Method, equipment, medium and product for predicting growth direction of hot crack of single-crystal high-temperature alloy gas film pore structure

Abstract

The invention discloses a method and equipment for predicting the growth direction of a hot crack of a single-crystal high-temperature alloy gas film pore structure, a medium and a product, and relates to the field of crack detection. The method comprises the following steps: constructing a finite element model of a to-be-predicted single-crystal high-temperature alloy gas film hole structure; obtaining a stress field of a crack tip in the to-be-predicted single-crystal high-temperature alloy gas film pore structure based on the finite element model; based on the stress field of the crack tip, determining the maximum J integral of the crack tip in the to-be-predicted single-crystal high-temperature alloy gas film pore structure; and based on the maximum J integral of the crack tip in the to-be-predicted single-crystal high-temperature alloy gas film pore structure, determining the thermal crack propagation direction of the single-crystal high-temperature alloy gas film pore structure. According to the method, under the condition of saving time and cost, the prediction precision of the thermal crack propagation direction of the single crystal high-temperature alloy gas film pore structure can be improved.

Description

Technical Field

[0001] The present application relates to the field of crack detection, and in particular to a method, device, medium and product for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure. Background Art

[0002] With the continuous advancement of aero-engine technology, the performance requirements for turbine blade materials are getting higher and higher. Turbine blades work in a high temperature, high pressure, and high stress environment. In order to extend the life of the blades and improve engine efficiency, air film pore structures are usually designed on the blade surface to reduce the blade surface temperature through air film cooling technology. However, under long-term high temperature cycles and complex stresses, the air film pore structure is prone to thermal fatigue cracks, which poses a serious threat to the safety and stability of the blades.

[0003] By predicting the propagation direction of thermal fatigue cracks in the air film pore structure, the failure of turbine blades can be effectively prevented, the service life of blades can be extended, and the safety and reliability of aircraft engines can be guaranteed. This prediction can help engineers optimize the design, select appropriate materials and manufacturing processes, thereby improving the performance and efficiency of the engine and reducing maintenance costs and risks. At the same time, accurate predictions can also guide repair and maintenance work, timely detect and deal with potential cracks, and avoid catastrophic accidents.

[0004] At present, the prediction method of thermal fatigue crack propagation direction for the film hole structure of aero-engine turbine blades mainly relies on a large number of experiments and empirical formulas. However, the accuracy of this method will drop significantly when the environmental and material conditions change. In engineering materials and structures, thermal fatigue crack propagation is a key failure mode, especially under high temperature and cyclic stress environment. The propagation of thermal fatigue cracks will significantly affect the life and safety of materials and structures. Predicting the crack propagation direction is of great significance for preventing structural failure and optimizing design.

[0005] The existing prediction of thermal crack propagation direction is mainly carried out by conducting thermal fatigue tests at different temperatures and different shapes. This method requires a large number of tests and data collection under different conditions. This traditional experimental method is time-consuming and costly.

[0006] Moreover, experimental data and empirical formulas are usually only accurate and reliable under similar conditions. Once new materials, structural shapes or extreme working conditions (such as higher temperatures or more complex loads) appear, these data and experience may no longer be applicable, and the prediction accuracy will be greatly reduced. Summary of the invention

[0007] The purpose of this application is to provide a method, device, medium and product for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure, which can improve the prediction accuracy while saving time and cost.

[0008] To achieve the above objectives, this application provides the following solutions:

[0009] In a first aspect, the present application provides a method for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure, comprising:

[0010] Construct a finite element model of the air film pore structure of the single crystal high-temperature alloy to be predicted;

[0011] Based on the finite element model, the stress field at the crack tip in the air film pore structure of the single crystal high temperature alloy to be predicted is obtained;

[0012] Determining the maximum J integral of the crack tip in the single crystal high temperature alloy air film pore structure to be predicted based on the stress field at the crack tip;

[0013] Based on the maximum J-integral of the crack tip in the single crystal high temperature alloy air film pore structure to be predicted, the thermal crack propagation direction of the single crystal high temperature alloy air film pore structure is determined.

[0014] Optionally, determining the maximum J-integral of the crack tip in the single crystal high temperature alloy air film pore structure to be predicted based on the stress field at the crack tip includes:

[0015] The maximum J-integral of the crack tip is determined based on the stress field at the crack tip by using the contour integration method.

[0016] Optionally, a finite element model of the single crystal high temperature alloy air film pore structure to be predicted is constructed in Abaqus software.

[0017] Optionally, in Abaqus software, a finite element model of the air film pore structure of the single crystal high temperature alloy to be predicted is constructed, including:

[0018] Defining the alloy properties and elastic behavior of the single crystal high temperature alloy air film pore structure to be predicted at different temperatures; the alloy properties include one or more of conductivity, elastic modulus, shear model, yield strength, thermal expansion coefficient and specific heat;

[0019] Create a model instance of the single crystal superalloy air film pore structure to be predicted based on the defined alloy properties and elastic behavior;

[0020] Referring to the thermal fatigue test method, an analysis step is created, and the thermal fatigue test parameters are loaded into the model instance of the single crystal high-temperature alloy air film pore structure to be predicted by using the analysis step to obtain an initial thermal fatigue temperature field model;

[0021] Meshing the initial thermal fatigue temperature field model to obtain a thermal fatigue temperature field model;

[0022] The temperature field result of the single crystal high temperature alloy air film pore structure to be predicted is obtained based on the thermal fatigue temperature field model by using a sequential thermal-mechanical coupling method;

[0023] The stress time length is defined, and a crack is created in the model instance of the single crystal high temperature alloy air film pore structure to be predicted to obtain a crack model;

[0024] Importing the temperature field result of the single crystal high temperature alloy air film pore structure to be predicted into the crack model to complete the temperature field definition of the crack model;

[0025] The crack model with the temperature field definition is meshed to obtain a thermal fatigue stress field model with cracks, and the thermal fatigue stress field model with cracks is used as the finite element model.

[0026] Optionally, determining the maximum J-integral of the crack tip in the single crystal high temperature alloy air film pore structure to be predicted based on the stress field at the crack tip includes:

[0027] Changing the position of the crack in the crack model and re-meshing to obtain a new finite element model;

[0028] Using the same temperature field results, the new finite element model was run to obtain the stress fields at different crack tips;

[0029] The J integral of different crack tips is obtained based on the stress field at different crack tips by using the contour integration method.

[0030] The maximum J integral at the crack tip is obtained from the J integrals of different crack tips.

[0031] Optionally, the elastic behavior is determined based on an elastic coefficient matrix; the elastic coefficient matrix is ​​determined based on elastic modulus, Poisson's ratio and shear modulus.

[0032] Optionally, the analysis step includes a heating phase and a cooling phase.

[0033] In a second aspect, the present application provides a computer device comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy air film pore structure provided above.

[0034] In a third aspect, the present application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the above-mentioned method for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure.

[0035] In a fourth aspect, the present application provides a computer program product, including a computer program, which, when executed by a processor, implements the above-mentioned method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy air film pore structure.

[0036] According to the specific embodiments provided in this application, this application discloses the following technical effects:

[0037] The present application provides a method, device, medium and product for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure. By determining the J integral of the crack tip through numerical simulation and finite element analysis, priority information on the crack propagation direction can be provided, and the propagation direction of thermal fatigue cracks can be accurately predicted, thereby guiding structural design and life assessment. Moreover, by determining the thermal crack propagation direction based on the maximum J integral, direction prediction can be achieved without the need for a large number of tests, greatly saving prediction time and prediction costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 This is an application environment diagram of a method for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure in one embodiment of the present application;

[0040] Figure 2 A schematic flow chart of a method for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure provided in one embodiment of the present application;

[0041] Figure 3 A schematic diagram of a thermal fatigue test of a plate air film hole provided in one embodiment of the present application;

[0042] Figure 4 A schematic diagram of a thermal fatigue unit temperature field model provided in another embodiment of the present application;

[0043] Figure 5 A schematic diagram of a temperature field model after assembly is provided for an embodiment of the present application;

[0044] Figure 6 A schematic diagram of a thermal fatigue temperature field model is provided for an embodiment of the present application;

[0045] Figure 7 A schematic diagram of thermal fatigue temperature field results is provided for another embodiment of the present application;

[0046] Figure 8 A schematic diagram of a thermal fatigue stress field model with thermal cracks is provided for another embodiment of the present application;

[0047] Fig. 9 A schematic diagram of a crack assignment interface is provided for another embodiment of the present application;

[0048] Fig.10 A schematic diagram of creating a predefined scene interface is provided for another embodiment of the present application;

[0049] Fig.11 A schematic diagram of a thermal fatigue stress field model with cracks is provided for another embodiment of the present application;

[0050] Fig.12 A schematic diagram of thermal fatigue stress field results with cracks is provided for another embodiment of the present application;

[0051] Fig.13 A schematic diagram of a curve showing a change of the J integral at the thermal crack tip over time is provided for another embodiment of the present application;

[0052] Fig.14 A schematic diagram of cracks at different positions is provided for another embodiment of the present application;

[0053] Fig.15 A schematic diagram of the structure of a computer device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0055] As an important parameter in fracture mechanics, the J integral can effectively describe the stress and strain state near the crack tip and can be used to predict the behavior of crack propagation. Finite element analysis can reduce the need for a large amount of experimental data, saving time and cost. At the same time, finite element simulation can quickly evaluate a variety of working conditions and materials, significantly shortening the design cycle.

[0056] Based on the above description, numerical simulation and finite element analysis can be used to calculate the J integral at the crack tip to provide priority information on the direction of crack propagation. When the J integral at the crack tip reaches a certain critical value (usually denoted as JIC), the crack will extend in the direction of maximum stress intensity. By analyzing the J integral distribution on different crack propagation paths, the direction in which the crack is most likely to extend can be determined. This method can not only be applied to conventional materials, but is also particularly suitable for engineering practices such as complex air film pore structures. By simulating the J integral at the crack tip, the extension direction of thermal fatigue cracks can be effectively predicted, thereby guiding structural design and life assessment.

[0057] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0058] The method for predicting the thermal crack propagation direction of the single crystal high temperature alloy air film pore structure provided in the embodiment of the present application can be applied to Figure 1 In the application environment shown. Among them, the terminal 102 communicates with the server 104 through the network. The data storage system can store the data that the server 104 needs to process. The data storage system can be set up separately, integrated on the server 104, or placed on the cloud or other servers. The terminal 102 can send the structural parameters of the single crystal high temperature alloy air film pore structure to be predicted to the server 104. After the server 104 receives the structural parameters of the single crystal high temperature alloy air film pore structure to be predicted, it constructs a finite element model of the single crystal high temperature alloy air film pore structure to be predicted. Based on the finite element model, the stress field at the crack tip in the single crystal high temperature alloy air film pore structure to be predicted is obtained. Based on the stress field at the crack tip, the maximum J integral of the crack tip in the single crystal high temperature alloy air film pore structure to be predicted is determined. Based on the maximum J integral of the crack tip in the single crystal high temperature alloy air film pore structure to be predicted, the thermal crack propagation direction of the single crystal high temperature alloy air film pore structure is determined. The server 104 can feedback the obtained thermal crack propagation direction prediction result to the terminal 102. In addition, in some embodiments, the method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy air film pore structure provided in the present application can also be implemented independently by the server 104 or the terminal 102. For example, the terminal 102 can directly predict the thermal crack propagation direction based on the structural parameters of the single crystal high-temperature alloy air film pore structure to be predicted, or the server 104 can obtain the structural parameters of the single crystal high-temperature alloy air film pore structure to be predicted from the data storage system, and predict the thermal crack propagation direction based on the structural parameters of the single crystal high-temperature alloy air film pore structure to be predicted.

[0059] The terminal 102 may be, but is not limited to, various desktop computers, laptop computers, smart phones, tablet computers, IoT devices, and portable wearable devices. The IoT devices may be smart speakers, smart TVs, smart air conditioners, smart vehicle-mounted devices, etc. The portable wearable devices may be smart watches, smart bracelets, head-mounted devices, etc. The server 104 may be implemented as an independent server or a server cluster consisting of multiple servers, or may be a cloud server.

[0060] In an exemplary embodiment, Figure 2 As shown, a method for predicting the thermal crack propagation direction of a single crystal high temperature alloy air film pore structure is provided. The method is executed by a computer device, and can be executed by a computer device such as a terminal or a server alone, or by a terminal and a server together. In the embodiment of the present application, the method is applied to Figure 1 The server 104 in the example is used as an example to illustrate, including the following steps 200 to 203. Among them:

[0061] Step 200: construct a finite element model of the single crystal high temperature alloy air film pore structure to be predicted.

[0062] Step 201: Obtaining the stress field at the crack tip in the single crystal high temperature alloy air film pore structure to be predicted based on the finite element model.

[0063] Step 202: Determine the maximum J-integral of the crack tip in the single crystal high-temperature alloy air film pore structure to be predicted based on the stress field at the crack tip.

[0064] Step 203: Determine the thermal crack propagation direction of the single crystal high temperature alloy air film pore structure based on the maximum J-integral of the crack tip in the single crystal high temperature alloy air film pore structure to be predicted.

[0065] Implementing the above steps 200 to 203 can improve prediction accuracy while saving time and cost, and can further guide structural design and life assessment.

[0066] In another exemplary embodiment of the present application, in order to accurately predict the crack propagation path and overcome the prediction inaccuracy problem in traditional methods, the present application determines the maximum J integral of the crack tip based on the stress field at the crack tip through the contour integration method.

[0067] In another exemplary embodiment of the present application, in order to significantly reduce the cost and time consumption of actual experiments, the present application constructs a finite element model of the single crystal high-temperature alloy air film pore structure to be predicted in Abaqus software.

[0068] In another exemplary embodiment of the present application, Figure 3Taking the plate V-notch thermal fatigue specimen (hereinafter referred to as the specimen) as an example, the visual process of the prediction method provided in the present application is described. Among them, the thickness of the specimen and the aperture of the air film hole can be adjusted according to actual conditions and are not limited to the content shown in Figure 3. The specimen adopts an air film hole structure, which can better simulate the thermal fatigue situation under actual use conditions compared with the traditional V-notch.

[0069] The temperature field of the sample is calculated first by the sequential thermal-mechanical coupling method, and then the stress field of the sample is calculated. The maximum J integral of the crack tip at the edge of the air film hole is calculated by the contour integral method, which is recorded as Jmax. The value of Jmax usually represents the driving force for crack extension, and the extension direction of the thermal fatigue crack of the air film hole can be predicted.

[0070] In another exemplary embodiment of the present application, Figure 3 Taking the plate V-notch thermal fatigue specimen (hereinafter referred to as the specimen) as an example, referring to the above thermal fatigue test method, and taking Abaqus software as the implementation object, the construction process of the finite element model in the above step 200 is explained. Among them:

[0071] (1) Create components: In the component module of Abaqus software, draw Figure 4 Model example shown.

[0072] (2) Property definition: Create a new material in the property module of Abaqus software. Taking the second-generation Ni-based single crystal high-temperature alloy IC21 as an example, define the properties of the alloy at different temperatures in the material properties, such as conductivity λ, elastic modulus E, shear modulus G, yield strength σ 0.2 , thermal expansion coefficient α and specific heat C, the specific parameters are shown in Table 1. Since single crystal high temperature alloys have significant mechanical anisotropy, anisotropy needs to be considered when defining their elastic behavior. The orthogonal elastic module is used to define their elastic behavior through the elastic coefficient matrix.

[0073] This step is essentially to define the alloy properties and elastic behavior of the single crystal high temperature alloy gas film pore structure to be predicted at different temperatures. The alloy properties include one or more of conductivity, elastic modulus, shear model, yield strength, thermal expansion coefficient and specific heat.

[0074] Table 1 Thermophysical parameters required for thermal fatigue finite element model

[0075] T / ℃ <![CDATA[σ 0.2 / MPa]]> E / GPa G / GPa ν <![CDATA[α / 10 -6 ·℃ -1 ]]> λ / mW / (mm·K) C / kJ / (t·℃) 20 537 129 127 0.39 / 10.24 / 100 / 127 125 0.39 11.68 11.03 497 500 / 117 113 0.40 12.98 11.64 391 760 974 / / / / / / 980 670 / / / / / / 1000 / 92.8 92.8 0.41 14.72 17.97 539 1100 330 83.2 90.1 0.42 15.37 / 588

[0076] The mechanical properties of single crystal superalloys show obvious anisotropy, and their elastic coefficient matrix can be expressed as:

[0077]

[0078] Among them, C represents the elastic coefficient matrix, and the elastic constant C 11 , C 12 , C 44 According to the elastic modulus E, Poisson's ratio υ and shear modulus G of the alloy, we have:

[0079]

[0080]

[0081] C 44 =G.

[0082] (3) Assemble components: Click “Create Instance” in the Abaqus software assembly module. Figure 4 The single component shown in the figure can be assembled directly. Figure 5 shown.

[0083] This step is mainly to create a model instance of the single crystal high-temperature alloy air film pore structure to be predicted based on the defined alloy properties and elastic behavior.

[0084] (4) With reference to the thermal fatigue test method, an analysis step is created. The thermal fatigue test parameters are loaded into the model instance of the single crystal high-temperature alloy air film pore structure to be predicted by the analysis step to obtain the initial thermal fatigue temperature field model.

[0085] For example, in the analysis step module of Abaqus software, click "Create Analysis Step" to create two analysis steps, Step-1 and Step-2. Referring to the thermal fatigue test method, Step-1 is the heating stage, and the time length is set to t1. Step-2 is the cooling stage, and the time length is set to t2, which correspond to the thermal fatigue heating stage and the thermal fatigue cooling stage respectively.

[0086] To set up the interaction, in the interaction module of the Abaqus software, click "Create Interaction Properties" to define the surface heat exchange conditions between the model and the environment. In the heating stage of Step-1, the heat exchange coefficient can be set to a fixed value of 0.2. In the cooling stage of Step-2, since the heat exchange between the model and water is more complicated, the heat exchange coefficient should be set to a function related to temperature as shown in Table 2. Finally, click "Create Interaction", select "Surface Heat Exchange Conditions", define the ambient temperature of Step-1 as 1000, the heat transfer coefficient as 0.2, define the ambient temperature of Step-2 as 25, and the heat transfer coefficient as the function shown in Table 2.

[0087] Table 2 Heat exchange coefficient between cooling stage model and water

[0088]

[0089]

[0090] (5) The initial thermal fatigue temperature field model is meshed to obtain the thermal fatigue temperature field model.

[0091] For example, in the mesh module of Abaqus software, the initial thermal fatigue temperature field model is meshed. The sequential thermal-mechanical coupling needs to simulate the temperature field of the initial thermal fatigue temperature field model first. Therefore, the unit type selected is the DC3D8R hexahedral unit of the heat transfer type, and the mesh at the air film hole is refined, such as Figure 6 shown.

[0092] (6) The sequential thermal-mechanical coupling method is used based on the thermal fatigue temperature field model to obtain the temperature field results of the single crystal high-temperature alloy air film pore structure to be predicted.

[0093] For example, to calculate the thermal fatigue temperature field model. In the job module of the Abaqus software, select the thermal fatigue temperature field model just created, create a job and click "Submit", run the thermal fatigue temperature field model, and obtain the temperature field results (the software will automatically output the result file). The effect is as follows: Figure 7 shown.

[0094] (7) The stress time length is defined, and a crack is created in the model instance of the single crystal high temperature alloy air film pore structure to be predicted to obtain a crack model.

[0095] For example, in the component module of Abaqus software, a crack plane is created on the edge of the air film hole by cutting and splitting the original component (i.e., model instance), such as Figure 8 As shown, the length of the crack is 100 μm.

[0096] Set the analysis step. In the analysis step module of the Abaqus software, set the time lengths of the original Step-1 and Step-2 to 1. This is because the temperature field at each moment has been output during the temperature field simulation. Therefore, the time length can be 1 when simulating stress. Select the output "J integral" in the history output.

[0097] Define the crack. In the interaction module of Abaqus software, create a plane (such as Figure 8 The newly created plane is assigned as a crack, and the crack type is selected as cloud integral. This behavior lets the software know that the newly created plane exists in the form of a crack. The way to assign cracks is as follows Fig. 9 shown.

[0098] (8) The temperature field results of the single crystal high-temperature alloy air film pore structure to be predicted are imported into the crack model to complete the temperature field definition of the crack model.

[0099] For example, in the load module of the Abaqus software, import the temperature field results calculated by the corresponding temperature field model, where the temperature field results are imported into the "load" module of the crack model. Click "Create Predefined Field", select the predefined temperature, read from the result or output database file, and then select the previously output temperature field result file to complete the temperature field definition of the crack model. The interface for creating a predefined field is as follows: Fig.10 shown.

[0100] (9) Meshing the crack model with the temperature field definition completed to obtain a thermal fatigue stress field model with cracks, and using the thermal fatigue stress field model with cracks as a finite element model.

[0101] For example, in the mesh module of Abaqus software, the crack model is re-meshed to obtain the thermal fatigue stress field model with cracks. The thermal fatigue stress field model with cracks is as follows: Fig.11 As shown. Since the J-integral at the crack tip needs to be calculated using the contour integration method, the mesh around the crack tip is specially divided, and many circles (i.e. contours) are divided at the tip of the thermal fatigue crack. The unit attribute is defined as C3D8R under the three-dimensional stress type, which is used for stress field calculation and crack tip J-integral calculation.

[0102] Based on the above description, the J integral at the crack tip can be calculated by running the thermal fatigue stress field model with cracks. For example, in the job module of the Abaqus software, select the thermal fatigue stress field model with cracks just established, create a job and click "Submit", run the thermal fatigue stress field model with cracks, and get the following Fig.12 The stress field results shown are Fig.13 The J-integral data shown in the figure. The first 55 seconds are the thermal fatigue heating stage, and the last 5 seconds are the thermal fatigue cooling stage. The maximum value of the J-integral (i.e., the maximum J-integral) appears at the beginning of the cooling stage, with a value of 0.30.

[0103] Furthermore, the J integral of the crack tip is calculated when the thermal crack is at different positions. For example, the position of the thermal crack is changed, and the meshing and the J integral calculation of the crack tip are re-performed. Fig.14 As shown in the figure, the crack is defined at different positions on the edge of the air film hole. Since the size of the thermal fatigue stress field model with cracks has not changed, the same temperature field results can be used to recalculate the stress field and J integral. Since the thermal fatigue stress field model with cracks is symmetrical from top to bottom, only the upper half of the air film hole needs to be calculated. Finally, when the thermal fatigue crack is at different positions, the Jmax at the crack tip can be obtained.

[0104] Based on the above description, by comparing the Jmax of the thermal crack tip at different positions, the preferred extension direction of the thermal crack can be determined. Among them, when the thermal fatigue crack is at different positions, the Jmax of the crack tip is compared, and the thermal fatigue crack tends to extend along the direction with the largest Jmax.

[0105] In summary, this application introduces an air film hole structure in the design of thermal fatigue specimens, which can more accurately simulate the thermal fatigue conditions in actual use compared to traditional V-notch specimens. Finite element simulation technology is used, combined with the sequential thermal-mechanical coupling method and the contour integral method to calculate the J integral of the crack tip, providing a novel method for predicting the direction of thermal crack propagation, which significantly improves the accuracy and reliability of thermal crack propagation prediction.

[0106] Moreover, compared with traditional methods, this application can more realistically reflect the fatigue behavior of materials in high temperature environments, and greatly reduce the cost and time consumption of actual experiments through finite element simulation. At the same time, the crack propagation path is accurately predicted through the contour integral method, which overcomes the inaccurate prediction problem in traditional methods, significantly improves the test efficiency, and provides a more efficient and economical solution for related research fields.

[0107] In addition, in the field of aerospace, this application can be used to evaluate and improve the thermal fatigue performance of high-temperature components such as aircraft engine turbine blades. By simulating the high temperature and high pressure environment under actual flight conditions, the fatigue crack propagation path of the component can be predicted, and people can be assisted in targeted design of the priority propagation direction and area of ​​thermal cracks, thereby improving the safety and reliability of the component.

[0108] In an exemplary embodiment, a computer device is provided. The computer device may be a server or a terminal. The internal structure diagram thereof may be as follows: Fig.15 As shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. Among them, the processor, the memory and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store prediction data of the thermal crack extension direction. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a method for predicting the thermal crack extension direction of a single crystal high-temperature alloy air film pore structure is implemented.

[0109] Those skilled in the art will understand that Fig.15 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components. In an exemplary embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above-mentioned method embodiments when executing the computer program.

[0110] In an exemplary embodiment, a computer-readable storage medium is provided, storing a computer program, and when the computer program is executed by a processor, the steps in the above method embodiments are implemented.

[0111] In an exemplary embodiment, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, the steps in the above method embodiments are implemented.

[0112] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0113] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM may be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0114] The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. The non-relational database may include a distributed database based on blockchain, etc., but is not limited thereto. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but is not limited thereto.

[0115] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0116] This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and core ideas of this application. At the same time, for those skilled in the art, according to the ideas of this application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting this application.

Claims

1. A method for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure, characterized in that: The method for predicting the thermal crack propagation direction of the single crystal high temperature alloy air film pore structure comprises: Construct a finite element model of the air film pore structure of the single crystal high-temperature alloy to be predicted; Based on the finite element model, the stress field at the crack tip in the air film pore structure of the single crystal high temperature alloy to be predicted is obtained; Determining the maximum J integral of the crack tip in the single crystal high temperature alloy air film pore structure to be predicted based on the stress field at the crack tip; Based on the maximum J-integral of the crack tip in the single crystal high temperature alloy air film pore structure to be predicted, the thermal crack propagation direction of the single crystal high temperature alloy air film pore structure is determined.

2. The method for predicting the thermal crack propagation direction of the single crystal high temperature alloy air film pore structure according to claim 1, characterized in that: Determining the maximum J integral of the crack tip in the single crystal high temperature alloy air film pore structure to be predicted based on the stress field at the crack tip includes: The maximum J-integral of the crack tip is determined based on the stress field at the crack tip by using the contour integration method.

3. The method for predicting the thermal crack propagation direction of the single crystal high temperature alloy air film pore structure according to claim 1, characterized in that: In Abaqus software, a finite element model of the single crystal high temperature alloy air film pore structure to be predicted is constructed.

4. The method for predicting the thermal crack propagation direction of the single crystal high temperature alloy air film pore structure according to claim 3, characterized in that: In Abaqus software, a finite element model of the single crystal high temperature alloy air film pore structure to be predicted is constructed, including: Defining the alloy properties and elastic behavior of the single crystal high temperature alloy air film pore structure to be predicted at different temperatures; the alloy properties include one or more of conductivity, elastic modulus, shear model, yield strength, thermal expansion coefficient and specific heat; Create a model instance of the single crystal superalloy air film pore structure to be predicted based on the defined alloy properties and elastic behavior; Referring to the thermal fatigue test method, an analysis step is created, and the thermal fatigue test parameters are loaded into the model instance of the single crystal high-temperature alloy air film pore structure to be predicted by using the analysis step to obtain an initial thermal fatigue temperature field model; Meshing the initial thermal fatigue temperature field model to obtain a thermal fatigue temperature field model; The temperature field result of the single crystal high temperature alloy air film pore structure to be predicted is obtained based on the thermal fatigue temperature field model by using a sequential thermal-mechanical coupling method; The stress time length is defined, and a crack is created in the model instance of the single crystal high temperature alloy air film pore structure to be predicted to obtain a crack model; Importing the temperature field result of the single crystal high temperature alloy air film pore structure to be predicted into the crack model to complete the temperature field definition of the crack model; The crack model with the temperature field definition is meshed to obtain a thermal fatigue stress field model with cracks, and the thermal fatigue stress field model with cracks is used as the finite element model.

5. The method for predicting the thermal crack propagation direction of the single crystal high temperature alloy air film pore structure according to claim 4, characterized in that: Determining the maximum J integral of the crack tip in the single crystal high temperature alloy air film pore structure to be predicted based on the stress field at the crack tip includes: Changing the position of the crack in the crack model and re-meshing to obtain a new finite element model; Using the same temperature field results, the new finite element model was run to obtain the stress fields at different crack tips; The J integral of different crack tips is obtained based on the stress field at different crack tips by using the contour integration method. The maximum J integral at the crack tip is obtained from the J integrals of different crack tips.

6. The method for predicting the thermal crack propagation direction of the single crystal high temperature alloy air film pore structure according to claim 4, characterized in that: The elastic behavior is determined based on an elastic coefficient matrix; the elastic coefficient matrix is ​​determined based on elastic modulus, Poisson's ratio and shear modulus.

7. The method for predicting the thermal crack propagation direction of the single crystal high temperature alloy air film pore structure according to claim 4, characterized in that: The analysis step includes a heating phase and a cooling phase.

8. A computer device comprising: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement a method for predicting the thermal crack propagation direction of a single crystal high-temperature alloy air film pore structure according to any one of claims 1 to 6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy air film pore structure according to any one of claims 1 to 6 is implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the method for predicting the thermal crack propagation direction of the single crystal high-temperature alloy air film pore structure according to any one of claims 1 to 6 is implemented.

Images