A welding device and method for a hemispherical resonator gyro electrode and base

Abstract

This invention belongs to the field of hemispherical resonator gyroscope welding technology, and particularly relates to a welding device and method for welding electrodes and bases of a hemispherical resonator gyroscope. The device includes: a vacuum glass cover, a base, a constant-temperature laser, a base, an electrode positioning seat, a positioning pin, solder, electrodes, and an electrode base; the electrode base is at the bottom, and the electrode positioning seat is placed in the central groove of the electrode base; the electrode is placed in the positioning cavity of the electrode positioning seat and is coaxial with the electrode positioning seat; the lower end of the positioning pin is inserted into the positioning hole of the electrode base, and the upper end is inserted into the positioning hole of the base; the base is below the base, and the top surface of the pin on the base is in close contact with the gold film on the upper surface of the flat electrode; the vacuum glass cover covers the entire assembly structure; the solder is above the electrode and wraps around the top of the welding pin; the constant-temperature laser is located on the outside of the entire assembly structure.

Description

Technical Field

[0001] This invention belongs to the field of hemispherical resonant gyroscope welding technology, and particularly relates to a welding device and method for welding hemispherical resonant gyroscope electrodes to a base. Background Technology

[0002] The hemispherical resonator gyroscope (HRG) is a novel type of solid-state wave gyroscope. This gyroscope features a simple structure, low manufacturing and maintenance costs, and can start up without preheating, quickly reaching operational status. Its core sensing element, the quartz resonator, is stable, exhibits no mechanical wear during operation, and boasts high reliability and long lifespan. It also exhibits strong radiation and shock resistance. Compared to optical gyroscopes, it is easier to miniaturize, making it considered an ideal inertial navigation gyroscope. Currently, hemispherical resonator gyroscope inertial navigation technology has been successfully applied in the space and maritime fields, and is expected to shape the development blueprint for a new generation of inertial navigation technology equipment systems.

[0003] Mainstream hemispherical resonator gyroscopes are divided into two types based on the excitation and detection electrodes. One type is the curved electrode hemispherical resonator gyroscope, which separates the excitation and detection electrodes; a representative product is the Northrop Grumman HRG130 series. The other type is the planar electrode hemispherical resonator gyroscope, represented by the SAFRAN HRG Crystal series. The latter has only three core components: a resonator, a planar electrode, and a base. This reduction in the number of components significantly simplifies assembly and makes it the most reliable navigation-grade gyroscope currently available. However, because it only has three core components, any assembly error can cause significant accuracy problems, which places higher demands on the HRG's assembly process.

[0004] The assembly of the electrodes and base of a hemispherical resonator gyroscope (HRG) is one of the main aspects of HRG assembly. The quality of this assembly directly affects the overall structural impact resistance, electrical signal stability, and high-load operating capacity of the gyroscope, ultimately impacting its accuracy and long-term reliability. However, there are currently few patents related to hemispherical resonator gyroscope assembly processes, and those that exist mainly focus on addressing the non-uniformity of the gap between the hemispherical resonator and the electrodes. No research has been found on high-precision assembly and welding processes between the flat electrode and the base. Achieving precise assembly and highly reliable eight-pin solder joints has become one of the bottlenecks limiting the development of high-precision and long-life hemispherical resonator gyroscopes.

[0005] The electrodes and base of the hemispherical resonant gyroscope are connected by eight pins, which conduct the electrode circuit and support the entire meter. This requires the solder joints to have low resistance, good conductivity, and high strength to withstand large loads. The connection point of each pin to the corresponding electrode gold film must be located on the axis of symmetry of the gold film to ensure the symmetry and central symmetry of the overall product after assembly. The reliability and consistency of the solder joints after welding must be good, and all process parameters during welding must be completely controllable. Contamination or influence caused by welding itself should be avoided as much as possible. Summary of the Invention

[0006] The technical problem solved by this invention: In view of the shortcomings of the current technology, the purpose of this invention is to provide an assembly process and welding method for electrodes and bases, which can achieve precise assembly of electrodes and bases and ensure the reliability, stability and consistency of welding.

[0007] The technical solution of this invention:

[0008] On one hand, the present invention provides a welding device for electrodes and base of a hemispherical resonant gyroscope, the device comprising: a vacuum glass cover 1, a base 2, a constant temperature laser 3, a base 4, an electrode positioning seat 5, a positioning pin 6, solder 7, an electrode 8, and an electrode base 9.

[0009] The electrode base 9 is at the bottom, and the electrode positioning seat 5 is placed in the central groove 9-2 of the electrode base 9; the electrode 8 is placed in the positioning cavity 5-2 of the electrode positioning seat 5 and is coaxial with the electrode positioning seat 5.

[0010] The lower end of the positioning pin 6 is inserted into the positioning hole 9-3 of the electrode base 9, and the upper end is inserted into the positioning hole 2-1 of the base base 2; the base 4 is below the base base 2, and the top surface of the pin 4-2 on the base 4 is in close contact with the gold film 8-1 on the upper surface of the flat electrode 8.

[0011] Vacuum glass cover 1 covers the entire assembly structure; solder 7 is above electrode 8 and wraps around the top of the solder needle; temperature-controlled laser 3 is located on the outside of the entire assembly structure.

[0012] Furthermore,

[0013] The base 2 has four threaded through holes 2-2 and four positioning through holes 2-1 on its upper and lower surfaces. The four threaded through holes 2-2 are used to fix the base 2 and the base 4, and the four positioning through holes 2-1 are used to position the base 2 and the electrode base 9.

[0014] Furthermore,

[0015] The electrode positioning seat 5 has protrusions on its inner sidewall that support the electrode, and eight spherical grooves 5-1 are symmetrically distributed on its outer sidewall.

[0016] Furthermore,

[0017] The electrode base 9 has a groove 9-4 for placing the electrode positioning seat, and eight positioning threaded holes 9-1 and eight fixing threaded holes 9-2 are centrally symmetrically distributed on the side wall. The upper and lower surfaces have positioning through holes 9-3. The eight positioning threaded holes 9-1 are used to finely adjust the position of the electrode positioning seat 5 to ensure coaxiality with the base 4; the eight fixing threaded holes 9-2 are used to fix the positioning pin 6; and the positioning through holes 9-3 are used to place the positioning pin 6.

[0018] Furthermore,

[0019] Positioning pin 6, electrode base 9, and base 2 are all made of 4J29 material. Electrode positioning seat 5 is made of quartz glass material. Electrode positioning seat 5 is made of the same material as electrode 8 and is used to protect electrode 8.

[0020] The solder 7 is a fluxless solder paste.

[0021] Secondly, the present invention also provides a method for welding electrodes of a hemispherical resonant gyroscope to a base, the method being implemented using the aforementioned device, the method comprising:

[0022] The base 4 is fixed to the base 2 with screws, and is made concentric with the base 2 and aligned on all four sides by a precision assembly method.

[0023] Electrode 8 is placed in the positioning cavity 5-2 of electrode positioning seat 5, concentric with electrode positioning seat 5, and the gold film direction of electrode 8 at 0°, 90°, 180° and 270° is perpendicular to the four square boundaries of electrode positioning seat 5.

[0024] Place the electrode positioning seat 5 in the groove 9-4 of the electrode base 9, and pass the spring ball head screw through the positioning thread hole 9-1 to contact the spherical groove 5-1 of the electrode positioning seat 5. Through precise measurement and adjustment, make the electrode positioning seat 5 concentric with the electrode base 9 and the four sides aligned.

[0025] Insert one end of each of the four positioning pins 6 into the positioning hole 9-3 of the electrode base 9, and pass the spring set screw through the fixing threaded hole 9-2 of the electrode base 9 to constrain the positioning pins 6.

[0026] Insert the other end of the positioning pin 6 into the positioning hole 2-1 of the base 2 with the base 4 installed, and complete the precision assembly of the electrode 8 and the base 4.

[0027] Furthermore, the method also includes:

[0028] The fluxless solder paste 7 is applied evenly and in equal amounts around the eight solder joints. The solder paste 7 is located on the upper surface of the electrode 8 and covers the top of the soldering needle of the base 4. The amount of solder at the laser-directed position of each solder joint is small, while the amount of solder at the position blocked by the soldering needle is large.

[0029] Furthermore, the entire device is fixedly mounted on the turntable, and the method further includes:

[0030] The vacuum glass cover 1 is installed on the outside of the entire device, completely enclosing the entire device. The glass cover has an air inlet and an air outlet. The inside of the glass cover is evacuated, and then a reducing gas is introduced.

[0031] The constant temperature laser 3 can irradiate the welding needle through the vacuum glass cover 1, with the irradiation focus 0.1-2mm above the solder 7;

[0032] The turntable is rotated 45° each time to weld the next weld point, until all eight weld points are completed.

[0033] This invention proposes an assembly process and welding method for electrodes and a base. Through precise mechanical assembly, it ensures high-precision control of the eight-pin solder joint positions. Simultaneously, it employs an intelligent constant-temperature laser vacuum heating solder paste welding method to achieve high-precision and high-reliability assembly of the electrodes and base, which is of great significance for ensuring the long-term stable operation of the hemispherical resonator gyroscope. Furthermore, the assembly fixture of this invention is small in size, has low manufacturing cost, and is independent of the welding equipment, allowing for mass production and improved efficiency. Attached Figure Description

[0034] Figure 1 This is an exploded view of the assembly structure;

[0035] Figure 2 This is a schematic diagram of the welding process;

[0036] Figure 3 A schematic diagram of eight solder joints formed by the assembled base welding pins and electrode gold film;

[0037] Figure 4 This is an enlarged view of the solder distribution at the tip of the welding pin;

[0038] Among them, 1-vacuum glass cover, 2-base base, 3-constant temperature laser, 4-base, 5-electrode positioning seat, 6-positioning pin, 7-solder, 8-electrode and 9-electrode base. Detailed Implementation

[0039] The present invention will be further described below with reference to the accompanying drawings:

[0040] This invention designs a precision assembly fixture for electrodes and bases, including a base, a positioning pin, an electrode base, and an electrode positioning seat.

[0041] The base is located above the base, which is above the electrode. The electrode is placed in the electrode positioning seat, which is placed in the electrode base. Four positioning pins are located at the four corners of the entire tooling set, with one end connected to the electrode base and the other end connected to the base.

[0042] The base has four threaded through holes and four positioning through holes on its upper and lower surfaces.

[0043] The inner sidewall of the electrode positioning seat has protrusions that support the flat plate electrode, and eight spherical grooves are symmetrically distributed in the center of the outer sidewall.

[0044] The electrode base has a groove for placing the electrode positioning seat, and the side wall has eight positioning threaded holes and eight fixing threaded holes symmetrically distributed in the center. The upper and lower surfaces have positioning through holes.

[0045] The positioning pin, electrode base, and base base are all made of 4J29 material, while the electrode positioning seat is made of quartz glass.

[0046] The present invention also provides a method for welding an electrode to a base, which employs an electrode and base assembly device as described above, and includes the following process:

[0047] The electrode base is fixed to the base with screws, and is precisely assembled to be concentric with the base and aligned on all four sides. The electrode is placed in the electrode positioning seat, concentric with the electrode positioning seat and with the gold film on its surface perpendicular to the square boundary of the electrode positioning seat. The electrode positioning seat is placed in the groove of the electrode base, and the spring ball head screw is passed through the positioning thread hole and contacts the spherical groove of the electrode positioning seat. Through precise measurement and adjustment, the electrode positioning seat is made concentric with the electrode base and aligned on all four sides. One end of the four positioning pins is inserted into the positioning through hole of the electrode base, and the spring set screw is passed through the fixing thread hole of the electrode base to constrain the positioning pins. The base with the base installed is connected to the positioning pins to complete the precision assembly of the electrode and the base.

[0048] Apply fluxless solder paste evenly and in equal amounts around the eight solder joints. At each solder joint, the amount of solder is less in the area directly hit by the laser and more in the area blocked by the soldering pin. The ratio is based on the diameter of the soldering pin and is approximately 1:1.5 to 1:3.

[0049] A specially designed vacuum glass cover is installed on the outside of the entire assembly structure, completely enclosing the entire assembly structure. The glass cover has air inlet and exhaust ports. The inside of the glass cover is evacuated, and then a small amount of reducing gas is introduced.

[0050] The solder is heated using an intelligent constant-temperature laser device. The laser can rotate around the central axis of the assembly structure, and the laser focus is located on the base welding pin, 0.1-2mm above the solder.

[0051] Currently, the focus of hemispherical resonator gyroscope assembly is mainly on the assembly of the resonator and electrodes. There are few methods for the precise assembly of the hemispherical resonator gyroscope base and the flat plate electrode. This invention designs a precision assembly scheme for the flat plate electrode and the base, which can ensure high coaxiality between the base and the electrode, and that the welding pins and the strip gold film are coaxial and correspond one-to-one, forming a total of eight uniform welding points.

[0052] Vacuum welding often employs a monolithic heating method. Due to variations in structural material parameters, uniform heating cannot be achieved, and uneven thermal expansion can even lead to structural damage. The isothermal laser vacuum heating scheme designed in this invention not only avoids various problems caused by uneven heating and inconsistent material parameters, but also ensures precise and controllable weld point temperature, resulting in high-quality and consistent welds.

[0053] In soldering, achieving good soldering results often requires the addition of an appropriate amount of flux to prevent the negative effects of oxide layers during the soldering process. However, for high-cleanliness precision devices such as hemispherical resonator gyroscopes, the introduction of flux inevitably leads to a decrease in performance. This invention presents a constant-temperature laser vacuum soldering solution that replaces flux by introducing a vacuum environment and reducing gas, thus achieving fluxless soldering.

[0054] Existing HRG assembly process patents mostly involve complex, large-scale, multi-part, and costly assembly equipment. In contrast, the assembly fixture in this invention is small in size, has fewer components, and a simple structure, allowing for mass production. Furthermore, the precision assembly of the electrodes and base, along with subsequent welding, are independent and can be performed simultaneously on two lines, significantly improving production efficiency.

[0055] In the assembly tooling, some components are made of 4J29 material and some are made of quartz glass material. Different materials are selected according to different functions. Both the overall and local aspects can meet the coordination and unity of parameters such as thermal expansion coefficient and hardness, and avoid extrusion damage between components.

[0056] The outer wall of the electrode positioning seat has a spherical hole, which can be used with a ball-head spring screw to adjust the position of the electrode positioning seat. This design can improve accuracy and avoid damage to the quartz glass material.

[0057] The vacuum heating welding process can effectively reduce solder joint bubbles and avoid oxidation of the solder surface. At the same time, a small amount of reducing gas is introduced to help remove the oxide layer of the solder, thereby avoiding the use of flux and solving the problems of flux contamination and difficulty in cleaning.

[0058] During laser welding, the temperature is higher near the direct laser beam and lower in areas shielded by the welding needle. Solder paste, after melting, tends to flow towards the warmer areas, making it easier for solder to accumulate in the laser-shielded area. Therefore, the ratio of solder in the laser-shielded area to the shielded area can be adjusted based on the welding needle diameter to achieve a more uniform solder joint distribution after welding.

[0059] The constant temperature laser can precisely control the temperature of the solder joint through a real-time temperature monitoring and feedback system, thereby ensuring that the temperature profile at the solder joint meets the welding requirements and achieving better welding results.

[0060] The irradiation point is positioned above the solder, allowing the solder to be heated evenly by heating the soldering needle. The height of the irradiation point can be adjusted according to factors such as temperature and real-time power to achieve the desired heating effect.

[0061] This invention provides a precision assembly and welding method for electrodes and bases, which can improve the assembly accuracy of electrodes and bases and accurately control the position of weld points. This is of great significance for improving weld point quality, welding reliability, and the overall assembly accuracy of the meter head.

[0062] Reference Figure 1 and Figure 2 This invention proposes a welding device for electrodes and a base, comprising a vacuum glass cover 1, a base 2, a constant-temperature laser 3, a base 4, an electrode positioning seat 5, a positioning pin 6, solder 7, an electrode 8, and an electrode base 9; the electrode base 9 is at the bottom, and the electrode positioning seat 5 is placed in the central groove 9-2 of the electrode base 9; the electrode 8 is placed in the positioning cavity 5-2 of the electrode positioning seat 5 and is coaxial with the electrode positioning seat 5; the lower end of the positioning pin 6 is inserted into the positioning hole 9-3 of the electrode base 9, and the upper end is inserted into the positioning hole 2-1 of the base 2; the base 4 is below the base 2, and the top surface of the pin 4-2 on the base 4 is in close contact with the gold film 8-1 on the upper surface of the flat electrode 8; the vacuum glass cover 1 covers the entire assembly structure; the solder 7 is above the electrode 8 and wraps around the top of the solder pin; the constant-temperature laser 3 is located on the outside of the entire assembly structure.

[0063] The base 2 has four threaded through holes 2-2 (through holes for fixing the base 2 and the base 4) and four positioning through holes 2-1 (through holes for positioning the base 2 and the electrode base 9) on its upper and lower surfaces.

[0064] The electrode positioning seat 5 has protrusions on its inner sidewalls to support the electrodes, and eight spherical grooves 5-1 are symmetrically distributed in the center of its outer sidewalls.

[0065] The electrode base 9 has a groove 9-4 for placing the electrode positioning seat, and eight positioning threaded holes 9-1 (used to finely adjust the position of the electrode positioning seat 5 to ensure coaxiality with the base 4) and eight fixing threaded holes 9-2 (used to fix the positioning pin 6) are centrally symmetrically distributed on the side wall. The upper and lower surfaces have positioning through holes 9-3 (used to place the positioning pin 6).

[0066] Positioning pin 6, electrode base 9, and base 2 are all made of 4J29 material, while electrode positioning seat 5 is made of quartz glass (the same material as electrode 8, used to protect electrode 8).

[0067] The solder 7 is a fluxless solder paste.

[0068] The present invention also provides a welding method for an electrode and a base. This welding method uses the above-mentioned electrode and base assembly device, and the specific process is as follows:

[0069] Reference Figure 1 and Figure 2 The base 4 is fixed to the base 2 with screws, and is precisely assembled to be concentric with the base 2 and aligned on all four sides. The electrode 8 is placed in the positioning cavity 5-2 of the electrode positioning seat 5, concentric with the electrode positioning seat 5, and the gold film direction of the electrode 8 at 0°, 90°, 180°, and 270° is perpendicular to the four square boundaries of the electrode positioning seat 5. The electrode positioning seat 5 is placed in the groove 9-4 of the electrode base 9, and the spring ball head screw is passed through the positioning thread hole 9-1 and contacts the spherical groove 5-1 of the electrode positioning seat 5. Through precise measurement and adjustment, the electrode positioning seat 5 is made concentric with the electrode base 9 and aligned on all four sides. One end of the four positioning pins 6 is inserted into the positioning hole 9-3 of the electrode base 9, and the spring set screw is passed through the fixing thread hole 9-2 of the electrode base 9 to constrain the positioning pins 6. The other end of the positioning pins 6 is inserted into the positioning hole 2-1 of the base 2 with the base 4 installed, completing the precision assembly of the electrode 8 and the base 4. The weld point diagram of the assembled structure is shown in the figure. Figure 3 As shown

[0070] Fluxless solder paste 7 is applied evenly and in equal amounts around the eight solder joints. Solder 7 is located on the upper surface of electrode 8 and covers the top of the soldering pin of base 4. The amount of solder at the laser-directed position of each solder joint is less, and the amount of solder at the position blocked by the soldering pin is more. The specific ratio is related to the diameter of the soldering pin; the larger the diameter of the soldering pin, the greater the difference in ratio.

[0071] A specially made vacuum glass cover 1 is installed on the outside of the entire assembly structure, completely enclosing the entire assembly structure. The glass cover has air inlet and exhaust holes. The inside of the glass cover is evacuated, and then a small amount of reducing gas is introduced.

[0072] The constant-temperature laser 3 can irradiate the welding needle through the vacuum glass cover 1, with the irradiation focus 0.1-2mm above the solder 7, and can rotate at any angle around the central axis of the entire assembly structure. After one weld point is completed, the laser 3 rotates 45° relative to the assembly structure to weld the next weld point, until all eight weld points are completed.

[0073] Alternatively, the constant temperature laser 3 is fixed, and the entire assembly structure is fixedly mounted on the turntable. The next weld point is welded by rotating the turntable 45° each time.

[0074] Example 1

[0075] First, place electrode 8 in the positioning cavity 5-2 of electrode positioning seat 5, and precisely adjust the position of electrode 8 so that the gold film is perpendicular to the square boundary of electrode positioning seat 5; then place electrode positioning seat 5 in the central groove 9-4 of electrode base 9, and tighten the ball head spring screw through the positioning threaded hole 9-1 of electrode base 9 to make electrode positioning seat 5 coaxial with electrode base 9 and its four sides parallel; insert the lower end of positioning pin 6 into positioning hole 9-3 of electrode base 9; fix base 4 below base base 2, and precisely adjust base 4 to be coaxial with base base 2 and its four sides aligned; insert the upper end of positioning pin 6 into positioning hole 2-1 of base base 2, such as... Figure 2 As shown.

[0076] The second step involves evenly and uniformly applying fluxless solder paste 7 around the eight solder joints. Solder paste 7 is located on the upper surface of the electrode 8 and surrounds the top of the solder pins on the base 4. The amount of solder is less at the laser-directed locations and more at locations shielded by the solder pins. In this embodiment, the diameter of the solder pins on the base 4 is 0.8 mm, and the solder-to-base ratio is approximately 1:2. Figure 4 As shown.

[0077] The third step is to cover the entire assembly fixture with the vacuum glass cover 1, then evacuate to a vacuum through the exhaust port 1-1 and introduce a small amount of reducing gas; adjust the incident point of the constant temperature laser 3 to 0.2mm above the solder, heat it to 220℃ after 5s, turn off the constant temperature laser 3, rotate it 45° around the central axis of the assembly structure and continue heating the next solder point until the welding is completed.

[0078] Example 2

[0079] First step, such as Figure 2As shown, place electrode 8 in the positioning cavity 5-2 of electrode positioning seat 5, and precisely adjust the position of electrode 8 so that the gold film is perpendicular to the square boundary of electrode positioning seat 5; then place electrode positioning seat 5 in the central groove 9-4 of electrode base 9, and tighten ball head spring screw through positioning thread hole 9-1 of electrode base 9 to make electrode positioning seat 5 coaxial with electrode base 9 and its four sides parallel; insert the lower end of positioning pin 6 into positioning hole 9-3 of electrode base 9; fix base 4 below base base 2, and precisely adjust base 4 to be coaxial with base base 2 and its four sides aligned; insert the upper end of positioning pin 6 into positioning hole 2-1 of base base 2.

[0080] The second step involves applying fluxless solder paste 7 evenly and in equal amounts around the eight solder joints. Solder paste 7 is located on the upper surface of the electrode 8 and covers the top of the solder pin of the base 4. The amount of solder at the laser-directed position of each solder joint is less, while the amount of solder at the position blocked by the solder pin is more. In this embodiment, the diameter of the solder pin of the base 4 is 1 mm, and the ratio of solder amount is approximately 1:3.

[0081] The third step is to cover the entire assembly fixture with the vacuum glass cover 1, then evacuate to a vacuum through the exhaust port 1-1 and introduce a small amount of reducing gas; adjust the incident point of the constant temperature laser 3 to 1mm above the solder, heat it to 250℃ after 5s, turn off the constant temperature laser 3, rotate it 45° around the central axis of the assembly structure and continue heating the next solder point until the welding is completed.

Claims

1. A device for welding electrodes to a base of a hemispherical resonator gyro, characterized in that, The device comprises a vacuum glass cover (1), a pedestal base (2), a constant temperature laser (3), a pedestal (4), an electrode positioning seat (5), a positioning pin (6), a solder (7), an electrode (8) and an electrode base (9); The electrode base (9) is at the bottom, the electrode positioning seat (5) is placed in the groove (9-4) of the electrode base (9), and the electrode (8) is placed in the positioning cavity (5-2) of the electrode positioning seat (5) and coaxial with the electrode positioning seat (5); The lower end of the positioning pin (6) is inserted into the positioning hole one (9-3) of the electrode base (9), and the upper end is inserted into the positioning hole two (2-1) of the pedestal base (2); the pedestal (4) is below the pedestal base (2), and the top surface of the pin (4-2) on the pedestal (4) is in close contact with the gold film (8-1) on the upper end surface of the flat plate electrode (8); The vacuum glass cover (1) covers the entire assembly structure; the solder (7) is above the electrode (8) and wraps the top of the soldering pin; the constant temperature laser (3) is located outside the entire assembly structure.

2. The electrode and pedestal welding device of a hemispherical resonator gyroscope according to claim 1, characterized in that, Four threaded holes (2-2) and four positioning holes two (2-1) are punched on the upper and lower surfaces of the pedestal base (2), the four threaded holes (2-2) are used to fix the pedestal base (2) and the pedestal (4), and the four positioning holes two (2-1) are used to position the pedestal base (2) and the electrode base (9).

3. The electrode and pedestal welding device of a hemispherical resonator gyroscope according to claim 1, characterized in that, The electrode positioning seat (5) has a protrusion for supporting the electrode on the inner side wall, and eight spherical grooves (5-1) are symmetrically distributed on the outer side wall.

4. The electrode and pedestal welding device of a hemispherical resonator gyroscope according to claim 1, characterized in that, The electrode base (9) has a groove (9-4) for placing the electrode positioning seat, the side wall has eight positioning threaded holes (9-1) and eight fixing threaded holes (9-2) which are symmetrically distributed in the center, and the upper and lower surfaces have a positioning hole one (9-3); the eight positioning threaded holes (9-1) are used to fine-tune the position of the electrode positioning seat (5) to ensure coaxiality with the pedestal (4); the eight fixing threaded holes (9-2) are used to fix the positioning pin (6); and the positioning hole one (9-3) is used to place the positioning pin (6).

5. The electrode and pedestal welding device of a hemispherical resonator gyroscope according to claim 1, characterized in that, The positioning pin (6), the electrode base (9) and the pedestal base (2) are made of 4J29 material, the electrode positioning seat (5) is made of quartz glass material, and the material of the electrode positioning seat (5) is consistent with that of the electrode (8) for protecting the electrode (8); The solder (7) is a solder paste without flux.

6. A method of welding a hemispherical resonator gyroscope electrode to a base, the method comprising: providing a base having a recessed portion; providing an electrode having a recessed portion; and welding the recessed portion of the electrode to the recessed portion of the base. The method is implemented by using the device according to any one of claims 1-5, and the method comprises: The pedestal (4) is fixed below the pedestal base (2) by screws, and is concentric with the pedestal base (2) and aligned with the four edges by a precise assembly method. The electrode (8) is placed in the positioning cavity (5-2) of the electrode positioning seat (5), concentric with the electrode positioning seat (5), and the gold film directions of the electrode (8) surface 0°, 90°, 180°, 270° are perpendicular to the four square boundaries of the electrode positioning seat (5); The electrode positioning seat (5) is placed in the groove (9-4) of the electrode base (9), the spring ball head screw is passed through the positioning threaded hole (9-1) and contacted with the spherical groove (5-1) of the electrode positioning seat (5), and the electrode positioning seat (5) is concentric with the electrode base (9) and the four edges are aligned through precise measurement and adjustment; One end of the four positioning pins (6) is inserted into the positioning hole one (9-3) of the electrode base (9), and the spring top wire is passed through the fixing threaded hole (9-2) of the electrode base (9) to constrain the positioning pin (6); The other end of the positioning pin (6) is inserted into the positioning hole two (2-1) of the base base (2) of the installed base (4), and the precise assembly of the electrode (8) and the base (4) is completed.

7. The method of claim 6, wherein the welding is performed by using a laser beam. The method further comprises: The flux-free tin paste solder (7) is uniformly and equally applied around the eight welding points, and the solder (7) is located on the upper surface of the electrode (8) and wraps the top of the welding needle of the base (4); the amount of solder at the laser direct position of each welding point is small, and the amount of solder at the position shielded by the welding needle is large.

8. The method of claim 7, wherein the welding is performed by using a laser beam. The entire device is fixedly installed on the turntable, and the method further comprises: The vacuum glass cover (1) is installed outside the entire device, and the entire device is completely wrapped therein, the glass cover is provided with an air inlet hole and an exhaust hole, the interior of the glass cover is vacuumized, and then a reducing gas is introduced; The constant temperature laser (3) can transmit the laser through the vacuum glass cover (1) to irradiate on the welding needle, and the irradiation focal point is located at 0.1-2mm above the solder (7); The welding of the next welding point is carried out by rotating the turntable by 45° each time until the welding of all eight welding points is completed.

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