Infrared emission assembly, cover body and cooking utensil

Abstract

The invention discloses an infrared emission assembly, a cover body and a cooking utensil. The infrared emission assembly comprises a supporting frame which is provided with a bearing surface; the infrared emission layer comprises an ore particle layer and an adhesive layer, the ore particle layer is constructed to be formed by arranging a plurality of ore particles, the ore particle layer is adhered to the bearing surface through the adhesive layer, and the ore particles can emit infrared rays; the infrared emission layer is formed by the following processes: applying an adhesive to the bearing surface, arranging an ore particle layer, applying the adhesive to the ore particle layer again, and solidifying. According to the infrared emission assembly, through a secondary bonding process, bonding between the ore particle layer and the bearing surface and bonding between the ore particles are firmer, falling or shaking of the ore particles is avoided, the stability of the assembly structure is guaranteed, and the use experience of a user is improved.

Description

Technical Field

[0001] The present application relates to the technical field of cooking utensils, and in particular to an infrared emitting component, a cover body and a cooking utensil. Background Art

[0002] By setting an infrared emitting component in the cover of the cooking utensil, when the cover covers the inner pot and forms a cooking space between the cover and the inner pot, the infrared emitting component can radiate infrared rays into the cooking space to achieve auxiliary cooking, which can not only cook food with more delicious taste but also reduce energy consumption.

[0003] At present, some infrared modules are made of mineral materials that can radiate infrared rays, and use infrared radiation to assist in cooking food. However, the infrared modules are made of mineral materials, and the mineral particles are small and irregular in shape, which are prone to shaking, causing great inconvenience to the assembly of the infrared modules.

[0004] Therefore, an infrared emitting assembly, a cover and a cooking utensil are needed to at least partially solve the above problems. Summary of the invention

[0005] A series of simplified concepts are introduced in the Summary of the Invention section, which will be further described in detail in the Detailed Description of the Invention section. The Summary of the Invention section of this application does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the scope of protection of the claimed technical solution.

[0006] In order to at least partially solve the above problems, the present application provides an infrared emission component for a cooking appliance, the infrared emission component comprising:

[0007] A support frame, the support frame having a load-bearing surface;

[0008] An infrared emitting layer, the infrared emitting layer includes a mineral particle layer and an adhesive layer, the mineral particle layer is formed by arranging a plurality of mineral particles, the mineral particle layer is bonded to the bearing surface through the adhesive layer, the mineral particles can emit infrared rays, and the infrared emitting layer is formed by the following process: the mineral particle layer is arranged after applying an adhesive to the bearing surface, and the adhesive is applied to the mineral particle layer again and solidified.

[0009] According to the infrared emitting assembly of the present application, the mineral particle layer is bonded to the support frame through a bonding process, and the installation process is simple and the production efficiency is high; and after two bondings, the bonding between the mineral particle layer and the bearing surface and between the mineral particles is more firm, thus preventing the mineral particles from falling off or shaking, ensuring the stability of the assembly structure, and improving the user experience.

[0010] Optionally, the adhesive layer comprises:

[0011] a first adhesive layer, the first adhesive layer is disposed on the bearing surface, the mineral particle layer is disposed on the first adhesive layer, and the first adhesive layer is formed by applying an adhesive for the first time;

[0012] The second adhesive layer is arranged on the ore particle layer, and the second adhesive layer is formed by applying the adhesive for the second time. According to the above arrangement, the process is simple and efficient.

[0013] Optionally, the thickness of the first adhesive layer is 1 / 5 to 2 / 5 of the diameter of the mineral particles in the mineral particle layer. According to the above configuration, a suitable adhesive layer thickness can balance the drying time and the bonding strength.

[0014] Optionally, the thickness of the second adhesive layer is 1 / 10 to 3 / 10 of the diameter of the ore particles in the ore particle layer. According to the above arrangement, the cost is saved and the firmness of the installation is further improved.

[0015] Optionally, the infrared emitting assembly further comprises a first mounting frame, the first mounting frame is provided with a first through hole, the first mounting frame has a mounting platform arranged around the first through hole, the support frame corresponds to the mounting platform, and the infrared emitting layer is arranged corresponding to the first through hole. According to the above arrangement, assembly is facilitated, which is conducive to improving production efficiency.

[0016] Optionally, the infrared emitting assembly further comprises a second mounting frame, the second mounting frame is located on the upper side of the first mounting frame and connected to the first mounting frame, and the support frame is limited between the first mounting frame and the second mounting frame. According to the above arrangement, the support frame can be firmly installed.

[0017] Optionally, the support frame includes a bearing portion, the bearing portion includes the bearing surface, and the periphery of the bearing portion overlaps the mounting platform;

[0018] The end of the mounting platform is provided with a limiting rib extending downward, the infrared emitting layer is provided on the lower surface of the bearing part, and the infrared emitting layer is limited inside the limiting rib. According to the above arrangement, the installation process of the ore particles is facilitated and the production efficiency can be improved.

[0019] Optionally, the support frame includes a bearing portion, the bearing portion includes the bearing surface, the periphery of the bearing portion overlaps the mounting platform, the infrared emitting layer is arranged on the upper surface of the bearing portion, and the support frame is constructed as a light-transmitting support frame. According to the above arrangement, the structure is simple and easy to implement.

[0020] Optionally, the support frame is characterized in that:

[0021] A bearing portion, the bearing portion comprising the bearing surface, the periphery of the bearing portion overlapping the mounting platform;

[0022] A limiting portion is provided on the upper surface of the bearing portion along the circumference of the bearing portion, and the limiting portion abuts against the second mounting frame so that the support frame is fixed between the first mounting frame and the second mounting frame. According to the above arrangement, the structure is simple and the functions are comprehensive, which not only facilitates the installation of the support frame, but also prevents the support frame from displacement after installation, thereby improving product quality.

[0023] Optionally, the infrared emission component further includes a heating component, which is arranged above the infrared emission layer, and the ore particles can be heated to excite infrared rays. According to the above arrangement, infrared rays are excited by the heating component, and the infrared auxiliary heating has good effect and low cost.

[0024] Optionally, the infrared emission component further includes a heating component, the heating component is arranged on the second mounting frame, and the ore particles can be heated to excite infrared rays. According to the above configuration, infrared auxiliary heating has good effect, low cost and convenient installation by using the heating component to excite infrared rays.

[0025] Optionally, the heating component comprises:

[0026] A heat conducting plate, the heat conducting plate is spaced apart from the support frame, the heat conducting plate comprises a main body and a flange arranged at the periphery of the main body, the flange is connected to the second mounting frame to form an accommodation space between the second mounting frame and the heat conducting plate;

[0027] A heating device is arranged in the accommodation space. According to the above arrangement, the heating device is blocked by the heat conducting plate, which can not only conduct heat efficiently, but also improve safety and avoid burns caused by direct contact with the heating device.

[0028] Optionally, the flange of the heat conducting plate has an insertion portion, the second mounting frame is provided with an insertion hole, and the insertion portion is inserted into the insertion hole, thereby assembling the heating device conveniently.

[0029] Optionally, the infrared emitting component is manufactured by the following steps:

[0030] mounting the heating assembly to the second mounting bracket;

[0031] Mounting the support frame to the first mounting frame;

[0032] Assembling the second mounting frame and the first mounting frame to form an assembly;

[0033] Turning the assembly over so that the surface of the carrying portion facing away from the heating element faces upward;

[0034] Injecting a transparent adhesive onto the surface of the bearing portion facing away from the heating assembly to form the first adhesive layer;

[0035] Arranging ore particles on the bearing portion and scraping them flat to form the ore particle layer;

[0036] injecting a transparent adhesive onto the ore particles to form the second adhesive layer;

[0037] Solidify and form the infrared emission component. According to the above configuration, the production process is simplified and the production efficiency is improved.

[0038] Optionally, the support frame and the first mounting frame are constructed as an integral piece. According to the above arrangement, the number of parts can be reduced, the assembly can be further simplified and the cost can be reduced.

[0039] A second aspect of the present application provides a cover for a cooking utensil, the cover comprising:

[0040] an inner liner having a second through opening;

[0041] The infrared emitting component described in the first aspect above is arranged in the lining and at least partially exposed from the second through hole.

[0042] The cover according to the present application can achieve a technical effect similar to that of the infrared emitting component of the first aspect described above.

[0043] Optionally, the cover body further comprises a transmission member, the transmission member is arranged on the inner lining and covers the second through hole, the infrared emission component is arranged above the transmission member, and the transmission member has a transmission area corresponding to the infrared emission layer. According to the above arrangement, the infrared ray can be transmitted and the infrared emission component can be shielded, thereby preventing the user from being burned due to accidental touch, thereby improving safety.

[0044] Optionally, the transmission area is configured as a transparent area; or

[0045] The transmission area is configured as a colored semi-transparent area; or

[0046] The transmission area is configured as a color-changing area, and the color-changing area is configured to form a transparent or translucent color when heated, and to form an opaque color when not heated. According to the above configuration, the sense of design hierarchy can be improved, which is conducive to improving the user experience.

[0047] Optionally, the infrared emission assembly includes a first mounting bracket, the first mounting bracket is fixedly connected to the inner lining, and the first mounting bracket has a torsion spring positioning portion, and the torsion spring positioning portion is used to limit the torsion spring of the cover opening of the cooking utensil. According to the above configuration, the torsion spring positioning portion is integrated into the first mounting bracket, which improves the integration of various functions in the cover body, improves the space utilization, and is conducive to improving assembly efficiency.

[0048] Optionally, the infrared emission assembly further comprises a second mounting bracket, the second mounting bracket is located on the upper side of the first mounting bracket and connected to the first mounting bracket, the second mounting bracket has an additional positioning portion, the position of the additional positioning portion corresponds to the torsion spring positioning portion of the first mounting bracket, the additional positioning portion and the torsion spring positioning portion are used to cooperate and limit the cover opening torsion spring of the cooking utensil. According to the above arrangement, the limiting effect of the cover opening torsion spring is enhanced.

[0049] A third aspect of the present application provides a cooking appliance, comprising:

[0050] The infrared emitting component described in the first aspect above; or

[0051] The cover body described in the second aspect above.

[0052] According to the cooking utensil of the present application, the mineral particle layer is firmly bonded to the bearing surface and between the mineral particles, and during the opening and closing process of the lid, the mineral particles are prevented from falling off or shaking and producing abnormal noises, thereby enhancing the safety performance of the product and improving the competitiveness of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] The following drawings of the present application are used as a part of the present application for understanding the present application. The drawings show the embodiments of the present application and their descriptions, which are used to explain the principle of the present application.

[0054] In the attached figure:

[0055] Figure 1 It is an exploded schematic diagram of a cover body according to a preferred embodiment of the present application;

[0056] Figure 2 is a cross-sectional schematic diagram of a cover body according to a preferred embodiment of the present application;

[0057] Figure 3 is a schematic diagram of the installation of the assembly according to the present application;

[0058] Figure 4 is a schematic diagram of forming a first adhesive layer according to the present application;

[0059] Figure 5 A schematic diagram of the formation of an ore particle layer according to the present application;

[0060] Figure 6 Schematic diagram of forming the second adhesive layer according to the present application.

[0061] Description of reference numerals:

[0062] 100: cover 101: cover 102: lining

[0063] 103: removable cover 104: transmissive member 105: second through opening

[0064] 106: Transmission area 110: First mounting frame 111: First through opening

[0065] 112: Mounting platform 113: Mounting wall 114: Limiting rib

[0066] 120: second mounting frame 121: insertion hole 130: heating component

[0067] 131: Heat conducting plate 132: Heating device 133: Flanging

[0068] 134: Insertion part 140: Support frame 141: Load-bearing part

[0069] 142: limiter 160: infrared emission layer 161: ore particle layer

[0070] 162: first adhesive layer 163: second adhesive layer 115: torsion spring positioning portion

[0071] 122: Additional positioning unit DETAILED DESCRIPTION

[0072] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present application. However, it is apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described.

[0073] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should also be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of the features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0074] Ordinal numbers such as "first" and "second" cited in this application are merely identifiers and do not have any other meaning, such as a specific order. Moreover, for example, the term "first component" itself does not imply the existence of a "second component", and the term "second component" itself does not imply the existence of a "first component". It should be noted that the terms "upper", "lower", "front", "back", "left", "right", "inner", "outer" and similar expressions used in this document are for illustrative purposes only and are not limiting.

[0075] For example, "upper" and "lower" in this application refer to the cooking utensil in use, or when the cooking utensil is placed on the table with the lid closed. "Inside" and "outside" in this application refer to the central position of the cooking space.

[0076] Now, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings.

[0077] The cooking utensil of the present application generally comprises a pot body and a cover body 100. The pot body is basically in the shape of a rounded rectangular parallelepiped, and has a middle plate and an outer shell connected to the lower side of the middle plate, and the two can be integrally injection molded. And the middle part of the middle plate has a cylindrical inner pot accommodating cavity, and the inner pot can be freely placed in the inner pot accommodating cavity or taken out from the inner pot accommodating cavity to facilitate the cleaning of the inner pot. The inner pot is generally made of metal material and has a circular opening on the upper surface, which is used to hold materials to be heated, such as rice, soup, etc.

[0078] The cover 100 has a shape substantially corresponding to that of the pot body. The cover 100 is arranged on the pot body in an openable and closable manner. Specifically, the cover 100 is pivotally connected to the pot body via a pivot shaft and can freely pivot between a closed position and an open position relative to the pot body around a pivot axis where the pivot shaft is located, so as to facilitate closing and opening of the pot body. When the cover 100 is closed on the pot body, it covers the inner pot and forms a cooking space between the cover 100 and the inner pot.

[0079] The cooking appliance also has a lid opening torsion spring connected between the pot body and the lid body 100 to provide power for opening the lid body 100. Specifically, the lid opening torsion spring may have a first torsion spring arm and a second torsion spring arm, wherein the first torsion spring arm is connected to the lid body 100 and the second torsion spring arm is connected to the pot body.

[0080] The cooking appliance includes a control device and a heating module. The control device is used to achieve the purpose of cooking control of the cooking appliance, and the control device may be an MCU (Micro Control Unit). The heating module is used to heat the inner pot, and the heating module may be a coil disk. The control device is electrically connected to the heating module to achieve control of the heating process.

[0081] For the specific structure of the cover 100, please refer to Figure 1and Figure 2 , which includes a surface cover 101, an inner lining 102, an infrared emitting assembly and a removable cover 103. The inner lining 102 is arranged below the surface cover 101 and connected to the surface cover 101. The infrared emitting assembly can emit infrared rays to assist in cooking the food in the cooking space. The inner lining 102 has a second through hole 105, and the infrared emitting assembly is arranged on the inner lining 102 and corresponds to the second through hole 105, so that the infrared emitting assembly is above the inner pot. When the cover body 100 is covered on the pot body, the infrared rays radiated by the infrared emitting assembly pass through the second through hole 105 to assist in heating the cooking space. The removable cover 103 is arranged below the inner lining 102 and connected to the inner lining 102.

[0082] For the specific structure of the infrared emission component, please refer to Figures 1 to 6 The infrared emission assembly includes a support frame 140 and an infrared emission layer 160. The support frame 140 has a bearing surface. The infrared emission layer 160 includes an ore particle layer 161 and an adhesive layer. The ore particle layer 161 is formed by arranging a plurality of ore particles. The ore particle layer 161 is bonded to the bearing surface through the adhesive layer. The ore particles can emit infrared rays. For example, the ore particles can be tourmaline. The infrared emission layer 160 is formed by the following process: the ore particle layer 161 is set after applying an adhesive to the bearing surface, and the adhesive is applied to the ore particle layer 161 again and solidified.

[0083] According to the infrared emitting assembly of the present application, the mineral particle layer is bonded to the support frame through a bonding process, and the installation process is simple and the production efficiency is high; and after two bondings, the bonding between the mineral particle layer 161 and the bearing surface and between the mineral particles is more firmly established, thus preventing the mineral particles from falling off or shaking, ensuring the stability of the assembly structure, and improving the user experience.

[0084] For the specific structure of the adhesive layer, please refer to Figure 2 and Figure 6 The adhesive layer includes a first adhesive layer 162 and a second adhesive layer 163. The first adhesive layer 162 is disposed on the bearing surface, and the ore particle layer 161 is disposed on the first adhesive layer 162. The first adhesive layer 162 is formed by applying the adhesive for the first time. The second adhesive layer 163 is disposed on the ore particle layer 161. The second adhesive layer 163 is formed by applying the adhesive for the second time. The ore particle layer 161 is fixedly connected to the bearing surface by the first adhesive layer 162 to prevent the ore particles from separating from the support frame 140. The ore particles are then bonded and fixedly connected by the second adhesive layer 163 to prevent the ore particles from rubbing or colliding with each other to generate abnormal noise.

[0085] As an optional embodiment, the thickness of the first adhesive layer 162 is 1 / 5 to 2 / 5 of the diameter of the ore particles in the ore particle layer 161, ensuring a firm bond between the ore particle layer 161 and the bearing surface. If the first adhesive layer 162 is too thin, the ore particle layer 161 is likely to fall off the bearing surface; if the first adhesive layer 162 is too thick, the adhesive is likely to overflow from the gap between the ore particle layer 161 and the bearing surface, resulting in a waste of adhesive.

[0086] As an optional implementation, the thickness of the second adhesive layer 163 is 1 / 10 to 3 / 10 of the diameter of the ore particles in the ore particle layer 161, to ensure that the ore particles are firmly bonded to each other. If the second adhesive layer 163 is too thin, the ore particles are prone to shaking; if the second adhesive layer 163 is too thick, the adhesive is prone to overflow from the gaps between the ore particles, resulting in a waste of adhesive.

[0087] like Figure 1 , Figure 2 and Figure 6 As shown, the infrared emission assembly also includes a first mounting frame 110, the first mounting frame 110 is provided with a first through hole 111, the first mounting frame 110 has a mounting platform 112 arranged around the first through hole 111, the support frame 140 is arranged on the mounting platform 112, and the infrared emission layer 160 is arranged corresponding to the first through hole 111, wherein the support frame 140 is connected to the mounting platform 112 to enhance the firmness of the assembly structure, and the infrared emission layer 160 is arranged corresponding to the first through hole 111, and the infrared emission layer 160 can radiate infrared rays to the cooking space through the first through hole 111, thereby heating the cooking space. In the embodiment shown in the figure, the outer periphery of the mounting platform 112 is provided with an upwardly extending mounting wall 113, and the outer periphery of the support frame 140 is limited in the mounting wall 113, and preferably can abut against the mounting wall 113. In other words, the inner part of the first mounting frame 110 located on the mounting wall 113 forms the above-mentioned mounting platform 112.

[0088] As an optional embodiment, the first mounting frame 110 is further provided with a torsion spring positioning portion 115 , which is used to limit the cover opening torsion spring of the cooking utensil. For example, the first torsion spring arm of the cover opening torsion spring can be limited at the torsion spring positioning portion 115 .

[0089] As another optional embodiment, the first mounting frame 110 and the support frame 140 can be integrated together. In other words, the support frame 140 and the first mounting frame 110 can be constructed as an integral piece. In this way, the number of parts can be reduced, the assembly can be further simplified, and the cost can be reduced.

[0090] like Figure 1 , Figure 2 and Figure 6As shown, the infrared emitting assembly also includes a second mounting frame 120, which is located on the upper side of the first mounting frame 110 and connected to the first mounting frame 110, and the support frame 140 is limited between the first mounting frame 110 and the second mounting frame 120, so as to further enhance the firmness of the assembly structure and prevent the support frame 140 from shaking.

[0091] The first mounting frame 110, the second mounting frame 120, the support frame 140, and the infrared emitting layer 160 can form an assembly together. In other words, after the infrared emitting component is formed into an assembly as a whole, it is then installed on the lining 102, which greatly improves the assembly efficiency.

[0092] As an optional embodiment, the second mounting frame 120 may be provided with an additional positioning portion 122, the position of which corresponds to the torsion spring positioning portion 115 of the first mounting frame 110, so that the additional positioning portion 122 and the torsion spring positioning portion 115 form a matching relationship to jointly limit the cover opening torsion spring. For example, the first torsion spring arm of the cover opening torsion spring may be limited between the torsion spring positioning portion 115 and the additional positioning portion 122.

[0093] The specific structure of the support frame 140 is shown in FIG. Figures 2 to 6 As shown, the support frame 140 includes a bearing portion 141 and a limiting portion 142. The bearing portion 141 includes a bearing surface, and the periphery of the bearing portion 141 overlaps the mounting platform 112. The limiting portion 142 is arranged on the upper surface of the bearing portion 141 along the circumference of the bearing portion 141, and the limiting portion 142 abuts against the second mounting frame 120, so that the support frame 140 is fixed between the first mounting frame 110 and the second mounting frame 120.

[0094] like Figure 2 As shown, the end of the mounting platform 112 is provided with a limiting rib 114 extending in a direction away from the second mounting frame 120, and the infrared emitting layer 160 is provided on the surface of the bearing portion 141 facing away from the second mounting frame 120, that is, the infrared emitting layer 160 is provided on the lower surface of the bearing portion 141. The surface of the bearing portion 141 facing away from the second mounting frame 120, or the lower surface, is configured as the above-mentioned bearing surface. The infrared emitting layer 160 is limited to the inner side of the limiting rib 114. As a result, it can provide convenience during assembly, for example, preventing the mineral particles from jumping out, spilling or scattering when laying.

[0095] As an optional embodiment not shown, the infrared emitting layer 160 is arranged on the surface of the bearing part 141 facing the second mounting frame 120, that is, the infrared emitting layer 160 is arranged on the upper surface of the bearing part 141. In other words, the surface (upper surface) of the bearing part 141 facing the second mounting frame 120 is constructed as the above-mentioned bearing surface. At this time, in order to enable the infrared rays to be emitted smoothly, the support frame 140 needs to be constructed as a light-transmitting support frame 140 to ensure that the infrared rays emitted by the ore particle layer 161 can pass through the first mounting frame 110 to heat the cooking space, reduce the energy loss in the process of infrared ray propagation, and ensure the radiation efficiency of the ore particle layer 161.

[0096] like Figures 1 to 6 As shown, the infrared emission component also includes a heating component 130, which is arranged above the infrared emission layer 160. The mineral particles can be heated to excite infrared rays. The mineral particle layer 161 is heated by the heating component 130, which is conducive to stimulating the mineral particle layer 161 to emit infrared rays, thereby effectively improving the auxiliary cooking effect of the infrared emission component. Preferably, the heating component 130 is arranged on the second mounting frame 120. The second mounting frame 120 is arranged above the heating component 130, and can also play a blocking role to prevent the heat generated by the heating component 130 from damaging other components. In other words, the second mounting frame 120 can also play the role of a heat shield.

[0097] For the specific structure of the heating assembly 130, please refer to Figures 1 to 6 The heating assembly 130 includes a heat conducting plate 131 and a heating device 132. The heat conducting plate 131 is spaced apart from the support frame 140. The heat conducting plate 131 includes a main body and a flange 133 arranged on the periphery of the main body. The flange 133 is connected to the second mounting frame 120 to form a receiving space 135 between the second mounting frame 120 and the heat conducting plate 131. The heating device 132 is arranged in the receiving space 135. The heat generated by the heating device 132 is transferred to the ore particle layer 161 through the heat conducting plate 131, which is conducive to controlling the heat conduction rate. And the heat conducting plate 131 is used to shield the heating device 132, which can not only efficiently transfer heat, but also prevent the occurrence of burns caused by the direct exposure of the heating device 132.

[0098] like Figures 1 to 3 As shown, the flange 133 of the heat conducting plate 131 has an insertion portion 134, the second mounting frame 120 is provided with an insertion hole 121, the insertion portion 134 is inserted into the insertion hole 121, and the heating device 132 is limited between the heat conducting plate 131 and the second mounting frame 120, so that the connection between the heating device 132 and the heat conducting plate 131 is more firmly.

[0099] Preferably, the infrared emission component also includes a temperature sensor, and the heating device 132 and the temperature sensor are both coupled to the control device, so that the control device can control the operation of the heating device 132 based on the temperature of the mineral particle layer 161, so that the mineral particle layer 161 is maintained in a suitable temperature range to radiate infrared rays that are beneficial to stimulating the flavor substances of the food, such as infrared rays with a wavelength of 2-16μm, and at the same time, prevent the heating temperature from being too high and causing heat aging of the parts of the cooking utensil.

[0100] The power of the heating device 132 is 5W to 500W, preferably 25W, which not only ensures that the mineral particle layer 161 is heated and efficiently stimulates infrared rays to irradiate food, but also reduces the risk of heat aging of the cooking utensils' parts.

[0101] Preferably, the heating device 132 is a heating wire, such as a spiral heating wire, which has the advantages of low cost, large specific surface area, and simple installation. It can fit tightly with the upper surface of the heat conducting plate 131, which is conducive to quickly transferring heat to the surface of the ore particle layer 161.

[0102] like Figures 3 to 6 As shown, the infrared emission component is made by the following steps:

[0103] Step S1: installing the heating assembly 130 to the second mounting frame 120;

[0104] Step S2: installing the support frame 140 to the first mounting frame 110;

[0105] Step S3: Assemble the second mounting frame 120 and the first mounting frame 110 to form an assembly;

[0106] Step S4: turning the assembly over so that the surface of the carrying portion 141 facing away from the heating element 130 faces upward;

[0107] Step S5: injecting a transparent adhesive onto the surface of the carrier 141 facing away from the heating assembly 130 to form a first adhesive layer 162;

[0108] Step S6: arranging ore particles on the carrying portion 141 and scraping them flat to form an ore particle layer 161;

[0109] Step S7: injecting a transparent adhesive onto the ore particles to form a second adhesive layer 163;

[0110] Step S8: solidify and form an infrared emitting component.

[0111] Through the secondary bonding process, the bonding between the ore particle layer 161 and the bearing surface and between the ore particles is made stronger, preventing the ore particles from falling off or shaking. At the same time, the support frame 140 is limited between the first mounting frame 110 and the second mounting frame 120, further improving the stability of the assembly structure.

[0112] like Figure 1 and Figure 2 As shown, the cover body 100 also includes a transmissive member 104, which is arranged on the lining 102 and covers the second through hole 105. The infrared emitting component is arranged above the transmissive member 104. The transmissive member 104 has a transmissive area 106 corresponding to the infrared emitting layer 160, so that the infrared rays emitted by the mineral particle layer 161 can pass through the transmissive area 106 to heat the cooking space, reduce the energy loss during the propagation of the light beam, and improve the radiation efficiency of the mineral particle layer 161.

[0113] Exemplarily, the transmission area 106 is configured as a transparent area so that the infrared rays emitted by the mineral particle layer 161 can pass through the transmission area 106. Alternatively, the transmission area 106 is configured as a translucent area with color to enhance the display effect and improve the aesthetics of the cooking utensil. Alternatively, the transmission area 106 is configured as a color-changing area, and the color-changing area is configured to form a transparent or translucent color when heated, and an opaque color when not heated, so that the transmission area 106 has a variety of display effects, thereby bringing a sense of freshness to the user and further improving the user's favorability.

[0114] According to the cooking utensil of the present application, the mineral particle layer 161 is firmly bonded to the bearing surface and between the mineral particles, and during the opening and closing process of the cover 100, the mineral particles are prevented from falling off or shaking and producing abnormal noises, thereby enhancing the safety performance of the product and improving the competitiveness of the product.

[0115] The processes and steps in all the above preferred embodiments are only examples. Unless adverse effects occur, various processing operations can be performed in a sequence different from the sequence of the above processes. The sequence of steps in the above processes can also be increased, merged or deleted according to actual needs.

[0116] Unless otherwise defined, the technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the present application. The terms used herein are only for describing specific implementation purposes and are not intended to limit the present application. The features described herein in one embodiment may be applied to another embodiment individually or in combination with other features, unless the feature is not applicable or otherwise specified in the other embodiment.

[0117] The present application has been illustrated through the above-mentioned embodiments, but it should be understood that the above-mentioned embodiments are only for the purpose of example and explanation, and the present application is not limited to the above-mentioned embodiments. According to the teachings of the present application, more variations and modifications can be made, and these variations and modifications all fall within the scope of protection claimed by the present application.

Claims

1. An infrared emitting component for a cooking utensil, characterized in that: The infrared emission component comprises: A support frame (140), wherein the support frame (140) has a bearing surface; An infrared emitting layer (160), the infrared emitting layer (160) comprising a mineral particle layer (161) and an adhesive layer, the mineral particle layer (161) being formed by arranging a plurality of mineral particles, the mineral particle layer (161) being bonded to the bearing surface via the adhesive layer, the mineral particles being capable of emitting infrared rays, and the infrared emitting layer (160) being formed by the following process: the mineral particle layer (161) is provided after applying an adhesive to the bearing surface, and the adhesive is applied again to the mineral particle layer (161) and solidified.

2. The infrared emitting assembly according to claim 1, characterized in that: The adhesive layer comprises: a first adhesive layer (162), the first adhesive layer (162) being arranged on the bearing surface, the mineral particle layer (161) being arranged on the first adhesive layer (162), the first adhesive layer (162) being formed by applying an adhesive for the first time; A second adhesive layer (163), wherein the second adhesive layer (163) is disposed on the mineral particle layer (161), and the second adhesive layer (163) is formed by applying the adhesive for the second time.

3. The infrared emitting assembly according to claim 2, characterized in that: The thickness of the first adhesive layer (162) is 1 / 5 to 2 / 5 of the diameter of the ore particles in the ore particle layer (161).

4. The infrared emitting assembly according to claim 2, characterized in that: The thickness of the second adhesive layer (163) is 1 / 10 to 3 / 10 of the diameter of the ore particles in the ore particle layer (161).

5. The infrared emitting assembly according to claim 1, characterized in that: The infrared emitting component further comprises a first mounting frame (110), the first mounting frame (110) being provided with a first through-hole (111), the first mounting frame (110) having a mounting platform (112) arranged around the first through-hole (111), the supporting frame (140) corresponding to the position of the mounting platform (112), and the infrared emitting layer (160) being arranged corresponding to the first through-hole (111).

6. The infrared emitting assembly according to claim 5, characterized in that: The infrared emitting assembly further comprises a second mounting frame (120), wherein the second mounting frame (120) is located on the upper side of the first mounting frame (110) and is connected to the first mounting frame (110), and the supporting frame (140) is limited between the first mounting frame (110) and the second mounting frame (120).

7. The infrared emitting assembly according to claim 5, characterized in that: The support frame (140) comprises a bearing portion (141), the bearing portion (141) comprises the bearing surface, and the periphery of the bearing portion (141) is overlapped with the mounting platform (112); A limiting rib (114) extending downward is provided at the end of the mounting platform (112); the infrared emitting layer (160) is provided on the lower surface of the bearing portion (141), and the infrared emitting layer (160) is limited to the inner side of the limiting rib (114).

8. The infrared emitting assembly according to claim 5, characterized in that: The support frame (140) comprises a bearing portion (141), the bearing portion (141) comprises the bearing surface, the periphery of the bearing portion (141) is overlapped with the mounting platform (112), the infrared emitting layer (160) is arranged on the upper surface of the bearing portion (141), and the support frame (140) is constructed as a light-transmitting support frame (140).

9. The infrared emitting assembly according to claim 6, characterized in that The support frame (140) comprises: A bearing portion (141), the bearing portion (141) comprising the bearing surface, and a periphery of the bearing portion (141) overlaps the mounting platform (112); A limiting portion (142), wherein the limiting portion (142) is arranged on the upper surface of the bearing portion (141) along the circumferential direction of the bearing portion (141), and the limiting portion (142) abuts against the second mounting frame (120) so that the support frame (140) is fixed between the first mounting frame (110) and the second mounting frame (120).

10. The infrared emitting assembly according to claim 1, characterized in that: The infrared emission component further comprises a heating component (130), wherein the heating component (130) is arranged above the infrared emission layer (160), and the ore particles can be heated to excite infrared rays.

11. The infrared emitting assembly according to claim 6, characterized in that: The infrared emitting component further comprises a heating component (130), wherein the heating component (130) is arranged on the second mounting frame (120), and the ore particles can be heated to generate infrared rays.

12. The infrared emitting assembly according to claim 11, characterized in that: The heating assembly (130) comprises: a heat conducting plate (131), the heat conducting plate (131) being spaced apart from the support frame (140), the heat conducting plate (131) comprising a main body and a flange (133) arranged at the periphery of the main body, the flange (133) being connected to the second mounting frame (120) to form a receiving space (135) between the second mounting frame (120) and the heat conducting plate (131); A heating device (132), wherein the heating device (132) is arranged in the accommodating space (135).

13. The infrared emitting assembly according to claim 12, characterized in that: The flange (133) of the heat conducting plate (131) has an insertion portion (134), the second mounting frame (120) is provided with an insertion hole (121), and the insertion portion (134) is inserted into the insertion hole (121).

14. The infrared emitting assembly according to claim 5, characterized in that: The support frame and the first mounting frame are constructed as an integral piece.

15. The infrared emitting assembly according to claim 11, characterized in that: The infrared emission assembly is manufactured by the following steps: Mounting the heating assembly (130) to the second mounting frame (120); Installing the support frame (140) to the first mounting frame (110); Assembling the second mounting frame (120) and the first mounting frame (110) to form an assembly; Turning the assembly over so that the surface of the carrying portion (141) facing away from the heating component (130) faces upward; Injecting a transparent adhesive onto the surface of the bearing portion (141) facing away from the heating component (130) to form the first adhesive layer (162); Arranging ore particles on the bearing portion (141) and scraping them flat to form the ore particle layer (161); injecting a transparent adhesive onto the ore particles to form the second adhesive layer (163); Solidify and form the infrared emitting component.

16. A cover for a cooking utensil, characterized in that: The cover body comprises: An inner liner (102), the inner liner having a second through opening (105); According to any one of claims 1 to 15, the infrared emitting component is arranged in the lining (102) and is at least partially exposed from the second through-hole (105).

17. The cover according to claim 16, characterized in that: The cover body (100) further comprises a transmissive member (104), wherein the transmissive member (104) is arranged on the lining (102) and covers the second through-hole (105), the infrared emitting component is arranged above the transmissive member (104), and the transmissive member (104) has a transmissive area (106) corresponding to the infrared emitting layer (160).

18. The cover according to claim 17, characterized in that: The transmission area (106) is configured as a transparent area; or The transmission area (106) is configured as a colored semi-transparent area; or The transmission area (106) is configured as a color-changeable area, and the color-changeable area is configured so that when heated, the color-changeable area forms a transparent color or a semi-transparent color, and when not heated, the color-changeable area forms an opaque color.

19. The cover according to claim 16, characterized in that: The infrared emission assembly comprises a first mounting frame (110), the first mounting frame is fixedly connected to the lining, the first mounting frame has a torsion spring positioning portion (115), and the torsion spring positioning portion (115) is used to limit the torsion spring of the cooking utensil for opening the cover.

20. The cover according to claim 19, characterized in that: The infrared emitting assembly further comprises a second mounting frame (120), wherein the second mounting frame (120) is located on the upper side of the first mounting frame (110) and is connected to the first mounting frame (110), and the second mounting frame has an additional positioning portion (122), the position of the additional positioning portion corresponds to the torsion spring positioning portion (115) of the first mounting frame (110), and the additional positioning portion (122) and the torsion spring positioning portion (115) are used to cooperate and limit the torsion spring of the cooking utensil for opening the cover.

21. A cooking utensil, characterized in that: include: The infrared emitting assembly according to any one of claims 1 to 15; or A cover (100) according to any one of claims 16 to 19.

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