Bonding head of bonding machine with six degrees of freedom

Abstract

A bonding head having a bonding tool for bonding electronic components includes a rotational motion mechanism and a linear positioning mechanism connected to the rotational motion mechanism. The rotary motion mechanism is operable to rotate the bonding tool to adjust an angular orientation of the electronic component held by the bonding tool. The rotary motion mechanism includes a rotary assembly operable to rotate the bonding tool about a first axis of rotation and a flexible carousel operable to rotate the bonding tool about respective second and third axes of rotation, the first, second and third axes of rotation being orthogonal to each other. The linear positioning mechanism can be operated to drive the bonding tool to move parallel to the first rotating shaft and a first plane parallel to a second plane where the second rotating shaft and the third rotating shaft are located so as to adjust the position of the electronic component.

Description

Technical Field

[0001] The present invention relates to a bonding head of a bonding device or a bonding machine with six degrees of freedom (DOF), and in particular to a bonding head comprising a flip-tilt mechanism to achieve six DOF, a bonding machine comprising the above bonding head, and a bonding method used by the above bonding head. Background Art

[0002] Adhesive bonding is a key packaging process in the manufacturing of electronic devices. This technology has been widely used to make electrical connections between electronic components with adhesives. The quality of adhesive bonding plays a vital role in the thermal performance, reliability and service life of electronic devices. For example, the thickness, uniformity and coverage of the adhesive layer must be well controlled during the bonding process to ensure the performance of the electronic device.

[0003] The quality of such bonding using adhesives may be affected by variations in geometrical features occurring on the mating surfaces between the electronic component to be joined or connected and the base member. Typically, tight tolerances are applied to the dimensions and geometrical features of the electronic components to reduce any excessive variations. However, this approach is not cost-effective and sometimes even technical solutions to achieve such tight tolerances are not available. In particular, the miniaturization of electronic devices requires higher accuracy and precision to meet the tight tolerance requirements of electronic assemblies. This makes the bonding process more challenging and, therefore, there is a need for improved processes and equipment to cope with excessive variations in geometrical features as well as defects of the electronic components used in electronic assemblies.

[0004] In the prior art, various bonding machines are specially designed to automate the bonding process in order to ensure the quality of bonding. In these bonding machines, the conventional bonding head is designed to adjust the orientation and position of the electronic components in three orthogonal linear motion axes and one rotation axis. However, these conventional four-axis bonding heads do not have enough degrees of freedom to adjust the orientation of the electronic components in three-dimensional space before placing the electronic components to ensure that the electronic components are accurately bonded to the base member. In essence, the conventional four-axis bonding head lacks two degrees of freedom, namely, the degrees of freedom in the flipping and tilting directions, respectively. The inability to adjust the bonding head in the flipping and tilting directions may result in poor coplanarity between the two mating surfaces. Therefore, during the bonding process, the load applied by the bonding head may not be evenly distributed to the adhesive sandwiched between the mating surfaces, resulting in the adhesive not being able to evenly cover the specified bonding area. As a result, partial coverage and uneven thickness of the adhesive layer may occur in the bonded electronic components, which will ultimately greatly reduce the heat dissipation, reliability and service life of the electronic device.

[0005] Therefore, it would be beneficial to provide greater freedom for adjusting the orientation of electronic components prior to bonding them. Summary of the invention

[0006] Therefore, the object of the present invention is to seek to provide a more efficient and cost-effective solution for adjusting the orientation of electronic components in three-dimensional space to compensate for changes in the geometric characteristics of the electronic components that may affect the parallelism between mating surfaces. Such a solution can significantly reduce the dependence of assembly accuracy on the geometric tolerances of the electronic components.

[0007] According to a first aspect of the present invention, there is provided a bonding head of a bonding machine having a bonding tool for bonding electronic components. The bonding head includes a rotary motion mechanism, which is operable to rotate the bonding tool to adjust the angular orientation of the electronic component held by the bonding tool. The rotary motion mechanism includes a rotating assembly and a flexible turntable, the rotating assembly being operable to rotate the bonding tool around a first rotation axis, the flexible turntable being operable to rotate the bonding tool around corresponding second and third rotation axes, the first, second and third rotation axes being orthogonal to each other. The bonding head also includes a linear positioning mechanism, which is connected to the rotary motion mechanism and is operable to drive the bonding tool to move parallel to the first rotation axis and along a first plane parallel to a second plane where the second and third rotation axes are located. The linear positioning mechanism can be used to adjust the position of the electronic component held by the bonding tool along three axes of a Cartesian coordinate system.

[0008] With this bond head, the orientation of an electronic component held by the bonding tool of the bond head can be adjusted about three rotational axes, and the position of the electronic component can be adjusted in three linear motion axes. In this way, the angular orientation and position of the electronic component can be effectively adjusted in all six degrees of freedom. In other words, the bond head can be moved in three dimensions to adjust the orientation and position of the electronic component before bonding it to the base member. In addition, the flexure turntable is designed to guide the adjustment of the angular orientation of the electronic component without friction in the flip and tilt directions. This helps to improve the accuracy and repeatability of the motion performance and extend the service life of the bond head.

[0009] The rotary motion mechanism can be directly connected to the bonding tool. In other words, the rotary assembly or the flexible turntable can be directly connected to the bonding tool. Alternatively, the linear positioning mechanism can be directly connected to the bonding tool. The linear positioning mechanism can include three linear motion assemblies connected / connected in sequence. Any of the three linear motion assemblies can be directly connected to the bonding tool. In a preferred embodiment, the bonding head is designed as a serial mechanical structure, in which one motion assembly is mounted on another motion assembly, and all linear and rotary motions along or around different axes are independent of each other.

[0010] In one embodiment, the linear positioning mechanism may include a first linear motion component, a second linear motion component arranged on the first linear motion component, and a third linear motion component arranged on the second linear motion component, wherein the first, second and third motion components drive the bonding tool to move along three orthogonal axes in a Cartesian coordinate system respectively.

[0011] The flexible turntable may include a first rotating stage, a second rotating stage and a substrate, wherein a first flexible joint is connected between the first rotating stage and the substrate so that the first rotating stage can rotate around the second rotating axis, and a second flexible joint is connected between the first and second rotating stages so that the second rotating stage can rotate around the third rotating axis. Since the first and second flexible joints form a deformable rotating guide system, there is no moving part for flipping and tilting movements, so no friction and stick-slip movement occur in the guide system, thereby greatly improving the repeatability and accuracy of the flipping and tilting movements of the bonding head.

[0012] The first flexible joint may include a first pair of flexible hinges, the first pair of flexible hinges being between the first rotating stage and the base plate and being arranged on opposite sides of the first rotating stage so that the two flexible hinges can be operated to flex synchronously around the second rotating axis. The second flexible joint may include a second pair of flexible hinges, the second pair of flexible hinges being between the first and second rotating stages and being arranged on opposite sides of the second rotating stage so that the two flexible hinges can be operated to flex synchronously around the third rotating axis. Each flexible hinge may include two crossed leaf springs. The flexible hinges do not wear and do not require lubricants, making them particularly suitable for use in clean rooms, while traditional guide mechanisms involving moving parts (such as bearings) require lubrication.

[0013] Preferably, the second rotation axis passing through the first pair of flexible hinges can be perpendicular to the third rotation axis passing through the second pair of flexible hinges. In this way, the second and third rotation axes are perpendicular to each other and are located on the plane where they intersect. The intersection of these two axes can be regarded as the rotation center of the flexible turntable. This design can prevent the rotation axis of one rotating stage from being translated unnecessarily due to the rotation movement of another rotating stage, for example, it can prevent the third rotation axis of the second rotating stage from being translated unnecessarily due to the rotation movement of the first rotating stage.

[0014] The linear positioning mechanism is configured to drive the bonding tool to move along the first plane on a first linear motion axis and a second linear motion axis, the first and second linear motion axes being arranged at 45 degrees relative to the second and third rotation axes, respectively. This structural arrangement helps to evenly balance the weight of the flexible turntables on the three linear motion components of the linear positioning mechanism around a center plane that is parallel to the plane of the first rotation axis and the axis at a 45 degree angle to the second rotation axis of the bonding head, thereby improving the dynamic performance of the mechanical structure of the bonding head.

[0015] The rotary motion mechanism may further include a first drive system and / or a second drive system, wherein the first drive system is mounted on the base plate of the flexible turntable and connected to a first arm protruding from the first rotating stage through an elastic member so as to provide a force to the first arm to rotate the first rotating stage around the first flexible joint, that is, to rotate the first rotating stage around the second rotation axis under the guidance of the first flexible joint. The second drive system is mounted on the first rotating stage and connected to a second arm protruding from the second rotating stage through an elastic member so as to provide a force to the second arm to rotate the second rotating stage around the second flexible joint. The elastic member includes a pair of preloaded tension springs.

[0016] In one embodiment, at least one of the first and second drive systems may include a cam drive assembly, the cam drive assembly including an eccentric cam and a rotary motor connected to the first and / or second arm. The rotary motion mechanism may also include at least one rotary encoder integrated with the rotary motor to measure the angular displacement of the rotary motor, and then use the angular displacement to determine the corresponding linear displacement of the eccentric cam. Specifically, the first drive system may include a first cam drive assembly, the first cam drive assembly including a first eccentric cam and a first rotary motor connected to the first arm, and the second drive system may include a second cam drive assembly, the second cam drive assembly including a second eccentric cam and a second rotary motor connected to the second arm.

[0017] The flexure turntable may include a hollow portion having a size suitable for accommodating and mounting the rotating assembly and connecting the bonding tool to the rotating assembly. Providing the hollow portion on the flexure turntable allows the bond head to be compact in size and facilitates positioning the rotating assembly closer to the rotation center of the flexure turntable. Thus, any unnecessary translation resulting from the tilting and tilting motions can be minimized.

[0018] According to a second aspect of the present invention, there is provided a bonding machine, comprising a bonding head having a bonding tool for bonding electronic components. The bonding head comprises: a rotary motion mechanism operable to rotate the bonding tool to adjust the angular orientation of the electronic component held by the bonding tool, wherein the rotary motion mechanism comprises a rotary assembly and a flexible turntable, the rotary assembly operable to rotate the bonding tool around a first rotation axis, the flexible turntable operable to rotate the bonding tool around respective second and third rotation axes, the first, second and third rotation axes being orthogonal to each other; and a linear positioning mechanism connected to the rotary motion mechanism and operable to drive the bonding tool to move parallel to the first rotation axis and along a first plane parallel to a second plane where the second and third rotation axes are located.

[0019] According to a third aspect of the present invention, there is provided a method for manufacturing an electronic package, the electronic package comprising an electronic component bonded to a surface of the electronic package by a bonding tool of a bonding head. The method comprises: rotating the bonding tool around a first rotation axis by a rotary motion mechanism to adjust the angular orientation of the electronic component held by the bonding tool; rotating the bonding tool around at least one of a second and a third rotation axis by a flexible turntable, the first rotation axis being orthogonal to the second and third rotation axes; moving the bonding tool parallel to the first rotation axis and a first plane parallel to a second plane where the second and third rotation axes are located by a linear positioning mechanism connected to the rotary motion mechanism; and bonding the electronic component to the surface by the bonding tool.

[0020] These and other features, aspects and advantages will become better understood with reference to the specification portion, appended claims and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings.

[0022] Figure 1 is a schematic perspective view of a bonding head with six degrees of freedom according to an embodiment of the present invention.

[0023] Figure 2A It shows that Figure 1 A perspective view of the flexure turntable of the rotary motion mechanism of the bonding head is shown.

[0024] Figure 2B and Figure 2C The Figure 1 The x-axis and y-axis are shown as Figure 2A A side view of the flexible turntable is shown.

[0025] Figure 3AShown as Figure 2A The flexible crossbar hinges of the first and second flexible joints of the flexible turntable are shown.

[0026] Figure 3B yes Figure 2A A stereoscopic view of a flexible turntable in FIG. 1 , showing the flexible cross-bar hinges of the first and second flexible joints of the flexible turntable.

[0027] Figure 4 A plan view of a bond head according to one embodiment of the present invention is shown.

[0028] In the drawings, the same components are denoted by the same reference numerals. DETAILED DESCRIPTION

[0029] Before discussing the embodiments of the present invention in detail, an overview will first be provided. Embodiments of the present invention provide a bonding head of a bonding machine with six degrees of freedom for bonding electronic components to a base member. The bonding head is capable of rotating the bonding tool it carries around three orthogonal rotation axes to adjust the angular orientation of the electronic component held by the bonding tool, and is capable of moving the bonding tool along three orthogonal axes of a Cartesian coordinate system to adjust the position of the electronic component. The bonding head is capable of moving and rotating the electronic component in three-dimensional space to accurately adjust the position and angular orientation of the electronic component. In addition, a flexure-based mechanism is designed and used to provide frictionless and repeatable guidance when performing flipping and tilting movements of the bonding head, that is, rotating the bonding tool around two of the three orthogonal rotation axes.

[0030] Figure 1 FIG. 1 is a schematic perspective view of a bonding head 100 according to an embodiment of the present invention. Figure 1 , a bonding tool 101 is connected to a bonding head 100 to bond an electronic component to a base member (not shown in the figure). The bonding head 100 includes a linear positioning mechanism 120 and a rotary motion mechanism 110 connected to the linear positioning mechanism 120. Accordingly, the bonding tool 101 is directly connected to the rotary motion mechanism 110.

[0031] The rotational motion mechanism 110 is operable to rotate the bonding tool 101 about orthogonal rotational axes x, y, and z to adjust the angular orientation of the electronic component held by the bonding tool 101 ( θ x、 θ y、 θ z). In this embodiment, the rotational motion mechanism 110 includes a rotational assembly 111 and a flexible turntable 112 connected to the rotational assembly 111. The bonding tool 101 is directly mounted on the rotational assembly 111. The rotational assembly 111 is configured and operable to rotate the bonding tool 101 around the z-axis (the first rotational axis) to adjust the angular orientation of the electronic component held by the bonding tool 101. θ The flexure turntable 112 is a key substructure of the bonding head 100, which is configured and operable to rotate the bonding tool 101 about the x-axis and y-axis (the second and third rotational axes), respectively, so as to adjust the angular orientation of the electronic component held by the bonding tool 101. θ y and θ The flexure turntable 112 is also referred to as a flexure flip-tilt stage and is used to guide the flip and tilt motion (ie, rotation about the x-axis and the y-axis) of the bonding tool 101 held by the bond head 100 .

[0032] The linear positioning mechanism 120 is operative to drive the bonding tool 101 to move along three orthogonal linear motion axes (x', y', z) to linearly adjust the position of the electronic component held by the bonding tool 101. Figure 1 , the x'-y' plane P1 where the linear motion axis x' axis and y' axis are located is parallel to the xy plane P2 where the rotation axis x axis and y axis are located. In addition, the x' axis and y' axis are set at an oblique angle relative to the x axis and y axis respectively. Preferably, the oblique angle in this embodiment is 45 degrees.

[0033] The linear positioning mechanism 120 may include a first linear motion assembly 121, a second linear motion assembly 122 attached to the first linear motion assembly 121, and a third linear motion assembly 123 attached to the second linear motion assembly 122. The flexible turntable 122 is directly attached to the third linear motion assembly 123. The first linear motion assembly 121 is configured to drive the bonding tool 101 to move along the y'-axis direction to adjust the position of the electronic component held by the bonding tool 101 in the y'-axis direction. The second linear motion assembly 122 is configured to drive the bonding tool 101 to move along the z-axis direction to adjust the position of the electronic component in the z-axis direction. The third linear motion assembly 123 is configured to drive the bonding tool 101 to move along the x'-axis direction to adjust the position of the electronic component in the x'-axis direction.

[0034] Figure 2A A perspective view of the flexible disc 112 of the rotary motion mechanism 110 is shown. Figure 2B and Figure 2C 1 and 2 show side views of the flexure turntable 112 along the x-axis and the y-axis, respectively. Figure 2A, the flexible turntable 112 includes a first rotating stage 112a, a second rotating stage 112b and a base plate 112c. The flexible turntable 112 also includes a first flexible joint 112d and a second flexible joint 112e, the first flexible joint 112d is connected between the first rotating stage 112a and the base plate 112c so that the first rotating stage 112a can rotate around the x-axis, and the second flexible joint 112e is connected between the first and second rotating stages 112a, 112b so that the second rotating stage 112b can rotate around the y-axis. The first and second flexible joints 112d, 112e are designed to be used in the flexible turntable 112 to provide frictionless and repeatable guidance for the flipping and tilting movements of the first rotating stage 112a, respectively.

[0035] The rotary motion mechanism 110 further includes a first cam drive system 114 and a second cam drive system 116 for automatically activating and controlling the flipping and tilting motions of the bonding tool 101, respectively. Each drive system includes an eccentric cam and a rotary motor for converting the rotary motion into a linear motion. Figure 2B and Figure 2C , the first cam drive system 114 is mounted on the base plate 112c of the flexible turntable 112 and is connected to the first rotating stage 112a through an elastic member 118 so as to provide a force to rotate the first rotating stage 112a around the first flexible joint 112d. In this embodiment, the first cam drive system 114 can be connected to the first rotating stage 112a via a first arm (flip arm) 115 protruding from the first rotating stage 112a. The first arm 115 can be integrally formed with the first rotating stage 112a and protrude from the first rotating stage 112a, or attached to the first rotating stage 112a by any suitable attachment method. The elastic member 118 can include a pair of preloaded tension springs. Specifically, the first cam drive system 114 can be connected to the first arm 115 through an elastic member 118, so that the force from the first cam drive system 114 can be transmitted to the first arm 115, so that the first rotating stage 112a is rotated by generating a torque through the guidance provided by the first flexible joint 112d connected between the first rotating stage 112a and the substrate 112c. In this embodiment, the first cam drive system 114 includes a first eccentric cam and a first rotary motor connected to the first arm 115. In addition, a first rotary encoder can be integrated with the first rotary motor to measure the angular displacement of the first rotary motor, and then use the angular displacement to determine the corresponding linear displacement of the first eccentric cam. A displacement sensor, such as a linear encoder, can also be used to measure the linear displacement of the first cam drive system 114. The measured linear displacement of the first eccentric cam of the first cam drive system 114 is used to calculate the angular movement of the first rotating stage 112a. A sensor can also be used to directly measure the angular displacement of the first rotating stage 112a relative to the substrate 112c.

[0036] The second cam drive system 116 is mounted on the first rotating stage 112a and connected to the second rotating stage 112b by an elastic member 119 so as to provide a force to rotate the second rotating stage 112b around the second flexible joint 112e. In this embodiment, the second cam drive system 116 can be connected to the second rotating stage 112b via a second arm (tilt arm) 117 protruding from the second rotating stage 112b. The second arm 117 can be integrally formed with the second rotating stage 112b and protrude from the second rotating stage 112b, or attached to the second rotating stage 112b by any suitable attachment method. The elastic member 119 can include a pair of preloaded tension springs. Specifically, the second cam driving system 116 can be connected to the first arm 117 through an elastic member 119, so that the force from the second cam driving system 116 can be transmitted to the second arm 117, so that the second rotating stage 112b can be rotated by generating a torque through the guidance provided by the second flexible joint 112e connected between the first rotating stage 112a and the second rotating stage 112b. In this embodiment, the second cam driving system 116 includes a second eccentric cam and a second rotary motor connected to the second arm 117. In addition, a second rotary encoder can be integrated with the second rotary motor to measure the angular displacement of the second rotary motor, and then use the angular displacement to determine the corresponding linear displacement of the second eccentric cam. Similar to the first rotating stage 112a, different types of encoders can be used to measure the linear displacement of the second eccentric cam of the second cam driving system 116 or the angular displacement of the second rotating stage 112b.

[0037] Each of the first and second flexible joints 112d and 112e may include a pair of cross-bar hinges. Figure 3A A flexible cross-bar hinge of first and second flexible joints 112d, 112e is shown. Each flexible hinge may include two crossed leaf springs. In this embodiment, each flexible hinge may include a cross-bar hinge formed by connecting two substantially parallel rigid plates 112-1 with a pair of leaf springs 112-2 that cross each other at an angle (typically 90 degrees).

[0038] Figure 3B FIG. 1 is a perspective view of the flexible turntable 112, showing the flexible crossbar hinges of the first and second flexible joints 112d and 112e. Figure 3BAs shown, the first flexible joint 112d includes a pair of flexible cross-bar hinges 112d-1 and 112d-2, which are between the first rotating stage 112a and the base plate 112c and are arranged on opposite sides of the first rotating stage 112a. The arrangement of the pair of flexible cross-bar hinges 112d-1 and 112d-2 allows the two flexible cross-bar hinges 112d-1 and 112d-2 to be operable to be synchronously flexed around the x-axis. The second flexible joint 112e includes a pair of flexible cross-bar hinges 112e-1 and 112e-2, which are between the first and second rotating stages 112a, 112b and are arranged on opposite sides of the second rotating stage 112b. The arrangement of the pair of flexible cross-bar hinges 112e-1 and 112e-2 allows the two flexible cross-bar hinges 112e-1 and 112e-2 to be operable to be synchronously flexed around the y-axis. In this embodiment, the two pairs of flexible cross-bar hinges 112d-1, 112d-2, 112e-1 and 112e-2 are arranged in such a manner that a line passing through the pair of flexible cross-bar hinges 112d-1 and 112d-2 (i.e., Figure 2A The x-axis (second rotation axis) passing through it is perpendicular to the line passing through the pair of flexible cross-bar hinges 112e-1 and 112e-2 (ie, as shown in FIG. Figure 2A In addition, the arrangement of the flexible cross-bar hinges of the first and second flexible joints 112d and 112e ensures that the x-axis and the y-axis are located in the same plane.

[0039] It should be noted that the flexible crossbar hinge is provided for illustration purposes only and is not intended to limit the scope of the present invention. Other types of flexible hinges may also be used in the present invention.

[0040] like Figure 2A and Figure 3B As shown, the flexure turntable 112 can be designed to include a hollow portion 112f, the size of which is suitable for accommodating and installing the rotating assembly 111, so that the bonding tool 101 can be connected to the rotating assembly 111. This hollow portion configured to accommodate the rotating assembly 111 helps to minimize the size of the bond head, and also facilitates the installation of the rotating assembly 111 at a position closer to the rotation center of the flexure turntable 112, thereby minimizing unnecessary translation of the bond head 100 due to the aforementioned flipping and tilting movements.

[0041] Figure 4A plan view of a bonding head 200 according to one embodiment of the present invention is shown. The bonding head 200 includes a rotational motion mechanism 210 and a linear positioning mechanism 220 connected to the rotational motion mechanism 210. The rotational motion mechanism 210 includes a rotational assembly 211 and a flexible turntable 212. The rotational assembly 211 can be connected to the flexible turntable 212 and is arranged to pass through the hollow portion of the flexible turntable 212 so that a bonding tool can be mounted on one end of the rotational assembly 211. The linear positioning mechanism 220 includes an x'-axis linear motion assembly 221, a z-axis linear motion assembly 222 arranged on the x'-axis linear motion assembly 221, and a y'-axis linear motion assembly 223 arranged on the z-axis linear motion assembly 222. The x'-axis linear motion assembly 221 is configured to drive the bonding tool mounted on the rotational assembly 211 to move along the x'-axis direction. The z-axis linear motion assembly 222 is configured to drive the bonding tool mounted on the rotational assembly 211 to move along the z-axis direction. The y'-axis linear motion assembly 223 is configured to drive the bonding tool mounted on the rotating assembly 211 to move along the y'-axis direction. The flexible turntable 212 is directly connected to the y-axis linear motion assembly 223. The flexible turntable 212 is operable to rotate the bonding tool mounted on the rotating assembly 211 around the tilt axis x and the flip axis y, respectively. The tilt axis x is at a 45-degree angle relative to the x' axis, and the flip axis y is at a 45-degree angle relative to the y' axis.

[0042] When the bond head 100 , 200 is used to pick up or place an electronic component during a bonding process, a method for manufacturing an electronic package including an electronic component bonded to a surface of the electronic package using the bond head 100 , 200 includes the following steps.

[0043] Step 1: Rotate the bonding tool 101 of the bonding head 100 , 200 by the rotary motion mechanism 110 , 210 to adjust the angular orientation of the electronic component held by the bonding tool 101 .

[0044] Specifically, in step 1, the bonding tool 101 can be rotated around the z-axis by the rotating components 111, 211 of the rotating motion mechanism 110, 210 to adjust the angular orientation of the electronic component. θ z, and / or by rotating the flexure turntable 112, 212 of the rotational motion mechanism 110, 210 to rotate the bonding tool 101 about at least one of the x-axis and the y-axis to adjust the angular orientation of the electronic component held by the bonding tool 101 θ x、 θ y.

[0045] Step 2: The bonding tool 101 is moved along at least one of the x′ axis, the y′ axis, and the z axis by the linear positioning mechanism 120 , 220 connected to the rotary motion mechanism 110 , 120 to adjust the position of the electronic component held by the bonding tool 101 .

[0046] It should be noted that in other embodiments, the order of step 1 and step 2 may be changed. That is, the position of the electronic component held by the bonding tool 101 may be adjusted using the linear positioning mechanism 120, 220 first, and then the angular orientation of the electronic component held by the bonding tool 101 may be adjusted using the rotational movement mechanism 110, 210. Alternatively, the electronic component may be adjusted by the linear positioning mechanism 120, 220 and the rotational movement mechanism 110, 210 at the same time.

[0047] Step 3: Use bonding tool 101 to bond the electronic component to the surface of the electronic package.

[0048] Various modifications may be made to the above-described embodiments. In other embodiments, the mechanical arrangement order of the rotary motion mechanism 110, 210 and the linear positioning mechanism 120, 220 may be different. For example, the flexible turntable 112, 222 may be disposed on the rotary assembly 111, 211, and the bonding tool 101 may be directly mounted on the flexible turntable 112, 222; the order of the x-axis, y-axis, and z-axis linear motion assemblies may be different; or the linear positioning mechanism 120, 220 may be mounted on the rotary motion mechanism 110 and 210, and the bonding tool 101 may be directly connected to the linear positioning mechanism 120, 220. As long as these drive systems can drive the flipping and tilting motions of the flexible turntable 112, 212, other types of drive systems may be used to replace the first and second cam drive systems 114 and 116. The flexible cross-bar hinges of the first and second flexible joints 112d and 112e may also be replaced with other types of flexible hinges or flexible structures as long as they are operable to guide the tilt and flip motions of the first and second rotating stages 112a and 112b.

[0049] The invention described herein is susceptible to variations, modifications and / or additions other than those specifically described, and it is to be understood that the invention includes all such variations, modifications and / or additions that fall within the spirit and scope of the foregoing description.

Claims

1. A bonding head of a bonding machine having a bonding tool for bonding electronic components, the bonding head comprising: a rotational movement mechanism operable to rotate the bonding tool to adjust the angular orientation of the electronic component held by the bonding tool, wherein the rotational movement mechanism comprises a rotation assembly and a flexible turntable connected to each other, The rotation assembly is operable to rotate the bonding tool about a first rotation axis, and the flexure turntable is operable to rotate the bonding tool about respective second and third rotation axes, the first, second and third rotation axes being orthogonal to one another; and A linear positioning mechanism is connected to the rotary motion mechanism and is operable to drive the bonding tool to move parallel to the first rotation axis and along a first plane parallel to a second plane where the second rotation axis and the third rotation axis are located.

2. The bonding head according to claim 1, wherein: The rotating assembly or the flexure disk is directly connected to the bonding tool.

3. The bonding head according to claim 1, wherein: The flexible turntable includes a first rotating stage, a second rotating stage and a substrate, a first flexible joint is connected between the first rotating stage and the substrate so that the first rotating stage can rotate around the second rotating axis, and a second flexible joint is connected between the first rotating stage and the second rotating stage so that the second rotating stage can rotate around the third rotating axis.

4. The bonding head according to claim 3, wherein: The first flexure joint includes a first pair of flexure hinges between the first rotating stage and the base plate and disposed on opposite sides of the first rotating stage such that the two flexure hinges are operable to flex synchronously about the second rotation axis.

5. The bonding head according to claim 4, wherein: The second flexure joint includes a second pair of flexure hinges between the first and second rotating stages and disposed on opposite sides of the second rotating stage such that the two flexure hinges are operable to flex synchronously about the third rotation axis.

6. The bonding head according to claim 5, wherein: Each flexure hinge comprises two crossed leaf springs.

7. The bonding head according to claim 5, wherein: A line passing through the first pair of flexure hinges is perpendicular to a line passing through the second pair of flexure hinges.

8. The bonding head according to claim 7, wherein: The linear positioning mechanism is configured to drive the bonding tool to move along the first plane on a first linear motion axis and a second linear motion axis, wherein the first linear motion axis and the second linear motion axis are respectively arranged at a 45 degree angle relative to the second rotation axis and the third rotation axis.

9. The bonding head according to claim 3, wherein: The rotary motion mechanism also includes a first drive system, which is mounted on the base plate of the flexible turntable and connected to a first arm protruding from the first rotary stage through an elastic member so as to provide force to the first arm to rotate the first rotary stage around the first flexible joint.

10. The bonding head according to claim 9, wherein: The rotary motion mechanism also includes a second drive system, which is mounted on the first rotary stage and connected to a second arm protruding from the second rotary stage through an elastic member so as to provide force to the second arm to rotate the second rotary stage around the second flexible joint.

11. The bonding head according to claim 10, wherein: The elastic member includes a pair of preloaded tension springs.

12. The bonding head according to claim 10, wherein: At least one of the first drive system and the second drive system includes a cam drive assembly including an eccentric cam and a rotary motor connected to the first arm and / or the second arm.

13. The bonding head according to claim 12, wherein: The rotary motion mechanism further includes a rotary encoder integrated with the rotary motor to measure an angular displacement of the rotary motor, and then use the angular displacement to determine a corresponding linear displacement of the eccentric cam.

14. The bonding head according to claim 3, wherein: The flexible turntable includes a hollow portion sized to receive and mount the rotational assembly and to couple the bonding tool to the rotational motion mechanism.

15. The bonding head according to claim 1, wherein: The linear positioning mechanism includes a first linear motion component, a second linear motion component arranged on the first linear motion component, and a third linear motion component arranged on the second linear motion component, wherein the first linear motion component, the second linear motion component and the third motion component drive the bonding tool to move along three orthogonal axes in a Cartesian coordinate system respectively.

16. A bonding machine comprising a bonding head having a bonding tool for bonding electronic components, the bonding head comprising: a rotational movement mechanism operable to rotate the bonding tool to adjust the angular orientation of the electronic component held by the bonding tool, wherein the rotational movement mechanism comprises a rotation assembly and a flexible turntable, the rotation assembly being operable to rotate the bonding tool about a first rotational axis, the flexible turntable being operable to rotate the bonding tool about respective second and third rotational axes, the first rotational axis being orthogonal to the second and third rotational axes; and A linear positioning mechanism is connected to the rotary motion mechanism and is operable to drive the bonding tool to move parallel to the first rotation axis and along a first plane parallel to a second plane where the second rotation axis and the third rotation axis lie.

17. A method for manufacturing an electronic package, the electronic package comprising an electronic component bonded to a surface of the electronic package using a bonding tool, the method comprising: rotating the bonding tool about a first rotational axis using a rotational motion mechanism to adjust an angular orientation of the electronic component held by the bonding tool; rotating the bonding tool about at least one of a second rotation axis and a third rotation axis using a flexible rotary disk, the first rotation axis being orthogonal to the second rotation axis and the third rotation axis; Using a linear positioning mechanism connected to the rotary motion mechanism, the bonding tool is moved parallel to the first rotation axis and a first plane parallel to a second plane in which the second rotation axis and the third rotation axis lie; and The electronic component is bonded to the surface using the bonding tool.

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