Semiconductor process chamber and position detection method of liquid medicine spraying arm

Abstract

The invention provides a semiconductor process chamber and a position detection method of a liquid medicine spraying arm, the semiconductor process chamber comprises a cavity, the liquid medicine spraying arm and a chuck, the liquid medicine spraying arm and the chuck are both arranged in the cavity, the liquid medicine spraying arm is used for spraying liquid medicine to a wafer carried by the chuck, and the liquid medicine spraying arm is used for spraying the liquid medicine to the wafer. The semiconductor process chamber further comprises a measuring structure and a plurality of distance measuring sensors, the measuring structure is fixedly arranged on the liquid medicine spraying arm, the measuring structure is provided with a plurality of measuring faces, and the distance measuring sensors are used for measuring the distances of the measuring faces facing the distance measuring sensors so as to determine the positions of the measuring structure in the direction perpendicular to the measuring faces. And further determining the position offset of the measurement structure. According to the semiconductor process chamber provided by the invention, distance measurement can be carried out on the measurement surface of the measurement structure on the liquid medicine spraying arm through the plurality of distance measurement sensors so as to determine the position offset of the measurement structure, so that abnormity is found when the verticality of the liquid medicine spraying arm changes, and the cleaning effect of wafers and the yield of the wafers are ensured.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor process equipment, and in particular to a semiconductor process chamber and a position detection method for a liquid medicine spray arm. Background Art

[0002] In single-wafer cleaning equipment, the liquid spray arm (ARM) structure plays the role of spraying liquid. During the process, the liquid spray arm needs to spray liquid onto the wafer on the chuck. If the verticality of the liquid spray arm structure is affected, the liquid sprayed onto the wafer will be unevenly distributed, affecting the cleaning effect of the wafer and the yield of the wafer. This will not only cause irreparable losses to the current products, but also cause a large amount of product waste if not discovered in time. However, the existing single-wafer cleaning equipment cannot automatically detect the position of the liquid spray arm before the liquid spray arm sprays the liquid, so it is impossible to detect changes in the verticality of the liquid spray arm in time, resulting in poor wafer cleaning effect and low yield.

[0003] Therefore, how to provide a semiconductor process chamber that can automatically detect the position of a liquid medicine spray arm has become a technical problem that needs to be solved urgently in this field. Summary of the invention

[0004] The present invention aims to provide a semiconductor process chamber, which can ensure the accuracy of the position of a liquid medicine spray arm.

[0005] To achieve the above-mentioned purpose, as one aspect of the present invention, a semiconductor process chamber is provided, which includes a cavity, a liquid medicine spray arm and a chuck, wherein the liquid medicine spray arm and the chuck are both arranged in the cavity, and the liquid medicine spray arm is used to spray liquid medicine onto a wafer carried by the chuck. The semiconductor process chamber also includes a measuring structure and a plurality of ranging sensors, wherein the measuring structure is fixedly arranged on the liquid medicine spray arm, and the measuring structure has a plurality of measuring surfaces, and the plurality of ranging sensors are used to measure the distance of the measuring surfaces to which they are directed, so as to determine the position of the measuring structure along a direction perpendicular to each of the measuring surfaces, and further determine the position offset of the measuring structure.

[0006] Optionally, the measurement structure includes at least one measurement block, the measurement block has a pair of measurement surfaces, and the two measurement surfaces are perpendicular to each other, and the semiconductor process chamber includes a pair of distance measuring sensors, the two distance measuring sensors are respectively opposite to the two measurement surfaces of the measurement block and are used to measure the distance of the measurement surfaces to determine the position offset of the measurement structure.

[0007] Optionally, the measuring structure includes a pair of measuring blocks, each of which has a docking surface. Both the measuring surface and the docking surface are parallel to the axis of the liquid medicine spray arm. A locking groove is formed on the docking surface. The docking surfaces of the two measuring blocks are matched, and the two locking grooves surround the two sides of the liquid medicine spray arm to fix the two measuring blocks on the liquid medicine spray arm.

[0008] Optionally, the measuring block has a plurality of fixing parts on both sides along the extending direction of the axis of the liquid medicine spraying arm, and the plurality of fixing parts of the two measuring blocks are fixedly connected in a one-to-one correspondence.

[0009] Optionally, at least one arc-shaped groove extending around the axis of the liquid medicine spray arm is formed on the inner wall of the locking groove, and the arc-shaped grooves of the two measuring blocks are connected one-to-one. The semiconductor process chamber also includes at least one sealing ring, which is mounted on the liquid medicine spray arm and accommodated in the arc-shaped groove one-to-one.

[0010] Optionally, two arc-shaped grooves are formed on the inner wall of the locking groove, and the two arc-shaped grooves are arranged at intervals along the extension direction of the axis of the liquid medicine spray arm, and the semiconductor process chamber includes a pair of sealing rings.

[0011] Optionally, the measuring block has a pair of fixing parts on both sides along the extending direction of the axis of the liquid medicine spraying arm, and each pair of fixing parts is arranged on both sides of the locking groove.

[0012] Optionally, a mounting hole is formed in the fixing portion, and the multiple fixing portions of the two measuring blocks are fixedly connected one by one via threaded fasteners.

[0013] As a second aspect of the present invention, a method for detecting the position of a liquid spray arm is provided, which is used to detect the position of the liquid spray arm in the semiconductor process chamber described above, and the method comprises:

[0014] The position offset of the measuring structure is determined according to the distance values ​​obtained by the plurality of distance measuring sensors for measuring the distances of the plurality of measuring surfaces.

[0015] Optionally, determining the position offset of the liquid spray arm according to the distance values ​​obtained by the multiple distance measuring sensors measuring the distances of the multiple measuring surfaces includes:

[0016] Determine the axial offset of the measuring structure along the corresponding two coordinate axis directions according to the detection distance values ​​obtained by the two distance measuring sensors measuring the distances of the two measuring surfaces and the origin distance values ​​of the two distance measuring sensors when the liquid spray arm is in a normal position;

[0017] According to the two axial offsets of the measuring structure, the position offset of the measuring structure is determined based on the Pythagorean theorem.

[0018] In the semiconductor process chamber and the position detection method of the liquid spray arm provided by the present invention, a measuring structure is provided on the liquid spray arm, and the measuring structure has a plurality of measuring surfaces, so that when the verticality of the liquid spray arm changes, the position of the measuring structure will also change with the swing of the liquid spray arm, thereby changing the distance between each measuring surface of the measuring structure and its corresponding distance measuring sensor, and then the position offset of the measuring structure can be determined according to the distance measurement results of each distance measuring sensor, and the swing amplitude of the liquid spray arm can be determined thereby to correct the verticality deviation of the liquid spray arm. The semiconductor process chamber provided by the present invention can measure the distance of the plurality of measuring surfaces of the measuring structure fixed on the liquid spray arm by a plurality of distance measuring sensors to determine the position offset of the measuring structure on the liquid spray arm, so that the abnormality can be found in time when the verticality of the liquid spray arm changes, and the semiconductor process can be avoided from continuing when the liquid spray arm is abnormally positioned, thereby ensuring the cleaning effect of the wafer and the yield rate of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention but do not constitute a limitation of the present invention. In the accompanying drawings:

[0020] Figure 1 is a schematic structural diagram of a semiconductor process chamber provided by an embodiment of the present invention;

[0021] Figure 2 is a partial structural schematic diagram of a semiconductor process chamber provided by an embodiment of the present invention;

[0022] Figure 3 is a partial structural schematic diagram of a semiconductor process chamber provided by an embodiment of the present invention;

[0023] Figure 4 yes Figure 3 Exploded schematic diagram of the structure;

[0024] Figure 5 is a schematic structural diagram of a measurement structure in a semiconductor process chamber provided by an embodiment of the present invention;

[0025] Figure 6 yes Figure 5 Exploded schematic diagram of the structure;

[0026] Figure 7 It is a schematic diagram of the top structure of a measurement block in a semiconductor process chamber provided by an embodiment of the present invention.

[0027] Description of reference numerals:

[0028] 100: Cavity

[0029] 200: Liquid spray arm

[0030] 210: Vertical segment

[0031] 220: Horizontal segment

[0032] 230: Nozzle

[0033] 300: Chuck

[0034] 400: Measurement Structure

[0035] 410: Measurement Block

[0036] 411: Measurement surface

[0037] 412: Butt joint

[0038] 413: Locking groove

[0039] 414: Arc groove

[0040] 420: Fixed part

[0041] 430: Sealing ring

[0042] 440: Threaded fasteners

[0043] 441: Screw

[0044] 442: Nut

[0045] 510: Distance sensor

[0046] 520: Mounting

[0047] 600: Driving mechanism DETAILED DESCRIPTION

[0048] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present invention, and is not used to limit the present invention.

[0049] To solve the above technical problems, as one aspect of the present invention, a semiconductor process chamber is provided, such as Figure 1 As shown, the semiconductor process chamber includes a cavity 100, a liquid spray arm 200 and a chuck 300. The liquid spray arm 200 and the chuck 300 are both arranged in the cavity 100. The liquid spray arm 200 is used to spray liquid onto the wafer carried by the chuck 300. Figure 2As shown, the semiconductor process chamber also includes a measuring structure 400 and a plurality of distance measuring sensors 510. The measuring structure 400 is fixedly disposed on the liquid spray arm 200, and has a plurality of measuring surfaces 411. The plurality of distance measuring sensors 510 are used to measure the distances of the measuring surfaces 411 in their respective directions, so as to determine the position of the measuring structure 400 along a direction perpendicular to each measuring surface 411, and further determine the position offset of the measuring structure 400.

[0050] In the semiconductor process chamber provided by the present invention, a measuring structure 400 is provided on the liquid spray arm 200, and a plurality of measuring surfaces 411 are provided on the measuring structure 400, so that when the verticality of the liquid spray arm 200 changes, the position of the measuring structure 400 will also change with the swing of the liquid spray arm 200, thereby changing the distance between each measuring surface 411 of the measuring structure 400 and its corresponding distance measuring sensor 510, and then the position offset of the measuring structure 400 (i.e., the deviation between the position of the measuring structure 400 and the initial position when the verticality of the liquid spray arm 200 is normal) can be determined according to the distance measurement results of each distance measuring sensor 510 for the measuring surface 411 facing each other, and the swing amplitude of the liquid spray arm 200 is determined thereby to correct the verticality deviation of the liquid spray arm 200. The semiconductor process chamber provided by the present invention can measure the distance of multiple measuring surfaces 411 of the measuring structure 400 fixed on the liquid spray arm 200 through multiple ranging sensors 510 to determine the position offset of the measuring structure 400 on the liquid spray arm 200, so as to detect abnormalities in time when the verticality of the liquid spray arm 200 changes, avoid continuing the semiconductor process when the position of the liquid spray arm 200 is abnormal, and ensure the cleaning effect of the wafer and the yield of the wafer.

[0051] As an optional implementation of the present invention, the distance measuring sensor 510 is a photoelectric distance measuring sensor.

[0052] In order to ensure the accuracy of detecting the position of the liquid spray arm 200, as a preferred embodiment of the present invention, Figures 3 to 7 As shown, the measurement structure 400 includes at least one measurement block 410, and the measurement block 410 has a pair of measurement surfaces 411, and the two measurement surfaces 411 are perpendicular to each other. Figure 3 , Figure 4 As shown, the semiconductor process chamber includes a pair of distance measuring sensors 510 , and the two distance measuring sensors 510 are respectively opposite to the two measuring surfaces 411 of the measuring block 410 and are used to measure the distance of the two measuring surfaces 411 to determine the position offset of the liquid spray arm 200 .

[0053] In the embodiment of the present invention, the two distance measuring sensors 510 are facing the two measuring surfaces 411 of the measuring block 410 and measure the distance of the measuring surfaces 411 one by one. The two measuring surfaces 411 to be measured are located on the same measuring block 410, so that the two measuring surfaces 411 to be measured can always be kept vertical and the relative position remains unchanged, thereby ensuring the accuracy of detecting the position of the liquid spray arm 200;

[0054] Furthermore, in the embodiment of the present invention, the position offset of the measurement structure 400 is determined by the result of the two distance measuring sensors 510 measuring the distances of the two measurement surfaces 411, so that a plane rectangular coordinate system can be constructed according to the distance measuring data of the two distance measuring sensors 510, specifically:

[0055] like Figure 2 As shown in the figure, the distance measurement direction of one distance measurement sensor 510 is the x direction, and the distance measurement direction of the other distance measurement sensor 510 is the y direction. In the case that the verticality of the liquid spray arm 200 is good, the distance measurement can be performed to obtain the origin distance measurement value X0 between the distance measurement sensor 510 in the x direction and the corresponding measurement surface 411, and the origin distance measurement value Y0 between the distance measurement sensor 510 in the y direction and the corresponding measurement surface 411. Then, the origin position of the liquid spray arm 200 is A(X0, Y0). In the actual process, the distance measurement in the x direction is The detection distance value measured by the distance sensor 510 is X1, and the detection distance value measured by the distance sensor 510 in the y direction is Y1. The detection position of the liquid spray arm 200 is B(X1, Y1), the offset of the liquid spray arm 200 in the X-axis direction is ΔX=|X1-X0|, and the offset of the liquid spray arm 200 in the Y-axis direction is ΔY=|Y1-Y0|. Then, according to the Pythagorean theorem, the position offset of the liquid spray arm 200 relative to the origin (that is, the position of the measuring structure 400 when the verticality of the liquid spray arm 200 is good) can be obtained as

[0056] As a preferred embodiment of the present invention, Figures 3 to 6 As shown, the measuring structure 400 includes a pair of measuring blocks 410, and the measuring blocks 410 also have a docking surface 412. The measuring surface 411 and the docking surface 412 are parallel to the axis of the liquid spray arm 200. A locking groove 413 is formed on the docking surface 412. The docking surfaces 412 of the two measuring blocks 410 are aligned, and the two locking grooves 413 surround the two sides of the liquid spray arm 200 to fix the two measuring blocks 410 on the liquid spray arm 200.

[0057] In the embodiment of the present invention, the measuring structure 400 includes a pair of measuring blocks 410, which are fixed by holding the liquid spray arm 200 on both sides. In actual use, only the two measuring surfaces 411 of one measuring block 410 are respectively facing the two distance measuring sensors 510, and the two distance measuring sensors 510 respectively emit light to the two measuring surfaces 411 and receive the reflected light to measure the distance, thereby determining the position of the measuring structure 400. In addition, the two measuring blocks 410 have two measuring surfaces 411 perpendicular to each other, so that when one measuring block 410 cannot measure the distance due to wear, dirt, etc., the other measuring block 410 can be rotated to the direction of the measuring block 410 originally used for distance measurement, and the positions of the two measuring blocks 410 are interchanged, so that the other measuring block 410 replaces the original measuring block 410 in use, and the measuring surface 411 rotated to face the distance measuring sensor 510 can still measure the distance normally, thereby reducing the maintenance cycle of the measuring block 410, thereby ensuring the machine production capacity.

[0058] As an optional embodiment of the present invention, Figure 2 As shown, the semiconductor process chamber further includes a plurality of mounting seats 520 , which are fixedly disposed on the inner wall of the chamber 100 , and a plurality of distance measuring sensors 510 are fixedly disposed on the plurality of mounting seats 520 in a one-to-one correspondence.

[0059] As an optional implementation of the present invention, the semiconductor process chamber further includes a controller, and the controller is used to determine the position offset of the measurement structure 400 according to the distance measurement result of the distance measurement sensor 510 .

[0060] In order to improve the safety of the semiconductor process, as a preferred embodiment of the present invention, the controller is also used to issue an alarm and control the semiconductor process chamber to stop the process when the position offset of the measuring structure 400 exceeds a preset offset threshold (that is, when the inclination amplitude of the liquid spray arm 200 increases to affect the uniformity of the liquid spray arm 200 spraying liquid onto the wafer).

[0061] As an optional embodiment of the present invention, Figure 6 , Figure 7 As shown, the locking groove 413 is a semi-cylindrical groove.

[0062] As an optional embodiment of the present invention, Figures 4 to 7 As shown, the measuring block 410 has a plurality of fixing parts 420 on both sides along the extending direction of the axis of the liquid medicine spraying arm 200 , and the plurality of fixing parts 420 of the two measuring blocks 410 are fixedly connected in a one-to-one correspondence.

[0063] In order to ensure the stability of the position of the measuring block 410, as a preferred embodiment of the present invention, Figure 6As shown, at least one arc groove 414 extending around the axis of the liquid spray arm 200 is formed on the inner wall of the locking groove 413, and the arc grooves 414 of the two measuring blocks 410 are connected one by one. The semiconductor process chamber also includes at least one sealing ring 430, which is sleeved on the liquid spray arm 200 and accommodated in the arc groove 414 one by one.

[0064] In the embodiment of the present invention, a sealing ring 430 is further provided between the inner wall of the locking groove 413 and the surface of the liquid spray arm 200. The sealing ring can fasten the liquid spray arm 200 through elastic deformation, thereby preventing the measuring block 410 from slipping off the liquid spray arm 200 and preventing the measuring block 410 from twisting around the axis of the liquid spray arm 200, thereby ensuring the stability of the position of the measuring block 410, and further ensuring the accuracy of the ranging result of the ranging sensor 510, thereby improving the accuracy of the position of the liquid spray arm 200.

[0065] As an optional implementation of the present invention, the material of the sealing ring 430 includes Teflon rubber.

[0066] As an optional embodiment of the present invention, Figure 6 As shown, two arc grooves 414 are formed on the inner wall of the locking groove 413 , and the two arc grooves 414 are spaced apart along the extending direction of the axis of the liquid spray arm 200 . The semiconductor process chamber includes a pair of sealing rings 430 .

[0067] As an optional embodiment of the present invention, Figures 4 to 7 As shown, the measuring block 410 has a pair of fixing parts 420 on both sides along the extending direction of the axis of the liquid medicine spraying arm 200 , and each pair of fixing parts 420 is arranged on both sides of the locking groove 413 .

[0068] As an optional embodiment of the present invention, Figure 6 As shown, a mounting hole is formed in the fixing portion 420 , and the multiple fixing portions 420 of the two measuring blocks 410 are fixedly connected one by one via threaded fasteners 440 .

[0069] As an optional embodiment of the present invention, the threaded fastener 440 may be a bolt, specifically, Figure 6 As shown, the threaded fastener 440 includes a screw 441 and a nut 442 . The screw 441 passes through the corresponding mounting holes of the two fixing parts 420 in sequence and is screwed into the nut 442 to fix the two fixing parts 420 together.

[0070] As an optional implementation of the present invention, the material of the measuring block 410 includes polyvinyl chloride (PVC).

[0071] As an optional embodiment of the present invention, Figure 3 , Figure 4 As shown, the liquid spray arm 200 includes a vertical section 210, a horizontal section 220 and a nozzle 230. The horizontal section 220 is connected between the vertical section 210 and the nozzle 230. The vertical section 210 and the nozzle 230 are both vertically arranged, and the vertical section 210 and the horizontal section 220 are connected by an arc transition, and the horizontal section 220 and the nozzle 230 are connected by an arc transition.

[0072] As an optional embodiment of the present invention, Figures 2 to 4 As shown, the height of the measuring structure 400 is lower than the height of the nozzle.

[0073] As an optional embodiment of the present invention, Figure 1 As shown, the semiconductor process chamber further includes a driving mechanism 600 , which is connected to the bottom end of the vertical section 210 and is used to drive the liquid spray arm 200 to move up and down and rotate around the axis of the vertical section 210 .

[0074] As a second aspect of the present invention, a method for detecting the position of a liquid spray arm 200 is provided, which is used to detect the position of the liquid spray arm 200 in the semiconductor process chamber provided by an embodiment of the present invention. The method comprises:

[0075] The position of the measurement structure 400 along the direction perpendicular to each measurement surface 411 is determined based on the distance measurement values ​​obtained by the multiple distance measurement sensors 510 on the measurement surfaces 411 facing the respective directions, and then the position offset of the measurement structure 400 is determined.

[0076] In the position detection method of the liquid medicine spray arm 200 provided by the present invention, a measuring structure 400 is provided on the liquid medicine spray arm 200, and the measuring structure 400 has a plurality of measuring surfaces 411, so that when the verticality of the liquid medicine spray arm 200 changes, the position of the measuring structure 400 will also change with the swing of the liquid medicine spray arm 200, thereby changing the distance between each measuring surface 411 of the measuring structure 400 and its corresponding distance measuring sensor 510, and then the position offset of the measuring structure 400 can be determined according to the distance measuring results of each distance measuring sensor 510. The semiconductor process chamber provided by the present invention can measure the distance of multiple measuring surfaces 411 of the measuring structure 400 fixed on the liquid spray arm 200 through multiple ranging sensors 510 to determine the position offset of the measuring structure 400 on the liquid spray arm 200, so as to detect abnormalities in time when the verticality of the liquid spray arm 200 changes, and avoid continuing the semiconductor process when the position of the liquid spray arm 200 is abnormal, thereby ensuring the cleaning effect of the wafer and the wafer yield.

[0077] As an optional embodiment of the present invention, the measuring structure 400 includes a pair of measuring blocks 410, the measuring blocks 410 have a docking surface 412 parallel to the axis of the liquid medicine spray arm 200 and a pair of measuring surfaces 411, and the two measuring surfaces 411 of each measuring block 410 are perpendicular to each other, and a locking groove 413 is formed on the docking surface 412. The docking surfaces 412 of the two measuring blocks 410 are matched, and the two locking grooves 413 surround the two sides of the liquid medicine spray arm 200 to fix the two measuring blocks 410 on the liquid medicine spray arm 200;

[0078] The semiconductor process chamber includes a pair of distance measuring sensors 510, and the two distance measuring sensors 510 are used to measure the distance of two measuring surfaces 411 of the same measuring block 410 to determine the position offset of the measuring structure 400;

[0079] The steps of determining the position of the measurement structure 400 along a direction perpendicular to each measurement surface 411 according to the distance measurement values ​​obtained by the multiple distance measurement sensors 510 for the measurement surfaces 411 facing the respective directions, and then determining the position offset of the measurement structure 400 specifically include:

[0080] According to the detection distance measurement values ​​obtained by the two distance measurement sensors 510 measuring the distances of the two measurement surfaces 411, and the origin distance measurement values ​​of the two distance measurement sensors 510 when the liquid spray arm 200 is in a normal position, the axial offset of the measurement structure 400 along the corresponding two coordinate axis directions is determined;

[0081] According to the two axial offsets of the measuring structure 400 , the position offset of the measuring structure 400 is determined based on the Pythagorean theorem.

[0082] Specifically, Figure 2 As shown, the ranging direction of one ranging sensor 510 is the x direction, and the ranging direction of the other ranging sensor 510 is the y direction. When the verticality of the liquid spray arm 200 is good, the ranging can be performed to obtain the origin ranging value between the ranging sensor 510 in the x direction and the corresponding measuring surface 411 as X0, and the origin ranging value between the ranging sensor 510 in the y direction and the corresponding measuring surface 411 as Y0. Then, the origin position of the liquid spray arm 200 is A(X0, Y0 ); In the actual process, the detection distance value measured by the distance sensor 510 in the x direction is X1, and the detection distance value measured by the distance sensor 510 in the y direction is Y1, then the detection position of the measurement structure 400 is B(X1, Y1), the offset of the measurement structure 400 in the x-axis direction is ΔX=|X1-X0|, and the offset of the measurement structure 400 in the y-axis direction is ΔY=|Y1-Y0|, then the position offset of the measurement structure 400 relative to the origin can be obtained according to the Pythagorean theorem:

[0083] As a third aspect of the present invention, a single-wafer cleaning device is provided, including the semiconductor process chamber provided by an embodiment of the present invention.

[0084] In the single-wafer cleaning equipment provided by the present invention, a measuring structure 400 is provided on the liquid spray arm 200, and the measuring structure 400 has a plurality of measuring surfaces 411, so that when the verticality of the liquid spray arm 200 changes, the position of the measuring structure 400 will also change with the swing of the liquid spray arm 200, thereby changing the distance between each measuring surface 411 of the measuring structure 400 and its corresponding distance measuring sensor 510, and then the position offset of the measuring structure 400 can be determined according to the distance measuring result of each distance measuring sensor 510. The semiconductor process chamber provided by the present invention can measure the distance of the plurality of measuring surfaces 411 of the measuring structure 400 fixed on the liquid spray arm 200 by a plurality of distance measuring sensors 510 to determine the position offset of the measuring structure 400, so that the abnormality can be found in time when the verticality of the liquid spray arm 200 changes, and the semiconductor process can be avoided from continuing when the position of the liquid spray arm 200 is abnormal, thereby ensuring the cleaning effect of the wafer and the yield rate of the wafer.

[0085] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A semiconductor process chamber, comprising a chamber, a liquid medicine spray arm and a chuck, wherein the liquid medicine spray arm and the chuck are both arranged in the chamber, and the liquid medicine spray arm is used to spray liquid medicine onto a wafer carried by the chuck, characterized in that: The semiconductor process chamber also includes a measurement structure and a plurality of distance measuring sensors. The measurement structure is fixedly arranged on the liquid spray arm and has a plurality of measurement surfaces. The plurality of distance measuring sensors are used to measure the distance of the measurement surfaces in their respective directions to determine the position of the measurement structure along a direction perpendicular to each of the measurement surfaces, and further determine the position offset of the measurement structure.

2. The semiconductor process chamber according to claim 1, characterized in that: The measurement structure includes at least one measurement block, the measurement block has a pair of measurement surfaces, and the two measurement surfaces are perpendicular to each other. The semiconductor process chamber includes a pair of distance measuring sensors, the two distance measuring sensors are respectively opposite to the two measurement surfaces of the measurement block and are used to measure the distance of the measurement surfaces to determine the position offset of the measurement structure.

3. The semiconductor process chamber according to claim 2, characterized in that: The measuring structure includes a pair of measuring blocks, each of which has a docking surface. Both the measuring surface and the docking surface are parallel to the axis of the liquid medicine spray arm. A locking groove is formed on the docking surface. The docking surfaces of the two measuring blocks are matched, and the two locking grooves surround the two sides of the liquid medicine spray arm to fix the two measuring blocks on the liquid medicine spray arm.

4. The semiconductor process chamber according to claim 3, characterized in that: The measuring block has a plurality of fixing parts on both sides along the extending direction of the axis of the liquid medicine spraying arm, and the plurality of fixing parts of the two measuring blocks are fixedly connected in a one-to-one correspondence.

5. The semiconductor process chamber according to claim 4, characterized in that: At least one arc-shaped groove extending around the axis of the liquid medicine spray arm is formed on the inner wall of the locking groove, and the arc-shaped grooves of the two measuring blocks are connected one-to-one. The semiconductor process chamber also includes at least one sealing ring, which is sleeved on the liquid medicine spray arm and accommodated in the arc-shaped groove one-to-one.

6. The semiconductor process chamber according to claim 5, characterized in that: Two arc grooves are formed on the inner wall of the locking groove, and the two arc grooves are arranged at intervals along the extending direction of the axis of the liquid medicine spraying arm. The semiconductor process chamber includes a pair of sealing rings.

7. The semiconductor process chamber according to claim 4, characterized in that: The measuring block has a pair of fixing parts on both sides along the extending direction of the axis of the liquid medicine spraying arm, and each pair of fixing parts is arranged on both sides of the locking groove.

8. The semiconductor process chamber according to claim 4, characterized in that: A mounting hole is formed in the fixing portion, and the multiple fixing portions of the two measuring blocks are fixedly connected in a one-to-one correspondence through threaded fasteners.

9. A method for detecting the position of a liquid spray arm, characterized in that: Used to detect the position of a liquid spray arm in a semiconductor process chamber according to any one of claims 1 to 8, the method comprising: According to the distance measurement values ​​obtained by the multiple distance measurement sensors for measuring the distances of the respective measurement surfaces, the position of the measurement structure along the direction perpendicular to each of the measurement surfaces is determined, and then the position offset of the measurement structure is determined.

10. The method for detecting the position of a liquid medicine spray arm according to claim 9, characterized in that: Determining the position of the measurement structure along a direction perpendicular to each of the measurement surfaces according to the distance values ​​obtained by the plurality of distance measuring sensors for measuring the distances of the measurement surfaces in their respective directions, and then determining the position offset of the measurement structure, comprises: Determine the axial offset of the measuring structure along the corresponding two coordinate axis directions according to the detection distance values ​​obtained by the two distance measuring sensors measuring the distances of the two measuring surfaces and the origin distance values ​​of the two distance measuring sensors when the liquid spray arm is in a normal position; According to the two axial offsets of the measuring structure, the position offset of the measuring structure is determined based on the Pythagorean theorem.

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