Camera module, circuit board assembly, manufacturing method of circuit board assembly and electronic equipment

Abstract

The invention provides a camera module, a circuit board assembly, a manufacturing method of the circuit board assembly and electronic equipment. The circuit board assembly comprises a substrate, a photosensitive element and at least one molding base. The photosensitive element is electrically connected to the substrate, the photosensitive element is integrally fixed on the substrate by the molded base, the molded base comprises a base inner wall, a base outer wall and further comprises a molded upper end surface and a molded lower end surface, the base inner wall forms a light window of the molded base, and the molded upper end surface and the molded lower end surface form a light window of the molded base. Wherein the inner wall of the base is further provided with an inner inclined surface and an inner cambered surface, the inner cambered surface extends to the inner side surface, and the inner cambered surface faces the molding base.

Description

Technical Field

[0001] The present invention relates to the field of optical imaging, and in particular to a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device. Background Art

[0002] At present, electronic devices are increasingly developing towards intelligence and thinness, which puts forward more stringent requirements on the size and imaging quality of camera modules, which are one of the standard configurations of electronic products. The hardware basis of high-pixel and high-quality camera modules is that the photosensitive elements have a larger photosensitive area and more and larger passive components. As smart electronic devices pursue higher pixels and higher quality, the size of camera modules is getting larger and larger, which also makes the development trend of camera modules increasingly inconsistent with the development trend of thinness of electronic devices.

[0003] Therefore, in order to reduce the size of the camera module, the camera module of the prior art uses molding technology to encapsulate the photosensitive elements in the camera module to reduce the size of the camera module in the horizontal direction. Specifically, the electronic components of the camera module are mounted on the circuit board through a surface mounting process, and then the molding process is used to integrally combine the molding material with the circuit board to form a base-type circuit board. The molding process of the prior art is to place the semi-finished circuit board in a molding mold, and when the molding material is filled, a molding base is formed that is solidified on the circuit board, and then the mold is removed to obtain the base-type circuit board.

[0004] However, in order to facilitate demolding and ensure the yield after demolding, the demolding angle of the molded circuit board of the camera module in the prior art is less than 90°, which makes the structure of the molded base of the molded circuit board of the camera module small at the top and large at the bottom. This results in a very small width on the upper surface of the molded base, and the space reserved for subsequent processing operations is very limited. For example, the glue space reserved for the motor or the mirror base to be pasted on the molded upper surface is very small, and it is not easy to control the amount of glue. Usually, the amount of glue is insufficient, resulting in insufficient adhesion between the motor or the mirror base and the upper surface of the molded base. Therefore, in order to ensure that the amount of glue is sufficient, the molding process in the prior art can only increase the width of the upper surface of the molded base. In this way, the size of the lower surface of the molded base also increases, thereby increasing the overall size of the molded base, and also invisibly increasing the size of the camera module.

[0005] In addition, the molding process of the prior art inevitably leads to the structural characteristics of the mold base being narrow at the top and wide at the bottom, because the draft angle is less than 90°, and the upper opening size of the mold base is larger than the lower opening size of the mold base, wherein the photosensitive element is mounted on the circuit board below the mold base. Therefore, it is inevitable that stray light easily enters the photosensitive element, so an additional structure to prevent stray light is required, thereby increasing the molding structure and assembly process on the other hand.

[0006] In addition, with the emergence of full-screen displays, terminal devices (mobile phones) require a higher screen-to-body ratio, so the camera module, especially the front camera module, needs to be installed closer to the top of the terminal. The existing molded base of the camera module has a small top and large bottom structure, which makes it difficult for the circuit board to have an extremely narrow edge. In other words, the molded base of the camera module in the prior art has a small top and large bottom structure because the draft angle is less than 90°. If one side of the circuit board is designed to have an extremely narrow edge, it will inevitably cause one side of the upper surface of the molded base to be narrower, which may cause the upper surface of the molded base to be unable to reliably attach the light-transmitting component, resulting in unstable imaging of the camera module or even overall scrapping. Summary of the invention

[0007] A major advantage of the present invention is that it provides a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the camera module can be reduced in size while ensuring imaging quality, so that the camera module can adapt to the miniaturization and thinness requirements of the electronic device.

[0008] Another advantage of the present invention is that it provides a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein while ensuring the imaging quality, the width dimension of the camera module can be effectively reduced, thereby reducing the internal space occupied by the camera module of the electronic device, which is beneficial to the design, processing and development of the electronic device.

[0009] Another advantage of the present invention is that it provides a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the width dimension of the circuit board assembly of the camera module can be effectively reduced, thereby facilitating reducing the width dimension of the camera module while maintaining the stability of the camera module structure.

[0010] Another advantage of the present invention is that it provides a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein when the area of ​​the lower end surface of the molding base remains unchanged, the area of ​​the upper end surface of the molding base can be increased, thereby providing a larger space for the AA process or the HA process, so as to improve the assembly yield of the electronic product.

[0011] Another advantage of the present invention is that it provides a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein the draft angle of at least one side of the molding base of the circuit board assembly is greater than 90°, which is beneficial for increasing the area of ​​the upper end surface of the molding base while keeping the lower end area of ​​the same molding base unchanged, thereby facilitating subsequent processing of the camera module.

[0012] Another advantage of the present invention is that it provides a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein during the molding process of the molded base of the circuit board assembly, a molding film is extruded by a mold, and the molding space of the molded base is squeezed by the molding film so that the draft angle of the molded base is greater than 90°.

[0013] Another advantage of the present invention is that it provides a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the draft angle of at least one side of the molding base of the circuit board assembly is greater than 90°, and the width of the painting glue on the upper end surface of the molding base can be increased when the overall size of the camera module is reduced, thereby increasing the force of the lens holder or IR attachment, which helps to improve the manufacturing yield of the camera module.

[0014] Another advantage of the present invention is to provide a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein a molded base of the circuit board assembly is integrally formed on a circuit board of the circuit board assembly through a molding process, wherein the draft angle of the molded base during the molding process is greater than 90° so that the size of the upper end face of the molded base is greater than the size of the lower end face.

[0015] Another advantage of the present invention is to provide a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the inner draft angle of at least one side of the molded base of the circuit board assembly is greater than 90°, wherein the inner surface of the molded base is inclined outward from top to bottom, thereby reducing the reflection of external stray light on the inner surface of the molded base, thereby improving the imaging performance of the camera module.

[0016] Another advantage of the present invention is that it provides a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the mold extrude the molding film so that the upper end of the inner surface formed on the molding base is an inclined slope, and the lower end of the inner surface of the molding base is an arc-shaped surface, which is beneficial to reduce the reflection of external stray light on the inner surface of the molding base and improve the imaging performance of the camera module.

[0017] Another advantage of the present invention is that it provides a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the curved surface of the inner surface of the molded base is a rough surface, which is beneficial to reduce the reflection effect of the inner surface of the molded base on stray light, thereby helping to reduce the stray light reflected by the inner surface of the molded base to the photosensitive element, thereby improving the imaging performance of the camera module.

[0018] Another advantage of the present invention is that it provides a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the outer draft angle of at least one side of the molded base of the circuit board assembly is greater than 90°, so that at least one outer side surface of the molded base tilts inward from top to bottom to reduce the size of the lower end of the molded base, which is beneficial to reducing the substrate of the circuit board assembly, thereby reducing the overall size of the camera module.

[0019] Another advantage of the present invention is that it provides a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the inner draft angle of at least one side of the molding base of the circuit board assembly is greater than 90° and the outer draft angle is greater than 90°, and the molding base gradually narrows from top to bottom to facilitate the formation of a narrow edge of the substrate of the circuit board assembly.

[0020] Another advantage of the present invention is that it provides a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein at least one side of the substrate of the circuit board assembly is a narrow edge, and the inner draft angle of the molded base corresponding to the narrow edge is greater than 90° and the outer draft angle is greater than 90°, so as to increase the area of ​​the upper surface of the base of the molded base corresponding to the narrow edge, which is beneficial to the installation of the circuit board assembly and the light-transmitting assembly.

[0021] Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein the circuit board of the circuit board assembly has at least one side with a narrow edge, and wherein the extremely narrow edge of the camera module is installed close to the top of the electronic device, thereby helping to increase the screen-to-body ratio of the electronic device.

[0022] Another advantage of the present invention is that it provides a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein during the molding process of the molded base, the mold for processing the molded base is deformed by extruding a plastic film so that the demolding angle of at least one side of the molded base is greater than 90° during the mold demolding process.

[0023] Another advantage of the present invention is that it provides a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the mold squeezes the plastic film to deform, and the demolding angle of the molding base is formed by the extrusion deformation of the plastic film. When the mold is demolded, the plastic film returns to its initial state so that the mold and the plastic film can be demolded from the molding base.

[0024] Other advantages and features of the present invention will become more apparent from the following detailed description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.

[0025] According to one aspect of the present invention, a circuit board assembly of the present invention that can achieve the above-mentioned objects and other objects and advantages includes:

[0026] a substrate; and

[0027] At least one molded base, wherein the molded base includes a base inner wall, a base outer wall and further has a molded upper end surface and a molded lower end surface, wherein the base inner wall forms a light window of the molded base, wherein the base inner wall further has an inner side surface and an inner curved surface, the inner curved surface extends from the inner side surface, and the inner curved surface faces the molded base.

[0028] According to an embodiment of the present invention, the molded base is integrally formed on the substrate by a molding process, wherein the molded base is manufactured by the following steps:

[0029] Placing the substrate and the photosensitive element in a processing space of a mold, wherein the mold includes an upper mold, a lower mold and a molding film;

[0030] The upper mold and the lower mold are combined to form a molding space between the molding film and the substrate, wherein an isolation block of the upper mold squeezes the molding film to produce an inner extension, and the molding space is squeezed outward from the isolation block through the inner extension;

[0031] Adding molding material into the molding space, and curing and molding the molding material in the molding space, wherein the inner wall of the molding base is molded on the outer side of the inner extension; and

[0032] Demolding to mold the molded base on the substrate.

[0033] According to an embodiment of the present invention, the included angle between the inner side surface of the inner wall of the base and the substrate is less than or equal to 90°, so that the inner draft angle of the molded base during demolding is greater than or equal to 90°.

[0034] According to an embodiment of the present invention, the roughness of the inner arc surface is greater than the roughness of the inner side surface.

[0035] According to one embodiment of the present invention, the outer wall of the molding base has an outer side surface and an outer arc surface, wherein the outer side surface extends downward and obliquely inward from the molding upper end surface to the outer arc surface, and the outer arc surface extends upward and obliquely inward from the molding lower end surface of the molding base to the outer side surface.

[0036] According to an embodiment of the present invention, the molded base is integrally formed on the substrate by a molding process, wherein the molded base is manufactured by the following steps:

[0037] Placing the substrate and the photosensitive element in a processing space of a mold, wherein the mold includes an upper mold, a lower mold and a molding film;

[0038] The upper mold and the lower mold are combined to form a molding space between the molding film and the substrate, wherein a pressing block of the upper mold presses the molding film to produce an extension, and the molding space is pressed inward from the pressing block by the extension;

[0039] Adding molding material into the molding space, and curing and molding the molding material in the molding space, wherein the base outer wall of the molding base is molded on the inner side of the extension portion; and

[0040] Demolding to mold the molded base on the substrate.

[0041] According to an embodiment of the present invention, the included angle between the outer side surface of the outer wall of the base and the substrate is less than or equal to 90°, so that the outer draft angle of the molded base during demolding is greater than or equal to 90°.

[0042] According to an embodiment of the present invention, the circuit board assembly further comprises a photosensitive element, wherein the photosensitive element is electrically connected to the substrate, and the photosensitive element is integrally fixed to the substrate by the molded base.

[0043] According to an embodiment of the present invention, the circuit board assembly further comprises a photosensitive element, the photosensitive element is electrically connected to the substrate, and the molded base is integrally disposed on the outer side of the photosensitive element.

[0044] According to one embodiment of the present invention, the photosensitive element includes a photosensitive portion and at least one non-photosensitive portion, wherein the non-photosensitive portion is located on the outside of the photosensitive portion, wherein the non-photosensitive portion is electrically connected to the substrate, wherein the molded base covers the non-photosensitive portion of the photosensitive element, and the photosensitive element is fixed to the substrate by the molded base.

[0045] According to one embodiment of the present invention, the substrate further has a substrate upper surface and a substrate lower surface corresponding to the substrate upper surface, wherein the photosensitive element is attached to the substrate upper surface, and wherein the molding base is integrally formed on the substrate upper surface.

[0046] According to an embodiment of the present invention, the circuit board assembly further includes a group of leads, wherein the leads electrically connect the non-photosensitive portion of the photosensitive element to the substrate, and the leads are embedded above the substrate by the molded base.

[0047] According to an embodiment of the present invention, the circuit board assembly further comprises at least one electronic device, wherein the electronic device is disposed in the edge region of the substrate, wherein the mold base embeds the electronic device in the substrate.

[0048] According to one embodiment of the present invention, the substrate is further provided with a bonding area and an edge area, wherein the photosensitive element is attached to the bonding area, and the edge area is located at the periphery of the bonding area, wherein the photosensitive element is attached to the substrate in a manner close to one side of the substrate, so that the edge area of ​​the substrate forms at least one narrow edge and at least one load edge, wherein the width of the narrow edge is smaller than the width of the load edge.

[0049] According to an embodiment of the present invention, the circuit board assembly further comprises at least one electronic device, wherein the electronic device is disposed on the load side of the substrate, wherein the molded base embeds the electronic device in the substrate.

[0050] According to another aspect of the present invention, the present invention further provides a camera module, comprising:

[0051] A circuit board assembly as described above;

[0052] a lens, wherein the lens is held above the photosensitive element along a light sensing path of the photosensitive element; and

[0053] At least one filter element, wherein the filter element is held between the lens and the photosensitive element.

[0054] According to one embodiment of the present invention, the camera module further includes a driving device, wherein the driving device is disposed above the molded base, the lens is mounted on the driving device, and the movement of the lens is driven by the driving device.

[0055] According to an embodiment of the present invention, the filter element is disposed above the mold base of the circuit board assembly, and the filter element is supported by the mold base.

[0056] According to one embodiment of the present invention, the camera module further includes a lens mount, wherein the lens mount is disposed between the driving device and the molding base, wherein the filter element is disposed on the lens mount and supported by the lens mount.

[0057] According to another aspect of the present invention, the present invention further provides an electronic device, comprising:

[0058] an electronic device body; and

[0059] The camera module as described above, wherein the camera module is mounted on the upper end of the electronic device body.

[0060] According to another aspect of the present invention, the present invention further provides a method for manufacturing a circuit board assembly, wherein the manufacturing method comprises the following steps:

[0061] (a) placing a substrate and at least one photosensitive element in a processing space of a mold, wherein the mold comprises an upper mold, a lower mold and a molding film, wherein the processing space is formed in the upper mold and the lower mold;

[0062] (b) closing the upper mold and the lower mold to form a molding space between the molding film and the substrate, and squeezing the molding film to deform, thereby squeezing the molding space through the molding film;

[0063] (c) adding a molding material into the molding space, and curing the molding material in the molding space;

[0064] as well as

[0065] (d) demolding the upper mold and the lower mold to mold a molded base on the substrate.

[0066] According to an embodiment of the present invention, in the step (a) of the above method, the photosensitive element is attached to the upper surface of the substrate, and a set of leads are provided to electrically connect the photosensitive element to the substrate via the leads.

[0067] According to an embodiment of the present invention, before step (b) of the above method, the method further includes the step of extracting air between the molding film and the upper mold by vacuuming to adhere the molding film to the lower surface of the upper mold.

[0068] According to one embodiment of the present invention, in the step (b) of the above-mentioned manufacturing method, an isolation block of the upper mold squeezes the molding film onto the photosensitive element, wherein the molding film is squeezed to form an inner extension portion, wherein the inner extension portion squeezes the molding space outward from the isolation block so that the inner draft angle of the molding base is greater than or equal to 90°.

[0069] According to an embodiment of the present invention, in the step (c) of the manufacturing method, the molding material is formed on the outer side of the inner extension portion and solidified to form an inner wall of the molding base.

[0070] According to one embodiment of the present invention, in the step (c) of the above-mentioned manufacturing method, the molding material fills the molding space, wherein the inner wall of the molding base is molded on the outer side of the inner extension portion, and the inner side surface and inner arc surface of the inner wall of the base are formed by the inner extension portion.

[0071] According to one embodiment of the present invention, in the step (b) of the above-mentioned manufacturing method, a pressing block of the upper mold extrude the molding film onto the substrate, wherein the molding film is extruded to form an extension portion, wherein the extension portion extrude the molding space inward from the isolation block so that the outer draft angle of the molding base is greater than or equal to 90°.

[0072] According to an embodiment of the present invention, in the step (c) of the above manufacturing method, the molding material is formed on the inner side of the extension portion and solidified to form an outer wall of the molding base.

[0073] According to one embodiment of the present invention, in the step (c) of the above-mentioned manufacturing method, the molding material fills the molding space, wherein the base outer wall of the molding base is molded on the inner side of the extension portion, and the outer side surface and outer arc surface of the base outer wall are formed by the extension portion.

[0074] According to one embodiment of the present invention, step (d) of the above method further includes: pulling the upper mold of the mold to release the pressure of the upper mold on the shaping film, wherein the shaping film returns to its initial state under the action of elasticity.

[0075] Further objects and advantages of the present invention will be fully apparent from an understanding of the following description and the accompanying drawings.

[0076] These and other objects, features and advantages of the present invention will be more fully understood from the following detailed description, accompanying drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0077] Figure 1 It is a three-dimensional schematic diagram of an electronic device according to a first preferred embodiment of the present invention.

[0078] Figure 2 It is an overall schematic diagram of a camera module of the electronic device according to the above preferred embodiment of the present invention.

[0079] Figure 3It is a schematic diagram of the decomposition of the camera module according to the above preferred embodiment of the present invention.

[0080] Figure 4 It is a stereoscopic cross-sectional view of the camera module according to the above preferred embodiment of the present invention.

[0081] Figure 5A It is a three-dimensional schematic diagram of a circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0082] Figure 5B It is a three-dimensional cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0083] Figure 5C It is a three-dimensional schematic diagram of a circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0084] Figure 5D It is a three-dimensional cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0085] Fig. 6A It is a three-dimensional schematic diagram of another circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0086] Figure 6B It is a three-dimensional cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0087] Figure 6C It is a three-dimensional schematic diagram of another circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0088] Fig.6D It is a three-dimensional cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0089] Fig. 7A It is a three-dimensional cross-sectional view of another circuit board component of the camera module according to the above preferred embodiment of the present invention.

[0090] Figure 7B It is a schematic diagram of an optional implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0091] Figure 7C It is a schematic diagram of another optional implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0092] Fig.7D It is a schematic diagram of another optional implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0093] Fig. 7E It is a schematic diagram of another optional implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0094] Figure 8 It is an overall schematic diagram of another camera module of the electronic device according to the above preferred embodiment of the present invention.

[0095] Fig. 9 It is a schematic diagram of the decomposition of a camera module according to the camera module of the above preferred embodiment of the present invention.

[0096] Fig.10 It is a stereoscopic cross-sectional view of the camera module according to the above preferred embodiment of the present invention.

[0097] FIG. 11A to FIG. 11G It is a schematic diagram of the steps of the manufacturing process of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0098] FIG. 12A to FIG. 12F It is a schematic diagram of the steps of another manufacturing process of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0099] Fig.13A It is a schematic diagram of a modified implementation of another circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0100] Fig. 13B It is a schematic diagram of the molding of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0101] Fig.14 It is a cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0102] Fig.15 It is a schematic diagram of a modified implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0103] Fig.16 It is a schematic diagram of another variant implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0104] Fig.17 It is a schematic diagram of another variant implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0105] Fig.18 It is a three-dimensional cross-sectional view of a camera module according to the second preferred embodiment of the present invention.

[0106] Fig.19A It is a schematic diagram of the manufacturing process of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

[0107] Fig.19B It is a schematic diagram of manufacturing the circuit board assembly of the camera module according to the above preferred embodiment of the present invention. DETAILED DESCRIPTION

[0108] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0109] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0110] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0111] Referring to the accompanying drawings of the present invention Figure 1As shown, an electronic device according to the first preferred embodiment of the present invention is explained in the following description. The electronic device includes at least one camera module 100 and an electronic device body 200 equipped with the at least one camera module 100, wherein the electronic device body 200 controls the camera module 100 to shoot images. For example, the camera module 100 can be installed on the electronic device body 200 in a manner facing the front of the electronic device body 200, and the camera module 100 assists the electronic device body 200 in assisting in shooting the image information in front of the electronic device. In short, the camera module 100 is used as a front camera device of the electronic device. It can be understood that in this preferred embodiment of the present invention, the way in which the camera module 100 is installed on the electronic device body 200 is merely exemplary and not restrictive. Therefore, the at least one camera module 100 can also be installed on the electronic device body 200 in a manner facing the back of the electronic device body 200, that is, the camera module 200 serves as a rear camera device of the electronic device to capture image information behind the electronic device.

[0112] For example, the electronic device can be implemented as a smart phone. In the drawings of the specification of the present invention, the camera device in the electronic device is shown in the form of a single camera, and in other embodiments, the camera module can also be implemented as an array camera module, such as a dual-camera module, a triple-camera module or other multi-camera modules. In addition, the type of the electronic device is only used as an example. The drawings of the specification of the present invention take mobile phone devices as an example, but are not limited to smart phone devices. The electronic device can also be implemented as other electronic devices with shooting functions, such as tablet computers, smart home electronic devices, and other types of electronic devices.

[0113] Referring to the accompanying drawings of the present invention Figures 2 to 7B As shown, the camera module 100 of the electronic device according to the above preferred embodiment of the present invention is explained in the following description. The camera module 100 includes at least one circuit board assembly 10 and at least one lens 20, wherein the lens 20 is maintained above the circuit board assembly 10 along the photosensitive path of the camera module 100, and light is received to the circuit board assembly 10 through the lens 20, so that the circuit board assembly 10 receives the light and converts the optical signal of the light into an electrical signal. The circuit board assembly 10 includes a substrate 11, a molded base 12, and a photosensitive element 130, wherein the photosensitive element 130 is disposed on the substrate 11, and the molded base 12 is formed on the substrate 11 in an integrally molded manner, wherein the photosensitive element 130 is fixed to the substrate 11 by the molded base 12.

[0114] The photosensitive element 130 is electrically connected to the substrate 11 of the circuit board assembly 10, and the electrical signal generated by the photosensitive element 130 is transmitted to the electronic device body 200 via the substrate 11. Accordingly, when the camera module 100 is mounted on the electronic device body 200, the circuit board assembly 10 of the camera module 100 is communicatively connected to the electronic device body 200.

[0115] In the present invention, the circuit board assembly 10 is formed by molding the molded base 12 integrally on the substrate 11. The camera module 100 further includes at least one filter element 40, wherein the filter element 40 is disposed between the photosensitive element 130 and the lens 20, wherein the filter element 40 filters stray light transmitted from the lens 20 to the photosensitive element 130, which helps to improve the imaging quality of the camera module 100.

[0116] like Figures 2 to 4 As shown, the lens 20 is an optical system element of the camera module 100, wherein the lens 20 includes at least one optical lens 21 and at least one lens barrel 22, wherein the optical lens 21 is arranged on the lens barrel 22 based on the optical axis of the camera module. Preferably, in this preferred embodiment of the present invention, the number of the optical lenses 21 of the lens 20 is multiple, wherein the optical lenses 21 are arranged on the lens barrel 22 based on the direction of the optical axis. The lens barrel 22 keeps the optical lens 21 of the lens 20 above the light sensing path of the photosensitive element 130.

[0117] In the first preferred embodiment of the present invention, the filter element 40 of the camera module 100 is disposed on the molded base 12 of the circuit board assembly 10, and the filter element 40 is held by the molded base 12. Preferably, in the first preferred embodiment of the present invention, the filter element 40 is attached to the top of the molded base 12 in an attached manner. It is worth mentioning that the manner in which the filter element 40 is installed in the present invention is merely exemplary and not restrictive. Therefore, the filter element 40 can also be disposed on the molded base 12 by other installation methods, such as installing the filter element 40 on the molded base 12 by a mounting bracket, and fixing the position of the filter element 40 by the mounting bracket; or the filter element 40 is disposed on a bracket, and the bracket is disposed above the photosensitive element 130.

[0118] like Figures 2 to 4As shown, the camera module 100 further includes a driving device 50, wherein the at least one lens 20 is disposed on the driving device 50, and the driving device 50 keeps the lens 20 above the photosensitive element 130 based on the light sensing path. The driving device 50 is disposed on the molded base 12 of the circuit board assembly 10, wherein the driving device 50 is supported by the molded base 12 to drive the lens 20 to move. The driving device 50 can be attached to the top of the molded base 12 by gluing. The lens barrel 22 of the lens 20 is drivably disposed on the driving device 50, wherein the driving device 50 drives the lens barrel 22 to move.

[0119] Those skilled in the art may understand that the driving device 50 of the camera module 100 may be, but is not limited to, a motor, such as a voice coil motor, wherein the driving device 50 drives the lens 20 to move above the photosensitive path of the photosensitive element 130 .

[0120] It is worth mentioning that in the first preferred embodiment of the present invention, the driving device 50 and the filter element 40 are attached or glued to the upper surface of the mold base 12. Therefore, the upper surface of the mold base 12 of the circuit board assembly 10 needs to reserve a sufficiently large attachment surface for the driving device 50 and the filter element 40 to be attached.

[0121] like Figures 2 to 4 As shown, the molded base 12 is integrally formed on the substrate 11 through a molding process, wherein the molding material forming the molded base 12 is wrapped around the substrate 11. It is understandable that, since the molding material is integrally formed on the surface of the substrate 11, the size of the surface area of ​​the substrate 11 must be at least greater than or equal to the size of the bottom of the molded base 12, so that the substrate 11 is sufficient to support the molding of the molding material. It is understandable to those skilled in the art that when the size of the lower portion of the molded base 12 is reduced, the size of the substrate 11 corresponding to the lower portion of the molded base 12 can be reduced, thereby reducing the overall size of the circuit board assembly 10 while being sufficient to support the molded base 12.

[0122] It is worth mentioning that, in the preferred embodiment of the present invention, the molding base 12 fixes the photosensitive element 130 on the substrate 11 through a molding process.

[0123] The mold base 12 includes a base upper end 121 and a base lower end 122, wherein the base upper end 121 integrally extends upward from the base lower end 122, and the base lower end 122 is integrally attached to the upper surface of the substrate 11. Preferably, the mold base 12 is a structure that is larger at the top and smaller at the bottom, wherein the size of the base upper end 121 of the mold base 12 is larger than the size of the base lower end 122. In short, the mold base 12 is a structure that is larger at the top and smaller at the bottom, wherein the size of the lower portion of the mold base 12 is smaller, so as to reduce the overall width of the circuit board assembly 10. Preferably, the size of the base upper end 121 of the mold base 12 is larger than the size of the base lower end 122, so that the base upper end 121 of the mold base 12 has enough space for the drive device 50 and the filter element 40 to be attached to the base upper end 121. In other words, the structural dimensions of the upper end portion 121 of the base are larger than those of the lower end portion 122 of the base. When the size of the lower end portion 122 of the base is reduced in order to reduce the width dimension of the substrate 11 of the circuit board assembly 10, the upper end portion 121 of the molded base 12 still has sufficient space for subsequent processing processes, such as AA process and HA process.

[0124] The molded base 12 further has a molded upper end surface 123 and a molded lower end surface 124, wherein the molded upper end surface 123 is located on the upper surface of the molded base 12, that is, the upper surface of the base upper end 121; wherein the molded lower end surface 124 is formed on the lower surface of the molded base 12, that is, the lower surface of the base lower end 122. It can be understood that the molded lower end surface 124 is integrally formed on the upper surface of the base 11 by the molding material through a molding process, or the molded lower end surface 124 is integrally attached to the upper surface of the base 11 face to face through a molding process.

[0125] It is worth mentioning that the molding upper end surface 123 is a smooth surface formed on the upper surface of the molding base 12 , so that a glue layer can be coated on the molding upper end surface 123 and a uniform supporting force can be provided to the supported object.

[0126] Preferably, the size and area of ​​the molded upper end surface 123 are larger than the size and area of ​​the molded lower end surface 124, so that the molded upper end surface 123 of the molded base 12 can provide enough space for the filter element 40 and the drive device 50, thereby meeting the processing requirements of the molded base 12. It can be understood that, when the size of the molded upper end surface 123 of the molded base 12 meets the requirements of subsequent processing (such as AA process or HA process), the size of the molded lower end surface 124 of the molded base 12 is smaller than the size of the molded lower end surface 123, so as to reduce the width of the substrate 11 of the circuit board assembly 10, thereby reducing the overall size of the circuit board assembly 10. In other words, when the size of the molded upper end surface 123 of the molded base 12 remains unchanged, the size of the molded lower end surface 124 is reduced by reducing the size of the base lower end portion 122 of the molded base 12, thereby facilitating reducing the width size of the substrate 11 of the circuit board assembly 10.

[0127] It can be understood by those skilled in the art that the size of the substrate 11 of the circuit board assembly 10 is the main factor that restricts the overall width of the camera module 100. Therefore, when the width of the substrate 11 of the circuit board assembly 10 is reduced, it is beneficial to reduce the overall size of the camera module 100. When the size of the camera module 100 is reduced and the camera module 100 is installed in the electronic device body 200, the ratio of the camera module 100 to the electronic device body 200 can be reduced, which is beneficial to improve the screen-to-body ratio of the electronic device.

[0128] When the size and area of ​​the molded lower end surface 124 of the molded base 12 remain unchanged, the base upper end portion 121 of the molded base 12 can be enlarged, and the area of ​​the molded upper end surface 123 is increased, thereby increasing the size of the contact surface between the driving device 50 and the filter element 40 and the circuit board assembly 10, making it easier to draw glue on the molded upper end surface 123 of the molded base 12, and increasing the glue drawing width. It can be understood by those skilled in the art that when the camera module 100 is assembled, the space reserved for the AA process and the HA process is very small. By increasing the size of the molded upper end surface 123 of the molded base 12, the processing space reserved for the AA process or the HA process can be increased, thereby helping to improve the yield of the AA process.

[0129] The mold base 12 of the circuit board assembly 10 further includes a base inner wall 125 and a base outer wall 126, wherein the base inner wall 125 is formed on the inner inner wall of the mold base 12, and the base outer wall 126 is formed on the outer outer wall of the mold base 12. It can be understood that the base inner wall 125 and the base outer wall 126 of the mold base 12 are formed on the inner and outer sides of the mold base 12 after demolding through a molding process. Preferably, in the first preferred embodiment of the present invention, the base inner wall 125 of the mold base 12 is an inclined surface formed on the mold base 12 and inclined outward from top to bottom. In other words, the inner surface of the molded base 12 is inclined downward toward the substrate 11 of the circuit board assembly 10, wherein the projection of the base inner wall 125 in the vertical direction is covered by the projection of the molded upper end surface 124 in the vertical direction, that is, along the light-sensitive path direction of the camera module 100, the projection of the base inner wall 125 is covered by the projection of the molded upper end surface 124.

[0130] Preferably, the base inner wall 125 and the base outer wall 126 of the molding base 12 are planes formed on the inner and outer sides of the molding base 12, or curved surfaces with a certain curvature, or arc surfaces with irregular shapes. Therefore, in the present invention, the shape, curvature and smoothness of the base inner wall 125 and the base outer wall 126 are not limited here.

[0131] It can be understood by those skilled in the art that when external stray light is transmitted to the circuit board assembly 10 through the lens 20 of the camera module 100, the molded base 12 of the circuit board assembly 10 can reduce the stray light from entering the photosensitive element 130 by reflection, thereby effectively reducing the influence of stray light on the imaging of the camera module 100 and improving the imaging performance of the camera module 100. The base inner wall 125 of the molded base 12 faces the substrate 11 of the circuit board assembly 10, thereby preventing stray light from being irradiated on the base inner wall 125 and then reflected to the photosensitive element 130. In short, the molded base 12 has the base inner wall 12 that is tilted inward and downward, which reduces the stray light reflected to the photosensitive element 130 by the base inner wall 12 of the molded base 12, thereby improving the imaging quality of the camera module 100.

[0132] Preferably, in this preferred embodiment of the present invention, the base inner wall 125 of the mold base 12 is a rough surface formed on the inner side of the mold base, wherein the roughness of the base inner wall 125 of the mold base 12 is greater than the roughness of the upper surface of the mold base 12. In other words, the base inner wall 125 of the mold base 12 is a non-smooth surface to reduce the reflection effect of the base inner wall 125 on light, which is beneficial to reduce the stray light reflected by the base inner wall 125.

[0133] Each of the base inner walls 125 of the molding base 12 has an inner side surface 1251 and an inner arc surface 1252 formed by the inner side surface 1251 extending downwardly as a whole, wherein the inner side surface 1251 extends downwardly and obliquely outwardly from the inner side edge of the molding upper end surface 123 of the molding base 12 to the inner arc surface 1252. The inner arc surface 1252 extends upwardly and obliquely outwardly from the molding lower end surface 124 of the molding base 12 to the inner side surface 1251. It is worth mentioning that the inner side surface 1251 of the base inner wall 125 of the molding base 12 can also be a vertical surface perpendicular to the molding upper end surface 123, that is, the inner side surface 1251 is perpendicular to the molding upper end surface 123. Preferably, the inner side surface 1251 of the base inner wall 125 is an inclined plane of the base inner wall 125. The opening of the inner arc surface 1252 faces the inner side of the mold base 12. The inner arc surface 1252 of the base inner wall 125 is a rough surface formed at the lower end of the base inner wall 125, wherein the inner arc surface 1252 of the base inner wall 125 is formed at the lower inner side of the mold base 12. It can be understood that the inner arc surface 1252 in the form of a rough surface can reduce the reflection effect on light, so that the inner arc surface 1252 can reduce the stray light reflected to the photosensitive element 130, which is beneficial to improve the imaging performance of the camera module 100.

[0134] Preferably, in the first preferred embodiment of the present invention, the base outer wall 126 of the molded base 12 is an inclined surface formed on the base 12 and tilted inward from top to bottom, wherein the projection of the base outer wall 126 in the vertical direction is covered by the projection of the molded upper end surface 124 in the vertical direction, that is, along the light sensing path direction of the camera module 100, the projection of the base outer wall 126 is covered by the molded upper end surface 124. In short, the molded base 12 is a structure that is larger at the top and smaller at the bottom, wherein the base outer wall 126 of the molded base 12 is tilted downward toward the substrate 11 of the circuit board assembly 10. The base upper end 121 of the molded base 12 extends inward from top to bottom to the base lower end 122 of the molded base 12, and the size of the base lower end 122 of the molded base 12 is smaller than the size of the base upper end 121. The base lower end portion 122 of the mold base 12 is reduced in size so as to reduce the width dimension of the substrate 11 of the circuit board assembly 10 .

[0135] Each of the base outer walls 126 of the molding base 12 has an outer side surface 1261 and an outer arc surface 1262, wherein the outer side surface 1261 extends downward and obliquely inward from the outer side edge of the molding upper end surface 123 of the molding base 12 to the outer arc surface 1262. The outer arc surface 1262 extends upward and obliquely inward from the molding lower end surface 124 of the molding base 12 to the outer side surface 1261. It is worth mentioning that the outer side surface 1261 of the base outer wall 126 of the molding base 12 can also be a vertical plane perpendicular to the molding upper end surface 123, that is, the outer side surface 1261 is perpendicular to the molding upper end surface 123. Preferably, the outer side surface 1261 of the base outer wall 126 is an inclined plane of the base outer wall 126. The opening of the outer arc surface 1262 faces the outside of the molding base 12, or faces the substrate 11. The outer arc surface 1262 of the base outer wall 126 is formed on the outside of the lower part of the molding base 12, wherein the outer arc surface 1262 of the base outer wall 126 is concave from the outside to the inside to reduce the size of the base lower end portion 122 of the molding base 12.

[0136] In the first preferred embodiment of the present invention, the driving device 50 of the camera module 100 is set on the molded base 12 of the circuit board assembly 10 by gluing. The camera module 100 further includes a base glue layer 60, wherein the base glue layer 60 is formed on the base upper end surface 123 of the molded base 12 by painting glue. It can be understood that the base glue layer 60 can also be implemented as being formed on the bottom of the driving device 50 by painting glue.

[0137] like Figures 2 to 5A As shown, the mold base 12 is further provided with a glue drawing area 127, wherein the glue drawing area 127 is located at the base upper end surface 123 of the mold base 12. The colloid is glued to the glue drawing area 127, and the base glue layer 60 is formed above the glue drawing area 127. It can be understood that the formation of the base glue layer 60 can be not limited to solid colloid materials and fluid colloid materials. When the base lower end 122 of the mold base 12 is reduced, or when the size of the base lower end 122 is kept unchanged, the base upper end 121 of the mold base 12 can be enlarged to increase the size of the base upper end surface 123 of the mold base 12, thereby facilitating the increase of the width of the glue drawing area 127, so as to increase the width of the base glue layer 60 of the camera module 100. Those skilled in the art will appreciate that increasing the width of the glue area 127 of the molded base 12 to increase the width of the base glue layer 60 of the camera module 100 facilitates the attachment of the molded base 12 to the drive device 50 and improves the attachment reliability.

[0138] like Figures 2 to 4 As shown, the circuit board assembly 10 of the camera module 100 further includes a group of leads 13, wherein the leads 13 connect the photosensitive element 130 to the substrate 11. The substrate 11 of the circuit board assembly 10 is connected to the photosensitive element 130 through the leads 13, so that the photosensitive element 130 transmits an electrical signal to the substrate 11 of the circuit board assembly 10 through the leads 13.

[0139] Preferably, in the first preferred embodiment of the present invention, the lead 13 and the photosensitive element 130 of the circuit board assembly 10 of the camera module 100 are embedded in the mold base 12 to reduce the width of the camera module 100. In other embodiments, the mold base 12 is integrally formed on the substrate 11 in a manner of winding around the outside of the photosensitive element 130 and the lead 13.

[0140] It can be understood by those skilled in the art that the lead 13 of the circuit board assembly 10 is embedded in the mold base 12, and the mold base 12 further fixes the photosensitive element 130 to the substrate 11. The lead 13 and part of the photosensitive element 130 are embedded in the mold base 12, so as to reduce the size of the substrate 11 of the circuit board assembly 10 and improve the utilization rate of the photosensitive element 130.

[0141] Furthermore, the circuit board assembly 10 further has a light window 14, wherein the light window 14 is formed on the inner side of the molded base 12 through a molding process. The lens 20 transmits light to the photosensitive element 130 through the light window 14. It can be understood that the light window 14 is defined by the base inner wall 125 of the molded base 12. Preferably, the opening size of the light window 14 should be adapted to the photosensitive element 130 so that the light entering the module can be received by the photosensitive element 130. According to the first preferred embodiment of the present invention, the size of the upper opening of the light window 14 of the photosensitive element 130 is less than or equal to the size of the lower opening of the light window 14, wherein the upper opening of the light window 14 limits the light transmittance of the camera module 100. The upper opening of the light window 14 can limit the entry of some external stray light. At the same time, the inner wall 125 of the base faces the substrate 11 of the circuit board assembly 10. The entering light will not be reflected by the inner wall 125 of the base, thereby avoiding the generation of stray light, thereby improving the imaging quality of the camera module 100.

[0142] like Figures 2 to 4 As shown, the photosensitive element 130 further includes a photosensitive portion 31 and a non-photosensitive portion 32, wherein the non-photosensitive portion 32 integrally extends outward from the photosensitive portion 31. The photosensitive portion 31 receives the light transmitted by the lens 20 and converts the light signal into a corresponding electrical signal. The lead 13 connects the non-photosensitive portion 32 of the photosensitive element 130 to the substrate 11 of the circuit board assembly 10, so that the photosensitive element 130 transmits the photoelectric conversion signal to the substrate 11 through the lead 13. Preferably, in the first preferred embodiment of the present invention, the light window 14 corresponds to the photosensitive portion 31 of the photosensitive element 130. Accordingly, the non-photosensitive portion 31 of the photosensitive element 130 is embedded in the molded base of the circuit board assembly 10. The molded base 12 fixes the photosensitive element 130 on the upper surface of the substrate 11.

[0143] The lower surface of the photosensitive element 130 is attached to the upper surface of the substrate 11, wherein the upper surface of the photosensitive element 130 has a photosensitive area 33 and a non-photosensitive area 34, wherein the non-photosensitive area 33 is located at the upper end surface of the photosensitive portion 31, and the non-photosensitive area 34 is located at the upper end surface of the non-photosensitive portion 32 and the edge portion of the upper end surface of the photosensitive portion 31. Specifically, the size of the photosensitive area 33 of the photosensitive unit 30 corresponds to the size of the upper opening (aperture) of the light window 14, and the portion of the upper surface of the photosensitive element covered by the mold base 12 corresponds to the non-photosensitive area 34 of the photosensitive element 130. The photosensitive area 33 of the photosensitive element 130 receives the light transmitted by the lens 20 based on the light window 14.

[0144] like Figures 2 to 4 As shown, the circuit board assembly 10 further includes at least one electronic device 15, wherein the electronic device 15 is disposed on the surface of the substrate 11. Preferably, the at least one electronic device 15 is attached to the edge of the substrate 11, and the electronic device 15 is embedded in the upper surface of the substrate 11 by the molded base 12. The electronic device 15 of the circuit board assembly 10 is covered by the molded base 12, and the electronic device 15 is isolated by the molded base 12, so as to protect the electronic device 15 of the circuit board assembly and avoid oxidation due to long-term contact with the environment.

[0145] The substrate 11 has a substrate upper surface 111 and a substrate lower surface 112 corresponding to the substrate upper surface 111, wherein the photosensitive element 130 and the electronic device 15 are attached to the substrate upper surface 111. The mold base 12 is integrally formed on the upper surface 111 of the substrate 11, wherein the width dimension of the substrate upper surface 111 of the substrate 11 is greater than or equal to the width dimension of the mold base 12. When the width dimension of the mold base 12 can be reduced, the dimension of the substrate 11 corresponding to the lower end of the mold base 12 can be correspondingly reduced, thereby reducing the width dimension of the circuit board assembly 10, which is conducive to reducing the overall size of the camera module 100.

[0146] The substrate 11 is further provided with a bonding area 113 and an edge area 114, wherein the photosensitive element 130 is attached to the bonding area 113 of the substrate 11, and the edge area 114 is located around the bonding area 113. The molded base 12 is integrally formed in the edge area 114 of the substrate 11. Preferably, the base lower end 122 of the molded base 12 covers or is embedded in the edge area 114 of the substrate 11. Optionally, the size of the edge area 114 of the substrate 11 is greater than or equal to the size of the base lower end 122 of the molded base 12. Therefore, the size of the substrate 11 of the circuit board assembly 10 can be reduced by reducing the size of the base lower end 122 of the molded base 12, thereby reducing the overall size of the camera module 100.

[0147] Referring to the accompanying drawings of the present invention FIG. 5A to FIG. 7BAs shown, several optional implementations of the circuit board assembly 10 of the above preferred embodiment of the present invention are shown. The substrate 11 of the circuit board assembly 10 is connected to the photosensitive element 20 through the lead 13, wherein the electronic device 15 is arranged on the upper surface of the substrate 11. After the electronic device 15 and the circuit board assembly 10 are arranged on the substrate 11, the substrate 11 is placed in a mold 300 for molding, and the mold base is integrally formed on the upper surface of the substrate 11 by the mold 300 in a molding process. It is worth mentioning that during the molding process of the circuit board assembly 10, the draft angle of the draft process for forming the mold base 12 is greater than or equal to 90° (including 90°), so that after the mold base 12 is formed on the substrate 11, the size of the base upper end 121 of the mold base 12 is greater than the size of the base lower end 122.

[0148] like Figure 7C , two different embodiments of the inner side surface 1251 and the inner arc surface 1252 of the base inner wall 125 of the mold base 12 are shown, wherein the inner arc surface 1252 is recessed from the inside to the outside to form a groove, wherein the inner side surface 1251 is located above the groove. In another embodiment, the inner side surface 1251 of the base inner wall 125 of the mold base 12 smoothly extends downward to the inner arc surface 1252, wherein the connection portion between the inner side surface 1251 and the inner arc surface 1252 has a smooth chamfer.

[0149] In particular, the molding base 12 formed by the molding material impacting the substrate 11 and / or the photosensitive element 130 has an inner side surface, an inner arc surface and an inclined surface formed on the base inner wall 125. The inner side surface is located above the inner arc surface, and the inclined surface is an inclined surface formed by the molding material impacting the substrate 11 or the photosensitive element 130.

[0150] It is worth mentioning that the draft angle of the draft process for forming the mold base 12 includes at least one inner draft angle and at least one outer draft angle, wherein the inclination angle and shape of the base inner wall 125 of the mold base 12 depend on the size of the inner draft angle, wherein the inclination angle and shape of the base outer wall 126 of the mold base 12 depend on the outer draft angle. In this preferred embodiment of the present invention, at least one draft angle in the molding process of the mold base 12 is greater than or equal to 90°.

[0151] like FIG. 5A to FIG. 5DAs shown, the inner draft angle of at least one side of the molded base 12 is greater than or equal to 90° (including 90°), so that the base inner wall 125 of at least one side of the molded base 12 after molding extends outwardly from top to bottom. The angle between the outer side of the molded base 12 and the substrate 11 is less than or equal to 90° (including 90°), so that the base outer wall 126 of the molded base 12 after molding is tilted inwardly from top to bottom. Preferably, the inner draft angle of each side of the molded base 12 is greater than or equal to 90° (including 90°), so that the base inner wall 125 of the molded base 12 is tilted inwardly to prevent stray light from being reflected by the base inner wall 125 and entering the photosensitive element 130.

[0152] The angle between the base inner wall 125 of the molding base 12 and the vertical direction of the molding base 12 is θ1, wherein the angle θ1 is greater than 0. It can be understood that the base inner wall of the molding base 12 extends upward from the inward direction of the molding base 12, and when the area of ​​the molding lower end surface 124 of the molding base 12 remains unchanged, the angle between the base inner wall 125 and the vertical direction of the molding base 12 is adjusted to θ1 by adjusting the inner draft angle, so as to increase the area of ​​the base upper end surface 123 of the molding base 12, thereby facilitating the subsequent AA process or HA process.

[0153] The angle between the inner wall 125 of the molding base 12 and the plane where the substrate 11 is located is α1, wherein α1 is less than or equal to 90°, and the sum of α1 and the angle θ1 is 90°. Preferably, the angle between the inner wall 125 of the molding base and the plane where the substrate 11 is located is an acute angle where α1 is less than 90°. It is understandable that the inner draft angle of the molding base 12 is 90°+θ1.

[0154] It is worth mentioning that the base inner wall 125 of the molding base 12 can be a flat surface or a curved surface formed on the inner side of the molding base 12. Figure 5C and Figure 5D As shown, the base inner wall 125 is a curved surface formed on the inner side of the molded base 12, wherein the base inner wall 125 has a certain curvature, and along the light-sensitive path direction of the camera module 100, that is, in the vertical direction of the camera module 100, the projection of the base inner wall 125 is covered by the base upper end surface 123 of the molded base 12.

[0155] Referring to the accompanying drawings of the present invention FIG. 6A to FIG. 6DAs shown, another optional implementation of the molded base 12 of the camera module 100 according to the above preferred embodiment of the present invention is explained in the following description. The molded base 12 of the camera module 100 is integrally formed on the substrate 11 of the circuit board assembly 10 through a molding process, and the outer draft angle of at least one side of the molded base 12 is greater than or equal to 90° (including 90°), so that the base outer wall 126 of at least one side of the molded base 12 after molding is tilted inward from top to bottom. The inner side of the molded molded base 12 is formed at an angle less than or equal to 90° (including 90°) with the substrate 11, so that the base outer wall 126 of the molded base 12 after molding is tilted inward from top to bottom. Preferably, the inner draft angle of each side of the molded base 12 is greater than 90° (including 90°), so that the base outer wall 126 of the molded base 12 is tilted inward from top to bottom. An included angle θ2 is formed between the base outer wall 126 of the molding base 12 and the vertical direction of the molding base 12 , wherein the included angle θ2 is greater than 0.

[0156] The angle between the outer wall 126 of the molding base 12 and the plane where the substrate 11 is located is α2, wherein α2 is less than or equal to 90°, and the sum of α2 and the angle θ2 is 90°. Preferably, the angle between the outer wall 126 of the molding base and the plane where the substrate 11 is located is an acute angle where α2 is less than 90°. It is understandable that the inner draft angle of the molding base 12 is 90°+θ2.

[0157] It is worth mentioning that the base outer wall 126 of the molding base 12 can be a flat surface or a curved surface formed on the outer side of the molding base 12. Figure 6C and Fig.6D As shown, the base outer wall 126 is a curved surface formed on the outside of the molded base 12, wherein the base outer wall 126 has a certain curvature, and along the light-sensitive path direction of the camera module 100, that is, in the vertical direction of the camera module 100, the projection of the base outer wall 126 is covered by the base upper end surface 123 of the molded base 12.

[0158] Correspondingly, when the size of the upper end portion 121 of the molded base 12 is kept unchanged and is sufficient to support and assemble the driving device 50 and the green light element 40, the lower end portion 122 of the molded base 12 extends inwardly from the upper end portion 121 of the base so that the bottom end of the molded base 12 becomes smaller, which is beneficial to reducing the size of the substrate 11 of the circuit board assembly 10, thereby facilitating reducing the overall size of the camera module.

[0159] Referring to the accompanying drawings of the present invention 7A to 7EAs shown, some other optional implementations of the molded base 12 of the camera module 100 according to the above preferred embodiment of the present invention are explained in the following description. The molded base 12 of the camera module 100 is integrally formed on the substrate 11 of the circuit board assembly 10 through a molding process, and the outer draft angle of at least one side of the molded base 12 is greater than or equal to 90° (including 90°), so that the base outer wall 126 of at least one side of the molded base 12 after molding is tilted inward from top to bottom. The draft angle of the inner side of the molded base 12 is greater than or equal to 90° (including 90°), so that the base outer wall 126 of the molded base 12 after molding is tilted outward from top to bottom. Preferably, the inner draft angle of each side of the mold base 12 is greater than 90° and the outer draft angle is greater than 90°, so that the mold base 12 after molding is a structure with a larger upper part and a smaller lower part, wherein the size of the upper end 121 of the mold base 12 is larger than the size of the lower end 122. The angle between the base inner wall 125 of the mold base 12 and the vertical direction of the mold base 12 is θ1, wherein the angle θ1 is greater than 0. The angle between the base outer wall 126 of the mold base 12 and the vertical direction of the mold base 12 is θ2, wherein the angle θ2 is greater than 0.

[0160] The angle between the inner wall 125 of the molding base 12 and the plane where the substrate 11 is located is α1, wherein α1 is less than or equal to 90°, and the sum of α1 and the angle θ1 is 90°. Preferably, the angle between the inner wall 125 of the molding base and the plane where the substrate 11 is located is an acute angle with α1 less than 90°. It is understood that the inner draft angle of the molding base 12 is 90°+θ1. The angle between the outer wall 126 of the molding base 12 and the plane where the substrate 11 is located is α2, wherein α2 is less than or equal to 90°, and the sum of α2 and the angle θ2 is 90°. Preferably, the angle between the outer wall 126 of the molding base and the plane where the substrate 11 is located is an acute angle with α2 less than 90°. It is understood that the inner draft angle of the molding base 12 is 90°+θ2.

[0161] It is worth mentioning that the base inner wall 125 of the molding base 12 can be a flat surface or a curved surface formed on the inner side of the molding base 12. Figure 7C and Fig.7D As shown, the base inner wall 125 is a curved surface formed on the inner side of the molded base 12, wherein the base inner wall 125 and the base outer wall 126 have a certain curvature, and along the light-sensitive path direction of the camera module 100, that is, in the vertical direction of the camera module 100, the projections of the base inner wall 125 and the base outer wall 126 are covered by the base upper end surface 123 of the molded base 12.

[0162] It can be understood that when the inner draft angle of the mold base 12 is greater than 90°, the inner wall of the base of the mold base 12 can reduce the external stray light from entering the photosensitive element 130, and when the outer draft angle of the mold base 12 is greater than 90°, the size of the base lower end 122 of the mold base 12 can be reduced to reduce the size of the base 11, which is beneficial to the overall size of the camera module 100. While the base lower end surface 124 of the mold base 12 is reduced, the base upper end surface 123 of the mold base 12 can be enlarged, so that the base upper end 121 of the mold base 12 is enlarged under the premise that the base lower end 122 of the mold base 12 is reduced. In short, when the inner draft angle and the outer draft angle of the molding base 122 are both greater than 90°, the size of the base lower end surface 124 of the molding base 12 becomes smaller so that the size of the molding base 12 is reduced, and the size of the base upper end surface 123 of the molding base 12 becomes larger so that the molding base 12 provides a larger processing space for subsequent processing.

[0163] Referring to the accompanying drawings of the present invention Figures 8 to 10 As shown, another optional implementation of a camera module according to the first preferred embodiment of the present invention is explained in the following description. The camera module 100 further includes a lens holder 70, wherein the lens holder 70 is disposed between the mold base 12 and the driving device 50, and the driving device 50 is fixed to the mold base 12 of the circuit board assembly 10 by the lens holder 70.

[0164] Furthermore, in this embodiment, the filter element 40 of the camera module 100 is also disposed on the lens holder 70 , wherein the lens holder 70 supports the filter element 40 to keep the filter element 40 above the photosensitive element 130 .

[0165] It can be understood that the lens holder 70 can be implemented as a supporting base, wherein the lens holder 70 further includes a lens holder body 71 and a lens holder adhesive layer 72, wherein the lens holder adhesive layer 72 is disposed above or below the lens holder 70, and the drive device 50 is fixed to the lens holder body 71 through the lens holder adhesive layer 72, or the lens holder body 71 is fixed to the mold base 12 through the lens holder adhesive layer 72. The drive device 50 is supported by the lens holder body 71 to drive the lens 20 to move.

[0166] Referring to the accompanying drawings of the present invention FIG. 11A to FIG. 11G , shows the process of manufacturing the circuit board assembly 10 of the camera module 100 of the above preferred embodiment of the present invention. Fig.11AAs shown, first, at least one substrate 11 of the circuit board assembly 10 is provided or prepared. According to the above preferred embodiment of the present invention, the upper end of the substrate 11 is attached with the photosensitive element 130. In short, the substrate 11 of the semi-finished circuit board assembly 10 is provided, wherein the lead 13 connects the photosensitive element 130 to the substrate 11.

[0167] like Fig. 11B As shown, the substrate 11 of the circuit board assembly 10 is placed in the mold 300, and the substrate 11 is fixed by the mold 300. It is worth mentioning that the mold 300 includes an upper mold 310, a lower mold 320, and further has at least one processing space 330, wherein the processing space 330 is located between the upper mold 310 and the lower mold 320. The substrate 11 is placed in the processing space 330, and when the mold is closed, the processing space 330 between the upper mold 310 and the lower mold 320 is squeezed and reduced until the upper mold 310 is attached to the upper surface of the substrate 11.

[0168] Furthermore, the mold 300 further includes a shaping film 340, wherein the shaping film 340 is disposed below the upper mold 310 of the mold 300, and when the upper mold 310 and the lower mold 320 are molded together, the shaping film 340 is attached to the upper mold 310. After the molds are molded together, the upper mold 310 of the mold 300 squeezes the shaping film 340 on the upper surface of the substrate 11, so that part of the shaping film 340 is closely attached to the substrate 11. After the mold 300 is molded together, a molding space 350 is further formed between the shaping film 340 and the substrate 11, wherein the molding material of the molding base 12 is placed in the molding space 350 to be solidified to form the molding base 12.

[0169] It is worth mentioning that the shaping film 340 of the mold 300 is elastic. When the upper mold 310 and the lower mold 320 are molded together, the upper mold 310 squeezes the shaping film 340, and the shaping film 340 is squeezed to produce elastic deformation. It can be understood that the shape profile of the shaping film 340 determines the spatial shape characteristics of the molding space 350, and the molding base 12 is obtained after the molding material is molded in the molding space 350.

[0170] It is worth mentioning that when the shaping film 340 is adsorbed below the upper mold 3100 of the mold 300, the upper mold 310 solidifies the molding base 12 in the molding space 350 through the shaping film 340. When the molding material is solidified and formed in the molding space 350, the molding material solidifies based on the lower surface of the shaping film 340 to form the molding base 12. It can be understood that the molding upper end surface 123 of the molding base 12 is formed at the upper end of the molding space 350, wherein the molding upper end surface 123 is directly opposite to the lower surface of the shaping film 340 at the upper end of the molding space 350. It is worth mentioning that the surface of the shaping film 340 is smooth, and the molding upper end surface 123 of the molding base 12 formed by the shaping film 340 is a smooth plane.

[0171] When the upper mold 310 of the mold 300 squeezes the plastic film 340 to deform, the plastic film 340 is squeezed outward by the upper mold 310 to produce plastic elastic deformation, wherein the surface of the part of the plastic film 340 protruding outward is rough, and the surface of the molding base 12 formed by the protruding part of the plastic film 340 is a rough surface.

[0172] The upper mold 310 of the mold 300 further includes at least one isolation block 311 and at least one pressing block 312, wherein the isolation block 311 and the pressing block 312 are pressed above the photosensitive element 130 and the substrate 11 to form a channel of the molding space 350. The isolation block 311 has a groove, wherein the two ends of the isolation block 311 squeeze the molding film 340, and an isolation space 360 ​​is formed between the isolation block 311 and the photosensitive element 130. The isolation block 311 is located on the inner side of the pressing block 312, wherein the isolation block 311 is correspondingly tightly fitted to the upper surface of the photosensitive element 130 to prevent the molding material from entering the isolation space 360 ​​from the molding space 350. In short, when the upper mold 310 and the lower mold 320 are molded together, the isolation block 311 is tightly fitted above the photosensitive element 130 to form the light path of the photosensitive element 130. The isolation block 311 squeezes the shaping film 340 so that the shaping film 340 is closely attached to the upper surface of the photosensitive element 130 to isolate the molding space 350 from the light path. When the upper mold 310 and the lower mold 320 are molded together, the pressing block 312 and the isolation block 311 squeeze the shaping film 340 above the substrate 11 and the photosensitive element 130 to form the molding space 350 between the shaping film 340 and the substrate 11.

[0173] Correspondingly, in the above steps, the shaping film 340 is attached to the lower surface of the upper mold 310, and the gas between the shaping film 340 and the upper mold 310 is extracted by vacuum so that the shaping film 340 is tightly attached to the upper mold 310, avoiding the presence of air between the shaping film 340 and the upper mold 310, which affects the flatness of the shaping film 340.

[0174] like Fig. 11C and Fig.11D As shown, the mold 300 is closed, wherein the upper mold 310 squeezes the shaping film 340, so that the shaping film 340 generates elastic deformation, wherein the shaping film 340 squeezes the molding space 350 in an elastically deformed manner. The isolation block 311 of the upper mold 310 squeezes the shaping film 340, so that the shaping film 340 is squeezed by the isolation block 311 and generates elastic deformation extending outward from the isolation block 311. It can be understood that the lower end of the isolation block 311 squeezes the shaping film 340, wherein the elastic deformation generated by the shaping film 340 close to the bottom end of the isolation block 311 is greater than the elastic deformation generated by the shaping film 340 at the top end of the isolation block 311. In other words, the isolation block 311 squeezes the shaping film 340 on the photosensitive element 130, so that the shaping film 340 attached to the outside of the isolation block 311 undergoes elastic deformation that gradually decreases from bottom to top, so that the shaping film 340 squeezes the molding space 350 outward from the outer wall of the isolation block 311. In short, the shaping film 340 is squeezed by the isolation block 311, so that the thickness of the lower end of the shaping film 340 attached to the outside of the isolation block 311 is greater than the thickness of the upper end of the shaping film 340.

[0175] The isolation block 311 of the upper mold 310 extrude the shaping film 340, wherein the shaping film 3400 is extruded by the isolation block 311 to form an inner extension 341, wherein the inner extension 341 is extruded and formed on the outer side of the isolation block 311, wherein the inner extension 341 extrude the molding space 350 outward from the outer side of the isolation block 311. It can be understood that the inner extension 341 forms the inner side surface 1251 and the inner arc surface 1252 of the molding base 12. It can be understood that since the inner extension 341 formed by the extrusion of the shaping film 340 has a rough outer surface at the lower part of the inner extension 341, the inner arc surface 1252 is roughened by the inner extension 341, so that the surface smoothness of the inner arc surface 1252 is reduced.

[0176] The pressing block 312 of the upper mold 310 squeezes the shaping film 340, so that the shaping film 3400 is squeezed by the isolation block 311 and generates elastic deformation extending inward from the pressing block 312. It can be understood that the lower end of the pressing block 312 squeezes the shaping film 340, wherein the elastic deformation generated by the shaping film 340 close to the bottom end of the pressing block 312 is greater than the elastic deformation generated by the shaping film 340 at the top end of the pressing block 312. In other words, the pressing block 312 squeezes the shaping film 340 on the substrate 11, so that the shaping film 340 attached to the inner side of the pressing block 312 generates an elastic deformation that gradually decreases from bottom to top, so that the shaping film 340 squeezes the molding space 350 outward from the inner wall of the pressing block 312.

[0177] The pressing block 312 of the upper mold 310 squeezes the molding film 340 to form an extension 342, wherein the extension 342 is formed below the upper mold 310 and is formed on the inner side of the pressing block 312, wherein the extension 342 squeezes the molding space 350 inward from the inner side of the pressing block 312. It can be understood that the extension 342 forms the outer side surface 1261 and the outer arc surface 1262 of the molding base 12.

[0178] The isolation block 311 of the upper mold 310 squeezes the shaping film 340, wherein the shaping film 340 is squeezed by the isolation block 311 to form an inner extension 341, and the inner extension 341 is divided into an upper inner extension and a lower inner extension, wherein the upper inner extension forms the inner side surface 1251, and the lower inner extension forms the inner arc surface 1252. It is worth mentioning that when the upper mold 210 and the lower mold 320 are molded together, the shaping film 340 on the isolation block 311 is squeezed, so that the shaping film 340 protrudes outward to form the lower inner extension. Since the lower inner extension squeezes the shaping film 340, the shaping film 340 is stacked, and the shape of the lower inner extension is not easy to be controlled, so the shape of the corresponding inner arc surface 1252 is not fixed. Secondly, the lower inner extension is formed because the shaping film 340 is elastic and is therefore extruded, and the surface of the lower inner extension is relatively rough. The upper inner extension is formed by the lower inner extension, so that the upper inner extension is subjected to a certain force, which may form an inclined surface. However, the upper inner extension remains in a taut state during the molding process, so the surface of the upper inner extension is relatively smooth. Therefore, after molding, the surface of the inner side surface 1251 is smoother than the inner arc surface 1252.

[0179] It is worth mentioning that the isolation block 311 and the pressing block 312 of the upper mold 310 squeeze the plastic film 340 to generate deformation, wherein the magnitude of the elastic deformation generated by the plastic film 340 determines the draft angle of the molding base 12. Therefore, the shape and size of the inner extension 341 and the outer extension 342 can be controlled by the thickness and elastic coefficient of the plastic film 340, and the pressure of the upper mold 311 and the plastic film 340 after mold closing, thereby determining the draft angle of the molding base 12.

[0180] When the thickness of the shaping film 340 of the present invention is H, the thickness of the inner extension 341 and the outer extension 342 generated by the upper mold 310 extruding the shaping film 340 is 1.2H to 1.5H. In other words, the lateral vertical distance between the inner arc surface 341 of the molding base 12 and the light window opening of the molding base 12 is 0.2H to 0.5H. Exemplarily, when the thickness of the shaping film 340 is 100μm, the vertical distance between the upper end surface 123 and the lower end surface 124 of the molding base 12 after molding in the direction of the optical axis is 20μm to 50μm.

[0181] like Fig.11D and Fig.11E As shown, the molding material is added to the molding space so that the molding material is molded in the molding space 350 based on the outer wall of the molding film 340. Since the molding film 340 is squeezed by the isolation block 311 of the upper mold 310 and is closely attached to the upper surface of the photosensitive element 130, when the molding material is molded in the molding space 350, the molding film 340 is squeezed by the isolation block 311 to prevent the molding material from entering the photosensitive channel of the photosensitive element 130 from the molding space 350.

[0182] like Fig.11F and Fig.11G As shown, the molding material is solidified and molded in the molding space 350 to obtain the molding base 12. When the molding base 12 is demolded from the mold 300, the upper mold 310 and / or the lower mold 320 of the mold 300 are pulled to separate the upper mold 310 from the lower mold 320. During the separation of the upper mold 310 from the lower mold 320, the pressure between the upper mold 310 and the molding film 340 is eliminated, and the molding film 340 returns to its initial state under the action of elasticity, so that the molding film 340 and the upper mold 310 are separated from the molding base 12.

[0183] Referring to the accompanying drawings of the present invention FIG. 12A to FIG. 12FAs shown, another manufacturing process of the mold base 12 of the circuit board assembly 10 according to the above preferred embodiment of the present invention is explained in the following description. Fig. 12A As shown, first, in a substrate panel composed of a plurality of substrates 11, the photosensitive element 130 is connected to the substrate 11 through a lead 13, and the electronic device 15 of the circuit board assembly 10 is arranged on the substrate 11, so that a circuit board panel is composed of a plurality of semi-finished circuit boards.

[0184] like Fig. 12B As shown, the substrate panel is placed in a mold 300, wherein the mold includes an upper mold 310 and a lower mold 320, wherein a processing space 330 is formed between the upper mold 310 and the lower mold 320, wherein the substrate panel is placed in the processing space 330. The mold 300 further includes a plastic film 340, wherein the plastic film 340 has elasticity and toughness, and the plastic film 340 is attached to the upper mold 310 of the mold 300. The air between the upper mold 310 and the plastic film 340 is extracted by vacuuming, so that the plastic film 340 is closely attached to the upper mold 310. The upper mold 310 further includes a plurality of isolation blocks 311 and a plurality of pressing blocks 312, wherein each isolation block 311 corresponds to the upper surface of the photosensitive element 130, wherein each pressing block 312 is correspondingly closely attached to the substrate 11. During the molding process, the adjacent isolation blocks 311 and the pressing blocks 312 are spaced to form at least one molding space 350, wherein the molding material is solidified and molded in the molding space 350, thereby forming the molding bases 12 of two adjacent circuit board assemblies 20. The isolation block 311 is further provided with a groove, wherein the two ends of the isolation block 311 squeeze the molding film 340, so that an isolation space 360 ​​is formed between the isolation block 311 and the photosensitive element 130, wherein the isolation space 360 ​​corresponds to the photosensitive channel of the photosensitive element 130. The isolation block 311 corresponds to the upper part of the photosensitive element 130, and the molding material in the molding space 350 is prevented from entering the isolation space 360 ​​by squeezing the molding film 340 through the pressing block 312.

[0185] like Fig. 12CAs shown, when the substrate panel is placed in the processing space 330, the upper mold 310 and the lower mold 320 of the mold 300 are molded together, and the upper mold 310 is tightly fitted above the substrate 11 and the photosensitive element 130. Each of the upper molds 310 squeezes the photosensitive element 130 and the substrate 11 through the plastic film 340, wherein the plastic film 340 is squeezed by the upper mold 310 to produce elastic deformation. The isolation block 311 of the upper mold 310 squeezes the plastic film 340, so that the plastic film 340 is squeezed by the isolation block 311 and produces elastic deformation extending outward from the isolation block 311. It can be understood that the lower end of the isolation block 311 squeezes the plastic film 340, wherein the elastic deformation generated by the plastic film 340 close to the bottom end of the isolation block 311 is greater than the elastic deformation generated by the plastic film 340 at the top of the isolation block 311. In other words, the isolation block 311 squeezes the shaping film 340 on the photosensitive element 130, so that the shaping film 340 attached to the outside of the isolation block 311 undergoes elastic deformation that gradually decreases from bottom to top, so that the shaping film 340 squeezes the molding space 350 outward from the outer wall of the isolation block 311. In short, the shaping film 340 is squeezed by the isolation block 311, so that the thickness of the lower end of the shaping film 340 attached to the outside of the isolation block 311 is greater than the thickness of the upper end of the shaping film 340.

[0186] like FIG. 12D to FIG. 12E As shown, the molding material is injected into the molding space 350, wherein the molding material is solidified in the molding space 350 to form the molding base 12. After the molding base 12 is solidified, the circuit board assembly 10 is removed from the mold 300 by demolding. It is worth mentioning that during the demolding process, the upper mold 311 and the molding film 340 are depressurized, so that the molding film 340 returns to its initial state under the action of elasticity after being depressurized, so that the upper mold 311 and the molding film 340 are separated from the molded molding base 12.

[0187] like Fig.12F As shown, after demoulding, a circuit board assembly panel consisting of circuit board assemblies connected to each other is obtained, and the circuit board assembly panel is cut by cutting to obtain each circuit board assembly 10. It is worth mentioning that after demoulding, the molded bases 12 of the adjacent circuit board assemblies 10 are connected to each other. It can be understood that the molded base 12 is cut in an inwardly inclined manner from top to bottom so that the size of the base upper end 121 of the molded base 12 is larger than the size of the base lower end 122.

[0188] Referring to the accompanying drawings of the present invention FIG. 13A to FIG. 14As shown, the modified implementation of the above preferred embodiment of the present invention is explained in the following description. The photosensitive element 130 and the electronic device 15 are attached to the substrate 11 of the circuit board assembly 10, wherein the photosensitive element 130 is attached to the substrate 11 in a manner close to one side of the substrate 11, so that the edge area 1144 of the substrate 11 has at least one narrow side 115 and at least one load side 116, wherein the width of the narrow side 115 is smaller than the width of the load side 116.

[0189] like Fig.13A , 13B As shown, the electronic device 15 is arranged in the edge area 114 close to the load edge 116, wherein the edge of the photosensitive element 130 is close to the narrow edge 115 of the substrate 11, so as to reduce the length of the substrate 11 of the circuit board assembly 10 in at least one direction. The substrate 11 with the photosensitive element 130 is placed in the mold 300, wherein the isolation block 311 and the pressing block 312 of the upper mold 310 are pressed against the photosensitive element 130 and the substrate 11 respectively. After the mold 300 is closed, the width of the channel of the molding space 350 corresponding to the narrow edge 115 is smaller than the width of the channel of the molding space 350 corresponding to the load edge 116, so that the bottom surface of at least one side of the molding base 12 obtained after molding is narrower.

[0190] like Fig.14 As shown, during the molding process, the draft angle of the molding base 12 corresponding to the narrow side 115 of the substrate 11 is greater than 90°, so that the width of the base lower end 122 of the molding base 12 molded above the narrow side 115 is smaller than the width of the base upper end 121. In short, the molding base 12 formed by molding above the narrow side 115 of the substrate 11 is a structure that is larger at the top and smaller at the bottom. Preferably, the inner draft angle and the outer draft angle of the molding base 12 corresponding to the narrow side 115 are both greater than 90°, so that the size of the base upper end surface 123 of the molding base 12 corresponding to the narrow side 115 of the substrate 11 is sufficient to support and be attached by the driving device 50.

[0191] Those skilled in the art may understand that the camera module 100 is installed on the electronic device body 200 of the electronic device, and one side of the narrow side 115 of the circuit board assembly 10 is facing the top of the electronic device body 200, so that the lens 20 of the camera module 100 is upwardly close to the top of the electronic device body 200.

[0192] It is understandable that the draft angle of the mold base 12 is greater than 90°, so as to reduce the size of the base lower end 122 of the mold base 12 and the substrate 11, thereby reducing the width of the circuit board assembly 10. Based on the reduction in size of the circuit board assembly 10, the overall lateral size of the camera module 100 can be reduced to reduce the ratio of the camera module 100 to the electronic device body 200, thereby increasing the screen-to-body ratio of the electronic device body 200.

[0193] Referring to the accompanying drawings of the present invention Fig.15 As shown, a modified implementation of the circuit board assembly 10 of the camera module 100 according to the above preferred embodiment of the present invention is explained in the following description. The circuit board assembly 10 includes at least one substrate 11, at least one molded base 12, at least one set of leads 13, and at least one electronic device 15, wherein the leads 13 connect the photosensitive element 130 to the substrate 11, and the electronic device 15 is attached to the top of the substrate 11.

[0194] It is worth mentioning that the structures of the substrate 11, the lead 13, and the electronic device 15 are the same as those of the first preferred embodiment, and the difference is that the mold base 12 is embedded in the edge area 114 of the substrate 11, and the photosensitive element 130 and the lead 13 are located on the inner side of the mold base 12. The base lower end 122 of the mold base 12 covers the edge area 114 of the substrate 11, and the lead 13 connects the photosensitive element 130 to the bonding area 113 of the substrate 11. In other words, the base lower end 122 of the mold base 12 is located on the outer side of the photosensitive element 130.

[0195] Similar to the first preferred embodiment, the draft angle of the mold base 12 is greater than 90°, so that the structural size of the upper base end portion 121 of the mold base 12 is greater than the structural size of the lower base end portion 122. The inner draft angle or the outer draft angle of at least one side of the mold base 12 is greater than 90°. Preferably, the inner draft angle and the outer draft angle of the mold base 12 are both greater than 90°, so as to reduce the size of the lower base end portion 122 of the mold base 12, thereby reducing the size of the substrate 11. The inner draft angle and the outer draft angle of the mold base 12 are both greater than 90°, increasing the size of the upper base end portion 121 of the mold base 12, so that the area of ​​the upper base end surface 123 of the mold base 12 is increased, which is convenient for attaching the drive device 50 or the mirror base 70.

[0196] Referring to the accompanying drawings of the present invention Fig.16As shown, another variant implementation of the circuit board assembly 10 of the camera module 100 according to the above preferred embodiment of the present invention is explained in the following description. The photosensitive element 130 is attached to the bottom of the substrate 11 of the circuit board assembly 10, wherein the substrate 11 is further provided with a through hole 117, wherein the photosensitive element 130 is attached to the bottom of the substrate 11 based on the through hole 117. The molded base 12 of the circuit board assembly 10 is integrally formed above the substrate 11, wherein the draft angle of at least one side of the molded base 12 is greater than 90°, so that the structural size of the upper end portion 121 of the molded base 12 is greater than the structural size of the lower end portion 122 of the base.

[0197] Different from the first preferred embodiment described above, during the molding process, the substrate 11 is placed in the mold 300 , wherein the upper mold 310 of the mold 300 squeezes the molding film 340 onto the substrate 11 so that the molding film 340 fits tightly to the substrate 11 .

[0198] Referring to the accompanying drawings of the present invention Fig.17 As shown, another variant implementation of the circuit board assembly 10 of the camera module 100 according to the above preferred embodiment of the present invention is explained in the following description. The camera module 100 is a dual-camera, triple-camera, or multi-camera camera module, wherein the circuit board assembly 10 of the camera module 100 includes at least one substrate 11, at least two molded bases 12, at least one set of leads 13, and a plurality of electronic devices 15, wherein the molded base 12 is integrally molded above the substrate 11 in a molded manner. The photosensitive element 130 is disposed above the substrate 11, and the molded base 12 is embedded above a portion of the non-photosensitive area of ​​the photosensitive element 130 and above the edge area 114 of the substrate 11.

[0199] The draft angle of at least one side of at least one mold base 12 of the circuit board assembly 10 is greater than 90°, so that the structural size of the base lower end 122 of the mold base 12 is smaller than the structural size of the base upper end 121. Preferably, the inner draft angle and the outer draft angle of the mold base 12 are both greater than 90°, and the mold base 12 of the circuit board assembly 10 is a structure with a larger upper portion and a smaller lower portion after molding, so that the width of the mold base 12 of the circuit board assembly 10 is reduced, thereby reducing the size of the substrate 11 of the circuit board assembly 10. The mold base 12 of the circuit board assembly 10 is a structure with a larger upper portion and a smaller lower portion after molding, which increases the size of the base upper end 121 of the mold base 12, thereby providing sufficient processing space for subsequent AA process or HA process.

[0200] Referring to the accompanying drawings of the present invention Figures 18 to 19B As shown, another optional implementation of a camera module 100a according to the second preferred embodiment of the present invention is explained in the following description. The camera module 100a in this preferred embodiment of the present invention can be but is not limited to a single projection module, so the camera module 100a can also be implemented as an array module composed of other camera units, such as a TOF camera module.

[0201] The camera module 100a includes a circuit board assembly 10a, at least one optical element 20a, and a projection unit 30a, wherein the projection unit 30a is disposed on the circuit board assembly 10a, and the projection unit 30a is point-connected to the circuit board assembly 10a, wherein the circuit board assembly 10a provides the power required by the projection unit 30a. The optical element 20a is held above the projection unit 30a by the circuit board assembly 10a to project the light generated by the projection element 30a outwardly.

[0202] It is worth mentioning that the projection unit 30a of the camera module 100a is implemented as a light source, which may be but is not limited to an LED light source, wherein the light generated by the projection unit 30a is diffused and emitted outwardly via the optical element 20a.

[0203] like Fig.18 As shown, the circuit board assembly 10a includes a substrate 11a and a molded base 12a, wherein the molded base 12a wraps the substrate 11a, and the projection unit 30a is disposed on the substrate 11a of the circuit board assembly 10a, and the substrate 11a provides the projection unit 30a with electrical energy. The substrate 11a further includes a substrate body 111a and at least one conductive member 112a disposed on the substrate body 111a, wherein the conductive member 112a is electrically connected to the projection unit 30a. The circuit board assembly 10a further includes at least one lead 13a, wherein the lead 13a electrically connects the conductive member 112a to the projection unit 30a.

[0204] The molded base 12a is integrally formed on the substrate 11a of the circuit board assembly 10a through a molding process, wherein the molded base 12a includes a base upper end 121a, a base lower end 122a, and a base bottom plate 123a, wherein the base upper end 121a and the base lower end 122a integrally extend upward from the base bottom plate 123a. It is worth mentioning that in this preferred embodiment of the present invention, unlike the above preferred embodiment, the molded base 12a is integrally wrapped on the substrate 11a through a molding process so as to reduce the thickness of the circuit board assembly 10a. Preferably, the base bottom plate 123a wraps the substrate 11a, and the thickness of the base bottom plate 123a is the same as the thickness of the substrate 11a.

[0205] The mold base 12a further has a support portion 124a, wherein the support portion 124a is formed at the base upper end portion 121a of the mold base 12a, and the support portion 124a supports the optical element 20a. Preferably, in this preferred embodiment of the present invention, the support portion 124a is a groove formed at the base upper end portion 121a of the mold base 12a, wherein the optical element 20a is disposed on the support portion 124a.

[0206] The molded base 12a is further provided with a base inner wall 125a and a base outer wall 126a, wherein the base inner wall 125a is formed on the inner side of the molded base 12a, and the base outer wall 126a is formed on the outer side of the molded base 12a. Preferably, the base inner wall 125a extends inwardly and upwardly from the base lower end 122a of the molded base 12a to the base upper end 121a. More preferably, the base outer wall 126a extends outwardly and upwardly from the base lower end 122a of the molded base 12a to the base upper end 121a. In other words, the size of the base lower end 122a of the molded base 12a is smaller than the size of the base upper end 121a.

[0207] like Fig.18As shown, the base inner wall 125a has an inner side surface 1251a and an inner arc surface 1252a, wherein the inner side surface 1251a extends downward and obliquely outward from the inner side edge of the molding upper end surface 123a of the molding base 12a to the inner arc surface 1252a. The inner arc surface 1252a extends upward and obliquely outward from the molding lower end surface 124a of the molding base 12a to the inner side surface 1251a. Each of the base outer walls 126a of the molding base 12a has an outer side surface 1261a and an outer arc surface 1262a, wherein the outer side surface 1261a extends downward and obliquely inward from the outer side edge of the molding upper end surface 123a of the molding base 12a to the outer arc surface 1262a. The outer arc surface 1262a extends upward and obliquely inward from the molding lower end surface 124a of the molding base 12aa to the outer side surface 1261a.

[0208] like FIG. 19A to FIG. 19B FIG. 1 shows a manufacturing method of the mold base 12a, wherein the mold base 12a is integrally formed with the substrate 11a through a molding process. The draft angle of at least one side of the mold base 12a is greater than 90°, so that the mold base 12a forms a structural feature of a certain size, so that when the optical element 20a is placed on the support portion 124a, the contact surface between the support portion 124a and the optical element 20a is large enough to ensure the installation reliability of the mold base 12a and the optical element 20a.

[0209] like Fig.19A As shown, a substrate is first processed to form a patch panel, wherein the substrate may be, but is not limited to, a metal substrate, such as a copper substrate. The patch panel is processed by etching to form the conductive member on the substrate 11a. Fig.19BAs shown, the panel is placed in a mold 300a, wherein the mold 300a includes an upper mold 310a, a lower mold 320a, and a shaping film 340a, wherein the shaping film 340a is attached to the upper mold 310a, and a processing space 330a is formed between the upper mold 310a and the lower mold 320a. The upper mold 310 includes an isolation block 311a and a pressing block 312a, wherein the isolation block 311a squeezes the shaping film 340a on the substrate 11a so that the shaping film 340a is closely attached to the substrate 11a. The pressing block 312a squeezes the shaping film 340a on the lower mold 320a so that the shaping film 340 is closely attached to the lower mold 320a. When the upper mold 310a and the lower mold 320a are molded together, the upper mold 310a squeezes the molding film into the lower mold 320a, and a molding space 350a corresponding to the molding base 12a is formed between the molding film 340a and the lower mold 320a. The molding material is injected into the molding space 350 and solidified in the molding space 350a to form the molding base 12a.

[0210] The molding material is solidified in the mold 300a to form the molding base 12a on the substrate 11a. After the molding base 12a is solidified, it is demolded to obtain the circuit board assembly 10a. It is worth mentioning that the projection unit 30a can be set on the upper surface of the substrate 11a after the molding is completed, or it can be set on the substrate 11a before the molding process. In other words, the installation order of the projection unit 30a is not limited here.

[0211] Similar to the first preferred embodiment, the draft angle of at least one side of the mold base 12a is greater than 90°, so that the size of the base lower end 122a of the mold base 12a is smaller than the size of the base upper end 121a. Preferably, the inner molding film angle and the outer draft angle of the mold base 12a are both greater than 90°, so as to reduce the size of the base lower end 122a of the mold base 12a, thereby reducing the overall size of the mold base 12a. It can be understood that the reduction in the overall size of the mold base 12a can reduce the lateral size of the camera module 100a. When the size of the base lower end 122a of the mold base 12a is reduced, the size of the base upper end 121a of the mold base 12a is increased to increase the size of the support portion 124a of the base upper end 121a, thereby increasing the contact area between the support portion 124a and the optical element 30a.

[0212] It is understood that during the molding process of the molding base 12a, the upper mold 310a of the mold 300a squeezes the plastic film 340a on the substrate 11a, so that the plastic film 340a is squeezed and elastically deformed. It is understood that when the inner side of the upper mold 310a squeezes the plastic film 340a and produces elastic deformation from the inside to the outside, the inner draft angle of the molding base 12a is greater than 90° to form the base inner wall 125a of the molding base 12a. When the outer side of the upper mold 310a squeezes the plastic film 340a and produces elastic deformation from the inside to the inside, the outer draft angle of the molding base 12a is greater than 90° to form the base outer wall 126a of the molding base 12a.

[0213] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A circuit board assembly, characterized in that: include: a substrate; and At least one molded base, wherein the molded base includes a base inner wall, a base outer wall and further has a molded upper end surface and a molded lower end surface, wherein the base inner wall forms a light window of the molded base, wherein the base inner wall is arranged to be inclined inwardly and downwardly toward the substrate, wherein the base inner wall further has an inner side surface and an inner curved surface, the inner curved surface extends from the inner side surface, and the opening of the inner curved surface faces the inner side of the molded base.

2. The circuit board assembly according to claim 1, wherein the molded base is integrally formed on the substrate by a molding process, wherein the molded base is manufactured by the following steps: Placing the substrate and the photosensitive element in a processing space of a mold, wherein the mold includes an upper mold, a lower mold and a molding film; The upper mold and the lower mold are combined to form a molding space between the molding film and the substrate, wherein an isolation block of the upper mold squeezes the molding film to produce an inner extension, and the molding space is squeezed outward from the isolation block through the inner extension; Adding molding material into the molding space and curing and molding the molding material in the molding space, wherein the inner wall of the molding base is molded on the outer side of the inner extension; and demolding to mold the molding base on the substrate.

3. The circuit board assembly according to claim 2, wherein the angle between the inner side surface of the inner wall of the base and the substrate is less than or equal to 90°, so that the inner draft angle of the molded base during demolding is greater than or equal to 90°. The circuit board assembly according to claim 1 , wherein the roughness of the inner arc surface is greater than the roughness of the inner side surface. 5 . The circuit board assembly according to claim 1 , wherein the inner arc surface contacts a photosensitive element of the circuit board assembly.

6. A camera module, characterized in that: include: The circuit board assembly according to any one of claims 1 to 5; a lens, wherein the lens is held above the photosensitive element along a light sensing path of the photosensitive element; and At least one filter element, wherein the filter element is held between the lens and the photosensitive element.

7. The camera module according to claim 6, wherein the camera module further comprises a driving device, wherein the driving device is disposed above the molded base, the lens is mounted on the driving device, and the movement of the lens is driven by the driving device.

8. The camera module according to claim 7, wherein the filter element is disposed above the molded base of the circuit board assembly, and the filter element is supported by the molded base.

9. The camera module according to claim 8, wherein the camera module further comprises a lens mount, wherein the lens mount is disposed between the driving device and the molded base, wherein the filter element is disposed on the lens mount and supported by the lens mount.

10. An electronic device, characterized in that: include: An electronic device body; and A camera module as described in at least one of claims 6 to 9, wherein the camera module is mounted on the upper end of the electronic device body.

11. A method for manufacturing a circuit board assembly, characterized in that: The steps include: (a) placing a substrate and at least one photosensitive element in a processing space of a mold, wherein the mold comprises an upper mold, a lower mold and a molding film, wherein the processing space is formed in the upper mold and the lower mold, wherein the upper mold further comprises at least one isolation block and at least one pressing block, wherein the isolation block and the pressing block are pressed above the photosensitive element and the substrate to form a channel of the molding space; (b) closing the upper mold and the lower mold to form a molding space between the molding film and the substrate, and squeezing the molding film to deform, squeezing the molding space by the molding film, wherein the molding film protrudes outward and stacks under the squeezing of the at least one isolation block to form a lower inner extension; (c) adding a molding material into the molding space, and curing the molding material in the molding space; as well as (d) demolding the upper mold and the lower mold to mold a molded base on the substrate.

12. The manufacturing method according to claim 11, wherein in the step (a) of the above method, the photosensitive element is attached to the upper surface of the substrate, and a set of leads are provided to electrically connect the photosensitive element to the substrate through the leads.

13. The manufacturing method according to claim 11, further comprising the step of extracting the air between the molding film and the upper mold by vacuuming to adhere the molding film to the lower surface of the upper mold before the step (b) of the method.

14. The manufacturing method according to claim 11, wherein in the step (b) of the above manufacturing method, the at least one isolation block of the upper mold squeezes the molding film onto the photosensitive element, wherein the molding film is squeezed to further form an upper inner extension portion, wherein the upper inner extension portion and the lower inner extension portion form an inner extension portion, wherein the inner extension portion squeezes the molding space outward from the isolation block so that the inner draft angle of the molding base is greater than or equal to 90°.

15. The manufacturing method according to claim 14, wherein in the step (c) of the manufacturing method, the molding material is formed on the outer side of the inner extension portion and solidified to form an inner wall of the molding base.

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