Cover body and cooking utensil

Abstract

The invention discloses a cover body and a cooking utensil. The cover body comprises a lining, an infrared emission device and an infrared enhancement device. The infrared emitting device is arranged on the lining and can emit infrared rays when powered on. The infrared enhancement devices are arranged in the lining, the infrared enhancement devices are arranged at intervals relative to the infrared emission device in the thickness direction of the cover body, and the infrared enhancement devices are configured to be capable of emitting infrared rays when being heated. And infrared rays emitted by the infrared emitting device can be emitted through the penetrating opening. According to the cover body, the infrared emitting device is used for emitting infrared rays to assist cooking, meanwhile, the infrared rays can heat the infrared enhancing device, the infrared enhancing device is heated to excite the infrared rays, the dual infrared radiation further improves the auxiliary cooking effect, and cooked food is more delicious.

Description

Technical Field

[0001] The present application relates to the technical field of cooking utensils, and in particular to a cover body and a cooking utensil. Background Art

[0002] At present, in order to improve the cooking effect of food, some cooking utensils add infrared radiators on the top, thereby improving the cooking effect of food through infrared radiation.

[0003] However, the radiation intensity of a single infrared radiator is currently insufficient and the improvement in cooking effects is not ideal.

[0004] Therefore, a cover and a cooking utensil are needed to at least partially solve the above problems. Summary of the invention

[0005] A series of simplified concepts are introduced in the Summary of the Invention section, which will be further described in detail in the Detailed Description of the Invention section. The Summary of the Invention section of this application does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the scope of protection of the claimed technical solution.

[0006] In order to at least partially solve the above problems, the first aspect of the present application provides a cover body for a cooking utensil, the cover body comprising:

[0007] Lining;

[0008] an infrared emitting device, the infrared emitting device being disposed on the inner lining and being configured to emit infrared rays when powered on;

[0009] An infrared enhancement device is arranged on the lining, and the infrared enhancement device is spaced apart from the infrared emitting device along the thickness direction of the cover body, and the infrared enhancement device is configured to emit infrared rays when heated.

[0010] According to the cover body of the present application, the infrared emitting device is used to emit infrared rays to assist cooking. At the same time, the infrared rays can also heat the infrared enhancing device, so that the infrared enhancing device is heated and also stimulates infrared rays. The double infrared radiation further enhances the effect of assisting cooking, making the cooked food more delicious.

[0011] Optionally, the infrared enhancement device is at least partially located below the infrared emitting device, and the infrared enhancement device is provided with a penetration hole, the penetration hole is used to penetrate the infrared emitting device, wherein the infrared rays emitted by the infrared emitting device can be emitted through the penetration hole, and the infrared emitting device can heat the infrared enhancement device so that the infrared enhancement device emits infrared rays. According to the above configuration, the infrared enhancement device is arranged below the infrared emitting device, so that the infrared rays emitted by the infrared emitting device can excite the infrared enhancement device when they are emitted to the cooking space, thereby improving the utilization rate of infrared rays, which is beneficial to energy saving and cooking effect.

[0012] Optionally, the cover body further comprises a detachable cover, the detachable cover is detachably arranged on the lining, and the infrared enhancement device is arranged on the detachable cover. According to the above arrangement, the infrared enhancement device is installed using the detachable cover, so that the structure is simplified, the cover body space is saved, and the cost advantage is achieved.

[0013] Optionally, the cover body further comprises a transmission member, the transmission member is located between the infrared enhancement device and the infrared emission device, and the position of the transmission member corresponds to the penetration opening to shield the penetration opening. According to the above arrangement, the penetration opening is shielded by the transmission member, and the infrared emission device is directly exposed, thereby improving safety.

[0014] Optionally, the cover body further comprises a heat-conducting baffle, and the heat-conducting baffle is located between the infrared enhancement device and the infrared emission device. According to the above configuration, the heat-conducting baffle is used to transfer heat to the infrared enhancement device, which has high energy utilization and enables the infrared enhancement device to fully excite infrared rays, and can also block the infrared emission device to prevent it from being directly exposed.

[0015] Optionally, the cover body further comprises a first mounting frame, the first mounting frame is arranged on the inner lining and located above the infrared enhancement device, the first mounting frame has a first through hole, the first through hole corresponds to the penetration hole, and the transmission member is arranged on the first mounting frame and located at the first through hole. According to the above arrangement, installation is convenient and assembly efficiency is high.

[0016] Optionally, the cover body further comprises a first mounting frame, the first mounting frame is arranged on the inner lining and located above the infrared enhancement device, the first mounting frame has a second through hole, the position of the second through hole corresponds to the main body of the infrared enhancement device, and the first mounting frame of the heat conductive baffle is located at the second through hole. According to the above arrangement, installation is convenient and assembly efficiency is high.

[0017] Optionally, the distance between the heat-conducting baffle and the infrared enhancement device is greater than or equal to 0.1 mm and less than or equal to 5 mm. According to the above configuration, there will be no poor heating effect due to a too large distance, and no assembly interference due to a too close distance.

[0018] Optionally, the distance between the heat-conducting baffle and the infrared enhancement device is greater than or equal to 0.3 mm and less than or equal to 0.7 mm. According to the above arrangement, a better heat-conducting effect can be obtained while facilitating smooth assembly.

[0019] Optionally, the infrared enhancement device includes an infrared radiation plate, the infrared radiation plate is made of infrared radiation material, the infrared radiation plate has a sealing boss arranged around the penetration opening and protruding upward, the sealing boss at least partially extends into the first through-opening, and the cover body also includes a first sealing member, the first sealing member is arranged between the transmission member and the first mounting frame and between the transmission member and the sealing boss. According to the above arrangement, it does not affect the infrared rays emitted by the infrared emitting device to irradiate the food, and can also make full use of the space so that the infrared enhancement device receives heat over a larger area, and a larger area of ​​secondary infrared rays is excited, which effectively improves the cooking effect of the food.

[0020] Optionally, the first sealing member comprises:

[0021] A first bending portion, wherein the first bending portion is sleeved on the periphery of the transmissive member;

[0022] The second bending portion is connected to the first bending portion and is clamped between the transmission member and the sealing boss. According to the above arrangement, the sealing performance between the transmission member and the sealing boss is further improved.

[0023] Optionally, the infrared enhancement device includes an infrared radiation plate, the infrared radiation plate is made of infrared radiation material, the infrared radiation plate is provided with at least one steam through hole, a water retaining rib is provided around the at least one steam through hole to form a steam passing area, the water retaining rib protrudes upward, the liner is provided with a steam channel and a second sealing member, the steam passing area corresponds to the steam channel, and the second sealing member is used to seal the steam channel and the steam passing area. According to the above arrangement, it is conducive to the discharge of steam in the cooking space and it is not easy to accumulate condensed water.

[0024] Optionally, the radial dimension of the water retaining rib is smaller than the maximum radial dimension of the second sealing member; and / or

[0025] The height of the water retaining rib is greater than or equal to 0.1 mm and less than or equal to 5 mm. According to the above arrangement, the possibility of condensation water accumulation is further reduced.

[0026] Optionally, the height of the water retaining rib is greater than or equal to 1.7 mm and less than or equal to 2.3 mm. According to the above configuration, condensed water on the upper surface of the infrared radiation plate can be prevented from flowing back into the cooking space, thereby avoiding the phenomenon of white dripping on food.

[0027] Optionally, the infrared radiation plate is constructed as a carbon plate. According to the above configuration, the cost is low and the efficiency of exciting infrared rays is high, and the contact property is food-grade.

[0028] Optionally, the cover body further includes a second mounting frame, the second mounting frame is arranged on the inner lining and is located above the first mounting frame, the infrared emitting device includes a reflective cover and an infrared emitter, the reflective cover is arranged on the lower side of the second mounting frame, the infrared emitter is arranged on the reflective cover, and the shape of the reflective cover is adapted to the shape of the infrared emitter. According to the above arrangement, the mounting structure is simple and has high space utilization, and the loss of infrared rays is small, and the second mounting frame can block heat and reduce the possibility of damage to other components in the cover body.

[0029] Optionally, the infrared emitting device comprises an infrared emitter;

[0030] The infrared emitter is configured in a curved shape, and the second through-hole is configured in a curved shape adapted to the infrared emitter; or

[0031] The infrared emitter is configured as a straight line, the second through hole is configured as a straight line shape adapted to the infrared emitter, two second through holes are provided, and the two second through holes are provided at intervals. According to the above configuration, the design has high freedom and good adaptability, which is conducive to reducing production costs.

[0032] Optionally, the cover body further includes a second mounting frame, the second mounting frame is arranged on the inner lining and is located above the first mounting frame, the first mounting frame is fixedly connected to the second mounting frame, the second mounting frame has a compression rib protruding toward the first mounting frame, the compression rib abuts against the transmission member, and the first mounting frame, the second mounting frame, the infrared emitting device and the transmission member together form an assembly. According to the above arrangement, the first mounting frame, the second mounting frame, the infrared emitting device, the heat-conducting baffle and the transmission member are combined into an assembly before the next step of assembly is performed, which greatly simplifies the assembly steps and improves production efficiency.

[0033] Optionally, the second mounting frame is provided with a torsion spring positioning portion, and the torsion spring positioning portion is used to limit the torsion spring of the cover opening of the cooking utensil. According to the above configuration, the torsion spring positioning portion is integrated into the second mounting frame, which improves the integration of various functions in the cover body, improves the space utilization, and is conducive to improving assembly efficiency.

[0034] A second aspect of the present application provides a cooking utensil, comprising the cover body described in the first aspect.

[0035] The cooking utensil according to the present application has the technical effect similar to that of the cover body of the first aspect described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The following drawings of the present application are used as a part of the present application for understanding the present application. The drawings show the embodiments of the present application and their descriptions, which are used to explain the principle of the present application.

[0037] In the attached figure:

[0038] Figure 1 is an exploded schematic diagram of a cover body according to an embodiment of the present application;

[0039] Figure 2 is a schematic diagram of a cover body according to an embodiment of the present application when viewed from bottom;

[0040] Figure 3 is a cross-sectional schematic diagram of an assembled state of a cover body according to an embodiment of the present application;

[0041] Figure 4 for Figure 3 A magnified schematic diagram of part A;

[0042] Figure 5 for Figure 1 An exploded schematic diagram of the first mounting frame of the middle cover body and related structures;

[0043] Figure 6 is a schematic diagram of a detachable cover of a cover body according to an embodiment of the present application;

[0044] Figure 7 for Figure 6 A magnified schematic diagram of part C;

[0045] Figure 8 is a schematic diagram of an infrared radiation plate of a cover according to an embodiment of the present application;

[0046] Fig. 9 for Figure 8 Schematic diagram of the cross section of the mid-infrared radiation panel;

[0047] Fig.10 for Figure 3 A magnified schematic diagram of part B;

[0048] Fig.11 is an exploded schematic diagram of a cover body according to another embodiment of the present application; and

[0049] Fig.12It is a schematic diagram of a cover body according to another embodiment of the present application when viewed from bottom. DETAILED DESCRIPTION

[0050] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present application. However, it is apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described.

[0051] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should also be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of the features, wholes, steps, operations, elements and / or devices, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, devices and / or combinations thereof.

[0052] Ordinal numbers such as "first" and "second" cited in this application are merely identifiers and do not have any other meaning, such as a specific order. Moreover, for example, the term "first component" itself does not imply the existence of a "second component", and the term "second component" itself does not imply the existence of a "first component". It should be noted that the terms "upper", "lower", "front", "back", "left", "right", "inner", "outer" and similar expressions used in this document are for illustrative purposes only and are not limiting.

[0053] For example, "upper" and "lower" in this application refer to the cooking utensil in use, or when the cooking utensil is placed on the table with the lid closed. "Inside" and "outside" in this application refer to the central position of the cooking space.

[0054] Now, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings.

[0055] First embodiment

[0056] The cooking utensil of the present application generally comprises a pot body and a cover body 100. The pot body can be basically in the shape of a rounded rectangular parallelepiped, and the pot body has a middle plate and an outer shell connected to the lower side of the middle plate, and the two can be integrally injection molded. And the middle part of the middle plate has a cylindrical accommodating cavity, and the inner pot can be freely placed in the accommodating cavity or taken out from the accommodating cavity to facilitate the cleaning of the inner pot. The inner pot is generally made of metal material and has a circular opening on the upper surface for holding materials to be heated, such as rice, soup, etc. The pot body includes a heating device for heating the inner pot.

[0057] The cover 100 has a shape substantially corresponding to that of the pot body. The cover 100 is arranged on the pot body in an openable and closable manner. Specifically, the cover 100 is pivotally connected to the pot body via a pivot shaft and can freely pivot between a closed position and an open position relative to the pot body around a pivot axis where the pivot shaft is located, so as to facilitate closing and opening of the pot body. When the cover 100 is closed on the pot body, it covers the inner pot and forms a cooking space between the cover 100 and the inner pot.

[0058] The cooking appliance also has a lid opening torsion spring connected between the pot body and the lid body 100 to provide power for opening the lid body 100. Specifically, the lid opening torsion spring may have a first torsion spring arm and a second torsion spring arm, wherein the first torsion spring arm is connected to the lid body 100 and the second torsion spring arm is connected to the pot body.

[0059] In addition, the cooking utensil may also have a temperature sensing device, such as an upper temperature sensing device disposed in the cover 100 and / or a lower temperature sensing device disposed below the inner pot accommodating cavity. The cooking utensil may also include a cover opening button mechanism, which is preferably disposed on the pot body and is connected to a locking mechanism that locks the cover 100 on the pot body through a transmission mechanism. When the cover opening button mechanism is pressed, the cover 100 can be automatically opened.

[0060] The cooking appliance includes a control device and a heating device. The control device is used to achieve the purpose of cooking control of the cooking appliance, and the control device may be an MCU (Micro Control Unit). The heating device is used to heat the inner pot, and the heating device may be a coil disk. The control device is electrically connected to the heating device to achieve heating control.

[0061] The upper and lower temperature sensing devices are both electrically connected to the control device of the cooking appliance, so as to feed back the sensed temperature signal to the control device after sensing the temperature of the inner pot, so that the control device can achieve more accurate control of the cooking process based on the temperature signal. When the inner pot is placed in the inner pot accommodating cavity of the pot body, the lower temperature sensing device can sense the temperature of the bottom of the inner pot, for example, the lower temperature sensing device can be in direct or indirect contact with the bottom of the inner pot.

[0062] The specific structure of the cover 100 can be referred to Figures 1 to 10. Wherein, the cover body 100 includes a face cover 103, an inner lining 101, an infrared emitting device 110 and an infrared enhancing device. The inner lining 101 is arranged below the face cover 103 and connected to the face cover 103. The infrared emitting device 110 is arranged on the inner lining 101, and the infrared emitting device 110 is configured to emit infrared rays when powered on. The infrared emitting element can emit infrared rays to assist in cooking food in the cooking space. For example, the infrared emitting element can be an infrared emitting tube, which can excite infrared rays when powered on. The infrared enhancing device is arranged on the inner lining 101, and the infrared enhancing device is spaced relative to the infrared emitting device 110 along the thickness direction of the cover body 100, and the infrared enhancing device is configured to emit infrared rays when heated.

[0063] According to the cover 100 of the present application, the infrared emitting device 110 is used to emit infrared rays to assist cooking. At the same time, the infrared rays can also heat the infrared enhancing device, so that the infrared enhancing device is heated and also stimulates infrared rays. The double infrared radiation further enhances the effect of assisting cooking, making the cooked food more delicious.

[0064] Preferably, the infrared enhancement device is at least partially located below the infrared emitting device 110, and the infrared enhancement device is provided with a penetration hole 121, and the penetration hole 121 is used to penetrate the infrared emitting device 110. The infrared rays emitted by the infrared emitting device 110 can be emitted through the penetration hole 121. The infrared enhancement device is arranged below the infrared emitting device, so that the infrared rays emitted by the infrared emitting device can stimulate the infrared enhancement device when they are emitted to the cooking space, thereby improving the utilization rate of the infrared rays, which is beneficial to energy saving and cooking effect.

[0065] As an optional embodiment, the cover body 100 further includes a removable cover 170, which is detachably arranged on the lining 101, and the infrared enhancement device is arranged on the removable cover 170. In this way, the infrared enhancement device is installed by using the removable cover 170, so that the structure is simplified, the space of the cover body 100 is saved, and the cost advantage is achieved. Optionally, the infrared enhancement device includes an infrared radiation plate 120, which is made of infrared radiation material so that the infrared radiation plate 120 can be heated to excite infrared rays. The infrared radiation plate 120 is provided with the above-mentioned penetration opening 121, and the area of ​​the penetration opening 121 should be able to fully cover the infrared emitting device 110. Designing the infrared enhancement device as a plate and providing the penetration opening 121 does not affect the infrared rays emitted by the infrared emitting device 110 to irradiate the food, and can also make full use of the space so that the infrared enhancement device receives heat over a larger area, and excites infrared rays over a larger area, effectively improving the cooking effect of the food.

[0066] For example, the infrared radiation plate 120 may be a carbon plate, which has low cost, high efficiency in exciting infrared rays, and food-grade contact properties.

[0067] Next, continue to combine Figures 1 to 10 The specific structure of the cover body 100 of the present application is introduced in more detail. The cover body 100 also includes a first mounting frame 130, a transmission member 133 and a heat-conducting baffle plate 134. Among them, the first mounting frame 130 is arranged on the lining 101 and is located above the infrared radiation plate 120. The first mounting frame 130 has a first through hole 131 and a second through hole 132. The first through hole 131 corresponds to the penetration hole 121, and the second through hole 132 corresponds to the main body of the infrared radiation plate 120. The transmission member 133 is arranged at the first through hole 131 to block the first through hole 131. The heat-conducting baffle plate 134 is arranged at the second through hole 132, and the heat-conducting baffle plate 134 is used to block the second through hole 132 and to transfer heat to the infrared radiation plate 120.

[0068] With such an arrangement, the infrared rays of the infrared emitting device 110 pass through the second through-hole 132 to heat the heat-conducting baffle 134, and the heat-conducting baffle 134 transfers heat to the infrared radiation plate 120 and causes it to excite infrared rays. Such an arrangement can utilize both the heating effect of the infrared emitting device 110 and the barrier effect of the heat-conducting baffle 134 to avoid the risk of direct exposure of the infrared emitting device 110. At the same time, the arrangement of the transmission member 133 also plays an isolating role without blocking the infrared rays, thereby improving safety.

[0069] As a preferred embodiment, the cover body 100 further includes a second mounting frame 140, which is disposed on the lining 101 and above the first mounting frame 130, and the infrared emitting device 110 is disposed on the second mounting frame 140. In this way, the second mounting frame 140 can block heat and reduce the possibility of damage to other components in the cover body 100. In other words, the second mounting frame 140 can act as a heat insulating member.

[0070] As an optional embodiment, the second mounting frame 140 is provided with a torsion spring positioning portion 142, which is used to limit the torsion spring of the cover opening of the cooking utensil. For example, the first torsion spring arm of the cover opening torsion spring can be limited at the torsion spring positioning portion 142. As a result, the integration of various functions in the cover body is improved, the space utilization rate is improved, and it is conducive to improving assembly efficiency.

[0071] Furthermore, the first mounting frame 130 is fixedly connected to the second mounting frame 140, and the second mounting frame 140 has a pressing rib 141 protruding toward the first mounting frame 130, and the pressing rib 141 abuts against the transmission member 133. The first mounting frame 130, the second mounting frame 140, the infrared emitting device 110, and the transmission member 133 together form an assembly. According to the above arrangement, the first mounting frame 130, the second mounting frame 140, the infrared emitting device 110, the heat-conducting baffle 134, and the transmission member 133 are combined into an assembly before the next step of assembly is performed, which greatly simplifies the assembly steps and improves production efficiency.

[0072] The infrared emitting device 110 includes a reflective cover 111 and an infrared emitter 112. The reflective cover 111 is arranged at the lower side of the second mounting frame 140, and the infrared emitter 112 is arranged at the reflective cover 111. The mounting structure is simple and the space utilization rate is high. The shape of the reflective cover 111 is adapted to the shape of the infrared emitter 112. The reflective cover 111 is used to reflect infrared rays, and the loss of infrared rays is small, thereby improving the auxiliary cooking efficiency.

[0073] In this embodiment, the infrared emitter 112 is configured in a curved shape, for example, the infrared emitter 112 is configured as a U-shaped, horseshoe-shaped or ring-shaped transmitting tube. Figure 1 and Figure 2 As shown, the infrared emitting tube in this embodiment is a U-shaped tube. The second through hole 132 is constructed to be a curved shape adapted to the infrared emitter 112, i.e., the above-mentioned U-shape, horseshoe shape or ring shape. In this case, in order to make full use of the area, the second through hole 132 is arranged around the first through hole 131. Correspondingly, the through hole of the infrared radiation plate 120 also needs to be shaped to adapt to the infrared emitting tube, but the overall area needs to cover the infrared emitting tube.

[0074] As an optional embodiment, the heat-conducting baffle 134 protrudes toward the infrared enhancement device, and the distance between the heat-conducting baffle 134 and the infrared enhancement device is greater than or equal to 0.1 mm and less than or equal to 5 mm. For example, the distance between the heat-conducting baffle 134 and the infrared enhancement device can be 0.1 mm, 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5 mm, 4.0 mm, 4.5 mm or 5.0 mm, etc. Preferably, the distance between the heat-conducting baffle 134 and the infrared enhancement device is greater than or equal to 0.3 mm and less than or equal to 0.7 mm. For example, the distance between the heat-conducting baffle 134 and the infrared enhancement device can be 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm or 0.7 mm, etc. If the distance between the heat-conducting baffle 134 and the infrared enhancement device is too large, it is easy to cause poor heating effect, and if the distance is too close, it is easy to cause interference with other components during assembly. Selecting the above distance between the heat-conducting baffle 134 and the infrared enhancement device can achieve a better heat-conducting effect and facilitate smooth assembly.

[0075] In order to prevent the food in the cooking space from overflowing through the through-hole 121 of the infrared radiation plate 120, the infrared radiation plate 120 is preferably provided with a sealing boss 122, and the cover body 100 further includes a first sealing member 150, which is provided between the transmission member 133 and the first mounting frame 130 and between the transmission member 133 and the sealing boss 122. The sealing boss 122 is provided around the through-hole 121 and protrudes upward, and at least a portion of the sealing boss 122 extends into the first through-hole 131.

[0076] The first sealing member 150 includes a first bent portion 151 and a second bent portion 152. The first bent portion 151 is sleeved on the periphery of the transmission member 133, and the second bent portion 152 is connected to the first bent portion 151 and clamped between the transmission member 133 and the sealing boss 122, thereby improving the sealing between the transmission member 133 and the sealing boss 122, avoiding excessive condensation of water on the surface of the infrared radiation plate 120 when the removable cover 170 is removed, which is beneficial to improving user experience.

[0077] refer to Figure 8 , Fig. 9 and Fig.10The infrared radiation plate 120 is provided with at least one steam through hole 123, and a water retaining rib 124 is provided around the at least one steam through hole 123 to form a steam passing area 125, the water retaining rib 124 protrudes upward, and the liner 101 is provided with a steam channel 102 and a second sealing member 160, the steam passing area 125 corresponds to the steam channel 102, and the second sealing member 160 is used to seal the steam channel 102 and the steam passing area 125. According to the above arrangement, it is beneficial to discharge the steam in the cooking space and it is not easy to accumulate condensed water. Among them, the radial dimension of the water retaining rib 124 is smaller than the maximum radial dimension of the second sealing member 160.

[0078] The height dimension of the water retaining rib 124 is greater than or equal to 0.1 mm and less than or equal to 5 mm. For example, the height dimension of the water retaining rib 124 can be 0.1 mm, 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5 mm, 4.0 mm, 4.5 mm or 5.0 mm, etc. A height that is too low cannot effectively block condensed water. In addition, since the size structure at the water retaining rib 124 is small and more precise, a height that is too high will cause processing difficulties. Preferably, the height dimension of the water retaining rib 124 is greater than or equal to 1.7 mm and less than or equal to 2.3 mm. For example, the height dimension of the water retaining rib 124 can be 1.7 mm, 1.8 mm, 1.9 mm, 2.0 mm, 2.1 mm, 2.2 mm or 2.3 mm, etc. According to the above arrangement, the condensed water on the upper surface of the infrared radiation plate 120 can be prevented from flowing back into the cooking space, avoiding the phenomenon of white dripping from food.

[0079] For the specific structure of the removable cover 170, please refer to Figure 1 , Figure 6 and Figure 7 . The removable cover 170 includes an upper bracket 171, a lower bracket 172, the above-mentioned infrared radiation plate 120 and a third sealing member 173. The upper bracket 171 is used to be detachably connected to the lining 101 of the cover body 100. The lower bracket 172 is located below the upper bracket 171 and is fixedly connected to the upper bracket 171. The infrared radiation plate 120 is arranged between the upper bracket 171 and the lower bracket 172. The third sealing member 173 is arranged on the lower bracket 172 and is at least partially clamped between the upper bracket 171 and the lower bracket 172, and is at least partially clamped between the lower bracket 172 and the infrared radiation plate 120. The sealed clamping installation method makes the infrared radiation plate 120 not easy to be damaged, and has high installation efficiency and low production cost.

[0080] The lower bracket 172 includes a connecting portion 176 and a bearing portion 177. The connecting portion 176 is connected to the upper bracket 171, the bearing portion 177 is connected to the inner side of the connecting portion 176, and the bearing portion 177 is spaced apart from the upper bracket 171, and the infrared radiation plate 120 is disposed between the bearing portion 177 and the upper bracket 171. The upper bracket 171 includes a first mounting portion 174 and a second mounting portion 175. The second mounting portion 175 is disposed around the first mounting portion 174. In other words, the second mounting portion 175 is disposed on the outer side of the first mounting portion 174. The second mounting portion 175 is used to connect to the liner 101, and the first mounting portion 174 is connected to the lower bracket 172. That is, the first mounting portion 174 of the upper bracket 171 is connected to the connecting portion 176 of the lower bracket 172, and the first mounting portion 174 is spaced apart from the bearing portion 177 of the lower bracket 172 to form a groove for accommodating the infrared radiation plate 120. According to the above arrangement, the connection between the upper and lower brackets and the formation of the clamping groove are achieved with a simplified structure, thereby improving the assembly efficiency.

[0081] Optionally, the first mounting portion 174 and the lower bracket 172 are fixedly connected by a fastener 178. This provides a high degree of firmness in the connection.

[0082] For the specific structure of the third sealing member 173, please refer to Figure 7 The third sealing member 173 includes a support sealing portion 179 and a pot mouth sealing portion 183. The support sealing portion 179 is disposed on the lower support 172, and is used to seal the gap between the upper support 171 and the lower support 172, and is used to seal the gap between the infrared radiation plate 120 and the lower support 172. The pot mouth sealing portion 183 is connected to the support sealing portion 179 and extends outwardly at an angle, and is used to seal the pot edge of the inner pot of the cooking utensil. With such an arrangement, a sealing member can be used to achieve sealing between the upper and lower supports and between the infrared radiation plate 120 and the support, and can significantly improve the sealing performance at a relatively low cost.

[0083] Specifically, the bracket sealing portion 179 includes a first sealing section 180, a second sealing section 181 and a surrounding sealing section 182. The first sealing section 180 is arranged between the upper bracket 171 and the connecting portion 176. The second sealing section 181 is arranged between the bearing portion 177 and the infrared radiation plate 120. The surrounding sealing section 182 is connected to both the first sealing section 180 and the second sealing section 181, and the surrounding sealing section 182 surrounds the outer side surface of the connecting portion 176, the bottom side surface of the connecting portion 176 and the bearing portion 177, and the inner side surface of the bearing portion 177. According to the above arrangement, the enveloping design greatly improves the sealing performance and is conducive to the integral molding production of the third sealing member 173.

[0084] The pot mouth sealing portion 183 includes a first bending section 184 and a second bending section 185, wherein the second bending section 185 is connected to the first bending section 184, and the first bending section 184 is connected to the pot mouth sealing portion 183, or in other words, the first bending section 184 is connected to the first sealing section 180 or the surrounding sealing section 182. The maximum radial dimension of the first bending section 184 is greater than the pot mouth dimension of the inner pot of the cooking utensil.

[0085] Furthermore, the angle between the first bending section 184 and the second bending section 185 is preferably greater than or equal to 70° and less than or equal to 80°. For example, the angle between the first bending section 184 and the second bending section 185 may be 70°, 72°, 74°, 76°, 78°, 80°, etc. Preferably, the angle between the first bending section 184 and the second bending section 185 is 75°. If the angle is too small, the bending strength of the third seal 173 will be transitional, and if the angle is too large, the third seal 173 will not be easy to bend, affecting the fitting effect. Therefore, setting a suitable angle between the first bending section 184 and the second bending section 185 can effectively improve the mechanical properties and sealing properties of the third seal 173.

[0086] Second embodiment

[0087] Fig.11 and Fig.12 The second embodiment of the present application is shown. The second embodiment of the present application is a variation of the first embodiment. The cover 200 of the second preferred embodiment has a structure and / or construction similar to the cover 100 of the first preferred embodiment, except for the shape of the infrared emitter 212 and related structures. Therefore, elements having substantially the same functions as those in the first embodiment will be numbered the same here, and will not be described and / or illustrated in detail for the sake of brevity.

[0088] In this embodiment, the infrared emitter 212 is configured as a straight line shape, such as the "I"-shaped infrared tube as shown in the figure. The first through hole 231 is configured as a straight line shape that is compatible with the infrared emitter 212. In this case, the shape of the infrared radiation plate 220 is compatible with the "I"-shaped infrared tube, and can also be configured as a "I" shape. At the same time, the shapes of the transmission member 233, the first sealing member 250, the reflective cover 211, etc. also need to be designed adaptively.

[0089] As shown in the figure, there are two second through-holes 232, and the two second through-holes 232 are respectively arranged on both sides of the first through-hole 231. Correspondingly, there are also two heat-conducting baffles 134, which are respectively arranged corresponding to the two second through-holes 232.

[0090] Unless otherwise defined, the technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the present application. The terms used herein are only for describing specific implementation purposes and are not intended to limit the present application. The features described herein in one embodiment may be applied to another embodiment individually or in combination with other features, unless the feature is not applicable or otherwise specified in the other embodiment.

[0091] The present application has been illustrated through the above-mentioned embodiments, but it should be understood that the above-mentioned embodiments are only for the purpose of example and explanation, and the present application is not limited to the above-mentioned embodiments. According to the teachings of the present application, more variations and modifications can be made, and these variations and modifications all fall within the scope of protection claimed by the present application.

Claims

1. A cover for a cooking utensil, characterized in that: The cover body comprises: Lining; an infrared emitting device, the infrared emitting device being disposed on the inner lining and being configured to emit infrared rays when powered on; An infrared enhancement device is arranged on the lining, and the infrared enhancement device is spaced apart from the infrared emitting device along the thickness direction of the cover body, and the infrared enhancement device is configured to emit infrared rays when heated.

2. The cover according to claim 1, characterized in that: The infrared enhancement device is at least partially located below the infrared emitting device. The infrared enhancement device is provided with a penetration opening, which is used to penetrate the infrared emitting device, wherein the infrared rays emitted by the infrared emitting device can be emitted through the penetration opening.

3. The cover according to claim 2, characterized in that: The cover body further comprises a detachable cover, the detachable cover is detachably arranged on the lining, and the infrared enhancement device is arranged on the detachable cover.

4. The cover according to claim 2, characterized in that: The cover body further comprises a transmission member, which is located between the infrared enhancement device and the infrared emission device, and the position of the transmission member corresponds to the penetration opening so as to cover the penetration opening.

5. The cover according to claim 2, characterized in that: The cover body further comprises a heat-conducting baffle, and the heat-conducting baffle is located between the infrared enhancement device and the infrared emission device.

6. The cover according to claim 4, characterized in that: The cover body also includes a first mounting frame, which is arranged on the lining and located above the infrared enhancement device. The first mounting frame has a first through hole, which corresponds to the penetration hole. The transmission member is arranged on the first mounting frame and located at the first through hole.

7. The cover according to claim 5, characterized in that: The cover body also includes a first mounting frame, which is arranged on the lining and located above the infrared enhancement device. The first mounting frame has a second through-hole, and the position of the second through-hole corresponds to the main body of the infrared enhancement device. The first mounting frame of the heat-conducting baffle is located at the second through-hole.

8. The cover according to claim 5, characterized in that: The distance between the heat conductive baffle and the infrared enhancement device is greater than or equal to 0.1 mm and less than or equal to 5 mm.

9. The cover according to claim 5, characterized in that: The distance between the heat-conducting baffle and the infrared enhancement device is greater than or equal to 0.3 mm and less than or equal to 0.7 mm.

10. The cover according to claim 6, characterized in that: The infrared enhancement device comprises an infrared radiation plate, which is made of infrared radiation material and has a sealing boss arranged around the penetration opening and protruding upward, wherein the sealing boss at least partially extends into the first through opening.

11. The cover according to claim 10, characterized in that: The cover body further includes a first sealing member, which is disposed between the transmissive member and the first mounting frame and between the transmissive member and the sealing boss.

12. The cover according to claim 11, characterized in that: The first sealing member comprises: A first bending portion, wherein the first bending portion is sleeved on the periphery of the transmissive member; A second bending portion, wherein the second bending portion is connected to the first bending portion and is clamped between the transmission member and the sealing boss.

13. The cover according to claim 1, characterized in that: The infrared enhancement device comprises an infrared radiation plate, which is made of infrared radiation material and is provided with at least one steam through hole.

14. The cover according to claim 13, characterized in that: A water retaining rib is arranged around the at least one steam through hole to form a steam passing area, the water retaining rib protrudes upward, the liner is provided with a steam channel and a second seal, the steam passing area corresponds to the steam channel, and the second seal is used to seal the steam channel and the steam passing area.

15. The cover according to claim 14, characterized in that: The radial dimension of the water retaining rib is smaller than the maximum radial dimension of the second sealing member; and / or The height of the water retaining rib is greater than or equal to 0.1 mm and less than or equal to 5 mm.

16. The cover according to claim 14, characterized in that: The height of the water retaining rib is greater than or equal to 1.7 mm and less than or equal to 2.3 mm.

17. The cover according to any one of claims 10 to 16, characterized in that: The infrared radiation plate is configured as a carbon plate.

18. The cover according to claim 6, characterized in that: The cover body also includes a second mounting frame, which is arranged on the lining and located above the first mounting frame. The infrared emitting device includes a reflective cover and an infrared emitter. The reflective cover is arranged on the lower side of the second mounting frame, and the infrared emitter is arranged on the reflective cover, and the shape of the reflective cover is adapted to the shape of the infrared emitter.

19. The cover according to claim 7, characterized in that: The infrared emitting device comprises an infrared emitter; The infrared emitter is configured in a curved shape, and the second through-hole is configured in a curved shape adapted to the infrared emitter; or The infrared emitter is configured in a straight line shape, the second through-hole is configured in a straight line shape adapted to the infrared emitter, two second through-holes are provided, and the two second through-holes are provided at intervals.

20. The cover according to claim 6, characterized in that: The cover body also includes a second mounting frame, which is arranged on the lining and located above the first mounting frame, the first mounting frame is fixedly connected to the second mounting frame, the second mounting frame has a clamping rib protruding toward the first mounting frame, the clamping rib abuts against the transmissive member, and the first mounting frame, the second mounting frame, the infrared emitting device and the transmissive member together constitute an assembly.

21. The cover according to claim 18 or 20, characterized in that: The second mounting frame is provided with a torsion spring positioning portion, and the torsion spring positioning portion is used to limit the cover opening torsion spring of the cooking utensil.

22. A cooking utensil, characterized in that: Comprising a cover according to any one of claims 1-21.

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