Electroplating device and electroplating method for feature phone motherboard

Abstract

The present invention discloses an electroplating device and an electroplating method for a functional mobile phone motherboard. The device includes a supporting base plate, a gantry moving mechanism clamping mechanism and an electroplating treatment mechanism. Support members are arranged on both sides of the supporting base plate; the gantry moving mechanism is arranged at the top of the supporting member; the clamping mechanism includes a connecting frame and a clamping member, the clamping member is arranged at the bottom of the connecting frame, and the top of the connecting frame is transmission-connected with the bottom of the gantry moving mechanism; the electroplating treatment mechanism is arranged at the top of the supporting base plate, and the electroplating treatment mechanism includes a pre-treatment member, a cleaning member and an electroplating member. The present invention cooperates with the clamping member and the connecting frame. When the clamping member cooperates with the cleaning member for water washing and cleaning, the cleaning member rotates with the internal structure of the cleaning member. In this way, the mobile phone motherboard moves up and down by rotating in the cleaning member, that is, the surface of the mobile phone motherboard can be completely covered and cleaned, and the water inside the cleaning member can be stirred at the same time, so as to ensure the comprehensive and effective washing of the mobile phone motherboard.

Description

Technical Field

[0001] The present invention relates to the field of electroplating equipment, and in particular to an electroplating device and an electroplating method for a mainboard of a feature phone. Background Art

[0002] In the production process of feature phone motherboards, in order to improve the conductivity of the motherboard and enhance its corrosion resistance and aesthetics, it is necessary to use an electroplating process to electroplate the feature phone motherboard. At this time, an electroplating device is required to perform this operation.

[0003] The existing electroplating process is mostly performed using a gantry line electroplating device, that is, the pre-treatment, cleaning and electroplating of the mainboard of the functional mobile phone are performed by lifting by a gantry frame. The pre-treatment is to perform acid degreasing of the mainboard of the mobile phone, and the cleaning treatment is to wash the mainboard of the mobile phone after acid degreasing to remove the acidic liquid attached to the surface of the mainboard of the mobile phone. After cleaning, the mainboard of the mobile phone is lifted to the electroplating treatment site to perform the electroplating operation. When performing these operations, the transportation of the mainboard of the mobile phone is carried out by the cooperation of the gantry moving mechanism and the vertical moving mechanism. First, the gantry moving mechanism is used to realize the horizontal position movement, and then the mobile phone mainboard is embedded in each processing tank for processing by using the vertical movement; In order to ensure the stability of the mobile phone motherboard during electroplating, the acidic degreasing operation of the pretreatment is very important. After the acidic treatment is completed, the surface of the mobile phone motherboard will be attached with acidic liquid, so it needs to be washed with water. The existing water washing method is to vertically transport the mobile phone motherboard into the water washing box for water washing. In order to ensure comprehensive water washing, a gushing structure is set on both sides of the water washing box, so that water flows to the middle of the water washing box. Although this method can well cover the surface of the mobile phone motherboard to achieve full coverage water washing, during the water gushing process, the washed acidic liquid will be more concentrated in the middle of the water washing box, which will affect the effect of the motherboard water washing. At the same time, the existing operation directly transports the water machine motherboard to the electroplating treatment site for electroplating after water washing. The aqueous solution attached to the surface of the mobile phone motherboard will also dilute the electroplating solution, thereby affecting the effect of electroplating. In view of this, this scheme proposes an electroplating device and electroplating method for a functional mobile phone motherboard to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide an electroplating device and an electroplating method for a feature phone motherboard to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: an electroplating device for a feature phone motherboard, comprising: A supporting bottom plate, wherein both sides of the supporting bottom plate are provided with supporting members; A gantry moving mechanism, the gantry moving mechanism is arranged on the top of the support member, and the gantry moving mechanism is used to move horizontally and longitudinally along the top of the support member; A clamping mechanism, the clamping mechanism comprises a connecting frame and a clamping piece, the clamping piece is arranged at the bottom of the connecting frame, the connecting frame is used to drive the clamping piece to move in the vertical direction, the top of the connecting frame is transmission-connected to the bottom of the gantry moving mechanism, the connecting frame is driven by the gantry moving mechanism to move horizontally and longitudinally, and the clamping piece is used to clamp the mobile phone motherboard to be electroplated; The electroplating treatment mechanism is arranged at the top of the supporting base plate and located in the middle of the supporting member. The electroplating treatment mechanism includes a pre-treatment member, a cleaning member and an electroplating member. The pre-treatment member is used for pickling and degreasing the mobile phone mainboard, the cleaning member is used for water washing, cleaning and dehydrating the mobile phone mainboard after degreasing, and the electroplating member is used for copper plating and tin plating of the mobile phone mainboard after dehydration.

[0006] Preferably, the support member comprises: Track support plates, multiple track support plates are symmetrically arranged on both sides of the support base plate, a connecting groove is opened at the bottom of the track support plates, both sides of the support base plate are fixedly connected with connecting strips, the connecting strips are connected with the connecting grooves through the connection, and the gantry moving mechanism is mounted on the top of the multiple track support plates to move; The diagonal bracing rods are arranged in a horizontal and longitudinal direction on a side of the track support plate away from the supporting bottom plate.

[0007] Preferably, the gantry moving mechanism comprises a horizontal longitudinal frame, both ends of which are inserted into the top of the track support plate, and the outer wall of the horizontal longitudinal frame is provided with a connecting sleeve, which is used for the installation of the connecting frame.

[0008] Preferably, the connecting frame comprises: A vertical moving module, wherein the vertical moving module is arranged on the outer wall of the connecting sleeve, the output end of the vertical moving module is drivingly connected to a moving sleeve, and the bottom end of the moving sleeve is fixedly connected to a connecting rod; The N-shaped frame is fixedly connected to the bottom end of the connecting rod, and the clamping piece is arranged at the bottom of the N-shaped frame.

[0009] Preferably, the clamping member comprises: A supporting connecting rod, wherein the two ends of the supporting connecting rod are respectively inserted and connected to the bottom of the two arms of the N-shaped frame, a bearing is provided between the insertion of the supporting connecting rod and the N-shaped frame, and a rotating driving part is provided between the two ends of the supporting connecting rod and the cleaning member, and the rotating driving part is used to drive the supporting connecting rod to rotate; A clamping part, a plurality of the clamping parts are slidably sleeved on the outer wall of the supporting connecting rod, and the clamping part is used for conductive clamping of the mobile phone motherboard to be electroplated.

[0010] Preferably, the clamping portion comprises: A clamping sleeve, wherein the clamping sleeve is slidably sleeved on the outer wall of the supporting connecting rod, a rotating opening is opened in the middle of the clamping sleeve, and a fixed pressure rod is fixedly connected to the top of the clamping sleeve; A rotating clamp rod, the middle part of which is rotatably and interlacedly connected with the rotating mouth, a plug piece is fixedly connected to the middle part of the rotating clamp rod, a positioning slot is provided on the outer wall of the supporting connecting rod, the outer wall of the plug piece is interlacedly connected with the inner wall of the positioning slot, a rotating pressure rod is fixedly connected to the top of the rotating clamp rod, a supporting spring is arranged between the opposite sides of the rotating pressure rod and the fixed pressure rod, and clamping blocks are arranged at the bottom of the rotating clamp rod and the clamping sleeve.

[0011] Preferably, the cleaning element comprises: A water washing box, which is arranged at the top of the supporting bottom plate and located on one side of the pre-processing part, and is used for washing the mobile phone motherboard after pickling; A dehydration box, which is arranged at the top of the supporting bottom plate and is located between the washing box and the electroplating parts; Guide blocks, multiple guide blocks are respectively arranged at both ends of the inner walls of the washing box and the dehydration box, a guide groove is opened in the middle of the guide block, a shifting tooth plate is arranged on the inner wall on one side of the guide groove, the shifting tooth plate is used to drive the rotating driving part to rotate, and a pressure relief groove is opened on the top inner wall of the guide groove.

[0012] Preferably, the bottoms of the two arms of the N-shaped frame are provided with a rotating opening, the inner wall of the top of the rotating opening is provided with a locking groove, the inner wall of the top of the locking groove is provided with a pushing groove, and the rotating driving part includes: A rotating toothed disc, wherein the rotating toothed disc is sleeved on the end of the supporting connecting rod, and the outer wall of the rotating toothed disc is meshed with the tooth side of the shifting tooth plate; A tooth block, the tooth block is inserted and connected in the locking groove, and the tooth side of the tooth block is meshed with the top of the rotating toothed disc, one end of the tooth block is fixedly connected to an extrusion rod, the end of the extrusion rod away from the tooth block passes through the bottom of the N-shaped frame and is inserted and connected with the pressure relief groove and the guide groove, and the top of the extrusion rod is fixedly connected to a push sleeve; The guide rod is inserted and connected in the push groove, the push sleeve is slidably sleeved on the outer wall of the guide rod, and the outer wall of the guide rod is provided with a compression spring, and the compression spring is used to compress the push sleeve to move in a direction away from the center of the N-shaped frame.

[0013] Preferably, the pre-treatment unit comprises an acidic oil removal tank, which is arranged at the top of the supporting bottom plate and located on the side of the water washing tank away from the dehydration tank; The electroplated parts include a micro-etching box, a copper plating box, a pickling box and a tinning box in order from the direction close to the dehydration box to the direction far away from the dehydration box.

[0014] An electroplating method of an electroplating device for a feature phone motherboard, using the electroplating device for a feature phone motherboard, the electroplating method comprises the following steps: The first step is to clamp the mobile phone motherboard to be electroplated, and at this time, the side of the mobile phone motherboard is clamped by the clamping parts; The second step is to start the gantry moving mechanism. Driven by the gantry moving mechanism, the connecting frame moves horizontally and vertically. At this time, the clamping piece drives the clamped mobile phone motherboard to move horizontally and vertically synchronously. In the third step, when the gantry moving mechanism drives the mobile phone motherboard to be suspended above the pre-processing part, the horizontal longitudinal movement is stopped, and the connecting frame is driven vertically to drive the clamping part and the mobile phone motherboard to move down into the pre-processing part for pickling and degreasing of the mobile phone motherboard; Step 4: After the acid degreasing is completed, the connecting frame moves upward so that the mobile phone motherboard is suspended above the pre-processing part. At this time, the gantry moving mechanism continues to start, driving the mobile phone motherboard after the acid degreasing to move above the cleaning part, and the gantry moving mechanism stops. At this time, the connecting frame moves vertically to drive the mobile phone motherboard to move upward, and the mobile phone motherboard after acid washing and degreasing is washed and dehydrated; The fifth step, after dehydration is completed, the connecting frame moves up so that the mobile phone motherboard is suspended above the cleaning part. At this time, the gantry moving mechanism continues to start, driving the dehydrated mobile phone motherboard to move above the electroplating part, and the gantry moving mechanism stops. At this time, the connecting frame moves vertically to drive the mobile phone motherboard for electroplating. After completing it separately, the connecting frame drives the mobile phone motherboard to move up above the electroplating part. At this time, the gantry moving mechanism drives the electroplated mobile phone motherboard to move to the unloading area for unloading.

[0015] Technical effects and advantages of the present invention: The present invention sets a clamping mechanism, and through the cooperation of the clamping piece and the connecting frame, after the gantry moving mechanism transfers the clamping mechanism to the electroplating processing mechanism, the connecting frame drives the clamping piece to be lifted and lowered, and when the clamping piece cooperates with the cleaning piece to perform water washing and cleaning, the clamping piece moves vertically in the cleaning piece, and rotates in cooperation with the structure inside the cleaning piece when moving, so that the mobile phone mainboard moves up and down in the cleaning piece by rotation, that is, the surface of the mobile phone mainboard can be completely covered and cleaned, and the water inside the cleaning piece can be stirred at the same time, so as to avoid the accumulation of impurities in the water body in contact with the mobile phone mainboard, so as to ensure the comprehensive and effective washing of the mobile phone mainboard; The cleaning part of the present invention is also provided with a dehydration function, so that the surface moisture of the mobile phone motherboard after washing can be quickly shaken off by the same rotation method, so that the mobile phone motherboard entering the electroplating part can be kept dry to avoid affecting the concentration of the electroplating solution, thereby ensuring the stability of the electroplating effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the electroplating device of the present invention.

[0017] Figure 2 It is a top view of the overall structure of the electroplating device of the present invention.

[0018] Figure 3 It is a front view of the overall structure of the electroplating device of the present invention.

[0019] Figure 4 It is a schematic diagram of the structural connection between the N-shaped frame and the clamping member of the present invention.

[0020] Figure 5 It is a front view of the structural connection between the N-shaped frame and the clamping member of the present invention.

[0021] Figure 6 It is a schematic structural diagram of the clamping member of the present invention.

[0022] Figure 7 It is a structural cross-sectional view of the connection between the clamping piece and the N-shaped frame of the present invention.

[0023] Figure 8 For the present invention Figure 7 A schematic diagram of the enlarged structure at point A in the middle.

[0024] Fig. 9 It is a schematic structural diagram of the clamping part of the present invention.

[0025] Fig.10 It is a schematic diagram of the structural connection of the N-shaped frame, the clamping parts and the water washing box of the present invention.

[0026] Fig.11 It is a structural schematic diagram of the water washing box of the present invention.

[0027] In the figure: 1, supporting base plate; 101, connecting strip; 2, track support plate; 3, diagonal support rod; 4, horizontal longitudinal frame; 401, connecting sleeve; 5, vertical moving module; 501, moving sliding sleeve; 502, connecting rod; 6, N-shaped frame; 601, guide rod; 602, extrusion spring; 7, supporting connecting rod; 701, rotating toothed disc; 702, positioning slot; 703, bearing; 8, clamping sleeve; 801, rotating clamping rod ; 802, insert; 803, rotating pressure rod; 804, fixed pressure rod; 805, support spring; 806, clamping block; 9, extrusion plug rod; 901, tooth block; 902, push sleeve; 10, acid degreasing tank; 11, water washing tank; 12, dehydration tank; 13, micro-etching tank; 14, copper plating box; 15, pickling tank; 16, tinning box; 17, guide block; 1701, toggle tooth plate; 1702, pressure relief groove. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Embodiment 1, the present invention provides as follows Figure 1-11 The electroplating device of a feature phone mainboard shown includes: A supporting base plate 1, with supporting members disposed on both sides of the supporting base plate 1; Specifically, the support member includes: Track support plates 2, multiple track support plates 2 are symmetrically arranged on both sides of the support base plate 1, a connection groove is opened at the bottom of the track support plates 2, and both sides of the support base plate 1 are fixedly connected with connection strips 101, and the connection strips 101 are interlaced and connected with the connection grooves; The diagonal braces 3 are arranged in a horizontal and longitudinal direction on a side of the track support plate 2 away from the support base plate 1 .

[0030] It should be noted that, through the setting of the track support plate 2, in cooperation with the supporting base plate 1, a processing space is enclosed, so that each processing structure is arranged in the enclosed space, and through the design of the diagonal support rod 3, the track support plate 2 can be diagonally supported from the side, so that when the top erection mechanism of the track support plate 2 is installed, the stability of the structural setting of the track support plate 2 can be guaranteed.

[0031] Gantry moving mechanism, the gantry moving mechanism is arranged on the top of the support, the gantry moving mechanism is used to move horizontally and longitudinally along the top of the support, and the gantry moving mechanism is mounted on the top of the plurality of track support plates 2 for movement; Specifically, the gantry moving mechanism includes a horizontal longitudinal frame 4 , both ends of which are inserted into the top of the track support plate 2 , and the outer wall of the horizontal longitudinal frame 4 is provided with a connecting sleeve 401 .

[0032] It should be noted that moving wheels are provided at both ends of the horizontal longitudinal frame 4, and the moving wheels are inserted at the top of the track support plate 2 for restrictive movement, and the horizontal longitudinal frame 4 is CNC driven, and the start-up time interval is controlled by CNC, so that the horizontal longitudinal frame 4 is supported when it moves horizontally and longitudinally at the top of the track support plate 2.

[0033] The clamping mechanism includes a connecting frame and a clamping piece. The clamping piece is arranged at the bottom of the connecting frame. The connecting frame is used to drive the clamping piece to move in the vertical direction. The top of the connecting frame is connected to the bottom of the gantry moving mechanism by transmission. The connecting frame is driven by the gantry moving mechanism to move horizontally and longitudinally. The clamping piece is used to clamp the motherboard of the mobile phone to be electroplated. The connecting sleeve 401 is used for the installation of the connecting frame; Specifically, the connecting frame includes: A vertical moving module 5, which is arranged on the outer wall of the connecting sleeve 401, wherein the output end of the vertical moving module 5 is drivingly connected to a moving sleeve 501, and the bottom end of the moving sleeve 501 is fixedly connected to a connecting rod 502; The N-shaped frame 6 is fixedly connected to the bottom end of the connecting rod 502 , and the clamping piece is arranged at the bottom of the N-shaped frame 6 .

[0034] It should be noted that, through the transmission connection between the movable sleeve 501 and the vertical movable module 5, after the vertical movable module 5 is started, the movable sleeve 501 moves vertically according to the output direction of the start-up, thereby driving the connecting rod 502 to enable the N-shaped frame 6 to move vertically.

[0035] Specifically, the clamping parts include: Support link 7, both ends of the support link 7 are respectively inserted and connected to the bottom of the two arms of the N-shaped frame 6, a bearing 703 is provided between the insertion of the support link 7 and the N-shaped frame 6, and the rotation drive part is used to drive the support link 7 to rotate; The clamping parts are slidably sleeved on the outer wall of the supporting connecting rod 7, and the clamping parts are used for conductive clamping of the mobile phone motherboard to be electroplated.

[0036] It should be noted that the two ends of the support link 7 respectively penetrate the sides of the bottoms of the two arms of the N-shaped frame 6 away from each other, and the bearing 703 is inserted to ensure that the support link 7 can rotate stably when it is able to rotate.

[0037] Further, the clamping part includes: A clamping sleeve 8 is slidably sleeved on the outer wall of the supporting connecting rod 7, a rotating opening is opened in the middle of the clamping sleeve 8, and a fixed pressure rod 804 is fixedly connected to the top of the clamping sleeve 8; The rotating clamp rod 801 has its middle part rotatably and interlacedly connected with the rotating mouth, the middle part of the rotating clamp rod 801 is fixedly connected with an insert 802, the outer wall of the supporting connecting rod 7 is provided with a positioning slot 702, the outer wall of the insert 802 is interlacedly connected with the inner wall of the positioning slot 702, the top of the rotating clamp rod 801 is fixedly connected with a rotating pressure rod 803, a supporting spring 805 is arranged between the opposite sides of the rotating pressure rod 803 and the fixed pressure rod 804, and a clamping block 806 is arranged at the bottom of the rotating clamp rod 801 and the clamping sleeve 8.

[0038] It should be noted that a groove structure is provided on the outer wall of the support connecting rod 7, so that there are some areas outside the support connecting rod 7 that are not cylindrical structures, so that after the clamping sleeve 8 is sleeved on the outer wall of the support connecting rod 7, when the support connecting rod 7 rotates, the clamping sleeve 8 can rotate synchronously with the support connecting rod 7; The rotating pressure rod 803 and the fixed pressure rod 804 are not parallel and symmetrically arranged, and the angle between the two is set. In this way, under the setting of the supporting spring 805, when the rotating pressure rod 803 is pressed, the rotating clamp rod 801 is rotatably and interlacedly connected with the rotating mouth, so that the rotating pressure rod 803 is rotated, so that the clamping block 806 and the insert 802 connected at the rotating clamp rod 801 rotate synchronously with the rotating clamp rod 801, so that the insert 802 can move in the positioning slot 702, so as to adjust the horizontal lateral setting position of the clamping part on the outer wall of the supporting connecting rod 7, and at the same time separate the clamping blocks 806 that are close together, so that the side of the mobile phone motherboard can be set between the separated clamping blocks 806, and when the pressing on the rotating pressure rod 803 is cancelled, the rotating clamp rod 801 is pushed by the restoring force of the supporting spring 805, and the clamping block 806 is driven to close together, thereby completing the clamping of the mobile phone motherboard.

[0039] The electroplating treatment mechanism is arranged at the top of the supporting base plate 1 and is located in the middle of the supporting member. The electroplating treatment mechanism includes a pre-treatment member, a cleaning member and an electroplating member. The pre-treatment member is used for pickling and degreasing the mobile phone mainboard, the cleaning member is used for water washing and dehydrating the mobile phone mainboard after degreasing, and the electroplating member is used for copper plating and tin plating of the mobile phone mainboard after dehydration. A rotating drive part is arranged between the two ends of the supporting connecting rod 7 and the cleaning member.

[0040] Specifically, the cleaning parts include: A water washing box 11, which is arranged at the top of the supporting base plate 1 and located on one side of the pre-processing part, and is used for washing the mobile phone motherboard after pickling; A dehydration box 12, which is disposed at the top of the supporting bottom plate 1 and is located between the washing box 11 and the electroplating parts; It should be noted that the washing box 11 is filled with clean water for washing the mobile phone mainboard after pickling, while the dehydration box 12 is empty for receiving the water thrown off from the mobile phone mainboard.

[0041] Guide blocks 17, multiple guide blocks 17 are respectively arranged at both ends of the inner walls of the washing box 11 and the dehydration box 12, a guide groove is opened in the middle of the guide block 17, and a shifting tooth plate 1701 is arranged on the inner wall of one side of the guide groove. The shifting tooth plate 1701 is used to drive the rotating driving part to rotate, and a pressure relief groove 1702 is opened on the top inner wall of the guide groove.

[0042] Further, the bottoms of the two arms of the N-shaped frame 6 are provided with a rotating opening, the inner wall of the top of the rotating opening is provided with a locking groove, and the inner wall of the top of the locking groove is provided with a pushing groove, and the rotating driving part includes: A rotating toothed disc 701, which is sleeved on the end of the supporting connecting rod 7, and the outer wall of the rotating toothed disc 701 is meshed with the tooth side of the shifting tooth plate 1701; It should be noted that when the N-shaped frame 6 drives the supporting link 7 and the rotating toothed disc 701 to move downward in the guide groove, after the rotating toothed disc 701 engages with the shifting toothed plate 1701, the rotating toothed disc 701 drives the supporting link 7 to rotate under the meshing transmission.

[0043] Tooth block 901, tooth block 901 is inserted and connected in the locking groove, and the tooth side of tooth block 901 is meshed with the top of rotating toothed disc 701, one end of tooth block 901 is fixedly connected with extrusion rod 9, one end of extrusion rod 9 away from tooth block 901 passes through the bottom of N-shaped frame 6 and is inserted and connected with pressure relief groove 1702 and guide groove, and the top of extrusion rod 9 is fixedly connected with push sleeve 902; It should be noted that the pressure relief groove 1702 is designed to be arc-shaped, and the curvature of the bottom exceeds that of the top, so that when the N-shaped frame 6 moves downward in the guide groove, the pressure relief groove 1702 continues to squeeze the extrusion rod 9 until the extrusion rod 9 is completely embedded in the locking groove, and the engagement between the tooth block 901 and the rotating toothed disc 701 is released. At the same time, the rotating toothed disc 701 and the toggle tooth plate 1701 reach the engagement point. After the two are engaged, the rotating toothed disc 701 rotates under the meshing transmission.

[0044] The guide rod 601 is inserted and connected in the pushing groove, and the pushing sleeve 902 is slidably sleeved on the outer wall of the guide rod 601. The outer wall of the guide rod 601 is provided with a squeezing spring 602, and the squeezing spring 602 is used to squeeze and push the sleeve 902 to move away from the center of the N-shaped frame 6.

[0045] It should be noted that, under the setting of the extrusion spring 602, when the pressure relief groove 1702 gradually loses the extrusion with the extrusion rod 9, driven by the pushing sleeve 902, the tooth block 901 engages with the rotating toothed disc 701. At this time, the rotation of the rotating toothed disc 701 is locked by the tooth block 901, so that the clamped mobile phone motherboard can be stably moved out.

[0046] Specifically, the pre-treatment unit includes an acidic oil removal tank 10, which is arranged at the top of the supporting bottom plate 1 and located on the side of the water washing tank 11 away from the dehydration tank 12; The electroplated parts include a micro-etching box 13, a copper plating box 14, a pickling box 15 and a tinning box 16 in order from the direction close to the dehydration box 12 to the direction far away from the dehydration box 12.

[0047] It should be noted that a feeding pipe is provided at the top of one side of the acidic oil removal tank 10, the water washing tank 11, the dehydration tank 12, the micro-etching box 13, the copper plating box 14, the pickling box 15 and the tin plating box 16 to facilitate the feeding of materials into each box, and a discharge pipe is provided at the bottom of the other side of the acidic oil removal tank 10, the water washing tank 11, the dehydration box 12, the micro-etching box 13, the copper plating box 14, the pickling box 15 and the tin plating box 16 to discharge materials from each box, and electrodes are inserted in the copper plating box 14 and the tin plating box 16 to facilitate the electroplating operation by powering on.

[0048] In the second embodiment, the present invention provides an electroplating method for an electroplating device of a feature phone motherboard, using the electroplating device of the feature phone motherboard of the first embodiment, the electroplating method comprises the following steps: The first step is to clamp the mobile phone motherboard to be electroplated, and at this time, the side of the mobile phone motherboard is clamped by the clamping parts; It should be noted that at this time, the rotating pressure rod 803 and the fixed pressure rod 804 are pinched together to move closer to each other. When the rotating pressure rod 803 drives the rotating clamp rod 801 to rotate, the supporting spring 805 is squeezed to shrink it. When the distance between the oppositely arranged clamping blocks 806 is sufficient to clamp the mobile phone motherboard, the side of the mobile phone motherboard is inserted into the opened clamping block 806, and then the pressure is released. At this time, under the push of the restoring force of the supporting spring 805, the rotating clamp rod 801 is driven to rotate, so that the clamping block 806 set on the object is closed, thereby completing the clamping of the mobile phone motherboard.

[0049] The second step is to start the gantry moving mechanism. Driven by the gantry moving mechanism, the connecting frame moves horizontally and vertically. At this time, the clamping piece drives the clamped mobile phone motherboard to move horizontally and vertically synchronously. In the third step, when the gantry moving mechanism drives the mobile phone motherboard to be suspended above the pre-processing part, the horizontal longitudinal movement is stopped, and the connecting frame is driven vertically to drive the clamping part and the mobile phone motherboard to move down into the pre-processing part for pickling and degreasing of the mobile phone motherboard; Step 4: After the acid degreasing is completed, the connecting frame moves upward so that the mobile phone motherboard is suspended above the pre-processing part. At this time, the gantry moving mechanism continues to start, driving the mobile phone motherboard after the acid degreasing to move above the cleaning part, and the gantry moving mechanism stops. At this time, the connecting frame moves vertically to drive the mobile phone motherboard to move upward, and the mobile phone motherboard after acid washing and degreasing is washed and dehydrated; It should be noted that when the N-shaped frame 6 drives the clamping parts to move vertically in the washing box 11 and the dehydration box 12, when the extrusion rod 9 moves along the guide groove to the bottom of the pressure relief groove 1702, the rotation lock of the rotating toothed disc 701 is released. At this time, the rotating toothed disc 701 and the toggle toothed plate 1701 are engaged for transmission, so that the supporting connecting rod 7 rotates under the drive of the rotating toothed disc 701. At this time, the clamping part drives the mobile phone mainboard to rotate synchronously, and stirs in the washing box 11 and the dehydration box 12, so as to perform flip cleaning and flip dehydration of the mobile phone mainboard.

[0050] The fifth step, after dehydration is completed, the connecting frame moves up so that the mobile phone motherboard is suspended above the cleaning part. At this time, the gantry moving mechanism continues to start, driving the dehydrated mobile phone motherboard to move above the electroplating part, and the gantry moving mechanism stops. At this time, the connecting frame moves vertically to drive the mobile phone motherboard for electroplating. After completing it separately, the connecting frame drives the mobile phone motherboard to move up above the electroplating part. At this time, the gantry moving mechanism drives the electroplated mobile phone motherboard to move to the unloading area for unloading.

[0051] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An electroplating device for a feature phone motherboard, characterized in that: include: A supporting base plate (1), wherein both sides of the supporting base plate (1) are provided with supporting members; A gantry moving mechanism, the gantry moving mechanism is arranged on the top of the support member, and the gantry moving mechanism is used to move horizontally and longitudinally along the top of the support member; A clamping mechanism, the clamping mechanism comprises a connecting frame and a clamping piece, the clamping piece is arranged at the bottom of the connecting frame, the connecting frame is used to drive the clamping piece to move in the vertical direction, the top of the connecting frame is transmission-connected to the bottom of the gantry moving mechanism, the connecting frame is driven by the gantry moving mechanism to move horizontally and longitudinally, and the clamping piece is used to clamp the mobile phone motherboard to be electroplated; An electroplating treatment mechanism is provided at the top of the supporting base plate (1) and in the middle of the supporting member, the electroplating treatment mechanism comprises a pre-treatment member, a cleaning member and an electroplating member, the pre-treatment member is used for pickling and degreasing the mobile phone mainboard, the cleaning member is used for water washing and dehydrating the mobile phone mainboard after degreasing, and the electroplating member is used for copper plating and tin plating the mobile phone mainboard after dehydration.

2. The electroplating device for a feature phone motherboard according to claim 1, characterized in that: The support member comprises: Track support plates (2), wherein a plurality of the track support plates (2) are symmetrically arranged on both sides of the support base plate (1), a connection groove is provided at the bottom of the track support plates (2), both sides of the support base plate (1) are fixedly connected with connection bars (101), the connection bars (101) are interlaced and connected with the connection grooves, and the gantry moving mechanism is mounted on the top of the plurality of track support plates (2) for movement; Diagonal support rods (3), wherein a plurality of the diagonal support rods (3) are arranged in a horizontal and longitudinal direction on a side of the track support plate (2) away from the supporting bottom plate (1).

3. The electroplating device for a feature phone motherboard according to claim 2, characterized in that: The gantry moving mechanism comprises a horizontal longitudinal frame (4), the two ends of the horizontal longitudinal frame (4) are inserted into the top of the track support plate (2), and the outer wall of the horizontal longitudinal frame (4) is provided with a connecting sleeve (401), and the connecting sleeve (401) is used for installing the connecting frame.

4. The electroplating device for a feature phone motherboard according to claim 3, characterized in that: The connecting frame comprises: A vertical moving module (5), the vertical moving module (5) being arranged on the outer wall of the connecting sleeve (401), the output end of the vertical moving module (5) being drivingly connected to the moving sleeve (501), and the bottom end of the moving sleeve (501) being fixedly connected to the connecting rod (502); An N-shaped frame (6), the N-shaped frame (6) being fixedly connected to the bottom end of the connecting rod (502), and the clamping member being arranged at the bottom of the N-shaped frame (6).

5. The electroplating device for a feature phone motherboard according to claim 4, characterized in that: The clamping member comprises: A supporting connecting rod (7), wherein the two ends of the supporting connecting rod (7) are respectively inserted and connected to the bottoms of the two arms of the N-shaped frame (6), a bearing (703) is provided between the insertion point of the supporting connecting rod (7) and the N-shaped frame (6), and a rotation driving part is provided between the two ends of the supporting connecting rod (7) and the cleaning member, and the rotation driving part is used to drive the supporting connecting rod (7) to rotate; A clamping part, a plurality of the clamping parts are slidably sleeved on the outer wall of the supporting connecting rod (7), and the clamping parts are used for conductively clamping the mobile phone motherboard to be electroplated.

6. The electroplating device for a feature phone motherboard according to claim 5, characterized in that: The clamping portion comprises: A clamping sleeve (8), the clamping sleeve (8) being slidably sleeved on the outer wall of the supporting connecting rod (7), a rotation opening being opened in the middle of the clamping sleeve (8), and a fixed pressure rod (804) being fixedly connected to the top end of the clamping sleeve (8); A rotating clamp rod (801) is provided, wherein the middle portion of the rotating clamp rod (801) is rotatably connected to the rotating opening, an insert (802) is fixedly connected to the middle portion of the rotating clamp rod (801), a positioning slot (702) is provided on the outer wall of the supporting connecting rod (7), the outer wall of the insert (802) is connected to the inner wall of the positioning slot (702), a rotating pressure rod (803) is fixedly connected to the top of the rotating clamp rod (801), a supporting spring (805) is provided between the opposite sides of the rotating pressure rod (803) and the fixed pressure rod (804), and a clamping block (806) is provided at the bottom of the rotating clamp rod (801) and the clamping sleeve (8).

7. The electroplating device for a feature phone motherboard according to claim 5, characterized in that: The cleaning element comprises: A water washing box (11), the water washing box (11) being arranged at the top of the supporting base plate (1) and located on one side of the pre-processing part, the water washing box (11) being used for washing the mobile phone mainboard after pickling; A dehydration box (12), the dehydration box (12) being arranged at the top end of the supporting bottom plate (1) and located between the washing box (11) and the electroplating part; A guide block (17), wherein a plurality of the guide blocks (17) are respectively arranged at both ends of the inner wall of the washing box (11) and the dehydration box (12), a guide groove is provided in the middle of the guide block (17), an inner wall on one side of the guide groove is provided with a shifting tooth plate (1701), the shifting tooth plate (1701) is used to drive the rotary drive unit to rotate, and a pressure relief groove (1702) is provided on the top inner wall of the guide groove.

8. The electroplating device for a feature phone motherboard according to claim 7, characterized in that: The bottoms of the two arms of the N-shaped frame (6) are each provided with a rotating opening, the inner wall of the top of the rotating opening is provided with a locking groove, the inner wall of the top of the locking groove is provided with a pushing groove, and the rotating driving part comprises: A rotating toothed disc (701), wherein the rotating toothed disc (701) is sleeved on the end of the supporting connecting rod (7), and the outer wall of the rotating toothed disc (701) is meshed with the tooth side of the shifting toothed plate (1701); A tooth block (901), the tooth block (901) being inserted and connected in the locking groove, and the tooth side of the tooth block (901) is meshed with the top of the rotating toothed disc (701), one end of the tooth block (901) is fixedly connected to an extrusion rod (9), one end of the extrusion rod (9) away from the tooth block (901) passes through the bottom of the N-shaped frame (6) and is inserted and connected with the pressure relief groove (1702) and the guide groove, and the top of the extrusion rod (9) is fixedly connected to a push sleeve (902); A guide rod (601), the guide rod (601) is inserted and connected in the push groove, the push sleeve (902) is slidably sleeved on the outer wall of the guide rod (601), and the outer wall of the guide rod (601) is provided with a pressing spring (602), and the pressing spring (602) is used to press the push sleeve (902) to move in a direction away from the center of the N-shaped frame (6).

9. The electroplating device for a feature phone motherboard according to claim 7, characterized in that: The pre-treatment component comprises an acidic oil removal tank (10), wherein the acidic oil removal tank (10) is arranged at the top of the supporting bottom plate (1) and is located on a side of the water washing tank (11) away from the dehydration tank (12); The electroplated parts include, in order from the direction close to the dehydration box (12) to the direction far away from it, a micro-etching box (13), a copper plating box (14), an acid dipping box (15) and a tinning box (16).

10. An electroplating method for an electroplating device for a feature phone motherboard, using an electroplating device for a feature phone motherboard according to any one of claims 1 to 9, characterized in that: The electroplating method comprises the following steps: The first step is to clamp the mobile phone motherboard to be electroplated, and at this time, the side of the mobile phone motherboard is clamped by the clamping parts; The second step is to start the gantry moving mechanism. Driven by the gantry moving mechanism, the connecting frame moves horizontally and vertically. At this time, the clamping piece drives the clamped mobile phone motherboard to move horizontally and vertically synchronously. In the third step, when the gantry moving mechanism drives the mobile phone motherboard to be suspended above the pre-processing part, the horizontal longitudinal movement is stopped, and the connecting frame is driven vertically to drive the clamping part and the mobile phone motherboard to move down into the pre-processing part for pickling and degreasing of the mobile phone motherboard; Step 4: After the acid degreasing is completed, the connecting frame moves upward so that the mobile phone motherboard is suspended above the pre-processing part. At this time, the gantry moving mechanism continues to start, driving the mobile phone motherboard after the acid degreasing to move above the cleaning part, and the gantry moving mechanism stops. At this time, the connecting frame moves vertically to drive the mobile phone motherboard to move upward, and the mobile phone motherboard after acid washing and degreasing is washed and dehydrated; The fifth step, after dehydration is completed, the connecting frame moves up so that the mobile phone motherboard is suspended above the cleaning part. At this time, the gantry moving mechanism continues to start, driving the dehydrated mobile phone motherboard to move above the electroplating part, and the gantry moving mechanism stops. At this time, the connecting frame moves vertically to drive the mobile phone motherboard for electroplating. After completing it separately, the connecting frame drives the mobile phone motherboard to move up above the electroplating part. At this time, the gantry moving mechanism drives the electroplated mobile phone motherboard to move to the unloading area for unloading.

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