FPC etching reinforcing sheet gluing process
By improving the FPC etching reinforcing sheet bonding process, the thickness difference between the reinforcing plate and the adhesive paper, as well as the filling effect of the pressed paper, allows the adhesive paper to break neatly along the edge of the reinforcing plate. This solves the deviation problem caused by the instability of precision and dimensional tolerance of laser equipment, improves product quality and inspection efficiency, and reduces labor costs and labor intensity.
Patent Information
- Application Number
- CN202411948726.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2044-12-27
AI Technical Summary
The existing FPC etching process for reinforcing sheets suffers from inconsistent laser equipment precision and reinforcing sheet dimensional tolerances, leading to adhesive stripping or overflow. This increases the workload of subsequent inspection stages and the risk of defective products, failing to meet production needs.
Through steps such as adhesive paper processing, etching, and pressing to cut the adhesive, the thickness difference between the reinforcing plate and the adhesive paper, as well as the filling effect of the pressing paper, are used to make the adhesive paper break neatly along the edge of the reinforcing plate, avoiding deviations caused by laser cutting. Acrylic release film is used to prevent adhesion and contamination, and visual inspection is carried out to ensure quality.
This solution addresses the deviation risks caused by the instability of laser equipment precision and reinforcing plate dimensional tolerances, improves product quality stability and the efficiency of manual inspection in subsequent processes, reduces labor costs and labor intensity, and achieves better quality control.
Smart Images

Figure CN119767554B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of FPC processing, in particular to an FPC etching reinforcing sheet gluing process. BACKGROUND
[0002] FPC (Flexible Printed Circuit, flexible printed circuit board) etching reinforcing sheet gluing is an important link in the FPC manufacturing process.
[0003] FPC etching reinforcing sheet is usually made of stainless steel through etching process, and is a sheet-shaped material used to strengthen the mechanical strength of FPC. It is usually pasted at a certain position or area of FPC to increase its thickness and strength, and facilitate surface-mounted parts, etc.
[0004] The existing FPC etching reinforcing sheet gluing process is to glue the etching reinforcing sheet after etching, and then use laser equipment to position and cut along the edge of the product to achieve the effect of gluing design.
[0005] However, this method is affected by the positioning and cutting precision of the laser equipment, plus the size tolerance of the etching reinforcing sheet itself, which cumulatively causes the reinforcing sheet to have glue retreat or overflow after laser cutting, increasing the labor and workload of the post-process inspection, and there is a risk of missing defective products, which cannot meet the production requirements. SUMMARY
[0006] In view of the defects of the above-mentioned prior art, the present application provides an FPC etching reinforcing sheet gluing process, which can effectively solve the deviation risk caused by the instability of laser equipment precision and reinforcing sheet size tolerance, and has stable quality, higher efficiency of manual inspection in the post-process, effectively reduces the labor cost and labor intensity, can better control the quality, and meets the production requirements.
[0007] To achieve the above-mentioned purpose, the technical solution adopted by the present application is:
[0008] The FPC etching reinforcing sheet gluing process comprises the following steps:
[0009] Step 1, prepare the substrate, prepare the reinforcing plate, etching liquid and adhesive paper;
[0010] Step 2, adhesive paper processing, process the adhesive paper to the predetermined size through the equipment;
[0011] Step 3, etching forming, etching forming the reinforcing plate to form the required shape and predetermined size;
[0012] The fourth step is to press the broken glue. The processed glue paper is attached to the etched reinforcing plate to perform false pressing to fix it. A silica gel pad is placed under the reinforcing plate, and a pressing paper is placed above the glue paper. The glue paper is broken along the edge of the reinforcing plate by the thickness difference of the glue paper and the reinforcing plate and the filling effect of the pressing paper through the roller pressing.
[0013] In the above description, as a preferred embodiment, the fourth step is followed by a fifth step of glue surface reverse film. The top of the reinforcing plate after passing through the roller is a glue surface, and the bottom is a stainless steel surface. After tearing off the bottom film of the top glue surface, a release film is covered.
[0014] In the above description, as a preferred embodiment, the fifth step is followed by a sixth step of glue paper waste removal. The reinforcing plate covered with the release film is turned over with the stainless steel surface facing up. The broken glue paper is removed.
[0015] In the above description, as a preferred embodiment, the sixth step is followed by a seventh step of steel surface reverse film. After the glue paper is removed, the stainless steel surface is covered with a release film again. The reinforcing plate is turned over again with the glue surface facing up, and the release film covered by the glue surface is torn off.
[0016] In the above description, as a preferred embodiment, the seventh step is followed by an eighth step of inspection. The inspection is performed by visual inspection. The glue surface is free of foreign matter, dirt, and bright edges, which are OK products.
[0017] In the above description, as a preferred embodiment, in the second step, the glue paper processing includes:
[0018] Glue paper striping. The glue paper is striping by a striping machine to process the predetermined width size.
[0019] Glue paper cutting. The striping glue paper is cut by a die-cutting machine to process the predetermined length size.
[0020] In the above description, as a preferred embodiment, the striping machine is a peeling and attaching round knife striping machine, and the die-cutting machine is a high-speed precision die-cutting machine.
[0021] In the above description, as a preferred embodiment, the release film in the fifth step and the seventh step is a Teflon release film.
[0022] In the above description, as a preferred embodiment, the glue paper is a conductive glue paper.
[0023] The beneficial effects generated by the present application are: after the processed adhesive paper is attached to the etched reinforcing plate, false pressure bonding is carried out to fix it, a silica gel pad is placed below the reinforcing plate, and a pressure bonding paper is placed above the adhesive paper, and then the adhesive paper is cut along the edge of the reinforcing plate by using the thickness difference of the reinforcing plate and the adhesive paper and the filling effect of the pressure bonding paper, so that the deviation risk caused by the instability of the precision of the laser equipment and the size tolerance of the reinforcing plate can be effectively solved, the carbonization phenomenon caused by laser cutting at the edge of the adhesive paper is avoided, the quality is stable, the manual inspection efficiency of the later work section is higher, the labor cost and labor intensity are effectively reduced, the quality control can be better, and the production demand can be met. BRIEF DESCRIPTION OF DRAWINGS
[0024] Figure 1 : Process schematic diagram of the embodiment of the present application; DETAILED DESCRIPTION
[0025] In order to more clearly illustrate the structural features, technical means and specific purposes and functions achieved by the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments:
[0026] The present embodiment: as shown in the FPC etching reinforcing sheet gluing process, the following steps are included: Figure 1
[0027] First step, prepare the substrate, prepare the reinforcing plate, etching liquid and adhesive paper, the reinforcing plate is made of stainless steel sheet, and the adhesive paper is conductive adhesive paper;
[0028] Second step, adhesive paper processing, the adhesive paper is processed to a predetermined size by the equipment, and the adhesive paper processing includes:
[0029] Adhesive paper slitting, the adhesive paper is slitted by a slitting machine, the slitting machine is a peeling and bonding circular knife slitting machine, and a predetermined width size is processed, and the width size is synchronous with the width size of the overall layout of the etched stainless steel sheet;
[0030] Adhesive paper cutting, the slitted adhesive paper is cut by a die-cutting machine, the die-cutting machine is a high-speed precision die-cutting machine, and a predetermined length size is cut, and the length size is synchronous with the length size of the overall layout of the etched stainless steel sheet;
[0031] Third step, etching forming, a layer of photosensitive material is coated on the surface of the stainless steel sheet, the coated photosensitive material is exposed to ultraviolet light, the photosensitive material absorbs light energy, undergoes a chemical reaction, and forms a corrosion-resistant protective film, the exposed stainless steel sheet is developed to remove the unexposed photosensitive material and expose the metal part to be etched, and the metal is corroded by using an etching liquid to form the required shape and predetermined size;
[0032] Step 4, Adhesive Cutting: The processed adhesive tape is adhered to the etched reinforcing plate and subjected to a sham pressing to fix it in place. A silicone pad is placed under the reinforcing plate to buffer and evenly distribute the pressure. A pressing paper with a certain thickness and hardness is placed on top of the adhesive tape to fill the gaps during the pressing process and help break the adhesive tape. The adhesive cutting is performed by using rollers to gradually apply pressure and move along the edge of the reinforcing plate. Due to the thickness difference between the reinforcing plate and the adhesive tape, coupled with the filling effect of the pressing paper, the adhesive tape will be squeezed and broken at the edge of the reinforcing plate, completing the adhesive cutting. This method utilizes the thickness difference and the help of the pressing paper to achieve a neat break of the adhesive tape at the edge of the reinforcing plate, improving the appearance quality and performance of the product. It can effectively solve the deviation risk caused by the instability of the precision of the laser equipment and the dimensional tolerance of the reinforcing plate, and avoid the carbonization phenomenon of the adhesive tape edge caused by laser cutting. The quality is stable, the efficiency of manual inspection in the later stage is higher, effectively reducing labor costs and labor intensity, and allowing for better quality control.
[0033] Step 5: Reverse film application. The reinforcing plate after passing through the rollers has an adhesive surface on top and a stainless steel surface on the bottom. After peeling off the bottom film of the adhesive surface, cover it with an acrylic release film. The acrylic release film has good high temperature resistance and a smooth surface, which can effectively prevent the adhesive surface from sticking or contaminating during subsequent processing.
[0034] Step 6: Remove excess adhesive tape. Turn the reinforcing plate covered with acrylic release film over so that the stainless steel side is facing up. Remove excess adhesive tape and any unwanted parts from the tape after the adhesive has broken. This can be done mechanically or manually.
[0035] Step 7: After removing the adhesive tape and waste from the stainless steel surface, cover the stainless steel surface with another layer of acrylic release film. At the same time, flip it over again so that the adhesive side is facing up, and peel off the acrylic release film covering the adhesive side to expose the adhesive side.
[0036] Step 8: Inspection. The product is considered OK if there are no foreign objects or dirt on the adhesive surface and no shiny edges.
[0037] This invention utilizes the thickness difference between the reinforcing plate and the adhesive tape, along with the filling effect of the pressed paper, to allow the adhesive tape to break along the edge of the reinforcing plate. This effectively solves the deviation risk caused by the instability of the precision of the laser equipment and the dimensional tolerance of the reinforcing plate, and avoids the carbonization phenomenon on the edge of the adhesive tape caused by laser cutting. The quality is stable, the efficiency of manual inspection in the later stages is higher, the labor cost and labor intensity are effectively reduced, and the quality control can be better carried out to meet production needs.
[0038] The above merely describes preferred embodiments of the present application, and is not intended to limit the present application, and any modification, equivalent replacement, improvement, etc. made to the above embodiments according to the technical solutions of the present application shall still fall within the scope of the technical solutions of the present application.
Claims
1. A FPC etching reinforcing sheet collation process, characterized by, The method comprises the following steps: First step, preparing the substrate, preparing the reinforcing plate, etching liquid and adhesive tape; Second step, adhesive tape processing, processing the adhesive tape to the predetermined size through the equipment; Third step, etching forming, etching forming the reinforcing plate to form the required shape and predetermined size; Fourth step, press-off, sticking the processed adhesive tape on the etching formed reinforcing plate, performing false press-off to fix it, placing the silica gel pad under the reinforcing plate, placing the press-off paper above the adhesive tape, and press-off through the roller, using the thickness difference of the reinforcing plate and the adhesive tape and the filling effect of the press-off paper to make the adhesive tape break along the edge of the reinforcing plate.
2. The FPC etching reinforcement sheet collation process of claim 1, wherein: The fourth step further comprises a fifth step, adhesive surface reverse film, the top of the reinforcing plate passing through the roller is the adhesive surface and the bottom is the stainless steel surface, after tearing off the bottom film of the adhesive surface, covering a layer of release film.
3. The FPC etching reinforcement sheet collation process of claim 2, wherein: The fifth step further comprises a sixth step, adhesive tape waste removal, turning over the reinforcing plate covered with the release film to make the stainless steel surface face up, and removing the waste adhesive tape after breaking.
4. The FPC etching reinforcement sheet collation process of claim 3, wherein: The sixth step further comprises a seventh step, steel surface reverse film, covering a layer of release film on the stainless steel surface after removing the waste adhesive tape, and turning over again to make the adhesive surface face up and tearing off the release film covered by the adhesive surface.
5. The FPC etching reinforcement sheet collation process of claim 4, wherein: The seventh step further comprises an eighth step, inspection, inspecting by visual inspection, and the OK product is the adhesive surface without foreign matter, dirt and bright edge.
6. The FPC etching reinforcement sheet collation process of claim 1, wherein: In the second step, the adhesive tape processing comprises: Adhesive tape slitting, slitting the adhesive tape through the slitting machine to process the predetermined width size; Adhesive tape breaking, breaking the slitted adhesive tape through the die-cutting machine to cut the predetermined length size.
7. The FPC etching reinforcement sheet collation process of claim 6, wherein: The slitting machine adopts a peeling and bonding circular knife slitting machine, and the die-cutting machine adopts a high-speed precision die-cutting machine.
8. The FPC etching reinforcement sheet collation process of claim 4, wherein: The release film in the fifth step and the seventh step is all Aliko release film.
9. The FPC etching reinforcement sheet collation process of claim 1, wherein: The adhesive tape is conductive adhesive tape.
Citation Information
Patent Citations
Stamping die for 5G chip circuit board three-dimensional steel reinforcing adhesive tape and processing technology of 5G chip circuit board three-dimensional steel reinforcing adhesive tape
CN114393096A
Flexible line way board laminating tool
CN204887727U