Thermal management system of integrated all-in-one computer

Abstract

The invention belongs to the field of thermal management of all-in-one computers, and discloses a thermal management system of an integrated all-in-one computer. Comprising a relation modeling module used for modeling power consumption and heat of the integrated all-in-one computer, generating a correlation expression of the power consumption and the heat, and obtaining a power consumption-heat model; the data acquisition and implementation module is used for importing the real-time data set into a power consumption-heat model to obtain a conversion data set; the trend prediction and mode selection module is used for judging the state of the all-in-one computer according to the curve and selecting an operation mode according to the state; the thermal management module is used for designing an operation mode under a thermal management program, and the design content comprises a dynamic frequency and voltage regulation and control unit and a power consumption and heat dissipation collaborative optimization unit; the regulation and control management module regulates and controls the all-in-one computer according to the output of the dynamic frequency and voltage regulation and control unit and the power consumption and heat dissipation collaborative optimization unit; and heat management of the integrated all-in-one computer is realized.

Description

Technical Field

[0001] The present invention relates to the field of thermal management of all-in-one computers, and more specifically, to a thermal management system for an integrated all-in-one computer. Background Art

[0002] Thermal management is particularly important for integrated all-in-one computers due to their compact structure and high integration. The internal hardware of an all-in-one computer is highly integrated, but the body design is usually thin and the internal space is limited. Due to the small space, the size and efficiency of the heat dissipation components are limited, and heat is not easy to be effectively discharged. If effective thermal management is not performed, heat will accumulate inside, causing the hardware temperature to rise.

[0003] All-in-one computers are usually equipped with high-performance processors (CPUs) and graphics cards (GPUs). These components generate a lot of heat when running high-load tasks. Thermal management can prevent hardware performance degradation or damage due to high temperatures. Especially when running tasks that require high computing power. Thermal management can avoid performance fluctuations caused by excessive temperatures and ensure stable system operation.

[0004] Excessive temperature may cause the surface of the device to heat up, affecting the user experience. High temperature may also cause the fan to rotate faster, generating louder noise, further affecting the user experience. Through thermal management optimization, the temperature of the device shell and fan noise can be reduced, improving the user experience.

[0005] In view of this, the present invention proposes a thermal management system for an integrated all-in-one computer to solve the above problems. Summary of the invention

[0006] In order to overcome the above-mentioned defects of the prior art and to achieve the above-mentioned purpose, the present invention provides the following technical solutions: A thermal management system for an integrated all-in-one computer, comprising: a relationship modeling module: used to model the power consumption and heat of the integrated all-in-one computer, generate a correlation expression of the power consumption and heat, and obtain a power consumption-heat model; Data collection and implementation module: used to collect real-time data sets, import the real-time data sets into the power consumption-heat model, and obtain the conversion data sets; Trend prediction and mode selection module: used to draw a trend prediction curve based on the converted data set, and judge the status of the all-in-one computer based on the curve, and select the operating mode according to the status; Thermal management module: used to design the operation mode under the thermal management program, including the dynamic frequency and voltage control unit and the power consumption and heat dissipation coordinated optimization unit; Control management module: controls the all-in-one computer according to the output of the dynamic frequency and voltage control unit and the power consumption and heat dissipation coordinated optimization unit; Visualization module: displays the analysis report on the computer page and interacts with the user interface.

[0007] Preferably, the method for modeling the power consumption and heat of the integrated all-in-one computer, generating a correlation expression of the power consumption and heat, and obtaining a power consumption-heat model comprises: The power consumption-heat model is constructed based on the power consumption expression, heat correlation formula, and the formula affecting temperature difference and heat dissipation efficiency; The power consumption expression is: + ; The heat correlation formula is ; Temperature difference and heat dissipation efficiency influence formula , ; in, Indicates the total power consumption of the all-in-one computer. Represents the total power consumption of CPU and GPU, represents the total power consumption of other components, Indicates The capacitance of each component, Indicates The voltage of each component, Indicates The frequency of the components, Indicates Components and temperature The leakage current , Indicates the power consumption coefficient of memory, Indicates the memory load, Represents the power consumption coefficient of the storage device, Indicates the load of the storage device. represents the baseline power consumption of the motherboard and other fixed components, Indicates the comprehensive temperature of each component in the all-in-one computer. Indicates the ambient temperature, Indicates The thermal resistance of each component, Indicates The power consumption of each component, Indicates the heat dissipation efficiency, Indicates the comprehensive thermal resistance of each component in the all-in-one computer. Indicates the heat dissipation area, represents the convective heat transfer coefficient, Indicates the difference between the combined temperature of the components inside the all-in-one computer and the ambient temperature; And leakage current , is the leakage current at the selected reference temperature and supply voltage, It is the voltage when the all-in-one computer is working. , , , , and is a constant.

[0008] Preferably, the real-time data set includes the capacitance, frequency, voltage, temperature and thermal resistance of each component of the CPU and GPU, and the ambient temperature; Based on real-time data sets, use power-thermal models to calculate the temperature of each component, the total power consumption of the AIO PC, and the cooling efficiency; The temperature of each component, the total power consumption of the all-in-one computer, and the cooling efficiency form a conversion data set.

[0009] Preferably, the method of drawing a trend prediction curve according to the converted data set, judging the state of the all-in-one computer according to the curve, and selecting the operation mode according to the state includes: Preset the cycle time, discretize the current cycle time into time points, and acquire the conversion data set at a fixed sampling frequency at each time point; With the time point as the horizontal axis, and the temperature of each component in the conversion data set and the total power consumption of the all-in-one computer as the horizontal and vertical axes, a two-dimensional coordinate system is drawn, and curve fitting is performed for each two-dimensional coordinate system to obtain the curve expression of the temperature of each component and the total power consumption of the all-in-one computer in the cycle time; Calculate the state performance coefficient based on the curve expression ,like If the value is greater than the limit threshold, the computer is judged to be overheated and the thermal management program is started. If it is less than or equal to the limit threshold, it is determined that the all-in-one computer is not overheated and continues to work normally; in, and is the weight coefficient, and its value range is from 0 to 1. is the number of discrete time points in the cycle time, is the index of the time point, Indicates time point The value on Indicates time point The value on It represents the curve expression integrated over the period time.

[0010] Preferably, the operation modes under the thermal management program include performance priority mode, silent priority mode and balanced mode; Performance priority mode means setting high thresholds for power consumption and temperature under high load, silent priority mode means limiting fan speed and power consumption, and balanced mode means striking a balance between performance and noise. Introduce a mode adaptive switching mechanism, specifically ,in, is the safety threshold of ambient temperature, is the average value of the current component load, is the preset load threshold, is the low load threshold.

[0011] Preferably, the design method of the dynamic frequency and voltage control unit includes: Define frequency dynamic control mechanism and voltage dynamic control mechanism for each component of the all-in-one computer; Frequency dynamic control mechanism ,in, Indicates the frequency after the component is dynamically adjusted. , , and For each temperature and load The preset frequencies in the state, and the values ​​are arranged from high to low, , and It is a preset multi-level temperature threshold, and the values ​​are arranged from low to high. Indicates the real-time temperature of the component, Represents the real-time load of the component, and is the preset load threshold; Voltage dynamic regulation mechanism ,in, Indicates the voltage after CPU or GPU is dynamically adjusted. is the reference voltage of the CPU or GPU, is the reference temperature of the CPU or GPU, is the temperature sensitivity coefficient of voltage.

[0012] Preferably, the design method of the power consumption and heat dissipation coordinated optimization unit includes: The power consumption and heat dissipation collaborative optimization unit includes a power consumption-heat dissipation adjustment mechanism and a collaborative optimization mechanism; The power consumption-heat dissipation adjustment mechanism includes power consumption allocation and optimization target. The power consumption allocation is , the optimization goal is ; in, is the dynamic allocation power consumption of the CPU or GPU, is the maximum power consumption of the CPU or GPU, is the dynamic adjustment coefficient, is the fan speed, is the total heat generated by the all-in-one computer. It's the fan noise. is the temperature fluctuation penalty coefficient, It refers to the first The rate of change of component temperature; The collaborative optimization mechanism is , is the base PWM frequency, is the frequency adjustment amplitude, It is the phase; The power consumption and heat dissipation collaborative optimization unit introduces a dynamic weight adjustment mechanism. The dynamic weight adjustment mechanism is ,in, Represents the dynamic user experience weight, is the base weight; is the environmental factor weight, and ; is the load factor weight, and ; in, and are the basic weights of environmental factors and load factors, and are the sensitivity coefficients of the environment and load respectively, is the reference temperature, is the current load on all components, is the maximum load on all components, Indicates the average temperature change of each load, is the time interval in the cycle time.

[0013] Preferably, the method for regulating the all-in-one computer according to the outputs of the dynamic frequency and voltage regulation unit and the power consumption and heat dissipation coordinated optimization unit includes: The dynamically adjusted frequency and voltage are obtained according to the dynamic frequency and voltage control unit, the dynamically allocated power consumption and fan speed of the CPU or GPU are obtained according to the power consumption and heat dissipation collaborative optimization unit, and the all-in-one computer is regulated using the obtained frequency and voltage, power consumption and fan speed.

[0014] Preferably, the method of displaying the analysis report on a computer terminal page and performing interface interaction with a user comprises: Users click, query or download the analysis report through the computer page.

[0015] Preferably, the analysis report includes the status of the all-in-one computer, the selected operating mode, the acquired frequency and voltage, as well as the power consumption and fan speed.

[0016] The technical effects and advantages of the thermal management system of an integrated all-in-one computer of the present invention are as follows: 1. Accurate power consumption and thermal modeling By constructing a power consumption-heat model, the power consumption expression, heat correlation formula, and temperature difference and heat dissipation efficiency formula are jointly modeled, which can accurately describe the dynamic relationship between power consumption and heat in all-in-one computers.

[0017] The model takes into account the power consumption characteristics of multiple hardware components such as CPU, GPU, memory, storage device, motherboard, etc., and covers multiple physical parameters such as capacitance, voltage, frequency, temperature, thermal resistance, etc. Key influencing factors such as leakage current, ambient temperature, and heat dissipation area are quantified to ensure the accuracy of the model. By driving the model with real-time data, it can reflect the operating status of the all-in-one computer in real time and adapt to the dynamically changing power consumption and heat characteristics.

[0018] 2. Efficient real-time data collection and conversion Data collection covers a variety of key hardware parameters, ensuring comprehensive perception of system status. Real-time data collection and conversion capabilities provide a basis for rapid response for subsequent prediction and regulation. Through model calculation, data conversion and analysis are automatically completed, reducing human intervention.

[0019] 3. Trend prediction and operation mode selection Based on the conversion data set, a trend prediction curve is drawn, and the operating status of the all-in-one computer (such as whether it is overheating) is judged through curve fitting and calculation of the state performance coefficient, so as to select performance priority, silent priority or balanced mode. Through the trend prediction curve, the operating status of the all-in-one computer can be judged in advance to avoid overheating or performance fluctuations.

[0020] It supports performance priority, silent priority and balanced modes, and can dynamically adjust the operating mode according to application scenarios and user needs. It introduces parameters such as ambient temperature and load conditions to dynamically adjust the mode switching mechanism, improving the intelligence and adaptability of mode selection.

[0021] 4. Optimization design of thermal management program The thermal management module achieves coordinated optimization of power consumption and heat dissipation through the design of dynamic frequency and voltage control unit and power consumption and heat dissipation coordinated optimization unit, thereby improving the heat dissipation efficiency and operation stability of the all-in-one computer.

[0022] Dynamically adjust the frequency and voltage of each component to reduce energy consumption and heat according to different temperature and load conditions. The power consumption allocation mechanism and fan noise suppression mechanism are combined to achieve global optimization of power consumption and heat dissipation, taking into account performance and user experience. A balance is achieved between performance, noise and temperature fluctuations to meet the needs of different users.

[0023] 5. Dynamic frequency and voltage control The dynamic frequency and voltage control unit dynamically adjusts the frequency and voltage of each component according to the real-time temperature and load status to optimize the relationship between power consumption and heat.

[0024] By dynamically adjusting the frequency and voltage, power consumption and heat generation are reduced, and energy efficiency is improved. Component overheating or damage caused by excessive frequency or voltage is avoided. Multi-level temperature and load threshold control strategies are supported to adapt to different operating scenarios.

[0025] 6. Coordinated optimization of power consumption and heat dissipation The power consumption and heat dissipation collaborative optimization unit dynamically allocates power consumption and adjusts fan speed through the power consumption allocation mechanism and collaborative optimization mechanism to optimize the relationship between power consumption and heat dissipation. By dynamically adjusting the power consumption allocation coefficient, the power consumption of the CPU and GPU is reasonably allocated to avoid overheating of a single component. The fan speed optimization mechanism effectively reduces noise and improves user experience. Dynamically adjust the weight according to user experience, environmental factors and load factors to optimize the synergistic effect of power consumption and heat dissipation.

[0026] In general, through the collaborative work of multiple modules, global optimization of power consumption, heat and performance is achieved, improving the overall performance and user experience of the all-in-one computer.

[0027] By establishing an accurate power consumption-heat model, combined with modules such as real-time data collection, trend prediction, dynamic regulation and collaborative optimization, the power consumption management and heat control capabilities of all-in-one computers are comprehensively improved. Its main advantages include high accuracy, high real-time performance, flexibility and intelligence, which can significantly improve the operating stability, heat dissipation efficiency and user experience of all-in-one computers, and has significant engineering application value. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of the structure of a thermal management system for an integrated all-in-one computer of the present invention; Figure 2 The present invention is a schematic diagram of the steps of a thermal management method for an integrated all-in-one computer. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Example 1

[0031] See also Figure 1 and Figure 2 As shown, this embodiment provides a thermal management system for an integrated all-in-one computer, including: Integrated all-in-one computers (such as iMac or other All-in-One computers) are compact and highly integrated, so thermal management is particularly important. Here are a few key reasons why all-in-one computers need thermal management: 1. Small space makes heat dissipation difficult The internal hardware of the all-in-one computer (such as CPU, GPU, storage device, power supply, etc.) is highly integrated, but the body design is usually thin and the internal space is limited. Due to the small space, the size and efficiency of the heat dissipation components (such as fans and heat sinks) are limited, and the heat is not easy to be effectively discharged. If effective thermal management is not performed, the heat will accumulate inside, causing the hardware temperature to rise.

[0032] 2. High-performance hardware generates a lot of heat All-in-one computers are usually equipped with high-performance processors (CPUs) and graphics cards (GPUs), which generate a lot of heat when running high-load tasks (such as video editing, graphics rendering, games, etc.). Thermal management can prevent hardware from experiencing performance degradation (such as frequency reduction) or damage due to high temperature.

[0033] 3. Protect hardware and extend equipment life Long-term operation in a high-temperature environment will accelerate hardware aging and shorten the life of the device. For example, high temperature may damage electronic components (such as capacitors and transistors) or even cause solder joints to fall off (such as the cracking of solder joints on BGA chips). Good thermal management can effectively reduce hardware temperature and extend the life of the device.

[0034] 4. Ensure stable performance When the hardware temperature is too high, modern computers will reduce the operating frequency of the CPU or GPU through "thermal throttling" to reduce heat generation. This frequency reduction mechanism will directly affect the performance of the computer, especially when running tasks that require high computing power. Thermal management can avoid performance fluctuations caused by excessive temperatures and ensure stable system operation.

[0035] 5. Prevent user experience from being affected Excessive temperature may cause the surface of the device to heat up, affecting the user experience. High temperature may also cause the fan to rotate faster, generating louder noise, further affecting the user experience. Through thermal management optimization, the temperature of the device shell and fan noise can be reduced, improving the user experience.

[0036] 6. Avoid safety hazards In extreme cases, overheating can cause hardware failures or even fire hazards. Thermal management can prevent equipment from overheating and reduce potential safety risks.

[0037] Therefore, thermal management is crucial for integrated all-in-one computers. It not only ensures stable performance and prolongs hardware life, but also improves user experience and avoids safety hazards. Due to its design limitations, all-in-one computers require more efficient and innovative thermal management solutions to achieve efficient heat dissipation in a limited space, thereby meeting the dual needs of modern users for performance and aesthetics.

[0038] In the process of thermal management of integrated all-in-one computers, due to their compact structure, complex design and high performance requirements, active heat dissipation (such as fans) is currently the most common heat dissipation method, which allows heat to be quickly transferred to the outside of the fuselage through heat pipes, heat sinks or air ducts, and then dissipated through air outlet. However, when running at high load, the increase in fan speed will produce obvious noise, affecting the user experience. In addition, the all-in-one computer will generate a lot of heat under high load, while increasing power consumption, and power consumption itself will further aggravate the heat, forming a vicious circle. How to find a balance between high performance and high power consumption, both to ensure performance output and control heat generation, so that the power management and cooling systems work together to avoid thermal management failure due to uncontrolled power consumption is an important issue facing thermal management.

[0039] In order to design a thermal management solution for an integrated all-in-one computer, effectively controlling heat and power consumption while ensuring high performance, we start from the perspective of hardware, software and system collaboration, combine thermodynamics, electronics and intelligent control technology, and comprehensively consider factors such as power consumption allocation, heat dissipation path optimization, fan noise control and user experience. The following is a detailed implementation plan: Relationship modeling module: used to model the power consumption and heat of the integrated all-in-one computer, generate the associated expression of power consumption and heat, and obtain the power consumption-heat model; Step S1: Modeling the power consumption and heat of the integrated all-in-one computer; The method for modeling the power consumption and heat of an integrated all-in-one computer, generating a correlation expression of the power consumption and the heat, and obtaining a power consumption-heat model includes: The power consumption-heat model is constructed based on the power consumption expression, heat correlation formula, and the formula affecting temperature difference and heat dissipation efficiency; The power consumption expression is + ; The heat correlation formula is ; Temperature difference and heat dissipation efficiency influence formula , ; in, Indicates the total power consumption of the all-in-one computer. Represents the total power consumption of CPU and GPU, represents the total power consumption of other components, Indicates The capacitance of each component, Indicates The voltage of each component, Indicates The frequency of the components, Indicates Components and temperature The leakage current , Indicates the power consumption coefficient of memory, Indicates the memory load, Represents the power consumption coefficient of the storage device, Indicates the load of the storage device. represents the baseline power consumption of the motherboard and other fixed components, Indicates the comprehensive temperature of each component in the all-in-one computer. Indicates the ambient temperature, Indicates The thermal resistance of each component, Indicates The power consumption of each component, Indicates the heat dissipation efficiency, Indicates the comprehensive thermal resistance of each component in the all-in-one computer. Indicates the heat dissipation area, represents the convective heat transfer coefficient, Indicates the difference between the combined temperature of the components inside the all-in-one computer and the ambient temperature; And leakage current , is the leakage current at the selected reference temperature and supply voltage, It is the voltage when the all-in-one computer is working. , , , , and is a constant.

[0040] CPU and GPU power consumption at different frequencies and voltage It has a nonlinear relationship and will dynamically adjust the frequency and voltage according to the load. It has dynamic power consumption characteristics. Therefore, we need to collect frequency and voltage data in real time to calculate the power consumption more accurately. According to the power consumption formula of CMOS circuit, dynamic power consumption It can be expressed as: ,in, is the capacitive load (related to the chip design), is the supply voltage (Volt), is the operating frequency (Hz).

[0041] In addition, static power consumption needs to be considered, which is mainly composed of leakage current Generated, static power consumption vs. voltage and temperature related, , Is with temperature The leakage current, leakage current With temperature The relationship can be expressed by the following formula: , is the leakage current at a certain (selectable by the operator) reference temperature and supply voltage, is the operating supply voltage, , , , , and is a technical constant determined empirically.

[0042] Therefore, the total power consumption of CPU and GPU It is expressed as: In actual applications, since the CPU and GPU support dynamic frequency and voltage scaling (DVFS), the actual power consumption will change with the changes in load, frequency and voltage. The power consumption of multiple components inside the CPU and GPU is taken into account, so the actual energy consumption , It is The capacitance of each component, It is The voltage of each component, It is The frequency of the components, Is with temperature The relevant The leakage current of a component.

[0043] For other components (such as memory, storage devices, motherboards, etc.), their power consumption is usually linear with the load and can be modeled as: , is the power consumption coefficient of the memory, is the memory load, is the power consumption coefficient of the storage device, is the load of the storage device, is the baseline power consumption of the motherboard and other fixed components. This formula takes into account the linear relationship between the power consumption of different components and the load, as well as the baseline power consumption of fixed components.

[0044] Combined power consumption of CPU, GPU and other components, total system power consumption + .

[0045] According to the law of conservation of energy, most of the system's power consumption is eventually converted into heat, which can be expressed as , is the computer running time. However, since the system has heat dissipation channels (such as fans, radiators, etc.), heat will not accumulate indefinitely. The temperature change of the system is controlled by the heat conduction equation. , is the difference between the system temperature and the ambient temperature, is the thermal resistance of the system (K / W), which indicates the heat dissipation efficiency. is the heat dissipation area (m²), is the ambient temperature.

[0046] For different components (CPU, GPU, memory, etc.), heat generation and temperature are affected by their respective power consumption and heat dissipation characteristics. Assuming that the thermal resistance of each component is different, the temperature of each component in the system can be comprehensively represented by superposition and heat conduction model: , is the combined temperature of the components in the system, It is The thermal resistance of each component, It is The power consumption of each component. Ambient temperature It has a direct impact on the system temperature, especially when the cooling efficiency is low. Considering that the cooling efficiency is inversely proportional to the ambient temperature, the cooling efficiency can be modeled. for: .

[0047] The power consumption-thermal model is a more accurate power consumption and thermal model designed after considering more complex factors (such as the frequency, voltage, ambient temperature and complex heat transfer process of the CPU and GPU). The model combines the influence of dynamic frequency and voltage scaling (DVFS), component-level thermal characteristics and ambient temperature, and is modeled through physical and statistical methods.

[0048] Data collection and implementation module: used to collect real-time data sets, import the real-time data sets into the power consumption-heat model, and obtain the conversion data sets; Step S2: importing the real-time data set into the power consumption-heat model to obtain a converted data set; The real-time data set includes the capacitance, frequency, voltage, temperature and thermal resistance of each component of the CPU and GPU, as well as the ambient temperature; Based on real-time data sets, use power-thermal models to calculate the temperature of each component, the total power consumption of the AIO PC, and the cooling efficiency; The temperature of each component, the total power consumption of the all-in-one computer, and the cooling efficiency form a conversion data set.

[0049] When managing the heat of a computer, hardware optimization is also necessary, including optimization of heat pipe and heat sink design. For example, using heat pipe materials with high thermal conductivity (such as copper and graphene composite materials) to improve heat transfer efficiency; increasing the effective heat dissipation area of ​​the heat sink, while optimizing the heat sink structure to improve airflow performance. Or air duct design and fan optimization. For example, the air duct design adopts a partitioned heat dissipation strategy to isolate the heat source (CPU, GPU) from the heat dissipation path of other modules to avoid heat accumulation; Trend prediction and mode selection module: used to draw a trend prediction curve based on the converted data set, and judge the status of the all-in-one computer based on the curve, and select the operating mode according to the status; Step S3: Draw a trend prediction curve based on the converted data set, and determine the status of the all-in-one computer based on the curve analysis, and select an operating mode based on the status; A trend prediction curve is drawn according to the converted data set, and the state of the all-in-one computer is judged according to the curve. The method of selecting the operation mode according to the state includes: Preset the cycle time, discretize the current cycle time into time points, and acquire the conversion data set at a fixed sampling frequency at each time point; With the time point as the horizontal axis, and the temperature of each component in the conversion data set and the total power consumption of the all-in-one computer as the horizontal and vertical axes, a two-dimensional coordinate system is drawn, and curve fitting is performed for each two-dimensional coordinate system. The curve fitting can be obtained using a neural network or an integrated learning method to obtain a curve expression of the temperature of each component and the total power consumption of the all-in-one computer in the cycle time; Calculate the state performance coefficient based on the curve expression The state performance coefficient comprehensively considers the fluctuation of temperature and total power consumption during the cycle time and the performance accumulation, making the judgment more accurate and precise. If the value is greater than the limit threshold, the computer is judged to be overheated and the thermal management program is started. If it is less than or equal to the limit threshold, it is determined that the all-in-one computer is not overheated and continues to work normally; The limit threshold is obtained by data analysis based on the performance of the formula of the state performance coefficient in the experimental data, and can also be preset by the management personnel based on experience.

[0050] in, and is the weight coefficient, and its value range is from 0 to 1. is the number of discrete time points in the cycle time, is the index of the time point, Indicates time point The value on Indicates time point The value on It means that the curve expression is integrated over the period time; Thermal management module: used to design the operation mode under the thermal management program, including the dynamic frequency and voltage control unit and the power consumption and heat dissipation coordinated optimization unit; Step S4: designing an operation mode under the thermal management program, and designing a dynamic frequency and voltage control unit and a power consumption and heat dissipation coordinated optimization unit according to the designed operation mode; The operating modes under the thermal management program include performance priority mode, silent priority mode and balanced mode; Performance priority mode means setting high thresholds for power consumption and temperature under high load, which means that higher power consumption and temperature are allowed under high load; Silent priority mode means limiting fan speed and power consumption; Balanced mode means balancing performance and noise; The introduction of a mode adaptive switching mechanism aims to reduce the frequency of manual adjustments by users and automatically select the working mode that best suits the current conditions. ,in, is the safety threshold of the ambient temperature. Exceeding this value may affect system stability or user comfort. It is the average value of the current component load and reflects the average workload of the system. It is a preset load threshold used to distinguish different working modes. is the low load threshold below which the system can switch to a quieter mode.

[0051] This mode switching mechanism works as follows: Performance priority mode: When the system load is above the threshold and the ambient temperature is within a safe range, the system will switch to performance mode to provide maximum processing power.

[0052] Balanced Mode: When system load approaches a threshold, the system switches to Balanced Mode, which aims to strike a balance between performance and noise / power consumption.

[0053] Silent priority mode: When the ambient temperature exceeds the safety threshold or the system load falls below the low load threshold, the system will switch to silent mode to reduce noise and power consumption to protect the system from damage due to overheating.

[0054] The design method of the dynamic frequency and voltage control unit includes: According to the real-time load and temperature, a multi-level dynamic control strategy is introduced to define the frequency dynamic control mechanism and voltage dynamic control mechanism for each component of the all-in-one computer; Frequency dynamic control mechanism ,in, Indicates the frequency after the component is dynamically adjusted. , , and For each temperature and load The frequencies are preset in the state, and the values ​​are arranged from high to low. They can be pre-formatted by the manufacturer during production, or customized by the user. is the maximum frequency, usually corresponding to the highest performance state. is the minimum frequency, usually corresponding to the lowest power state. , It is an intermediate frequency state used to strike a balance between performance and power consumption. , and It is a preset multi-level temperature threshold, and the values ​​are arranged from low to high. Indicates the real-time temperature of the component, Represents the real-time load of the component, and is the preset load threshold; Voltage dynamic regulation mechanism ,in, Indicates the voltage after CPU or GPU is dynamically adjusted. It is the reference voltage of the CPU or GPU, that is, the voltage of the CPU or GPU under normal working conditions. It is the reference temperature of the CPU or GPU, usually a preset safe or optimal operating temperature. It is the temperature sensitivity coefficient of voltage, which is used to quantify the impact of temperature changes on voltage regulation.

[0055] The voltage dynamic control mechanism is based on a temperature and leakage current comprehensive control strategy, the purpose of which is to reduce the increase in power consumption caused by leakage current by dynamically adjusting the voltage, which means that as the temperature of the CPU or GPU increases, the voltage will decrease relative to the reference temperature. This adjustment helps to reduce leakage current because leakage current usually increases with increasing temperature. By reducing the voltage, the power consumption caused by leakage current can be reduced, thereby controlling the overall power consumption and heat generation.

[0056] The design method of the power consumption and heat dissipation coordinated optimization unit includes: The goal of coordinated optimization of power consumption and heat dissipation is to dynamically optimize power consumption allocation and fan noise control while ensuring thermal management efficiency, thereby improving user experience.

[0057] The power consumption and heat dissipation collaborative optimization unit includes a power consumption-heat dissipation adjustment mechanism and a collaborative optimization mechanism; According to the weight of user experience To adjust the power consumption allocation priority of CPU / GPU.

[0058] The power consumption-heat dissipation adjustment mechanism includes power consumption allocation and optimization target. The power consumption allocation is , the optimization goal is ; in, is the dynamic allocation power consumption of the CPU or GPU, is the maximum power consumption of the CPU or GPU, is a dynamic adjustment coefficient used to control the impact of power consumption allocation on noise. is the fan speed, is the total heat generated by the all-in-one computer. It's the fan noise. is the temperature fluctuation penalty coefficient, which is used to reduce the impact of rapid temperature fluctuations on system stability. It refers to the first The rate of change of component temperature is used to suppress excessive temperature rise; The optimization goal is to refine the balance between total power consumption and fan noise into a dynamic optimization problem. The working principle of this model is as follows: when When it is larger, it means that the user prefers to reduce noise, so The item will be larger, resulting in Reduce, thereby reducing power consumption and heat generation, and reducing noise; when When it is smaller, it means that users prefer to improve performance, so The item will be smaller, resulting in near , thereby improving performance.

[0059] In high-load scenarios, giving priority to increasing heat dissipation efficiency can be achieved by increasing the fan speed to ensure that the system does not degrade performance due to overheating. In low-load scenarios, giving priority to reducing noise can be achieved by reducing the fan speed to reduce noise and improve user experience.

[0060] The collaborative optimization mechanism is based on the noise spectrum analysis of the fan to optimize the frequency distribution of the PWM signal to avoid high-frequency noise. The collaborative optimization mechanism is , is the basic PWM frequency, that is, the normal operating frequency of the fan. is the frequency adjustment amplitude, which is used to adjust the PWM frequency to optimize the noise spectrum, is the phase, which is used to mitigate the tinnitus effect caused by frequency changes. The working principle of this model is to The frequency variation of a sine wave is superimposed on To optimize the frequency distribution of the PWM signal. The frequency change of the sine waveform can effectively disperse the noise energy, reduce the noise intensity of a specific frequency, and thus reduce the overall noise level.

[0061] Phase The introduction of phase is to reduce the tinnitus effect caused by frequency changes. The tinnitus effect refers to the uncomfortable sound that the human ear may perceive when the frequency changes too quickly. , which can smooth out frequency changes and reduce tinnitus effects.

[0062] The power consumption and heat dissipation collaborative optimization unit introduces a dynamic weight adjustment mechanism. The dynamic weight adjustment mechanism makes the user experience weight dynamic and adjusts it according to the real-time scenario and user mode. The dynamic weight adjustment mechanism is ,in, Represents the dynamic user experience weight, is the base weight; it is set by the user mode. For example, in silent mode, this weight may be higher, such as 0.6, to reduce noise and heat; in performance mode, this weight may be lower, such as 0.5, to optimize performance.

[0063] is the environmental factor weight, which is dynamically adjusted based on the ambient temperature. When the ambient temperature is high, you may need to increase this weight to reduce heat generation and keep the device running at a safe temperature, and ; is the load factor weight, which is dynamically adjusted based on the current load and the rate of temperature change. High load or rapid temperature changes may require increasing this weight to adjust the performance and cooling strategy of the device, and ; in, and are the basic weights of environmental factors and load factors, and are the sensitivity coefficients of the environment and load, respectively, indicating the influence of the current environment and load on the weight. It is the reference temperature, usually set to the nominal ambient temperature for which the equipment is designed. is the current load on all components, is the maximum load on all components, Indicates the average temperature change of each load, is the time interval in the cycle time.

[0064] Control management module: controls the all-in-one computer according to the output of the dynamic frequency and voltage control unit and the power consumption and heat dissipation coordinated optimization unit; Step S5: obtaining the dynamically adjusted frequency and voltage according to the dynamic frequency and voltage control unit, obtaining the dynamically allocated power consumption and fan speed of the CPU or GPU according to the power consumption and heat dissipation collaborative optimization unit, and using the obtained frequency and voltage, power consumption and fan speed to control the all-in-one computer; According to the outputs of the dynamic frequency and voltage control unit and the power consumption and heat dissipation coordinated optimization unit, the method for controlling the all-in-one computer includes: The dynamically adjusted frequency and voltage are obtained according to the dynamic frequency and voltage control unit, the dynamically allocated power consumption and fan speed of the CPU or GPU are obtained according to the power consumption and heat dissipation collaborative optimization unit, and the all-in-one computer is regulated using the obtained frequency and voltage, power consumption and fan speed.

[0065] Step S6: Display the analysis report on the computer terminal page and interact with the user interface; Visualization module: used to arrange the analysis report on the computer page and interact with the user interface; The analysis report includes the status of the AIO computer, the selected operating mode, the acquired frequencies and voltages as well as the power consumption and fan speeds.

[0066] Users can click, query, download and perform other interactive operations on the analysis report through the computer page (computer display screen, where the computer refers to a smart device, which can be a mobile phone or tablet).

[0067] Example 2

[0068] See also Figure 2 As shown, the part not described in detail in this embodiment is described in Example 1, and a thermal management method for an integrated all-in-one computer is provided, comprising: Step S1: Modeling the power consumption and heat of the integrated all-in-one computer; Step S2: importing the real-time data set into the power consumption-heat model to obtain a converted data set; Step S3: Draw a trend prediction curve based on the converted data set, and determine the status of the all-in-one computer based on the curve analysis, and select an operating mode based on the status; Step S4: designing an operation mode under the thermal management program, and designing a dynamic frequency and voltage control unit and a power consumption and heat dissipation coordinated optimization unit according to the designed operation mode; Step S5: obtaining the dynamically adjusted frequency and voltage according to the dynamic frequency and voltage control unit, obtaining the dynamically allocated power consumption and fan speed of the CPU or GPU according to the power consumption and heat dissipation collaborative optimization unit, and using the obtained frequency and voltage, power consumption and fan speed to control the all-in-one computer; Step S6: Display the analysis report on the computer terminal page and interact with the user interface.

[0069] Example 3

[0070] This embodiment discloses an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the operation mode of the thermal management system of the integrated all-in-one computer provided above is implemented.

[0071] Since the electronic device introduced in this embodiment is an electronic device used to implement a thermal management system of an integrated all-in-one computer in the embodiment of this application, based on the thermal management system of an integrated all-in-one computer introduced in the embodiment of this application, a person skilled in the art can understand the specific implementation of the electronic device of this embodiment and its various variations, so how the electronic device implements the method in the embodiment of this application is not described in detail here. As long as a person skilled in the art implements an electronic device used by a thermal management system of an integrated all-in-one computer in the embodiment of this application, it belongs to the scope of protection of this application.

[0072] The above formulas are all dimensionless and numerical calculations. The formula is a formula for the most recent real situation obtained by collecting a large amount of data and performing software simulation. The preset parameters and thresholds in the formula are set by technicians in this field according to actual conditions.

[0073] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technical users in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A thermal management system for an integrated all-in-one computer, characterized in that: include: Relationship modeling module: used to model the power consumption and heat of the integrated all-in-one computer, generate the associated expression of power consumption and heat, and obtain the power consumption-heat model; Data collection and implementation module: used to collect real-time data sets, import the real-time data sets into the power consumption-heat model, and obtain the conversion data sets; Trend prediction and mode selection module: used to draw a trend prediction curve based on the converted data set, and judge the status of the all-in-one computer based on the curve, and select the operating mode according to the status; Thermal management module: used to design the operation mode under the thermal management program, including the dynamic frequency and voltage control unit and the power consumption and heat dissipation coordinated optimization unit; Control management module: controls the all-in-one computer according to the output of the dynamic frequency and voltage control unit and the power consumption and heat dissipation collaborative optimization unit; Visualization module: displays the analysis report on the computer page and interacts with the user interface.

2. The thermal management system of the integrated all-in-one computer according to claim 1, characterized in that: The method for modeling the power consumption and heat of the integrated all-in-one computer, generating a correlation expression of the power consumption and heat, and obtaining a power consumption-heat model includes: The power consumption-heat model is constructed based on the power consumption expression, heat correlation formula, and the formula affecting temperature difference and heat dissipation efficiency; The power consumption expression is: + ； The heat correlation formula is ; Temperature difference and heat dissipation efficiency influence formula , ; in, Indicates the total power consumption of the all-in-one computer. Represents the total power consumption of CPU and GPU, represents the total power consumption of other components, Indicates The capacitance of each component, Indicates The voltage of each component, Indicates The frequency of the components, Indicates Components and temperature The leakage current , Indicates the power consumption coefficient of memory, Indicates the memory load, Represents the power consumption coefficient of the storage device, Indicates the load of the storage device. represents the baseline power consumption of the motherboard and other fixed components, Indicates the comprehensive temperature of each component in the all-in-one computer. Indicates the ambient temperature, Indicates The thermal resistance of each component, Indicates The power consumption of each component, Indicates the heat dissipation efficiency, Indicates the comprehensive thermal resistance of each component in the all-in-one computer. Indicates the heat dissipation area, represents the convective heat transfer coefficient, Indicates the difference between the combined temperature of the components inside the all-in-one computer and the ambient temperature; And leakage current , is the leakage current at the selected reference temperature and supply voltage, It is the voltage when the all-in-one computer is working. , , , , and is a constant.

3. The thermal management system of the integrated all-in-one computer according to claim 2, characterized in that: The real-time data set includes the capacitance, frequency, voltage, temperature and thermal resistance of each component of the CPU and GPU, as well as the ambient temperature; Based on real-time data sets, use power-thermal models to calculate the temperature of each component, the total power consumption of the AIO PC, and the cooling efficiency; The temperature of each component, the total power consumption of the all-in-one computer, and the cooling efficiency form a conversion data set.

4. The thermal management system of the integrated all-in-one computer according to claim 3, characterized in that: The method of drawing a trend prediction curve according to the converted data set, judging the state of the all-in-one computer according to the curve, and selecting the operation mode according to the state includes: Preset the cycle time, discretize the current cycle time into time points, and acquire the conversion data set at a fixed sampling frequency at each time point; A two-dimensional coordinate system is drawn with the time point as the horizontal axis, and the temperature of each component in the conversion data set and the total power consumption of the all-in-one computer as the horizontal and vertical axes respectively. A curve fitting is performed for each two-dimensional coordinate system to obtain a curve expression of the temperature of each component and the total power consumption of the all-in-one computer in the cycle time; Calculate the state performance coefficient based on the curve expression ,like If the value is greater than the limit threshold, the computer is judged to be overheated and the thermal management program is started. If it is less than or equal to the limit threshold, it is determined that the all-in-one computer is not overheated and continues to work normally; in, and is the weight coefficient, and its value range is from 0 to 1. is the number of discrete time points in the cycle time, is the index of the time point, Indicates time point The value on Indicates time point The value on It represents the curve expression integrated over the period time.

5. The thermal management system of the integrated all-in-one computer according to claim 4, characterized in that: The operation modes under the thermal management program include performance priority mode, quiet priority mode and balanced mode; Performance priority mode means setting high thresholds for power consumption and temperature under high load, silent priority mode means limiting fan speed and power consumption, and balanced mode means striking a balance between performance and noise. Introduce a mode adaptive switching mechanism, specifically ,in, is the safety threshold of ambient temperature, is the average value of the current component load, is the preset load threshold, is the low load threshold.

6. The thermal management system of the integrated all-in-one computer according to claim 5, characterized in that: The design method of the dynamic frequency and voltage control unit includes: Define frequency dynamic control mechanism and voltage dynamic control mechanism for each component of the all-in-one computer; Frequency dynamic control mechanism ,in, Indicates the frequency after the component is dynamically adjusted. , , and For each temperature and load The preset frequencies in the state, and the values ​​are arranged from high to low, , and It is a preset multi-level temperature threshold, and the values ​​are arranged from low to high. Indicates the real-time temperature of the component, Represents the real-time load of the component, and is the preset load threshold; Voltage dynamic regulation mechanism ,in, Indicates the voltage after CPU or GPU is dynamically adjusted. is the reference voltage of the CPU or GPU, is the reference temperature of the CPU or GPU, is the temperature sensitivity coefficient of voltage.

7. The thermal management system of the integrated all-in-one computer according to claim 6, characterized in that: The design method of the power consumption and heat dissipation collaborative optimization unit includes: The power consumption and heat dissipation collaborative optimization unit includes a power consumption-heat dissipation adjustment mechanism and a collaborative optimization mechanism; The power consumption-heat dissipation adjustment mechanism includes power consumption allocation and optimization target. The power consumption allocation is , the optimization goal is ; in, is the dynamic allocation power consumption of the CPU or GPU, is the maximum power consumption of the CPU or GPU, is the dynamic adjustment coefficient, is the fan speed, is the total heat generated by the all-in-one computer. It's the fan noise. is the temperature fluctuation penalty coefficient, Refers to the first The rate of change of component temperature; The collaborative optimization mechanism is , is the base PWM frequency, is the frequency adjustment amplitude, It is the phase; The power consumption and heat dissipation collaborative optimization unit introduces a dynamic weight adjustment mechanism. The dynamic weight adjustment mechanism is ,in, Represents the dynamic user experience weight, is the base weight; is the environmental factor weight, and ; is the load factor weight, and ; in, and are the basic weights of environmental factors and load factors, and are the sensitivity coefficients of the environment and load, is the reference temperature, is the current load on all components, is the maximum load on all components, Indicates the average temperature change of each load, is the time interval in the cycle time.

8. The thermal management system of the integrated all-in-one computer according to claim 7, characterized in that: The method for regulating the all-in-one computer according to the outputs of the dynamic frequency and voltage regulation unit and the power consumption and heat dissipation coordinated optimization unit includes: The dynamically adjusted frequency and voltage are obtained according to the dynamic frequency and voltage control unit, the dynamically allocated power consumption and fan speed of the CPU or GPU are obtained according to the power consumption and heat dissipation collaborative optimization unit, and the all-in-one computer is regulated using the obtained frequency and voltage, power consumption and fan speed.

9. The thermal management system of the integrated all-in-one computer according to claim 8, characterized in that: The method of displaying the analysis report on a computer terminal page and performing interface interaction with a user comprises: Users click, query or download the analysis report through the computer page.

10. The thermal management system of the integrated all-in-one computer according to claim 9, characterized in that: The analysis report includes the status of the all-in-one computer, the selected operating mode, the obtained frequency and voltage, as well as the power consumption and fan speed.

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