Lens module and vehicle-mounted camera

Abstract

The invention relates to a lens module and a vehicle-mounted camera. The lens module comprises a lens which comprises a lens main body and a fixing part connected to the lens main body; the serial plate is fixedly arranged on the fixing part; the MEMS element is fixedly arranged and electrically connected to the serial plate; the photosensitive assembly comprises a sensor plate and a photosensitive chip, the sensor plate comprises a rigid plate body fixedly arranged on the MEMS element and a flexible plate body extending outwards from one side of the rigid plate body, the flexible plate body is electrically connected to the serial plate, and the photosensitive chip is arranged and electrically connected to the rigid plate body; and the temperature detection element is arranged in the lens main body and is electrically connected with the serial plate. According to the lens module provided by the invention, the MEMS element is controlled through the control circuit of the serial plate, the sensor plate can float up and down in a small range, and the offset of an imaging surface caused by thermal expansion and cold contraction of a component due to temperature is compensated by utilizing the floating, so that the clear imaging of a vehicle-mounted camera is kept.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, in particular to a lens module and a vehicle-mounted camera. Background Art

[0002] With the development of vehicle camera technology, people's demands for automobile safety level are getting higher and higher, and the requirements for the imaging performance of vehicle cameras are also getting higher and higher. At present, vehicle cameras generally have the problem of temperature drift, that is, at different temperatures, the internal components of the camera will expand and contract slightly according to the temperature, causing the originally focused lens to shift, the imaging surface to shift, and the imaging of the camera module to become blurred. The clarity of the camera module imaging is one of the important bases for judging the imaging performance of the camera, so it is very important to solve the problem of temperature drift.

[0003] Currently available camera modules generally reduce the impact of temperature changes by selecting components of different materials, but this solution cannot eliminate the problem of temperature drift. Summary of the invention

[0004] Based on this, it is necessary to provide a lens module and a vehicle-mounted camera to address the problem of temperature drift in existing vehicle-mounted cameras.

[0005] A lens module, comprising:

[0006] A lens, comprising a lens body and a fixing portion connected to the lens body;

[0007] A serial board, the serial board is fixed to the fixing part;

[0008] A MEMS element, wherein the MEMS element is fixedly mounted and electrically connected to the serial board;

[0009] A photosensitive component, the photosensitive component includes a sensor board and a photosensitive chip, the sensor board includes a rigid board body fixed to the MEMS element and a flexible board body extending outward from one side of the rigid board body, the flexible board body is electrically connected to the serial board, and the photosensitive chip is disposed and electrically connected to the rigid board body; and

[0010] A temperature detection element is disposed in the lens body and electrically connected to the serial board.

[0011] In some embodiments, the photosensitive component further includes a board-to-board connector, which is electrically connected to the flexible board and the serial board respectively.

[0012] In some embodiments, the serial board is provided with a plurality of pins, and the flexible board is welded to the pins.

[0013] In some embodiments, a welding layer is provided between the flexible board and the serial board to weld the flexible board to the serial board.

[0014] In some embodiments, the serial board is provided with a connection hole, and the flexible board body is inserted into and welded to the connection hole.

[0015] In some embodiments, the photosensitive chip is packaged in the rigid board.

[0016] In some embodiments, the photosensitive chip has a temperature register, and the temperature register is located in the lens body.

[0017] In some embodiments, the connection between the flexible board and the serial board is located on the inner side of the fixing portion.

[0018] In some embodiments, a through hole is opened on the side of the fixing portion, and the flexible board extends from the inner side of the fixing portion through the through hole to the outer side of the fixing portion, so that the connection between the flexible board and the serial board is located on the outer side of the fixing portion.

[0019] A vehicle-mounted camera, comprising:

[0020] A lens module as described in any one of the above; and

[0021] A camera body, wherein the lens module is installed on the camera body.

[0022] The lens module of the present application can control the MEMS element through the control circuit of the serial board, which can make the sensor board float up and down slightly. By using this floating, the displacement of the imaging surface caused by the thermal expansion and contraction of the components due to temperature is compensated, thereby maintaining the clear imaging of the vehicle-mounted camera. When the lens module of the present application is affected by temperature and the lens expands and contracts, the distance between the lens and the photosensitive chip changes, and the imaging surface of the lens shifts up and down, resulting in the imaging surface of the lens and the imaging surface of the photosensitive chip being unable to align, making the imaging of the lens module blurred. At this time, the control circuit of the serial board can drive the MEMS element to drive the rigid board to float up or down, adjust the height of the photosensitive chip, compensate for the displacement of the imaging surface, and make the imaging of the lens module clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A cross-sectional schematic diagram of a vehicle-mounted camera provided for one embodiment of the present application;

[0024] Figure 2 A cross-sectional schematic diagram of a first example of a lens module of a vehicle-mounted camera according to the above embodiment of the present application is shown;

[0025] Figure 3A cross-sectional schematic diagram of a second example of a lens module of a vehicle-mounted camera according to the above embodiment of the present application is shown;

[0026] Figure 4 A cross-sectional schematic diagram of a third example of a lens module for a vehicle-mounted camera according to the above embodiment of the present application is shown;

[0027] Figure 5 A cross-sectional schematic diagram of a fourth example of a lens module for a vehicle-mounted camera according to the above embodiment of the present application is shown;

[0028] Figure 6 A cross-sectional schematic diagram of a fifth example of a lens module for a vehicle-mounted camera according to the above embodiment of the present application is shown;

[0029] Figure 7 A cross-sectional schematic diagram of a sixth example of a lens module for a vehicle-mounted camera according to the above-mentioned embodiment of the present application is shown.

[0030] Figure numerals: 10, lens module; 11, lens; 111, lens body; 112, fixing part; 113, through-hole; 12, serial board; 121, connecting hole; 13, MEMS element; 14, photosensitive component; 141, sensor board; 1411, rigid board; 1412, flexible board; 142, photosensitive chip; 143, board-to-board connector; 144, pin; 145, welding layer; 20, camera body; 21, upper shell; 22, lower shell; 23, connector; 30, hot riveting head. DETAILED DESCRIPTION

[0031] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0037] Based on the fact that existing vehicle-mounted cameras have temperature drift problems, the present application provides a lens module and a vehicle-mounted camera. The lens module controls the MEMS element through a circuit, which can make the sensor board float up and down slightly, and use the floating to compensate for the offset of the imaging surface caused by the thermal expansion and contraction of the components due to temperature, thereby maintaining the clear imaging of the vehicle-mounted camera.

[0038] For details, please refer to Figure 1 and Figure 2In some embodiments, the lens module 10 of the present application may include a lens 11, a serial board 12, a MEMS element 13, a photosensitive component 14, and a temperature detection element. The lens 11 includes a lens body 111 and a fixing portion 112 connected to the lens body 111. The serial board 12 is fixed to the fixing portion 112. The MEMS element 13 is fixed and electrically connected to the serial board 12. The photosensitive component 14 includes a sensor board 141 (i.e., a sensor board) and a photosensitive chip 142. The sensor board 141 includes a rigid board 1411 fixed to the MEMS element 13 and a flexible board 1412 extending outward from one side of the rigid board 1411. The flexible board 1412 is electrically connected to the serial board 12, and the photosensitive chip 142 is arranged and electrically connected to the rigid board 1411.

[0039] It can be understood that the MEMS element 13 (i.e., micro-motor element) can be controlled by the control circuit of the serial board 12 so that the element thereon produces an effect of floating up and down, and the rigid board 1411 is fixed on the MEMS element 13 and connected to the serial board 12 through the flexible board 1412, so that the rigid board 1411 has a movable margin for floating up and down, and can be driven by the MEMS element 13 to float up and down. Based on the micron-level micro-deformation ability of the MEMS element 13, the height of the rigid board 1411 can be accurately adjusted, thereby accurately adjusting the distance between the photosensitive chip 142 located on the rigid board 1411 and the lens 11, so that the imaging surface of the lens 11 is always aligned with the imaging surface of the photosensitive chip 142, thereby realizing compensation for the focal length of the lens 11.

[0040] When the lens module 10 of the present application is affected by temperature and the lens 11 expands and contracts due to heat, the distance between the lens 11 and the photosensitive chip 142 changes, and the imaging surface of the lens 11 shifts up and down, resulting in the imaging surface of the lens 11 and the imaging surface of the photosensitive chip 142 being unable to be aligned, causing the imaging of the lens module 10 to become blurred. At this time, the control circuit of the serial board 12 can drive the MEMS element 13 to drive the rigid board 1411 to float upward or downward, adjust the height of the photosensitive chip 142, compensate for the offset of the imaging surface, and make the imaging of the lens module 10 clear.

[0041] In this way, the lens module 10 of the present application can compensate for the up and down deviation of the imaging surface caused by thermal expansion and contraction of components due to temperature influence through the MEMS element 13, and the lens module 10 of the present application is an integrated lens structure, which is itself less affected by the thermal expansion and contraction caused by temperature changes, and the deviation of the imaging surface caused by the temperature drift problem is small. The MEMS element 13 can be used to compensate for the deviation of the imaging surface, so that the lens module 10 can maintain the performance of clear imaging.

[0042] Optionally, in some embodiments, the center of the MEMS element 13 of the present application coincides with the center of the photosensitive chip 142. In other words, the photosensitive chip 142 is evenly disposed above the MEMS element 13. In this way, the MEMS element 13 can evenly and smoothly drive the photosensitive chip 142 to move.

[0043] Optionally, a signal connection is required between the sensor board 141 and the serial board 12. In some embodiments, the sensor board 141 can be connected by means of a board-to-board connector, pin welding, FPC heat welding, welding, etc.

[0044] For example, Figure 2 The figure shows a cross-sectional schematic diagram of the first example of the lens module 10 of the present application. In the first example of the present application, the photosensitive component 14 of the present application further includes a board-to-board connector 143, and the board-to-board connector 143 is electrically connected to the flexible board 1412 and the serial board 12. In this way, the board-to-board connector 143 has good design flexibility, can raise the end of the flexible board 1412, and can provide more floating margin for the rigid board 1411 while keeping the length of the flexible board 1412 unchanged. In addition, the board-to-board connector 143 is easy to plug and unplug, and is convenient for assembly and subsequent replacement and maintenance. During assembly, the male and female heads of the board-to-board connector 143 can be respectively welded to the serial board 12 and the flexible board body 1412, and then the rigid board body 1411 is fixed to the MEMS element, and then the male and female heads of the board-to-board connector 143 are plugged together. During subsequent replacement and maintenance, the male and female heads of the board-to-board connector 143 can be directly disconnected without using welding tools.

[0045] For example, Figure 3 The figure shows a cross-sectional schematic diagram of the second example of the lens module 10 of the present application. In the second example of the present application, a plurality of pins 144 are provided on the serial board 12 of the present application, and the flexible board 1412 is welded to the pins 144. In other words, the flexible board 1412 can be connected to the serial board 12 by welding the pins 144. With such a configuration, the welding structure of the flexible board 1412 and the serial board 12 is simple. During welding, the pins 144 can be passed through the flexible board 1412, and then the flexible board 1412 and the pins 144 can be welded by soldering to form a stable connection structure, thereby avoiding connection problems such as poor contact, thereby greatly reducing the failure rate of the lens module 10.

[0046] For example, Figure 4The third example of the lens module 10 of the present application is shown in cross-sectional view. In the third example of the present application, a welding layer 145 is provided between the flexible board 1412 of the present application and the serial board 12 to weld the flexible board 1412 to the serial board 12. The welding layer 145 can be formed by providing welding material between the flexible board 1412 and the serial board 12, and pressing the upper surface of the flexible board 1412 with a hot riveting head 30 to melt the welding material. The whole welding process is simple to operate, and the welding efficiency of the flexible board 1412 and the serial board 12 can be improved, thereby improving the assembly efficiency of the lens module 10.

[0047] For example, Figure 5 The fourth example of the lens module 10 of the present application is shown in the cross-sectional schematic diagram. In the fourth example of the present application, the serial board 12 of the present application is provided with a connection hole 121, and the flexible board 1412 is inserted and welded in the connection hole 121. With such a configuration, when the flexible board 1412 is welded to the serial board 12, the flexible board 1412 can be first inserted into the connection hole 121, and the flexible board 1412 can be pre-fixed through the connection hole 121, and then the flexible board 1412 can be welded by soldering, and the flexible board 1412 can be fixed by the connection hole 121, so that the welding structure has a higher reliability and can save welding space, which is suitable for some lens modules 10 with a smaller internal space.

[0048] Alternatively, if Figure 1 and Figure 6 As shown, Figure 6 It is a cross-sectional schematic diagram of the fifth example of the lens module 10 of the present application, and the photosensitive chip 142 of the present application is packaged in the rigid board 1411. Among them, in the first example of the present application, the photosensitive chip 142 of the present application can be packaged in the rigid board 1411 through the BGA packaging (ball grid array packaging) process. The BGA packaging process has solder balls with short connection paths, which can enable the photosensitive chip 142 to maintain excellent signal transmission performance and ensure that the photosensitive chip 142 can stably transmit signals. In the fifth example of the present application, the photosensitive chip 142 of the present application can also be packaged in the rigid board 1411 through the COB packaging (chip on board packaging) process. The packaging structure formed by the COB packaging process has a lower thermal resistance, which helps the heat dissipation of the photosensitive chip 142 and ensures the working stability of the photosensitive chip 142.

[0049] Alternatively, if Figure 1 As shown, in the first example of the present application, the connection between the flexible board 1412 and the serial board 12 is located on the inner side of the fixing portion 112. In this way, the photosensitive components 14 of the present application are all located on the inner side of the fixing portion 112, which can avoid external stray light interference, reduce the generation of ghost images, and improve the imaging effect of the lens module 10.

[0050] Optionally, in some embodiments, the photosensitive chip 142 of the present application has a temperature register, which is located in the lens body 111. The temperature register can detect the temperature changes inside the lens 11 in real time and output the temperature signal value to the serial board 12. The control circuit of the serial board 12 can control the MEMS element 13 to drive the rigid board 1411 to float upward or downward according to the temperature signal value, so as to more accurately compensate for the offset of the imaging surface.

[0051] It is worth noting that the lens module 10 of the present application may further include a temperature detection element, which is disposed in the lens body 111 and electrically connected to the serial board 12. The temperature detection element can further detect the temperature change inside the lens 11, and can cooperate with the temperature register to more accurately monitor the temperature change of the lens, thereby more accurately compensating the offset of the imaging surface.

[0052] Alternatively, if Figure 7 The sixth example of the lens module 10 of the present application is shown in cross-sectional view. In the sixth example of the present application, a through hole 113 is provided on the side of the fixing portion 112, and the flexible board 1412 extends from the inner side of the fixing portion 112 through the through hole 113 to the outer side of the fixing portion 112, and is electrically connected to the serial board 12. In this way, by providing the through hole 113 on the fixing portion 112 and arranging the connection between the flexible board 1412 and the serial board 12 on the outer side of the fixing portion 112, the space required for the photosensitive component 14 can be reduced, which is conducive to miniaturization of the lens module 10.

[0053] Optionally, in some embodiments, the rigid plate 1411 of the present application can be bonded to the upper surface of the MEMS element 13 by glue. Such a configuration can not only reduce the steps of screw assembly, reduce the overall assembly process of the lens module, shorten the assembly time, but also save material costs.

[0054] Optionally, in some embodiments, the serial board 12 of the present application may be bonded to the fixing portion 112 of the lens 11 by glue.

[0055] Furthermore, if Figure 1 As shown, the present application provides a vehicle-mounted camera, which may include any of the above-mentioned lens modules 10 and a camera body 20, wherein the lens module 10 is mounted on the camera body 20. The vehicle-mounted camera can maintain clear and reliable imaging under various temperature environments by using the lens module 10 that can compensate for temperature drift, thereby greatly improving the safety performance of the car.

[0056] Optionally, in some embodiments, the camera body 20 of the vehicle-mounted camera may include an upper shell 21, a lower shell 22 and a connector 23, the lens 11 of the lens module 10 is fixed to the upper shell 21, the lens 11 of the lens module 10 may also be integrally formed with the upper shell 21, and the lower shell 22 is fixed to the upper shell 21. The connector 23 is fixed to the back of the serial board 12 of the lens module 10, and can be connected to the control system of the car through the lower shell 22 to transmit image information.

[0057] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A lens module, characterized in that: include: A lens, comprising a lens body and a fixing portion connected to the lens body; A serial board, the serial board is fixed to the fixing part; A MEMS element, the MEMS element is fixedly mounted and electrically connected to the serial board; and The photosensitive component includes a sensor board and a photosensitive chip, the sensor board includes a rigid board body fixed to the MEMS element and a flexible board body extending outward from one side of the rigid board body, the flexible board body is electrically connected to the serial board, and the photosensitive chip is arranged and electrically connected to the rigid board body.

2. The lens module according to claim 1, characterized in that: The photosensitive component further includes a board-to-board connector, which is electrically connected to the flexible board and the serial board respectively.

3. The lens module according to claim 1, characterized in that: The serial board is provided with a plurality of pins, and the flexible board body is welded to the pins.

4. The lens module according to claim 1, characterized in that: A welding layer is provided between the flexible board and the serial board to weld the flexible board to the serial board.

5. The lens module according to claim 1, characterized in that: The serial board is provided with a connection hole, and the flexible board body is inserted and welded in the connection hole.

6. The lens module according to any one of claims 1 to 5, characterized in that: The photosensitive chip is packaged in the rigid board.

7. The lens module according to any one of claims 1 to 5, characterized in that: The photosensitive chip has a temperature register, and the temperature register is located in the lens body.

8. The lens module according to any one of claims 1 to 5, characterized in that: The connection between the flexible board and the serial board is located on the inner side of the fixing part.

9. The lens module according to any one of claims 1 to 5, characterized in that: A through hole is opened on the side of the fixing part, and the flexible board extends from the inner side of the fixing part through the through hole to the outer side of the fixing part, so that the connection between the flexible board and the serial board is located on the outer side of the fixing part.

10. A vehicle-mounted camera, characterized in that: include: The lens module according to any one of claims 1 to 9; and A camera body, wherein the lens module is installed on the camera body.

Images