Portable electronic device

Abstract

The invention provides a portable electronic device which comprises a main body, a camera module, a noise reduction microphone and a pickup hole, the main body comprises a first side edge, a second side edge and an outer surface, the first side edge and the second side edge are located on the two opposite sides of the outer surface, the camera module is assembled on the main body and exposed out of the outer surface, and the main body comprises a circuit board. The noise reduction microphone is installed on the circuit board, the pickup hole comprises a sound receiving end and a sound output end, the sound receiving end penetrates through the outer surface, the sound receiving end is located on one side of the outer surface and is close to the first side edge, and the sound output end is arranged on the circuit board and is communicated with the sound output hole of the noise reduction microphone; in the width direction of the portable electronic device, the pickup hole is located between the camera module and the first side edge, and the distance from the pickup hole to the first side edge is smaller than the distance from the pickup hole to the second side edge.

Description

Portable electronic devices

[0001] This application claims priority to a patent application filed with the China Patent Office on August 24, 2022, with application number 202211021683.X and application name “Portable Electronic Device,” the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field related to mobile communication equipment, and in particular to a portable electronic device. Background Art

[0003] As the most popular smart terminal device, mobile phones have become an indispensable communication and entertainment tool in our lives. The ultimate pursuit of appearance and reliability in design, and the need to fit more functions into smaller spaces, have become the major trends in mobile phones.

[0004] For example, in order to achieve the reliability of mobile phone sound effects in the existing technology, an additional microphone is added to the back of the circuit board to achieve high-quality sound effects together with the original audio device; in actual design, the microphone is located on the main board, and the sound pickup channel needs to be connected to the outside of the mobile phone. Because there are many internal devices and electronic devices on the main board, the sound pickup channel path is complex, which undoubtedly increases the difficulty of design and stability in a limited space.

[0005] Summary of the Invention

[0006] The present application provides a portable electronic device that can solve the technical problem of being unable to ensure the stability of microphone sound reception in a limited space.

[0007] The portable electronic device provided in the present application includes a main body, a camera module, a noise-canceling microphone and a sound pickup hole. The main body includes a first side edge, a second side edge and an outer surface, the first side edge and the second side edge are located on opposite sides of the outer surface, the camera module is assembled on the main body and exposed on the outer surface, the main body includes a circuit board, the noise-canceling microphone is installed on the circuit board, the sound pickup hole includes a sound receiving end and a sound output end, the sound receiving end passes through the outer surface, the sound receiving end is located on one side of the outer surface and close to the first side edge, the sound output end is opened on the circuit board and connected to the sound output hole of the noise-canceling microphone; along the width direction of the portable electronic device, the sound pickup hole is located between the camera module and the first side edge, and the distance from the sound pickup hole to the first side edge is smaller than the distance from the sound pickup hole to the second side edge.

[0008] In this embodiment, the camera module can be understood as being located in the upper left corner of the portable electronic device, the distance between the sound pickup hole and the first end edge is smaller than the distance between the sound pickup hole and the second end edge; the distance between the sound pickup hole and the first side edge is smaller than the distance between the sound pickup hole and the second side edge, and the sound pickup hole is located between the camera module and the first side edge (there is a sufficient distance from the camera module to ensure that the camera can achieve the purpose of noise reduction when shooting). At the same time, it can be understood that the sound pickup hole is located at the edge of the circuit board and the edge of the mobile phone. There are many components and shrapnel on the circuit board. The sound pickup hole is set at the edge of the circuit board instead of the middle position or inside the camera assembly. There is no need to set some sound pickup holes in the circuit board. This is more conducive to the layout and design of electronic components on the circuit board, improves the utilization rate of the circuit board, reduces the use of the internal space of the electronic device, and saves the internal space of the electronic device.

[0009] In one embodiment, the sound pickup hole includes the sound receiving end, the sound passing gap, the third sub-hole, the second sub-hole, the connecting gap, the first sub-hole and the sound output end. The sound receiving end, the sound passing gap, the third sub-hole, the second sub-hole, the connecting gap, the first sub-hole and the sound output end are connected in sequence to form a hole structure extending in a curve.

[0010] In this embodiment, the sound pickup hole is set as a curved hole structure, which can fully utilize the space between the internal structures of the electronic device, such as the arrangement and gaps between the middle frame, circuit board, bracket, and camera module, thereby improving the flexibility of setting the sound pickup position within a certain area.

[0011] In one embodiment, the sound receiving end is located at one end of the sound-passing slit and passes through the outer surface, the sound output end is one end of the first sub-hole, the sound-passing slit, the third sub-hole, the second sub-hole, the connecting slit, the first sub-hole and the sound output end are located inside the main body, the axial directions of the first sub-hole, the second sub-hole and the third sub-hole are parallel to the thickness direction of the portable electronic device, the third sub-hole and the second sub-hole are both staggered with the first sub-hole, and the connecting slit and the sound-passing slit extend along the width direction of the portable electronic device toward the first side. The sound pickup hole in this embodiment is not limited to a hole that passes through the board, but also utilizes the gaps between the middle frame, circuit board, bracket and back shell to simplify the structure and facilitate the formation of the sound pickup hole.

[0012] In one embodiment, the main body includes a middle frame, a frame surrounding the periphery of the middle frame, and a mainboard bracket, the first sub-hole passes through the circuit board, the second sub-hole passes through the mainboard bracket, and the connecting gap is located between the mainboard bracket and the circuit board; the frame has a recessed card slot on an inner side surface facing the mainboard bracket, and the mainboard bracket has a buckle, the buckle is adjacent to the second sub-hole, and the buckle extends along the width direction of the portable electronic device;

[0013] The circuit board is arranged between the middle frame and the mainboard bracket, and the clip is clamped with the card slot.

[0014] In this embodiment, the second sub-hole is provided to pass through the mainboard bracket and the frame that indirectly supports the mainboard bracket and is clamped with the card slot through a buckle, thereby increasing the mutual clamping force in the axial direction of the second sub-hole, which can increase the fixing force between the mainboard bracket and the middle frame in the thickness direction of the electronic device, and is used to enhance the assembly tightness between the mainboard bracket, the circuit board and the middle frame, and the sealing performance of the connecting gap and the second sub-hole, thereby ensuring the sealing performance of the sound pickup hole to ensure the sound pickup effect.

[0015] In one embodiment, the mainboard bracket is provided with a connection hole, the clip and the connection hole are respectively located on opposite sides of the second sub-hole, and the hole axis of the connection hole extends along the thickness direction of the portable electronic device; a screw is connected to the connection hole to securely connect the circuit board and the mainboard bracket. In this embodiment, the second sub-hole is provided through the mainboard bracket and the circuit board is directly connected and fixed by screws, and the connection hole and clip of the connecting screw are located on opposite sides of the second sub-hole. This further improves the assembly tightness between the mainboard bracket and the circuit board, thereby ensuring the sealing performance of the connection gap and the second sub-hole, and further ensuring the sealing performance of the sound pickup hole, thereby ensuring the sound pickup effect.

[0016] In one embodiment, a spring sheet is provided on the circuit board, the spring sheet is adjacent to the first sub-hole, the mainboard bracket includes a body and a retaining wall, the second sub-hole passes through two opposite surfaces of the body, the buckle is located on one side of the body, and the retaining wall is provided on the other side of the body and is spaced opposite to the buckle;

[0017] A cantilever is provided on the retaining wall, and the connection between the cantilever and the main body is a hollow area. The hollow area and the second sub-hole are spaced apart along the width direction of the portable electronic device. The buckle and the connecting hole are respectively spaced apart from the retaining walls on both sides of the hollow area, and the spring elastically supports between the retaining wall and the circuit board.

[0018] In this embodiment, the mainboard bracket and the frame indirectly supporting the mainboard bracket are clamped to the clamping slot via a buckle. The elastic holding force between the retaining wall and the circuit board caused by the elastic piece can be offset by the clamping force between the buckle and the clamping slot, thereby preventing the elastic holding force from pushing the mainboard bracket away from the circuit board and increasing the size of the connection gap. Furthermore, the elastic force of the elastic piece pushes the retaining wall away from the circuit board. Since the hollow area and the second sub-hole are spaced apart along the width direction of the portable electronic device, and the screw and buckle are located on opposite sides of the second sub-hole, the elastic force will bypass the hollow area and be transmitted along the cantilever to the positions on both sides of the hollow area. The elastic force can be decomposed by the screw and buckle, further reducing the reaction force on the mainboard bracket, thereby ensuring the sealing performance of the connection gap and the second sub-hole, thereby ensuring the sound pickup effect.

[0019] In one embodiment, the body includes a first surface and a second surface disposed opposite the first surface. The second surface is provided with a recessed groove, and the second sub-hole extends through the bottom wall of the recess. The recess is connected to the hollowed-out area and is used to accommodate the sealing foam. In this embodiment, the sealing foam is placed within the recess to seal the end of the second sub-hole away from the connecting gap. The sealing foam seals the periphery of the end of the second sub-hole located at the bottom wall of the recess, thereby improving the sealing performance of the second sub-hole. Simultaneously, the bracket of this embodiment presses against the sealing foam, providing a more effective seal. The sealing foam is disposed within the recess and is not directly affected by the insufficient fixing force between the bracket and the motherboard bracket, further ensuring the sealing effect of the second sub-hole.

[0020] In one embodiment, a recess is provided on the first surface, and the second sub-hole extends through the bottom of the recess. The recess and the groove at least partially overlap in the thickness direction of the portable electronic device, and the connecting gap is formed between the bottom of the recess and the surface of the circuit board. In this embodiment, the gap between the circuit board connected to the second sub-hole and the mainboard bracket is divided into areas by the recess, that is, the connecting gap is formed between the recess and the surface of the circuit board, rather than directly between two planes. This allows for control of the gap area and improves the sealing performance of the recess, thereby further improving the sealing of the connecting gap, thereby ensuring sound pickup.

[0021] In one embodiment, the main body includes a rear shell mounted on a middle frame, the rear shell includes a shell and a cover covering the shell, the sound receiving end passes through the side edge of the cover, and in the thickness direction of the electronic device, the sound-transmitting gap is formed between the cover and the outer surface of the shell, and the sound-transmitting gap is connected to the sound receiving end.

[0022] In this embodiment, a sound-passing gap is formed by utilizing the gap between the cover plate for fixing the camera assembly and the back cover as a part of the sound pickup hole, and the sound receiving end of the sound pickup hole is arranged at the side position of the back shell, that is, at a position intersecting with the thickness direction of the electronic device, so as to make full use of the space and facilitate the reception of the sound pickup effect.

[0023] In one embodiment, a bracket is provided on the surface of the housing facing away from the outer surface, supporting the camera module. The third sub-hole extends through the housing and the edge of the bracket along the thickness of the electronic device. One end of the third sub-hole connects to the second sub-hole, and the other end connects to the sound-passing gap. In this embodiment, the third sub-hole is positioned at the edge of the bracket, close to the camera module, to ensure sound quality during camera recording.

[0024] In one embodiment, the present application provides a portable electronic device comprising a middle frame, a frame surrounding the periphery of the middle frame, a circuit board, a mainboard bracket, a noise reduction microphone, and a sound pickup hole;

[0025] The circuit board comprises a front surface and a back surface, and the back surface is provided with a spring;

[0026] The sound pickup hole includes a first sub-hole, a connecting gap and a second sub-hole connected in sequence, the first sub-hole passes through the front and back sides and is adjacent to the elastic sheet, and the second sub-hole passes through the mainboard bracket;

[0027] The mainboard bracket is provided with a buckle and a connecting hole, the buckle and the connecting hole are respectively located on opposite sides of the second sub-hole, the buckle extends along the width direction of the portable electronic device; the hole axis of the connecting hole extends along the thickness direction of the portable electronic device; the inner side surface of the frame facing the mainboard bracket is recessed with a card slot;

[0028] The noise reduction microphone is mounted on the front of the circuit board and is connected to one end of the first sub-hole. The circuit board is arranged between the middle frame and the mainboard bracket. The connecting gap is formed between the mainboard bracket and the circuit board. The spring elastically supports the circuit board and the mainboard bracket. The buckle is clamped with the card slot. The connecting hole is connected with a screw to fix the circuit board and the mainboard bracket.

[0029] In this embodiment, the mainboard bracket and the frame are clamped to the card slot by a buckle, and are screwed to the circuit board by a screw. The connecting hole of the connecting screw and the buckle are located on opposite sides of the second sub-hole. The elastic supporting force between the spring sheet and the mainboard bracket and the circuit board can be offset by the clamping force between the buckle and the card slot, thereby preventing the elastic supporting force from pushing the mainboard bracket away from the circuit board and avoiding increasing the gap size of the connecting gap, thereby ensuring the sealing performance of the sound pickup hole to ensure the sound pickup effect.

[0030] In one embodiment, the mainboard bracket includes a body and a retaining wall, the second sub-hole passes through two opposite surfaces of the body, the buckle is located on one side of the body, and the retaining wall is provided on the other side of the body and is spaced opposite to the buckle;

[0031] The retaining wall is provided with a cantilever, and the connection between the cantilever and the body is a hollow area. The hollow area and the second sub-hole are spaced apart along the width direction of the portable electronic device. The buckle and the connecting hole are respectively spaced apart from the retaining walls on both sides of the hollow area, and the spring plate elastically supports the retaining wall and the circuit board. In this embodiment, the elastic force of the spring plate pushes the retaining wall away from the circuit board. Since the hollow area and the second sub-hole are spaced apart along the width direction of the portable electronic device, and the screw and buckle are located on opposite sides of the second sub-hole, the elastic force will bypass the hollow area and be transmitted along the cantilever to the positions on both sides of the hollow area. The elastic force can be decomposed by the screw and buckle, further reducing the reaction force on the circuit board, thereby ensuring the sealing performance of the connecting gap and the second sub-hole, thereby ensuring the sound pickup effect.

[0032] In one embodiment, the body includes a first surface and a second surface disposed opposite the first surface. The second surface is provided with a recessed groove, and the second sub-hole extends through the bottom wall of the recess. The recess is connected to the hollowed-out area and is used to accommodate the sealing foam. In this embodiment, the sealing foam is placed within the recess to seal the end of the second sub-hole away from the connecting gap. The sealing foam seals the periphery of the end of the second sub-hole located at the bottom wall of the recess, thereby improving the sealing performance of the second sub-hole. Simultaneously, the bracket of this embodiment presses against the sealing foam, providing a more effective seal. The sealing foam is disposed within the recess and is not directly affected by the insufficient fixing force between the bracket and the motherboard bracket, further ensuring the sealing effect of the second sub-hole.

[0033] In one embodiment, a recess is provided on the first surface, and the second sub-hole extends through the bottom of the recess. The recess and the groove at least partially overlap in the thickness direction of the portable electronic device, and the connecting gap is formed between the bottom of the recess and the surface of the circuit board. In this embodiment, the gap between the circuit board connected to the second sub-hole and the mainboard bracket is divided into areas by the recess, that is, the connecting gap is formed between the recess and the surface of the circuit board, rather than directly between two planes. This allows for control of the gap area and improves the sealing performance of the recess, thereby further improving the sealing of the connecting gap, thereby ensuring sound pickup.

[0034] In one embodiment, the sound pickup hole includes the sound receiving end and a sound-passing gap, the main body includes a rear shell mounted on the middle frame, the rear shell includes a shell and a cover plate covering the shell, the sound receiving end passes through the side edge of the cover plate, and the sound-passing gap is formed between the cover plate and the outer surface of the shell in the thickness direction of the electronic device, and the sound-passing gap is connected to the sound receiving end.

[0035] In this embodiment, a sound-passing gap is formed by utilizing the gap between the cover plate for fixing the camera assembly and the back cover as a part of the sound pickup hole, and the sound receiving end of the sound pickup hole is arranged at the side position of the back shell, that is, at a position intersecting with the thickness direction of the electronic device, so as to make full use of the space and facilitate the reception of the sound pickup effect.

[0036] In one embodiment, the sound pickup hole includes a third sub-hole. A bracket is provided on the surface of the housing facing away from the outer surface, supporting the camera module. The third sub-hole extends through the housing and the edge of the bracket along the thickness of the electronic device. One end of the third sub-hole connects to the second sub-hole, and the other end connects to the sound-passing slit. In this embodiment, the third sub-hole is positioned at the edge of the bracket, close to the camera module, to ensure sound quality when the camera is recording.

[0037] The portable electronic device described in the present application sets the sound pickup hole at the edge of the circuit board, rather than in the middle or inside the camera assembly. There is no need to set up some sound pickup holes in the circuit board, which is more conducive to the layout and design of electronic components on the circuit board, improves the utilization rate of the circuit board, reduces the use of the internal space of the electronic device, and saves the internal space of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0039] FIG1 is a schematic diagram of a three-dimensional structure of a portable electronic device provided in an embodiment of the present application;

[0040] FIG2 is a schematic diagram of a partial structure of the portable electronic device shown in FIG1 ;

[0041] FIG3 is a schematic cross-sectional view of the portable electronic device shown in FIG1 at an angle;

[0042] FIG4 is a schematic diagram of the internal structure of the portable electronic device shown in FIG1 ;

[0043] FIG5 is a schematic structural diagram of a mainboard bracket of the portable electronic device shown in FIG1 ;

[0044] FIG. 6 is a schematic cross-sectional view at an angle of the portable electronic device shown in FIG. 1 . DETAILED DESCRIPTION

[0045] In the description of this application, the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "vertical", "lateral", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting this application. In the following, the terms "first", "second", etc. are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of such features.

[0046] The portable electronic device provided in the present application includes a main body, a camera module, a noise-canceling microphone and a sound pickup hole. The main body includes a first side edge, a second side edge and an outer surface, the first side edge and the second side edge are located on opposite sides of the outer surface, the camera module is assembled on the main body and exposed on the outer surface, the main body includes a circuit board, the noise-canceling microphone is installed on the circuit board, the sound pickup hole includes a sound receiving end and a sound output end, the sound receiving end passes through the outer surface, the sound receiving end is located on one side of the outer surface and close to the first side edge, the sound output end is opened on the circuit board and connected to the sound output hole of the noise-canceling microphone; along the width direction of the portable electronic device, the sound pickup hole is located between the camera module and the first side edge, and the distance from the sound pickup hole to the first side edge is smaller than the distance from the sound pickup hole to the second side edge.

[0047] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0048] Please refer to Figures 1 and 2. Figure 1 is a schematic structural diagram of the portable electronic device 100 provided in an embodiment of the present application. Figure 2 is a schematic structural diagram of a portion of the portable electronic device 100 shown in Figure 1, in which the back cover is removed. The portable electronic device can be an electronic product with audio playback and recording functions, such as a mobile phone, a tablet computer, headphones, an audio player, a smart watch, etc. The embodiment of the present application is described using the portable electronic device 100 mobile phone as an example. For ease of description, the width direction of the portable electronic device 100 is defined as the X-axis direction, and the thickness is defined as the Y-axis direction, that is, the arrangement direction of the main body A and the display screen B; the width and length direction of the portable electronic device 100 is defined as the Z-axis direction.

[0049] Portable electronic device 100 includes a main body A, a display screen B, a camera assembly 50, a microphone module, and a sound pickup hole 60. Display screen B is mounted on one side of main body A, and camera assembly 50 is mounted on the other side of main body A. Display screen B is used to operate the phone and display phone function interfaces, images, and videos. Display screen B can be an organic light-emitting diode (OLED) display or a liquid crystal display. In this embodiment, an OLED display is used.

[0050] The camera assembly 50 includes two or more camera modules 50A and a flash, which are used for the mobile phone's photo and video recording functions. The camera assembly 50 of this embodiment includes three camera modules 50A, which are arranged at the left edge or right edge near the top of the main body A. For example, the first camera module 50A is the main camera, and the second and third camera modules are auxiliary cameras, which can be depth cameras, telephoto / wide-angle cameras, or black and white cameras. It should be noted that three cameras are only one embodiment, and they can be arranged side by side or in a ring.

[0051] The main body A of the portable electronic device 100 includes a top side 101 and a bottom side 102, as well as a first side 103 and a second side 104. The top side 101 is provided with a sound outlet for emitting sound, while the bottom side 102 is provided with a microphone hole and a connector jack. When a user is using a mobile phone for a call, the top side 101 corresponds to the user's ear, and the bottom side 102 corresponds to the person's mouth, facilitating the transmission of sound. Of course, the sound outlet and microphone holes can also be used to transmit sound from external functions. This embodiment only lists some of the functional components of the mobile phone. The top side 101 and bottom side 102 may also include other functional holes and buttons, and are not limited to the description of this embodiment. The first side 103 and the second side 104 are used to accommodate the volume button or the power button of the mobile phone. It can be understood that when the display screen B is installed on the main body A, the top side 101 and bottom side 102 of the main body also serve as the top and bottom of the portable electronic device 100, and the first side 103 and the second side 104 also serve as the two sides of the portable electronic device 100.

[0052] Please also refer to Figure 3, which is an angled cross-sectional diagram of the portable electronic device shown in Figure 1; the main body A also includes a rear shell 10, a middle frame assembly 20 and a circuit board 30. Of course, the main body A is not limited to the components listed above, and also includes components such as speakers, antennas, processors, etc. to meet the multi-functional performance of existing mobile phones. We will not elaborate on them here. The middle frame assembly 20 is used to support the rear shell 10, the circuit board 30, the microphone module, the display screen B and the camera assembly 50. The rear shell 10 and the display screen B are located on opposite sides of the middle frame assembly 20, and the rear shell 10 is on the back of the portable electronic device 100. The microphone module is located on the side of the circuit board 30 facing away from the rear shell 10 and is electrically connected to the circuit board 30. The camera assembly 50 is located on the side of the main body A facing away from the display screen B and is exposed from the rear shell 10. The sound pickup hole 60 is located inside the main body A and is connected to the outside of the mobile phone.

[0053] In this embodiment, the microphone module includes a main microphone (not shown), a secondary microphone (not shown) and a noise reduction microphone 40. The main microphone and the secondary microphone are respectively located in the main body A near the top edge 101 and the bottom edge 102. The mobile phone is also provided with a speaker (not shown) for playing audio. The speaker is located in the main body A near the top edge 101 and corresponds to the sound outlet. The main microphone is used to pick up external audio (including noise reduction functions) when the mobile phone is recording, recording, etc. The sound pickup hole is set on the top edge 101 or the back of the main body corresponding to the main microphone for volume passing. The secondary microphone corresponds to the microphone sound hole and is generally used to pick up speech audio when the mobile phone is talking. The noise reduction microphone is used to work simultaneously with the main microphone to pick up external noise for noise reduction. The noise reduction microphone 40 can work simultaneously with the main microphone to pick up external noise for noise reduction.

[0054] The sound pickup hole includes the sound receiving end, the sound-passing slit, the third sub-hole, the second sub-hole, the connecting slit, the first sub-hole, and the sound output end. The sound receiving end, the sound-passing slit, the third sub-hole, the second sub-hole, the connecting slit, the first sub-hole, and the sound output end are sequentially connected to form a curved hole structure. In this embodiment, configuring the sound pickup hole as a curved hole structure can fully utilize the space between internal structures of the electronic device, such as the arrangement and gaps between the middle frame, circuit board, bracket, and camera module, thereby increasing the flexibility of setting the sound pickup position within a given area.

[0055] Specifically, the sound pickup hole 60 includes a sound receiving end 61 and a sound output end. The sound pickup hole 60 passes through the rear housing 10, the middle frame assembly 20, and the circuit board 30. The sound receiving end 61 is located on the rear housing 10, and the sound output end is located inside the main body A and is connected to the noise reduction microphone 40 of the microphone module to collect sound. In this embodiment, the sound pickup hole 60 is provided on one side of the camera assembly 50 to facilitate the removal of noise when the camera is recording video or audio.

[0056] In this embodiment, the rear shell 10 includes a shell 11, a cover plate 13 and a third sub-hole 16. The shell 11 is a rectangular thin plate and can serve as a battery cover of the mobile phone and also as an appearance part of the back of the mobile phone.

[0057] Specifically, the housing 11 includes an outer surface 111 and a back surface (not labeled) facing away from the outer surface 111. The housing 11 also includes an opening (not labeled) extending through the outer surface 111 and the back surface. The opening is located at a corner of the housing 11 and is used to accommodate the camera assembly 50. This can also be understood as the camera assembly 50 being located at the upper left corner of the body A.

[0058] The bracket 14 is fixed to the back of the housing 11 and is used to support the camera assembly 50 and fix the camera assembly 50 to the rear housing 10. It is understood that the bracket 14 can be a part of the housing 11, integrally formed with the housing 11, or fixed to the housing 11 by a connection. In this embodiment, the bracket 14 is partially located within the opening, and the cover 13 is located on one side of the outer surface 111 and mounted on the opening to partially cover the structure of the camera assembly 50, preventing the internal structure of the camera assembly from affecting the appearance of the electronic device. The cover 13 can also be used to allow light to pass through or expose the lens of the camera module.

[0059] The third sub-hole 16 passes through the outer surface 111 and the back surface along the thickness direction of the rear shell 10, specifically, passes through the bracket 14 and part of the shell 11. It can also be understood that the third sub-hole 16 passes through the shell 11 or the rear shell 10.

[0060] As shown in Figure 6, Figure 6 is an angled cross-sectional schematic diagram of the portable electronic device shown in Figure 1. The cover 13 is bent around a connecting edge 131, and a notch 132 is provided on the connecting edge 131. After the cover 13 is installed on the opening of the shell 11, the connecting edge 131 is connected and sealed to the outer surface 111 around the opening. Among them, there is a sound-transmitting gap a extending along the X-axis direction between the cover 13 and the outer surface 111 of the shell 11, and the notch 132 and the outer surface 111 form the sound receiving end 61, which is connected to the sound-transmitting gap a. In this embodiment, the sound receiving end 61 faces the first side 103 of the portable electronic device 100. Of course, the sound receiving end 61 can also face the top edge 101. The outer surface of the cover 13 and the outer surface 111 can be understood as the outer surface of the back of the main body A or the mobile phone, and the sound receiving end 61 passes through the outer surface.

[0061] Referring to Figures 3 and 4 , Figure 4 is a schematic diagram of the internal structure of the portable electronic device shown in Figure 1 . The circuit board 30 is a board body comprising a front surface 31 and a back surface 32 disposed opposite the front surface 31 . A wiring layer is provided within the circuit board 30 , and the wiring layer protrudes from the front surface 31 . This layer is used for electrical connection to electronic components such as a central processing unit mounted on the front surface 31 , as well as for electrical connection to external components such as cameras and speakers. Multiple springs 35 are provided on the front surface 31 and back surface 32 . These serve as grounding or conduction devices. The back surface 32 can also be used to mount electronic components.

[0062] In this embodiment, the noise reduction microphone 40 is mounted on the front surface 31 and electrically connected to the circuit board 30. In this embodiment, the circuit board 30 is further provided with a first sub-hole 301, which passes through the front surface 31 and the back surface 32. The first sub-hole 301 is used to be opposite to and connected to the third sub-hole 16. The first sub-hole 301 is located at the edge of one side of the circuit board 30 and avoids the shrapnel 35. The number of shrapnel 35 on the edge of one side of the circuit board 30 is relatively small, which can be understood as the first sub-hole 301 avoiding the electronic components and shrapnel on the circuit board 30. The first sub-hole 301 is set at the edge of the circuit board 30, rather than in the middle or inside the camera assembly, and there is no need to set some pickup holes in the middle of the circuit board 30. This is more conducive to the layout and design of the electronic components on the circuit board 30, improves the utilization rate of the circuit board, reduces the use of the internal space of the electronic device, and saves the internal space of the electronic device.

[0063] Please refer to Figure 5 as well, which is a structural diagram of the motherboard bracket of the portable electronic device shown in Figure 1; the middle frame assembly 20 includes a middle frame 21, a frame 22 and a motherboard bracket 23. The middle frame 21 is a generally rectangular plate body, which includes a first side (the side where the first side 103 is located) and a second side 212 (the side where the second side 104 is located) arranged opposite to the first side 211. The frame 22 is a rectangular frame structure, which is arranged around the periphery of the middle frame 21. In this embodiment, the middle frame 21 is a metal part, the frame 22 is a plastic part, and the frame 22 is integrally formed with the middle frame 21. The motherboard bracket 23 is fixed on the first side 211 of the middle frame 21. It can be understood that the motherboard bracket 23 is a part of the middle frame 21 and can be integrally formed with the middle frame 21. The motherboard bracket 23 is used to support the circuit board 30.

[0064] Specifically, as shown in Figure 2, the frame 22 includes a first end edge 221, a second end edge 222, a first side edge 223, and a second side edge 224. The first end edge 221 and the second end edge 222 are spaced opposite to each other along the Z-axis direction, and the first side edge 223 and the second side edge 224 are spaced apart along the X-axis direction. The first end edge 221, the second end edge 222, the first side edge 223, and the second side edge 224 are connected end to end to form a frame. The first end edge 221 is connected to one end of the middle frame 21, and the second end edge 222 is connected to the other end of the middle frame 21; the first side edge 223 is connected to one side of the middle frame 21, and the second side edge 224 is connected to the other side of the middle frame 21. The first end edge 221 serves as the top edge 101 of the main body A and is located at the top position of the portable electronic device 100 as the top shell. The second end edge 222 serves as the bottom edge 102 of the main body A and is located at the bottom position of the portable electronic device 100 as the bottom shell. The first side 223 serves as the first side 103 of the main body A and is located at a side position of the portable electronic device 100 as a side shell. The second side 224 serves as the second side 104 of the main body A and is located at a side position of the portable electronic device 100 as a side shell.

[0065] Referring to FIG. 5 , in this embodiment, the mainboard bracket 23 includes a body 230 and a cantilever 235 , a buckle 236 , a second sub-hole 233 , and a connecting hole 237 disposed on the body 230 .

[0066] Specifically, the body 230 includes a first surface 231, a second surface 232 disposed opposite the first surface 231, a first side 238, and a second side 239 opposite the first side 238. The first side 238 and the second side 239 both connect the first surface 231 and the second surface 232. The second sub-hole 233 extends through the first surface 231 and the second surface 232. The second sub-hole 233 is configured to communicate with the first sub-hole 301, where such communication refers to coaxial communication between the first sub-hole 301 and the second sub-hole 233, or staggered communication. The connecting hole 237 extends through the first surface 231 and the second surface 232, and is spaced apart from the second sub-hole 233 along the Z direction.

[0067] A recess 2311 is provided on the first surface 231, and the recess 2311 is used to form a connecting gap b with the back surface 32 of the circuit board, and the connecting gap b is used to connect the second sub-hole 233 and the first sub-hole 301. The second sub-hole 233 passes through the bottom wall of the recess 2311. A groove 2321 is provided on the second surface 232, and the groove 2321 is used to accommodate sealing foam to achieve sealing of part of the pickup hole. In this embodiment, the recess 2311 and the groove 2321 at least partially overlap in the Y-axis direction, and the second sub-hole 233 (Y direction) passes through the bottom wall of the recess 2311 and the bottom wall of the groove 2321. Among them, the recess 2311 is closer to the first side 238, and is used to adapt to the position of the first sub-hole 301 on the circuit board 30.

[0068] In this embodiment, a sealing foam is placed in groove 2321 to seal the end of the second sub-hole away from the connecting gap. The sealing foam seals the periphery of the end of the second sub-hole 233 located at the bottom wall of groove 2321, improving the sealing performance of second sub-hole 233. Simultaneously, the bracket of this embodiment presses against the sealing foam, providing a more effective seal. The sealing foam is placed within the groove and is not directly affected by the insufficient fixing force between the bracket and the motherboard bracket 23, further ensuring the sealing effect of second sub-hole 233. In this embodiment, groove 2321 is connected to the hollow area.

[0069] The latch 236 is provided at the edge where the first surface 231 connects to the first side 238, and is located on the side of the groove 2321 away from the connection hole 237. The latch 236 extends parallel to the first surface 231 in a direction protruding from the first side 238, that is, the latch 236 protrudes from the first side 238. A recessed slot 225 is provided on the surface of the first side 223 of the frame 22 facing the middle frame 21. After the motherboard bracket 23 is installed in the middle frame 21, the latch 236 extends into the recessed slot 225 and engages with the recessed slot 225, preventing the motherboard bracket 23 from moving away from the circuit board in the Y-axis direction.

[0070] In this embodiment, the second sub-hole 233 is provided to pass through the mainboard bracket 23 and the circuit board 30 and is directly fixed by screws. The connecting hole 237 and the buckle 236 of the connecting screw are located on opposite sides of the second sub-hole 233, further improving the assembly tightness between the mainboard bracket 23 and the circuit board 30, thereby ensuring the sealing performance of the connecting gap b and the second sub-hole 233, and further ensuring the sealing performance of the sound pickup hole 60, so as to ensure the sound pickup effect.

[0071] A retaining wall 2320 is projecting from the second surface 232, extending along the length of the second surface 232. The retaining wall 2320 is positioned proximate to the second side 239. A hollowed-out area C is defined at the junction of the retaining wall 2320 and the body 230, and a cantilever 235 is formed on the retaining wall 2320 corresponding to the hollowed-out area C. Specifically, the portion remaining after the hollowed-out area C is formed on the retaining wall 2320 constitutes the cantilever 235. This can be understood as the cantilever 235 being separated from the first surface 231 of the body 230 by the hollowed-out area C, with the cantilever 235 positioned above one side of the groove 2321. In this embodiment, the hollowed-out area C extends through the retaining wall 2320 and connects to the groove 2321, with the direction of the hollowed-out area C intersecting the direction of extension of the retaining wall 2320. In other embodiments, the hollowed-out area C may extend through both the body 230 and the retaining wall 2320. It can be understood that the retaining wall 2320 has a gap that divides the retaining wall 2320 into two parts, and the cantilever 235 is located in the gap and connects the retaining wall parts on both sides of the gap. The length direction of the cantilever 235 is the X-axis direction. The cantilever 235 is separated from the body 230 by a portion of the gap.

[0072] In this embodiment, the mainboard bracket 23 and the frame 22 that indirectly supports the mainboard bracket 23 are clamped by the clip 236 and the slot 225. The elastic supporting force between the spring piece 35 and the retaining wall 2320 and the circuit board 30 can be offset by the clamping force between the clip 236 and the slot 225, thereby preventing the elastic supporting force from pushing the mainboard bracket 23 away from the circuit board and increasing the gap size of the connecting gap b.

[0073] The motherboard bracket 23 includes an extension arm 23A connected to the second side 239 of the main body 230. The extension arm 23A and the mainboard bracket 23 define a generally rectangular avoidance groove D for avoiding the camera assembly 50. It can be understood that the mainboard bracket 23 is a thin plate, and the avoidance groove is defined in the plate to form the main body 230 and the extension arm 23A.

[0074] The motherboard bracket 23 is fixed to the middle frame 21 near the first end edge 221 and the first side edge 223. The first surface 231 of the motherboard bracket 23 is oriented in the same direction as the first side 211, and the second surface 232 is oriented in the same direction as the second side 212. It is understood that the motherboard bracket 23 can be embedded in the middle frame 21 and supported by the middle frame 21. In this embodiment, the motherboard bracket 23 is supported by the middle frame 21.

[0075] The circuit board 30 and display screen B are located on the first side 211, with the display screen B supported by the middle frame 21 and the frame 22. The camera assembly 50 and rear housing 10 are located on the second side 212. The rear housing 10 covers the second side 212 of the middle frame 21 and is connected to the frame 22. A cover 13 secures the camera assembly 50 to the main body A. The bracket 14 of the camera assembly 50 abuts against the second side 232 of the mainboard bracket 23. A sealing foam is contained within the groove 2321, which the bracket 14 partially compresses to seal the perimeter of the second sub-hole 233. The circuit board 30 is supported by the mainboard bracket 23 and a portion of the middle frame 21, with the first side 231 facing the back side 32 of the circuit board 30. Screws are installed in the connection holes 237 of the main body 230. These screws threadably connect the circuit board 30 and the mainboard bracket 23, locking them relative to each other in the Y direction. Simultaneously, the latch 236 extends into the slot 225 of the frame 22 and engages with it.

[0076] In this embodiment, the first surface 231 of the motherboard bracket 23 contacts the back surface 32 of the circuit board 30; the first sub-hole 301 and the second sub-hole 233 are arranged along the Y-axis and are offset (the hole axes are not on the same straight line). A connecting gap b is defined between the recessed portion 2311 on the first surface 231 and the back surface 32, and the connecting gap b extends toward the first side 223 along the X-axis. The first sub-hole 301, which passes through one end of the first surface 231, and the second sub-hole 233, which passes through one end of the back surface 32, are connected to the connecting gap b, respectively. It can be understood that the connecting gap b is located in the offset region between the first sub-hole 301 and the second sub-hole 233. In this embodiment, in the X-axis direction, the first sub-hole 301 is closer to the first side 103 of the portable electronic device 100 than the second sub-hole 233. That is, the first sub-hole 301 is closer to the first side 223 of the frame 22 than the second sub-hole 233.

[0077] The noise-canceling microphone 40 is mounted on the front face 31 of the circuit board 30 and is connected to the first sub-hole 301. One end of the first sub-hole 301 that passes through the front face 31 serves as the sound output end. That is, along the Y direction, the motherboard bracket 23 is located between the circuit board 30 and the camera assembly 50. The sound pickup hole 60 is composed of the sound receiving end 61, the sound-passing gap a, the third sub-hole 16, the second sub-hole 233, the connecting gap b, the first sub-hole 301, and the sound output end located at the first sub-hole 301. The sound pickup path of the noise-canceling microphone 40 is a curve and is the extended path of the sound pickup hole 60. External sound sources of the mobile phone enter the sound pickup hole 60 through the sound receiving end 61 and are transmitted to the microphone through the sound output end, achieving a noise reduction effect. It can be understood that the sound receiving end 61 is located at one end of the sound-passing gap a and passes through the outer surface 111. The sound output end is one end of the first sub-hole 301. The sound-passing gap a, the third sub-hole 16, the second sub-hole 233, the connecting gap b, the first sub-hole 301 and the sound output end are located inside the main body A. The axial directions of the first sub-hole 301, the second sub-hole 233 and the third sub-hole 16 are parallel to the thickness direction of the portable electronic device. The third sub-hole 16 and the second sub-hole 233 are both offset from the first sub-hole 301. The connecting gap b and the sound-passing gap a extend along the width direction of the portable electronic device toward the first side. The sound pickup hole 60 in this embodiment is not limited to a hole that passes through the board. It also utilizes the gap between the middle frame 21, the circuit board 30, the mainboard bracket 23 and the rear shell to simplify the structure and facilitate the formation of the sound pickup hole.

[0078] It should be noted that a portion of the spring clip 35 of the circuit board 30 is located between the circuit board 30 and the motherboard bracket 23. The rebound force of the spring clip 35 in the direction away from the circuit board 30 acts against the retaining wall 2320 and the cantilever 235, exerting a certain amount of force against the motherboard bracket 23 in the direction away from the circuit board. Because the circuit board 30 and the motherboard bracket 23 are screwed together, they are locked relative to each other in the Y-axis direction. Simultaneously, the latch 236 extends into the slot 225 of the frame 22 and engages with the slot 225, also exerting a retaining force in the Y-axis direction. The retaining wall 2320 transfers the rebound force of the spring piece 35 to the buckle 236 and the screw through the main body 230; and then transfers it to the middle frame 21 and the frame 22 through the buckle 236 and the screw, and the limiting directions of the buckle 236 and the screw are both on the Y-axis direction frame, so that the pressing and sealing effect of the mainboard bracket 23 and the circuit board 30 is not affected by the rebound force of the spring piece, and thus the supporting force of the spring piece 35 on the mainboard bracket 23 will be offset, which can increase the pressing force between the mainboard bracket 23 and the circuit board 30, improve the sealing effect of the connection gap b of the sound pickup hole 60, and prevent sound leakage from the connection gap b to affect the sound pickup effect.

[0079] At the same time, a hollow area C is formed near the retaining wall 2320 near the second sub-hole 233. The rebound force generated by the spring clip 35 on the retaining wall 2320 bypasses the hollow area and is directed onto the cantilever 235, thereby reducing the direct impact of the rebound force of the spring clip 35 on the sealing performance of the second sub-hole 233. Specifically, the elastic force of the spring clip pushes the retaining wall away from the circuit board 30. Because the hollow area and the second sub-hole 233 are spaced apart along the width of the portable electronic device, and the screw and buckle 236 are located on opposite sides of the second sub-hole 233, the elastic force bypasses the hollow area and is transmitted along the cantilever 235 to the positions on both sides of the hollow area. This elastic force is then decomposed by the screw and buckle, further reducing the reaction force on the motherboard bracket, thereby ensuring the sealing performance of the connection gap b and the second sub-hole 233, thereby ensuring the sound pickup effect.

[0080] In this embodiment, the camera assembly 50 is mounted on the main body A and is located at the upper left corner of the rear shell 10, that is, at the upper left corner of the back of the portable electronic device 100. Along the Z-axis direction (the length direction of the mobile phone), the distance L1 between the sound pickup hole 60 and the first end edge 221 is smaller than the distance between the sound pickup hole 60 and the second end edge 222 (not shown in the figure); along the X-axis direction, the distance L3 between the sound pickup hole 60 and the first side edge 223 is smaller than the distance between the sound pickup hole 60 and the second side edge 224 (not shown in the figure), wherein the boundary of the sound pickup hole 60 is based on the entire area where the sound pickup hole 60 is located. The sound pickup hole 60 is located between the camera module 50A of the camera assembly 50 and the first side 223. It can be understood that the sound pickup hole 60 is located at the edge of the circuit board 30 and the edge of the mobile phone; since the sound pickup hole 60 passes through the rear shell 10, the mainboard bracket 23, the circuit board 30 and the camera module bracket 52, and there are many components and shrapnel 35 on the circuit board 30, the sound pickup hole 60 is set at the edge of the circuit board 30 instead of the middle position, or on the side of the camera assembly close to the middle, there is no need to set some sound pickup holes in the middle position of the circuit board, which is more conducive to the layout and design of electronic components on the circuit board 30, reduces the use of the internal space of the main body, and improves the utilization rate of the circuit board.

[0081] The above are only some of the embodiments and implementations of this application. The scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A portable electronic device, characterized in that: The device comprises a main body, a camera module, a noise reduction microphone and a sound pickup hole. The main body comprises a first side, a second side and an outer surface. The first side and the second side are located on opposite sides of the outer surface. The camera module is assembled on the main body and exposed on the outer surface. The main body comprises a circuit board. The noise reduction microphone is mounted on the circuit board. The sound pickup hole includes a sound receiving end and a sound output end, the sound receiving end passes through the outer surface, the sound receiving end is located on one side of the outer surface and close to the first side edge, and the sound output end is opened on the circuit board and communicates with the sound output hole of the noise reduction microphone; Along the width direction of the portable electronic device, the sound pickup hole is located between the camera module and the first side, and the distance from the sound pickup hole to the first side is smaller than the distance from the sound pickup hole to the second side.

2. The portable electronic device according to claim 1, wherein: The sound pickup hole includes the sound receiving end, the sound passing gap, the third sub-hole, the second sub-hole, the connecting gap, the first sub-hole and the sound output end. The sound receiving end, the sound passing gap, the third sub-hole, the second sub-hole, the connecting gap, the first sub-hole and the sound output end are connected in sequence to form a hole structure extending in a curve.

3. The portable electronic device according to claim 2, wherein: The sound receiving end is located at one end of the sound-passing slit and passes through the outer surface. The sound-emitting end is one end of the first sub-hole. The sound-passing slit, the third sub-hole, the second sub-hole, the connecting slit, the first sub-hole and the sound-emitting end are located inside the main body. The axial directions of the first sub-hole, the second sub-hole and the third sub-hole are parallel to the thickness direction of the portable electronic device. The third sub-hole and the second sub-hole are staggered with the first sub-hole. The connecting slit and the sound-passing slit extend toward the first side along the width direction of the portable electronic device.

4. The portable electronic device according to claim 2, wherein: The main body includes a middle frame, a frame surrounding the periphery of the middle frame, and a mainboard bracket, the first sub-hole passes through the circuit board, the second sub-hole passes through the mainboard bracket and, and the connecting gap is located between the mainboard bracket and the circuit board; The inner side surface of the frame facing the mainboard bracket is concavely provided with a card slot, and the mainboard bracket is provided with a card buckle, the card buckle is adjacent to the second sub-hole, and the card buckle extends along the width direction of the portable electronic device; The circuit board is arranged between the middle frame and the mainboard bracket, and the clip is clamped with the card slot.

5. The portable electronic device according to claim 4, wherein: The mainboard bracket is provided with a connecting hole, the clip and the connecting hole are respectively located on two opposite sides of the second sub-hole, and the hole axis of the connecting hole extends along the thickness direction of the portable electronic device; the connecting hole is connected with a screw to fix the circuit board and the mainboard bracket.

6. The portable electronic device according to claim 5, wherein: The circuit board is provided with a spring sheet, which is adjacent to the first sub-hole. The mainboard bracket includes a body and a retaining wall, the second sub-hole passes through two opposite surfaces of the body, the buckle is located on one side of the body, and the retaining wall is provided on the other side of the body and is spaced opposite to the buckle; A cantilever is provided on the retaining wall, and the connection between the cantilever and the main body is a hollow area. The hollow area and the second sub-hole are spaced apart along the width direction of the portable electronic device. The buckle and the connecting hole are respectively spaced apart from the retaining walls on both sides of the hollow area, and the spring elastically supports between the retaining wall and the circuit board.

7. The portable electronic device according to claim 6, wherein: The body includes a first surface and a second surface arranged opposite to the first surface, the second surface is concavely provided with a groove, the second sub-hole passes through the bottom wall of the groove, the groove is connected to the hollow area and is used to accommodate sealing foam.

8. The portable electronic device according to claim 7, wherein: A recess is provided on the first surface, the second sub-hole passes through the bottom of the recess, the recess and the groove at least partially overlap in the thickness direction of the portable electronic device, and the connecting gap is formed between the bottom of the recess and the surface of the circuit board.

9. The portable electronic device according to claim 6, wherein: The main body includes a rear shell installed on the middle frame, the rear shell includes a shell and a cover covering the shell, the sound receiving end passes through the side edge of the cover, and in the thickness direction of the electronic device, a sound-transmitting gap is formed between the cover and the outer surface of the shell, and the sound-transmitting gap is connected to the sound receiving end.

10. The portable electronic device according to claim 9, wherein: A bracket is provided on the surface of the shell facing away from the outer surface, and the bracket supports the camera module. Along the thickness direction of the electronic device, the third sub-hole passes through the shell and the bracket. One end of the third sub-hole is connected to the second sub-hole, and the other end is connected to the sound-passing gap.

11. A portable electronic device, characterized in that: It includes a middle frame, a frame surrounding the periphery of the middle frame, a circuit board, a mainboard bracket, a noise reduction microphone and a pickup hole; The circuit board comprises a front surface and a back surface, and the back surface is provided with a spring; The sound pickup hole includes a first sub-hole, a connecting gap and a second sub-hole connected in sequence, the first sub-hole passes through the front and back sides and is adjacent to the elastic sheet, and the second sub-hole passes through the mainboard bracket; The mainboard bracket is provided with a buckle and a connecting hole, the buckle and the connecting hole are respectively located on opposite sides of the second sub-hole, the buckle extends along the width direction of the portable electronic device; the hole axis of the connecting hole extends along the thickness direction of the portable electronic device; the inner side surface of the frame facing the mainboard bracket is recessed with a card slot; The noise reduction microphone is mounted on the front of the circuit board and is connected to one end of the first sub-hole. The circuit board is arranged between the middle frame and the mainboard bracket. The connecting gap is formed between the mainboard bracket and the circuit board. The spring elastically supports the circuit board and the mainboard bracket. The buckle is clamped with the card slot. The connecting hole is connected with a screw to fix the circuit board and the mainboard bracket.

12. The portable electronic device according to claim 11, wherein: The mainboard bracket includes a body and a retaining wall, the second sub-hole passes through two opposite surfaces of the body, the buckle is located on one side of the body, and the retaining wall is provided on the other side of the body and is spaced opposite to the buckle; A cantilever is provided on the retaining wall, and the connection between the cantilever and the main body is a hollow area. The hollow area and the second sub-hole are spaced apart along the width direction of the portable electronic device. The buckle and the connecting hole are respectively spaced apart from the retaining walls on both sides of the hollow area, and the spring elastically supports between the retaining wall and the circuit board.

13. The portable electronic device according to claim 12, wherein: The body includes a first surface and a second surface arranged opposite to the first surface, the second surface is concavely provided with a groove, the second sub-hole passes through the bottom wall of the groove, the groove is connected to the hollow area and is used to accommodate sealing foam.

14. The portable electronic device according to claim 13, wherein: A recess is provided on the first surface, the second sub-hole passes through the bottom of the recess, the recess and the groove at least partially overlap in the thickness direction of the portable electronic device, and the connecting gap is formed between the bottom of the recess and the surface of the circuit board.

15. The portable electronic device according to claim 14, wherein: The sound pickup hole includes the sound receiving end and the sound-passing gap. The main body includes a rear shell mounted on the middle frame. The rear shell includes a shell and a cover plate covering the shell. The sound receiving end passes through the side edge of the cover plate. In the thickness direction of the electronic device, the sound-passing gap is formed between the cover plate and the outer surface of the shell. The sound-passing gap is connected to the sound receiving end.

16. The portable electronic device according to claim 15, wherein: The sound pickup hole includes a third sub-hole, and a bracket is provided on the surface of the shell facing away from the outer surface. Along the thickness direction of the electronic device, the third sub-hole passes through the shell and the bracket, and one end of the third sub-hole is connected to the second sub-hole, and the other end is connected to the sound-passing gap.

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