Camera module and electronic equipment

Abstract

The invention relates to a camera module and electronic equipment, the camera module comprises a photosensitive chip and a support, the support comprises a seat body and a metal insert, at least part of the metal insert is embedded in the support, the outer wall of the seat body is provided with an electric connection part, and the metal insert is electrically connected to the photosensitive chip and the electric connection part. According to the camera module and the electronic equipment, the electric signal of the photosensitive chip can be output through the electric connection part by utilizing the metal insert, so that a circuit board does not need to be arranged at the bottom of the photosensitive chip, the consumable cost of the circuit board can be reduced, and meanwhile, the cost of the circuit board is reduced. And the condition that the thickness is increased due to the fact that the circuit board is stacked at the bottom of the photosensitive chip in the camera module is avoided, so that the scheme of the invention is beneficial to realizing the light and thin camera module.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to camera modules and electronic equipment. Background Art

[0002] As a module that realizes the shooting function of electronic devices such as mobile phones, tablets, and smart watches, the imaging performance of the camera module directly affects the shooting experience of the electronic devices.

[0003] In the related art, the photosensitive chip of the camera module is usually electrically connected to the PCB hard board through solder or wires, the PCB hard board is connected to a bendable FPC (Flexible Printed Circuit), and the FPC is further connected to a layer of hard board.

[0004] However, this structural design not only consumes a large amount of circuit boards, which is costly, but also is not conducive to the thinness and lightness of the camera module. Summary of the invention

[0005] The present application provides a camera module and an electronic device to solve the technical problem of how to reduce the cost while achieving the thinness and lightness of the camera module.

[0006] On the one hand, the present application provides a camera module, comprising:

[0007] Photosensitive chip;

[0008] The bracket comprises a seat body and a metal insert, wherein at least a portion of the metal insert is embedded in the bracket, an outer wall of the seat body is provided with an electrical connection portion, and the metal insert is electrically connected to the photosensitive chip and the electrical connection portion.

[0009] In one embodiment, the camera module further includes an electrical connector, which is connected to the outer wall of the base, and is electrically connected to the electrical connection portion.

[0010] In one embodiment, the photosensitive chip has a photosensitive area and a non-photosensitive area located around the photosensitive area, the non-photosensitive area is provided with a plurality of first solder pads, the base body is provided with a plurality of second solder pads, the plurality of first solder pads are correspondingly welded to the plurality of second solder pads, and the plurality of second solder pads are electrically connected to the metal insert.

[0011] In one embodiment, the photosensitive chip is rectangular, and the base body includes a first frame portion, a second frame portion, a third frame portion, and a fourth frame portion arranged along the circumference of the photosensitive chip, a portion of the second solder pad is located in the first frame portion, and another portion of the second solder pad is located in the third frame portion, and a partial structure of the metal insert is embedded in the second frame portion or the fourth frame portion, and at least one of the second solder pads located in the first frame portion is electrically connected to at least one of the second solder pads located in the third frame portion.

[0012] In one embodiment, at least a portion of the photosensitive chip is accommodated in the space enclosed by the base.

[0013] In one embodiment, the base body includes a side wall portion and a raised portion, the raised portion is protruding from the inner wall of the side wall portion, a plurality of the second solder pads are arranged on the raised portion, and the orthographic projection of the raised portion on the plane where the photosensitive chip is located is located in the non-photosensitive area.

[0014] In one embodiment, the non-photosensitive area of ​​the photosensitive chip is bonded to the raised portion by glue.

[0015] In one embodiment, the camera module includes a filter connected to a side of the protrusion facing away from the photosensitive chip.

[0016] In one embodiment, the camera module further includes a reinforcing sheet, a side of the photosensitive chip facing away from the photosensitive area is stacked on the reinforcing sheet, and the reinforcing sheet is connected to the base.

[0017] In one embodiment, the camera module includes a lens assembly, and the lens assembly is arranged on the photosensitive path of the photosensitive chip and connected to the bracket.

[0018] In one embodiment, the lens assembly includes a mounting seat and a plurality of lenses, the plurality of lenses are mounted on the mounting seat, and the mounting seat is integrally formed with the bracket.

[0019] On the other hand, the present application provides an electronic device, including a device body and the above-mentioned camera module, wherein the camera module is connected to the device body.

[0020] In the above-mentioned camera module and electronic equipment, the bracket of the camera module includes a base and a metal insert, at least part of the metal insert is embedded in the bracket, the outer wall of the base is provided with an electrical connection part, the metal insert is electrically connected to the photosensitive chip and the electrical connection part, so that the metal insert can be used to output the electrical signal of the photosensitive chip through the electrical connection part. Compared with the camera module in the related art that needs to set a circuit board at the bottom of the photosensitive chip (that is, the side of the photosensitive chip facing away from the photosensitive area), the present application solution can use the metal insert to output the electrical signal of the photosensitive chip through the electrical connection part, so there is no need to set a circuit board at the bottom of the photosensitive chip, which can not only reduce the consumables cost of the circuit board, but also avoid the situation in which the thickness of the camera module is increased due to the circuit board being stacked on the bottom of the photosensitive chip. Therefore, the present application solution is conducive to realizing the thinness of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a three-dimensional schematic diagram of an electronic device according to an embodiment.

[0023] Figure 2 It is a schematic diagram of the three-dimensional structure of an electronic device according to another embodiment.

[0024] Figure 3 The figure is a schematic cross-sectional structure diagram of a camera module according to one embodiment.

[0025] Figure 4 The present invention is a schematic diagram of the assembly structure of a photosensitive chip and a bracket of a camera module according to one embodiment.

[0026] Figure 5 for Figure 4 A schematic diagram of the exploded structure of the photosensitive chip and bracket of the camera module is shown.

[0027] Figure 6 for Figure 5 The schematic diagram of the structure of the bracket of the camera module is shown as viewed from above.

[0028] Figure 7 A schematic diagram of the cross-sectional structure of a camera module according to another embodiment.

[0029] Figure 8 The figure is a schematic cross-sectional structure diagram of a camera module according to another embodiment.

[0030] Fig. 9 This is a structural block diagram of the electronic device provided in this application.

[0031] Description of Figure Numbers:

[0032] 100. Equipment body; 110. Casing; 120. Display screen; 200. Camera module; 210. Photosensitive chip; 210a. Photosensitive area; 210b. Non-photosensitive area; 211. First solder pad; 220. Bracket; 221. Base; 221a. First frame portion; 221b. Second frame portion; 221c. Third frame portion; 221d. Four frame portions; 2211. Electrical connection portion; 2212. Second solder pad; 2213. Side wall portion; 2214. Raised portion; 222. Metal inlay; 230. Electrical connector; 240. Filter; 250. Reinforcement sheet; 260. Lens assembly; 261. Mounting seat; 262. Lens. DETAILED DESCRIPTION

[0033] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0034] As used herein, "electronic device" refers to a device that can receive and / or send communication signals, including but not limited to a device that is connected via any one or more of the following connection methods:

[0035] (1) Connection via wired lines, such as Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, and direct cable connection;

[0036] (2) Via wireless interfaces, such as cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, and AM-FM broadcast transmitters.

[0037] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0038] (1) Satellite phone or cellular phone;

[0039] (2) Personal Communications System (PCS) terminals that can combine cellular radio telephones with data processing, fax, and data communications capabilities;

[0040] (3) Radiotelephone, pager, Internet / Intranet access, Web browser, notepad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0041] (4) conventional laptop and / or handheld receivers;

[0042] (5) Conventional laptop and / or palmtop radiotelephone transceivers, etc.

[0043] An electronic device according to an embodiment of the present application, such as Figure 1 As shown, the electronic device can be a wearable device such as a smart bracelet, a smart watch, etc. Figure 2 As shown, the electronic device may also be a mobile phone. It is understood that the specific form of the electronic device may be other, such as a tablet computer, a notebook computer, a smart helmet, smart glasses, etc., which is not limited here.

[0044] like Figure 1 and Figure 2 As shown, the electronic device includes a device body 100 and a camera module 200. The camera module 200 is connected to the device body 100. The camera module 200 is used for shooting, so that the electronic device has a shooting function.

[0045] In some embodiments, the device body 100 includes a housing 110 and a display screen 120 connected to the housing 110. A receiving space is formed between the housing 110 and the display screen 120. The receiving space is used to receive the internal parts of the electronic device. The housing 110 can protect the internal parts of the electronic device. The housing 110 can be the back cover of the electronic device and cover the battery, motherboard and other components of the electronic device. The camera module 200 can be installed on the housing 110, and when shooting is required, the camera module 200 can receive external light for imaging.

[0046] It should be noted that the device body 100 may also not have the display screen 120 , that is, the display screen 120 is not necessary for the device body 100 .

[0047] The camera module 200 may be a conventional camera, for example, a plurality of lenses are arranged in a straight line along the optical axis. In some embodiments, the camera module 200 may also be a periscope camera implemented by using edges or reflectors to change the light propagation path. The type of the camera module 200 is not limited here.

[0048] The structure of the camera module 200 will be further described below.

[0049] Combination Figure 3 As shown, the camera module 200 includes a photosensitive chip 210 and a bracket 220 .

[0050] The photosensitive chip 210 is used to convert light into electrical signals when receiving light, and then convert them into digital signals through analog-to-digital conversion to meet the needs of digital imaging.

[0051] The types of the photosensitive chip 210 may include CCD (Charge Coupled Device) elements, CMOS (Complementary Metal Oxide Semiconductor) devices, photosensitive diodes, etc. In terms of color, the photosensitive chip 210 may be a color light sensor, a monochromatic light sensor, an infrared light sensor, a grayscale sensor, etc. The type of the photosensitive chip 210 is not limited here.

[0052] The bracket 220 includes a base body 221 and a metal insert 222. At least a portion of the metal insert 222 is embedded in the bracket 220. The outer wall of the base body 221 is provided with an electrical connection part 2211. The metal insert 222 is electrically connected to the photosensitive chip 210 and the electrical connection part 2211, so that the metal insert 222 can be used to output the electrical signal of the photosensitive chip 210 through the electrical connection part 2211.

[0053] Compared with the camera module 200 in the related art, which needs to set a circuit board at the bottom of the photosensitive chip 210 (i.e., the side of the photosensitive chip 210 facing away from the photosensitive area 210a), the present application solution can use the metal insert 222 to output the electrical signal of the photosensitive chip 210 through the electrical connection part 2211, thereby eliminating the need to set a circuit board at the bottom of the photosensitive chip 210. This not only reduces the consumables cost of the circuit board, but also avoids the situation in which the camera module 200 has a circuit board stacked on the bottom of the photosensitive chip 210, resulting in an increase in thickness. Therefore, the present application solution is conducive to achieving a lightweight camera module 200.

[0054] For the camera module 200 in the related art, in which a circuit board is disposed at the bottom of the photosensitive chip 210, if the thickness of the circuit board is M, after adopting the camera module 200 of the present application, the thickness of the camera module 200 is at least reduced by M due to the omission of the circuit board. For example, in the camera module 200 in the related art, in which the thickness M of the circuit board is 0.3 mm, the height of the camera module 200 of the present application is at least reduced by 0.3 mm relative to the camera module 200 in the related art.

[0055] Combination Figure 3 and Figure 4 As shown, in some embodiments, the camera module 200 further includes an electrical connector 230, which is connected to the outer wall of the seat body 221, and the electrical connector 230 is electrically connected to the electrical connection portion 2211. In this embodiment, the electrical connector 230 is disposed on the outer wall of the seat body 221, so that it is not necessary to connect the electrical connector 230 to the PCB board located at the bottom of the photosensitive chip 210 through the FPC in the related art, so this structural setting is conducive to reducing the cost of the circuit board and realizing the thinness of the camera module 200.

[0056] It should be noted here that, in an electronic device, the electrical connection portion 2211 may be connected to an electrical connector 230 , and then connected to a circuit module such as a main board or a sub-board in the device body 100 through the electrical connector 230 .

[0057] In some embodiments, the electrical connector 230 may also be omitted. For example, when the camera module 200 is set to the device body 100, a conductive structure such as solder or metal wire is used to weld the electrical connection part 2211 to the pad on the main board or sub-board of the device body 100, so that the photosensitive chip 210 can transmit the electrical signal to the main board or sub-board of the device body 100 through the metal insert 222. Correspondingly, the main board or sub-board of the device body 100 can transmit the electrical signal to the photosensitive chip 210. It should be noted that the electrical signal includes but is not limited to power supply-related signals such as current signals or voltage signals, and the electrical signal may also be a control signal or a detection signal. There is no limitation on the type of electrical signal, as long as the camera module 200 can use the electrical connection part 2211 to power on or communicate with the external module to achieve shooting.

[0058] Combination Figure 5 and Figure 6As shown, in some embodiments, the photosensitive chip 210 has a photosensitive area 210a and a non-photosensitive area 210b located around the photosensitive area 210a. The non-photosensitive area 210b is provided with a plurality of first pads 211, and the base 221 is provided with a plurality of second pads 2212. The plurality of first pads 211 are correspondingly welded to the plurality of second pads 2212, and the plurality of second pads 2212 are electrically connected to the metal insert 222. In this embodiment, since the base 221 and the non-photosensitive area 210b of the photosensitive chip 210 are correspondingly provided with corresponding pads, when the base 221 is connected to the photosensitive chip 210, the second pads 2212 can be electrically connected to the corresponding first pads 211 by solder or metal wire, thereby realizing the electrical connection between the photosensitive chip 210 and the metal insert 222, so as to output the electrical signal of the photosensitive chip 210 to the electrical connection portion 2211 by using the metal insert 222.

[0059] Furthermore, the photosensitive chip 210 is rectangular, and the base 221 includes a first frame portion 221a, a second frame portion 221b, a third frame portion 221c, and a fourth frame portion 221d arranged along the circumference of the photosensitive chip 210. A portion of the second solder pad 2212 is located in the first frame portion 221a, and another portion of the second solder pad 2212 is located in the third frame portion 221c. A portion of the structure of the metal insert 222 is embedded in the second frame portion 221b or the fourth frame portion 221d, and at least one second solder pad 2212 located in the first frame portion 221a is electrically connected to at least one second solder pad 2212 located in the third frame portion 221c. In this embodiment, the wall thickness of the base 221 can be used to arrange the metal insert 222, so as to make full use of the structural design space of the base 221, so as to facilitate the miniaturization of the camera module 200.

[0060] It should be noted that the embedding position of the metal insert 222 in the base 221 and the specific shape of the metal insert 222 are not limited here. When the second pads 2212 are provided on different frame parts of the base 221, the metal insert 222 can be adapted to electrically connect the second pads 2212 located on different frame parts of the base 221, so that the second pads 2212 are electrically connected to the electrical connection part 2211 located on the outer wall of the base 221.

[0061] Recombination Figure 3 As shown, in some embodiments, at least a portion of the photosensitive chip 210 is accommodated in the space enclosed by the base 221, so that the base 221 can be used to protect the surrounding side of the photosensitive chip 210, thereby reducing the probability of the photosensitive chip 210 being hit and causing edge breakage or damage when the camera module 200 is assembled to the device body 100.

[0062] Combination Figures 4 to 6As shown, the seat body 221 includes a side wall portion 2213 and a protruding portion 2214. The protruding portion 2214 is protruding from the inner wall of the side wall portion 2213. A plurality of second solder pads 2212 are provided on the protruding portion 2214, so that when the first solder pad 211 of the photosensitive chip 210 is correspondingly connected to the second solder pad 2212, the protruding portion 2214 can support the photosensitive chip 210, so as to maintain the installation stability of the photosensitive chip 210 relative to the seat body 221. The first solder pad 211 and the second solder pad 2212 can be connected by solder. The welding method includes but is not limited to hot pressing welding, solder reflow welding or low melting point alloy welding.

[0063] It should be noted that the orthographic projection of the protrusion 2214 on the plane where the photosensitive chip 210 is located is located in the non-photosensitive area 210 b. In this way, the protrusion 2214 will not block the photosensitive area 210 a and affect the imaging effect of the photosensitive chip 210.

[0064] In some embodiments, the non-photosensitive area 210b of the photosensitive chip 210 is bonded to the protrusion 2214 by glue, thereby further strengthening the connection stability between the protrusion 2214 and the photosensitive chip 210, thereby reducing the probability of desoldering between the first solder pad 211 of the photosensitive chip 210 and the second solder pad 2212 on the protrusion, thereby improving the reliability of the camera module 200.

[0065] Combination Figure 7 As shown, the camera module 200 includes a filter 240, and the filter 240 is connected to the side of the protrusion 2214 facing away from the photosensitive chip 210. In this embodiment, the protrusion can not only serve as a connection carrier for the photosensitive chip 210, but also as a carrier for supporting the filter 240, thereby effectively realizing that the photosensitive chip 210 and the filter 240 share a carrier, without the need to separately set different connection carriers for the photosensitive chip 210 and the filter 240, which is conducive to miniaturization of the camera module 200.

[0066] Continue to combine Figure 7 As shown, the camera module 200 further includes a reinforcing sheet 250, and the side of the photosensitive chip 210 facing away from the photosensitive area 210a is stacked on the reinforcing sheet 250, and the reinforcing sheet 250 is connected to the base 221. In this embodiment, the photosensitive chip 210 is stacked on the reinforcing sheet 250, and the reinforcing sheet 250 is connected to the base 221, so that the photosensitive chip 210 is connected to the base 221. In this structure, the reinforcing sheet 250 can support and reinforce the photosensitive chip 210, so that the photosensitive chip 210 is not easy to break and is not easy to fall off from the base 221.

[0067] The connection method between the reinforcing sheet 250 and the base body 221 includes but is not limited to glue connection or hot melt connection.

[0068] The reinforcing sheet 250 may be made of stainless steel, copper sheet or aluminum alloy, etc. In this way, the reinforcing sheet 250 can not only strengthen the photosensitive chip 210, but also help to achieve rapid heat dissipation of the photosensitive chip 210 to reduce the working temperature of the photosensitive chip 210, thereby ensuring the stability of the imaging performance of the photosensitive chip 210 and reducing the probability of damage due to excessive temperature.

[0069] It should be noted that the camera module 200 further includes a lens assembly 260, which is disposed on the light sensing path of the photosensitive chip 210 and connected to the bracket 220. The lens assembly 260 is used to process external light so as to process the light into light that can adapt to the imaging chip for imaging.

[0070] Specifically, the external light passes through the lens assembly 260 and irradiates the photosensitive area 210a of the photosensitive chip 210. The photosensitive chip 210 converts the light transmitted from the lens assembly 260 into an electrical signal, and then converts it into a digital signal through analog-to-digital conversion.

[0071] The lens assembly 260 includes a mounting seat 261 and a plurality of lenses 262, and the plurality of lenses 262 are mounted on the mounting seat 261. The plurality of lenses 262 are arranged on the mounting seat 261 along the optical axis direction of the lens assembly 260. The number of lenses 262 can be 2, or more than 2. The type, number, and arrangement structure of the lenses 262 arranged in the mounting seat 261 are not limited here.

[0072] In some embodiments, the lens assembly 260 includes a lens barrel connected to a mounting seat 261. A plurality of lenses 262 may be mounted in the lens barrel to be connected to the mounting seat 261 through the lens barrel.

[0073] The lens barrel is movably connected to the mounting seat 261, so that the lens barrel can adjust its position relative to the mounting seat 261, thereby achieving focusing. For example, the lens assembly 260 includes a voice coil motor (not shown), which is arranged between the lens barrel and the mounting seat 261. The voice coil motor is used to drive the lens barrel to move relative to the mounting seat 261, so that the lens 262 arranged on the lens barrel moves away from or close to the photosensitive chip 210 along the light sensing path of the photosensitive chip 210, so as to achieve optical focusing.

[0074] The connection method between the mounting base 261 and the bracket 220 includes but is not limited to glue connection or hot melt connection.

[0075] For example, combined with Figure 8As shown, the mounting seat 261 is integrally formed with the bracket 220. In some embodiments, the mounting seat 261 and the bracket 220 are integrally formed by injection molding. The mounting seat 261 and the bracket 220 can both be made of plastic. In this way, the mounting seat 261 and the bracket 220 can be integrally formed by injection molding, that is, the mounting seat 261 and the bracket 220 are an integral structural member. This reduces the number of parts, reduces the assembly complexity of the camera module 200, and reduces the processing cost of the camera module 200.

[0076] Combination Fig. 9 , Fig. 9 The circuit module block diagram of the device body 100 of the electronic device provided in the embodiment of the present application. The device body 100 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509. Those skilled in the art will understand that Fig. 9 The structure of the device body 100 shown in the figure does not constitute a limitation on the device body 100, and may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.

[0077] The radio frequency circuit 501 can be used to send and receive information, or receive and send signals during a call. In particular, after receiving the downlink information of the base station, it is handed over to one or more processors 508 for processing; in addition, the data related to the uplink is sent to the base station. Generally, the radio frequency circuit 501 includes but is not limited to an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc. In addition, the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to the Global System of Mobile Communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Messaging Service (SMS), etc.

[0078] The memory 502 can be used to store applications and data. The applications stored in the memory 502 include executable codes. The applications can be composed of various functional modules. The processor 508 executes various functional applications and data processing by running the applications stored in the memory 502. The memory 502 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the device body 100 (such as audio data, a phone book, etc.), etc. In addition, the memory 502 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the memory 502 can also include a memory controller to provide the processor 508 and the input unit 503 with access to the memory 502.

[0079] The input unit 503 can be used to receive input digital, character information or user feature information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, in a specific embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch camera module or a touchpad, can collect user touch operations on or near it (such as operations performed by users using fingers, styluses, or any other suitable objects or accessories on or near the touch-sensitive surface), and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 508, and can receive and execute commands sent by the processor 508.

[0080] Furthermore, the touch-sensitive surface may cover a liquid crystal panel. When the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of touch event. The processor 508 then provides corresponding visual output on the liquid crystal panel according to the type of touch event.

[0081] The display unit 504 may be used to display information input by a user or information provided to a user and various graphical user interfaces of the device body 100 . These graphical user interfaces may be composed of graphics, texts, icons, videos, and any combination thereof.

[0082] Although in Fig. 9 In the embodiment, the touch-sensitive surface and the liquid crystal panel are used as two independent components to realize input and output functions, but in some embodiments, the touch-sensitive surface and the liquid crystal panel can be integrated to realize input and output functions. It can be understood that the camera module 100 can include an input unit 503 and a display unit 504.

[0083] The device body 100 may also include at least one sensor 505, such as a proximity sensor, a motion sensor, and other sensors. Among them, the proximity sensor can turn off the LCD panel and / or the backlight when the device body 100 is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors that can be configured with the device body 100, such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., they will not be repeated here.

[0084] The audio circuit 506 can provide an audio interface between the user and the device body 100 through a speaker and a microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit it to the speaker, and convert it into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, and then the audio data is output to the processor 508 for processing, and then sent to another device body 100 through the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include an earphone socket to provide communication between an external earphone and the device body 100.

[0085] Wireless Fidelity (WiFi) is a short-range wireless transmission technology. The device body 100 can help users send and receive emails, browse web pages, and access streaming media through the wireless fidelity module 507. It provides users with wireless broadband Internet access. Fig. 9 A wireless fidelity module 507 is shown, but it is understandable that it is not a necessary component of the device body 100 and can be omitted as needed without changing the essence of the invention.

[0086] The processor 508 is the control center of the device body 100. It uses various interfaces and lines to connect various parts of the entire device body 100. By running or executing the application program stored in the memory 502 and calling the data stored in the memory 502, it executes various functions of the device body 100 and processes data, thereby monitoring the device body 100 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface and application program, etc., and the modem processor mainly processes wireless communication. It is understandable that the above-mentioned modem processor may not be integrated into the processor 508.

[0087] The device body 100 also includes a power supply 509 for supplying power to various components. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so that the power management system can manage charging, discharging, and power consumption. The power supply 509 can also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0088] although Fig. 9Not shown, the device body 100 may also include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can refer to the previous method embodiment, which will not be described in detail here.

[0089] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A camera module, characterized in that: include: Photosensitive chip; The bracket comprises a seat body and a metal insert, wherein at least a portion of the metal insert is embedded in the bracket, an outer wall of the seat body is provided with an electrical connection portion, and the metal insert is electrically connected to the photosensitive chip and the electrical connection portion.

2. The camera module according to claim 1, characterized in that: The camera module also includes an electrical connector, which is connected to the outer wall of the base and is electrically connected to the electrical connection portion.

3. The camera module according to claim 1 or 2, characterized in that: The photosensitive chip has a photosensitive area and a non-photosensitive area located around the photosensitive area, the non-photosensitive area is provided with a plurality of first solder pads, the base body is provided with a plurality of second solder pads, the plurality of first solder pads are correspondingly welded with the plurality of second solder pads, and the plurality of second solder pads are electrically connected to the metal insert.

4. The camera module according to claim 3, characterized in that: The photosensitive chip is rectangular, and the base body includes a first frame portion, a second frame portion, a third frame portion and a fourth frame portion arranged along the circumference of the photosensitive chip, a portion of the second solder pad is located in the first frame portion, and another portion of the second solder pad is located in the third frame portion, and a partial structure of the metal insert is embedded in the second frame portion or the fourth frame portion, and electrically connects at least one of the second solder pads located in the first frame portion to at least one of the second solder pads located in the third frame portion.

5. The camera module according to claim 3, characterized in that: At least a portion of the photosensitive chip is accommodated in the space enclosed by the base.

6. The camera module according to claim 5, characterized in that: The seat body includes a side wall portion and a raised portion, the raised portion is protruding from the inner wall of the side wall portion, a plurality of the second pads are arranged on the raised portion, and the orthographic projection of the raised portion on the plane where the photosensitive chip is located is located in the non-photosensitive area.

7. The camera module according to claim 6, characterized in that: The non-photosensitive area of ​​the photosensitive chip is bonded to the raised portion by glue.

8. The camera module according to claim 6, characterized in that: The camera module includes a filter, and the filter is connected to a side of the protrusion facing away from the photosensitive chip.

9. The camera module according to claim 5, characterized in that: The camera module further comprises a reinforcing sheet, on which a side of the photosensitive chip facing away from the photosensitive area is stacked, and the reinforcing sheet is connected to the base.

10. The camera module according to claim 1, characterized in that: The camera module includes a lens assembly, which is arranged on the photosensitive path of the photosensitive chip and connected to the bracket.

11. The camera module according to claim 10, characterized in that: The lens assembly comprises a mounting seat and a plurality of lenses, the plurality of lenses are mounted on the mounting seat, and the mounting seat is integrally formed with the bracket.

12. An electronic device, characterized in that: It comprises a device body and the camera module according to any one of claims 1 to 11, wherein the camera module is connected to the device body.

Images