Acoustic emission monitoring system and method for short-circuit failure of crimping packaging power module

Abstract

The invention belongs to the technical field of power semiconductor monitoring, and particularly relates to an acoustic emission monitoring system and method for short-circuit failure of a crimping packaging power module. The monitoring system comprises a sonic sensor array, a module characteristic parameter measuring unit, a multi-channel signal acquisition unit and an upper computer. The sonic sensor array is used for measuring a failure instantaneous sound signal of the crimping packaging power module; the module characteristic parameter measuring unit is used for measuring failure characteristic parameters; the multi-channel signal acquisition unit is used for transmitting all the received data to the upper computer; and the upper computer judges whether the crimping packaging power module has short-circuit failure or not by identifying the voiceprint information of the sound signals, and if the short-circuit failure occurs, the failure position is positioned based on the difference value between the failure instantaneous sound signal receiving time and the failure characteristic parameter abrupt change time of each sound wave sensor. The method has the characteristics of wide application occasion, non-intrusive installation and the like, and is beneficial to online monitoring of short-circuit failure of the crimping packaging power module and rapid positioning of failure points.

Description

Technical Field

[0001] The invention belongs to the technical field of power semiconductor monitoring, and in particular relates to a system and method for monitoring short-circuit failure acoustic emission of a press-fit packaged power module. Background Art

[0002] The crimped package power module achieves a high current level by connecting sub-modules in parallel on a large scale. It has the advantages of double-sided heat dissipation, high power density, and a stable short-circuit state after failure. It is a basic core device for high-voltage and high-power power electronic equipment and is widely used in high-voltage circuit breakers, flexible direct current converter valves and other equipment. Taking high-voltage circuit breakers as an example, crimped package power modules need to withstand short-circuit current shocks that are several times the rated current in harsh working conditions. Under long-term repeated shocks, overstressed sub-modules in the power module are prone to short-circuit failure. Although the crimped package power module has a stable short-circuit state after failure, and the equipment usually adopts a series redundant module design, after a power module fails, the remaining modules can continue to carry the current shock to ensure the normal operation of the equipment. However, once the number of failed modules exceeds the threshold, the impact on the remaining modules will exceed the design margin and fail quickly, leading to equipment failure. Therefore, it is very important to monitor the short-circuit failure of crimped package power modules.

[0003] At present, in the short-circuit failure monitoring of crimped packaged power modules, it is mainly carried out based on the electrical characteristic parameters of the equipment or power modules. This method requires the installation of a variety of invasive monitoring equipment in the power electronic equipment, such as voltage probes, current sensors, etc., which has a high cost of use. When short-circuit failure monitoring is carried out based on the electrical characteristic parameters of the equipment, it is usually only possible to determine whether a short-circuit failure has occurred in the equipment, but it is impossible to locate the power module where the short-circuit failure has occurred. When short-circuit failure monitoring is carried out based on the electrical characteristic parameters of the power module, it is necessary to install monitoring equipment on each power module, which has a higher economic cost, but it is impossible to further locate the information of the sub-module where the short-circuit failure has occurred inside the module. Therefore, the existing methods generally have the problems of high cost of use, difficulty in locating the failure point, and thus inability to effectively guide the operation and maintenance of the equipment, resulting in that most of the power electronic equipment composed of crimped packaged power modules are still equipped with bypass switches, and the advantage of the crimped packaged power module having a stable short-circuit state after failure has not been fully utilized.

[0004] In summary, the invention of a non-invasive, precisely located failure point short-circuit failure monitoring system for press-fit packaged power modules is of great significance for accurately guiding equipment operation and maintenance and giving full play to the advantages of press-fit packaged power modules. Summary of the invention

[0005] In view of this, an object of the present invention is to provide a system and method for monitoring acoustic emission of short-circuit failure of a crimped package power module, which is used for non-invasive monitoring of short-circuit failure of the crimped package power module and accurate positioning of the failure point.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] A short-circuit failure acoustic emission monitoring system for a crimped package power module, comprising a crimped package power module 7, an acoustic wave sensor array, a module characteristic parameter measurement unit 4, a multi-channel signal acquisition unit 5, and a host computer 6;

[0008] The acoustic wave sensor array is arranged around the crimping package power module 7, and the acoustic wave sensor array is composed of at least three high-resolution acoustic wave sensors that are not in the same straight line, and is used to measure the instantaneous acoustic signal of the failure of the crimping package power module 7, and the signal measured by each high-resolution acoustic wave sensor is sent to the multi-channel signal acquisition unit 5;

[0009] The module characteristic parameter measuring unit 4 is used to measure the short-circuit failure characteristic parameters of the crimped package power module 7, and send the measured failure characteristic parameters to the multi-channel signal acquisition unit 5;

[0010] The multi-channel signal acquisition unit 5 transmits all received data to the host computer 6;

[0011] The host computer 6 is used to determine whether the crimped package power module 7 has a short circuit failure based on the received data. If a short circuit failure occurs, the failure position is located based on the difference between the time when each high-resolution acoustic wave sensor receives the instantaneous acoustic signal of the failure and the time when the failure characteristic parameter suddenly changes.

[0012] Furthermore, the specific method for determining whether the crimping package power module 7 has a short circuit failure is:

[0013] First, a short-circuit test is performed to record the instantaneous acoustic signal of failure measured by the high-resolution acoustic wave sensor when the short-circuit failure occurs. Then, during the short-circuit failure monitoring process, it is determined whether the acoustic signal measured in real time by the high-resolution acoustic wave sensor matches the recorded instantaneous acoustic signal of failure. If they match, it is determined that a short-circuit failure occurs in the crimped package power module 7, otherwise, no short-circuit failure occurs.

[0014] Furthermore, the specific method of locating the failure position is:

[0015] In the short-circuit test, record the time when the short-circuit failure occurs t 0 , and record the time when the instantaneous acoustic signal reaches each high-resolution acoustic wave sensor when the short-circuit failure occurs, which are defined as t 1 ,t 2 …t n , the distance between the high-resolution acoustic wave sensor and the submodule 8 to be measured is defined as l 1 , l 2 …l n ; Calculate the speed of sound wave propagation v 1 、v2 …v n :

[0016]

[0017] And with v 1 、v 2 …v n The average value of is taken as the sound wave propagation speed v:

[0018]

[0019] During the short-circuit failure monitoring process, if it is determined that the crimping package power module 7 has a short-circuit failure, the moment T at which the failure characteristic parameter suddenly changes is recorded. 0 , record the time T when the instantaneous sound signal of failure reaches the acoustic wave sensor 1, 2…n 1 , T 2 …T n , and then take each sensor as the center and v(T n -T 0 ) is the radius, draw a sphere of possible sound source positions, and take the intersection of each sphere as the failure position.

[0020] The present invention also provides a monitoring method for a short-circuit failure acoustic emission monitoring system for a crimped package power module, comprising the following steps:

[0021] S1: Install an acoustic wave sensor array around the crimped package power module 7, where the acoustic wave sensor array consists of at least three high-resolution acoustic wave sensors that are not in the same straight line;

[0022] S2: Install the submodule 8 to be tested in the crimped package power module 7, and make the distance between the submodule 8 to be tested and each high-resolution acoustic wave sensor different, and measure the distance between the submodule 8 to be tested and n high-resolution acoustic wave sensors respectively, which is defined as l 1 , l 2 …l n ;

[0023] S3: Based on the application conditions, a short-circuit test is performed on the submodule 8 to be tested, and the module characteristic parameter measurement unit 4 is used to measure the short-circuit failure characteristic parameters. During the test, the conduction time is continuously extended until a destructive short-circuit failure occurs in the submodule 8 to be tested, and the time t when the short-circuit failure occurs is recorded. 0 , obtaining instantaneous acoustic signals of failure through acoustic wave sensors;

[0024] S4: Analyze the acoustic signal characteristics at the moment of failure;

[0025] S5: The time when the instantaneous acoustic signal of failure is obtained to n high-resolution acoustic wave sensors is defined as t 1 ,t 2 …tn , calculate the sound wave propagation speed v based on the distance and the time difference of the sound signal arrival 1 、v 2 …v n :

[0026]

[0027] And with v 1 、v 2 …v n The average value of is taken as the sound wave propagation speed v:

[0028]

[0029] S6: recording the soundprint characteristics of the instantaneous sound signal of failure and the sound wave propagation speed v into the host computer 6;

[0030] S7: Start short circuit failure monitoring, the host computer 6 records the sudden change time of the failure characteristic parameter T 0 , record the time T when the instantaneous sound signal of failure reaches the acoustic wave sensor 1, 2…n 1 , T 2 …T n ;

[0031] S8: Determine whether the sound wave voiceprint matches the recorded information. If so, go to S9; if not, go to S7.

[0032] S9: With each sensor as the center, v(T n -T 0 ) is the radius, draw a sphere of possible sound source positions;

[0033] S10: Taking each spherical intersection point as the position of the failed submodule.

[0034] The beneficial effects of the present invention are:

[0035] 1) The acoustic emission monitoring system of the present invention adopts a non-invasive design, and only needs to install several high-resolution acoustic wave sensors in the equipment as monitoring devices, which effectively improves the economy and convenience of the monitoring system.

[0036] 2) In the acoustic emission monitoring method described in the present invention, the instantaneous acoustic signal of failure is located by using the signal time difference, which can accurately locate the specific failed submodule and effectively improve the accuracy of failure point positioning. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is an acoustic emission monitoring system for short-circuit failure of crimped package power modules;

[0038] Figure 2 This is a flow chart of the acoustic emission monitoring method for short-circuit failure of press-fit package power module;

[0039] Figure 3 Schematic diagram for locating the failed submodule.

[0040] Reference numerals:

[0041] 1-high-resolution acoustic wave sensor 1; 2-high-resolution acoustic wave sensor 2; 3-high-resolution acoustic wave sensor 3; 4-module characteristic parameter measurement unit; 5-multi-channel signal acquisition unit; 6-host computer; 7-press-fit package power module; 8-submodule to be tested; 9-support rod; 10-collector water-cooled radiator; 11-emitter water-cooled radiator; 12-failed submodule. DETAILED DESCRIPTION

[0042] The scheme of the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0043] Example

[0044] like Figure 1 As shown, taking 3300V / 600A crimped package power module as the monitoring object, a crimped package power module short circuit failure acoustic emission monitoring system is established, including an acoustic wave sensor array, a module characteristic parameter measurement unit 4, a multi-channel signal acquisition unit 5, and a host computer 6.

[0045] The acoustic wave sensor array is composed of three high-resolution acoustic wave sensors 1, 2, and 3 that are not in the same straight line and are installed on a fixture support rod 9;

[0046] The module characteristic parameter measurement unit 4 is used to collect the gate voltage of the press-fit package power module 7;

[0047] The multi-channel signal acquisition unit 5 is used to collect the instantaneous sound signal of failure and the gate voltage, and transmit them to the host computer 6;

[0048] The upper computer 6 is used to analyze the collected sound signal soundprint information, including characteristic information such as the sound signal amplitude and frequency, to determine whether the crimped package power module 7 has a short circuit failure. If a short circuit failure occurs, the failure position is located based on the difference between the time when each acoustic wave sensor receives the instantaneous sound signal of the failure and the time when the failure characteristic parameter suddenly changes.

[0049] Install the submodule 8 to be tested at a certain position in the crimping package power module 7. The distance between the submodule 8 to be tested and the acoustic wave sensors 1, 2, and 3 should be different. Measure the distance l between the submodule 8 to be tested and the acoustic wave sensors 1, 2, and 3 respectively. 1 , l 2 , l 3 ;

[0050] Based on the application conditions, a short-circuit test is performed on the submodule 8 to be tested, and the gate voltage is measured using the module characteristic parameter measurement unit 4. During the test, the on-time is continuously extended until a destructive short-circuit failure occurs in the submodule 8 to be tested, and the time when the short-circuit failure occurs is recorded. 0 , obtaining instantaneous acoustic signals of failure through acoustic wave sensors;

[0051] Analyze the soundprint characteristics of the instantaneous sound signal of failure, including characteristic information such as amplitude and frequency;

[0052] Get the time t when the instantaneous acoustic signal of failure reaches the acoustic wave sensors 1, 2, and 3 1 ,t 2 ,t 3 , calculate the sound wave propagation speed v based on the distance and the time difference of the sound signal arrival 1 、v 2 、v 3 :

[0053]

[0054] And with v 1 、v 2 、v 3 The average value of is taken as the sound wave propagation speed v:

[0055]

[0056] Record the acoustic signal soundprint characteristics and the acoustic wave propagation speed v of the instantaneous failure into the host computer 6;

[0057] Carry out short-circuit failure monitoring of 3300V / 600A crimping package power module 7, and the host computer records the sudden change time of failure characteristic parameters T 0 , record the time T when the instantaneous sound signal of failure reaches the acoustic wave sensors 1, 2, and 3 1 , T 2 , T 3 ;

[0058] Determine whether the sound wave voiceprint matches the recorded information, confirm that the voiceprint matches, and it is a short-circuit failure instantaneous sound signal;

[0059] like Figure 3 As shown, with acoustic wave sensors 1, 2, and 3 as the center, v(T 1 -T 0 )、v(T 2 -T 0 )、v(T 3 -T 0 ) is the radius, draw a sphere of possible sound source positions;

[0060] The intersection points of the spheres are analyzed and the failure points are located as submodule 12.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution, which should be included in the scope of the claims of the present invention.

Claims

1. A short-circuit failure acoustic emission monitoring system for a crimped package power module, comprising a crimped package power module (7), characterized in that: It also includes an acoustic wave sensor array, a module characteristic parameter measurement unit (4), a multi-channel signal acquisition unit (5), and a host computer (6); The acoustic wave sensor array is arranged around the press-fit package power module (7), and the acoustic wave sensor array is composed of at least three high-resolution acoustic wave sensors that are not in the same straight line, and is used to measure the instantaneous acoustic signal of failure of the press-fit package power module (7), and the signal measured by each high-resolution acoustic wave sensor is sent to the multi-channel signal acquisition unit (5); The module characteristic parameter measurement unit (4) is used to measure the short-circuit failure characteristic parameters of the crimped package power module (7), and send the measured failure characteristic parameters to the multi-channel signal acquisition unit (5); The multi-channel signal acquisition unit (5) transmits all received data to a host computer (6); The host computer (6) is used to determine whether a short circuit failure occurs in the crimped package power module (7) based on the received data, and if a short circuit failure occurs, locate the failure position based on the difference between the time when each high-resolution acoustic wave sensor receives the instantaneous acoustic signal of the failure and the time when the failure characteristic parameter suddenly changes.

2. According to claim 1, a short-circuit failure acoustic emission monitoring system for a press-fit package power module is characterized in that: The specific method for determining whether a short circuit failure occurs in the crimped package power module (7) is: First, a short-circuit test is performed to record the instantaneous acoustic signal of failure measured by the high-resolution acoustic wave sensor at the time when the short-circuit failure occurs. Then, during the short-circuit failure monitoring process, it is determined whether the acoustic signal measured in real time by the high-resolution acoustic wave sensor matches the recorded instantaneous acoustic signal of failure. If they match, it is determined that the crimped package power module (7) has a short-circuit failure. Otherwise, no short-circuit failure occurs.

3. According to claim 1, a short-circuit failure acoustic emission monitoring system for a press-fit package power module is characterized in that: The specific method of locating the failure position is: In the short-circuit test, the time t0 when the short-circuit failure occurs is recorded, and the time when the instantaneous sound signal reaches each high-resolution acoustic wave sensor when the short-circuit failure occurs is also recorded, which are defined as t1, t2…t n , the distance between the high-resolution acoustic wave sensor and the submodule to be measured (8) is defined as l1, l2…l n ; Calculate the sound wave propagation speed v1, v2…v n : And with v1, v2…v n The average value of is taken as the sound wave propagation speed v: In the short-circuit failure monitoring process, if it is determined that the crimping package power module (7) has a short-circuit failure, the moment T0 of the sudden change of the failure characteristic parameter is recorded, and the moment T1, T2, ..., Tn when the instantaneous sound signal of the failure reaches the sound wave sensors 1, 2, ..., are recorded. n , and then take each sensor as the center and v(T n -T0) is the radius, a sphere of possible sound source positions is drawn, and the intersection point of each sphere is taken as the failure position.

4. A monitoring method for a short-circuit failure acoustic emission monitoring system for a press-fit package power module as claimed in claim 1, characterized in that: The following steps are involved: S1: installing an acoustic wave sensor array around the press-fit package power module (7), wherein the acoustic wave sensor array is composed of at least three high-resolution acoustic wave sensors that are not in the same straight line; S2: Install the submodule to be tested (8) in the crimping package power module (7), and make the distance between the submodule to be tested (8) and each high-resolution acoustic wave sensor different, and measure the distance between the submodule to be tested (8) and n high-resolution acoustic wave sensors respectively, which are defined as l1, l2…l n ; S3: Based on the application conditions, a short-circuit test is performed on the submodule to be tested (8), and the module characteristic parameter measurement unit (4) is used to measure the short-circuit failure characteristic parameter. During the test, the conduction time is continuously extended until a destructive short-circuit failure occurs in the submodule to be tested (8), and the time t0 when the short-circuit failure occurs is recorded, and the instantaneous acoustic signal of the failure is obtained through an acoustic wave sensor; S4: Analyze the acoustic signal characteristics at the moment of failure; S5: The time when the instantaneous acoustic signal of failure is obtained to n high-resolution acoustic wave sensors is defined as t1, t2…t n , based on the distance and the time difference of the sound signal arrival, the sound wave propagation speed v1, v2…v is calculated n : And with v1, v2…v n The average value of is taken as the sound wave propagation speed v: S6: Record the soundprint characteristics of the instantaneous sound signal of the failure and the sound wave propagation speed v into the host computer (6); S7: Start short circuit failure monitoring, the host computer (6) records the moment T0 of the sudden change of the failure characteristic parameter, and records the moment T1, T2, ..., T3 when the instantaneous failure sound signal reaches the sound wave sensors 1, 2, ..., n. n ; S8: Determine whether the sound wave voiceprint matches the recorded information. If so, go to S9; if not, go to S7. S9: With each sensor as the center, v(T n -T0) is the radius, and a sphere of possible sound source positions is drawn; S10: taking each spherical intersection point as the position of the failed submodule.

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