Housing structure for handheld electronic device

Abstract

The present application relates to a housing structure for a handheld electronic device. A tablet computing system is disclosed, which may include: a housing member, the housing member defining: a first portion of a back exterior surface of the tablet computer; at least a portion of a side exterior surface of the tablet computer; a raised edge extending from the back exterior surface and at least partially defining a sensor assembly hole extending through the housing member; and a support protrusion positioned in the sensor assembly hole. The tablet computing system may also include: a frame member, at least partially positioned in the sensor assembly hole and coupled to the support protrusion; a camera bracket, coupled to the frame member; a first camera module, coupled to the camera bracket; a second camera module, coupled to the camera bracket, the camera bracket fixing the relative positions of the first camera module and the second camera module; and a cover member, positioned in the sensor assembly hole and attached to the frame member.

Description

[0001] This application is a divisional application of the invention patent application with application date of August 18, 2020, application number 202010831945.3, and invention name “Housing structure for handheld electronic devices”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This patent application is a non-provisional patent application of U.S. Provisional Patent Application No. 62 / 986,588, entitled “Housing Structure for Handheld Electronic Device,” filed on March 6, 2020 and claims the benefit of that patent application, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0004] The presently disclosed subject matter relates generally to electronic devices, and more particularly to housing structures for handheld electronic devices. Background Art

[0005] Modern consumer electronic devices come in many shapes and forms and have a variety of uses and functions. Tablet computing systems, for example, may include a touch-sensitive display, speakers, cameras, microphones, batteries, and advanced processors and other electronics. These and other subsystems may be integrated into compact handheld products that offer many functions while being reliable and able to withstand daily use. Summary of the invention

[0006] The present invention discloses a tablet computing system, which may include: a housing member, the housing member defining a first portion of a back exterior surface of the tablet computer; at least a portion of a side exterior surface of the tablet computer; a raised edge, the raised edge extending from the back exterior surface and at least partially defining a sensor assembly hole extending through the housing member; and a support protrusion, the support protrusion being positioned in the sensor assembly hole. The tablet computing system may also include: a frame member, the frame member at least partially positioned in the sensor assembly hole and coupled to the support protrusion; a camera bracket, the camera bracket coupled to the frame member; a first camera module, the first camera module coupled to the camera bracket; a second camera module, the second camera module coupled to the camera bracket, the camera bracket fixing the relative positions of the first camera module and the second camera module; and a cover member, the cover member being positioned in the sensor assembly hole and attached to the frame member. The outer surface of the cover member may define a second portion of the back exterior surface of the tablet computing system.

[0007] The raised rim may define a flat top surface, and the outer surface of the cover member may be flush with or recessed relative to the flat top surface of the raised rim. The frame member may define a network of ribs configured to transfer impact forces from a first portion of the shell member to a second portion of the shell member. The frame member may be sintered to the shell member.

[0008] The cover member may define: a first hole, the first hole being aligned with the first camera module; a second hole, the second hole being aligned with the second camera module. The tablet computing system further includes: a first transparent camera window, the first transparent camera window being positioned in the first hole and covering the first camera module; and a second transparent camera window, the second transparent camera window being positioned in the second hole and covering the second camera module.

[0009] The frame member may define a first reference surface and a second reference surface, and the tablet computing system may further include: a first spring, the first spring being configured to apply a first force to the camera bracket in a first direction, thereby forcing the camera bracket to abut against the first reference surface; and a second spring, the second spring being configured to apply a second force to the camera bracket in a second direction different from the first direction, thereby forcing the camera bracket to abut against the second reference surface.

[0010] The tablet computing system may include a depth sensor coupled to the camera bracket and configured to determine a distance between the tablet computing system and an external object. The cover member may define: a light-transmitting window area positioned above the depth sensor; and an opaque area at least partially surrounding the light-transmitting window area.

[0011] The tablet computing system may include: a housing member defining at least a portion of a back exterior surface of the tablet computing system; and a raised rim extending from the back exterior surface and at least partially defining a sensor assembly aperture extending through the housing member. The tablet computing system may also include a frame member at least partially positioned in the sensor assembly aperture and coupled to the housing member, the frame member defining: a first recessed portion, the first recessed portion being located at a front side of the frame member; a second recessed portion, the second recessed portion being located at a rear side of the frame member; and a first aperture, the first aperture extending from the first recessed portion through the frame member to the second recessed portion. The tablet computing system may also include a cover member positioned in the sensor assembly aperture and attached to the frame member, the cover member defining a second aperture extending through the cover member. The tablet computing system may also include a microphone module positioned in the second recessed portion of the frame member and configured to receive sound via an acoustic path extending through the first hole in the frame member, a volume defined between the first recessed portion and the cover member, and the second hole in the cover member. The first hole and the second hole may not be coaxial. The tablet computing system may also include a microphone shield coupled to the cover member and covering the second hole.

[0012] The cover member may be attached to the frame member with an adhesive, and the adhesive may surround the first recess and define an airtight seal between the frame member and the cover member around the first recess. The adhesive may be a first adhesive, and the microphone module may be attached to the frame member with a second adhesive, and the second adhesive may define an airtight seal between the frame member and the microphone module. The first adhesive and the second adhesive may hermetically seal the acoustic path from an internal volume of the tablet computing system. The tablet computing system may also include a microphone shield coupled to the cover member and covering the second hole.

[0013] The covering member may define a third hole extending through the covering member, and the tablet computing system may further include: a flash module coupled to the frame member; and a flash window positioned in the third hole and covering the flash module.

[0014] The electronic device may include: a housing member defining a first portion of a back exterior surface of the electronic device; and a raised rim extending from the back exterior surface and at least partially defining a sensor assembly aperture extending through the housing member. The electronic device may also include: a frame member at least partially positioned in the sensor assembly aperture and coupled to the housing member; a camera bracket coupled to the frame member; a first camera module coupled to the camera bracket and including a camera lens having a first focal length; a second camera module coupled to the camera bracket and including a camera lens having a second focal length different from the first focal length; and a depth sensor module coupled to the camera bracket. The depth sensor module may include: an optical emitter; and an optical sensor configured to detect light emitted by the optical emitter and reflected by an object external to the electronic device. The electronic device may also include a cover member positioned in the sensor assembly aperture and defining a second portion of the back exterior surface of the electronic device. The electronic device may further include: a microphone module coupled to the frame member; and a flash module coupled to the frame member. The frame member may be welded to the housing member, and the frame member may define a network of ribs configured to transfer an impact force from a first portion of the housing member to a second portion of the housing member.

[0015] The frame member defines a depth sensor hole, which is configured to receive at least a portion of the depth sensor module, and the electronic device may also include: a conductive cover, which at least partially surrounds the depth sensor hole and defines a plurality of conductive plugs extending into the depth sensor hole; and a compliant material, which is configured to bias the plurality of conductive plugs against the depth sensor module.

[0016] The frame member may be conductively coupled to a ground plane of the electronic device, and the depth sensor module may be conductively coupled to the frame member via the conductive shield. The conductive shield may include a metal foil. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present disclosure will be readily understood through the following detailed description in conjunction with the accompanying drawings, in which like reference numerals refer to like structural elements, and in which:

[0018] Figure 1A to Figure 1B An example electronic device is shown;

[0019] Figure 2AAn exploded view of an example electronic device is shown;

[0020] Figure 2B A partial cross-sectional view of a portion of an example electronic device is shown;

[0021] Figure 3A A portion of an example electronic device is shown;

[0022] Figure 3B shows the impact surface Figure 3A electronic devices;

[0023] Figure 3C Shows Figure 3A part of an electronic device;

[0024] FIG. 3D to FIG. 3E Shows Figure 3A A partial cross-sectional view of an electronic device;

[0025] Figure 3F shows a partial cross-sectional view of another example electronic device;

[0026] Figure 4A Components of an example electronic device are shown;

[0027] Figure 4B An exploded view of an example electronic device is shown;

[0028] Figure 4C Shows Figure 4B part of an electronic device;

[0029] FIG. 5A to FIG. 5C A partial cutaway view of an example electronic device is shown;

[0030] Fig. 6A A portion of an example electronic device is shown;

[0031] FIG. 6B to FIG. 6C Shows Fig. 6A A partial cross-sectional view of an electronic device;

[0032] Fig.6D Components of an electronic device are shown;

[0033] Fig. 7A A portion of an example electronic device is shown;

[0034] Figure 7B Shows Fig. 7A Detailed view of electronic devices;

[0035] Figure 7C Shows Fig. 7A A partial cross-sectional view of an electronic device;

[0036] Fig. 8AAn example sensor component for use in an electronic device is shown;

[0037] FIG. 8B to FIG. 8D A partial cross-sectional view of a sensor component for an electronic device is shown; and

[0038] Fig. 9 A schematic diagram of an exemplary electronic device is shown. DETAILED DESCRIPTION

[0039] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a preferred embodiment. On the contrary, it is intended to cover alternatives, modifications and equivalent forms that may be included in the spirit and scope of the embodiments defined by the appended claims.

[0040] Modern portable electronic devices are complex devices that include many complex, advanced components and systems that facilitate a variety of functions. For example, a tablet computer according to the present disclosure may include a touch-sensitive display and / or a force-sensitive display, multiple cameras (including both forward-facing and rear-facing cameras), a GPS system, a tactile actuator, a wireless charging system, and all necessary computing components and software for operating these (and other) systems and otherwise providing the functionality of the tablet computer. In order to maintain the portability and usability of such devices, these systems must be physically integrated into a small, thin, and lightweight device, while also ensuring that the device remains stable and capable of daily use.

[0041] Figure 1A An example electronic device 100 is shown that is embodied as a tablet computing system (also referred to as a tablet computer). Although device 100 is a tablet computer, the concepts presented herein may be applicable to any suitable electronic device, including a wearable device (e.g., a watch), a laptop computer, a handheld gaming device, a mobile phone, a computing peripheral device (e.g., a mouse, a trackpad, a keyboard), or any other device. Thus, any reference to an "electronic device" encompasses any and all of the foregoing.

[0042] The electronic device 100 includes a cover 102 (e.g., a front cover) such as glass, glass ceramic, ceramic, plastic, sapphire, or other substantially transparent material, component, or assembly attached to a housing 104. The cover 102 can be positioned above the display 103. The cover 102 can be formed of glass (e.g., chemically strengthened glass), sapphire, ceramic, glass ceramic, plastic, or another suitable material. The cover 102 can be formed as a single piece or unitary sheet. The cover 102 can also be formed as a composite of multiple layers of different materials, coatings, and other elements.

[0043] Display 103 may be at least partially positioned within the interior volume of housing 104. Display 103 may be coupled to cover 102, such as via an adhesive or other coupling scheme. Display 103 may include a liquid crystal display (LCD), a light emitting diode, an organic light emitting diode (OLED) display, an active layer organic light emitting diode (AMOLED) display, an organic electroluminescent (EL) display, an electrophoretic ink display, etc. Display 103 may be configured to display graphical output, such as a graphical user interface that a user can view and interact with. Device 100 may also include an ambient light sensor that may determine properties of ambient light conditions surrounding device 100. Device 100 may use information from the ambient light sensor to change, modify, adjust, or otherwise control display 103 (e.g., by changing the hue, brightness, saturation, or other optical aspects of the display based on information from the ambient light sensor).

[0044] The display 103 may include or be associated with one or more touch sensing systems and / or force sensing systems. In some cases, components of the touch sensing system and / or force sensing system are integrated with the display stack. For example, the electrode layer of the touch sensor and / or force sensor may be provided in the form of a stack that includes display components (and is optionally attached to the cover 102 or at least visible through the cover). The touch sensing system and / or force sensing system may use any suitable type of sensing technology, including capacitive sensors, resistive sensors, surface acoustic wave sensors, piezoelectric sensors, strain gauges, etc. The exterior or external surface of the cover 102 may define the input surface of the device (e.g., a touch-sensitive input surface and / or a force-sensitive input surface). Although both a touch sensing system and a force sensing system may be included, in some cases, the device 100 includes a touch sensing system and does not include a force sensing system. The device 100 using the touch sensing system and / or force sensing system may be configured to detect input applied to the cover 102. Such input includes, for example, a touch input applied by one or more fingers, a stylus, or another tool. Touch-based input applied using a finger, stylus, or other tool may include touch, tap, single-finger or multi-finger gesture (e.g., swipe, pinch gesture, etc.), handwriting input, drawing input, etc. In some cases, the force sensing system detects the amount of force associated with the touch-based input. The device 100 may take different actions based on the amount of force detected. For example, if the touch-based input (e.g., applied to a selectable element displayed on the display 103) is associated with a force below a threshold, the device 100 may take a first action (e.g., launch an application associated with the selectable element), and if the touch-based input is associated with a force exceeding the threshold, the device 100 may take a second action (e.g., display a menu associated with the selectable element). Other actions are also contemplated.

[0045] Device 100 may also include a forward camera 111. Forward camera 111 may be positioned below cover 102 or otherwise covered and / or protected by the cover. Forward camera 111 may have any suitable operating parameters. For example, forward camera 111 may include a 12 megapixel sensor (with a pixel size of 1 micron) and a field of view of 80° to 90°. Forward camera 111 may have a fixed focal length optical element with an aperture of f / 1.8. Other types of cameras may also be used for forward camera 111.

[0046] Device 100 may also include one or more buttons (e.g., buttons 106, 108), switches, and / or other physical input systems. Such input systems may be used to control power state (e.g., button 106), change speaker volume (e.g., button 108), switch between "ring" mode and "silent" mode, etc.

[0047] Device 100 may also include a charging port 113 (e.g., for receiving a power cable for providing power to device 100 and charging a battery of device 100). Device 100 may also include one or more speakers and one or more microphones. Housing 104 may include audio openings to allow sound (produced by internal speakers) to exit housing 104 and to allow internal microphones to acoustically couple to the surrounding environment through the audio openings.

[0048] The housing 104 may be a multi-piece housing. For example, the housing 104 may be formed by a plurality of housing members 128, 130, which are structurally coupled together via one or more joint structures 112. The joint structure 112 may mechanically interlock with the housing members 128, 130 to structurally couple the housing members and form a structural housing assembly. The housing members 128 and 130 and the joint structure 112 together may define four side walls (and thus four outer side surfaces) of the device 100. Therefore, both the housing members and the joint structure define portions of the outer side surfaces of the device 100. For example, the housing member 128 may define a first side surface of the electronic device, and portions of the second and third side surfaces of the electronic device. The housing member 130 may also define portions of the second and third side surfaces of the electronic device and a fourth side surface. The housing member 130 may also define substantially the entire back exterior surface of the device 100. The housing member 130 may be an integral structure, such as a single piece of metal (or other suitable material), which defines portions of the back surface and two, three or four side surfaces. (In some cases, housing member 130 may be configured to define only the back surface of device 100.)

[0049] The shell members 128 and 130 may be formed of conductive materials (e.g., metals such as aluminum, stainless steel, etc.), and the joint structure 112 may be formed of one or more polymer materials (e.g., glass reinforced polymer). The joint structure 112 may include one or more molded elements. The joint structure 112 may be formed of a polymer material (e.g., a fiber reinforced polymer). In the case where the joint structure 112 is formed by two or more molded elements, the molded elements may be formed of different materials. For example, the inner molded element may be formed of a first material (e.g., a polymer material), and the outer molded element may be formed of a second material different from the first material (e.g., a different polymer material). These materials may have different properties, which may be selected based on different functions of the inner molded element and the outer molded element. For example, the inner molded element may be configured to form a main structural connection between the shell members, and may have a higher mechanical strength and / or toughness than the outer molded element. On the other hand, the outer molded element may be configured to have a specific appearance, surface finish, chemical resistance, waterproof function, etc., and its composition may be selected to give priority to those functions over mechanical strength.

[0050] In some cases, one or more of the housing components 128, 130 (or portions thereof) are configured to operate as antennas (e.g., components configured to transmit and / or receive electromagnetic waves to facilitate wireless communication with other computers and / or devices). In order to facilitate the use of the housing components as antennas, feed lines and ground lines can be coupled to the housing components in a conductive manner to couple the housing components to other antennas and / or communication circuits. In addition, the connector structure 112 can be substantially non-conductive to provide suitable separation and / or electrical isolation between the housing components. The connector structure 112 can be used to tune the radiating portion, reduce capacitive coupling between the radiating portion and other structures, etc. In addition to the housing components 128, 130 (some or all of which can be used as antennas), the device 100 can also include various internal antenna elements configured to transmit and receive wireless communication signals through various areas of the housing 104.

[0051] The exterior surfaces of the shell members 128, 130 can have substantially the same color, surface texture, and overall appearance as the exterior surfaces of the joint structure 112. In some cases, the exterior surfaces of the shell members 128, 130 and the exterior surfaces of the joint structure 112 are subjected to at least one common finishing process, such as abrasive blasting, machining, polishing, grinding, etc. Thus, the exterior surfaces of the shell members and the joint structure can have the same or similar surface finish (e.g., surface texture, roughness, pattern, etc.). In some cases, the exterior surfaces of the shell members and the joint structure can be subjected to a two-stage blasting method to produce a target surface finish.

[0052] Device 100 may also include sensor 110. Sensor 110 may be configured to detect the presence or configuration of an accessory. For example, a foldable cover accessory may be provided for use with device 100. Sensor 110 may be configured to detect whether the cover accessory is in an open configuration (e.g., such that cover 102 is exposed, graphical output on display 103 is visible, and a user can provide touch-based input on cover 102). Device 100 may take different actions in response to detecting whether the cover accessory is open or closed, and / or based on detecting a transition (e.g., when the cover accessory transitions from open to closed, or vice versa). For example, device 100 may activate display 103 upon detecting that the cover accessory has been opened, and deactivate display 103 upon detecting that the cover accessory has been closed.

[0053] The sensor 110 may be configured to detect components or materials of the accessory cover. For example, the sensor 110 may be a Hall effect sensor, an optical sensor, a reed switch, a magnetometer, an inductive sensor, or any other suitable sensor or sensor system. In some cases, the sensor 110 (e.g., a Hall effect sensor) may detect the presence of a magnet in the cover accessory, where the magnet is positioned so that it is proximate to the sensor 110 when the cover accessory is in a closed configuration. The sensor 110 may be positioned below (or behind) the display 103 and may sense the presence of the cover accessory through the cover 102, the display 103, components of the touch sensing system and / or force sensing system, etc.

[0054] Figure 1B The back side of device 100 is shown. Housing members 128, 130 and joint structure 112 can each define a portion of a back surface 114 of device 100. Device 100 can also include a rearward sensor area 116. Rearward sensor area 116 can include a cover member 132, which can be set into an opening in housing member 130. Housing member 130 can define a raised rim 134 surrounding the outer perimeter of cover member 132. Cover member 132 can cover various types of input and output devices, including but not limited to one or more cameras, flashes, microphones, depth sensing devices or distance sensing devices, ambient light sensors, etc. Cover member 132 can define openings (e.g., meshes, windows, etc.) in which other components can be positioned, sensor windows (e.g., areas transparent to visible light, infrared light, etc.), etc.

[0055] Device 100 may include a first camera 118, a second camera 120, and a flash 122 in or associated with rearward sensor area 116. First camera 118 may be an ultra-wide camera with a 12-megapixel sensor and a camera lens with a first focal length (or focal length range), a wide field of view (e.g., 120° FOV) optical stack with an f-stop number of f / 2.4, and second camera 120 may be a wide-angle camera with a 12-megapixel sensor, a second focal length (or focal length range) different from the first focal length, and an f-stop number of f / 1.6. In some cases, the first camera and the second camera may have other optical properties and / or capabilities. For example, the first camera or the second camera may be a telephoto camera with a 12-megapixel sensor and a 2x optical zoom optical stack and an f-stop number in the range of f / 2.0 to f / 2.2. One or more of the cameras 118, 120 may also include optical image stabilization, whereby the camera lens is dynamically moved relative to a fixed structure within the device 100 to reduce the effects of "camera shake" on images captured by the camera. The camera may also perform optical image stabilization by moving the image sensor relative to a fixed lens or optical assembly.

[0056] The cameras 118, 120, along with associated processors and software, may provide several image capture features. For example, the cameras 118, 120 may be configured to capture a full-resolution video clip of a certain duration each time a user captures a still image. As used herein, capturing a full-resolution image (e.g., a video image or a still image) may refer to capturing an image using all or substantially all pixels of an image sensor, or otherwise capturing an image using the maximum resolution of the camera (whether the maximum resolution is limited by hardware or software).

[0057] The captured video clip may be associated with a still image. In some cases, the user may be able to select individual frames from the video clip as representative still images associated with the video clip. Thus, when the user takes a snapshot of a scene, the camera will actually record a short video clip (e.g., 1 second, 2 seconds, etc.), and the user can select a precise frame from the video to use as the captured still image (in addition to simply viewing the video clip as a video).

[0058] The cameras 118, 120 may also include one or more cameras with a high dynamic range (HDR) mode in which the camera captures an image with a dynamic brightness range that is greater than the brightness range captured when the camera is not in HDR mode. In some cases, the cameras 118, 120 automatically determine whether to capture an image in HDR mode or non-HDR mode. Such a determination may be based on various factors, such as the ambient light of the scene, the detected brightness range, hue, or other optical parameters in the scene, etc. An HDR image may be generated by capturing multiple images, each using a different exposure or other image capture parameter, and generating a composite image from the multiple captured images.

[0059] Cameras 118, 120 may also include or be configured to operate according to an object detection mode in which a user may select (and / or device 100 may automatically identify) objects within a scene to facilitate processing, displaying, or capturing those objects differently than other portions of the scene. For example, a user may select (or device 100 may automatically identify) a person's face in a scene, and device 100 may focus on the person's face while selectively blurring portions of the scene other than the person's face. Notably, features such as an HDR mode and an object detection mode may be provided with a single camera (e.g., a single lens and sensor).

[0060] The flash 122 is configured to illuminate a scene to facilitate capturing an image using the cameras 118, 120. The flash 122 may include one or more light sources, such as one or more light emitting diodes (e.g., 1, 2, 3, 4, or more LEDs). In conjunction with the cameras 118, 120 or other systems of the device 100, the flash 122 may adjust the color temperature of the light emitted by the light source to match or otherwise adapt to the color temperature within the scene being captured. The device 100 may also be configured to operate the flash 122 and shutter of the cameras 118, 120 to avoid the consequences of flash "blinking". For example, the device 100 may avoid capturing exposures during moments when the flash 122 is in no lighting or low lighting (e.g., which may be caused by discontinuous or pulsed operation of the LED).

[0061] Device 100 may also include microphone 124 and depth sensor 126 in or associated with rearward sensor region 116. Microphone 124 may be configured to capture audio and may be associated with an opening in cover member 132. 7A to 7C Microphone 124 and its physical integration in device 100 are described. Depth sensor 126 may be configured to estimate the distance between device 100 and a separate object or target. Depth sensor 126 may include a transmitter and a receiver and may be configured to transmit and receive light through the material of cover member 132. FIG. 6A to FIG. 6D Depth sensor 126 and its physical integration into device 100 are described.

[0062] FIG. 2 shows a partially exploded view of the electronic device 100. Specifically, Figure 2A An exploded view of a portion of device 100 including rearward-facing sensor region 116 (also referred to herein simply as sensor region 116) is shown. Housing member 130 may define a raised rim 134, and raised rim 134 in turn defines a sensor assembly aperture 200 (or just aperture 200) extending through housing member 130. Aperture 200 may house components of sensor region 116, such as cameras 118, 120, flash 122, microphone 124, and depth sensor 126. For example, aperture 200 may provide the internal components with optical, audio, or other access to the environment surrounding device 100 (e.g., so that a camera may capture an image, a flash may illuminate a scene, a microphone may receive audio, etc.). In some cases, more, fewer, or different components may be housed within or proximate aperture 200.

[0063] Figure 2A A first camera module 202 and a second camera module 204 are shown, which may include camera lenses and sensors of the first camera 118 and the second camera 120, respectively. Figure 2A Also shown is a depth sensor module 206, which may include one or more sensors, emitters, and lenses of the depth sensor 126. For example, the depth sensor module 206 may include one or more optical emitters 212 adapted to emit one or more light beams that may be used to estimate distance. In some cases, the one or more light beams are coherent light beams having a substantially uniform wavelength / frequency. Coherent light sources may facilitate depth measurement using time of flight, phase shift, or other optical effects. The depth sensor module 206 may also include an optical sensor 214 (and an associated lens) that uses time of flight or another optical effect to measure the distance between the device 100 and an external object. For example, the optical sensor 214 may detect reflected light emitted from the optical emitter 212. In some cases, the depth sensor module 206 uses an audio output, a radio output, or other types of outputs that may be used to measure the distance between the device 100 and one or more external objects.

[0064] Figure 2AAlso shown are a flash module 208 and a microphone module 210. As described herein, the flash module 208 may include one or more light sources and be configured to illuminate a scene to facilitate capturing an image with the camera. The microphone module 210 may include a diaphragm, membrane, or other transducer component for detecting sound. The camera modules 202, 204, the depth sensor module 206, the microphone module 210, and the flash module 208 may all be positioned in the rearward sensor region 116 ( Figure 1B ) and can be configured to interact with the external environment of the device 100 through the hole 200 and the covering member 132.

[0065] The device 100 may also include a bracket member 216 (also referred to herein as a camera bracket) to which the camera modules 202, 204 and the depth sensor module 206 may be coupled. The bracket member (or camera bracket) 216 may define a first container portion 218 configured to receive the first camera module 202, a second container portion 220 configured to receive the second camera module 204, and a third container portion 222 configured to receive the depth sensor module 206. Each container portion may define an opening for optical components of the camera module and the depth sensor module. The container portions may define flanges or sidewalls that at least partially surround the camera module and the depth sensor module. The bracket member 216 may be configured to fix the relative position of the camera module and the depth sensor module. For example, the relative position and / or orientation of the camera module and the depth sensor module may be important to ensure the correct operation of the features and / or functions of the camera module and the depth sensor module. For example, in some cases, it is necessary or desirable that the optical axes of the camera module and the depth sensor module (where the optical axis may refer to a line defining the path along which light propagates through the lens of the module) converge parallel to the device 100 or at a predetermined distance away from the device. As another example, it is necessary or desirable that the offset (e.g., the offset along the optical axis) between the camera module and the depth sensor module be set at a predetermined distance. Such alignment and positioning may be necessary or desirable to provide functions such as camera focus assistance, depth mapping, image processing, etc., and the use of a common structure (such as a bracket member 216) to which the camera module and the depth sensor module are coupled may help establish and maintain the desired alignment and positioning. Notably, the bracket member 216 may establish and maintain any desired alignment, positioning, orientation, offset, or other spatial parameter that results in the proper operation of the optical system.

[0066] The device 100 may also include a frame member 224. The frame member 224 may be positioned in the hole 200 and attached to the housing member 130. The frame member 224 may improve the strength, stiffness, or other physical properties of the housing member 130. For example, the frame member 224 may compensate for the reduced strength and / or stiffness of the housing member 130 caused by the hole 200 formed in the housing member 130. The frame member 224 may define a first opening 226, a second opening 228, and a third opening 230 for the first camera module 202, the second camera module 204, and the depth sensor module 206, respectively. The frame member 224 may also define a fourth opening 232 for the flash module 208 and a fifth opening 234 for the microphone module 210. The openings in the frame member 224 may at least partially receive the corresponding modules, and optical, acoustic, or other pathways may be provided through the frame member 224. The openings in the frame member 224 may also receive other components. For example, a flash module trim member 238 may be positioned in or adjacent to the fourth opening 232 and may help hold the flash module 208 (and flash window 236) in place.

[0067] The frame member 224 may be formed of or include steel, aluminum, magnesium, titanium, polymers (e.g., fiber reinforced polymers), composite materials, or any other suitable material. The frame member 224 may include a coating. For example, the frame member 224 may include a diamond-like carbon (DLC) coating, a metal or metal coating, an oxide coating, or any other suitable coating (applied using plasma vapor deposition (PVD), chemical vapor deposition (CVD), electroplating, etc.). In some cases, the frame member 224 is anodized, oxidized, or otherwise treated to produce an outer shell or layer having a composition different from that of the underlying portion of the frame member 224. In some cases, an external coating, layer, or other treatment may provide desired optical properties, such as imparting a specific reflectivity, color, etc. to the surface of the frame member 224. In some cases, not all surfaces of the frame member 224 are coated as described above. For example, in some cases, only the external surface includes a coating.

[0068] Figure 2A Also shown is a cover member 132 that can cover the frame member 224 and can define an exterior surface of the device 100. For example, the exterior surface of the cover member 132 can be an aesthetically pleasing exterior surface of the electronic device 100 in the area of ​​the rearward sensor area 116. The cover member 132 can be formed of sapphire, glass, polymer, ceramic, etc. The cover member 132 can be formed of a transparent material. In other specific implementations, the cover member 132 can be formed of an opaque or non-transparent material.

[0069] In some cases, some or all of the exterior or interior surfaces of the cover member 132 may include a coating such as a paint, ink, dye, sheet, film, etc. Such a coating may be transparent, translucent, or opaque. In some cases, the coating is discontinuous and / or defines regions along the cover member 132 having different optical properties. For example, the depth sensor window region 246 of the cover member 132 may have different optical properties (e.g., different materials, different optical properties, different layers, etc.) than the region outside and / or surrounding the depth sensor window region 246. For example, the sensor window region 246 may be more transparent to light (e.g., for a particular wavelength of light emitted by the depth sensor and / or detected by the depth sensor) than the region surrounding the sensor window region 246, which may be opaque.

[0070] The cover member 132 may define openings in which other protective elements may be positioned. For example, the cover member 132 defines a first opening 242 for the first camera module 202 and is configured to receive a first camera window 250 therein. The cover member 132 also defines a second opening 244 for the second camera module 204 and is configured to receive a second camera window 252 therein. The first camera window 250 and the second camera window 252 may cover the first camera module 202 and the second camera module 204, respectively, and may protect the camera modules 204, 206 (and their lenses) from scratches or other damage or contamination. The first opening 242 and the second opening 244 of the cover member 132 may be configured to surround a flange or raised rim extending around the first opening 226 and the second opening 228 of the frame member 224, and the first camera window 250 and the second camera window 252 may be coupled to a protrusion or other feature of the frame member 224 within the flange or raised rim. Thus, in some cases, the exterior surface of rearward sensor region 116 (eg, in the area of ​​the camera) may be defined by a portion of cover member 132 , a top surface of a flange or raised edge of frame member 224 , and camera windows 250 , 252 .

[0071] The cover member 132 may also define a third opening 248 for the flash module 208 and a fourth opening 254 for the microphone module 210. The flash window 236 may extend at least partially into the third opening 248 and may cover and / or protect the flash module 208 while allowing light from the flash module 208 to exit the device 100. The microphone shield 240 may be at least partially positioned in the fourth opening 254 to cover and / or protect the microphone module 210 while allowing sound to enter the device 100 from outside the device 100.

[0072] Figure 2B Shown along Figure 1B1 is an example cross-sectional view of the device 100 viewed along line AA in FIG. More specifically, Figure 2B Shows the relative Figure 2A An example arrangement of a subset of components associated with the rearward sensor region 116 is shown and described. Figure 2B Some components of the device 100 are omitted.

[0073] Figure 2B The raised rim 134 of the housing member 130 is shown. As shown, the housing member 130 can define a rounded or curved surface extending from the back surface of the housing member 130 to the raised rim 134. The raised rim 134 can surround and protect the side surfaces of the cover member 132. The top surface of the raised rim 134 (which can be planar) can be substantially flush (or convex) with the top exterior surface of the cover member 132.

[0074] The frame member 224 can be attached to the shell member 130. For example, the shell member 130 can define a first support protrusion 264 that can extend at least partially (and optionally completely) around the interior surface of the hole 200 in the shell member 130. The frame member 224 can define a second support protrusion 266 that is configured to overlap and contact the first support protrusion 264. In other cases, the frame member 224 does not contain a distinct support protrusion, but rather another portion of the frame member 224 rests on the first support protrusion 264. The frame member 224 can be attached to the shell member 130 by inserting the frame member 224 into the hole 200 so that the second support protrusion 266 rests on the first support protrusion 264 (with or without an interstitial layer such as an adhesive, sealant, etc.), and then securing the frame member 224 to the shell member 130. In this article with respect to FIG. 3C to FIG. 3F Techniques for securing the frame member 224 to the housing member 130 are described. The positioning of the frame member 224 relative to the housing member 130 can be defined by the positioning and location of the first support protrusion 264 and the second support protrusion 266.

[0075] The cover member 132 can be attached to the frame member 224 to hold the cover member 132 to the device 100. For example, the cover member 132 can be attached to the frame member 224 via the adhesive 256. FIG. 5A to FIG. 5C Techniques for attaching the cover member 132 to the housing member 224 are described.

[0076] Figure 2BAlso shown is how the frame member 224, the cover member 132, and the camera window (e.g., the camera window 252) may be arranged. For example, the frame member 224 may define a raised rim 258 that may extend through an opening (e.g., the opening 244) in the cover member 132. The frame member 224 may also define a protrusion within the raised rim 258 that supports the camera window 252. When assembled, the cover member 132, the top surface of the raised rim 258, and the camera window 252 may be substantially flush. In some cases, the raised rim 258 may be omitted, and the camera window 252 may be fixed to the cover member 132 within the opening 244 (e.g., the camera window 252 may abut or be attached to the cover member 132 within the opening 244). In other cases, the cover member 132 may not have an opening for a separate camera window, but may include a transparent area above the camera.

[0077] Figure 2B Also shown are example configurations of the second camera module 204 and the depth sensor module 206, as well as the arrangement of the bracket member 216 relative to the frame member 224. For example, the container portion of the bracket member 216 can be positioned in a recess, cavity, or other area (defined by a network of ribs or flanges) of the frame member 224. As shown, the second camera module 204 is positioned in the second container portion 220 and is aligned with the opening 260 in the bracket member 216, the second opening 228 in the frame member, and the second opening 244 in the cover member 132 (and the camera window 252). Similarly, the depth sensor module 206 is positioned in the third container portion 222 and is aligned with the opening 262 in the bracket member 216, the third opening 230 in the frame member, and the depth sensor window area 246 of the cover member 132. As described above, the depth sensor window area 246 may be a portion of the cover member 132 that has a different coating than another portion of the cover member 132 (or otherwise has optical properties that allow the depth sensor module 206 to transmit and / or receive light through the cover member 132).

[0078] FIG. 3A to FIG. 3B A portion of the housing 104 is shown with the frame member 224 mounted thereto. FIG. 3A to FIG. 3B Other components are omitted.) As described above, frame member 224 can provide structural support for the housing of device 100. For example, hole 200 in housing 104 can reduce the strength, stiffness, and / or overall structural robustness of housing 104 in the area of ​​hole 200. In addition, the area of ​​housing 104 in which hole 200 is located is near the area where the joint structure mechanically joins housing member 130 to housing member 128, which area can be weaker than an area defined by uninterrupted metal material.

[0079] However, these effects can be mitigated by attaching the frame member 224 to the housing 104 in the aperture 200. In addition, the configuration of the frame member 224 can help direct forces from impacts, drop events, and the like. For example, the frame member 224 can define ribs 300 (indicated by the stippled pattern). The ribs 300 can define a recess or cavity along a back side (e.g., an inward side) of the frame member 224. Components can be positioned in the recess or cavity defined by the ribs 300, such as portions of the bracket member 216, camera modules, and the like. The ribs 300 can define a load path from the peripheral sides of the frame member 224 (e.g., sides along the top and sides of the device 100) to the main central structural portion of the housing member 130. More generally, the ribs 300 can help improve the stiffness and / or strength of the housing 104 in the area of ​​the aperture 200 compared to a frame member 224 without the ribs or a housing in which the frame member 224 is omitted.

[0080] Figure 3B 300 and frame members 224 more generally improve the strength of device 100 and / or its resistance to deformation or damage in the event of an impact. More specifically, Figure 3B The device 100 is shown upon impact with a surface 304 (e.g., the ground). As shown, the force from the impact is transferred or directed from the point of impact (e.g., the corner of the device 100) through the ribs 300 to the body of the housing member 130. The load path 302 shows one example load path extending from the side of the housing 104 through the frame member 224 (although this is merely representative and is not intended to show the only load path). In other words, the ribs 300 provide structural support for the housing member 130 in the area of ​​the hole 200 to help prevent the housing member 130 from collapsing, bending, deforming, or otherwise being damaged due to the impact.

[0081] In order for the frame members 224 to provide structural support for the housing 104, the frame members 224 can be securely attached to the housing. For example, the frame members 224 can be secured to the housing via welding, adhesives, fasteners, mechanical interlocking, or any other suitable technique. Figure 3C 2 shows a portion of the housing 104 with the frame member 224 mounted thereto, illustrating an example technique for securely attaching the frame member 224 to the housing 104. Figure 3C As shown, the frame member 224 can be attached to the housing 104 via welds and fasteners. For example, the frame member 224 can be welded (or soldered, brazed, etc.) to the housing member 130 at attachment locations 306, 308, 310, and 312 (and other possible locations). The frame member 224 can also be attached to the housing member 130 via fasteners 314, 316, and 318. The fasteners can be threaded fasteners, rivets, or any other suitable fasteners.

[0082] Figure 3D For along Figure 3C BB in FIG. 1 shows a partial cross-sectional view of the device 100 viewed along line BB in FIG. 1 , which shows how a fastener can secure the frame member 224 to the housing member 130. The fastener 314 can extend through a hole (e.g., a through hole) in the housing member 130 and into a hole (e.g., a threaded hole) in the frame member 224. The fastener 314 can define a chamfered or angled surface 320 that is configured to contact (and maintain contact with) the housing member 130 when installed. By inducing contact between the chamfered surface 320 of the fastener 314 and the housing member 130 when assembled, a load applied to the housing 104 (e.g., from a drop event) can be immediately transferred through the fastener 314 upon impact. In contrast, a conventional screw or bolt (e.g., having a cylindrical shaft portion) can result in a void or gap between the through hole in the housing member 130 and the screw or bolt. Upon impact, the presence of a void or gap may allow the frame member 224 to shift relative to the housing member 130, thereby straining other connections between the frame member 224 and the housing (such as welds) and otherwise reducing the structural integrity of the device.

[0083] Figure 3E For along Figure 3C 1, which shows how the frame member 224 is secured to the housing member 130 using welds. Specifically, the frame member 224 can be positioned proximate to the housing member 130 and the optional weld bracket 322. The frame member 224 can be secured to the weld bracket 322 via a weld bead 324. The weld bracket 322 can be attached to the frame member 224 via any suitable technique, such as welding, brazing, sintering, soldering, adhesives, rivets, etc. In some cases, the weld bracket 322 is part of the housing member 130, rather than being a part of the housing member 130. Figure 3E The separate components shown (e.g., the welding bracket 322 and the housing member 130 may be part of a single integral structure). Figure 3E The welds are shown along a butt joint between the frame member 224 and the shell member 130 , but the welds may also be applied to or used with other types of joints, such as lap joints, interlocks, etc.

[0084] Figure 3F Attachment techniques that may be used with alternative frame member configurations are shown. Figure 3F For along similar Figure 3E A partial cross-sectional view of the device as viewed along line CC. Figure 3FAs shown, the frame member 326 can define a front flange 328 configured to engage an exterior surface of the shell member 334. The frame member 326 and the shell member 334 can be similar to the frame member 224 and the shell member 130 in other respects, and for the sake of brevity, the details of these components will not be repeated here. The frame member 326 can also define an angled surface 330 configured to overlap at least a portion of the shell member 334. The wedge-shaped member 332 can be positioned between the angled surface 330 and the shell member 334. The wedge-shaped member 332 can force the frame member 326 upward (relative to the outer surface of the frame member 326). Figure 3F 334) to generate an engagement force between the front flange 328 and the exterior surface of the shell member 334 and tend to rigidly retain the frame member 326 to the shell member 334. The angles of the angled surface 330 and the wedge member 332 (as well as the materials and / or surface textures of the angled surface 330 and the wedge member 332) can be selected to produce a self-locking interface in which a downward force (relative to the force applied to the frame member 326) is not applied to the frame member 326. Figure 3F The orientation shown in FIG. 10 ) does not cause the wedge-shaped member 332 to be forced out of position (e.g., to the right, as shown in FIG. 10 ). Figure 3F In some cases, wedge members 332 are secured to frame members 326 and / or housing members 334, such as via welding, soldering, brazing, fasteners, adhesives, mechanical interlocks, and the like.

[0085] FIG. 4A to FIG. 4C Details of the bracket member 216 and its integration with the device 100 are shown. For example, Figure 4A A perspective view of the bracket member 216 is shown. As described above, the bracket member 216 defines container portions 218, 220, 222 configured to receive the first camera module 202 and the second camera module 204 and the depth sensor module 206. The bracket member 216 may also define openings 402, 404, 406 to allow the camera modules and the depth sensor module to enter the external environment through the bracket member 216. The bracket member 216 may also define a sensor opening 400, which may be aligned with a sensor (e.g., sensor 110). More specifically, the bracket member 216 may be positioned between the sensor 110 and the display of the device 100, and thus in a position that may otherwise interfere with the sensing function of the sensor 110. The sensor opening 400 may allow the sensor 110 to sense objects proximate to the display 103 and the cover 102 of the device 100. For example, the sensor opening 400 may allow a magnetic field from a magnet of a cover attachment to reach the sensor 110 and allow the sensor 110 to detect the presence and / or absence of a magnetic field.

[0086] Figure 4B FIG. 2 is a partial exploded view of the device 100, which shows the bracket member 216 detached and removed from the device 100. Figure 4BAs shown, the device 100 may include a circuit board 408 on which the sensor 110 may be positioned. The portion of the circuit board 408 having the sensor 110 may extend below the bracket member 216 such that the sensor 110 is positioned below the opening 400.

[0087] Figure 4B Also shown is how the container portion of the bracket member 216 may be nested in the corresponding container portion defined by the ribs 300 of the frame member 224, and also shown are the first camera module 202 and the second camera module 204 and the depth sensor module 206 above their respective container portions of the bracket member 216. As shown, the first camera module 202 and the second camera module 204 and the depth sensor module 206 may be coupled to one or more circuit elements 412 (e.g., a flexible circuit board), which may include a connector attached to the circuit board 408. The switch module 410 may also include a circuit element (e.g., a flexible circuit board) that extends above or is integrated with the circuit elements of the first camera module 202 and the second camera module 204 and the depth sensor module 206 and is electrically coupled to the circuit board 408.

[0088] Figure 4C A portion of the device 100 is shown with the bracket member 216 mounted in the device. For clarity, the first and second camera modules 202, 204 and the depth sensor module 206 are omitted.

[0089] As described above, the cover member 132 may be attached to the device 100 by adhering the cover member 132 to the frame member 224 . FIG. 5A to FIG. 5B An example method by which the cover member 132 may be attached to the frame member 224 is shown. Specifically, the adhesive 256 may be deposited on the bottom surface of the cover member 132 (and / or the top surface of the frame member 224), and the cover member 132 may be pressed into the hole 200 and onto the top surface of the frame member 224 using the press 500. The press 500 may be heated and may be used to heat the adhesive 256 before, during, and / or after the method of pressing the cover member 132 onto the frame member 224. For example, the adhesive 256 may be a heat activated adhesive, and the heat from the press 500 may cause the adhesive 256 to adhere to the cover member 132 and the frame member 224.

[0090] The press 500 can be configured to position the cover member 132 in the hole 200 so that the outer surface of the cover member 132 is flush (e.g., within 25 microns) with the top surface of the raised rim 134. For example, when the press 500 moves downward (indicated by arrow 504) and the cover member 132 is positioned in the hole 200, the bottom surface 502 of the press 500 (which is substantially flush with the outer surface of the cover member 132) contacts the top surface of the raised rim 134 and is limited in travel thereby, as shown in FIG. Figure 5B At this point, the outer surface of the cover member 132 is flush with the top surface of the raised rim 134. The adhesive 256 may be allowed to cure to hold the cover member 132 in this position.

[0091] Due to manufacturing and material variations, the distance between the top surface of the frame member 224 and the top surface of the raised rim 134 may vary between different devices. FIG. 5A to FIG. 5C The structure of the device 100 and the method described are configured to accommodate such dimensional differences while still consistently producing a device in which the cover member 132 is flush with the raised rim 134. This can be achieved, for example, by providing a sufficient amount of adhesive 256 to accommodate the different sized gaps between the top of the frame member 224 and the bottom of the cover member 132 (when the top of the cover member 132 is flush with the raised rim 134). Figure 5A The adhesive 256 is shown as having a thickness 506. When the cover member 132 is positioned in place by the press 500, as shown in FIG. Figure 5B As shown, adhesive 256 is compressed to a certain extent (e.g., compressed to thickness 508 to match the gap between cover member 132 and frame member 224), thereby ensuring that adhesive 256 is in close contact with the surface of frame member 224. This method also causes adhesive 256 to flow or expand laterally by a certain amount, which is defined by the amount of adhesive 256 and the actual gap between the components.

[0092] The gap between the cover member 132 and the frame member 224 is greater or less than Figure 5B In the case of the gap shown, adhesive 256 can flow laterally by different amounts to accommodate different gap sizes. For example, Figure 5C The housing 130, frame member 224 and cover member 132 are shown to result in a gap size of 510 (greater than Figure 5B Due to the lateral flow capability of adhesive 256 and the fact that initial height 506 of adhesive 256 is greater than gap dimension 510, adhesive 256 can successfully secure cover member 132 to frame member 224 despite having different gap dimensions while still positioning cover member 132 such that the outer surface of cover member 132 is flush with the top surface of raised rim 134. Figure 5B In the case shown, the lateral flow of adhesive 256 may be greater than Figure 5B As shown. In addition, other types of irregularities may also be accommodated using this assembly technique. For example, variations in the flatness of the cover member 132, the frame member 224, the protrusions of the frame member 224, and / or the protrusions of the housing member 130 may result in uneven gap sizes between the cover member 132 and the frame member 224. The ability of the adhesive to flow (and the attachment method using the raised edge 134 as a reference for positioning the cover member 132) allows for accommodating uneven gap sizes while maintaining the flushness of the cover member 132 and the raised edge 134.

[0093] The height 506 of the adhesive 256 may be selected to accommodate a range of possible gap sizes. For example, the height 506 may be about 100 microns, about 150 microns, about 200 microns, about 250 microns, or any other suitable height. In some cases, a specific height of the adhesive may be selected based on one or more measurements of components of the device 100. For example, before the adhesive 256 is applied to the cover member 132, components such as the cover member 132, the frame member 224, and / or the housing member 130 (in an unassembled or partially assembled state) may be measured. Based on the measurement, if the gap between the cover member 132 and the frame member 224 is measured or estimated to be greater than a threshold, a first thickness of adhesive (e.g., about 200 microns) is applied, and if it is measured or estimated to be less than a threshold, a second thickness of adhesive (e.g., about 150 microns) is applied. Other thicknesses are also contemplated.

[0094] Although FIG. 5A to FIG. 5C While adhesive is shown around the perimeter of the bottom surface of cover member 132, this is only one configuration or positioning of adhesive. For example, in some cases, adhesive 256 may be deposited in a web or other pattern that is more complex than just a single path around the outer perimeter. For example, Fig. 7A An adhesive application pattern that may be used to secure the cover member 132 to the frame member 224 is shown.

[0095] In compact electronic devices such as tablet computers, the close proximity of various electronic components may require shielding and other techniques to mitigate or eliminate the effects of electrical noise or other interference on various systems. The depth sensor module 206 may include, for example, a high frequency oscillator that may generate electromagnetic noise that may interfere with other electronic devices or circuits of the device 100. Therefore, the depth sensor module 206 may be shielded and / or grounded to help reduce or mitigate the negative effects of noise.

[0096] FIG. 6A to FIG. 6C Example techniques for effectively shielding and grounding the depth sensor module 206 are shown. For example, Fig. 6AA partial view of the device 100 is shown showing the housing with the frame member 224 mounted in the housing member 130. The device 100 may include a conductive cover 600 coupled to the frame member 224. The cover 600 is formed of a conductive material such as copper, gold, or other flexible metal foil or film. The cover 600 defines an opening that is aligned with or otherwise coincides with the opening 230 in the frame member 224 and is configured to allow the depth sensor module 206 to access the external environment. The cover 600 can be configured to contact and conductively couple to the housing of the depth sensor module 206 and the frame member 224 (which can be conductively coupled to the ground layer of the device 100). Therefore, the cover 600 defines a conductive path from the depth sensor module 206 to the electrical ground, thereby helping to prevent interference from the depth sensor module 206 from affecting other circuits or components of the device 100.

[0097] As compared to FIG. 6B to FIG. 6C As shown, when the depth sensor module 206 is coupled to the device 100, it can be forced against the cover 600, causing the cover 600 to deform. The cover 600 can define a series of conductive tabs 601 separated from each other by spaces 602. When the depth sensor module 206 is installed, the tabs 601 can facilitate the deformation of the cover 600 to conform to the depth sensor module 206, while helping to prevent and / or avoid buckling, curling, or other undesirable deformation that may deform the cover 600 in a manner that may be detrimental to the function of the cover 600.

[0098] Figure 6B For along Fig. 6A A partial cross-sectional view of the device 100 as viewed along line DD in FIG. 1 , showing the depth sensor module 206 prior to being installed in the device 100 . Figure 6B The cover 600 is shown attached to the frame member 224 along a surface surrounding the opening 230 in the frame member 224. The cover 600 can be conductively coupled to the frame member 224 in this area via a conductive adhesive, brazing, soldering, or any other technique that holds the cover 600 to the frame member 224 and facilitates conductive coupling between these components. Foam 603 (or other compliant material) can be positioned between the cover 600 and the cover member 132 (e.g., above the insert 601, which extends above and / or in the opening). The foam 603 can be configured to deform when the depth sensor module 206 is placed in place in the device and provide a biasing force between the insert 601 and the depth sensor module 206 (e.g., to bias the insert 601 against the depth sensor module 206, thereby maintaining a physical and conductive coupling between the insert 601 and the depth sensor module 206).

[0099] Figure 6C For along Fig. 6AFIG. 1 is a partial cross-sectional view of device 100 viewed along line DD in FIG. 1 , which shows depth sensor module 206 after being installed in device 100. As shown, cover 600 has been deformed (e.g., tab 601 of cover 600), as has foam 603. Tab 601 has conformed to the contours of depth sensor module 206, and foam 603 helps define the contours and keep tab 601 conforming to and in contact with depth sensor module 206.

[0100] Fig.6D 6 is a perspective view of the depth sensor module 206 showing additional components that may be used to shield the depth sensor module 206. Specifically, a flexible conductive material 614 (e.g., copper tape) may be wrapped around at least a portion of the depth sensor module 206, such as around at least two sides of the depth sensor module 206. The conductive material 614 may also extend over the top of the depth sensor module 206 and along the top surface of the flexible circuit element 612 that interconnects the depth sensor module 206 with other circuit elements of the device (e.g., via the connector 616). The conductive material 614 may be coupled to a ground layer of the device 100 in a conductive manner to facilitate the shielding function of the conductive material 614.

[0101] As described above, cover member 132 can be attached to frame member 224 using adhesive 256. Adhesive 256 can be arranged in a pattern that provides a large surface area for adhesive 256 to bond to both cover member 132 and frame member 224. Fig. 7A A portion of device 100 including rearward-facing sensor area 116 is shown, illustrating an example application pattern for adhesive 256. As shown, adhesive 256 at least partially surrounds various components of rearward-facing sensor area 116. For example, adhesive 256 extends around first camera 118, second camera 120, flash 122, depth sensor 126, and microphone 124. By depositing adhesive 256 in this manner, cover member 132 can be securely attached to device 100.

[0102] In addition to securing cover member 132 to frame member 224, adhesive 256 may perform other functions. For example, adhesive 256 may surround microphone 124 (or an area associated with microphone 124) to help define a sealed audio path extending from the external environment to the microphone module within device 100. Figure 7B Shows the corresponding Fig. 7A Detailed view of rearward sensor area 116 in area EE. Figure 7B A pattern of adhesive 256 is shown around the microphone area. Figure 7BAlso shown are the boundaries of a recess 700 formed in the frame member 224 and forming a portion of the acoustic path from the opening 254 in the cover member 132 to the opening 234 in the frame member 224. Notably, the opening 254 is offset from (e.g., not coaxial with) the opening 234. Thus, as shown relative to Figure 7C As described above, the acoustic path from the external environment to the microphone module 210 may be non-linear and may pass through a chamber or volume defined between the cover member 132 and the frame member 224 (where the path includes the recessed portion 700 of the frame member 224). Figure 7B Also shown is the outer perimeter of a microphone shield 240 that may cover an opening 254 in the cover member 132 .

[0103] Figure 7C For along Figure 7B 706 is a partial cross-sectional view of the device 100 as viewed along line FF in FIG. As shown, an acoustic path 706 is defined from the exterior of the device 100 to the diaphragm 712 (or other sensing element) of the microphone module 210 (which may be positioned in a recess 708 defined by the frame member 224). The acoustic path 706 extends through a volume 704 defined in part by the recess 700 and the cover member 132. The acoustic path 706 also extends through the microphone shield 240, which may be positioned in the opening 254 of the cover member 132. The microphone shield 240 may be attached to the cover member 132 using an adhesive 702 and may define a deformed portion that extends into the opening 254 and defines an outer portion that is flush with the outer surface of the cover member 132 (although in some embodiments, it may be recessed or protruding relative to the outer surface of the cover member 132).

[0104] The volume through which the acoustic path 706 extends can be a sealed or closed volume, except for the opening 254 in the cover member 132. For example, the adhesive 256 that attaches the cover member 132 to the frame member 224 can extend around the perimeter of the recessed portion 700, such as Figure 7B As shown, volume 704 is enclosed and / or sealed to protect it from other environments (e.g., the external environment and the internal volume of device 100). Similarly, microphone module 210 can be attached to frame member 224 via adhesive 710 (e.g., a pressure-sensitive adhesive), which can extend around opening 234 in frame member 224 to enclose and / or seal the joint between microphone module 210 and frame member 224. By sealing the volume through which acoustic path 706 extends, interference from both internal and external auditory interference sources can be avoided. In some cases, the seal provided by adhesives 256 and 710 is a watertight seal and / or an airtight seal.

[0105] As described above, the frame member 224 may include at least one outer surface of the frame member 224 (e.g., Figure 7C In some cases, the surface of the recess 700 is free of a coating. For example, after the recess 700 is formed in the frame member 224 (e.g., by machining), a coating such as a DLC coating can be applied to the frame member 224. The DLC coating can then be locally removed from an area of ​​the frame member 224, such as from the surface of the recess 700, an area where an adhesive is applied to the frame member 224, and the like.

[0106] Fig. 8A 8 is a top view of an example optical sensor assembly 800 that may be used for depth sensor 126. Sensor assembly 800 may include an optical sensor 802 (e.g., a charge coupled device (CCD) sensor, a complementary metal oxide semiconductor (CMOS) sensor, or any other suitable type of sensor). Optical sensor 802 may be attached to substrate 804 and may be conductively coupled to one or more connection pads, such as connection pad 806 (through substrate 804). Sensor assembly 800 may also include a flexible circuit board 808, which may include connection pads conductively coupled to connection pads on substrate 804 and conductive traces that facilitate conductive coupling between sensor 802 and other components.

[0107] Figure 8B For along Fig. 8A 800 . A partial cross-sectional view of the optical sensor assembly 800 as viewed along line GG in FIG. The flexible circuit board 808 may include a flexible substrate 814 (which may include one or more sublayers, such as one or more polyimide sheets, adhesive layers, etc.). The flexible circuit board 808 may also include connection pads 810 that are exposed along the top surface of the flexible circuit board 808 and are configured to be coupled to connection pads (e.g., connection pads 806) of the substrate 804 in a conductive manner. The flexible circuit board 808 may also include components 816 (e.g., electrical traces, connection pads, circuit elements, or other components) that are coupled to the surface of the flexible circuit board 808 but are not intended to be coupled to the substrate 804 in a conductive manner. Therefore, such components 816 may be covered by a cover layer 818, which may protect the components 816 and electrically insulate the components.

[0108] The flexible circuit board 808 may be coupled to the substrate 804 using a conductive adhesive 807 such as an anisotropic conductive film. The conductive adhesive 807 may bond the flexible circuit board 808 to the substrate 804 and also couple the connection pads 806 to the connection pads 810 in a conductive manner.

[0109] In some cases, cover layer 818 on the top surface of flexible circuit board 808 may cause flexible circuit board 808 to bend or deform when flexible circuit board 808 is coupled to substrate 804 . Figure 8B Such a condition is shown in which the flexible circuit board 808 has been deformed in the area surrounding the cover layer 818 to accommodate the additional thickness of the cover layer 818 on the top surface. This configuration can tension the flexible circuit board 808 and the adhesive joint between the connection pads 806 and 810.

[0110] FIG. 8C to FIG. 8D 8 is a partial cross-sectional view of an optical sensor assembly 800 using a different flexible circuit board configuration. Specifically, rather than mounting component 816 on the top exterior surface of flexible substrate 814, a cover layer 818 is then applied over component 816 (which adds additional height to the flexible circuit board in the area of ​​the cover layer). FIG. 8C to FIG. 8D A flexible circuit board 820 is shown in which a component 832 is sandwiched between multiple substrate layers of the flexible circuit board 820.

[0111] Figure 8C A flexible circuit board 820 is shown before being attached to a substrate 804. As shown, the flexible circuit board 820 includes a component 832 (e.g., an electrical trace, a connection pad, a circuit element, or other component) between a first substrate layer 831 and a second substrate layer 833. The first substrate layer and the second substrate layer may be polyimide layers that are adhered together after positioning the component 832 therebetween. The connection pad 822 may be exposed on the top surface of the flexible circuit board 820 so that it can be coupled to the connection pad 806 on the substrate 804 in a conductive manner. The flexible circuit board 820 may also include a through hole 830 to couple the external connection pad 822 to other traces, circuit elements, or other components between the first substrate layer 831 and the second substrate layer 833 or on the bottom surface of the flexible circuit board 820 in a conductive manner. The flexible circuit board 820 may also include components 826 (e.g., electrical traces, connection pads, circuit elements, or other components) on the bottom surface of the flexible circuit board 820, portions of which may be covered by a cover layer 828 (e.g., to protect and / or electrically insulate the components 826).

[0112] The configuration of the flexible circuit board 820 results in a top-side ratio Figure 8B The flexible circuit board 808 in is significantly flatter. Specifically, by using multiple laminates and positioning components between these laminates (rather than on top of the flexible substrate), the need for an external cover layer on the top surface can be eliminated. Fig.8DThe optical sensor assembly 800 is shown with a flexible circuit board 820 attached. As shown, the conductive adhesive 807 bonds the flexible circuit board 820 to the substrate 804 and also couples the connection pads 822 to the connection pads 810 in a conductive manner. Figure 8B Unlike the flexible circuit board 808 in the embodiment, the flexible circuit board 820 does not significantly deform, flex, or bend when attached to the substrate 804. Instead, the flexible circuit board 820 remains substantially flat and / or undeformed, resulting in a less strained flexible circuit board 820 and reducing the likelihood of delamination, breakage, or other potential damage.

[0113] Fig. 9 An exemplary schematic diagram of an electronic device 900 is depicted. The electronic device 900 may be an embodiment of the device 100 (or any other device described herein) or otherwise represent the device. The device 900 includes one or more processing units 901, which are configured to access a memory 902 having instructions stored thereon. These instructions or computer programs may be configured to perform one or more of the operations or functions described relative to the electronic device described herein. For example, these instructions may be configured to control or coordinate the operation of one or more displays 908, one or more touch sensors 903, one or more force sensors 905, one or more communication channels 904, one or more audio input systems 909, one or more audio output systems 910, one or more positioning systems 911, one or more sensors 912, and / or one or more tactile feedback devices 906.

[0114] Fig. 9 The processing unit 901 may be implemented as any electronic device capable of processing, receiving or transmitting data or instructions. For example, the processing unit 901 may include one or more of the following: a microprocessor, a central processing unit (CPU), an application specific integrated circuit (ASIC), a digital signal processor (DSP), or a combination of such devices. As described herein, the term "processor" is intended to cover a single processor or processing unit, multiple processors, multiple processing units, or one or more other appropriately configured computing elements. The processing unit 901 may be coupled to a circuit board, such as circuit board 408 ( Figure 4B ) or a different circuit board.

[0115] The memory 902 can store electronic data that can be used by the device 900. For example, the memory can store electronic data or content, such as, for example, audio and video files, images, documents and applications, device settings and user preferences, programs, instructions, timing and control signals or data for various modules, data structures or databases, etc. The memory 902 can be configured as any type of memory. By way of example only, the memory can be implemented as random access memory, read-only memory, flash memory, removable memory, other types of storage elements, or combinations of such devices.

[0116] The touch sensor 903 can detect various types of touch-based inputs and generate signals or data that can be accessed using processor instructions. The touch sensor 903 can use any suitable components and can rely on any suitable phenomenon to detect physical inputs. For example, the touch sensor 903 can be a capacitive touch sensor, a resistive touch sensor, an acoustic wave sensor, etc. The touch sensor 903 may include any suitable components for detecting touch-based inputs and generating signals or data that can be accessed using processor instructions, including electrodes (e.g., electrode layers), physical components (e.g., substrates, spacer layers, structural supports, compressible elements, etc.), processors, circuits, firmware, etc. The touch sensor 903 can be integrated with any part of the device 900 or otherwise configured to detect touch inputs applied to any part of the device. For example, the touch sensor 903 can be configured to detect touch inputs applied to any part of the device 900 including a display (and can be integrated with a display). The touch sensor 903 can operate in conjunction with the force sensor 905 to generate signals or data in response to touch inputs. A touch sensor or force sensor positioned above a display surface or otherwise integrated with a display may be referred to herein as a touch-sensitive display, a force-sensitive display, or a touch screen.

[0117] The force sensor 905 can detect various types of force-based inputs and generate signals or data that can be accessed using processor instructions. The force sensor 905 can use any suitable components and can rely on any suitable phenomenon to detect physical inputs. For example, the force sensor 905 can be a strain-based sensor, a piezoelectric-based sensor, a piezoresistive-based sensor, a capacitive sensor, a resistive sensor, etc. The force sensor 905 may include any suitable components for detecting force-based inputs and generating signals or data that can be accessed using processor instructions, including electrodes (e.g., electrode layers), physical components (e.g., substrates, spacer layers, structural supports, compressible elements, etc.), processors, circuits, firmware, etc. The force sensor 905 can be used with various input mechanisms to detect various types of inputs. For example, the force sensor 905 can be used to detect a press or other force input that meets a force threshold (which can represent a more powerful input than a typical input of a standard "touch" input). Similar to the touch sensor 903, the force sensor 905 can be integrated with any part of the device 900 or otherwise configured to detect a force input applied to any part of the device. For example, force sensor 905 can be configured to detect force input applied to any portion of device 900, including (and can be integrated with) a display. Force sensor 905 can operate in conjunction with touch sensor 903 to generate signals or data in response to touch-based and / or force-based inputs.

[0118] The device 900 may also include one or more haptic devices 906. The haptic device 906 may include one or more of a variety of haptic technologies, such as but not necessarily limited to a rotary haptic device, a linear actuator, a piezoelectric device, a vibrating element, etc. In general, the haptic device 906 may be configured to provide intermittent and different feedback to a user of the device. More specifically, the haptic device 906 may be adapted to produce a knocking or tapping sensation and / or a vibration sensation. Such tactile output may be provided in response to detecting a touch and / or force input, and may be imparted to the user through an external surface of the device 900 (e.g., via a glass or other surface that acts as a touch-sensitive display and / or a force-sensitive display or surface).

[0119] One or more communication channels 904 may include one or more wireless interfaces adapted to provide communication between the processing unit 901 and an external device. One or more communication channels 904 may include an antenna (e.g., an antenna including or using a housing member of the housing 104 as a radiating member), a communication circuit, firmware, software, or any other component or system that facilitates wireless communication with other devices. Typically, one or more communication channels 904 may be configured to transmit and receive data and / or signals that may be interpreted by instructions executed on the processing unit 901. In some cases, the external device is part of an external communication network configured to exchange data with a wireless device. Generally speaking, the wireless interface may communicate via, but is not limited to, radio frequency, optical, acoustic, and / or magnetic signals and may be configured to operate on a wireless interface or protocol. Example wireless interfaces include radio frequency cellular interfaces (e.g., 2G, 3G, 4G, 4G, 4G Long Term Evolution (LTE), 5G, GSM, CDMA, etc.), optical fiber interfaces, acoustic interfaces, Bluetooth interfaces, infrared interfaces, USB interfaces, Wi-Fi interfaces, TCP / IP interfaces, network communication interfaces, or any conventional communication interfaces. The one or more communication channels 904 may also include an ultra-wideband (UWB) interface, which may include any appropriate communication circuitry, instructions, and number and locations of suitable UWB antennas.

[0120] like Fig. 9 As shown, the device 900 may include a battery 907 for storing power and providing power to other components of the device 900. The battery 907 may be a rechargeable power source configured to provide power to the device 900. The battery 907 may be coupled to a charging system (e.g., a wired and / or wireless charging system) and / or other circuits to control the power provided to the battery 907 and control the power provided from the battery 907 to the device 900.

[0121] The device 900 may also include one or more displays 908 configured to display graphical output. The display 908 may use any suitable display technology, including a liquid crystal display (LCD), an organic light emitting diode (OLED), an active matrix organic light emitting diode display (AMOLED), etc. The display 908 may display a graphical user interface, an image, an icon, or any other suitable graphical output. The display 908 may correspond to the display 103.

[0122] Device 900 may also provide audio input functionality via one or more audio input systems 909. Audio input systems 909 may include microphones, transducers, or other devices that capture sound for voice calls, video calls, audio recording, video recording, voice commands, and the like.

[0123] Device 900 may also provide audio output functionality via one or more audio output systems (eg, speakers) 910. Audio output system 910 may produce sound from a voice call, a video call, streaming or local audio content, streaming or local video content, and the like.

[0124] The device 900 may also include a positioning system 911. The positioning system 911 may be configured to determine the location of the device 900. For example, the positioning system 911 may include a magnetometer, a gyroscope, an accelerometer, an optical sensor, a camera, a global positioning system (GPS) receiver, an inertial positioning system, etc. The positioning system 911 may be used to determine spatial parameters of the device 900, such as the location of the device 900 (e.g., the geographic coordinates of the device), a measurement or estimate of the physical movement of the device 900, the orientation of the device 900, etc.

[0125] Device 900 may also include one or more additional sensors 912 to receive input (e.g., from a user or another computer, device, system, network, etc.) or detect any suitable property or parameter of the device, the environment surrounding the device, a person or object interacting with the device (or near the device), etc. For example, the device may include a temperature sensor, a biometric sensor (e.g., a fingerprint sensor, a spectrometer, a blood oxygen sensor, a blood glucose sensor, etc.), an eye tracking sensor, a retinal scanner, a humidity sensor, a button, a switch, an eyelid closure sensor, etc.

[0126] In reference Fig. 9 To the extent that the described multiple functions, operations, and structures are disclosed as part of, incorporated into, or performed by the device 900, it should be understood that various embodiments may omit any or all of such described functions, operations, and structures. Thus, different embodiments of the device 900 may have some or all of the various capabilities, devices, physical features, modes, and operating parameters described herein, or none of them. In addition, the systems included in the device 900 are not exclusive, and the device 900 may include alternative or additional systems, components, modules, programs, instructions, etc. that may be necessary or useful to perform the functions described herein.

[0127] It is understood that the use of personally identifiable information should be subject to privacy policies and practices that are generally recognized to meet or exceed industry or government requirements for maintaining user privacy. Specifically, personally identifiable information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use, and the nature of the authorized use should be clearly stated to users.

[0128] For the purpose of illustration, the foregoing description uses specific naming to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that the embodiments can be practiced without specific details. Therefore, for the purpose of illustration and description, the foregoing description of the specific embodiments described herein is presented. These descriptions are not intended to be exhaustive or to limit the embodiments to the disclosed precise forms. It will be apparent to those of ordinary skill in the art that, in view of the above teachings, many modifications and variations are feasible. Moreover, when used herein to refer to the position of a component, the term above, below, above, below, left or right (or other similar relative position terms) does not necessarily refer to an absolute position relative to an external reference, but instead refers to the relative position of the component in the referenced figure.

Claims

1. A tablet computing system, the tablet computing system comprising: A housing member, the housing member defining: a first portion of a rear exterior surface of the tablet computer; at least a portion of a lateral exterior surface of the tablet computer; a raised rim extending from the back exterior surface and at least partially defining a sensor assembly aperture extending through the housing member; as well as a supporting protrusion, the supporting protrusion being positioned in the sensor assembly hole; a frame member at least partially positioned within the sensor assembly aperture and coupled to the support boss; a camera bracket coupled to the frame member; a first camera module coupled to the camera bracket; a second camera module, the second camera module being coupled to the camera bracket, the camera bracket fixing a relative position of the first camera module and the second camera module; as well as A cover member is positioned in the sensor assembly aperture and attached to the frame member, the cover member having an exterior surface defining a second portion of the rear exterior surface of the tablet computing system.

2. The tablet computing system of claim 1, wherein: The raised rim defines a flat top surface; and The exterior surface of the cover member is flush with or recessed relative to the flat top surface of the raised rim. 3 . The tablet computing system of claim 1 , wherein the frame member defines a network of ribs configured to transfer impact forces from a first portion of the housing member to a second portion of the housing member. The tablet computing system of claim 3 , wherein the frame member is fused to the housing member.

5. The tablet computing system of claim 1, wherein: The covering member defines: a first hole, the first hole being aligned with the first camera module; as well as a second hole, the second hole being aligned with the second camera module; and The tablet computing system further includes: a first transparent camera window positioned in the first hole and covering the first camera module; as well as A second transparent camera window is positioned in the second hole and covers the second camera module.

6. The tablet computing system of claim 1, wherein: The frame member defines: a first reference surface; as well as a second reference surface; and The tablet computing system further includes: a first spring configured to apply a first force to the camera bracket in a first direction, thereby urging the camera bracket against the first reference surface; as well as A second spring is configured to apply a second force to the camera bracket in a second direction different from the first direction to urge the camera bracket against the second reference surface.

7. The tablet computing system of claim 1, wherein: The tablet computing system includes a depth sensor coupled to the camera mount and configured to determine a distance between the tablet computing system and an external object; as well as A covering member, the covering member defining: a light-transmitting window area, the light-transmitting window area being positioned above the depth sensor; as well as An opaque area at least partially surrounds the light-transmitting window area.

8. A tablet computing system, the tablet computing system comprising: A housing member, the housing member defining: at least a portion of a rear exterior surface of the tablet computing system; as well as a raised rim extending from the back exterior surface and at least partially defining a sensor assembly aperture extending through the housing member; as well as a frame member at least partially positioned within the sensor assembly aperture and coupled to the housing member, the frame member defining: a first recessed portion, the first recessed portion being located at a front side of the frame member; a second recessed portion, the second recessed portion being located at a rear side of the frame member; as well as a first hole extending from the first recessed portion through the frame member to the second recessed portion; a cover member positioned in the sensor assembly aperture and attached to the frame member, the cover member defining a second aperture extending therethrough; as well as A microphone module is positioned in the second recess of the frame member and is configured to receive sound via an acoustic path extending through the first hole in the frame member, a volume defined between the first recess and the cover member, and the second hole in the cover member.

9. The tablet computing system of claim 8, wherein the first hole and the second hole are not coaxial.

10. The tablet computing system of claim 8, wherein: attaching the cover member to the frame member with an adhesive; and The adhesive surrounds the first recess and defines a hermetic seal between the frame member and the cover member around the first recess.

11. The tablet computing system of claim 10, wherein: The adhesive is a first adhesive; attaching the microphone module to the frame member with a second adhesive; and The second adhesive defines a hermetic seal between the frame member and the microphone module. 12 . The tablet computing system of claim 11 , wherein the first adhesive and the second adhesive hermetically seal the acoustic path from an interior volume of the tablet computing system. 13 . The tablet computing system of claim 11 , further comprising a microphone shield coupled to the cover member and covering the second hole.

14. The tablet computing system of claim 8, wherein: The cover member defines a third aperture extending therethrough; and The tablet computing system further includes: a flash module coupled to the frame member; and A flashlight window is positioned in the third hole and covers the flashlight module.

15. An electronic device, comprising: A housing member, the housing member defining: a first portion of a rear exterior surface of the electronic device; as well as a raised rim extending from the back exterior surface and at least partially defining a sensor assembly aperture extending through the housing member; as well as a frame member at least partially positioned within the sensor assembly aperture and coupled to the housing member; a camera bracket coupled to the frame member; a first camera module coupled to the camera mount and comprising a camera lens having a first focal length; a second camera module coupled to the camera mount and comprising a camera lens having a second focal length different from the first focal length; A depth sensor module coupled to the camera bracket and comprising: an optical transmitter; and an optical sensor configured to detect light emitted by the optical emitter and reflected by an object external to the electronic device; and A cover member is positioned in the sensor assembly aperture and defines a second portion of the rear exterior surface of the electronic device.

16. The electronic device according to claim 15, wherein: the frame member defining a depth sensor aperture configured to receive at least a portion of the depth sensor module; and The electronic device further comprises: a conductive shield at least partially surrounding the depth sensor aperture and defining a plurality of conductive tabs extending into the depth sensor aperture; as well as A compliant material is configured to bias the plurality of conductive tabs against the depth sensor module.

17. The electronic device according to claim 16, wherein: The frame member is conductively coupled to a ground layer of the electronic device; and The depth sensor module is conductively coupled to the frame member via the conductive cover.

18. The electronic device of claim 17, wherein the conductive cover comprises a metal foil.

19. The electronic device according to claim 15, further comprising: a microphone module coupled to the frame member; as well as A flash module is coupled to the frame member.

20. The electronic device according to claim 15, wherein: The frame member is welded to the housing member; and The frame member defines a network of ribs configured to transfer impact forces from a first portion of the shell member to a second portion of the shell member.

Images