Bonding apparatus and bonding method thereof

Abstract

The application provides a bonding device and a bonding method thereof, the bonding device comprising a base, a micro-motion base and a vertical motion component arranged on the base respectively, and further comprising: a lower bonding head component arranged on the micro-motion base, comprising a first suction disc and a first reference block; an upper bonding head component arranged on the vertical motion component, comprising a second suction disc and a second reference block; a profile measurement component comprising a horizontal motion component and a profile sensor, the profile sensor performing profile scanning on the upper bonding head component and the lower bonding head component; and a visual sensor detecting the relative position of the first reference block and the second reference block. According to the profile characteristics of the upper bonding head component and the lower bonding head component obtained by the profile sensor scanning, the first suction disc is adjusted by the micro-motion base, so as to realize horizontal alignment and vertical leveling of the upper and lower chips or wafers, and the relative position of the upper and lower chips or wafers is detected by the visual sensor before bonding, so as to ensure the bonding precision.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor processing technology, and specifically relates to a bonding device and a bonding method thereof. Background Technology

[0002] 3D chips refer to chips that are stacked together using vertical stacking or layering technology to achieve higher performance, higher integration, and smaller size. This technology can stack chips with different functions (such as processors, memory, and sensors) together, thereby achieving functional integration and performance improvement, while reducing horizontal space occupation and transmission loss.

[0003] The manufacturing of 3D chips is primarily achieved through chip or wafer bonding equipment. 3D chips require the precise alignment and stacking of multiple chip layers, demanding high-precision alignment and stacking techniques in the manufacturing process to ensure the proper functioning of interconnects and heat dissipation channels between the chip layers. In practice, achieving high-density, high-reliability interconnects at the micrometer or even nanometer scale places extremely high demands on both manufacturing processes and equipment.

[0004] Traditional bonding devices use complex optical imaging to identify and locate marker points on chips or wafers to achieve marker alignment. However, they cannot control the orientation between chips, wafers, or between chips and wafers. In addition, traditional bonding devices also suffer from the problem that while they can reduce horizontal alignment time, they sacrifice alignment accuracy. Summary of the Invention

[0005] In view of this, the present invention provides a bonding device and bonding method, wherein a first suction cup and a second suction cup are respectively disposed on the lower bonding head assembly and the upper bonding head assembly, for adsorbing the chips or wafers to be bonded. A contour sensor scans the contour features of the lower and upper bonding head assemblies, and a micro-motion stage adjusts the position of the first suction cup based on the scanned contour features, so that the upper and lower chips or wafers are horizontally aligned and vertically leveled. Furthermore, when the upper and lower bonding head assemblies are at a certain distance, a vision sensor detects the relative position of the upper and lower chips or wafers. If the current relative position error meets the requirements, the bonding continues; if the relative position exceeds the tolerance, the micro-motion stage performs fine-tuning of the posture to meet the position error requirements, thereby achieving fine-tuning and ensuring bonding accuracy.

[0006] The present invention provides the following technical solution: a bonding device, comprising a base and a micro-motion platform and a vertical motion component respectively disposed on the base, and further comprising:

[0007] The lower bonding head assembly is disposed on the micro-motion base and includes a first suction cup and a first reference block. The micro-motion base drives the first suction cup to move so as to adjust the position of the first suction cup.

[0008] The upper bonding head assembly is disposed on the vertical motion assembly and includes a second suction cup and a second reference block. The vertical motion assembly drives the second suction cup to move in order to adjust the position of the second suction cup.

[0009] A contour measurement assembly, disposed on the base, includes a horizontal motion component and a contour sensor. The horizontal motion component drives the contour sensor to move along a first direction to perform contour scanning on the upper bonding head assembly and the lower bonding head assembly; and

[0010] At least one vision sensor is disposed on the base for detecting the relative position of the first reference block and the second reference block.

[0011] Preferably, the lower bonding head assembly further includes a first mounting base, which is disposed on the side of the micro-motion base near the upper bonding head assembly.

[0012] Both the first suction cup and the first reference block are mounted on the first mounting base.

[0013] At least two of the first reference blocks are provided, and they are evenly distributed around the periphery of the first suction cup.

[0014] Preferably, the upper bonding head assembly further includes a second mounting base, the second mounting base being disposed on the side of the vertical movement assembly near the lower bonding head assembly.

[0015] Both the second suction cup and the second reference block are mounted on the second mounting base.

[0016] At least two second reference blocks are provided, which are evenly distributed around the periphery of the second suction cup and are provided in a one-to-one correspondence with the first reference block.

[0017] Preferably, when the upper bonding head assembly and the lower bonding head assembly are bonded, the orthographic projection of the second reference block on the first mounting base coincides with the orthographic projection of the first reference block on the first mounting base.

[0018] Preferably, the horizontal motion component includes a motion unit and a guide rail.

[0019] One end of the motion unit is connected to the contour sensor and drives the contour sensor to move along the guide rail.

[0020] Preferably, the contour sensor is a dual contour sensor or a single contour sensor, wherein

[0021] The dual-contour sensor is capable of simultaneously scanning the contours of the upper bonding head assembly and the lower bonding head assembly under the drive of the motion unit.

[0022] The single contour sensor is capable of scanning the contours of the upper bonding head assembly and the lower bonding head assembly respectively under the drive of the motion unit.

[0023] Preferably, the contour sensor is capable of acquiring at least the following contours: the contours of the chip and / or wafer adsorbed on the first suction cup and the second suction cup, the contours of the first suction cup and the second suction cup, and the contours of the first reference block and the second reference block.

[0024] Preferably, at least one of the vision sensors is disposed on the side of the lower bonding head assembly away from the contour measuring assembly.

[0025] The visual sensor detects the relative positions of the first reference block and the second reference block in a first direction and a third direction.

[0026] According to the bonding method of the present invention, based on the bonding apparatus described in any one of the preceding claims, the bonding method includes:

[0027] The first chip or wafer is adsorbed and fixed by the first suction cup, and the second chip or wafer is adsorbed and fixed by the second suction cup;

[0028] The horizontal motion component drives the contour sensor to move between the upper bonding head component and the lower bonding head component, and performs contour scanning on the upper bonding head component and the lower bonding head component to obtain at least the contour of the first chip or wafer, the contour of the second chip or wafer, the contour of the first reference block, and the contour of the second reference block.

[0029] The contour obtained by the contour sensor is used to obtain the first relative position of the lead or pad protrusion on the first chip or wafer relative to the first reference block, and the second relative position of the lead or pad protrusion on the second chip or wafer relative to the second reference block. The first relative position and the second relative position obtained are fitted to the same coordinate system, and the micro-motion platform is adjusted to make the first chip or wafer and the second chip or wafer horizontally aligned and vertically leveled.

[0030] After the horizontal motion component drives the contour sensor to move out along the first direction, the vertical motion component drives the second chip or wafer to move in the second direction toward the first chip or wafer. When the distance between the first chip or wafer and the second chip or wafer is a first distance, the vision sensor detects the relative position of the first reference block and the second reference block. After the micro-motion platform fine-tunes the horizontal and / or vertical errors of the first chip or wafer and the second chip or wafer, the vertical motion component continues to drive the second chip or wafer to move in the second direction toward the first chip or wafer to complete the bonding between the second chip or wafer and the first chip or wafer.

[0031] Preferably, during the contour scanning process of the upper bonding head assembly and the lower bonding head assembly:

[0032] When the contour sensor is a dual contour sensor, the motion unit drives the dual contour sensor to move to a designated position, and the dual contour sensor can simultaneously scan the contours of the upper bonding head assembly and the lower bonding head assembly.

[0033] When the contour sensor is a single contour sensor, the motion unit drives the single contour sensor to move to a designated position. The single contour sensor scans the contours of the upper bonding head assembly and the lower bonding head assembly twice. After completing the first scan, the single contour sensor rotates 180 degrees around the first direction as the axis under the drive of the motion unit, and then performs the second scan.

[0034] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least:

[0035] By using a contour sensor to scan the contour features of the lower and upper bonding head assemblies, the micro-motion stage adjusts the position of the first chuck based on the scanned contour features, achieving horizontal alignment and vertical leveling between the upper and lower chips or wafers. Furthermore, when the upper and lower bonding head assemblies are at a certain distance, a vision sensor detects the relative position of the upper and lower chips or wafers, achieving close-range secondary precision alignment and ensuring bonding accuracy. In addition, this invention uses only one contour sensor to simultaneously measure the horizontal position and vertical orientation between the upper and lower chips or wafers, enabling a compact measurement device. Moreover, traditional alignment methods cannot simultaneously measure the horizontal position and vertical orientation between the upper and lower chips or wafers, leading to multiple measurement errors. This invention only requires one movement to satisfy both horizontal and vertical measurements, reducing the impact of movement errors on the measurement results. Attached Figure Description

[0036] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the bonding device provided by the present invention;

[0038] Figure 2 This is a schematic diagram of the structure of the lower bonding head assembly in the bonding device provided by the present invention;

[0039] Figure 3 This is a schematic diagram of the upper bonding head assembly in the bonding device provided by the present invention;

[0040] Figure 4 This is a schematic diagram of the upper and lower bonding head assemblies in the bonding device provided by the present invention during bonding.

[0041] In the figure, 1 is the base; 2 is the lower bonding head assembly; 21 is the first mounting base; 22 is the first suction cup; 23 is the first reference block; 3 is the upper bonding head assembly; 31 is the second mounting base; 32 is the second suction cup; 33 is the second reference block; 4 is the contour measurement assembly; 41 is the contour sensor; 42 is the horizontal motion assembly; 421 is the motion unit; 422 is the guide rail; 5 is the vision sensor; 6 is the micro-motion base; and 7 is the vertical motion assembly. Detailed Implementation

[0042] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0043] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0044] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this invention, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0045] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. The drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0046] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0047] The technical solutions provided by the various embodiments of the present invention are described below with reference to the accompanying drawings.

[0048] Reference Figure 1 In this invention, the X direction is referred to as the first direction, the Z direction as the second direction, and the Y direction as the third direction. Figures 1-4 As shown, the bonding device of the present invention includes a base 1 and a micro-motion platform 6 and a vertical motion assembly 7 respectively disposed on the base 1. The bonding device also includes a lower bonding head assembly 2 and an upper bonding head assembly 3. The lower bonding head assembly 2 is mounted on the micro-motion platform 6 and includes a first suction cup 22 and a first reference block 23. The micro-motion platform 6 is used to drive the first suction cup 22 to move, so as to adjust the position of the first suction cup 22. The upper bonding head assembly 3 is mounted on the vertical motion assembly 7 and includes a second suction cup 32 and a second reference block 33. The vertical motion assembly 7 is used to drive the second suction cup 32 along... Figure 1 The movement in the Z direction (second direction) is shown to adjust the position of the second suction cup 32, so that the second suction cup 32 moves closer to or further away from the first suction cup 22.

[0049] It should be noted that, in some embodiments, the movement of the vertical motion component 7 driving the second suction cup 32 is not limited to the above-described movement along... Figure 1As shown in the Z-direction movement, the vertical motion component 7 can also drive the second suction cup 32 to move in the Rx and / or Ry directions.

[0050] The bonding device further includes a contour measurement component 4 and at least one vision sensor 5. The contour measurement component 4 is mounted on the base 1 and includes a contour sensor 41 and a horizontal motion component 42. The contour sensor 41 is mounted on the horizontal motion component 42, and the horizontal motion component 42 drives the contour sensor 41 along... Figure 1 The X-direction (first direction) indicated by the sensor moves between the lower bonding head assembly 2 and the upper bonding head assembly 3 to enable the contour sensor 41 to perform contour scanning on the lower bonding head assembly 2 and the upper bonding head assembly 3. The vision sensor 5 is disposed on the base 1 and is used to detect the relative positions of the first reference block 23 and the second reference block 33 in the X-direction (first direction) and the Y-direction (third direction). At least one of the vision sensors 5 can be disposed on the side of the lower bonding head assembly 2 away from the contour measurement assembly 4, and multiple vision sensors 5 can be distributed on the side of the lower bonding head assembly 2 away from the vertical movement assembly 7.

[0051] It should be noted that the horizontal motion component 42 and the vertical motion component 7 can be selected according to the actual situation, ensuring that the horizontal motion component 42 can drive the contour sensor 41 to move along the X direction (first direction) and the vertical motion component 7 can at least drive the upper bonding head component 3 to move along the Z direction (second direction).

[0052] It should also be noted that the contour sensor 41 described in this invention (e.g., line-scanned laser triangle, line-scanned spectral confocal sensor, etc.) has a minimum contour resolution of micrometers, which can effectively identify pad protrusions or leads with heights and spacings less than micrometers, and can meet the detection requirements of bonding accuracy less than micrometers.

[0053] like Figure 2As shown, in some embodiments, the lower bonding head assembly 2 further includes a first mounting base 21, which is mounted on the micro-motion base 6. The first chuck 22 and the first reference block 23 are both mounted on the side of the first mounting base 21 near the upper bonding head assembly 3. At least two first reference blocks 23 are provided, and the first reference blocks 23 are evenly distributed around the periphery of the first chuck 22. The position of the first reference block 23 on the first mounting base 21 is fixed, and the position of the first reference block 23 relative to the first chuck 22 is fixed. After the contour sensor 41 scans the lower bonding head assembly 2, based on the obtained contour features, the orientation of the wafer or chip pins or pad protrusions relative to the first reference block 23 in the horizontal and vertical directions is obtained through conversion and calibration. Based on the overall coordinate system, the position of the leads or pad protrusions on the wafer or chip relative to the first reference block 23 is obtained.

[0054] It should be noted that in this embodiment, there are two first reference blocks 23, which are symmetrically distributed on both sides of the first suction cup 22. However, in some embodiments, the number of first reference blocks 23 may be three, four, or other numbers, as long as the first reference blocks 23 are distributed around the first suction cup 22 and their positions relative to the first suction cup 22 remain fixed.

[0055] like Figure 3 As shown, in some embodiments, the upper bonding head assembly 3 further includes a second mounting base 31, which is mounted on the side of the vertical motion assembly 7 near the lower bonding head assembly 2. The second chuck 32 and the second reference block 33 are both mounted on the second mounting base 31. At least two second reference blocks 33 are provided, and the second reference blocks 33 are evenly distributed around the periphery of the second chuck 32. The position of the second reference block 33 on the second mounting base 31 is fixed, and the position of the second reference block 33 relative to the second chuck 32 is fixed. After the contour sensor 41 scans the upper bonding head assembly 3, based on the obtained contour features, the orientation of the wafer or chip pins or pad protrusions relative to the second reference block 33 in the horizontal and vertical directions is obtained through conversion and calibration. The position of the leads or pad protrusions on the wafer or chip relative to the second reference block 33 is obtained based on the overall coordinate system.

[0056] It should be noted that in this embodiment, two second reference blocks 33 are provided, and the two second reference blocks 33 are symmetrically distributed on both sides of the second suction cup 32. However, in some embodiments, the number of second reference blocks 33 may also be three, four, or other numbers, as long as the second reference blocks 33 are distributed on the periphery of the second suction cup 32 and their positions are fixed relative to the second suction cup 32.

[0057] like Figure 4 As shown, when the upper bonding head assembly 3 and the lower bonding head assembly 2 are bonded, the orthographic projection of the second reference block 33 on the first mounting base 21 coincides with the orthographic projection of the first reference block 23 on the first mounting base 21. Thus, by detecting the relative positions of the first reference block 23 and the second reference block 33 in the X and Y directions, the alignment of the upper and lower chips or wafers can be achieved.

[0058] like Figure 1 As shown, in some embodiments, the horizontal motion component 42 includes a motion unit 421 and a guide rail 422. One end of the motion unit 421 is connected to the contour sensor 41 and drives the contour sensor 41 to move along the guide rail 422.

[0059] In some embodiments, the contour sensor 41 is a dual-contour sensor or a single-contour sensor. When the contour sensor 41 is a dual-contour sensor, it can simultaneously scan the contours of the upper bonding head assembly 3 and the lower bonding head assembly 2 under the action of the motion unit 421. When the contour sensor 41 is a single-contour sensor, it can scan the contours of the upper bonding head assembly 3 and the lower bonding head assembly 2 separately under the action of the motion unit 421. Specifically, when the horizontal motion unit 42 moves the single-contour sensor between the upper bonding head assembly 3 and the lower bonding head assembly 2, the single-contour sensor first scans the contour of the upper bonding head assembly 3. After the contour scan of the upper bonding head assembly 3 is completed, the single-contour sensor rotates 180 degrees around the X-direction (first direction) as its axis and then scans the contour of the lower bonding head assembly 2. Alternatively, the contour scan of the lower bonding head assembly 2 can be performed first, followed by the contour scan of the upper bonding head assembly 3.

[0060] In some embodiments, the contour sensor 41 is capable of acquiring at least the following contours: the contours of the chip and / or wafer adsorbed on the first suction cup 22 and the second suction cup 32, the contours of the first suction cup 22 and the second suction cup 32, and the contours of the first reference block 23 and the second reference block 33.

[0061] Combination Figures 1-4 The bonding method of the present invention will now be described.

[0062] Example 1

[0063] The chip bonding method of the present invention includes adsorbing and fixing a first chip by the first suction cup 22, adsorbing and fixing a second chip by the second suction cup 32, driving the contour sensor 41 to move between the upper bonding head assembly 3 and the lower bonding head assembly 2 by the horizontal motion component 42, using the contour sensor 41 to perform an overall scan of the lower bonding head assembly 2 and the upper bonding head assembly 3 to obtain the contour features of the entire upper bonding head assembly 3 and the lower bonding head assembly 2, and obtaining the attitude of the pins or pad protrusions on the first chip and the second chip relative to the reference block in the horizontal and vertical directions by conversion and calibration, thereby obtaining the first relative position of the pins or pad protrusions on the first chip relative to the first reference block 23 and the second relative position of the pins or pad protrusions on the second chip relative to the second reference block 33.

[0064] By converting the first relative position and the second relative position into the same coordinate system, the current position and orientation of the first chip and the second chip can be determined. Based on this, the position of the first chip is adjusted by the micro-motion base 6 so that the first chip and the second chip are aligned in the horizontal direction and parallel in the vertical direction.

[0065] The horizontal motion component 42 moves the contour sensor 41 outwards, and the vertical motion component 7 moves the second chip closer to the first chip via the second suction cup 32. When the distance between the first chip and the second chip is extremely close, for example, when the distance between them is a first distance (preferably between 0.05mm and 0.1mm), the vision sensor 5 detects the relative positions of the first reference block 23 and the second reference block 33 in the X direction (first direction) and the Y direction (third direction), calculates the relative positions of the lead or pad protrusions of the first chip and the second chip in the current state, and detects the relative vertical distance between the first reference block 23 and the second reference block 33 to calculate whether the first chip and the second chip are parallel. If the error of the current relative position meets the requirements, the bonding continues. If the error of the current relative position does not meet the requirements, the position of the first chip is adjusted by the micro-motion base 6 until the error of the relative position meets the requirements, completing the bonding operation and ensuring bonding accuracy.

[0066] For precision motion, the downward movement of the upper bonding head assembly 3 driven by the vertical motion component 7 can cause uncertain displacement, resulting in horizontal or vertical deviations between the upper and lower chips. However, this invention uses the vision sensor when the first suction cup 22 and the second suction cup 32 are very close. By detecting the relative positions of the first reference block 23 and the second reference block 33 in the X and Y directions, it further determines whether the upper and lower chips are aligned or parallel for fine-tuning, thereby improving bonding accuracy.

[0067] It should be noted that in the chip bonding method of the present invention, the contour sensor 41 can be a dual contour sensor or a single contour sensor.

[0068] Example 2

[0069] The wafer chip bonding method of the present invention includes:

[0070] The wafer is adsorbed and fixed by the first suction cup 22, and the chip is adsorbed and fixed by the second suction cup 32. The horizontal motion component 42 drives the contour sensor 41 to move between the upper bonding head component 3 and the lower bonding head component 2. The contour sensor 41 performs an overall scan of the upper bonding head component 3 to obtain the contour features of the entire upper bonding head component 3. The contour sensor 41 obtains the contour features of the entire wafer in a step-scan manner. Through conversion and calibration, the attitude of the pins or pads on the wafer and the chip relative to the reference block in the horizontal and vertical directions is obtained, thereby obtaining the first relative position of the leads or pads on the wafer relative to the first reference block 23 and the second relative position of the leads or pads on the chip relative to the second reference block 33.

[0071] By converting the first relative position and the second relative position into the same coordinate system, the current position and orientation of the wafer and the chip can be determined. Based on this, the position of the wafer is adjusted by the micro-motion platform 6 so that the wafer and the chip are aligned in the horizontal direction and parallel in the vertical direction.

[0072] The horizontal motion component 42 moves the contour sensor 41 outward, and the vertical motion component 7 moves the chip closer to the wafer via the second suction cup 32. When the distance between the wafer and the chip is extremely close, for example, a first distance (preferably between 0.05mm and 0.1mm), the vision sensor 5 detects the relative positions of the first reference block 23 and the second reference block 33 in the X direction (first direction) and Y direction (third direction), calculates the relative positions of the leads or pad protrusions of the wafer and the chip in the current state, and detects the relative vertical distance between the first reference block 23 and the second reference block 33 to calculate whether the wafer and the chip are parallel. If the error of the current relative position meets the requirements, the bonding continues. If the error of the current relative position does not meet the requirements, the position of the wafer is adjusted by the micro-motion platform 6 until the error of the relative position meets the requirements, completing the bonding operation and ensuring bonding accuracy.

[0073] It should be noted that, in the wafer chip bonding process of the present invention, the micro-motion platform 6 can carry the wafer for stepping, move the area on the wafer that needs to be bonded to directly below the chip, and make fine adjustments according to the surface shape (warpage) of the current area of ​​the wafer to ensure that the current area is parallel to the chip.

[0074] For precision motion, the downward movement of the upper bonding head assembly 3 driven by the vertical motion component 7 can cause uncertain displacements, resulting in horizontal or vertical deviations between the upper and lower wafers and chips. However, this invention utilizes the vision sensor when the first suction cup 22 and the second suction cup 32 are extremely close. By detecting the relative positions of the first reference block 23 and the second reference block 33 in the X and Y directions, it further determines whether the upper and lower chips or wafers are aligned or parallel for fine-tuning, thereby improving bonding accuracy.

[0075] It should be noted that in the chip bonding method of the present invention, the contour sensor 41 can be a dual contour sensor or a single contour sensor.

[0076] The various embodiments in this specification can be referred to interchangeably for the same or similar parts. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments described later are relatively simple in description since they correspond to the system, and relevant parts can be referred to the descriptions in the system embodiments.

[0077] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A bonding device, comprising a base and a micro-motion platform and a vertical motion assembly respectively disposed on the base, characterized in that, Also includes: The lower bonding head assembly is disposed on the micro-motion base and includes a first suction cup and a first reference block. The micro-motion base drives the first suction cup to move so as to adjust the position of the first suction cup. The upper bonding head assembly is disposed on the vertical motion assembly and includes a second suction cup and a second reference block. The vertical motion assembly drives the second suction cup to move in order to adjust the position of the second suction cup. A contour measurement component is disposed on the base and includes a horizontal motion component and a contour sensor. The horizontal motion component drives the contour sensor to move along a first direction to perform contour scanning on the upper bonding head component and the lower bonding head component. as well as At least one vision sensor is disposed on the base for detecting the relative position of the first reference block and the second reference block.

2. The bonding apparatus according to claim 1, characterized in that, The lower bonding head assembly further includes a first mounting base, which is disposed on the side of the micro-motion base near the upper bonding head assembly. Both the first suction cup and the first reference block are mounted on the first mounting base. At least two of the first reference blocks are provided, and they are evenly distributed around the periphery of the first suction cup.

3. The bonding apparatus according to claim 1, characterized in that, The upper bonding head assembly further includes a second mounting base, which is disposed on the side of the vertical movement assembly near the lower bonding head assembly. Both the second suction cup and the second reference block are mounted on the second mounting base. At least two second reference blocks are provided, which are evenly distributed around the periphery of the second suction cup and are provided in a one-to-one correspondence with the first reference block.

4. The bonding apparatus according to claim 1, characterized in that, When the upper bonding head assembly and the lower bonding head assembly are bonded, the orthographic projection of the second reference block on the first mounting base coincides with the orthographic projection of the first reference block on the first mounting base.

5. The bonding apparatus according to claim 1, characterized in that, The horizontal motion component includes a motion unit and a guide rail. One end of the motion unit is connected to the contour sensor and drives the contour sensor to move along the guide rail.

6. The bonding apparatus according to claim 5, characterized in that, The contour sensor is either a dual-contour sensor or a single-contour sensor, wherein... The dual-contour sensor is capable of simultaneously scanning the contours of the upper bonding head assembly and the lower bonding head assembly under the drive of the motion unit. The single contour sensor is capable of scanning the contours of the upper bonding head assembly and the lower bonding head assembly respectively under the drive of the motion unit.

7. The bonding apparatus according to any one of claims 1-6, characterized in that, The contour sensor is capable of acquiring at least the following contours: the contours of the chip and / or wafer adsorbed on the first suction cup and the second suction cup, the contours of the first suction cup and the second suction cup, and the contours of the first reference block and the second reference block.

8. The bonding apparatus according to any one of claims 1-6, characterized in that, At least one of the vision sensors is disposed on the side of the lower bonding head assembly away from the contour measuring assembly. The visual sensor detects the relative positions of the first reference block and the second reference block in a first direction and a third direction.

9. A bonding method, based on the bonding apparatus according to any one of claims 1-8, characterized in that, The bonding method includes: The first chip or wafer is adsorbed and fixed by the first suction cup, and the second chip or wafer is adsorbed and fixed by the second suction cup; The horizontal motion component drives the contour sensor to move between the upper bonding head component and the lower bonding head component, and performs contour scanning on the upper bonding head component and the lower bonding head component to obtain at least the contour of the first chip or wafer, the contour of the second chip or wafer, the contour of the first reference block, and the contour of the second reference block. The contour obtained by the contour sensor is used to obtain the first relative position of the lead or pad protrusion on the first chip or wafer relative to the first reference block, and the second relative position of the lead or pad protrusion on the second chip or wafer relative to the second reference block. The first relative position and the second relative position obtained are fitted to the same coordinate system, and the micro-motion platform is adjusted to make the first chip or wafer and the second chip or wafer horizontally aligned and vertically leveled. After the horizontal motion component drives the contour sensor to move out along the first direction, the vertical motion component drives the second chip or wafer to move in the second direction toward the first chip or wafer. When the distance between the first chip or wafer and the second chip or wafer is a first distance, the vision sensor detects the relative position of the first reference block and the second reference block. After the micro-motion platform fine-tunes the horizontal and / or vertical errors of the first chip or wafer and the second chip or wafer, the vertical motion component continues to drive the second chip or wafer to move in the second direction toward the first chip or wafer to complete the bonding between the second chip or wafer and the first chip or wafer.

10. The bonding method according to claim 9, characterized in that, During the contour scanning process of the upper bonding head assembly and the lower bonding head assembly: When the contour sensor is a dual contour sensor, the motion unit drives the dual contour sensor to move to a designated position, and the dual contour sensor can simultaneously scan the contours of the upper bonding head assembly and the lower bonding head assembly. When the contour sensor is a single contour sensor, the motion unit drives the single contour sensor to move to a designated position. The single contour sensor scans the contours of the upper bonding head assembly and the lower bonding head assembly twice. After completing the first scan, the single contour sensor rotates 180 degrees around the first direction as the axis under the drive of the motion unit, and then performs the second scan.

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