Connector with contact support structure

Abstract

Aspects of a connector with a contact support structure are described herein. An example connector includes: a base; the sheet body assembly comprises a terminal strip and a sheet body molding and forming plug-in unit; and a sheet assembly support strip. The terminal strip includes a plurality of terminal conductors. The sheet assembly support strip includes a terminal seating surface, a reference surface, and a molded interlock. A terminal conductor of the plurality of terminal conductors is electrically coupled to the terminal seating surface, and the sheet molded insert is molded and extends into the molded interlock to fasten the terminal strip relative to the reference surface. As a result, the terminal strip, the support strip, and the sheet molded insert are fastened together. The support strip provides additional strength, a higher modulus of elasticity, and thermal stability compared to other designs.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Provisional Application No. 63 / 406,264, filed on September 14, 2022, the contents of which are incorporated by reference in their entirety. Background Art

[0003] A range of input / output (I / O) connectors are designed for power, data, and power and data interconnect systems, including board-to-board systems, wire-to-wire systems, and wire-to-board systems. There are various designs for various types of systems, depending on the requirements of the power and data communication environment in which the connector is used. As an example, a wire-to-board system includes a free-end connector attached to a wire and a fixed-end connector attached to a board.

[0004] As an example, designing interconnect system connectors for high data rate applications where physical space is constrained can be challenging due to many competing concerns. High data rate interconnect systems often rely on differentially coupled signal pairs, in which two conductors are arranged as a pair to transmit a differential signal. The signal being transmitted is reflected by the electrical difference measured between the conductor pairs. Differential signaling can help avoid parasitic signals and crosstalk and avoid unintentional signaling modes between adjacent signal pairs. In the connector interface, ground terminals can be relied upon to create a return path for electrical grounding, to provide shielding between differential pairs, and for other purposes.

[0005] The connector used in high data rate applications is typically designed to meet a series of mechanical and electrical requirements. As an example, high data rate connectors are often used in backplane applications that require very high conductor density and data rate. In order to achieve the required mechanical and electrical requirements, connectors used in such applications are often incorporated with one or more wafer assemblies. The wafer assembly may include an insulating web supporting the terminal conductors in the wafer assembly. The use of a wafer assembly can help to utilize many different assembly processes to manufacture connectors that can achieve high data rates. In any case, it is still challenging to design a wafer that has the conductor density and small pin arrangement required for high data rate applications in new systems while also maintaining the electrical characteristics desired for the transmission of data under integrity. Summary of the invention

[0006] Aspects of a connector with a contact support structure are described. An example connector includes: a base; a wafer assembly including a terminal row and a wafer molded insert; and a wafer assembly support strip. The terminal row includes a plurality of terminal conductors. The wafer assembly support strip includes a terminal seating surface, a reference surface, and a molded interlock. A terminal conductor of the plurality of terminal conductors is electrically connected to the terminal seating surface, and the wafer molded insert is molded and extends into the molded interlock to secure the terminal row relative to the reference surface. Thus, the terminal row is secured to the support strip and the wafer molded insert. The support strip provides additional strength, a higher elastic modulus, and thermal stability compared to other designs. In other aspects of various embodiments, the wafer assembly support strip is embodied or formed of metal, and the wafer molded insert is embodied or formed of plastic. The wafer assembly support strip includes a first arm, a second arm, and an extension strip extending between the first arm and the second arm. The first arm and the second arm define two sides of a front port opening of the connector. The extension strip of the wafer assembly support strip includes the molded interlocking member, and at least one of the first arm and the second arm includes the reference surface.

[0007] In other aspects, the plurality of terminal conductors include a plurality of ground conductors and a plurality of signal conductors, the wafer assembly support strip includes a plurality of terminal placement surfaces, and each of the plurality of ground conductors is electrically connected to a respective terminal placement surface of the plurality of terminal placement surfaces. The wafer assembly support strip also includes a terminal recess located between a pair of terminal placement surfaces of the plurality of terminal placement surfaces. A pair of signal conductors of the plurality of signal conductors extend through the terminal recess of the wafer assembly support strip and are surrounded by the wafer molded insert.

[0008] In other aspects of multiple embodiments, the connector includes a ground path assembly. The ground path assembly includes a ground channel block, and the ground channel block includes a plurality of channels. A pair of signal conductors among the plurality of terminal conductors extend along a channel among the plurality of channels. In one example, the ground channel block includes a metal plating layer on a plastic body. In other aspects, the ground channel block includes a plurality of grounding ribs for surface mounting at a terminal foot of the connector. The channel extends between a pair of grounding ribs among the plurality of grounding ribs at the terminal foot of the connector. On the other hand, the ground channel block includes a grounding strip extending between the plurality of grounding ribs of the ground channel block and electrically connected to the plurality of grounding ribs of the ground channel block. In one example, the plurality of grounding ribs are formed integrally with the ground channel block ribs.

[0009] In another example, the ground channel block includes a metal plating layer on a plastic body, and the plurality of grounding ribs are independent of the ground channel block and formed of metal. In other aspects, the ground path assembly also includes a ground platform frame, and the main surface of the ground platform frame extends in a plane extending parallel to the main surface of the plurality of grounding ribs at a terminal foot of the connector.

[0010] Another example connector includes: a wafer assembly including a terminal row and a wafer molded insert; and a wafer assembly support strip. The wafer assembly support strip includes a molded interlock, and the wafer molded insert is molded into and extends into the molded interlock of the wafer assembly support strip. In one example, the wafer assembly support strip includes a terminal placement surface, and a ground conductor of the terminal row is electrically connected to the terminal placement surface of the wafer assembly support strip. In one example, the wafer assembly support strip includes a first arm, a second arm, and an extension strip extending between the first arm and the second arm, and the first arm and the second arm define two sides of a front port opening of the connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Many aspects of the present disclosure may be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, but emphasis is placed on clearly illustrating the principles of the present disclosure. In addition, in the drawings, similar reference numerals throughout the several views represent corresponding parts.

[0012] Figure 1 A perspective view of an example connector according to various embodiments of the present disclosure is shown.

[0013] Figure 2 The various embodiments of the present disclosure are shown Figure 1 A front perspective view of the connector is shown with the base omitted.

[0014] Figure 3 The various embodiments of the present disclosure are shown Figure 1 A rear perspective view of the connector is shown with the base omitted.

[0015] Figure 4 The various embodiments of the present disclosure are shown Figure 1 The two support bars of the connector are shown.

[0016] Figure 5 Show Figure 4 An AA cutaway view of a support strip is shown.

[0017] Figure 6 In various embodiments according to the present disclosure, Figure 1 A detail view of the two support bars and two terminal rows at one side of the connector is shown.

[0018] Figure 7 The various embodiments of the present disclosure are shown Figure 1 A detail view of a terminal block and laminate molded insert of the connector is shown.

[0019] Figure 8 Show Figure 7 Another detail of the terminal block is shown, with the laminate molding insert omitted.

[0020] Fig. 9 The various embodiments of the present disclosure are shown Figure 1 A top perspective view of a terminal block and a laminate molded insert in a connector is shown.

[0021] Fig.10 The various embodiments of the present disclosure are shown Figure 1 A bottom perspective view of a terminal block and laminate molded insert in the connector is shown.

[0022] Fig.11 The various embodiments of the present disclosure are shown Figure 1 A top perspective view of a terminal block and a laminate molded insert in a connector is shown.

[0023] Fig.12 The various embodiments of the present disclosure are shown Figure 1 A bottom perspective view of a terminal block and laminate molded insert in the connector is shown.

[0024] Fig.13 The various embodiments of the present disclosure are shown Figure 1 A front perspective view of a ground channel block in a connector is shown.

[0025] Fig.14 The various embodiments of the present disclosure are shown Figure 1 A rear perspective view of a ground channel block in a connector is shown.

[0026] Fig.15 The various embodiments of the present disclosure are shown Figure 1 A front perspective view of a ground frame in the connector is shown.

[0027] Fig.16 The various embodiments of the present disclosure are shown Figure 1 A rear perspective view of the ground frame in the connector is shown.

[0028] Fig.17 The various embodiments of the present disclosure are shown Figure 1 A rear perspective view of the ground frame in the connector is shown.

[0029] Fig.18 The various embodiments of the present disclosure are shown Figure 1 A perspective view of a terminal foot of the connector shown.

[0030] Fig.19 The various embodiments of the present disclosure are shown Figure 1 A side view of the ground rib of the connector is shown.

[0031] Fig. 20 A side view of a ground rib in other forms according to various embodiments of the present disclosure is shown.

[0032] Fig.21 A connector with grounding ribs and a grounding platform frame according to various embodiments of the present disclosure is shown.

[0033] Fig. 22 A side view of a metal rib insert is shown in accordance with various embodiments of the present disclosure.

[0034] Fig.23 A top view of a ground platform frame according to various embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0035] The connector used in high data rate applications is typically designed to meet a series of mechanical and electrical requirements. As an example, high data rate connectors are often used in backplane applications that require very high conductor density and data rate. In order to achieve the required mechanical and electrical requirements, connectors used in such applications are often incorporated with one or more wafer assemblies. The wafer assembly may include an insulating web supporting the terminal conductors in the wafer assembly. The use of a wafer assembly can help to utilize a series of different assembly processes to manufacture connectors that can achieve high data rates. In any case, it is still challenging to design a wafer and connector that has the conductor density and small pin arrangement required for high data rate applications in new systems while also maintaining the electrical characteristics desired for the transmission of data under integrity.

[0036] In the sections summarized above, various aspects and multiple embodiments of connectors with contact support structures and other features are described herein. An example connector includes: a base; a wafer assembly including a terminal row and a wafer molded insert; and a wafer assembly support strip. The terminal row includes a plurality of terminal conductors. The wafer assembly support strip includes a terminal placement surface, a reference surface, and a molded interlocking piece. A terminal conductor of the plurality of terminal conductors is electrically connected to the terminal placement surface, and the wafer molded insert is molded and extends into the molded interlocking piece to secure the terminal row relative to the reference surface. Thus, the terminal row is secured together with the support strip and the wafer molded insert. Compared to other designs, the support strip provides additional strength, a higher elastic modulus, and thermal stability.

[0037] Turning to the attached figure, Figure 1 A perspective view of an example connector 10 according to various embodiments of the present disclosure is shown. Connector 10 is shown as a representative example and is not drawn to any particular scale or size. The shape, size, ratio, and other characteristics of connector 10 can vary compared to what is shown. For example, connector 10 can accommodate more or fewer rows of terminals (e.g., connector 10 is wider or narrower), and other variations are within the scope of the examples described herein. For higher data rate interconnections, many connectors similar to connector 10 can be stacked or arranged side by side. In addition, in some cases, one or more of the parts or components of connector 10 as shown and described herein can be omitted. Connector 10 can also include other parts or components not shown.

[0038] The connector 10 includes a front port opening 12 and a terminal foot 13. The connector 10 is designed to establish and maintain electrical connection with a contact on a free end interface of a cable assembly. For example, a printed circuit board (PCB) style interface of an Octal Small Form Factor Pluggable (OSFP), a Quad Small Form Factor Pluggable (QSFP) or similar cable assembly can be inserted into the front port opening 12 of the connector 10.

[0039] The connector 10 includes rows of terminal conductors extending from a front port opening 12 to terminal pins 13 for data signals to communicate on the conductors. The connector 10 is designed to provide shielding and maintain signal integrity for differential signals on the terminal conductors as the terminal conductors extend from the front port opening 12 to the terminal pins 13. The connector 10 can be designed for use with an OSFP, QSFP, or related interconnection system, but the concepts described herein are not limited to use with any particular type or style of interconnection system. In addition, the terminal pins 13 of the connector 10 can be designed as a surface mount technology (SMT) pin for connection to a surface of a larger substrate or component, but, in some cases, the connector 10 can also be designed to have through-hole leads or other head styles at the terminal pins 13.

[0040] like Figure 1 As shown, the connector includes a base 100, two support strips 220, 320 and two terminal rows 210, 310 located in the opening 12. In one example, the base 100 can be formed of a plastic or other insulating material, but in some cases, the base can also be formed of a metal or a combination of insulating material and conductive material. The base includes a front port 110, a bottom mounting surface 120 and a plurality of mounting posts 122, 124. In one example, the connector 10 is suitable for receiving an OSFP, QSFP or related type of PCB style end of a cable system. The PCB style end of the cable system can be assembled into the opening 12 of the connector. When inserted, the terminal rows 210, 310 of the base 100, including the terminal conductors 211, 311, etc., will be seated on the contacts on the top and bottom surfaces of the PCB style end and make electrical contact with them.

[0041] The alignment and positioning of the terminal conductors within the connector 10 is particularly important. The mechanical compliance and robustness of the terminal conductors in the terminal rows 210, 310 within the base 100 should be consistent with each other across the terminal rows 210, 310. It can be difficult to design a connector with a terminal row that does not vary in mechanical robustness, bend or buckle at the center (or other locations), or exhibit other mechanical or electrical variations, especially when the terminal row is wider. In addition, when the connector 10 is mounted to the surface of a larger substrate or assembly, it is often done with heat, and the application of heat can cause the inner laminate molded supports within the connector 10 to relax, which can sometimes change the mechanical or electrical properties of the terminal conductors.

[0042] In the section summarized above, the connector 10 includes two support bars 220, 320. The two support bars 220, 320 are formed of a material that is relatively rigid even when heated and has a high elastic modulus. In multiple other examples described herein, the two support bars 220, 320 can be formed of a rigid and thermally stable metal or metal alloy such as aluminum, copper or another metal. The wafer assembly within the connector 10 can be molded into the molded interlocking parts of the support bars 220, 320, and the terminal conductors can be mechanically and electrically fastened (such as soldered or welded) to the terminal mounting surfaces on the support bars 220, 320. As a result, the wafer assembly can be mechanically and electrically integrated with the support bars 220, 320 to provide additional strength and dimensional accuracy to the terminal row in the wafer assembly. The support bars 220, 320 thereby provide a common electrical path between the ground terminals in the terminal row.

[0043] In addition, if Figure 1 As shown, the two ends of the two support strips 220, 320 define the two sides of the opening 12 in the connector. In that arrangement, the surfaces at the two ends of the two support strips 220, 320 provide datum surfaces, and the position of the terminal conductor relative to the datum surfaces can be manufactured with better accuracy. The position can be maintained even under mechanical stress and thermal cycles. The PCB style end of the cable system can be assembled into the opening 12 of the connector 10, and based on the contact with the datum surfaces of the two support strips 220, 320, the terminal row alignment with the conductor in the base 100 can be found. These and other features of the base 100 will be described in additional detail later.

[0044] Figure 2 Show Figure 1 A front perspective view of the connector 10 is shown, wherein the base 100 is omitted from this view, and Figure 3 A rear perspective view of the connector 10 is shown. In the base 100, the connector 10 includes a first or upper wafer assembly 200, a second or lower wafer assembly 300, two support bars 220, 320 and a plurality of ground path assemblies. These components of the connector 10 are first described with reference to Figure 2 and Figure 3 Detailed views of these components are shown in the following Figures 4 to 19 To explain.

[0045] The wafer assembly 200 includes a terminal row 210, two flexible shields 230, 231 and two wafer molded inserts 240, 250 and other possible components. Together with the support bar 220, the wafer assembly 200 supports, spaces and aligns the terminal conductors in the terminal row 210. The connector 10 also includes a ground path assembly for the wafer assembly 200. The ground path assembly for the wafer assembly 200 includes upper ground channel blocks 400A, 400B and lower ground channel blocks 450A, 450B. Blocks 400A, 400B, 450A, 450B are also shown separately in Fig.13 and Fig.14 The ground path assembly further includes ground frames 410A, 410B for the upper ground channel blocks 400A, 400B, and ground frames 460A, 460B for the lower ground channel blocks 450A, 450B, respectively. The ground frames 410A, 410B, 460A, 460B are also shown separately in FIG. Figures 15 to 17 middle.

[0046] The terminal row 210 includes a signal conductor, a power conductor, and a ground conductor. The signal conductor and the power conductor in the terminal row 210 are each included at a distal end (ie, at the front port opening 12 of the connector 10, such as Figure 1 The terminal row 210 includes a head contact at the front end (shown), a tail contact at the other distal end (i.e., at the terminal foot 13), and a conductor bend between the head contact and the tail contact. The signal conductors and the power conductors in the terminal row 210 are electrically isolated from each other in the connector 10. The signal conductors and the power conductors start from the head contact at the front port opening 12 and extend to the tail contact at the terminal foot 13 of the connector 10. The tail contacts of the signal conductors and the power conductors can be formed with SMT tail contacts as in the example shown or with a through-hole type or other type of contact.

[0047] The ground conductors in the terminal block 210 each include a head contact at one distal end and a tail contact at the other distal end. The ground conductors extend from the head contact within the front port opening 12 to contact points on a ground path assembly for the wafer assembly 200, which will also be described later. The ground path assembly includes a plurality of ground ribs or fins for surface mounting to a substrate at the terminal foot 13. Additional views of the terminal block 210 are provided in Fig. 9 and Fig.10 middle.

[0048] The terminal row 210 can be formed from a flat sheet of metal (e.g., stamped, sheared, or otherwise formed). In some cases, the sheet of metal can be plated with one or more plated metals. The two sheet molded inserts 240, 250 can be formed from a plastic such as a liquid crystal polymer (LCP) or other insulating material and molded around the terminal conductors in the terminal row 210. The two sheet molded inserts 240, 250 are spaced apart from each other along the length of the terminal conductors in the terminal row 210, and a bend is formed in the terminal row 210 between the two sheet molded inserts 240, 250.

[0049] The two flexible shields 230, 231 can be formed from a flat sheet of metal (e.g., stamped, sheared, or otherwise formed) and in some cases plated. The two flexible shields 230, 231 are fastened to a top surface of a ground conductor in the terminal block 210 by mechanical interference within an opening through which the ground conductor passes. The two flexible shields 230, 231 span over (but do not contact) the signal conductors in the terminal block 210 to provide shielding for the signal conductors. The two flexible shields 230, 231 provide additional support for the ground conductors in the terminal block 210 and shield the signal conductors in the terminal block 210 to maintain an electrical ground connection and maintain data signal integrity. Although in Figure 2 Not seen in FIG. 3 , but the terminal block 310 also includes two flexible shielding members.

[0050] In one example, upper ground channel blocks 400A, 400B and lower ground channel blocks 450A, 450B can be formed with insulating blocks or insulators covered with one or more plated metals. As an example, blocks 400A, 400B, 450A, 450B can be formed of LCP, polyethylene (PE), polytetrafluoroethylene (PTFE), conductive PE or PTFE, fluoropolymers or other plastics or insulating materials. Blocks 400A, 400B, 450A, 450B can be plated with a metal or multiple metals of tin, gold or other plating. In other cases, ground channel blocks 400A, 400B can be formed of metals or other conductive materials with or without plating. The signal conductors of terminal row 210 extend in the channels formed in blocks 400A, 400B, 450A, 450B, which helps prevent signal crosstalk and interference between the signal conductors of terminal row 210. The lower ground channel blocks 450A and 450B include a plurality of ground ribs, including ground ribs 451A and 452A of block 450A and ground ribs 451B and 451B of block 450B, etc. Figure 3 shown.

[0051] Reference Figure 3, the ground channel block 450A includes a grounding strip 456A, and the ground channel block 450B includes a grounding strip 456B. The two grounding strips 456A, 456B can be formed of a metal or metal alloy such as aluminum, copper, zinc, stainless steel or other metals, and in some cases can be plated with one or more plated metals. The grounding strip 456A extends between the grounding ribs of the ground channel block 450A and is electrically connected to the grounding ribs of the ground channel block 450A for ground communication and maintaining a common voltage potential between the grounding ribs. Similarly, the grounding strip 456B extends between the grounding ribs of the ground channel block 450B and is electrically connected to the grounding ribs of the ground channel block 450B for ground communication and maintaining a common voltage potential between the grounding ribs. Several other aspects of the ground path assembly for the wafer assembly 300 will be described later.

[0052] The two sheet molded inserts 240, 250 are molded or otherwise formed around the terminal row 210. Before the two sheet molded inserts 240, 250 are formed, one or more of the grounding conductors in the terminal row 210 can be mechanically and electrically fastened (e.g., soldered, welded, bonded, etc.) to the terminal placement surface of the support bar 220. The terminal row 210 and the support bar 220 can then be inserted into a mold fixture, and the LCP or another insulating material can be injected into the mold. The insulating material forms the two sheet molded inserts 240, 250 around the terminal row 210, and the insulating material also flows into the molded interlocking parts molded into the support bar 220. The sheet molded insert 240 is thereby anchored and fastened to the support bar 220.

[0053] For example, Figure 2 and Figure 3 How the material of the thin sheet molded plug-in 240 is shown to extend into an interlocking opening 222A of the support bar 220 to form an interlocking plug 241. The support bar 220 includes many interlocking openings, and the thin sheet molded plug-in 240 extends through each interlocking opening to form many interlocking plugs. In that way, the terminal row 210 is fastened together with the support bar 220 and the thin sheet molded plug-in 240. Compared with other designs, the support bar 220 provides additional strength, a higher elastic modulus and better thermal stability. The support bar 220 also provides the additional benefits described herein. Other aspects of the arrangement of the terminal row 210, the support bar 220 and the thin sheet molded plug-in 240 will be described below.

[0054] In addition to other possible components, the wafer assembly 300 includes a terminal block 310, two flexible shielding members ( Figure 2 and Figure 3The wafer assembly 300 includes a plurality of wafer molded inserts 340, 350. Together with the support bar 320, the wafer assembly 300 supports, spaces and aligns the terminal conductors in the terminal row 310. The connector 10 also includes a ground path assembly for the wafer assembly 300. The ground path assembly for the wafer assembly 300 includes upper ground channel blocks 500A, 500B and lower ground channel blocks 550A, 550B. Blocks 500A, 500B, 550A, 550B are also shown separately in FIG. Fig.13 and Fig.14 The ground path assembly further includes ground frames 510A, 510B for the upper ground channel blocks 500A, 500B, and ground frames 560A, 560B for the lower ground channel blocks 550A, 550B, respectively. The ground frames 510A, 510B, 560A, 560B are also shown separately in FIG. Figures 15 to 17 middle.

[0055] The terminal row 310 includes a signal conductor, a power conductor, and a ground conductor. The signal conductor and the power conductor in the terminal row 310 are each included at a distal end (ie, at the front port opening 12 of the connector 10, such as Figure 1 The terminal row 310 includes a head contact at the other distal end (shown), a tail contact at the other distal end (i.e., located at the terminal foot 13), and a conductor bend between the head contact and the tail contact. The signal conductors and the power conductors in the terminal row 310 are electrically isolated from each other in the connector 10. The signal conductors and the power conductors extend from the head contact at the front port opening 12 to the tail contact at the terminal foot 13 of the connector 10. As an example, the signal conductor 312 extends from a head contact 312L end at the front port opening 12 to a tail contact 312T end at the terminal foot 13. The tail contacts of the signal conductors and the power conductors can be formed with SMT tail contacts as in the example shown or with perforations or other types of contacts.

[0056] The ground conductors in the terminal block 310 each include a head contact at one distal end and a tail contact at the other distal end. The ground conductors extend from the head contact within the front port opening 12 to a contact point on a ground path assembly for the wafer assembly 300, which will also be described later. The ground path assembly includes a plurality of ground ribs or fins for surface mounting to a board at the terminal foot 13. Additional views of the terminal block 210 are provided in Fig. 9 and Fig.10 middle.

[0057] The terminal row 310 can be formed from a flat sheet of metal (e.g., stamped, sheared, or otherwise formed). In some cases, the sheet of metal can be plated with one or more plating metals. The two sheet molded inserts 340, 350 can be formed from a plastic such as LCP or other insulating material and are molded around the terminal conductors in the terminal row 310. The two sheet molded inserts 340, 350 are spaced apart from each other along the length of the terminal conductors in the terminal row 310, and a bend is formed in the terminal row 310 between the sheet molded inserts 340, 350.

[0058] In one example, the upper ground channel blocks 500A, 500B and the lower ground channel blocks 550A, 550B can be formed of plastic blocks covered with one or more plated metals, however, the blocks can also be formed of metal or other conductive materials. As an example, the blocks 500A, 500B, 550A, 550B can be formed of LCP, PE, PTFE, conductive PE or PTFE, fluoropolymers or other plastic or insulating materials. The signal conductors of the terminal block 310 extend within the channels formed in the blocks 500A, 500B, 550A, 550B, which helps prevent signal crosstalk and interference between the signal conductors of the terminal block 310. The two ground channel blocks 550A, 550B include grounding ribs. As an example, the ground channel block 550A includes grounding ribs 551A, 552A, etc., while the ground channel block 550B includes grounding ribs 551B, 552B, etc., as shown in FIG. Figure 2 shown.

[0059] Reference Figure 2 , the ground channel block 550A includes a grounding strip 556A, and the ground channel block 550B includes a grounding strip 556B. The two grounding strips 556A, 556B can be formed of a metal or metal alloy such as aluminum, copper, zinc, stainless steel or other metals, and can be plated with one or more plated metals in some cases. The grounding strip 556A extends between the grounding ribs of the ground channel block 550A and is electrically connected to the grounding ribs of the ground channel block 550A for grounding communication and maintaining a common potential between the grounding ribs. Similarly, the grounding strip 556B extends between the grounding ribs of the ground channel block 550B and is electrically connected to the grounding ribs of the ground channel block 550B for grounding communication and maintaining a common potential between the grounding ribs. Multiple other aspects of the ground path assembly for the wafer assembly 300 will be described later.

[0060] The two sheet molded inserts 340, 350 are molded or otherwise formed around the terminal block 310. Before the two sheet molded inserts 340, 350 are formed, one or more of the ground conductors in the terminal block 310 can be electrically and mechanically fastened (e.g., soldered, welded, bonded, etc.) to the mounting surface of the terminal support strip 320. When the sheet molded insert 340 is molded, the insulating material of the sheet molded insert 340 flows into the molded interlocking pieces of the support strip 320 to anchor and fasten the sheet molded insert 340 to the support strip 320. This is similar to how the sheet molded insert 240 is anchored to the support strip 220. In that manner, the terminal block 310 is fastened to the support strip 320 and the sheet molded insert 340. The support strip 320 provides additional strength, a higher modulus of elasticity, and thermal stability compared to other designs. The support bar 320 also provides additional benefits described herein. The arrangement of the terminal block 310, support bar 320 and other aspects of the thin film molded insert 340 will be described later.

[0061] Figure 4 The two support strips 220, 320 are shown separated from each other, wherein all other components of the connector 10 are omitted from this view. The two support strips 220, 320 are shown as a representative example. Figure 4 . The size, shape, and style of the two support bars 220, 320 can vary from that shown. For example, the number and location of interlocking features, terminal placement surfaces, and other features of the two support bars 220, 320 can vary relative to that shown. The two support bars 220, 320 can be formed from a metal such as aluminum, copper, zinc, stainless steel, or other metal or metal alloy that is relatively rigid even when heated and has a high modulus of elasticity. The two support bars 220, 320 are preferably formed from a material having a higher rigidity and modulus of elasticity than the sheet molded inserts 240, 250, 340, 350. The two support bars 220, 320 can be molded, machined, or formed by other suitable manufacturing techniques. In some cases, the two support bars 220, 320 can also be plated with one or more metals.

[0062] exist Figure 4In the example shown, the two support bars 220, 320 are formed to have the same shape and size, and the support bar 320 is rotated 180° relative to the support bar 220 along the axis "B". Thus, the two support bars 220, 320 are exactly the same as each other and can serve as a source of multiple identical parts or components to reduce cost, complexity and tooling requirements. However, in other cases, the two support bars 220, 320 can differ from each other in size, shape, or both size and shape, as well as other aspects. The support bar 220 includes a first or right end arm 220A, a second or left end arm 220B and an extension bar 220C. The extension bar 220C extends between the two arms 220A, 220B. The right end arm 220A and the left end arm 220B include interlocking features 221A, 221B that are complementary in shape, respectively. In the arrangement shown, the interlocking features of support strip 220 correspond and abut the interlocking features of support strip 320 so that the two support strips 220, 320 will be placed and aligned together in connector 10. The two arms 220A, 220B of support strip 220 and the two arms of support strip 320 define two sides of the front port opening 12 of connector 10.

[0063] The support strip 220 includes a plurality of molded interlocking parts, such as interlocking openings 222A-222F, etc. The support strip 220 also includes a plurality of terminal placement surfaces, such as terminal placement surfaces 223A-223C, etc. The support strip 220 also includes recesses between the plurality of terminal placement surfaces. Figure 4 , the terminal recesses 224A, 224B are shown between the terminal placement surfaces 223A-223C, and so on. Figure 4 As shown, the support bar 320 further includes interlocking openings, terminal placement surfaces, and terminal recesses.

[0064] The ground conductors in the terminal block 210 can be mechanically and electrically fastened (e.g., soldered, welded, bonded, etc.) to the terminal placement surfaces 223A-223C. In that manner, the terminal block 210 can be fastened together with the support bar 220 before the two sheet molded inserts 240, 250 are formed. The terminal block 210 and the support bar 220 can then be inserted into a mold fixture, and the LCP or another insulating material can be injected into the mold. When the two sheet molded inserts 240, 250 are molded around the terminal block 210, the insulating material of the sheet molded insert 240 also flows into the interlocking openings 222A-222F of the support bar 220 to anchor and fasten the sheet molded insert 240 to the support bar 220. The support strip 220 provides additional strength, a higher modulus of elasticity, and thermal stability compared to other designs where only one plastic molded part is used to support a row of terminal conductors.

[0065] In a similar manner, the ground conductors in the terminal block 310 can be mechanically and electrically fastened to the terminal placement surface of the support strip 320. In that manner, the terminal block 310 can be fastened to the support strip 320 before the two sheet molded inserts 340, 350 are formed. When the two sheet molded inserts 340, 350 are formed, the insulating material of the sheet molded insert 340 flows into the interlocking openings such as the interlocking openings 322D of the support strip 320 to anchor and fasten the sheet molded insert 340 to the support strip 320.

[0066] The two support strips 220, 320 also include a number of reference surfaces, and according to aspects of various embodiments, the positions and surfaces of the terminal conductors in the terminal strips 210, 310 are precisely set by the number of reference surfaces. For example, the support strip 220 includes a reference surface 226, and the support strip 320 includes reference surfaces 326, 327. The reference surfaces 226, 326, 327 provide surface interfaces (or mechanical interfaces or interferences) through which the contacts on a PCB style connector can be aligned with the terminal conductors in the terminal strips 210, 310, which will be referred to later. Figure 6 illustrate.

[0067] Figure 5 Show Figure 4 AA cutaway view of support strip 320 is shown taken through interlocking aperture 322D. Interlocking aperture 322D is cylindrical and gradually changes in shape but can be formed in other shapes and extends from an inner surface 329A of support strip 320 to an outer surface 329B of support strip 320. Interlocking aperture 322D includes: a first, narrow gradually changing aperture 328A extending from inner surface 329A to a position within support strip 320; and a second, wide gradually changing aperture 328B extending from within support strip 320 to outer surface 329B. Thus, interlocking aperture 322D includes a step or ledge between narrow aperture 328A and wide aperture 328B. In one example, each of the other interlocking apertures in the two support strips 220, 320 has a similar shape, but the two support strips 220, 320 can include different types and styles of molded interlocking parts.

[0068] As the sheet molded insert 340 is molded around the terminal block 310, the insulating material of the sheet molded insert 340 flows into the interlocking openings 322D and the like in the support strip 320. The sheet molded insert 340 forms a large cap or interlocking plug within the wide opening 328B, wherein a mechanical interference is between the plug and the step or ledge in the interlocking opening 322D. After the sheet molded insert 340 is formed, the sheet molded insert 340 is thereby secured to the support strip 320. In a similar manner, the sheet molded insert 240 is also secured to the support strip 220 based on the flow of a material extending from the sheet molded insert 240 into the openings 222A-222F of the support strip 220.

[0069] Figure 6 A detailed view of the two support strips 220, 320 and the two terminal strips 210, 310 on one side of the connector 10 is shown. Figure 6 , the base 100 and the two flexible shields 230, 231 are omitted from this view. The two support bars 220, 320 include reference surfaces by which the positions and surfaces of the terminal conductors in the two terminal rows 210, 310 are set or determined with better accuracy than in other designs. For example, the support bar 220 includes a reference surface 226, while the support bar 320 includes reference surfaces 326, 327. When a PCB-style end of a cable system is inserted into the front port opening 12 of the connector 10, the top surface of the PCB can be guided by the reference surface 226, the bottom surface of the PCB can be guided by the reference surface 326, and the side surface of the PCB can be guided by the reference surface 327. Thus, the reference surfaces 226, 326, 327 provide a surface interface (or mechanical interference) by which the PCB and the contacts on the PCB can be aligned with the terminal conductors in the two terminal rows 210, 310. The two support bars 220, 320 include reference surfaces on the right and left sides of the opening 12 in the front port 110 of the base 100. In addition, the two support bars 220, 320 provide a type of ground shield around the two terminal rows 210, 310 in the front port 110 of the base 100 because the two support bars 220, 320 are electrically connected to the ground conductors in the two terminal rows 210, 310.

[0070] The terminal conductors 211-214 of the terminal row 210 refer to Figure 6 The two terminal conductors 211 and 214 are ground conductors (also referred to as "two ground conductors 211 and 214"), and the two terminal conductors 212 and 213 are a pair of signal conductors for a differential signal (also referred to as "two signal conductors 212 and 213"). The two signal conductors 212 and 213 are arranged between the two ground conductors 211 and 214 in the terminal block 210, and other pairs of signal conductors are also arranged between the two ground conductors in the terminal block 210.

[0071] Figure 6 It is shown how the top surfaces of the two ground conductors 211, 214 contact the two terminal placement surfaces 223A, 223B of the support strip 220. Before the sheet molded insert 240 is formed, the two ground conductors 211, 214 can be soldered, welded or otherwise bonded to the two terminal placement surfaces 223A, 223B. On the other hand, the two signal conductors 212, 213 pass under the terminal recess 224A of the support strip 220 without contacting the support strip 220. The signal conductors in the other terminal rows 210 also pass under the terminal recess in the support strip 220.

[0072] When the sheet molded insert 240 is formed, the material flows into the terminal recess 224B of the support bar 220, surrounding the two signal conductors 212, 213 along a length of the two signal conductors 212, 213. The material also flows into the interlocking opening 222A to form the interlocking plug 241. Thus, the sheet molded insert 240 not only electrically isolates the two signal conductors 212, 213 from the support bar 220 but also secures the two signal conductors 212, 213 to the support bar 220. Based on the structural design and assembly method of the connector 10, a high degree of accuracy can be obtained between the reference surfaces 226, 326, 327 of the support bar 220 and the terminal conductors in the terminal block 210. In a similar manner, the wafer assemblies 200, 300 are secured together with two support bars 220, 320, respectively, and the support bars 220, 320 provide a number of advantages, including additional strength and dimensional accuracy for the two terminal rows 210, 310 and the two wafer assemblies 200, 300.

[0073] Figure 7 Show Figure 1 A detailed view of the terminal block 210 and the sheet molded insert 240 of the connector 10 is shown. Figure 7 , the base 100, the support bar 220, and the upper ground channel block 400A are omitted from this view. Figure 8 Show Figure 7 Another detailed view of the terminal block 210 is shown, wherein the laminate molding insert 240 is also omitted from this view. Figure 7 2 shows how a pair of signal conductors, such as two signal conductors 212, 213, pass through the sheet mold insert 240 (i.e., the sheet mold insert 240 is formed around the two signal conductors 212, 213). However, the top surfaces of the ground conductors, such as the two ground conductors 211, 214, are not wrapped or surrounded by the sheet mold insert 240. Instead, the top surfaces of the two ground conductors 211, 214 can be soldered, welded, or otherwise bonded to the two terminal placement surfaces 223A, 223B of the support strip 220 (see FIG. Figure 6). In that manner, the two ground conductors 211 , 214 are electrically connected to the support bar 220 .

[0074] Reference Figure 8 The grounding frame 410A includes grounding contact platforms 411A-413A, etc. The grounding contact platforms 411A-413A are bent or otherwise formed to extend upward from a main surface of the grounding frame 410A. When the connector 10 is assembled, the top surfaces of the grounding contact platforms 411A-413A contact the bottom surfaces of the grounding conductors in the terminal row 210. For example, the top surfaces of the grounding contact platforms 411A, 412A contact the bottom surfaces of the grounding conductors 211, 214. In that manner, the two grounding conductors 211, 214 are electrically connected to the grounding frame 410A, and the grounding frame 410A is assembled or integrated with the upper grounding channel block 400A, both of which are parts of the grounding path assembly for the wafer assembly 200. The grounding frame 410A, the upper grounding channel block 400A, and other grounding frames and grounding channel blocks in the connector will be referred to later. Figures 13 to 16 Explain in more detail.

[0075] The ground frame 410A also includes interface openings on the sides of the ground contact platform. For example, the ground frame 410A includes two interface openings 416, 417 on both sides of the ground contact platform 411A. When the connector 10 is assembled, the interface plug on the thin sheet molded insert 240 can be located in the interface opening of the ground frame 410A. The ground frames 410B, 510A, 510B also include interface openings, and the thin sheet molded insert 340 of the thin sheet assembly 300 also includes an interface plug. Examples of interface plugs on the thin sheet molded insert 240 will be referred to later. Fig.10 An example of an interface plug on the sheet molding insert 340 will be referred to later. Fig.11 illustrate.

[0076] Fig. 9 A top perspective view of the terminal block 210 and two thin-sheet molded inserts 240, 250 is shown. Fig.10 A bottom perspective view of the terminal block 210 and two thin sheet molded inserts 240, 250 is shown. The thin sheet molded insert 240 extends across a width "W" of the terminal block 210, as shown in FIG. Fig. 9 Similarly, the sheet molded insert 250 extends across the width "W" of the terminal row 210, as shown in FIG. Fig.10 The terminal block 210 and the two wafer molded inserts 240 , 250 are parts or components of the first or upper wafer assembly 200 of the connector 10 .

[0077] The terminal row 210 includes a first or right group 216 of terminal conductors, a central group 217 of terminal conductors, and a second or left group 218 of terminal conductors. The two groups 216 and 218 include ground conductors and signal conductors. Among them, group 216 includes a ground conductor 211, two signal conductors 212 and 213 forming a differential pair of signal conductors, and a ground conductor 214. Overall, group 216 includes eight signal conductors and five ground conductors, wherein each pair of signal conductors is located between two ground conductors. The terminal conductors of the central group 217 include power conductors, and in some cases, can include ground conductors or signal conductors. Group 218 is similar to group 216 but is located on the other side of group 217. Fig.11 The terminal row 310 shown is similar to the terminal row 210. In one example, the spacing between the head contacts of the terminal conductors is the same in the two terminal rows 210, 310. However, the terminal conductors in the terminal row 210 may deviate from the terminal conductors of the terminal row 310, so that the head contacts are staggered between the two rows. In other cases, the terminal conductors in the two terminal rows 210, 310 may have the same spacing and are aligned relative to each other (i.e., not staggered). In other cases that are still there, the terminal conductors in the two terminal rows 210, 310 may have different head contact spacings compared to each other.

[0078] Fig.10 210 is shown how the signal conductors and power conductors in the terminal block 210 are connected from the opening 12 (see Figure 1 ) and extends to the tail contact at the terminal foot 13 of the connector 10. As an example, the signal conductor 212 extends from a head contact 212L end to a tail contact 212T end of the connector 10. The signal conductor 212 includes a bend 212B between the sheet molded insert 240 and the sheet molded insert 250, as do the other signal conductors and power conductors in the terminal row 210. The tail contacts of the signal conductors and power conductors in the terminal row 210 can be as follows Fig.10 The SMT tail contact is shown formed or formed with a through hole or other type of contact. The ground conductor in the terminal row 210 does not extend directly to the terminal foot 13. Instead, the ground conductor extends from the head contact in the opening 12 to a contact point on the ground path assembly for the wafer assembly 200. The ground path assembly includes a ground rib for surface mounting on a substrate, which will be described later.

[0079] Fig.10 Also shown are the wafer interface plugs 243, 244, etc. of the wafer molded insert 240. When the connector 10 is assembled, the interface plugs on the wafer molded insert 240 can be located in the interface openings of the ground frame 410A. For example, Fig.10 The wafer interface plugs 243, 244 shown can be located Figure 8The wafer assembly 200 and the ground path assembly for the wafer assembly 200 can be fastened together by means of the interface plug of the wafer molded insert 240. In a similar manner, the wafer assembly 300 and the ground path assembly for the wafer assembly 300 can be fastened together by means of the interface plug of the wafer molded insert 350, which will be described later.

[0080] Fig.11 A top perspective view of the terminal block 310 and two sheet molded inserts 340, 350 is shown. Fig.12 A bottom perspective view of the terminal block 310 and two sheet molded inserts 340, 350 is shown. The sheet molded insert 340 extends across a width "W" of the terminal block 310, as shown in FIG. Fig.11 Similarly, the sheet molded insert 350 extends across the width "W" of the terminal row 310, as shown in FIG. Fig.12 The terminal block 310 and the two wafer molded inserts 340 , 350 are parts or components of the second or lower wafer assembly 300 in the connector 10 .

[0081] The terminal row 310 includes a first or right group 316 of terminal conductors, a central group 317 of terminal conductors, and a second or left group 318 of terminal conductors. Groups 316, 317 include ground conductors and signal conductors. For example, group 316 includes a ground conductor 311, two signal conductors 312, 313 forming a differential pair of signal conductors, and a ground conductor 314. Overall, group 316 includes eight signal conductors and five ground conductors, wherein each pair of signal conductors is located between two ground conductors. The terminal conductors of the central group 317 include power conductors, and in some cases, can include ground or signal conductors. Group 318 is similar to group 316 but is located on the other side of group 317.

[0082] Fig.11 Also shown are the wafer interface plugs 343, 344, etc. of the wafer molded insert 340. When the connector 10 is assembled, the interface plugs on the wafer molded insert 340 can be located in the interface openings of the ground frame 410A. The interface plugs of the wafer molded insert 340 can be relied upon to fasten the wafer assembly 300 and the ground path assembly for the wafer assembly 300 together.

[0083] Fig.12 1 and 10. It shows how the signal conductors and power conductors in the terminal block 310 are connected from the opening 12 (see Figure 1) and extends to the tail contact at the terminal foot 13 of the connector 10. As an example, the signal conductor 312 extends from a head contact 312L end to a tail contact 312T end of the connector 10. The signal conductor 312 includes a bend 312B between the sheet molded insert 340 and the sheet molded insert 350, as do other signal conductors and power conductors in the terminal row 310. The tail contacts of the signal conductors and power conductors in the terminal row 310 can be as follows: Fig.12 The SMT tail contacts shown are formed by through-hole or other types of contacts. The ground conductors in the terminal block 310 do not extend directly to the mounting interface 330. Instead, the ground conductors extend from the opening 12 (see Figure 1 )'s head contact portion extends to a contact point on a ground path assembly for wafer assembly 300.

[0084] Fig.13 Show Figure 1 A front perspective view of the ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, 550B of the connector 10 is shown. Fig.14 A rear perspective view of these blocks is shown. Ground channel blocks 400A, 400B, 450A, 450B form parts or components of the ground path assembly for wafer assembly 200, while ground channel blocks 500A, 500B, 550A, 550B form parts or components of the ground path assembly for wafer assembly 300. In the example shown, ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, 550B are separate (i.e., not integrally formed) blocks, however, in some cases, one or more of these blocks can be combined or integrally formed together. For example, in some cases, blocks 400A, 450A can be formed as a single block, while other blocks can be combined. As described above, the ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, 550B can be formed of LCP, PE, PTFE, conductive PE or PTFE, fluoropolymers, or other plastic or insulating materials.

[0085] like Fig.13 and Fig.14 As shown, the ground channel block 400A includes channels 401C-404C, while the ground channel block 400B includes channels 401D-404D. When the connector 10 is assembled, the paired signal conductors in the terminal block 210 extend within the channels 401C-404C, 401D-404D in the ground channel blocks 400A, 400B, as shown in FIG. Figure 3The channels 401C-404C, 401D-404D help to electrically isolate the pairs of signal conductors in the terminal block 210 from each other to reduce crosstalk and interference between the pairs of signal conductors in the terminal block 210.

[0086] Similarly, ground channel blocks 500A, 500B include channels 501C, 502C, 501D, 502D, and other channels. Pairs of signal conductors in terminal block 310 extend within channels 501C, 502C in ground channel block 500A, within channels 501D, 502D in ground channel block 500B, and so on. Pairs of signal conductors in terminal block 310 also extend within channels 551C, 552C of ground channel block 550A, within channels 551D, 552D of ground channel block 550B, and so on. These channels in blocks 500A, 500B, 550A, 550B help to electrically isolate pairs of signal conductors in terminal block 310 from each other to reduce crosstalk and interference between pairs of signal conductors in terminal block 310. Signal conductors in terminal block 310 are electrically isolated from each other at openings 12 (see Figure 1 ), passes through the channels in the ground channel blocks 500A, 500B, passes through the channels in the ground channel blocks 550A, 550B, and extends to the tail contact at the terminal foot 13 of the connector 10.

[0087] Reference Fig.14 , ground channel block 450A includes channels 451C-452C, etc., and ground channel block 450B includes channels 451D-452D, etc. Pairs of signal conductors in terminal block 210 extend within channels 451C, 452C of ground channel block 450A and within channels 451D, 452D, etc. of ground channel block 450B. These channels in blocks 450A, 450B help to electrically isolate the pairs of signal conductors in terminal block 210 from each other to reduce crosstalk and interference between the pairs of signal conductors in terminal block 210. The signal conductors in terminal block 210 are electrically isolated from each other at openings 12 (see Figure 1 ) starts from the header contact in the ground channel block 400A, 400B through the channel (see Figure 3 ), through the channels of the ground channel blocks 450A, 450B, and extending to the tail contacts at the terminal feet 13 of the connector 10. The channels of the ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, 550B can also include shifts, bends or other features that follow the shifts or bends on the signal conductors extending in the channels. As an example, Fig.13 and Fig.14Offsets 610, 612 are shown, and other changes in the direction of the channels are within the scope of the various embodiments.

[0088] Fig.13 and Fig.14 A subset of the ground via blocks shown also includes ground ribs at the terminal legs 13 of the connector 10. Fig.13 and Fig.14 In the example shown, the grounding ribs are integrally formed with the grounding channel blocks 450A, 450B, 550A, 550B. In various other examples, a grounding channel block including separate grounding ribs formed of metal, such as Figure 21 to Figure 23 As shown in Fig.13 As shown, the ground channel block 550A includes ground ribs 551A and 552A, and the ground channel block 550B includes ground ribs 551B and 552B, etc. Channel 551C extends between two ground ribs 551A and 552A of the ground channel block 550A, and the other channels of the ground channel block 550A extend between the pairs of ground ribs of the ground channel block 550A. Channel 551D extends between two ground ribs 551B and 552B, and the other channels of the ground channel block 550B also extend between the pairs of ground ribs of the ground channel block 550B.

[0089] like Fig.14 As shown, ground channel block 450A includes ground ribs 451A, 452A, while ground channel block 450B includes ground ribs 451B, 452B, and so on. The ground ribs can be plated with a plating layer of tin, gold, or another metal suitable for surface mounting, and the ground ribs can be surface mounted to traces on a PCB along with the SMT tails of the signal terminal conductors and the power terminal conductors. The ground ribs provide shielding between the SMT tails, even at the mounting surface of the terminal feet 13 of the connector 10. The ground ribs in the ground channel blocks 450A, 450B, 550A, 550B will also be referred to later. Fig.18 and Fig.19 To explain.

[0090] Reference Fig.13 , the ground channel block 550A further includes a grounding strip 556A, and the ground channel block 550B includes a grounding strip 556B. The grounding strip 556A extends between the grounding ribs of the ground channel block 550A and is electrically connected to the grounding ribs of the ground channel block 550A for grounding connection and maintaining a common potential between the grounding ribs. Similarly, the grounding strip 556B extends between the grounding ribs of the ground channel block 550B and is electrically connected to the grounding ribs of the ground channel block 550B for grounding connection and maintaining a common potential between the grounding ribs.

[0091] Reference Fig.14 , the ground channel block 450A further includes a grounding strip 456A, and the ground channel block 450B includes a grounding strip 456B. The grounding strip 456A extends between the grounding ribs of the ground channel block 450A and is electrically connected to the grounding ribs of the ground channel block 450A for grounding connection and maintaining a common potential between the grounding ribs. Similarly, the grounding strip 456B extends between the grounding ribs of the ground channel block 450B and is electrically connected to the grounding ribs of the ground channel block 450B for grounding connection and maintaining a common potential between the grounding ribs.

[0092] The grounding strips 456A, 456B, 556A, 556B can be formed of a metal or metal alloy such as aluminum, copper, zinc, stainless steel or other metals, and in some cases can be plated with one or more plated metals. In one example, the grounding channel blocks 450A, 450B can be molded around the grounding strips 456A, 456B, or the grounding strips 456A, 456B can be inserted into the slots at the ends of the grounding ribs and fastened using interference fit, welding, bonding or other means. Similarly, in one example, the grounding channel blocks 550A, 550B can be molded around the grounding strips 556A, 556B, or the grounding strips 556A, 556B can be inserted into the slots at the ends of the grounding ribs and fastened using interference fit, welding, bonding or other means.

[0093] The ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, 550B can also include a number of corresponding or mating interlocking features, such as Fig.13 The interlocking features 600 and Fig.14 Interlocking features 601, etc. are shown. The interlocking features 600 can be used to position, align and secure pairs of ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, 550B to each other.

[0094] Fig.15 Show Figure 1 A front perspective view of the ground frame 410A, 410B, 460A, 460B, 510A, 510B, 560A, 560B in the connector 10 is shown. Fig.16A rear perspective view of these ground frames is shown. The ground frames 410A, 410B, 460A, 460B form parts or components of the ground path assembly for the wafer assembly 200, while the ground frames 510A, 510B, 560A, 560B form parts or components of the ground path assembly for the wafer assembly 300. The ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, 560B are separate (i.e., not integrally formed) in the example shown, but in some cases, one or more of the ground frames can be combined and integrated together. For example, in some cases, the ground frames 410A, 460A can be formed as a single ground frame, while the other ground frames can be combined.

[0095] The ground frame 410A, 410B, 460A, 460B, 510A, 510B, 560A, 560B can be stamped, sheared or otherwise formed from a flat sheet of metal. In some cases, the sheet of metal can be plated with one or more plated metals. When the connector 10 is assembled, the ground frame 410A, 410B, 460A, 460B, 510A, 510B, 560A, 560B can be positioned (e.g., adjacent to, between, against, etc.) and fastened together with the sheet molded insert 240, 250, 340, 350 and the ground channel block 400A, 400B, 450A, 450B, 500A, 500B, 550A, 550B. Each of the ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, 560B includes two main side surfaces that are the two largest surfaces of the ground frame. As an example, the main surfaces of the ground frames 410A and 410B are Fig.15 and Fig.16 Indicated by hatching.

[0096] The ground frame 410A includes ground contact platforms 411A-413A, etc. The ground contact platforms 411A-413A are bent or otherwise formed to extend upward from a main surface of the ground frame 410A. When the connector 10 is assembled, the top surfaces of the ground contact platforms 411A-413A contact the bottom surfaces of the ground conductors in the terminal row 210. For example, the top surfaces of the ground contact platforms 411A and 412A contact the bottom surfaces of the ground conductors 211 and 214, as shown in FIG. Figure 8 In that manner, the ground conductors 211 , 214 are electrically connected to the ground frame 410A, and the ground frame 410A and the upper ground channel block 400A are assembled or integrated as parts of the ground path assembly for the wafer assembly 200 .

[0097] Similarly, the ground frame 410B includes ground contact platforms 411B-413B, etc. The ground contact platforms 411B-413B are bent or otherwise formed to extend upward from a main surface of the ground frame 410B. When the connector 10 is assembled, the top surface of the ground contact platforms 411B-413B contacts the bottom surface of the ground conductor in the terminal row 210. In that manner, the ground conductor in the terminal row 210 is connected to the ground frame 410B, and the ground frame 410B is assembled or integrated with the upper ground channel block 400B as a ground path component for the wafer assembly 200. Also as shown in FIG. Fig.17 As shown, the grounding frames 510A and 510B further include grounding contact platforms 511A, 512A, 511B, 512B, etc. that are in contact with the grounding terminals in the terminal row 310 .

[0098] like Fig.16 As shown, the ground frame 410A includes a plurality of curved sheets, including a curved sheet 414A, etc. When the connector 10 is assembled, the curved sheet 414A is mechanically and electrically connected to the connecting sheet of the ground frame 460A by an interference fit. Fig.16 In one example shown, the bent sheet 414A is mechanically and electrically connected to the connecting sheet 461A of the ground frame 460A. The ground frame 510A is also mechanically and electrically connected to the ground frame 560A, and the ground frame 510B is also mechanically and electrically connected to the ground frame 560B. Fig.17 As shown, the ground frame 560B includes a plurality of needle holes such as needle holes 561A, and the ground frame 510B includes a plurality of ground pins such as ground pins 514B. The ground pins 514B are inserted through the needle holes 561A to mechanically and electrically connect the two ground frames 510B and 560B together. In a similar manner, the two ground frames 510A and 510B are connected together. Although Figures 15 to 17 Example ground frames and ways of connecting the ground frames to each other are shown, but other sizes, shapes and styles of frames can be relied upon. The ground frames can also be electrically connected to each other in other ways using mechanical interfaces and mounting arrangements.

[0099] The ground frame 410A, 410B, 460A, 460B, 510A, 510B, 560A, 560B and the sheet molded insert 240, 250, 340, 350 and the ground channel block 400A, 400B, 450A, 450B, 500A, 500B, 550A, 550B can be fastened together in a variety of ways. Fig.16, the ground frame 460B includes a mounting opening 620 at one end, while the ground frame 560B includes a mounting opening 622 at one end. For example, mounting posts or plugs of the sheet molded inserts 250, 350 can be molded or inserted through the openings 620, 622 to help secure the ground frame 460B, 560B to the sheet molded inserts 250, 350 in place. Each of the ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, 560B includes one or more mounting openings, but other features can be relied upon to position the ground frame within the connector 10. In some cases, the mounting openings can also be omitted.

[0100] Fig.18 Show Figure 1 1 is a perspective view of the terminal pin 13 of the connector 10 shown. As shown, the ground channel blocks 450A, 450B, 550A, 550B include grounding ribs. For example, the ground channel blocks 450A, 450B include grounding ribs 451A, 452A of the block 450A and grounding ribs 451B, 451B, etc. of the block 450B. The ground channel block 550A includes grounding ribs 551A, 552A, etc., and the ground channel block 550B includes grounding ribs 551B, 552B, etc. The grounding ribs of the ground channel blocks 450A, 450B, 550A, 550B can be plated with a plating layer of tin, gold or another metal suitable for surface mounting using tin, cadmium, zinc, indium or other types of solder.

[0101] Due to the larger surface area of ​​the grounding ribs, the grounding ribs help electrically isolate the tail contacts or ends of the terminal conductors in the terminal row 210, 310 down to the PCB or other component to which the connector 10 is mounted at the terminal foot 13. For example, the tail contacts 318T, 319T are located between the grounding ribs 551B, 552B, and the grounding ribs 551B, 552B help maintain electrical isolation between the signals on the tail contacts 318T, 319T. Similarly, the tail contacts 218T, 219T are located between the grounding ribs 451B, 452B, and the grounding ribs 451B, 452B help maintain electrical isolation between the signals on the tail contacts 218T, 219T.

[0102] In some cases, the side profile of the ground rib can be formed to track or coincide with the side profile of the tail contact in the terminal block 210, 310. Fig.19As shown, the side profiles of the grounding ribs 451B and 551B respectively track the side profiles of the tail contacts 219T and 319T along the bottom edge length 630 and the bottom edge length 631 of the grounding ribs 451B. Thus, when the terminal foot 13 of the connector 10 is placed on the top surface of a PCB or other component for surface mounting, the two edge lengths 630 and 631 of the grounding ribs 451B and 551B and the tail contacts 219T and 319T of the terminal blocks 210 and 310 contact the PCB.

[0103] The ground rib of connector 10 can include other features to facilitate surface mounting. For example, Fig. 20 A side view of a grounding rib 451F, 551F is shown that provides an alternative example of a grounding rib. The grounding rib 451F includes flexure recesses 641, 642, while the grounding rib 551F includes flexure recesses 643, 644. The flexure recesses 641, 642 of the grounding rib 451F are at opposite ends of the bottom edge length 650 of the grounding rib 451F, while the flexure recesses 643, 644 of the grounding rib 551F are at opposite ends of the bottom edge length 651 of the grounding rib 551F. For example, the recesses 641-644 provide an area for solder or other means of electrical connection to flow and secure around the edge length 650, 651 of the grounding ribs 451F, 551F.

[0104] Fig.21 A partial view of another connector 20 is shown. The connector 20 is similar to the connector 10 but includes metal grounding ribs and a grounding platform. In the connector 20, each grounding channel block includes a grounding rib and a platform frame. Fig.21 , ground channel block 450E is similar to ground channel block 450B in connector 10 described above. However, ground channel block 450E includes ground ribs 451F-455F formed as metal rib inserts. Ground ribs 451F-455F can be formed (e.g., stamped, sheared, or otherwise formed) from a metal or metal alloy such as aluminum, copper, zinc, stainless steel, or other metals, and in some cases can be plated with one or more plated metals. A side view of ground rib 455F is shown in FIG. Fig. 22 middle.

[0105] The grounding ribs 451F-455F are not integrally formed with the ground channel block 450E, as the grounding ribs 451B, 452B are integrally formed with the ground channel block 450B. Instead, the grounding ribs 451F-455F are assembled around the sheet molded insert 250E and the ground channel block 450E. The sheet molded insert 250E includes a plurality of placement channels, such as the placement channel 251E. The grounding rib 455F includes a rib tooth 670 (see Fig. 22), the rib teeth 670 are placed into a lower protrusion in the placement channel 251E to form an interference fit between the grounding rib 455F and the thin sheet molded insert 250E. The grounding channel block 450E also includes a channel or slot, and a rib body 680 of the grounding rib 455F (see Fig. 22 ) slides into the channel or slot of the ground channel block 450E to help secure the ground rib 455F in place. In a similar manner, other ground ribs 451F-454F are also secured together with the sheet molded insert 250E and the ground channel block 450E.

[0106] Fig.21 The illustrated example also includes a grounding platform frame 640. At least one major surface of the grounding platform frame 640 extends in a plane parallel to the major surfaces of the grounding ribs 451F-455F. For reference, a major surface of the grounding platform frame 640 is Fig.21 The ground rib 455F is marked with hatching, and one main surface of the ground rib 455F is Fig. 22 The ground platform frame 640 includes a plurality of openings 690-693 (see Fig.23 ) and a connecting strip 649 (see Fig.23 ), the connecting strip 649 crosses the ground ribs 451F-455F and extends over the tail end of the signal conductor, such as Fig.21 The ground platform frame 640 can be formed of a metal or metal alloy such as aluminum, copper, zinc, stainless steel or other metals, and in some cases can be plated with one or more plated metals.

[0107] Fig. 22 A side view of the ground rib 455F is shown, and Fig.23 A top view of the ground platform frame 640 is shown. The grounding rib 455F includes a bottom edge length 660 for surface mounting. The bottom edge length 660 of the grounding rib 455F can have other side profile shapes or styles than shown, including angled lengths. For example, the bottom edge length 660 includes a flexure recess 661 that provides an area for solder to flow. In some cases, the bottom edge length 660 of the grounding rib 455F can also have a side profile shape or style than shown. Fig. 20 The example shown has similar additional recesses.

[0108] The grounding rib 455F further includes a rib body 680. The rib body 680 can be inserted into the grounding channel block 450E (see Fig.21 ) and the abutting edge of the rib body 680 can contact a rear surface in the channel or slot. The rib body 680 also extends into a channel 646 in the ground platform frame 640, such as Fig.23As shown, the ribs of other grounding ribs can extend into other channels in the grounding platform frame 640. For example, a rib of the grounding rib 454F can extend into the channel 647 of the grounding platform frame 640, and so on.

[0109] The grounding rib 455F also includes a rib tooth 670, which is mounted to the thin-film molded insert 250E (see Fig.21 ) is placed in the lower protrusion of the placement channel 251E to form an interference fit between the grounding rib 455F and the thin-sheet molded insert 250E. In addition, the grounding rib 455F includes a communicating channel 672. Fig. 22 and Fig.23 When the connector 20 is assembled, an interlocking area 695 of the grounding platform frame 640 is inserted into the communicating channel 672 of the grounding rib 455F. A similar interlocking area of ​​the grounding platform frame 640 can be inserted into the communicating channel of the grounding ribs 451F-454F. A communicating tooth 671 of the grounding rib 455F is placed against the leading edge 648 of the interlocking area 695 to electrically and mechanically fasten the grounding rib 455F to the grounding platform frame 640. When the connector 20 is assembled, the signal conductors can extend downward and through the openings 690-693 in the grounding platform frame 640, and the communicating strips 649 span the grounding ribs 451F-455F and extend over the tail ends of the signal conductors, as shown in FIG. Fig.21 shown.

[0110] Terms such as "top", "bottom", "side", "front", "back", "right", and "left" are not intended to provide an absolute frame of reference. Instead, these terms are relative and are intended to identify certain features in relation to each other, as the posture of the structures described herein can vary. The terms "include", "comprises", "having", etc. are synonymous and are used in an open manner and do not exclude additional elements, features, behaviors, operations, etc. In addition, the term "or" is used in its inclusive sense and not in its exclusive sense, so that, for example, when used to connect a list of elements, the term "or" means one, some, or all of the elements in the list.

[0111] Unless otherwise specified, combination language such as "at least one of X, Y, and Z" or "at least one of X, Z, or Y" is generally used to identify one of them, a combination of any two, or all three (or more if a larger group is identified), such as X and only X, Y and only Y, and Z and only Z, X and Y, a combination of X and Z, and a combination of Y and Z, and all of X, Y, and Z. Unless otherwise specified, such combination language is generally not intended to identify or require the inclusion of at least one of X, at least one of Y, and at least one of Z. The terms "about" and "substantially," unless otherwise defined herein as relating to a specific range, percentage, or related measure of deviation, take into account at least some manufacturing tolerances between a theoretical design and a manufactured product or component, such as the American Society of Mechanical Engineers. Y14.5 and related international standardization organizations As will be understood by those skilled in the art, such manufacturing tolerances are still considered even if "approximately", "substantially" or related terms are not explicitly indicated, even in connection with the use of theoretical terms, such as geometric terms "perpendicular", "orthogonal", "vertex", "collinear", "coplanar" and other terms.

[0112] The above-described embodiments of the present disclosure are merely examples of implementation, to provide a clear understanding of the principles of the present disclosure. In essence, many variations and modifications may be made to the above-described embodiments without departing from the spirit and principles of the present disclosure. In addition, the components and features described for one embodiment may be included in another embodiment. All such modifications and variations are intended to be included in the scope of the present disclosure herein.

Claims

1. A connector, comprising: a base; A wafer assembly includes a terminal row and a wafer molded insert, wherein the terminal row includes a plurality of terminal conductors; as well as a wafer assembly support strip, the wafer assembly support strip comprising a terminal placement surface, a reference surface and a molded interlocking member, in, A terminal conductor of the plurality of terminal conductors is electrically connected to the terminal placement surface of the wafer assembly support strip; and The wafer body molded insert extends into the molded interlocking member of the wafer body assembly support strip to secure the terminal block relative to the reference surface.

2. The connector according to claim 1, wherein: The wafer assembly support strip comprises metal; and The laminar body molded insert comprises plastic.

3. The connector according to claim 1, wherein: The wafer assembly support strip includes a first arm, a second arm, and an extension strip extending between the first arm and the second arm; and The first arm and the second arm define two sides of a port opening of the connector.

4. The connector according to claim 3, wherein: The extension strip of the sheet assembly support strip includes the molded interlocking member; and At least one of the first arm and the second arm includes the reference surface.

5. The connector according to claim 1, wherein: The plurality of terminal conductors include a plurality of ground conductors and a plurality of signal conductors; The wafer assembly support strip includes a plurality of terminal placement surfaces; and Each of the plurality of ground conductors is electrically connected to a respective terminal placement surface of the plurality of terminal placement surfaces.

6. The connector according to claim 5, wherein: The wafer assembly support bar further includes a terminal recess located between a pair of terminal placement surfaces among the plurality of terminal placement surfaces.

7. The connector according to claim 6, wherein: A pair of signal conductors of the plurality of signal conductors extend through the terminal recess of the wafer assembly support strip and are surrounded by the wafer mold insert.

8. The connector according to claim 1, further comprising: a ground path component, wherein The ground path assembly includes a ground channel block; The ground channel block includes a plurality of channels; and A pair of signal conductors of the plurality of terminal conductors extends along a channel of the plurality of channels.

9. The connector according to claim 8, wherein: The ground via block includes a metal plating layer on a plastic body.

10. The connector according to claim 8, wherein: The ground channel block includes a plurality of ground ribs for surface mounting at a terminal foot of the connector; and The passage extends between a pair of ground ribs among the plurality of ground ribs at a terminal foot of the connector.

11. The connector according to claim 10, wherein: The ground channel block includes a grounding strip extending between and electrically connected to the plurality of grounding ribs of the ground channel block.

12. The connector according to claim 10, wherein: The plurality of ground ribs are integrally formed with the ground channel block.

13. The connector according to claim 10, wherein: The ground via block includes a metal plating layer on a plastic body; and The plurality of ground ribs are independent from the ground channel block and are formed of metal.

14. The connector according to claim 13, wherein: The ground path assembly also includes a ground platform frame; and The main surface of the grounding platform frame extends in a plane extending parallel to the main surface of the plurality of grounding ribs at a terminal leg of the connector.

15. A connector, comprising: A wafer assembly including a terminal block and a wafer molded insert; as well as a wafer assembly support strip, the wafer assembly support strip comprising a molded interlocking member, Wherein, the wafer body molded insert extends into the molded interlocking piece of the wafer body assembly support strip.

16. The connector according to claim 15, wherein: The wafer assembly support strip further includes a terminal placement surface; and A ground conductor of the terminal row is electrically connected to the terminal placement surface of the wafer assembly support bar.

17. The connector according to claim 15, wherein: The sheet assembly support strip comprises metal; The laminar body molded insert comprises plastic; The wafer assembly support strip includes a first arm, a second arm, and an extension strip extending between the first arm and the second arm; and The first arm and the second arm define two sides of a front port opening of the connector.

18. The connector according to claim 15, further comprising: a ground path component, wherein The ground path assembly includes a ground channel block; The ground channel block includes a channel; and A pair of signal conductors of the terminal block extend along the passage.

19. The connector according to claim 18, wherein: The ground channel block includes a plurality of ground ribs for surface mounting at a terminal foot of the connector; and The passage extends between a pair of ground ribs among the plurality of ground ribs at a terminal foot of the connector.

20. The connector according to claim 19, wherein The ground channel block includes a ground bar extending between the plurality of ground ribs of the ground channel block and electrically connected to the plurality of ground ribs of the ground channel block.

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