Storage chip packaging module

Abstract

The utility model discloses a memory chip packaging module, comprising a base layer; the chip layer comprises at least one chip packaging module, a temperature adjusting module and a temperature sensor, and the temperature adjusting module is used for adjusting the temperature of the chip packaging module corresponding to the temperature sensor according to the monitored temperature of the temperature sensor; and the plastic packaging layer comprises a heating device, and the heating device is used for heating the chip packaging module corresponding to the heating device according to the instruction of the temperature adjusting module. According to the utility model, the plastic packaging layer comprises the heating device, and the heating device can heat the chip packaging module, so that the storage chip packaging module can still work normally when the ambient temperature is lower.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a storage chip packaging module. Background Art

[0002] With the rapid development of information technology, memory chip packaging modules are increasingly used in various electronic devices. The temperature of the memory chip packaging module has an important impact on its working state. If the temperature of the memory chip packaging module is not within the normal working temperature range, it often cannot work normally.

[0003] Current memory chip packaging modules generally include a cooling device, which cools down the memory chip packaging module when the temperature of the memory chip packaging module is too high.

[0004] However, when the electronic device is in a cold storage or in a winter area, the temperature of the memory chip packaging module may be too low, causing the memory chip packaging module to fail to work normally. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present application provides a memory chip packaging module. In the utility model, the plastic packaging layer includes a heating device, which can heat the chip packaging module so that the memory chip packaging module can still work normally when the ambient temperature is low.

[0006] In order to solve the above problems, the utility model provides the following technical solutions:

[0007] In a first aspect, an embodiment of the present application provides a memory chip packaging module, including:

[0008] A base layer, the base layer comprising a circuit network;

[0009] A chip layer, wherein the chip layer is stacked and mounted on the base layer and is electrically connected to the circuit network, wherein the chip layer comprises at least one chip packaging module, a temperature regulating module and a temperature sensor, wherein the temperature regulating module is electrically connected to the temperature sensor, wherein the temperature sensor is used to monitor the temperature of the chip packaging module corresponding to the temperature sensor, and wherein the temperature regulating module determines whether to start the heating device according to the monitored temperature of the temperature sensor;

[0010] A plastic encapsulation layer, wherein the plastic encapsulation layer is stacked on the chip layer, and the plastic encapsulation layer includes the heating device, which is electrically connected to the temperature regulating module and is used to heat the chip packaging module corresponding to the heating device according to the instruction of the temperature regulating module.

[0011] In some embodiments, the temperature sensor is disposed inside a chip packaging module corresponding to the temperature sensor; and the temperature adjustment module is disposed inside a chip packaging module corresponding to the temperature sensor.

[0012] In some embodiments, the heating device comprises a heating wire mesh.

[0013] In some embodiments, the chip packaging module includes at least one chip element, the heating wire mesh is arranged in an area corresponding to each chip element in the chip packaging module corresponding to the heating device, and the heating wire mesh avoids a pin area corresponding to the chip element.

[0014] In some embodiments, the heating wire mesh is a thermistor with a positive temperature coefficient, and when the temperature of the heating wire mesh increases, the resistance value of the heating wire mesh increases; or

[0015] The heating wire mesh is a thermistor with a negative temperature coefficient. When the temperature of the heating wire mesh increases, the resistance value of the heating wire mesh decreases.

[0016] In some embodiments, the heating wire mesh includes a first heating wire having a positive temperature coefficient and a second heating wire having a negative temperature coefficient, and the first heating wire and the second heating wire are intertwined to form the heating wire mesh;

[0017] The heating device is used to control the first heating wire and / or the second heating wire to be energized.

[0018] In some embodiments, the plastic encapsulation layer includes an insulating layer, the heating wire mesh is pre-buried in the insulating layer, and the heating wire mesh is a single-layer structure or a stacked structure separated by the insulating layer.

[0019] In some embodiments, the heating device comprises a heating film.

[0020] In some embodiments, the heating device includes an overheating protection device, and when the temperature of the heating device is too high, the overheating protection device controls the heating device to stop heating.

[0021] In some embodiments, the plastic packaging layer further includes a heat dissipation device, and the heat dissipation device is connected to a heat dissipation pin of the chip packaging module.

[0022] The present application provides a memory chip packaging module. The present application includes a heating device through a plastic packaging layer. The heating device is used to heat the chip packaging module corresponding to the heating device according to the instruction of the temperature adjustment module. When the monitoring temperature of the temperature sensor is too low, the chip packaging module can be heated by the heating device, and the chip packaging module can be raised to the normal operating temperature and then work normally, so that the memory chip packaging module can still work normally when the ambient temperature is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of a partial cross-sectional structure of a first implementation mode of a memory chip packaging module provided in an embodiment of the present application.

[0024] Figure 2 It is a structural schematic diagram of the first implementation mode of the memory chip packaging module provided in the embodiment of the present application.

[0025] Figure 3 It is a schematic diagram of a partial cross-sectional structure of a second implementation mode of a memory chip packaging module provided in an embodiment of the present application.

[0026] Figure 4 It is a schematic diagram of a partial cross-sectional structure of the third implementation mode of the memory chip packaging module provided in an embodiment of the present application.

[0027] Main unit symbol description:

[0028] 1. Memory chip packaging module; 10. Base layer; 20. Chip layer; 30. Plastic sealing layer;

[0029] 200, chip packaging module; 210, control chip packaging module; 220, cache chip packaging module; 230, flash memory chip packaging module; 240, temperature adjustment module; 250, temperature sensor; 201, pin;

[0030] 310, insulating layer; 320, heating device; 321, heating screen; 322, heating film; 330, area corresponding to chip packaging module; 340, pin area corresponding to chip packaging module; 350, heat dissipation device. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0033] The present application provides a memory chip packaging module, wherein the plastic packaging layer includes a heating device, and the heating device can heat the chip packaging module, so that the memory chip packaging module can still work normally when the ambient temperature is low.

[0034] The memory chip packaging module provided by the present application will be described in detail below with reference to the accompanying drawings.

[0035] See also Figure 1 , Figure 1 FIG. 1 is a schematic diagram of a partial cross-sectional structure of a first embodiment of a memory chip packaging module provided in an embodiment of the present application. Figure 1 As shown, in some embodiments, the memory chip packaging module 1 includes a base layer 10, a chip layer 20 and a plastic packaging layer 30. The base layer 10 includes a circuit network ( Figure 1 The substrate 10 is a plate-like structure for supporting and connecting electronic components, and the circuit network is used to electrically connect at least one chip packaging module 200 in the chip layer 20. The chip layer 20 is stacked and mounted on the substrate 10 and is electrically connected to the circuit network, and the plastic encapsulation layer 30 is stacked and arranged on the chip layer 20.

[0036] See also Figure 2 , Figure 2 1 is a schematic diagram of the structure of the first embodiment of the memory chip packaging module provided in the embodiment of the present application. Figure 2 As shown, in some embodiments, the chip layer 20 includes at least one chip packaging module 200. The chip packaging module 200 refers to a module that packages a chip component in a specific housing so that the chip component is connected and fixed with other electronic components.

[0037] In some embodiments, the chip packaging module 200 includes a chip component, a circuit connecting contacts on the chip component, and a plurality of pins 201 electrically connected to the circuit.

[0038] In some embodiments, the chip packaging module 200 includes a plurality of chip components, a circuit connecting contacts on the plurality of chip components, and a plurality of pins 201 electrically connected to the circuit. In this way, compared with the way that the chip packaging module 200 includes one chip component, the chip packaging module 200 including a plurality of chip components can have a larger storage space; when the uses of the plurality of chip components are different, the chip packaging module 200 can perform more complex functions.

[0039] In some embodiments, the number of the chip packaging modules 200 may be at least one, for example, the number of the chip packaging modules 200 may be one, two, three, four, five, ten, etc.

[0040] like Figure 2 As shown, optionally, at least one chip packaging module 200 may include a control chip packaging module 210 , a cache chip packaging module 220 and a flash memory chip packaging module 230 .

[0041] However, this application is not limited to Figure 2 In the illustrated embodiment, in some embodiments, the memory chip packaging module 1 may include other electronic components, such as resistors, capacitors, inductors, diodes, transistors, or various sensor components.

[0042] In some embodiments, the storage chip packaging module 1 may be an SSD (Solid State Disk), wherein the chip layer 20 may include a control chip packaging module 210 , a cache chip packaging module 220 , and a flash memory chip packaging module 230 .

[0043] In some embodiments, the control chip packaging module 210 is used to manage data and instructions in the storage chip packaging module 1, the cache chip packaging module 220 is used to temporarily store frequently accessed data and instructions, and the flash chip packaging module 230 is used to store data.

[0044] In some embodiments, the control chip packaging module 210 can be electrically connected to the cache chip packaging module 220 and the flash memory chip packaging module 230 respectively, storing the received data that needs to be accessed quickly into the cache chip packaging module 220, and storing the data that is not frequently accessed into the flash memory chip packaging module 230.

[0045] In some embodiments, the cache chip packaging module 220 is electrically connected to the flash chip packaging module 230 , and the cache chip packaging module 220 can store infrequently accessed data into the flash chip packaging module 230 .

[0046] However, the present application is not limited thereto. In some embodiments, the chip layer 20 may also include other types of chip packaging modules 200 , such as a quantum computing chip packaging module 200 .

[0047] like Figure 2 As shown, in some embodiments, the chip layer 20 further includes a temperature regulating module 250 and a temperature sensor 240 , and the temperature regulating module 250 is electrically connected to the temperature sensor 240 .

[0048] Optionally, the temperature sensor 240 is used to monitor the temperature of the chip packaging module 200 corresponding to the temperature sensor 240 , and the temperature adjustment module 250 determines whether to start the heating device 320 according to the monitored temperature of the temperature sensor 240 .

[0049] Optionally, the temperature sensor 240 is disposed inside the chip packaging module 200 corresponding to the temperature sensor 240. Figure 2 As shown, in some embodiments, the temperature sensor 240 is disposed inside the control chip packaging module 210 corresponding to the temperature sensor 240. In this way, the accuracy of the temperature monitored by the temperature sensor 240 can be improved.

[0050] Optionally, the temperature adjustment module 250 is disposed inside the chip packaging module 200 corresponding to the temperature sensor 240. Figure 2 As shown, in some embodiments, the temperature regulating module 250 is disposed inside the control chip packaging module 210 corresponding to the temperature sensor 240. In this way, the temperature regulating module 250 is integrated inside the chip packaging module 200, and there is no need to further dispose the temperature regulating module 250 on the chip layer 20 and electrically connect it to the corresponding chip packaging module 200, which can facilitate the processing of the storage chip packaging module 1.

[0051] Optionally, the temperature sensor 240 and the temperature regulating module 250 are both disposed inside the chip packaging module 200 corresponding to the temperature sensor 240. In this way, it is not necessary to further dispose the temperature sensor 240 and the temperature regulating module 250 on the chip layer 20 and electrically connect them to the corresponding chip packaging module 200, which can facilitate the processing of the storage chip packaging module 1.

[0052] In some embodiments, the temperature sensor 240 and the temperature adjustment module 250 are disposed in an area of ​​the chip layer 20 except the area where the chip packaging module 200 is located. In this way, the temperature of the memory chip packaging module 1 can also be adjusted, and the memory chip packaging module 1 can be manufactured using the common chip packaging module 200 on the market, thereby improving the compatibility of the memory chip packaging module 1.

[0053] In some embodiments, the plastic encapsulation layer 30 is used to encapsulate the chip layer 20 to provide physical protection for the chip layer 20 .

[0054] Optionally, the plastic layer 30 can be used to solve the problems caused by the exposure of the chip layer 20, such as vulnerable to damage and contaminated connections, so as to ensure the reliability and stability of the memory chip packaging module 1 and extend its service life.

[0055] Optionally, the plastic packaging layer 30 may also fix at least one chip packaging module 200 in the chip layer 20 .

[0056] Optionally, the plastic packaging layer 30 provides electrical insulation for the chip layer 20 , thereby preventing the chip layer 20 from directly contacting external conductive materials and reducing the risk of short circuit.

[0057] Optionally, the plastic packaging layer 30 provides the chip layer 20 with an anti-electromagnetic interference function, which can reduce the interference of the external electromagnetic environment on the chip layer 20 .

[0058] Optionally, the plastic packaging layer 30 may include a thermosetting plastic material, such as epoxy resin.

[0059] In some embodiments, the plastic encapsulation layer 30 includes a heating device 320 , which is electrically connected to the temperature regulating module 250 . The heating device 320 is used to heat the chip packaging module 200 corresponding to the heating device 320 according to instructions of the temperature regulating module 250 .

[0060] like Figure 1 As shown, optionally, the heating device 320 is electrically connected to the circuit network of the base layer 10, and thus electrically connected to the temperature adjustment module 250 through the circuit network.

[0061] like Figure 1 As shown, in some embodiments, the molding layer 30 includes an insulating layer 310 and a heating device 320 .

[0062] As described above, the plastic encapsulation layer 30 may include a thermosetting plastic material. Optionally, the insulating layer 310 may be a thermosetting plastic material. In this way, it is convenient to pre-embed the heating device 320 in the insulating layer 310 when the insulating layer 310 is not completely cured during processing.

[0063] By pre-embedding the heating device 320 in the insulating layer 310 as described above, firstly, it is possible to avoid uneven heating or excessive temperature of the chip packaging module 200 due to direct contact between the heating device 320 and the chip packaging module 200; secondly, the insulating layer 310 can provide physical protection for the chip layer 20 and the heating device 320 at the same time, thereby ensuring the reliability and stability of the storage chip packaging module 1.

[0064] In some embodiments, the heating device 320 is stacked on the insulating layer 310 .

[0065] Optionally, the heating device 320 is bonded onto the insulating layer 310 .

[0066] By stacking the heating device 320 on the insulating layer 310, firstly, the insulating layer 310 can be easily processed; secondly, other memory chip packaging modules 1 can be easily modified in this way to add a heating function.

[0067] like Figure 1 As shown, in some embodiments, in the insulating layer 310 , the heating device 320 is pre-buried in a region 330 corresponding to the chip packaging module 200 .

[0068] like Figure 1 As shown, optionally, the region 330 corresponding to the chip packaging module 200 refers to a region in the insulating layer 310 that vertically corresponds to a region of the chip packaging module 200 on the base layer 10 .

[0069] like Figure 1 As shown, in some embodiments, the heating device 320 avoids the pin area 340 corresponding to the chip packaging module 200 .

[0070] like Figure 1 As shown, optionally, the pin region 340 corresponding to the chip packaging module 200 refers to a region in the insulating layer 310 that vertically corresponds to the pin region of the chip packaging module 200 on the base layer 10 .

[0071] The pins 201 of the chip packaging module 200 are usually made of metal material with good thermal conductivity, so they are sensitive to temperature and easily damaged. Through the above method, the heating device 320 will not be too close to the pin area. During the heating process, the pins 201 and the circuit network connected to the pins 201 can be prevented from being damaged due to excessive temperature, thereby enabling the chip packaging module 200 to work normally.

[0072] In some embodiments, each chip packaging module 200 has a corresponding temperature sensor 240, a temperature adjustment module 250, and a heating device 320. In this way, each chip packaging module 200 can be temperature-adjusted individually.

[0073] In some embodiments, when the chip packaging module 200 includes at least one chip element, at least one heating device 320 is pre-buried in an area in the insulating layer 310 corresponding to at least one chip element in the chip packaging module 200. In this way, only the chip element in the chip packaging module 200 can be heated, thereby preventing other temperature-sensitive elements in the chip packaging module from being damaged due to overheating, and saving energy.

[0074] See also Figure 3 , Figure 3 FIG. 2 is a schematic diagram of a partial cross-sectional structure of a second embodiment of a memory chip packaging module provided in an embodiment of the present application. Figure 3 As shown, in some embodiments, the heating device 320 includes a heating film 322 .

[0075] Optionally, the heating film 322 may be a carbon fiber film, a stainless steel film, a titanium film or the like.

[0076] Please return to Figure 1 ,like Figure 1 As shown, in some embodiments, the heating device 320 includes a heating wire mesh 321. The heating wire mesh 321 refers to a mesh formed by winding heating wires. In this way, the heating wire mesh 321 can maintain a certain heat dissipation area while heating, and can prevent the temperature of the heating device 320 from rising too fast during the heating process, so that it is convenient for the temperature adjustment module 250 to control the heating device 320.

[0077] Optionally, the diameter of the heating wire is 0.01 mm (millimeter) to 0.05 mm. For example, the diameter of the heating wire may be 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm or 0.05 mm.

[0078] In some embodiments, the plastic encapsulation layer 30 includes an insulating layer 310 , and the heating device 320 is a single-layer structure or a stacked structure separated by the insulating layer 310 .

[0079] like Figure 1 As shown, in some embodiments, the plastic encapsulation layer 30 includes an insulating layer 310, a heating wire mesh 321 is pre-buried in the insulating layer 310, and the heating wire mesh 321 is a single-layer structure.

[0080] By pre-embedding the heating mesh 321 in the insulating layer 310, firstly, it is possible to avoid uneven heating or excessive temperature of the chip packaging module 200 due to direct contact between the heating mesh 321 and the chip packaging module 200; secondly, the insulating layer 310 can provide physical protection for the chip layer 20 and the heating mesh 321 at the same time, thereby ensuring the reliability and stability of the storage chip packaging module 1.

[0081] See also Figure 4 , Figure 4 FIG. 2 is a schematic diagram of a partial cross-sectional structure of a third embodiment of a memory chip packaging module provided in an embodiment of the present application. Figure 4 As shown, in some embodiments, the heating wire mesh 321 is pre-buried in the insulating layer 310, and the heating wire mesh 321 is a laminated structure separated by the insulating layer 310. Optionally, the insulating layer 310 includes three layers of heating devices 320, and each layer of the heating device 320 includes a heating wire mesh 321.

[0082] like Figure 4 As shown, optionally, the heating device 320 closest to the base layer 10 is electrically connected to the circuit network of the base layer 10 , and adjacent heating devices 320 are electrically connected to each other.

[0083] By adopting the above-mentioned method, compared with the method in which the heating wire mesh 321 is a single-layer structure, the heating speed can be increased, so that the chip packaging module 200 can be restored to a normal working state as soon as possible when the temperature is too low.

[0084] As described above, the plastic encapsulation layer 30 may include a thermosetting plastic material. Optionally, the insulating layer 310 may be a thermosetting plastic material. In this way, it is convenient to pre-embed the heating wire mesh 321 in the insulating layer 310 when the insulating layer 310 is not completely cured during processing.

[0085] In some embodiments, the chip packaging module 200 includes at least one chip element, and the heating wire mesh 321 is disposed in a region corresponding to each chip element in the chip packaging module 200 corresponding to the heating device 320 .

[0086] Please return to Figure 2 ,like Figure 2 As shown, the heating wire mesh 321 is arranged in the area corresponding to the chip element in the chip packaging module 200 corresponding to the heating device 320 (because the area of ​​the chip element overlaps with the heating wire mesh 321, Figure 2 The chip components are not shown).

[0087] Optionally, the heating screen 321 avoids the pin area corresponding to the chip component.

[0088] Optionally, the pin region corresponding to the chip component refers to a region in the insulating layer 310 that vertically corresponds to the pin region of the chip component on the chip packaging module 200 .

[0089] In the above manner, the heating screen 321 will not be too close to the pin area corresponding to the chip component, and during the heating process, the pin 201 and the circuit network connected to the pin 201 can be prevented from being damaged due to excessive temperature, so that the chip component can work normally, and then the storage chip packaging module 1 can work normally.

[0090] In some embodiments, at least one heating screen 321 is disposed in a region corresponding to at least one chip element in the chip packaging module 200 corresponding to the heating device 320 , and each heating screen 321 avoids a pin region corresponding to the chip element.

[0091] In some embodiments, in the area corresponding to each chip element, the heating wire mesh 321 forms a honeycomb pattern, a Chinese-shaped pattern, a serpentine pattern, a Z-shaped pattern, or a ring pattern. In this way, the heat dissipation area of ​​the heating wire mesh 321 can be increased to prevent the chip packaging module 200 from being damaged due to excessive temperature.

[0092] In some embodiments, the heating mesh 321 is a thermistor with a positive temperature coefficient. When the temperature of the heating mesh 321 increases, the resistance value of the heating mesh 321 increases.

[0093] In some embodiments, the calculation formula of the heating power of the heating screen 321 may be:

[0094] P=U 2 / R,

[0095] Wherein, P represents the heating power of the heating mesh 321 , U represents the voltage across the heating mesh 321 , and R represents the resistance of the heating mesh 321 .

[0096] Optionally, during the heating process, the voltage across the heating device 320 is kept constant.

[0097] In this way, when the temperature of the heating mesh 321 increases and the resistance value of the heating mesh 321 increases, the heating power will decrease. Therefore, when the temperature of the heating mesh 321 is low, the heating power is high and the heating is faster, which is convenient for the chip packaging module 200 to heat up quickly when the temperature is low; when the temperature of the heating mesh 321 is high, the heating power is low and the heating is slower, which can prevent the chip packaging module 200 from being damaged due to excessive temperature.

[0098] In some embodiments, the heating mesh 321 is a thermistor with a negative temperature coefficient. When the temperature of the heating mesh 321 increases, the resistance value of the heating mesh 321 decreases.

[0099] In this way, when the temperature of the heating mesh 321 increases and the resistance value of the heating mesh 321 decreases, the heating power will increase. Therefore, during the heating process, the higher the temperature of the heating mesh 321, the higher the heating power and the faster the heating, which makes it easier for the chip packaging module 200 to quickly heat up to the normal operating temperature when the temperature is extremely low, so that it can quickly return to the normal working state.

[0100] In some embodiments, the heating wire mesh 321 includes a first heating wire having a positive temperature coefficient and a second heating wire having a negative temperature coefficient, and the first heating wire and the second heating wire are intertwined to form the heating wire mesh 321 .

[0101] Optionally, the heating device 320 is used to control the first heating wire and / or the second heating wire to be energized.

[0102] In some embodiments, when the monitored temperature of the temperature sensor 240 is lower than a first preset value, the temperature adjustment module 250 sends a first heating instruction to the heating device 320, and the heating device 320 energizes the first heating wire according to the first heating instruction.

[0103] In some embodiments, the first preset value is determined by the lowest operating temperature or the best operating temperature in the normal operating temperature range of the chip packaging module 200 .

[0104] In some embodiments, the industrial-grade normal operating temperature range of the chip packaging module 200 is from -45 degrees to 85 degrees.

[0105] In some embodiments, the normal operating temperature range of the chip packaging module 200 is from -55 degrees to 125 degrees.

[0106] Optionally, the first preset value may be a minimum operating temperature, such as -45 degrees or -55 degrees.

[0107] In some embodiments, when the temperature of the chip packaging module 200 is slightly lower than the minimum operating temperature, the chip packaging module 200 can still work, so the first preset value can be lower than the minimum operating temperature. For example, when the minimum operating temperature is -45 degrees, the first preset value can be -50 degrees, -60 degrees or -70 degrees.

[0108] In some embodiments, although the temperature of the chip packaging module 200 is higher than the minimum operating temperature, since the temperature is not yet the optimal operating temperature, the working efficiency of the chip packaging module 200 is not high, so the first preset value may be higher than the minimum operating temperature.

[0109] Optionally, the first preset value may be -20 degrees, -15 degrees, -10 degrees, 0 degrees, 5 degrees or 10 degrees, etc.

[0110] In some embodiments, when the monitored temperature of the temperature sensor 240 is lower than a first preset value and higher than a second preset value, the temperature regulating module 250 controls the second heating wire of the heating device 320 to not be energized, wherein the second preset value is lower than the first preset value. In this way, energy can be saved when heating the chip packaging module 200 when the temperature is not extremely low.

[0111] By energizing the first heating wire with a positive temperature coefficient when the monitored temperature is lower than the first preset value, the chip packaging module 200 can be heated when the monitored temperature is lower than the first preset value. When the temperature of the first heating wire is low, the heating power is high and the heating is fast, so that the chip packaging module 200 can be heated quickly when the temperature is low; when the temperature of the first heating wire is high, the heating power is low and the heating is slow, so that the chip packaging module 200 can be prevented from being damaged due to excessively high temperature.

[0112] In some embodiments, when the monitored temperature of the temperature sensor 240 is lower than a second preset value, the temperature regulating module 250 sends a second heating instruction to the heating device 320, and the heating device 320 energizes the second heating wire according to the second heating instruction.

[0113] Optionally, when the first preset value is -45 degrees, the second preset value may be -50 degrees.

[0114] In some embodiments, when the monitored temperature of the temperature sensor 240 is lower than the second preset value, since the second preset value is lower than the first preset value, the monitored temperature of the temperature sensor 240 is also lower than the first preset value, and the temperature adjustment module 250 controls the first heating wire and the second heating wire of the heating device 320 to be energized at the same time.

[0115] By energizing the second heating wire with a negative temperature coefficient when the monitored temperature is lower than the second preset value, the chip packaging module 200 can be heated when the monitored temperature is lower than the second preset value. During the heating process, the higher the temperature of the second heating wire, the higher the heating power and the faster the heating, so that the chip packaging module 200 can be quickly heated to the normal operating temperature when the temperature is extremely low, so that it can quickly return to the normal operating state.

[0116] In some embodiments, when the monitored temperature of the temperature sensor 240 changes from lower than the second preset value to higher than the second preset value and lower than the first preset value, the temperature adjustment module 250 sends a third heating instruction to the heating device 320, and the heating device 320 cuts off power to the second heating wire and keeps power on to the first heating wire according to the third heating instruction.

[0117] Since the higher the temperature of the first heating wire, the lower the heating power, and the slower the heating; the higher the temperature of the second heating wire, the higher the heating power, and the faster the heating, through the above method, during the heating process, when the monitored temperature changes from lower than the second preset value to higher than the second preset value and lower than the first preset value, the heating power can be reduced, and in the subsequent heating process, the heating power decreases with the increase in temperature, which can avoid damage to the chip packaging module 200 due to excessive temperature.

[0118] In some embodiments, when the monitored temperature of the temperature sensor 240 changes from below a first preset value to above a first preset value, the temperature adjustment module 250 sends a stop heating instruction to the heating device 320, and the heating device 320 cuts off power to the first heating wire according to the stop heating instruction.

[0119] In some embodiments, although the monitored temperature is higher than the first preset value, the temperature at this time is not the optimal working temperature, and the working efficiency of the chip packaging module 200 is not high, so it is necessary to heat the chip packaging module 200 to a temperature of a third preset value before stopping the heating. The third preset value is higher than the first preset value. For example, when the first preset value is -45 degrees, the third preset value can be 0 degrees.

[0120] In some embodiments, the heating device 320 stops heating the chip packaging module 200 corresponding to the temperature sensor 240 in response to receiving a stop heating instruction.

[0121] In some embodiments, when the monitored temperature of the temperature sensor 240 changes from below the third preset value to above the third preset value, the temperature adjustment module 250 sends a stop heating instruction to the heating device 320, and the heating device 320 cuts off power to the first heating wire according to the stop heating instruction.

[0122] By means of the above method, when the chip packaging module 200 is heated to a suitable temperature, the heating can be automatically stopped, thereby preventing the chip packaging module 200 from being damaged due to over-high temperature.

[0123] In some embodiments, the temperature regulating module 250 issues a periodic heating instruction to the heating device 320 , and the heating device 320 is periodically powered on and off according to the periodic heating instruction to periodically heat the chip packaging module 200 .

[0124] In this way, the heating device 320 does not need to be kept powered on for heating all the time, which can save energy consumption and can slowly heat up the chip packaging module 200 to avoid overheating the chip packaging module 200 to make it too high.

[0125] Optionally, the heating device 320 is powered on and off periodically according to the conversion cycle of the high level and the low level of the input terminal signal of the heating device 320 to periodically heat the chip packaging module 200 .

[0126] In some embodiments, the heating device 320 includes an overheating protection device. When the temperature of the heating device 320 is too high, the overheating protection device controls the heating device 320 to stop heating.

[0127] Optionally, when the temperature of the heating device 320 is higher than a fourth preset value, the overheat protection device controls the heating device 320 to be powered off.

[0128] Optionally, the overheat protection device includes a thermal fuse, which melts when the temperature is higher than a fourth preset value, thereby cutting off the electrical connection between the heating device 320 and the circuit network.

[0129] Optionally, the fourth preset value is higher than the third preset value, for example, the fourth preset value may be 30 degrees.

[0130] By adopting the above-mentioned method, it is possible to prevent the chip packaging module 200 from being damaged due to over-high temperature.

[0131] In some embodiments, during operation, the temperature of the chip packaging module 200 may be too high, and the chip packaging module 200 needs to be cooled down.

[0132] like Figure 1 As shown, in some embodiments, the plastic packaging layer 30 further includes a heat dissipation device 350 , and the heat dissipation device 350 is connected to the heat dissipation pins of the chip packaging module 200 . Figure 1 The middle pin 201 is a heat dissipation pin.

[0133] like Figure 1 As shown, optionally, in the insulating layer 310 , a heat dissipation device 350 is pre-buried in a region 330 corresponding to the chip packaging module.

[0134] Optionally, each chip packaging module 200 has a corresponding heat dissipation device 350 .

[0135] Because the heat dissipation pins of the chip packaging module 200 are usually made of metal, through the above method, the heat of the chip packaging module 200 can be quickly conducted to the heat dissipation device 350 through the heat dissipation pins. The heat dissipation device 350 has a large heat dissipation area, which can increase the heat dissipation speed of the chip packaging module 200, thereby cooling the chip packaging module 200.

[0136] Optionally, the heat dissipation device 350 does not avoid the pin area 340 corresponding to the chip packaging module 200 .

[0137] In this way, the heat dissipation device 350 has a larger heat dissipation area and can dissipate the heat conducted by the pins 201 through the insulating layer 310 , which can further improve the heat dissipation speed of the chip packaging module 200 .

[0138] In some embodiments, the heat sink 350 is connected to a heat dissipation pin of at least one chip component in the chip packaging module 200 .

[0139] Optionally, each chip element in the chip packaging module 200 has a corresponding heat dissipation device 350 .

[0140] Optionally, in the insulating layer 310 , the heat dissipation device 350 is pre-buried in a region corresponding to the chip element in the chip packaging module 200 .

[0141] Optionally, the heat dissipation device 350 does not avoid the pin regions corresponding to the chip components in the chip packaging module 200 .

[0142] In this way, the heat dissipation device 350 has a larger heat dissipation area and can conduct the heat dissipated by the pins corresponding to the chip components through the insulating layer 310 , which can further improve the heat dissipation speed of the chip components in the chip packaging module 200 .

[0143] In some embodiments, in the insulating layer 310 , the relative positions of the heating device 320 and the heat dissipation device 350 are not limited.

[0144] Optionally, the heating device 320 is closer to the chip packaging module 200 than the heat dissipation device 350 . In this way, the chip packaging module 200 can be heated by the heating device 320 .

[0145] Optionally, the heat dissipation device 350 is closer to the chip packaging module 200 than the heating device 320. In this way, the chip packaging module 200 can be cooled by the heat dissipation device 350.

[0146] Optionally, the heat dissipation device 350 includes a heat dissipation wire mesh.

[0147] Optionally, the heat dissipation device 350 includes a heat dissipation film.

[0148] Optionally, the material of the heat dissipation wire mesh or the heat dissipation film is a material with good thermal conductivity, such as copper, graphene, carbon nanotubes or metal oxides.

[0149] In some embodiments, the temperature of the chip packaging module 200 is reduced by adjusting the working state of the chip packaging module 200 corresponding to the temperature sensor 240 through the temperature adjustment module 250 .

[0150] In some embodiments, when the monitored temperature of the temperature sensor 240 is higher than a fifth preset value, the temperature adjustment module 250 controls the chip packaging module 200 corresponding to the temperature sensor 240 to reduce the reading and writing speed or stop writing data.

[0151] Optionally, the fifth preset value may be higher than 60 degrees, for example, the fifth preset value may be 60 degrees, 70 degrees, 80 degrees, 90 degrees or 100 degrees, etc.

[0152] In some embodiments, when the monitored temperature of the temperature sensor 240 is higher than the fifth preset value and lower than the sixth preset value, the temperature adjustment module 250 controls the chip packaging module 200 corresponding to the temperature sensor 240 to reduce the read and write speed, wherein the sixth preset value is higher than the fifth preset value. For example, when the fifth preset value is 60 degrees, the sixth preset value may be 90 degrees.

[0153] Optionally, if the original read / write speed is 500 Mbps, the reduced read / write speed may be 300 Mbps or 200 Mbps, etc.

[0154] In some embodiments, when the monitored temperature of the temperature sensor 240 is higher than a sixth preset value, the temperature adjustment module 250 controls the chip packaging module 200 corresponding to the temperature sensor 240 to stop writing data.

[0155] Through the above manner, when the chip packaging module 200 is overheated, the temperature of the chip packaging module 200 can be reduced to ensure the normal operation of the chip packaging module 200.

[0156] In summary, the memory chip packaging module 1 provided in the embodiment of the present application has the following advantages:

[0157] 1. In the present invention, the plastic sealing layer 30 includes a heating device 320, which can heat the chip packaging module 200, so that the memory chip packaging module 1 can still work normally when the ambient temperature is low.

[0158] 2. By setting the temperature sensor 240 and the temperature adjustment module 250 inside the chip packaging module 200 corresponding to the temperature sensor 240, there is no need to set the temperature sensor 240 and the temperature adjustment module 250 in the chip layer 20 and electrically connect them to the corresponding chip packaging module 200, which can facilitate the processing of the storage chip packaging module 1.

[0159] 3. By pre-embedding the heating mesh 321 in the insulating layer 310, firstly, it can avoid uneven heating or excessive temperature of the chip packaging module 200 due to direct contact between the heating mesh 321 and the chip packaging module 200; secondly, the insulating layer 310 can provide physical protection for the chip layer 20 and the heating mesh 321 at the same time, thereby ensuring the reliability and stability of the storage chip packaging module 1.

[0160] 4. By avoiding the pin area corresponding to the chip component by the heating screen 321, the heating screen 321 will not be too close to the pin area corresponding to the chip component. During the heating process, the pin 201 and the circuit network connected to the pin 201 can be prevented from being damaged due to excessive temperature, thereby enabling the chip component to work normally, and further enabling the storage chip packaging module 1 to work normally.

[0161] 5. The heating wire mesh 321 includes a first heating wire with a positive temperature coefficient and a second heating wire with a negative temperature coefficient. The thermal device is used to control the way in which the first heating wire and / or the second heating wire are powered on. The power supply of the first heating wire and / or the second heating wire can be flexibly controlled according to the monitored temperature, thereby preventing the storage chip packaging module 1 from being damaged due to excessive temperature and saving energy.

[0162] 6. The plastic sealing layer 310 also includes a heat dissipation device 350. The heat dissipation device 350 is connected to the heat dissipation pins of the chip packaging module 200, so that the heat of the chip packaging module 200 can be quickly transferred to the heat dissipation device 350 through the heat dissipation pins. The heat dissipation area of ​​the heat dissipation device 350 is large, which can increase the heat dissipation speed of the chip packaging module 200, thereby cooling the chip packaging module 200.

[0163] In summary, the present application provides a memory chip packaging module 1. The plastic packaging layer 30 of the present invention includes a heating device 320. The heating device 320 can heat the chip packaging module 200, so that the memory chip packaging module 1 can still work normally when the ambient temperature is low.

[0164] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A memory chip packaging module, characterized in that: include: A base layer, the base layer comprising a circuit network; A chip layer, wherein the chip layer is stacked and mounted on the base layer and is electrically connected to the circuit network, wherein the chip layer comprises at least one chip packaging module, a temperature regulating module and a temperature sensor, wherein the temperature regulating module is electrically connected to the temperature sensor, wherein the temperature sensor is used to monitor the temperature of the chip packaging module corresponding to the temperature sensor, and wherein the temperature regulating module determines whether to start the heating device according to the monitored temperature of the temperature sensor; The plastic encapsulation layer is stacked on the chip layer, and the plastic encapsulation layer includes the heating device, which is electrically connected to the temperature adjustment module and is used to heat the chip packaging module corresponding to the heating device according to the instruction of the temperature adjustment module.

2. The memory chip packaging module according to claim 1, characterized in that: The temperature sensor is arranged inside a chip packaging module corresponding to the temperature sensor; The temperature regulating module is arranged inside the chip packaging module corresponding to the temperature sensor.

3. The memory chip packaging module according to claim 1, characterized in that: The heating device comprises a heating wire mesh.

4. The memory chip packaging module according to claim 3, wherein the chip packaging module comprises at least one chip element, characterized in that: The heating wire mesh is arranged in an area corresponding to each chip element in the chip packaging module corresponding to the heating device, and the heating wire mesh avoids a pin area corresponding to the chip element.

5. The memory chip packaging module according to claim 4, characterized in that: The heating wire mesh is a thermistor with a positive temperature coefficient, and when the temperature of the heating wire mesh increases, the resistance value of the heating wire mesh increases; or The heating wire mesh is a thermistor with a negative temperature coefficient. When the temperature of the heating wire mesh increases, the resistance value of the heating wire mesh decreases.

6. The memory chip packaging module according to claim 4, characterized in that: The heating wire mesh comprises a first heating wire with a positive temperature coefficient and a second heating wire with a negative temperature coefficient, and the first heating wire and the second heating wire are mutually wound to form the heating wire mesh; The heating device is used to control the first heating wire and / or the second heating wire to be energized.

7. The memory chip packaging module according to claim 3, characterized in that: The plastic sealing layer includes an insulating layer, the heating wire mesh is pre-buried in the insulating layer, and the heating wire mesh is a single-layer structure or a stacked structure separated by the insulating layer.

8. The memory chip packaging module according to claim 1, characterized in that: The heating device comprises a heating film.

9. The memory chip packaging module according to any one of claims 1 to 8, characterized in that: The heating device comprises an overheating protection device. When the temperature of the heating device is too high, the overheating protection device controls the heating device to stop heating.

10. The memory chip packaging module according to claim 1, characterized in that: The plastic packaging layer also includes a heat dissipation device, and the heat dissipation device is connected to the heat dissipation pins of the chip packaging module.

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