A copper alloy wire electroplating device for shielding
By designing a copper alloy wire electroplating device including wire components, split vertical plates and split frames, the problem of difficulty in achieving uniform splitting of existing electroplating equipment is solved, and efficient electroplating operations under different conditions are achieved.
Patent Information
- Application Number
- CN202411780299.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-05
- Publication Date
- 2025-04-04
AI Technical Summary
It is difficult for existing electroplating equipment to adjust the uniform distribution lines of each electroplating copper wire under the electroplating solution to facilitate and efficiently, making it difficult to achieve adaptive and efficient electroplating operations when the number of electroplating copper wires and the depth of the electroplating solution changes.
A copper alloy wire plating device for shielding is designed, including an electroplating cell, wire assembly, split vertical plate, through cavity, vertical roller, roller shaft, winding pole and split frame. By rotating the boom, adjusting the height of the splitter frame, using elastic ropes to maintain equal spacing of the splitter frame, and driving the vertical roller to press the splitter frame by rotating the roller shaft, the fixed position of the splitter frame is achieved, ensuring the uniform splitting of the copper wire in the electroplating solution.
It realizes the convenient and efficient adjustment of the uniform distribution lines of each electroplated copper wire under the electroplating solution, adapting to the changes in the number of different electroplated copper wires and the depth of the electroplated solution, and achieving the effect of efficient electroplated operation.
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Figure CN119753788A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of copper wire electroplating equipment, and in particular to a copper alloy wire electroplating device for shielding. Background Art
[0002] The existing copper and copper alloys have excellent electrical conductivity and can have good anti-electromagnetic shielding performance in high-frequency environments, but the electromagnetic shielding effect is not ideal in the low-frequency band. In this regard, by studying the composition of shielding copper alloys, continuously verifying and optimizing the ratio of various metals, and studying suitable electroplating formulas and process parameters during electroplating including cathode current density, solution temperature and pH value, the shielding effectiveness of the product can be improved. In this regard, the prior art, such as a copper wire electroplating device disclosed in CN117210920A, includes an electroplating tank, an inner insert, a brush assembly and a circulating pump assembly. One end of the electroplating tank is a feed end, and the other end is a discharge end. The interior is used to accumulate the electroplating solution. The inner insert tube is used to pass the copper wire through the tube, so that the copper wire enters below the surface of the electroplating solution from the feed end through the inner insert tube, and leaves the electroplating solution from the discharge end through the inner insert tube to realize the electroplating operation of the copper wire. However, in actual operation, in order to improve the electroplating efficiency, multiple copper wires are often electroplated through the electroplating tank at the same time. The specific number of copper wires to be electroplated and the depth of the electroplating solution need to be determined according to different electroplating processes or in accordance with the requirements of different electroplating products. However, for the existing electroplating equipment disclosed above, it is still difficult to complete the convenient and efficient adjustment of the uniform distribution of each electroplated copper wire under the electroplating solution when facing different numbers of electroplated copper wires and changes in the depth of the electroplating solution, so as to achieve adaptive and efficient electroplating operation. Summary of the invention
[0003] In view of this, the purpose of the present invention is to propose a shielding copper alloy wire electroplating device to solve the problem that it is difficult for existing electroplating equipment to conveniently and efficiently adjust the uniform distribution of each electroplated copper wire under the electroplating solution to achieve adaptive and efficient electroplating operations.
[0004] Based on the above purpose, the present invention provides a shielding copper alloy wire electroplating device, including an electroplating pool:
[0005] Conductor assemblies are provided at both ends of the electroplating tank for introducing a plurality of copper conductors into the electroplating tank for electroplating;
[0006] A line dividing plate is provided on the side of the conductor assembly, a through cavity is provided in the line dividing plate, a vertical roller is provided on one side of the through cavity, roller shafts are connected at eccentric positions at the upper and lower ends of the vertical rollers, and are connected to the through cavity through the rotation of the roller shafts, and a plurality of line dividing frames are arranged from top to bottom on the other side of the vertical rollers in the through cavity, and a single copper wire is passed through the line dividing frame, and electroplated in the electroplating tank;
[0007] Among them, the wire branching frame at the lowest end is fixedly connected in the through cavity, and elastic ropes are vertically connected between the wire branching frames. The top of the wire branching frame at the highest end is connected with a connecting rope, and the top of the wire branching vertical plate is rotatably connected to a winding rod. One end of the connecting rope is wound around the winding rod. By rotating the winding rod, the height of each wire branching frame except the lowest wire branching frame is adjusted, and the vertical roller is driven to rotate by rotating the roller shaft until the side end of the vertical roller is pressed against the side end of the wire branching frame, which is used to fix the position of the wire branching frame.
[0008] Preferably, the wire assembly includes a wire cover connected to the outer side of the top end of the branching plate, and a traction wheel is rotatably connected inside the wire cover. Multiple copper wires are pulled by the traction wheel, then branched by the branching plate and introduced into the electroplating pool for electroplating.
[0009] Preferably, the through cavity is symmetrically arranged on both sides of the line dividing plate, and the traction wheel is symmetrically arranged on both sides of the wire cover and is located above the line dividing frame.
[0010] Preferably, a wire wheel is rotatably connected inside the wire distribution frame, and two of them are symmetrically arranged. The copper wire is passed through the wheel grooves of the wire wheels on both sides and introduced into the electroplating bath for electroplating.
[0011] Preferably, the winding rod is rotatably connected to the top end of the line dividing plate in a transverse manner, and the outer end of the winding rod passes through the side end of the line dividing plate and is connected to a rod turning handle.
[0012] Preferably, the top end of the roller shaft passes through the top end of the dividing line vertical plate and is connected to an axis turning handle.
[0013] Preferably, an anti-skid pad is provided around the outer side of the vertical roller.
[0014] Preferably, a limit rod is passed through the winding rod along its axial direction, and a limit hole is correspondingly opened on the roller shaft. The limit hole is designed to be a polygonal shape matching the limit rod. When the side end of the vertical roller rotates and presses against the side end of the branching frame, the opening direction of the limit hole is toward the axial direction of the limit rod, and the limit rod is pushed inward so that the inner end of the limit rod is inserted into the limit hole.
[0015] Preferably, drainage tanks are symmetrically provided on both sides of the electroplating tank, and the top of the drainage tanks is covered with a filter net.
[0016] The beneficial effects of the present invention are as follows: a conductor assembly is respectively provided at both ends of the electroplating pool for introducing a plurality of copper conductors into the electroplating pool for electroplating; a branching vertical plate is provided on the side of the conductor assembly, a through cavity is opened in the branching vertical plate, a vertical roller is provided on one side of the through cavity, and a plurality of branching frames are arranged from top to bottom on the other side of the vertical roller in the through cavity; the branching frame is used to pass a single copper conductor and electroplate it in the electroplating pool; when facing different numbers of electroplated copper wires and changes in the depth of the electroplating solution, the winding rod is rotated to adjust the height of each branching frame except the branching frame at the lower end; since each branching frame is connected by the same elastic rope, the branching frames are kept at an equal distance; after the adjustment is completed, the vertical roller is driven to rotate by rotating the roller shaft until the side end of the vertical roller is pressed against the side end of the branching frame, which is used to tightly fix the position of the branching frame to prevent deviation during the electroplating operation, thereby realizing convenient and efficient adjustment of the uniform branching of each electroplated copper wire under the electroplating solution, and achieving the effect of adaptive and efficient electroplating operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;
[0019] Figure 2 It is a structural schematic diagram of the line separation vertical plate of the present invention;
[0020] Figure 3 It is a structural schematic diagram of the wire assembly of the present invention;
[0021] Figure 4 It is a structural schematic diagram of the limiting hole of the present invention;
[0022] Figure 5 It is a schematic diagram of the structure when the limit rod is pulled outward in the present invention;
[0023] Figure 6 It is a structural schematic diagram of the vertical roller of the present invention when it rotates away from the side end of the wire distribution frame;
[0024] Figure 7 It is a schematic diagram of the structure of the elastic rope of the present invention during elastic expansion and contraction adjustment;
[0025] Figure 8 It is a structural schematic diagram of the present invention when the side end of the vertical roller rotates and presses against the side end of the branching frame.
[0026] The markings in the figure are:
[0027] 100, copper conductor; 1, electroplating tank; 2, conductor assembly; 201, conductor cover; 202, traction wheel; 3, branch line plate; 31, through cavity; 32, vertical roller; 33, roller shaft; 34, winding rod; 35, rod turning handle; 36, shaft turning handle; 37, limit rod; 38, limit hole; 4, branch line frame; 41, conductor wheel; 5, elastic rope; 6, connecting rope; 7, sewage tank; 8, filter screen. DETAILED DESCRIPTION
[0028] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments.
[0029] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0030] like Figure 1 , Figure 2 , Figure 3 As shown, a shielding copper alloy wire electroplating device comprises an electroplating pool 1, and a conductor assembly 2 is respectively arranged at both ends of the electroplating pool 1, which is used to introduce a plurality of copper conductors 100 into the electroplating pool 1 for electroplating, and a line dividing plate 3 is arranged beside the conductor assembly 2, and a through cavity 31 is opened in the line dividing plate 3, and a vertical roller 32 is arranged on one side of the through cavity 31, and a roller shaft 33 is connected to the eccentric position of the upper and lower ends of the vertical roller 32, and is rotatably connected to the through cavity 31 through the roller shaft 33, and a plurality of line dividing frames 4 are arranged from top to bottom on the other side of the vertical roller 32 in the through cavity 31, and the line dividing frame 4 is used to pass a single copper conductor 1 00, and electroplated in the electroplating pool 1, wherein the lowest branch frame 4 is fixedly connected in the through cavity 31, and elastic ropes 5 are vertically connected between the branch frames 4, and the top of the highest branch frame 4 is connected with a connecting rope 6, and the top of the branch vertical plate 3 is rotatably connected with a winding rod 34, and one end of the connecting rope 6 is wound around the winding rod 34. By rotating the winding rod 34, it is used to adjust the height of each branch frame 4 except the lowest branch frame 4, and by rotating the roller shaft 33, the vertical roller 32 is driven to rotate until the side end of the vertical roller 32 is pressed against the side end of the branch frame 4, which is used to fix the position of the branch frame 4.
[0031] The present invention is based on the existing electroplating equipment structure, including an electroplating pool 1, and a conductor assembly 2 is respectively provided at both ends of the electroplating pool 1, which is used to introduce multiple copper conductors 100 into the electroplating pool 1 for electroplating, and a line dividing plate 3 is provided on the side of the conductor assembly 2, and a through cavity 31 is opened in the line dividing plate 3, and a vertical roller 32 is provided on one side of the through cavity 31, and a roller shaft 33 is connected to the eccentric position of the upper and lower ends of the vertical roller 32, and is rotatably connected to the through cavity 31 through the roller shaft 33, and a plurality of line dividing frames 4 are arranged from top to bottom on the other side of the vertical roller 32 in the through cavity 31, and a single copper conductor 100 is passed through the line dividing frame 4, so as to Figure 1 As shown, multiple copper wires 100 are pulled into the pool through the wire assembly 2 at one end, and then divided so that each single copper wire 100 is inserted into the pool through the wire splitter 4, and the single copper wire 100 is transmitted along the length direction in the pool, and then pulled out of the pool through the wire splitter stand 3 and the wire assembly 2 at the other end;
[0032] Among them, the lowermost branch frame 4 is fixedly connected to the through cavity 31, and elastic ropes 5 are vertically connected between the branch frames 4. Alternatively, the lowermost branch frame 4 can also be connected to the bottom of the through cavity 31 through the elastic rope 5, but because the bottom position of the electroplating pool 1 is fixed, the lowermost branch frame 4 is also preferably located at the lower end near the bottom of the pool, wherein the top of the uppermost branch frame 4 is connected to a connecting rope 6. Specifically, the elastic rope 5 can adopt an existing conventional elastic rope structure, which has good elastic coefficient, deformation resistance and other properties. The branch frames 4 are connected by elastic ropes 5 of exactly the same length and specification, and the top of the branch vertical plate 3 is rotatably connected to a winding rod 34, and one end of the connecting rope 6 is wound around the winding rod 34. On the wire rod 34, therefore, when facing different numbers of electroplated copper wires and changes in the depth of the electroplating solution, for example, when the depth of the electroplating solution changes, it is necessary to adaptively adjust the height spacing between the electroplated copper wires. The winding rod 34 can be rotated to adjust the height of each branch frame 4 except the branch frame 4 at the bottom. Since the branch frames 4 are connected by the same elastic rope 5, when the branch frame 4 at the top is pulled, the elastic ropes 5 can make the same elastic expansion and contraction changes, so as to keep the height spacing between the electroplated copper wires to make the same change, that is, the branch frames 4 are kept at an equal spacing. After the adjustment is completed, the vertical roller 32 is driven to rotate by rotating the roller shaft 33 until the side end of the vertical roller 32 is pressed against the side end of the branch frame 4, such as Figure 2 As shown, it is used to tightly fix the position of the wire splitter 4 to prevent deviation during the electroplating operation. When adjustment is needed next time, it is only necessary to rotate the roller shaft 33 to drive the vertical roller 32 to rotate so that the vertical roller 32 deviates from the side end of the wire splitter 4, that is, a gap is created between the vertical roller 32 and the side end of the wire splitter 4. In this way, it is possible to conveniently and efficiently adjust the uniform splitting of each electroplated copper wire under the electroplating solution, thereby achieving the effect of adaptive and efficient electroplating operation.
[0033] In an embodiment of the present invention, Figure 1 , Figure 2 , Figure 3 As shown, the wire assembly 2 includes a wire cover 201 connected to the outer side of the top end of the branching plate 3, and a traction wheel 202 is rotatably connected inside the wire cover 201. Specifically, multiple copper wires 100 can be pulled by the traction wheel 202, or by a traction wire feeding or wire taking-up device outside the electroplating pool 1, and then guided by the traction wheel 202, and then divided by the branching plate 3, and introduced into the electroplating pool 1 for electroplating.
[0034] Among them, if it is necessary to change the different numbers of electroplated copper wires, the connecting rope 6 can be pulled up first so that the upper branch frame 4 is exposed above the electroplating liquid surface. At this time, the copper wire 100 in the upper branch frame 4 can be cut off as needed, and then the connecting rope 6 is lowered, and the height of the branch frame 4 is adaptively adjusted to reduce the number of electroplated copper wires. Similarly, by first pulling the connecting rope 6 so that the upper branch frame 4 is exposed above the electroplating liquid surface, the newly added copper wire 100 can be inserted into the upper branch frame 4 as needed, and then the connecting rope 6 is lowered, and the height of the branch frame 4 is adaptively adjusted to increase the number of electroplated copper wires.
[0035] In the embodiment of the present invention, it is more preferred that Figure 1 , Figure 2 , Figure 3 As shown, the through cavity 31 is symmetrically arranged on both sides of the line dividing plate 3, and the traction wheels 202 are symmetrically arranged on both sides of the wire cover 201 and located above the line dividing frame 4, so that multiple copper wires 100 are arranged in the vertical direction on both sides of the pool, and the electroplating is transmitted along the length direction of the pool to improve the electroplating efficiency.
[0036] In the embodiment of the present invention, it is more preferred that Figure 1 , Figure 2 , Figure 3 As shown, a wire wheel 41 is rotatably connected inside the wire distribution frame 4, and two of them are symmetrically arranged. The copper wire 100 is inserted between the wheel grooves of the wire wheels 41 on both sides and introduced into the electroplating tank 1 for electroplating. Therefore, when the copper wire 100 is transmitted through the electroplating tank 1 for electroplating, the wire wheel 41 is driven to rotate, thereby avoiding hard friction and damaging the copper wire 100, and helping to improve the transmission efficiency.
[0037] In the embodiment of the present invention, it is more preferred that Figure 1 , Figure 2 , Figure 3 As shown, the winding rod 34 is connected to the top end of the dividing line plate 3 in a transversely rotatable manner, and the outer end of the winding rod 34 passes through the side end of the dividing line plate 3 and is connected to a rod turning handle 35.
[0038] In the embodiment of the present invention, it is more preferred that Figure 1 , Figure 2 , Figure 3As shown, the top end of the roller shaft 33 passes through the top end of the dividing line vertical plate 3 and is connected to the shaft turning handle 36.
[0039] In the embodiment of the present invention, it is more preferred that Figure 1 , Figure 2 , Figure 3 As shown, an anti-skid pad is attached around the outer side of the vertical roller 32, so as to further facilitate the close pressing of the side end of the branching frame 4 and firmly fix the position of the branching frame 4.
[0040] In the embodiment of the present invention, it is more preferred that Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, a limiting rod 37 is provided inside the winding rod 34 along its axial direction, and one end of the limiting rod 37 passing through the winding rod 34 and the rod turning handle 35 can also be connected to a handle, and a limiting hole 38 is correspondingly provided on the roller shaft 33, and the limiting hole 38 is designed to be a polygonal shape matching the limiting rod 37. When the side end of the vertical roller 32 rotates and presses against the side end of the branch frame 4, as shown in FIG. Figure 2 As shown, the opening direction of the limit hole 38 is toward the axial direction of the limit rod 37, and the connecting rope 6 can adopt a rope body structure with slight elasticity. At this time, each branch frame 4 has been pressed and fixed by the vertical roller 32, and the limit rod 37 is also facing the limit hole 38. Even if the polygonal orientation of the limit rod 37 is different from the polygonal orientation of the limit hole 38, the winding rod 34 can be slightly rotated to make the connecting rope 6 slightly elastically deformed and the limit rod 37 is pushed inward so that the inner end of the limit rod 37 can be smoothly inserted into the limit hole 38. At this time, the winding rod 34 cannot rotate anymore due to the limit rod 37, and the roller shaft 33 cannot rotate anymore, so as to achieve a stable fixing effect and avoid accidental adjustment. When adjustment is needed, Figure 5 As shown, pull out the limit rod 37, and then, as shown in Figure 6 As shown, the shaft handle 36 is rotated to make the vertical roller 32 deviate from the side end of the wire distribution frame 4, and then, as shown in FIG. Figure 7 As shown, the handle 35 of the rotating rod drives each elastic rope 5 to change elastically, and when the adjustment is completed, as shown in FIG. Figure 8 As shown, the shaft handle 36 is rotated again to press the side end of the vertical roller 32 against the side end of the wire distribution frame 4, and then the winding rod 34 is slightly rotated to push the limit rod 37 inward, thereby restoring to the position as shown in FIG. Figure 2 Normal working status shown.
[0041] In the embodiment of the present invention, it is more preferred that Figure 1 , Figure 2 , Figure 3As shown, drainage tanks 7 are symmetrically provided on both sides of the electroplating pool 1, and the top of the drainage tank 7 is covered with a filter screen 8. A bubbler or a circulation pump may be provided in the electroplating pool 1, thereby causing dynamic flow of the electroplating solution in the pool, which is beneficial to efficient electroplating and circulating liquid replacement. The circulating waste liquid can be discharged into the drainage tank 7, and the filter screen 8 can be used to filter solid impurities in the waste liquid, so as to facilitate the recycling of the electroplating solution.
[0042] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present invention is limited to these examples. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity.
Claims
1. A shielding copper alloy wire electroplating device, comprising an electroplating bath (1), characterized in that: The two ends of the electroplating pool (1) are respectively provided with a conductor assembly (2) for introducing a plurality of copper conductors (100) into the electroplating pool (1) for electroplating; A line dividing plate (3) is provided on the side of the conductor assembly (2), a through cavity (31) is provided in the line dividing plate (3), a vertical roller (32) is provided on one side of the through cavity (31), roller shafts (33) are connected at eccentric positions at the upper and lower ends of the vertical roller (32), and are rotatably connected to the through cavity (31) through the roller shaft (33), and a plurality of line dividing frames (4) are arranged from top to bottom on the other side of the vertical roller (32) in the through cavity (31), and a single copper wire (100) is passed through the line dividing frame (4), and electroplated in the electroplating bath (1); The lowermost wire splitter frame (4) is fixedly connected to the through cavity (31), and elastic ropes (5) are vertically connected between the wire splitters (4). The top of the uppermost wire splitter frame (4) is connected to a connecting rope (6). The top of the wire splitter vertical plate (3) is rotatably connected to a winding rod (34), and one end of the connecting rope (6) is wound around the winding rod (34). By rotating the winding rod (34), the height of each wire splitter frame (4) except the lowermost wire splitter frame (4) is adjusted. By rotating the roller shaft (33), the vertical roller (32) is driven to rotate until the side end of the vertical roller (32) is pressed against the side end of the wire splitter frame (4), so as to fix the position of the wire splitter frame (4).
2. The shielding copper alloy wire electroplating device according to claim 1, characterized in that: The wire assembly (2) comprises a wire cover (201) connected to the outer side of the top end of a wire separation plate (3); a traction wheel (202) is rotatably connected inside the wire cover (201); a plurality of copper wires (100) are pulled by the traction wheel (202), then separated by the wire separation plate (3), and introduced into the electroplating bath (1) for electroplating.
3. The shielding copper alloy wire electroplating device according to claim 2, characterized in that: The through cavity (31) is symmetrically arranged on both sides of the line dividing plate (3), and the traction wheel (202) is symmetrically arranged on both sides of the wire cover (201) and is located above the line dividing frame (4).
4. The shielding copper alloy wire electroplating device according to claim 1, characterized in that: The wire distribution frame (4) is rotatably connected to a wire wheel (41), and two of them are symmetrically arranged. The copper wire (100) is inserted between the wheel grooves of the wire wheels (41) on both sides and introduced into the electroplating bath (1) for electroplating.
5. The shielding copper alloy wire electroplating device according to claim 1, characterized in that: The winding rod (34) is rotatably connected to the top end of the line dividing plate (3) in a transverse manner. The outer end of the winding rod (34) passes through the side end of the line dividing plate (3) and is connected to a rod turning handle (35).
6. The shielding copper alloy wire electroplating device according to claim 1, characterized in that: The top end of the roller shaft (33) passes through the top end of the dividing line vertical plate (3) and is connected to a shaft turning handle (36).
7. The shielding copper alloy wire electroplating device according to claim 1, characterized in that: The outer side of the vertical roller (32) is surrounded by an anti-skid soft pad.
8. The shielding copper alloy wire electroplating device according to claim 1, characterized in that: A limiting rod (37) is provided inside the winding rod (34) along its axial direction, and a limiting hole (38) is correspondingly provided on the roller shaft (33). The limiting hole (38) is designed to be a polygonal shape matching the limiting rod (37). When the side end of the vertical roller (32) is rotated and pressed against the side end of the wire distribution frame (4), the opening direction of the limiting hole (38) faces the axial direction of the limiting rod (37), and the limiting rod (37) is pushed inwardly so that the inner end of the limiting rod (37) is inserted into the limiting hole (38).
9. The shielding copper alloy wire electroplating device according to claim 1, characterized in that: Drainage tanks (7) are symmetrically arranged on both sides of the electroplating tank (1), and the top of the drainage tank (7) is covered with a filter screen (8).
Citation Information
Patent Citations
Copper wire electroplating device
CN117210920A