Metal bond cutting sheet for cutting CSP packaged products and preparation method thereof
By designing metal bonding agent cutting sheets with cutting teeth, chip removal grooves and thermal conductivity, the problems of poor chip removal ability and poor thermal conductivity in the cutting process of CSP packaging products are solved, and a smoother cutting surface, longer service life and higher cutting quality are achieved.
Patent Information
- Application Number
- CN202311280202.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-07
- Publication Date
- 2025-04-08
AI Technical Summary
Traditional cutting sheets have poor chip removal capabilities and poor thermal conductivity during the cutting process of CSP packaging products, resulting in unsmooth cutting surface, short service life, and easy burrs.
A metal bonding agent cutting sheet including a cutting sheet body and a heat conducting sheet is designed. A plurality of cutting teeth are distributed in the circumferential direction of the cutting sheet body. Each cutting teeth is provided with chip discharge grooves, and a heat conducting groove is provided on both the front and the back sides. The heat conducting sheet is adhered to the heat conducting grooves through an adhesive.
By using inorganic filler particles such as zinc oxide and titanium oxide to improve matrix hardness, silver powder enhances guidance and self-sharpness, carbon fiber increases strength, the arc-shaped structure of cutting teeth reduces grinding damage, and the heat conduction sheet improves thermal conductivity, significantly improving the life of the cutting sheet and cutting quality.
Smart Images

Figure CN119773079A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of metal binder cutting sheets, and in particular to a metal binder cutting sheet for cutting CSP packaging products and a preparation method thereof. Background Art
[0002] CSP (Chip Scale Package) packaging means chip-level packaging. CSP packaging is the latest generation of memory chip packaging technology, and its technical performance has been further improved. CSP packaging can make the ratio of chip area to package area exceed 1:1.14, which is quite close to the ideal situation of 1:1. The absolute size is only 32 square millimeters, which is about 1 / 3 of the ordinary BGA and only 1 / 6 of the area of TSOP memory chip. Compared with BGA packaging, CSP packaging can increase the storage capacity by three times in the same space.
[0003] CSP packaged products require cutting discs for cutting. Traditional cutting discs have poor chip removal capabilities and poor thermal conductivity, resulting in rough cutting surfaces, short service life, and easy generation of large burrs on the product.
[0004] Therefore, how to provide a metal binder cutting sheet for cutting CSP package products and a preparation method thereof to solve the problems existing in the prior art is of great significance for its application. Summary of the invention
[0005] In view of this, the purpose of the present application is to provide a metal binder cutting blade for cutting CSP packaging products and a preparation method thereof, so as to solve the problems of poor chip removal ability and poor thermal conductivity of traditional cutting blades, resulting in rough cutting surfaces, short service life, and easy generation of large burrs on the product.
[0006] To achieve the above object, the present invention provides the following technical solutions:
[0007] A metal binder cutting sheet for cutting CSP packaged products comprises a cutting sheet body and a heat conducting sheet. The surface of the cutting sheet body is uniformly provided with a plurality of cutting teeth along the circumferential direction, a chip removal groove is arranged between each of the cutting teeth, and heat conducting grooves are arranged on the front and back surfaces of the cutting sheet body. The heat conducting sheet is adhered to the heat conducting grooves by an adhesive.
[0008] Preferably, the cutting teeth are arranged obliquely, and the outer edges of the cutting teeth are arranged in an arc shape.
[0009] Preferably, the heat-conducting groove comprises a groove portion and an annular portion, the groove portion is located on the front and back sides of the cutting tooth, and the annular portion is connected to the groove portion.
[0010] Preferably, the thermally conductive sheet is graphene or a composite of graphene and copper.
[0011] A method for preparing a metal bond cutting sheet for cutting CSP package products comprises the following steps:
[0012] A: Mixing: Accurately weigh diamond, resin powder and filler, feed the raw materials into the mixer and mix them to obtain molding material;
[0013] B: Hot pressing: Weigh the required amount of molding material, put it into the hot pressing mold, water-cool the mold and demould it to obtain the lower layer of the cutting sheet blank; replace the hot pressing module to obtain the cutting sheet blank;
[0014] C: Secondary curing: Place the cut sheet blank into a secondary curing furnace for curing, and take it out after cooling to room temperature;
[0015] D: Preparation of thermal conductive sheet: putting the thermal conductive sheet raw material into a hot pressing mold, hot pressing and forming, curing and cooling;
[0016] F: Fill the thermal conductive sheet into the thermal conductive groove with adhesive to complete the preparation of the cut sheet.
[0017] Preferably, the filler particles in step A include zinc oxide, titanium-coated carbon fiber, titanium oxide and silver powder.
[0018] Preferably, the volume fractions of the raw materials in step A are 12.5%-20% diamond, 40-60% resin powder, 1-8% zinc oxide, 1-12% silver powder, 5-15% titanium-coated carbon fiber, and 5-10% titanium oxide.
[0019] Preferably, the diamond particle size is 20-40 μm.
[0020] Preferably, the resin powder is one or more of epoxy resin, phenolic resin or polyimide resin.
[0021] Preferably, the pressure of the hot pressing process in step B is 200-250 kN, the temperature is 150-180° C., and the time is 10-15 min;
[0022] The temperature of the secondary curing in step C is 150-180° C. and the time is 10-20 hours.
[0023] Compared with the prior art, the present invention has the following beneficial effects:
[0024] 1. The inorganic filler particles of the present invention use zinc oxide and titanium oxide to significantly increase the hardness of the matrix, assist diamond grinding, increase the life of the blade and improve the surface finish of the workpiece, ensuring good cutting quality and stability of the blade.
[0025] 2. The introduction of silver powder in the formula of the present invention enhances the guiding property and self-sharpening property of the blade, improves the quality of cutting wire drawing burrs, and assists with carbon fiber to increase the strength of the blade, which can avoid the occurrence of blade breakage during the cutting process to the greatest extent.
[0026] 3. The cutting teeth in the present invention are provided with an arc-shaped structure without sharp edges, which can effectively reduce the probability of deep scratches generated at the moment of cutting into the grinding wheel when the grinding wheel feeds in, and has the advantages of high grinding efficiency, less dressing times and good workpiece surface quality.
[0027] 4. The present invention is provided with a heat conducting sheet, which can effectively conduct heat and make the cutting surface smoother.
[0028] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application so that it can be implemented in accordance with the contents of the specification, and to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings as follows.
[0029] Based on the detailed description of the specific embodiments of the present application in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other objects, advantages and features of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. In all drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.
[0031] Figure 1 It is a structural schematic diagram of the present invention;
[0032] Figure 2 for Figure 1 A magnified image of point A;
[0033] Figure 3 It is a cross-sectional view of the cutting teeth in the present invention.
[0034] In the figure: 1. Cutting disc body; 2. Heat conducting plate; 3. Heat conducting groove; 11. Cutting teeth. DETAILED DESCRIPTION
[0035] To make the purpose, technical scheme and advantages of the embodiment of the present application clearer, the technical scheme in the embodiment of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the present application. Obviously, the described embodiment is a part of the embodiment of the present application, rather than all of the embodiments. In the following description, specific details such as specific configuration and components are provided only to help fully understand the embodiments of the present application. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. In addition, for clarity and brevity, the description of known functions and structures is omitted in the embodiment.
[0036] In addition, the present application may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and / or settings discussed.
[0037] The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, B exists alone, and A and B exist at the same time. The term " / and" in this article describes another type of association object relationship, indicating that there can be two relationships. For example, A / and B can mean: A exists alone, and A and B exist alone. In addition, the character " / " in this article generally indicates that the previous and next associated objects are in an "or" relationship.
[0038] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusions.
[0039] See also Figure 1-3 The present invention provides a technical solution of a metal bond cutting sheet for cutting CSP packaging products and a preparation method thereof:
[0040] Embodiment 1:
[0041] Accurately weigh 12.5% of diamond, 54% of resin powder, 5% of titanium oxide, 4.5% of zinc oxide, 11.5% of silver powder and 12.5% of carbon fiber, feed the raw materials into a mixer for mixing to obtain a molding material, weigh the molding material according to the unit weight requirement, weigh the required amount of molding material, put it into a hot pressing mold, hot press it for 12 minutes under air conditions at a pressure of 200-250kN and a temperature of 150°C, and water-cool the mold to demould to obtain the lower layer of the cutting piece blank; put the cutting piece blank into a secondary curing furnace for curing, cool it to room temperature and take it out; put the graphene raw material into the hot pressing mold, hot press it into shape, and obtain the thermal conductive sheet 2 after cooling; install the thermal conductive sheet 2 in the thermal conductive groove 3, fix it with an adhesive, and obtain a finished cutting piece.
[0042] Embodiment 2:
[0043] Accurately weigh 12.5% of diamond, 64% of resin powder, 5% of titanium oxide, 4.5% of zinc oxide, 1.5% of silver powder and 12.5% of carbon fiber, feed the raw materials into a mixer for mixing to obtain a molding material, weigh the molding material according to the unit weight requirement, weigh the required amount of molding material, put it into a hot pressing mold, hot press it for 12 minutes under air conditions at a pressure of 200-250kN and a temperature of 150°C, and water-cool the mold before demolding to obtain the lower layer of the cutting piece blank; replace the hot pressing module, hot press it for 12 minutes under air conditions at a pressure of 200-250kN and a temperature of 150°C to obtain a cutting piece body 1, put the mixed raw materials of graphene and copper powder into the hot pressing mold, hot press it, and obtain a heat conductive sheet 2 after cooling; install the heat conductive sheet 2 in the heat conductive groove 3, fix it with an adhesive, and obtain a finished cutting piece.
[0044] In the above embodiments, embodiment 2 uses a mixed raw material of graphene and copper powder as the raw material of the thermal conductive sheet 2, and uses the cutting blades in embodiments 1 and 2 and commonly used resin cutting blades on the market for cutting. The service life of embodiment 1 is increased by one third compared with that of ordinary cutting blades, and that of embodiment 2 is increased by one quarter compared with that of ordinary cutting blades.
[0045] The above description is only the preferred embodiment of the present invention, which does not limit the protection scope of the present invention. For those skilled in the art, the present invention can be modified and varied in various ways. Within the spirit and principle of the present invention, any change, modification, replacement, integration and parameter change of these embodiments by conventional substitution or capable of achieving the same function without departing from the principle and spirit of the present invention shall fall within the protection scope of the present invention.
Claims
1. A metal bond cutting sheet for cutting CSP package products, characterized in that: The invention comprises a cutting blade body (1) and a heat conducting blade (2), wherein the surface of the cutting blade body (1) is evenly distributed with a plurality of cutting teeth (11) along the circumferential direction, a chip removal groove is arranged between each of the cutting teeth (11), and heat conducting grooves (3) are arranged on the front and back surfaces of the cutting blade body (1), and the heat conducting blade (2) is adhered to the heat conducting grooves (3) by means of an adhesive.
2. The metal bond cutting sheet for cutting CSP packaged products according to claim 1, characterized in that: The cutting teeth (11) are arranged obliquely, and the outer edges of the cutting teeth (11) are arranged in an arc shape.
3. A metal bond cutting sheet for cutting CSP packaged products as claimed in claim 2, characterized in that: The heat conduction groove (3) comprises a groove portion and an annular portion, the groove portion is located on the front and back sides of the cutting tooth (11), and the annular portion is connected to the groove portion.
4. A metal bond cutting sheet for cutting CSP packaged products as claimed in claim 3, characterized in that: The heat conducting sheet (2) is graphene or a composite of graphene and copper.
5. The metal bond cutting sheet for cutting CSP packaged products according to claim 4, characterized in that: Preparation method thereof The following steps are involved: A: Mixing: Accurately weigh diamond, resin powder and filler, feed the raw materials into the mixer and mix them to obtain molding material; B: Hot pressing: Weigh the required amount of molding material, put it into the hot pressing mold, water-cool the mold and demould it to obtain the lower layer of the cutting sheet blank; replace the hot pressing module to obtain the cutting sheet blank; C: Secondary curing: Place the cut sheet blank into a secondary curing furnace for curing, and take it out after cooling to room temperature; D: preparing the heat conducting sheet (2): putting the raw material of the heat conducting sheet (2) into a hot pressing mold, hot pressing and forming, and solidifying and cooling; F: Fill the heat conducting sheet (2) into the heat conducting groove (3) through the adhesive to complete the preparation of the cut sheet.
6. The preparation method according to claim 5, characterized in that: The filler particles in step A include zinc oxide, titanium-coated carbon fiber, titanium oxide and silver powder.
7. The preparation method according to claim 6, characterized in that: The volume fractions of the raw materials in step A are 12.5%-20% diamond, 40%-60% resin powder, 1%-8% zinc oxide, 1%-12% silver powder, 5%-15% titanium-plated carbon fiber, and 5%-10% titanium oxide.
8. The preparation method according to claim 7, characterized in that: The diamond particle size is 20-40 μm.
9. The preparation method according to claim 8, characterized in that: The resin powder is one or more of epoxy resin, phenolic resin or polyimide resin.
10. The preparation method according to claim 9, characterized in that: The pressure of the hot pressing process in step B is 200-250 kN, the temperature is 150-180° C., and the time is 10-15 min; The temperature of the secondary curing in step C is 150-180° C. and the time is 10-20 hours.