in a manner capable of performing one or more tasks to be solved. "Configured to" may also include adapting a manufacturing process (eg, a semiconductor fabrication facility) to produce a device (eg, an integrated circuit) suitable for implementing or performing one or more tasks.

[0015] "First," "second," etc. As used herein, these terms act as labels for the nouns that precede them, and do not imply any type of ordering (e.g., spatial, temporal, logical, etc.). For example, a buffer circuit may be described herein as performing a write operation of a "first" value and a "second" value. The terms "first" and "second" do not necessarily imply that the first value must be written before the second value.

[0016] "Based on". As used herein, this term is used to describe one or more factors that influence a determination. This term does not exclude additional factors that influence a determination. That is, a determination may be based solely on these factors or at least in part on these factors. Consider the phrase "A is determined based on B". In this case, B is a factor that influences the determination of A, and such a phrase does not exclude that the determination of A may also be based on C. In other examples, A may be determined based solely on B.

[0017] It will also be understood that, although the terms "first", "second", etc. may be used to describe various elements in this article, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the expected scope, the first contact may be referred to as the second contact, and similarly, the second contact may be referred to as the first contact. Both the first contact and the second contact are contacts, but they are not the same contact.

[0018] The terms used in the description herein are only for describing specific embodiments and are not intended to be limiting. As used in the specification and the appended claims, the singular forms of "one", "a kind of" and "the" are intended to also cover the plural forms, unless the context clearly indicates otherwise. It will also be understood that the term "and / or" used herein refers to and covers any and all possible combinations of one or more items in the items listed in association. It will also be understood that the terms "including" and / or "comprising" when used in this specification specify the presence of stated features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or their grouping.

[0019] As used herein, the term "if" may be interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [a stated condition or event] is detected" may be interpreted to mean "upon determining that" or "in response to determining that" or "upon detecting [a stated condition or event]" or "in response to detecting [a stated condition or event]," depending on the context. DETAILED DESCRIPTION

[0020] Various embodiments described herein relate to actuator assemblies that can be used in cameras with movable image sensors. In some embodiments, a camera may include a camera device equipped with controls, magnets, flexures, and voice coil motors to improve the effectiveness of a micro-actuation mechanism for a compact camera module. More specifically, in some embodiments, a compact camera module includes an actuator for providing functions such as autofocus (AF) and optical image stabilization (OIS). One method of providing a very compact actuator for OIS and AF is to use a voice coil motor (VCM) arrangement.

[0021] In some embodiments, the actuator assembly can be used to provide AF and / or OIS for the camera. In some aspects, the axial actuator can drive an optical assembly having one or more lenses in one or more directions parallel to the optical axis (e.g., z direction) to provide auto focus. A lateral actuator separated from the axial actuator can drive an optical assembly and / or an image sensor in one or more directions orthogonal to the optical axis (e.g., x direction, y direction) to provide OIS. In some OIS sensor displacement actuators, the flexure holding the image sensor can be attached to the top surface of the camera base. The camera base can be an embedded injection molded base, which includes an intermediate frame inside, which mechanically strengthens the structure of the base and provides an electrical connector for grounding. The flexure may need to be grounded by the housing through the base. In this way, the base may have a molded thickness, which causes a large gap between the image sensor of the camera and the housing (e.g., outer wall). The large gap formed between the image sensor and the housing may limit the amount of heat dissipation generated by the image sensor, and therefore may limit the function of the sensor package, and limit the number of video modes that the camera can support. Furthermore, base thickness and large gaps may directly affect module shoulder height and lens top height, thus affecting system fit.

[0022] As described herein, the flexure holding the image sensor can be attached to the base of the camera with a relatively thin width so that the base does not extend below the flexure (e.g., between the flexure and the housing). The flexure is attached to the base via a downward facing base on the base (e.g., a base facing in a direction parallel to the optical axis and away from the optical assembly) rather than an upward facing base (e.g., a base facing in a direction parallel to the optical axis and toward the optical assembly). Because the base is thinner, the image sensor (or sensor reinforcement) can be directly grounded to the housing rather than grounded to the housing through an intermediate frame (e.g., a baffle) of the base. The flexure is attached to a downward facing base of the base having a relatively thin dimension (e.g., width) so that the base does not extend below the flexure (e.g., a static platform) (e.g., between the flexure and the housing), which can reduce the gap between the image sensor and the housing of the camera. The relatively small gap between the image sensor of the camera and the housing can increase heat dissipation on the housing, and thus improve the functionality of the sensor package, and increase the number of video modes that the camera can support. In addition, the relatively thin dimensions (e.g., width) of the base allow the base to not extend between the flexure and the housing, at least helping to create a relatively small gap, which can also provide camera module / camera shoulder height savings for different sensor mounting configurations. In some embodiments, the flexure mounting configuration can reduce the camera module height by approximately 250 microns (μm). In some embodiments, the flexure mounting configuration can reduce the module height by approximately 400 μm. In addition, in some embodiments, wire bonding can electrically connect the image sensor to the flexure to improve electronic signal transmission. In addition, the configurations described herein can reduce the warpage requirements for base molding and can allow a variety of different base manufacturing processes including metal injection molding (MIM).

[0023] Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings. In the detailed description that follows, numerous specific details are given in order to provide a thorough understanding of the present disclosure. However, it will be apparent to one of ordinary skill in the art that some embodiments may be implemented without these specific details. In other cases, well-known methods, processes, components, circuits, and networks are not described in detail so as not to unnecessarily obscure various aspects of the embodiments.

[0024] Figure 1 Components of an example camera 100 / 300 / 500 are shown having components that may be used, for example, to provide autofocus and / or optical image stabilization with image sensor movement in a small form factor camera, according to at least some embodiments. Figure 1 A top view of the exterior of the camera is shown. The camera 100 / 300 / 500 may include a Figure 2A , Figure 2B , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 One or more features that are the same or similar to the features described or illustrated in . Figure 1 The example XYZ coordinate system shown may be used to discuss aspects of components and / or systems and may apply to embodiments described throughout this disclosure.

[0025] In various embodiments, the camera 100 / 300 / 500 may include an optical assembly 103 having one or more lenses 102 (eg, Figure 2A , Figure 3 and Figure 5 Shield 110 may form an outer wall of a top portion (and in some cases a side portion) of camera 100 / 300 / 500 and may form one or more camera shoulders. Housing 113 may form an outer wall of a bottom portion of camera 100 / 300 / 500. Electrical connector 104 may extend from housing 113 (and shield 110) and may electrically connect camera 100 / 300 / 500 to an external device. For example, camera 100 / 300 / 500 may be connected to a Fig. 9 The camera 904b shown or Fig.10 The camera 1008 shown is the same as or similar to the camera 1008. Thus, the electrical connector 104 can extend from the housing 113 and can electrically connect the camera 100 / 300 / 500 to the housing 113, respectively. Fig. 9 The device 900 or Fig.10 In some aspects, the shield 110 can be mechanically attached to the base (e.g., Figure 2A and Figure 2B The base 114 shown, Figure 3 and Figure 4 The base 314 shown, and / or Figure 5 and Figure 6 The shield 110 may be mechanically coupled to the base via a housing 113 attached to both the shield 110 and the base.

[0026] Figure 2A and Figure 2B Components of an example camera 100 are illustrated having components that may be used, for example, to provide autofocus and / or optical image stabilization with image sensor movement in a small form factor camera, according to at least some embodiments. Figure 2A A cross-sectional view of the camera 100 through the AA plane is shown. Figure 2B 1 shows an exploded view of the camera 100. The camera 100 may include Figure 1 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 One or more features that are the same or similar to the features described or illustrated in . Figure 2A and Figure 2B The example XYZ coordinate system shown may be used to discuss aspects of components and / or systems and may apply to embodiments described throughout this disclosure.

[0027] Figure 2A and Figure 2B The camera 100 (eg, camera module) is illustrated having a relatively large gap 190 (eg, with respect to the camera module) between the image sensor 108 of the camera 100 and the housing 113. Figure 3 and Figure 4 The gap 390 of the camera 300 is compared with that of the camera 300, and Figure 5 and Figure 6590 of camera 500). The relatively large gap 190 formed between the image sensor 108 of camera 100 and the housing 113 may limit the amount of heat dissipated by the image sensor 108 through the housing 113, and may therefore limit the functionality of the sensor package and the number of video modes that camera 100 can support. For example, camera 100 may only be able to barely support a 4k / 120fps mode, and may not be able to support an 8k / 30fps mode. For example, for camera 100, when image sensor 127 uses a power mode of 4K120FPS, the peak temperature at the image sensor may be 70.2 degrees Celsius. Conversely, for camera 300 and / or camera 500, when image sensor 127 uses a power mode of 4K120FPS, the peak temperature at the image sensor may be 63.2 degrees Celsius. Therefore, when image sensor 127 uses a power mode of 8K30FPS, the configuration of cameras 300 and 500 is approximately 7 degrees Celsius cooler than camera 100. As another example, for camera 100, when image sensor 127 uses a power mode of 8K30FPS, the peak temperature at the image sensor may be 95.2 degrees Celsius. Conversely, for camera 300 and / or camera 500, when image sensor 127 uses a power mode of 8K30FPS, the peak temperature at the image sensor may be 84.2 degrees Celsius. Thus, when image sensor 127 uses a power mode of 8K30FPS, the configuration of cameras 300 and 500 is approximately 11 degrees Celsius cooler than camera 100. In addition, the thickness of the base 114 below the static platform 115 of the flexure 120 provides structural support for the upward facing base 161 coupling of the static platform 115 and creates a larger gap 190, which may directly affect the camera shoulder height 199 and the lens top height, thereby affecting the system fit.

[0028] like Figure 2A and Figure 2BAs shown, the camera 100 includes an optical axis 101 and an optical assembly 103 including one or more lenses 102. A lens holder 128 can hold the optical assembly 103. The lens holder 128 can include one or more auto focus (AF) coils 118 positioned circumferentially around the optical assembly 103 and the optical axis 101. A magnet holder 106 can be fixedly attached to the electrostatic shield 110. The magnet holder 106 can include one or more magnets that are used to magnetically interact with the AF coil 118 when current flows through the AF coil 118 to move the lens holder 128 and the optical assembly 103 along the optical axis (z) 101 for auto focus. The magnet and the AF coil 118 can be considered together as a voice coil motor (VCM) actuator that uses the Lorentz force to move the lens holder 128 and the optical assembly 103 along the optical axis (z) 101 for auto focus. When the Lorentz force causes the lens holder 128 and the optical assembly 103 to move along the optical axis 101, a corresponding AF spring 150 fixedly attached to the magnet holder 106 (and the static portion of the camera 100) and fixedly attached to the lens holder 128 can be used to inhibit movement of the lens holder 128 and the optical assembly 103 along the optical axis 101 relative to the magnet holder 106 and / or the shield 110.

[0029] The camera 100 also includes an image sensor 108, one or more filters 122a, a sensor stiffener 152, a substrate 134 (e.g., an OIS FPC, a printed circuit board, and / or the like) including an upper substrate 134a and a lower substrate 134b, a flexure 120, a baffle 153, a base 114, a shield 110, and a housing 130. The shield 110 may be mechanically attached to the base 114. The shield 110 may be mechanically coupled to the base 114 via a housing 113 attached to both the shield 110 and the base 114. The flexure 120 may include a dynamic platform 121, a static platform 115, and a plurality of flexure arms 124. The image sensor 108 may be held by the dynamic platform 121 such that the image sensor 108 moves as the dynamic platform 121 moves relative to the static portion of the camera 100. The plurality of flexure arms 124 may provide a flexible mechanical coupling between the static platform 115 and the dynamic platform 121. For example, the flexure arms 124 can allow the dynamic platform 121 (and therefore the image sensor 108) to move relative to the static platform 115 (e.g., the rest of the camera 100) in one or more directions orthogonal to the optical axis 101 using one or more lateral actuators. For example, the OIS coils 119 (e.g., as shown in FIG. 1 ) located on the substrate 134 can be moved relative to the static platform 115 (e.g., the rest of the camera 100) in one or more directions orthogonal to the optical axis 101. Figure 2B101 ) can interact with magnets in magnet holder 106 to generate Lorentz forces to move the dynamic platform 121 and image sensor 108 relative to the static platform 115 (e.g., the rest of the camera 100) in one or more directions orthogonal to the optical axis 101. In some aspects, the flexure arms 124 can allow the dynamic platform 121 (and therefore the image sensor 108) to move relative to the static platform 115 (e.g., the rest of the camera 100) in one or more directions parallel to or along the optical axis 101 using one or more axial actuators. The baffles 153 can prevent the dynamic platform 121 and image sensor from axially moving away from the optical assembly and in direct contact with the housing 113. In addition, the flexure arms 124 can allow the dynamic platform 121 (and therefore the image sensor 108) to move relative to the static platform 115 (e.g., the rest of the camera 100) in one or more angular directions about one or more axes orthogonal to the optical axis 101 using one or more axial actuators. Sensor stiffener 152 may be used to provide rigidity to image sensor 108 during movement, as described herein.

[0030] In some aspects, the flexure arm 124 may include electrical traces for transmitting electrical power and electrical signals between the dynamic platform 121 (e.g., one or more electronic components (e.g., electronic components 151) mounted (e.g., surface mounted) on a substrate (e.g., upper substrate block 134a), the image sensor 108 mounted on a substrate (e.g., lower substrate block 134b), one or more electronic components mounted on the dynamic platform 121, etc.) and the static platform 115. The static platform 115 can be fixedly attached to the base 114 via one or more mounts 161. For example, the base 114 may include one or more mounts 161 facing in a direction parallel to the optical axis 101 and facing the optical assembly 103. The static platform 115 can be located on the mounts 161 and can be in electrical communication with one or more other components of the camera 100 (e.g., via Figure 1 The electrical connector 104 is shown for performing one or more camera operations via the base 114.

[0031] In some non-limiting examples, the image sensor 108 may be attached to or otherwise integrated into the substrate 134 such that the image sensor 108 is connected to the OIS frame or flexure 120 via the substrate. For example, the dynamic platform 121 may hold a substrate (e.g., an upper substrate block 134a, a lower substrate block 134b) for mounting one or more electronic components 151 and / or the image sensor 108. In some aspects, the substrate 134 (e.g., the upper substrate block 134a and / or the lower substrate block 134b) may be formed of ceramic. The substrate 134 may include an opening having a cross-sectional size suitable for allowing light to pass therethrough while also receiving or holding the filter 122 and the image sensor 108. The upper surface of the substrate 134 (e.g., the upper surface of the lower substrate block 134b) may hold the filter 122 around the perimeter of the opening, and the lower surface of the substrate (e.g., the lower surface of the lower substrate block 134b) may hold the image sensor 108 around the perimeter of the opening. The lower substrate block 134b can couple the image sensor 108 to the upper substrate block 134a. With the lower surface of the substrate 134 holding the image sensor 108 around the perimeter of the opening, the image sensor 108 can be connected to the flexure 120 via the substrate 134 (e.g., mechanically and / or electrically). This configuration can allow the substrate to hold the image sensor 108 (and the filter 122) while also allowing light to pass from the lens of the optical assembly 103 through the filter 122 and be received by the image sensor 108 for image capture (e.g., a light receiving surface of the image sensor for image capture). In other embodiments, the substrate 134 and the image sensor 108 can be separately attached to the OIS frame or flexure 120. For example, a first set of one or more electrical traces can be routed between the substrate and the OIS frame or flexure 120. A different second set of one or more electrical traces can be routed between the image sensor 108 and the OIS frame or flexure 120.

[0032] As stated in this article, Figure 2A and Figure 2B The camera 100 (eg, camera module) is illustrated having a relatively large gap 190 (eg, with respect to the camera module) between the image sensor 108 of the camera 100 and the housing 113. Figure 3 and Figure 4 The gap 390 of the camera 300 is compared with that of the camera 300, and Figure 5 and Figure 6100). The relatively large gap 190 formed between the image sensor 108 and the housing 113 of the camera 100 may limit the amount of heat dissipated by the image sensor 108 through the housing 113, and may therefore limit the functionality of the sensor package, and limit the number of video modes that can be supported by the camera 100. For example, the camera 100 may only be able to barely support the 4k / 120fps mode, and may not be able to support the 8k / 30fps mode.

[0033] The flexure 120 is attached to the base 114 such that the static platform 115 of the flexure 120 can be attached to an upward-facing mount 161 of the base 114 (e.g., a mount that faces in a direction parallel to the optical axis and toward the optical assembly and / or lens 102). The portion of the base 114 that supports the mount 161 can form a relatively thick dimension (e.g., width) of the base 114 and create a relatively large gap 190 between the image sensor 108 (e.g., sensor stiffener 152) and the housing 113. As the flexure 120 and image sensor 108 move downward along the optical axis 101 and away from the optical assembly 103, the substrate 134 (e.g., substrate lower block 134b) can be ground against the baffle 153, thereby creating at least a portion of the gap 190 between the image sensor 108 and the housing 113. The flexure 120 is attached to the upward facing base 161 of the base 114 with a relatively thick width, so that the base 114 extends at least partially below the flexure 120 (e.g., static platform 115) (e.g., between the flexure and the housing), which may result in a relatively large gap 190 between the image sensor 108 of the camera 100 and the housing 113. The relatively large gap 190 between the image sensor 108 of the camera 100 and the housing 113 may reduce heat dissipation on the housing 113 and thus limit the functionality of the sensor package and limit the number of video modes that the camera 100 can support. For example, the camera 100 may only be able to barely support a 4k / 120fps mode and may not be able to support an 8k / 30fps mode. In addition, the relatively thick base 114, which at least contributes to the creation of the relatively large gap 190, can provide a relatively large z-height 199 of the camera module / camera shoulder height.

[0034] Figure 3 and Figure 4 Components of an example camera 300 are illustrated having components that may be used, for example, to provide autofocus and / or optical image stabilization with image sensor movement in a small form factor camera, according to at least some embodiments. Figure 3 A cross-sectional view of camera 300 through the AA plane is shown. Figure 4 300 is shown in an exploded view. The camera 300 may include Figure 1 , Figure 2A, Figure 2B , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 One or more features that are the same or similar to the features described or illustrated in . Figure 3 and Figure 4 The example XYZ coordinate system shown may be used to discuss aspects of components and / or systems and may be applicable to embodiments described throughout this disclosure. The flexure 120 holding the image sensor 108 may be attached to the base 314 of the camera, with a relatively thin portion not extending below the flexure 120 (e.g., the static platform 115) (e.g., between the flexure 120 and the housing 113).

[0035] Figure 3 and Figure 4 A camera 300 (eg, a camera module) is shown having a relatively small gap 390 (eg, with respect to the camera module) between the image sensor 108 of the camera 300 and the housing 113. Figure 2A and Figure 2B 190 compared to the gap 100 of the camera 100), which is at least partly due to the lack of Figure 2A and Figure 2BBaffle 153 shown. The relatively small gap 390 formed between the image sensor 108 of the camera 300 and the housing 113 can increase the amount of heat dissipated by the image sensor 108 through the housing 113, and thus can improve the functionality of the sensor package and increase the number of video modes that the camera 300 can support. For example, the camera 300 may be able to support a 4K120FPS mode, and may support an 8K30FPS mode. For example, for the camera 100, when the image sensor 127 uses the power mode of 4K120FPS, the peak temperature at the image sensor may be 70.2 degrees Celsius. Conversely, for the camera 300, when the image sensor 127 uses the power mode of 4K120FPS, the peak temperature at the image sensor may be 63.2 degrees Celsius. Therefore, when the image sensor 127 uses the power mode of 4K120FPS, the configuration of the camera 300 is approximately 7 degrees Celsius lower than that of the camera 100. As another example, for camera 100, when image sensor 127 uses the power mode of 8K30 FPS, the peak temperature at the image sensor may be 95.2 degrees Celsius. Conversely, for camera 300, when image sensor 127 uses the power mode of 8K30 FPS, the peak temperature at the image sensor may be 84.2 degrees Celsius. Thus, when image sensor 127 uses the power mode of 8K30 FPS, the configuration of camera 300 is approximately 11 degrees Celsius cooler than camera 100. In addition, the flexure 120 (e.g., static platform 115) is attached to the downward-facing base 361 of the base 314, and the base 314 below the static platform 115 of the flexure 120 is thinner so that the base does not extend below the flexure 120 (e.g., static platform 115) (e.g., between the flexure 120 and the housing 113), which can create a relatively smaller gap 390 between the image sensor 108 of the camera 300 and the housing 113 relative to the gap 190. This smaller gap 390 directly reduces the camera shoulder height 399 and the lens top height, thereby improving system fit.

[0036] like Figure 3 and Figure 4As shown, the camera 300 includes an optical axis 101 and an optical assembly 103 including one or more lenses 102. A lens holder 128 can hold the optical assembly 103. The lens holder 128 can include one or more auto focus (AF) coils 118 positioned circumferentially around the optical assembly 103 and the optical axis 101. A magnet holder 106 can be fixedly attached to the electrostatic shield 110. The magnet holder 106 can include one or more magnets that are used to magnetically interact with the AF coil 118 when current flows through the AF coil 118 to move the lens holder 128 and the optical assembly 103 along the optical axis (z) 101 for auto focus. The magnet and the AF coil 118 can be considered together as a voice coil motor (VCM) actuator that uses the Lorentz force to move the lens holder 128 and the optical assembly 103 along the optical axis (z) 101 for auto focus. When Lorentz forces cause the lens holder 128 and optical assembly 103 to move along the optical axis 101, a corresponding AF spring 150 fixedly attached to the magnet holder 106 (and therefore the static portion of the camera 300) and fixedly attached to the lens holder 128 can be used to inhibit movement of the lens holder 128 and optical assembly 103 along the optical axis 101 relative to the magnet holder 106 and / or the shield 110.

[0037] The camera 300 also includes an image sensor 108, one or more filters 122a, a sensor stiffener 152, a substrate 334 (e.g., an OIS FPC, a printed circuit board, and / or the like) including an upper substrate 334a and a lower substrate 334b, a flexure 120, a base 314, a shield 110, and a housing 130. The shield 110 may be mechanically attached to the base 314. The shield 110 may be mechanically coupled to the base 314 via a housing 113 attached to both the shield 110 and the base 314. The flexure 120 may include a dynamic platform 121, a static platform 115, and a plurality of flexure arms 124. The image sensor 108 may be held by the dynamic platform 121 so that the image sensor 108 moves as the dynamic platform 121 moves relative to the static portion of the camera 300. The plurality of flexure arms 124 may provide a flexible mechanical coupling between the static platform 115 and the dynamic platform 121. For example, the flexure arms 124 can allow the dynamic platform 121 (and therefore the image sensor 108) to move relative to the static platform 115 (e.g., the rest of the camera 300) in one or more directions orthogonal to the optical axis 101 using one or more lateral actuators. For example, the OIS coils 119 (e.g., as shown in FIG. 1 ) located on the substrate 334 can be moved relative to the static platform 115 (e.g., the rest of the camera 300) in one or more directions orthogonal to the optical axis 101. Figure 4101) can interact with magnets in the magnet holder 106 to generate Lorentz forces to move the dynamic platform 121 and the image sensor 108 relative to the static platform 115 (e.g., the rest of the camera 300) in one or more directions orthogonal to the optical axis 101. In some aspects, the flexure arms 124 can allow the dynamic platform 121 (and therefore the image sensor 108) to move relative to the static platform 115 (e.g., the rest of the camera 300) in one or more directions parallel to or along the optical axis 101 using one or more axial actuators. The image sensor stiffener 352 can provide rigidity to the image sensor 108 as the dynamic platform 121 and the image sensor 108 move axially away from the optical assembly 103 along the optical axis 101, and can be grounded into the housing 113. Additionally, the flexure arms 124 can allow the dynamic platform 121 (and therefore the image sensor 108 ) to move in one or more angular directions relative to the static platform 115 (e.g., the remainder of the camera 300 ) about one or more axes orthogonal to the optical axis 101 using one or more axial actuators.

[0038] In some aspects, the flexure arm 124 may include electrical traces for transmitting electrical power and electrical signals between the dynamic platform 121 (e.g., one or more electronic components (e.g., electronic components 151) mounted (e.g., surface mounted) on a substrate (e.g., upper substrate block 334a), the image sensor 108 mounted on a substrate (e.g., lower substrate block 334b), one or more electronic components mounted on the dynamic platform 121, etc.) and the static platform 115. The static platform 115 can be fixedly attached to the base 314 via one or more mounts 361. For example, the base 314 may include one or more mounts 361 facing in a direction parallel to the optical axis 101 and away from the optical assembly 103. The static platform 115 can be located on the mounts 361 and can be in electrical communication with one or more other components of the camera 300 (e.g., via Figure 1 The electrical connector 104 shown is used to perform one or more camera operations via the base 314.

[0039] In some non-limiting examples, the image sensor 108 may be attached to or otherwise integrated into the substrate 334 such that the image sensor 108 is connected to the OIS frame or flexure 120 via the substrate. For example, the dynamic platform 121 may hold a substrate (e.g., an upper substrate block 334a, a lower substrate block 334b) for mounting one or more electronic components 151 and / or the image sensor 108. In some aspects, the substrate 334 (e.g., an upper substrate block 334a and / or a lower substrate block 334b) may be formed of ceramic and organic materials. For example, the upper substrate block 334a may be formed of an organic material, and the lower substrate block 334b ​​may be formed of a ceramic material. The substrate 334 may include an opening having a cross-sectional size suitable for allowing light to pass therethrough while also receiving or holding the filter 122 and the image sensor 108. The upper surface of the substrate 334 (e.g., the upper surface of the substrate lower block 334b) can hold the filter 122 around the perimeter of the opening, and the lower surface of the substrate (e.g., the lower surface of the substrate lower block 334b) can hold the image sensor 108 around the perimeter of the opening. The substrate lower block 334b ​​can couple the image sensor 108 to the substrate upper block 334a. In the case where the lower surface of the substrate 334 holds the image sensor 108 around the perimeter of the opening, the image sensor 108 can be connected to the flexure 120 via the substrate 334 (e.g., mechanically and / or electrically). This configuration can allow the substrate to hold the image sensor 108 (and the filter 122) while also allowing light from the lens of the optical assembly 103 to pass through the filter 122 and be received by the image sensor 108 for image capture (e.g., the light receiving surface of the image sensor for image capture). In other embodiments, the substrate 334 and the image sensor 108 can be attached to the OIS frame or the flexure 120 separately. For example, a first set of one or more electrical traces may be routed between the substrate and the OIS frame or flexure 120. A second, different set of one or more electrical traces may be routed between the image sensor 108 and the OIS frame or flexure 120.

[0040] The camera 300 (eg, camera module) may have a relatively small gap 390 (eg, at least 100 mm) between the image sensor 108 of the camera 300 and the housing 113. Figure 2A and Figure 2B The relatively small gap 390 formed between the image sensor 108 (e.g., image sensor stiffener 352) and the housing 113 of the camera 300 can enhance the amount of heat dissipated by the image sensor 108 through the housing 113, and thus can improve the functionality of the sensor package and increase the number of video modes that the camera 300 can support (e.g., relative to the image sensor stiffener 352). Figure 2A and Figure 2BFor example, the camera 300 may improve support for the 4k / 120fps mode and may support the 8k / 30fps mode.

[0041] The flexure 120 can be attached to the base 314 such that the static platform 115 of the flexure 120 can be attached to a downward-facing base 361 of the base 314 (e.g., a base facing in a direction parallel to the optical axis and away from the optical assembly and / or lens 102), rather than an upward-facing base (e.g., a base facing in a direction parallel to the optical axis and toward the optical assembly and / or lens 102, Figure 2A and Figure 2B The base 161 of the embodiment of the present invention can allow the image sensor 108 (e.g., and the image sensor reinforcement 352) to be moved (e.g., away from the optical assembly 103 and / or the lens 102) to the housing 113 so that the image sensor 108 (e.g., the image sensor reinforcement 352) is in direct contact with the housing 113, rather than through an intermediate frame of the base 314 (e.g., Figure 2A and Figure 2B The base 114, Figure 2A and Figure 2B The flexure 120 (e.g., static platform 115) is attached to the downward facing base 361 of the base 314, with a relatively thin portion (e.g., between the flexure 120 and the housing 113) that does not extend below the flexure 120 (e.g., static platform 115), which can create a gap 390 between the image sensor 108 of the camera 300 and the housing 113 that is smaller than the gap 190. The gap 390 can be located between the image sensor 108 (e.g., image sensor stiffener 352) and the housing 113 so that no object exists in the gap 309 between the image sensor 108 (e.g., image sensor stiffener 352) and the housing 113. In other words, the image sensor 108 (e.g., image sensor stiffener 352) can be the moving component of the camera 300 that is closest to the housing 113 (e.g., at or near the optical axis 101). The relatively small gap 390 between the image sensor 108 of the camera 300 and the housing 113 can increase heat dissipation on the housing 113, remove heat from the camera 300 (e.g., the image sensor 108 of the camera 300) more quickly, and thus improve the functionality of the sensor package, and increase the number of video modes that the camera 300 can support (e.g., relative to the image sensor 108 of the camera 300). Figure 2A and Figure 2B100). In addition, the relatively thin base does not extend between the flexure 120 and the housing 113, which at least helps to create a relatively small gap 390, thereby providing a camera module / camera shoulder height reduced z-height 399 (e.g., compared to camera module / camera shoulder height z-height 199) for different sensor mounting configurations. In some embodiments, the flexure mounting configuration can reduce the camera module height / camera shoulder height, z-height, by about 250 μm, so that Figure 3 and Figure 4 The z-height is 399. Figure 2A and Figure 2B The z-height 199 is less than 250 μm. In addition, the configuration described herein can reduce the warpage requirements of the base molding and can allow a variety of different base manufacturing processes including metal injection molding (MIM).

[0042] Figure 5 and Figure 6 Components of an example camera 500 are illustrated having components that may be used, for example, to provide autofocus and / or optical image stabilization with image sensor movement in a small form factor camera, according to at least some embodiments. Figure 5 A cross-sectional view of camera 500 through the AA plane is shown. Figure 6 5 shows an exploded view of camera 500. Camera 500 may include Figure 1 , Figure 2A , Figure 2B , Figure 3 , Figure 4 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 One or more features that are the same or similar to the features described or illustrated in . Figure 5 and Figure 6 The example XYZ coordinate system shown may be used to discuss aspects of components and / or systems and may be applicable to embodiments described throughout this disclosure. The flexure 520 holding the image sensor 108 may be attached to the base 314 of the camera, with a relatively thin portion not extending below the flexure 520 (e.g., the static platform 515) (e.g., between the flexure 520 and the housing 113).

[0043] Figure 5 and Figure 6 The camera 500 is shown with a relatively small gap 590 (eg, with respect to the housing 113) between the image sensor 108 of the camera 500 (eg, the camera module) and the housing 113. Figure 2A and Figure 2B The gap of the camera 100 is 190 compared with Figure 3 and Figure 4390 of the camera 300), which is at least in part due to the lack of Figure 2A and Figure 2B The baffle 153 shown and / or at least partially due to the lack of Figure 2A , Figure 2B , Figure 3 and Figure 4 The image sensor reinforcement 152 shown. The relatively small gap 590 formed between the image sensor 108 of the camera 500 and the housing 113 can increase the amount of heat dissipated by the image sensor 108 through the housing 113, and thus can improve the functionality of the sensor package and increase the number of video modes that the camera 500 can support. For example, the camera 500 may be able to support a 4K120FPS mode, and may support an 8K30FPS mode. For example, for the camera 100, when the image sensor 127 uses the power mode of 4K120FPS, the peak temperature at the image sensor may be 70.2 degrees Celsius. Conversely, for the camera 500, when the image sensor 127 uses the power mode of 4K120FPS, the peak temperature at the image sensor may be 63.2 degrees Celsius. Therefore, when the image sensor 127 uses the power mode of 4K120FPS, the configuration of the camera 500 is approximately 7 degrees Celsius lower than that of the camera 100. As another example, for camera 100, when image sensor 127 uses a power mode of 8K30FPS, the peak temperature at the image sensor may be 95.2 degrees Celsius. Conversely, for camera 500, when image sensor 127 uses a power mode of 8K30FPS, the peak temperature at the image sensor may be 84.2 degrees Celsius. Thus, when image sensor 127 uses a power mode of 8K30FPS, camera 500 is configured approximately 11 degrees Celsius cooler than camera 100. In addition, flexure 520 (e.g., static platform 515) is attached to downward-facing base 361 of base 314, and base 314 is thinner below static platform 115 of flexure 120 such that the base does not extend below flexure 120 (e.g., static platform 515) (e.g., between flexure 520 and housing 113), which may create a gap between image sensor 108 and housing 113 of camera 500 relative to the base 361 of base 314. Figure 2A and Figure 2B The gap 190 shown and Figure 3 and Figure 4 The gap 390 shown is relatively small compared to the gap 590. This smaller gap 590 directly reduces the camera shoulder height 599 and the lens top height, thereby improving system fit. In addition, the camera 500 does not include a baffle or sensor reinforcement. Instead, the dynamic platform 521 of the flexure 520 extends completely under the image sensor 108 so that there is no hole through the dynamic platform along the optical axis 101, eliminating the need for a baffle and / or sensor reinforcement, and relative to Figure 2A and Figure 2B The gap is 190 and relative to Figure 3 and Figure 4 The gap 390 further reduces the size of the gap 590.

[0044] like Figure 5 and Figure 6 As shown, camera 500 includes an optical axis 101 and an optical assembly 103 including one or more lenses 102. A lens holder 128 can hold the optical assembly 103. The lens holder 128 can include one or more auto focus (AF) coils 118 positioned circumferentially around the optical assembly 103 and the optical axis 101. A magnet holder 106 can be fixedly attached to the electrostatic shield 110. The magnet holder 106 can include one or more magnets that are used to magnetically interact with the AF coil 118 when current flows through the AF coil 118 to move the lens holder 128 and the optical assembly 103 along the optical axis (z) 101 for auto focus. The magnet and AF coil 118 can be considered together as a voice coil motor (VCM) actuator that uses the Lorentz force to move the lens holder 128 and the optical assembly 103 along the optical axis (z) 101 for auto focus. When Lorentz forces cause the lens holder 128 and optical assembly 103 to move along the optical axis 101, a corresponding AF spring 150 fixedly attached to the magnet holder 106 (and therefore the static portion of the camera 500) and fixedly attached to the lens holder 128 can be used to inhibit movement of the lens holder 128 and optical assembly 103 along the optical axis 101 relative to the magnet holder 106 and / or the shield 110.

[0045] The camera 500 also includes an image sensor 108, one or more filters 122a, a substrate 534 (e.g., an OIS FPC, a printed circuit board, and / or the like) including an upper substrate 534a and a lower substrate 534b, a flexure 520, a base 314, a shield 110, and a housing 130. The shield 110 may be mechanically attached to the base 314. The shield 110 may be mechanically coupled to the base 314 via a housing 113 attached to both the shield 110 and the base 314. The flexure 520 may include a dynamic platform 521, a static platform 515, and a plurality of flexure arms 524. The image sensor 108 may be held by the dynamic platform 521 so that the image sensor 108 moves as the dynamic platform 521 moves relative to the static portion of the camera 500. The plurality of flexure arms 524 may provide a flexible mechanical coupling between the static platform 515 and the dynamic platform 521. For example, the flexure arms 524 can allow the dynamic platform 521 (and therefore the image sensor 108) to move relative to the static platform 515 (e.g., the rest of the camera 300) in one or more directions orthogonal to the optical axis 101 using one or more lateral actuators. For example, the OIS coils 119 (e.g., as shown in FIG. 1 ) located on the substrate 534 can be moved relative to the static platform 515 (e.g., the rest of the camera 300) in one or more directions orthogonal to the optical axis 101. Figure 6 101 ) can interact with magnets in magnet holder 106 to generate Lorentz forces, thereby moving the dynamic platform 521 and image sensor 108 relative to the static platform 515 (e.g., the rest of the camera 500) in one or more directions orthogonal to the optical axis 101. In some aspects, the flexure arm 524 can allow the dynamic platform 521 (and therefore the image sensor 108) to move relative to the static platform 515 (e.g., the rest of the camera 500) in one or more directions parallel to or along the optical axis 101 using one or more axial actuators. In addition, the flexure arm 524 can allow the dynamic platform 521 (and therefore the image sensor 108) to move relative to the static platform 515 (e.g., the rest of the camera 500) in one or more angular directions around one or more axes orthogonal to the optical axis 101 using one or more axial actuators.

[0046] Different from Figure 2A , Figure 2B , Figure 3 and Figure 4108, the flexure 120 may include a dynamic platform 521 extending completely under the image sensor 108 such that there is no opening through the dynamic platform 521 that intersects the optical axis 101. Extending the dynamic platform 521 completely across the image sensor 108 may eliminate the need for a baffle or sensor reinforcement to protect the image sensor 108 when the dynamic platform is fully extended and grounded against the housing 113, which may further reduce the size of the gap 590 compared to the gap 390 and the gap 190. In some aspects, one or more end stops 553 (e.g., formed of polyimide (PI)) may be attached to the underside of the dynamic platform 521 to inhibit contact between the dynamic platform 521 and the housing 113.

[0047] In some aspects, the flexure arm 524 may include electrical traces for transmitting electrical power and electrical signals between the dynamic platform 521 (e.g., one or more electronic components (e.g., electronic components 151) mounted (e.g., surface mounted) on a substrate (e.g., upper substrate block 534a), the image sensor 108 mounted on a substrate (e.g., lower substrate block 534b), one or more electronic components mounted on the dynamic platform 521, etc.) and the static platform 515. The static platform 515 can be fixedly attached to the base 314 via one or more mounts 361. For example, the base 314 may include one or more mounts 361 facing in a direction parallel to the optical axis 101 and away from the optical assembly 103. The static platform 515 can be located on the mounts 361 and can be in electrical communication with one or more other components of the camera 500 (e.g., via Figure 1 The electrical connector 104 shown is used to perform one or more camera operations via the base 314.

[0048] In some non-limiting examples, the image sensor 108 can be directly connected to the OIS frame or flexure 520. For example, the dynamic platform 521 can hold a substrate 534 (e.g., a substrate upper block 534a, a substrate lower block 534b) and an image sensor 108 for mounting one or more electronic components 151. One or more wire bonds 552 can electrically connect the image sensor 108 located on the dynamic platform 521 to the dynamic platform 521. In some aspects, the substrate 534 (e.g., the substrate upper block 534a and / or the substrate lower block 534b) can be formed of an organic material. For example, the substrate upper block 534a can be formed of an organic material, and the substrate lower block 534b can also be formed of an organic material. Forming the substrate 534 with an organic material can better facilitate electrical transmission compared to a ceramic material. The substrate 534 may include an opening having a cross-sectional size suitable for allowing light to pass therethrough to reach the image sensor 108 while also receiving or holding the filter 122. The upper surface of the substrate 534 (e.g., the upper surface of the lower substrate block 534b) can hold the filter 122 around the perimeter of the opening, and the dynamic platform 521 attached to the lower substrate block 534b can hold the image sensor 108. This configuration can allow light to pass from the lens of the optical assembly 103 through the filter 122 and be received by the filter 122 and the image sensor 108 for image capture (e.g., the light receiving surface of the image sensor for image capture).

[0049] The camera 500 (eg, camera module) may have a relatively small gap 590 (eg, at least 100 mm) between the image sensor 108 of the camera 500 and the housing 113. Figure 2A and Figure 2B The gap 190 of the camera 100 is compared with that of the camera 100, and at least Figure 3 and Figure 4 The relatively small gap 590 formed between the image sensor 108 of the camera 500 and the housing 113 can enhance the amount of heat dissipated by the image sensor 108 through the housing 113, and thus can improve the functionality of the sensor package and increase the number of video modes that the camera 500 can support (e.g., relative to the gap 390 of the camera 300). Figure 2A and Figure 2B The camera 100 and the Figure 3 and Figure 4 For example, the camera 500 may improve support for the 4k / 120fps mode and may support the 8k / 30fps mode.

[0050] The flexure 520 can be attached to the base 314 such that the static platform 515 of the flexure 520 can be attached to a downward-facing base 361 of the base 314 (e.g., a base facing in a direction parallel to the optical axis and away from the optical assembly and / or lens 102), rather than an upward-facing base (e.g., a base facing in a direction parallel to the optical axis and toward the optical assembly and / or lens 102, Figure 2A and Figure 2B The base 161 of the base 314 can allow the image sensor 108 and the dynamic platform 521 to move (e.g., move away from the optical assembly 103 and / or the lens 102) to the housing 113 so that the image sensor 108 (e.g., the dynamic platform 521, the end stop 553) is in direct contact with the housing 113, rather than through an intermediate frame of the base 314 (e.g., Figure 2A and Figure 2B The base 114, Figure 2A and Figure 2B The flexure 520 (e.g., static platform 515) is attached to a downward-facing base 361 of the base 314, having a relatively thin portion (e.g., between the flexure 120 and the housing 113) that does not extend below the flexure 520 (e.g., static platform 515), which can create a gap 590 between the image sensor 108 of the camera 500 and the housing 113 that is smaller than the gap 190 and the gap 390. In some aspects, one or more end stops 553 (e.g., formed of polyimide (PI)) can be attached to the underside of the dynamic platform 521 to inhibit contact between the dynamic platform 521 and the housing 113. In addition, unlike Figure 2A , Figure 2B , Figure 3 and Figure 4 108, the flexure 120 including the dynamic platform 521 extends completely under the image sensor 108 such that there is no opening through the dynamic platform 521 that intersects the optical axis 101. Extending the dynamic platform 521 completely across and under the image sensor 108 can eliminate the need for a baffle or sensor reinforcement to protect the image sensor 108 when the dynamic platform is fully extended and grounded against the housing 113, which further reduces the gap 590 compared to the gaps 190 and 390.

[0051] The relatively small gap 590 between the image sensor 108 of the camera 500 and the housing 113 can increase heat dissipation on the housing 113, remove heat from the camera 500 (e.g., the image sensor 108 of the camera 500) more quickly, and thus improve the functionality of the sensor package (e.g., the image sensor 108), and increase the number of video modes that the camera 500 can support (e.g., relative to Figure 2A and Figure 2B100). Additionally, the relatively thin base allows the base to not extend between the flexure 520 and the housing 113, which at least helps create a relatively small gap 590, thereby providing a camera module / camera shoulder height reduction z-height 599 (e.g., compared to camera module / camera shoulder height z-height 199 and camera module / camera shoulder height z-height 399) (and / or lens top height) for different sensor mounting configurations. The relatively small gap 590 can be located between the flexure 520 (e.g., dynamic platform 521, end stop 553) and the housing 113 so that no object is present in the relatively small gap 509 between the flexure 520 (e.g., dynamic platform 521, end stop 553) and the housing 113. In other words, the flexure 520 (e.g., dynamic platform 521, end stop 553) can be the moving portion of the camera 500 closest to the housing 113 (e.g., at or near the optical axis 101). In some embodiments, the flexure mounting configuration can reduce the camera module height / camera shoulder height, z-height, by about 400 μm, such that Figure 5 and Figure 6 The z-height of 599 is Figure 2A and Figure 2B The z-height 199 of the module is less than 400 μm. In some embodiments, the flexure mounting configuration can reduce the module height by about 400 μm. In addition, in some embodiments, wire bonds 552 can electrically connect the image sensor to the flexure to improve electronic signal transmission. In addition, the configuration described herein can reduce the warpage requirements of the base molding and can allow a variety of different base manufacturing processes including metal injection molding (MIM).

[0052] Figure 7 Illustrated Figure 2A and Figure 2B The camera 100 is shown with Figure 3 and Figure 4Cross-sectional comparison between the cameras 300 shown. As described herein, the camera 300 (e.g., the camera module) has a relatively smaller gap 390 compared to the gap 190 between the image sensor 108 and the housing 113 of the camera 100. This is due, at least in part, to the lack of the baffle 153 in the camera 100. The relatively smaller gap 390 formed between the image sensor 108 and the housing 113 of the camera 300 can increase the amount of heat dissipated through the housing 113 by the image sensor 108, and thus can improve the functionality of the sensor package and increase the number of video modes that the camera 300 can support. For example, the camera 300 may be able to support a 4K120FPS mode, and may support an 8K30FPS mode. For example, for the camera 100, when the image sensor 127 uses the power mode of 4K120FPS, the peak temperature at the image sensor can be 70.2 degrees Celsius. Conversely, for camera 300, when image sensor 127 uses a power mode of 4K120FPS, the peak temperature at the image sensor may be 63.2 degrees Celsius. Thus, when image sensor 127 uses a power mode of 4K120FPS, camera 300 is configured approximately 7 degrees Celsius cooler than camera 100. As another example, for camera 100, when image sensor 127 uses a power mode of 8K30FPS, the peak temperature at the image sensor may be 95.2 degrees Celsius. Conversely, for camera 300, when image sensor 127 uses a power mode of 8K30FPS, the peak temperature at the image sensor may be 84.2 degrees Celsius. Thus, when image sensor 127 uses a power mode of 8K30FPS, camera 300 is configured approximately 11 degrees Celsius cooler than camera 100. In addition, the flexure 120 (e.g., static platform 115) is attached to the downward-facing base 361 of the base 314, and the base 314 below the static platform 115 of the flexure 120 is thinner so that the base does not extend below the flexure 120 (e.g., static platform 115) (e.g., between the flexure 120 and the housing 113), which can create a relatively smaller gap 390 between the image sensor 108 and the housing 113 of the camera 300 relative to the gap 190. This smaller gap 390 directly reduces the camera shoulder height 399 and the lens top height, thereby improving system fit. For example, as Figure 7 As shown, the smaller gap 390 of camera 300 may provide camera 300 with a z-height saving 799 of approximately 250 μm compared to camera 100 .

[0053] Figure 8 Illustrated Figure 2A and Figure 2B The camera 100 is shown with Figure 5 and Figure 65. As described herein, camera 500 (e.g., camera module) has a relatively smaller gap 590 than gap 190 of camera 100 and gap 390 of camera 300 between image sensor 108 and housing 113 of camera 500. This is due, at least in part, to the lack of baffle 153 included in camera 100 and / or the lack of Figure 2A , Figure 2B , Figure 3 and Figure 4 . The relatively small gap 590 formed between the image sensor 108 of the camera 500 and the housing 113 can increase the amount of heat dissipated by the image sensor 108 through the housing 113, and thus can improve the functionality of the sensor package and increase the number of video modes that the camera 500 can support. For example, the camera 500 may be able to support a 4K120FPS mode, and may support an 8K30FPS mode. For example, for the camera 100, when the image sensor 127 uses a power mode of 4K120FPS, the peak temperature at the image sensor may be 70.2 degrees Celsius. Conversely, for the camera 500, when the image sensor 127 uses a power mode of 4K120FPS, the peak temperature at the image sensor may be 63.2 degrees Celsius. Therefore, when the image sensor 127 uses a power mode of 4K120FPS, the configuration of the camera 500 is approximately 7 degrees Celsius lower than that of the camera 100. As another example, for camera 100, when image sensor 127 uses a power mode of 8K30FPS, the peak temperature at the image sensor may be 95.2 degrees Celsius. Conversely, for camera 500, when image sensor 127 uses a power mode of 8K30FPS, the peak temperature at the image sensor may be 84.2 degrees Celsius. Thus, when image sensor 127 uses a power mode of 8K30FPS, camera 500 is configured approximately 11 degrees Celsius cooler than camera 100. In addition, flexure 520 (e.g., static platform 515) is attached to downward-facing base 361 of base 314, and base 314 is thinner below static platform 115 of flexure 120 such that the base does not extend below flexure 120 (e.g., static platform 515) (e.g., between flexure 520 and housing 113), which may create a gap between image sensor 108 and housing 113 of camera 500 relative to the base 361 of base 314. Figure 2A and Figure 2B The gap 190 shown and Figure 3 and Figure 4The gap 390 shown is relatively small compared to the gap 590. This smaller gap 590 directly reduces the camera shoulder height 599 and the lens top height, thereby improving system fit. In addition, the camera 500 does not include a baffle or sensor reinforcement. Instead, the dynamic platform 521 of the flexure 520 extends completely under the image sensor 108 so that there is no hole through the dynamic platform along the optical axis 101, eliminating the need for a baffle and / or sensor reinforcement, and relative to Figure 2A and Figure 2B The gap is 190 and relative to Figure 3 and Figure 4 The gap 390 further reduces the size of the gap 590. Figure 8 As shown, the smaller gap 590 of camera 500 may provide camera 500 with a z-height saving 899 of approximately 400 μm as compared to camera 100 .

[0054] Fig. 9 A camera (e.g., as described herein with reference to Figure 1 , Figure 2A , Figure 2B , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Fig.10 Schematic diagram of an example device 900 of the present invention (described in detail in the accompanying drawings). In some embodiments, the device 900 can be a mobile device and / or a multi-function device. In various embodiments, the device 900 can be any of various types of devices, including, but not limited to: a personal computer system, a desktop computer, a laptop computer, a notebook computer, a tablet computer, an all-in-one computer, a tablet or netbook computer, a mainframe computer system, a handheld computer, a workstation, a network computer, a camera, a set-top box, a mobile device, an augmented reality (AR) and / or virtual reality (VR) headset, a consumer device, a video game controller, a handheld video game device, an application server, a storage device, a television, a video recording device, a peripheral device (such as a switch, a modem, a router), or generally any type of computing or electronic device.

[0055] In some embodiments, the device 900 may include a display system 902 (e.g., including a display and / or a touch-sensitive surface) and / or one or more cameras 904. In some non-limiting embodiments, the display system 902 and / or one or more forward-facing cameras 904a may be disposed on the front side of the device 900, e.g., Fig. 9Additionally or alternatively, one or more rear-facing cameras 904b may be disposed at the rear side of the device 900. In some embodiments including multiple cameras 904, some or all of the cameras may be identical or similar to one another. Additionally or alternatively, some or all of the cameras may be different from one another. In various embodiments, the location and / or arrangement of the cameras 904 may differ from one another. Fig. 9 Those cameras indicated in .

[0056] The device 900 may include, among other things, a memory 906 (e.g., including an operating system 908 and / or application / program instructions 910), one or more processors and / or controllers 912 (e.g., including a CPU, a memory controller, a display controller, and / or a camera controller, etc.), and / or one or more sensors 916 (e.g., an orientation sensor, a proximity sensor, and / or a position sensor, etc.). In some embodiments, the device 900 may communicate with one or more other devices and / or services such as a computing device 918, a cloud service 920, etc. via one or more networks 922. For example, the device 900 may include a network interface (e.g., a network interface 910) that enables the device 900 to transmit data to a network 922 and to receive data from the network. Additionally or alternatively, the device 900 may be able to communicate with other devices via wireless communications using any of a variety of communication standards, protocols, and / or technologies.

[0057] Fig.10 A schematic block diagram of an example computing device, referred to as computer system 1000, is shown that may include or house an embodiment of a camera (e.g., as referred to herein). Figure 1 , Figure 2A , Figure 2B , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 In addition, the computer system 1000 may implement methods for controlling the operation of a camera and / or for performing image processing on images captured by a camera (including the cameras 100, 300, and 500 described herein). In some embodiments, the device 1000 (described herein with reference to Fig.10 The ) may additionally or alternatively include some or all of the functional components of the computer system 700 described herein.

[0058] The computer system 1000 may be configured to perform any or all of the embodiments described above. In various embodiments, the computer system 1000 may be any of various types of devices, including, but not limited to, a personal computer system, a desktop computer, a laptop computer, a notebook computer, a tablet computer, an all-in-one computer, a tablet or netbook computer, a mainframe computer system, a handheld computer, a workstation, a network computer, a camera, a set-top box, a mobile device, an augmented reality (AR) and / or virtual reality (VR) headset, a consumer device, a video game controller, a handheld video game device, an application server, a storage device, a television, a video recording device, a peripheral device (such as a switch, a modem, a router), or generally any type of computing or electronic device.

[0059] In the illustrated embodiment, the computer system 1000 includes one or more processors 1002 coupled to a system memory 1004 via an input / output (I / O) interface 1006. The computer system 1000 also includes one or more cameras 1008 coupled to the I / O interface 1006. The computer system 1000 also includes a network interface 1010 and one or more input / output devices 1012, such as a cursor control device 1014, a keyboard 1016, and a display 1018, coupled to the I / O interface 1006. In some cases, it is contemplated that embodiments may be implemented using a single instance of the computer system 1000, while in other embodiments, multiple such systems or multiple nodes making up the computer system 1000 may be configured to host different portions or instances of the embodiments. For example, in one embodiment, some elements may be implemented via one or more nodes of the computer system 1000 that are different from those nodes that implement other elements.

[0060] In various embodiments, computer system 1000 may be a uniprocessor system including one processor 1002, or a multiprocessor system including a number of processors 1002 (e.g., two, four, eight, or another suitable number). Processor 1002 may be any suitable processor capable of executing instructions. For example, in various embodiments, processor 1002 may be a general-purpose or embedded processor that implements any of a variety of instruction set architectures (ISAs), such as x86, PowerPC, SPARC, or MIPS ISAs, or any other suitable ISAs. In a multiprocessor system, each of processors 1002 may typically, but need not necessarily, implement the same ISA.

[0061] The system memory 1004 may be configured to store program instructions 1020 accessible by the processor 1002. In various embodiments, the system memory 1004 may be implemented using any suitable memory technology, such as static random access memory (SRAM), synchronous dynamic RAM (SDRAM), non-volatile / flash type memory, or any other type of memory. In addition, the existing camera control data 1022 of the memory 1004 may include any of the above-mentioned information or data structures. In some embodiments, the program instructions 1020 and / or data 1022 may be received, sent, or stored on different types of computer-accessible media or similar media separate from the system memory 1004 or the computer system 1000. In various embodiments, some or all of the functions described herein may be implemented via such a computer system 1000.

[0062] In one embodiment, the I / O interface 1006 may be configured to coordinate I / O communications between the processor 1002, the system memory 1004, and any peripheral devices in the device (including the network interface 1010 or other peripheral device interfaces, such as the input / output device 1012). In some embodiments, the I / O interface 1006 may perform any necessary protocol, timing, or other data conversion to convert data signals from one component (e.g., the system memory 1004) into a format suitable for use by another component (e.g., the processor 1002). In some embodiments, the I / O interface 1006 may include support for devices attached, for example, via various types of peripheral device buses (such as a variation of the peripheral component interconnect (PCI) bus standard or the universal serial bus (USB) standard). In some embodiments, the functionality of the I / O interface 1006 may be divided into two or more separate components, such as a north bridge and a south bridge, for example. In addition, in some embodiments, some or all of the functionality of the I / O interface 1006 (such as an interface to the system memory 1004) may be directly incorporated into the processor 1002.

[0063] The network interface 1010 may be configured to allow data to be exchanged between the computer system 1000 and other devices (e.g., carriers or proxy devices) attached to the network 1024 or between nodes of the computer system 1000. In various embodiments, the network 1024 may include one or more networks, including, but not limited to, a local area network (LAN) (e.g., an Ethernet or an enterprise network), a wide area network (WAN) (e.g., the Internet), a wireless data network, some other electronic data network, or some combination thereof. In various embodiments, the network interface 1010 may support, for example, communication via a wired or wireless general data network (such as any suitable type of Ethernet network); communication via a telecommunications / telephone network (such as an analog voice network or a digital fiber optic communication network); communication via a storage area network (such as a Fiber Channel SAN), or communication via any other suitable type of network and / or protocol.

[0064] In some embodiments, input / output devices 1012 may include one or more display terminals, keyboards, keypads, touch pads, scanning devices, voice or optical recognition devices, or any other device suitable for inputting or accessing data by one or more computer systems 1000. Multiple input / output devices 1012 may be present in computer system 1000, or may be distributed across various nodes of computer system 1000. In some embodiments, similar input / output devices may be separate from computer system 1000 and may interact with one or more nodes of computer system 1000 via a wired or wireless connection (such as via network interface 1010).

[0065] It will be appreciated by those skilled in the art that computer system 1000 is merely illustrative, and is not intended to limit the scope of the embodiments. Specifically, computer systems and devices may include any combination of hardware or software that can perform the indicated functions, including computers, network devices, Internet devices, personal digital assistants (PDAs), wireless phones, pagers, etc. Computer system 1000 may also be connected to other devices not shown, or may otherwise be operated as an independent system. In addition, the functions provided by the components shown may be combined in fewer components or distributed in additional components in some embodiments. Similarly, in some embodiments, the functions of some components in the components shown may not be provided, and / or other additional functions may be available.

[0066] Those skilled in the art will also recognize that, although various items are shown as being stored in memory or on storage devices during use, for the purpose of memory management and data integrity, these items or parts thereof may be transmitted between memory and other storage devices. Alternatively, in other embodiments, some or all of these software components may be executed in a memory on another device and communicate with the illustrated computer system via inter-computer communication. Some or all of the system components or data structures may also be stored (e.g., as instructions or structured data) on a computer-accessible medium or portable article to be read by a suitable driver, and various examples thereof are described above. In some embodiments, instructions stored on a computer-accessible medium separated from the computer system 1000 may be transmitted to the computer system 1000 via a transmission medium or signal (such as an electrical signal, an electromagnetic signal, or a digital signal transmitted by a communication medium such as a network and / or a wireless link). Various embodiments may also include receiving, sending, or storing instructions and / or data implemented according to the above description on a computer-accessible medium. Generally speaking, a computer-accessible medium may include a non-transitory computer-readable storage medium or memory medium, such as a magnetic medium or an optical medium, for example a disk or a DVD / CD-ROM, a volatile or non-volatile medium, such as a RAM (e.g., SDRAM, DDR, RDRAM, SRAM, etc.), a ROM, etc. In some embodiments, a computer-accessible medium may include a transmission medium or signal, such as an electrical signal, an electromagnetic signal, or a digital signal transmitted via a communication medium such as a network and / or a wireless link.

[0067] In different embodiments, the methods described herein can be implemented in software, hardware or a combination thereof. In addition, the order of the frames of the method can be changed, and various elements can be added, reordered, combined, omitted, modified, etc. For those skilled in the art who benefit from the present disclosure, various modifications and changes can obviously be made. The various embodiments described herein are intended to be illustrative and not restrictive. Many variations, modifications, additions and improvements are possible. Therefore, multiple examples can be provided for the components described as a single example in this article. The boundaries between various components, operations and data repositories are arbitrary to a certain extent, and specific operations are shown in the context of a specific exemplary configuration. Other allocations of functions are expected, and they may fall within the scope of the appended claims. Finally, the structure and function presented as discrete components in the example configuration may be implemented as a combined structure or component. These and other variations, modifications, additions and improvements may fall within the scope of the embodiments defined in the following claims.

Claims

1. A camera, comprising: an optical assembly having one or more lenses defining an optical axis; Image sensor; a housing, the housing forming an outer wall of the camera; an actuator assembly for moving the image sensor relative to the optical assembly; a base, the base being a static component of the camera, wherein the base includes a seat facing in a direction parallel to the optical axis and away from the optical assembly; and A flexure is attached to the mount, the flexure suspending the image sensor from the base and allowing movement of the image sensor by the actuator assembly.

2. The camera of claim 1 , further comprising a substrate providing electronic communication between one or more surface mounted electrical components located on the substrate and the image sensor, wherein the image sensor is fixedly attached to a surface of the substrate facing the direction parallel to the optical axis and away from the optical assembly, wherein the substrate comprises an upper block formed of an organic material and a lower block formed of a ceramic material.

3. The camera of claim 2, further comprising an image sensor stiffener extending over at least a portion of the flexure, wherein the image sensor stiffener is a moving part of the camera closest to the housing.

4. The camera of claim 1 , further comprising a substrate that provides electronic communication between one or more surface mounted electrical components located on the substrate and the image sensor via the flexure, wherein the flexure is fixedly attached to a surface of the substrate that faces in the direction parallel to the optical axis and away from the optical assembly, wherein the substrate comprises an upper block and a lower block formed of an organic material.

5. The camera of claim 4, wherein the flexure extends completely across a surface of the image sensor that faces in the direction parallel to the optical axis and away from the optical assembly, wherein the flexure is the moving part of the camera closest to the housing.

6. The camera of claim 4 further comprising an end stop fixedly attached to a surface of the flexure facing the direction parallel to the optical axis and away from the optical assembly, wherein the end stop is the moving part of the camera closest to the housing.

7. The camera of claim 4 further comprising wire bonds providing electronic communication between the image sensor and the flexure.

8. A device comprising: one or more processors; a memory storing program instructions executable by the one or more processors to control the operation of the camera; and The camera comprises: an optical assembly having one or more lenses defining an optical axis, an image sensor, a housing, the housing forming an outer wall of the camera, an actuator assembly for moving the image sensor relative to the optical assembly, a base that is a static component of the camera, wherein the base includes a base that faces in a direction parallel to the optical axis and away from the optical assembly, and A flexure is attached to the mount, the flexure suspending the image sensor from the base and allowing movement of the image sensor by the actuator assembly.

9. The apparatus of claim 8, wherein the camera further comprises a substrate providing electronic communication between one or more surface mounted electrical components located on the substrate and the image sensor, wherein the image sensor is fixedly attached to a surface of the substrate facing in the direction parallel to the optical axis and away from the optical assembly, wherein the substrate comprises an upper block formed of an organic material and a lower block formed of a ceramic material.

10. The apparatus of claim 9, wherein the camera further comprises an image sensor stiffener extending over at least a portion of the flexure, wherein the image sensor stiffener is a moving part of the camera closest to the housing.

11. The apparatus of claim 8, wherein the camera further comprises a substrate that provides electronic communication between one or more surface mounted electrical components located on the substrate and the image sensor via the flexure, wherein the flexure is fixedly attached to a surface of the substrate that faces in the direction parallel to the optical axis and away from the optical assembly, wherein the substrate comprises an upper block and a lower block formed of a ceramic material.

12. The apparatus of claim 11, wherein the flexure extends completely across a surface of the image sensor that faces in the direction parallel to the optical axis and away from the optical assembly, wherein the flexure is a moving part of the camera closest to the housing.

13. The apparatus of claim 11 further comprising an end stop fixedly attached to a surface of the flexure facing the direction parallel to the optical axis and away from the optical assembly, wherein the end stop is a moving part of the camera closest to the housing.

14. The apparatus of claim 11 further comprising wire bonds providing electronic communication between the image sensor and the flexure.

15. An image sensor actuator assembly comprising: Image sensor; an actuator assembly for moving the image sensor in one or more directions relative to an axis orthogonal to a light receiving surface of the image sensor; a housing, the housing forming an outer wall of the camera; a base fixedly attached to the housing, wherein the base includes a seat facing in a direction parallel to the axis and facing in an opposite direction of the light receiving surface of the image sensor; and A flexure is attached to the mount, the flexure suspending the image sensor from the base and allowing movement of the image sensor by the actuator assembly.

16. The image sensor actuator assembly of claim 15 , further comprising a substrate providing electronic communication between one or more surface mounted electrical components located on the substrate and the image sensor, wherein the image sensor is fixedly attached to a surface of the substrate facing in the direction parallel to the axis and facing in the opposite direction of the light receiving surface of the image sensor, wherein the substrate comprises an upper block formed of an organic material and a lower block formed of a ceramic material.

17. The image sensor actuator assembly of claim 16, further comprising an image sensor stiffener extending over at least a portion of the flexure, wherein the image sensor stiffener is a moving part of the camera closest to the housing.

18. The image sensor actuator assembly of claim 15 , further comprising wire bonds providing electronic communication between the image sensor and the flexure, and a substrate providing electronic communication between one or more surface mounted electrical components located on the substrate and the image sensor via the flexure, wherein the flexure is fixedly attached to a surface of the substrate facing in the direction parallel to the axis and facing in the opposite direction of the light receiving surface of the image sensor, wherein the substrate comprises an upper block and a lower block formed of an organic material.

19. The image sensor actuator assembly of claim 15, wherein the flexure extends completely through a surface of the image sensor facing in the direction parallel to the axis and facing in the opposite direction to the light receiving surface of the image sensor, wherein the flexure is a moving part of the camera closest to the housing.

20. The image sensor actuator assembly of claim 15, further comprising an end stop fixedly attached to a surface of the flexure facing parallel to the direction of the axis and facing in the opposite direction to the light receiving surface of the image sensor, wherein the end stop is a moving part of the camera closest to the housing.

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