Wafer flipping device and method, wafer processing apparatus

Abstract

This disclosure provides a wafer flipping device and method, and a wafer processing apparatus. The wafer flipping device includes: a support unit; a clamping unit including two clamping components, which are spaced apart from each other on the support unit along a first direction; a moving unit connected to the clamping unit, which drives the two clamping components to move towards or away from each other along the first direction; a flipping unit connected to the clamping unit, which drives the clamping unit to flip the wafer; a detection unit for detecting the actual clamping information applied to the wafer by the clamping components, the actual clamping information including at least one of actual clamping information and actual clamping position; and a control unit for controlling the moving unit to move the two clamping components towards or away from each other according to the actual clamping information and preset target clamping information. The wafer flipping device and method and the wafer processing apparatus of this disclosure can reduce wafer breakage.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a wafer flipping device and method, and wafer processing equipment. Background Technology

[0002] Semiconductor device fabrication involves numerous steps, often performed on different surfaces of the wafer. For example, some steps require processing both the front and back sides of the wafer. However, most current processing equipment can only process one side of the wafer, failing to meet the requirements for processing both sides. Therefore, a wafer flipping device can be used to grip the wafer and flip it 180 degrees to process both sides separately.

[0003] However, in the existing technology, wafer flipping devices are not suitable for having a large wafer contact area and can only hold the edge of the wafer. During the wafer flipping process, problems such as wafer breakage are likely to occur. Summary of the Invention

[0004] To address at least one of the technical solutions in the prior art, this disclosure provides a wafer flipping device and method, and a wafer processing equipment.

[0005] The technical solutions provided in this disclosure are as follows:

[0006] In a first aspect, embodiments of this disclosure provide a wafer flipping device, comprising:

[0007] Support unit;

[0008] The clamping unit includes two clamping components for clamping two sides of the wafer edge respectively, and the two clamping components are disposed on the support unit at a distance from each other along a first direction;

[0009] A moving unit is connected to the clamping unit, the moving unit being configured to drive the two clamping components to move toward or away from each other along the first direction;

[0010] A flipping unit is connected to the clamping unit, and the flipping unit is configured to drive the clamping unit to flip the wafer.

[0011] A detection unit, connected to the clamping unit, is used to detect the actual clamping information applied by the clamping assembly to the wafer;

[0012] The control unit is connected to the detection unit and the moving unit respectively. The control unit is used to control the moving unit to make the two clamping components move towards or away from each other according to the actual clamping information and the preset target clamping information.

[0013] For example, the control unit is specifically used for:

[0014] Based on the actual clamping information and the target clamping information, the distance adjustment parameters of the two clamping components are obtained;

[0015] Based on the distance adjustment parameters, the moving unit is controlled to move the two clamping components so that the distance between the two clamping components along the first direction is the target distance.

[0016] For example, the support unit includes: a base and two support components disposed on the base, each support component extending along a second direction perpendicular to the first direction, and the two support components being spaced apart from each other in the first direction, and a clamping component being movably connected to a corresponding support component.

[0017] For example, the wafer flipping device further includes: a wafer pick-and-place unit connected to the support unit, the wafer pick-and-place unit including a wafer holding part and a moving part, the wafer holding part being used to hold the wafer, the wafer holding part being configured to be movable under the drive of the moving part to perform the wafer pick-and-place operation; the control unit is also connected to the wafer pick-and-place unit, the control unit being used to control the wafer pick-and-place unit to perform the wafer pick-and-place operation.

[0018] For example, the wafer pick-and-place unit includes a robotic arm, which includes a robotic arm and an end effector. The moving part includes the robotic arm, and the wafer holding part includes the end effector.

[0019] For example, the wafer holding portion includes a wafer carrier region; wherein, the wafer holding portion further includes a plurality of holding portions distributed around the wafer carrier region, the plurality of holding portions being used to hold the edge of the wafer; and / or, the wafer holding portion further includes a plurality of adsorption structures arranged on the carrier surface of the wafer carrier region, the plurality of adsorption structures being used to adsorb and fix the wafer.

[0020] For example, the clamping assembly includes a clamping end for contacting the wafer; the detection unit includes a pressure sensor disposed on the clamping end.

[0021] For example, the wafer flipping device further includes an alarm unit connected to the control unit, wherein the control unit is further configured to control the alarm unit to issue an alarm signal when the difference between the actual clamping information and the target clamping information is greater than a threshold.

[0022] Secondly, embodiments of this disclosure also provide a wafer flipping method, which is applied to the wafer flipping apparatus described above, the method comprising:

[0023] The two clamping components of the clamping unit respectively clamp both sides of the wafer edge;

[0024] The detection unit detects the actual clamping information applied to the wafer by the clamping assembly.

[0025] Based on the actual clamping information and the preset target clamping information, the moving unit is controlled to make the two clamping components move towards or away from each other, so that the actual clamping information reaches the target clamping information.

[0026] The flipping unit drives the clamping unit to flip the wafer.

[0027] Thirdly, embodiments of this disclosure also provide a wafer processing apparatus, including the wafer flipping device described above.

[0028] The beneficial effects of the embodiments disclosed herein are as follows:

[0029] The wafer flipping device and method and wafer processing equipment provided in this disclosure include a support unit, a clamping unit, a moving unit, a flipping unit, a detection unit, and a control unit. The clamping unit may include two clamping components, which can clamp the wafer on both sides of its edge. The two clamping components can drive the wafer to flip under the drive of the flipping unit to achieve the purpose of wafer flipping. Furthermore, the two clamping components can move closer to or further away from each other along a first direction under the drive of the moving unit to adjust the distance between the two clamping components along the first direction. The detection unit can detect the actual clamping information applied to the wafer by the clamping unit. The control unit can control the moving unit to move the two clamping components closer to or further away from each other based on the detected actual clamping information and the preset target clamping information.

[0030] In this way, by detecting the actual clamping information of the wafer, the clamping force and / or clamping position of the wafer can be accurately quantified. This allows the position of the clamping components to be adjusted based on the actual clamping information and the target clamping information, thereby achieving automatic adjustment of the clamping force and / or clamping position of the wafer. This ensures that the clamping force and / or wafer clamping position are more reasonable, avoiding wafer breakage caused by improper clamping force and / or improper clamping position. Attached Figure Description

[0031] Figure 1 This is a schematic diagram showing the structure of a wafer flipping device in some embodiments of the present disclosure;

[0032] Figures 2A to 2D This diagram illustrates the wafer pick-and-place process of a wafer flipping apparatus in some embodiments of the present disclosure.

[0033] Figure 3 This is a block diagram showing the structure of the control unit in an embodiment of the present disclosure. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0035] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0036] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of said value.

[0037] Furthermore, throughout this document, unless otherwise defined, the terms “substantially,” “essentially,” “approximately,” and “about” are used to describe and explain small variations. When used with an event or situation, these terms can cover situations where the event or situation occurs precisely or approximately. For example, when used with a numerical value, these terms can include a range of variation of the numerical value less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term “substantially coplanar” can refer to two surfaces arranged along the same plane within a micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.

[0038] like Figure 1 and Figure 3 As shown, the wafer flipping apparatus provided in this embodiment includes:

[0039] Support unit 100;

[0040] The clamping unit 200 includes two clamping components 210 for clamping two sides of the wafer edge respectively, and the two clamping components 210 are disposed on the support unit 100 at intervals along a first direction X;

[0041] A moving unit 300 is connected to the clamping unit 200, and the moving unit 300 is configured to drive the two clamping components 210 to move toward or away from each other along the first direction X.

[0042] A flipping unit 400 is connected to the clamping unit 200, and the flipping unit 400 is configured to drive the clamping unit 200 to flip the wafer.

[0043] A detection unit 500 is connected to the clamping unit 200. The detection unit 500 is used to detect the actual clamping information applied by the clamping assembly 210 to the wafer, wherein the actual clamping information includes at least one of clamping force and clamping position.

[0044] The control unit 600 is connected to the detection unit 500 and the moving unit 300 respectively. The control unit 600 is used to control the moving unit 300 to move the two clamping components 210 towards each other or away from each other according to the actual clamping information and the preset target clamping information, so as to adjust the distance between the two clamping components 210 along the first direction X.

[0045] In the above scheme, the two clamping components 210 of the clamping unit 200 can clamp the wafer on both sides of the edge, and the two clamping components 210 can drive the wafer to flip under the drive of the flipping unit 400 to achieve the purpose of wafer flipping; and the two clamping components 210 can also move closer or further away from each other along the first direction X under the drive of the moving unit 300, so that the distance between the two clamping components 210 along the first direction X can be adjusted, and the detection unit 500 can detect the actual clamping information applied to the wafer by the clamping unit 200, and the control unit 600 can control the moving unit 300 to move the two clamping components 210 closer or further away from each other according to the detected actual clamping information and the preset target clamping information.

[0046] When the edge of the wafer is clamped, the magnitude of the clamping force and the clamping position are related to the distance between the two clamping components 210. By detecting the actual clamping information of the wafer, the actual clamping force and actual clamping position of the wafer can be accurately quantified. Thus, the positions of the two clamping components 210 can be adjusted according to the actual clamping information and the target clamping information, so as to realize the automatic adjustment of the clamping force and / or clamping position of the wafer, to ensure that the clamping force and / or clamping position of the wafer is more reasonable, and to avoid problems such as wafer breakage due to improper clamping force or improper clamping position.

[0047] It should be noted that the target clamping information refers to the clamping information where the wafer is clamped at its edge during flipping, ensuring no damage to the wafer. The target clamping information can be data pre-set in the control unit 600. The target clamping information can be obtained through multiple tests, or set based on experience or industry practice.

[0048] It should also be noted that, when the moving unit 300 controls the two clamping components 210 to move towards or away from each other based on the actual clamping information and the preset target clamping information, the wafer may have already been removed from the clamping components 210, and after adjusting the distance between the two clamping components 210 to the target distance, the wafer is then clamped between the two clamping components 210. In this way, damage to the wafer can be avoided during the movement of the clamping components 210.

[0049] In some exemplary embodiments, the control unit 600 is specifically configured to: obtain distance adjustment parameters of the two clamping components 210 based on the actual clamping information and the target clamping information; and control the moving unit 300 to move the two clamping components 210 based on the distance adjustment parameters, so that the distance between the two clamping components 210 along the first direction X is the target distance.

[0050] In the above scheme, for example, the difference between the actual clamping information and the target clamping information pre-stored in the control unit 600 can be converted into a distance adjustment parameter for the two clamping components 210, that is, the distance difference between the actual distance of the two clamping components 210 and the target distance. Thus, the moving unit 300 works according to the distance adjustment parameter and can adjust the distance between the two clamping components 210 along the first direction X to the target distance.

[0051] It should be noted that when the distance between the two clamping components 210 along the first direction X is the target distance, when the wafer is clamped and flipped by the two clamping components 210, the clamping force and clamping position of the wafer can ensure that the wafer does not break.

[0052] Furthermore, in some exemplary embodiments, such as Figure 1 As shown, the support unit 100 includes a base 110 and two support components 120 disposed on the base 110. The base 110 can serve as a support body, and can be fixed to the process equipment or constructed to be movable. The support components 120 extend along a second direction Y perpendicular to the first direction X. For example, as... Figure 1 As shown, the first direction X can refer to the horizontal direction, and the second direction Y can refer to the vertical direction.

[0053] Two support components 120 are spaced apart from each other in the first direction X, and a clamping component 210 is movably connected to a corresponding support component 120. This movable connection can mean that the clamping component 210 can move relative to its corresponding support component 120 under the drive of the moving unit 300, and that the clamping component 210 can flip relative to its corresponding support component 120 under the drive of the flipping unit 400.

[0054] In the above scheme, the two support components 120 can clamp only the edge of the wafer 10, which can ensure that the wafer 10 can be flipped while only contacting the edge of the wafer 10, thus preventing contamination of the wafer. The clamping force can be automatically adjusted, and the clamping accuracy is high.

[0055] In some exemplary embodiments, such as Figure 1As shown, the wafer flipping device may further include: a wafer pick-and-place unit 800, which is connected to the support unit 100. The wafer pick-and-place unit 800 includes a wafer holding part 810 and a moving part 820. The wafer holding part 810 is used to hold the wafer and is configured to move under the drive of the moving part 820 to perform the operation of picking and placing the wafer 10. The control unit 600 is also connected to the wafer pick-and-place unit 800 and is also used to control the wafer pick-and-place unit 800 to perform the operation of picking and placing the wafer 10.

[0056] Using the above solution, a wafer pick-and-place unit 800 can also be integrated into the wafer flipping device to complete the pick-and-place of wafer 10. For example, please refer to... Figures 2A to 2D As shown, the wafer pick-and-place unit 800 can remove the wafer 10 with one processed side (e.g., front side 11) from the wafer processing apparatus. Figure 2A As shown), and placed with the machined surface (e.g., front 11) facing down in the clamping unit 200 (as shown). Figure 2B (As shown); after the wafer flipping operation is completed, the unprocessed side of wafer 10 (e.g., the back side 12) faces down. Figure 2C As shown), at this time, the wafer pick-and-place unit 800 can be removed from the clamping unit 200, so that the unprocessed surface (e.g., the back side 12) of the wafer 10 faces upwards, and the wafer 10 is transferred to the wafer processing apparatus with the unprocessed surface facing upwards. Figure 2D (As shown).

[0057] In some exemplary embodiments, the wafer pick-and-place unit 800 includes a robotic arm, which comprises a robotic arm and an end effector. The moving part 820 includes the robotic arm, and the wafer holding part 810 includes the end effector. The robotic arm performs the pick-and-place operation of the wafer 10 in the clamping unit 200, which is easy to operate and allows for precise control of the wafer pick-and-place position.

[0058] In some exemplary embodiments, the wafer holding portion 810 includes a wafer carrier region 811; wherein, the wafer holding portion 810 further includes a plurality of holding portions distributed around the wafer carrier region 811, the plurality of holding portions being used to hold the edge of the wafer 10. For example, the holding portions may include any suitable structure such as a gripper or a clamping groove.

[0059] Furthermore, in some exemplary embodiments, such as Figure 1 As shown, the wafer holding portion 810 may further include a plurality of adsorption structures 812 arranged on the bearing surface of the wafer bearing area 811, the plurality of adsorption structures 812 being used to adsorb and fix the wafer 10. For example, the adsorption structure 812 may include a suction cup or a vacuum adsorption hole, etc.

[0060] Furthermore, in some exemplary embodiments, the clamping assembly 210 may include a clamping end for contacting the wafer 10. For example, the clamping assembly 210 may include a jaw, and the clamping end is the portion where the jaw contacts the wafer 10. The detection unit 500 may be a pressure sensor, which is disposed on the clamping end.

[0061] The pressure sensors include, but are not limited to, piezoelectric pressure sensors, resistive pressure sensors, and capacitive pressure sensors. Piezoelectric pressure sensors utilize the piezoelectric effect, where a material generates an electric charge when subjected to pressure, thus measuring pressure. Resistive pressure sensors measure pressure based on the principle that when external pressure is applied to a pressure-sensitive resistor, the shape or structure of the material changes, causing an increase or decrease in resistance. By measuring the change in resistance, the pressure value applied to the pressure-sensitive resistor can be deduced. Capacitive pressure sensors measure pressure using changes in capacitance. For example, in this embodiment, a resistive pressure sensor is used.

[0062] It should be noted that in the above scheme, the detection unit 500 is a pressure sensor, which reflects the actual clamping information of the wafer 10 through pressure detection. In other embodiments, the detection unit 500 can also be a position sensor, which reflects the actual clamping information of the wafer 10 through position sensor.

[0063] In some exemplary embodiments, such as Figure 3 As shown, the wafer flipping device further includes an alarm unit 700 connected to the control unit 600. The control unit 600 is also used to control the alarm unit 700 to issue an alarm signal when the difference between the actual clamping information and the target clamping information is greater than a threshold.

[0064] The alarm signals can include sound signals, visual signals, tactile signals, communication signals, and odor signals. Alarms can promptly detect improper clamping during wafer flipping, improving product yield. Specifically, the threshold can be obtained through multiple tests, or set based on experience or industry practice.

[0065] Thus, during actual processing, the detection unit 500 monitors the actual clamping information in real time. When the difference between the actual clamping information and the target clamping information is greater than a threshold, it indicates that the clamping information on wafer 10 fluctuates significantly. At this time, an alarm signal can be triggered to remind personnel to handle the product during the fluctuation period in a timely manner. At the same time, the signal is fed back to the MES system (Manufacturing Execution System) to avoid product hold during the fluctuation period (product hold refers to the temporary suspension or isolation of a batch or a specific product). After the clamping component 210 is moved by the moving unit 300 to complete the clamping information adjustment, the signal of the wafer flipping device that has been adjusted is fed back to the MES system, and the product flows normally (normal product flow refers to the product being produced according to the predetermined process during production or quality control).

[0066] It should be noted that in some embodiments, the clamping assembly 210 can be translated under the drive of the moving unit 300 and rotated under the drive of the flipping unit 400. The specific structure of the moving unit 300 and the flipping unit 400 is not limited.

[0067] In some embodiments, the clamping assembly 210 includes a clamping end for clamping the wafer 10 and a non-clamping end opposite the clamping end along the first direction X. The moving unit 300 may be connected to the non-clamping end, and the moving unit 300 may include a moving member and a driving member. The moving member is connected to the non-clamping end, and the driving member can drive the moving member to move along the first direction X, thereby moving the clamping assembly 210 along the first direction X.

[0068] For example, the moving part can be a telescopic rod, and the driving part can be a cylinder; or, the moving part can be a lead screw, and the driving part can be a drive motor. The specific construction of the moving part and the driving part is not limited.

[0069] In some embodiments, the clamping assembly 210 includes a clamping end for clamping the wafer 10 and a non-clamping end opposite to the clamping end along the first direction X. The flipping unit 400 may include a rotating shaft and a drive motor, the rotating shaft being connected to the non-clamping end, and the drive motor driving the rotating shaft to rotate the clamping assembly 210.

[0070] The moving unit 300 may be configured to be connected to the rotating shaft so as to rotate synchronously with the clamping assembly 210 under the drive of the flipping unit 400; or, the flipping unit 400 may be configured to be connected to the moving member so as to rotate synchronously with the clamping assembly 210 under the drive of the moving unit 300.

[0071] It should be understood that the specific construction of the moving unit 300 and the flipping unit 400 is not limited.

[0072] Furthermore, this disclosure also provides a wafer flipping method, which is applied to the wafer flipping apparatus provided in this disclosure, the method comprising:

[0073] Step S01: The two clamping components 210 of the clamping unit 200 clamp the two sides of the edge of the wafer 10 respectively;

[0074] Step S02: The detection unit 500 detects the actual clamping information applied by the clamping assembly 210 to the wafer 10.

[0075] Step S03: Based on the actual clamping information and the preset target clamping information, control the moving unit 300 to make the two clamping components 210 move towards each other or away from each other, so that the actual clamping information reaches the target clamping information;

[0076] Step S04: Drive the clamping unit 200 to flip the wafer by the flipping unit 400.

[0077] In the above scheme, when the edge of wafer 10 is clamped, the magnitude of the clamping force and the clamping position are related to the distance between the two clamping components 210. By detecting the actual clamping information of wafer 10, the actual clamping force and actual clamping position of wafer 10 can be accurately quantified. Thus, the positions of the two clamping components 210 can be adjusted according to the actual clamping information and the target clamping information, so as to realize the automatic adjustment of the clamping force and / or clamping position of wafer 10, to ensure that the clamping force and / or clamping position of wafer 10 is more reasonable, and to avoid problems such as wafer 10 breakage due to improper clamping force or improper clamping position.

[0078] It should be noted that the target clamping information refers to the clamping information where the edge of wafer 10 is clamped during flipping, and the wafer 10 is undamaged. The target clamping information can be data pre-set in the control unit 600. The target clamping information can be obtained from multiple tests, or set based on experience or industry practice.

[0079] It should be noted that in step S03 above, when the moving unit 300 is controlled to move the two clamping components 210 toward each other or away from each other according to the actual clamping information and the preset target clamping information, the wafer 10 may have been removed from the clamping component 210, and after the distance between the two clamping components 210 is adjusted to the target distance, the wafer 10 is clamped between the two clamping components 210. In this way, damage to the wafer 10 can be avoided during the movement of the clamping components 210.

[0080] In some exemplary embodiments, step S03 specifically includes:

[0081] Step S031: Based on the actual clamping information and the target clamping information, obtain the distance adjustment parameters of the two clamping components 210;

[0082] Step S032: Based on the distance adjustment parameters, control the moving unit 300 to move the two clamping components 210 so that the distance between the two clamping components 210 along the first direction X is the target distance.

[0083] In the above scheme, the difference between the actual clamping information and the target clamping information pre-stored in the control unit 600 can be converted into a distance adjustment parameter for the two clamping components 210, that is, the distance difference between the actual distance of the two clamping components 210 and the target distance. Thus, the moving unit 300 works according to the distance adjustment parameter and can adjust the distance between the two clamping components 210 along the first direction X to the target distance.

[0084] It should be noted that when the distance between the two clamping components 210 along the first direction X is the target distance, when the wafer 10 is clamped and flipped by the two clamping components 210, the clamping force and clamping position of the wafer 10 can ensure that the wafer 10 does not break.

[0085] Furthermore, by way of example, in step S01 above, the wafer 10 can be placed between the two clamping components 210 by the wafer pick-and-place unit 800; after step S04 above, the wafer 10 can be removed from the two clamping components 210 by the wafer pick-and-place unit 800.

[0086] Since the principle of solving the problem by this crystal rod flipping method is similar to that of solving the problem by the crystal rod flipping device described above, the embodiments of the crystal rod flipping method provided in this disclosure can refer to the embodiments of the crystal rod flipping device provided in this disclosure, and will not be repeated here.

[0087] Furthermore, this disclosure also provides a wafer processing apparatus, including the wafer flipping device provided in this disclosure. For example, the wafer processing apparatus may be a wafer polishing apparatus, etc. It should be understood that the wafer flipping device can be applied to various production or testing equipment in scenarios where wafer flipping is required.

[0088] Since the principle by which this wafer processing equipment solves the problem is similar to that of the crystal ingot flipping device described above, the embodiments of the wafer processing equipment provided in this disclosure can refer to the embodiments of the crystal ingot flipping device described above, and will not be repeated here.

[0089] Furthermore, this disclosure also provides an electronic device including a memory, a processor, and one or more programs stored in the memory and executable on the processor, wherein when the one or more programs are executed by the processor, the electronic device performs the wafer flipping method as described above.

[0090] In one embodiment, this disclosure also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps in the above method embodiments.

[0091] The aforementioned computer-readable storage medium enables the implementation of the steps in the above method embodiments when a computer program stored in its memory is executed by a processor.

[0092] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the methods described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, or optical storage, etc. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.

[0093] The following points need to be explained:

[0094] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0095] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0096] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0097] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. The scope of protection of this disclosure shall be determined by the scope of the claims.

Claims

1. A wafer flipping device, characterized in that, include: Support unit; The clamping unit includes two clamping components for clamping two sides of the wafer edge respectively, and the two clamping components are disposed on the support unit at a distance from each other along a first direction; A moving unit is connected to the clamping unit, the moving unit being configured to drive the two clamping components to move toward or away from each other along the first direction; A flipping unit is connected to the clamping unit, and the flipping unit is configured to drive the clamping unit to flip the wafer. A detection unit, connected to the clamping unit, is used to detect the actual clamping information applied by the clamping assembly to the wafer; The control unit is connected to the detection unit and the moving unit respectively. The control unit is used to control the moving unit to make the two clamping components move towards each other or away from each other according to the actual clamping information and the preset target clamping information. Specifically, the control unit is used for: Based on the actual clamping information and the target clamping information, distance adjustment parameters for the two clamping components are obtained. The actual clamping information includes the actual clamping force and / or the actual clamping position, and the target clamping information includes the target clamping force and / or the target clamping position. Based on the distance adjustment parameters, the moving unit is controlled to move the two clamping components so that the distance between the two clamping components along the first direction is the target distance, the actual clamping force is the target clamping force, and the actual clamping position is the target clamping position.

2. The wafer flipping device according to claim 1, characterized in that, The support unit includes: a base and two support components disposed on the base, each support component extending along a second direction perpendicular to the first direction, and the two support components being spaced apart from each other in the first direction, and a clamping component being movably connected to a corresponding support component.

3. The wafer flipping device according to claim 1, characterized in that, The wafer flipping device further includes: a wafer pick-and-place unit connected to the support unit, the wafer pick-and-place unit including a wafer holding part and a moving part, the wafer holding part being used to hold the wafer, the wafer holding part being configured to move under the drive of the moving part to perform wafer pick-and-place operations; the control unit is also connected to the wafer pick-and-place unit, and the control unit is also used to control the wafer pick-and-place unit to perform wafer pick-and-place operations.

4. The wafer flipping device according to claim 3, characterized in that, The wafer pick-and-place unit includes a robotic arm, which includes a robotic arm and an end effector. The moving part includes the robotic arm, and the wafer holding part includes the end effector.

5. The wafer flipping device according to claim 3, characterized in that, The wafer holding portion includes a wafer carrier region; wherein, the wafer holding portion further includes a plurality of holding portions distributed around the wafer carrier region, the plurality of holding portions being used to hold the edge of the wafer; and / or, the wafer holding portion further includes a plurality of adsorption structures arranged on the carrier surface of the wafer carrier region, the plurality of adsorption structures being used to adsorb and fix the wafer.

6. The wafer flipping device according to claim 1, characterized in that, The clamping assembly includes a clamping end for contacting the wafer; the detection unit includes a pressure sensor disposed on the clamping end.

7. The wafer flipping device according to claim 1, characterized in that, The wafer flipping device further includes an alarm unit connected to the control unit. The control unit is also used to control the alarm unit to issue an alarm signal when the difference between the actual clamping information and the target clamping information is greater than a threshold.

8. A wafer flipping method, characterized in that, The method, applied to the wafer flipping apparatus as described in any one of claims 1 to 7, comprises: The two clamping components of the clamping unit respectively clamp both sides of the wafer edge; Detect the actual clamping information applied to the wafer by the clamping assembly; Based on the actual clamping information and the preset target clamping information, the moving unit is controlled to make the two clamping components move towards or away from each other, so that the actual clamping information reaches the target clamping information. The flipping unit drives the clamping unit to flip the wafer.

9. A wafer processing equipment, characterized in that, Includes the wafer flipping device as described in any one of claims 1 to 7.

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