Apparatus and method for testing an RF transceiver

Abstract

The present disclosure relates to an apparatus and method for testing a radio frequency (RF) transceiver. A test apparatus and method of testing an RF device. An apparatus for testing an RF transceiver includes a test waveguide structure. The test waveguide structure includes a body and a hollow waveguide embedded inside the body, where the hollow waveguide is formed by a metal wall of the body, and where the hollow waveguide extends through the body to route RF signals. The hollow waveguide includes an input port on the first surface of the body configured to receive an RF signal from an RF transceiver. The hollow waveguide also includes an output port on the first surface, and the output port is configured to wirelessly transmit at least a portion of the RF signal to an RF transceiver. A coupler is disposed within the body and is configured to couple a first portion of the RF signal to the output port and a second portion of the RF signal to the test port.

Description

Technical Field

[0001] The present disclosure relates generally to the field of radio frequency (RF) transceivers, and in particular to testing of RF transceivers. Background Art

[0002] A radio frequency (RF) transceiver having an RF wireless transmission structure such as an RF transmitter or an antenna integrated to transmit and receive wireless RF signals is used in various applications (eg, in wireless communications or radar sensors).

[0003] During manufacturing, such RF transceivers need to be tested to confirm that their functionality meets specifications or is confirmed with other requirements. In many applications, RF devices are used in safety-critical applications (e.g., in the automotive industry, RF transceivers may be an essential part of advanced driver assistance systems that improve driver safety and comfort). Therefore, it is important to test RF transceivers during manufacturing testing, since any deviation from the expected performance or even defects of the RF transceiver may result in poor performance or failure when the RF transceiver is operated in the field. On the other hand, manufacturing testing should also be cost-effective, since the time spent on testing increases the overall manufacturing cost.

[0004] Therefore, it is an object of the present application to provide a concept for improving the testing of RF transceivers. This object is solved by an apparatus according to claim 1 and a method for testing an RF transceiver according to claim 10 . Summary of the invention

[0005] According to an example of the present disclosure, a device for testing a radio frequency (RF) transceiver includes a test waveguide structure. The test waveguide structure includes a body and a hollow waveguide embedded inside the body, wherein the hollow waveguide is formed by a metal wall of the body, and wherein the hollow waveguide extends through the body to route RF signals. The hollow waveguide includes an input port on a first surface of the body, which is configured to receive an RF signal from an RF transceiver. The hollow waveguide also includes an output port on the first surface, and it is configured to transmit at least a portion of the RF signal to the RF transceiver. A coupler is arranged in the body, and it is configured to couple a first portion of the RF signal to the output port and couple a second portion to the test port.

[0006] According to an example of the present disclosure, a method for testing an RF transceiver includes: coupling the RF transceiver to an apparatus for testing the RF transceiver, and wirelessly transmitting an RF signal from the RF transceiver to an input port of a hollow waveguide. The method also includes: coupling a first portion of the RF signal to an output port of the hollow waveguide via a coupler, and wirelessly transmitting the first portion of the RF signal from the output port of the hollow waveguide to the RF transceiver. Further, the first portion of the RF signal is processed in the RF transceiver and a first test result of the test is determined based on the processing of the first portion of the RF signal in the RF transceiver. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The present disclosure is illustrated by way of example and not limitation, and the same reference numerals in the drawings refer to similar or equivalent elements. The elements of the drawings do not have to be drawn to scale relative to each other. Unless mutually exclusive, the features of the various illustrated examples may be combined.

[0008] Figure 1 A block diagram of an example of a test setup for testing an RF transceiver is illustrated.

[0009] Figure 2 A block diagram of an example of a test setup for testing an RF transceiver is illustrated.

[0010] Figure 3 A block diagram of an alternative example of a test setup for testing an RF transceiver is illustrated.

[0011] Figure 4A and Figure 4B Illustration of a 3D view of a test waveguide structure that can be used to test an RF transceiver.

[0012] Figure 4C The diagram shows the Figure 4A and Figure 4B Example of a waveguide delay line in a test waveguide structure.

[0013] Figure 5 A cross-sectional view of an apparatus for testing an RF transceiver is illustrated.

[0014] Figure 6 A block diagram of an example of a test setup for testing more than one RF transceiver is illustrated.

[0015] Figure 7 A block diagram of an example of a test setup for simultaneously testing more than one RF transceiver is illustrated. DETAILED DESCRIPTION

[0016] In the following description, directional terms (such as "top", "bottom", "upper", "lower", "front", "back", etc.) will be used with reference to the orientation of the figures being described. Components of the present disclosure can be placed in many different orientations, and the directional terms are used for purposes of illustration and not limitation.

[0017] In addition, when the terms "include," "have," "with," or other variations thereof are used in the detailed description or claims, these terms are intended to be included in a manner similar to the term "comprise." The terms "coupled" and "connected," as well as their derivatives, may be used. It should be understood that these terms may be used to indicate that two elements cooperate or interact with each other, whether or not they are in direct physical or electrical contact, or not in direct contact with each other; an intervening element or intervening layer may be provided between "bonded," "attached," or "connected" elements.

[0018] The embodiments described herein provide a new concept for testing RF transceivers, especially during manufacturing tests (process tests). Today, the industry is looking for a cost-effective solution to implement wireless RF transceivers. RF transceivers need to have wireless transmission elements (such as antennas or transmitters) designed for the operating frequency of the device. Integrating the wireless transmission element into the chip or into the chip package saves the end user from designing the interface between the wireless transmission element and the test sensor. However, for silicon chip manufacturers, the testing of RF transceivers during manufacturing tests provides new challenges due to the need to test silicon chip devices to provide evidence that the shipped equipment including the wireless transmission element is working properly. In addition, due to time and cost reasons, functional evidence in manufacturing tests needs to be obtained using a limited number of qualitative measurements.

[0019] The embodiments described herein allow for improved testing of RF transceivers with integrated wireless transmission structures (such as transmitters, antennas, etc.) without the need to obtain RF signals directly from the RF output port of the RF transceiver. As will be further described below, a hollow metal waveguide is provided in a body (such as a block made of metal or plastic) of a test setup. The hollow waveguide provides continuous wireless transmission of at least a portion of the RF signal coupled from the RF transceiver into the input port of the hollow waveguide and coupled to the output port of the hollow waveguide. At the output port of the hollow waveguide, at least a portion of the RF signal is transmitted back to the RF transceiver so that the RF signal is completely transmitted through the hollow waveguide inside the body. In other words, after the RF signal is coupled into the hollow waveguide, the RF signal transmitted back to the RF transceiver does not leave the body. With this in mind, as the RF signal propagates completely within the hollow waveguide, cross-coupling of the RF signal from the input port to the output port is minimized. In addition, one or more specific RF elements (such as passive couplers) are provided in the hollow waveguide to provide a portion of the RF signal to a dedicated test port. The overall concept thus enables efficient and time-saving testing as will be described hereinafter.

[0020] Reference now Figure 1 , a block diagram of a test setup 100 for testing an RF transceiver 102 is shown. The test setup 100 has a test waveguide structure 104 that is detachably coupled to the RF transceiver 102 to be tested (sometimes also referred to as a device under test (DUT)) during manufacturing testing. The test setup 100 can be used, for example, during manufacturing testing of the RF transceiver 102. As will be described later, the test waveguide structure 104 can also be considered a distribution waveguide structure that distributes test signals generated within the RF transceiver 102 to various ports.

[0021] The RF transceiver 102 has a first wireless transmission element 106 (such as an integrated transmitter or an integrated antenna) that is wirelessly coupled to an input port 120 of a hollow waveguide 146 of a test waveguide structure 104 during manufacturing testing. The RF transceiver 102 also includes a local oscillator 114 to generate an RF signal. The local oscillator 114 is coupled to a transmit channel 110 to process the RF signal. The output of the transmit channel 110 is coupled to the input of the first wireless transmission element 106.

[0022] The RF transceiver 102 also includes a second wireless transmission element 108 coupled to the receiving channel 112. The second wireless transmission element 108 may be a receiving antenna or a receiving transmitter. Figure 1As shown, the second wireless transmission element 108 is wirelessly coupled to the output port 122 of the hollow waveguide 146 during manufacturing testing. In some examples, the first wireless transmission element 106 and the second wireless transmission element 108 may be antennas integrated in the RF transceiver 102 and configured to directly transmit RF signals to the surroundings or receive RF signals from the surroundings during field operation of the RF transceiver 102. In some examples, the first wireless transmission element 106 and the second wireless transmission element 108 may be transmitters that are integrated in the RF transceiver 102 and configured to wirelessly transmit RF signals to a transmitting antenna during field operation or receive RF signals from a receiving antenna mounted to the RF transceiver 102 after manufacturing testing.

[0023] The transmit channel 110 and the receive channel 112 may be referred to as RF circuits 150. The RF transceiver 102 including the RF circuits 150 is generally referred to as a monolithic microwave integrated circuit (MMIC), which may include a chip package suitable for RF applications. For example, the MMIC may be packaged in an enhanced wafer-level ball grid array (eWLB) package. It should be understood that other types of chip packages are also available.

[0024] In some examples, the transmit channel 110 may include an amplifier 116 and a first coupler 118 between the first wireless transmission element 106 and the local oscillator 114. The RF signal may be amplified by the amplifier 116 before being transmitted to the first wireless transmission element 106. The first coupler 118 may be provided to monitor and correct the transmit channel 110 of the RF transceiver 102 by coupling out segments of the RF signal and providing the RF signal to monitoring or correction circuits. In some applications, the RF transceiver 102 may be an automotive radar transceiver with an RF signal in the SHF (super high frequency) or EHF (extremely high frequency) band (e.g., between 76 GHz and 81 GHz).

[0025] In some examples, transmit channel 110 may have a modulator between amplifier 116 and first coupler 118. The modulator modulates the frequency, amplitude, or phase of the RF signal (ie, adds or subtracts an offset frequency from the RF signal).

[0026] As described above, in manufacturing testing, the first wireless transmission element 106 and the second wireless transmission element 108 of the RF transceiver 102 are detachably coupled to the test waveguide structure 104 to transmit RF signals from the transmit channel 110 of the RF transceiver 102 to the test waveguide structure 104, and to transmit RF signals from the test waveguide structure 104 back to the RF transceiver 102. For example, detachably coupling the RF transceiver 102 may include clamping the RF transceiver 102 to a test socket having a plurality of pins (such as spring pins) to electrically connect electrical contacts of the RF transceiver 102 to a power source or a processing circuit device to make the RF transceiver 102 operable and allow data to be read from the RF transceiver 102. In some examples, the RF transceiver 102 may be automatically placed on the test socket by an automatic handler (robotic handler) rather than being manually clamped on the test socket. As will be described below, the test socket is mounted to the test waveguide structure 104 to distribute the RF signal.

[0027] A coupler 126 is provided in the hollow core waveguide 146 to distribute the RF signal from the input port 120 to the output port 122 and the test port 124. To this end, an input 128 of the coupler 126 is coupled to the input port 120 via a first component of the hollow core waveguide 146, a first output 130 of the coupler 126 is coupled to the output port 122 and a second output 132 of the coupler 126 is coupled to the test port 124.

[0028] An input 128 of the coupler 126 receives an RF signal from an input port 120 of the hollow core waveguide 146. The RF signal is divided into a first portion (first power segment) and a second portion (second power segment), which are output at a first output 130 and a second output 132 of the coupler 126, respectively. The coupler 126 couples the first portion of the RF signal to the output port 122 of the hollow core waveguide 146 via the first output 130 of the coupler 126. Similarly, the coupler 126 also couples the second portion of the RF signal to the test port 124 of the hollow core waveguide 146 via the second output 132 of the coupler 126.

[0029] The coupler 126 is a passive coupler and may be, for example, a directional coupler, a ring coupler, a competitive coupler, a branch line coupler, a Lange coupler, or a Wilkinson divider. The power level of the first portion of the RF signal may depend on the geometric distance of the structure (such as an arm or loop assembly provided in the coupler 126) relative to the wavelength of the RF signal.

[0030] During manufacturing testing, the test port 124 of the hollow waveguide 146 is coupled to a measurement device 148. The measurement device 148 may be formed inside or outside the test waveguide structure 104. The measurement device 148 may be a power detector or a power sensor that measures the power of the second portion of the RF signal. The power detector may be integrated into the hollow waveguide 146 or in an external device coupled to the external coupling port. In this case, the hollow waveguide 146 is coupled to the external coupling port, and a standard mechanical connection structure may be provided to provide a standard waveguide connection (e.g., by screwing the external waveguide into a standard mechanical structure).

[0031] The power level measured by the power detector allows the segment of the RF signal that is actually coupled from the RF transceiver 102 into the test waveguide structure 104 to be determined. As the coupling factor of each RF transceiver installed and tested changes, accurate information on the coupling or coupling factor between the RF transceiver 102 and the test waveguide structure 104 provides for improved and more accurate testing. The measured power level of the second portion of the RF signal can be compared to or set with respect to a power level measured by a power detector or power sensor provided in the RF transceiver 102 that can receive a portion of the RF signal via the coupler 118. This comparison allows detection of any problems or faults that may occur, for example, in the coupling from the transmit channel 110 to the first wireless transmission element 106.

[0032] In some examples, the test device 148 can be a spectrum analyzer device that is coupled to the outside of the test waveguide structure 104 to measure information in addition to power (such as the frequency or phase of the second portion of the RF signal) and compare it to the frequency and phase of the determination signal. This allows for more detailed information to be obtained about the characteristics of the RF signal generation and processing in the transmit channel 110 of the RF transceiver 102, and generally more accurate manufacturing testing.

[0033] In one example, the test device 148 can be a diode integrated into the hollow waveguide 146, which indicates the power level of the second portion of the RF signal received at the test port 124 of the hollow waveguide 146. The hollow waveguide 146 can have an RF test signal source to provide a signal of a defined parameter. For example, the output signal of the RF test signal source can have a predetermined power level, which can be used to calibrate the diode (e.g., during manufacturing testing). Measuring at least one of the power, frequency, or phase of the second portion of the RF signal at the test port 124 constitutes a second test result, which can be compared with the result obtained by the receive channel 112 of the RF transceiver 102.

[0034] The output port 122 of the hollow waveguide 146 transmits the first portion of the RF signal to the second wireless transmission element 108 of the RF transceiver 102. In other words, a portion of the RF signal (i.e., the first portion) is directed back to the RF transceiver 102. The second wireless transmission element 108 is coupled to a receiving channel 112 including a mixer 140 (optionally including a second coupler 138 and a signal processing unit 142). The second wireless transmission element 108 transmits the first portion of the RF signal to the signal processing unit 142 via the mixer 140. The second coupler 138 can be used to inject a test signal into the receiving channel 112 to allow internal testing of monitoring of the receiving channel of the RF transceiver 102.

[0035] The mixer 140 is configured to receive an RF signal from the local oscillator 114 at an input and down-convert a first portion of the RF signal to a baseband signal (sometimes referred to as an intermediate frequency signal). The baseband signal is further processed by a signal processing unit 142 having an analog baseband signal processing chain and an analog-to-digital converter. The analog baseband signal processing chain may include one or more filters to remove undesirable sidebands and image frequencies. The filtered baseband signal is supplied to the analog-to-digital converter to digitize the baseband signal for further processing in the digital domain. Processing of the received RF signal allows the characteristics of the received RF signal to be determined. For example, the digital processing may include a Fourier transform of the received signal (which allows the power, phase, phase noise or spectral information of the received signal to be obtained) and constitute a first test result. The first test result may be compared with a measurement value (i.e., a second measurement result) provided by the test device 148 in one example.

[0036] In other words, by measuring a characteristic (such as power, frequency, or phase) of the first portion of the RF signal at the signal processing module 142, the performance of the receive channel 112 of the RF transceiver 102 may be evaluated. In the event that the second test result provided by the measurement device 148 deviates from the first test result obtained from the processing module 142, a warning signal may be generated indicating a potential problem or potential failure of the RF transceiver 102.

[0037] Reference now Figure 2 , a block diagram of a test setup 200 for testing an RF transceiver 202 is shown. The test setup 200 may include Figure 1 100, and will describe test setup 200 only with respect to the differences. Figure 1 For example, Figure 2 The test setup 200 is used to test an RF transceiver 202 having multiple transmit channels and multiple receive channels. Figure 2Two transmit channels 110, 210 and two receive channels 112, 212 are shown, but any number of transmit channels and receive channels may be implemented. Thus, the RF transceiver 202 may have at least one additional first wireless transmission element 206 and at least one additional second wireless transmission element 208. In other words, the RF transceiver 202 may have a plurality of first wireless transmission elements 106, 206 and a plurality of second wireless transmission elements 108, 208. Each of the plurality of first wireless transmission elements 106, 206 is coupled to a corresponding transmit channel of the plurality of receive channels 110, 210 of the RF transceiver 202. Furthermore, each of the plurality of second wireless transmission elements 108, 208 is coupled to a corresponding receive channel of the plurality of receive channels 112, 212 of the RF transceiver 202.

[0038] In addition, according to an example, the hollow waveguide 146 includes a plurality of input ports 120, 220 for coupling to the plurality of first wireless transmission elements 106, 206, and a plurality of output ports 122, 222 for coupling to the plurality of second wireless transmission elements 108, 208. A combiner 224 may be arranged in the hollow waveguide 146 between the input 128 of the coupler 126 and the plurality of input ports 120, 220. The combiner 224 has a plurality of inputs 214 and an output 216. Figure 2 The multiple inputs 214 of the combiner 224 in the embodiment constitute five inputs, however, for simplicity, the coupling between the two inputs 214 of the combiner 224 and the two input ports 120, 220 of the hollow waveguide structure 146 is illustrated. In particular, each input of the multiple inputs 214 of the combiner 224 is coupled to a corresponding input port of the multiple input ports 120, 220 via the hollow waveguide 146, and the output 216 of the combiner 224 is coupled to the input 128 of the coupler 126.

[0039] Similarly, a beam splitter 228 may be disposed between the second output 130 of the coupler 126 and the plurality of output ports 122, 222. The beam splitter 228 has an input 218 and a plurality of outputs 226. Figure 2 The multiple outputs 226 of the beam splitter 228 in the embodiment constitute five outputs, however, for the purpose of simplicity, the coupling between the two outputs 226 of the beam splitter 228 and the two output ports 122, 222 of the hollow waveguide 146 is illustrated. In particular, each of the multiple outputs 226 of the beam splitter 228 is coupled to a corresponding output port of the multiple output ports 122, 222 via the hollow waveguide 146, and the input 218 of the beam splitter 228 is coupled to the output 130 of the coupler 126 via the hollow waveguide 146.

[0040] During manufacturing testing, one of the transmit channels of the plurality of transmit channels 110, 210 can be activated to transmit an RF signal to the corresponding input port 120 or input port 220 of the hollow waveguide 146 while disabling the other transmit channels 110 or transmit channels 210. Via the combiner 224, the RF signal is passed to the coupler 126 and a second portion of the RF signal is distributed to the measurement device 148 described above. The first portion of the RF signal is distributed to the beam splitter 228, which separates the first portion of the RF signal into a plurality of RF signals corresponding to the first RF signal (copies). The plurality of RF signals are passed to the plurality of output ports 122, 222, so that copies of the first portion of the RF signal are simultaneously transmitted to the plurality of receive channels 112, 212.

[0041] Since all the second transmission elements in the plurality of second transmission elements 108, 208 can be tested simultaneously while one of the transmission channels 110, 210 is activated, this allows for efficient manufacturing testing. As described above, in order to test all the transmission channels in the plurality of transmission channels 110, 210, each of the transmission channels needs to be activated to transmit an RF signal.

[0042] The RF transceivers 102, 202 may be any type of transceiver, such as a radar transceiver, a wireless communication transceiver, etc. The RF transceiver may be configured to transmit a fixed frequency continuous wave signal or a frequency modulated continuous wave signal (FMCW signal) during manufacturing testing.

[0043] Figure 3 An example of a block diagram of an alternative test setup 300 is shown, which may include Figure 2 The test setup 300 is characterized by an additional port 302 of the hollow core waveguide 146, which is coupled to a third input 304 of the coupler 126. The third output 304 of the coupler 126 is an isolated port of the coupler 126. In some examples, the third portion of the RF signal can be coupled to the additional port 302 of the hollow core waveguide 146 via the third output 304 of the coupler 126.

[0044] In some examples, the additional port 302 can be a terminal port of the hollow waveguide 146 to provide a termination using a structure such as a wedge element or a specific dielectric to provide a matched terminal impedance (e.g., in the range of 40 ohms to 90 ohms). The additional port 302 is used to provide improved isolation between the output 130, 132, 304 and the input 128 of the coupler 126.

[0045] In some examples, additional port 302 can be configured as a reflective port that is configured to reflect RF signals back to coupler 126 .

[0046] In some examples, the additional port 302 of the hollow waveguide 146 can be coupled to a measurement device 306. The measurement device 306 can be similar to Figure 2 The measuring device 306 may be a power detector or a power sensor configured to measure the power of the third portion of the RF signal, or a spectrum analysis device configured to measure the frequency or phase of the third portion of the RF signal. The measurement of the power or frequency or phase of the third portion of the RF signal at the additional port 302 may allow for the acquisition of additional information of the RF signal generated by the RF transceiver 202, as well as additional information of the second portion of the RF signal transmitted back to the RF transceiver 202, which may improve the determination of whether the RF transceiver 202 is operating properly.

[0047] In some examples, the additional port 302 may be coupled to an external RF source that is capable of providing a defined RF test signal as an input to the coupler 146. The defined RF test signal is partially passed to the receive channel 112, 212 of the RF transceiver 202 via the coupler 126 and the output port 122, 222. In other words, the receive channel 112, 212 receives the first portion of the RF signal and the RF test signal processed in the receive channel 112, 212 as previously described. This provides information about the power, phase, noise, and quality of the first portion of the RF signal.

[0048] Overall, the provision of additional ports 302 may allow implementation of a terminal port that increases test accuracy or may allow coupling to external equipment (such as external measurement equipment or an external RF signal source) to improve test capabilities.

[0049] In some examples, the output 130 of the coupler 126 may also be coupled to a waveguide delay line 308 disposed between the coupler 126 and the beam splitter 228. In the absence of a beam splitter, the waveguide delay line 308 is disposed between the output 130 of the coupler 126 and the output ports 122, 222. Each of the waveguide delay lines 308 may have a predetermined length and may optionally also include a specific material to change the group delay of the RF signal. Delaying the RF signal may allow the analog RF signal to propagate a specific distance. In the case where the RF transceiver 202 is implemented as a radar transceiver (such as an FMCW radar transceiver), the receive channel 112, 212 receives a version of the RF signal with a time delay generated by the waveguide delay line 308. Processing the received signal may then determine (e.g., by Fourier transforming the baseband signal) a phase shift between the LO signal and the received signal or a corresponding radar target distance. The information generated by processing in the receive channel 112, 212 can be compared to the predetermined delay introduced by the waveguide delay line 308 to verify the correct operation of the RF transceiver 202. In other words, the waveguide delay line 308 can simulate an object at a specific distance that can subsequently be detected by the FMCW radar transceiver.

[0050] In some examples, the other waveguide delay line may be arranged between the input 128 of the coupler 126 and the input ports 120, 220, or more particularly, between the input 128 of the coupler and the output 216 of the combiner 224. In the absence of a combiner, the other waveguide delay line is arranged between the input 128 of the coupler 126 and the input ports 120, 220. The test waveguide structure 204 may have both or either of the waveguide delay line 308 and the other waveguide delay line.

[0051] Figure 4A and Figure 4B A 3D view of a portion of a test waveguide structure 204 that can be used to test an RF transceiver having three first wireless transmission elements and four second wireless transmission elements is shown. However, the number of first wireless transmission elements and second wireless transmission elements may be arbitrary. Figure 4A The coupling between the plurality of input ports 120, 220 of the hollow core waveguide 146 and the coupler 126 is illustrated, and Figure 4BThe coupling between the coupler 126 and the plurality of output ports 122, 222 of the hollow waveguide 146 is further illustrated. The test waveguide structure 204 has a body 402 made of a metal, such as aluminum. In some embodiments, the body 402 may be formed of a plastic material after a metallization process for forming a metal surface of the hollow waveguide 146. The body 402 has a first surface 404, a second surface 406 opposite to the first surface 404, and a sidewall 408 connecting the first surface 404 and the second surface 406. The first surface 404 may be a first major surface and the second surface 406 may be a second major surface. The vertical direction and the lateral direction refer to directions that are vertical or lateral, respectively, relative to the first surface 404 of the body 402. The hollow waveguide 146 is formed inside the body 402 by an inner metal wall of the body 402. The plurality of input ports 120, 220 and the plurality of output ports 122, 222 of the hollow waveguide 146 are formed on the first surface 404 of the body 402, and other test ports and optional additional ports are formed on the second surface 406 of the body 402 (not shown). Figure 4A and Figure 4B 4. (not shown explicitly in FIG. 4 ) Optionally, the test port and the additional port may also be formed on the side wall 408 or on the first surface 404 of the body 402. The test waveguide structure 204 has the coupler 126, the beam splitter 228 and the combiner 224 formed inside the hollow waveguide 146, i.e., the body 402 of the test waveguide structure 204 including the hollow waveguide 146 is a single piece.

[0052] like Figure 4A As shown, the plurality of input ports 120, 220 are coupled via a first component 146a of a hollow waveguide 146, wherein the first component 146a of the hollow waveguide 146 extends in a vertical direction toward the second surface 406 of the body 402. The combiner 224 is formed by a first combiner element 224-1 and a second combiner element 224-2. The first component 146a of the hollow waveguide 146 is coupled to an input 214 of the first combiner element 224-1, wherein the combiner element 224-1 extends in a lateral direction. The interface of the hollow waveguide 146 between the first component 146a of the hollow waveguide 146 and the input 214 of the combiner 224 can be tapered to transmit RF signals. Each input 214 of each combiner element 224-1 is coupled to a corresponding input port of the plurality of input ports 120, 220 of the hollow waveguide 146 via the first component 146a of the hollow waveguide 146. As shown in FIG. Figure 4A As shown, the plurality of input ports 120, 220 includes three input ports, two of which are coupled to one of the combiner elements 224-1 and another of which is coupled to the corresponding other combiner element 224-1.

[0053] The output 226 of each combiner element 224-1 is coupled to a corresponding input of the input of the second combiner element 224-2 via the second component 146b of the hollow waveguide 146. The second combiner element 224-2 combines the two components 146b of the hollow waveguide 146 into one output that is directly coupled to the input 128 of the coupler 126. The second component 146b of the hollow waveguide 146 extends in a vertical direction between the first surface 404 and the second surface 406 of the body 402. In particular, the second component 146b of the hollow waveguide 146 extends proximate to one of the sidewalls 408 of the body 402. The interface of the hollow waveguide 146 between the second component 146b of the hollow waveguide 146 and the output 226 of the combiner elements 224-1, 224-2 can be tapered to transmit RF signals. Similarly, the interface of the hollow core waveguide 146 between the second component 146b of the hollow core waveguide 146 and the input 128 of the coupler 126 may also be tapered.

[0054] The third component 146c of the hollow waveguide 146 extends in the horizontal direction close to the second surface 406 of the body 402, which forms the main part of the coupler 126, which is further coupled to the output 130, 132, 304 of the coupler 126. The output 130, 132, 304 of the coupler 126 is connected to the hollow waveguide 146 (at Figure 4A The coupler 126 is further coupled to the output ports 122, 222, the test port 124, and the additional port 304 of the hollow waveguide 146 (not explicitly shown). As previously described, the main portion of the coupler 126 has an aperture 410, which is configured to couple RF signals into the first portion, the second portion, and optionally into the third portion, and the RF signals are transmitted to the corresponding ports 122, 222, 124, 302 of the hollow waveguide 146 via the outputs 130, 132, 304 of the coupler 126.

[0055] like Figure 4BAs shown, the output 130 of the coupler 126 is coupled to the input 218 of the beam splitter 228 via the fourth component 146d of the hollow waveguide 146. The beam splitter 228 is formed adjacent to the combiner 224, but may be formed anywhere within the body 402. The fourth component 146d of the hollow waveguide 146 extends in a vertical direction toward the first surface 404 of the body 402 and is bent in a horizontal direction to provide a delay element before coupling with the input 218 of the beam splitter 228. The beam splitter 228 has an output 226 that is coupled to a corresponding output port of the plurality of output ports 122, 222 of the hollow waveguide 146 via the fifth component 146e of the hollow waveguide 146. The fifth component 146e of the hollow waveguide 146 extends in a vertical direction toward the first surface 404 of the body 402, coupling the plurality of output ports 222 to the corresponding outputs 226 of the beam splitter 228. The interface of the hollow core waveguide 146 between the fifth component 146e of the hollow core waveguide 146 and the output 226 of the beam splitter 228 may be tapered to transmit the RF signal.

[0056] Figure 4C An example of a waveguide delay line 308 is shown inside a body 402, which may be implemented, for example, between the output 130 of the coupler 126 and the input 218 of the beam splitter 228. It can be observed that the delay line may be implemented in a meandering shape on multiple levels (planes), which may be connected by vertical components of the hollow waveguide 146 (not shown). Figure 4C ).

[0057] It should be noted that the multi-layer arrangement of hollow core waveguides extending over multiple levels connected by vertical assemblies enables a very compact implementation of the delay lines required for automated manufacturing testing. In some examples, the test waveguide structure (ie, the box in which the waveguide 146 is formed) can be less than 3 cm x 5 cm.

[0058] Figure 5An example of a cross section of a test setup 500 is shown. For simplicity, the RF transceiver 102 and the test waveguide structure 104 are used and the waveguide delay line in the test waveguide structure is omitted. However, it should be understood that the RF transceiver 202 and the test waveguide structure 204 may also be used. The test waveguide structure 104 is coupled to the RF transceiver 102 via a printed circuit board 502 and a socket 504. The test waveguide structure 104, the printed circuit board 502, and the socket 504 are arranged in a stack 506. The printed circuit board 502 is sandwiched between the first surface 404 of the body 402 of the test waveguide structure 104 and the socket 504. The printed circuit board 502 and the socket 504 have a first through hole 518 aligned with the input port 120 of the hollow waveguide structure 104, and a second through hole 520 aligned with the output port 122 of the hollow waveguide structure 146. As shown, the input port 120 and the output port 122 of the hollow waveguide 146 are on the first surface 404 of the body 402 of the test waveguide structure 104, facing the first wireless transmission element 106 and the second wireless transmission element 108 of the RF transceiver 102, respectively. The test port 124 is on the second surface 406 of the body 402 of the test waveguide structure 104. The coupler 126 is arranged inside the hollow waveguide 146, near the input port 120.

[0059] In the existing example, the RF transceiver 102 is packaged in a chip package (referred to as an enhanced wafer-level ball grid array (eWLB) package). The RF transceiver 102 has a semiconductor die 508 on which at least one transmit channel and at least one receive channel are formed. The semiconductor die 508 is arranged on a top side 512 of a redistribution layer 510. Electrical contact is established between the semiconductor die 508 and the electrically conductive structure of the redistribution layer 510. The first wireless transmission element 106 and the second wireless transmission element 108 are formed on a bottom side 514 of the redistribution layer 510 opposite to the top side 512. The redistribution layer 510 couples the first wireless transmission element 106 and the second wireless transmission element 108 to the semiconductor die 508 through the electrically conductive structure. This allows RF signals to be transmitted from the semiconductor die 508 to the wireless transmission elements 106, 108 and / or vice versa. A plurality of solder balls 516 are arranged on a bottom side 514 of the redistribution layer 510. Thus, the redistribution layer 510 establishes electrical connections between the plurality of solder balls 516 and the semiconductor die 508. The plurality of solder balls 516 further electrically connect the RF transceiver 102 with other components attached or connected to the printed circuit board 502. However, other examples may include other configurations and arrangements of the wireless transmission element 106 and the wireless transmission element 108. For example, the wireless transmission element 106 and the wireless transmission element 108 may be arranged on a separate substrate that is mechanically connected to the semiconductor die 508 including the RF circuit device.

[0060] Optionally, semiconductor die 508 and portions of redistribution layer 510 and wireless transmission elements 106 and 108 are encapsulated by encapsulation material 528. Encapsulation material 528 may be epoxy, filled epoxy, glass-filled epoxy, thermosetting polymer, thermoplastic polymer, or elastomeric polymer.

[0061] The socket 504 has a plurality of contact pins 522 protruding from two opposite sides of the socket 504. The contact pins 522 may be spring pins configured to detachably attach the RF transceiver 104 to the stack 506. A first end 524 of the contact pins 522 is coupled to the printed circuit board 502. A second end 526 of the contact pins 522 opposite to the first end 524 is coupled to the plurality of solder balls 516 of the RF transceiver 102.

[0062] By introducing the waveguide structure 104 in the test setup 100, 200, 300, a new concept is introduced, which allows an efficient and configurable concept for testing the RF transceiver 102, 202 with an integrated wireless transmission element. The RF signal generated by the RF transceiver can be transmitted to the waveguide structure without the need for a dielectric medium for isolation or impedance matching. The waveguide structure connected to the measurement device allows at least a portion of the RF signal to be fed back to the RF transceiver via an integrated coupler, so that the RF signal propagates completely inside the waveguide structure, and also allows at least one characteristic of the RF signal (such as power completely inside the hollow waveguide) to be measured. This provides an improved evaluation of the performance of the RF transceiver. When a portion of the RF signal is simultaneously transmitted back to the RF transceiver (which allows the performance of the receiving channel to be evaluated), the RF signal transmitted by the RF transceiver can be evaluated to detect the performance of the transmitting channel. In addition, beam splitters and combiners can be integrated into the hollow waveguide, allowing efficient testing of multiple receiving channels or transmitting channels, so that one RF signal can be used to evaluate the performance of multiple receiving channels of the RF transceiver. Furthermore, the concept may be used for a single-chip RF transceiver or a multi-chip RF transceiver (where multiple semiconductor chips are arranged on top of each other or laterally to each other within the RF transceiver).

[0063] The following example is directed to a test setup in which multiple separate RF transceivers implemented on separate RF chips can be tested concurrently. To this end, at least two RF transceivers implemented on separate semiconductor chips are detachably coupled to a test waveguide structure. Concurrently coupling multiple RF transceivers allows RF signals to be exchanged from one of the RF transceivers to another of the RF transceivers via a hollow waveguide, and allows the use of signals from one semiconductor die to test in another semiconductor die.

[0064] The test setup for multiple separate RF transceivers allows many new test possibilities, which are not feasible when only a single RF transceiver implemented on a single chip is coupled to test. The public examples below allow the possibility of testing during manufacturing test or component verification, which has not been realized so far by utilizing signals from other RF transceivers implemented on separate semiconductor chips. The example can solve the need for testing multiple chips in parallel operation. In some examples, a large number of chips can be configured in a specific configuration similar to the end field application (such as in a cascade system) to form a MIMO system that extends the transmission or reception channel, wherein one chip is a main chip, and one or more chips are secondary chips synchronized with the main chip or the cascade system in a daisy chain configuration. The test of phase stability and / or power stability of the cascade device can be implemented across a wider area (similar to PCB application space or distance and RF channel allocation). Other test possibilities include tests for robustness against interference, and tests for suppression of undesirable signals (for example, to meet electromagnetic compatibility (EMC) requirements) or tests for meeting the requirements of data sheets or product specifications.

[0065] Additionally, in some examples, testing of immunity to other applications using the same or similar frequency operating ranges may be implemented (eg, mobile communications immunity to radar signals).

[0066] In the following, an example of a test setup that can be used to implement one or more of the testing possibilities described above is described. Details of one example of testing a bandpass filter in a receive channel of an RF transceiver will be described, which example can be implemented by combining RF signals from more than one RF transceiver 102, 602 and forming a combined RF signal. The combined RF signal can be processed in the receive channel 112 of the RF transceiver 102, 602 and thus used to test the operation of the bandpass filter in the respective RF transceiver 102, 602 during manufacturing testing. As outlined in this example above, the skilled person will be able to derive other testing possibilities.

[0067] Reference now Figure 6 , a block diagram of a test setup 600 for testing an RF transceiver is shown. An example of a test provided by the test setup 600 includes testing of a bandpass filter of an RF transceiver. The test setup 600 may include some or all of the features of any of the aforementioned test setups 100, 200, 300. Another RF transceiver 602 is detachably coupled to another test waveguide structure 604 associated with the other RF transceiver 602. The RF transceiver 602 is coupled to a test waveguide structure 604 associated with the other RF transceiver 602. Figure 11 and 2. The RF transceiver 102 is coupled to the test waveguide structure 604 in the same manner as described in the foregoing. The test waveguide structures 104, 604 are coupled to each other by connecting hollow waveguides 648 discussed later. The RF signal from the RF transceiver 102 is referred to as the first RF signal hereinafter. The RF transceiver 602 generates an RF signal, which will be referred to as the second RF signal hereinafter. The hollow waveguide 146 of the test waveguide structure 104 will be referred to as the first hollow waveguide 146 hereinafter, and the hollow waveguide of the test waveguide structure 604 will be referred to as the second hollow waveguide 646 hereinafter. The RF transceivers 102, 602 are two separate transceivers implemented on two different RF semiconductor chips in one package or in two different semiconductor packages.

[0068] For simplicity, each of the RF transceivers 102, 602 is shown having one first wireless transmission element 106 and one second wireless transmission element 108. To illustrate the test setup 600, for each of the RF transceivers 102, 602, a respective test waveguide structure 104, 604 having a hollow waveguide 146, 646 is illustrated, and one input port 120 and one output port 122 are illustrated. However, it should be understood that other types of RF transceivers, test waveguide structures, and hollow waveguides (such as Figure 2 The RF transceiver 202 and test waveguide structure 204 shown are also suitable for use in the test setup 600 .

[0069] The RF transceivers 102, 602 can be synchronized with each other so that the RF signal generated by the local oscillator 114 of the RF transceiver 102 can be distributed to other RF transceivers 602 and used here to synchronize the LO signal in each RF transceiver. In other words, the testing of the RF transceivers 102, 602 can be implemented in a cascaded manner and can be tested in a cascade configuration. In addition, the RF transceivers 102, 602 can be tested in parallel, which can reduce the time required to test the RF transceivers 102, 602 during manufacturing testing. In one example, the RF transceivers 102, 602 are detachably coupled to a printed circuit board (corresponding to the printed circuit board 502), which may include an RF signal line for transmitting an RF signal for LO synchronization from the first RF transceiver 102 to the second RF transceiver 602. In the case where the RF transceiver 102 and the RF transceiver 602 are included in the same semiconductor package, the semiconductor package may include a structure for transmitting an RF signal for LO synchronization. In one example, in addition to LO synchronization, clock synchronization between the first RF transceiver 102 and the second RF transceiver 602 can be provided by a printed circuit board.

[0070] Further references Figure 6, each test waveguide structure 104, 604 of the test setup 600 may be embedded inside a separate body, and the connecting hollow waveguide 648 may externally couple the test waveguide structures 104, 604 to each other. Alternatively, both the test waveguide structures 104, 604 and the connecting hollow waveguide 648 may be embedded inside a single body, i.e. forming an integrated test waveguide structure. This allows for a more compact implementation and better handling of the test setup.

[0071] Another beam splitter 650 may be arranged inside the first hollow core waveguide 146, between the coupler 126 and the output port 122 of the first hollow core waveguide 146. Similarly, another combiner 658 may be arranged inside the second hollow core waveguide 646, between the coupler 126 and the output port 122 of the second hollow core waveguide 646. The connecting hollow core waveguide 648 couples the beam splitter 650 with the combiner 658. In particular, the connecting hollow core waveguide 648 couples a first output 652 of the beam splitter 650 with a first input 660 of the combiner 658. A second output 654 of the beam splitter 650 is coupled to the output port 122 of the first hollow core waveguide 146 via the first hollow core waveguide 146. An input 656 of the beam splitter 650 is coupled to the output 130 of the coupler 126 of the first hollow core waveguide 146 via the first hollow core waveguide 146. The beam splitter 650 is configured to separate the first portion of the first RF signal from the output 130 of the coupler 126 of the first hollow core waveguide 146 into a first portion (hereinafter referred to as the fourth portion of the first RF signal) and a second portion (hereinafter referred to as the fifth portion of the first RF signal). The fourth portion of the first RF signal is delivered to the test waveguide structure 604 via the connecting hollow core waveguide 648. The fifth portion of the first RF signal is wirelessly delivered to the RF transceiver 102 and analyzed in the receive channel 112 of the RF transceiver 102, as described in the test setup 100, the test setup 200, and the test setup 300 of FIGS. 100, 200, and 300, respectively.

[0072] A second input 662 of the combiner 658 is coupled to the output 130 of the coupler 126 of the second hollow core waveguide 646 via the second hollow core waveguide 646. The combiner 658 is configured to combine the fourth portion of the first RF signal and the first portion of the second RF signal and form a combined signal. An output 664 of the combiner 658 is coupled to the output port 122 of the second hollow core waveguide 646 via the second hollow core waveguide 646. The combined RF signal is wirelessly transmitted to the second wireless transmission element 108 of the RF transceiver 602 via the output port 122 of the second hollow core waveguide 646.

[0073] In some examples, the first RF signal and the second RF signal may have different RF frequencies or have RF frequencies in different frequency ranges. The combined RF signal may therefore include the frequency of the first RF signal and the frequency of the second RF signal. In some examples, the combined RF signal may have more signal components than either of the first RF signal and the second RF signal, and the frequency range may be extended compared to either of the first RF signal and the second RF signal. This allows new testing opportunities, as will be described below.

[0074] The combined RF signal is passed to the receiving channel 112 of the RF transceiver 602. The processing unit 142 of the receiving channel 112 of the RF transceiver 602 has a baseband filter that is configured to allow frequencies in a predefined range and shield other frequencies. After processing the combined RF signal in the receiving channel 112 of the RF transceiver 602 (e.g., by down-converting the combined RF signal), a third test result is obtained. The third test result may include a value or estimate of the frequency of the down-converted signal, which can be compared with an expected value. This can, for example, provide information on whether the RF transceiver 602 is protected from distortion or intermodulation from external RF signals. In the case of deriving the third test result from the frequency of the exemplary test RF signal, a warning signal can be generated, which indicates a potential problem or potential failure of the RF transceiver 602.

[0075] Figure 7 Another example of a test setup 700 is shown, where the test setup 700 may include Figure 6 The test waveguide structure 104 and the test waveguide structure 604 may be further coupled to each other by another connecting hollow waveguide 748. In one example, the connecting hollow waveguide 648 and the connecting hollow waveguide 748 allow for concurrent testing of the transceiver 102 and the transceiver 602. The testing may be mutual or symmetrical such that the transceiver 102 transmits the same signal or the same type of signal to the transceiver 602 at the same time as the signal transmitted to the transceiver 102 by the transceiver 602.

[0076] Each of the test waveguide structures 104, 604 of the test setup 700 may be embedded inside a separate body, and the connecting hollow waveguides 646, 746 externally couple the test waveguide structures 104, 604 to each other. Alternatively, both the test waveguide structures 104, 604 and the connecting hollow waveguides 646, 746 may be embedded inside a single body, i.e., forming an integrated test waveguide structure.

[0077] Another combiner 750 may be disposed inside the first hollow core waveguide 146 between the beam splitter 650 and the output port 122 of the first hollow core waveguide 146. Similarly, another beam splitter 758 may be disposed inside the second hollow core waveguide 646 between the coupler 126 of the second hollow core waveguide 646 and the combiner 658 of the second hollow core waveguide 646. The connecting hollow core waveguide 748 couples the combiner 750 with the beam splitter 758. In particular, a first input 752 of the combiner 750 is coupled to a first output 760 of the beam splitter 758 through the connecting hollow core waveguide 748. A second input 754 of the combiner 750 is coupled to a second output 654 of the beam splitter 650. A second output 762 of the beam splitter 758 is coupled to a second input 662 of the combiner 658. An input 764 of the beam splitter 758 is coupled to an output 130 of the coupler 126 of the second hollow core waveguide 646.

[0078] The beam splitter 758 is configured to separate the first portion of the second RF signal into a fourth portion of the second RF signal and a fifth portion of the second RF signal. The fourth portion of the second RF signal is delivered to the test waveguide structure 104 via the connecting hollow waveguide 748, while the fifth portion of the second RF signal is delivered to the combiner 658.

[0079] The combiner 658 is configured to combine the fourth portion of the first RF signal and the fifth portion of the second RF signal and form a second combined RF signal. Figure 6 As described in the test setup 600 , the second combined RF signal is passed to the RF transceiver 602 .

[0080] The combiner 750 is configured to combine the fifth portion of the first RF signal and the fourth portion of the second RF signal to form a first combined RF signal. In addition, an output 756 of the combiner 750 is coupled to the output port 122 of the first hollow waveguide 146 via the first hollow waveguide 146. The first combined RF signal is wirelessly transmitted to the receive channel 112 of the RF transceiver 102 via the second wireless transmission element 108 of the RF transceiver 102.

[0081] The first combined RF signal is processed in the receive channel 112 of the RF transceiver 102 (e.g., by down-converting the first combined RF signal) to obtain a fourth test result. Similarly, the second combined RF signal is processed in the receive channel 112 of the RF transceiver 602 (e.g., by down-converting the second combined RF signal) to obtain a fifth test result.

[0082] In one example, by Figure 7The additional features provided by the example of can be used to simultaneously test the bandpass filters of both RF transceivers 102 and 602. For example, if the frequency components of the fourth test result and the fifth test result deviate from the expected frequency, a warning signal can be generated, indicating a potential problem or potential failure of one or both of the RF transceiver 102 and the RF transceiver 602.

[0083] The following examples relate to other aspects of the present disclosure:

[0084] Example 1 discloses an apparatus for testing a radio frequency (RF) transceiver, comprising:

[0085] Test waveguide structures including:

[0086] main body,

[0087] a hollow waveguide embedded within the body, the hollow waveguide being formed by a metal wall of the body, wherein the hollow waveguide extends through the body to route RF signals,

[0088] wherein the hollow waveguide includes an input port on the first surface of the body and configured to wirelessly receive an RF signal from the RF transceiver,

[0089] wherein the hollow core waveguide further comprises an output port on the first surface and configured to transmit at least a portion of the RF signal to the RF transceiver, and

[0090] A coupler is disposed within the body and is configured to couple a first portion of the RF signal to the output port and a second portion of the RF signal to the test port.

[0091] Example 2 discloses an apparatus according to Example 1, wherein the apparatus comprises a power detector integrated in the body and coupled to the test port, wherein the power detector is configured to determine a power of the second portion of the RF signal.

[0092] Example 3 discloses an apparatus according to example 1 or 2, wherein the test port comprises an external waveguide connector for connecting an external waveguide to the test port.

[0093] Example 4 discloses an apparatus according to any one of Examples 1 to 3, wherein the input port is a first input port and the hollow waveguide includes a second input port on the first surface, wherein the apparatus further includes a combiner arranged in the hollow waveguide, wherein the first input port is coupled to a first input of the combiner via the hollow waveguide, and the second input port is coupled to a second input of the combiner via the hollow waveguide, wherein the combiner includes an output coupled to the input of the coupler via the hollow waveguide.

[0094] Example 5 discloses an apparatus according to any one of Examples 1 to 4, wherein the output port is a first output port, and the hollow waveguide further comprises a second output port arranged on the first surface, the second output port being configured to wirelessly pass the RF signal to the RF transceiver,

[0095] wherein the apparatus further comprises a beam splitter arranged in the hollow waveguide, the beam splitter comprising an input, a first output and a second output,

[0096] wherein an input of the beam splitter is coupled to an output of the coupler via a hollow core waveguide, and wherein a first output of the beam splitter is coupled to a first output port via the hollow core waveguide, and a second output of the beam splitter is coupled to a second output port via the hollow core waveguide.

[0097] Example 6 discloses an apparatus according to Example 5, wherein the coupler is configured to couple a third portion of the RF signal to a terminal port of the hollow core waveguide.

[0098] Example 7 discloses the apparatus according to Example 6, wherein the terminal port comprises a wedge shape.

[0099] Example 8 discloses an apparatus according to Example 7, wherein the apparatus further comprises a socket arranged between the printed circuit board and the RF transceiver, wherein the socket is configured to detachably attach the RF transceiver to the socket.

[0100] Example 9 discloses a device according to any one of Examples 1 to 8, wherein the body is formed as a single piece.

[0101] Example 10 discloses an apparatus according to any of the preceding examples, wherein the test waveguide structure is a first test waveguide structure, the hollow waveguide structure is a first hollow waveguide structure, the RF transceiver is a first RF transceiver, the beam splitter is a first beam splitter, and the combiner is a first combiner, and wherein the apparatus is configured to test a second RF transceiver in addition to the first RF transceiver,

[0102] wherein the first hollow waveguide comprises a second beam splitter,

[0103] wherein the apparatus further comprises a second test waveguide structure, the second test waveguide structure comprising a second hollow waveguide and a second combiner inside the second hollow waveguide,

[0104] The first output of the second beam splitter is coupled to the first input of the second combiner via a connecting hollow waveguide.

[0105] Example 11 discloses an apparatus according to Example 10, wherein the RF signal is a first RF signal from a first RF transceiver, and the second RF transceiver transmits a second RF signal,

[0106] wherein the input of the second beam splitter is coupled to the output of the coupler of the first hollow core waveguide,

[0107] A second output of the second beam splitter is coupled to an output port of the first hollow core waveguide,

[0108] wherein a second input of the second combiner is coupled to an output of the coupler of the second hollow core waveguide, and wherein the second combiner is configured to combine the fourth portion of the first RF signal and the first portion of the second RF signal,

[0109] The output of the second combiner is coupled to the output port of the second hollow core waveguide and is configured to wirelessly pass the fourth portion of the first RF signal and the first portion of the second RF signal to the second RF transceiver.

[0110] Example 12 discloses a device according to Example 11, wherein the first hollow core waveguide includes a third combiner arranged between an output port of the first hollow core waveguide and the second beam splitter, and the second hollow core waveguide includes a third beam splitter arranged between a coupler of the second hollow core waveguide and the third combiner,

[0111] wherein a first input of the third combiner is coupled to a first output of the third beam splitter via another connecting hollow waveguide, and

[0112] wherein a second input of the third combiner is coupled to the second output of the second beam splitter, and the third combiner is configured to combine the fifth portion of the first RF signal and the fourth portion of the second RF signal,

[0113] wherein an output of the third combiner is coupled to an output port of the first hollow core waveguide and is configured to pass a fifth portion of the first RF signal and a fourth portion of the second RF signal to the first RF transceiver,

[0114] wherein a second output of the third beam splitter is coupled to a second input of the second combiner,

[0115] wherein the input of the third beam splitter is coupled to the output of the coupler of the second hollow core waveguide, and

[0116] The second combiner is configured to pass the fourth portion of the first RF signal and the fifth portion of the second RF signal to the second RF transceiver.

[0117] Example 13 discloses an apparatus according to example 11 or 12, wherein the second hollow waveguide is embedded inside the body of the second test waveguide structure, and wherein the first hollow waveguide is externally coupled to the second hollow waveguide by a connecting waveguide.

[0118] Example 14 discloses an apparatus according to example 11 or 12, wherein the second hollow waveguide and the connecting waveguide are embedded inside the body of the first test waveguide structure.

[0119] Example 15 discloses a method of testing an RF transceiver, comprising:

[0120] coupling an RF transceiver to the apparatus for testing an RF transceiver according to any one of Examples 1 to 9, wirelessly passing an RF signal from the RF transceiver to an input port of the hollow core waveguide,

[0121] coupling a first portion of the RF signal to an output port of the hollow core waveguide via a coupler,

[0122] wirelessly passing the first portion of the RF signal from the output port of the hollow core waveguide to the RF transceiver,

[0123] The first part of processing the RF signal in the RF transceiver,

[0124] And determining a first test result of the test based on processing the first portion of the RF signal in the RF transceiver.

[0125] Example 16 discloses a method according to Example 15, wherein processing the first portion of the RF signal in the RF transceiver includes downconverting the first portion of the RF signal in the RF transceiver to generate a downconverted signal,

[0126] The down-converted signal is processed in a receive path of the RF transceiver and a first test result is determined based on the processing of the down-converted signal.

[0127] Example 17 discloses a method according to Example 15 or 16, wherein determining the first test result includes determining at least one of phase information of the first portion of the RF signal or power of the first portion of the RF signal.

[0128] Example 18 discloses the method according to Example 17, further comprising:

[0129] Couple the second portion of the RF signal into the test port,

[0130] measuring at least one of phase information or power of a second portion of the RF signal coupled to the test port,

[0131] A second test result is determined based on the measurement.

[0132] Example 19 discloses a method according to Example 18, further comprising comparing the first test result with the second test result.

[0133] Example 20 discloses a method according to Example 18, comprising coupling a third portion of the RF signal to a terminal port of the hollow waveguide via a coupler.

[0134] Example 21 discloses a method according to any one of Examples 15 to 20, wherein the hollow core waveguide comprises a plurality of input ports and a plurality of output ports, wherein coupling the RF transceiver to the device further comprises:

[0135] coupling each of a plurality of wireless transmit structures of the RF transceiver to a corresponding input port of the plurality of input ports,

[0136] coupling each of a plurality of wireless receive structures of the RF transceiver to a corresponding output port of a plurality of output ports, wherein the method further comprises:

[0137] Select a corresponding transmission path from multiple transmission paths,

[0138] activating the selected transmit path and wirelessly passing the RF signal from the selected transmit path to the input port,

[0139] Activate multiple receive paths,

[0140] splitting the first portion of the RF signal such that each of the plurality of output ports receives a respective split portion of the first portion of the RF signal,

[0141] Each separated portion is processed in a corresponding receive path of the transceiver.

[0142] Example 22 discloses a method according to Example 15, comprising:

[0143] coupling a second RF transceiver to the apparatus for testing an RF transceiver according to Examples 10 to 13, wirelessly passing a fourth portion of the first RF signal to a second test waveguide structure,

[0144] mixing the first portion of the second RF signal and the fourth portion of the first RF signal via a combiner to form a combined RF signal, and

[0145] coupling the combined RF signal to the output port of the second hollow core waveguide,

[0146] wirelessly passing the combined RF signal from the second hollow core waveguide to a second RF transceiver,

[0147] processing the combined RF signal in a second RF transceiver,

[0148] And determining a third test result of the test based on processing the combined RF signal in the second RF transceiver.

[0149] Example 23 discloses a method according to Example 22, wherein processing the combined RF signal in the second RF transceiver includes down-converting the mixed RF signal in the second RF transceiver to generate a down-converted signal,

[0150] processing the down-converted signal in a receive channel of the second RF transceiver; and determining a third test result based on the processing of the down-converted signal.

[0151] Example 24 discloses a method according to Example 22 or 23, wherein determining the third test result comprises determining frequency information of the down-converted signal.

Claims

1. A device for testing a radio frequency (RF) transceiver, comprising: A test waveguide structure (104, 204) comprising: Subject (402), a hollow waveguide (146) embedded within the body (402), the hollow waveguide (146) being formed by a metal wall of the body (402), wherein the hollow waveguide (146) extends through the body (402) to route the RF signal, wherein the hollow waveguide (146) includes an input port (120) on a first surface (404) of the body (402) and configured to wirelessly receive RF signals from the RF transceiver, wherein the hollow core waveguide (146) further comprises an output port (122) on the first surface (404) and configured to wirelessly transmit at least a portion of the RF signal to the RF transceiver, and A coupler (126) is disposed within the body (402) and is configured to couple a first portion of the RF signal to the output port (122) and a second portion of the RF signal to a test port (124).

2. The apparatus of claim 1, wherein the apparatus comprises a power detector integrated in the body (402) and coupled to the test port (124), wherein the power detector is configured to determine the power of the second portion of the RF signal.

3. The device according to claim 1 or 2, wherein the test port (124) comprises an external waveguide connector for connecting an external waveguide to the test port (124).

4. The device of any one of claims 1 to 3, wherein the input port (120) is a first input port (120) and the hollow core waveguide (146) comprises a second input port (220) on the first surface (404), wherein the device further comprises a combiner (224) arranged in the hollow core waveguide (146), wherein the first input port (120) is coupled to a first input (214) of the combiner (224) via the hollow core waveguide (146) and the second input port (220) is coupled to a second input (214) of the combiner (224) via the hollow core waveguide (146), wherein the combiner (224) comprises an output (216) which is coupled to an input (128) of the coupler (126) via the hollow core waveguide (146).

5. The apparatus of any one of claims 1 to 4, wherein the output port (122) is a first output port (122), and the hollow waveguide (146) further comprises a second output port (222) disposed on the first surface (404), the second output port (222) being configured to wirelessly pass RF signals to the RF transceiver, wherein the device further comprises a beam splitter (228) disposed in the hollow waveguide (146), the beam splitter (228) comprising an input (218), a first output (226) and a second output (226), wherein the input (218) of the beam splitter (228) is coupled to the output (130) of the coupler (126) via the hollow waveguide (146), and wherein the first output (226) of the beam splitter (228) is coupled to the first output port (122) via the hollow waveguide (146), and wherein the second output (226) of the beam splitter (228) is coupled to the second output port (222) via the hollow waveguide (146).

6. The apparatus of claim 5, wherein the coupler (126) is configured to couple a third portion of the RF signal to an additional port (302) of the hollow core waveguide (146).

7. The device of claim 6, wherein the additional port (302) comprises a wedge shape.

8. The apparatus of claim 7, wherein the apparatus further comprises a socket (504) disposed between a printed circuit board (502) and the RF transceiver, wherein the socket (504) is configured to detachably attach the RF transceiver to the socket (504).

9. The device according to any one of claims 1 to 8, wherein the body (402) is formed as a single piece.

10. The apparatus of any one of the preceding claims, wherein the test waveguide structure (104, 204) is a first test waveguide structure (104, 204), the hollow core waveguide (146) is a first hollow core waveguide (146), the RF transceiver is a first RF transceiver (102, 202), the beam splitter (228) is a first beam splitter (228), and the combiner (224) is a first combiner (224), and wherein the apparatus is configured to test a second RF transceiver (602) in addition to the first RF transceiver (102, 202), wherein the first hollow waveguide (146) comprises a second beam splitter (650), wherein the apparatus further comprises a second test waveguide structure (604), the second test waveguide structure (604) comprising a second hollow waveguide (646) and a second combiner (658) inside the second hollow waveguide (646), The first output (652) of the second beam splitter (650) is coupled to the first input (660) of the second combiner (658) via a connecting hollow waveguide (648).

11. The apparatus of claim 10, wherein the RF signal is a first RF signal from the first RF transceiver (102, 202), and the second RF transceiver (602) transmits a second RF signal, wherein an input (656) of the second beam splitter (650) is coupled to the output (130) of the coupler (126) of the first hollow waveguide (146), A second output (654) of the second beam splitter (650) is coupled to the output port (122) of the first hollow core waveguide (146), wherein a second input (662) of the second combiner (658) is coupled to an output (630) of the coupler (226) of the second hollow core waveguide (646), and wherein the second combiner (658) is configured to combine a fourth portion of the first RF signal with the first portion of the second RF signal, The output (664) of the second combiner (658) is coupled to the output port (622) of the second hollow waveguide (646) and is configured to wirelessly transmit the fourth portion of the first RF signal and the first portion of the second RF signal to the second RF transceiver (602).

12. The apparatus of claim 11, wherein the first hollow core waveguide (146) comprises a third combiner (750) disposed between the output port (122) of the first hollow core waveguide (146) and the second beam splitter (650), and the second hollow core waveguide (646) comprises a third beam splitter (758) disposed between the coupler (226) of the second hollow core waveguide (646) and the third combiner (750), wherein the first input (752) of the third combiner (750) is coupled to the first output (760) of the third beam splitter (758) via a further connecting hollow waveguide (748), and wherein a second input (754) of the third combiner (750) is coupled to the second output (654) of the second beam splitter (650), and the third combiner (750) is configured to combine a fifth portion of the first RF signal and a fourth portion of the second RF signal, wherein an output (756) of the third combiner (750) is coupled to the output port (122) of the first hollow waveguide (146) and is configured to pass the fifth portion of the first RF signal and the fourth portion of the second RF signal to the first RF transceiver (102, 202), wherein the second output (762) of the third beam splitter (758) is coupled to the second input (662) of the second combiner (658), wherein an input (764) of the third beam splitter (758) is coupled to the output (630) of the coupler (126) of the second hollow waveguide (646), and Wherein the second combiner (658) is configured to pass the fourth portion of the first RF signal and the fifth portion of the second RF signal to the second RF transceiver (602).

13. The apparatus of claim 11 or 12, wherein the second hollow waveguide (604) is embedded inside the body of the second test waveguide structure, and wherein the first hollow waveguide (146) is externally coupled to the second hollow waveguide (646) by the connecting waveguide.

14. The apparatus according to claim 11 or 12, wherein the second hollow waveguide (646) and the connecting waveguide are embedded inside the body (402) of the first test waveguide structure (104, 204).

15. A method for testing an RF transceiver, comprising: coupling the RF transceiver to the apparatus for testing an RF transceiver according to any one of claims 1 to 9, wirelessly transmitting an RF signal from the RF transceiver to the input port (120) of the hollow core waveguide (146), coupling the first portion of the RF signal to the output port (122) of the hollow core waveguide (146) via the coupler (126), wirelessly transmitting the first portion of the RF signal from the output port (122) of the hollow core waveguide (146) to the RF transceiver, processing the first portion of the RF signal in the RF transceiver, and determining a first test result of the test based on the processing of the first portion of the RF signal in the RF transceiver.

16. The method of claim 15, wherein processing the first portion of the RF signal in the RF transceiver comprises down-converting the first portion of the RF signal in the RF transceiver to generate a down-converted signal, processing the down-converted signal in a receive channel (112) of the RF transceiver; and determining the first test result based on the processing of the down-converted signal.

17. The method of claim 15 or 16, wherein determining the first test result comprises determining at least one of phase information of the first portion of the RF signal or power of the first portion of the RF signal.

18. The method of claim 17, further comprising coupling the second portion of the RF signal to the test port (124), measuring at least one of phase information or power of the second portion of the RF signal coupled to the test port (124), A second test result is determined based on the measurement.

19. The method of claim 18, further comprising comparing the first test result to the second test result.

20. The method of claim 18, comprising coupling the third portion of the RF signal to an additional port (302) of the hollow core waveguide (146) via the coupler (126).

21. The method of any one of claims 15 to 20, wherein the hollow core waveguide (146) comprises a plurality of input ports (120, 220) and a plurality of output ports (122, 222), wherein coupling the RF transceiver to the device further comprises: coupling each of a plurality of wireless transmit structures (106, 206) of the RF transceiver to a corresponding input port of the plurality of input ports (120, 220), coupling each of a plurality of wireless receive structures (108, 208) of the RF transceiver to a corresponding output port of the plurality of output ports (122, 222), The method further comprises: selecting a corresponding transmission path from a plurality of transmission paths (110, 210), activating the selected transmit path and wirelessly passing the RF signal from the selected transmit path to the input port (120, 220), activating multiple receive paths (112, 212), splitting the first portion of the RF signal such that each of the plurality of output ports (122, 222) receives a respective split portion of the first portion of the RF signal, Each split portion is processed in a corresponding receive path of the RF transceiver.

22. The method according to claim 15, comprising: coupling a second RF transceiver (602) to the apparatus for testing the RF transceiver according to claims 10 to 13, wirelessly transferring the fourth portion of the first RF signal to the second test waveguide structure (604), mixing the first portion of the second RF signal and the fourth portion of the first RF signal via the combiner (658) to form a combined RF signal, and coupling the combined RF signal to the output port (622) of the second hollow core waveguide (646), wirelessly transmitting the combined RF signal from the output port (622) of the second hollow core waveguide (646) to the second RF transceiver (604), processing the combined RF signal in the second RF transceiver (602), and determining a third test result of the test based on the processing of the combined RF signal in the second RF transceiver (602).

23. The method of claim 22, wherein processing the combined RF signal in the second RF transceiver (602) comprises down-converting the combined RF signal in the second RF transceiver (602) to generate a down-converted signal, processing the down-converted signal in a receive channel (112) of the second RF transceiver (604); and determining the third test result based on the processing of the down-converted signal.

24. The method according to claim 22 or 23, wherein determining the third test result comprises determining frequency information of the down-converted signal.

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