Total reflection optical mosaic focal plane structure

By adjusting the focal plane substrate structure and detector support method, the distance from the detector's photosensitive pixel surface to the reflector surface was shortened, solving the problem of low detector pixel utilization caused by a large pixel overlap area, and achieving the effect of reducing the number of detectors and lowering production costs.

CN119729172BActive Publication Date: 2026-02-24CHANGGUANG SATELLITE TECH CO LTD
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Patent Information

Application Number
CN202411931560.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-12-26
Publication Date
2026-02-24
Estimated Expiration
2044-12-26

AI Technical Summary

Technical Problem

In existing technologies, total internal reflection optical splicing focal plane structures suffer from reduced detector pixel utilization due to the large pixel overlap area.

Method used

By adjusting the structure of the focal plane substrate and increasing the size of the light-transmitting aperture on the substrate, the detector and detector mount support structure can pass through the substrate wall. The photosensitive surface of the detector moves forward along the incident direction of light, and the detector support structure is placed behind the detector housing, shortening the distance from the photosensitive pixel surface to the mirror surface and reducing the overlapping pixel area.

Benefits of technology

This improved the utilization rate of detector pixels, reduced the number of detectors, lowered production costs, and improved the economic benefits of mass production of cameras.

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Abstract

The present application relates to a kind of total reflection optical mosaic focal plane structures, belong to space optical remote sensing technical field, solve the problem that the utilization rate of detector element is reduced due to the large range of element overlap area.The present application includes focal plane substrate, mirror assembly and at least two detector module assembly, each detector module assembly includes detector, support structure assembly, assembly of adjustment gasket, circuit board, module assembly cover plate and stray light baffle, stray light baffle is fixed in the installation surface of the photosensitive element area of detector, detector, circuit board and module assembly cover plate are all fixed on support structure assembly, focal plane substrate is provided with substrate light hole, each substrate light hole is fixed with one detector module assembly.The present application can reduce the distance between sensor photosurface and mirror surface, thereby reducing the number of element overlap area element, improve the utilization rate of detector element, reduce the number of detector and the number of structure assembly, electronic component matched with detector, reduce production cost.
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Description

Technical Field

[0001] This invention relates to the field of space optical remote sensing technology, and in particular to a total internal reflection optical splicing focal plane structure. Background Technology

[0002] Space cameras widely employ multi-detector stitching to expand the swath width, meeting the requirements of long linear arrays and large-area arrays of the focal plane. Currently, common focal plane stitching methods include mechanical stitching and optical stitching. Among them, optical stitching is mainly divided into semi-reflective and semi-transparent optical stitching and fully reflective and fully transparent optical stitching.

[0003] Focal plane mechanical stitching involves arranging detectors in two staggered parallel arrays. Adjacent detectors are offset in the direction of image movement, with the gaps in the first row filled by detectors in the second row, and the pixel areas of adjacent detectors overlapping end-to-end. The advantages are compact structure and simple operation. The disadvantages are that this stitching method makes post-processing image processing difficult and requires a large storage capacity.

[0004] Semi-reflective and semi-transparent optical splicing has the advantage of avoiding a lot of image processing work in mechanical splicing, but the disadvantage is that the beam splitter is large and heavy, and the light energy utilization rate is low, which affects the camera's imaging effect.

[0005] Currently, total reflection and total transparency optical splicing is commonly used. This splicing method utilizes mirrors that are small in size and weight and have high light energy utilization. However, a drawback is that the edges of the total reflection mirrors can cause vignetting by dividing the light beam. Therefore, a pixel overlap area is needed to compensate for this vignetting effect. The size of the overlap area is designed based on the size of the vignetting spot and must be large enough to cover it. Typically, the number of pixels in the pixel overlap area accounts for 10%-30% of the total number of detector pixels. The existence of this overlap area reduces the utilization rate of the detector pixels. Summary of the Invention

[0006] To address the problem of reduced detector pixel utilization due to large pixel overlap areas in existing technologies, this invention proposes a total internal reflection optical splicing focal plane structure that can improve detector pixel utilization. This total internal reflection optical splicing focal plane structure improves the vignetting phenomenon introduced by the mirror, reduces the number of overlapping pixels, and thus improves detector pixel utilization.

[0007] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0008] A total internal reflection optical splicing focal plane structure includes a focal plane substrate, a mirror assembly, and at least two detector module assemblies;

[0009] Each detector module assembly includes a detector, a support structure assembly, an assembly shim set, a circuit board, a module assembly cover plate, and a stray light blocking plate. One side of the support structure assembly has a first cover plate mounting surface and a first circuit board mounting surface located inside the first cover plate mounting surface. The opposite side has a detector mount support structure. The detector mount support structure has a detector mounting surface and detector pin through-holes inside. The detector pins pass through the detector pin through-holes and are soldered to the circuit board through-holes on the circuit board. The support structure mounting surface where the pins are located is fixedly connected to the detector mounting surface. Furthermore, the first baffle mounting surface where the photosensitive pixel area of ​​the detector is located is flush with the top surface of the detector base support structure. The second circuit board mounting surface of the circuit board is fixedly connected to the first circuit board mounting surface. The module component cover plate is fixedly connected to the first cover plate mounting surface. The stray light baffle is provided with a baffle light-passing hole that matches the size of the photosensitive pixel area. After the baffle light-passing hole is aligned with the photosensitive pixel area, the stray light baffle is fixedly connected to the first baffle mounting surface. The two opposite sides of the support structure component are provided with support structure external mounting surfaces. The support structure external mounting surfaces are provided with support structure external mounting interfaces for fixing to the focal plane substrate.

[0010] The focal plane substrate includes a direct-projection detector mounting plate, a reflective detector mounting plate, and a mirror mounting surface located between the two. Each of the direct-projection and reflective detector mounting plates has at least one substrate light-transmitting hole. A mirror assembly is mounted on the mirror mounting surface. On the sides of the direct-projection and reflective detector mounting plates facing away from the mirror assembly, a pair of mounting bosses with mounting threaded holes are provided on both sides of each substrate light-transmitting hole. The size of each substrate light-transmitting hole is larger than the outer contour size of the detector mount support structure. A detector module assembly is fixedly mounted on each substrate light-transmitting hole via mounting threaded holes, a set of mounting shims, and an external mounting interface of the support structure. The mounting shim set includes two shims, both assembled between the external mounting surface of the support structure and the mounting bosses of the focal plane substrate. The detector mount support structure in the mounted detector module assembly passes through the corresponding substrate light-transmitting hole from the side where the mounting boss is located.

[0011] The beneficial effects of this invention are as follows:

[0012] This invention adjusts the focal plane substrate structure and enlarges the size of the light-transmitting aperture on the substrate, allowing the detector and detector mount support structure to pass through the substrate wall. This causes the photosensitive surface of the detector to move forward in the opposite direction of light incidence, reducing the distance between the photosensitive pixel surface of the detector and the mirror surface. Simultaneously, placing the detector support structure at the back of the detector housing eliminates the thickness of the detector support and mounting shims, further shortening the distance between the photosensitive pixel surface and the mirror surface. This improves the vignetting phenomenon caused by the mirror during optical stitching, thereby reducing the overlap area of ​​the detector pixels and ultimately increasing the utilization rate of detector pixels in optical stitching. Furthermore, it helps reduce the number of detectors used in the focal plane of a wide-format camera, lowering the production cost of wide-format cameras and improving the economic benefits of mass production. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of one possible structure of the total internal reflection optical splicing focal plane structure described in this invention;

[0014] Figure 2 for Figure 1 The schematic diagram of the back structure of the total internal reflection optical splicing focal plane structure shown.

[0015] Figure 3 This is a schematic diagram of one type of focal plane substrate structure;

[0016] Figure 4 This is a schematic diagram of the reflector assembly.

[0017] Figure 5 This is a schematic diagram of the detector's structure;

[0018] Figure 6 A structural diagram of the supporting structural components;

[0019] Figure 7 This is a schematic diagram of the assembly of the shims;

[0020] Figure 8 This is a schematic diagram of the circuit board structure;

[0021] Figure 9 A schematic diagram of the structure of the cover plate for the modular component;

[0022] Figure 10 This is a schematic diagram of the structure of the stray light blocking plate;

[0023] Figure 11 This is a schematic diagram showing the assembly relationship of the detector module components;

[0024] Figure 12 A comparison diagram of a conventional focal plane structure and the focal plane structure of the present invention;

[0025] Figure 13The light trail of the mirror when L1 = 31.7 mm and the field of view is 0°;

[0026] Figure 14 The light trail of the mirror is shown when L2 = 21.7 mm and the field of view is 0°.

[0027] Explanation of reference numerals in the attached drawings: 1. Focal surface substrate; 2. Detector; 3. Mirror assembly; 4. Support structure assembly; 5. Mounting shim group; 6. Circuit board; 7. Module assembly cover plate; 8. Stray light blocking plate; 9. Substrate light-transmitting hole; 10. Mirror mounting surface; 11. Direct-view mounting boss; 12. Reflective-view mounting boss; 13. Mounting threaded hole; 14. Mirror surface; 15. External mounting surface of the mirror; 16. Photosensitive pixel area; 17. Pin lead; 18. First blocking plate mounting surface; 9. Support structure mounting surface; 20. Detector mounting surface; 21. Detector pin through hole; 22. Detector seat support structure; 23. Support structure external mounting surface; 24. First circuit board mounting surface; 25. First cover plate mounting surface; 26. Support structure external mounting interface; 27. Circuit board through hole; 28. Second circuit board mounting surface; 29. ​​Second cover plate mounting surface; 30. Limiting boss structure; 31. Second baffle mounting surface; 32. Baffle light transmission hole; 33. Detector module assembly. Detailed Implementation

[0028] The technical solution of the present invention will now be described in detail with reference to the accompanying drawings and preferred embodiments.

[0029] See Figures 1 to 11 This embodiment provides a total internal reflection optical splicing focal plane structure that can improve detector pixel utilization. It includes a focal plane substrate 1, a mirror assembly 3, and at least two identical detector module assemblies 33. The mirror assembly 3 and each detector module assembly 33 are mounted on the focal plane substrate 1. Each detector module assembly 33 includes a detector 2, a support structure assembly 4, a circuit board 6, a module assembly cover plate 7, and a stray light blocking plate 8. It should be noted that... Figures 1-3 The structure of the present invention is illustrated by taking the total internal reflection optical splicing focal plane structure of the present invention, which includes three detector module components 33, as an example, and should not be regarded as a limitation on the scope of protection of the present invention.

[0030] Specifically, the focal plane substrate 1 includes a direct-view detector mounting plate and a reflective-view detector mounting plate. The sides of the direct-view detector mounting plate and the reflective-view detector mounting plate are connected and perpendicular to each other. Alternatively, the direct-view detector mounting plate and the reflective-view detector mounting plate may adopt an integrated structure or other common focal plane structures, which are not limited here.

[0031] The direct-view detector mounting plate has at least one substrate light-transmitting hole 9, and the reflective detector mounting plate also has at least one substrate light-transmitting hole 9. The size of each substrate light-transmitting hole 9 is larger than the outer contour dimension of the detector seat support structure 22 in the support structure assembly 4, i.e. Figure 6 The outline dimensions of the area enveloped by the dashed line.

[0032] The focal plane substrate 1 also includes a reflector mounting surface 10 assembled with the reflector assembly 3, and the reflector mounting surface 10 is located between the direct surface detector mounting plate and the reflective surface detector mounting plate. The function of the reflector assembly 3 is to fold the optical path and connect the pixel areas of the detector on the direct surface detector mounting plate and the detector on the reflective surface detector mounting plate to realize the detector pixel connection.

[0033] like Figure 3 As shown, taking the focal plane substrate 1, which includes three substrate light-transmitting holes 9 as an example, the direct-view detector mounting plate has two substrate light-transmitting holes 9, the reflective-view detector mounting plate has one substrate light-transmitting hole 9, and the reflector mounting surface 10 is located between the two substrate light-transmitting holes 9 on the direct-view detector mounting plate. The substrate light-transmitting hole 9 on the reflective-view detector mounting plate is opposite to the reflector assembly 3 mounted on the reflector mounting surface 10, so as to receive the light reflected by the reflector assembly 3.

[0034] On the sides of the direct-view detector mounting plate and the reflective-view detector mounting plate facing away from the reflector assembly 3, a pair of mounting bosses are provided on both sides of the light-transmitting hole 9 of each substrate. The mounting bosses provided on the direct-view detector mounting plate and the reflective-view detector mounting plate are a direct-view mounting boss 11 and a reflective-view mounting boss 12, respectively, and both the direct-view mounting boss 11 and the reflective-view mounting boss 12 are provided with mounting threaded holes 13 for assembly with the corresponding support structure assembly 4.

[0035] The direct-view mounting boss 11 is used to assemble with the support structure component 4 located on the direct-view detector mounting plate. It should be noted that each support structure component 4 located on the direct-view detector mounting plate has two coplanar mounting surfaces with the focal plane substrate 1. As the number of direct-view detectors increases, the mounting surfaces increase in pairs.

[0036] The reflective surface mounting boss 12 is used to assemble with the support structure assembly 4 located on the reflective surface detector mounting plate. It should be noted that the support structure assembly 4 located on the reflective surface detector mounting plate has two coplanar mounting surfaces with the focal surface substrate 1.

[0037] The reflector assembly 3 includes a reflector surface 14 and a reflector external mounting surface 15, which is fixedly connected to the reflector mounting surface 10.

[0038] The detector 2 includes a photosensitive pixel area 16, pins 17, a first baffle mounting surface 18, and a support structure mounting surface 19. The photosensitive pixel area 16 and the pins 17 are located on opposite sides. The first baffle mounting surface 18 is located on the side where the photosensitive pixel area 16 is located, and the support structure mounting surface 19 is located on the side away from the photosensitive surface, on the side where the pins 17 are located. The first baffle mounting surface 18 is used to mount the stray light blocking baffle 8, and the support structure mounting surface 19 is used to fix it to the support structure assembly 4.

[0039] The support structure assembly 4 includes a detector mounting surface 20, a detector pin through-hole 21, a detector seat support structure 22, a support structure external mounting surface 23, a first circuit board mounting surface 24, a first cover plate mounting surface 25, and a support structure external mounting interface 26. One side of the support structure assembly 4 has the first cover plate mounting surface 25 and a recessed first circuit board mounting surface 24 located inside the first cover plate mounting surface 25. The opposite side has the detector seat support structure 22, which has a recessed detector mounting surface 20 and a through-hole 21 for the detector pins. The support structure assembly 4 is an integrated assembly that provides support for both the detector 2 and the circuit board 6. It should be noted that, as long as a stable connection between the detector 2, the circuit board 6, and the focal plane substrate 1 can be achieved, the support structure assembly 4 is not limited to the integrated structure form described in this application; it can also be a separate design or other structural forms.

[0040] Circuit board 6 has a circuit board through hole 27 that mates with the pin 17 of detector 2. After the pin 17 of detector 2 passes through the detector pin through hole 21, the position of the circuit board through hole 27 of circuit board 6 is adjusted so that the circuit board through hole 27 can be adapted to the pin 17. After the pin 17 and the circuit board through hole 27 are adapted, they are soldered together. The mounting surface 19 of the support structure where the pin 17 is located is fixedly connected to the detector mounting surface 20 of the support structure assembly 4 by means of adhesive bonding or other methods. Furthermore, the first baffle mounting surface 18 where the photosensitive pixel area 16 of detector 2 is located is flush with the top surface of the detector base support structure 22, which reduces the distance from the photosensitive pixel area 16 of detector 2 to the reflective mirror surface 14.

[0041] The side of the circuit board 6 that is fixed to the supporting structure assembly 4 is the second circuit board mounting surface 28. The second circuit board mounting surface 28 and the first circuit board mounting surface 24 are fixedly connected by means of adhesive bonding or other methods. The circuit board 6 may include different electrical components and modules depending on the actual situation.

[0042] After the through hole 27 of the circuit board is adapted to the detector pin 17, it is soldered together.

[0043] The module component cover plate 7 includes a second cover plate mounting surface 29 that is assembled with the support structure component 4. The second cover plate mounting surface 29 and the first cover plate mounting surface 25 are fixedly connected by means of adhesive bonding or the like.

[0044] Further, see Figure 9 The module component cover plate 7 has a limiting boss structure 30 around the side opposite to the circuit board 6, i.e. the second cover plate mounting surface 29. The limiting boss structure 30 cooperates with the inner edge of the first cover plate mounting surface 25 for limiting.

[0045] The stray light blocking plate 8 is provided with a light-passing hole 32 that matches the size of the photosensitive pixel area 16. After the light-passing hole 32 of the blocking plate is aligned with the photosensitive pixel area 16, it is ensured that the photosensitive pixel area 16 of the detector 2 can be fully exposed through the light-passing hole 32 of the stray light blocking plate 8, and the system light will not be blocked by the stray light blocking plate 8. The second blocking plate mounting surface 31 of the stray light blocking plate 8 and the first blocking plate mounting surface 18 of the detector 2 are fixedly connected by means of bonding or other methods.

[0046] The stray light blocking plate 8 needs to undergo any one or a combination of stray light reduction treatment methods, such as blackening, painting, or coating. It should be noted that the stray light reduction treatment methods are not limited to the above-mentioned methods; any method that achieves the effect of eliminating stray light without damaging the structure of the stray light blocking plate can be used.

[0047] It should be noted that the fixing methods between detector 2 and support structure component 4, circuit board 6 and support structure component 4, module component cover plate 7 and support structure component 4, and stray light blocking plate 8 and detector 2 are not limited to adhesive connection. As long as the fastening effect can be achieved without damaging detector 2, support structure component 4, circuit board 6, module component cover plate 7, and stray light blocking plate 8, it is acceptable.

[0048] The support structure assembly 4 has two opposite sides with external mounting surfaces 23. Each external mounting surface 23 has an external mounting interface 26 for fixing to the focal plane substrate 1. The number of external mounting interfaces 26 can be selected according to actual needs; for example, each external mounting surface 23 may have two external mounting interfaces 26 to achieve stable fixing of the support structure assembly 4.

[0049] Each substrate light-transmitting hole 9 is fixedly mounted with a detector module assembly 33 via a mounting threaded hole 13 and a support structure external mounting interface 26. The detector mount support structure 22 of the mounted detector module assembly 33 passes through the corresponding substrate light-transmitting hole 9 from the side where the mounting boss is located. After the detector module assembly 33 is mounted on the focal plane substrate 1, the detector mount support structure 22 can extend fully out of the substrate light-transmitting hole 9 on the focal plane substrate 1, which can reduce the distance from the photosensitive pixel area 16 of the detector 2 to the reflecting mirror surface 14.

[0050] Specifically, two detector module components 33 are mounted together with the mounting pad group 5 on the direct-view mounting boss 11 of the focal plane substrate 1 through the external mounting interface 26 of the support structure, thus completing the installation of the detector module component on the direct-view side of the focal plane; the remaining detector module component 33 is mounted together with the mounting pad group 5 on the reflective surface mounting boss 12 of the focal plane substrate 1 through the external mounting interface 26 of the support structure, thus completing the installation of the detector module component on the reflective surface side of the focal plane.

[0051] The mounting shim group 5 includes at least one set of two shims, which are assembled between the external mounting surface 23 of the support structure assembly 4 and the direct-view mounting boss 11 or reflective mounting boss 12 of the focal plane substrate 1. The mounting shim group 5 in this invention replaces the original mounting shims between the detector and the substrate, shortening the distance between the photosensitive surface of the detector and the mirror surface. By adjusting the mounting shim group 5, the position of the detector can be adjusted, thereby further improving the focal plane splicing accuracy.

[0052] Furthermore, the focal plane substrate 1, the support structure assembly 4, the assembly and adjustment pad assembly 5, the module assembly cover plate 7, and the stray light blocking plate 8 should all be made of the same material to ensure consistent thermal expansion coefficients and avoid thermal stress accumulation.

[0053] The assembly relationship of the total internal reflection optical splicing focal plane structure proposed in this invention is described below:

[0054] First, the detector 2 is bonded to the detector mounting surface 20 of the support structure assembly 4 via the mounting surface 19 of the support structure, and the pin pin 17 of the detector 2 passes through the detector pin through hole 21 of the support structure assembly 4.

[0055] Then, the circuit board 6 is bonded to the support structure assembly 4. The first circuit board mounting surface 24 and the second circuit board mounting surface 28 of the support structure assembly 4 are bonded together. During the bonding process between the circuit board 6 and the support structure assembly 4, the position of the circuit board through hole 27 should be adjusted so that the circuit board through hole 27 can be adapted to the pin 17 of the detector 2. After adaptation, the two are soldered together.

[0056] The second cover mounting surface 29 of the module component cover plate 7 is bonded to the first cover mounting surface 25 of the support structure component 4, and is limited by the limiting boss structure 30 of the module component cover plate 7.

[0057] When bonding the stray light blocking plate 8 to the first blocking plate mounting surface 18 of the detector 2, it is necessary to ensure that the photosensitive pixel area 16 of the detector 2 is fully exposed through the light-transmitting hole 32 of the blocking plate 8 so that the system light is not blocked.

[0058] Assemble the detector module assembly 33 one by one according to the above method. The structure of the detector module assembly 33 is as follows: Figure 11 As shown, in this embodiment, there are 3 optical splicing detectors, including 2 direct-facing detectors and 1 reflective detector, that is, this embodiment includes a total of 3 sets of detector module components 33;

[0059] The two detector module assemblies 33 are installed together with the mounting pad group 5 on the direct surface mounting boss 11 of the focal plane substrate 1 through the external mounting interface 26 of the support structure assembly 4, thus completing the installation of the detector module assembly on the direct surface side of the focal plane.

[0060] A detector module assembly 33 is mounted on the reflective surface mounting boss 12 of the focal plane substrate 1 through the external mounting interface 26 of the support structure assembly 4 and the mounting pad group 5, thereby completing the installation of the detector module assembly on the reflective surface side of the focal plane.

[0061] The position of the detector is adjusted by repairing and adjusting the shim group 5, thus achieving high-precision splicing of the focal plane;

[0062] After completing the above steps, the total internal reflection optical splicing focal plane structure proposed in this embodiment, which can improve the utilization rate of detector pixels, can be obtained.

[0063] This invention provides a total internal reflection optical stitching focal plane structure that improves detector pixel utilization. By modifying the structural configuration of the focal plane components and the assembly method between them, particularly the assembly method between the detector and the support structure components, and between the detector and the focal plane substrate, and by adjusting the focal plane substrate structure and enlarging the size of the light-transmitting aperture, the detector and detector mount support structure can pass through the substrate wall. This allows the detector's photosensitive surface to move forward in the opposite direction of light incidence. Simultaneously, placing the detector support structure at the back of the detector housing eliminates the thickness of the detector support and mounting shims, further shortening the distance from the photosensitive pixel surface of the focal plane detector to the mirror surface, reducing the field of view width corresponding to the focal plane vignetting region, and consequently reducing the overlap width between adjacent detectors, thus improving the detector pixel utilization of the total internal reflection optical stitching focal plane. Furthermore, this invention helps reduce the number of detectors used in wide-format optical stitching focal planes, while also reducing the workload of detector-related structural components, electronic equipment, and subsequent image processing, lowering the production cost of wide-format cameras, and improving the economic efficiency of mass production.

[0064] For a total internal reflection optical splicing focal plane, the size of the vignetting region is related to the distance L between the reflector and the photosensitive surface of the detector; the smaller the L value, the smaller the vignetting region. Since the detector has no external mounting interface, it needs to be bonded to a detector support base, which provides the external interface for connection to the substrate. In conventional focal plane structures, the shell side of the detector closest to the photosensitive surface is bonded to the detector base, and then the detector base and mounting shims are connected to the substrate with screws. The distance L is usually greater than the sum of the substrate thickness and the detector base thickness. Limited by the structural volume of the detector support base, mounting shims, and substrate, the distance L cannot be further reduced.

[0065] like Figure 12 As shown, Figure (a) shows a conventional focal plane structure, including a conventional focal plane substrate, detector, mirror assembly, and support structure assembly, with a distance of L1 between the mirror and the photosensitive surface. Figure (b) shows the focal plane structure in an embodiment of the present invention, with a distance of L2 between the mirror and the photosensitive surface. The measured model distances are L1 = 31.7 mm and L2 = 21.7 mm.

[0066] To illustrate the actual improvement effect of the present invention on focal plane vignetting, and to further illustrate the effect of the present invention on reducing the pixel area of ​​the detector overlap, an optical system model was introduced, and the vignetting field of view of the conventional focal plane structure and the focal plane structure of the present invention was measured and compared.

[0067] When L1 = 31.7 mm and the field of view is 0°, the field width angle corresponding to the vignetting zone is:

[0068] 2.21° - 1.77° = 0.44°, as shown Figure 13 As shown, the colored ring in Figure (a) is the light spot of the reflecting mirror under a field of view of 1.77°, and the colored ring in Figure (b) is the light spot of the reflecting mirror under a field of view of 2.21°.

[0069] When L2 = 21.7mm, at a 0° field of view, the field width angle corresponding to the vignetting zone is:

[0070] 2.23° - 1.89° = 0.34°, as shown Figure 14 As shown, the colored ring in Figure (a) is the light spot of the reflecting mirror under a field of view of 1.89°, and the colored ring in Figure (b) is the light spot of the reflecting mirror under a field of view of 2.23°.

[0071] Calculations show that, compared to conventional focal plane structures, the field of view width corresponding to the vignetting region of this invention is reduced by 22.7%. Typically, the width of the detector pixel overlap area is proportional to the field of view width corresponding to the vignetting region; therefore, the detector overlap width is reduced by 22.7%. This demonstrates the practical beneficial effect of this invention on improving detector pixel utilization.

[0072] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0073] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A total internal reflection optical splicing focal plane structure, characterized in that, It includes a focal plane substrate (1), a mirror assembly (3), and at least two detector module assemblies (33); Each detector module assembly (33) includes a detector (2), a support structure assembly (4), an assembly pad group (5), a circuit board (6), a module assembly cover plate (7), and a stray light blocking plate (8). One side of the support structure assembly (4) is provided with a first cover plate mounting surface (25) and a first circuit board mounting surface (24) located inside the first cover plate mounting surface (25). The opposite side is provided with a detector seat support structure (22). The detector seat support structure (22) is provided with a detector mounting surface (20) and a detector pin through hole (21). The pins (17) of the detector (2) pass through the detector pin through hole (21) and are soldered to the circuit board through hole (27) on the circuit board (6). The support structure mounting surface (19) where the pins (17) are located is fixed to the detector mounting surface (20). The first baffle mounting surface (18) where the photosensitive pixel area (16) of the detector (2) is located is flush with the top surface of the detector base support structure (22). The second circuit board mounting surface (28) of the circuit board (6) is fixedly connected to the first circuit board mounting surface (24). The module assembly cover plate (7) is fixedly connected to the first cover plate mounting surface (25). The stray light baffle (8) is provided with a baffle light-transmitting hole (32) that matches the size of the photosensitive pixel area (16). After the baffle light-transmitting hole (32) is aligned with the photosensitive pixel area (16), the stray light baffle (8) is fixedly connected to the first baffle mounting surface (18). The two opposite sides of the support structure assembly (4) are provided with support structure external mounting surfaces (23). The support structure external mounting surfaces (23) are provided with support structure external mounting interfaces (26) for fixing with the focal plane substrate (1). The focal plane substrate (1) includes a direct-view detector mounting plate, a reflective-view detector mounting plate, and a reflector mounting surface (10) located between the two. Each of the direct-view detector mounting plate and the reflective-view detector mounting plate has at least one substrate light-transmitting hole (9). A reflector assembly (3) is mounted on the reflector mounting surface (10). On the sides of the direct-view detector mounting plate and the reflective-view detector mounting plate facing away from the reflector assembly (3), a pair of mounting bosses with mounting threaded holes (13) are respectively provided on both sides of each substrate light-transmitting hole (9). The dimensions of each substrate light-transmitting hole (9) are... The dimensions are all larger than the outer contour dimensions of the detector mount support structure (22). Each substrate light-transmitting hole (9) is fixedly mounted with a detector module assembly (33) through a mounting thread hole (13), a mounting shim group (5) and a support structure external mounting interface (26). The mounting shim group (5) includes two shims, which are assembled between the support structure external mounting surface (23) and the mounting boss of the focal plane substrate (1). The detector mount support structure (22) in the installed detector module assembly (33) passes through the corresponding substrate light-transmitting hole (9) from the side where the mounting boss is located.

2. The total internal reflection optical splicing focal plane structure according to claim 1, characterized in that, The detector module assembly (33) consists of three components. The direct-view detector mounting plate has two substrate light-transmitting holes (9), and the reflector mounting surface (10) is located between the two substrate light-transmitting holes (9).

3. The total internal reflection optical splicing focal plane structure according to claim 1 or 2, characterized in that, The focal plane substrate (1), the support structure assembly (4), the assembly pad assembly (5), the module assembly cover plate (7), and the stray light blocking plate (8) are made of the same material.

4. A total internal reflection optical splicing focal plane structure according to claim 1 or 2, characterized in that, The module assembly cover plate (7) has a limiting boss structure (30) around the side opposite to the circuit board (6), which is matched with the inner edge of the first cover plate mounting surface (25) for limiting.

5. A total internal reflection optical splicing focal plane structure according to claim 1 or 2, characterized in that, Each support structure has two external mounting interfaces (26) on its external mounting surface (23).

6. A total internal reflection optical splicing focal plane structure according to claim 1 or 2, characterized in that, The sides of the direct-view detector mounting plate and the reflective-view detector mounting plate are connected and perpendicular to each other.

7. A total internal reflection optical splicing focal plane structure according to claim 1 or 2, characterized in that, The stray light removal plate (8) is a plate after stray light removal treatment. The stray light removal treatment methods include any one or any combination of blackening, spraying, and coating.

8. A total internal reflection optical splicing focal plane structure according to claim 1 or 2, characterized in that, The mounting surface (19) of the support structure and the mounting surface (20) of the detector are fixed by adhesive bonding.

9. A total internal reflection optical splicing focal plane structure according to claim 1 or 2, characterized in that, The second circuit board mounting surface (28) is fixed to the first circuit board mounting surface (24) by adhesive bonding.

10. A total internal reflection optical splicing focal plane structure according to claim 1 or 2, characterized in that, The module component cover plate (7) is fixed to the first cover plate mounting surface (25) by adhesive bonding.

Citation Information

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