Package structure

Abstract

The invention discloses a packaging structure, and the structure comprises a pedestal; the device chip is mounted on the base; the plastic packaging layer is located on the base and wraps the device chip; the first heat dissipation pin is exposed out of the plastic packaging layer and connected with the side portion of the base, the first heat dissipation pin comprises a first connecting portion and a first extending portion connected with the first connecting portion in a bent mode, the first connecting portion is connected with the side portion of the base, and the first extending portion and the side wall of the plastic packaging layer are oppositely arranged. By arranging the first heat dissipation pins which are exposed out of the plastic packaging layer and are connected with the side part of the base, the heat dissipation performance of the packaging structure can be improved, and the transverse size of the packaging structure can be reduced, so that the product competitiveness of the packaging structure is improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of semiconductor packaging, and in particular to a packaging structure. Background Art

[0002] Leadframe Packages such as DIP (Dual In-line Package), SOT (Small Outline Transistor), QFP (Quad Flat Package), SOP (Small Outline Package), and SON (Small Outline No-leads Package) are still widely used in consumer electronics, automotive, and medical fields due to their low cost, small size, and high reliability.

[0003] However, as chip functions become more powerful and power consumption increases, the heat generated by the chip during operation also increases.

[0004] Currently, the packaging structure can no longer meet the requirements of high heat dissipation. Summary of the invention

[0005] The problem solved by the embodiments of the present invention is to provide a packaging structure, which improves the heat dissipation performance of the packaging structure and reduces the lateral size of the packaging structure.

[0006] To solve the above problems, an embodiment of the present invention provides a packaging structure, including: a base; a device chip mounted on the base; a plastic packaging layer located on the base and covering the device chip; a first heat dissipation pin exposed from the plastic packaging layer and connected to the side of the base, the first heat dissipation pin including a first connecting portion and a first extension portion bent and connected thereto, the first connecting portion being connected to the side of the base, and the first extension portion being arranged opposite to the side wall of the plastic packaging layer.

[0007] Optionally, the width of the first connecting portion is smaller than the width of the first extending portion.

[0008] Optionally, the number of the first connecting portion between the first extension portion and the base is one; or the number of the first connecting portion between the first extension portion and the base is multiple.

[0009] Optionally, when there are multiple first connecting portions between the first extending portion and the base, distances between adjacent first connecting portions are equal.

[0010] Optionally, the packaging structure also includes: a second heat dissipation pin, exposed from the plastic packaging layer and connected to the first extension portion of the first heat dissipation pin, the second heat dissipation pin includes a second connection portion and a second extension portion bent and connected thereto, the second connection portion is connected to the first extension portion, and the second extension portion is arranged relative to the top of the plastic packaging layer.

[0011] Optionally, there are one or more second connecting portions between the first extension portion and the second extension portion.

[0012] Optionally, the packaging structure also includes: an adhesive layer, located between the side wall of the plastic layer and the first heat dissipation pin, and between the top of the plastic layer and the second heat dissipation pin, and the plastic layer, the first heat dissipation pin and the second heat dissipation pin are in contact with the adhesive layer.

[0013] Optionally, the packaging structure further includes: an adhesive layer, located between the side wall of the plastic packaging layer and the first heat dissipation pin, and the adhesive layer is in contact with the plastic packaging layer and the first heat dissipation pin.

[0014] Optionally, the material of the adhesive layer includes one or both of epoxy resin and thermal conductive adhesive.

[0015] Optionally, the top of the first extension portion is flush with the top of the plastic packaging layer.

[0016] Optionally, the packaging structure further includes: a heat dissipation cover fixed to the outer side wall of the first heat dissipation pin, and the plastic sealing layer is placed in a cavity surrounded by the heat dissipation cover and the base.

[0017] Optionally, the heat dissipation cover includes a heat dissipation top cover and a heat dissipation side cover connected to an edge of the heat dissipation top cover, and the heat dissipation side cover abuts against the first extension portion.

[0018] Optionally, the outer side wall of the first extension portion has a protrusion; the heat dissipation cover includes a heat dissipation top cover and a heat dissipation side cover connected to the edge of the heat dissipation top cover, the inner side wall of the heat dissipation cover has a locking groove, and the protrusion is embedded in the locking groove.

[0019] Optionally, the material of the heat dissipation cover includes one or more of copper, aluminum, ceramic, and graphene.

[0020] Optionally, the first heat dissipation pin is connected to both sides of the base in a first direction; the packaging structure also includes: functional pins, which are arranged on both sides of the base in a second direction, the functional pins are spaced apart from the base, and the first direction and the second direction are perpendicular to each other.

[0021] Optionally, the packaging structure also includes: a lead, which is arranged above the base, one end of the lead is electrically connected to the device chip, and the other end of the lead is electrically connected to the functional pin; the plastic encapsulation layer also covers the lead and the electrical connection between the lead and the functional pin.

[0022] Optionally, the material of the lead wire includes one or more of copper, gold, silver, nickel, palladium and aluminum.

[0023] Compared with the prior art, the technical solution of the embodiment of the present invention has the following advantages:

[0024] In the packaging structure provided by an embodiment of the present invention, the device chip is mounted on the base, the plastic packaging layer is located on the base and covers the device chip, the first heat dissipation pin is exposed from the plastic packaging layer and is connected to the side of the base, the first heat dissipation pin includes a first connecting portion and a first extension portion bent and connected thereto, the first connecting portion is connected to the side of the base, and the first extension portion is arranged opposite to the side wall of the plastic packaging layer. In the embodiment of the present invention, a first heat dissipation pin exposed in the plastic packaging layer and connected to the side of the base is provided, so that the first heat dissipation pin is in direct contact with the air environment, and the heat generated by the chip in the working state can be quickly dissipated through the first heat dissipation pin, thereby improving the heat dissipation performance of the packaging structure. At the same time, the first heat dissipation pin includes a first connecting portion and a first extension portion connected to the first connecting portion in a bent shape, so that the first connecting portion and the first extension portion are in a bent shape, so that the lateral size of the packaging structure is reduced. In summary, by providing the first heat dissipation pin exposed in the plastic packaging layer and connected to the side of the base, not only the heat dissipation performance of the packaging structure can be improved, but also the lateral size of the packaging structure can be reduced, thereby improving the product competitiveness of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figures 1 to 4 is a schematic structural diagram corresponding to the first embodiment of the packaging structure of the present invention;

[0026] Figures 5 and 6 is a schematic diagram of the structure corresponding to the second embodiment of the packaging structure of the present invention;

[0027] Figure 7 is a schematic diagram of the structure corresponding to the third embodiment of the packaging structure of the present invention;

[0028] Figure 8 is a schematic structural diagram corresponding to the fourth embodiment of the packaging structure of the present invention;

[0029] Figures 9 and 10 It is a schematic diagram of the corresponding structure in the fifth embodiment of the packaging structure of the present invention. DETAILED DESCRIPTION

[0030] As can be seen from the background technology, currently, the packaging structure can no longer meet the requirements of high heat dissipation.

[0031] In order to solve the above technical problems, an embodiment of the present invention provides a packaging structure, including: a base; a device chip, mounted on the base; a plastic packaging layer, located on the base and covering the device chip; a first heat dissipation pin, exposed from the plastic packaging layer and connected to the side of the base, the first heat dissipation pin includes a first connecting portion and a first extension portion bent and connected thereto, the first connecting portion is connected to the side of the base, and the first extension portion is arranged opposite to the side wall of the plastic packaging layer.

[0032] In the packaging structure provided by an embodiment of the present invention, the device chip is mounted on the base, the plastic packaging layer is located on the base and covers the device chip, the first heat dissipation pin is exposed from the plastic packaging layer and is connected to the side of the base, the first heat dissipation pin includes a first connecting portion and a first extension portion bent and connected thereto, the first connecting portion is connected to the side of the base, and the first extension portion is arranged opposite to the side wall of the plastic packaging layer. In the embodiment of the present invention, a first heat dissipation pin exposed in the plastic packaging layer and connected to the side of the base is provided, so that the first heat dissipation pin is in direct contact with the air environment, and the heat generated by the chip in the working state can be quickly dissipated through the first heat dissipation pin, thereby improving the heat dissipation performance of the packaging structure. At the same time, the first heat dissipation pin includes a first connecting portion and a first extension portion connected to the first connecting portion in a bent shape, so that the first connecting portion and the first extension portion are in a bent shape, so that the lateral size of the packaging structure is reduced. In summary, by providing the first heat dissipation pin exposed in the plastic packaging layer and connected to the side of the base, not only the heat dissipation performance of the packaging structure can be improved, but also the lateral size of the packaging structure can be reduced, thereby improving the product competitiveness of the packaging structure.

[0033] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present invention more obvious and understandable, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0034] Figures 1 to 4 : is a schematic diagram of the structure corresponding to the first embodiment of the packaging structure of the present invention. Figure 1 It is a top view of the packaging structure. Figure 2 yes Figure 1 Cross-sectional view along the A1A2 direction, Figure 3 yes Figure 1 Cross-sectional view along direction A1A2.

[0035] The packaging structure includes: a base 100; a device chip 110, mounted on the base 100; a plastic layer 108, located on the base 100 and covering the device chip 110; a first heat dissipation pin 104, exposed from the plastic layer 108 and connected to the side of the base 100, the first heat dissipation pin 104 includes a first connecting portion 103 and a first extension portion 102 bent and connected thereto, the first connecting portion 103 is connected to the side of the base 100, and the first extension portion 102 is arranged opposite to the side wall of the plastic layer 108.

[0036] It should be noted that, by providing a first heat dissipation pin 104 exposed in the plastic packaging layer 108 and connected to the side of the base 100, the first heat dissipation pin 104 is directly in contact with the air environment, so that the heat generated by the chip in the working state can be quickly dissipated through the first heat dissipation pin 104, thereby improving the heat dissipation performance of the packaging structure. At the same time, the first heat dissipation pin 104 includes a first connecting portion 103 and a first extension portion 102 connected thereto by a bend, so that the first connecting portion 103 and the first extension portion 102 are in a bent shape, so that the lateral size of the packaging structure is reduced. In summary, by providing the first heat dissipation pin 104 exposed in the plastic packaging layer 108 and connected to the side of the base 100, not only the heat dissipation performance of the packaging structure can be improved, but also the lateral size of the packaging structure can be reduced, thereby improving the product competitiveness of the packaging structure.

[0037] Specifically, the base 100 provides a carrying platform for disposing the device chip 110 to support the device chip 110 .

[0038] As an example, the base 100 is a metal base 100. In this embodiment, the material of the base 100 includes copper or iron-nickel alloy.

[0039] Specifically, copper or iron-nickel alloy has good electrical conductivity, high thermal conductivity, and a low thermal expansion coefficient. At the same time, it also has good corrosion resistance and oxidation resistance.

[0040] It should be noted that the device chip 110 is a chip with a specific function.

[0041] Specifically, the type of device chip 110 depends on actual functional requirements or application scenarios. For example, the device chip 110 includes one or more of a system-on-chip (SoC), a memory chip, an ASIC (Application-Specific Integrated Circuit) chip, a CPU (Central Processing Unit) chip, a GPU (Graphics Processing Unit) chip, and an FPGA (Field-Programmable Gate Array) chip.

[0042] Specifically, the plastic encapsulation layer 108 protects the device chip 110 and prevents the device chips 110 from being cross-wired with each other. It can also reduce the probability of the device chip 110 being damaged and contaminated by the air environment. At the same time, the device chip 110 and the substrate encapsulated by the plastic encapsulation layer 108 are also convenient for installation and transportation.

[0043] In this embodiment, the material of the plastic layer 108 includes plastic compound. Specifically, the material of the plastic compound includes epoxy resin, which has the advantages of low shrinkage, good adhesion, good corrosion resistance, excellent electrical properties and low cost.

[0044] It should be noted that the material of the plastic packaging material may also include one or more of a hardener, a catalyst, and a filler.

[0045] It should also be noted that the plastic layer 108 needs to be cured and baked to make the molecular chains in the plastic layer 108 cross-react more fully, so that it has more stable physical and chemical properties and releases the internal stress in the plastic layer 108.

[0046] Specifically, by providing a first heat dissipation pin 104 exposed from the plastic packaging layer 108 and connected to the side of the base 100, the first heat dissipation pin 104 is directly in contact with the air environment, so that the heat generated by the chip in the working state can be quickly dissipated through the first heat dissipation pin 104, thereby improving the heat dissipation performance of the packaging structure. At the same time, the first heat dissipation pin 104 includes a first connecting portion 103 and a first extension portion 102 connected thereto in a bend, so that the first connecting portion 103 and the first extension portion 102 are in a bent shape, thereby reducing the lateral size of the packaging structure.

[0047] It should be noted that the first connecting portion 103 is connected to the side of the base 100, and the first extension portion 102 is connected to the first connecting portion 103. The heat generated when the device chip 110 is in a working state is dissipated to the first extension portion 102 through the base 100 and the first connecting portion 103. Since the first extension portion 102 is exposed to the air environment, the generated heat can be quickly dissipated through the first extension portion 102, thereby improving the heat dissipation performance of the packaging structure.

[0048] As an example, the first heat dissipation pin 104 is in a first direction (eg Figure 1 The two ends of the base 100 are connected to each other (as shown in the X direction).

[0049] Specifically, the first heat dissipation pins 104 are connected to both sides of the base 100 in a first direction, so that the heat generated when the device chip 110 is in a working state can be evenly dissipated through the first heat dissipation pins 104 on both sides of the base 100, thereby making the heat of various areas of the base 100 uniform and reducing the probability of local high heat and local low heat in the base 100.

[0050] It should be noted that, by setting the first connecting part 103 and bending the first connecting part 103, the first extension part 102 connected to the first connecting part 103 can be arranged opposite to the side wall of the plastic layer 108, thereby reducing the lateral dimension of the packaging structure. At the same time, the first connecting part 103 is connected to the first extension part 102, and the first connecting part 103 provides a heat dissipation channel, so that the heat on the base 100 can enter the first extension part 102 through the heat dissipation channel provided by the first connecting part 103, so that the first extension part 102 can quickly dissipate the heat.

[0051] In this embodiment, the width of the first connecting portion 103 is smaller than the width of the first extending portion 102 .

[0052] Specifically, the width of the first connecting portion 103 is smaller than the width of the first extending portion 102 , which can reduce the difficulty of bending the first connecting portion 103 and enable the first extending portion 102 to be arranged opposite to the side of the plastic packaging layer 108 .

[0053] As an example, the number of the first connecting portion 103 between the first extending portion 102 and the base 100 is one.

[0054] In other embodiments, Figure 4 As shown, there are multiple first connecting portions 103 between the first extension portion 102 and the base 100 .

[0055] Specifically, there are multiple first connecting parts 103 between the first extension part 102 and the base 100, which means that there are multiple heat dissipation channels between the first extension part 102 and the base 100, so that the heat of the base 100 can be quickly dissipated through the multiple heat dissipation channels.

[0056] As an example, when there are multiple first connection portions 103 between the first extension portion 102 and the base 100 , distances between adjacent first connection portions 103 are equal.

[0057] It should be noted that the equal distances between adjacent first connection portions 103 can improve the thermal conductivity uniformity of multiple heat dissipation channels, thereby making the heat in various areas of the base 100 uniform and reducing the probability of local high heat and local low heat in the base 100.

[0058] In this embodiment, the top of the first extension portion 102 is flush with the top of the plastic packaging layer 108 .

[0059] Specifically, the top of the first extension portion 102 is flush with the top of the plastic layer 108, which can improve the flatness of the top surface of the packaging structure. At the same time, the top of the first extension portion 102 is flush with the top of the plastic layer 108, which can maximize the size of the first extension portion 102 in the normal direction of the base 100, thereby maximizing the heat dissipation area of ​​the packaging structure, thereby effectively improving the heat dissipation performance of the packaging structure.

[0060] In this embodiment, the packaging structure further includes: a functional pin 101, in the second direction (such as Figure 1 The functional pins 101 are arranged on both sides of the base 100 (as shown in the Y direction), the functional pins 101 are spaced apart from the base 100, and the first direction and the second direction are perpendicular to each other.

[0061] It should be noted that the function pins 101 are used to electrically connect to the external circuit carrier and the device chip 110 , so that the device chip 110 can transmit electrical signals with other electronic components on the external circuit carrier through the function pins 101 .

[0062] It should also be noted that the function pins 101 are arranged on both sides of the base 100 in the second direction, so that the function pins 101 on one side of the base 100 can be used as signal input terminals, and the function pins 101 on the other side of the base 100 can be used as signal output terminals. At the same time, the arrangement directions of the function pins 101 and the first heat dissipation pins 104 are inconsistent, which is conducive to the electrical connection between the device chip 110 and the function pins 101 through the leads 126, thereby reducing the risk of mutual interference between the function pins 101 and the first heat dissipation pins 104 and improving the reliability of the packaging structure.

[0063] In this embodiment, the packaging structure further includes: a lead 126 disposed above the base 100 , one end of the lead 126 being electrically connected to the chip, and the other end of the lead 126 being electrically connected to the functional pin 101 .

[0064] It should be noted that one end of the lead 126 is electrically connected to the chip, and the other end of the lead 126 is electrically connected to the functional pin 101. The lead 126 is used to realize the electrical connection between the device chip 110 and the functional pin 101, so that the device chip 110 can be electrically connected to other external electronic components through the functional pin 101.

[0065] In this embodiment, the material of the lead 126 includes one or more of copper, gold, silver, nickel, palladium and aluminum.

[0066] Copper, gold, silver, nickel, palladium and aluminum are all conductive materials and are commonly used materials for the leads 126 of the packaging structure. In addition, copper, gold, silver, nickel, palladium and aluminum have low resistivity and can improve the conductivity of the leads 126.

[0067] In this embodiment, the plastic encapsulation layer 108 also covers the lead 126 and the electrical connection between the lead 126 and the functional pin 101 .

[0068] It should be noted that the plastic layer 108 covers the lead 126 and the electrical connection between the lead 126 and the functional pin 101, which can reduce the probability of the lead 126 and the electrical connection between the lead 126 and the functional pin 101 being contaminated by the air environment, and reduce the probability of electrical failure of the electrical connection between the lead 126 and the functional pin 101, thereby improving the reliability of the packaging structure.

[0069] Figures 5 and 6 : is a schematic diagram of the structure corresponding to the second embodiment of the packaging structure of the present invention. Figure 5 It is a top view of the packaging structure. Figure 6 yes Figure 5 Cross-sectional view along direction A1A2.

[0070] The similarities between the packaging structure of the present invention and the first embodiment are not described in detail here. The differences between the packaging structure of the present invention and the first embodiment are as follows:

[0071] refer to Figures 5 and 6 The packaging structure also includes: a second heat dissipation pin 263, which is exposed in the plastic packaging layer 208 and connected to the first extension portion 202 of the first heat dissipation pin 204, the second heat dissipation pin 263 includes a second connecting portion 261 and a second extension portion 262 bent and connected thereto, the second connecting portion 261 is connected to the first extension portion 202, and the second extension portion 262 is arranged opposite to the top of the plastic packaging layer 208.

[0072] Specifically, the second heat dissipation pin 263 includes a second connecting portion 261 and a second extension portion 262 which is bent and connected thereto, and the second heat dissipation pin 263 is exposed from the plastic packaging layer 208 and is connected to the first extension portion 202 of the first heat dissipation pin 204. That is to say, the heat dissipation pin formed by the second heat dissipation pin 263 and the first heat dissipation pin 204 is bent twice, the first extension portion 202 is arranged opposite to the side wall of the plastic packaging layer 208, and the second extension portion 262 is arranged opposite to the top of the plastic packaging layer 208. When the device chip is in working state, the heat of the base 200 can be quickly dissipated through the first heat dissipation pin 204 and the second heat dissipation pin 263, and the second heat dissipation pin 263 further increases the heat dissipation channel area of ​​the packaging structure, thereby further improving the heat dissipation performance of the packaging structure.

[0073] It should be noted that by setting the second connection part 261, it is convenient to bend the second connection part 261, so that the second extension part 262 connected to the second connection part 261 can be set relative to the top of the plastic layer 208, further increasing the heat dissipation channel area of ​​the packaging structure and improving the heat dissipation performance of the packaging structure. At the same time, the second connection part 261 is connected to the first extension part 202, and the second connection part 261 provides a heat dissipation channel, so that the heat on the first extension part 202 can enter the second extension part 262 through the heat dissipation channel provided by the second connection part 261, so that the second extension part 262 can quickly dissipate the heat.

[0074] As an example, the number of the second connecting portions 261 between the first extending portion 202 and the second extending portion 262 is one or more.

[0075] Specifically, there are one or more first connecting parts 203 between the first extension part 202 and the base 200, which means that there are one or more heat dissipation channels between the first extension part 202 and the base 200, so that the heat of the base 200 can be quickly dissipated through the one or more heat dissipation channels.

[0076] As an example, Figure 5 As shown, the number of the second connecting portion 261 between the first extension portion 202 and the second extension portion 262 is shown as one.

[0077] Figure 7 It is a schematic diagram of the corresponding structure in the third embodiment of the packaging structure of the present invention.

[0078] The similarities between the packaging structure of the present invention and the first embodiment are not described in detail here. The differences between the packaging structure of the present invention and the first embodiment are as follows:

[0079] refer to Figure 7The packaging structure further includes: an adhesive layer 380 located between the side wall of the plastic packaging layer 308 and the first heat dissipation pin 304 , and the adhesive layer 380 is in contact with the plastic packaging layer 308 and the first heat dissipation pin 304 .

[0080] It should be noted that by providing an adhesive layer 380 between the side wall of the plastic packaging layer 308 and the first heat dissipation pin 304 , the stability of the first heat dissipation pin 304 can be improved, the risk of shaking of the first heat dissipation pin 304 can be reduced, and the reliability of the packaging structure can be further improved.

[0081] As an example, the material of the adhesive layer 380 includes one or both of epoxy resin and thermal conductive adhesive.

[0082] Figure 8 It is a schematic diagram of the corresponding structure in the fourth embodiment of the packaging structure of the present invention.

[0083] The similarities between the packaging structure of the present invention and the first embodiment are not described in detail here. The differences between the packaging structure of the present invention and the first embodiment are as follows:

[0084] refer to Figure 8 The packaging structure also includes: a second heat dissipation pin 463, which is exposed in the plastic packaging layer 408 and connected to the first extension portion 402 of the first heat dissipation pin 404, the second heat dissipation pin 463 includes a second connecting portion 461 and a second extension portion 462 bent and connected thereto, the second connecting portion 461 is connected to the first extension portion 402, and the second extension portion 462 is arranged opposite to the top of the plastic packaging layer 408.

[0085] Specifically, the second heat dissipation pin 463 includes a second connecting portion 461 and a second extension portion 462 which is bent and connected thereto, and the second heat dissipation pin 463 is exposed from the plastic packaging layer 408 and is connected to the first extension portion 402 of the first heat dissipation pin 404. That is to say, the heat dissipation pin formed by the second heat dissipation pin 463 and the first heat dissipation pin 404 is bent twice, the first extension portion 402 is arranged opposite to the side wall of the plastic packaging layer 408, and the second extension portion 462 is arranged opposite to the top of the plastic packaging layer 408. When the device chip is in working state, the heat of the base 400 can be quickly dissipated through the first heat dissipation pin 404 and the second heat dissipation pin 463, and the second heat dissipation pin 463 further increases the heat dissipation channel area of ​​the packaging structure, thereby further improving the heat dissipation performance of the packaging structure.

[0086] It should be noted that by setting the second connection part 461, it is convenient to bend the second connection part 461, so that the second extension part 462 connected to the second connection part 461 can be set relative to the top of the plastic layer 408, further increasing the heat dissipation channel area of ​​the packaging structure and improving the heat dissipation performance of the packaging structure. At the same time, the second connection part 461 is connected to the first extension part 402, and the second connection part 461 provides a heat dissipation channel, so that the heat on the first extension part 402 can enter the second extension part 462 through the heat dissipation channel provided by the second connection part 461, so that the second extension part 462 can quickly dissipate the heat.

[0087] As an example, the number of the second connecting portions 461 between the first extending portion 402 and the second extending portion 462 is one or more.

[0088] Specifically, there are one or more first connecting parts 403 between the first extension part 402 and the base 400, which means that there are one or more heat dissipation channels between the first extension part 402 and the base 400, so that the heat of the base 400 can be quickly dissipated through the one or more heat dissipation channels.

[0089] As an example, the packaging structure also includes: an adhesive layer 480, which is located between the side wall of the plastic layer 408 and the first heat dissipation pin 404, and between the top of the plastic layer 408 and the second heat dissipation pin 463, and the plastic layer 408, the first heat dissipation pin 404 and the second heat dissipation pin 463 are in contact with the adhesive layer 480.

[0090] It should be noted that by setting an adhesive layer 480 between the side wall of the plastic layer 408 and the first heat dissipation pin 404, and between the top of the plastic layer 408 and the second heat dissipation pin 463, the stability of the first heat dissipation pin 404 and the second heat dissipation pin 463 can be improved, the risk of shaking of the first heat dissipation pin 404 and the second heat dissipation pin 463 is reduced, and the reliability of the packaging structure is further improved.

[0091] As an example, the material of the adhesive layer 480 includes one or both of epoxy resin and thermal conductive adhesive.

[0092] Figures 9 and 10 1 is a schematic diagram of the structure corresponding to the fifth embodiment of the packaging structure of the present invention. The similarities between the packaging structure of the present invention and the first embodiment are not repeated here. The differences between the packaging structure of the present invention and the first embodiment are:

[0093] refer to Fig. 9The packaging structure further includes: a heat dissipation cover 590 fixed to the outer side wall of the first heat dissipation pin 504 , and the plastic sealing layer 508 is located in a cavity surrounded by the heat dissipation cover 590 and the base 500 .

[0094] It should be noted that by fixing the heat dissipation cover 590 on the outer wall of the first heat dissipation pin 504, the heat in the first heat dissipation pin 504 can enter the heat dissipation cover 590, so that the heat dissipation cover 590 can also play a role in heat dissipation, thereby further improving the heat dissipation performance of the packaging structure.

[0095] It should also be noted that the plastic encapsulation layer 508 is located in the cavity surrounded by the heat dissipation cover 590 and the base 500, so that the heat dissipation cover 590 can protect the plastic encapsulation layer 508 and the device chip 510 in the cavity.

[0096] In this embodiment, the heat dissipation cover 590 includes a heat dissipation top cover 5902 and a heat dissipation side cover 5901 connected to the edge of the heat dissipation top cover 5902 , and the heat dissipation side cover 5901 abuts against the first extension portion 502 .

[0097] It should be noted that, by setting the first connecting portion 503, it is convenient to bend the first connecting portion 503 so that the first extension portion 502 connected to the first connecting portion 503 can be arranged opposite to the side wall of the plastic packaging layer 508, which means that the first extension portion 502 is elastic in the outward direction. When the heat dissipation side cover 5901 contacts the first extension portion 502, the first extension portion 502 will exert a certain elastic force on the inner wall of the heat dissipation side cover 5901, so that the heat dissipation cover 590 can be fixed on the first heat dissipation pin 504 by utilizing the elasticity of the first extension portion 502.

[0098] like Fig.10 As shown, in other embodiments, the outer side wall of the first extension portion 502 has a protrusion 520 .

[0099] Specifically, when the heat dissipation cover 590 is fixed to the outer wall of the first extension portion 502, the protrusion 520 provides fixed support for the heat dissipation cover 590, thereby preventing the heat dissipation side cover 5901 from sliding on the outer wall of the first extension portion 502, thereby improving the reliability of the packaging structure.

[0100] As an example, the heat dissipation cover 590 includes a heat dissipation top cover 5902 and a heat dissipation side cover 5901 connected to the edge of the heat dissipation top cover 5902, the inner side wall of the heat dissipation cover 590 has a locking groove (not marked), and the protrusion 520 is embedded in the locking groove.

[0101] Specifically, the locking groove provides a space for placing the protrusion 520 on the first extension portion 502 , so that the protrusion 520 can be embedded in the locking groove, thereby improving the stability between the heat dissipation cover 590 and the first heat dissipation pin 504 .

[0102] In this embodiment, the material of the heat dissipation cover 590 includes one or more of copper, aluminum, ceramic, and graphene.

[0103] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A packaging structure, characterized in that: include: Pedestal; A device chip is mounted on the base; A plastic packaging layer, located on the base and covering the device chip; A first heat dissipation pin is exposed from the plastic packaging layer and connected to the side of the base. The first heat dissipation pin includes a first connecting portion and a first extension portion bent and connected thereto. The first connecting portion is connected to the side of the base, and the first extension portion is arranged opposite to the side wall of the plastic packaging layer.

2. The packaging structure according to claim 1, characterized in that: The width of the first connecting portion is smaller than the width of the first extending portion.

3. The packaging structure according to claim 1, characterized in that: The number of the first connecting portion between the first extension portion and the base is one; or, There are multiple first connecting parts between the first extension part and the base.

4. The packaging structure according to claim 3, characterized in that: When there are multiple first connecting portions between the first extending portion and the base, distances between adjacent first connecting portions are equal.

5. The packaging structure according to claim 1, characterized in that: The packaging structure also includes: a second heat dissipation pin, exposed from the plastic packaging layer and connected to the first extension portion of the first heat dissipation pin, the second heat dissipation pin includes a second connecting portion and a second extension portion bent and connected thereto, the second connecting portion is connected to the first extension portion, and the second extension portion is arranged opposite to the top of the plastic packaging layer.

6. The packaging structure according to claim 5, characterized in that: The number of the second connecting parts between the first extension part and the second extension part is one or more.

7. The packaging structure according to claim 5, characterized in that: The packaging structure also includes: an adhesive layer located between the side wall of the plastic layer and the first heat dissipation pin, and between the top of the plastic layer and the second heat dissipation pin, and the plastic layer, the first heat dissipation pin and the second heat dissipation pin are in contact with the adhesive layer.

8. The packaging structure according to claim 1, characterized in that: The packaging structure further includes: an adhesive layer, which is located between the side wall of the plastic packaging layer and the first heat dissipation pin, and the adhesive layer is in contact with the plastic packaging layer and the first heat dissipation pin.

9. The packaging structure according to claim 7 or 8, characterized in that: The material of the adhesive layer includes one or both of epoxy resin and thermal conductive adhesive.

10. The packaging structure according to claim 1, wherein: The top of the first extension portion is flush with the top of the plastic packaging layer.

11. The packaging structure according to claim 1, characterized in that: The packaging structure further includes: a heat dissipation cover fixed to the outer side wall of the first heat dissipation pin, and the plastic sealing layer is placed in a cavity surrounded by the heat dissipation cover and the base.

12. The packaging structure according to claim 11, characterized in that: The heat dissipation cover comprises a heat dissipation top cover and a heat dissipation side cover connected to the edge of the heat dissipation top cover, and the heat dissipation side cover abuts against the first extension portion.

13. The packaging structure according to claim 11, characterized in that: The outer side wall of the first extension portion has a protrusion; The heat dissipation cover comprises a heat dissipation top cover and a heat dissipation side cover connected to the edge of the heat dissipation top cover. The inner side wall of the heat dissipation cover is provided with a locking groove, and the protrusion is embedded in the locking groove.

14. The packaging structure according to claim 11, characterized in that: The material of the heat dissipation cover includes one or more of copper, aluminum, ceramic and graphene.

15. The packaging structure according to claim 1, characterized in that: The first heat dissipation pins are connected to two sides of the base in a first direction; The packaging structure further includes: functional pins, which are arranged on both sides of the base in the second direction, the functional pins are spaced apart from the base, and the first direction and the second direction are perpendicular to each other.

16. The packaging structure according to claim 15, characterized in that: The packaging structure further includes: a lead wire, which is arranged above the base, one end of the lead wire is electrically connected to the device chip, and the other end of the lead wire is electrically connected to the functional pin; The plastic packaging layer also covers the lead wire and the electrical connection between the lead wire and the functional pin.

17. The packaging structure according to claim 16, characterized in that: The material of the lead wire includes one or more of copper, gold, silver, nickel, palladium and aluminum.

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