Cooling system and server

Abstract

The invention provides a heat dissipation system and a server, and relates to the field of heat dissipation, the heat dissipation system comprises a liquid cooling component and a connecting component, the liquid cooling component is provided with a liquid cooling channel arranged in the first direction, and the liquid cooling component is used for being connected with a heating component to dissipate heat through the liquid cooling channel; the connecting part is connected with the liquid cooling part, the connecting part is provided with a first side and a second side which are oppositely arranged, the first side is concave towards the second side to form an air cooling channel, the first side is arranged towards the heating part and used for dissipating heat of the heating part, and the liquid cooling part is higher than the air cooling channel in the direction from the first side to the second side; the heat dissipation system provided by the invention is used for dissipating heat of the heating component.

Description

Technical Field

[0001] The present application relates to, but is not limited to, the field of heat dissipation technology, and in particular to a heat dissipation system and a server. Background Art

[0002] The heat dissipation system is used to provide liquid cooling to heat generating components (e.g., computer processors, dual in-line memory modules, power modules, etc.) In the related art, the heat dissipation system is directly attached to the heat generating components for liquid cooling, which makes the overall heat dissipation effect of the heat dissipation system poor. Summary of the invention

[0003] The present application provides a heat dissipation system, which includes a liquid cooling component and a connecting component. The liquid cooling component has a liquid cooling channel arranged along a first direction, and the liquid cooling component is used to connect with a heat-generating component to dissipate heat through the liquid cooling channel; the connecting component is connected to the liquid cooling component, and the connecting component has a first side and a second side arranged opposite to each other, the first side is concave toward the second side to form an air cooling channel, and the first side is arranged toward the heat-generating component to dissipate heat for the heat-generating component; along the direction from the first side to the second side, the liquid cooling component is higher than the air cooling channel.

[0004] In an implementable method provided in the present application, the liquid cooling component includes a plurality of liquid cooling tubes arranged on the connecting component along the second direction, and each liquid cooling tube is higher than the air cooling channel along the direction from the first side toward the second side. The liquid cooling tube has a liquid cooling channel, and an accommodating gap is provided between two adjacent liquid cooling tubes for accommodating the first heating component in the heating component, and at least one of the two liquid cooling tubes forming the accommodating gap is in contact with the first heating component; wherein the second direction and the first direction meet a vertical condition.

[0005] In an implementation method provided in the present application, the connecting component also includes a first connecting component, the first side of the first connecting component is concave toward the second side to form a first channel portion; a second connecting component, the first side of the second connecting component is concave toward the second side to form a second channel portion; the first channel portion and the second channel portion are arranged opposite to each other and have the same direction to form an air-cooling channel arranged along the first direction; the flow direction of the air-cooling channel is the same as or opposite to the flow direction of the liquid-cooling channel.

[0006] In an implementable method provided in the present application, the first connecting component has a liquid inlet diverter pipe, which is respectively connected to the first ends of multiple liquid cooling tubes; the second connecting component has a liquid outlet confluence pipe, which is respectively connected to the second ends of multiple liquid cooling tubes; the liquid inlet diverter pipe, multiple liquid cooling tubes and the liquid outlet confluence pipe are connected to form a liquid cooling circuit; a diverter regulating valve is provided in the liquid inlet diverter pipe, which is used to regulate the flow from the liquid inlet diverter pipe to the multiple liquid cooling tubes; a confluence regulating valve is provided in the liquid outlet confluence pipe, which is used to regulate the flow from the multiple liquid cooling tubes to the liquid outlet confluence pipe; the projection of the air cooling channel along the second direction at least partially overlaps with the projection of the liquid cooling channel in the second direction.

[0007] In an implementable method provided in the present application, a first connecting surface is provided on the first side of the first connecting component, and the first connecting surface is used to contact the second heating component of the heating component, and the projection of the first channel portion along the first direction at least partially covers the second heating component; or; a second connecting surface is provided on the first side of the second connecting component, and the second connecting surface is used to contact the second heating component of the heating component, and the projection of the second channel portion along the first direction at least partially covers the second heating component; the second heating element is located on the heat dissipation path of the connecting component.

[0008] In an implementable method provided in the present application, the heat dissipation system also includes a support bracket, which is connected to the second side of the connecting component, and the support bracket is used to connect the supporting connecting component and the liquid cooling component to the server base. The support bracket has an avoidance channel, and the avoidance channel is arranged corresponding to the air cooling channel to form an air cooling flow channel.

[0009] In an implementable method provided in the present application, the heat dissipation system also includes an auxiliary bracket, which is connected to the second side of the connecting component and inserted in the accommodating gap, one side of the auxiliary bracket is in contact with the side wall of one of the two liquid cooling tubes forming the accommodating gap, and the other side of the auxiliary bracket is used to be in contact with the first heat generating component; the auxiliary bracket is connected to the liquid cooling tube via a heat conducting structure; and / or; the auxiliary bracket is connected to the first heat generating component via a heat conducting structure; and / or; the liquid cooling tube is connected to the first heat generating component via a heat conducting structure.

[0010] In an implementable method provided in the present application, the heat dissipation system includes a liquid cooling plate, which is connected to the second connecting component of the connecting component, the liquid cooling plate is located on the same side of the liquid cooling component and the connecting component, the liquid cooling component is connected to the liquid cooling plate through the second connecting component to form a liquid cooling circuit, and the liquid cooling plate is used to contact the third heating component of the heating component.

[0011] In a second aspect, the present application also provides a server, which includes a server base and a heat dissipation system, wherein a heat-generating component is arranged on the server base, and the heat-dissipating system includes a cooling component and a connecting component, the liquid cooling component has a liquid cooling channel arranged along a first direction, and the liquid cooling component is used to connect with the heat-generating component to dissipate heat through the liquid cooling channel; the connecting component is connected to the liquid cooling component, and the connecting component has a first side and a second side arranged opposite to each other, the first side is concave toward the second side to form an air cooling channel, and the first side is arranged toward the heat-generating component to dissipate heat for the heat-generating component; along the direction from the first side toward the second side, the liquid cooling component is higher than the air cooling channel.

[0012] In an implementable method provided in the present application, a support bracket of the heat dissipation system is connected to a server base to support a connecting component and a liquid cooling component, and the support bracket is arranged corresponding to the heat-generating component along a first direction; the heat-generating component includes at least one of the following: a first heat-generating component, the liquid cooling component of the heat dissipation system is arranged corresponding to the first heat-generating component for heat transfer; a second heat-generating component, the connecting component of the heat dissipation system is arranged corresponding to the second heat-generating component for heat transfer; a third heat-generating component, the liquid cooling plate of the heat dissipation system is arranged corresponding to the third heat-generating component for heat transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A top view of a server provided in an embodiment of the present application;

[0014] Figure 2 A schematic diagram of a partial structure of a server provided in an embodiment of the present application;

[0015] Figure 3 Provided in the embodiments of this application Figure 2 Cross-sectional view of the middle DD;

[0016] Figure 4 Provided in the embodiments of this application Figure 2 Sectional view of EE;

[0017] Figure 5 An exploded schematic diagram of a server provided in an embodiment of the present application;

[0018] Figure 6 An exploded schematic diagram of a heat dissipation system provided in an embodiment of the present application;

[0019] Figure 7 A top view of a heat dissipation system provided in an embodiment of the present application;

[0020] Figure 8 A schematic diagram of the structure of the heat dissipation system of the first perspective provided in the embodiment of the present application without including a water inlet pipe and a water outlet pipe;

[0021] Fig. 9A top view of the heat dissipation system not including a water inlet pipe and a water outlet pipe provided in a first perspective for an embodiment of the present application;

[0022] Fig.10 A front view of the heat dissipation system not including a water inlet pipe and a water outlet pipe, provided from a first perspective for an embodiment of the present application;

[0023] Fig.11 A schematic diagram of the structure of a first connecting assembly that does not include a water inlet pipe and a water outlet pipe for a heat dissipation system provided in an embodiment of the present application;

[0024] Fig.12 A schematic diagram of the structure of the heat dissipation system of the second perspective provided in the embodiment of the present application does not include a water inlet pipe and a water outlet pipe;

[0025] Fig.13 A front view of the heat dissipation system from a second perspective provided in an embodiment of the present application, not including a water inlet pipe and a water outlet pipe;

[0026] Fig.14 A schematic diagram of the structure of a second connecting assembly that does not include a water inlet pipe and a water outlet pipe for a heat dissipation system provided in an embodiment of the present application;

[0027] Fig.15 A schematic diagram of the structure of an auxiliary bracket in a heat dissipation system provided in an embodiment of the present application;

[0028] Fig.16 A schematic diagram of a force simulation structure of a heat dissipation system provided in an embodiment of the present application without including an auxiliary bracket;

[0029] Fig.17 A schematic diagram of a force simulation structure of an auxiliary bracket in a heat dissipation system provided in an embodiment of the present application;

[0030] Fig.18 One of the flow simulation schematic diagrams of the heat dissipation system provided in the embodiment of the present application;

[0031] Fig.19 This is the second flow simulation diagram of the heat dissipation system provided in the embodiment of the present application.

[0032] Description of reference numerals:

[0033] 1-server; 11-server base; 111-first position; 112-second position; 113-third position; 114-fourth position; 115-fifth position; 116-sixth position; 117-high-speed wiring area; 12-heating component; 121-first heating component; 122-second heating component; 123-third heating component; 13-heat dissipation system; 131-liquid cooling component; 1311-liquid cooling pipe; 1312-liquid inlet pipe; 1313-liquid outlet pipe; 1314-first branch pipe; 1315-second branch pipe; 1316-third branch pipe; 1317-fourth branch pipe; 1 32-connecting component; 1321-first connecting component; 13211-liquid inlet shunt pipe; 13212-first channel portion; 1322-second connecting component; 13221-liquid outlet manifold; 13222-second channel portion; 13223-second connecting surface; 133-support bracket; 1331-first support bracket; 1332-second support bracket; 134-auxiliary bracket; 135-heat-conducting structure; 136-liquid cooling plate; 137-threaded connector; 138-air-cooling channel; 1381-air-cooling channel; 1382-avoidance channel; A-first direction; B-second direction; C-third direction. DETAILED DESCRIPTION

[0034] It should be noted that, in the absence of conflict, the embodiments and technical features in the embodiments of the present application can be combined with each other, and the detailed description in the specific implementation method should be understood as an explanation of the purpose of the present application and should not be regarded as an improper limitation on the present application.

[0035] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the specific technical solution of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application, but are not used to limit the scope of the present application.

[0036] In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more.

[0037] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left" and "right" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to the changes in the orientation of the components in the drawings.

[0038] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0039] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0040] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0041] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 The embodiment of the present application provides a heat dissipation system, the heat dissipation system 13 includes a liquid cooling component 131 and a connecting component 132, the liquid cooling component 131 has a liquid cooling channel arranged along a first direction A, the liquid cooling component 131 is used to connect with the heat-generating component 12 to dissipate heat through the liquid cooling channel; the connecting component 132 is connected to the liquid cooling component 131, the connecting component 132 has a first side and a second side arranged opposite to each other, the first side is concave toward the second side to form an air cooling channel 1381, the first side is arranged toward the heat-generating component 12 to dissipate heat for the heat-generating component 12; along the direction from the first side to the second side, the liquid cooling component 131 is higher than the air cooling channel 1381.

[0042] In the embodiment of the present application, the heat dissipation system 13 can be applied in the server 1 to dissipate the heat of the heat-generating components 12 in the server 1; the heat dissipation system 13 can be applied in a workstation to dissipate the heat of the heat-generating components 12 in the workstation; here, the embodiment of the present application does not limit the application scenario of the heat dissipation system 13. In an implementable manner provided in an embodiment of the present application, the heat dissipation system 13 is applied to a server 1, and the heat generating component 12 may be a computer processor (Central Processing Unit, CPU) of the server 1, which is a functional unit for interpreting and executing commands of the server 1, and the heat generating component 12 may be a dual-inline-memory-module (Dual-Inline-Memory-Modules, DIMM) of the server 1, which is a functional unit with storage in the server 1; the heat generating component 12 may be a power supply module (Voltage Regulator Module, VRM) of the server 1, which is a functional unit in the server 1 that converts the DC voltage of the power input into a stable voltage supply required by the processor and other components; of course, the heat generating component 12 may also be any combination of two or three of a computer processor (CPU), a dual-inline-memory module (DIMM) and a power supply module (VRM), and the embodiment of the present application is also not limited to this. In an implementable manner provided in an embodiment of the present application, the heat generating component 12 is a combination of a computer processor (CPU), a dual-inline-memory module (DIMM) and a power supply module (VRM).

[0043] In the embodiment of the present application, the liquid cooling component 131 can be fixed to the server base 11 in the server 1 to which the heating component 12 is plugged, for example, the liquid cooling component 131 can be fixed to the server base 11 by threading, or for another example, the liquid cooling component 131 can be fixed to the server base 11 by snapping; of course, the connecting component 132 can also be fixed to the server base 11 in the server 1 to which the heating component 12 is plugged, for example, the connecting component 132 can be fixed to the server base 11 by threading; for another example, the connecting component 132 can be fixed to the server base 11 by snapping; in addition, the liquid cooling component 131 and the connecting component 132 can be fixed to the server base 11 in the server 1 to which the heating component 12 is plugged at the same time, and the embodiment of the present application does not limit this. In an achievable method provided in the embodiment of the present application, only the connecting component 132 is fixed to the server base 11 in the server 1 to which the heating component 12 is plugged, so that the processing difficulty of setting the connecting structure on the liquid cooling component 131 can be reduced. For example, the connecting component 132 is threadedly fixed to the server base 11, a first threaded hole is opened on the connecting component 132, and a second threaded hole is opened on the server base 11. The threaded connection member 137 (such as a screw) is sequentially passed through the first threaded hole and the second threaded hole to threadably fix the connecting component 132 and the server base 11.

[0044] In the embodiment of the present application, the liquid cooling component 131 refers to a component that provides liquid cooling and heat dissipation for the heat generating component 12. In other words, the liquid in the liquid cooling channel of the liquid cooling component 131 takes away the heat of the heat generating component 12 during the flow. The liquid cooling component 131 may include a liquid cooling tube 1311, which is directly attached to the heat generating component 12, and the liquid cooling tube 1311 is higher than the air cooling channel 1381 along the direction from the first side to the second side. Of course, the liquid cooling component 131 may include a plurality of liquid cooling tubes 1311 arranged along the second direction B, and each liquid cooling tube 1311 is higher than the air cooling channel 1381 along the direction from the first side to the second side. An accommodation gap is provided between two adjacent liquid cooling tubes 1311 for accommodating the heat generating component 12, and at least one of the two liquid cooling tubes 1311 forming the accommodation gap is attached to the liquid cooling component 131, and the second direction B satisfies the vertical condition with the first direction A. In this regard, the embodiment of the present application is also not limited. In one possible implementation provided in the embodiment of the present application, the liquid cooling component 131 includes a liquid cooling tube 1311 .

[0045] In the embodiment of the present application, the liquid cooling component 131 has a liquid cooling channel arranged along the first direction A. The liquid cooling component 131 is used to connect with the heat generating component 12 to dissipate heat through the liquid cooling channel. Here, the first direction A can be the length direction of the heat generating component 12; the first direction A can also be the width direction of the heat generating component 12. This is not limited by the embodiment of the present application. In an implementable method provided in the embodiment of the present application, the first direction A is the length direction of the heat generating component 12.

[0046] In the embodiment of the present application, the liquid cooling component 131 is used to connect with the heat generating component 12 to dissipate heat through the liquid cooling channel. Here, the liquid cooling channel refers to a channel formed inside the liquid cooling component 131 for liquid flow. During the heat dissipation process, liquid is introduced into the liquid cooling channel, and the liquid flows in the liquid cooling channel, thereby driving the heat of the heat generating component 12 in contact with the liquid cooling component to perform liquid cooling. Here, the liquid cooling component 131 is used to connect with the heat generating component 12, which means that the liquid cooling component 131 and the heat generating component 12 need to at least be in contact, for example, the liquid cooling component 131 is used to only abut against the heat generating component 12; for another example, the liquid cooling component 131 and the heat generating component 12 are bonded on the premise of abutting against each other.

[0047] In the embodiment of the present application, the connecting component 132 is connected to the liquid cooling component 131. Here, the connecting component 132 and the liquid cooling component 131 can be integrally formed, for example, the connecting component 132 and the liquid cooling component 131 are integrally formed of a metal material; of course, the connecting component 132 and the liquid cooling component 131 can also be connected by a connecting structure, for example, the connecting component 132 and the liquid cooling component 131 are connected by a snap-fit ​​structure; for another example, the connecting component 132 and the liquid cooling component 131 are connected by a threaded structure. The embodiment of the present application does not limit the connection form of the connecting component 132 and the liquid cooling component 131.

[0048] In the embodiment of the present application, the connecting component 132 has a first side and a second side that are arranged opposite to each other. Here, the direction in which the first side and the second side of the connecting component 132 are arranged opposite to each other is the height direction of the heating component 12. In the figure, the direction from the first side toward the second side is marked as the third direction C. In the embodiment of the present application, the connecting component 132 has a first side and a second side that are arranged opposite to each other. Here, the first side is a side facing the heating component 12, and the second side is arranged opposite to the first side. Correspondingly, the second side is a side away from the heating component 12. The direction from the first side toward the second side refers to a side opposite to the heating component 12 and away from the heating component 12.

[0049] In the embodiment of the present application, the first side is concave toward the second side to form an air cooling channel 1381, and the first side is arranged toward the heat-generating component 12 for dissipating heat from the heat-generating component 12. Here, the formation of the air cooling channel 1381 can perform air cooling on the heat-generating component 12. Secondly, the flow direction of the air cooling channel 1381 can be the same as or opposite to the flow direction of the liquid cooling channel to further increase the heat dissipation efficiency of the heat dissipation system 13.

[0050] In the embodiment of the present application, the liquid cooling component 131 is used to connect with the heat-generating component 12 to dissipate heat through the liquid cooling channel. The first side is concave toward the second side to form an air cooling channel 1381. The first side is arranged toward the heat-generating component 12 to dissipate heat for the heat-generating component 12. Here, the heat-generating component 12 dissipated by the liquid cooling component 131 can be the same component as the heat-generating component 12 dissipated by the air cooling channel 1381, or can be a different component. The embodiment of the present application does not impose any limitation on this.

[0051] In the embodiment of the present application, the connecting component 132 has a first side and a second side that are arranged opposite to each other, and the first side is concave toward the second side to form an air cooling channel. Here, the first side is a side facing the heating component 12, and the second side is arranged opposite to the first side. Correspondingly, the second side is a side away from the heating component 12, and the direction from the first side to the second side refers to the side opposite to the heating component 12 and away from the heating component 12. Further, the first side is concave toward the second side to form an air cooling channel. In one example, a channel can be dug on the first side along the direction from the first side to the second side, and the channel is the air cooling channel. Further, since the liquid cooling component 131 is higher than the air cooling channel 1381 along the direction from the first side toward the second side, correspondingly, the liquid cooling channel in the liquid cooling component 131 is also higher than the air cooling channel, and the flow direction of the liquid cooling channel can be the same as or opposite to the flow direction of the air cooling channel. Here, the flow direction of the liquid cooling channel refers to the flow direction of the liquid in the liquid cooling channel. Similarly, the flow direction of the air cooling channel refers to the flow direction of the air flow in the air cooling channel. The first side is arranged toward the heat generating component 12 for heat dissipation of the heat generating component 12. Here, the first side forms the air cooling channel 1381 toward the second side. The first side is arranged toward the heat generating component 12 for heat dissipation of the heat generating component 12 only by air cooling. Of course, the first side is arranged toward the heat generating component 12 for heat dissipation of the heat generating component 12 while performing air cooling and liquid cooling. This is not limited in the embodiment of the present application. In an achievable method provided in the embodiment of the present application, the first side is arranged toward the heat generating component 12 for heat dissipation of the heat generating component 12 while performing air cooling and liquid cooling, so as to improve the heat dissipation efficiency of the entire heat dissipation system 13.

[0052] In the embodiment of the present application, the liquid cooling component 131 is higher than the air cooling channel 1381 along the direction from the first side to the second side, which means that the liquid cooling component 131 does not block the air cooling channel 1381 along the direction from the first side to the second side, so that the airflow can smoothly enter the air cooling channel 1381.

[0053] The heat dissipation system 13 provided in the embodiment of the present application, in a first aspect, the liquid cooling component 131 in the heat dissipation system 13 has a liquid cooling channel arranged along the first direction A, and the liquid cooling component 131 is used to connect with the heat-generating component 12 to dissipate heat through the liquid cooling channel, so that the liquid cooling component 131 of the heat dissipation system 13 can liquid-cool the heat-generating component 12; in a second aspect, the first side of the connecting component 132 in the heat dissipation system 13 is concave toward the second side to form an air-cooling channel 1381, the first side is not directly in contact with the heat-generating component 12, and the first side is arranged toward the heat-generating component 12 to dissipate heat for the heat-generating component 12, so that the connecting component 132 of the heat dissipation system 13 can at least air-cool the heat-generating component 12; in a third aspect, along the direction from the first side toward the second side, the liquid cooling component 131 is higher than the air-cooling channel 1381, so that the liquid cooling component 131 does not hinder the air-cooling channel 1381, and the wind can smoothly enter the wind flow channel. From the above three aspects, it can be known that the heat dissipation system 13 can perform both liquid cooling and air cooling, and the liquid cooling and air cooling do not hinder each other. The heat dissipation system 13 can support liquid cooling and air cooling mixed cooling, thereby improving the overall heat dissipation efficiency of the heat dissipation system 13. Compared with the technical problem in the related art that the heat dissipation system 13 and the heat-generating component 12 are directly attached to each other for liquid cooling, resulting in poor overall heat dissipation effect of the heat dissipation system 13, the heat dissipation system 13 provided in the embodiment of the present application can perform both liquid cooling and air cooling. In other words, the heat dissipation system 13 can support liquid cooling and air cooling mixed cooling, and at the same time, liquid cooling and air cooling do not hinder each other, thereby improving the overall heat dissipation efficiency of the heat dissipation system 13.

[0054] Reference Figure 5 , Figure 6 , Figure 7 and Figure 8 In a heat dissipation system 13 provided in an embodiment of the present application, a liquid cooling component 131 includes a plurality of liquid cooling tubes 1311 arranged on a connecting component 132 along a second direction B, and each liquid cooling tube 1311 is higher than an air cooling channel 1381 along a direction from a first side toward a second side, and the liquid cooling tube 1311 has a liquid cooling channel, and an accommodation gap is provided between two adjacent liquid cooling tubes 1311 for accommodating a first heating component 121 in a heating component 12, and at least one of the two liquid cooling tubes 1311 forming the accommodation gap is in contact with the first heating component 121; wherein, the second direction B and the first direction A meet a vertical condition.

[0055] In the embodiment of the present application, the liquid cooling component 131 includes a plurality of liquid cooling tubes 1311 arranged on the connecting component 132 along the second direction B. Correspondingly, the liquid cooling channel is a liquid cooling sub-channel formed in each liquid cooling tube 1311. In other words, a liquid cooling sub-channel is formed in each liquid cooling tube 1311, and a plurality of liquid cooling sub-channels are combined into a liquid cooling channel. On this basis, in the direction from the first side toward the second side, each liquid cooling tube 1311 is higher than the air cooling channel. Correspondingly, in the direction from the first side toward the second side, the liquid cooling sub-channel formed in each liquid cooling tube 1311 is also higher than the air cooling channel.

[0056] In the embodiment of the present application, the second direction B and the first direction A meet the perpendicular condition. Here, if the first direction A is the length direction of the heat-generating component 12, the second direction B can be the width direction of the heat-generating component 12; if the first direction A is the width direction of the heat-generating component 12, the second direction B can be the length direction of the heat-generating component 12. The embodiment of the present application does not limit this. In an implementable manner provided in the embodiment of the present application, the first direction A is the length direction of the heat-generating component 12, and the second direction B is the width direction of the heat-generating component 12.

[0057] In the embodiment of the present application, an accommodating gap is provided between two adjacent liquid cooling tubes 1311 for accommodating the first heating component 121 in the heating component 12, and at least one of the two liquid cooling tubes 1311 forming the accommodating gap is fitted along the first heating component 121. Here, one of the two liquid cooling tubes 1311 forming the accommodating gap may be fitted with the first heating component 121; or both of the two liquid cooling tubes 1311 forming the accommodating gap may be fitted along the first heating component 121, and the embodiment of the present application does not limit this.

[0058] In the embodiment of the present application, an accommodation gap is provided between two adjacent liquid cooling tubes 1311 for accommodating the first heating component 121 in the heating component 12. Here, the first heating component 121 may be a computer processor; the first heating component 121 may be a dual in-line memory module; the first heating component 121 may be a power module, which is not limited in the embodiment of the present application. In an implementable manner provided in the embodiment of the present application, the first heating component 121 is a dual in-line memory module.

[0059] In the embodiment of the present application, the liquid cooling component 131 also includes a liquid inlet pipe 1312 and a liquid outlet pipe 1313 respectively connected to multiple liquid cooling tubes 1311. The liquid inlet pipe 1312, multiple liquid cooling tubes 1311 and the liquid outlet pipe 1313 form a liquid cooling circuit. The liquid inlet pipe 1312 is used to provide liquid to the liquid cooling channel of the liquid cooling tube 1311, and the liquid outlet pipe 1313 is used to provide an outlet for the liquid in the liquid cooling channel of the liquid cooling tube 1311.

[0060] On this basis, for example, a plurality of first heating components 121 are plugged into a first position 111 along a second direction B on a server base 11 in the server 1, a plurality of first heating components 121 are plugged into a second position 112 of the server base 11 along the second direction B, a plurality of first heating components 121 are plugged into a third position 113 of the server base 11 along the second direction B, a plurality of fourth heating components are plugged into a fourth position 114 of the server base 11 along the second direction B, the third position 113 and the fourth position 114 are adjacent, and the first position 111 and the third position 113 are adjacent. The second position 112 and the fourth position 114 are adjacent to each other. Correspondingly, the liquid cooling component 131 includes a plurality of liquid cooling tubes 1311 arranged on the connecting component 132 along the second direction B corresponding to the first position 111, and each first heating component 121 corresponding to the first position 111 is plugged into the accommodation gap formed by the two adjacent liquid cooling tubes 1311; the liquid cooling component 131 also includes a plurality of liquid cooling tubes 1311 arranged on the connecting component 132 along the second direction B corresponding to the second position 112, and each first heating component 121 corresponding to the second position 112 is plugged into the adjacent The liquid-cooling component 131 further includes a plurality of liquid-cooling tubes 1311 arranged on the connecting component 132 along the second direction B at the corresponding third position 113, and each first heating component 121 at the corresponding third position 113 is plugged into the accommodating gap formed by the two adjacent liquid-cooling tubes 1311; the liquid-cooling component 131 further includes a plurality of liquid-cooling tubes 1311 arranged on the connecting component 132 along the second direction B at the corresponding fourth position 114, and each first heating component 121 at the corresponding fourth position 114 is plugged into the accommodating gap formed by the two adjacent liquid-cooling tubes 1311. In the accommodating gap formed by the cold pipe 1311, the liquid inlet pipe 1312, multiple liquid cooling pipes 1311 located at the third position 113, multiple liquid cooling pipes 1311 located at the first position 111, and the liquid outlet pipe 1313 form a first liquid cooling circuit; the liquid inlet pipe 1312, multiple liquid cooling pipes 1311 located at the fourth position 114, multiple liquid cooling pipes 1311 located at the second position 112, and the liquid outlet pipe 1313 form a second liquid cooling circuit. Here, it should be supplemented that a connecting component 132 is correspondingly provided for the multiple liquid cooling pipes 1311 at each position. On this basis, since the third position and the fourth position are adjacent, the multiple liquid cooling tubes corresponding to the third position 113 arranged along the second direction B on the connecting component 132 and the multiple liquid cooling tubes corresponding to the fourth position 114 arranged along the second direction B on the connecting component 132 can be formed separately or integrally. In this regard, the embodiments of the present application are not limited. In an implementable method provided in the embodiments of the present application, the multiple liquid cooling tubes corresponding to the third position 113 arranged along the second direction B on the connecting component 132 and the multiple liquid cooling tubes corresponding to the fourth position 114 arranged along the second direction B on the connecting component 132 are integrally formed. In this way, the later installation time can be saved.

[0061] In an implementable method provided in an embodiment of the present application, an example is given in which a plurality of first heating components 121 are plugged in at a first position 111 on a server base 11 along a second direction B to dissipate heat. The liquid cooling component 131 includes a plurality of liquid cooling tubes 1311 arranged on a connecting component 132 along a second direction B corresponding to the first position 111. Each first heating component 121 corresponding to the first position 111 is plugged in an accommodation gap formed by two adjacent liquid cooling tubes 1311. A liquid inlet pipe 1312 provides liquid to a liquid cooling sub-channel in each liquid cooling tube 1311. A liquid outlet pipe 1311 is used to provide an outlet for a liquid cooling sub-channel in each liquid cooling tube 1311. Liquid enters the liquid cooling sub-channel from the liquid inlet pipe. In the process of flowing from the liquid cooling sub-channel to the liquid outlet pipe 1313, the liquid in the liquid cooling sub-channel absorbs the heat of the first heating component 121 in contact with the liquid cooling tube 1311, thereby achieving heat dissipation of the first heating component.

[0062] The heat dissipation system 13 provided in the embodiment of the present application, the liquid cooling component 131 includes a plurality of liquid cooling tubes 1311 arranged on the connecting component 132 along the second direction B. Here, the arrangement of the plurality of liquid cooling tubes 1311 and the accommodation gap between two adjacent liquid cooling tubes 1311 is similar to the arrangement of a plurality of comb teeth on a comb and the shape of a gap between two adjacent comb teeth. Therefore, the arrangement of the plurality of liquid cooling tubes 1311 arranged on the connecting component 132 along the second direction can also be called a comb-tooth arrangement, and an accommodation gap is provided between two adjacent liquid cooling tubes 1311 for accommodating the first heating component 121 in the heating component 12, and then forming At least one of the two liquid cooling tubes 1311 in the accommodating gap is fitted along the first heat generating component 121 to liquid-cool the first heat generating component 121 in the heat generating component 12; on this basis, along the direction from the first side toward the second side, each liquid cooling tube 1311 is higher than the air cooling channel 1381, along the first direction A and the second direction B, each liquid cooling tube 1311 does not overlap with the air cooling channel, and the air cooling channel 1381 formed by the concave first side toward the second side is not blocked by multiple liquid cooling tubes 1311. In other words, when the airflow in the air cooling channel enters, each liquid cooling tube 1311 will not hinder the airflow, so that the airflow can fully flow through the air cooling channel 1381.

[0063] Reference Fig. 9 , Fig.10 , Fig.11 as well as Fig.12 , Fig.13 , Fig.14The embodiment of the present application provides a heat dissipation system 13, wherein the connecting component 132 further includes a first connecting component 1321, wherein the first side of the first connecting component 1321 is concave toward the second side to form a first channel portion 13212; a second connecting component 1322, wherein the first side of the second connecting component 1322 is concave toward the second side to form a second channel portion 13222; the first channel portion 13212 and the second channel portion 13222 are arranged opposite to each other and in the same direction to form an air-cooling channel 1381 arranged along the first direction A; the flow direction of the air-cooling channel 1381 is the same as or opposite to the flow direction of the liquid-cooling channel.

[0064] In the embodiment of the present application, the first side of the first connecting component 1321 is concave toward the second side to form a first channel portion 13212, and the first side of the second connecting component 1322 is concave toward the second side to form a second channel portion 13222. The first channel portion 13212 and the second channel portion 13222 are arranged opposite to each other and face the same direction to form a wind-cooling channel 1381 arranged along the first direction A. Here, the inner contour shape of the first channel portion 13212 and the inner contour shape of the second channel portion 13222 can be the same, for example, the inner contour shape of the first channel portion 13212 and the inner contour shape of the second channel portion 13222 are both cylindrical; of course, the inner contour shape of the first channel portion 13212 may also be different from the inner contour shape of the second channel portion 13222, for example, the inner contour shape of the first channel portion 13212 is cylindrical, and the inner contour shape of the second channel portion 13222 is a cube. This is not limited to the embodiment of the present application. In an implementable method provided in an embodiment of the present application, the inner contour shape of the first channel portion 13212 is the same as the inner contour shape of the second channel portion 13222. On the one hand, it is convenient for processing and manufacturing, and on the other hand, it is also for the convenience of the relative setting of the first channel portion 13212 and the second channel portion 13222.

[0065] In the embodiment of the present application, the dimension of the first channel portion 13212 that is concave along the first side of the first connecting component 1321 toward the second side can be the same as the dimension of the second channel portion 13222 that is concave along the first side of the second connecting component 1322 toward the second side; the dimension of the first channel portion 13212 that is concave along the first side of the first connecting component 1321 toward the second side can also be larger than the dimension of the second channel portion 13222 that is concave along the first side of the second connecting component 1322 toward the second side; the dimension of the first channel portion 13212 that is concave along the first side of the first connecting component 1321 toward the second side can also be smaller than the dimension of the second channel portion 13222, and the embodiment of the present application does not impose any restrictions on this. In an implementable method provided in an embodiment of the present application, the dimension of the first channel portion 13212 that is concave along the first side of the first connecting component 1321 toward the second side is equal to the dimension of the second channel portion 13222 that is concave along the first side of the second connecting component 1322 toward the second side, so that the flow rate of the wind flowing in from the first channel portion 13212 can be the same as the flow rate of the wind flowing out from the second channel portion 13222, or the flow rate of the wind flowing in from the second channel portion 13222 can be the same as the flow rate of the wind flowing out from the first channel portion 13212.

[0066] In the embodiment of the present application, if the cold air flows into the first channel portion 13212, and the hot air flows out from the second channel portion 13222 after absorbing the first heat-generating component 121, and the flow rate of the air flowing into the first channel portion 13212 is the same as the flow rate of the air flowing out of the second channel portion 13222, hot air will not accumulate in the air-cooling channel or the cold air will be insufficient, thereby accelerating the heat dissipation of the heat dissipation system 13; and the flow rate of the air flowing into the first channel portion 13212 is greater than the flow rate of the air flowing out of the second channel portion 13222, so that hot air accumulates in the air-cooling channel, and the heat dissipation effect of the heat dissipation system is poor; and when the flow rate of the air flowing into the first channel portion 13212 is less than the flow rate of the air flowing out of the first channel portion 13212, less cold air enters the air-cooling channel, and the heat dissipation effect of the heat dissipation system is poor.

[0067] Furthermore, the flow rate can be set by making the dimension of the first channel portion 13212 that is concave along the first side of the first connecting component 1321 toward the second side different from or the same as the dimension of the second channel portion 13222 that is concave along the first side of the second connecting component 1322 toward the second side; the flow rate can also be set by making the dimension of the first channel portion 13212 along the arrangement direction of the multiple liquid cooling tubes 1311 along the second direction B different from or the same as the dimension of the second channel portion 13222 along the arrangement direction of the multiple liquid cooling tubes along the second direction B.

[0068] In an implementable method provided in an embodiment of the present application, only the connecting component 132 is fixed to the server base 11 in the server 1 provided with the heat generating component 12. For example, the first connecting component 1321 and the second connecting component 1322 can be respectively threadedly fixed to the server base 11, a first threaded hole is opened on the first connecting component 1321, a second threaded hole is opened on the second connecting component 1322, and two third threaded holes are opened on the server base 11, and two threaded connectors 137 (such as screws) are respectively passed through the first threaded hole and the third threaded hole, and the second threaded hole and the third threaded hole in sequence to threadably fix the connecting component 132 to the server base 11.

[0069] The heat dissipation system 13 provided in the embodiment of the present application further improves the overall heat dissipation efficiency of the heat dissipation system 13 by arranging the first channel portion 13212 and the second channel portion 13222 opposite to each other and in the same direction to form an air cooling channel 1381 arranged along the first direction A, and the flow direction of the air cooling channel 1381 is the same as or opposite to that of the liquid cooling channel.

[0070] In the embodiment of the present application, if the flow direction of the air-cooling channel 1381 is the same as that of the liquid-cooling channel, the liquid in the liquid-cooling channel is a non-heat-absorbing liquid when it just flows through the first heat-generating component 121 to dissipate heat, and the wind flow in the air-cooling channel 1381 is a cold wind flow when it just flows through the first heat-generating component 121 to dissipate heat. In the process of flowing through the first heat-generating component 121, the wind flow in the air-cooling channel can also absorb the heat on the liquid-cooling component 131, thereby accelerating the heat dissipation; if the flow direction of the wind flow channel 1381 is the same as that of the liquid-cooling channel, the liquid in the liquid-cooling channel is a non-heat-absorbing liquid when it just flows through the first heat-generating component 121 to dissipate heat, and the wind flow in the air-cooling channel 1381 is a cold wind flow when it just flows through the first heat-generating component 121 to dissipate heat. The air-cooling channel can only dissipate heat for other heat-generating components 12, and the heat dissipation efficiency is poor.

[0071] Reference Figure 5 , Figure 6 , Figure 7 and Figure 8The embodiment of the present application provides a heat dissipation system 13, wherein the first connecting component 1321 has a liquid inlet manifold 13211, and the liquid inlet manifold 13211 is respectively connected to the first ends of the plurality of liquid cooling tubes 1311; the second connecting component 1322 has a liquid outlet manifold 13221, and the liquid outlet manifold 13221 is respectively connected to the second ends of the plurality of liquid cooling tubes 1311; the liquid inlet manifold 13211, the plurality of liquid cooling tubes 1311, and the liquid outlet manifold 13221 The connection is used to form a liquid cooling circuit; a diversion regulating valve is provided in the liquid inlet diversion pipe 13211, and the diversion regulating valve is used to regulate the flow from the liquid inlet diversion pipe 13211 to the multiple liquid cooling pipes 1311; a confluence regulating valve is provided in the liquid outlet confluence pipe 13221, and the confluence regulating valve is used to regulate the flow from the multiple liquid cooling pipes 1311 to the liquid outlet confluence pipe 13221; the projection of the air cooling channel 1381 along the second direction B at least partially overlaps with the projection of the liquid cooling channel in the second direction B.

[0072] In the embodiment of the present application, the heat dissipation system 13 also includes a liquid inlet pipe 1312 and a liquid outlet pipe 1313. The liquid inlet pipe 1312 is connected to the liquid inlet shunt pipe 13211, and the liquid inlet pipe 1312 is used to provide liquid to the liquid inlet shunt pipe 13211; the liquid outlet pipe 1313 is connected to the liquid inlet shunt pipe 13211, and the liquid outlet pipe 1313 provides an outlet for the liquid located at the liquid outlet conduit 13221. The liquid inlet pipe 1312, the liquid inlet shunt pipe 13211, a plurality of liquid cooling pipes 1311, the liquid outlet conduit 13221 and the liquid outlet pipe 1313 form a liquid cooling circuit.

[0073] In the embodiment of the present application, the liquid cooling component 131 has a liquid cooling channel along the first direction A, and the liquid cooling component 131 has a plurality of liquid cooling tubes 1311 arranged on the connecting component 132 along the second direction B, then the first end and the second end of the plurality of liquid cooling tubes 1311 should be the two ends of the plurality of liquid cooling tubes 1311 along the first direction B.

[0074] In the embodiment of the present application, the liquid inlet diverter pipe 13211 is respectively connected to the first ends of the multiple liquid cooling tubes 1311, which means that the liquid in the liquid inlet diverter pipe 13211 can enter the first ends of the multiple liquid cooling tubes 1311. In addition, in order to facilitate fixation, the liquid inlet diverter pipe 13211 can also be fixed on the first ends of the multiple liquid cooling tubes 1311 while ensuring that the liquid in the liquid inlet diverter pipe 13211 can enter the first ends of the multiple liquid cooling tubes 1311.

[0075] In the embodiment of the present application, the liquid outlet manifold 13221 is respectively connected to the second ends of the multiple liquid cooling tubes 1311, which means that the liquid at the second ends of the multiple liquid cooling tubes 1311 can all enter the liquid outlet manifold 13221. In addition, for the convenience of fixation, the liquid outlet manifold 13221 can also be fixed on the second ends of the multiple liquid cooling tubes 1311 while ensuring that the liquid at the second ends of the multiple liquid cooling tubes 1311 can all enter the liquid outlet manifold 13221.

[0076] Further, for example, a plurality of first heating components 121 are plugged into a first position 111 along a second direction B on a server base 11 in a server 1, a plurality of first heating components 121 are plugged into a second position 112 of the server base 11 along a second direction B, a plurality of first heating components 121 are plugged into a third position 113 of the server base 11 along a second direction B, a plurality of first heating components 121 are plugged into a fourth position 114 of the server base 11 along a second direction B, the third position 113 is adjacent to the fourth position 114, the first position 111 is adjacent to the third position 113, the second position 112 is adjacent to the fourth position 114, and correspondingly, the liquid cooling component 131 includes a plurality of liquid cooling pipes 1311 arranged on a connecting component 132 along the second direction B at the corresponding first position 111, and each first heating component 121 at the corresponding first position 111 is plugged into two adjacent liquid The liquid-cooling component 131 also includes a plurality of liquid-cooling tubes 1311 arranged on the connecting component 132 along the second direction B at the corresponding second position 112, and each first heating component 121 at the corresponding second position 112 is inserted into the accommodation gap formed by two adjacent liquid-cooling tubes 1311; the liquid-cooling component 131 also includes a plurality of liquid-cooling tubes 1311 arranged on the connecting component 132 along the second direction B at the corresponding third position 113, and each first heating component 121 at the corresponding third position 113 is inserted into the accommodation gap formed by two adjacent liquid-cooling tubes 1311; the liquid-cooling component 131 also includes a plurality of liquid-cooling tubes 1311 arranged on the connecting component 132 along the second direction B at the corresponding fourth position 114, and each first heating component 121 at the corresponding fourth position 114 is inserted into the accommodation gap formed by two adjacent liquid-cooling tubes 1311.

[0077] Furthermore, the liquid inlet pipe 1312, a plurality of liquid cooling tubes 1311 located at the third position 113, a plurality of liquid cooling tubes 1311 located at the first position 111, and the liquid outlet pipe 1313 form a first liquid cooling circuit; the liquid inlet pipe 1312, a plurality of liquid cooling tubes 1311 located at the fourth position 114, a plurality of liquid cooling tubes 1311 located at the second position 112, and the liquid outlet pipe 1313 form a second liquid cooling circuit, and the first ends of the plurality of liquid cooling tubes 1311 at the first position 111, the plurality of liquid cooling tubes 1311 at the second position 112, the plurality of liquid cooling tubes 1311 at the third position 113, and the plurality of liquid cooling tubes 1311 at the fourth position 114 are all provided with a liquid inlet diversion pipe 13211, and the second ends are all provided with a liquid outlet confluence pipe 13221.

[0078] Correspondingly, when the liquid in the liquid inlet pipe 1312 needs to enter the multiple liquid cooling pipes 1311 located at the third position 113, the liquid inlet shunt pipe 13211 connected to the multiple liquid cooling pipes 1311 located at the third position 113 adjusts the flow rate of the liquid inlet pipe 1312 to the multiple liquid cooling pipes 1311 located at the third position 113, and when the liquid in the multiple liquid cooling pipes 1311 located at the third position 113 flows through the multiple liquid cooling pipes 1311 located at the first position 111, the liquid in the multiple liquid cooling pipes 1311 located at the third position 113 first passes through the liquid outlet confluence pipe 13221 connected to the multiple liquid cooling pipes 1311 located at the third position 113 to adjust the flow rate of the liquid inlet pipe 1312 to the multiple liquid cooling pipes 1311 located at the third position 113. The multiple liquid cooling tubes 1311 at the first position 113 converge into the first branch tube 1314, and the liquid reaches the liquid inlet shunt tube 13211 connected to the multiple liquid cooling tubes 1311 at the first position 111 through the first branch tube 1314 to adjust the flow rate of the first branch tube 1314 to the multiple liquid cooling tubes 1311 at the first position 111, and the liquid in the multiple liquid cooling tubes 1311 at the first position 111 first passes through the liquid outlet converging tube 13221 connected to the multiple liquid cooling tubes 1311 at the first position 111 to adjust the multiple liquid cooling tubes 1311 at the first position 111 to converge into the second branch tube 1315, and the liquid reaches the liquid outlet tube 1313 through the second branch tube 1315.

[0079] Similarly, when the liquid in the liquid inlet pipe 1312 needs to enter the multiple liquid cooling pipes 1311 located at the fourth position 114, the liquid inlet diverter pipe 13211 connected to the multiple liquid cooling pipes 1311 located at the fourth position 114 adjusts the flow rate of the liquid inlet pipe 1312 to the multiple liquid cooling pipes 1311 located at the fourth position 114, and when the liquid in the multiple liquid cooling pipes 1311 located at the fourth position 114 flows through the multiple liquid cooling pipes 1311 located at the second position 112, the liquid in the multiple liquid cooling pipes 1311 located at the fourth position 114 first flows through the liquid outlet confluence pipe 13221 connected to the multiple liquid cooling pipes 1311 located at the fourth position 114 to converge to the third branch pipe 1316, and the liquid flows through the second branch pipe 1316. 15 reaches the liquid inlet shunt pipe 13211 connected to the multiple liquid-cooling tubes 1311 located at the second position 112 to adjust the flow of the third branch pipe 1316 to the multiple liquid-cooling tubes 1311 located at the second position 112. The liquid in the multiple liquid-cooling tubes 1311 located at the second position 112 first flows through the liquid outlet confluence pipe 13221 connected to the multiple liquid-cooling tubes 1311 located at the second position 112 to adjust the multiple liquid-cooling tubes 1311 located at the second position 112 to converge to the fourth branch pipe 1317. The liquid reaches the liquid outlet pipe 1313 through the fourth branch pipe 1317. Here, it should be supplemented that the multiple liquid-cooling tubes 1311 arranged along the second direction B corresponding to each position each correspond to a connecting component 132 (a first connecting component 1321 and a second connecting component 1322).

[0080] In an embodiment of the present application, a diverter regulating valve is provided in the liquid inlet diverter pipe 13211, and the diverter regulating valve is used to adjust the flow from the liquid inlet diverter pipe 13211 to the multiple liquid cooling pipes 1311. For example, the diverter regulating valve can adjust the diameter of the diverter pipe to each liquid cooling pipe 1311 to adjust the flow from the liquid inlet diverter pipe 13211 to the multiple liquid cooling pipes 1311; similarly, a confluence regulating valve is provided in the liquid outlet confluence pipe 13221, and the confluence regulating valve is used to adjust the flow from the multiple liquid cooling pipes 1311 to the liquid outlet confluence pipe 13221. For example, the confluence regulating valve can adjust the diameter of each liquid cooling pipe 1311 to the confluence regulating pipe to adjust the energy from the multiple liquid cooling pipes 1311 to the confluence regulating valve.

[0081] The heat dissipation system 13 provided in the embodiment of the present application is provided with a shunt regulating valve in the liquid inlet shunt pipe 13211, the shunt regulating valve is used to regulate the flow from the liquid inlet shunt pipe 13211 to the multiple liquid cooling pipes 1311, and a confluence regulating valve is provided in the liquid outlet confluence pipe 13221, the confluence regulating valve is used to regulate the flow from the multiple liquid cooling pipes 1311 to the liquid outlet confluence pipe 13221, so as to reduce the possibility that the multiple liquid cooling pipes 1311 have large differences due to different distances from the liquid inlet pipe 1312 or the liquid outlet pipe 1313, so that the flow resistance and liquid flow between the multiple liquid cooling pipes 1311 are uniform. In an implementable method provided in the embodiment of the present application, refer to Fig.18 and Fig.19 , a flow uniformity simulation was performed on the heat dissipation system 13, and the simulation results showed that the flow difference between the multiple liquid cooling tubes 1311 was within ten percent.

[0082] In the embodiment of the present application, a shunt regulating valve is provided in the liquid inlet shunt pipe 13211, and the shunt regulating valve is used to adjust the flow from the liquid inlet shunt pipe 13211 to the multiple liquid cooling pipes 1311. For example, the shunt regulating valve can be a baffle plate provided between the liquid inlet shunt pipe 13211 and each liquid cooling pipe 1311, and the baffle plate can control the flow diameter between the liquid inlet shunt pipe 13211 and each liquid cooling pipe 1311. For example, if one of the liquid cooling pipes 1311 is far away from the liquid inlet shunt pipe 13211, the baffle plate located there will hinder the flow diameter of the liquid inlet shunt pipe 13211 to the liquid cooling pipe 1311 to a lesser extent. In other words, the liquid inlet shunt pipe 13211 and the liquid cooling pipe 1311 at a farther distance are relatively close. 1 has a larger flow tube diameter. Correspondingly, if one of the liquid-cooling tubes 1311 is closer to the liquid inlet diverter tube 13211, the degree to which the baffle located there hinders the flow tube diameter from the liquid inlet diverter tube 13211 to the liquid cooling tube 1311 is smaller. In other words, the flow tube diameter between the liquid inlet diverter tube 13211 and the liquid cooling tube 1311 at the closer location is smaller. In short, as the distance between the multiple liquid-cooling tubes 1311 and the liquid inlet diverter tube 13211 becomes farther, the degree of obstruction of the baffles corresponding to the multiple liquid-cooling tubes 1311 between the liquid cooling tube 1311 and the liquid inlet diverter tube 13211 becomes greater, and the flow tube diameter between the multiple liquid-cooling tubes 1311 and the corresponding liquid inlet diverter tube 13211 becomes smaller and smaller.

[0083] In the embodiment of the present application, a confluence regulating valve is provided in the liquid outlet manifold 13221, and the confluence regulating valve is used to regulate the flow from the plurality of liquid cooling tubes 1311 to the liquid outlet manifold 13221. By way of example, the confluence regulating valve can be a baffle provided between the liquid outlet manifold 13221 and each liquid cooling tube 1311, and the baffle can control the flow diameter between the liquid outlet manifold 13221 and each liquid cooling tube 1311. By way of example, if one of the liquid cooling tubes 1311 is farther from the liquid outlet manifold 13221, the baffle located there will less hinder the flow diameter from the liquid outlet manifold 13221 to the liquid cooling tube 1311. In other words, the liquid outlet manifold 13221 and the liquid cooling tube 1311 farther away will be connected. The flow tube diameter between them is larger. Correspondingly, if one of the liquid cooling tubes 1311 is closer to the liquid outlet manifold 13221, the baffle located there will less hinder the flow tube diameter from the liquid outlet manifold 13221 to the liquid cooling tube 1311. In other words, the flow tube diameter between the liquid inlet diversion tube 13211 and the liquid cooling tube 1311 at the closer location is smaller. In short, as the distance between the multiple liquid cooling tubes 1311 and the liquid outlet manifold 13221 increases, the baffles corresponding to the multiple liquid cooling tubes 1311 will hinder the flow between the liquid cooling tube 1311 and the liquid outlet manifold 13221 to a greater extent, and the flow tube diameter between the multiple liquid cooling tubes 1311 and the corresponding liquid outlet manifold 13221 will become smaller and smaller.

[0084] Reference Fig. 9 , Fig.10 , Fig.11 as well as Fig.12 , Fig.13 , Fig.14 , an embodiment of the present application provides a heat dissipation system 13, wherein a first connecting surface is provided on the first side of a first connecting component 1321, and the first connecting surface is used to contact the second heating component 122 of the heating component 12, and the projection of the first channel portion 13212 along the first direction A at least partially covers the second heating component 122; or; a second connecting surface 13223 is provided on the first side of the second connecting component 1322, and the second connecting surface 13223 is used to contact the second heating component 122 of the heating component 12, and the projection of the second channel portion 13222 along the first direction A at least partially covers the second heating component 122; the second heating component 122 is located on the heat dissipation path of the connecting component 132.

[0085] In the embodiment of the present application, the second heating component 122 of the heating component 12 can be a computer processor; the second heating component 122 can be a dual in-line memory module; the second heating component 122 can be a power module, which is not limited in the embodiment of the present application. In an implementable manner provided in the embodiment of the present application, the second heating component 122 is a power module.

[0086] In the embodiment of the present application, a first connecting surface is provided on the first side of the first connecting component 1321, and the first connecting surface is used to contact the second heating component 122 of the heating component 12. Here, the first side is the side facing the heating component 12, and the first connecting surface of the first side is also the side facing the heating component. Here, the first connecting surface is used to contact the second heating component 122 of the heating component 12, which means that the surface on the first side of the first connecting component 1321 that contacts the second heating component 122 of the heating component 12 is called the first connecting surface.

[0087] In the embodiment of the present application, the first connecting surface can be a first convex surface, which refers to a surface that is raised in the direction of the heat-generating component 12, and the first convex surface is used to cooperate and contact with the concave surface of the second heat-generating component 122 of the heat-generating component 12; the first connecting surface can also be a first concave surface, which refers to a surface that is recessed in the direction of the heat-generating component 12, and the first concave surface is used to cooperate and contact with the convex surface of the second heat-generating component 122 of the heat-generating component 12. Of course, the first connecting surface can also be a first plane, which refers to a surface that is neither raised nor recessed in the direction of the heat-generating component, and the first plane is used to cooperate and contact with the plane of the second heat-generating component 122 of the heat-generating component 12. The embodiment of the present application does not limit this.

[0088] In the embodiment of the present application, the projection of the first channel portion 13212 along the first direction A at least partially covers the second heat generating component 122. Here, the projection of the first channel portion 13212 along the first direction A may cover a portion of the second heat generating component 122, or the projection of the first channel portion 13212 along the first direction A may cover the entire second heat generating component 122. The embodiment of the present application does not limit this.

[0089] In the embodiment of the present application, the projection of the first channel portion 13212 along the first direction A at least partially covers the second heat generating component 122. Here, the projection of the first channel portion 13212 along the first direction A covers a portion of the second heat generating component 122. At this time, the first channel portion 13212 can perform air cooling and liquid cooling on the second heat generating component, which can also accelerate the heat dissipation of the second heat generating component 122. Of course, the projection of the first channel portion 13212 along the first direction A can completely cover the second heat generating component 122. At this time, the contact area between the first channel portion 13212 and the second heat generating component is increased, which can also accelerate the heat dissipation of the second heat generating component.

[0090] In the embodiment of the present application, a second connecting surface 13223 is provided on the first side of the second connecting component 1322, and the second connecting surface 13223 is used to contact the second heating component 122 of the heating component 12. Here, the first side is the side facing the heating component 12, and the second connecting surface 13223 of the first side is also the side facing the heating component. Here, the second connecting surface 13223 is used to contact the second heating component 122 of the heating component 12, which means that the surface on the first side of the second connecting component 1322 that contacts the second heating component 122 of the heating component 12 is called the second connecting surface 13223.

[0091] In the embodiment of the present application, the second connecting surface 13223 can be a second convex surface, which refers to a surface that is raised in the direction of the heat-generating component 12, and the second convex surface is used to cooperate and contact with the concave surface of the second heat-generating component 122 of the heat-generating component 12; the second connecting surface 13223 can also be a second concave surface, which refers to a surface that is recessed in the direction of the heat-generating component 12, and the second concave surface is used to cooperate and contact with the convex surface of the second heat-generating component 122 of the heat-generating component 12; of course, the second connecting surface 13223 can also be a second plane, which refers to a surface that is neither raised nor recessed in the direction of the heat-generating component, and the second plane is used to cooperate and contact with the plane of the second heat-generating component 122 of the heat-generating component 12, and the embodiment of the present application does not limit this.

[0092] In the embodiment of the present application, the projection of the second channel portion 13222 along the first direction A at least partially covers the second heat generating component 122. Here, the projection of the second channel portion 13222 along the first direction A may cover a portion of the second heat generating component 122, or the projection of the second channel portion 13222 along the first direction A may cover the entire second heat generating component 122. The embodiment of the present application does not limit this.

[0093] In the embodiment of the present application, the projection of the second channel portion 13222 along the first direction A at least partially covers the second heat generating component 122. Here, the projection of the second channel portion 13222 along the first direction A covers a portion of the second heat generating component 122. At this time, the second channel portion 13222 can perform air cooling and liquid cooling on the second heat generating component, thereby accelerating the heat dissipation of the second heat generating component 122. Of course, the projection of the second channel portion 13222 along the first direction A can completely cover the second heat generating component 122. At this time, the contact area between the second channel portion 13222 and the second heat generating component 122 is increased, thereby accelerating the heat dissipation of the second heat generating component 122.

[0094] It can be seen from the above embodiments that each of the multiple liquid cooling tubes 1311 arranged along the second direction B at each position corresponds to a connecting component 132 (a first connecting component 1321 and a second connecting component 1322). For example, two second heating components 122 are provided on the server base 11 of the server 1, one of which is in contact with the second connecting surface 13223 of the second connecting component 1322 connected to the multiple liquid cooling tubes 1311 located at the first position 111, and the other second heating component 122 is in contact with the second connecting surface 13223 of the second connecting component 1322 connected to the multiple liquid cooling tubes 1311 located at the second position 112.

[0095] Furthermore, the liquid inlet pipe 1312, the multiple liquid cooling tubes 1311 located at the third position 113, the multiple liquid cooling tubes 1311 located at the first position 111, and the liquid outlet pipe 1313 form a first liquid cooling circuit. When the liquid flows through the first liquid cooling circuit, the heat is dissipated to the multiple first heating components 121 located at the third position 113, the multiple first heating components 121 located at the first position 111, and the second heating component 122 in turn; similarly, the multiple liquid cooling tubes 1311 located at the fourth position 114, the multiple liquid cooling tubes 1311 located at the second position 112, and the liquid outlet pipe 1313 form a second liquid cooling circuit. When the liquid flows through the second liquid cooling circuit, the heat is dissipated to the multiple first heating components 121 located at the fourth position 114, the multiple second heating components 122 located at the second position 112, and the second heating component 122 in turn.

[0096] In the embodiment of the present application, the second heating element 122 may be a computer processor (CPU); the second heating component 122 may be a dual in-line memory module (DIMM); the second heating component 122 may be a power module (VRM), which is not limited in the embodiment of the present application. In an implementable manner provided in the embodiment of the present application, the second heating component 121 is a power module (VRM).

[0097] In the embodiment of the present application, the second heating element 122 can be in contact with the first connecting surface. In this way, when the heat dissipation system is dissipating heat, the liquid coming out of the liquid inlet pipe 1311 can dissipate heat to the second heating element 122 when passing through the first connecting component 1321, and the heat dissipation effect of the second heating component 122 is better; of course, the second heating element 122 can also be in contact with the second connecting surface 13223. In this way, when the heat dissipation system is dissipating heat, the liquid coming out of multiple liquid cooling pipes 1311 can dissipate heat to the second heating component 122 only when it flows through the second connecting component 1322. In this way, the heat dissipation effect of the first heating component is better.

[0098] The heat dissipation system 13 provided in the embodiment of the present application is configured such that the first connection surface is used to contact the second heat generating component 122 of the heat generating component 12, and the projection of the first channel portion 13212 along the first direction A at least partially covers the second heat generating component 122; or; a second connection surface 13223 is provided on the first side of the second connection component 1322, and the second connection surface 13223 is used to contact the second heat generating component 122 of the heat generating component 12, and the projection of the second channel portion 13222 along the first direction A at least partially covers the second heat generating component 122, and the second heat generating element is located on the heat dissipation path of the connection component 132. While dissipating the heat for the first heat generating element, the first connection component 1321 or the second connection component 1322 can also dissipate the heat for the second heat generating element, thereby further improving the heat dissipation efficiency of the entire heat dissipation system 13.

[0099] Reference Figure 5 , Figure 6 , Figure 7 and Figure 8 The embodiment of the present application provides a heat dissipation system 13, which further includes a support bracket 133, the support bracket 133 is connected to the second side of the connecting component 132, the support bracket 133 is used to connect the supporting connecting component 132 and the liquid cooling component 131 with the server base 11, and the support bracket 133 has an avoidance channel 1382, and the avoidance channel 1382 is arranged corresponding to the air cooling channel 1381 to form an air cooling flow channel 138.

[0100] In the embodiment of the present application, the support bracket 133 may include a first support bracket 1331 and a second support bracket 1332. The first support bracket 1331 is connected to the second side of the first connecting component 1321, and the second support bracket 1332 is connected to the second side of the second connecting component 1322. The first support bracket 1331 and the second support bracket 1332 are arranged relative to each other along the first direction A. In this way, the stability of the connection between the support bracket 133 and the second side of the connecting component 132 can be improved.

[0101] In the embodiment of the present application, the support bracket 133 and the second side of the connecting component 132 may be connected in a non-detachable manner, such as welding, and the support bracket 133 and the second side of the connecting component 132 may be connected in a detachable manner, such as threaded connection, which is not limited in the embodiment of the present application. In an implementable manner provided in the embodiment of the present application, the support bracket 133 and the second side of the connecting component 132 are connected in a threaded manner.

[0102] In the embodiment of the present application, the support bracket 133 is used to connect the support connection component 132 and the liquid cooling component 131 with the server base 11. Similarly, the connection between the support bracket 133 and the server base 11 can be a non-detachable connection, such as welding, and the connection between the support bracket 133 and the server base 11 can be a detachable connection, such as a threaded connection. This embodiment of the present application does not limit this. In an achievable method provided in the embodiment of the present application, the connection between the support bracket 133 and the server base 11 is a threaded connection. For example, a first threaded hole is provided on the second side of the connection component 132, a second threaded hole is provided on the server base 11, and a third threaded hole is provided on the support bracket 133. The threaded connector 137 (such as a screw) is sequentially passed through the first threaded hole, the third threaded hole, and the second threaded hole, so that the second side of the connection component 132, the support bracket 133 and the server base 11 are threadedly connected and fixed. On this basis, there can be six threaded connectors 137.

[0103] In an embodiment of the present application, the support bracket 133 has an avoidance channel 1382. Along the direction from the second side toward the first side, the avoidance channel 1382 can overlap with at least part of the high-speed wiring area 117 of the server base 11. In this way, at least part of the high-speed wiring area 117 of the server base 11 can be avoided to improve the overall compatibility of the cooling system 13.

[0104] In the embodiment of the present application, the avoidance channel 1382 is arranged corresponding to the air cooling channel 1381 to form the air cooling channel 138. In other words, the air cooling channel 1381 is a part of the air cooling channel 138. That is to say, due to the design of the avoidance channel 1382 of the support bracket 133, in addition to the air cooling passing through the air cooling channel 138, the air cooling can also pass through the avoidance channel 1382. In this way, the overall heat dissipation efficiency of the heat dissipation system 13 can be further increased.

[0105] The heat dissipation system 13 provided in the embodiment of the present application connects the support bracket 133 to the second side of the connecting component 132. The support bracket 133 is used to connect the supporting connecting component 132 and the liquid cooling component 131 with the server base 11, and the support bracket 133 has an avoidance channel 1382, thereby achieving the effect of fixing the heat dissipation system 13 on the server base 11 with fewer screws, thereby ensuring both the overall strength of the heat dissipation system 13 and the compatibility of the heat dissipation system 13 with the server 1.

[0106] Reference Figure 5 , Fig.15 , Fig.16 , Fig.17 and Fig.18The embodiment of the present application provides a heat dissipation system 13, which also includes an auxiliary bracket 134. The auxiliary bracket 134 is connected to the second side of the connecting component 132 and is inserted into the accommodating gap. One side of the auxiliary bracket 134 is in contact with the side wall of one of the two liquid-cooling tubes 1311 forming the accommodating gap, and the other side of the auxiliary bracket 134 is used to be in contact with the first heating component 121; the auxiliary bracket 134 is connected to the liquid-cooling tube 1311 through a heat-conducting structure 135; and / or; the auxiliary bracket 134 is connected to the first heating component 121 through the heat-conducting structure 135; and / or; the liquid-cooling tube 1311 is connected to the first heating component 121 through the heat-conducting structure 135.

[0107] In the embodiment of the present application, the auxiliary bracket 134 is connected to the second side of the connecting component 132. Here, the connection between the auxiliary bracket 134 and the second side of the connecting component 132 can be a non-detachable connection, such as welding; of course, the connection between the auxiliary bracket 134 and the second side of the connecting component 132 can also be a detachable connection, such as a threaded connection, which is not limited in the embodiment of the present application. In an implementable manner provided in the embodiment of the present application, the auxiliary bracket 134 is threadedly connected to the second side of the connecting component 132.

[0108] For example, a first threaded hole is set on the second side of the connecting component 132, a second threaded hole is set on the server base 11, a third threaded hole is set on the supporting bracket 133, and a fourth threaded hole is set on the auxiliary bracket 134. The threaded connecting member 137 (such as a screw) passes through the fourth threaded hole, the first threaded hole, the third threaded hole and the second threaded hole in sequence, so that the auxiliary bracket 134, the second side of the connecting component 132, the supporting bracket 133 and the server base 11 are threadedly connected and fixed.

[0109] In the embodiment of the present application, the auxiliary bracket 134 is connected to the liquid cooling tube 1311 through the heat-conducting structure 135; and / or; the auxiliary bracket 134 is connected to the first heating component 121 through the heat-conducting structure 135; and / or; the liquid cooling tube 1311 is connected to the first heating component 121 through the heat-conducting structure 135. Here, only the auxiliary bracket 134 can be connected to the liquid cooling tube 1311 through the heat-conducting structure 135; only the auxiliary bracket 134 can be connected to the first heating component 121 through the heat-conducting structure 135; only the liquid cooling tube 1311 can be connected to the first heating component 121 through the heat-conducting structure 135; it can also be that the auxiliary bracket 134 is connected to the liquid cooling tube 1311 through the heat-conducting structure 135 and the auxiliary bracket 134 is connected to the first heat generating component 121 through a heat-conducting structure 135; the auxiliary bracket 134 can also be connected to the first heat generating component 121 through a heat-conducting structure 135, and the liquid cooling tube 1311 is connected to the first heat generating component 121 through a heat-conducting structure 135; the auxiliary bracket 134 can also be connected to the first heat generating component 121 through a heat-conducting structure 135, and the liquid cooling tube 1311 is connected to the first heat generating component 121 through a heat-conducting structure 135; the auxiliary bracket 134 can also be connected to the liquid cooling tube 1311 through a heat-conducting structure 135, and the auxiliary bracket 134 can be connected to the first heat generating component 121 through a heat-conducting structure 135, and the liquid cooling tube 1311 is connected to the first heat generating component 121 through a heat-conducting structure 135.

[0110] In the embodiment of the present application, if only the auxiliary bracket 134 is connected to the liquid cooling tube 1311 through the heat-conducting structure 135, the heat on the liquid cooling tube 1311 can be directly transferred to the auxiliary bracket 134 through the heat-conducting structure 135, thereby reducing the heat of the liquid cooling tube 1311; if only the auxiliary bracket 134 is connected to the first heating component 121 through the heat-conducting structure 135, the heat of the first heating component 121 can be directly transferred to the auxiliary bracket 134 through the heat-conducting structure 135; if only the liquid cooling tube 1311 is connected to the first heating component 121 through the heat-conducting structure 135, the heat of the first heating component 121 can be directly transferred to the liquid cooling tube 1311 through the heat-conducting structure 135.

[0111] In an embodiment of the present application, if the auxiliary bracket 134 is connected to the liquid cooling tube 1311 through the heat-conducting structure 135, the auxiliary bracket 134 is connected to the first heating component 121 through the heat-conducting structure 135, and the liquid cooling tube 1311 is connected to the first heating component 121 through the heat-conducting structure 135, the heat on the first heating component 121 can be accelerated to be transferred to the liquid cooling tube 1311.

[0112] In the embodiment of the present application, the auxiliary bracket 134 is connected to the liquid cooling tube 1311 through the heat-conducting structure 135. Here, the heat-conducting structure 135 can be a heat-conducting gasket wrapped on the auxiliary bracket 134 and a heat-conducting gasket wrapped on the liquid cooling tube 1311, and the auxiliary bracket 134 is connected to the liquid cooling tube 1311 through the heat-conducting gasket; the heat-conducting structure 135 can be thermal grease wrapped on the auxiliary bracket 134 and thermal grease wrapped on the liquid cooling tube 1311, and the auxiliary bracket 134 is connected to the liquid cooling tube 1311 through the thermal grease; the heat-conducting structure 135 can be thermal glue bonded to the auxiliary bracket 134 and thermal glue bonded to the liquid cooling tube 1311, and the auxiliary bracket 134 is connected to the liquid cooling tube 1311 through the heat-conducting glue. The embodiment of the present application does not limit the specific type of the heat-conducting structure 135. In an implementable manner provided in an embodiment of the present application, the heat-conducting structure 135 is a heat-conducting gasket wrapped on the auxiliary bracket 134 and a heat-conducting gasket wrapped on the liquid cooling tube 1311 .

[0113] In the embodiment of the present application, the auxiliary bracket 134 is connected to the first heating component 121 through a heat-conducting structure 135. Here, the heat-conducting structure 135 can be a heat-conducting gasket wrapped on the auxiliary bracket 134, and the auxiliary bracket 134 is connected to the first heating component 121 through the heat-conducting gasket; the heat-conducting structure 135 can be a heat-conducting silicone grease wrapped on the auxiliary bracket 134, and the auxiliary bracket 134 is connected to the first heating component 121 through the heat-conducting silicone grease; the heat-conducting structure 135 can be a heat-conducting glue bonded to the auxiliary bracket 134, and the auxiliary bracket 134 is connected to the first heating component 121 through the heat-conducting glue. The embodiment of the present application does not limit the specific type of the heat-conducting structure 135. In an implementable method provided in the embodiment of the present application, the heat-conducting structure 135 is a heat-conducting gasket wrapped on the auxiliary bracket 134.

[0114] In the embodiment of the present application, the liquid cooling tube 1311 is connected to the first heating component 121 through the heat-conducting structure 135. Here, the heat-conducting structure 135 can be a heat-conducting gasket wrapped on the liquid cooling tube 1311, and the liquid cooling tube 1311 is connected to the first heating component 121 through the heat-conducting gasket; the heat-conducting structure 135 can be a heat-conducting silicone grease wrapped on the liquid cooling tube 1311, and the liquid cooling tube 1311 is connected to the first heating component 121 through the heat-conducting silicone grease; the heat-conducting structure 135 can be a heat-conducting glue bonded to the liquid cooling tube 1311, and the liquid cooling tube 1311 is connected to the first heating component 121 through the heat-conducting glue. The embodiment of the present application does not limit the specific type of the heat-conducting structure 135. In an implementable method provided in the embodiment of the present application, the heat-conducting structure 135 is a heat-conducting gasket wrapped on the liquid cooling tube 1311.

[0115] The heat dissipation system 13 provided in the embodiment of the present application is provided with an auxiliary bracket 134, so that the auxiliary bracket 134 is connected to the second side of the connecting component 132 and inserted into the accommodating gap, one side of the auxiliary bracket 134 is fitted with the side wall of one of the two liquid cooling tubes 1311 forming the accommodating gap, and the other side of the auxiliary bracket 134 is used to fit with the first heating component 121. In this way, the phenomenon of the first heating component 121 being squeezed by the liquid cooling tube 1311 during transportation can be reduced, and the risk of the first heating component 121 being damaged can be reduced. The force simulation of the heat dissipation system 13 without the auxiliary bracket 134 and the auxiliary bracket 134 can also be obtained from the simulation diagram. The effect of reducing the phenomenon of the first heating component 121 being squeezed by the liquid cooling tube 1311 during transportation and reducing the risk of the first heating component 121 being damaged can be obtained.

[0116] Reference Figure 5 , Figure 6 , Figure 7 and Figure 8 The embodiment of the present application provides a heat dissipation system 13, which includes a liquid cooling plate 136, which is connected to the second connecting component 1322 of the connecting component 132, and the liquid cooling plate 136 is located on the same side of the liquid cooling component 131 and the connecting component 132. The liquid cooling component 131 is connected to the liquid cooling plate 136 through the second connecting component 1322 to form a liquid cooling circuit, and the liquid cooling plate 136 is used to contact the third heating component 123 of the heating component 12.

[0117] In the embodiment of the present application, the liquid cooling plate 136 is connected to the second connecting component 1322 of the connecting part 132. The connection method between the liquid cooling plate 136 and the second connecting component 1322 of the connecting part 132 can be a non-detachable connection, such as welding. The connection method between the liquid cooling plate 136 and the second connecting component 1322 of the connecting part 132 can be a detachable connection, such as a threaded connection, such as a snap connection. The embodiment of the present application does not limit the connection method between the liquid cooling plate 136 and the second connecting component 1322 of the connecting part 132.

[0118] In the embodiment of the present application, the liquid cooling plate 136 is used to contact the third heating component 123 of the heating component 12. Here, the third heating component 123 of the heating component 12 can be a computer processor (CPU); the third heating component 123 can be a dual in-line memory module (DIMM); the third heating component 123 can be a power module (VRM), which is not limited in the embodiment of the present application. In an implementable manner provided in the embodiment of the present application, the third heating component 123 is a computer processor (CPU).

[0119] The third heating component 123 is plugged into the fifth position 115 on the server 1, and the third heating component 123 is plugged into the sixth position 116. The fifth position 115 is located between the third position 113 and the first position 111, and the sixth position 116 is located between the fourth position 114 and the second position 112. The heat dissipation system 13 includes a liquid cooling plate 136 arranged on the third heating component 123 plugged into the fifth position 115. The heat dissipation system 13 includes a liquid cooling plate 136 arranged on the third heating component 123 plugged into the fifth position 115, a liquid cooling pipe 1311 arranged on the third heating component 123 plugged into the fifth position 115, and a second connecting component 1311 connected to the first position 111 and a plurality of liquid cooling pipes 1311. 22 is connected and is connected to the second branch pipe 1315, so that the liquid inlet pipe 1312, the multiple liquid cooling pipes 1311 located at the third position 113, the first branch pipe 1314, the multiple liquid cooling pipes 1311 located at the first position 111, the liquid cooling pipe 1311 located at the fifth position 115, the second branch pipe 1315 and the liquid outlet pipe 1313 form a first liquid cooling circuit to dissipate heat for the first heating component 121 located at the third position 113, the first heating component 121 located at the first position 111, the second heating component 122 contacted by the second connecting surface 13223 of the second connecting component 1322 of the multiple liquid cooling pipes 1311 located at the first position 111, and the third heating component 123 located at the fifth position 115.

[0120] Similarly, a liquid cooling plate 136 is provided on the third heating component 123 plugged in the corresponding sixth position 116, and a liquid cooling pipe 1311 provided on the third heating component 123 plugged in the corresponding sixth position is connected to a second connecting component 1322 connected to a plurality of liquid cooling pipes 1311 at the second position 112, and is communicated with the fourth branch pipe 1317. In this way, the liquid inlet pipe 1312, the plurality of liquid cooling pipes 1311 at the fourth position 114, the third branch pipe 1316, and the plurality of liquid cooling pipes 1311 at the second position 112 are connected to each other. The tube 1311, the liquid cooling tube 1311 located at the sixth position 116, the fourth branch tube 1317 and the liquid outlet pipe 1313 form a second liquid cooling circuit to dissipate heat for the first heating component 121 located at the fourth position 114, the first heating component 121 located at the second position 112, the second heating component 122 contacted by the second connecting surface 13223 of the second connecting component 1322 of the multiple liquid cooling tubes 1311 located at the second position 112, and the third heating component 123 located at the sixth position 116.

[0121] The heat dissipation system 13 provided in the embodiment of the present application connects the liquid cooling plate 136 with the second connecting component 1322 of the connecting component 132, and the liquid cooling component 131 is connected to the liquid cooling plate 136 through the second connecting component 1322 to form a liquid cooling circuit. The liquid cooling plate 136 is used to contact the second heating component 122 of the heating component 12. The heat dissipation system 13 can dissipate heat for the third heating element while dissipating heat for the first heating element and the second heating element. In this way, the heat dissipation efficiency of the entire heat dissipation system 13 can be further improved.

[0122] The embodiment of the present application also provides a server 1, which includes a server base 11 and a heat dissipation system 13, wherein a heat generating component 12 is arranged on the server base 11, and the heat dissipation system 13 includes a cooling component and a connecting component 132, the liquid cooling component 131 has a liquid cooling channel arranged along a first direction A, and the liquid cooling component 131 is used to connect with the heat generating component 12 to dissipate heat through the liquid cooling channel; the connecting component 132 is connected to the liquid cooling component 131, and the connecting component 132 has a first side and a second side arranged opposite to each other, the first side is concave toward the second side to form an air cooling channel 1381, and the first side is arranged toward the heat generating component 12 to dissipate heat for the heat generating component 12; along the direction from the first side to the second side, the liquid cooling component 131 is higher than the air cooling channel 1381.

[0123] Reference Figure 5 , Figure 6 , Figure 7 and Figure 8 The embodiment of the present application further provides a server 1, wherein a support bracket 133 of a heat dissipation system 13 is connected to a server base 11 to support a connecting component 132 and a liquid cooling component 131, and the support bracket 133 is arranged corresponding to the heat-generating component 12 along a first direction A; the heat-generating component 12 comprises at least one of the following: a first heat-generating component 121, wherein the liquid cooling component 131 of the heat dissipation system 13 is arranged corresponding to the first heat-generating component 121 for heat transfer; a second heat-generating component 122, wherein the connecting component 132 of the heat dissipation system 13 is arranged corresponding to the second heat-generating component 122 for heat transfer; and a third heat-generating component 123, wherein a liquid cooling plate 136 of the heat dissipation system 13 is arranged corresponding to the third heat-generating component 123 for heat transfer.

[0124] In the embodiment of the present application, the liquid cooling component 131 also includes a liquid inlet pipe 1312 and a liquid outlet pipe 1313 respectively connected to multiple liquid cooling tubes 1311. The liquid inlet pipe 1312, multiple liquid cooling tubes 1311 and the liquid outlet pipe 1313 form a liquid cooling circuit. The liquid inlet pipe 1312 is used to provide liquid to the liquid cooling channel of the liquid cooling tube 1311, and the liquid outlet pipe 1313 is used to provide an outlet for the liquid in the liquid cooling channel of the liquid cooling tube 1311.

[0125] In the embodiment of the present application, the first heat generating component 121 may be a CPU, the second heat generating component 122 may be a DIMM, and the third heat generating component 123 may be a VRM.

[0126] In an implementable manner provided in an embodiment of the present application, the heat generating component 12 includes a plurality of first heat generating components 121, a second heat generating component 122, and a third heat generating component 123 arranged along a second direction B, the plurality of first heat generating components 121 are plugged into a first position 111 of a server base 11 along the second direction B, the heat dissipation system 13 includes a plurality of liquid cooling pipes 1311 distributed along the second direction B corresponding to the first heat generating component 121 at the first position 111, the second heat generating component 122 is in contact with a second connecting surface 13223 of a second connecting component 1322 connected to the plurality of liquid cooling pipes 1311 located at the first position 111, and the third heat generating component 123 is located at a fifth position 111 of the server base 11. 5. The heat dissipation system 13 includes a liquid cooling plate 136 corresponding to the third heating component 123 at the fifth position 115, and the liquid cooling plate 136 is connected to a second connecting component 1322 connected to a plurality of liquid cooling tubes 1311 located at the first position 111. At this time, the liquid inlet pipe 1312, the plurality of liquid cooling tubes 1311 located at the first position 111, and the liquid cooling plate 136 form a first liquid cooling circuit to dissipate heat for the plurality of first heating components 121 located at the first position 111, the second heating component 122 contacting the second connecting surface 13223 of the second connecting component 1322 connected to the plurality of liquid cooling tubes 1311 located at the first position 111, and the third heating component 123 located at the fifth position 115.

[0127] In an implementable method provided in an embodiment of the present application, the heating component 12 includes a plurality of first heating components 121 plugged in at a first position 111 along a second direction B on a server base 11, a plurality of first heating components 121 plugged in at a second position 112 of the server base 11 along the second direction B, a plurality of first heating components 121 plugged in at a third position 113 of the server base 11 along the second direction B, and a plurality of first heating components 121 plugged in at a fourth position 114 of the server base 11 along the second direction B. It should be additionally noted here that a corresponding connecting component 132 (a first connecting component 1321 and a second connecting component 1322) is provided for each of the plurality of liquid cooling tubes 1311 at each position.

[0128] The heating component 12 further includes two second heating components 122, one of which is located at one side of the first heating component 121 at the first position of the server base 1 along the first direction A, and the second heating component 122 is in contact with the second connecting surface 13223 of the second connecting component 1322 located at the first position 111 and connected to the plurality of liquid cooling pipes 1311 along the second direction B, and the other second heating component 122 is located at one side of the first heating component 121 at the second position of the server base 1 along the second direction B and connected to the plurality of first heating components 121 along the first direction A, and the second heating component 122 is in contact with the second connecting surface 13223 of the second connecting component 1322 located at the second position 111 and connected to the plurality of liquid cooling pipes 1311 along the second direction B ... 2, and the third heating component 123 plugged in the fifth position 115 of the server base 11 and the fifth heating component plugged in the sixth position 116 of the server base 11, wherein the third position 113 and the fourth position 114 are adjacent, the first position 111 and the third position 113 are adjacent, the second position 112 and the fourth position 114 are adjacent, the fifth position 115 is located between the third position 113 and the first position 111, and the sixth position 116 is located between the fourth position 114 and the second position 112.

[0129] Correspondingly, the liquid-cooling component 131 includes a plurality of liquid-cooling tubes 1311 arranged on the connecting component 132 along the second direction B corresponding to the first position 111, and each first heating component 121 corresponding to the first position 111 is plugged into the accommodation gap formed by two adjacent liquid-cooling tubes 1311; the liquid-cooling component 131 also includes a plurality of liquid-cooling tubes 1311 arranged on the connecting component 132 along the second direction B corresponding to the second position 112, and each first heating component 121 corresponding to the second position 112 is plugged into the accommodation gap formed by two adjacent liquid-cooling tubes 1311; the liquid-cooling component 131 also includes a plurality of liquid-cooling tubes 1311 arranged on the connecting component 132 along the second direction B corresponding to the third position 113, Each first heating component 121 at the third position 113 is plugged into the accommodation gap formed by two adjacent liquid cooling tubes 1311; the liquid cooling component 131 also includes a plurality of liquid cooling tubes 1311 arranged on the connecting component 132 along the second direction B at the corresponding fourth position 114, and each first heating component 121 at the corresponding fourth position 114 is plugged into the accommodation gap formed by two adjacent liquid cooling tubes 1311, and the heat dissipation component also includes a liquid cooling plate 136 of the third heating component 123 plugged into the corresponding fifth position 115 and a liquid cooling plate 136 of the third heating component 123 plugged into the corresponding fifth position 115, and the liquid cooling plate 136 at the fifth position 115 and the plurality of liquid cooling tubes 1311 at the first position 111 The second connecting component 1322 is connected, and the liquid cooling plate 136 located at the sixth position 116 is connected to the second connecting component 1322 of the plurality of liquid cooling tubes 1311 located at the second position 112; the liquid inlet pipe 1312, the plurality of liquid cooling tubes 1311 located at the third position 113, the plurality of liquid cooling tubes 1311 located at the first position 111, the liquid cooling plate 136 located at the fifth position 115, and the liquid outlet pipe 1313 form a first liquid cooling circuit to contact the plurality of liquid cooling tubes 1311 located at the third position 113, the plurality of first heating components 121 located at the first position 111, and the second connecting surface 13223 of the second connecting component 1322 connected to the plurality of liquid cooling tubes 1311 located at the first position 111 The second heating component 122 located at the fifth position 115 and the third heating component 123 located at the fifth position 115 dissipate heat; the liquid inlet pipe 1312, the multiple liquid cooling tubes 1311 located at the fourth position 114, the multiple liquid cooling tubes 1311 located at the second position 112, the liquid cooling plate 136 located at the sixth position 116, and the liquid outlet pipe 1313 form a second liquid cooling circuit to dissipate heat for the multiple liquid cooling tubes 1311 located at the fourth position 114, the multiple first heating components 121 located at the second position 112, the second heating component 122 contacting the second connecting surface 13223 of the second connecting component 1322 connected to the multiple liquid cooling tubes 1311 located at the second position 112, and the third heating component 123 located at the sixth position 116.

[0130] Furthermore, the liquid inlet pipe 1312, a plurality of liquid cooling tubes 1311 located at the third position 113, a plurality of liquid cooling tubes 1311 located at the first position 111, a liquid cooling plate 136 located at the fifth position 115, and a liquid outlet pipe 1313 form a first liquid cooling circuit; the liquid inlet pipe 1312, a plurality of liquid cooling tubes 1311 located at the fourth position 114, a plurality of liquid cooling tubes 1311 located at the second position 112, a liquid cooling plate 136 located at the sixth position 116, and a liquid outlet pipe 1313 form a second liquid cooling circuit, and the first ends of the plurality of liquid cooling tubes 1311 at the first position 111, the plurality of liquid cooling tubes 1311 at the second position 112, the plurality of liquid cooling tubes 1311 at the third position 113, and the plurality of liquid cooling tubes 1311 at the fourth position 114 are all provided with a liquid inlet diversion pipe 13211, and the second ends are all provided with a liquid outlet confluence pipe 13221.

[0131] Correspondingly, when the liquid in the liquid inlet pipe 1312 needs to enter the multiple liquid cooling pipes 1311 located at the third position 113, the liquid inlet shunt pipe 13211 connected to the multiple liquid cooling pipes 1311 located at the third position 113 adjusts the flow rate of the liquid inlet pipe 1312 to the multiple liquid cooling pipes 1311 located at the third position 113, and when the liquid in the multiple liquid cooling pipes 1311 located at the third position 113 flows through the multiple liquid cooling pipes 1311 located at the first position 111, the liquid in the multiple liquid cooling pipes 1311 located at the third position 113 first flows through the liquid outlet confluence pipe 13221 connected to the multiple liquid cooling pipes 1311 located at the third position 113 to the first branch pipe 13211. The liquid passes through the first branch pipe 1314 to reach the liquid inlet shunt pipe 13211 connected to the multiple liquid-cooling pipes 1311 located at the first position 111 to adjust the flow rate of the first branch pipe 1314 to reach the multiple liquid-cooling pipes 1311 located at the first position 111. The liquid in the multiple liquid-cooling pipes 1311 located at the first position 111 first passes through the liquid outlet confluence pipe 13221 connected to the multiple liquid-cooling pipes 1311 located at the first position 111 to adjust the multiple liquid-cooling pipes 1311 located at the first position 111 to converge to the liquid cooling plate 136 located at the fifth position 115. The liquid passes through the liquid cooling plate 136 located at the fifth position 115 to reach the second branch pipe 1315, and then reaches the liquid outlet pipe 1313 through the second branch pipe 1315.

[0132] Similarly, when the liquid in the liquid inlet pipe 1312 needs to enter the multiple liquid-cooling pipes 1311 located at the fourth position 114, the liquid inlet diverter pipe 13211 connected to the multiple liquid-cooling pipes 1311 located at the fourth position 114 adjusts the flow rate of the liquid inlet pipe 1312 to the multiple liquid-cooling pipes 1311 located at the fourth position 114, and when the liquid in the multiple liquid-cooling pipes 1311 located at the fourth position 114 flows through the multiple liquid-cooling pipes 1311 located at the second position 112, the liquid in the multiple liquid-cooling pipes 1311 located at the fourth position 114 first flows through the liquid outlet confluence pipe 13221 connected to the multiple liquid-cooling pipes 1311 located at the fourth position 114 to the third branch pipe 13211. The liquid passes through the second branch pipe 1315 to reach the liquid inlet shunt pipe 13211 connected to the multiple liquid-cooling pipes 1311 located at the second position 112 to adjust the flow rate of the third branch pipe 1316 to reach the multiple liquid-cooling pipes 1311 located at the second position 112; the liquid in the multiple liquid-cooling pipes 1311 located at the second position 112 first passes through the liquid outlet confluence pipe 13221 connected to the multiple liquid-cooling pipes 1311 located at the second position 112 to adjust the multiple liquid-cooling pipes 1311 located at the second position 112 to converge to the liquid-cooling pipe 1311 located at the sixth position 116; the liquid passes through the liquid cooling plate 136 located at the sixth position 116 to reach the fourth branch pipe 1317, and then reaches the liquid outlet pipe 1313 through the fourth branch pipe 1317.

[0133] In another implementable manner provided in the embodiment of the present application, the heat dissipation system 13 includes four liquid cooling tubes 1311 located at the first position 111, four liquid cooling tubes 1311 located at the third position 113, four liquid cooling tubes 1311 located at the fourth position 114, and four liquid cooling tubes 1311 located at the second position 112, for a total of 16 liquid cooling tubes 1311, which are numbered 1-16 along the direction from the first position 111 to the fourth position 114, respectively. The temperature of the first liquid cooling tube 1311 is 54 degrees Celsius, the temperature of the second liquid cooling tube 1311 is 51 degrees Celsius; the temperature of the third liquid cooling tube 1311 is 51 degrees Celsius; the temperature of the fourth liquid cooling tube 1311 is 49 degrees Celsius; the temperature of the fifth liquid cooling tube 1311 is 47 degrees Celsius; and the temperature of the sixth liquid cooling tube 1311 is 48 degrees Celsius. The temperature of the 11th liquid-cooling tube 1311 is 49 degrees Celsius; the temperature of the 7th liquid-cooling tube 1311 is 51 degrees Celsius; the temperature of the 8th liquid-cooling tube 1311 is 60 degrees Celsius; the temperature of the 9th liquid-cooling tube 1311 is 52 degrees Celsius; the temperature of the 10th liquid-cooling tube 1311 is 48 degrees Celsius; the temperature of the 11th liquid-cooling tube 1311 is 48 degrees Celsius; the temperature of the 12th liquid-cooling tube 1311 is 48 degrees Celsius; the temperature of the 13th liquid-cooling tube 1311 is 49 degrees Celsius; the temperature of the 14th liquid-cooling tube 1311 is 50 degrees Celsius; the temperature of the 15th liquid-cooling tube 1311 is 50 degrees Celsius; the temperature of the 16th liquid-cooling tube 1311 is 52 degrees Celsius. Judging from the test temperatures of the above 16 liquid-cooling tubes 1311, the temperature difference measured between each liquid-cooling tube 1311 is small.

[0134] The above are only preferred embodiments of the present application and are not intended to limit the scope of protection of the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A heat dissipation system, comprising: A liquid cooling component, wherein the liquid cooling component has a liquid cooling channel arranged along a first direction, and the liquid cooling component is used to connect with the heat generating component to dissipate heat through the liquid cooling channel; A connecting component is connected to the liquid cooling component, the connecting component has a first side and a second side arranged opposite to each other, the first side is concave toward the second side to form an air cooling channel, and the first side is arranged toward the heat generating component to dissipate heat from the heat generating component; along the direction from the first side toward the second side, the liquid cooling component is higher than the air cooling channel.

2. The heat dissipation system according to claim 1, wherein the liquid cooling component comprises a plurality of liquid cooling tubes arranged on the connecting component along the second direction, and each of the liquid cooling tubes is higher than the air cooling channel along the direction from the first side to the second side, and the liquid cooling tube has the liquid cooling channel, and an accommodation gap is provided between two adjacent liquid cooling tubes for accommodating a first heat generating component in the heat generating component, and at least one of the two liquid cooling tubes forming the accommodation gap is in contact with the first heat generating component; in, The second direction and the first direction meet a perpendicular condition.

3. The heat dissipation system according to claim 2, wherein the connecting component further comprises A first connecting component, wherein the first side of the first connecting component is concave toward the second side to form a first channel portion; a second connecting component, wherein the first side of the second connecting component is concave toward the second side to form a second channel portion; The first channel portion and the second channel portion are arranged opposite to each other and face the same direction to form the air cooling channel arranged along the first direction; The flow direction of the air-cooling channel is the same as or opposite to the flow direction of the liquid-cooling channel.

4. The heat dissipation system according to claim 3, wherein the first connecting assembly comprises a liquid inlet manifold, and the liquid inlet manifold is respectively connected to the first ends of the plurality of liquid cooling tubes; The second connecting assembly has a liquid outlet manifold, and the liquid outlet manifold is respectively connected to the second ends of the plurality of liquid cooling tubes; The liquid inlet manifold, the plurality of liquid cooling pipes and the liquid outlet manifold are connected to form a liquid cooling circuit; A shunt regulating valve is arranged in the liquid inlet shunt pipe, and the shunt regulating valve is used to regulate the flow from the liquid inlet shunt pipe to the plurality of liquid cooling pipes; A flow regulating valve is arranged in the liquid outlet manifold, and the flow regulating valve is used to regulate the flow from the plurality of liquid cooling tubes to the liquid outlet manifold; The projection of the air-cooling channel along the second direction at least partially overlaps with the projection of the liquid-cooling channel along the second direction.

5. The heat dissipation system according to claim 3, wherein the first side of the first connecting component is provided with a first connecting surface, the first connecting surface is used to contact with a second heat-generating component of the heat-generating component, and a projection of the first channel portion along the first direction at least partially covers the second heat-generating component; or; The first side of the second connecting component is provided with a second connecting surface, the second connecting surface is used to contact the second heating component of the heating element, and the projection of the second channel portion along the first direction at least partially covers the second heating component; The second heating element is located on a heat dissipation path of the connecting component.

6. The heat dissipation system according to claim 1 or 3 further includes a support bracket, wherein the support bracket is connected to the second side of the connecting component, the support bracket is used to connect to the server base to support the connecting component and the liquid cooling component, and the support bracket has an avoidance channel, and the avoidance channel is arranged corresponding to the air cooling channel to form an air cooling flow channel.

7. The heat dissipation system according to claim 2 or 3, further comprising an auxiliary bracket, the auxiliary bracket being connected to the second side of the connecting component and inserted into the accommodating gap, one side of the auxiliary bracket being in contact with a side wall of one of the two liquid cooling tubes forming the accommodating gap, and the other side of the auxiliary bracket being used to be in contact with the first heating component; The auxiliary bracket is connected to the liquid cooling pipe via a heat conducting structure; and / or; The auxiliary bracket is connected to the first heat generating component via a heat conducting structure; and / or; The liquid cooling tube is connected to the first heating component through a heat conducting structure.

8. The heat dissipation system according to claim 3 comprises a liquid cooling plate, which is connected to the second connecting component of the connecting component, the liquid cooling plate is located on the same side of the liquid cooling component and the connecting component, the liquid cooling component is connected to the liquid cooling plate through the second connecting component to form a liquid cooling circuit, and the liquid cooling plate is used to contact the third heating component of the heating component.

9. A server, comprising: A server base, wherein a heat generating component is arranged on the server base; Cooling system, including: A liquid cooling component, wherein the liquid cooling component has a liquid cooling channel arranged along a first direction, and the liquid cooling component is used to connect with the heat generating component to dissipate heat through the liquid cooling channel; a connecting component, the connecting component being connected to the liquid cooling component, the connecting component having a first side and a second side arranged opposite to each other, the first side being concave toward the second side to form an air cooling channel, and the first side being arranged toward the heat generating component to dissipate heat from the heat generating component; Along the direction from the first side to the second side, the liquid cooling component is higher than the air cooling channel.

10. The server according to claim 9, wherein the support bracket of the heat dissipation system is connected to the server base to support the connection component and the liquid cooling component, and the support bracket is arranged along the first direction corresponding to the heat generating component; The heat generating component includes at least one of the following: A first heat generating component, wherein the liquid cooling component of the heat dissipation system is arranged corresponding to the first heat generating component and is used for heat transfer; A second heat generating component, wherein the connecting component of the heat dissipation system is arranged corresponding to the second heat generating component for heat transfer; A third heat generating component, the liquid cooling plate of the heat dissipation system is arranged corresponding to the third heat generating component for heat transfer.

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