Plasma polishing equipment

Abstract

The invention discloses plasma polishing equipment which comprises a supporting device, a liquid supply device, a line electrode, an electric connection assembly and a magnetic field generation device. The supporting device is used for bearing a metal pipe fitting, the liquid supply device comprises a liquid storage tank and a liquid supply pump, the liquid supply pump is used for enabling electrolyte to flow in the metal pipe fitting, the wire electrode is used for stretching into the metal pipe fitting, the electric connection assembly comprises an anode electric connection piece and a cathode electric connection piece, and the anode electric connection piece is used for connecting the metal pipe fitting with a power supply positive electrode; the cathode electric connecting piece is connected with the line electrode and used for being connected with the negative electrode of the power source. And the magnetic field generating device is used for generating a magnetic field, so that the metal cations are subjected to Lorentz force, the movement direction of the metal cations is changed, the metal cations flow more easily and are taken out of the metal pipe fitting, and the deposition amount of the metal cations on the line electrode is reduced. And meanwhile, the magnetic field can locally generate eddy current in the electrolyte, bubble separation is improved, interface current density distribution is more uniform, and the polishing efficiency and the surface smoothness of the workpiece are improved.

Description

Technical Field

[0001] The invention relates to the technical field of polishing, and in particular to a plasma polishing device. Background Art

[0002] Plasma electrochemical polishing utilizes the random and dense plasma discharge behavior generated on the workpiece surface to enhance the chemical activity of the anode interface. At the same time, the electrochemical dissolution behavior provides a thermal field and a local flow field to promote mass transfer, thereby enhancing the electrochemical dissolution behavior and enhancing the polishing effect and material removal rate of the inner surface of the anode. For the polishing of the inner wall of the pipeline, some technologies use a method of a central cathode electrode wire and an electrolyte to generate an electrolytic plasma in the tube to achieve high-quality polishing of the inner wall. However, when the inner diameter of the flow channel is small, the hydrogen and water vapor generated on the surface of the central electrode wire (cathode) merge with the oxygen, water vapor and other gases generated on the inner wall of the tube (anode), causing the tube cavity to be completely filled with gas, the electric field is shielded, and it is difficult to generate a dynamic and stable electrolytic plasma phenomenon in the electrolytic machining environment. At the same time, for the anode material that is easy to deposit metals such as copper, the copper ions generated by the anode dissolution enter the electrolyte and diffuse to the surface of the cathode wire electrode. These metal cations will be deposited at the cathode. The deposition product phenomenon interferes with the electrolysis process and affects the polishing quality, especially for narrow tube lumens. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a plasma polishing device that can be used for polishing pipe fittings to improve the polishing quality.

[0004] The plasma polishing equipment according to the embodiment of the present invention includes: a supporting device, a liquid supply device, a wire electrode, an electrical connection component and a magnetic field generating device.

[0005] The supporting device comprises a base and a first supporting member, wherein the first supporting member is connected to the base and is used to support a metal pipe. The liquid supply device comprises a liquid storage tank and a liquid supply pump, wherein the liquid storage tank is used to store electrolyte, and the liquid supply pump is used to drive the electrolyte to flow in the metal pipe. The wire electrode is used to extend into the metal pipe. The electrical connection assembly comprises an anode electrical connector and a cathode electrical connector, wherein the anode electrical connector is used to electrically connect the metal pipe to the positive pole of a power source, and the cathode electrical connector is electrically connected to the wire electrode and is also used to electrically connect to the negative pole of the power source. A magnetic field generating device is used to generate a magnetic field so that metal cations are subjected to Lorentz magnetic force.

[0006] The plasma polishing technology according to the embodiment of the present invention has at least the following beneficial effects:

[0007] During operation, the wire electrode is electrically connected to the negative pole of the power supply, serving as the cathode in the electrolysis system. The metal pipe is connected to the positive pole of the power supply, serving as the anode in the electrolysis system. The magnetic field generating device generates a magnetic field. At the interface between the cathode and the anode, the ions in the electrolyte migrate under the action of the electric field and the concentration difference. A large number of metal cations are generated on the anode surface, and they continue to diffuse and migrate outward. The hydrogen ions and metal cations near the cathode surface will also continue to migrate to the cathode interface and undergo a reduction reaction. The electrolyte is electrically neutral as a whole, but at the electrode interface, due to the concentrated ion concentration, the cations migrate under the action of the electric field and the concentration difference, which can make the electrolyte at the electrode interface charged and can be affected by the Lorentz magnetic force, generating eddy currents locally. This phenomenon can promote the detachment of bubbles on the electrode surface, improve bubble shielding, promote the electrolysis process and local temperature rise, and ensure the effective excitation of subsequent plasma, thereby facilitating the polishing of pipes with smaller diameters. At the same time, the metal cations generated by the oxidation and dissolution of the anode will be affected by the Lorentz magnetic force when moving toward the wire electrode, which can change the movement direction of the metal cations, making it easier for the metal cations to flow with the electrolyte, thereby making it easier for the metal cations to be taken out of the metal pipe. In summary, by improving the bubble shielding phenomenon and reducing the deposition rate of metal cations on the wire electrode, and enhancing the uniformity of the electrolytic environment, the polishing efficiency and surface finish of large roughness metal pipes can be improved.

[0008] According to some embodiments of the present invention, the plasma polishing equipment includes a plurality of the magnetic field generating devices, the plurality of the magnetic field generating devices are distributed along the flow direction of the electrolyte in the metal tube, and the magnetic fields generated by the plurality of the magnetic field generating devices gradually increase.

[0009] According to some embodiments of the present invention, the magnetic field generating device is capable of generating a circular magnetic field so that ions in the electrolyte are subjected to the Lorentz magnetic force in the same direction as the electrolyte flow, and the electrolyte generates local eddy currents at the positive and negative electrode interfaces, thereby promoting mass transfer, improving uniformity, and promoting the detachment and discharge of bubbles.

[0010] According to some embodiments of the present invention, the supporting device includes a mounting member connected to the base, the mounting member includes a plurality of mounting parts distributed around the wire electrode, the magnetic field generating device includes a plurality of magnetic parts, the plurality of magnetic parts are respectively installed on the plurality of mounting parts, and along the circumference of the wire electrode, among any two adjacent magnetic parts, the south pole of one magnetic part faces the north pole of the other magnetic part.

[0011] According to some embodiments of the present invention, the mounting member is slidably connected to the base so that the mounting member can move along the axial direction of the wire electrode.

[0012] According to some embodiments of the present invention, the cathode electrical connector includes two rollers, the two rollers are rotatably connected to the support device, and at least one of the two rollers is a conductive structure, and the wire electrode is clamped between the radial side surfaces of the two rollers;

[0013] The plasma polishing equipment also includes a second driving device, which is connected to the wire electrode and is used to drive the wire electrode to move relative to the metal tube.

[0014] According to some embodiments of the present invention, the wire electrode is a flexible structure.

[0015] According to some embodiments of the present invention, the plasma polishing equipment further comprises an insulating sleeve, wherein the insulating sleeve is disposed on the outside of the wire electrode, the insulating sleeve defines a conducting hole, and the wire electrode is exposed from the conducting hole.

[0016] According to some embodiments of the present invention, the wire electrode is a flexible structure;

[0017] The insulating sleeve is a flexible structure; or,

[0018] The plasma polishing equipment comprises a plurality of insulating sleeves, which are spaced apart and distributed along the axial direction of the wire electrode, and the gaps between adjacent insulating sleeves form the conducting holes.

[0019] According to some embodiments of the present invention, the plasma polishing equipment includes a plurality of insulating sleeves, which are spaced apart along the axial direction of the wire electrode, and the gaps between adjacent insulating sleeves form the conductive holes. The insulating sleeves are magnetic structures, and the direction from the north pole to the south pole of the insulating sleeves is the same as the flow direction of the electrolyte.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0022] Figure 1 It is a structural schematic diagram of a plasma polishing device according to an embodiment of the present invention;

[0023] Figure 2 for Figure 1 A schematic diagram of the structure of the middle support device, the wire electrode and the magnetic field generating device;

[0024] Figure 3 for Figure 2 Schematic cross-section diagram in ;

[0025] Figure 4for Figure 2 A cross-sectional schematic diagram of another embodiment;

[0026] Figure 5 for Figure 4 Schematic diagram of magnetic field lines;

[0027] Figure 6 for Figure 1 A schematic diagram of the structure of the middle cathode electrical connector and the wire electrode;

[0028] Figure 7 It is a schematic diagram of another plasma polishing device polishing a metal pipe according to an embodiment of the present invention;

[0029] Figure 8 for Figure 7 Sectional view of AA.

[0030] Reference numerals:

[0031] Metal pipe fittings 1000;

[0032] Support device 100, base 110, slide groove 111, first support member 120, mounting member 130, mounting portion 131, connecting block 132, second support member 140;

[0033] Liquid supply device 200, liquid storage tank 210, liquid supply pump 220, delivery pipe 230;

[0034] Wire electrode 300;

[0035] Magnetic field generating device 400, magnetic member 410;

[0036] Electrical connection assembly 500, cathode electrical connection member 510, roller 511, limiting groove 5112, anode electrical connection member 520;

[0037] Insulation sleeve 600. DETAILED DESCRIPTION

[0038] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0039] In the description of the present invention, it should be understood that the descriptions involving orientations, such as up, down, front, back, left, right, etc., and the orientations or positional relationships indicated are based on the orientations or positional relationships described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0040] In the description of the present invention, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0041] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0042] In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0043] Plasma electrochemical polishing utilizes the random and dense plasma discharge behavior generated on the workpiece surface to enhance the chemical activity of the anode interface. At the same time, the electrochemical dissolution behavior provides a thermal field and a local flow field to promote mass transfer, thereby enhancing the electrochemical dissolution behavior and enhancing the polishing effect and material removal rate of the inner surface of the anode. However, in the related technology, due to the high voltage between the electrodes in the initial stage of electrolysis, the electrochemical reaction is violent, and metal cations will be deposited at the cathode. The deposition product phenomenon interferes with the electrolysis process and affects the polishing quality, especially for narrow lumens.

[0044] Based on the above problems, the present invention provides a plasma polishing device. Figure 1 FIG. 1 is a schematic diagram of the structure of a plasma polishing device according to an embodiment of the present invention. Figure 1 The plasma polishing equipment of this embodiment includes: a supporting device 100 , a liquid supply device 200 , a wire electrode 300 , a magnetic field generating device 400 and an electrical connection assembly 500 .

[0045] The supporting device 100 includes a base 110 and a first supporting member 120, the first supporting member 120 is connected to the base 110, and the first supporting member 120 is used to carry the metal pipe 1000. For example, two first supporting members 120 may be provided, and the two first supporting members 120 are arranged at intervals on the base 110. The first supporting member 120 may be provided with a receiving groove or a receiving hole, and the two ends of the metal pipe 1000 are respectively penetrated in the receiving hole. The liquid supply device 200 includes a liquid storage tank 210 and a liquid supply pump 220. The liquid storage tank 210 is used to store electrolyte, and the liquid supply pump 220 is used to drive the electrolyte to flow in the metal pipe 1000. For example, the liquid supply device 200 includes a delivery pipe 230, the liquid inlet of the liquid supply pump 220 is connected to the liquid storage tank 210, the liquid outlet is connected to the delivery pipe 230, and the other end of the delivery pipe 230 is connected to the metal pipe, so as to deliver the electrolyte to the metal pipe 1000. The electrolyte flows out from the other end of the metal pipe 1000 and flows back to the liquid storage tank 210 through the delivery pipe 230 .

[0046] The wire electrode 300 is used to extend into the metal pipe 1000. For example, the wire electrode is a copper structure, and the wire electrode 300 passes through the metal pipe. Alternatively, the electrical connection assembly 500 includes an anode electrical connector 520 and a cathode electrical connector 510. Both the anode electrical connector 520 and the cathode electrical connector 510 can be alligator clips. The anode electrical connector 520 is connected to the positive electrode of the power supply and is used to connect to the metal pipe 1000, so that the metal pipe 1000 is electrically connected to the positive electrode of the power supply to form an anode in the electrolysis system. For example, the anode electrical connector 520 is formed by a partial structure of the first support member 120, and the positive electrode of the power supply is electrically connected to the first support member 120. The cathode electrical connector 510 is electrically connected to the wire electrode 300 and is used to be electrically connected to the negative electrode of the power supply, so that the wire electrode 300 becomes the cathode in the electrolysis system. Among them, the power supply can be an external power supply or an internal power supply, that is, the plasma polishing equipment of this embodiment also includes a power supply, and the power supply can be a pulse power supply to generate a pulse voltage to ensure that the flowing electrolyte can carry away the electrolysis products in time, thereby achieving dynamic balance and facilitating the excitation of plasma.

[0047] The magnetic field generating device 400 is used to generate a magnetic field. When the direction of movement of the metal cations is not parallel to the field intensity direction of the magnetic field, the metal cations are subjected to the Lorentz magnetic force, thereby changing the direction of movement of the metal cations. For example, the magnetic field generating device 400 can generate an annular magnetic field around the wire electrode 300 so that the ions in the electrolyte are subjected to the Lorentz magnetic force in the same direction as the electrolyte flow. Specifically, during the electrolysis process, the inner wall surface of the metal pipe 1000 (the protruding part will produce a tip electric field concentration, which is preferentially removed) is oxidized to form metal cations, and moves from the inner wall of the metal pipe 1000 toward the wire electrode 300, and the moving direction approaches the radial direction of the metal pipe 1000. Based on this, the magnetic field generating device 400 of this embodiment generates an annular magnetic field around the wire electrode 300, and the direction of the magnetic field is clockwise when observed along the flow direction of the electrolyte. Therefore, in the process of the metal cations moving toward the wire electrode 300, they will be subjected to the Lorentz magnetic force in the same direction as the flow direction of the electrolyte, and can facilitate the flow of metal cations at the electrode interface, thereby enhancing the polishing effect.

[0048] Alternatively, the magnetic field generating device 400 generates a variable magnetic field, the direction and magnitude of which change with time, so that the direction and magnitude of the Lorentz magnetic force on the moving metal cations at different times are different, which is conducive to the dispersion of the metal cations, so that the metal cations are more easily driven by the electrolyte, thereby reducing the amount of metal cations deposited on the wire electrode 300, and enhancing the uniformity of the electrolytic environment. It is helpful to supply cations and inhibit the diffusion layer at the cathode workpiece, weaken the concentration polarization phenomenon, and further improve the polishing efficiency and surface finish of large roughness workpieces.

[0049] It is understandable that, since the plasma polishing equipment of this embodiment can reduce the deposits on the wire electrode 300, it is beneficial for the electrolyte to flow during polishing and avoids short circuits caused by excessive deposits. Therefore, the plasma polishing equipment of this embodiment can be applied to metal pipes 1000 with smaller diameters, thereby improving the scope of application of the plasma polishing equipment of this embodiment.

[0050] In addition, the reduction of deposits on the wire electrode 300 can facilitate the subsequent excitation of plasma. The diffusion and disappearance of bubbles and plasma generated during the plasma excitation process form an inwardly contracting liquid pressure, which promotes the discharge of local processing products and the renewal of local electrolyte. At the same time, the temperature rises, thereby improving the efficiency of electrolytic processing. Specifically, the generation of bubbles and the disturbance effect on the local electrolyte when they detach from the inner wall of the metal pipe 1000 can promote local mass transfer, thin the mucus layer, make the current density distribution more uniform, and promote the electrolytic processing process. During the electrolysis process, due to the application of high voltage, a large amount of Joule heat is generated at the anode interface (the inner wall of the metal pipe 1000). The metal pipe 1000 is quickly surrounded by oxygen and water vapor. After a stable gas film is formed, the resistance between the cathode and the anode rises rapidly. When the electric field strength between the two electrodes reaches a certain value (for example, 106V·cm-1), a plasma is formed to break through the gas film. When the gas film is broken down to generate plasma, the local volume expands instantly, rushing out the electrolyte on the gas film in the discharge area, and then the plasma collapses and the electrolyte is refilled. This process can enhance local mass transfer and promote the electrolytic machining process. At the same time, some of the plasma energy will diffuse into the surrounding electrolytic environment in the form of heat energy, causing local temperature rise, which can also increase the electrolytic machining rate to a certain extent.

[0051] It is understandable that, since the metal cations flow with the electrolyte, the concentration of metal cations in the electrolyte along the flow direction of the electrolyte will become higher and higher. Based on this, the plasma polishing equipment of this embodiment includes a plurality of magnetic field generating devices 400. The plurality of magnetic field generating devices 400 are distributed along the flow direction of the electrolyte in the metal tube, and the field strength of the magnetic field generated by the plurality of magnetic field generating devices 400 gradually increases, so that the field strength of the magnetic field corresponds to the solubility of the metal cations in the electrolyte. That is, the higher the solubility of the metal cations, the greater the field strength of the magnetic field, so that the metal cations are subjected to a greater Lorentz magnetic force, thereby utilizing the metal cations to flow with the electrolyte.

[0052] Reference Figures 2 to 4 , Figure 2 for Figure 1 Schematic diagram of the structure of the middle support device, wire electrode and magnetic field generating device, Figure 3 for Figure 2 The cross-sectional diagram in Figure 4 for Figure 2 A cross-sectional schematic diagram of another embodiment, in some embodiments, the support device 100 includes a mounting member 130, the mounting member 130 is connected to the base 110, and the mounting member 130 includes a mounting portion 131 distributed with a plurality of winding electrodes 300. The magnetic field generating device 400 includes a plurality of magnetic members 410 (such as Figure 2As shown in FIG. 1 , the magnetic member 410 is, for example, a magnet or an induction coil, and a plurality of magnetic members 410 are respectively mounted on a plurality of mounting portions 131. Also, along the circumference of the linear electrode 300, any two adjacent magnetic members 410, the south pole of one magnetic member 410 faces the north pole of the other magnetic member 410, thereby forming a magnetic field that is close to a ring shape, and the magnetic field generating device 400 has a simple structure and lower cost.

[0053] It should be noted that in the drawings, two magnetic members 410 are provided (eg Figure 3 The magnetic member 410 may be provided with three or four (such as Figure 4 As shown) and any number of five, as long as a similar annular magnetic field can be formed, the annular magnetic field is as shown Figure 5 As shown, the annular magnetic field cannot be interpreted as a circular ring only, as long as it is distributed around the wire electrode 300 .

[0054] Further, Figure 4 and Figure 5 For example, under the action of the electric field, the bubbles move toward the wire electrode 300 with the metal cations. In this embodiment, there are tangential magnetic flux lines on the surface of the wire electrode 300, and the metal cations close to the surface of the wire electrode 300 will be subject to the Lorentz magnetic force along the flow direction of the electrolyte, and the bubbles will be subject to the external force along the flow direction of the electrolyte, which can promote the tiny bubbles to detach from the surface of the wire electrode 300 and be discharged. Because the bubbles are insulated, when the bubbles are placed in the electric field, since the electric field lines are always perpendicular to the surface of the insulator, the shape and size of the bubbles will affect the degree of deflection of the electric field lines, causing the electric field lines around the bubbles to deform, and the electrolyte on the surface of the wire electrode 300 will be locally disturbed under the action of the tangential magnetic field, which can further promote the detachment of the bubbles. In addition, a thin layer area on the surface of the wire electrode 300 where ions diffuse due to the concentration gradient is called a diffusion layer. The concentration gradient in the diffusion layer determines the diffusion rate of the solute to the electrode surface, thereby affecting the electrolysis reaction rate. The thicker the diffusion layer, the slower the solute diffuses to the electrode surface and the lower the electrolysis reaction rate. Due to the eddy current generated by the electrolyte near the diffusion layer under the action of the Lorentz force and the local mass transfer effect caused by the detachment of bubbles, the diffusion layer is thinned, thereby accelerating the electrochemical process.

[0055] Reference Figure 2On the basis of the above embodiment, the plasma polishing equipment further includes a first driving device (not shown in the figure), the first driving device is connected to the mounting member 130, and is used to drive the mounting member 130 to rotate around the wire electrode 300, so that the magnetic field around the wire electrode 300 rotates. For example, the support device 100 also includes two second support members 140 arranged at intervals, and both ends of the mounting member 130 are rotatably connected to the second support member 140, and at least one end is connected to a rotating wheel. The first driving device is set as a driving motor, and the rotating shaft of the driving motor is connected to the rotating wheel through a gear or a belt, so that the mounting member 130 rotates. During the rotation of the mounting member 130, the magnetic field rotates accordingly, so that each moving metal cation has a moment when the moving direction is different from the magnetic field direction. Therefore, each metal cation moving in the electrolyte can be subjected to the Lorentz magnetic force, thereby enhancing the polishing effect.

[0056] Reference Figure 2 In some embodiments, the mounting member 130 is slidably connected to the base 110 so that the mounting member 130 can move along the axial direction of the wire electrode 300. Specifically, a slide groove 111 is provided on the upper surface of the base 110, and the bottom of the second support member 140 is slidably connected in the slide groove 111, or a slide rail is further provided on the upper surface of the base 110, and a slider is provided at the bottom of the second support member 140. The second support member 140 can move relative to the base 110 through the sliding cooperation between the slide rail and the slider, so that the magnetic field generating device 400 moves relative to the metal pipe 1000, so that the metal cations generated at each part of the metal pipe 1000 can be subjected to the Lorentz magnetic force, without the need to distribute the magnetic field generating device 400 along the axial direction of the metal pipe 1000, thereby reducing the equipment cost. During the working process, it can be moved manually, or a third driving device can be set to drive the second support member 140 to rotate, and the third driving device can be set as a cylinder, a hydraulic cylinder or a ball screw.

[0057] Based on the above embodiment, the mounting member 130 includes a plurality of mounting portions 131 and a plurality of connecting blocks 132. The plurality of mounting portions 131 are distributed along the axial direction of the wire electrode 300. The connecting blocks 132 are detachably connected between adjacent mounting portions 131. Thus, different numbers of mounting portions 131 and connecting blocks 132 can be set according to the length of the metal pipe 1000 to be processed, thereby improving the practicality of the plasma polishing equipment of this embodiment.

[0058] In some embodiments, in order to further improve the metal cation discharge efficiency, the plasma polishing equipment also includes a second driving device, which is connected to the wire electrode 300 and is used to drive the wire electrode 300 to move relative to the metal tube. Specifically, the wire electrode 300 can be a hard electrode or a flexible electrode. For example, when the wire electrode 300 is set as a hard electrode, the second driving device can include a driving motor and two driving wheels arranged oppositely, and the wire electrode 300 is clamped between the sides of the two driving wheels. The driving motor is connected to the driving wheel to rotate the driving wheel, thereby driving the wire electrode 300 to move. When the wire electrode 300 is a flexible structure, the second driving device can include a winding drum and a driving motor, the wire electrode 300 is connected to the side of the winding drum, and the driving motor is connected to the winding drum to drive the winding drum to rotate, so that the wire electrode 300 is wound around the side of the winding drum, so as to achieve the purpose of moving the wire electrode 300 in the metal pipe 1000. It is understandable that the wire electrode 300 can carry the deposited metal cations away from the metal pipe 1000 during movement, preventing the accumulation of metal cations and causing a short circuit between the wire electrode 300 and the metal pipe 1000, thereby further improving the safety during the polishing process.

[0059] It should be noted that the movement of the wire electrode 300 can be continuous movement or intermittent movement, and the distance of each movement is the length of the metal pipe 1000, so that all the deposits are taken away from the metal pipe 1000. In addition, in some embodiments, the plasma polishing equipment further includes a fourth driving device, which is used to drive the rotation of the wire electrode 300 so that the metal cations deposited on the wire electrode 300 are more easily separated.

[0060] Reference Figure 1 and Figure 5 , Figure 5 for Figure 1 A schematic diagram of the structure of the cathode electrical connector and the wire electrode. In some embodiments, the cathode electrical connector 510 includes two rollers 511, which are rotatably connected to the support device 100, and at least one of the two rollers 511 is a conductive structure. The roller 511 configured as a conductive structure is connected to the negative pole of the power supply. The wire electrode 300 is clamped between the radial sides of the two rollers 511. During the movement of the wire electrode 300, the roller 511 rotates accordingly, so that the wire electrode 300 and the cathode electrical connector 510 are in rolling friction. On the one hand, it can reduce the noise generated during the polishing process and provide a more comfortable working environment for workers. On the other hand, it can extend the service life of the wire electrode 300, thereby reducing the cost of use.

[0061] Reference Figure 6 , Figure 6 for Figure 1The schematic diagram of the structure of the middle cathode electrical connector and the wire electrode, based on the above embodiment, the radial side surface of at least one of the two rollers 511 has a surrounding limiting groove 5112, and the wire electrode 300 is clamped in the limiting groove 5112. Thus, the position of the wire electrode 300 is limited, so that the position of the wire electrode 300 always approaches the axial position of the metal pipe 1000 during the working process. Prevent the displacement of the wire electrode 300 and cause the equipment to short-circuit, thereby improving the safety of the plasma polishing equipment of this embodiment when in use.

[0062] In some embodiments, the wire electrode 300 is a flexible structure. Therefore, the wire electrode 300 can be inserted into a special-shaped metal pipe 1000. For example, if the metal pipe 1000 is an arc-shaped structure, the flexible wire electrode 300 can be inserted into the arc-shaped metal pipe 1000, so that the plasma polishing device of this embodiment can be used for polishing the arc-shaped metal pipe 1000, thereby improving the applicability of this embodiment.

[0063] On the basis of the above embodiment, the plasma polishing device further comprises an insulating sleeve 600, which is sleeved on the outside of the wire electrode 300, and the insulating sleeve 600 defines a conduction hole, from which the wire electrode 300 is exposed, for example, the insulating sleeve 600 is set as a hollow structure to form a conduction hole, or the plasma polishing device comprises a plurality of insulating sleeves 600 arranged at intervals, and the gaps between the insulating sleeves 600 form a conduction hole. Specifically, the insulating sleeve 600 is sleeved on the outside of the wire electrode 300, so as to ensure that the surface of the wire electrode 300 always maintains a certain distance from the inner wall of the metal pipe 1000 inside the narrow lumen, and can avoid contact with the inner wall of the metal pipe 1000 due to vibration of the wire electrode 300 during movement, further improving the safety of the plasma polishing device of this embodiment when in use. In addition, the reason why the insulating sleeve 600 needs to be provided with a conduction hole is to ensure normal electrolysis, thereby ensuring normal polishing.

[0064] It should be noted that the insulating sleeve 600 can be tightly connected to the surface of the wire electrode 300, and the insulating sleeve 600 can move with the wire electrode 300. During the movement, the local flow rate of the electrolyte can be enhanced, thereby enhancing the mass transfer of the anode (metal pipe 1000) dissolution process, thereby improving the efficiency and quality of the electrolytic processing. The insulating sleeve 600 can also be loosely matched with the wire electrode 300, and the insulating sleeve 600 is fixed during the movement of the wire electrode 300. Therefore, the length of the insulating sleeve 600 only needs to be set to be consistent with the length of the metal pipe 1000, thereby reducing the cost of the insulating sleeve 600.

[0065] On the basis of the above embodiment, the wire electrode 300 is a flexible structure, and the insulating sleeve 600 is a flexible structure, so the wire electrode 300 can be inserted into the special-shaped metal pipe 1000, and the insulating sleeve 600 can be deformed with the wire electrode 300. For example, the metal pipe 1000 is an arc-shaped structure, and the flexible wire electrode 300 can be inserted into the arc-shaped metal pipe 1000, so that the plasma polishing device of this embodiment can be used for polishing the arc-shaped metal pipe 1000, thereby improving the applicability of this embodiment. Alternatively, in some embodiments, the plasma polishing device includes a plurality of insulating sleeves 600, and the plurality of insulating sleeves 600 are distributed at intervals along the axial direction of the wire electrode 300 to avoid the insulating sleeves 600 hindering the deformation of the wire electrode 300, and the wire electrode 300 can be inserted into the special-shaped metal pipe 1000, wherein the gaps between the insulating sleeves 600 form conductive holes.

[0066] Reference Figure 7 and Figure 8 In some embodiments, the plasma polishing device includes a plurality of insulating sleeves 600, the plurality of insulating sleeves 600 are spaced apart along the axial direction of the wire electrode 300, the gaps between the insulating sleeves 600 form a conducting hole, the insulating sleeves 600 are magnetic structures, and the direction from the north pole to the south pole of the insulating sleeves 600 is the same as the flow direction of the electrolyte. Specifically, the electric field, magnetic field and bubble movement direction in the metal pipe 1000 are as follows: Figure 8 As shown, therefore, the bubbles facing the wire electrode 300 are subjected to an external force tangential to the wire electrode 300, causing the bubbles to quickly detach from the surface of the wire electrode 300, thereby improving bubble shielding in a narrow lumen and accelerating the plasma polishing process.

[0067] It is known that the surface of the hydrophobic material has a lower surface energy, which makes its interaction with water molecules weaker. Therefore, when the bubble contacts the surface of the hydrophobic material, the water molecules on the surface of the bubble are more likely to form a thin water film with the surface of the hydrophobic material, thereby reducing the direct contact between the bubble and the surface of the material. The presence of this water film reduces the friction between the bubble and the surface of the material, making it easier for the bubble to stay on the surface of the hydrophobic material. Based on this, in some embodiments, the outer wall of the insulating sleeve is also provided with a hydrophobic structure, for example, the surface can be modified by coating a hydrophilic coating (such as a metal oxide coating) on ​​the surface of the insulating sleeve to enhance wettability and reduce bubble retention. Alternatively, micro-nano array structures such as lattices and stripes can be constructed on the surface by laser or atmospheric plasma etching and other micro-nano patterning processing technologies, while regulating the morphology and microscopic features of the surface, such as micro-pits, micro-grooves, etc. These micro-nano structures change the spreading behavior of the liquid on the surface and improve its wettability by changing the roughness and geometry of the surface. In addition, plasma surface modification technology can also change the chemical composition of the surface by introducing polar functional groups (such as hydroxyl and carboxyl), thereby significantly improving wettability. Improving the wettability of the insulating sleeve surface can help reduce bubble retention and gas shielding effects, promote fluid renewal and circulation, and ensure the continuity of electrochemical reactions, thereby significantly improving polishing efficiency.

[0068] On the basis of the above-mentioned embodiment, the insulating sleeve 600 is detachably connected to the wire electrode 300. The plasma polishing equipment of this embodiment includes a plurality of insulating sleeves 600, and the hydrophilicity of the plurality of insulating sleeves 600 is different. Therefore, when the plasma polishing equipment of this embodiment is used for the metal pipe 1000 of variable diameter, the hydrophilicity and hydrophobicity distribution can be designed for different regions. Specifically. An insulating sleeve 600 with a higher hydrophilicity is used in the region with a larger diameter to accelerate the detachment of bubbles. An insulating sleeve 600 with a lower hydrophilicity is used in the region with a smaller diameter, so as to balance the polishing rate of regions with different diameters and further improve the processing efficiency and uniformity.

[0069] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. Plasma polishing equipment, characterized in that, include: A supporting device, comprising a base and a first supporting member, wherein the first supporting member is connected to the base and is used to support a metal pipe; A liquid supply device, comprising a liquid storage tank and a liquid supply pump, wherein the liquid storage tank is used to store electrolyte, and the liquid supply pump is used to drive the electrolyte to flow in the metal pipe; A wire electrode, used to extend into the metal pipe; An electrical connection assembly, comprising an anode electrical connection member and a cathode electrical connection member, wherein the anode electrical connection member is used to electrically connect the metal pipe to the positive electrode of a power source, and the cathode electrical connection member is electrically connected to the wire electrode and is used to electrically connect to the negative electrode of the power source; The magnetic field generating device is used to generate a magnetic field to make the metal cations subject to Lorentz magnetic force, so as to improve the flow field environment in electrolytic machining.

2. The plasma polishing equipment according to claim 1, characterized in that: The plasma polishing equipment comprises a plurality of magnetic field generating devices, which are distributed along the flow direction of the electrolyte in the metal tube, and the magnetic fields generated by the plurality of magnetic field generating devices gradually increase.

3. The plasma polishing equipment according to claim 1, characterized in that: The magnetic field generating device can generate an annular magnetic field surrounding the wire electrode so that the metal cations are subjected to the Lorentz magnetic force in the same direction as the electrolyte flow.

4. The plasma polishing equipment according to claim 3, characterized in that: The supporting device also includes a mounting member, which is connected to the base, and the mounting member includes a plurality of mounting parts distributed around the wire electrode. The magnetic field generating device includes a plurality of magnetic parts, and the plurality of magnetic parts are respectively installed on the plurality of mounting parts. Along the circumference of the wire electrode, among any two adjacent magnetic parts, the south pole of one magnetic part faces the north pole of the other magnetic part.

5. The plasma polishing equipment according to claim 4, characterized in that: The mounting member is slidably connected to the base so that the mounting member can move along the axial direction of the wire electrode.

6. The plasma polishing equipment according to claim 1, characterized in that: The cathode electrical connector comprises two rollers, the two rollers are rotatably connected to the support device, and at least one of the two rollers is a conductive structure, and the wire electrode is clamped between the radial side surfaces of the two rollers; The plasma polishing equipment also includes a second driving device, which is connected to the wire electrode and is used to drive the wire electrode to move relative to the metal tube.

7. The plasma polishing equipment according to claim 1, characterized in that: The wire electrode is a flexible structure.

8. The plasma polishing equipment according to any one of claims 1 to 7, characterized in that: The plasma polishing equipment further comprises an insulating sleeve, which is sleeved on the outside of the wire electrode. The insulating sleeve defines a conducting hole, and the wire electrode is exposed from the conducting hole.

9. The plasma polishing equipment according to claim 8, characterized in that: The wire electrode is a flexible structure; The insulating sleeve is a flexible structure; or, The plasma polishing equipment comprises a plurality of insulating sleeves, which are spaced apart and distributed along the axial direction of the wire electrode, and the gaps between adjacent insulating sleeves form the conducting holes.

10. The plasma polishing equipment according to claim 8, characterized in that: The plasma polishing equipment includes a plurality of insulating sleeves, which are spaced apart along the axial direction of the wire electrode, and the gaps between adjacent insulating sleeves form the conducting holes. The insulating sleeves are magnetic structures, and the direction from the north pole to the south pole of the insulating sleeves is the same as the flow direction of the electrolyte.

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