Probe card device

Abstract

The invention discloses a probe card device which comprises at least one first guide plate, at least one second guide plate, at least one signal probe and a plurality of grounding elements. The first guide plate is provided with a plurality of first array type slotted holes; the second guide plate is provided with a plurality of second array type groove holes. A plurality of grounding elements are arranged in the first array type slotted holes and the second array type slotted holes in a penetrating mode, conductive traces are arranged on the periphery of at least one first array type slotted hole provided with the grounding elements in a penetrating mode so as to form a first grounding contact, and conductive traces are arranged on the periphery of at least one second array type slotted hole provided with the grounding elements in a penetrating mode so as to form a second grounding contact. The at least two first grounding contacts or the at least two second grounding contacts are connected through conductive traces.

Description

Technical Field

[0001] The present invention relates to a probe card device, and in particular to a probe card structure for shortening the distance between a signal probe and a grounding element. Background Art

[0002] The electrical testing of integrated circuit chips (IC chips) is very important in the manufacturing process. When the integrated circuit is tested, the test equipment contacts the device under test (DUT) through a probe card device to transmit electrical signals, and then the test equipment analyzes the received electrical signals to perform electrical testing to determine whether the manufacturing quality of the DUT is qualified.

[0003] In the prior art, a probe card device includes a signal probe and a guide plate. One end of the signal probe contacts the electrode, and the other end of the signal probe contacts the object to be tested for electrical testing. In high-speed or high-frequency signal testing, a grounding element is provided to stabilize the signal transmission of the signal probe and reduce interference. However, in the prior art, the grounding element (ground Hire) on the probe card device is usually too far away from the probe (probe). However, in the case of high-speed or high-frequency signal testing, such a design makes the grounding contact of the grounding element too far away from the object to be tested, resulting in poor electronic signals and a lack of optimal current distribution, and causing the signal transmission to take too long, thereby reducing the detection efficiency.

[0004] Therefore, how to shorten the distance between the grounding point of the grounding element and the object to be measured by improving the structural design to overcome the above-mentioned defects has become one of the important issues that this industry wants to solve. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a probe card device to reduce the distance between the grounding point of the grounding element and the object to be tested in view of the shortcomings of the prior art.

[0006] In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a probe card device, which includes: at least one first guide plate, at least one second guide plate and at least one high-frequency test probe group, the high-frequency test probe group includes at least one signal probe and multiple grounding elements. At least one first guide plate is provided with multiple first array slots. At least one second guide plate is arranged below at least one first guide plate and parallel to at least one first guide plate, at least one second guide plate is provided with multiple second array slots, and the multiple first array slots correspond to the multiple second array slots respectively. The signal probe is penetrated in the first array slot and the second array slot. Multiple grounding elements are penetrated in the first array slot and the second array slot. Conductive traces are arranged around the multiple first array slots penetrated with grounding elements or around the multiple second array slots penetrated with grounding elements to form grounding contacts, and are electrically connected through the conductive traces.

[0007] Furthermore, there is no electrical connection between the signal probe and the plurality of ground elements.

[0008] Furthermore, the first array slots through which the grounding elements are passed are respectively adjacent to the first array slots through which the signal probes are passed, and the second array slots through which the grounding elements are passed are respectively adjacent to the second array slots through which the signal probes are passed.

[0009] Among multiple grounding elements and grounding points in the shielding space, grounding is completed only through one of the grounding elements.

[0010] One of the beneficial effects of the present invention is that the probe card device provided by the present invention can be adjacent to the first array slot and the second array slot through which the signal probe is passed through, respectively, through the first array slot and the second array slot through which the grounding element is passed, and a conductive trace is set around at least one first array slot through which the grounding element is passed or around the second array slot to form a first grounding contact and a second grounding contact correspondingly, and the conductive trace is used to connect at least two first grounding contacts or at least two second grounding contacts to shorten the distance between the grounding contact of the grounding element and the object to be tested, so as to achieve high-speed transmission of electronic signals and better current distribution.

[0011] Another beneficial effect of the present invention is that in the probe card device provided by the present invention, the first array slots and the second array slots through which the four grounding elements are penetrated are respectively located at the diagonal positions of the first array slots and the second array slots through which the signal probes are penetrated, thereby achieving a good shielding effect and accurately transmitting the test signal.

[0012] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a cross-sectional schematic diagram of a first implementation aspect of a probe card device according to a first embodiment of the present invention;

[0014] Figure 2 It is a three-dimensional schematic diagram of a first implementation aspect of a probe card device according to a first embodiment of the present invention;

[0015] Figure 3 is a schematic diagram of the connection of the conductive traces of the first embodiment of the present invention;

[0016] Figure 4A is a cross-sectional schematic diagram of a second implementation of the probe card device of the first embodiment of the present invention;

[0017] Figure 4B is a cross-sectional schematic diagram of a third implementation of the probe card device of the first embodiment of the present invention;

[0018] Figure 4C is a cross-sectional schematic diagram of a fourth implementation aspect of the probe card device of the first embodiment of the present invention;

[0019] Figure 4D is a cross-sectional schematic diagram of a fifth implementation of the probe card device of the first embodiment of the present invention;

[0020] Figure 4E is a cross-sectional schematic diagram of a sixth implementation aspect of the probe card device of the first embodiment of the present invention;

[0021] Figure 4F is a cross-sectional schematic diagram of a seventh implementation aspect of the probe card device of the first embodiment of the present invention;

[0022] Figure 5 is a three-dimensional schematic diagram of a probe card device according to a second embodiment of the present invention;

[0023] Figure 6 FIG. 4 is a schematic diagram of connecting conductive traces according to the second embodiment of the present invention.

[0024] Explanation of the reference numerals: 100, 200, probe card device; 102, 202, first guide plate; 102a, 202a, upper surface of the first guide plate; 102b, 202b, lower surface of the first guide plate; 103, 203, second guide plate; 103a, 203a, upper surface of the second guide plate; 103b, 203b, lower surface of the second guide plate; 104, substrate; 105, 205, grounding element; 106, 206, signal probe; 107, 207, insulating coating; 108, 208, first grounding contact; 109, 209, second grounding contact; D, object to be tested; H1, first array-type slot; H2, second array-type slot; CT, conductive trace; X, X-axis; Y, Y-axis; A, A-axis; B, B-axis. DETAILED DESCRIPTION

[0025] The following is an explanation of the implementation of the "probe card device" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0026] [First embodiment]

[0027] See also Figures 1 to 4FAs shown, the first embodiment of the present invention provides a probe card device 100, which includes: at least one first guide plate 102, at least one second guide plate 103 and at least one high-frequency test probe group, the high-frequency test probe group includes at least one signal probe 106 and a plurality of grounding elements 105, the plurality of grounding elements 105 form a shielding space, and the shielding space surrounds the signal probe 106. It should be noted in advance that the number of the first guide plate 102 and the second guide plate 103 of the present invention can be adjusted according to the situation. All embodiments of the present invention are described on the premise that the number of the first guide plate 102 and the second guide plate 103 are both 2, so the present invention does not limit the number of the first guide plate 102 and the second guide plate 103. In the first embodiment, a plurality of first array slots H1 are provided on the first guide plate 102, and a plurality of second array slots H2 are also provided on the second guide plate 103. The second guide plate 103 is arranged below the first guide plate 102 and parallel to the first guide plate 102. The shapes of the first array slots H1 and the second array slots H2 may vary according to the shapes of the signal probes 106 and the grounding element 105. The shapes of the first array slots H1 and the second array slots H2 may be circular, square, rectangular, triangular or polygonal. The present invention does not limit the shapes of the first array slots H1, the second array slots H2, the signal probes 106 and the grounding element 105. A plurality of first array slots H1 may correspond to a plurality of second array slots H2 respectively.

[0028] It should be noted that the first array slots H1 and the second array slots H2 are arranged in arrays on the first guide plate 102 and the second guide plate 103 . Specifically, the first array slots H1 and the second array slots H2 are arranged in arrays at the same spacing distance.

[0029] It should be noted that the number of the signal probes 106 of the present invention can be adjusted according to the situation. All embodiments of the present invention are described based on the premise that the number of the signal probe 106 is 1, so the present invention does not limit the number of the signal probes 106. One end of the signal probe 106 contacts the substrate 104, and the other end of the signal probe 106 is electrically connected to the object to be tested D. The signal probe 106 passes through the first array slot H1 on the first guide plate 102 and the second array slot H2 on the second guide plate 103.

[0030] It should be noted that the number of the grounding elements 105 in the first embodiment of the present invention can be adjusted according to the situation, but at least two grounding elements 105 need to be provided for each signal probe 106 .

[0031] The first array slots H1 through which the grounding elements 105 are passed are respectively adjacent to the first array slots H1 through which the signal probes 106 are passed, and the second array slots H2 through which the grounding elements are passed are respectively adjacent to the second array slots H2 through which the signal probes 106 are passed.

[0032] In the first embodiment, the two first array slots H1 through which the two grounding elements 105 are passed are respectively adjacent and arranged side by side on different sides of the first array slot H1 through which the signal probe 106 is passed, and the two second array slots H2 through which the two grounding elements 105 are passed are respectively adjacent and arranged side by side on different sides of the second array slot H2 through which the signal probe 106 is passed.

[0033] That is to say, the first array slot H1 through which one of the two grounding elements 105 passes is located on one side of the first array slot H1 through which the signal probe 106 passes, and the first array slot H1 through which the other of the two grounding elements 105 passes is located on the other side of the first array slot H1 through which the signal probe 106 passes; the second array slot H2 through which one of the two grounding elements 105 passes is located on one side of the second array slot H2 through which the signal probe 106 passes, and the second array slot H2 through which the other of the two grounding elements 105 passes is located on the other side of the second array slot H2 through which the signal probe 106 passes.

[0034] See also Figure 2 , the planes of the first guide plate 102 and the second guide plate 103 all have an X-axis, a Y-axis, an A-axis and a B-axis, wherein the X-axis and the Y-axis are perpendicular to each other, the A-axis and the B-axis are not perpendicular and not parallel to the X-axis and the Y-axis, and the A-axis and the B-axis are not parallel to each other. The two grounding elements can be arranged along the X-axis with the signal probe as the center point, and the two grounding elements can be arranged along the Y-axis with the signal probe as the center point. Furthermore, the grounding elements can also be arranged along the X-axis, the Y-axis, the A-axis and the B-axis with the signal probe as the center point.

[0035] A conductive trace CT is arranged around at least one first array slot H1 through which a grounding element 105 is passed to form a corresponding first grounding contact 108, and / or a conductive trace CT is arranged around at least one second array slot H2 through which a grounding element 105 is passed to form a corresponding second grounding contact 109, and at least two of the first grounding contacts 108 or at least two of the second grounding contacts 109 are connected by the conductive trace CT.

[0036] A plurality of grounding elements 105 may be electrically connected via the conductive traces CT, and grounding conduction is achieved only through one or more grounding elements 105 .

[0037] A conductive trace CT is disposed on at least one of the first guide plate 102 and the second guide plate 103 . Figure 3 It is clearly shown that the conductive traces CT are disposed on the second guide plate 103. In a specific embodiment, the conductive traces CT can be disposed on both the first guide plate 202 and the second guide plate 203. The present invention is not limited thereto.

[0038] The conductive traces CT are formed by plating gold or copper on a slot frame (tray) around the first array slots H1 or the second array slots H2 .

[0039] In one embodiment, the conductive trace CT on the second guide plate 103 connects the second grounding contacts 109 respectively penetrated by the two grounding elements 105. In one embodiment, the conductive trace CT on the first guide plate 102 connects the first grounding contacts 108 respectively penetrated by the two grounding elements 205. In one embodiment, the conductive trace CT on the first guide plate 102 connects the first grounding contacts 108 respectively penetrated by the two grounding elements 105, and the conductive trace CT on the second guide plate 103 connects the second grounding contacts 109 respectively penetrated by the two grounding elements 105. Preferably, as long as there is a conductive trace CT connecting the grounding contacts on one of the first guide plate or the second guide plate, the shielding effect of the two grounding elements 105 on the signal probe 106 can be achieved.

[0040] Preferably, the first guide plate 102 has a first guide plate upper surface 102a and a first guide plate lower surface 102b; the second guide plate 103 has a second guide plate upper surface 103a and a second guide plate lower surface 103b, and the first grounding contact point 108 is formed on at least one of the first guide plate upper surface 102a and the first guide plate lower surface 102b; the second grounding contact point 109 is formed on at least one of the second guide plate upper surface 103a and the second guide plate lower surface 103b.

[0041] See also Figures 4A to 4F , Figures 4A to 4F In different implementations, the conductive traces CT are respectively arranged on the first guide plate 102 or the second guide plate 103. Figure 4A In FIG. 1 , it is shown that in the case of having two first guide plates 102 and a second guide plate 103 , the conductive trace CT is only arranged on the first guide plate upper surface 102 a of the first guide plate 102 closer to the substrate 104 . Figure 4BIn FIG. 1 , it is shown that in the case of having two first guide plates 102 and a second guide plate 103 , the conductive trace CT is only arranged on the second guide plate lower surface 103 b of the second guide plate 103 closer to the object to be tested D. Figure 4C In FIG. 1 , it is shown that in the case of two first guide plates 102 and a second guide plate 103 , the conductive trace CT is only disposed on the first guide plate upper surface 102a of the first guide plate 102 closer to the substrate 104 and the second guide plate lower surface 103b of the second guide plate 103 closer to the object to be tested D. Figure 4D In FIG. 1 , it is shown that in the case of having two first guide plates 102 and a second guide plate 103 , the conductive trace CT is only disposed on the first guide plate lower surface 102 b of the first guide plate 102 which is farther away from the substrate 104 . Figure 4E In FIG. 1 , it is shown that in the case of two first guide plates 102 and a second guide plate 103 , the conductive traces CT are only arranged on the second guide plate upper surface 103a of the second guide plate 103 which is farther from the object to be tested D and the second guide plate lower surface 103b of the second guide plate 103 which is closer to the object to be tested D. Figure 4F In the figure, it is shown that in the case of two first guide plates 102 and two second guide plates 103, the conductive traces CT are only arranged on the first guide plate lower surface 102b of the first guide plate 102 which is farther away from the substrate 104 and the second guide plate upper surface 103a of the second guide plate 103 which is farther away from the object to be measured D. However, the arrangement position of the conductive traces CT may be determined according to the actual application situation, and the present invention is not limited thereto.

[0042] Preferably, an insulating coating layer 107 is disposed on the grounding element 105 .

[0043] Preferably, the insulating coating layer 107 on the grounding element 105 does not contact the first guide plate 102 and the second guide plate 103 .

[0044] Preferably, the first guide plate 102 and the first grounding point 108 are integrally formed structures, and the second guide plate 103 and the second grounding point 109 are integrally formed structures.

[0045] It should be noted that there is no electrical connection between the signal probe 106 and the plurality of ground elements 105 .

[0046] [Second embodiment]

[0047] See also Figure 5 and Figure 6 , is a probe card device 200 in the second embodiment of the present invention. It should be noted that this embodiment is similar to the first embodiment, so the similarities between the two embodiments will not be repeated.

[0048] The difference between the second embodiment and the first embodiment is that the four grounding elements 205 of the probe card device 200 of the second embodiment are respectively penetrated through the four first array-type slots H1 on the first guide plate 202; and the four grounding elements 205 are respectively penetrated through the four second array-type slots H2 on the second guide plate 203. The four first array-type slots H1 and the four second array-type slots H2 through which the four grounding elements 205 are penetrated are respectively located at the diagonal positions of the first array-type slots H1 and the second array-type slots H2 through which the signal probes 206 are penetrated, and the four grounding elements 205 form a shielding space to surround the signal probes 206.

[0049] Specifically, the four first array slots H1 through which the four grounding elements 205 are passed and the four second array slots H2 are respectively located at diagonal positions of the first array slots H1 and the second array slots H2 through which the signal probes 206 are passed. Figure 5 For example, in the 3x3 first array slot H1 (an array consisting of 3 first array slots H1 facing the X-axis and 3 first array slots H1 facing the Y-axis), the first array slot H1 through which the signal probe 206 is penetrated will be located at the center of the 3x3 first array slot H1, and four different first array slots H1 will be respectively located at four diagonals of the 3x3 first array slot H1.

[0050] Further explanation, the planes of the first guide plate 202 and the second guide plate 203 in the second embodiment all have an X-axis, a Y-axis, an A-axis, and a B-axis. Similarly, the X-axis and the Y-axis are perpendicular to each other, the A-axis and the B-axis are not perpendicular and not parallel to the X-axis and the Y-axis, and the A-axis and the B-axis are not parallel to each other. In particular, in the second embodiment, the A-axis and the B-axis have the signal probe 206 as the intersection point, and the four grounding elements 205 are arranged at four diagonal positions of the signal probe 206 along the A-axis and the B-axis with the signal probe 206 as the center point.

[0051] In one embodiment, the four first array slots H1 through which the four grounding elements 205 are passed are surrounded by conductive traces CT to form four first grounding contacts 208, and the four first grounding contacts 208 are connected by the conductive traces CT. In one embodiment, the four second array slots H2 through which the four grounding elements 205 are passed are surrounded by conductive traces CT to form four second grounding contacts 209, and the four second grounding contacts 209 are connected by the conductive traces CT, and the four first array slots H1 through which the four grounding elements 205 are passed are surrounded by conductive traces CT to form four first grounding contacts 208, and the four first grounding contacts 208 are connected by the conductive traces CT.

[0052] Figure 6 It is clearly shown that the conductive traces CT are arranged on the second guide plate 203. The conductive traces CT are arranged around the four second array slots H2 through which the four grounding elements 205 are penetrated to form four second grounding points 209, and the four second grounding points 209 are connected by the conductive traces CT.

[0053] Likewise, an insulating coating layer 207 is disposed on the grounding element 205 .

[0054] Likewise, the insulating coating layer 207 on the grounding element 205 does not contact the first conductive plate 202 and the second conductive plate 203 .

[0055] Similarly, the first guide plate 202 and the first grounding point 208 are integrally formed, and the second guide plate 203 and the second grounding point 209 are integrally formed.

[0056] Likewise, there is no electrical connection between the signal probe 206 and the plurality of ground elements 205 .

[0057] In particular, the grounding between the multiple grounding elements 206 and the grounding points in the shielding space can be completed by only one of the grounding elements 206 .

[0058] By arranging the positions of the grounding element 205 and the signal probe 206 of the second embodiment of the present invention, a shielding effect can be achieved, noise interference and signal distortion can be reduced, and the test signal can be accurately transmitted.

[0059] [Beneficial Effects of Embodiments]

[0060] One of the beneficial effects of the present invention is that the probe card device provided by the present invention can be adjacent to the first array slot and the second array slot through which the signal probe is passed through, respectively, through the first array slot and the second array slot through which the grounding element is passed, and conductive traces are set around at least one first array slot through which the grounding element is passed and around the second array slot to form a first grounding contact and a second grounding contact correspondingly, and the conductive traces are used to connect at least two first grounding contacts or at least two second grounding contacts to shorten the distance between the grounding contact and the grounding element, so as to achieve high-speed transmission of electronic signals and better current distribution.

[0061] Another beneficial effect of the present invention is that in the probe card device provided by the present invention, the first array slots and the second array slots through which the four grounding elements are penetrated are respectively located at the diagonal positions of the first array slots and the second array slots through which the signal probes are penetrated, thereby achieving a good shielding effect and accurately transmitting the test signal.

[0062] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A probe card device, characterized in that: include: At least one first guide plate, wherein the at least one first guide plate is provided with a plurality of first array slots; At least one second guide plate is disposed below the at least one first guide plate and parallel to the at least one first guide plate, the at least one second guide plate is provided with a plurality of second array slots, and the plurality of the first array slots respectively correspond to the plurality of the second array slots; At least one high-frequency test probe set, the high-frequency test probe set comprising: at least one signal probe, the signal probe being disposed through the first array slot and the second array slot; and a plurality of grounding elements, disposed adjacent to the signal probes, the plurality of grounding elements being respectively penetrated through the first array slot and the second array slot, wherein the first array slot through which the grounding elements are penetrated is respectively adjacent to the first array slot through which the signal probes are penetrated, and the second array slot through which the grounding elements are penetrated is respectively adjacent to the second array slot through which the signal probes are penetrated; and a shielding space, wherein the shielding space is formed by the plurality of grounding elements and surrounds the signal probe; Wherein, conductive traces are arranged around the first array slots or around the second array slots through which the grounding elements are penetrated, and grounding contacts are formed between at least two of the grounding elements and the conductive traces and are electrically connected through the conductive traces; There is no electrical connection between the signal probe and the plurality of ground elements.

2. The probe card device according to claim 1, wherein: The first guide plate has a first guide plate upper surface and a first guide plate lower surface; the second guide plate has a second guide plate upper surface and a second guide plate lower surface, The grounding point is formed on at least one of an upper surface of the first guide plate, a lower surface of the first guide plate, an upper surface of the second guide plate, and a lower surface of the second guide plate.

3. The probe card device according to claim 1, wherein: At least one of the grounding elements is provided with an insulating coating layer.

4. The probe card device according to claim 1, wherein: The first array slots through which the grounding elements are passed are respectively adjacent to different sides of the first array slots through which the signal probes are passed, and the second array slots through which the plurality of grounding elements are passed are respectively adjacent to different sides of the second array slots through which the signal probes are passed.

5. The probe card device according to claim 4, characterized in that: The plurality of grounding elements are disposed on the first guide plate and the second guide plate along a first direction axis with the signal probe as a center point.

6. The probe card device according to claim 4, wherein: The plurality of grounding elements are disposed on the first guide plate and the second guide plate along a second direction axis with the signal probe as a center point.

7. The probe card device according to claim 4, wherein: The plurality of grounding elements are disposed on the first guide plate and the second guide plate along a direction that is not perpendicular to the first direction axis and the second direction axis with the signal probe as a center point.

8. The probe card device according to any one of claims 5 to 7, characterized in that: The first direction axis is perpendicular to the second direction axis.

9. The probe card device according to claim 1, wherein: The first array slots through which the grounding elements are passed are located at diagonal positions of the first array slots through which the signal probes are passed, and the second array slots through which the grounding elements are passed are located at diagonal positions of the second array slots through which the signal probes are passed.

10. The probe card device according to claim 9, wherein: A portion of the plurality of grounding elements are disposed on the first guide plate and the second guide plate along an axis in the third direction with the signal probe as the center point; another portion of the plurality of grounding elements are disposed on the first guide plate and the second guide plate along an axis in the fourth direction with the signal probe as the center point. The third direction axis and the fourth direction axis are not parallel to each other and have the signal probe as an intersection point.

11. The probe card device according to claim 3, wherein: The insulating coating layer does not contact the first guide plate and the second guide plate.

12. The probe card device according to claim 1, wherein: The grounding contact includes a first grounding contact formed on the first guide plate and a second grounding contact formed on the second guide plate. The first guide plate and the first grounding contact are integrally formed structures, and the second guide plate and the second grounding contact are integrally formed structures.

13. The probe card device according to claim 1, wherein: Among the multiple grounding elements forming the shielding space, grounding is completed only through one of the grounding elements.

Images