Optical module

Abstract

The invention discloses an optical module, which comprises a shell formed by covering an upper shell and a lower shell, and a circuit board positioned in the shell, and the light receiving part is positioned on the lower surface of the circuit board. A first optical channel and a second optical channel are arranged on the upper surface of an emitting shell of the light emitting component, and a first optical fiber containing part and a second optical fiber containing part are arranged on the lower surface of the emitting shell and used for containing a first internal optical fiber and a second internal optical fiber. A first optical fiber adapter, a second optical fiber adapter, a third optical fiber adapter and a fourth optical fiber adapter which are located at the same height are sequentially arranged on the first side wall of the transmitting shell. A first optical fiber accommodating part and a second optical fiber accommodating part are arranged on the lower surface of the transmitting shell, the first optical fiber accommodating part is communicated with the third optical fiber through hole, and the second optical fiber accommodating part is communicated with the third optical fiber through hole. By reasonably arranging the positions of the light emitting component and the light receiving component and the center height of the optical port of the optical module, the number of optical components is reduced, and the space of the optical module is reduced.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical module. Background Art

[0002] Optical communication technology is used in new business models and application models such as cloud computing, mobile Internet, and video. In optical communication, optical modules are tools for converting photoelectric signals into each other and are one of the key components in optical communication equipment. With the rapid development of 5G networks, optical modules, which are at the core of optical communication, have made great progress.

[0003] The optical module is equipped with an optical transmitting component for converting electrical signals into optical signals and an optical receiving component for converting optical signals into electrical signals. In the current 800G optical module solution, 100G EML lasers are usually included as the main optical transmitting devices. In the QSFP-DD packaging method, the internal space of the optical module is small, and the 800G optical module requires 8 100GEML lasers as optical transmitting components and 8 photodetectors as receiving devices. Summary of the invention

[0004] The present application provides an optical module to reduce the space occupied by the optical module.

[0005] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0006] On the one hand, an embodiment of the present application discloses an optical module, including:

[0007] Upper shell;

[0008] A lower shell, which is covered with the upper shell to form a shell;

[0009] A circuit board is located between the upper housing and the lower housing;

[0010] The light receiving component comprises:

[0011] A first receiving component, located on the lower surface of the circuit board;

[0012] A second receiving component is located on the lower surface of the circuit board;

[0013] A light emitting component is located on one side of the circuit board, and the light emitting component includes:

[0014] An emitting housing, a second side wall of which is provided with a first opening groove, one end of the circuit board is embedded in the first opening groove; an upper surface of the emitting housing is provided with a first optical channel and a second optical channel; a lower surface of the emitting housing is provided with a first optical fiber accommodating portion and a second optical fiber accommodating portion, respectively used to accommodate a first internal optical fiber and a second internal optical fiber;

[0015] A first light emitting assembly is embedded in the first light channel, and the opening of the first light channel faces the upper housing;

[0016] A first light emitting assembly is embedded in the second light channel, and the opening of the second light channel faces the upper housing;

[0017] Wherein, the first side wall of the transmitting housing is provided with a first optical fiber adapter, a second optical fiber adapter, a third optical fiber adapter and a fourth optical fiber adapter located at the same height in sequence;

[0018] The optical axis of the first optical fiber adapter is at the same height as the optical axis of the first optical emitting assembly, and the optical axis of the second optical fiber adapter is at the same height as the optical axis of the second optical emitting assembly;

[0019] The lower surface of the transmitting housing is provided with a first optical fiber accommodating portion and a second optical fiber accommodating portion;

[0020] The first optical fiber accommodating portion is in communication with the third optical fiber through hole, and the second optical fiber accommodating portion is in communication with the third optical fiber through hole;

[0021] One end of the first internal optical fiber is connected to the third optical fiber adapter via the first optical fiber accommodating portion, and the other end of the first internal optical fiber is connected to the first receiving assembly;

[0022] One end of the second internal optical fiber is connected to the fourth optical fiber adapter via the second optical fiber accommodating portion, and the other end of the second internal optical fiber is connected to the second receiving component; the pigtail is connected; the pigtail of the second receiving component faces away from the fourth optical fiber adapter.

[0023] In a second aspect, an embodiment of the present application discloses another optical module, including: an upper housing;

[0024] A lower shell, which is covered with the upper shell to form a shell;

[0025] A circuit board is located between the upper housing and the lower housing;

[0026] A light receiving component is located on the lower surface of the circuit board, and the light receiving component includes:

[0027] a first receiving component;

[0028] a second receiving component;

[0029] A light emitting component is located on one side of the circuit board, and the light emitting component includes:

[0030] The transmitting shell has a second side wall provided with a first opening groove, and one end of the circuit board is embedded in the first opening groove;

[0031] The upper surface of the transmitting housing is provided with a first optical channel and a second optical channel; the lower surface of the transmitting housing is provided with a first optical fiber accommodating portion and a second optical fiber accommodating portion for accommodating a first internal optical fiber and a second internal optical fiber;

[0032] A first light emitting assembly is embedded in the first light channel, and the opening of the first light channel faces the upper housing;

[0033] A first light emitting assembly is embedded in the second light channel, and the opening of the second light channel faces the upper housing;

[0034] Wherein, the first side wall of the transmitting housing is provided with a first optical fiber adapter, a second optical fiber adapter, a third optical fiber adapter and a fourth optical fiber adapter in sequence;

[0035] The central axes of the first optical fiber adapter, the second optical fiber adapter, the third optical fiber adapter, and the fourth optical fiber adapter are located on the same straight line;

[0036] The first optical fiber adapter is connected to the first optical transmission component, and the second optical fiber adapter is connected to the second optical transmission component;

[0037] One end of the first internal optical fiber is connected to the third optical fiber adapter, and the other end of the first internal optical fiber is connected to the pigtail of the first receiving component; the pigtail of the first receiving component faces away from the third optical fiber adapter;

[0038] One end of the second internal optical fiber is connected to the fourth optical fiber adapter, and the other end of the second internal optical fiber is connected to the pigtail of the second receiving component; the pigtail of the second receiving component faces away from the fourth optical fiber adapter; the distance between the bottom of the first optical fiber accommodating portion and the upper surface of the transmitting shell is smaller than the distance between the bottom of the first optical channel and the upper surface of the transmitting shell.

[0039] Compared with the prior art, the present invention has the following advantages:

[0040] The present application discloses an optical module, comprising: an upper shell and a lower shell that are covered to form a shell, and a circuit board located inside the shell. A light receiving component is located on the lower surface of the circuit board. A light transmitting component is located on one side of the circuit board. A first optical channel and a second optical channel are provided on the upper surface of the transmitting shell of the light transmitting component, and a first optical fiber accommodating portion and a second optical fiber accommodating portion are provided on the lower surface of the transmitting shell, for accommodating a first internal optical fiber and a second internal optical fiber. A first optical fiber adapter, a second optical fiber adapter, a third optical fiber adapter and a fourth optical fiber adapter located at the same height are provided in sequence on the first side wall of the transmitting shell. The first optical fiber adapter is connected to the first optical transmitting assembly, and the second optical fiber adapter is connected to the second optical transmitting assembly. A first optical fiber accommodating portion and a second optical fiber accommodating portion are provided on the lower surface of the transmitting shell, and the first optical fiber accommodating portion is connected to the third optical fiber through hole, and the second optical fiber accommodating portion is connected to the third optical fiber through hole. One end of the first internal optical fiber is connected to the third optical fiber adapter, and the other end of the first internal optical fiber is connected to the first receiving assembly; one end of the second internal optical fiber is connected to the fourth optical fiber adapter, and the other end of the second internal optical fiber is connected to the second receiving assembly. Compared with the case where the light emitting component and the light receiving component are arranged on both sides of the same housing, the light module space is reduced by reasonably arranging the positions of the light emitting component and the light receiving component and the center height of the optical port of the optical module, and the light path of the light emitting component is optimized and hard-connected with the optical port of the module; the light receiving component is softly connected with the optical port. Through the above arrangement, the number of optical components used is reduced and the assembly process is simplified. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the products involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0042] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0043] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0044] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0045] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0046] Figure 5 A schematic diagram of the structure of a light emitting component, a light receiving component and a circuit board according to some embodiments of the present disclosure Figure 1 ;

[0047] Figure 6 A schematic diagram of the structure of a light emitting component, a light receiving component and a circuit board according to some embodiments of the present disclosure Figure 2 ;

[0048] Figure 7 A cross-sectional view of a light emitting component, a light receiving component and a circuit board provided according to some embodiments of the present disclosure Figure 1 ;

[0049] Figure 8 An exploded schematic diagram of a light emitting component and a circuit board provided according to some embodiments of the present disclosure;

[0050] Fig. 9 A schematic diagram of an exploded view of a light emitting component provided according to some embodiments of the present disclosure;

[0051] Fig.10 A schematic diagram of a launch housing provided according to some embodiments of the present disclosure Figure 1 ;

[0052] Fig.11 A schematic diagram of a partial structure of a light emitting component and a circuit board provided according to some embodiments of the present disclosure;

[0053] Fig.12 A schematic diagram of a launch housing provided according to some embodiments of the present disclosure Figure 2 ;

[0054] Fig.13 A schematic cross-sectional view of a launch casing according to some embodiments of the present disclosure;

[0055] Fig.14 A cross-sectional view of a light emitting component, a light receiving component and a circuit board provided according to some embodiments of the present disclosure Figure 2 ;

[0056] Fig.15 It is a schematic diagram of another optical module decomposition provided according to some embodiments of the present disclosure;

[0057] Fig.16 A schematic diagram of a circuit board structure provided according to some embodiments of the present disclosure Figure 1 ;

[0058] Fig.17 A schematic diagram of a circuit board structure provided according to some embodiments of the present disclosure Figure 2 ;

[0059] Fig.18A schematic diagram of a circuit board cross-sectional structure provided according to some embodiments of the present disclosure Figure 1 ;

[0060] Fig.19 A schematic diagram of a circuit board cross-sectional structure provided according to some embodiments of the present disclosure Figure 2 ;

[0061] Fig. 20 A schematic cross-sectional view of an optical module provided according to some embodiments of the present disclosure;

[0062] Fig.21 A schematic diagram of a partial structure of a lower housing provided according to some embodiments of the present disclosure;

[0063] Fig. 22 This is a schematic diagram of the partial structure of the upper shell provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0064] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0065] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" implies open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "same", "consistent", and "flush" are not limited to absolute mathematical theoretical relationships, but also include an acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0066] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. Light loaded with information is an optical signal. When optical signals propagate in information transmission equipment, they can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. Information that can be processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission equipment.

[0067] The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is realized through optical modules. For example, an optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0068] Figure 1 FIG. 1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system is partially presented as a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0069] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the direction of the remote information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000, so as to realize long-distance and low-power-loss information transmission.

[0070] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0071] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0072] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional / bidirectional electrical signal connection.

[0073] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and Data Center Server are common host computers.

[0074] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0075] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0076] For example, a first optical signal from the direction of a remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0077] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between optical signals and electrical signals, the information does not change, but the encoding and decoding method of the information can change.

[0078] Figure 21 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structures related to the host computer 100 and the optical module 200 are shown. Figure 2 As shown, the host computer 100 also includes a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-shaped structure is a common protruding structure.

[0079] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0080] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 4 FIG. 1 is an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0081] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0082] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0083] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0084] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold finger 301 of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the host computer; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0085] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the above-mentioned shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components. In addition, when assembling components such as the circuit board 300, the light emitting component 400 and the light receiving component 500, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0086] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0087] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0088] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the snap-fit ​​fixed connection between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0089] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (MOSFET), etc. The chips may include microcontroller units (MCU), laser driver chips, transimpedance amplifiers (TIA), limiting amplifiers, clock and data recovery chips (CDR), power management chips, and digital signal processing (DSP) chips.

[0090] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0091] The circuit board 300 further includes a gold finger 301 formed on the end surface thereof, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0092] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0093] The light emitting component 400 and / or the light receiving component 500 are located on a side of the circuit board 300 away from the gold finger 301; in some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors; in some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board.

[0094] Figure 5A schematic diagram of the structure of a light emitting component, a light receiving component and a circuit board according to some embodiments of the present disclosure Figure 1 . Figure 6 A schematic diagram of the structure of a light emitting component, a light receiving component and a circuit board according to some embodiments of the present disclosure Figure 2 . Figure 7 A cross-sectional view of a light emitting component, a light receiving component and a circuit board provided according to some embodiments of the present disclosure Figure 1 . Figure 5 and Figure 6 The structures of the light emitting components, light receiving components and circuit boards are shown from different angles. Figure 5 , Figure 6 and Figure 7 As shown, in some embodiments, the light emitting component is located on one side of the circuit board, and the light emitting component is plugged into the circuit. The light emitting component includes a first light emitting component 410 and a second light emitting component 420, and the light emitting component faces the upper shell. The light receiving component is located on the lower surface of the circuit board, and the light receiving component faces the lower shell. In order to reduce the thickness of the optical module, the lower surface of the light emitting component is lower than the lower surface of the circuit board, so that the sum of the thickness of the light emitting component, the light receiving component and the circuit board is less than the thickness of the light emitting component and the thickness of the light receiving component. Compared with the light emitting component and the light receiving component being arranged on both sides of the same shell at the same time, the optical module of the example of the present application has a smaller thickness, which is conducive to the miniaturization of the optical module.

[0095] In some embodiments of the present application, the optical receiving component includes a first receiving component 510 and a second receiving component 520. The first receiving component 510 includes a first AWG pigtail assembly, a first optical receiving detector and a first transimpedance amplifier. The first AWG pigtail assembly has a first pigtail, and the first optical receiving detector and the first transimpedance amplifier are located between the first AWG pigtail assembly and the third optical fiber adapter. The first pigtail faces the electrical port direction, and a 180° fiber winding is performed after the coupling is completed. The second receiving component 520 includes a second AWG pigtail assembly 521, a second optical receiving detector group 522 and a second transimpedance amplifier 523. The second AWG pigtail assembly 521 has a second pigtail, and the second optical receiving detector group 522 and the second transimpedance amplifier 523 are located between the second AWG pigtail assembly 521 and the fourth optical fiber adapter 704. The second pigtail faces the electrical port direction, and a 180° fiber winding is performed after the coupling is completed.

[0096] The optical module provided by the present application realizes the optimized optical path of the optical emitting component and the hard connection with the optical port of the module by reasonably arranging the positions of the optical emitting chip, the wavelength division multiplexer and the center height of the optical port of the optical module. At the same time, in the optical receiving component part, a conventional AWG pigtail assembly is used, and the soft connection between the optical receiving component and the optical port is realized by reversely assembling the AWG assembly. Through the above arrangement, the number of optical components used in the optical module is reduced, and the assembly process is simplified.

[0097] For the convenience of expression, in this application, the connection direction between the optical port and the electrical port is defined as the length direction of the optical module, such as the X-axis shown in the figure; the width direction of the circuit board is defined as the width direction of the optical module, such as the Y-axis shown in the figure; the direction perpendicular to the circuit board is defined as the thickness direction of the optical module.

[0098] In some embodiments, the optical fiber adapter assembly of the optical module is provided with four optical fiber adapters, namely, a first optical fiber adapter 701, a second optical fiber adapter 702, a third optical fiber adapter 703, and a fourth optical fiber adapter 704. The optical axes of the first optical fiber adapter 701, the second optical fiber adapter 702, the third optical fiber adapter 703, and the fourth optical fiber adapter 704 are located at the same horizontal height. Among them, the first optical fiber adapter 701 and the second optical fiber adapter 702 are connected to the light emitting component, and the first optical fiber adapter 701 and the second optical fiber adapter 702 are used to transmit the signal light emitted by the light emitting component to the outside of the optical module. The third optical fiber adapter 703 and the fourth optical fiber adapter 704 are connected to the light receiving component 500, and the third optical fiber adapter 703 and the fourth optical fiber adapter 704 are used to transmit the external signal light to the light receiving component 500.

[0099] The optical transmitting component includes a first optical transmitting assembly 410 and a second optical transmitting assembly 420. The first optical transmitting assembly 410 is coupled to the first optical fiber adapter 701, and the second optical transmitting assembly is coupled to the second optical fiber adapter 702. The optical receiving component includes a first receiving assembly 510 and a second receiving assembly 520. The first receiving assembly is coupled to the third optical fiber adapter 703, and the second receiving assembly is coupled to the fourth optical fiber adapter 704.

[0100] The first optical fiber adapter 701, the second optical fiber adapter 702, the third optical fiber adapter 703 and the fourth optical fiber adapter 704 are arranged in sequence along the width direction of the circuit board. The optical axes of the first optical fiber adapter 701, the second optical fiber adapter 702, the third optical fiber adapter 703 and the fourth optical fiber adapter 704 are located at the same horizontal height, so as to avoid the increase of the thickness of the optical module caused by the optical fiber adapters being located at different heights.

[0101] Figure 8 FIG. 1 is a schematic diagram of an exploded view of a light emitting component and a circuit board according to some embodiments of the present disclosure. Figure 8As shown, the optical emission component includes an emission housing 401, and a first optical emission assembly 410 and a second optical emission assembly 420 embedded in the emission housing. One end of a circuit board is embedded in the emission housing 401, and the circuit board is electrically connected to the first optical emission assembly 410 and the second optical emission assembly 420.

[0102] The second side wall of the launch housing 401 is provided with a first opening groove, and one end of the circuit board 300 is inserted into the first opening groove to realize the installation and positioning of the circuit board 300 and the launch housing 401. In this example, the end of the circuit board 300 abuts against the inner wall of the first opening groove 4018, and the depth of the first opening groove 4018 is used to limit the position of the circuit board in the length direction.

[0103] Fig. 9 This is a schematic diagram of an exploded view of a light emitting component provided according to some embodiments of the present disclosure. Figure 8 , Fig. 9 As shown, the upper surface of the launch housing 401 is recessed to form a first optical channel 4051 and a second optical channel 4052. The first side wall of the launch housing 401 is provided with a first optical fiber through hole 4011 and a second optical fiber through hole 4012. The first optical fiber through hole 4011 is communicated with the first optical channel 4051, and the second optical fiber through hole 4012 is communicated with the second optical channel 4052. The first optical fiber adapter 701 is located in the first optical fiber through hole 4011, and one end of the first optical fiber adapter 701 extends out of the launch housing 401 through the first optical fiber through hole 4011, and one end of the second optical fiber adapter 702 extends out of the launch housing 401 through the second optical fiber through hole 4012.

[0104] Fig.10 A schematic diagram of a launch housing provided according to some embodiments of the present disclosure Figure 1 . Fig.11 The figure is a schematic diagram of a partial structure of a light emitting component and a circuit board according to some embodiments of the present disclosure. Fig.12 A schematic diagram of a launch housing provided according to some embodiments of the present disclosure Figure 2 . Fig.10 and Fig.12 The launch shell is displayed from different angles. Fig.13 FIG. 1 is a schematic cross-sectional view of a launch shell according to some embodiments of the present disclosure. Fig.10 , Fig.11 , Fig.12 and Fig.13As shown, one end of the first optical channel 4051 is connected to the first optical fiber through hole 4011, and one end of the first optical channel 4051 is provided with a first lens mounting portion 4031. The first lens 411 is located at the first lens mounting portion 4031. To facilitate the installation of the first lens 411, the width of the first lens mounting portion 4031 is greater than the width of the first lens 411. The first lens 411 is fixedly connected to the housing 401 by optical glue, and to facilitate the fixing of the optical glue, the first lens mounting portion 4031 is provided with a first notch 40311. During the curing process, the UV light enters the emitting housing through the first notch 40311 to accelerate the curing process of the optical glue.

[0105] The bottom of the first lens mounting portion is lower than the bottom of the first optical channel, so that the first lens and the optical axis of the first wavelength division multiplexer are located at the same level.

[0106] A first corner 4032 is provided at the other end of the first optical channel 4051 to increase the width of the first optical channel 4051, which facilitates the installation of the first wavelength division multiplexer 412. The first optical channel 4051 is provided with a first glue groove 40141, and the first wavelength division multiplexer 412 is located above the first glue groove 40141. The first wavelength division multiplexer 412 covers the first glue groove 40141, and the first glue groove 40141 is used to store optical glue. A first overflow glue groove is provided on the side of the first glue groove 40141, and the extra optical glue in the first wavelength division multiplexer 412 and the first glue groove 40141 overflows to the first overflow glue groove to ensure that the first wavelength division multiplexer 412 is parallel to the bottom surface of the first optical channel 4051, which facilitates the unification of the optical axes of the first wavelength division multiplexer 412 and the first lens 411.

[0107] The second optical channel 4052 is provided with a second corner 4042 to increase the width of the second optical channel 4052, which is convenient for the installation of the second wavelength division multiplexer 422. The second optical channel 4052 is provided with a second glue groove 40151, and the second wavelength division multiplexer 422 is located above the second glue groove 40151. The second wavelength division multiplexer 422 covers the second glue groove 40151, and the second glue groove 40151 is used to store optical glue. The second glue groove 40151 is provided with a second overflow glue groove 40152 outside, and the excess optical glue in the second wavelength division multiplexer 422 and the second glue groove 40151 overflows to the second overflow glue groove to ensure that the second wavelength division multiplexer 422 is parallel to the bottom surface of the second optical channel 4052, which is convenient for the unification of the optical axes of the second wavelength division multiplexer 422 and the second lens 421. The first lens mounting portion 4031 is adjacent to the side wall of the transmitting shell 401. The first wavelength division multiplexer combines the light emitted by four different transmitters into one beam, and the outlet of the first wavelength division multiplexer is located at the edge of the first wavelength division multiplexer. That is, the outlet of the first wavelength division multiplexer is adjacent to the upper side wall of the transmitting shell 401 (the side close to the first lower side plate in the figure). The outlet of the first wavelength division multiplexer corresponds to one of the four entrances of the first wavelength division multiplexer. The outlet of the second wavelength division multiplexer is in the same straight line with the laser optical axis at the edge position of the second transmitting component. In the width direction, the central axis of the first lens mounting portion 4031 is located to the right of the central axis of the first wavelength division multiplexer.

[0108] The second wavelength division multiplexer combines the light emitted by four different transmitters into one beam, and the outlet of the second wavelength division multiplexer is located at the edge of the second wavelength division multiplexer. The outlet of the second wavelength division multiplexer corresponds to one of the four inlets of the second wavelength division multiplexer. The outlet of the second wavelength division multiplexer is in the same straight line with the laser optical axis at the edge position of the second transmitting assembly. In the width direction, the central axis of the second lens mounting portion 4041 is located to the right of the central axis of the second wavelength division multiplexer.

[0109] Therefore, the distance between the central axis of the first lens mounting portion 4031 and the upper side wall of the launch housing 401 is smaller than the distance between the central axis of the second lens mounting portion and the lower side wall of the launch housing 401. The edge of the first lens mounting portion 4031 is close to the upper side wall of the launch housing 401, forming a first notch 40311.

[0110] In some embodiments, the optical transmission component includes a first optical transmission component 410 and a second optical transmission component 420, wherein the first optical transmission component 410 includes four lasers and the second optical transmission component 420 includes four lasers. The first wavelength division multiplexer combines the light emitted by the four lasers in the first optical transmission component 410 into one beam and sends it out through the first optical fiber adapter. The second wavelength division multiplexer combines the light emitted by the four lasers in the second optical transmission component 420 into one beam and sends it out through the second optical fiber adapter.

[0111] The light beam carried in the third optical fiber adapter is divided into four beams by the first demultiplexer and received by four optical receiving chips. The light beam carried in the fourth optical fiber adapter is divided into four beams by the second demultiplexer and received by four optical receiving chips.

[0112] In some embodiments, the first fiber optic adapter, the third fiber optic adapter, the second fiber optic adapter and the fourth fiber optic adapter may be arranged sequentially at the same height, or may be presented in two rows, such as the first fiber optic adapter and the third fiber optic adapter are respectively located above the second fiber optic adapter and the fourth fiber optic adapter.

[0113] In some embodiments, the upper surface of the emitting housing is hollowed out to form a first light channel and a second light channel to carry the light emitting device. The lower surface of the emitting housing is hollowed out to form a first light channel and a second light channel to carry the light emitting device.

[0114] In some embodiments of the present application, in order to reduce the width of the launch housing, the first corner and the second corner are in the same direction. In order to minimize the width of the launch housing, the first optical fiber adapter 701 is adjacent to the side wall of the launch housing. However, the first wavelength division multiplexer 412 has a certain angle with the optical axis, and the first wavelength division multiplexer 412 cannot be close to the side wall of the launch housing. In order to facilitate the unification of the optical axis of the first optical launch component, a displacement prism 414 is provided between the first lens 411 and the first wavelength division multiplexer 412 to displace the signal light emitted by the first wavelength division multiplexer 412 to a position adjacent to the side wall of the launch housing, so that the distance between the first optical fiber adapter 701 and the side wall of the launch housing is less than the distance between the first wavelength division multiplexer 412 and the side wall of the launch housing. The displacement prism 414 makes the optical axis of the signal light emitted by the first wavelength division multiplexer 412 reach the first optical fiber adapter.

[0115] In some embodiments of the present application, in order to make the central axis of the first lens 411 and the first wavelength division multiplexer 412 at the same height, the upper surface of the first lens mounting portion 4031 is recessed toward the lower housing, and the upper surface of the first lens mounting portion 4031 is lower than the upper surface of the first optical channel 4051. In order to make the central axis of the second lens 421 and the second wavelength division multiplexer 422 at the same height, the upper surface of the second lens mounting portion 4041 is recessed toward the lower housing, and the upper surface of the second lens mounting portion 4041 is lower than the upper surface of the second optical channel 4052.

[0116] In some embodiments of the present application, the optical housing 401 is further provided with a bearing portion 4016, and the bearing portion 4016 is used to bear the first emitting assembly 413 and the second emitting assembly 423. The first emitting assembly 413 includes optoelectronic devices such as a semiconductor refrigerator and a COC structure, and the height of the first emitting assembly 413 is greater than the thickness of the circuit board. To facilitate the electrical connection between the circuit board and the first emitting assembly 413, the bearing portion 4016 is recessed toward the lower housing.

[0117] The transmitting housing 401 is also provided with a receiving portion 4017, and the circuit board 300 is located above the receiving portion 4017. The upper surface of the circuit board 300 is flush with the upper surface of the first transmitting component 413, so that the connection line between the circuit board 300 and the first transmitting component 413 is as short as possible, which is conducive to reducing impedance and improving communication quality. The upper surface of the circuit board 300 is flush with the upper surface of the second transmitting component 423, so that the connection line between the circuit board 300 and the second transmitting component 423 is as short as possible, which is conducive to reducing impedance and improving communication quality.

[0118] In some embodiments of the present application, the optical axes of the first fiber adapter, the first launch component, the first wavelength division multiplexer and the first lens are located at the same height. The optical axes of the second fiber adapter, the second launch component, the second wavelength division multiplexer and the second lens are located at the same height.

[0119] In some embodiments of the present application, the lower side wall of the launch housing 401 extends to the upper part of the receiving portion 4017, and the first opening groove 4018 is located above the receiving portion 4017. The circuit board 300 is embedded in the first opening groove 4018, and the depth of the first opening groove 4018 is used to define the position of the circuit board in the length direction. The end of the third side wall of the launch housing 401 abuts against the side wall of the receiving portion 4017. The side wall of the circuit board 300 abuts against the end of the third side wall of the launch housing 401.

[0120] In order to achieve the connection between the circuit board 300 and the receiving portion 4017, a connecting glue is provided between the circuit board 300 and the receiving portion 4017. In order to facilitate the use of the connecting glue during the installation process, a second notch 40171 is provided at the end of the receiving portion 4017. The second notch 40171 forms an opening with the lower surface of the circuit board, which facilitates the connecting glue to enter the gap between the circuit board 300 and the receiving portion 4017 through the opening, and the excess connecting glue overflows along the opening.

[0121] The receiving portion 4017 is further provided with an electrical appliance avoidance groove 4019, which is recessed toward the lower shell body so that there is a gap between the electrical appliance avoidance groove 4019 and the circuit board, and the electronic components are accommodated in the gap.

[0122] Fig.14 A cross-sectional view of a light emitting component, a light receiving component and a circuit board provided according to some embodiments of the present disclosure Figure 2 . Fig.14 The arrow in the middle shows the optical path. Fig.14As shown, the lower surface of the transmitting housing is provided with a first optical fiber accommodating portion 4023 and a second optical fiber accommodating portion 4024. The first optical fiber accommodating portion 4023 is communicated with the third optical fiber through hole 4013, the third optical fiber adapter is connected to the first internal optical fiber, the first optical fiber accommodating portion 4023 is used to accommodate the first internal optical fiber, and the first internal optical fiber is connected to the first receiving component. The second optical fiber accommodating portion 4024 is communicated with the fourth optical fiber through hole 4014, the fourth optical fiber adapter 704 is connected to the second internal optical fiber, the second optical fiber accommodating portion 4024 is used to accommodate the second internal optical fiber, and the second internal optical fiber is connected to the second receiving component.

[0123] In some embodiments of the present application, the optical axes of the first fiber adapter, the first launch component, the first wavelength division multiplexer and the first lens are located at the same height. The optical axes of the second fiber adapter, the second launch component, the second wavelength division multiplexer and the second lens are located at the same height.

[0124] The first optical fiber accommodating portion 4023 is used to accommodate the first internal optical fiber and connect the first internal optical fiber to the first receiving assembly. The second optical fiber accommodating portion 4024 is communicated with the fourth optical fiber through hole 4014, and the fourth optical fiber adapter 704 is connected to the second internal optical fiber.

[0125] The first receiving assembly 510 and the second receiving assembly 520 are located on the lower surface of the circuit board. The first receiving assembly 510 and the third optical fiber adapter are not in the same height plane. To facilitate the connection between the first receiving assembly 510 and the third optical fiber adapter, a first optical fiber accommodating portion 4023 is provided on the lower surface of the transmitting housing. The first optical fiber accommodating portion 4023 is communicated with the third optical fiber through hole 4013, and the third optical fiber adapter is connected to the first internal optical fiber. The first optical fiber accommodating portion 4023 is used to accommodate the first internal optical fiber and connect the first internal optical fiber to the first receiving assembly. The first internal optical fiber is bent in the first optical fiber accommodating portion 4023, and the optical axis of the optical receiving component is converted from the height of the first receiving assembly to the height of the third optical fiber adapter.

[0126] The second receiving assembly 520 and the fourth optical fiber adapter are not in the same height plane. To facilitate the connection between the second receiving assembly 520 and the fourth optical fiber adapter, a second optical fiber accommodating portion is provided on the lower surface of the transmitting housing. The second optical fiber accommodating portion is communicated with the fourth optical fiber through hole, the fourth optical fiber adapter is connected to the second internal optical fiber, and the second optical fiber accommodating portion is used to accommodate the second internal optical fiber and connect the second internal optical fiber to the second receiving assembly. The second internal optical fiber is bent in the second optical fiber accommodating portion, and the optical axis of the optical receiving component is converted from the height of the second receiving assembly to the height of the fourth optical fiber adapter.

[0127] In some embodiments, in order to reduce the height difference between the optical fiber and the third optical fiber adapter, the lower surface of the launch housing is further provided with a first optical fiber groove 4021, and one end of the first optical fiber groove 4021 is connected to the first optical fiber accommodating portion 4023. The distance between the bottom of the first optical fiber accommodating portion 4023 and the lower surface of the launch housing is greater than the distance between the bottom of the first optical fiber groove 4021 and the bottom of the launch housing. The first internal optical fiber is bent in the first optical fiber accommodating portion 4023, so that the third optical fiber adapter can be smoothly inserted into the third optical fiber through hole.

[0128] like Fig.14 As shown in the figure, the bottom of the first optical fiber accommodating portion 4023 is lower than the bottom of the first optical fiber groove 4021, and the height of the first optical fiber groove 4021 is between the heights of the receiving component and the optical fiber adapter, so as to make the optical fiber setting smoother and avoid damage to the optical fiber due to sudden changes in height.

[0129] The lower surface of the launch housing is further provided with a second optical fiber groove 4022, one end of which is connected to the second optical fiber accommodating portion 4024. The distance between the lower surface of the second optical fiber accommodating portion 4024 and the lower surface of the launch housing is greater than the distance between the lower surface of the second optical fiber groove 4022 and the lower surface of the launch housing. The second internal optical fiber is bent in the second optical fiber accommodating portion 4024 so that the fourth optical fiber adapter can be smoothly inserted into the fourth optical fiber through hole.

[0130] In some embodiments of the present application, the lower bottom surface of the first optical channel 4051 is lower than the upper bottom surface of the first optical fiber accommodating portion 4023 , which reduces the thickness of the optical module and is conducive to the miniaturization of the optical module.

[0131] In the optical module, the circuit board is provided with a variety of electrical components, so the circuit board is the main component for generating electromagnetic waves. Reducing the leakage of electromagnetic waves generated on the circuit board to the outside of the optical module is beneficial to improving the electromagnetic shielding effect of the optical module and improving communication stability. The present application provides an optical module, which is provided with a first metal area and a second metal area at the electrical port position of the circuit board. The first metal area is connected to the upper shell; the second metal area is connected to the lower shell. The circuit board is provided with a plurality of vias, and the vias conduct the first metal area and the second metal area, so that a mesh shielding wall is formed near the electrical port position of the middle circuit board, dividing the original larger radiation port into several small radiation ports, which can block higher frequency electromagnetic radiation and improve the electromagnetic shielding effect of the optical module.

[0132] Fig.15 A schematic diagram of another optical module decomposition provided according to some embodiments of the present disclosure. Fig.16 A schematic diagram of a circuit board structure provided according to some embodiments of the present disclosure Figure 1 . Fig.17 A schematic diagram of a circuit board structure provided according to some embodiments of the present disclosure Figure 2 . Fig.18 A schematic diagram of a circuit board cross-sectional structure provided according to some embodiments of the present disclosure Figure 1 . Fig.16 and Fig.17 Figure 1 is a schematic diagram of the circuit board structure at different angles. Fig.15 , Fig.16 , Fig.17 , Fig.18 As shown, in order to improve the electromagnetic shielding effect of the electrical port, a first metal area 302 is provided on the upper surface of the circuit board 300, and the first metal area 301 runs through the width direction of the circuit board. A first conductive component 360 is provided between the first metal area 302 and the upper shell. A second metal area is provided on the lower surface of the circuit board 300, and the second metal area 303 runs through the width direction of the circuit board. A second conductive component 370 is provided between the circuit board 300 and the lower shell.

[0133] In the example of the present application, the circuit board has a surface metal layer 310, a bottom metal layer 320 and at least one intermediate metal layer 330. An isolation layer is provided between adjacent metal layers. For example, the circuit board has a surface metal layer 310, a bottom metal layer 320, a first intermediate metal layer 331 and a second intermediate metal layer 332. The surface metal layer 310 is located on the upper surface of the circuit board 300, the bottom metal layer 320 is located on the lower surface of the circuit board 300, and the first intermediate metal layer 331 is located between the surface metal layer 310 and the second intermediate metal layer 332. The second intermediate metal layer 332 is located between the first intermediate metal layer 331 and the bottom metal layer 320.

[0134] The first metal region 301 is not connected to other metal regions of the surface metal layer 310, so as to prevent the circuit from being connected to the upper housing 201. The second metal region 303 is not connected to other metal regions of the bottom metal layer 320, so as to prevent the circuit from being connected to the lower housing 202.

[0135] In order to realize the positioning and installation of the circuit board 300, the circuit board is provided with a first avoidance portion 304 and a second avoidance portion 305. The first avoidance portion 304 and the second avoidance portion 305 are respectively located on both sides of the circuit board, and are used to avoid the studs of the lower shell. The first metal area 302 is located on one side of the first avoidance portion 304, and the first metal area 302 is located on the side of the first avoidance portion 304 and the second avoidance portion 305 facing the electrical port. The second metal area 303 is located on one side of the first avoidance portion 304 and the second avoidance portion 305, and the first metal area 302 is located on the side of the first avoidance portion 304 and the second avoidance portion 305 facing the electrical port.

[0136] Fig.19 A schematic diagram of a circuit board cross-sectional structure provided according to some embodiments of the present disclosure Figure 2 . Fig.19 and Fig.18 Figure 1 is a schematic diagram of the cross section of the circuit board in different directions. Fig.18 As shown, in some examples of the present application, the circuit board 300 is provided with a plurality of vias, and the vias conduct the first metal area 302 and the second metal area 303. For example, the circuit board 300 is provided with a first via 3021, and the first via 3021 is arranged adjacent to the first lower side plate, one end of the first via is connected to the first metal area 302, and the other end of the first via 3021 is connected to the second metal area 303. In some embodiments of the present application, the number of the first vias may be 1, or may be 2 or 3 or other suitable numbers. The specific number of the first vias varies according to the layout of the circuit board, and all are within the protection scope of the present application.

[0137] The circuit board is provided with a second via hole 3023, which is arranged adjacent to the second lower plate 2023, one end of the second via hole 3023 is connected to the first metal region 302, and the other end of the second via hole 3023 is connected to the second metal region 303. The number of the second via holes can be 1, 2, 3 or other suitable numbers.

[0138] The circuit board is further provided with a third via 3022, which is located in the area between the first via 3021 and the second via 3023. One end of the third via 3022 is connected to the first metal area 302, and the other end of the third via 3022 is connected to the second metal area 303. The number of the second vias can be 1, or 2, 3, or other suitable numbers.

[0139] Fig. 20 is a cross-sectional schematic diagram of an optical module provided according to some embodiments of the present disclosure, Fig.21 Schematic diagram of the partial structure of the lower shell provided according to some embodiments of the present disclosure. Fig. 20 and Fig.21 As shown, the lower housing 202 includes a bottom plate 2021 and a first lower side plate 2022 and a second lower side plate 2023 located on both sides of the bottom plate 2021 and arranged perpendicularly to the bottom plate 2021. The lower housing is provided with a first support platform 20221 and a second support platform (not shown in the figure, the second support platform can be symmetrically arranged on the first support platform 20221), and the circuit board is located above the first support platform 20221 and the second support platform. The first support platform 20221 is provided with a first threaded column 20222, and the upper surface of the first threaded column protrudes from the first support platform 20221. The second support platform is provided with a second threaded column, and the upper surface of the second threaded column protrudes from the second support platform.

[0140] A lower shielding plate 2024 is provided between the first supporting platform 20221 and the second supporting platform, and the upper surface of the lower shielding plate is flush with the upper surfaces of the first supporting platform 20221 and the second supporting platform. The lower surface of the circuit board 300 is connected to the upper surface of the first supporting platform 20221, the upper surface of the second supporting platform, and the upper surface of the lower shielding plate 2024.

[0141] In some embodiments, the lower shielding plate 2024 is provided with a lower connecting portion 20242 and a lower bearing portion 20241. The upper surface of the lower bearing portion 20241 is recessed relative to the upper surface of the lower connecting portion 20242. The bottom surface of the second conductive component 370 is connected to the upper surface of the lower bearing portion 20241, and the side surface of the second conductive component 370 abuts against the side wall of the lower connecting portion 20242. The side wall of the lower connecting portion 20242 limits the second conductive component 370 in the length direction of the optical module. The second conductive component 370 is located between the first supporting platform 20221 and the second supporting platform, and the first supporting platform 20221 and the second supporting platform limit the second conductive component 370 in the width direction of the optical module. The circuit board limits the second conductive component 370 in the thickness direction of the optical module.

[0142] Fig. 22 Schematic diagram of the partial structure of the upper shell provided according to some embodiments of the present disclosure. Fig. 22 As shown, the upper shell 201 is provided with a first threaded hole 2012 and a second threaded hole 2014. The first screw is connected to the first threaded column 20222 through the first threaded hole 2012; the second screw is connected to the second threaded column through the second threaded hole 2014. The lower surface of the upper shell 201 is provided with an upper shielding plate 2013. The upper shielding plate 2013 is provided with an upper connecting portion 20132 and an upper bearing portion 20131. Among them, the lower surface of the upper bearing portion 20131 is recessed relative to the lower surface of the upper connecting portion 20132. The top surface of the first conductive component 360 is connected to the lower surface of the upper bearing portion 20131, and the side surface of the first conductive component 360 is against the side wall of the upper connecting portion 20132. The side wall of the upper connecting portion 20132 limits the first conductive component 360 in the length and width directions of the optical module. The first metal area 302 of the circuit board is connected to the first conductive component 360, and the circuit board limits the first conductive component 360 in the thickness direction of the optical module.

[0143] The upper surface of the optical module circuit board 300 provided in some embodiments of the present application is provided with a first metal area 301, and the lower surface of the circuit board 300 is provided with a second metal area. The first metal area 301 is connected to the upper shell 201 through the first conductive component 360; the second metal area 303 is connected to the lower shell 202 through the second conductive component 370. The circuit board 300 is provided with a plurality of vias, and the vias conduct the first metal area 302 and the second metal area 303. Among them, the first via 3021 is adjacent to the first lower side plate, the second via 3023 is adjacent to the second lower side plate 2023, and the third via 3022 is located in the area between the first via 3021 and the second via 3023. The above arrangement forms a mesh shielding wall near the electrical port of the middle circuit board, dividing the original larger radiation port into several small radiation ports, which can block higher frequency electromagnetic radiation and improve the electromagnetic shielding effect of the optical module.

[0144] Since the above embodiments are all described by citing and combining with other embodiments, different embodiments have the same parts, and the same and similar parts between the embodiments in this specification can be referred to each other, and will not be elaborated in detail here.

[0145] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure of the present application. The present application is intended to cover any variation, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the content of the claims.

[0146] The above-described embodiments of the present application do not constitute a limitation on the protection scope of the present application.

Claims

1. An optical module, characterized in that: include: Upper shell; A lower shell, which is covered with the upper shell to form a shell; A circuit board is located between the upper housing and the lower housing; The light receiving component comprises: A first receiving component, located on the lower surface of the circuit board; A second receiving component is located on the lower surface of the circuit board; A light emitting component is located on one side of the circuit board, and the light emitting component includes: An emitting housing, a second side wall of which is provided with a first opening groove, one end of the circuit board is embedded in the first opening groove; an upper surface of the emitting housing is provided with a first optical channel and a second optical channel; a lower surface of the emitting housing is provided with a first optical fiber accommodating portion and a second optical fiber accommodating portion, respectively used to accommodate a first internal optical fiber and a second internal optical fiber; A first light emitting assembly is embedded in the first light channel, and the opening of the first light channel faces the upper housing; A first light emitting assembly is embedded in the second light channel, and the opening of the second light channel faces the upper housing; Wherein, the first side wall of the transmitting housing is provided with a first optical fiber adapter, a second optical fiber adapter, a third optical fiber adapter and a fourth optical fiber adapter located at the same height in sequence; The optical axis of the first optical fiber adapter is at the same height as the optical axis of the first optical emitting assembly, and the optical axis of the second optical fiber adapter is at the same height as the optical axis of the second optical emitting assembly; The lower surface of the transmitting housing is provided with a first optical fiber accommodating portion and a second optical fiber accommodating portion; The first optical fiber accommodating portion is in communication with the third optical fiber through hole, and the second optical fiber accommodating portion is in communication with the third optical fiber through hole; One end of the first internal optical fiber is connected to the third optical fiber adapter via the first optical fiber accommodating portion, and the other end of the first internal optical fiber is connected to the first receiving assembly; One end of the second internal optical fiber is connected to the fourth optical fiber adapter via the second optical fiber accommodating portion, and the other end of the second internal optical fiber is connected to the second receiving component.

2. The optical module according to claim 1, characterized in that: A first lens mounting portion is provided at one end of the first optical channel, and the first lens is located at the first lens mounting portion; The width of the first lens mounting portion is greater than the width of the first lens; A first corner is arranged at the other end of the first optical channel to increase the width of the first optical channel, and the first wavelength division multiplexer is located at the first corner.

3. The optical module according to claim 2, characterized in that: The first optical channel is provided with a first notch, and the first notch is communicated with the first lens mounting portion.

4. The optical module according to claim 1, characterized in that: The transmitting housing further comprises: a bearing portion; an upper surface of the bearing portion is lower than a bottom surface of the first optical channel; The carrying portion is used to carry the first launching component and the second launching component; A receiving portion is located at one side of the bearing portion, and the circuit board is located above the receiving portion; an upper surface of the receiving portion is higher than an upper surface of the bearing portion; An electrical appliance avoidance groove is arranged at the end of the receiving portion, and electronic components are accommodated in the space between the electrical appliance avoidance groove and the circuit board.

5. The optical module according to claim 1, characterized in that: The first receiving component includes: a first AWG pigtail component, a first light receiving detector and a first transimpedance amplifier; The pigtail of the first AWG pigtail assembly faces away from the third fiber optic adapter; The second receiving assembly includes: a second AWG pigtail assembly, a second light receiving detector and a second transimpedance amplifier; The pigtail of the second AWG pigtail assembly faces away from the fourth fiber optic adapter.

6. The optical module according to claim 1, characterized in that: The lower surface of the transmitting housing is provided with a first optical fiber groove and a second optical fiber groove; The first optical fiber groove is in communication with the first optical fiber accommodating portion, and the second optical fiber groove is in communication with the second optical fiber accommodating portion; The distance between the bottom surface of the first optical fiber groove and the lower surface of the transmitting housing is smaller than the distance between the bottom surface of the first optical fiber accommodating portion and the lower surface of the transmitting housing; The distance between the bottom surface of the second optical fiber groove and the lower surface of the launch housing is smaller than the distance between the bottom surface of the second optical fiber accommodating portion and the lower surface of the launch housing.

7. An optical module, characterized in that: include: Upper shell; A lower shell, which is covered with the upper shell to form a shell; A circuit board is located between the upper housing and the lower housing; A light receiving component is located on the lower surface of the circuit board, and the light receiving component includes: a first receiving component; a second receiving component; A light emitting component is located on one side of the circuit board, and the light emitting component includes: The transmitting shell has a second side wall provided with a first opening groove, and one end of the circuit board is embedded in the first opening groove; The upper surface of the transmitting housing is provided with a first optical channel and a second optical channel; the lower surface of the transmitting housing is provided with a first optical fiber accommodating portion and a second optical fiber accommodating portion for accommodating a first internal optical fiber and a second internal optical fiber; A first light emitting assembly is embedded in the first light channel, and the opening of the first light channel faces the upper housing; A first light emitting assembly is embedded in the second light channel, and the opening of the second light channel faces the upper housing; Wherein, the first side wall of the transmitting housing is provided with a first optical fiber adapter, a second optical fiber adapter, a third optical fiber adapter and a fourth optical fiber adapter in sequence; The central axes of the first optical fiber adapter, the second optical fiber adapter, the third optical fiber adapter, and the fourth optical fiber adapter are located on the same straight line; The first optical fiber adapter is connected to the first optical transmission component, and the second optical fiber adapter is connected to the second optical transmission component; One end of the first internal optical fiber is connected to the third optical fiber adapter, and the other end of the first internal optical fiber is connected to the pigtail of the first receiving component; the pigtail of the first receiving component faces away from the third optical fiber adapter; One end of the second internal optical fiber is connected to the fourth optical fiber adapter, and the other end of the second internal optical fiber is connected to the pigtail of the second receiving component; the pigtail of the second receiving component faces away from the fourth optical fiber adapter; the distance between the bottom of the first optical fiber accommodating portion and the upper surface of the transmitting shell is smaller than the distance between the bottom of the first optical channel and the upper surface of the transmitting shell.

8. The optical module according to claim 7, characterized in that: A first lens mounting portion is provided at one end of the first optical channel, and the first lens is located at the first lens mounting portion; The width of the first lens mounting portion is greater than the width of the first lens; A first corner is arranged at the other end of the first optical channel to increase the width of the first optical channel, and the first wavelength division multiplexer is located at the first corner.

9. The optical module according to claim 7, characterized in that: The transmitting housing further comprises: a bearing portion; an upper surface of the bearing portion is lower than a bottom surface of the first optical channel; The carrying portion is used to carry the first launching component and the second launching component; A receiving portion is located at one side of the bearing portion, and the circuit board is located above the receiving portion; an upper surface of the receiving portion is higher than an upper surface of the bearing portion; An electrical appliance avoidance groove is arranged at the end of the receiving portion, and electronic components are accommodated in the space between the electrical appliance avoidance groove and the circuit board.

10. The optical module according to claim 7, characterized in that: The lower surface of the transmitting housing is provided with a first optical fiber groove and a second optical fiber groove; The first optical fiber groove is in communication with the first optical fiber accommodating portion, and the second optical fiber groove is in communication with the second optical fiber accommodating portion; The distance between the bottom surface of the first optical fiber groove and the lower surface of the transmitting housing is smaller than the distance between the bottom surface of the first optical fiber accommodating portion and the lower surface of the transmitting housing; The distance between the bottom surface of the second optical fiber groove and the lower surface of the launch housing is smaller than the distance between the bottom surface of the second optical fiber accommodating portion and the lower surface of the launch housing.

Images