Multi-channel temperature rise test method, equipment and device for switch equipment, and medium

Abstract

The invention discloses a multi-channel temperature rise test method, equipment and device for switch equipment and a medium, and is applied to the field of power transmission and transformation devices and equipment.The method comprises the steps that current amplitudes and initial current phases of a main loop and branches are measured; constructing a function of the current amplitude of the main loop relative to the compensation phase of each branch circuit under the same phase based on the connection mode of each branch circuit and the main loop; calculating the test compensation phase of each branch when the current amplitude of the main loop is minimum; and modulating the size of the phase test compensation phase of each branch. Through the phase current modulation method, the phases of the main loop and the branch are measured, the phase modulation parameter is calculated, and then through phase compensation, the current amplitude of the main loop is minimum under the condition that the current power is not changed. The multi-channel temperature rise test is carried out on the switch equipment under the condition that the heat generated by the main loop is small, the test measurement error is reduced, the multi-channel temperature rise test efficiency is improved, and the efficiency problem of one-by-one test during the multi-channel temperature rise test of the switch equipment is solved.

Description

Technical Field

[0001] The present invention relates to the field of power transmission and transformation devices and equipment, and in particular to a method, equipment, device and medium for testing multi-channel temperature rise of switchgear. Background Art

[0002] As an important protection and control equipment in the power system, switchgear equipment must undergo temperature rise test as a type and sampling test item. However, the current temperature rise test of switchgear equipment still has the problem of primitive test methods. For multi-way switch systems, such as busbar cabinets and multi-outlet cabinets in switchgear stations or low-voltage switch cabinets, there is currently no better detection method. It is often necessary to test multiple channels one by one in the same way as in the laboratory test, which makes wiring difficult, the test cycle is long, and it is time-consuming and laborious. In addition, there is an incomplete assessment of the motherboard and connection points; and the temperature rise test of multi-way switches is only carried out by stacking multiple power supplies. The traditional multi-way parallel test of switches requires repeated testing to meet the rated current of the main circuit and branches, which is extremely inefficient.

[0003] It can be seen that how to efficiently implement multi-channel temperature rise testing of switchgear is a technical problem that needs to be solved urgently by people in this field. Summary of the invention

[0004] In view of this, the purpose of the present invention is to provide a method, equipment, device and medium for multi-channel temperature rise testing of switchgear, so as to achieve the purpose of efficiently realizing multi-channel temperature rise testing of switchgear, and solve the problem that the traditional multi-channel parallel testing of switches needs to be repeatedly tested to meet the rated current of the main circuit and the branch circuit, and the efficiency is extremely low. The specific scheme is as follows:

[0005] In a first aspect, the present application provides a method for testing multi-channel temperature rise of a switch device, wherein the output ends of all branches are connected to form a common end, and the common end is connected to a main circuit through a multi-phase modulated power supply, comprising:

[0006] Measuring the current amplitude and initial current phase of the main circuit and each branch circuit;

[0007] Constructing a function of the current amplitude of the main circuit with respect to the compensation phase of each branch at the same phase based on the connection mode between each branch and the main circuit;

[0008] Calculating the test compensation phase of each branch when the current amplitude of the main circuit is minimum;

[0009] Modulate the phase of each branch to determine the magnitude of the test compensation phase.

[0010] Optionally, the magnitude of the test compensation phase of the phase of each branch modulated includes:

[0011] Phase compensation is achieved by controlling the adjustable resistor and capacitor elements in the switch cabinet, so that the current amplitude of the main circuit is minimized while ensuring that the current power remains unchanged.

[0012] Optionally, the calculation of the test compensation phase of each branch when the current amplitude of the main circuit is minimum includes:

[0013] Calculate the test compensation phase of the corresponding phase of each branch when the amplitude of any phase current of the main circuit is the smallest; wherein the number of branches to be measured is an even number, a certain phase current vector of each branch has an inverse complementary vector of the same phase of another branch, and the currents on each branch are evenly distributed in phase.

[0014] In a second aspect, the present application provides a multi-channel temperature rise test device for a switch device, comprising: a main controller, a multi-phase modulated power supply, and a current sensor in each branch corresponding to a load one by one;

[0015] The output ends of the current sensors corresponding to the loads in each branch are connected as the output ends of the branches to form a common end which is connected to the main circuit through the multi-phase modulated power supply;

[0016] The input end of the current sensor is connected to the corresponding load through a multi-phase wire;

[0017] The signal acquisition terminal of the main controller is connected to the current sensor;

[0018] The control end of the main controller is arranged between the multi-phase modulation power supply and the current sensor to implement the above-mentioned multi-channel temperature rise test method of the switching device based on current modulation.

[0019] Optionally, it further includes: a modulation terminal corresponding to each load in each branch;

[0020] The modulation terminal is arranged between the multi-phase modulation power supply and the current sensor corresponding to the same load as the modulation terminal;

[0021] The control end of the modulation terminal is connected to the main controller.

[0022] In a third aspect, the present application provides a test device, including the above-mentioned multi-channel temperature rise test device for switch equipment.

[0023] In a fourth aspect, the present application provides a computer-readable storage medium for storing a computer program; wherein, when the computer program is executed by a processor, the above-mentioned multi-channel temperature rise test method for a switching device is implemented.

[0024] It can be seen that the present application measures the current amplitude and initial current phase of the main circuit and each branch; constructs a function of the current amplitude of the main circuit with respect to the compensation phase of each branch under the same phase based on the connection mode of each branch to the main circuit; calculates the test compensation phase of each branch when the current amplitude of the main circuit is minimum; modulates the phase of each branch to determine the size of the test compensation phase. The present application measures the phase of the main circuit and the branch through the phase current modulation method, calculates the phase modulation parameter, and then through phase compensation, satisfies the minimum current amplitude of the main circuit while ensuring that the current power remains unchanged. Perform multi-channel temperature rise test on the switch device when the heat generated by the main circuit is small, reduces the test measurement error, improves the efficiency of multi-channel temperature rise test, and solves the efficiency problem of testing one by one during multi-channel temperature rise test of the switch device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0026] Figure 1 A flow chart of a multi-channel temperature rise test method for a switch device provided in an embodiment of the present application;

[0027] Figure 2 A schematic diagram of a branch current before phase modulation provided in an embodiment of the present application;

[0028] Figure 3 A schematic diagram of a branch current phase modulation provided in an embodiment of the present application;

[0029] Figure 4 A schematic diagram of a multi-channel temperature rise test device for a switch device provided in an embodiment of the present application;

[0030] Figure 5 A schematic diagram of a multi-channel temperature rise test device for a switch device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] The key point of this application is to disclose a multi-channel temperature rise test method for a switch device.

[0033] As an important protection and control equipment in the power system, switchgear equipment must undergo temperature rise test as a type and sampling test item. However, the current temperature rise test of switchgear equipment still has the problem of primitive test methods. For multi-way switch systems, such as busbar cabinets and multi-outlet cabinets in switchgear stations or low-voltage switch cabinets, there is currently no better detection method. It is often necessary to test multiple channels one by one in the same way as in the laboratory test, which makes wiring difficult, the test cycle is long, and it is time-consuming and laborious. In addition, there is an incomplete assessment of the motherboard and connection points; and the temperature rise test of multi-way switches is only carried out by stacking multiple power supplies. The traditional multi-way parallel test of switches requires repeated testing to meet the rated current of the main circuit and branches, which is extremely inefficient.

[0034] It can be seen that how to efficiently implement multi-channel temperature rise testing of switchgear is a technical problem that needs to be solved urgently by people in this field.

[0035] See also Figure 1 As shown, the embodiment of the present invention discloses a multi-channel temperature rise test method for a switch device to solve the problem of efficiently realizing the multi-channel temperature rise test of the switch device. The output ends of all branches are connected to form a common end, and the common end is connected to the main circuit through a multi-phase modulated power supply. It may include:

[0036] Step S11, measuring the current amplitude and initial current phase of the main circuit and each branch circuit.

[0037] In this embodiment, the output ends of all branches are connected to form a common end, and the common end is connected to the main circuit through a multi-phase modulated power supply. When all branches are tested for temperature rise through the same main circuit, the existing technology requires repeated testing to meet the rated current of the main circuit and each branch, which is extremely inefficient. To optimize the current control of the multi-way switch, it is first necessary to understand the actual situation of the current. By measuring the current amplitude of the main circuit and each branch, the size distribution of the current in each part can be known; by measuring the initial current phase, the relative position relationship between the current of each branch and the current of the main circuit can be clarified in time. These data are the basis for subsequent analysis and adjustment.

[0038] Step S12: constructing a function of the current amplitude of the main circuit with respect to the compensation phase of each branch at the same phase based on the connection mode between each branch and the main circuit.

[0039] In this embodiment, different connection modes, such as series connection, parallel connection, etc., will cause branch current to have different effects on the main circuit current. By constructing a function, the relationship between the main circuit current amplitude and each branch compensation phase can be quantified. In this way, it is possible to theoretically analyze how to adjust the branch phase to control the main circuit current amplitude, providing a basis for subsequent calculation of the optimal phase.

[0040] Step S13, calculating the test compensation phase of each branch when the current amplitude of the main circuit is minimum.

[0041] In this embodiment, after obtaining the function of the main loop current amplitude with respect to the compensation phase of each branch, the compensation phase value of each branch that minimizes the function value is found by mathematical methods. The phase setting corresponding to the minimum main loop current amplitude is the setting that the application expects to enable the circuit to reach the optimal state, which can reduce energy loss, reduce heat generation, etc., and is more conducive to meeting the test requirements.

[0042] In a specific implementation, the test compensation phase of the corresponding phase of each branch when the current amplitude of any phase of the main circuit is the smallest is calculated; the number of measurement branches can be selected to be an even number, and a certain phase current vector of each branch has an inverse complementary vector of the same phase of another branch, and the current on each branch is evenly distributed in phase. If there are four branches, two of which are inverse complementary vectors to each other, after constructing the function of the main circuit current amplitude with respect to the compensation phase of each branch, due to the inverse complementary characteristics, some current components are offset from each other, so that it is easy to find the test compensation phase of each branch that minimizes the main circuit current amplitude simply and directly. The main circuit current is the sum of an even number of vectors. When adjusting the phase, the current of each branch is balanced, thereby optimizing the main circuit current. When the current is evenly distributed in phase, the influence of each branch on the main circuit current is more balanced. Taking a three-phase circuit as an example, if it is expanded into six branches, with two branches in each phase, and evenly distributed in phase, when calculating the test compensation phase, the current in each phase of the main circuit can be better controlled to avoid the situation where the local current is too large or too small, further improving the stability of the entire system, and also conducive to the accuracy of the temperature rise test.

[0043] Step S14, modulating the phase of each branch to test the size of the compensation phase.

[0044] In this embodiment, after calculating the optimal test compensation phase, the phase of each branch is adjusted to this value, so that the main circuit current amplitude can be minimized. In this state, when performing temperature rise test, the main circuit and branches are more likely to reach the rated current, reducing the number of repeated tests and improving test efficiency.

[0045] In a specific embodiment, modulating the phase test compensation phase of each branch may include: achieving phase compensation by controlling the adjustable resistor and capacitor elements in the switch cabinet, while ensuring that the current power remains unchanged, satisfying the minimum current amplitude of the main circuit. After calculating the test compensation phase of each branch in step S13, the phase of each branch is adjusted by controlling the adjustable resistor and capacitor elements in the switch cabinet. Since the phase value that needs to be adjusted is accurately known, the phase of each branch can be adjusted to a suitable state in a targeted and rapid manner to minimize the current amplitude of the main circuit. In this process, the current power remains unchanged, which means that the active power is stable during the test process, while the stability of the main circuit current amplitude is reduced, reducing the current fluctuation. In an AC circuit, the power factor is related to the phase difference between current and voltage. The phase is adjusted by the adjustable resistor and capacitor elements so that the phase difference between current and voltage is closer to the ideal state. According to the calculation formula of the power factor:

[0046] ;

[0047] Where P is active power and S is apparent power. When the active power remains unchanged, that is, the current power remains unchanged, the apparent power will decrease as the amplitude of the main circuit current decreases, thereby improving the power factor. At the same time, the optimization of the main circuit current amplitude makes the current waveform more regular and closer to a sine wave. Compared with the traditional method of repeated attempts to adjust, this precise phase adjustment can reach the ideal test state in one step or quickly approach the ideal test state, avoiding a large number of meaningless repeated tests, so the number of repeated tests can be reduced. And each test can stabilize in a state that meets the requirements more quickly, thereby shortening the single test time and improving the test efficiency overall.

[0048] Based on the above steps, in actual application, for example, there are four branches 1, 2, 3, 4, and the three-phase currents are , , , In actual application, if the modulation is three-phase, assuming that the phases A, B, and C of each branch before modulation are 0°, 120°, and -120° respectively, the synthetic current of the main circuit is calculated as follows: , taking phase A as an example:

[0049] ;

[0050] like Figure 2 As shown, Indicates the main circuit A phase current synthesized before modulation, is the A phase current of the first branch, is the A phase current of the second branch, is the A phase current of the third branch, is the A-phase current of the fourth branch. The A-phase current amplitude of the main circuit is as follows: :

[0051] ;

[0052] in represents the amplitude of phase A of the first branch, represents the amplitude of the second branch A phase, Indicates the amplitude of the third branch A phase, Indicates the amplitude of the fourth branch A phase, such as Figure 3 As shown, after modulation, the phase of the A-phase current of branch 1 and branch 4 becomes , the phase current of phase A of branches 2 and 3 becomes The synthesized main circuit A phase current is as follows: :

[0053] ;

[0054] like Figure 3 As shown, is the A-phase current of the first branch after modulation, is the modulated A-phase current of the second branch, is the phase A current of the third branch after modulation, is the A phase current of the fourth branch after modulation. The amplitude after modulation , , , After modulation, the amplitude of each branch current remains unchanged, but due to the change of phase, , and , They are a set of reverse complementary vectors, and the imaginary components are offset, so the amplitude of the main circuit current after modulation is like :

[0055] ;

[0056] Among them, cos is the trigonometric function cosine, and Symmetric about the X axis, and and The sum of the absolute values ​​of is no greater than 90°, the addition of the simultaneous and , it can be seen , after modulating the branch current, the amplitude of the A phase current of the main circuit is reduced. The modulation of the other two phases B and C currents is the same, as shown in the formula:

[0057] ;

[0058] In summary, during the temperature rise test, the total current amplitude of the main circuit can be reduced to a certain extent by modulating the branch current phase.

[0059] It can be seen that the present application measures the current amplitude and initial current phase of the main circuit and each branch; constructs a function of the current amplitude of the main circuit with respect to the compensation phase of each branch under the same phase based on the connection mode of each branch to the main circuit; calculates the test compensation phase of each branch when the current amplitude of the main circuit is minimum; modulates the size of the phase test compensation phase of each branch. The present application measures the phase of the main circuit and the branch through the phase current modulation method, calculates the phase modulation parameter, and then through phase compensation, satisfies the minimum current amplitude of the main circuit while ensuring that the current power remains unchanged. Perform multi-channel temperature rise test on the switch device when the heat generated by the main circuit is small, reduces the test measurement error, improves the efficiency of multi-channel temperature rise test, and solves the efficiency problem of testing one by one during multi-channel temperature rise test of the switch device.

[0060] Accordingly, see Figure 4 As shown, the embodiment of the present application also provides a multi-channel temperature rise test device for a switch device, including: a main controller, a multi-phase modulation power supply, and a current sensor in each branch corresponding to the load one by one;

[0061] The output ends of the current sensors corresponding to the loads in each branch are connected as the output ends of the branches to form a common end which is connected to the main circuit through a multi-phase modulated power supply;

[0062] The input end of the current sensor is connected to the corresponding load through a multi-phase wire;

[0063] The signal collection terminal of the main controller is connected to the current sensor;

[0064] The control end of the main controller is arranged between the multi-phase modulation power supply and the current sensor to implement the above-mentioned multi-channel temperature rise test method of the switching device based on current modulation.

[0065] In this embodiment, the main controller is the core control component of the entire test device, which undertakes the tasks of data collection, analysis and processing, and issuing control instructions. Its signal acquisition end is connected to the current sensor, and can obtain the current information of each load in real time, including parameters such as current amplitude and phase. At the same time, its control end is set between the multi-phase modulation power supply and the current sensor, and can calculate the appropriate control parameters according to the collected current data and the multi-channel temperature rise test method of the switch device based on current modulation, and issue corresponding control instructions to the multi-phase modulation power supply and the current sensor to achieve accurate control of the entire test process. The output end of the multi-phase modulation power supply is connected to the main circuit current through a multi-phase wire to provide power for the entire test system. It can accurately modulate the output current according to the instructions issued by the main controller, including adjusting the current amplitude, phase and other parameters. The input end is connected to the output end of the current sensor corresponding to the load in each branch as the common end formed by the output end of all branches, and can receive the load current information fed back by the current sensor, so as to adjust the output current in real time according to the actual situation to ensure that the test requirements are met. The current sensor corresponds to the load one by one, and its input end is connected to the corresponding load through multi-phase wires. It is responsible for real-time monitoring of the current of each load and converting the collected current signal into an electrical signal and outputting it to the main controller and multi-phase modulated power supply. It provides accurate current data for the entire test system and is the basis for precise control and monitoring.

[0066] It can be seen that the multi-channel temperature rise test device for switch equipment works through the coordinated work of the main controller, multi-phase modulated power supply and current sensor. The current sensor monitors the current of each load in real time and accurately feeds back to the main controller. The main controller accurately calculates and analyzes the current and issues adjustment instructions to the multi-phase modulated power supply to achieve dynamic adjustment of the output current and ensure precise current control during the test. At the same time, the multi-phase modulated power supply can accurately modulate the current amplitude and phase according to the instructions of the main controller, accurately simulate the actual operating conditions of the switch equipment, and make the test results more reliable.

[0067] It can be seen that the main controller realizes the automatic control of the entire test process, reducing manual intervention and human errors. The multi-phase modulated power supply can quickly adjust the output current according to the instructions, reach the current state required for the test in a short time, and reduce the waiting time. The advantages are obvious in multiple tests or tests under different working conditions. The device forms a closed-loop control system. The current sensor monitors the current, the main controller analyzes and makes decisions, and the multi-phase modulated power supply adjusts the output to correct the current deviation in time; the main controller can also adaptively adjust the output parameters of the multi-phase modulated power supply according to load changes and test requirements, so that the system can quickly adapt to new working conditions. In addition, the device has a wide range of applications. The current sensor corresponds to the load one by one, and multiple loads can be monitored and controlled at the same time. It is suitable for various switchgear multi-channel temperature rise test scenarios; the multi-phase modulated power supply can flexibly modulate the output current, simulate different working conditions and load conditions, and provide comprehensive test data for switchgear performance evaluation and optimization.

[0068] like Figure 5 As shown, in order to further improve the control efficiency and accuracy of the device, in a specific implementation, this embodiment also provides a multi-channel temperature rise test device for a switch device, including: a modulation terminal corresponding to each load in each branch;

[0069] The modulation terminal is arranged between the multi-phase modulation power supply and the current sensor corresponding to the same load as the modulation terminal;

[0070] The control end of the modulation terminal is connected to the main controller.

[0071] In this embodiment, the modulation terminal corresponding to each load in each branch is arranged between the multi-phase modulation power supply and the current sensor corresponding to the same load as the modulation terminal, which plays a role in performing more refined and personalized modulation of the current of each load on the basis of the preliminary adjustment of the current by the multi-phase modulation power supply. The control end of the modulation terminal is connected to the main controller, and can receive control instructions sent by the main controller, and accurately adjust the current amplitude, phase and other parameters according to these instructions to meet the specific requirements of each load in the temperature rise test.

[0072] When each load is equipped with an independent modulation terminal, the main controller can perform personalized and precise control of each load through the modulation terminal according to the actual current situation of each load. Different loads may have different characteristics and working requirements. The original multi-phase modulation power supply can only make preliminary adjustments as a whole, while the modulation terminal can make more precise fine-tuning of the current amplitude and phase according to the specific situation of each load. After the introduction of the modulation terminal, the entire control architecture changes from centralized to distributed. The multi-phase modulation power supply is responsible for the overall power supply and preliminary current adjustment, while the modulation terminal is responsible for fine control of the current of each load. This distributed architecture distributes the control tasks to each modulation terminal, reduces the burden on the main controller, and enables the main controller to process data and issue control instructions more efficiently. At the same time, the modulation terminal can work in parallel and adjust the current of multiple loads at the same time, which greatly shortens the adjustment time and improves the control efficiency of the entire test process.

[0073] Furthermore, an embodiment of the present application also discloses a test device, including the above-mentioned multi-channel temperature rise test device for switch equipment.

[0074] Finally, the present application also discloses a computer-readable storage medium for storing a computer program; wherein, when the computer program is executed by a processor, the multi-channel temperature rise test method for a switch device disclosed above is implemented. For the specific steps of the method, reference may be made to the corresponding contents disclosed in the aforementioned embodiments, and no further description will be given here.

[0075] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0076] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0077] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0078] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0079] The technical solution provided by the present application is introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A multi-channel temperature rise test method for a switch device, characterized in that: The output ends of all branches are connected to form a common end, and the common end is connected to the main circuit through a multi-phase modulated power supply, including: Measuring the current amplitude and initial current phase of the main circuit and each branch circuit; Constructing a function of the current amplitude of the main circuit with respect to the compensation phase of each branch at the same phase based on the connection mode between each branch and the main circuit; Calculating the test compensation phase of each branch when the current amplitude of the main circuit is minimum; Modulate the phase of each branch to determine the magnitude of the test compensation phase.

2. The multi-channel temperature rise test method for switchgear according to claim 1, characterized in that: The magnitude of the test compensation phase of the phase of each branch of the modulation includes: Phase compensation is achieved by controlling the adjustable resistor and capacitor elements in the switch cabinet, so that the current amplitude of the main circuit is minimized while ensuring that the current power remains unchanged.

3. The multi-channel temperature rise test method for switchgear according to claim 1, characterized in that: The test compensation phase of each branch when calculating the current amplitude of the main circuit is minimum includes: Calculate the test compensation phase of the corresponding phase of each branch when the amplitude of any phase current of the main circuit is the smallest; wherein the number of branches to be measured is an even number, a certain phase current vector of each branch has an inverse complementary vector of the same phase of another branch, and the currents on each branch are evenly distributed in phase.

4. A multi-channel temperature rise test device for switchgear, characterized in that: include: A main controller, a multi-phase modulated power supply, and current sensors corresponding to the loads in each branch; The output ends of the current sensors corresponding to the loads in each branch are connected as the output ends of the branches to form a common end which is connected to the main circuit through the multi-phase modulated power supply; The input end of the current sensor is connected to the corresponding load through a multi-phase wire; The signal acquisition terminal of the main controller is connected to the current sensor; The control end of the main controller is arranged between the multi-phase modulation power supply and the current sensor to implement the multi-channel temperature rise test method of the switching device based on current modulation as described in any one of claims 1 to 3.

5. The switchgear multi-channel temperature rise test device according to claim 4, characterized in that: Also includes: A modulation terminal in each of the branches corresponding to the loads one by one; The modulation terminal is arranged between the multi-phase modulation power supply and the current sensor corresponding to the same load as the modulation terminal; The control end of the modulation terminal is connected to the main controller.

6. A test device, characterized in that: The invention comprises a multi-channel temperature rise test device for a switch device as claimed in any one of claims 4 or 5.

7. A computer-readable storage medium, characterized in that: Used to store a computer program; wherein, when the computer program is executed by a processor, the multi-channel temperature rise test method for a switching device as described in any one of claims 1 to 3 is implemented.

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