Method and system for judging quality of integrated chip packaging test data under abnormal distribution
Through the calculation of AD inspection and process capability index, combined with the degree of data concentration and offset, the problem of quality judgment of integrated chip packaging test data under non-normal distribution is solved, and efficient and accurate quality evaluation and grading are achieved.
CN119716706AActive Publication Date: 2025-03-28ANQING NORMAL UNIV
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Patent Information
- Application Number
- CN202510035398.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2045-01-09
AI Technical Summary
Technical Problem
The prior art is difficult to effectively judge the quality of integrated chip packaging test data under non-normal distribution, especially when calculating process capability indexes.
Method used
The distribution of integrated chip package test data is judged through AD tests, the process capability index under normal distribution and non-normal distribution is calculated, and the quality is graded based on the degree of data concentration and the overall degree of process offset.
Benefits of technology
Accurate judgment of the quality of integrated chip packaging test data under non-normal distribution is achieved, the credibility and grading of judgments are improved, weak links in the process can be detected and overall quality can be improved.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention discloses a method and a system for judging the quality of packaging test data of an integrated chip under abnormal distribution, belongs to the technical field of integrated chip detection, and solves the problem of how to judge the packaging quality of the integrated chip under the abnormal distribution. According to the test data distribution, different methods are selected to calculate the process capability index of the test data, and according to the data concentration degree and the process offset degree in the process capability index, the packaging quality grade of the integrated chip is judged; when the integrated chip packaging test data is in non-normal distribution, 1% significance level is used for filtering interference data with overlarge offset and a peak mean value is used for replacing a process mean value, so that a process capability index calculated by the integrated chip packaging test data under the non-normal distribution has higher anti-interference capability; and the reliability of judging the packaging quality of the integrated chip is higher.
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