Light sensing assembly, display module and electronic device

Abstract

The invention provides a light sensing assembly, a display module and an electronic device. The light sensing assembly comprises a flexible circuit board. The light sensing device is arranged in the first area of the flexible circuit board; the bonding layer is bonded with the second area of the flexible circuit board and is provided with an opening corresponding to the light sensing device; wherein the flexible circuit board in the first area extends in the direction away from the bonding layer, and one end, close to the opening, of the flexible circuit board in the second area extends out of the edge of the opening of the bonding layer and is connected with the flexible circuit board in the first area. The light-sensitive component is beneficial to increasing the attaching area of the light-sensitive device and the screen body, so that the edge can be prevented from tilting to leak light, meanwhile, the foam opening can be enlarged, and the detection range and the detection sensitivity of the light-sensitive device are ensured.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a light sensing component, a display module and an electronic device. Background Art

[0002] Light sensors are equipped in many smart terminal devices (such as tablets and mobile phones). They can be used for both ambient light adjustment and fingerprint recognition. Light sensors are usually installed on flexible printed circuits (FPCs) and are located below the device screen. Light can enter the light sensor through the openings on the screen, so that the light sensor can perceive the brightness information of the outside world based on the received light.

[0003] However, the light sensors of current smart terminal devices are prone to problems such as edge warping and light leakage after attachment, and light-sensing function abnormalities caused by obstruction of the light-receiving area. Summary of the invention

[0004] Based on this, the present invention aims to provide an improved light sensing component, display module and electronic device to solve at least one of the above problems.

[0005] In a first aspect, the present application provides a light sensing component, comprising:

[0006] Flexible circuit boards;

[0007] A photosensitive device, disposed in the first area of ​​the flexible circuit board;

[0008] An adhesive layer, bonded to the second area of ​​the flexible circuit board, and having an opening corresponding to the photosensitive device;

[0009] The flexible circuit board in the first area extends in a direction away from the adhesive layer, and one end of the flexible circuit board in the second area close to the opening extends out of the opening edge of the adhesive layer and is connected to the flexible circuit board in the first area.

[0010] The above-mentioned light sensing component has at least the following beneficial effects:

[0011] 1. By making the flexible circuit board in the second area bonded to the adhesive layer extend out of the opening edge of the adhesive layer, it is beneficial to increase the attachment area, so that there is no need to set foam material around the photosensitive device, avoiding the edge warping and light leakage problem caused by the small foam attachment area on both sides of the photosensitive device;

[0012] 2. At the same time, the increase in the attachment area is conducive to the adhesive layer avoiding the light receiving area of ​​the photosensitive device. For example, the opening of the adhesive layer can be increased so that the edge of the opening does not block the light receiving area of ​​the photosensitive device, thereby ensuring the detection range and detection sensitivity of the photosensitive device;

[0013] 3. Moreover, the flexible circuit board in the first area provided with the photosensitive device is connected to the flexible circuit board in the second area and extends in a direction away from the adhesive layer, which is conducive to reducing the height difference between the attachment position of the photosensitive device and the flexible circuit board in the second area, thereby saving the space of the whole machine and improving the edge warping and light leakage problem caused by the mutual pulling force during the attachment process;

[0014] 4. In addition, the above-mentioned flexible circuit board can achieve the final alignment between the photosensitive device and the opening by folding, which greatly reduces the number of alignment times, thereby helping to improve the cumulative tolerance effect caused by the large number of alignment times in the original preparation process, and further ensure the light collection and attachment effect of the photosensitive device.

[0015] In one of the embodiments, a side edge of the opening away from the photosensitive device is located at a boundary or outside of a light receiving area of ​​the photosensitive device.

[0016] In one of the embodiments, the flexible circuit board is tangent to or separated from the light receiving area of ​​the photosensitive device.

[0017] In one of the embodiments, a first reinforcement structure is disposed on a side of the flexible circuit board in the first region facing away from the photosensitive device.

[0018] In one embodiment, a second reinforcement structure is provided on a side of the flexible circuit board in the second zone facing away from the adhesive layer, wherein one end of the second reinforcement structure is connected to the first reinforcement structure and one end away from the first reinforcement structure extends through the opening edge.

[0019] In one embodiment, the extension direction of the flexible circuit board in the first area is perpendicular to the extension direction of the flexible circuit board in the second area.

[0020] In one embodiment, the flexible circuit board also includes a shading area connected to the flexible circuit board in the first area, and one end of the flexible circuit board in the shading area away from the flexible circuit board in the first area extends to the adhesive layer and is bonded to the adhesive layer; the flexible circuit board as a whole and the adhesive layer together form a accommodating space for accommodating the photosensitive device.

[0021] In one embodiment, the photosensitive component also includes a light shield, one end of the light shield is connected to the flexible circuit board in the first area, and the other end extends to the adhesive layer and is bonded to the adhesive layer; the light shield, the flexible circuit board and the adhesive layer together form a housing space for accommodating the photosensitive device.

[0022] In a second aspect, the present application provides a display module, comprising: a screen body; a light sensing component as described in any of the above embodiments arranged on one side of the screen body; and a packaging structure arranged on a side of the screen body away from the light sensing component.

[0023] The display module mentioned above is beneficial to improving the light detection performance by arranging the above-mentioned light sensing component under the screen body, thereby improving the overall display performance of the display module.

[0024] In a third aspect, the present application provides an electronic device, comprising a housing and a display module as described in the above embodiment connected to the housing.

[0025] The electronic device is provided with the display module, which is conducive to quickly and accurately realizing the ambient light adjustment function of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the implementation methods of this specification or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0027] Figure 1 It is a schematic diagram of the attachment structure of a photosensitive device in the prior art;

[0028] Figure 2 A schematic diagram of the structure of an electronic device according to an embodiment of the present application;

[0029] Figure 3 It is a cross-sectional schematic diagram of a display module on plane AA according to an embodiment of the present application;

[0030] Figure 4 It is a cross-sectional schematic diagram of a display module on plane AA according to an embodiment of the present application;

[0031] Figure 5 It is a schematic cross-sectional view of a display module on plane AA according to an embodiment of the present application.

[0032] Component number description:

[0033] 1. electronic device, 10. display structure, 20. housing, 100. display module, 110. light sensing component, 111. flexible circuit board, 111A. first area, 111B. second area, 111C. light shielding area, 112. light sensing device, 113. adhesive layer, 113A. opening, 114. reinforcement structure, 114A. first reinforcement structure, 114B. second reinforcement structure, 115. light shield;

[0034] 10', photosensitive device, 20', flexible circuit board, 30', photosensitive foam, 40', screen foam, 50', screen body;

[0035] AR', light receiving area, AR, light receiving area. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0037] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0040] In the process of implementing the present invention, the inventors found that the related art has the following problems:

[0041] Currently, if Figure 1As shown, the photosensitive device 10' is fixed on the flexible circuit board 20' by means of a fixing tape, and the flexible circuit board 20' is bonded to the screen foam 40' on the screen body 50' through the photosensitive foams 30' on both sides, so that the photosensitive device 10' can face the opening on the screen foam 40' and keep a certain distance from the screen body 50'. The photosensitive device 10' senses the incident light from the outside through the opening on the screen foam 40', thereby realizing the detection of ambient light.

[0042] However, the light receiving area AR' of the photosensitive device 10' is often blocked by the screen foam 40', which affects the detection sensitivity of the photosensitive device 10'. If the opening of the screen foam 40' is widened, the attachment area of ​​the photosensitive foam 30' and the screen foam 40' will be affected, and the edge warping and light leakage problems are likely to occur. In addition, due to Figure 1 It can be seen that a part of the flexible circuit board 20' is attached to the screen foam 40', and the other part has a height difference ΔH with the attached part of the flexible circuit board 20' due to the setting of the light sensing device 10', which may easily cause the flexible circuit board 20' to warp and leak light.

[0043] Based on the above problems, an embodiment of the present application provides a photosensitive component, which is mainly improved based on the following inventive concept: the photosensitive foam used to connect the photosensitive device to the screen body is removed, and a flexible circuit board and the screen body foam are used for attachment as a whole. In this way, the space on both sides of the photosensitive device can be fully utilized, thereby greatly increasing the attachment area of ​​the flexible circuit board, breaking through the attachment area constraint caused by the use of photosensitive foam, and then improving a series of problems affecting the detection performance of the photosensitive device.

[0044] like Figure 2 and Figure 3 As shown, the embodiment of the present application provides a light sensing component 110, which is applied to an electronic device 1 to sense changes in ambient light. Figure 2 As shown, the electronic device 1 may include a housing 20 and a display structure 10 connected to the housing 20 , wherein a light sensing component 110 is disposed in the display structure 10 .

[0045] Specifically, the photosensitive component 110 includes: a flexible circuit board 110; a photosensitive device 112, which is arranged in the first area 111A of the flexible circuit board 110; an adhesive layer 113, which is bonded to the second area 111B of the flexible circuit board 110 and has an opening 113A corresponding to the photosensitive device 112; wherein the flexible circuit board in the first area 111A extends in a direction away from the adhesive layer 113, and the end of the flexible circuit board in the second area 111B close to the opening 113A extends out of the opening edge of the adhesive layer 113 and is connected to the flexible circuit board in the first area 111A.

[0046] For example, Figure 3As shown, the photosensitive surface of the photosensitive device 112 is arranged toward the opening 113A to receive external incident light, and the non-photosensitive surface of the photosensitive device 112 is in contact with the flexible circuit board of the first area 111A, and the flexible circuit board of the first area 111A extends in a direction away from the adhesive layer 113 to separate the photosensitive device 112 from the screen body 120 by a certain distance, thereby ensuring the measurement accuracy and working stability of the photosensitive device 112.

[0047] Exemplarily, the photosensitive device 112 can be fixed to the flexible circuit board of the first area 111A by transparent tape, or glue can be applied on the non-photosensitive side surface to bond and fix the plug-in to the flexible circuit board of the first area 111A, or the protruding plug-in on the photosensitive device 112 can be inserted into the groove on the flexible circuit board of the first area 111A to achieve fixation, or the photosensitive device 112 can be fixed to the flexible circuit board of the first area 111A by snapping or hanging. The specific fixing method of the photosensitive device 112 can be selected according to the extension direction and / or angle of the flexible circuit board of the first area 111A, as long as stable attachment can be achieved, and this application does not limit this.

[0048] For example, Figure 3 As shown, the extension direction of the flexible circuit board in the first area 111A is perpendicular to the extension direction of the flexible circuit board in the second area 111B. In this way, the photosensitive device 112 can be designed to stand sideways relative to the screen body 120, which is beneficial to reduce the height difference of the photosensitive device 112 and avoid the influence of material size tolerance and process matching accuracy during design.

[0049] Exemplarily, the flexible circuit board in the second area 111B is partially bonded to the adhesive layer 113, that is, the flexible circuit board in the second area 111B extending from the edge of the opening 113A to the direction away from the opening 113A is bonded to the adhesive layer 113, and the part extending out of the edge of the opening is not bonded to the adhesive layer 113. In this way, the unused area between the original light-sensitive foam 30' and the flexible circuit board 20' can also be used, thereby increasing the attachment area of ​​the flexible circuit board 110. At the same time, since the height difference between the attachment position of the light-sensitive device 112 and the flexible circuit board 110 is also improved, the mutual pulling force between the two parts of the flexible circuit board in the first area 111A and the second area 111B is also reduced, which is more conducive to the stable attachment of the light-sensitive device 112 and avoids the problem of edge warping and light leakage.

[0050] The above-mentioned photosensitive component 110 is conducive to increasing the attachment area by extending the flexible circuit board of the second area 111B bonded to the adhesive layer 113 out of the opening edge of the adhesive layer 113, so that there is no need to set foam material around the photosensitive device 112, avoiding the edge warping and light leakage problem caused by the small foam attachment area on both sides of the photosensitive device; at the same time, the increase in the attachment area is conducive to the adhesive layer 113 avoiding the light receiving area of ​​the photosensitive device 112, for example, the opening 113A of the adhesive layer 113 can be enlarged so that the edge of the opening 113A will not affect the light receiving area of ​​the photosensitive device 112. Therefore, when the light receiving area of ​​the photosensitive device 112 is certain, it is helpful to improve the light receiving efficiency of the photosensitive device 112 and ensure the detection range and detection sensitivity of the photosensitive device 112; and, the flexible circuit board in the first area 111A provided with the photosensitive device 112 is connected to the flexible circuit board in the second area 111B and extends in a direction away from the adhesive layer 113, which is helpful to reduce the height difference between the attachment position of the photosensitive device 112 and the flexible circuit board in the second area 111B, thereby saving the space of the whole machine and improving the problem of edge warping and light leakage caused by the mutual pulling force during the attachment process.

[0051] In addition, by Figure 1 It can be seen that the existing photosensitive device 10' usually requires the photosensitive foam 30' and the photosensitive device 10' to be aligned and attached once, the flexible circuit board 20' is folded and aligned and attached again, and the opening of the photosensitive foam 30' and the opening of the screen foam 40' are aligned and attached again, that is, at least three alignment and attachment are performed, which easily increases the cumulative tolerance effect of alignment; while the photosensitive device attachment structure of the present scheme basically only needs to fold the flexible circuit board 110 once to achieve the final alignment of the photosensitive device 112 and the opening 113A, which greatly reduces the number of alignment times, thereby helping to improve the cumulative tolerance effect caused by the large number of alignment times in the original preparation process, and further ensure the light collection and attachment effect of the photosensitive device 112.

[0052] In some embodiments of the present application, Figure 3 As shown, the edge of the opening 113A on one side away from the photosensitive device 112 is located at the boundary or outside of the light receiving area AR of the photosensitive device 112. Since the size of the light receiving area AR (including the light receiving direction and the light receiving angle) of the photosensitive device 112 can also be determined after the model of the photosensitive device 112 is determined, the opening 113A can be appropriately widened on the basis of increasing the attachment area to avoid the light receiving area AR of the photosensitive device 112, thereby ensuring the light receiving efficiency and detection sensitivity of the photosensitive device 112.

[0053] In some embodiments of the present application, see Figure 3, the flexible circuit board 111 is tangent to or separated from the light receiving area AR of the photosensitive device 112. Since one end of the flexible circuit board in the first area 111A extends out of the opening edge, the bending start position (corresponding to the connection position of the first area 111A and the second area 111B) and the bending angle of the flexible circuit board 111 can be determined by the attachment position of the photosensitive device 112 and the light receiving area AR to avoid the light receiving area AR of the photosensitive device 112, thereby ensuring the light receiving efficiency and detection sensitivity of the photosensitive device 112.

[0054] In some embodiments of the present application, Figure 4 As shown, a first reinforcement structure 114A is provided on the side of the flexible circuit board in the first area 111A away from the photosensitive device 112. Providing the first reinforcement structure 114A on the back of the flexible circuit board in the first area 111A helps to support and fix the photosensitive device 112, thereby ensuring the stable attachment of the photosensitive device 112.

[0055] In some embodiments of the present application, see Figure 4 , a second reinforcement structure 114B is provided on the side of the flexible circuit board in the second area 111B away from the adhesive layer 113, wherein one end of the second reinforcement structure 114B is connected to the first reinforcement structure 114A, and the end away from the first reinforcement structure 114A extends through the edge of the opening. The “extending through the edge of the opening” means that part of the second reinforcement structure 114B extends to the bottom of the adhesive layer 113. This is conducive to enhancing the attachment strength between the flexible circuit board in the first area 111A and the adhesive layer 113, and is also conducive to ensuring the attachment flatness and stability of the flexible circuit board 110.

[0056] Exemplarily, the connection position of the first reinforcement structure 114A and the second reinforcement structure 114B corresponds to the connection position of the flexible circuit board of the first area 111A and the second area 111B, that is, corresponds to the bending position of the flexible circuit board 110, so that the bending angle at the connection position of the two reinforcement structures matches the bending angle of the flexible circuit board 110. Further, the length, width and bending angle of each reinforcement structure at the connection position can be determined according to the length, width and bending angle of the corresponding flexible circuit board, so as to achieve a better side-standing attachment design of the photosensitive device 112. Optionally, the first reinforcement structure 114A and the second reinforcement structure 114B are made of the same material. Optionally, each reinforcement structure can be a stainless steel sheet. Optionally, the reinforcement structure 114 can be either segmented or integrated, that is, the first reinforcement structure 114A and the second reinforcement structure 114B can be integrally formed to form the reinforcement structure 114, which is conducive to simplifying the structure and preparation process of the photosensitive component 110.

[0057] In some embodiments of the present application, Figure 3As shown, the light sensing component 110 also includes a light shield 115, one end of which is connected to the flexible circuit board of the first area 111A, and the other end extends to the adhesive layer 113 and is bonded to the adhesive layer 113; the light shield 115, the flexible circuit board 110 and the adhesive layer 113 together form a housing space for accommodating the light sensing device 112. The light shield 115 is provided to shield the light sensing device 112, which is beneficial to reduce the stray light incident on the housing space, thereby improving the detection sensitivity of the light sensing device 112. Optionally, the bottom non-light sensing surface of the light sensing device 112 can be in contact with the light shield 115 or suspended in the air, wherein the contact setting can improve the setting stability of the light sensing device 112, and the suspended setting is beneficial to avoid the light receiving area from being blocked.

[0058] In some embodiments of the present application, Figure 5 As shown, the flexible circuit board 111 also includes a light shielding area 111C connected to the flexible circuit board in the first area 111A, and one end of the flexible circuit board in the light shielding area 111C away from the flexible circuit board in the first area 111A extends to the adhesive layer 113 and is bonded to the adhesive layer 113; the flexible circuit board 111 as a whole and the adhesive layer 113 together form a containing space for accommodating the photosensitive device 112. By bending the flexible circuit board 111 multiple times, and using the flexible circuit board corresponding to one of the bends as a light shielding member for the photosensitive device 112, on the one hand, the process and attachment alignment of the light shield 115 can be reduced, greatly saving the space of the whole machine, and on the other hand, the split structure of the photosensitive device 112 and the light shield 115 is changed to an integrated structure of the flexible circuit board 110, which can make the overall structure simpler, with higher attachment accuracy and better light shielding effect.

[0059] The present application also provides a display module, such as Figures 3 to 5 As shown, the display module 100 includes: a screen body 120; a light sensing component 110 as described in any of the above embodiments disposed on one side of the screen body 120; and a packaging structure 130 disposed on a side of the screen body 120 away from the light sensing component.

[0060] Exemplarily, the screen 120 can adopt LCD (Liquid Crystal Display, LCD), OLED (Organic Light-Emitting Diode, OLED), active-matrix organic light-emitting diode or active-matrix organic light-emitting diode Active-matrix Organic Light-emitting Diode, AMOLED), flexible light-emitting diode (FlexLight-emitting Diode, FLED), mini light-emitting diode (Mini Light-emitting Diode, miniled), Micro-LED, Micro-OLED, quantum dot light-emitting diode (Quantum Dot Light-emitting Diodes, QLED), etc.

[0061] Exemplarily, the packaging structure 130 may have various configurations depending on the type of the screen body 120. In one embodiment, the packaging structure 130 may include a polarizer 131, an optical adhesive 132, and a cover plate 133 in order from bottom to top along the thickness direction of the display module 100.

[0062] The display module 100 is provided with the light sensing component 110 below the screen body 120 , which is beneficial to improving the light detection performance, thereby improving the overall display performance of the display module.

[0063] The present application also provides an electronic device 1, such as Figure 2 As shown, the electronic device 1 includes a housing 20 and a display module 100 as described in the above embodiment connected to the housing 20 .

[0064] Exemplarily, the electronic device 1 may be any device with communication functions, such as a smart phone, a vehicle-mounted device, a wearable device, a charging device (such as a power bank), a smart watch, smart glasses, a wireless Bluetooth headset, a computing device or other processing device connected to a wireless modem, as well as various forms of user equipment (UE), a mobile station (MS), a virtual reality / augmented reality device, a terminal device, etc. The electronic device may also be a base station or a server.

[0065] The electronic device 1 is provided with the display module 100 , which is conducive to realizing the ambient light adjustment function of the electronic device 1 quickly and accurately.

[0066] It should be noted that the numbers representing quantities or properties used to describe and claim certain embodiments of the present application should be understood to be modified by the terms "roughly", "about", "approximately" or "substantially" in some cases. For example, unless otherwise specified, "roughly", "about", "approximately" or "substantially" can indicate a ±20% variation of the value described. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values ​​is as accurate as possible within the feasible range.

[0067] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A light sensing component, characterized in that: include: Flexible circuit boards; A photosensitive device, disposed in the first area of ​​the flexible circuit board; An adhesive layer, bonded to the second area of ​​the flexible circuit board, and having an opening corresponding to the photosensitive device; The flexible circuit board in the first area extends in a direction away from the adhesive layer, and one end of the flexible circuit board in the second area close to the opening extends out of the opening edge of the adhesive layer and is connected to the flexible circuit board in the first area.

2. The light sensing component according to claim 1, characterized in that: The edge of one side of the opening away from the photosensitive device is located at the boundary or outside of the light receiving area of ​​the photosensitive device.

3. The light sensing component according to claim 2, characterized in that: The flexible circuit board is tangent to or separated from the light receiving area of ​​the photosensitive device.

4. The light sensing component according to any one of claims 1 to 3, characterized in that: A first reinforcement structure is disposed on a side of the flexible circuit board in the first region facing away from the photosensitive device.

5. The light sensing component according to claim 4, characterized in that: A second reinforcement structure is provided on a side of the flexible circuit board in the second zone away from the adhesive layer, wherein one end of the second reinforcement structure is connected to the first reinforcement structure and one end away from the first reinforcement structure extends through the opening edge.

6. The light sensing component according to any one of claims 1 to 3, characterized in that: An extension direction of the flexible circuit board in the first area is perpendicular to an extension direction of the flexible circuit board in the second area.

7. The light sensing component according to any one of claims 1 to 3, characterized in that: The flexible circuit board further comprises a light shielding area connected to the flexible circuit board in the first area, wherein one end of the flexible circuit board in the light shielding area away from the flexible circuit board in the first area extends to the adhesive layer and is bonded to the adhesive layer; The flexible circuit board as a whole and the adhesive layer together form an accommodating space for accommodating the photosensitive device.

8. The light sensing component according to any one of claims 1 to 3, characterized in that: The light sensing component further comprises a light shield, one end of which is connected to the flexible circuit board in the first area, and the other end of which extends to the adhesive layer and is bonded to the adhesive layer; The light shield, the flexible circuit board and the adhesive layer together form an accommodating space for accommodating the photosensitive device.

9. A display module, characterized in that: include: Screen body; A light sensing component as claimed in any one of claims 1 to 8, arranged on one side of the screen; as well as, A packaging structure is arranged on a side of the screen body away from the light sensing component.

10. An electronic device, characterized in that: The display module comprises a housing and the display module as claimed in claim 9 connected to the housing.

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