Method and system for transmitting and receiving data based on circuit board, and medium

Abstract

The invention relates to the technical field of signal transmission, in particular to a method and system for transmitting and receiving data based on a circuit board and a medium. The method comprises the following steps: acquiring circuit board design data, and performing signal layer wiring design feature extraction according to the circuit board design data so as to obtain signal layer wiring design data; according to the circuit board design data, carrying out circuit board stacking structure feature extraction so as to obtain circuit board stacking structure data; carrying out electromagnetic interference analysis according to the circuit board stacking structure data and the signal layer wiring design data so as to obtain circuit board electromagnetic interference data; crosstalk path positioning is carried out according to the signal crosstalk data so as to obtain signal crosstalk path data, and signal interlayer layout optimization is carried out according to the signal crosstalk path data so as to obtain signal interlayer layout optimization data. The transmitting and receiving performance of the circuit board is efficiently optimized based on the signal transmission technology.

Description

Technical Field

[0001] The present invention relates to the field of signal transmission technology, and in particular to a method, system and medium for sending and receiving data based on a circuit board. Background Art

[0002] Traditional circuit board design methods have problems such as reduced signal integrity, increased noise, and significant crosstalk when dealing with the simultaneous transmission of multiple complex signals, which will lead to increased bit error rates in data transmission, thereby affecting the overall device performance. Especially in high-speed signal design with data transmission frequencies exceeding hundreds of megahertz, impedance mismatch, signal reflection, delay, crosstalk, and electromagnetic interference (EMI) problems become more prominent. Conventional wiring strategies and physical isolation methods are difficult to effectively deal with these complex electromagnetic environments. In high-density integrated circuits, the reduction in signal line spacing exacerbates the coupling effect between signals, resulting in stronger capacitive and inductive coupling. These two coupling mechanisms work together to increase the severity of crosstalk. This crosstalk can cause unexpected interference during signal transmission, resulting in signal distortion and reduced data integrity. Summary of the invention

[0003] Based on this, it is necessary for the present invention to provide a method, system and medium for sending and receiving data based on a circuit board to solve at least one of the above technical problems.

[0004] To achieve the above purpose, a method for sending and receiving data based on a circuit board includes the following steps:

[0005] Step S1: obtaining circuit board design data, and performing signal layer wiring design feature extraction according to the circuit board design data, thereby obtaining signal layer wiring design data; performing signal crosstalk analysis according to the signal layer wiring design data, thereby obtaining signal crosstalk data;

[0006] Step S2: extracting circuit board stacking structure features according to the circuit board design data, thereby obtaining circuit board stacking structure data; performing electromagnetic interference analysis according to the circuit board stacking structure data and the signal layer wiring design data, thereby obtaining circuit board electromagnetic interference data;

[0007] Step S3: performing crosstalk path positioning according to the signal crosstalk data, thereby obtaining the signal crosstalk path data, and performing signal interlayer layout optimization according to the signal crosstalk path data, thereby obtaining signal interlayer layout optimization data;

[0008] Step S4: Visualizing the electromagnetic interference distribution according to the electromagnetic interference data of the circuit board, thereby obtaining the electromagnetic interference distribution visualization data; adjusting the stacking structure according to the electromagnetic interference distribution visualization data, thereby obtaining the stacking structure adjustment data;

[0009] Step S5: Perform circuit board transceiver data testing according to the signal layer layout optimization data and the stacking structure adjustment data, thereby obtaining circuit board transceiver test data, and uploading it to the circuit board transceiver data test platform to execute the transceiver data optimization task.

[0010] The present invention can identify and extract the key features of signal layer wiring by acquiring and analyzing circuit board design data, which provides basic data support for subsequent signal analysis. The signal crosstalk analysis performed at the same time can help to discover potential crosstalk risks early in the design stage, thereby reducing the occurrence of bit error rate. Through the in-depth extraction and analysis of the circuit board stacking structure, the electromagnetic characteristics and coupling effects between different layers in the circuit board can be mastered, and electromagnetic interference analysis can be carried out in combination with the signal layer wiring data, which not only improves the pertinence and effectiveness of the design, but also reduces the impact of electromagnetic interference on signal propagation. Through the path positioning of the signal crosstalk data, designers can clearly understand the specific source and propagation path of the crosstalk, and then perform reasonable layout optimization between the signal layers to achieve effective suppression of the crosstalk problem, thereby significantly improving the integrity and stability of the signal. With the help of the visual analysis of electromagnetic interference data, designers can view the distribution of interference in a more intuitive way, and can more effectively adjust the stacking structure to reduce the adverse effects of electromagnetic coupling on the overall circuit performance. This data-driven visualization method makes the adjustment more efficient. By optimizing the layout between signal layers and adjusting the stacking structure data to conduct the circuit board transceiver test, the optimization results can be effectively verified. The test data generated can be uploaded to the platform to provide valuable feedback and reference for subsequent design improvements, ensuring the continuous improvement of transceiver data optimization. Through this integrated approach, the performance of the circuit board in dealing with complex high-frequency signals and dense wiring has been significantly enhanced, thereby improving the overall reliability of the equipment and data transmission efficiency.

[0011] Optionally, step S1 specifically includes:

[0012] Step S11: obtaining circuit board design data, and performing signal layer wiring design feature extraction according to the circuit board design data, thereby obtaining signal layer wiring design data;

[0013] Step S12: performing routing angle abnormality analysis on the signal layer wiring design data, thereby obtaining signal routing angle abnormality data;

[0014] Step S13: performing routing impedance anomaly analysis on the signal layer wiring design data, thereby obtaining signal routing impedance anomaly data;

[0015] Step S14: performing signal routing anomaly integration according to the signal routing angle anomaly data and the signal routing impedance anomaly data, thereby obtaining signal routing anomaly data;

[0016] Step S15: performing signal crosstalk evaluation according to the signal routing anomaly, thereby obtaining signal crosstalk data.

[0017] The present invention can provide basic data for subsequent analysis by acquiring and analyzing circuit board design data and extracting signal layer wiring design features, thereby ensuring the effectiveness and traceability of the design process. The routing angle abnormality analysis of the signal layer wiring design data can identify sharp turns and irregular angles in the wiring. These abnormal angles can cause signal reflection and path distortion. The analysis results are helpful to optimize the wiring angle and improve the consistency and stability of the signal path. By analyzing the abnormal situation of the routing impedance, the impedance mismatch area in the wiring is identified. This impedance mismatch often causes signal reflection and transmission loss, thereby causing crosstalk and bit errors. The analysis data can provide a reference for subsequent adjustments. The angle abnormality data and the impedance abnormality data are integrated to form the overall signal routing abnormality data, which helps to fully understand the comprehensive problems in the wiring and facilitates designers to take more targeted corrective measures. Signal crosstalk evaluation is performed on the basis of the integrated signal routing abnormality data, so that the crosstalk area caused by the routing abnormality can be more accurately located, thereby providing a scientific basis for optimizing the design. Designers can systematically identify and resolve potential problems in signal transmission, improve the performance of circuit boards in high-frequency, high-speed applications, reduce bit error rates, and ultimately improve the overall performance and stability of the equipment.

[0018] Optionally, step S12 is specifically:

[0019] Step S121: extracting signal routing coordinate features from the signal layer wiring design data, thereby obtaining signal routing coordinate data;

[0020] Step S122: Draw a signal routing path diagram according to the signal routing coordinate data, thereby obtaining a signal routing path diagram;

[0021] Step S123: identifying the bending point area according to the signal routing path diagram, thereby obtaining the signal routing bending point area data;

[0022] Step S124: Calculate the angle of the signal routing bend point area data to obtain the signal routing angle data;

[0023] Step S125: obtaining high-speed signal transmission design rules, and setting signal routing angle thresholds according to the high-speed signal transmission design rules, thereby obtaining signal routing angle threshold data;

[0024] Step S126: performing abnormal angle comparison on the signal routing angle data according to the signal routing angle threshold data, thereby obtaining abnormal signal routing angle data.

[0025] The present invention can accurately identify the actual routing path of the line by extracting the signal routing coordinate features from the signal layer wiring design data, laying the foundation for subsequent analysis. By drawing the signal routing path diagram, the abstract data is visualized, so that designers can clearly see the transmission path and layout of the signal, helping to identify potential design weaknesses. Through the identification of the bending point area of ​​the path diagram, the key bending areas can be located in the complex signal routing. These areas are often potential sources of signal reflection and distortion, and the identification results make the analysis more accurate. Angle calculation is performed in the bending point area to obtain detailed signal routing angle data, which is crucial for evaluating and optimizing the rationality of the circuit design. High-speed signal transmission design rules are introduced to set the threshold of the signal routing angle to ensure the reliability and stability of signal transmission in high-frequency applications. This threshold setting ensures that the analysis has the guidance of industry standards. The signal routing angle data is compared with the set angle threshold to identify and mark the abnormal angle area. This comparison analysis helps to find potential problems that cause signal reflection and loss in the design. Designers can not only detect and correct problems in signal routing early, but also improve the integrity of overall signal transmission, reduce the risk of noise and crosstalk, and ensure the stability and high performance of circuit boards in high-speed applications.

[0026] Optionally, step S13 is specifically:

[0027] Step S131: extracting via position features and signal line spacing features from the signal layer wiring design data, thereby obtaining via position data and signal line spacing data;

[0028] Step S132: performing signal transmission simulation according to the via position data and the signal line spacing data, thereby obtaining signal transmission data;

[0029] Step S133: performing signal distortion analysis according to the signal transmission data, thereby obtaining signal distortion data;

[0030] Step S134: capturing reflected wave data of the signal distortion data, thereby obtaining reflected wave data;

[0031] Step S135: performing amplitude statistics according to the reflected wave data, thereby obtaining high reflection amplitude data;

[0032] Step S136: performing reflection delay time statistics according to the reflected wave data to obtain reflection delay time data, and performing reflection delay position calculation according to the reflection delay time data to obtain reflection delay position data;

[0033] Step S137: performing impedance anomaly intersection operation according to the reflection delay position data and the high reflection amplitude data, so as to obtain signal line impedance anomaly data.

[0034] The present invention can provide key information about the physical structure of the wiring by extracting the via position and signal line spacing features from the signal layer wiring design data, and provides accurate basic data for signal transmission analysis. Based on these data, signal transmission simulation is performed, so that designers can evaluate signal behavior and potential distortion in a virtual environment, providing effective support for early detection and prevention. Signal distortion analysis is performed according to the signal transmission simulation results to identify transmission problems that cause reduced signal quality, which helps to discover and correct potential defects in the signal path. By capturing the reflected wave of the signal distortion data, the location where the signal reflection occurs can be located, so as to intervene and repair the reflection source early in the design process. Step S135 obtains high reflection amplitude data by statistically analyzing the amplitude of the reflected wave, and can identify those reflection areas that have a greater impact on signal transmission, ensuring that the design process is optimized in a targeted manner. Statistics of the reflection delay time and calculation of the reflection delay position are performed to help discover delay problems in signal transmission, ensure that the design can achieve accurate timing control, and reduce data transmission errors. The impedance anomaly intersection operation is performed by combining the high reflection amplitude data and the reflection delay position data to accurately locate the impedance mismatch area in the signal routing, which helps to improve the design quality of the circuit board and reduce the possibility of signal reflection, distortion and data transmission errors.

[0035] Optionally, step S133 is specifically:

[0036] Perform fast Fourier transform according to the signal transmission data to obtain the signal transmission spectrum diagram;

[0037] Perform spectrum statistics on the signal transmission spectrum diagram to obtain high-frequency spectrum signal transmission data;

[0038] Performing phase curve jump identification on high-frequency spectrum signal transmission data to obtain phase curve jump data;

[0039] Perform nonlinear offset identification on high-frequency spectrum signal transmission data, thereby obtaining signal line nonlinear offset data;

[0040] Performing phase distortion intersection operation according to phase curve jump data and signal line nonlinear offset data, thereby obtaining phase distortion data;

[0041] The signal distortion area of ​​the signal transmission spectrum diagram is located according to the phase distortion data, so as to obtain the signal distortion data.

[0042] The present invention obtains a signal transmission spectrum diagram by performing a fast Fourier transform according to the signal transmission data, which helps to convert complex time domain signals into frequency domain representations, thereby revealing potential spectral features in the signal. Performing spectrum statistics on the signal transmission spectrum diagram and obtaining high-frequency signal transmission data helps to identify those signal components that perform abnormally in the high-frequency band, making it easier for designers to determine the high-frequency area that affects the integrity of the signal. Phase curve jump identification of high-frequency signal transmission data can detect areas with abnormal phase changes, which is particularly important for maintaining data synchronization in high-speed signal transmission. Nonlinear offset identification of high-frequency signal transmission data can detect nonlinear distortion in the signal path, which will affect the stability and transmission quality of the signal. Performing phase distortion intersection operations based on the phase curve jump data and nonlinear offset data of the signal helps to comprehensively analyze the interactive effects of different distortion types and accurately locate the position of phase distortion in signal transmission, thereby providing a precise target for design optimization. Finally, using phase distortion data to locate the signal distortion area of ​​the signal transmission spectrum diagram can help designers accurately determine the problem area, which is convenient for subsequent adjustment and repair. Ensure the integrity and stability of signal transmission in high-speed signal design and improve the overall performance and reliability of the circuit board.

[0043] Optionally, step S3 specifically includes:

[0044] Step S31: extracting signal crosstalk area features according to the signal crosstalk data, thereby obtaining signal crosstalk area data;

[0045] Step S32: performing electric field distribution simulation on the signal crosstalk area data to obtain electric field distribution data;

[0046] Step S33: performing current density statistics according to the electric field distribution data, thereby obtaining high-density current distribution data;

[0047] Step S34: performing hotspot identification on the signal crosstalk area data according to the high-density current distribution data, thereby obtaining signal crosstalk hotspot area data;

[0048] Step S35: performing signal path tracing according to the signal crosstalk hotspot area data, thereby obtaining signal crosstalk path data;

[0049] Step S36: Optimize the signal layer layout according to the signal crosstalk path data, so as to obtain signal layer layout optimization data.

[0050] The present invention helps to clarify the signal interference concentration area by extracting the signal crosstalk area features according to the signal crosstalk data, thereby providing data support for further analysis and processing. Electric field distribution simulation of signal crosstalk area data can simulate the electric field changes in signal transmission, reveal the strength distribution of the electric field, and help identify potential signal interference sources. Current density statistics based on electric field distribution data help determine the current concentration area and clarify which areas are more likely to cause problems under high current density. Hot spot identification based on high-density current distribution data helps to locate hot spots where signal loss and crosstalk are serious, providing guidance for optimized design. Signal path tracking through signal crosstalk hot spot area data can understand the interference path and its propagation direction, which is convenient for taking targeted layout optimization measures. Signal interlayer layout optimization based on signal crosstalk path data can effectively improve the interlayer signal wiring structure, reduce crosstalk effects, improve signal integrity and transmission performance, and enhance the anti-interference ability of the overall circuit board design.

[0051] Optionally, step S35 is specifically:

[0052] Step S351: extracting the hotspot area routing coordinates of the signal crosstalk hotspot area data according to the signal routing coordinate data, thereby obtaining the signal crosstalk hotspot area routing coordinates data;

[0053] Step S352: constructing topology according to the routing coordinate data of the signal crosstalk hotspot area, thereby obtaining routing topology structure data of the signal crosstalk hotspot area;

[0054] Step S353: performing a path depth-first search on the routing topology data of the signal crosstalk hotspot area according to the high-density current distribution data, thereby obtaining path depth-first search data;

[0055] Step S354: performing a path breadth-first search on the routing topology data of the signal crosstalk hotspot area according to the high-density current distribution data, thereby obtaining path breadth-first search data;

[0056] Step S355: merging signal crosstalk paths according to the path depth-first search data and the path breadth-first search data, thereby obtaining signal crosstalk path data.

[0057] The present invention extracts the hot spot area routing coordinates of the signal crosstalk hot spot area data according to the signal routing coordinate data, which helps to clarify the location and distribution of specific routing in the hot spot area and provide accurate input for subsequent analysis. By constructing the topology according to the signal crosstalk hot spot area routing coordinate data, a topological structure reflecting the connection relationship of the signal routing in the area can be generated, which is convenient for analyzing the connectivity and path characteristics of the complex network. Using high-density current distribution data to perform a path depth-first search on the topological structure, it is possible to identify the deep path of the signal in the complex line and discover potential interference propagation paths. Performing a path breadth-first search helps to obtain a wide range of transmission modes of the signal in the hot spot area, thereby identifying a crosstalk path with a larger impact range. By combining the path depth-first search and breadth-first search data for path merging, different search results can be integrated to comprehensively identify the signal crosstalk path and improve the accuracy of the signal interference analysis. The final result provides detailed path information for the optimization design, which helps to take effective measures to reduce the impact of crosstalk on signal integrity.

[0058] Optionally, step S36 is specifically:

[0059] Step S361: performing crosstalk intensity statistics according to the signal crosstalk path data, thereby obtaining high-intensity signal crosstalk path data;

[0060] Step S362: performing signal routing adjustment on the high-intensity signal crosstalk path data, thereby obtaining signal routing adjustment data;

[0061] Step S363: increasing the signal line spacing for the high-intensity signal crosstalk path data, thereby obtaining signal line spacing increase data;

[0062] Step S364: performing signal routing optimization feature fusion according to the signal routing adjustment data and the signal line spacing increase data, thereby obtaining signal routing optimization data;

[0063] Step S365: performing stacking structure allocation according to the signal routing optimization data, thereby obtaining signal layer layout optimization data.

[0064] The present invention helps to identify and quantify the significant crosstalk areas existing in the signal line by performing crosstalk intensity statistics according to the signal crosstalk path data, and provides a basis for subsequent adjustments. By adjusting the signal routing of the high-intensity signal crosstalk path data, the interference overlap can be reduced and the signal transmission path can be optimized, thereby improving the anti-crosstalk capability of the overall circuit. Increasing the signal line spacing can effectively reduce the coupling effect between signals, reduce capacitive and inductive coupling, and thus reduce the probability and intensity of signal crosstalk. According to the signal routing adjustment data and the signal line spacing increase data, the signal routing optimization feature fusion is performed, and the comprehensive adjustment measures can be achieved to achieve the global optimization of the signal routing and enhance the reliability of signal transmission. Finally, by performing stacked structure allocation according to the signal routing optimization data, the reasonable arrangement and layout optimization of the signal in the multi-layer circuit board can be ensured, and the electromagnetic compatibility can be further improved, and interference and noise can be reduced, thereby enhancing the stability and signal integrity of the device in a complex electromagnetic environment.

[0065] Optionally, the present specification also provides a computer-readable storage medium storing a computer program, wherein when the computer program is executed by a processor, any one of the methods for sending and receiving data based on a circuit board is implemented.

[0066] Optionally, the present specification further provides a system for sending and receiving data based on a circuit board, which is used to execute the method for sending and receiving data based on a circuit board as described above, and the system for sending and receiving data based on a circuit board includes:

[0067] A signal crosstalk analysis module is used to obtain circuit board design data, and perform signal layer wiring design feature extraction based on the circuit board design data, thereby obtaining signal layer wiring design data; perform signal crosstalk analysis based on the signal layer wiring design data, thereby obtaining signal crosstalk data;

[0068] The electromagnetic interference analysis module is used to extract the circuit board stacking structure features according to the circuit board design data, so as to obtain the circuit board stacking structure data; perform electromagnetic interference analysis according to the circuit board stacking structure data and the signal layer wiring design data, so as to obtain the circuit board electromagnetic interference data;

[0069] A signal layer layout optimization module is used to locate the crosstalk path according to the signal crosstalk data, thereby obtaining the signal crosstalk path data, and optimize the signal layer layout according to the signal crosstalk path data, thereby obtaining the signal layer layout optimization data;

[0070] A stacking structure adjustment module is used to visualize the electromagnetic interference distribution according to the electromagnetic interference data of the circuit board, thereby obtaining the electromagnetic interference distribution visualization data; and to adjust the stacking structure according to the electromagnetic interference distribution visualization data, thereby obtaining the stacking structure adjustment data;

[0071] The circuit board receiving and transmitting data test module is used to perform the circuit board receiving and transmitting data test according to the signal layer layout optimization data and the stacking structure adjustment data, so as to obtain the circuit board receiving and transmitting test data, and upload it to the circuit board receiving and transmitting data test platform to perform the receiving and transmitting data optimization task.

[0072] The present invention provides a system based on circuit board data transmission and reception. The system can implement any method based on circuit board data transmission and reception of the present invention, and is used to combine the operation and signal transmission medium between various modules to complete the method based on circuit board data transmission and reception. The internal modules of the system cooperate with each other, thereby realizing efficient optimization of circuit board transmission and reception performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0073] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments thereof made with reference to the following drawings:

[0074] Figure 1 A schematic diagram of the steps of the method for sending and receiving data based on a circuit board according to the present invention;

[0075] Figure 2 Detailed step flow diagram of step S1 in the present invention;

[0076] Figure 3 Detailed step flow diagram of step S12 in the present invention;

[0077] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0078] The following is a clear and complete description of the technical method of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by technicians in this field without creative work are within the scope of protection of the present invention.

[0079] In addition, the accompanying drawings are only schematic illustrations of the present invention and are not necessarily drawn to scale. The same reference numerals in the figures represent the same or similar parts, and their repeated description will be omitted. Some of the block diagrams shown in the accompanying drawings are functional entities and do not necessarily correspond to physically or logically independent entities. The functional entities can be implemented in software form, or implemented in one or more hardware modules or integrated circuits, or implemented in different networks and / or processor methods and / or microcontroller methods.

[0080] It should be understood that, although the terms "first", "second", etc. may be used herein to describe various units, these units should not be limited by these terms. These terms are used only to distinguish one unit from another unit. For example, without departing from the scope of the exemplary embodiments, the first unit may be referred to as the second unit, and similarly the second unit may be referred to as the first unit. The term "and / or" used herein includes any and all combinations of one or more of the listed associated items.

[0081] To achieve this, please refer to Figures 1 to 3 The present invention provides a method for sending and receiving data based on a circuit board, the method comprising the following steps:

[0082] Step S1: obtaining circuit board design data, and performing signal layer wiring design feature extraction according to the circuit board design data, thereby obtaining signal layer wiring design data; performing signal crosstalk analysis according to the signal layer wiring design data, thereby obtaining signal crosstalk data;

[0083] In this embodiment, circuit board design data is obtained from design software (such as Altium Designer, Cadence, etc.). Including the layout of each layer of the circuit board, signal layer wiring, component layout and connection mode. According to these design data, the signal layer wiring design features are extracted, mainly including information such as routing length, width, routing spacing, and via position. These features are obtained through data analysis algorithms (such as geometric shape extraction and matching technology), with special attention paid to the stability and consistency of signal layer wiring. Then, signal crosstalk analysis is performed using wiring data. Signal crosstalk analysis is performed using electromagnetic field simulation tools (such as ANSYS HFSS or CST) to analyze the transmission process of electrical signals in the signal layer and identify the mutual interference area between high-frequency signals. At this time, according to the threshold value (such as crosstalk tolerance) set by the circuit design specification, the crosstalk between the signals is calculated, the potential interference path is identified, and the signal crosstalk data is output. The crosstalk analysis obtains the crosstalk value and risk between signal pairs through multi-layer signal simulation calculation.

[0084] Step S2: extracting circuit board stacking structure features according to the circuit board design data, thereby obtaining circuit board stacking structure data; performing electromagnetic interference analysis according to the circuit board stacking structure data and the signal layer wiring design data, thereby obtaining circuit board electromagnetic interference data;

[0085] In this embodiment, by parsing the circuit board design data, the stacking structure characteristics of the circuit board are extracted, including information such as the material, thickness, and dielectric constant of each layer. The feature extraction of the stacked structure is usually implemented through the layer definition field in the PCB design file, such as layer spacing, dielectric layer material (such as FR4, ceramic, polyimide, etc.). Electromagnetic interference analysis is performed using an electromagnetic simulation tool combined with the stacking structure data and the signal layer wiring design data. Electromagnetic interference analysis simulates the electromagnetic interference effects on the circuit board by solving the electric field and magnetic field distribution. The analysis takes into account signal transmission at different levels and their interaction with the power supply and ground layer. According to the set electromagnetic interference tolerance standard (such as electromagnetic radiation level, radiation intensity threshold), the circuit board electromagnetic interference data is output, including interference sources and interference intensity, as well as the impact on signal integrity.

[0086] Step S3: performing crosstalk path positioning according to the signal crosstalk data, thereby obtaining the signal crosstalk path data, and performing signal interlayer layout optimization according to the signal crosstalk path data, thereby obtaining signal interlayer layout optimization data;

[0087] In this embodiment, the crosstalk path is located according to the results of the signal crosstalk analysis. By comparing the crosstalk data with the signal path in the circuit board design, the interference source and the affected signal path are calibrated to obtain the signal crosstalk path data. Then, the signal layer layout is optimized according to the signal crosstalk path data. The layout optimization is carried out according to the design rules (such as signal line spacing, via spacing, etc.), and the goal is to reduce the crosstalk effect and improve the signal transmission quality. The optimization method can use a wiring adjustment algorithm, such as layout adjustment based on simulated annealing or genetic algorithm. In this process, parameters such as signal line spacing and routing paths are continuously adjusted until the preset electrical and physical rules are met, and finally the signal layer optimization data is obtained to ensure that the interference between signals is minimized.

[0088] Step S4: Visualizing the electromagnetic interference distribution according to the electromagnetic interference data of the circuit board, thereby obtaining the electromagnetic interference distribution visualization data; adjusting the stacking structure according to the electromagnetic interference distribution visualization data, thereby obtaining the stacking structure adjustment data;

[0089] In this embodiment, electromagnetic simulation software (such as CST Studio or COMSOL) is used to visualize the electromagnetic interference data of the circuit board. The visualization of electromagnetic interference distribution includes the distribution of electromagnetic field strength, the location of the interference source, and the extension of the interference area. Through this visualization, engineers can clearly identify the areas with the most serious electromagnetic interference. Subsequently, the stacked structure is adjusted according to the signal crosstalk analysis and the electromagnetic interference distribution diagram. During the adjustment process, the impact of electromagnetic interference on the signal can be reduced by changing the order of the layers, adding a shielding layer, and optimizing the design of the ground layer or the power layer. The goal of stacked structure adjustment is to improve signal integrity and reduce signal attenuation and distortion by improving the physical structure. The adjusted data is recorded as stacked structure adjustment data to provide a basis for subsequent testing and verification.

[0090] Step S5: Perform circuit board transceiver data testing according to the signal layer layout optimization data and the stacking structure adjustment data, thereby obtaining circuit board transceiver test data, and uploading it to the circuit board transceiver data test platform to execute the transceiver data optimization task.

[0091] In this embodiment, the signal interlayer layout optimization data and stacked structure adjustment data obtained by the above optimization are used to test the receiving and sending data of the circuit board. The test uses dedicated test equipment (such as an oscilloscope, a signal source, and a data acquisition system) to test the signal transmission characteristics of the circuit board, including the transmission rate, delay, amplitude, distortion, etc. of the signal. During the test, the appropriate test signal frequency range and amplitude standard are set according to the test requirements, and the actual measurement results are compared with the theoretical results to evaluate the receiving and sending performance of the circuit board. Automatic test equipment (ATE) is also used for batch testing during the test, and the signal transmission performance is further optimized by adjusting parameters (such as power supply voltage, signal frequency, etc.). The test results are uploaded to the circuit board receiving and sending data test platform, and data analysis and processing are performed through the cloud platform to complete the receiving and sending data optimization task and ensure that the signal transmission performance of the circuit board meets the design requirements.

[0092] Optionally, step S1 specifically includes:

[0093] Step S11: obtaining circuit board design data, and performing signal layer wiring design feature extraction according to the circuit board design data, thereby obtaining signal layer wiring design data;

[0094] In this embodiment, the design data of the circuit board is exported from the circuit board design software (such as Altium Designer, Cadence, etc.). These data include the layout of each layer of the circuit board, the structure of the signal layer wiring, the routing path, the position of the components, the via configuration, the wiring width and spacing, etc. The signal layer wiring design features are extracted by parsing these design data. The direction, length, spacing, via position of each signal line and the physical relationship between adjacent signal lines are obtained by a geometric analysis algorithm. For each signal line, the coordinates of its starting point and end point are analyzed, and the geometric features of each routing (such as slope, curvature, etc.) are calculated. According to the signal layer wiring design data, various electrical characteristics are extracted, including parameters such as the type of signal routing, characteristic impedance, and signal frequency range, which will be used for subsequent signal quality analysis and optimization.

[0095] Step S12: performing routing angle abnormality analysis on the signal layer wiring design data, thereby obtaining signal routing angle abnormality data;

[0096] In this embodiment, the angle of each signal routing is extracted through geometric analysis. The angle between the starting point and the ending point of each routing segment is calculated, and the routing angle is checked according to the set standard (for example, the routing angle should be between 30 degrees and 45 degrees). If the routing angle exceeds the predetermined threshold, the routing angle is considered abnormal. Abnormal angles cause reflections and losses in signal transmission, affecting signal quality. The set angle abnormality standard is usually an angle that is too large or too small, and routing segments that exceed this range are considered abnormal. All signal lines that do not meet the angle standard are marked as angle abnormalities, and the signal routing angle abnormality data is output for subsequent optimization.

[0097] Step S13: performing routing impedance anomaly analysis on the signal layer wiring design data, thereby obtaining signal routing impedance anomaly data;

[0098] In this embodiment, the characteristic impedance of each signal line is calculated based on the width of the signal line, the spacing, the thickness of the signal layer, and the dielectric constant of the material. Common signal line impedance values ​​should meet certain standards, for example, 50Ω for series signals and 100Ω for differential signals. Use electromagnetic field simulation tools or signal integrity analysis tools (such as ANSYS HFSS, Cadence Sigrity) to perform impedance analysis on the signal lines, calculate the actual impedance value and compare it with the impedance value required by the design. If the impedance value of the signal line deviates from the set value by more than a certain tolerance (usually within 5%), the line is considered to have impedance anomalies. Finally, the system outputs the impedance anomaly data of each signal line, marks the line parts that do not meet the standards, and provides a basis for subsequent optimization and adjustment.

[0099] Step S14: performing signal routing anomaly integration according to the signal routing angle anomaly data and the signal routing impedance anomaly data, thereby obtaining signal routing anomaly data;

[0100] In this embodiment, the detected abnormal data is collected and integrated to generate a comprehensive abnormality report. For each signal line, check whether it has both angle abnormalities and impedance abnormalities. If a signal line is abnormal in both dimensions, the degree of abnormality of the signal line is more serious and needs to be optimized first. During the integration process, a weight parameter is set to assign different weight values ​​to angle abnormalities and impedance abnormalities. The weight ratio can usually be determined based on design requirements and signal frequency and other factors. Then, based on the comprehensive abnormal data, all abnormal signal routings are classified, and the signal routing abnormality data is output, including detailed information on various abnormalities, such as abnormal location, abnormality type, severity, etc., to facilitate subsequent optimization and adjustment.

[0101] Step S15: performing signal crosstalk evaluation according to the signal routing anomaly, thereby obtaining signal crosstalk data.

[0102] In this embodiment, the signal lines that generate crosstalk are identified based on the abnormal data of the signal routing (including angle anomalies and impedance anomalies). Signal crosstalk usually occurs when the routing is too close, the angle is inappropriate, or the impedance is mismatched. These factors can cause mutual interference between signals. Use electromagnetic simulation tools (such as CST Studio, HFSS, etc.) to simulate the propagation process of the signal in the routing and analyze the crosstalk effect between signals. For each pair of signal lines that are subject to crosstalk, calculate the coupling strength and compare it with the preset crosstalk tolerance threshold. If the coupling strength exceeds the threshold, it is considered that these signal lines have crosstalk problems. Output signal crosstalk data, including the signal pairs where crosstalk occurs, the crosstalk strength, and the affected signal quality, for further optimization and rectification.

[0103] Optionally, step S12 is specifically:

[0104] Step S121: extracting signal routing coordinate features from the signal layer wiring design data, thereby obtaining signal routing coordinate data;

[0105] In the present embodiment, the wiring design data of the signal layer is extracted from the circuit board design file, including the coordinate information of each signal line. The data is usually generated by circuit board design software (such as Altium Designer, Cadence, etc.) and exported in a standard file format (such as Gerber file). By parsing these design files, the starting and ending coordinates of each signal line can be obtained and expressed in a two-dimensional coordinate system. For each routing, the coordinate information of all its intermediate nodes (such as the coordinates of each bending point) is extracted and recorded. These coordinate data are the basis for further signal routing path analysis and optimization. The coordinate data needs to be standardized to ensure data consistency, such as converting the coordinates to a unified unit (such as millimeters or micrometers) for subsequent processing and analysis.

[0106] Step S122: Draw a signal routing path diagram according to the signal routing coordinate data, thereby obtaining a signal routing path diagram;

[0107] In this embodiment, through coordinate data, each point of the signal routing is connected in sequence using a visualization tool (such as AutoCAD, Matplotlib or other design software) to generate a signal routing path diagram. The path diagram shows the overall layout of the signal line from the starting point to the end point, including the straight line segment and the bending segment of the routing. This process will ensure that the structure and morphology of the routing are clearly visible, and provide a visual basis for subsequent analysis such as bending point detection and angle calculation. During the path diagram drawing process, each path of the signal routing should be drawn according to predetermined design rules, such as minimum spacing, routing width, etc., to ensure that the graphics meet the actual design requirements. The routing path diagram finally generated will serve as the basic data for further analysis.

[0108] Step S123: identifying the bending point area according to the signal routing path diagram, thereby obtaining the signal routing bending point area data;

[0109] In this embodiment, a geometric analysis method is used to identify the bending point according to the change of the path through each signal routing line in the path diagram. The bending point is usually the turning point of the path, and the position where the direction of the signal line changes significantly. The algorithm identifies the bending point by calculating the angle change between adjacent points. For example, if the angle between three adjacent points is greater than a predetermined value (such as 45 degrees), the turning position between the three points is considered to be a bending point. The coordinates of all bending points and the corresponding routing paths will be recorded as the basis for subsequent angle calculations and signal optimization. The purpose of this step is to divide the morphology of the signal routing in detail and provide accurate data for further analysis and optimization of the signal routing.

[0110] Step S124: Calculate the angle of the signal routing bend point area data to obtain the signal routing angle data;

[0111] In this embodiment, the signal routing angle at each bending point is calculated by identifying the bending point area. The calculation method is based on the angle between two adjacent line segments. For each bending point, the angle of the two intersecting line segments is calculated, and the vector inner product formula is usually used to determine the angle. If the angle between two adjacent line segments of the signal routing is large (such as greater than 90 degrees), signal attenuation or reflection will occur, affecting the signal quality. This step will calculate the angles of all bending points and verify the angles according to the design requirements to ensure that the routing angles meet the design standards. These angle data will provide a basis for subsequent angle anomaly detection and optimization.

[0112] Step S125: obtaining high-speed signal transmission design rules, and setting signal routing angle thresholds according to the high-speed signal transmission design rules, thereby obtaining signal routing angle threshold data;

[0113] In this embodiment, design rules related to high-speed signal transmission are obtained. These rules are usually provided by circuit board design standards, industry specifications (such as IPC-2221A) or specific high-speed signal transmission standards (such as USB, HDMI, etc.). For the angle of signal routing, the design rules specify the maximum allowable angle, for example, the routing bending angle should be limited to within 45 degrees to avoid signal reflection and loss caused by larger angles. According to the frequency of the signal, the signal type (single-ended or differential) and the signal transmission rate, the applicable angle threshold is determined. For high-speed signals, the routing angle is generally required to be less than or equal to 45 degrees to ensure the integrity of the signal. The threshold is set as a standardized parameter and applied to the subsequent angle anomaly comparison process.

[0114] Step S126: performing abnormal angle comparison on the signal routing angle data according to the signal routing angle threshold data, thereby obtaining abnormal signal routing angle data.

[0115] In this embodiment, the signal routing angle data of each bending point is collected and compared with the set angle threshold. If the angle of any bending point exceeds a predetermined threshold (for example, 45 degrees), the bending point is considered abnormal. Routing at abnormal angles causes problems such as signal reflection, attenuation, and crosstalk, so it needs to be optimized first. The system records all bending points that exceed the threshold and outputs signal routing angle abnormality data, including abnormal angle values, abnormal positions, and affected ranges. These data will provide an important basis for further optimizing the signal routing design.

[0116] Optionally, step S13 is specifically:

[0117] Step S131: extracting via position features and signal line spacing features from the signal layer wiring design data, thereby obtaining via position data and signal line spacing data;

[0118] In this embodiment, the via position can usually be extracted through a Gerber file or ODB++ file generated by a circuit board design tool (such as Altium Designer, Cadence, etc.), which contains the location coordinates of the via and the type of the via (such as an electrical via or a mechanical via). The extraction of the signal line spacing depends on the signal layer wiring data. By calculating the minimum distance between adjacent signal lines, the spacing between each pair of signal lines is extracted. The signal line spacing is critical to signal integrity. Too small a spacing causes crosstalk or electromagnetic interference, so it should be extracted strictly in accordance with the design specifications. The extracted via position data and signal line spacing data will be stored as two data sets, respectively, as the basis for subsequent signal transmission simulation and signal distortion analysis.

[0119] Step S132: performing signal transmission simulation according to the via position data and the signal line spacing data, thereby obtaining signal transmission data;

[0120] In this embodiment, the signal transmission simulation needs to consider the material of the circuit board, the signal frequency, the length of the routing and the influence of the via. Electromagnetic field simulation tools (such as Ansys HFSS, Keysight ADS, etc.) are usually used for signal transmission analysis. In this step, the model should include the geometry of the signal routing, the position of the via, the spacing between the signal lines and other characteristics of the electromagnetic environment. During the simulation process, based on the finite element method (FEM) or the finite difference time domain method (FDTD), the propagation behavior of the signal in the routing is simulated, and the reflection, attenuation and other effects of the signal are analyzed. Through these simulations, key data in the signal transmission process, such as signal transmission delay, signal amplitude attenuation and signal distortion, etc., can be obtained.

[0121] Step S133: performing signal distortion analysis according to the signal transmission data, thereby obtaining signal distortion data;

[0122] In this embodiment, signal distortion is usually manifested as a change in the waveform of the signal, including a decrease in amplitude, a distortion of the waveform, etc. In this step, the time domain data in the simulation results (such as the time delay of the signal, the amplitude attenuation, etc.) is used to perform a distortion type analysis. The degree of distortion of the signal during transmission can be evaluated by calculating indicators such as the waveform distortion of the signal, the distortion amount of the differential mode and the common mode. Distortion analysis usually uses a regression model of the signal to compare the difference between the ideal signal and the actual signal, and calculates the error degree of the signal. For paths with large signal distortion, the causes of the distortion should be identified, such as too long routing, unreasonable via design, or too small spacing between signal lines.

[0123] Step S134: capturing reflected wave data of the signal distortion data, thereby obtaining reflected wave data;

[0124] In this embodiment, the reflected wave is a signal reflected back due to the impedance mismatch of the signal, which will interfere with the transmission of the original signal and cause the signal quality to deteriorate. Through time domain analysis tools (such as TDR, S parameter testing, etc.), the reflected wave generated by the detection signal during the transmission process. The capture of the reflected wave requires the analysis of the reflection coefficient of the signal, and VSWR (voltage standing wave ratio) is usually used to quantify the intensity of the reflected wave. In this process, the time position and amplitude of the signal echo are detected to capture all the reflected wave data. The characteristics of each reflected wave will be recorded, including the peak value of the reflected wave, the frequency response and the location where it occurs.

[0125] Step S135: performing amplitude statistics according to the reflected wave data, thereby obtaining high reflection amplitude data;

[0126] In this embodiment, by analyzing the amplitude of each reflected wave, the statistical data such as the maximum amplitude, minimum amplitude and average amplitude of the reflected wave are calculated. The amplitude of the reflected wave is closely related to the impedance matching of the signal. When the amplitude of the reflected wave is large, it means that the impedance mismatch in the signal transmission process is more serious, resulting in higher signal loss and quality degradation. At this time, the reflected waves are classified based on the set threshold (such as the reflected wave amplitude is greater than a preset value, such as -10dB), and the signal path with high reflection amplitude is screened out. The amplitude statistical results of the reflected wave will provide key data basis for the subsequent impedance anomaly analysis.

[0127] Step S136: performing reflection delay time statistics according to the reflected wave data to obtain reflection delay time data, and performing reflection delay position calculation according to the reflection delay time data to obtain reflection delay position data;

[0128] In this embodiment, the reflection delay time refers to the time it takes for a signal to be reflected and returned from the transmitting source to the receiving point. Through time domain analysis, the delay time of each reflected wave is recorded, and is usually measured using a time domain reflectometer (TDR) with a time resolution of nanoseconds. Then, based on the propagation speed of the signal, the delayed position of the reflected wave, that is, the position where the reflected wave occurs, is calculated. The reflection delay position refers to the position of the reflected wave from the signal source to the reflection source, which is usually related to the impedance change in the signal transmission path. The data of the reflection delay time and delay position will provide accurate data support for the subsequent impedance anomaly intersection operation, helping to identify key areas that affect signal quality.

[0129] Step S137: performing impedance anomaly intersection operation according to the reflection delay position data and the high reflection amplitude data, so as to obtain signal line impedance anomaly data.

[0130] In this embodiment, the amplitude and delay position of the reflected wave reflect the impedance mismatch in the signal transmission path. By combining the high amplitude data of the reflected wave with the reflection delay position data, the intersection area of ​​the impedance mismatch is calculated. Usually, the impedance of each node is calculated using the impedance matching standard (such as the S11 parameter), and the area with abnormal impedance is identified. Through the intersection operation, the impedance mismatch position in the signal routing is determined, and the signal routing impedance abnormality data is output. This data will help discover and optimize potential impedance problems in the design stage to ensure signal integrity and transmission efficiency.

[0131] Optionally, step S133 is specifically:

[0132] Perform fast Fourier transform according to the signal transmission data to obtain the signal transmission spectrum diagram;

[0133] In this embodiment, it is necessary to obtain time domain signal data from the signal transmission simulation. The time domain signal data represents the amplitude and waveform of the signal changing over time. Then, the fast Fourier transform (FFT) is applied to perform frequency domain conversion on these time domain signals. The FFT algorithm decomposes the time signal into different frequency components to obtain the distribution of the signal in the frequency domain. Specifically, FFT inputs the time domain data of the signal into the algorithm, calculates the amplitude and phase information of each frequency point, and generates a spectrum diagram. The spectrum diagram shows the intensity of each frequency component in the signal and is often used to analyze the frequency characteristics of the signal, such as the bandwidth and frequency distribution of the signal. For high-frequency signals, it is usually necessary to set a frequency range (such as 0-6GHz) and output the frequency component diagram within the range through FFT. The accuracy and resolution of FFT are determined by the sampling rate and number of sampling points of the signal. Usually, a suitable sampling rate is selected to ensure the integrity and accuracy of the spectrum diagram.

[0134] Perform spectrum statistics on the signal transmission spectrum diagram to obtain high-frequency spectrum signal transmission data;

[0135] In this embodiment, spectrum statistical analysis is performed based on the signal transmission spectrum diagram, with the purpose of identifying high-frequency components in the spectrum. By analyzing the frequency distribution in the spectrum diagram, the spectral characteristics of the signal can be quantified, especially focusing on the high-frequency signal components. The frequency components and the corresponding amplitude data are extracted from the spectrum diagram, and then the high-frequency part is subjected to specific statistical processing. For example, a threshold value (such as a frequency range above 1 GHz) is set to identify the frequency components within this range. Spectral statistics include calculating the power spectral density (PSD) of the spectrum and analyzing the power distribution of the signal in the high-frequency region. By statistics on high-frequency components, high-frequency signal transmission data in the spectrum can be identified, and these high-frequency data will affect the transmission quality of the signal, such as signal attenuation, interference, etc. High-frequency signals usually require special attention because they will decay rapidly during long-distance transmission, affecting the integrity of the signal.

[0136] Performing phase curve jump identification on high-frequency spectrum signal transmission data to obtain phase curve jump data;

[0137] In this embodiment, the extracted high-frequency spectrum signal transmission data is subjected to phase curve analysis, and phase jumps therein are identified. A phase jump refers to a sudden change in the phase of a signal in the frequency domain, which usually indicates interference or discontinuity of the signal. The identification of phase curve jumps is performed by calculating the phase change of the signal in the spectrum diagram. First, the phase information in the high-frequency spectrum area is extracted, and the phase difference between adjacent frequency points is calculated. When the phase difference exceeds a preset threshold (for example, a phase jump is set when the phase change is greater than 180 degrees). It is considered that a phase jump has occurred. By identifying phase jumps, problem areas in the signal transmission process can be marked, such as phase problems caused by discontinuous transmission lines or impedance changes in the signal transmission path. Phase jump data is crucial for analyzing the stability and quality of signals, and it helps to identify abnormal phenomena in the signal transmission process.

[0138] Perform nonlinear offset identification on high-frequency spectrum signal transmission data, thereby obtaining signal line nonlinear offset data;

[0139] In this embodiment, nonlinear offset analysis is performed on the high-frequency signal transmission data to identify the nonlinear distortion of the signal. The nonlinear offset of the signal is manifested as a nonlinear change in the signal amplitude and phase, which is usually related to nonlinear elements in the signal path (such as amplifiers, transformers, etc.) or nonlinear effects in the transmission process (such as reflection, distortion, etc.). By analyzing the nonlinear behavior of the signal spectrum diagram, Fourier series expansion or regression analysis is used to identify the nonlinear offset in the frequency component. For example, the spectrum of the high-frequency part is analyzed to identify the nonlinear relationship between the amplitude and phase, and the nonlinear offset data is identified by setting a threshold (for example, setting a nonlinear offset greater than 10% to be considered abnormal). These data help to reveal the degree of distortion of the signal during transmission and provide an important basis for subsequent distortion analysis.

[0140] Performing phase distortion intersection operation according to phase curve jump data and signal line nonlinear offset data, thereby obtaining phase distortion data;

[0141] In this embodiment, the phase curve jump data and the signal line nonlinear offset data are used to perform an intersection operation to calculate the phase distortion. The purpose of the intersection operation is to combine the two types of data to identify the phase distortion area during the signal transmission process. First, the data of the phase jump area and the nonlinear offset area are overlapped and calculated to identify the areas where both phase jumps and nonlinear offsets exist. In these areas, the phase distortion of the signal will be more serious, resulting in a decrease in the stability of the signal. When performing the intersection operation, a statistical method (such as the least squares method) can be used to calculate the combined area of ​​the two and output the phase distortion data of the signal. This data represents the degree of phase distortion of the signal, helps identify key problem areas in the signal transmission process, and provides a basis for optimizing signal quality and improving transmission stability.

[0142] The signal distortion area of ​​the signal transmission spectrum diagram is located according to the phase distortion data, so as to obtain the signal distortion data.

[0143] In this embodiment, based on the phase distortion data calculated previously, the area where the signal is distorted in the spectrum diagram is marked. The spectrum diagram can be divided into distortion areas by setting a distortion threshold (for example, setting the distortion to be greater than 30% as a distortion area). By calibrating the phase distortion area, the damaged area of ​​the signal in the frequency domain can be accurately located, which helps to further analyze the impact of signal distortion on transmission quality. The location of the distortion area helps to optimize the circuit board design, improve the signal transmission quality, and reduce system failures or performance degradation caused by signal distortion.

[0144] Optionally, step S3 specifically includes:

[0145] Step S31: extracting signal crosstalk area features according to the signal crosstalk data, thereby obtaining signal crosstalk area data;

[0146] In this embodiment, signal crosstalk usually occurs between adjacent wires, especially when the signal frequency is high. In order to identify the signal crosstalk area, the electromagnetic interference between the signal lines in the circuit is first analyzed. Use electromagnetic simulation tools (such as ANSYS HFSS or COMSOL Multiphysics) to simulate signal propagation and calculate the coupling effect of signals at different frequencies and different signal line spacings. By analyzing the distribution of electric and magnetic fields between signal lines, areas that are greatly affected by crosstalk can be identified. The characteristics of the signal crosstalk area include electric field strength, coupling coefficient, and wire spacing. During signal transmission, when the coupling coefficient of adjacent signal lines reaches a preset threshold (for example, more than 0.5), the area is considered to be a potential signal crosstalk area. Extract the data of these areas, including their location, range of influence, and coupling strength, for subsequent processing.

[0147] Step S32: performing electric field distribution simulation on the signal crosstalk area data to obtain electric field distribution data;

[0148] In the present embodiment, electromagnetic field simulation tools, such as ANSYS HFSS or CST Studio Suite, are used to input the data of signal routing into a simulation model, simulate the propagation process of signals at different frequencies, and pay special attention to the electric field distribution in the signal crosstalk region. By setting appropriate simulation parameters (such as simulation frequency range, conductor material, dielectric constant, etc.), the distribution of electric field in the circuit can be calculated. Electric field distribution data provide detailed information of signal interaction, especially electric field strength and distribution area for circuit design. The data can help identify the intensity area of ​​signal crosstalk, particularly the area with higher electric field strength, indicating that signal interference is more serious in these areas. Electric field distribution data is usually presented by a three-dimensional visualization tool, which is convenient for engineers to further analyze and optimize high-intensity interference areas.

[0149] Step S33: performing current density statistics according to the electric field distribution data, thereby obtaining high-density current distribution data;

[0150] In this embodiment, the current density is a function of the electric field distribution, which represents the amount of current passing through a unit area. First, according to the electric field distribution data, Ohm's law (J = σE, where J is the current density, σ is the conductivity, and E is the electric field strength) is used to calculate the current density distribution. By statistically analyzing the current density, the high-density area of ​​current distribution during signal transmission can be obtained. When using simulation tools, different material conductivities and electric field strengths can be set to obtain current density data in different areas. High current density areas are usually associated with hot spots of signal crosstalk, so further design optimization is required in these areas. High-density current distribution data is usually obtained through thermal analysis and current analysis tools, such as by calculating the specific value of current density through finite element analysis (FEA), and performing thermal simulation predictions.

[0151] Step S34: performing hotspot identification on the signal crosstalk area data according to the high-density current distribution data, thereby obtaining signal crosstalk hotspot area data;

[0152] In this embodiment, signal crosstalk hotspots refer to areas with high current density. These areas cause signal quality degradation due to excessive current density, and even cause thermal failure or material damage. Set a current density threshold (such as when the current density exceeds a certain value, such as 100A / m 2When the current density is higher than the threshold, it is considered a hot spot. Area calibration is performed based on the current density data to identify areas where the current density is higher than the threshold and define them as signal crosstalk hot spots. These hot spots usually appear in areas where signal lines cross, where the routing is tight, or where there is frequent interference. Through accurate current density analysis, these key areas can be located, providing a basis for subsequent optimization design.

[0153] Step S35: performing signal path tracing according to the signal crosstalk hotspot area data, thereby obtaining signal crosstalk path data;

[0154] In this embodiment, by locating the signal crosstalk hotspot area, the signal transmission path in the area is analyzed. Signal path tracing refers to analyzing the signal transmission path and interference source in the wiring starting from the hotspot area. Electromagnetic simulation tools (such as TracePro or HyperLynx) can be used to perform path simulation to identify which lines or paths the signal passes through are affected by crosstalk. During the signal path tracing process, detailed signal crosstalk path data is obtained by taking into account factors such as the signal propagation speed, path length, and the influence of adjacent lines. In this way, it can be clarified which paths are most affected by crosstalk, and provide a basis for subsequent design adjustments.

[0155] Step S36: Optimize the signal layer layout according to the signal crosstalk path data, so as to obtain signal layer layout optimization data.

[0156] In this embodiment, by analyzing the signal path data, the areas and paths with the most serious signal crosstalk are identified, and the specific reasons for the signal quality problems are analyzed. According to the identified signal crosstalk path, the wiring design of the signal layer is adjusted to reduce the occurrence of crosstalk. For example, the spacing between signal lines can be increased, the direction of the signal lines can be rearranged, and a shielding layer can be used to isolate the crosstalk. By optimizing the layout of the signal layer, the interference between signals can be effectively reduced and the stability and accuracy of signal transmission can be improved. The signal layer layout optimization data includes the optimized signal line position, spacing, layout method, etc., and is usually verified by simulation tools to ensure that the optimized design can meet the electromagnetic compatibility (EMC) requirements.

[0157] Optionally, step S35 is specifically:

[0158] Step S351: extracting the hotspot area routing coordinates of the signal crosstalk hotspot area data according to the signal routing coordinate data, thereby obtaining the signal crosstalk hotspot area routing coordinates data;

[0159] In this embodiment, the signal routing coordinate data is usually derived from a circuit design file, such as a PCB wiring diagram, which contains the starting and ending coordinate information of all signal lines. The signal crosstalk hotspot area data is a high-density current area or an area with a large electric field intensity extracted by the aforementioned steps. By locating the hotspot area, the coordinates of the signal routing involved in the hotspot area are extracted. According to the design drawing of the signal routing, the data of the hotspot area is matched with the signal routing coordinates, and the specific coordinates of the signal routing in the hotspot area are obtained by using geometric operations or spatial query technology. These coordinate data include the starting position, the end position and each intermediate node along the signal line, which provide basic data for subsequent topology construction.

[0160] Step S352: constructing topology according to the routing coordinate data of the signal crosstalk hotspot area, thereby obtaining routing topology structure data of the signal crosstalk hotspot area;

[0161] In the present embodiment, the topological structure data reflects the connection relationship and transmission path between the signal lines. Through geometric analysis tools, such as CAD software or circuit simulation tools (such as Altium Designer, Autodesk Eagle, etc.), the signal routing in the hot spot area is analyzed for connection relationship, and a topological diagram of the signal routing is constructed. This topological diagram is composed of the nodes and edges of the signal lines, and the nodes represent the starting point or end point of the signal lines, and the edges represent the connection relationship between the signal lines. When constructing the topology, it is necessary to pay attention to the physical connection, intersection, branching and other structures of the signal lines, which all affect the occurrence and transmission of signal crosstalk. The signal routing topological structure data finally obtained includes the coordinates of the nodes and edges and the connectivity information of the signal lines, which provides basic structural data for the path search algorithm.

[0162] Step S353: performing a path depth-first search on the routing topology data of the signal crosstalk hotspot area according to the high-density current distribution data, thereby obtaining path depth-first search data;

[0163] In this embodiment, a depth-first search algorithm (DFS) is used to perform a path search on the routing topology structure of the signal crosstalk hotspot area to obtain path depth-first search data. Depth-first search is a traversal algorithm that starts from a node in a graph structure and goes deep along the edge of the graph until the end is reached or there are no accessible nodes. Through DFS, the transmission path of the signal in the hotspot area can be traced to identify the crosstalk path of the signal. When using DFS, it is first necessary to set the priority for the signal path according to the high-density current distribution data, and the weight of the signal path is usually defined by the current density or the electric field strength. Paths with higher current density indicate that the influence of signal transmission is greater, so these paths are traversed preferentially during the search process. The result of the depth-first search is the traversal order of the path and the connection status of the signal line, specifically including the starting node, the end node of each path, and all the intermediate nodes encountered during the path process.

[0164] Step S354: performing a path breadth-first search on the routing topology data of the signal crosstalk hotspot area according to the high-density current distribution data, thereby obtaining path breadth-first search data;

[0165] In this embodiment, a breadth-first search algorithm (BFS) is used to perform a path search on the routing topology structure of the signal crosstalk hotspot area to obtain path breadth-first search data. Breadth-first search is a graph traversal algorithm that uses a hierarchical traversal method. Starting from a certain node, it first visits all its adjacent nodes, and then visits the neighbor nodes of the adjacent nodes in turn. In this way, BFS can obtain the shortest path from the starting node to the target node, which is suitable for finding the path where crosstalk occurs in signal transmission. Unlike DFS, BFS usually selects nodes closer to the starting point when selecting a path, so it can effectively locate the key area in the signal transmission path. In this step, weights are also set for the paths based on the high-density current distribution data, and paths with higher current density will be given priority in the search. Through BFS, the path breadth-first search data obtained includes the traversal order of each path, the path length, and the status information of each node.

[0166] Step S355: merging signal crosstalk paths according to the path depth-first search data and the path breadth-first search data, thereby obtaining signal crosstalk path data.

[0167] In this embodiment, the merging of signal crosstalk paths is to integrate the path information obtained by two different search methods to form a comprehensive signal transmission path diagram. The results of DFS and BFS are compared to identify the intersection of the two paths, that is, the paths that appear in both searches, and these paths are analyzed in detail. For paths where there is no intersection, the connection relationship and path information of the signal lines are merged to ensure that each path can be fully displayed in the entire system. Through this merging method, more accurate signal crosstalk path data can be obtained. Signal crosstalk path data usually includes the connection order of the path, node information in the path, current density and electric field distribution of each path, etc., to help further optimize the signal wiring design and reduce the impact of crosstalk.

[0168] Optionally, step S36 is specifically:

[0169] Step S361: performing crosstalk intensity statistics according to the signal crosstalk path data, thereby obtaining high-intensity signal crosstalk path data;

[0170] In this embodiment, according to the signal crosstalk path data, the crosstalk intensity calculation formula is used to perform intensity statistics. The signal crosstalk intensity is usually calculated based on parameters such as electric field strength and power transmission. The crosstalk intensity of each signal path during transmission is calculated using a circuit simulation tool (such as SPICE simulation software) or a custom calculation script. The mutual influence coefficient between the signal paths is obtained, and the crosstalk effect is modeled based on electromagnetic field theory to calculate the electric field coupling intensity between the two signal paths. When the distance between the signal paths is close or there is a poor layout between the paths, the crosstalk intensity will increase. The crosstalk intensity values ​​obtained by statistics are used to determine which paths have a large crosstalk effect, and high-intensity signal crosstalk path data are screened out by setting a threshold (for example, a path with a crosstalk intensity exceeding a certain set value is defined as a high-intensity crosstalk path). These data provide guidance for subsequent optimization and adjustment.

[0171] Step S362: performing signal routing adjustment on the high-intensity signal crosstalk path data, thereby obtaining signal routing adjustment data;

[0172] In the present embodiment, it is necessary to adjust these paths using layout optimization tools (such as Autodesk Eagle, Altium Designer, etc.) according to the high-intensity signal crosstalk path data. The adjustment method includes changing the starting or ending position of the signal routing, increasing the spacing between the signal lines, or changing the direction of the signal path. The adjustment of the signal routing is carried out by an optimization algorithm (such as a simulated annealing algorithm or a genetic algorithm), and the goal is to reduce the coupling strength between the signals and reduce the impact of crosstalk. During the adjustment process, it is necessary to set parameters, such as the minimum spacing standard, the maximum bending angle, the length limit of the signal routing, etc., to ensure that the optimized design meets the circuit design specifications and physical constraints. Through adjustment, the optimized signal routing data is finally obtained, which reflects the adjusted path, node position and routing layout, and provides data support for subsequent signal line spacing adjustment and stacked structure allocation.

[0173] Step S363: increasing the signal line spacing for the high-intensity signal crosstalk path data, thereby obtaining signal line spacing increase data;

[0174] In this embodiment, according to the characteristics of the signal crosstalk path and the current density data, the areas where the crosstalk between the signal lines is more serious are identified. In these areas, the signal line spacing is adjusted by optimizing the design tool (such as Mentor Graphics or Cadence). According to the degree of electric field coupling between the signal lines, the minimum signal line spacing value is set. When the distance between the signal lines is less than this value, the spacing is automatically increased to ensure that the crosstalk is reduced to an acceptable range. In this process, it is necessary to determine the standards for the minimum and maximum signal line spacing, taking into account factors such as the size limit of the PCB board and the number of layers required. The adjusted signal line spacing increase data will record the new signal routing spacing and provide new layout information. This adjustment effectively reduces the signal crosstalk intensity and improves the stability of the circuit and the signal transmission quality.

[0175] Step S364: performing signal routing optimization feature fusion according to the signal routing adjustment data and the signal line spacing increase data, thereby obtaining signal routing optimization data;

[0176] In this embodiment, the data of the two are combined, and the signal routing is comprehensively optimized through an optimization algorithm (such as a weighted sum method and a least square method). The goal of the fusion is to comprehensively consider the adjustment of the signal routing and the result of the increase in the spacing between the signal lines, optimize the signal path layout, and thus achieve the optimization of signal transmission. In this process, it is necessary to define the optimization goals, such as reducing crosstalk, improving signal transmission quality, minimizing routing length, etc., and to ensure that the optimization results meet the design requirements by setting optimization constraints (such as PCB size restrictions, layout constraints, etc.). The signal routing optimization data will record the optimized routing path, signal line spacing, and current density data. These optimization data provide a basis for further optimization of the layout between signal layers.

[0177] Step S365: performing stacking structure allocation according to the signal routing optimization data, thereby obtaining signal layer layout optimization data.

[0178] In this embodiment, according to the obtained signal routing optimization data, including information such as signal path, signal line spacing, crosstalk intensity, etc., the designer will optimize the stacking structure of the PCB according to the signal transmission requirements, signal integrity requirements and layer number restrictions. The stacking structure allocation includes the reasonable allocation and optimization of the signal layer, the ground layer, and the power layer. By using circuit board layout design tools (such as Altium Designer, Cadence PCB Designer, etc.), the optimized signal routing path is allocated to different levels to ensure the signal transmission quality of each layer. In this process, the matching of the signal layer and the ground layer and the power layer needs to meet the design requirements such as EMI suppression and signal isolation. The optimal layout scheme can be achieved by setting the spacing of the interlayer signal routing, the stacking order of the signal, etc. The signal layer layout optimization data finally obtained includes the signal layer allocation results, the electrical connection relationship between the layers, and the routing path information of each layer, providing effective design data for subsequent production and manufacturing.

[0179] Optionally, the present specification also provides a computer-readable storage medium storing a computer program, wherein when the computer program is executed by a processor, any one of the methods for sending and receiving data based on a circuit board is implemented.

[0180] Optionally, the present specification further provides a system for sending and receiving data based on a circuit board, which is used to execute the method for sending and receiving data based on a circuit board as described above, and the system for sending and receiving data based on a circuit board includes:

[0181] A signal crosstalk analysis module is used to obtain circuit board design data, and perform signal layer wiring design feature extraction based on the circuit board design data, thereby obtaining signal layer wiring design data; perform signal crosstalk analysis based on the signal layer wiring design data, thereby obtaining signal crosstalk data;

[0182] The electromagnetic interference analysis module is used to extract the circuit board stacking structure features according to the circuit board design data, so as to obtain the circuit board stacking structure data; perform electromagnetic interference analysis according to the circuit board stacking structure data and the signal layer wiring design data, so as to obtain the circuit board electromagnetic interference data;

[0183] A signal layer layout optimization module is used to locate the crosstalk path according to the signal crosstalk data, thereby obtaining the signal crosstalk path data, and optimize the signal layer layout according to the signal crosstalk path data, thereby obtaining the signal layer layout optimization data;

[0184] A stacking structure adjustment module is used to visualize the electromagnetic interference distribution according to the electromagnetic interference data of the circuit board, thereby obtaining the electromagnetic interference distribution visualization data; and to adjust the stacking structure according to the electromagnetic interference distribution visualization data, thereby obtaining the stacking structure adjustment data;

[0185] The circuit board receiving and transmitting data test module is used to perform the circuit board receiving and transmitting data test according to the signal layer layout optimization data and the stacking structure adjustment data, so as to obtain the circuit board receiving and transmitting test data, and upload it to the circuit board receiving and transmitting data test platform to perform the receiving and transmitting data optimization task.

[0186] The present invention provides a system based on circuit board data transmission and reception. The system can implement any method based on circuit board data transmission and reception of the present invention, and is used to combine the operation and signal transmission medium between various modules to complete the method based on circuit board data transmission and reception. The internal modules of the system cooperate with each other, thereby realizing efficient optimization of circuit board transmission and reception performance.

[0187] Therefore, the embodiments should be regarded as illustrative and non-restrictive from all points, and the scope of the present invention is limited by the appended claims rather than the above description, and it is therefore intended that all changes falling within the meaning and range of equivalent elements of the application documents are included in the present invention.

[0188] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features invented herein.

Claims

1. A method for sending and receiving data based on a circuit board, characterized in that: The following steps are involved: Step S1: obtaining circuit board design data, and performing signal layer wiring design feature extraction according to the circuit board design data, thereby obtaining signal layer wiring design data; Perform signal crosstalk analysis based on signal layer wiring design data to obtain signal crosstalk data; Step S2: extracting circuit board stacking structure features according to circuit board design data, thereby obtaining circuit board stacking structure data; Perform electromagnetic interference analysis based on the circuit board stacking structure data and signal layer wiring design data to obtain the circuit board electromagnetic interference data; Step S3: performing crosstalk path positioning according to the signal crosstalk data, thereby obtaining the signal crosstalk path data, and performing signal interlayer layout optimization according to the signal crosstalk path data, thereby obtaining signal interlayer layout optimization data; Step S4: Visualizing the electromagnetic interference distribution according to the electromagnetic interference data of the circuit board, thereby obtaining the electromagnetic interference distribution visualization data; adjusting the stacking structure according to the electromagnetic interference distribution visualization data, thereby obtaining the stacking structure adjustment data; Step S5: Perform circuit board transceiver data testing according to the signal layer layout optimization data and the stacking structure adjustment data, thereby obtaining circuit board transceiver test data, and uploading it to the circuit board transceiver data test platform to execute the transceiver data optimization task.

2. The method for sending and receiving data based on a circuit board according to claim 1, characterized in that: Step S1 is specifically as follows: Step S11: obtaining circuit board design data, and performing signal layer wiring design feature extraction according to the circuit board design data, thereby obtaining signal layer wiring design data; Step S12: performing routing angle abnormality analysis on the signal layer wiring design data, thereby obtaining signal routing angle abnormality data; Step S13: performing routing impedance anomaly analysis on the signal layer wiring design data, thereby obtaining signal routing impedance anomaly data; Step S14: performing signal routing anomaly integration according to the signal routing angle anomaly data and the signal routing impedance anomaly data, thereby obtaining signal routing anomaly data; Step S15: performing signal crosstalk evaluation according to the signal routing anomaly, thereby obtaining signal crosstalk data.

3. The method for sending and receiving data based on a circuit board according to claim 2, characterized in that: Step S12 is specifically as follows: Step S121: extracting signal routing coordinate features from the signal layer wiring design data, thereby obtaining signal routing coordinate data; Step S122: Draw a signal routing path diagram according to the signal routing coordinate data, thereby obtaining a signal routing path diagram; Step S123: identifying the bending point area according to the signal routing path diagram, thereby obtaining the signal routing bending point area data; Step S124: Calculate the angle of the signal routing bend point area data to obtain the signal routing angle data; Step S125: obtaining high-speed signal transmission design rules, and setting signal routing angle thresholds according to the high-speed signal transmission design rules, thereby obtaining signal routing angle threshold data; Step S126: performing abnormal angle comparison on the signal routing angle data according to the signal routing angle threshold data, thereby obtaining abnormal signal routing angle data.

4. The method for sending and receiving data based on a circuit board according to claim 2, characterized in that: Step S13 is specifically as follows: Step S131: extracting via position features and signal line spacing features from the signal layer wiring design data, thereby obtaining via position data and signal line spacing data; Step S132: performing signal transmission simulation according to the via position data and the signal line spacing data, thereby obtaining signal transmission data; Step S133: performing signal distortion analysis according to the signal transmission data, thereby obtaining signal distortion data; Step S134: capturing reflected wave data of the signal distortion data, thereby obtaining reflected wave data; Step S135: performing amplitude statistics according to the reflected wave data, thereby obtaining high reflection amplitude data; Step S136: performing reflection delay time statistics according to the reflected wave data to obtain reflection delay time data, and performing reflection delay position calculation according to the reflection delay time data to obtain reflection delay position data; Step S137: performing impedance anomaly intersection operation according to the reflection delay position data and the high reflection amplitude data, so as to obtain signal line impedance anomaly data.

5. The method for sending and receiving data based on a circuit board according to claim 4, characterized in that: Step S133 is specifically as follows: Perform fast Fourier transform according to the signal transmission data to obtain the signal transmission spectrum diagram; Perform spectrum statistics on the signal transmission spectrum diagram to obtain high-frequency spectrum signal transmission data; Performing phase curve jump identification on high-frequency spectrum signal transmission data to obtain phase curve jump data; Perform nonlinear offset identification on high-frequency spectrum signal transmission data, thereby obtaining signal line nonlinear offset data; Performing phase distortion intersection operation according to phase curve jump data and signal line nonlinear offset data, thereby obtaining phase distortion data; The signal distortion area of ​​the signal transmission spectrum diagram is located according to the phase distortion data, so as to obtain the signal distortion data.

6. The method for sending and receiving data based on a circuit board according to claim 1, characterized in that: Step S3 is specifically as follows: Step S31: extracting signal crosstalk area features according to the signal crosstalk data, thereby obtaining signal crosstalk area data; Step S32: performing electric field distribution simulation on the signal crosstalk area data to obtain electric field distribution data; Step S33: performing current density statistics according to the electric field distribution data, thereby obtaining high-density current distribution data; Step S34: performing hotspot identification on the signal crosstalk area data according to the high-density current distribution data, thereby obtaining signal crosstalk hotspot area data; Step S35: performing signal path tracing according to the signal crosstalk hotspot area data, thereby obtaining signal crosstalk path data; Step S36: Optimize the signal layer layout according to the signal crosstalk path data, so as to obtain signal layer layout optimization data.

7. The method for sending and receiving data based on a circuit board according to claim 6, characterized in that: Step S35 is specifically as follows: Step S351: extracting the hotspot area routing coordinates of the signal crosstalk hotspot area data according to the signal routing coordinate data, thereby obtaining the signal crosstalk hotspot area routing coordinates data; Step S352: constructing topology according to the routing coordinate data of the signal crosstalk hotspot area, thereby obtaining routing topology structure data of the signal crosstalk hotspot area; Step S353: performing a path depth-first search on the routing topology data of the signal crosstalk hotspot area according to the high-density current distribution data, thereby obtaining path depth-first search data; Step S354: performing a path breadth-first search on the routing topology data of the signal crosstalk hotspot area according to the high-density current distribution data, thereby obtaining path breadth-first search data; Step S355: merging signal crosstalk paths according to the path depth-first search data and the path breadth-first search data, thereby obtaining signal crosstalk path data.

8. The method for sending and receiving data based on a circuit board according to claim 6, characterized in that: Step S36 is specifically as follows: Step S361: performing crosstalk intensity statistics according to the signal crosstalk path data, thereby obtaining high-intensity signal crosstalk path data; Step S362: performing signal routing adjustment on the high-intensity signal crosstalk path data, thereby obtaining signal routing adjustment data; Step S363: increasing the signal line spacing for the high-intensity signal crosstalk path data, thereby obtaining signal line spacing increase data; Step S364: performing signal routing optimization feature fusion according to the signal routing adjustment data and the signal line spacing increase data, thereby obtaining signal routing optimization data; Step S365: performing stacking structure allocation according to the signal routing optimization data, thereby obtaining signal layer layout optimization data.

9. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method for sending and receiving data based on a circuit board as described in any one of claims 1 to 8 is implemented.

10. A system for sending and receiving data based on a circuit board, characterized in that: For executing the method for sending and receiving data based on a circuit board as claimed in claim 1, the system for sending and receiving data based on a circuit board comprises: A signal crosstalk analysis module is used to obtain circuit board design data, and perform signal layer wiring design feature extraction based on the circuit board design data, thereby obtaining signal layer wiring design data; perform signal crosstalk analysis based on the signal layer wiring design data, thereby obtaining signal crosstalk data; The electromagnetic interference analysis module is used to extract the circuit board stacking structure features according to the circuit board design data, so as to obtain the circuit board stacking structure data; perform electromagnetic interference analysis according to the circuit board stacking structure data and the signal layer wiring design data, so as to obtain the circuit board electromagnetic interference data; A signal layer layout optimization module is used to locate the crosstalk path according to the signal crosstalk data, thereby obtaining the signal crosstalk path data, and optimize the signal layer layout according to the signal crosstalk path data, thereby obtaining the signal layer layout optimization data; A stacking structure adjustment module is used to visualize the electromagnetic interference distribution according to the electromagnetic interference data of the circuit board, thereby obtaining the electromagnetic interference distribution visualization data; and to adjust the stacking structure according to the electromagnetic interference distribution visualization data, thereby obtaining the stacking structure adjustment data; The circuit board receiving and transmitting data test module is used to perform the circuit board receiving and transmitting data test according to the signal layer layout optimization data and the stacking structure adjustment data, so as to obtain the circuit board receiving and transmitting test data, and upload it to the circuit board receiving and transmitting data test platform to perform the receiving and transmitting data optimization task.

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