Packaging equipment for semiconductor IC (integrated circuit)
By introducing electric slide rails, cutting parts, extrusion rods and reciprocating screws into semiconductor IC packaging equipment, the problem of mold removal caused by the adhesion of plastics to the chip after injection molding is solved, and a more efficient packaging process and better product quality is achieved.
Patent Information
- Application Number
- CN202411847319.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-04-04
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
After injection molding of existing semiconductor IC packaging equipment, the plastic is prone to stick to the chip, resulting in difficulty in demolding, increasing production time and affecting efficiency.
A packaging device including an electric slide rail, a cutting piece, an extrusion rod and a reciprocating screw is designed. The cutting piece is driven to cut off the residual plastic in the injection molded piece by the electric slide rail. The extrusion rod stretches the plastic for cutting, and the reciprocating screw is used to position the semiconductor IC to ensure accurate packaging.
It effectively solves the problem of adhesion in semiconductor ICs during demolding, reduces manual intervention, shortens demolding time, and improves packaging efficiency and product quality.
Smart Images
Figure CN119748752A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor packaging, in particular to a packaging device for semiconductor IC. Background Art
[0002] The packaging of semiconductor IC is a key link to connect the chip with the external circuit. Since semiconductor chips are very fragile and are easily physically damaged when directly exposed to the external environment, packaging equipment is needed to form a hard shell on the outer surface of the semiconductor IC to effectively protect the chip from the external environment.
[0003] However, when the semiconductor is packaged using packaging equipment, the cooled plastic in the injection port will adhere to the encapsulated semiconductor, making it difficult to demold the semiconductor in the injection mold. Workers are required to use tools to cut off the residual glue in the injection port before they can remove the semiconductor, which greatly increases production time and affects the overall efficiency of encapsulation.
[0004] Therefore, the present invention proposes a packaging device for semiconductor IC to make up for and improve the deficiencies of the prior art. Summary of the invention
[0005] In view of the defects existing in the prior art, the present invention provides a packaging device for semiconductor IC, which can effectively solve the above technical problems.
[0006] The technical implementation scheme of the present invention is as follows: a packaging device for semiconductor ICs comprises a base, an electric push rod is fixedly connected to the inner side of the top of the base, a sliding member is slidably connected to the upper surface of the inner side of the base, a heating device is arranged on the inner side of the base, an injection mold is fixedly connected to the output end of the electric push rod, an injection mold is slidably connected to the upper surface of the injection mold, a first fixing member is symmetrically fixedly connected to the outer surface of the injection mold, both ends of the first fixing member are slidably engaged with the outer surfaces of both ends of the sliding member, an electric slide rail is fixedly connected to one side of the outer surface of the injection mold, and the electric push rod is fixedly connected to the injection mold. The rod is electrically controlled and connected to the inside of the electric slide rail, and a cutting piece is slidably connected to the inner side of the electric slide rail. The upper surface of the cutting piece away from one end of the injection mold is fixedly connected to a first sliding frame, and the other end of the first sliding frame is fixedly connected to a first rack, one side of the first rack is meshed with a spur gear, and the bottom of the spur gear is fixedly connected to a screw rod, and the bottom of the screw rod is rotatably connected to the upper surface of the injection mold, and the outer surface of the screw rod is threadedly connected to a second sliding frame, one side of the second sliding frame is fixedly connected to the outer surface of the bottom of the injection molded part, and the lower surface of the second sliding frame is slidably connected to the inner side of the upper surface of the injection mold.
[0007] More preferably, the size of the cutting piece is matched with the size of the bottom of the injection molded part.
[0008] More preferably, the upper surface of the injection mold is slidably connected with a lift piece, the lift piece is composed of a square frame and a plurality of cylindrical rods, the outer surfaces of the cylindrical rods of the lift piece are fixedly sleeved with a first spring, the bottom of the first spring is fixedly connected to the upper surface of the injection mold, the upper surface of the injection mold is symmetrically fixedly connected with guide rods, the top of one of the guide rods is slidably connected to one side of the square frame of the lift piece, the other side of the square frame of the lift piece is fixedly connected to a limiting block, the inner side of the limiting block is slidably connected to the outer surface of another guide rod, the outer surface of one of the guide rods is fixedly connected with a wedge block, the wedge block is inclined outward away from the upper and lower sides of the guide rod, and the inner side of one end of the base is slidably connected to a limiting piece.
[0009] More preferably, a return spring is fixedly sleeved on the outer surface of the limiting member, and the other end of the return spring is fixedly connected to the outer surface of the base.
[0010] More preferably, one end of the limiting member is pressed and matched with the inclined surface of the wedge block, and the inner side of the limiting block is matched in size with the outer surface of the wedge block.
[0011] More preferably, an extrusion rod is fixedly connected to the upper surface of the first sliding frame, the upper surface of the extrusion rod is inclined, the outer surface of the top of the injection molded part is symmetrically fixedly connected to the second fixing part, a pulling piece is slidably connected between the outer surfaces of the second fixing parts, the bottom of the pulling piece is attached to the upper surface of the injection molded part, and a fixing strip is fixedly connected to one side of the outer surface of the pulling piece.
[0012] More preferably, the inclined surface of the extrusion rod is extrusion-fitted with the outer surface of the fixing bar.
[0013] More preferably, a second spring is fixedly sleeved on the outer surface of each of the second fixing members, and the bottoms of the second springs are fixedly connected to the upper surface of the material pulling member.
[0014] More preferably, the outer surface of the injection mold is fixedly connected to a fixing rod, the bottom of the fixing rod is fixedly connected to a second rack, one side of the second rack is meshed with a one-way gear, the outer side of the one-way gear is fixedly connected to a reciprocating screw, the inner side of the one-way gear is fixedly connected to a connecting rod, the end of the connecting rod away from the one-way gear is fixedly connected to another reciprocating screw, the outer surface of the connecting rod is rotatably connected to the inside of the base, the outer surface of the reciprocating screw away from the one-way gear is threadedly connected to a pushing member, the inner wall of the pushing member is slidably connected to the outer surface of the sliding member, and the inner side of the top of the pushing member is slidably connected to a limiting member.
[0015] More preferably, a third spring is fixedly sleeved on the outer surface of the outer side of the limiting member, and one end of the third spring away from the limiting member is fixedly connected to one end of the pushing member.
[0016] Compared with the prior art, the present invention has the following advantages:
[0017] 1. The present invention can cut off the residual plastic in the injection molded part when the cutting piece is driven to slide to the right by the electric slide rail, so that the semiconductor IC can be more easily removed from the injection mold, thereby reducing manual intervention and enabling the injection molding machine to operate continuously and efficiently. After cutting, the demolding time can be greatly shortened, reducing the downtime of the packaging equipment and improving the overall plastic packaging efficiency.
[0018] 2. When the limiting piece blocks the limit block of the present invention, the injection mold can move upward at the bottom of the ejecting piece, and the semiconductor IC can be separated from the injection mold, thereby reducing the damage to the semiconductor IC during the demolding process and improving the quality of the semiconductor IC plastic packaging. When the injection mold drives the semiconductor IC to hit the bottom of the cylindrical rod of the ejecting piece, the force and position of each ejection are consistent, which helps to maintain the consistency and reliability of the product.
[0019] 3. The present invention can move the material pulling piece upward when the extrusion rod moves to the right, so that the plastic inside the injection molded part is slightly stretched, so that the cutting piece can cut the plastic more directly, reducing the resistance during cutting and improving the cutting efficiency. In addition, the plastic part can be stretched and then cut to accurately cut the plastic end, preventing incomplete cutting due to plastic shrinkage.
[0020] 4. The present invention can push the semiconductor IC to the center position of the sliding part when the reciprocating screw rotates and drives the limit part to push inward, so that the semiconductor IC can be accurately positioned in the center position during packaging, which helps to reduce errors in the packaging process, improve packaging accuracy, ensure the performance and quality of semiconductor IC devices, and avoid poor packaging due to position offset. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.
[0022] Figure 2 It is a schematic diagram of the three-dimensional structure of the base, electric push rod, sliding member and other components of the present invention.
[0023] Figure 3 This is a sectional view of the three-dimensional structure of the heating device, the injection mold, the first fixing member and other components of the present invention.
[0024] Figure 4 It is a schematic diagram of the three-dimensional structure of the screw rod, the first sliding frame, the electric slide rail and other components of the present invention.
[0025] Figure 5 It is a sectional view of the three-dimensional structure of the first rack, spur gear, second sliding frame and other components of the present invention.
[0026] Figure 6 This is a sectional view of the three-dimensional structure of the ejecting member, the first spring, the limiting member and other components of the present invention.
[0027] Figure 7 It is a schematic diagram of the three-dimensional structure of the limiting member, the guide rod, the wedge block and other components of the present invention.
[0028] Figure 8 It is a schematic diagram of the three-dimensional structure of the fixing strip, the second fixing member, the second spring and other components of the present invention.
[0029] Fig. 9 It is a schematic diagram of the three-dimensional structure of the fixing rod, the second rack and the reciprocating screw rod and other components of the present invention.
[0030] Fig.10 It is a three-dimensional structural schematic diagram of the one-way gear, the limiting member, the pushing member and other components of the present invention.
[0031] Fig.11 It is a schematic diagram of the three-dimensional structure of the reciprocating screw, one-way gear and connecting rod components of the present invention.
[0032] The markings of the components in the accompanying drawings are as follows: 1-base, 11-electric push rod, 12-sliding part, 13-injection molded part, 14-heating device, 15-injection mold, 16-first fixed part, 2-first rack, 21-spur gear, 22-screw, 23-first sliding frame, 24-electric slide rail, 25-cutting part, 26-second sliding frame, 3-top material part, 31-first spring, 32-limiting part, 321-reset spring, 33-guide rod, 34-wedge block, 35-limiting block, 4-extrusion rod, 41-pulling part, 411-fixing bar, 42-second fixing part, 43-second spring, 5-fixing rod, 51-second rack, 52-reciprocating screw, 53-one-way gear, 54-limiting part, 55-third spring, 56-connecting rod, 57-pushing part. DETAILED DESCRIPTION
[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0034] The present invention will be further described below in conjunction with the embodiments.
[0035] Embodiments of the present invention
[0036] refer to Figures 1 to 5 As shown, a semiconductor IC packaging device includes a base 1, an electric push rod 11 is fixedly connected to the inner side of the top of the base 1, a sliding member 12 is slidably connected to the upper surface of the inner side of the base 1, the two ends of the inner side of the base 1 are used to limit the sliding member 12 from sliding up and down, the upper surface of the sliding member 12 is used to place the semiconductor IC, a heating device 14 is arranged on the inner side of the center of the base 1, the heating device 14 is used to heat the plastic, an injection mold 15 is fixedly connected to the output end of the electric push rod 11, the output end of the electric push rod 11 is used to drive the injection mold 15 to move up and down, the injection mold 15 is used to inject the semiconductor IC, and the upper surface of the injection mold 15 slides An injection molded part 13 is connected through it, and the injection molded part 13 is used to transport the material to the inside of the injection mold 15. The outer surface of the injection mold 15 is symmetrically fixedly connected with a first fixing part 16. Both ends of the first fixing part 16 are slidably engaged with the outer surfaces of both ends of the sliding part 12. The first fixing part 16 is used to drive the sliding part 12 to slide up and down. The left side of the outer surface of the injection mold 15 is fixedly connected with an electric slide rail 24. The injection mold 15 is used to drive the electric slide rail 24 to move simultaneously. The electric push rod 11 is electrically controlled and connected to the inside of the electric slide rail 24. Since the electric push rod 11 is electrically controlled and connected to the inside of the electric slide rail 24, the inner side of the electric slide rail 24 is slidably connected. The cutting piece 25 and the electric slide rail 24 are used to drive the cutting piece 25 to slide left and right. The right end of the cutting piece 25 is used to cut the plastic inside the injection molded part 13. The upper surface of the left side of the cutting piece 25 is fixedly connected with the first sliding frame 23. The cutting piece 25 is used to drive the first sliding frame 23 to move simultaneously. The right end of the first sliding frame 23 is fixedly connected with the first rack 2. The first sliding frame 23 is used to drive the first rack 2 to slide simultaneously. The rear side of the first rack 2 is meshed with a spur gear 21. The first rack 2 is used to drive the spur gear 21 to rotate. The bottom of the spur gear 21 is fixedly connected with a screw rod 22. The spur gear 21 is used to drive the screw rod 22 to rotate simultaneously. The bottom of the screw rod 22 rotates Connected to the upper surface of the injection mold 15, the outer surface of the screw 22 is threadedly connected to the second sliding frame 26, the screw 22 is used to drive the second sliding frame 26 to move up and down, the right side of the second sliding frame 26 is fixedly connected to the outer surface of the bottom of the injection molded part 13, the second sliding frame 26 is used to drive the injection molded part 13 to move up and down, the lower surface of the second sliding frame 26 is slidably connected to the inner side of the upper surface of the injection mold 15, and when the cutting piece 25 is driven by the electric slide rail 24 to slide to the right, the residual plastic in the injection molded part 13 can be cut off, so that the semiconductor IC can fall off from the injection mold 15 more easily, thereby reducing manual intervention and allowing the injection molding machine to operate continuously and efficiently.
[0037] refer to Figure 6 and Figure 7As shown, a packaging device for semiconductor ICs is shown, the upper surface of the injection mold 15 is slidably connected with a ejector 3, the ejector 3 is composed of a square frame and a plurality of cylindrical rods, the cylindrical rods of the ejector 3 are used to eject the semiconductor IC packaged inside the injection mold 15, the outer surfaces of the cylindrical rods of the ejector 3 are fixedly sleeved with first springs 31, the bottom of the first spring 31 is fixedly connected to the upper surface of the injection mold 15, the first spring 31 is used to drive the ejector 3 to reset and slide, the upper surface of the injection mold 15 is symmetrically fixedly connected with guide rods 33, the top of the left guide rod 33 is slidably connected to the left side of the square frame of the ejector 3, the guide rod 33 is used to limit the left side of the ejector 3 from sliding on the outer surface of the guide rod 33, the right side of the square frame of the ejector 3 is fixedly connected with a limiting block 35, the inner side of the limiting block 35 is slidably connected to the outer surface of the right guide rod 33, the right guide rod 33 is used to limit the limiting block 35 The outer surface of the right guide rod 33 slides up and down, and a wedge block 34 is fixedly connected to the outer surface of the right guide rod 33. The guide rod 33 is used to drive the wedge block 34 to move simultaneously. The upper and lower sides of the right end of the wedge block 34 are inclined outward. The inner side of the right end of the base 1 is slidably connected with a limiting member 32. The right end of the base 1 is used to limit the limiting member 32 from sliding inside the base 1. The outer surface of the left side of the limiting member 32 is squeezed and matched with the inclined surface of the wedge block 34. The outer surface of the limiting member 32 is fixedly sleeved with a return spring 321. The left end of the return spring 321 is fixedly connected to the outer surface of the base 1. The return spring 321 is used to drive the limiting member 32 to reset and move. When the limiting member 32 blocks the limit block 35, the ejecting member 3 can move downward in the injection mold 15 to eject the semiconductor IC from the injection mold 15, thereby reducing the damage to the semiconductor IC during the demolding process and improving the quality of the semiconductor IC plastic packaging.
[0038] refer to Figure 8As shown, a packaging device for semiconductor IC, the upper surface of the first sliding frame 23 is fixedly connected with an extrusion rod 4, the first sliding frame 23 is used to drive the extrusion rod 4 to move left and right, the upper surface of the extrusion rod 4 is inclined to the right, the outer surface of the top of the injection molded part 13 is symmetrically fixedly connected with a second fixing member 42, the outer surface of the second fixing member 42 is slidably connected with a puller 41, the second fixing member 42 is used to limit the puller 41 from sliding on the outer surface of the second fixing member 42, the bottom of the puller 41 is attached to the upper surface of the injection molded part 13, the front side of the outer surface of the puller 41 is fixedly connected with a fixing bar 411, the fixing bar 411 is used to In order to drive the pulling piece 41 to move up and down, the inclined surface of the extrusion rod 4 is squeezed and matched with the outer surface of the fixing strip 411, and the extrusion rod 4 is used to drive the fixing strip 411 to move upward. The outer surface of the second fixing piece 42 is fixedly sleeved with a second spring 43, and the bottom of the second spring 43 is fixedly connected to the upper surface of the pulling piece 41. The second spring 43 is used to drive the pulling piece 41 to reset. When the extrusion rod 4 moves to the right, the pulling piece 41 can be moved upward, so that the plastic inside the injection molded part 13 is slightly stretched, so that the cutting piece 25 can cut the plastic more directly, reducing the resistance during cutting and improving the cutting efficiency.
[0039] refer to Figures 9 to 11As shown, a semiconductor IC packaging device is shown, the outer surface of the right side of the injection mold 15 is fixedly connected with a fixing rod 5, the injection mold 15 is used to drive the fixing rod 5 to move up and down, the bottom of the fixing rod 5 is fixedly connected with a second rack 51, when the fixing rod 5 moves up and down, the second rack 51 is driven to move simultaneously, the left side of the second rack 51 is meshed with a one-way gear 53, the second rack 51 is used to drive the one-way gear 53 to rotate, the outer side of the one-way gear 53 is fixedly connected with a reciprocating screw rod 52, the one-way gear 53 is used to drive the reciprocating screw rod 52 The one-way gear 53 rotates at the same time. A connecting rod 56 is fixedly connected to the inner side of the one-way gear 53. The outer surface of the connecting rod 56 is rotatably connected to the inside of the base 1. The one-way gear 53 is used to drive the connecting rod 56 to rotate on the inner side of the sliding member 12. The end of the connecting rod 56 away from the one-way gear 53 is fixedly connected to another reciprocating screw rod 52. The connecting rod 56 is used to drive the other reciprocating screw rod 52 to rotate at the same time. The outer surface of the reciprocating screw rod 52 away from the one-way gear 53 is threadedly connected to a pusher 57. The reciprocating screw rod 52 is used to drive the pusher 57 to rotate in the reciprocating gear 53. The outer surface of the multithread rod 52 reciprocates, and the inner wall of the pushing member 57 is slidably connected to the outer surface of the sliding member 12. The pushing member 57 is used to slide back and forth on the outer surface of the sliding member 12. The inner side of the top of the pushing member 57 is slidably connected to the limiting member 54. The pushing member 57 is used to drive the limiting member 54 to move inward. The inner side of the limiting member 54 is used to squeeze the outer surface of the semiconductor IC so that the semiconductor IC is located in the center of the upper surface of the sliding member 12. The outer surface of the outer side of the limiting member 54 is fixedly sleeved with a third spring 55. The end of the third spring 55 away from the limiting member 54 is fixedly connected to the inner side of the pushing member 57. The third spring 55 is used to drive the limiting member 54 to reset and move, and can adapt to semiconductor ICs of different sizes for central placement. When the reciprocating screw rod 52 rotates and drives the limiting member 54 to push inward, the semiconductor IC can be pushed to the center of the sliding member 12, so that the semiconductor IC can be accurately positioned in the center during packaging, which helps to reduce errors in the packaging process, improve packaging accuracy, and ensure the performance and quality of semiconductor IC devices.
[0040] The complete working principle and steps of the above embodiment are as follows:
[0041] refer to Figures 1 to 5 As shown, when the packaging device is in the initial state, the electric push rod 11 is in a retracted state, the sliding member 12 and the injection mold 15 are in a separated state, the cutting member 25 is slidably connected to the left end of the inner side of the electric slide rail 24, and the bottom of the second sliding frame 26 is attached to the inner side of the upper surface of the injection mold 15;
[0042] When the device is used to package a semiconductor IC, the semiconductor IC is first placed on the upper surface of the sliding member 12, and then the electric push rod 11 is started, so that the output end of the electric push rod 11 drives the injection mold 15 to move downward. When the injection mold 15 moves downward, it drives the first fixing members 16 on both sides to move simultaneously. Since the inner side of the bottom of the first fixing member 16 is slidably engaged with the two ends of the sliding member 12, when the first fixing member 16 moves downward, it drives the sliding member 12 to move simultaneously, causing the sliding member 12 to slide into the interior of the base 1. When the lower surface of the injection mold 15 is attached to the upper surface of the sliding member 12, At this time, the plastic encapsulation material is poured into the interior of the injection molded part 13, and the plastic encapsulation material will enter the interior of the injection mold 15 from the interior of the injection molded part 13, so that the plastic encapsulation material is scattered on the upper surface of the sliding part 12. After the plastic encapsulation material on the upper surface of the sliding part 12 is heated by the heating device 14, the injection mold 15 can encapsulate the semiconductor IC on the upper surface of the sliding part 12. When the semiconductor IC is encapsulated, the output end of the electric push rod 11 will drive the injection mold 15 to move upward. At this time, the encapsulated semiconductor IC will stick to the inner wall of the injection mold 15, and when the injection mold 15 moves upward, it will be driven by the first fixing member 16. The movable sliding member 12 moves upward, and since the electric push rod 11 is electrically controlled and connected to the inside of the electric slide rail 24, as the electric push rod 11 contracts inward, the electric slide rail 24 will drive the cutting member 25 to move to the right, and when the cutting member 25 moves to the right, it will drive the first sliding frame 23 to move at the same time, and when the first sliding frame 23 moves to the right, it will drive the first rack 2 to move at the same time. Since the rear side of the first rack 2 is engaged with the outer surface of the spur gear 21, when the first rack 2 moves to the right, it will drive the spur gear 21 to rotate, and when the spur gear 21 rotates, it will drive the screw 22 to rotate at the same time. The screw 22 is rotated at the injection mold 15. When the upper surface rotates, it will drive the second sliding frame 26 threadedly connected to the outer surface of the screw 22 to move upward. At this time, the second sliding frame 26 will drive the injection molded part 13 to move upward on the inner side of the upper surface of the injection mold 15. At this time, the cutting piece 25 will also move to the right, prompting the right end of the cutting piece 25 to cut off the remaining plastic at the bottom of the injection molded part 13, so that the semiconductor IC can fall off from the injection mold 15 more easily, thereby reducing manual intervention and enabling the injection molding machine to operate continuously and efficiently. After cutting, the demolding time can be greatly shortened, reducing the downtime of the packaging equipment and improving the overall plastic packaging efficiency.
[0043] As the plastic inside the injection molded part 13 is cut off, the electric slide rail 24 drives the cutting piece 25 to move to the left. When the cutting piece 25 moves to the left, it drives the first rack 2 to move at the same time through the first sliding frame 23. When the first rack 2 moves to the left, it drives the spur gear 21 to rotate in the opposite direction. As the spur gear 21 drives the screw 22 to rotate in the opposite direction, the second sliding frame 26 drives the injection molded part 13 to return to the initial state.
[0044] refer to Figure 6 and Figure 7As shown, when the packaging device is in the initial state, the first spring 31 and the return spring 321 are in a naturally relaxed state, and the left side of the limiting member 32 has not yet been squeezed by the inclined surface of the wedge block 34;
[0045] When the injection mold 15 moves downward, the guide rod 33 symmetrically fixedly connected to the upper surface of the injection mold 15 will be driven to move simultaneously. When the guide rod 33 moves downward, the ejecting piece 3 will be driven to move simultaneously. When the ejecting piece 3 moves downward, the limit block 35 will be driven to move simultaneously. At this time, the wedge block 34 fixedly connected to the outer surface of the guide rod 33 will also move simultaneously with the guide rod 33. At this time, when the wedge block 34 moves downward, the inclined surface of the wedge block 34 will be squeezed with the left end of the limit piece 32, causing the limit piece 32 to slide to the right on the right side of the base 1. When the limit piece 32 slides to the right, the return spring 321 will be prompted to move into a stretched state. As the wedge block 34 continues to slide downward, the left end of the limit piece 32 will be separated from the squeezing of the inclined surface of the wedge block 34. At this time, the return spring 321 in the stretched state will drive the limit piece 32 to slide to the left. When the injection mold 15 is packaged and moved upward, the guide rod 33 will be driven to move simultaneously, and the ejecting piece 3 will also be moved synchronously with the injection mold 15 through the first spring 31. When the ejector 3 moves upward, the limit block 35 will be driven to move at the same time. When the limit block 35 moves upward, it will be blocked by the left side of the limit piece 32. The limit block 35 will not drive the ejector 3 to move upward, and the injection mold 15 will also drive the guide rod 33 to move upward. At this time, the injection mold 15 will move upward on the outer surface of the cylindrical rod of the ejector 3, and the first spring 31 on the outer surface of the cylindrical rod of the ejector 3 will move to a compressed state. At this time, the semiconductor IC inside the injection mold 15 will be blocked by the bottom of the cylindrical rod of the ejector 3 when the injection mold 15 moves upward. As the injection mold 15 continues to move upward, the semiconductor IC will fall off from the inner side of the injection mold 15 due to the bottom of the cylindrical rod of the ejector 3, thereby reducing the damage to the semiconductor IC during the demolding process and improving the quality of the semiconductor IC plastic packaging. When the injection mold 15 drives the semiconductor IC to impact the bottom of the cylindrical rod of the ejector 3, the consistency of the force and position of each impact is made, which helps to maintain the consistency and reliability of the product.
[0046] When the injection mold 15 drives the guide rod 33 to move upward, the guide rod 33 will drive the wedge block 34 to move at the same time. When the wedge block 34 moves upward, it will pass through the inner side of the limit block 35, and cause the inclined surface at the top of the wedge block 34 to be squeezed with the left side of the limit piece 32, so that the limit piece 32 moves to the right on the right side of the base 1, and when the limit piece 32 moves to the right, it will drive the return spring 321 to move into a stretched state. As the wedge block 34 continues to move upward, the inclined surface of the wedge block 34 will be separated from the fit with the left side of the limit piece 32. At this time, the return spring 321 in the stretched state will drive the limit piece 32 to move to the left, and the right side of the limit piece 32 will be separated from the obstruction of the top of the limit block 35, and the first spring 31 in the compressed state will drive the ejection piece 3 to slide upward, causing the ejection piece 3 to return to the initial state.
[0047] refer to Figure 8 As shown, when the first sliding frame 23 moves to the right, it will drive the extrusion rod 4 to move at the same time. When the extrusion rod 4 moves to the right, the inclined surface of the top of the extrusion rod 4 will fit the lower surface of the fixing bar 411 and push the fixing bar 411 upward. When the fixing bar 411 moves upward, it will drive the pulling piece 41 to move at the same time. When the outer surface of the second fixing piece 42 moves upward, the pulling piece 41 will be separated from the fit with the top of the injection molded part 13 and prompt the second spring 43 to move into a compressed state. As the pulling piece 41 moves upward, it can drive the plastic inside the injection molded part 13 to move upward, so that the plastic inside the injection molded part 13 is slightly stretched, so that the right end of the cutting piece 25 can cut the plastic more sharply, reducing the resistance during cutting and improving the cutting efficiency. In addition, cutting after stretching the plastic part can accurately cut the plastic end to prevent incomplete cutting due to plastic shrinkage.
[0048] As the first sliding frame 23 drives the extrusion rod 4 to move rightward, the inclined surface of the upper surface of the extrusion rod 4 is disengaged from the bottom of the fixing strip 411, prompting the second spring 43 in a compressed state to drive the puller 41 to move downward, so that the bottom of the puller 41 is re-engaged with the upper surface of the injection molded part 13.
[0049] refer to Figures 9 to 11As shown, when the injection mold 15 moves downward, it will drive the second rack 51 to move simultaneously through the fixed rod 5. When the second rack 51 moves downward, it will drive the one-way gear 53 to rotate. At this time, the one-way gear 53 will rotate at the front end of the connecting rod 56, and when the connecting rod 56 rotates, it will drive another reciprocating screw 52 to rotate simultaneously. As the one-way gear 53 rotates, it will drive the reciprocating screw 52 to rotate simultaneously. Since the outer surface of the outer end of the reciprocating screw 52 is threadedly connected to the inner side of the bottom of the pushing member 57, when the reciprocating screw 52 rotates, it will cause the pushing member 57 to slide inward on the outer surface of the sliding member 12. When the pushing member 57 slides inward, it will drive the limiting member 54 to slide simultaneously through the third spring 55, so that the inner side of the limiting member 54 can squeeze the outer surface of the semiconductor IC, causing the semiconductor IC to be located at the center of the upper surface of the sliding member 12, which helps to reduce errors in the packaging process, improve packaging accuracy, ensure the performance and quality of semiconductor IC devices, and avoid poor packaging due to position offset.
[0050] When the limit member 54 squeezes the semiconductor IC, the limit member 54 will drive the third spring 55 to move outward, so that semiconductor ICs of different sizes can be squeezed. When the limit member 54 finishes squeezing the semiconductor IC, the reciprocating screw rod 52 will drive the pushing member 57 to slide outward. When the pushing member 57 slides outward, it can drive the limit member 54 to slide at the same time through the third spring 55, causing the limit member 54 to slide out from the upper surface of the sliding member 12, thereby avoiding squeezing of the limit member 54 when the injection mold 15 moves downward for packaging.
[0051] Although the present disclosure has been shown and described with reference to specific exemplary embodiments of the present disclosure, it should be understood by those skilled in the art that various changes in form and details may be made to the present disclosure without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents. Therefore, the scope of the present disclosure should not be limited to the above-mentioned embodiments, but should be determined not only by the appended claims, but also by the equivalents of the appended claims.
Claims
1. A packaging device for semiconductor IC, comprising a base (1), wherein an electric push rod (11) is fixedly connected to the inner side of the top of the base (1), a sliding member (12) is slidably connected to the upper surface of the inner side of the base (1), a heating device (14) is arranged on the inner side of the base (1), an injection mold (15) is fixedly connected to the output end of the electric push rod (11), an injection molded part (13) is slidably connected to the upper surface of the injection mold (15), a first fixing member (16) is symmetrically fixedly connected to the outer surface of the injection mold (15), and both ends of the first fixing member (16) are slidably engaged with the outer surfaces of both ends of the sliding member (12), wherein: An electric slide rail (24) is fixedly connected to one side of the outer surface of the injection mold (15); the electric push rod (11) is electrically controlled and connected to the inside of the electric slide rail (24); a cutting piece (25) is slidably connected to the inner side of the electric slide rail (24); a first sliding frame (23) is fixedly connected to the upper surface of the cutting piece (25) away from one end of the injection mold (15); a first rack (2) is fixedly connected to the other end of the first sliding frame (23); a spur gear (21) is meshed with one side of the first rack (2); a screw rod (22) is fixedly connected to the bottom of the spur gear (21); the bottom of the screw rod (22) is rotatably connected to the upper surface of the injection mold (15); a second sliding frame (26) is threadedly connected to the outer surface of the bottom of the injection mold (13); a second sliding frame (26) is fixedly connected to one side of the second sliding frame (26) to the outer surface of the second sliding frame (26); a lower surface of the second sliding frame (26) is slidably connected to the inner side of the upper surface of the injection mold (15).
2. A semiconductor IC packaging device according to claim 1, characterized in that: The size of the cutting piece (25) is adapted to the size of the bottom of the injection molded part (13).
3. A semiconductor IC packaging device according to claim 2, characterized in that: The upper surface of the injection mold (15) is slidably connected with a top material (3), the top material (3) is composed of a square frame and a plurality of cylindrical rods, the outer surfaces of the cylindrical rods of the top material (3) are fixedly sleeved with first springs (31), the bottom of the first springs (31) are fixedly connected to the upper surface of the injection mold (15), the upper surface of the injection mold (15) is symmetrically fixedly connected with guide rods (33), the top of one of the guide rods (33) is slidably connected to one side of the square frame of the top material (3), the other side of the square frame of the top material (3) is fixedly connected to a limiting block (35), the inner side of the limiting block (35) is slidably connected to the outer surface of another guide rod (33), the outer surface of one side of the guide rod (33) is fixedly connected with a wedge block (34), the upper and lower sides of the wedge block (34) away from the guide rod (33) are both inclined outwards, and the inner side of one end of the base (1) is slidably connected with a limiting member (32).
4. A semiconductor IC packaging device according to claim 3, characterized in that: A return spring (321) is fixedly sleeved on the outer surface of the limiting member (32), and the other end of the return spring (321) is fixedly connected to the outer surface of the base (1).
5. A semiconductor IC packaging device according to claim 4, characterized in that: One end of the limiting member (32) is pressed and matched with the inclined surface of the wedge block (34), and the inner side of the limiting block (35) is matched in size with the outer surface of the wedge block (34).
6. A semiconductor IC packaging device according to claim 5, characterized in that: The upper surface of the first sliding frame (23) is fixedly connected to an extrusion rod (4), the upper surface of the extrusion rod (4) is inclined, the outer surface of the top of the injection molded part (13) is symmetrically fixedly connected to a second fixing part (42), the outer surface of the second fixing part (42) is slidably connected to a material pulling part (41), the bottom of the material pulling part (41) is attached to the upper surface of the injection molded part (13), and one side of the outer surface of the material pulling part (41) is fixedly connected to a fixing strip (411).
7. A semiconductor IC packaging device according to claim 6, characterized in that: The inclined surface of the extrusion rod (4) is extrusion-fitted with the outer surface of the fixing strip (411).
8. A semiconductor IC packaging device according to claim 7, characterized in that: The outer surface of the second fixing member (42) is fixedly sleeved with a second spring (43), and the bottom of the second spring (43) is fixedly connected to the upper surface of the material pulling member (41).
9. A semiconductor IC packaging device according to claim 8, characterized in that: The outer surface of the injection mold (15) is fixedly connected to a fixed rod (5), the bottom of the fixed rod (5) is fixedly connected to a second rack (51), one side of the second rack (51) is meshed with a one-way gear (53), the outer side of the one-way gear (53) is fixedly connected to a reciprocating screw (52), the inner side of the one-way gear (53) is fixedly connected to a connecting rod (56), the end of the connecting rod (56) away from the one-way gear (53) is fixedly connected to another reciprocating screw (52), the outer surface of the connecting rod (56) is rotatably connected to the inside of the base (1), the outer surface of the end of the reciprocating screw (52) away from the one-way gear (53) is threadedly connected to a pusher (57), the inner wall of the pusher (57) is slidably connected to the outer surface of the sliding member (12), and the inner side of the top of the pusher (57) is slidably connected to a limiting member (54).
10. A semiconductor IC packaging device according to claim 9, characterized in that: The outer surface of the outer side of the limiting member (54) is fixedly sleeved with a third spring (55), and one end of the third spring (55) away from the limiting member (54) is fixedly connected to one end of the pushing member (57).