Ultrasonic device

Abstract

The present invention provides an ultrasonic device capable of suppressing the influence of electromagnetic noise accompanying wireless communication in a wireless communication unit. The ultrasonic device of the present invention comprises: an ultrasonic sensor that transmits and receives ultrasonic waves and outputs an ultrasonic signal corresponding to the received ultrasonic waves; a circuit unit that is connected to the ultrasonic sensor and processes the ultrasonic signal input from the ultrasonic sensor to generate a received signal; a wireless communication unit that is connected to the circuit unit and converts the received signal into electromagnetic waves and transmits it to an external device; a housing that accommodates the ultrasonic sensor, the circuit unit, and the wireless communication unit; and a shielding unit that is disposed between the ultrasonic sensor and the wireless communication unit in the housing and shields the electromagnetic waves.

Description

Technical Field

[0001] The invention relates to an ultrasonic device. Background Art

[0002] Conventionally, as an ultrasonic device that transmits and receives ultrasonic waves, there is known a wireless communication type ultrasonic measuring device that transmits and receives signals with an external device by wireless communication (see, for example, Patent Document 1).

[0003] In the ultrasonic device described in Patent Document 1, a detection signal based on received ultrasonic waves output from an ultrasonic transducer array is modulated into a radio wave and transmitted from a wireless communication unit to an ultrasonic scope.

[0004] In an ultrasonic device that communicates with an external device through wireless communication, such as Patent Document 1, the operability is good because no cable is required, and the influence of external noise caused by the use of a long cable is also reduced. However, there is a problem that electromagnetic noise is generated along with the wireless communication in the wireless communication unit, which has an adverse effect on the ultrasonic signal output from the ultrasonic transducer.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2011-072583 Summary of the invention

[0006] The ultrasonic device involved in the first embodiment of the present disclosure comprises: an ultrasonic sensor, which transmits and receives ultrasonic waves and outputs ultrasonic signals corresponding to the received ultrasonic waves; a circuit unit, which is connected to the ultrasonic sensor and processes the ultrasonic signals input from the ultrasonic sensor to generate received signals; a wireless communication unit, which is connected to the circuit unit and converts the received signals into electromagnetic waves and transmits them to an external device; a housing, which accommodates the ultrasonic sensor, the circuit unit, and the wireless communication unit; and a shielding unit, which is arranged between the ultrasonic sensor and the wireless communication unit in the housing and shields the electromagnetic waves. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a cross-sectional view showing a schematic structure of the ultrasonic device according to the first embodiment.

[0008] Figure 2 This is a schematic plan view of the ultrasonic device according to the first embodiment with the upper housing removed.

[0009] Figure 3 It is a schematic plan view showing an example of the ultrasonic sensor according to the first embodiment.

[0010] Figure 4For use Figure 3 This is a schematic cross-sectional view of the ultrasonic sensor taken along line BB.

[0011] Figure 5 This is a block diagram of the ultrasonic device according to the first embodiment.

[0012] Figure 6 This is a block diagram of an ultrasonic device according to a second embodiment. DETAILED DESCRIPTION

[0013] First embodiment

[0014] Hereinafter, an ultrasonic device according to a first embodiment of the present disclosure will be described.

[0015] Figure 1 2 is a cross-sectional view showing a schematic structure of an ultrasonic device 1 according to the present embodiment. Figure 2 1 is a plan view of the ultrasonic device 1 according to the present embodiment with the upper housing 12 removed.

[0016] like Figure 1 As shown, the ultrasonic device 1 of this embodiment includes: a housing 10, an ultrasonic sensor 20, a relay substrate 30, a circuit substrate 40, a wireless communication substrate 50 (wireless communication unit), and a battery 60. The housing 10 includes a lower housing 11, an upper housing 12, a support portion 13 disposed between the lower housing 11 and the upper housing 12, and a sensor housing 15.

[0017] Here, in the following description, the thickness direction of the ultrasonic device 1 from the lower housing 11 toward the upper housing 12 is referred to as the Z direction. In addition, the direction perpendicular to the Z direction and from the wireless communication board 50 toward the ultrasonic sensor 20 is referred to as the X direction, and the direction perpendicular to the X direction and the Z direction and extending in the direction perpendicular to the X direction and the Z direction is referred to as the X direction. Figure 2 The direction from the bottom to the top of the paper is set as the Y direction.

[0018] Furthermore, the ultrasonic device 1 of the present embodiment can communicate with an external device 70 (see Figure 5 ) for wireless communication. Although the specific structure of the external device 70 in the present disclosure is omitted, a common computer such as a smart phone or tablet terminal, a personal computer, etc. can be used as the external device 70. The external device 70 receives a reception signal sent from the ultrasonic device 1, and performs various processes. For example, the external device 70 generates an internal tomographic image of the measurement object based on the reception signal, calculates the thickness of a specified part inside the measurement object, or confirms the operation state of a specified part of the measurement object.

[0019] Structure of Ultrasonic Sensor 20

[0020] The ultrasonic sensor 20 is a sensor that transmits and receives ultrasonic waves, and is disposed at one end (+X side) of the ultrasonic device 1 .

[0021] The ultrasonic sensor 20 transmits ultrasonic waves to the object to be measured, and receives ultrasonic waves reflected by the object to be measured. The ultrasonic sensor 20 is not particularly limited as long as it is a structure capable of transmitting and receiving ultrasonic waves. For example, a bulk ultrasonic element may be used, which transmits ultrasonic waves by applying voltage to a piezoelectric body, thereby vibrating the piezoelectric body itself, and detects the reflected wave using an ultrasonic signal outputted due to the deformation of the piezoelectric body itself caused by the reflected wave. Alternatively, a thin-film ultrasonic element may be used, which has a plurality of ultrasonic transducers in an array with piezoelectric elements arranged on a thin-film vibrating portion, and each vibrating portion is vibrated by applying voltage to the piezoelectric element, thereby transmitting ultrasonic waves.

[0022] In the present embodiment, a thin-film type ultrasonic element is used as the ultrasonic sensor 20 . Figure 3 , is a schematic top view showing an example of the ultrasonic sensor 20 of the present embodiment. Figure 4 for Figure 3 This is a schematic cross-sectional view of the ultrasonic sensor 20 taken along line BB.

[0023] In the ultrasonic sensor 20 , a plurality of ultrasonic transducers Tr are arranged in a two-dimensional array along the Y direction and the Z direction.

[0024] In addition, although Figure 3 In the figure, the number of ultrasonic transducers Tr is reduced for the sake of convenience, but in fact more ultrasonic transducers Tr may be configured.

[0025] like Figure 4 As shown, the ultrasonic sensor 20 is configured to include an element substrate 21 , a vibration plate 22 provided on the element substrate 21 , and a piezoelectric element 23 provided on the vibration plate 22 .

[0026] The element substrate 21 is composed of a semiconductor substrate such as Si, for example. The element substrate 21 includes a first surface 211 on the -X side and a second surface 212 on the +X side that forms a front and back relationship with the first surface 211. On the element substrate 21, a substrate opening 21A that opens from the first surface 211 to the second surface 212 is provided in a manner corresponding to each ultrasonic transducer Tr. In the present embodiment, each substrate opening 21A is a through hole that penetrates the element substrate 21 in the substrate thickness direction (X direction), and a vibration plate 22 is provided on the -X side of the through hole.

[0027] In addition, an acoustic matching material having an acoustic impedance close to that of the measurement object (e.g., a biological body) may be filled on the side (+X side) of the substrate opening 21A where the vibration plate 22 is not provided. As the acoustic matching material, for example, a resin material such as silicone may be used. Furthermore, an acoustic lens may be provided on the side (+X side) of the substrate opening 21A where the vibration plate 22 is not provided. In this case, an acoustic matching material having an acoustic impedance close to that of the acoustic lens is filled between the acoustic lens and the vibration plate 22.

[0028] The vibration plate 22 is composed of, for example, a laminate of SiO2 and ZrO2, and is provided so as to cover the entire -X side of the element substrate 21. That is, the vibration plate 22 is supported by the partition wall 21B constituting the substrate opening 21A, and blocks the -X side of the substrate opening 21A. The thickness dimension of the vibration plate 22 is sufficiently small relative to the thickness dimension of the element substrate 21.

[0029] The piezoelectric elements 23 are provided on the vibration plates 22 that close the substrate openings 21A. The piezoelectric elements 23 are composed of, for example, a stacked body in which a first electrode 23A, a piezoelectric layer 23B, and a second electrode 23C are stacked from the vibration plate 22 toward the -X side.

[0030] Here, a portion of the vibration plate 22 that closes the substrate opening 21A constitutes a vibration portion 22A, and the vibration portion 22A and the piezoelectric element 23 constitute one ultrasonic transducer Tr.

[0031] In such an ultrasonic transducer Tr, a rectangular wave voltage (driving signal) of a predetermined frequency is applied between the first electrode 23A and the second electrode 23C, so that the piezoelectric layer 23B is bent and the vibration part 22A is vibrated, thereby sending ultrasonic waves to the +X side. In addition, when the vibration part 22A vibrates due to the ultrasonic wave (reflected wave) reflected by the measured object, a potential difference is generated between the upper and lower parts of the piezoelectric layer 23B. Thus, by detecting the potential difference generated between the first electrode 23A and the second electrode 23C, the received ultrasonic wave can be detected.

[0032] In this embodiment, if Figure 3 As shown, the first electrodes 23A of the ultrasonic transducers Tr arranged in the Y direction are connected to each other. These first electrodes 23A are connected to the drive terminals 23D, and are electrically connected to a control substrate (not shown) via the drive terminals 23D, for example, a flexible printed substrate.

[0033] The second electrodes 23C of the ultrasonic transducers Tr arranged in the Z direction are connected to each other. These second electrodes 23C are connected to a common terminal 23E, and the common terminal 23E is electrically connected to the control substrate via a flexible printed substrate or the like.

[0034] Here, in this embodiment, the ultrasonic transducers Tr arranged in the Y direction are set as one transmitting and receiving group, and a plurality of transmitting and receiving groups are arranged in the Z direction. Although in this embodiment, each transmitting and receiving group is configured to be driven simultaneously, each transmitting and receiving group may be connected to an independent driving terminal 23D, in which case each transmitting and receiving group can be driven individually. In this case, by staggering the driving timing of each transmitting and receiving group, the transmission direction of the ultrasonic wave can be deviated to a specified direction, or the ultrasonic wave can be transmitted in a manner that converges to the measured depth. On the other hand, if Figure 3 In this way, when each ultrasonic transducer Tr is connected to one driving terminal 23D and driven simultaneously, ultrasonic waves can be converged to a predetermined depth by separately providing an acoustic lens.

[0035] Structure of the relay substrate 30

[0036] Back to Figure 1 as well as Figure 2 The relay substrate 30 connects the ultrasonic sensor 20 and the circuit substrate 40. Although not shown in the figure, the relay substrate 30 includes a terminal portion electrically connected to the drive terminal 23D or the common terminal 23E provided on the ultrasonic sensor 20, and a wiring circuit for connecting the terminal portion to the circuit substrate 40.

[0037] The connection between the relay substrate 30 and the ultrasonic sensor 20 and the connection between the relay substrate 30 and the circuit substrate 40 can use a flexible substrate or lead wire (not shown). In addition, a support portion 13 may be arranged between the relay substrate 30 and the circuit substrate 40, and the relay substrate 30 may be fixed to the support portion 13 by using a conductive screw, and the conductive screw may be brought into contact with or screwed to a terminal portion provided on the circuit substrate 40, thereby connecting the relay substrate 30 and the circuit substrate 40.

[0038] In addition, although a structure in which a relay substrate 30 is provided is illustrated in this embodiment, a structure in which the ultrasonic sensor 20 and the circuit substrate 40 are directly connected through an FPC (Flexible Print Circuit) or a lead wire, etc., may be adopted without providing the relay substrate 30.

[0039] Structure of the circuit board 40

[0040] The circuit board 40 is connected to the ultrasonic sensor 20 via the relay board 30. The circuit board 40 outputs a driving voltage for transmitting ultrasonic waves to the ultrasonic sensor 20. In addition, the circuit board 40 processes the ultrasonic signal input from the ultrasonic sensor 20 to generate a reception signal, and transmits the generated reception signal to an external device via the wireless communication board 50.

[0041] Figure 5 2 is a block diagram showing a schematic configuration of an ultrasonic device 1 according to the present embodiment.

[0042] More specifically, if Figure 5 As shown in the figure, the circuit board 40 of this embodiment includes a transmitting circuit 41, a receiving circuit 42 (signal generating unit), a switching circuit 43, a control circuit 44, and a circuit board side power supply IC 45. Although the details will be described later, the circuit board 40 is arranged between the lower housing 11 and the support portion 13 in the housing 10. Here, Figure 5 The ultrasonic sensor 20, the relay substrate 30, the transmission circuit 41, the receiving circuit 42, and the switch circuit 43 in the circuit substrate 40 included in the range A1 are structures that implement signal transmission based on analog signals and require noise countermeasures. The transmission circuit 41, the receiving circuit 42, and the switch circuit 43 included in the range A1 are equivalent to the circuit unit of the present disclosure.

[0043] The transmission circuit 41 generates a drive signal for outputting ultrasonic waves from the ultrasonic sensor 20 , and outputs the drive signal to the ultrasonic sensor 20 .

[0044] The receiving circuit 42 is configured to include, for example, a noise removal circuit, a signal amplification circuit, an ADC (analog / digital converter), etc., and performs signal processing on the ultrasonic signal input from the ultrasonic sensor 20 to generate a received signal. That is, the receiving circuit 42 is a signal generating unit of the present disclosure, which removes noise from the ultrasonic signal, amplifies the signal value of the ultrasonic signal by a predetermined amplification factor, and samples the signal value of the ultrasonic signal as an analog signal at a predetermined sampling frequency and converts the received signal into a digital signal.

[0045] The switch circuit 43 can switch between a transmission connection for connecting the transmission circuit 41 and the ultrasonic sensor 20 and a reception connection for connecting the reception circuit 42 and the ultrasonic sensor 20, and switches the connection state based on the control of the control circuit 44. In the case where the ultrasonic sensor 20 has a plurality of independent transmission and reception groups, a MUX (multiplexer) that can switch the connection state for each transmission and reception group may be used.

[0046] The control circuit 44 is constituted by, for example, a semiconductor device such as an FPGA (Field Programmable Gate Array) and functions as, for example, a transmission control unit 441 and a reception control unit 442 .

[0047] The transmission control unit 441 switches the switch circuit 43 to the transmission connection based on the start instruction of the ultrasonic measurement, generates a drive signal of a predetermined drive voltage in the transmission circuit 41, and transmits it to the ultrasonic sensor 20. As the start instruction, for example, the user can operate the external device 70 so that it is input to the ultrasonic device 1 from the external device 70, or an operation button is set in the ultrasonic device 1 and the user operates the operation button so that it is input.

[0048] After a predetermined time has passed from the ultrasonic transmission timing, the reception control unit 442 switches the switch circuit 43 to the reception connection, and causes the ultrasonic signal output from the ultrasonic sensor 20 to be processed in the reception circuit 42. Thus, the reception signal is input to the control circuit 44 as a digital signal.

[0049] Then, the reception control unit 442 transmits the reception signal input from the reception circuit 42 to the external device 70 via the wireless communication board 50 .

[0050] The circuit board side power IC 45 modulates the power supplied from the battery 60 via the communication board side power IC 52 into a voltage and power frequency suitable for the circuit board 40 and the ultrasonic sensor 20 , and supplies the modulated power to each component of the circuit board 40 .

[0051] The circuit board power IC45 is connected to the communication board power IC52 provided on the wireless communication board 50. In this embodiment, the power supplied from the battery 60 is modulated by the communication board power IC52 and supplied from the communication board power IC52 to the circuit board power IC45.

[0052] Structure of the wireless communication substrate 50

[0053] The wireless communication board 50 is connected to the circuit board 40 and the battery 60 .

[0054] Although details will be described later, the wireless communication board 50 is disposed between the upper housing 12 and the support portion 13 in the housing 10 and is disposed on the −X side of the battery 60 in the housing 10 .

[0055] The wireless communication board 50 includes a wireless module 51 , a communication board-side power supply IC 52 , and a battery charger 53 .

[0056] The wireless module 51 transmits a reception signal input from the circuit board 40 to the external device 70 . The wireless module 51 also receives information such as a start command of ultrasonic measurement transmitted from the external device 70 , and outputs it to the control circuit 44 of the circuit board 40 .

[0057] The communication board side power IC52 modulates the power supplied from the battery 60 into a voltage and power frequency usable for communication processing in the wireless module 51, and supplies it to the wireless module 51. In addition, the communication board side power IC52 supplies part of the power supplied from the battery 60 to the circuit board side power IC45.

[0058] Here, the power supply adjustment by the communication board side power supply IC 52 is implemented based on the communication frequency of the electromagnetic wave when wireless communication is performed through the wireless module 51. Figure 5 Each structure of the wireless communication board 50 surrounded by the range A2, especially the communication board side power supply IC 52 that performs power supply adjustment, becomes a generation source of electromagnetic waves (noise generation source).

[0059] The battery charger 53 is a charging circuit that charges the battery 60. The battery charger 53 is connected to, for example, a connector 55 exposed from the outer surface of the housing 10, and supplies power supplied from a charging cable connected to the connector 55 to the battery 60 to charge it.

[0060] Structure of the battery 60

[0061] The storage battery 60 is a secondary battery that supplies power to various components of the ultrasonic device 1, and various secondary batteries such as lithium ion batteries can be used. In addition, although the secondary battery is used as an example in this embodiment, the storage battery 60 may also use a primary battery.

[0062] The battery 60 is supported by the support portion 13 in the housing 10 , and is disposed between the upper housing 12 and the support portion 13 , and between the ultrasonic sensor 20 (relay board 30 ) and the wireless communication board 50 .

[0063] In such a storage battery 60 , the exterior is generally covered with a conductive cover 61 , and functions as an electromagnetic shield (that is, a shielding portion in the present disclosure).

[0064] Structure of the housing 10

[0065] As described above, the housing 10 includes the lower housing 11, the upper housing 12, the support portion 13, and the sensor housing 15. The lower housing 11 disposed on the -Z side of the ultrasonic device 1 is engaged with the upper housing 12 disposed on the +Z side to form an exterior decoration portion of the ultrasonic device 1. When the lower housing 11 and the upper housing 12 are engaged, a housing opening 14 is formed at the +X side end of the housing 10, and the sensor housing 15 is fixed to close the housing opening 14.

[0066] Preferably, the lower housing 11, the upper housing 12, the support 13, and the sensor housing 15 are made of a conductive material. As the conductive material, for example, a metal such as aluminum or a conductive resin may be used. Thus, by making the lower housing 11, the upper housing 12, and the sensor housing 15 of a conductive material, the ultrasonic sensor 20, the relay substrate 30, the circuit substrate 40, and the wireless communication substrate 50 arranged inside the housing 10 are shielded from the influence of external electromagnetic waves.

[0067] The support portion 13 is disposed between the lower housing 11 and the upper housing 12 .

[0068] The support portion 13 includes a battery engagement portion 131 that faces the upper housing 12 and conforms to the outer shape of the battery 60 . The battery 60 is fitted into the battery engagement portion 131 , so that the support portion 13 supports the battery 60 .

[0069] As described above, the support portion 13 is made of a conductive material and functions as an electromagnetic shielding member that shields electromagnetic waves between the +Z side (upper housing 12 side) and the -Z side (lower housing 11 side) of the support portion 13. In the present embodiment, the circuit board 40 and the wireless communication board 50 are arranged across the support portion 13. Thus, the electromagnetic shielding member is arranged between the circuit board 40 and the wireless communication board 50, thereby suppressing the influence of electromagnetic waves generated on the wireless communication board 50 on the circuit board 40.

[0070] In addition, although Figure 2In the example shown, the relay substrate 30, the circuit substrate 40, and the wireless communication substrate 50 are fixed to the support portion 13 by screwing, but the method of fixing them to the housing 10 is not particularly limited. For example, they may be fixed using an adhesive or the like, or they may be fixed by engaging a protruding claw provided on the support portion 13 with a hole provided on each substrate 30, 40, 50.

[0071] In addition, in this embodiment, the relay substrate 30 may be fixed to the upper housing 12 , the circuit substrate 40 may be fixed to the lower housing 11 , the wireless communication substrate 50 may be fixed to the upper housing 12 , or the like.

[0072] Arrangement of each structure in the ultrasonic device 1

[0073] Next, the arrangement of the ultrasonic sensor 20 , the relay board 30 , the circuit board 40 , the wireless communication board 50 , and the battery 60 in the ultrasonic device 1 will be described.

[0074] As described above, the ultrasonic sensor 20 is fixed to the sensor housing 15 that closes the housing opening 14 at the +X side end of the housing 10. In addition, the relay substrate 30 that relays the ultrasonic signal from the ultrasonic sensor 20 to the circuit substrate 40 is also provided on the +X side of the housing 10.

[0075] Furthermore, the circuit substrate 40 is arranged on the lower housing 11 side with respect to the relay substrate 30 via the support portion 13. In the circuit substrate 40, a transmission circuit 41, a reception circuit 42, and a switch circuit 43 for transmitting analog signals are arranged on the +X side of the circuit substrate 40. That is, the transmission circuit 41, the reception circuit 42, and the switch circuit 43 are arranged on the -Z side of the relay substrate 30.

[0076] The wireless communication board 50 is arranged on the -X side opposite to the ultrasonic sensor 20 and on the upper housing 12 side (+Z side) of the support portion 13 in the ultrasonic device 1. In addition, a battery 60 having a conductive cover 61 and a conductive support portion 13 having a battery engaging portion 131 for supporting the battery 60 are arranged between the wireless communication board 50, the ultrasonic sensor 20, and the relay board 30.

[0077] Here, in Figure 5As described above, the ultrasonic sensor 20 (ultrasonic sensor 20, transmission circuit 41, reception circuit 42, and switch circuit 43) surrounded by range A1 is a structure that implements signal transmission based on analog signals and is easily affected by electromagnetic waves, so noise countermeasures are required. On the other hand, the wireless communication board 50 surrounded by range A2 becomes a noise generation source centered on the communication board side power supply IC 52.

[0078] In the present embodiment, as described above, the structure included in the range A1 is arranged on the +X side of the ultrasonic device 1, and the structure included in the range A2 is arranged on the -X side of the ultrasonic device 1. Thus, since the structure included in the range A1 and the structure included in the range A2 of the noise generation source are arranged separately, it is possible to suppress the inconvenience that the noise generated from the structure included in the range A2 of the noise generation source affects the structure included in the range A1.

[0079] Furthermore, in the present embodiment, the battery 60 and the support portion 13 function as the shielding portion of the present disclosure and shield the electromagnetic waves generated in the structure included in the range A2. As a result, the electromagnetic waves generated on the wireless communication substrate 50 are further suppressed from affecting the analog signals of the various structures included in the range A1 (for example, the ultrasonic signal output from the ultrasonic sensor 20). In addition, since the received signal converted into a digital signal by the receiving circuit is not affected by noise, the control circuit 44 or the circuit substrate side power IC 45 in the circuit substrate 40 can also be arranged on the -X side close to the wireless communication substrate 50.

[0080] Effects of this embodiment

[0081] The ultrasonic device 1 of this embodiment includes: an ultrasonic sensor 20; a transmitting circuit 41, a receiving circuit 42, and a switch circuit 43 constituting a circuit unit; a wireless communication board 50 constituting a wireless communication unit; and a housing 10. The ultrasonic sensor 20 transmits and receives ultrasonic waves and outputs ultrasonic signals corresponding to received ultrasonic waves. The transmitting circuit 41, the receiving circuit 42, and the switch circuit 43 are connected to the ultrasonic sensor 20, and process the ultrasonic signals input from the ultrasonic sensor 20 by ultrasonic measurement to generate received signals. The wireless communication board 50 is connected to the circuit board 40 including the circuit unit, and converts the received signals into electromagnetic waves and transmits them to the external device 70. The housing 10 accommodates the ultrasonic sensor 20, the circuit board 40, and the wireless communication board 50. In addition, a shielding unit (battery 60 and support unit 13) is arranged between the ultrasonic sensor 20 and the wireless communication board 50 and shields electromagnetic waves in the housing 10.

[0082] As a result, an electromagnetic shielding device is provided between the wireless communication substrate 50, which is a noise generating source, and the ultrasonic sensor 20, the transmitting circuit 41, the receiving circuit 42, and the switching circuit 43, which implement signal transmission based on analog signals, thereby suppressing the increase of noise caused by the ultrasonic signal being affected by electromagnetic waves.

[0083] In this embodiment, the battery 60 is disposed between components in the range A1 including the ultrasonic sensor 20, the transmission circuit 41, the reception circuit 42, the switch circuit 43, and the relay board 30, and components in the range A2 including the wireless communication board 50. The battery 60 is covered with a conductive cover 61.

[0084] Thus, the battery 60 functions as the shielding part of the present disclosure, thereby suppressing the adverse condition that the electromagnetic waves generated on the wireless communication substrate 50 affect the structural components of the range A1, and suppressing noise. In addition, in the ultrasonic device 1 that communicates with the external device 70 through wireless communication, it is difficult to supply power from the external device 70 because it is not connected to the external device 70 in a wired manner. Therefore, in such an ultrasonic device 1, the battery 60 is usually provided for driving the ultrasonic sensor 20. In the present embodiment, since the battery 60 functions as the shielding part (electromagnetic shielding member), it is not necessary to separately set other components constituting the electromagnetic shielding member in the housing 10, thereby achieving a simplified structure of the ultrasonic device 1 compared to a structure in which a shielding part is separately set.

[0085] In the present embodiment, the housing 10 includes a conductive support portion 13 that supports the battery 60 , and the support portion 13 functions as a shield portion.

[0086] Thus, in addition to the battery 60, the support portion 13 can also function as a shielding portion, so that the electromagnetic wave generated on the wireless communication substrate 50 can be further suppressed from affecting the structural components of the range A1. In addition, in the ultrasonic device 1 equipped with the battery 60, the support portion 13 for arranging the battery 60 is usually provided. In the present embodiment, by making such a support portion 13 function as a shielding portion, it is not necessary to separately provide other components constituting an electromagnetic shielding member in the housing 10, thereby achieving a simplified structure of the ultrasonic device 1 compared with a structure in which a shielding portion is separately provided.

[0087] In the present embodiment, the lower housing 11 , the upper housing 12 , and the sensor housing 15 constituting the housing 10 also have conductivity.

[0088] Thus, the ultrasonic sensor 20 , the transmission circuit 41 , the reception circuit 42 , the switch circuit 43 , and the relay substrate 30 inside the housing 10 can be shielded from external electromagnetic waves, thereby suppressing the influence of noise caused by external electromagnetic waves.

[0089] In this embodiment, the receiving circuit 42 that generates a reception signal from an ultrasonic signal is arranged closer to the ultrasonic sensor 20 than the battery 60 constituting the shield. This can suppress the problem of noise being mixed into the ultrasonic signal and generate an appropriate reception signal.

[0090] In the present embodiment, the ultrasonic sensor 20 comprises: an element substrate 21 having a first surface 211 and a second surface 212, and having a substrate opening portion 21A extending from the first surface 211 to the second surface 212; a vibration plate 22 configured to cover the first surface 211 of the element substrate 21; and a piezoelectric element 23, which is arranged on the side of the vibration plate 22 opposite to the element substrate 21 at a position overlapping with the substrate opening portion 21A when viewed in the substrate thickness direction (X direction) from the first surface 211 toward the second surface 212, and the piezoelectric element 23 is constructed in a manner in which a first electrode 23A, a piezoelectric layer 23B and a second electrode 23C are stacked along the X direction.

[0091] By using such a thin film type ultrasonic element, it is possible to promote miniaturization of the ultrasonic device 1. In addition, although the distance between the wireless communication board 50 and the ultrasonic sensor 20 or each component constituting the circuit unit becomes closer in the miniaturized ultrasonic device 1, the influence of noise can be suppressed by providing a shielding portion such as the battery 60 or the support portion 13 between the wireless communication board 50 and each component constituting the circuit unit.

[0092] Second embodiment

[0093] Next, a second embodiment will be described.

[0094] In the first embodiment described above, a structure is illustrated in which the wireless communication unit of the present disclosure, i.e., the wireless communication substrate 50, is provided separately from the circuit substrate 40 of the present disclosure, which includes the transmission circuit 41, the reception circuit 42, and the switch circuit 43. On the other hand, a structure in which the wireless communication unit and the circuit unit are provided on one substrate may also be provided.

[0095] Figure 6 1 is a block diagram showing a schematic configuration of an ultrasonic device 1A according to the second embodiment. In the following description, the same reference numerals are used for configurations that have already been described, and the description thereof will be omitted or simplified.

[0096] The ultrasonic device 1A of the present embodiment includes a housing 10 , an ultrasonic sensor 20 , a relay substrate 30 , a circuit substrate 40A, and a battery 60 .

[0097] Furthermore, the circuit board 40A includes a wireless module 51 , a battery charger 53 , a power IC 46 , and the like in addition to the transmission circuit 41 , the reception circuit 42 , the switch circuit 43 , the control circuit 44 , and the circuit board-side power IC 45 .

[0098] That is, in this embodiment, the circuit board 40 and the wireless communication board 50 of the first embodiment are provided as an integrated board, and the various circuit structures are integrated on one board.

[0099] Furthermore, in the present embodiment, the transmitting circuit 41, the receiving circuit 42 and the switching circuit 43 constituting the circuit unit are arranged on the +X side close to the ultrasonic sensor 20 in the circuit substrate 40A, and the wireless module 51 and the power supply IC 46 constituting the wireless communication unit which become the noise generation source are arranged on the -X side opposite to the ultrasonic sensor 20 in the circuit substrate 40A.

[0100] In this embodiment, the various structures of the range A1 that implement signal transmission based on analog signals (ultrasonic sensor 20, relay substrate 30, transmission circuit 41, reception circuit 42, and switch circuit 43) and the various structures of the range A2 that become noise generation sources (wireless module 51 and power supply IC 46) are separated and configured. In addition, as in the first embodiment, a storage battery 60 is arranged as a shielding portion between the various structures of the range A1 and the various structures of the range A2.

[0101] This can achieve the same effects as those of the first embodiment, and can suppress the problem that analog signals such as ultrasonic signals are affected by electromagnetic waves and increase in noise, thereby enabling appropriate ultrasonic measurement to be performed in the ultrasonic device 1A.

[0102] Modifications

[0103] The present invention is not limited to the above-described embodiments, and modifications, improvements, and configurations obtained by appropriately combining the embodiments within the scope of achieving the object of the present invention are also included in the present invention.

[0104] Modification 1

[0105] In the above embodiment, the structure in which the relay substrate 30 is provided is exemplified. However, as described above, the relay substrate 30 may not be provided. In this case, the ultrasonic sensor 20 and the circuit substrate 40 may be directly connected.

[0106] Modification 2

[0107] Although in the above-mentioned embodiment, an example is shown in which the transmitting circuit 41, the receiving circuit 42 and the switching circuit 43 constituting the circuit unit of the present invention are arranged on the circuit substrate 40, for example, it is also possible to set a structure in which all or at least a part of these transmitting circuits 41, the receiving circuit 42 and the switching circuit 43 are arranged on the relay substrate 30.

[0108] Modification 3

[0109] In the above-described embodiment, the battery 60 and the support portion 13 are exemplified as the shielding portion, but a configuration in which another electromagnetic shielding member is provided may be adopted.

[0110] Furthermore, the battery 60 and the support 13 may not function as a shielding member. Even when the support 13 is made of a non-conductive resin member, the battery 60 can be provided to provide a shielding effect of an electromagnetic shielding member.

[0111] Summary of the Disclosure

[0112] The ultrasonic device involved in the first mode of the present disclosure comprises: an ultrasonic sensor, which transmits and receives ultrasonic waves and outputs ultrasonic signals corresponding to the received ultrasonic waves; a circuit unit, which is connected to the ultrasonic sensor and processes the ultrasonic signals input from the ultrasonic sensor to generate received signals; a wireless communication unit, which is connected to the circuit unit and converts the received signals into electromagnetic waves and transmits them to an external device; a housing, which accommodates the ultrasonic sensor, the circuit unit, and the wireless communication unit; and a shielding unit, which is arranged between the ultrasonic sensor and the wireless communication unit in the housing and shields electromagnetic waves.

[0113] Thus, an electromagnetic shield is provided between the wireless communication unit as a noise generation source and the ultrasonic sensor and circuit unit that perform signal transmission based on analog signals, thereby suppressing an increase in noise caused by the ultrasonic signal being affected by electromagnetic waves.

[0114] In the ultrasonic device of this aspect, preferably, the shielding unit is a battery that supplies power to the ultrasonic sensor, the circuit unit, and the wireless communication unit.

[0115] Thus, the storage battery for supplying electric power to each structure of the ultrasonic device can be used as a shielding portion, thereby simplifying the structure of the ultrasonic device.

[0116] In the ultrasonic device of this aspect, it is preferable that the battery is covered with a conductive cover.

[0117] Thus, the conductive cover of the battery functions as an electromagnetic shield, and the influence of electromagnetic waves generated in the wireless communication unit on the circuit unit and the ultrasonic sensor can be suppressed.

[0118] The ultrasonic device of this aspect preferably includes a battery for supplying power to the ultrasonic sensor, the circuit unit, and the wireless communication unit, the housing includes a conductive support portion for supporting the battery, and the shield portion is the support portion.

[0119] Therefore, in an ultrasonic device equipped with a battery, a support portion for supporting the battery is generally provided. In this aspect, by using a conductive support portion, the support portion can function as a shielding portion, thereby simplifying the structure of the ultrasonic device.

[0120] In the ultrasonic device of this aspect, preferably, the housing has conductivity.

[0121] This allows the ultrasonic sensor and the circuit unit to be shielded from external electromagnetic waves.

[0122] In the ultrasonic device of this aspect, preferably, the circuit unit includes a signal generating unit that generates the reception signal based on the ultrasonic signal, and the signal generating unit is arranged on a side closer to the ultrasonic sensor than the shielding unit.

[0123] Thus, the signal generating unit that generates a reception signal based on an ultrasonic signal output from the ultrasonic sensor is arranged closer to the ultrasonic sensor than the shielding unit, thereby suppressing the problem of noise being mixed in the ultrasonic signal and generating an appropriate reception signal.

[0124] In the ultrasonic device of this embodiment, the ultrasonic sensor comprises: a substrate having a first surface and a second surface, and having an opening extending from the first surface to the second surface; a vibration plate configured to cover the first surface of the substrate; and a piezoelectric element, which is arranged at a position overlapping with the opening on the side of the vibration plate opposite to the substrate when observed in the direction of the thickness of the substrate from the first surface toward the second surface, and the piezoelectric element is constructed in a manner in which a first electrode, a piezoelectric layer, and a second electrode are stacked along the thickness direction of the substrate.

[0125] This can make the ultrasonic sensor thinner and promote the miniaturization of the ultrasonic device. In such a miniaturized ultrasonic device, the distance between the wireless communication unit and the circuit unit is particularly shortened, but the influence of noise can be suppressed by providing a shielding unit between the wireless communication unit and the circuit unit.

[0126] Explanation of symbols

[0127] 1, 1A…ultrasonic device; 10…housing; 11…lower housing; 12…upper housing; 13…support portion (shielding portion); 14…housing opening; 15…sensor housing; 20…ultrasonic sensor; 21…element substrate (substrate); 21A…substrate opening (opening); 22…vibration plate; 23…piezoelectric element; 23A…first electrode; 23B…piezoelectric layer; 23C…second electrode; 30…relay substrate; 40, 40A…circuit substrate; 41…transmitting circuit; 42…receiving circuit; 43…switching circuit; 44…control circuit; 45…power supply IC on circuit substrate side; 46…power supply IC; 50…wireless communication substrate (wireless communication portion); 51…wireless module; 52…power supply IC on communication substrate side; 53…battery charger; 60…battery (shielding portion); 61…conductive cover; 70…external device; 211…first surface; 212…second surface.

Claims

1. An ultrasonic device comprising: An ultrasonic sensor that transmits and receives ultrasonic waves and outputs an ultrasonic signal corresponding to the received ultrasonic waves; a circuit unit connected to the ultrasonic sensor and processing the ultrasonic signal input from the ultrasonic sensor to generate a reception signal; a wireless communication unit connected to the circuit unit and converting the received signal into electromagnetic waves and sending the electromagnetic waves to an external device; a housing for housing the ultrasonic sensor, the circuit unit, and the wireless communication unit; The shielding unit is disposed in the housing between the ultrasonic sensor and the wireless communication unit and shields electromagnetic waves.

2. The ultrasonic device according to claim 1, wherein The shielding unit is a battery that supplies power to the ultrasonic sensor, the circuit unit, and the wireless communication unit.

3. The ultrasonic device according to claim 2, wherein: The storage battery is covered with a conductive cover.

4. The ultrasonic device according to claim 1, wherein A battery is provided for supplying power to the ultrasonic sensor, the circuit unit, and the wireless communication unit. The housing includes a conductive support portion that supports the battery. The shielding portion is the supporting portion.

5. The ultrasonic device according to claim 4, wherein: The support portion is arranged between the circuit portion and the wireless communication portion.

6. The ultrasonic device according to claim 1, wherein The housing is conductive.

7. The ultrasonic device according to claim 1, wherein The circuit unit includes a signal generating unit, and the signal generating unit generates the reception signal based on the ultrasonic signal. The signal generating unit is arranged on a side closer to the ultrasonic sensor than the shielding unit.

8. The ultrasonic device according to claim 1, wherein The ultrasonic sensor has: A substrate having a first surface and a second surface, and having an opening extending from the first surface to the second surface; a vibration plate arranged to cover the first surface of the substrate; a piezoelectric element disposed at a position overlapping with the opening when viewed in a substrate thickness direction from the first surface toward the second surface on a side surface of the vibration plate opposite to the substrate; The piezoelectric element is configured such that a first electrode, a piezoelectric layer, and a second electrode are stacked along the thickness direction of the substrate.

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