A diamond surface treatment process with high holding strength

Abstract

The present application relates to a kind of diamond surface treatment compositions, it includes the following proportion of raw materials: with volume fraction, nickel-plated diamond 12-35 parts, dispersing agent 40-50 parts, composite resin liquid 22-35 parts, photoinitiator 1-3 parts.The present application also provides a kind of process using the composition carries out diamond surface treatment with high holding strength: nickel-plated diamond, dispersing agent is mixed uniformly, composite resin liquid, photoinitiator is added and mixed uniformly after drying;Then carry out pre-photocuring treatment, subsequently dispersed;Finally with filler through three-dimensional mixer mixing uniformly and carrying out complete photocuring treatment, obtain the nickel-plated diamond with adhesive layer on surface after sieving.The diamond surface treatment process has the advantages of strong combination ability, with high holding strength, good dispersibility, and can be single large batch production, strong universality etc..

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of diamond surface treatment, and particularly relates to a diamond surface treatment process with high holding strength. BACKGROUND

[0002] Diamond has the advantages of high hardness, high wear resistance, high thermal conductivity, corrosion resistance and the like, and is widely used in cutting and grinding processing of silicon, silicon carbide, hard alloy and composite materials. Resin bond diamond grinding wheels have good self-sharpening and excellent processing surface quality, but the resin itself has low strength, and the holding capacity of resin for diamond is weaker than that of metal bond, resulting in generally low service life of resin diamond grinding wheels. In view of this problem, the industry often improves the holding force of resin bond for diamond by plating diamond surface, such as plating nickel to increase the weight by 30% and 56%. Although this method can improve the service life of diamond grinding wheels, the enhancement effect has reached the upper limit, and in addition, an excessively thick plating layer will hinder the opening of diamond, resulting in a decrease in sharpness of the grinding wheel and a decrease in processing efficiency.

[0003] A Chinese patent with the application number CN202310618643.1 mixes diamond, metal powder etching agent, additive and dispersant in a three-dimensional mixer, then puts the mixed material into a muffle furnace for etching heat treatment, and finally takes out the diamond after the treatment is completed, and screens the diamond with the metal mixed powder, additive and dispersant to obtain diamond with a rough surface. This method can produce in batches, but the etching temperature reaches 820 DEG C or higher, which consumes a lot of energy, and it is difficult to control the etching process and uniformity in the high-temperature furnace cavity. A Chinese patent with the authorization publication number CN117862967B washes plated diamond, then lays it in the inside of a hoisting column, pours grinding liquid into the grinding mechanism, and starts the grinding mechanism to grind the surface of the diamond for 5-15 minutes. This patent uses a grinding method to treat diamond, which will directly damage the surface plating layer, and the grinding resistance will affect the bonding strength between the plating layer and the diamond.

[0004] Therefore, the present application is developed. SUMMARY

[0005] The present application aims to overcome the defects of the prior art, break through the bottleneck of the existing diamond surface treatment technology, and provide a diamond surface treatment process which has strong bonding capacity, high holding strength, good dispersity, can be produced in large quantities at a time, and has strong universality.

[0006] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0007] A kind of diamond surface treatment composition, it includes the following proportion of raw materials: with volume fraction, nickel-plated diamond 12-35 parts, dispersing agent 40-50 parts, composite resin liquid 22-35 parts, light initiator 1173 1-3 parts.

[0008] Specifically, the dispersing agent includes but is not limited to one or more of ethanol, water, glacial acetic acid and KH550; the composite resin liquid includes but is not limited to one or more of phenolic resin, styrene, tripropylene glycol diacrylate.

[0009] Further, the dispersing agent is preferably 45-70 parts of ethanol, 5-10 parts of water, 5-15 parts of glacial acetic acid and 3-12 parts of KH550 by volume fraction.

[0010] Further, the composite resin liquid is preferably 25-40 parts of phenolic resin, 5-15 parts of styrene and 35-70 parts of tripropylene glycol diacrylate by volume fraction.

[0011] Further, the nickel layer of the nickel-plated diamond can be increased by 30%-56%, and the particle size is M35 / 54 or finer, specifically M36 / 54, M22 / 36, M20 / 30, M12 / 22, M10 / 20, M8 / 16, M8 / 12, M6 / 12, M5 / 10, M4 / 8, M3 / 6, etc. The nickel-plated diamond is a commonly available product.

[0012] The application provides the use of the above-mentioned composition in the surface treatment of high-holding-strength diamond.

[0013] The application provides a process for surface treatment of high-holding-strength diamond using the above-mentioned composition, which comprises the following steps:

[0014] S1, mix the nickel-plated diamond and the dispersing agent uniformly, add the composite resin liquid and the light initiator, mix uniformly and dry;

[0015] S2, pre-photocuring treatment is performed on the product obtained in step S1, and then dispersion is performed;

[0016] S3, mix the product after dispersion in step S2 and the filler uniformly by a three-dimensional mixer and perform complete photocuring treatment, and obtain the nickel-plated diamond with an adhesive layer on the surface after sieving.

[0017] Specifically, in step S1, the abrasive nickel-plated diamond can be placed in the dispersing agent, stirred at 60-90°C for 15-40 min, and then mixed uniformly with the composite resin liquid and the light initiator and dried; in step S2, the ultrasonic resonator can be used for dispersion, and the acceleration of the ultrasonic resonator can be 39.2-68.6 m / s 2The frequency can be 50-80 Hz, and the dispersion time can be 100-140 s.

[0018] Specifically, in step S2, the product can be placed in a light curing machine for 5-10 s of pre-light curing treatment; in step S3, the light curing time of the complete light curing treatment can be 10-45 s.

[0019] Further, in step S3, the filler can be ZrW2O8 powder with a particle size of 0.4-3.6 μm; the addition amount of the product after dispersion in step S2 can be 85-92 parts by volume, and the addition amount of the ZrW2O8 powder can be 8-15 parts.

[0020] Compared with the prior art, the application has the following advantages and beneficial effects:

[0021] The application light cures a layer of resin liquid on the surface of the diamond nickel layer, greatly improving the cross-linking ability of the diamond nickel layer with the resin bond of the grinding wheel; the introduction of the ZrW2O8 filler enhances the strength of the resin liquid on the surface of the nickel layer, adjusts the expansion coefficient of the resin liquid, and significantly reduces the interface bonding defects; the synergistic effect of the pre-light curing process and the filler solves the problem of easy agglomeration of the resin liquid on the surface of the nickel-plated diamond after complete light curing, and the obtained diamond particles have good dispersibility; at the same time, the process flow is simple, and the process can be used for single batch production, which has great application value in the grinding processing of glass, ceramic, hard alloy, silicon and silicon carbide materials. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 The flow chart of the diamond surface treatment process with high holding strength in the preferred embodiment of the application;

[0023] Figure 2 The SEM images of the diamond surfaces obtained in Example 1 and Comparative Example 1 of the application;

[0024] Figure 3 The SEM images of the fracture of the superhard grinding wheel obtained in Example 1, Example 2, Example 3 and Comparative Example 1 of the application.

[0025] Figure 4 The self-stripping rate statistical chart of the nickel-plated diamond of the SEM images of the fracture of the superhard grinding wheel obtained in Example 1, Example 2, Example 3 and Comparative Example 1 of the application. DETAILED DESCRIPTION

[0026] The technical solutions in the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only a part of the embodiments of the application, rather than all the embodiments of the application. The protection scope of the application is not limited thereto.

[0027] REFERENCE Figure 1As shown in the preferred embodiment of the present application, a diamond surface treatment process with high holding strength comprises the following steps:

[0028] S1, the plated nickel diamond, dispersant is mixed uniformly, the composite resin liquid, the light initiator is uniformly mixed and dried;

[0029] Among them, the adding amount of dispersant is 40-50 parts by volume, the adding amount of composite resin liquid is 22-35 parts, the adding amount of light initiator is 1-3 parts, and the adding amount of diamond is 12-35 parts; uniform mixing is to put the plated nickel diamond abrasive into the dispersant, stirring at 60~90℃ for 30min, adding composite resin liquid and light initiator 1173, mixing uniformly and drying.

[0030] The dispersant is composed of one or more of ethanol, water, glacial acetic acid and KH550; the ratio of ethanol, water, glacial acetic acid and KH550 in the dispersant of this embodiment is: by volume, ethanol 45-70 parts, water 5-10 parts, glacial acetic acid 5-15 parts, KH550 3-12 parts.

[0031] The composite resin liquid is composed of one or more of phenolic resin, styrene and tripropylene glycol diacrylate; the ratio of phenolic resin, styrene and tripropylene glycol diacrylate in the composite resin liquid of this embodiment is: by volume, phenolic resin 25-40 parts, styrene 5-15 parts, tripropylene glycol diacrylate 35-70 parts.

[0032] The plated nickel diamond abrasive has a nickel layer with a weight gain of 30% and 56%, and a particle size of M35 / 54.

[0033] S2, the diamond obtained in step S1 is subjected to pre-photocuring treatment, and then dispersed by using an ultrasonic resonator;

[0034] Among them, the pre-photocuring treatment is to place the diamond obtained in step S1 in the photocuring machine for 5~10s of pre-photocuring, the acceleration of the ultrasonic resonator is 58.8m / s 2 , the frequency is 50-80Hz, and the dispersion time is 100-140s.

[0035] S3, the dispersed diamond of step S2 is mixed with the filler by a three-dimensional mixer and subjected to complete photocuring treatment, and then sieved to obtain plated nickel diamond with adhesive layer on the surface.

[0036] Among them, the photocuring time of complete photocuring treatment is 10~45s. The filler is ZrW2O8 powder with a particle size of 0.4~3.6μm, and the adding amount of ZrW2O8 powder is 8-15 parts by volume.

[0037] Example 1

[0038] A surface treatment process of nickel-plated diamond (commonly marketed product) with particle size M22 / 36 and weight gain of 30%, comprising the following steps:

[0039] S101, preparation of dispersant

[0040] Take 69 parts of ethanol, 8 parts of water, 13 parts of glacial acetic acid and 10 parts of KH550 by volume fraction, mix the medicines and stir uniformly.

[0041] S102, preparation of composite resin solution

[0042] Take 35 parts of phenolic resin, 12 parts of styrene and 53 parts of tripropyleneglycol dipropylene acrylate by volume fraction, mix the medicines uniformly.

[0043] S103, mixing of nickel-plated diamond, dispersant, composite resin solution and photoinitiator

[0044] Put 30 parts of nickel-plated diamond abrasive into 45 parts of dispersant, stir at 60°C for 30 min, mix uniformly after adding 24 parts of composite resin solution and 1 part of photoinitiator, and dry.

[0045] S104, pre-photocuring treatment and ultrasonic dispersion

[0046] Put the dried diamond in step S103 into a photocuring machine for 8s of pre-photocuring, then use an ultrasonic resonator for dispersion, the acceleration of the ultrasonic resonator is 58.8m / s, the frequency is 80Hz, and the dispersion time is 140s. 2

[0047] S105, mixing with filler and complete photocuring treatment

[0048] Take 85 parts of pre-photocuring treated and dispersed diamond and 15 parts of ZrW2O8 powder by volume fraction, mix uniformly through a three-dimensional mixer, then put into a photocuring machine for 35s of complete photocuring treatment, and obtain nickel-plated diamond with adhesive layer on the surface after passing through a 400# sieve.

[0049] Example 2

[0050] A surface treatment process of nickel-plated diamond (commonly marketed product) with particle size M22 / 36 and weight gain of 56%, comprising the following steps:

[0051] S101, preparation of dispersant

[0052] Take 69 parts of ethanol, 8 parts of water, 13 parts of glacial acetic acid and 10 parts of KH550 by volume fraction, mix the medicines and stir uniformly.

[0053] S102, preparation of composite resin solution​

[0054] Take 25 parts of phenolic resin, 14 parts of styrene, 61 parts of tripropylene glycol diacrylate by volume fraction, and mix the medicines uniformly.

[0055] S103, mixing of nickel-plated diamond, dispersant, composite resin liquid, and photoinitiator

[0056] Put 30 parts of nickel-plated diamond abrasive into 45 parts of dispersant, stir at 60°C for 30 min, mix uniformly after adding 24 parts of composite resin liquid and 1 part of photoinitiator, and dry.

[0057] S104, pre-photocuring treatment and ultrasonic dispersion

[0058] Put the dried diamond in step S103 into a photocuring machine for 5s of pre-photocuring, and then use an ultrasonic resonator for dispersion, with an acceleration of 58.8m / s and a frequency of 80Hz, and a dispersion time of 140s. 2

[0059] S105, mixing with filler and complete photocuring treatment

[0060] Take 92 parts of pre-photocuring treated and dispersed diamond and 8 parts of ZrW2O8 powder by volume fraction, mix uniformly through a three-dimensional mixer, and then put into a photocuring machine for 30s of complete photocuring treatment, and obtain nickel-plated diamond with an adhesive layer on the surface after passing through a 400# sieve.

[0061] Example 3

[0062] The surface treatment process of nickel-plated diamond with particle size M8 / 12 and weight gain of 30% (commonly marketed product) includes the following steps:

[0063] S101, preparation of dispersant

[0064] Take 69 parts of ethanol, 8 parts of water, 13 parts of glacial acetic acid, and 10 parts of KH550 by volume fraction, mix the medicines, and stir.

[0065] S102, preparation of composite resin liquid

[0066] Take 35 parts of phenolic resin, 12 parts of styrene, and 53 parts of tripropylene glycol diacrylate by volume fraction, and mix the medicines uniformly.

[0067] S103, mixing of nickel-plated diamond, dispersant, composite resin liquid, and photoinitiator

[0068] ​30 parts of nickel-plated diamond abrasive by volume was put into 45 parts of dispersant, stirred for 30 min at 60℃, then 24 parts of composite resin liquid and 1 part of photoinitiator were added and mixed uniformly and dried.

[0069] S104, pre-photocuring treatment and ultrasonic dispersion

[0070] The dried diamond in step S103 was placed in a photocuring machine for 8 s of pre-photocuring, and then dispersed using an ultrasonic resonator with an acceleration of 58.8 m / s and a frequency of 80 Hz for 140 s. 2

[0071] S105, mixing with filler and complete photocuring treatment

[0072] 85 parts of pre-photocured diamond and 15 parts of ZrW2O8 powder by volume were mixed uniformly by a three-dimensional mixer and placed in a photocuring machine for 35 s of complete photocuring treatment, and then the nickel-plated diamond with an adhesive layer on the surface was obtained after passing through a 500# sieve.

[0073] Comparative Example 1

[0074] Nickel-plated diamond with a particle size of M22 / 36 and a weight gain of 30% without surface treatment (commonly commercially available product).

[0075] The diamond obtained in Example 1 and Comparative Example 1 was observed by scanning electron microscopy, as shown in Figure 2 the surface of the diamond without surface treatment in Comparative Example 1 was composed of a Ni layer, and the surface adhesive layer obtained by the method was composed of resin and ZrW2O8 powder, which was combined with the Ni layer on the surface of the diamond and was dense.

[0076] The diamond finally obtained in Example 1, Example 2, Example 3 and Comparative Example 1 was mixed uniformly with phenolic resin and silicon carbide, and then molded by a hot press to obtain a superhard grinding wheel. By Figure 3 and Figure 4 SEM analysis of the fracture of the superhard grinding wheel showed that the self-stripping rate of the Ni layer on the surface of the nickel-plated diamond with a particle size of M22 / 36 and a weight gain of 30%, the nickel-plated diamond with a particle size of M22 / 36 and a weight gain of 56%, and the nickel-plated diamond with a particle size of M8 / 12 and a weight gain of 30% was higher than that of Comparative Example 1, indicating that the holding strength of the phenolic resin binder to the Ni layer was higher, and the obtained superhard grinding wheel had good sharpness and high service life. As shown in Table 1, the tensile strength and hardness of the grinding wheel could be significantly improved by the process of the application.

[0077] Table 1 Tensile strength and Rockwell hardness test of superhard grinding wheels obtained in Examples 1-3 and Comparative Example 1 of the application

[0078] ​

[0079] The above additional technical features can be combined and used in addition to each other by those skilled in the art without conflicts.

[0080] It is to be understood that the application is described by way of example only and that modifications or substitutions can be made by those skilled in the art without departing from the spirit and scope of the application. In addition, modifications can be made to the features and embodiments described herein to adapt them to specific situations and materials without departing from the spirit and scope of the application. Thus, the application is not intended to be limited to the particular embodiments disclosed, but is to be accorded the full scope that the claims permit.

Claims

1. A composition for diamond surface treatment, characterized in that, The raw materials include the following proportions: by volume, 12-35 parts nickel-plated diamond, 40-50 parts dispersant, 22-35 parts composite resin liquid, and 1-3 parts photoinitiator; The dispersant is composed of a mixture of ethanol, water, glacial acetic acid, and KH550; the composite resin solution is composed of a mixture of phenolic resin, styrene, and tripropylene glycol diacrylate. The process of using the composition to perform diamond surface treatment with high holding strength includes the following steps: S1. Mix the nickel-plated diamond and dispersant evenly, add the composite resin liquid and photoinitiator, mix evenly, and then dry. S2. The product obtained in step S1 is subjected to pre-photocuring treatment, followed by dispersion; S3. The product dispersed in step S2 is mixed evenly with the filler through a three-dimensional mixer and then subjected to complete photocuring treatment. After sieving, nickel-plated diamond with an adhesive layer on the surface is obtained.

2. The composition for diamond surface treatment as described in claim 1, characterized in that, The dispersant is formulated in the following proportions by volume: 45-70 parts ethanol, 5-10 parts water, 5-15 parts glacial acetic acid, and 3-12 parts KH550.

3. The composition for diamond surface treatment as described in claim 1, characterized in that, The composite resin liquid is formulated in the following proportions by volume: 25-40 parts phenolic resin, 5-15 parts styrene, and 35-70 parts tripropylene glycol diacrylate.

4. The composition for diamond surface treatment as described in claim 1, characterized in that, The nickel-plated diamond is a nickel-plated diamond with a nickel layer weight increase of 30%-56% and a particle size of M35 / 54 or finer.

5. The use of the composition according to any one of claims 1 to 4 in the surface treatment of high-holding-strength diamond.

6. A process for performing diamond surface treatment with high holding strength using the composition according to any one of claims 1 to 4, characterized in that, Includes the following steps: S1. Mix the nickel-plated diamond and dispersant evenly, add the composite resin liquid and photoinitiator, mix evenly, and then dry. S2. The product obtained in step S1 is subjected to pre-photocuring treatment, followed by dispersion; S3. The product dispersed in step S2 is mixed evenly with the filler through a three-dimensional mixer and then subjected to complete photocuring treatment. After sieving, nickel-plated diamond with an adhesive layer on the surface is obtained.

7. The process as described in claim 6, characterized in that, In step S1, the nickel-plated diamond is placed in a dispersant and stirred at 60-90℃ for 15-40 minutes. Then, the composite resin solution and photoinitiator are added, mixed thoroughly, and dried. In step S2, dispersion is performed using an ultrasonic resonator with an acceleration of 39.2-68.6 m / s². 2 The frequency is 50-80Hz, and the dispersion time is 100-140s.

8. The process as described in claim 6, characterized in that, In step S2, the product is placed in a photocuring machine for 5-10 seconds of pre-photocuring treatment; in step S3, the photocuring time for the complete photocuring treatment is 10-45 seconds.

9. The process as described in claim 6, characterized in that, In step S3, the filler is ZrW2O8 powder with a particle size of 0.4~3.6μm; by volume, the amount of the product added after dispersion in step S2 is 85-92 parts, and the amount of ZrW2O8 powder added is 8-15 parts.

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