Chips and ink cartridges

Abstract

The embodiment of the present invention provides a chip and an ink cartridge, which relate to the field of printing technology. The chip includes a substrate and an IC module; the substrate has an external surface, and at least one terminal for contacting a contact pin of an image forming device is arranged on the external surface; the IC module is arranged on the external surface, and the IC module includes at least one internal pin and at least one external pin, each internal pin is connected to the substrate, each internal pin is electrically connected to a terminal, and each external pin is used to contact a contact pin of the image forming device, which can reduce the number of terminals, so that the chip can reduce the amount of materials used to manufacture the terminals, thereby reducing the production cost of the chip.

Description

Technical Field

[0001] The present invention relates to the field of printing technology, and in particular to a chip and an ink cartridge. Background Art

[0002] Image forming devices such as printers are common office equipment that provide convenience for modern office work. The image forming device is equipped with replaceable ink cartridges filled with ink. The ink cartridge is attached with a chip that stores information such as the type of ink, the cartridge manufacturing date, the number of printed pages, the cartridge serial number, and the amount of remaining ink.

[0003] In the related art, a chip includes a substrate, an integrated circuit (IC) module and a plurality of terminals disposed on the substrate, wherein the plurality of terminals are electrically connected to the IC module. The plurality of terminals are usually disposed on the substrate by a copper electroplating process, and the plurality of terminals are used to contact the tips of the corresponding contact pins of the image forming device. The IC module is soldered on the substrate.

[0004] However, there is a high cost problem in the chip production process. Summary of the invention

[0005] The embodiments of the present invention provide a chip and an ink cartridge to solve the problem of high cost in the production process of the chip.

[0006] On the one hand, an embodiment of the present invention provides a chip, which is installed on a cartridge body of an ink cartridge, wherein the ink cartridge is applied to an image forming device, wherein the image forming device has a mounting portion, wherein the mounting portion includes a plurality of contact pins, and wherein the chip includes:

[0007] a substrate having an external surface on which at least one terminal for contacting a contact pin of the image forming device is disposed;

[0008] An IC module, wherein the IC module is arranged on the external surface, the IC module includes at least one internal pin and at least one external pin, each of the internal pins is connected to the substrate, each of the internal pins is electrically connected to one of the terminals, and each of the external pins is used to contact a contact pin of the image forming device.

[0009] In a possible implementation manner, the contact pin has a side contact surface, and the external connection pin has a side connection surface intersecting with the external connection surface, and the side connection surface is used to contact the side contact surface of the contact pin.

[0010] In a possible implementation manner, the contact pin has an oblique contact surface, the external pin is provided with a bending section, the bending section has a corner portion, and the corner portion is used to contact the oblique contact surface of the contact pin.

[0011] In a possible implementation manner, the contact pin has a tip portion, and the external connection pin has a planar surface parallel to the external connection surface, and the planar surface is used to contact the tip portion of the contact pin.

[0012] In a possible implementation manner, the external pin is connected to the substrate; or,

[0013] The external pins are movable relative to the substrate.

[0014] In a possible implementation manner, the IC module has a ground signal processing unit, and the external pin is electrically connected to the ground signal processing unit.

[0015] In a possible implementation manner, the IC module has a clock signal processing unit, and the external pin is electrically connected to the clock signal processing unit.

[0016] In a possible implementation manner, the IC module has a data signal processing unit, and the external pin is electrically connected to the data signal processing unit.

[0017] In a possible implementation manner, the IC module has a reset signal processing unit, and the external pin is electrically connected to the reset signal processing unit.

[0018] In a possible implementation manner, the IC module has a power signal processing unit, and the external pin is electrically connected to the power signal processing unit.

[0019] On the other hand, an embodiment of the present invention provides an ink cartridge, comprising a main body and the chip as described above; the chip is mounted on the main body.

[0020] The embodiment of the present invention provides a chip and an ink cartridge. The IC module includes at least one external pin, each of which contacts a contact pin of an image forming device, which can reduce the number of terminals. Therefore, the chip can reduce the amount of materials used to manufacture the terminals, thereby reducing the production cost of the chip.

[0021] The external pins are made of metal sheets, and their structural strength and scratch resistance are stronger than those of the terminals obtained through the copper cladding process. During the installation of the ink cartridge, the contact pins of the image forming device are less worn on the external pins than those obtained through the copper cladding process, thereby increasing the service life of the chip.

[0022] By making direct contact with the contact pins through the external pins, the length of the signal path can be reduced, thereby reducing signal delay. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0024] Figure 1 A schematic diagram of a structure of a mounting portion of an ink cartridge installed in an image forming device provided by a first embodiment of the present invention;

[0025] Figure 2 for Figure 1 A schematic diagram of the structure of the installation part;

[0026] Figure 3 A schematic diagram of the structure of a chip provided in Embodiment 1 of the present invention;

[0027] Figure 4 for Figure 3 Schematic diagram of contact between the chip and the contact pin;

[0028] Figure 5 A schematic diagram of the structure of a chip provided in the second embodiment of the present invention;

[0029] Figure 6 for Figure 5 Schematic diagram of contact between the chip and the contact pin;

[0030] Figure 7 A schematic diagram of the structure of a chip provided in Embodiment 3 of the present invention;

[0031] Figure 8 for Figure 7 Schematic diagram of contact between the chip and the contact pin;

[0032] Fig. 9 A schematic diagram of contact between a chip and a contact pin provided in the fourth embodiment of the present invention;

[0033] Fig.10 A schematic diagram of contact between a chip and a contact pin provided in Embodiment 5 of the present invention;

[0034] Fig.11 This is a schematic diagram of the contact between the chip and the contact pin provided in the sixth embodiment of the present invention.

[0035] Description of reference numerals:

[0036] 10- chip; 11- substrate;

[0037] 111-external surface; 112-internal surface;

[0038] 113-through hole; 12-IC module;

[0039] 121-internal pin; 122-external pin;

[0040] 1221-corner; 1222-side connection surface;

[0041] 1223- flat surface; 13- terminal;

[0042] 1-ink cartridge; 2-installation part;

[0043] 100- ground contact pin; 200- clock contact pin;

[0044] 300-data contact pin; 400-reset contact pin;

[0045] 500-power contact pin; 101-tip;

[0046] 102- lateral contact surface; 103- oblique contact surface;

[0047] 1a- outlet section; 2a- ink supply section. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0050] In the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0052] In the above description, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0053] In the related art, the number of terminals of the chip is large, which results in a large amount of material used to manufacture the terminals, resulting in high chip production costs. In addition, during the installation of the ink cartridge, the tip of the contact pin of the image forming device slides along the surface of the terminal, causing great wear on the terminal, resulting in a reduced service life of the chip.

[0054] In order to solve the above problems, an embodiment of the present invention provides a chip and an ink cartridge. The IC module includes at least one external pin, and each external pin contacts a contact pin of an image forming device, which can reduce the number of terminals. Therefore, the chip can reduce the amount of materials used to manufacture the terminals, thereby reducing the production cost of the chip.

[0055] The external pins are made of metal sheets, and their structural strength and scratch resistance are stronger than those of the terminals obtained through the copper cladding process. During the installation of the ink cartridge, the contact pins of the image forming device are less worn on the external pins than those obtained through the copper cladding process, thereby helping to increase the service life of the chip.

[0056] The chip and ink cartridge provided by the embodiments of the present invention are described in detail below in conjunction with specific embodiments.

[0057] Embodiment 1

[0058] See also Figure 1 and Figure 2As shown, an embodiment of the present invention provides an ink cartridge 1, which is detachably mounted on a mounting portion 2 of an image forming device. The mounting portion 2 is a component of the image forming device, and is used to carry a plurality of or one ink cartridge 1.

[0059] The mounting portion 2 has an ink supply portion 2a and a stylus group, the stylus group including a plurality of stylus (see Figure 2 As shown). Exemplarily, the contact pin group includes 5 contact pins, and the 5 contact pins include a ground contact pin 100 (transmitting a ground signal), a clock contact pin 200 (transmitting a clock signal), a data contact pin 300 (transmitting a data signal), a reset contact pin 400 (transmitting a reset signal) and a power contact pin 500 (transmitting a power signal).

[0060] The ink cartridge 1 includes a main body. The main body stores ink. The main body is provided with a lead-out portion 1a. When the ink cartridge 1 is mounted on a mounting portion 2 of an image forming device, the lead-out portion 1a is engaged with an ink supply portion 2a, and the ink in the main body is supplied to the ink supply portion 2a through the lead-out portion 1a.

[0061] See also Figure 3 and Figure 4 As shown, the ink cartridge includes a chip 10. The chip 10 is mounted on the body.

[0062] The width direction of the chip 10 is the X-axis direction, and the width direction of the ink cartridge 1 is the same as the width direction of the chip 10. The height direction of the chip 10 is the Y-axis direction, and the height direction of the ink cartridge 1 is the same as the height direction of the chip 10. The thickness direction of the chip 10 is the Z-axis direction, and the length direction of the ink cartridge 1 is the same as the thickness direction of the chip 10. In some examples, the chip 10 is mounted on one side of the length direction of the ink cartridge 1. The ink cartridge 1 is installed in the mounting portion 2 along the Y-axis direction.

[0063] The chip 10 includes a substrate 11 .

[0064] The substrate 11 has an outer surface 111 and an inner surface 112. The outer surface 111 and the inner surface 112 are arranged opposite to each other in the thickness direction of the chip 10. The inner surface 112 of the substrate 11 faces the main body of the ink cartridge 1. The outer surface 111 of the substrate 11 faces away from the main body of the ink cartridge.

[0065] At least one terminal 13 for contacting with a contact pin of an image forming device is disposed on the external connection surface 111. The terminal 13 is disposed on the substrate 11 by a copper electroplating process.

[0066] The chip 10 includes an IC module 12. The IC module 12 stores information of the chip 10, for example, the IC module 12 stores information such as manufacturer information, ink volume information, consumable box category information, ink color, and the like.

[0067] The IC module 12 is disposed on the external connection surface 111 , that is, the IC module 12 and the terminals 13 are located on the same side of the substrate 11 .

[0068] The IC module 12 has five processing units, including a ground signal processing unit, a clock signal processing unit, a data signal processing unit, a reset signal processing unit and a power signal processing unit; the ground signal processing unit is used to process the ground signal sent by the image forming device; the clock signal processing unit is used to process the clock signal sent by the image forming device; the data signal processing unit is used to process the data signal sent by the image forming device; the reset signal processing unit is used to process the reset signal sent by the image forming device; and the power signal processing unit is used to process the power signal sent by the image forming device.

[0069] The IC module 12 includes at least one internal pin 121 and at least one external pin 122. Both the internal pin 121 and the external pin 122 are made of metal sheets.

[0070] The number of the internal connection pins 121 is equal to the number of the terminals 13 on the substrate 11. The sum of the number of the internal connection pins 121 and the number of the external connection pins 122 is equal to the number of the contact pins of the mounting portion 2.

[0071] Each internal pin 121 is connected to the substrate 11. For example, each internal pin 121 may be connected to the substrate 11 by welding.

[0072] Each of the internal pins 121 is electrically connected to one of the terminals 13 .

[0073] Each external pin 122 is connected to the substrate 11. For example, each external pin 122 may be connected to the substrate 11 by welding.

[0074] Each external pin 122 is used to contact a contact pin of the image forming device. In this way, the external pin 122 can replace the terminal, so that the chip 10 can reduce the number of terminals, thereby reducing the amount of material used to manufacture the terminal, thereby reducing the production cost of the chip 10.

[0075] The external pin 122 is made of metal sheet, and its structural strength and scratch resistance are stronger than the terminal 13 obtained by the copper cladding process. During the installation of the ink cartridge 1, the contact pin of the image forming device wears the external pin 122 less than the terminal 13 obtained by the copper cladding process, thereby increasing the service life of the chip 10.

[0076] By directly contacting the contact pin through the external pin 122, the length of the transmission signal path can be reduced, which is beneficial to reducing signal delay. It is also beneficial to reduce the adverse effects on signal transmission caused by the degradation of local conductive performance of the conductive path due to wear, oxidation, etc. when the conductive path corresponding to the signal transmission path is long.

[0077] In some examples, four terminals 13 are provided on the external surface 111 of the substrate 11, and the four terminals 13 may include a clock terminal, a data terminal, a reset terminal, and a power terminal. The IC module 12 includes four internal pins 121 and one external pin 122, and the four internal pins 121 are electrically connected to the clock signal processing unit, the data signal processing unit, the reset signal processing unit, and the power signal processing unit, respectively, and the external pin 122 is electrically connected to the ground signal processing unit. The four internal pins 121 are electrically connected to the four terminals 13, respectively. When the ink cartridge 1 is installed on the mounting portion 2, the clock terminal contacts the clock contact pin 200, the data terminal contacts the data, the reset terminal contacts the reset contact pin 400, the power terminal contacts the power contact pin 500, and the external pin 122 can replace the ground terminal of the existing chip used to contact the ground contact pin 100. The external pin 122 contacts the ground contact pin 100, so that the IC module 12 receives the clock signal through the clock terminal, receives the data signal through the data terminal, receives the reset signal through the reset terminal and resets the internal data, receives the power signal through the power terminal, and receives the ground signal through the external pin 122.

[0078] In a possible implementation manner, the external pin 122 contacts the tip portion 101 of the contact pin.

[0079] The external pin 122 may be arranged in a bent shape. The external pin 122 is provided with a bent section, which has a corner 1221, a side surface 1222 intersecting the external surface 111, and a flat surface 1223 parallel to the external surface 111. Exemplarily, the flat surface 1223 of the external pin 122 contacts the tip 101 of the contact pin.

[0080] Each stylus of the image forming device has a tip portion 101, a side contact surface 102, and an inclined contact surface 103. The tip portion 101 is located on one side of the stylus in the length direction of the ink cartridge 1. The side contact surface 102 is located on one side of the stylus in the width direction of the ink cartridge. The inclined contact surface 103 is located on one side of the stylus in the height direction of the ink cartridge 1, and the inclined contact surface 103 intersects with the tip portion 101 and the side contact surface 102, respectively.

[0081] Embodiment 2

[0082] See also Figure 5 and Figure 6 As shown, the chip 10 in the second embodiment is different from the chip 10 in the first embodiment in that: a plurality of through holes 113 are provided on the substrate 11, and the inner wall of each through hole 113 is electroplated with copper. Each internal pin 121 and each external pin 122 are respectively welded to the inner wall of the corresponding through hole 113.

[0083] The structures of the remaining parts are the same as those of the first embodiment, and this embodiment has the same or similar technical effects as those of the first embodiment.

[0084] Embodiment 3

[0085] See also Figure 7 and Figure 8 As shown, the chip 10 in the third embodiment is different from the chip 10 in the first embodiment in that the external pins 122 can move relative to the substrate 11. The external pins 122 do not contact the substrate 11, and the external pins 122 are in a flat plate structure.

[0086] One end of the external pin 122 is in a suspended state. The external pin 122 can be elastically deformed. When the ink cartridge 1 is mounted on the mounting portion 2, the external pin 122 elastically contacts the tip portion 101 of the contact pin, so that the external pin 122 and the contact pin are in stable contact.

[0087] The structures of the remaining parts are the same as those of the first embodiment, and this embodiment has the same or similar technical effects as those of the first embodiment.

[0088] Embodiment 4

[0089] See also Fig. 9 As shown, the chip 10 in the fourth embodiment is different from the chip 10 in the first embodiment in that: four terminals 13 are provided on the external surface 111 of the substrate 11, and the four terminals 13 may include a clock terminal, a data terminal, a ground terminal and a power terminal. The IC module 12 includes four internal pins 121 and one external pin 122, and the four internal pins 121 are electrically connected to the clock signal processing unit, the data signal processing unit, the ground signal processing unit and the power signal processing unit, respectively, and the external pin 122 is electrically connected to the reset signal processing unit. The four internal pins 121 are electrically connected to the four terminals 13, respectively. When the ink cartridge is installed on the mounting portion, the clock terminal contacts the clock contact pin 200, the data terminal contacts the data, the ground terminal contacts the ground contact pin 100, the power terminal contacts the power contact pin 500, and the external pin 122 can replace the reset terminal of the existing chip used to contact the reset contact pin 400. The external pin 122 contacts the reset contact pin 400, so that the IC module 12 receives the clock signal through the clock terminal, receives the data signal through the data terminal, receives the ground signal through the ground terminal, receives the power signal through the power terminal, receives the reset signal through the external pin 122 and resets the internal data.

[0090] The external connection pin 122 may be arranged in a bent shape. The external connection pin 122 has a side connection surface 1222 intersecting with the external connection surface 111 , and the side connection surface 1222 contacts the side contact surface 102 of the contact pin.

[0091] Exemplarily, the external pin 122 has a side surface 1222 intersecting with the external surface 111 in the width direction of the chip 10. When the ink cartridge is mounted on the mounting portion, the side surface 1222 of the external pin 122 contacts the side contact surface 102 of the contact pin in the width direction of the ink cartridge. In this way, the ink cartridge can be limited in position by the cooperation between the external pin 122 and the contact pin in the width direction of the ink cartridge.

[0092] The structures of the remaining parts are the same as those of the first embodiment, and this embodiment has the same or similar technical effects as those of the first embodiment.

[0093] Embodiment 5

[0094] See also Fig.10 As shown, the chip 10 in the fifth embodiment is different from the chip 10 in the first embodiment in that: four terminals 13 are provided on the external surface 111 of the substrate 11, and the four terminals 13 may include a clock terminal, a reset terminal, a ground terminal and a power terminal. The IC module 12 includes four internal pins 121 and one external pin 122, and the four internal pins 121 are electrically connected to the clock signal processing unit, the reset signal processing unit, the ground signal processing unit and the power signal processing unit, respectively, and the external pin 122 is electrically connected to the data signal processing unit. The four internal pins 121 are electrically connected to the four terminals 13, respectively. When the ink cartridge is installed on the mounting portion, the clock terminal contacts the clock contact pin 200, the reset terminal contacts the reset contact pin 400, the ground terminal contacts the ground contact pin 100, the power terminal contacts the power contact pin 500, and the external pin 122 can replace the data terminal of the existing chip used to contact the data contact pin 300. The external pin 122 contacts the data contact pin 300, so that the IC module 12 receives the clock signal through the clock terminal, receives the ground signal through the ground terminal, receives the reset signal through the reset terminal and resets the internal data, receives the power signal through the power terminal, and receives the data signal through the external pin 122.

[0095] The external pin 122 is arranged in a bent shape. The external pin 122 is provided with a bent section, and the bent section has a corner 1221, and the corner 1221 contacts the inclined contact surface 103 of the contact pin (see Figure 2 shown) contact.

[0096] In some examples, when the ink cartridge is mounted on the mounting portion, in the height direction of the ink cartridge, the corner 1221 of the external pin 122 contacts the inclined contact surface 103 of the contact pin. In this way, the ink cartridge is limited in the height direction of the ink cartridge.

[0097] The structures of the remaining parts are the same as those of the first embodiment, and this embodiment has the same or similar technical effects as those of the first embodiment.

[0098] Embodiment 6

[0099] See also Fig.11 As shown, the chip 10 in the sixth embodiment is different from the chip 10 in the first embodiment in that: three terminals 13 are provided on the external surface 111 of the substrate 11, and the three terminals 13 may include a clock terminal, a reset terminal, and a data terminal. The IC module 12 includes three internal pins 121 and two external pins 122, the three internal pins 121 are electrically connected to the clock signal processing unit, the reset signal processing unit, and the data signal processing unit, respectively, and the two external pins 122 are electrically connected to the power signal processing unit and the ground signal processing unit, respectively. The three internal pins 121 are electrically connected to the three terminals 13, respectively. When the ink cartridge is installed on the mounting portion, the clock terminal contacts the clock contact pin 200, the reset terminal contacts the reset contact pin 400, and the data terminal contacts the data contact pin 300. The two external pins 122 can replace the power terminal of the existing chip for contacting the power contact pin 500 and the ground terminal for contacting the ground contact pin 100. The two external pins 122 contact the power contact pin 500 and the ground contact pin 100 respectively, so that the IC module 12 receives the clock signal through the clock terminal, receives the data signal through the data terminal, receives the reset signal through the reset terminal and resets the internal data, and receives the power signal and the ground signal through the two external pins 122 respectively.

[0100] The external connection pin 122 has a planar connection surface 1223 parallel to the external connection surface 111 and a side connection surface 1222 intersecting the external connection surface 111 .

[0101] Exemplarily, the flat surface 1223 of the external pin 122 in contact with the power contact pin 500 contacts the tip 101 of the contact pin. The side surface 1222 of the external pin 122 in contact with the power contact pin 500 contacts the side contact surface 102 of the contact pin.

[0102] The structures of the remaining parts are the same as those of the first embodiment, and this embodiment has the same or similar technical effects as those of the first embodiment.

[0103] It should be noted that, in other embodiments, four terminals 13 are provided on the external surface 111 of the substrate 11, and the four terminals 13 may include a data terminal, a reset terminal, a ground terminal, and a power terminal. The IC module 12 includes four internal pins 121 and one external pin 122, and the four internal pins 121 are electrically connected to the data signal processing unit, the reset signal processing unit, the ground signal processing unit, and the power signal processing unit, respectively, and the external pin 122 is electrically connected to the clock signal processing unit. The four internal pins 121 are electrically connected to the four terminals 13, respectively. When the ink cartridge is installed on the mounting portion, the data terminal contacts the data contact pin 300, the reset terminal contacts the reset contact pin 400, the ground terminal contacts the ground contact pin 100, the power terminal contacts the power contact pin 500, and the external pin 122 can replace the clock terminal of the existing chip used to contact the clock contact pin 200. The external pin 122 contacts the clock contact pin 200, so that the IC module 12 receives the ground signal through the ground terminal, receives the data signal through the data terminal, receives the reset signal through the reset terminal and resets the internal data, receives the power signal through the power terminal, and receives the clock signal through the external pin 122. The structure of the remaining parts is the same as that of the first embodiment, and this embodiment has the same or similar technical effects as the first embodiment.

[0104] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip mounted on a cartridge body of an ink cartridge, wherein the ink cartridge is applied to an image forming device, wherein the image forming device has a mounting portion, wherein the mounting portion includes a plurality of contact pins, wherein: The chip comprises: a substrate having an external surface on which at least one terminal for contacting a contact pin of the image forming device is disposed; An IC module, wherein the IC module is arranged on the external surface, the IC module includes at least one internal pin and at least one external pin, each of the internal pins is connected to the substrate, each of the internal pins is electrically connected to one of the terminals, and each of the external pins is used to contact a contact pin of the image forming device.

2. The chip according to claim 1, characterized in that: The contact pin has a side contact surface, and the external connection pin has a side connection surface intersecting with the external connection surface, wherein the side connection surface is used to contact the side contact surface of the contact pin.

3. The chip according to claim 1, characterized in that: The contact pin has an oblique contact surface, the external pin is provided with a bending section, the bending section has a corner portion, and the corner portion is used to contact the oblique contact surface of the contact pin.

4. The chip according to claim 1, characterized in that: The contact pin has a tip portion, and the external connection pin has a flat surface parallel to the external connection surface, wherein the flat surface is used to contact the tip portion of the contact pin.

5. The chip according to claim 1, characterized in that: The external pins are connected to the substrate; or, The external pins are movable relative to the substrate.

6. The chip according to any one of claims 1 to 5, characterized in that: The IC module has a ground signal processing unit, and the external pin is electrically connected to the ground signal processing unit.

7. The chip according to any one of claims 1 to 5, characterized in that: The IC module has a clock signal processing unit, and the external pin is electrically connected to the clock signal processing unit.

8. The chip according to any one of claims 1 to 5, characterized in that: The IC module has a data signal processing unit, and the external pin is electrically connected to the data signal processing unit.

9. The chip according to any one of claims 1 to 5, characterized in that: The IC module has a reset signal processing unit, and the external pin is electrically connected to the reset signal processing unit.

10. The chip according to any one of claims 1 to 5, characterized in that: The IC module has a power signal processing unit, and the external pin is electrically connected to the power signal processing unit.

11. An ink cartridge, characterized in that: comprising a main body and a chip as claimed in any one of claims 1 to 10; The chip is mounted on the body.

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