Infrared imaging equipment calibration method, device and electronic equipment

Abstract

The present application provides a method, device and electronic device for correcting infrared imaging equipment. In the case of obtaining a reference radiation energy matrix of a target object, the present application determines a correction matrix for correcting the reference radiation energy matrix according to the size of the target object and the position of the target object, and determines to correct the reference radiation energy matrix through the correction matrix to obtain a target radiation energy matrix; the present application determines different correction matrices for the reference radiation energy matrix detected by the infrared imaging equipment according to the size of the target object and the position of the target object, and corrects the detection value of the infrared imaging equipment according to the correction matrix, thereby reducing the influence of factors such as the size of the target object, the optical characteristics of the lens, and the optical path structure on the detection value of the infrared imaging equipment, and improving the detection accuracy of the infrared imaging equipment for radiation energy.

Description

Technical Field

[0001] The present application relates to the field of infrared detection technology, and in particular to a calibration method, device and electronic equipment for infrared imaging equipment. Background Art

[0002] At present, the radiation energy detected by infrared imaging equipment is affected by the radiation of the observed target and the radiation of the internal structure. The radiation of the internal structure will interfere with the imaging of the target, generate stray light, and reduce the contrast of infrared thermal imaging. The radiation of the internal structure can be corrected by external correction. However, the distribution of the radiation of the observed target on the image plane of the infrared imaging equipment will be affected by factors such as the target size, the optical characteristics of the lens, and the structural components in the optical path, resulting in inaccurate radiation energy detected by the infrared imaging equipment. Summary of the invention

[0003] In view of this, the present application provides an infrared imaging device calibration method, apparatus and electronic device to achieve calibration of the radiation energy detected by the infrared imaging device.

[0004] The technical solutions provided by this application are as follows:

[0005] According to an embodiment of the first aspect of the present application, a method for calibrating an infrared imaging device is provided, the method comprising:

[0006] Obtaining a reference radiation energy matrix of the target object; the reference radiation energy matrix is ​​composed of radiation energy values ​​obtained by detecting the target object by each pixel in the infrared imaging device;

[0007] Determining a correction matrix for correcting the reference radiation energy matrix according to the size of the target object and the position of the target object;

[0008] The reference radiation energy matrix is ​​corrected by the correction matrix to obtain a target radiation energy matrix.

[0009] Optionally, determining a correction matrix for correcting the reference radiation energy matrix according to the size of the target object and the position of the target object includes:

[0010] If the imaging size of the target object meets the first set size, or the connected area of ​​the target object is within the edge range of the field of view of the infrared imaging device and the area of ​​the connected area meets the first requirement, then the correction matrix for correcting the reference radiation energy matrix is ​​determined to be the first matrix; the first matrix is ​​obtained based on the background data collected by the infrared imaging device; the background data includes data collected from an object at a specified high temperature and an object at a specified low temperature respectively; the imaging size of the object meets the first set size to indicate that the object fills the field of view of the infrared imaging device; the first requirement means that the area of ​​the connected area is larger than the specified area, and the specified area is determined according to the area of ​​the detector pixel surface in the infrared imaging device.

[0011] Optionally, determining a correction matrix for correcting the reference radiation energy matrix according to the size of the target object and the position of the target object includes:

[0012] If the area of ​​the connected area of ​​the target object meets the second requirement, the correction matrix for correcting the reference radiation energy matrix is ​​determined to be the second matrix; the second matrix is ​​obtained by collecting background data from each of the M×N regional grids for an object at a specified high temperature and an object at a specified low temperature; the M×N regional grids are obtained by dividing the detector pixel surface in the infrared imaging device; the second requirement is that the area of ​​the connected area is less than K times the area of ​​the regional grid, and K is greater than 1.

[0013] Optionally, determining a correction matrix for correcting the reference radiation energy matrix according to the size of the target object and the position of the target object includes:

[0014] If the connected area of ​​the target object is not within the edge range of the field of view of the infrared imaging device and the area of ​​the connected area meets the third requirement, or the connected area of ​​the target object is within the edge range of the field of view of the infrared imaging device and the area of ​​the connected area meets the fourth requirement, then determine that the correction matrix for correcting the reference radiation energy matrix is ​​the first matrix and the second matrix;

[0015] Among them, the first matrix is ​​obtained based on the background data collected by the infrared imaging device; the background data includes data collected from objects at a specified high temperature and objects at a specified low temperature respectively; the second matrix is ​​obtained by collecting background data from objects at a specified high temperature and objects at a specified low temperature respectively in each of M×N regional grids; the M×N regional grids are obtained by dividing the detector pixel surface in the infrared imaging device.

[0016] Optionally, the third requirement means that the area of ​​the connected region is not less than K times the area of ​​the regional grid and not greater than the area of ​​the detector pixel surface, and K is greater than 1; when the connected region of the target object is not within the edge range of the field of view of the infrared imaging device and the area of ​​the connected region meets the third requirement, the reference radiation energy matrix is ​​corrected by the correction matrix to obtain the target radiation energy matrix, including:

[0017] Determine a first reference matrix according to the first matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the area of ​​the pixel surface;

[0018] Determine a second reference matrix according to the second matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the area of ​​the pixel surface;

[0019] Determine a first target reference matrix according to the first reference matrix and the second reference matrix;

[0020] The target radiation energy matrix is ​​determined according to the product of the first target reference matrix and the reference radiation energy matrix.

[0021] Optionally, the fourth requirement refers to that the area of ​​the connected region is not less than K times the area of ​​the regional grid and not greater than a specified area, the specified area is determined according to the area of ​​the pixel surface, and K is greater than 1; when the connected region of the target object is within the edge range of the field of view of the infrared imaging device and the area of ​​the connected region meets the fourth requirement, the reference radiation energy matrix is ​​corrected by the correction matrix to obtain the target radiation energy matrix, including:

[0022] Determine a third reference matrix according to the first matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the designated area;

[0023] Determine a fourth reference matrix according to the second matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the designated area;

[0024] Determine a second target reference matrix according to the third reference matrix and the fourth reference matrix;

[0025] The target radiation energy matrix is ​​determined according to the product of the second target reference matrix and the reference radiation energy matrix.

[0026] Optionally, the second matrix is ​​obtained in the following manner:

[0027] For each of the M×N regional grids, background data corresponding to the grid is collected; the background data includes data collected from an object at a specified high temperature and an object at a specified low temperature, respectively, and the area occupied by the object at the specified high temperature and the object at the low temperature includes the regional grid and is less than K times the area of ​​the regional grid;

[0028] For each regional grid, a compensation coefficient matrix corresponding to the regional grid is determined according to the background data corresponding to the regional grid;

[0029] The compensation coefficient matrix corresponding to each regional grid is spliced ​​according to the position of the regional grid in the M×N regional grids to obtain the second matrix.

[0030] Optionally, the second matrix is ​​obtained in the following manner:

[0031] A first matrix is ​​obtained based on background data collected by the infrared imaging device; the background data includes data collected from an object at a specified high temperature and an object at a specified low temperature respectively; the imaging size of the object satisfies a first set size, so as to indicate that the object fills the field of view of the infrared imaging device;

[0032] According to the radiation energy intensity distribution of all object points included in the object at the specified high temperature and the radiation energy intensity distribution of all object points included in the object at the specified low temperature, a first radiation energy difference received by each pixel in the pixel plane is determined to obtain a first radiation energy difference matrix;

[0033] When the imaging size of the object at the specified high temperature and the object at the specified low temperature does not meet the first set size but meets the second set size, the second radiation energy difference received by each pixel in the pixel plane is determined according to the radiation energy intensity distribution of all object points included in the object at the specified high temperature and the radiation energy intensity distribution of all object points included in the object at the specified low temperature, and a second radiation energy difference matrix is ​​obtained; the imaging size of the object does not meet the first set size but meets the second set size, so as to indicate that the object does not fill the field of view of the infrared imaging device, but fills any one of the M×N area grids;

[0034] Determine a target compensation matrix according to the first radiation energy difference matrix and the second radiation energy difference matrix;

[0035] The second matrix is ​​determined according to the target compensation matrix and the first matrix.

[0036] According to an embodiment of the second aspect of the present application, there is provided an infrared imaging device calibration device, the device comprising:

[0037] An obtaining unit, used for obtaining a reference radiation energy matrix of the target object; the reference radiation energy matrix is ​​composed of radiation energy values ​​obtained by detecting the target object by each pixel in the infrared imaging device;

[0038] A determination unit, configured to determine a correction matrix for correcting the reference radiation energy matrix according to the size of the target object and the position of the target object;

[0039] The correction unit is used to correct the reference radiation energy matrix by using the correction matrix to obtain a target radiation energy matrix.

[0040] According to an embodiment of the third aspect of the present application, an electronic device is provided, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the method described in the first aspect when executing the program.

[0041] It can be seen from the above technical scheme that when obtaining the reference radiation energy matrix of the target object, the present application determines the correction matrix for correcting the reference radiation energy matrix according to the size of the target object and the position of the target object, and determines to correct the reference radiation energy matrix through the correction matrix to obtain the target radiation energy matrix; the present application determines different correction matrices for the reference radiation energy matrix detected by the infrared imaging device according to the size of the target object and the position of the target object, and corrects the detection value of the infrared imaging device according to the correction matrix, thereby reducing the influence of factors such as the size of the target object, the optical characteristics of the lens, and the optical path structure on the detection value of the infrared imaging device, and improving the detection accuracy of the infrared imaging device for radiation energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0043] Figure 1 A flowchart of a calibration method for an infrared imaging device provided in an embodiment of the present application;

[0044] Figure 2 A schematic diagram of dividing the detector pixel surface into M×N area grids provided in an embodiment of the present application;

[0045] Figure 3 A schematic diagram of a specific process of a calibration method for an infrared imaging device provided in an embodiment of the present application;

[0046] Figure 4 A schematic diagram of a second matrix determination process provided in an embodiment of the present application;

[0047] Figure 5 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0048] Figure 6 A structural diagram of an infrared imaging device correction device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0049] In order to enable those skilled in the art to better understand the technical solutions provided by the embodiments of the present application and to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application are further described in detail below in conjunction with the accompanying drawings.

[0050] The radiation energy of the target object detected by the infrared imaging device will be affected by the radiation of the observed target and the radiation of the internal structure.

[0051] Among them, the radiation of the internal structure will interfere with the target imaging, generate stray light, and reduce the contrast of infrared thermal imaging. At present, the radiation of the internal structure can be corrected by external block correction and other methods. For example, a standard black body source (external block) with a known temperature can be used to provide a known radiation amount to correct the sensor reading of the device and ensure the accuracy and consistency of the imaging results.

[0052] However, the distribution of the radiation of the observed target on the image plane of the infrared imaging device will be affected by factors such as the target size, the optical properties of the lens, and the structural components in the optical path, resulting in inaccurate radiation energy detection, which in turn leads to uneven images and / or inaccurate temperature measurements in the infrared imaging device.

[0053] Based on this, the present application proposes a method for calibrating an infrared imaging device to calibrate the radiation energy detected by the infrared imaging device so that the infrared imaging device presents better uniformity in both image and temperature.

[0054] Please refer to Figure 1 , Figure 1 A flowchart of a method for calibrating an infrared imaging device provided in an embodiment of the present application.

[0055] like Figure 1 As shown, the method may include the following steps:

[0056] Step 101: Obtain a reference radiation energy matrix of a target object.

[0057] In this embodiment, the target object refers to an object observed through the field of view of the infrared imaging device, and the reference radiation energy matrix is ​​composed of radiation energy values ​​obtained by detecting the target object by each pixel in the infrared imaging device.

[0058] As an embodiment, each element in the reference radiation energy matrix corresponds to a pixel at a corresponding position in the pixel plane of the infrared imaging device detector, and the radiation energy value obtained by each pixel in the infrared imaging device when detecting the target object can be used as the element at the corresponding position in the reference radiation energy matrix.

[0059] At this point, the description of step 101 ends, and step 102 is executed next.

[0060] Step 102: determining a correction matrix for correcting a reference radiation energy matrix according to the size and position of the target object.

[0061] In this embodiment, different correction matrices may be used to correct the reference radiation energy matrix according to the size and position of the target object.

[0062] Exemplarily, the correction matrix for correcting the reference radiation energy matrix may include a first matrix and / or a second matrix.

[0063] In this embodiment, the first matrix can be a correction coefficient matrix (denoted as K matrix) in a two-point correction model. The first matrix can be obtained based on background data collected by an infrared imaging device. The background data includes data collected from objects at a specified high temperature and objects at a specified low temperature.

[0064] Among them, the imaging size of the above-mentioned object satisfies the first set size, so as to indicate that the object fills the field of view of the infrared imaging device, that is, in this embodiment, the K matrix is ​​actually calculated based on the high-temperature uniform surface background data and the low-temperature uniform surface background data filling the field of view collected by the infrared imaging device.

[0065] Specifically, the method of calculating the first matrix based on the high and low temperature background that fills the field of view is a common method in the related art and will not be described in detail here.

[0066] In this embodiment, the second matrix (denoted as K' matrix) can be obtained by collecting background data of an object at a specified high temperature and an object at a specified low temperature in each of the M×N regional grids; the M×N regional grids are obtained by dividing the detector pixel surface in the infrared imaging device.

[0067] Please refer to Figure 2 , Figure 2 A schematic diagram of dividing the detector pixel surface into M×N area grids provided in an embodiment of the present application.

[0068] like Figure 2 As shown, the pixel surface can be divided into multiple area grids of the same size, wherein the length and width of each area grid can be configured according to actual needs, and the present application does not impose any restrictions on this.

[0069] In this embodiment, a specific method for determining the second matrix will be described in detail below and will not be repeated here.

[0070] At this point, the description of step 102 ends, and step 103 is executed next.

[0071] Step 103: Correct the reference radiation energy matrix using the correction matrix to obtain the target radiation energy matrix.

[0072] In this embodiment, the reference radiation energy matrix may be corrected by the correction matrix determined in step 102 to obtain a final corrected target radiation energy matrix.

[0073] The following describes, in different situations, how to determine a correction matrix for correcting a reference radiation energy matrix according to the size and position of a target object, and how to correct the reference radiation energy matrix according to the correction matrix.

[0074] In case one, if the imaging size of the target object meets the first set size, or the connected area of ​​the target object is within the edge range of the field of view of the infrared imaging device and the area of ​​the connected area meets the first requirement, then the correction matrix for correcting the reference radiation energy matrix is ​​determined to be the first matrix.

[0075] In this embodiment, the imaging size of the target object satisfies the first set size, which means that the target object fills the field of view of the infrared imaging device.

[0076] As an example, the connected area of ​​the target object may be determined in the following manner:

[0077] Assuming that the target radiation energy is E1, the area with a radiation energy range of (E1±△E) and connected is defined as the connected area of ​​the target object; generally, △E=E1×10%.

[0078] The connected areas of the target objects mentioned below can all be determined by the above method, which will not be described in detail later.

[0079] In this embodiment, the area of ​​the connected region meets the first requirement, which means that the area of ​​the connected region is larger than a specified area, and the specified area is determined according to the area of ​​the detector pixel surface in the infrared imaging device.

[0080] As an embodiment, the designated area may be 1 / 4, 1 / 3, etc. of the detector pixel surface area, and the present application does not impose any limitation on this.

[0081] In this embodiment, taking the designated area as 1 / 4 of the area of ​​the detector pixel surface as an example, when the target object fills the field of view or the connected area of ​​the target object occupies more than one quarter of the area of ​​the detector pixel surface and is at the edge of the field of view, the K matrix (first matrix) can be used alone to perform non-uniformity correction on the reference radiation energy matrix of the target object collected by the infrared imaging device, that is, the K matrix is ​​used as the correction matrix.

[0082] Specifically, the following methods can be used:

[0083] Y i,j =G i,j ·K i,j ·(X i,j -B i,j )+C i,j ;

[0084] Among them, Y is the response output value of the detector pixel (i.e., the target radiation energy matrix obtained after correction), (i, j) is the coordinate of the pixel, G is the gain coefficient, K is the non-uniformity correction coefficient (i.e., the above-mentioned K matrix), X is the magnitude of the radiation energy received by the detector when observing the target, X includes two parts: the radiation of the target and the radiation of the internal structure, B is the magnitude of the radiation energy received by the detector when calibrating the baffle, XB is the reference radiation energy matrix, and C is the offset coefficient. It should be noted that the above-mentioned G, B, and C can all be obtained by common methods in related technologies, which will not be repeated here.

[0085] Case 2: If the area of ​​the connected region of the target object meets the second requirement, the correction matrix for correcting the reference radiation energy matrix is ​​determined to be the second matrix.

[0086] In this embodiment, the second requirement is that the area of ​​the connected region is less than K times the area of ​​the regional grid, where K is greater than 1. For example, the area of ​​the connected region of the target object is less than 2 times the area of ​​the regional grid, and this application does not limit this.

[0087] In this embodiment, taking the case where the area of ​​the connected area of ​​the target object is less than twice the area of ​​the regional grid as an example, when the area of ​​the connected area of ​​the target object is less than twice the area of ​​the regional grid, the K′ matrix (the second matrix) can be used alone to perform non-uniformity correction on the reference radiation energy matrix of the target object collected by the infrared imaging device, that is, the K′ matrix is ​​used as the correction matrix.

[0088] Specifically, the following methods can be used:

[0089] Y i,j =G i,j K′ i,j ·(X i,j -B i,j )+C i,j ;

[0090] Among them, Y is the response output value of the detector pixel (i.e., the target radiation energy matrix obtained after correction), (i, j) is the coordinate of the pixel, G is the gain coefficient, K' is the non-uniformity correction coefficient (i.e., the above K' matrix), X is the radiation energy received by the detector when observing the target, X includes the radiation of the target and the radiation of the internal structure, B is the radiation energy received by the detector when calibrating the baffle, XB is the reference radiation energy matrix, and C is the offset coefficient. It should be noted that the above G, B, and C can all be obtained by common methods in related technologies, which will not be repeated here.

[0091] Case three, if the connected area of ​​the target object is not within the edge range of the field of view of the infrared imaging device and the area of ​​the connected area meets the third requirement, or the connected area of ​​the target object is within the edge range of the field of view of the infrared imaging device and the area of ​​the connected area meets the fourth requirement, then the correction matrix for correcting the reference radiation energy matrix is ​​determined to be the first matrix and the second matrix.

[0092] In this embodiment, situation three is further divided into two specific situations:

[0093] (1) The connected area of ​​the target object is not within the edge of the field of view of the infrared imaging device and the area of ​​the connected area meets the third requirement.

[0094] As an embodiment, the third requirement means that the area of ​​the connected region is not less than K times the area of ​​the regional grid and not greater than the area of ​​the detector pixel surface, where K is greater than 1. For example, the area of ​​the connected region is not less than 2 times the area of ​​the regional grid and not greater than the area of ​​the detector pixel surface.

[0095] At this time, the first reference matrix can be determined according to the first matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the area of ​​the pixel surface;

[0096] Determine a second reference matrix according to the second matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the area of ​​the pixel surface;

[0097] Determine a first target reference matrix according to the first reference matrix and the second reference matrix;

[0098] The target radiation energy matrix is ​​determined according to the product of the first target reference matrix and the reference radiation energy matrix.

[0099] The following describes this situation through a specific embodiment. Taking the example that the area of ​​the connected region is not less than 2 times the area of ​​the regional grid and not greater than the area of ​​the detector pixel surface, when the connected region of the target object is not at the edge of the field of view and the area is between 2 times the grid area and the area of ​​the entire pixel surface, the reference radiation energy matrix of the target object collected by the infrared imaging device can be corrected for non-uniformity using the K matrix (first matrix) and the K' matrix (second matrix), that is, the K' matrix and the K matrix are used as correction matrices. Perform non-uniformity correction:

[0100] Specifically, the following methods can be used:

[0101]

[0102] Among them, Y is the response output value of the detector pixel (that is, the target radiation energy matrix obtained after correction), (i, j) is the coordinate of the pixel, G is the gain coefficient, K is the first non-uniform correction coefficient (that is, the above-mentioned K matrix), K' is the second non-uniform correction coefficient (that is, the above-mentioned K' matrix), X is the magnitude of the radiation energy received by the detector when observing the target, X includes two parts: the radiation of the target and the radiation of the internal structure, B is the magnitude of the radiation energy received by the detector when calibrating the baffle, XB is the reference radiation energy matrix, and C is the offset coefficient. A0 is the area of ​​the target connected area, A1 is the grid area, and A2 is the area of ​​the entire pixel surface. It should be noted that the above G, B, and C can all be obtained by common methods in related technologies, which will not be repeated here.

[0103] (2) The connected area of ​​the target object is within the edge of the field of view of the infrared imaging device and the area of ​​the connected area meets the fourth requirement.

[0104] As an embodiment, the fourth requirement means that the area of ​​the connected region is not less than K times the area of ​​the regional grid and not greater than a specified area. The specified area is determined according to the area of ​​the pixel surface, and K is greater than 1. For example, the area of ​​the connected region is not less than 2 times the area of ​​the regional grid and not greater than 1 / 4 of the area of ​​the pixel surface.

[0105] At this time, the third reference matrix can be determined according to the first matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the specified area;

[0106] Determine a fourth reference matrix according to the second matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the specified area;

[0107] Determine a second target reference matrix according to the third reference matrix and the fourth reference matrix;

[0108] The target radiation energy matrix is ​​determined according to the product of the second target reference matrix and the reference radiation energy matrix.

[0109] The following describes this situation through a specific embodiment. Take the case where the connected area of ​​the target object is at the edge of the field of view of the infrared imaging device and the area of ​​the connected area is not less than 2 times the area of ​​the regional grid and not more than 1 / 4 of the area of ​​the pixel surface as an example. When the connected area of ​​the target object is at the edge of the field of view and the area is between 2 times the grid area and 1 / 4 of the area of ​​the pixel surface, the reference radiation energy matrix of the target object collected by the infrared imaging device can be corrected for non-uniformity using the K matrix (first matrix) and the K' matrix (second matrix), that is, the K' matrix and the K matrix are used as correction matrices. Perform non-uniformity correction:

[0110] Specifically, the following methods can be used:

[0111]

[0112] Among them, Y is the response output value of the detector pixel (that is, the target radiation energy matrix obtained after correction), (i, j) is the coordinate of the pixel, G is the gain coefficient, K is the first non-uniform correction coefficient (that is, the above-mentioned K matrix), K' is the second non-uniform correction coefficient (that is, the above-mentioned K' matrix), X is the magnitude of the radiation energy received by the detector when observing the target, X includes two parts: the radiation of the target and the radiation of the internal structure, B is the magnitude of the radiation energy received by the detector when calibrating the baffle, XB is the reference radiation energy matrix, and C is the offset coefficient. A0 is the area of ​​the target connected area, A1 is the grid area, and A2 is the area of ​​the entire pixel surface. It should be noted that the above G, B, and C can all be obtained by common methods in related technologies, which will not be repeated here.

[0113] So far, the description of the process of selecting the correction matrix and correcting the reference radiation energy by using the correction matrix is ​​completed.

[0114] The method of determining the second matrix (K' matrix) is described below.

[0115] In this embodiment, there are two methods for determining the second matrix:

[0116] (1) For each of the M×N regional grids, background data corresponding to the grid is collected; the background data includes data collected from an object at a specified high temperature and an object at a specified low temperature, respectively; the area occupied by the object at the specified high temperature and the object at the specified low temperature includes the regional grid and is less than K times the area of ​​the regional grid;

[0117] For each regional grid, a compensation coefficient matrix corresponding to the regional grid is determined according to the background data corresponding to the regional grid;

[0118] The compensation coefficient matrix corresponding to each regional grid is spliced ​​according to the position of the regional grid in the M×N regional grids to obtain a second matrix.

[0119] In this embodiment, the method for determining the K' matrix is ​​similar to the method for determining the K matrix. The compensation coefficient matrix corresponding to each regional grid, that is, the local K matrix, is determined separately, and then the compensation coefficient matrix corresponding to each regional grid is spliced ​​into a complete K' matrix (second matrix), which will not be repeated here.

[0120] As an embodiment, when calibrating the K′ matrix, a pre-configured tool (calibration-specific tool) may be used for calibration, and the status of high and low temperature objects and infrared imaging equipment may be controlled by the tool.

[0121] (2) obtaining a first matrix based on background data collected by the infrared imaging device; the background data includes data collected from an object at a specified high temperature and an object at a specified low temperature respectively; the imaging size of the object satisfies a first set size, so as to indicate that the object fills the field of view of the infrared imaging device;

[0122] According to the radiation energy intensity distribution of all object points of the object at the specified high temperature and the radiation energy intensity distribution of all object points of the object at the specified low temperature, a first radiation energy difference received by each pixel in the pixel plane is determined to obtain a first radiation energy difference matrix;

[0123] When the imaging size of the object at the specified high temperature and the object at the specified low temperature does not meet the first set size but meets the second set size, the second radiation energy difference received by each pixel in the pixel plane is determined according to the radiation energy intensity distribution of all object points included in the object at the specified high temperature and the radiation energy intensity distribution of all object points included in the object at the specified low temperature, and a second radiation energy difference matrix is ​​obtained; the imaging size of the object does not meet the first set size but meets the second set size, so as to indicate that the object does not fill the field of view of the infrared imaging device, but fills any one of the M×N area grids;

[0124] Determine a target compensation matrix according to the first radiation energy difference matrix and the second radiation energy difference matrix;

[0125] A second matrix is ​​determined according to the target compensation matrix and the first matrix.

[0126] Specifically, the detector pixel surface can be divided into M×N regional grids, the target compensation matrix A of the K matrix can be obtained by simulation or measurement, and then the K′ matrix can be calculated, specifically:

[0127] K′ i,j =K i,j ·Ai,j

[0128] Among them, K ′ The matrix is ​​a non-uniform compensation matrix when the high and low temperature targets do not fill the entire field of view.

[0129] The calculation method of the compensation coefficient matrix specifically includes:

[0130] Simulate or measure the energy distribution of a single object point (small object point) on the image plane. Generally, the energy distribution of a single object point on the image plane is similar to the energy intensity distribution of the Airy disk, that is:

[0131]

[0132] Where I0 is the intensity of the central energy, h is the distance relative to the center, λ is the wavelength, and α is a constant.

[0133] Furthermore, the radiation energy E corresponding to the pixel (i, j) is i,j The total radiation energy accumulated by all object points corresponding to the image surface:

[0134]

[0135] Where S is the area of ​​the pixel, h i0,j0 is the distance between pixel (i, j) and pixel (i0, j0). I and J are the maximum horizontal and vertical coordinates of the pixel, respectively. The radiation energy intensity is the radiation energy per unit area.

[0136] Correspondingly, the difference in radiation energy received by the pixel when the high and low temperature targets fill the field of view is recorded as E i,j When the high and low temperature targets do not fill the field of view but fill the grid, the difference in radiation energy received by the pixel is recorded as E′ i,j ,but:

[0137]

[0138] in,

[0139]

[0140] Among them, I1 and J1 are the maximum horizontal and vertical coordinates of the pixel in the image plane corresponding to the high and low temperature targets, respectively, and I′ is the energy distribution of the background radiation.

[0141] According to the above formula, the target compensation matrix A of the K matrix can be determined, and the K′ matrix can be further calculated based on the K matrix and the target compensation matrix A.

[0142] Please refer to Figure 3 , Figure 3A schematic diagram of a specific process flow of a method for calibrating an infrared imaging device provided in an embodiment of the present application.

[0143] like Figure 3 Specifically, the process includes:

[0144] Calibrate the first matrix, denoted as K matrix;

[0145] The detector pixel surface is divided into M×N regional grids, and the compensation coefficient matrix A of the K matrix (denoted as K' matrix) of each grid is obtained by simulation or actual measurement, where K'=K*A;

[0146] The K and / or K' matrices are used to perform non-uniformity correction according to the size and position of the target.

[0147] Please refer to Figure 4 , Figure 4 A schematic diagram of a second matrix determination process provided in an embodiment of the present application.

[0148] like Figure 4 As shown, the method includes:

[0149] Simulate or measure the energy intensity distribution of a single object point (small object point) on the image plane;

[0150] Calculate the radiation energy received by the pixel, which is the sum of the radiation energy accumulated by all object points corresponding to the image surface;

[0151] Calculate the compensation coefficient matrix, which is the ratio of the inverse of the radiation energy when the high and low temperature targets do not fill the field of view and fill the field of view.

[0152] The specific method for determining the second matrix and the method for correcting the reference radiation matrix according to the correction matrix have been described in detail above and will not be repeated here.

[0153] This concludes the description of the two methods for determining the K' matrix.

[0154] In this embodiment, the area of ​​the pixel surface is the sum of the areas of all pixels, that is, the field of view area of ​​the infrared imaging device. The area of ​​the pixel surface is the same as the area referred to by the field of view area, and the connected area of ​​the target object actually refers to the area of ​​the pixels occupied by the target imaging.

[0155] This concludes Figure 1 Description of the calibration method for mid-infrared imaging equipment.

[0156] When obtaining a reference radiation energy matrix of the target object, the present application determines a correction matrix for correcting the reference radiation energy matrix according to the size of the target object and the position of the target object, and corrects the reference radiation energy matrix through the correction matrix to obtain the target radiation energy matrix; the present application determines different correction matrices for the reference radiation energy matrix detected by the infrared imaging device according to the size of the target object and the position of the target object, and corrects the detection value of the infrared imaging device according to the correction matrix, thereby reducing the influence of factors such as the size of the target object, the optical characteristics of the lens, and the optical path structure on the detection value of the infrared imaging device, and improving the detection accuracy of the infrared imaging device for radiation energy.

[0157] Please refer to Figure 5 , Figure 5 It is a schematic structural diagram of an electronic device proposed in an embodiment of the present application. At the hardware level, the electronic device includes a processor, an internal bus, a network interface, a memory, and a non-volatile memory, and of course may also include hardware required for other services. The processor reads the corresponding computer program from the non-volatile memory into the memory and then runs it, forming a terminal interaction device at the logical level. Of course, in addition to the software implementation method, this application does not exclude other implementation methods, such as logic devices or a combination of software and hardware, etc., that is to say, the execution subject of the following processing flow is not limited to each logic unit, but can also be hardware or logic devices.

[0158] Please refer to Figure 6 , Figure 6 1 is a structural diagram of an infrared imaging device correction device proposed in an embodiment of the present application. Figure 6 As shown, the device may include an obtaining unit 601, a determining unit 602, and a correcting unit 603. Specifically, the device includes:

[0159] An obtaining unit 601 is used to obtain a reference radiation energy matrix of the target object; the reference radiation energy matrix is ​​composed of radiation energy values ​​obtained by detecting the target object by each pixel in the infrared imaging device;

[0160] A determination unit 602, configured to determine a correction matrix for correcting a reference radiation energy matrix according to the size of the target object and the position of the target object;

[0161] The correction unit 603 is used to correct the reference radiation energy matrix by using the correction matrix to obtain the target radiation energy matrix.

[0162] Optionally, the determining unit 602 is specifically configured to:

[0163] If the imaging size of the target object meets the first set size, or the connected area of ​​the target object is within the edge range of the field of view of the infrared imaging device and the area of ​​the connected area meets the first requirement, then the correction matrix for correcting the reference radiation energy matrix is ​​determined to be the first matrix; the first matrix is ​​obtained based on the background data collected by the infrared imaging device; the background data includes data collected from an object at a specified high temperature and an object at a specified low temperature respectively; the imaging size of the object meets the first set size to indicate that the object fills the field of view of the infrared imaging device; the first requirement means that the area of ​​the connected area is greater than the specified area, and the specified area is determined based on the area of ​​the detector pixel surface in the infrared imaging device.

[0164] Optionally, the determining unit 602 is specifically configured to:

[0165] If the area of ​​the connected area of ​​the target object meets the second requirement, the correction matrix for correcting the reference radiation energy matrix is ​​determined to be the second matrix; the second matrix is ​​obtained by collecting background data for an object at a specified high temperature and an object at a specified low temperature in each of the M×N regional grids; the M×N regional grids are obtained by dividing the detector pixel surface in the infrared imaging device; the second requirement is that the area of ​​the connected area is less than K times the area of ​​the regional grid, and K is greater than 1.

[0166] Optionally, the determining unit 602 is specifically configured to:

[0167] If the connected area of ​​the target object is not within the edge range of the field of view of the infrared imaging device and the area of ​​the connected area meets the third requirement, or the connected area of ​​the target object is within the edge range of the field of view of the infrared imaging device and the area of ​​the connected area meets the fourth requirement, then determine that the correction matrix for correcting the reference radiation energy matrix is ​​the first matrix and the second matrix;

[0168] Among them, the first matrix is ​​obtained based on the background data collected by the infrared imaging device; the background data includes data collected from objects at a specified high temperature and objects at a specified low temperature respectively; the second matrix is ​​obtained by collecting background data from objects at a specified high temperature and objects at a specified low temperature respectively in each of the M×N regional grids; the M×N regional grids are obtained by dividing the detector pixel surface in the infrared imaging device.

[0169] Optionally, the third requirement means that the area of ​​the connected region is not less than K times the area of ​​the regional grid and not greater than the area of ​​the detector pixel surface, where K is greater than 1; when the connected region of the target object is not within the edge range of the field of view of the infrared imaging device and the area of ​​the connected region meets the third requirement, the correction unit 603 is specifically used to:

[0170] Determine a first reference matrix according to the first matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the area of ​​the pixel surface;

[0171] Determine a second reference matrix according to the second matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the area of ​​the pixel surface;

[0172] Determine a first target reference matrix according to the first reference matrix and the second reference matrix;

[0173] The target radiation energy matrix is ​​determined according to the product of the first target reference matrix and the reference radiation energy matrix.

[0174] Optionally, the fourth requirement means that the area of ​​the connected region is not less than K times the area of ​​the regional grid and not greater than a specified area, the specified area is determined according to the area of ​​the pixel surface, and K is greater than 1; when the connected region of the target object is within the edge range of the field of view of the infrared imaging device and the area of ​​the connected region meets the fourth requirement, the correction unit 603 is specifically used to:

[0175] Determine a third reference matrix according to the first matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the specified area;

[0176] Determine a fourth reference matrix according to the second matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the specified area;

[0177] Determine a second target reference matrix according to the third reference matrix and the fourth reference matrix;

[0178] The target radiation energy matrix is ​​determined according to the product of the second target reference matrix and the reference radiation energy matrix.

[0179] Optionally, the second matrix can be obtained by:

[0180] For each of the M×N regional grids, background data corresponding to the grid is collected; the background data includes data collected from an object at a specified high temperature and an object at a specified low temperature, respectively; the area occupied by the object at the specified high temperature and the object at the low temperature includes the regional grid and is less than K times the area of ​​the regional grid;

[0181] For each regional grid, a compensation coefficient matrix corresponding to the regional grid is determined according to the background data corresponding to the regional grid;

[0182] The compensation coefficient matrix corresponding to each regional grid is spliced ​​according to the position of the regional grid in the M×N regional grids to obtain a second matrix.

[0183] Optionally, the second matrix can also be obtained by:

[0184] A first matrix is ​​obtained based on background data collected by the infrared imaging device; the background data includes data collected from an object at a specified high temperature and an object at a specified low temperature respectively; the imaging size of the object satisfies a first set size, so as to indicate that the object fills the field of view of the infrared imaging device;

[0185] According to the radiation energy intensity distribution of all object points of the object at the specified high temperature and the radiation energy intensity distribution of all object points of the object at the specified low temperature, a first radiation energy difference received by each pixel in the pixel plane is determined to obtain a first radiation energy difference matrix;

[0186] When the imaging size of the object at the specified high temperature and the object at the specified low temperature does not meet the first set size but meets the second set size, the second radiation energy difference received by each pixel in the pixel plane is determined according to the radiation energy intensity distribution of all object points included in the object at the specified high temperature and the radiation energy intensity distribution of all object points included in the object at the specified low temperature, and a second radiation energy difference matrix is ​​obtained; the imaging size of the object does not meet the first set size but meets the second set size, so as to indicate that the object does not fill the field of view of the infrared imaging device, but fills any one of the M×N area grids;

[0187] Determine a target compensation matrix according to the first radiation energy difference matrix and the second radiation energy difference matrix;

[0188] A second matrix is ​​determined according to the target compensation matrix and the first matrix.

[0189] So far, completed Figure 6 Description of the calibration device for mid-infrared imaging equipment.

[0190] Correspondingly, in this embodiment, the embodiment of the present application also provides a computer-readable storage medium, on which a number of computer instructions are stored. When the computer instructions are executed, the method disclosed in the above example of the present application can be implemented.

[0191] Exemplarily, the computer-readable storage medium may be any electronic, magnetic, optical or other physical storage device that may contain or store information, such as executable instructions, data, etc. For example, the computer-readable storage medium may be: RAM (Radom Access Memory), volatile memory, non-volatile memory, flash memory, storage drive (such as hard disk drive), solid state drive, any type of storage disk (such as optical disk, DVD, etc.), or similar storage medium, or a combination thereof.

[0192] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of protection of the present application.

Claims

1. A method for calibrating an infrared imaging device, characterized in that: The method includes: Obtaining a reference radiation energy matrix of the target object; the reference radiation energy matrix is ​​composed of radiation energy values ​​obtained by detecting the target object by each pixel in the infrared imaging device; Determining a correction matrix for correcting the reference radiation energy matrix according to the size of the target object and the position of the target object; The reference radiation energy matrix is ​​corrected by the correction matrix to obtain a target radiation energy matrix.

2. The method according to claim 1, characterized in that: Determining a correction matrix for correcting the reference radiation energy matrix according to the size of the target object and the position of the target object includes: If the imaging size of the target object meets the first set size, or the connected area of ​​the target object is within the edge range of the field of view of the infrared imaging device and the area of ​​the connected area meets the first requirement, then the correction matrix for correcting the reference radiation energy matrix is ​​determined to be the first matrix; the first matrix is ​​obtained based on the background data collected by the infrared imaging device; the background data includes data collected from an object at a specified high temperature and an object at a specified low temperature respectively; the imaging size of the object meets the first set size to indicate that the object fills the field of view of the infrared imaging device; the first requirement means that the area of ​​the connected area is larger than the specified area, and the specified area is determined according to the area of ​​the detector pixel surface in the infrared imaging device.

3. The method according to claim 1, characterized in that Determining a correction matrix for correcting the reference radiation energy matrix according to the size of the target object and the position of the target object includes: If the area of ​​the connected area of ​​the target object meets the second requirement, the correction matrix for correcting the reference radiation energy matrix is ​​determined to be the second matrix; the second matrix is ​​obtained by collecting background data from each of the M×N regional grids for an object at a specified high temperature and an object at a specified low temperature; the M×N regional grids are obtained by dividing the detector pixel surface in the infrared imaging device; the second requirement is that the area of ​​the connected area is less than K times the area of ​​the regional grid, and K is greater than 1.

4. The method according to claim 1, characterized in that: Determining a correction matrix for correcting the reference radiation energy matrix according to the size of the target object and the position of the target object includes: If the connected area of ​​the target object is not within the edge range of the field of view of the infrared imaging device and the area of ​​the connected area meets the third requirement, or the connected area of ​​the target object is within the edge range of the field of view of the infrared imaging device and the area of ​​the connected area meets the fourth requirement, then determine that the correction matrix for correcting the reference radiation energy matrix is ​​the first matrix and the second matrix; Among them, the first matrix is ​​obtained based on the background data collected by the infrared imaging device; the background data includes data collected from objects at a specified high temperature and objects at a specified low temperature respectively; the second matrix is ​​obtained by collecting background data from objects at a specified high temperature and objects at a specified low temperature respectively in each of M×N regional grids; the M×N regional grids are obtained by dividing the detector pixel surface in the infrared imaging device.

5. The method according to claim 4, characterized in that The third requirement means that the area of ​​the connected region is not less than K times the area of ​​the regional grid and not greater than the area of ​​the detector pixel surface, and K is greater than 1; when the connected region of the target object is not within the edge range of the field of view of the infrared imaging device and the area of ​​the connected region meets the third requirement, the reference radiation energy matrix is ​​corrected by the correction matrix to obtain the target radiation energy matrix, including: Determine a first reference matrix according to the first matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the area of ​​the pixel surface; Determine a second reference matrix according to the second matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the area of ​​the pixel surface; Determine a first target reference matrix according to the first reference matrix and the second reference matrix; The target radiation energy matrix is ​​determined according to the product of the first target reference matrix and the reference radiation energy matrix.

6. The method according to claim 4, characterized in that The fourth requirement means that the area of ​​the connected region is not less than K times the area of ​​the regional grid and not greater than a specified area, the specified area is determined according to the area of ​​the pixel surface, and K is greater than 1; when the connected region of the target object is within the edge range of the field of view of the infrared imaging device and the area of ​​the connected region meets the fourth requirement, the reference radiation energy matrix is ​​corrected by the correction matrix to obtain the target radiation energy matrix, including: Determine a third reference matrix according to the first matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the designated area; Determine a fourth reference matrix according to the second matrix, the area of ​​the connected region, K times the area of ​​the regional grid, and the designated area; Determine a second target reference matrix according to the third reference matrix and the fourth reference matrix; The target radiation energy matrix is ​​determined according to the product of the second target reference matrix and the reference radiation energy matrix.

7. The method according to any one of claims 3 to 6, characterized in that: The second matrix is ​​obtained by: For each of the M×N regional grids, background data corresponding to the grid is collected; the background data includes data collected from an object at a specified high temperature and an object at a specified low temperature, respectively, and the area occupied by the object at the specified high temperature and the object at the low temperature includes the regional grid and is less than K times the area of ​​the regional grid; For each regional grid, a compensation coefficient matrix corresponding to the regional grid is determined according to the background data corresponding to the regional grid; The compensation coefficient matrix corresponding to each regional grid is spliced ​​according to the position of the regional grid in the M×N regional grids to obtain the second matrix.

8. The method according to any one of claims 3 to 6, characterized in that: The second matrix is ​​obtained by: A first matrix is ​​obtained based on background data collected by the infrared imaging device; the background data includes data collected from an object at a specified high temperature and an object at a specified low temperature respectively; the imaging size of the object satisfies a first set size, so as to indicate that the object fills the field of view of the infrared imaging device; According to the radiation energy intensity distribution of all object points included in the object at the specified high temperature and the radiation energy intensity distribution of all object points included in the object at the specified low temperature, a first radiation energy difference received by each pixel in the pixel plane is determined to obtain a first radiation energy difference matrix; When the imaging size of the object at the specified high temperature and the object at the specified low temperature does not meet the first set size but meets the second set size, the second radiation energy difference received by each pixel in the pixel plane is determined according to the radiation energy intensity distribution of all object points included in the object at the specified high temperature and the radiation energy intensity distribution of all object points included in the object at the specified low temperature, and a second radiation energy difference matrix is ​​obtained; the imaging size of the object does not meet the first set size but meets the second set size, so as to indicate that the object does not fill the field of view of the infrared imaging device, but fills any one of the M×N area grids; Determine a target compensation matrix according to the first radiation energy difference matrix and the second radiation energy difference matrix; The second matrix is ​​determined according to the target compensation matrix and the first matrix.

9. An infrared imaging device calibration device, characterized in that: The device includes: An obtaining unit, used for obtaining a reference radiation energy matrix of the target object; the reference radiation energy matrix is ​​composed of radiation energy values ​​obtained by detecting the target object by each pixel in the infrared imaging device; A determination unit, configured to determine a correction matrix for correcting the reference radiation energy matrix according to the size of the target object and the position of the target object; The correction unit is used to correct the reference radiation energy matrix by using the correction matrix to obtain a target radiation energy matrix.

10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the program, the method according to any one of claims 1 to 8 is implemented.

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