Circuit board inspection apparatus and method

Abstract

The application discloses a circuit board detection device and method, and relates to the technical field of circuit board detection. The circuit board detection device comprises a transfer mechanism, a camera assembly and a backlight light source assembly. The transfer mechanism is used for carrying and moving the circuit board. The camera assembly is arranged above the transfer mechanism. The camera assembly is used for detecting the circuit board when the circuit board moves to a preset detection area. The backlight light source assembly is arranged below the transfer platform. The backlight light source is used for backlighting the circuit board during the detection of the circuit board by the camera assembly. The backlight light source assembly can clearly identify various features on the circuit board, such as straight edges, arc edges, bosses, blind holes, through holes, expansion holes and honeycomb holes, so that the accuracy of the circuit board detection is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board detection, in particular to a circuit board detection device and method. BACKGROUND

[0002] With the rapid development of electronic industry, as a key component of electronic equipment, the quality of circuit board directly affects the performance and reliability of the entire electronic product. Therefore, the detection of circuit board quality is increasingly important. Traditionally, circuit board detection mainly relies on manual visual inspection, however, this method has the problem of low efficiency and is easily affected by human factors, thereby affecting the accuracy of the detection results. SUMMARY

[0003] The main purpose of the present application is to provide a circuit board detection device and method, which aims to improve the accuracy of circuit board detection.

[0004] To achieve the above purpose, the circuit board detection device provided by the present application comprises:

[0005] A transfer mechanism for carrying and moving the circuit board;

[0006] A camera assembly arranged above the transfer mechanism; the camera assembly is used to detect the circuit board when the circuit board moves to a preset detection area;

[0007] A backlight light source assembly arranged below the transfer platform; the backlight light source is used to backlight illuminate the circuit board during the detection of the circuit board by the camera assembly.

[0008] In an embodiment, the transfer mechanism comprises:

[0009] A first guide rail, one side of the first guide rail is a feeding side, and the other side of the first guide rail is a turning-back side;

[0010] A transfer platform in sliding connection with the first guide rail, the transfer platform is made of transparent material; the transfer platform is used to carry the circuit board to move along the first guide rail between the feeding side and the turning-back side.

[0011] In an embodiment, the camera assembly comprises:

[0012] A line-scan camera movably arranged above the transfer mechanism;

[0013] A face array camera movably arranged above the transfer mechanism; the face array camera is arranged on the side of the line-scan camera away from the feeding side.

[0014] In an embodiment, the circuit board detection device further comprises:

[0015] A second guide rail is slidably connected with the line-scan camera, and is arranged perpendicularly to the first guide rail. The second guide rail is configured to move the line-scan camera in a direction perpendicular to the first guide rail.

[0016] A third guide rail is slidably connected with the area-scan camera, and is arranged perpendicularly to the first guide rail. The third guide rail is configured to move the area-scan camera in a direction perpendicular to the first guide rail.

[0017] In an embodiment, the area-scan camera is arranged in a plurality.

[0018] In an embodiment, the circuit board detection device further comprises:

[0019] A coaxial linear light source is arranged between the line-scan camera and the transfer mechanism.

[0020] In an embodiment, the circuit board detection device further comprises:

[0021] A first ring light source is arranged at a first height position above the transfer mechanism.

[0022] A second ring light source is arranged at a second height position above the transfer mechanism.

[0023] The present application also proposes a circuit board detection method based on the circuit board detection device, which comprises a transfer mechanism, a camera assembly and a backlight light source assembly. The camera assembly comprises:

[0024] A line-scan camera is movably arranged above the transfer mechanism.

[0025] An area-scan camera is movably arranged above the transfer mechanism. The area-scan camera is arranged on a side of the line-scan camera away from a feeding side.

[0026] The circuit board detection method comprises:

[0027] Obtaining a plurality of features to be detected of the circuit board and a positional relationship between the plurality of features to be detected.

[0028] Controlling the transfer mechanism to carry the circuit board to move, and controlling the line-scan camera to work to detect the plurality of features to be detected.

[0029] When a preset number of features to be detected are detected by the line-scan camera, the positions of the remaining features to be detected are calculated according to the features to be detected detected by the line-scan camera and the positional relationship between the plurality of features to be detected.

[0030] Controlling the area-scan camera to move to a corresponding position of the positions of the remaining features to be detected to detect the same.

[0031] In an embodiment, the features to be detected include at least one of a straight edge, a circular arc edge, a boss, a blind hole, a through hole, a tapered hole, and a honeycomb hole.

[0032] In an embodiment, the circuit board detection device includes:

[0033] A coaxial linear light source is arranged between the line-scan camera and the transfer mechanism.

[0034] A first ring light source is arranged at a first height position above the transfer mechanism.

[0035] A second ring light source is arranged at a second height position above the transfer mechanism.

[0036] Before the step of controlling the transfer mechanism to carry the circuit board to move and controlling the line-scan camera to work to detect a plurality of the features to be detected, the method further includes:

[0037] Turning on the backlight light source assembly and the coaxial linear light source to provide backlight illumination and coaxial illumination for the circuit board detection.

[0038] Before the step of controlling the area array camera to move to a position corresponding to the remaining features to be detected to detect the same, the method further includes:

[0039] Turning on the first ring light source and / or the second ring light source to provide ring light illumination for the circuit board detection.

[0040] The circuit board detection device of the present application includes a transfer mechanism, a camera assembly, and a backlight light source assembly. The transfer mechanism is used to carry the circuit board to move. The camera assembly is arranged above the transfer mechanism. The camera assembly is used to detect the circuit board when the circuit board moves to a preset detection area. The backlight light source assembly is arranged below the transfer mechanism. The backlight light source is used to provide backlight illumination for the circuit board during the detection of the circuit board by the camera assembly. Since the backlight light source assembly is used, various features on the circuit board, including but not limited to a straight edge, a circular arc edge, a boss, a blind hole, a through hole, a tapered hole, and a honeycomb hole, can be clearly identified, thereby improving the accuracy of the circuit board detection. BRIEF DESCRIPTION OF DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort based on the drawings shown.

[0042] Figure 1A structural schematic diagram provided by an embodiment of the circuit board detection device of the present application;

[0043] Figure 2 A structural schematic diagram provided by another embodiment of the circuit board detection device of the present application;

[0044] Figure 3 For Figure 1 A local enlarged view at A in FIG. 4;

[0045] Figure 4 A method flowchart provided by an embodiment of the circuit board detection method of the present application;

[0046] Figure 5 A method flowchart provided by another embodiment of the circuit board detection method of the present application.

[0047] BRIEF DESCRIPTION OF THE DRAWINGS

[0048] 11, transfer platform; 12, first guide rail; 13, cover plate; 21, line scan camera; 22, area array camera; 211, second guide rail; 221, third guide rail; 31, telecentric back light point light source; 32, telecentric large field of view back light light source; 41, coaxial linear light source; 42, first ring light light source; 43, second ring light light source. DETAILED DESCRIPTION

[0049] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0050] It should be noted that if the present application involves directionality indication (such as up, down, left, right, front, back, …), the directionality indication is only used to explain the relative position relationship, movement condition, etc. between components in a certain posture, and if the certain posture changes, the directionality indication also changes accordingly.

[0051] In addition, if the description of "first", "second" and the like is involved in the embodiments of the present application, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one of the features. In addition, if "and / or" or "and / or" appears throughout the text, it means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor in the protection scope claimed by the present application.

[0052] The present application provides a circuit board detection device, referring to Figure 1 、 Figure 3 The circuit board detection device includes a transfer mechanism, a camera assembly and a backlight light source assembly. The transfer mechanism is used to carry and move the circuit board. Specifically, the transfer mechanism can include one or more conveyor belts, sliding rails or other moving platforms to achieve precise positioning and movement of the circuit board. The camera assembly can include a line scan camera 21 and an area array camera 22. The line scan camera 21 is used to quickly and continuously scan the surface of the circuit board to capture the edge and line features of the circuit board, while the area array camera 22 is used to capture specific areas on the circuit board, such as hole, boss and other detail features. The backlight light source assembly is arranged below the transfer platform 11, which provides uniform backlight illumination when the camera assembly detects the circuit board, thereby enhancing the contrast of the features on the circuit board, so that the camera can capture the details on the circuit board more clearly. In practical applications, the backlight light source assembly can be an LED backlight light bar or other types of backlight light sources, which can ensure uniform distribution of backlight light, avoiding shadows or light spots during camera assembly detection. In the present embodiment, since the backlight light source assembly is used, various features on the circuit board can be clearly identified, including but not limited to straight edges, arc edges, bosses, blind holes, through holes, expansion holes and honeycomb holes, thereby improving the accuracy of circuit board detection.

[0053] In a feasible embodiment, referring to Figure 1 、 Figure 2The transfer mechanism includes a first guide rail 12 and a transfer platform 11. One side of the first guide rail 12 is the loading side, and the other side of the first guide rail 12 is the turning side. The transfer platform 11 is slidingly connected with the first guide rail 12. The transfer platform 11 is made of transparent material. The transfer platform 11 is used to carry the circuit board to move along the first guide rail 12 between the loading side and the turning side. The backlight source assembly includes a telecentric backlight point source 31 and a telecentric large field-of-view backlight source 32. The telecentric backlight point source 31 is used to provide high-brightness point source illumination to enhance the identification ability of specific area features on the circuit board. The telecentric large field-of-view backlight source 32 is used to provide a wide illumination area to ensure uniform illumination of the entire circuit board surface. Through this combined illumination method, the illumination needs of different areas and different features on the circuit board can be met at the same time, further improving the comprehensiveness and accuracy of circuit board detection.

[0054] In this embodiment, the transfer platform 11 can be made of glass, acrylic material or other transparent material to ensure that light can penetrate and provide good light transmission for backlight illumination, which facilitates the camera assembly to capture features on the circuit board. In this embodiment, the first guide rail 12 can be provided as two parallel guide rails to ensure smooth movement of the transfer platform 11 on the guide rails. One end of the first guide rail 12 is connected to the loading port. The user can manually place the circuit board through the loading port or use an automatic loading device to place the circuit board through the loading port onto the transfer platform 11. The camera assembly is arranged at a corresponding position above the loading side and the turning side. During the process of transferring the circuit board from the loading side to the turning side on the first guide rail 12 and the process of transferring the circuit board from the turning side back to the loading side, the camera assembly can take pictures of the surface features of the circuit board, thereby detecting the circuit board. After completing a detection, the transfer platform 11 returns the circuit board to the loading side, preparing for the next detection. During this process, the backlight source assembly continuously provides uniform backlight illumination to ensure that the camera assembly can capture all the detailed features on the circuit board, including small holes and complex edges that are difficult to identify. In addition, in order to further improve the detection efficiency and accuracy, the camera assembly can be used in cooperation with advanced image processing software, which can automatically analyze the captured image data and quickly identify defects and inconsistencies on the circuit board. In this way, the circuit board detection device can not only achieve high efficiency, but also ensure high precision and reliability of the circuit board detection results.

[0055] In one feasible embodiment, the transfer mechanism further includes a drive assembly for driving the transfer platform 11 to move along the first guide rail 12. The drive assembly can be a stepper motor or other type of motor. By precisely controlling the motor's speed and direction, precise control of the transfer platform 11's movement speed and direction is achieved, thereby ensuring the stability and repeatability of the circuit board during the inspection process and improving inspection accuracy. Furthermore, the drive assembly can also be equipped with an encoder for real-time monitoring of the transfer platform 11's position, ensuring that the camera assembly captures images of the circuit board at the correct time and position, further improving the circuit board inspection efficiency.

[0056] In one feasible implementation, refer to Figure 1 The transfer mechanism also includes a cover plate 13 disposed above the transfer platform 11. The cover plate 13 can be transparent to allow light to pass through and achieve a backlighting effect. The cover plate 13 helps to secure the circuit board, preventing displacement due to vibration or movement during inspection. The cover plate 13 also protects the camera assembly from external environmental interference while ensuring that the light from the backlight source assembly illuminates the circuit board evenly. Furthermore, the cover plate 13 serves as a dust and moisture barrier, ensuring a clean inspection environment and thus improving the stability and reliability of the inspection. In practical applications, the cover plate 13 can be designed to be removable for easy maintenance and cleaning. With this design, the circuit board inspection device can adapt to various inspection environments while ensuring the efficiency and accuracy of the circuit board inspection process.

[0057] In one feasible implementation, refer to Figure 1 , Figure 3 The camera assembly includes a line scan camera 21 and an area scan camera 22, both of which are movably mounted above the transfer mechanism. The area scan camera 22 is located on the side of the line scan camera 21 away from the feeding side.

[0058] In this embodiment, the configuration of the line-scan camera 21 and the area-scan camera 22 allows them to be optimized for different detection needs of the circuit board. The line-scan camera 21, due to its high-speed scanning capability, is particularly suitable for detecting continuous lines and edges on the circuit board, while the area-scan camera 22, with its high-resolution characteristics, is more suitable for capturing small features on the circuit board, such as apertures, pads, etc. Through the division of labor between the line-scan camera 21 and the area-scan camera 22, comprehensive detection of the circuit board can be achieved, ensuring that all key features are identified without omission. In addition, the mobility design of the camera assembly allows them to adjust their positions according to detection needs, thus adapting to circuit boards of different sizes and shapes. This flexibility not only improves the applicability of the detection device, but also allows for multi-angle and multi-position detection of the circuit board, further enhancing the comprehensiveness and accuracy of the detection. Since the area-scan camera 22 is arranged on the side of the line-scan camera 21 away from the feeding side, i.e., after the circuit board is fed, the edge and line features are first scanned by the line-scan camera 21, and the circuit board can be positioned based on the results of the line-scan camera 21 scanning, so that the area-scan camera 22 can be moved to a specific area of the circuit board in time for high-resolution detail capture. This sequential detection method ensures the efficiency and accuracy of the detection process, while reducing the time wasted by repeated detection of the same area.

[0059] In actual operation, the movement and positioning of the camera assembly can be achieved through precise mechanical devices or electronic control systems, ensuring that the camera can accurately align with a specific area on the circuit board each time. With advanced image processing software, the camera assembly can analyze image data in real time, quickly identify defects on the circuit board, and feed back the detection results to the operator or automatic control system for timely adjustment or repair.

[0060] In a feasible implementation mode, referring to Figure 1 , the circuit board detection device further comprises a second guide rail 211 and a third guide rail 221, the second guide rail 211 is slidably connected with the line-scan camera 21, and the second guide rail 211 is arranged perpendicularly to the first guide rail 12; the second guide rail 211 is used to move the line-scan camera 21 along the vertical direction of the first guide rail 12; the third guide rail 221 is slidably connected with the area-scan camera 22, and the third guide rail 221 is arranged perpendicularly to the first guide rail 12; the third guide rail 221 is used to move the area-scan camera 22 along the vertical direction of the first guide rail 12.

[0061] In this embodiment, the second guide rail 211 and the third guide rail 221 are arranged to enable the line-scan camera 21 and the area-array camera 22 to cover a wider area of the circuit board, thus achieving comprehensive detection of the circuit board. The second guide rail 211 and the third guide rail 221 can be precision linear guides, ensuring the stability and accuracy of the cameras during movement. Through the second guide rail 211, the line-scan camera 21 can perform scanning in a path perpendicular to the movement direction of the circuit board, which can detect lines and features in different directions on the circuit board. Similarly, the third guide rail 221 also allows the area-array camera 22 to move perpendicular to the movement direction of the circuit board, so as to perform high-resolution detailed inspection on specific areas of the circuit board. In this way, not only the flexibility of detection is improved, but also more detailed analysis of the circuit board is allowed, ensuring the comprehensiveness and accuracy of the detection results. In addition, the vertical arrangement of the second guide rail 211 and the third guide rail 221 also helps to reduce mutual interference between the cameras, ensuring smooth detection process. In actual application, the length of the second guide rail 211 and the third guide rail 221 can be adjusted according to the size of the circuit board to adapt to the detection needs of circuit boards of different sizes.

[0062] In a feasible implementation, the area-array camera 22 is arranged in multiple. It can be understood that the circuit board generally has multiple areas that need to be scanned by the area-array camera 22, such as multiple chip mounting positions, connector slots, etc. By arranging multiple area-array cameras 22, multiple areas on the circuit board can be scanned at high resolution at the same time, significantly improving detection efficiency. Each area-array camera 22 can work independently or cooperatively, and can be optimized according to the specific area of the circuit board and the detection needs. For example, some area-array cameras 22 can focus on detecting high-density chip areas, while other cameras can handle connector or edge areas. This parallel processing method not only speeds up the detection, but also ensures that each area is carefully checked, thereby improving the accuracy and reliability of the overall detection. In addition, the arrangement of multiple area-array cameras 22 can also realize redundant detection, that is, multiple cameras are used for repeated scanning in key areas to further reduce the risk of missed detection and misjudgment. In actual operation, the synchronization and coordination of multiple area-array cameras 22 can be realized through an advanced control system, ensuring that each camera can take pictures at the correct time and position, thereby realizing efficient and accurate circuit board detection.

[0063] In a feasible implementation, with reference to Figure 1 、 Figure 3The circuit board detection device further comprises a coaxial linear light source 41 arranged between the line-scan camera 21 and the transfer mechanism. In this embodiment, the use of the coaxial linear light source 41 provides uniform and stable lighting conditions for circuit board detection. The coaxial linear light source 41 can be a LED light source, which can provide high brightness and high uniformity of light. Since the coaxial linear light source 41 is arranged coaxially with the camera assembly, the light is directly illuminated on the circuit board, reducing shadows and reflections, making the features on the circuit board more clearly visible. This lighting method is particularly suitable for detecting small defects on the circuit board, such as scratches, stains or solder defects, etc. The uniform illumination of the coaxial linear light source 41 ensures that the camera can capture the details of each part of the circuit board, thereby improving the accuracy and repeatability of the detection. In addition, the use of the coaxial linear light source 41 also reduces the dependence on environmental light, so that the circuit board detection device can work stably under different lighting conditions, further improving the reliability and efficiency of the detection. In practical applications, the brightness and color temperature of the coaxial linear light source 41 can be adjusted according to the detection requirements to adapt to circuit boards of different materials and colors, ensuring the accuracy of the circuit board detection results.

[0064] In a feasible embodiment, the circuit board detection device further comprises a first ring light source 42 and a second ring light source 43, the first ring light source 42 is arranged at a first height position above the transfer mechanism, and the second ring light source 43 is arranged at a second height position above the transfer mechanism.

[0065] In this embodiment, the first ring light source 42 and the second ring light source 43 are arranged to provide additional illumination angles for a more comprehensive illumination of the surface of the circuit board. The first ring light source 42 is located at a higher position to provide light from above to form a high-angle ring light, while the second ring light source 43 is located at a lower position to provide light from below to form a low-angle ring light. The first ring light source 42 can make the planar part of the object reflect the light to form a bright field, while the uneven part will make the light diverge and cannot enter the camera, forming a dark area, so that the camera assembly can accurately capture the defects, scratches, etc. on the uneven surface of the circuit board. The second ring light source 43 can make the planar part of the object form a dark field due to reflection, while the uneven part will reflect chaotic light into the camera, forming a bright area, so that the camera assembly can accurately capture the protrusions or texture changes on the surface of the circuit board. Through the cooperation of the first ring light source 42 and the second ring light source 43, a three-dimensional lighting effect of the surface features of the circuit board can be achieved. This three-dimensional lighting technology helps to enhance the contrast of the surface features of the circuit board, so that even small defects can be clearly identified. For example, for the solder joints and pads on the circuit board, the first ring light source 42 can highlight their outlines, while the second ring light source 43 can highlight the gloss changes on their surfaces. Through this multi-angle lighting, the detection device can more accurately judge the manufacturing quality of the circuit board to ensure the reliability of the final product. In actual operation, the brightness and height of the first ring light source 42 and the second ring light source 43 can be adjusted according to the material and surface characteristics of the circuit board to achieve the best lighting effect.

[0066] In this embodiment, the circuit board detection device includes a transfer mechanism, a camera assembly, and a backlight source assembly. The transfer mechanism is used to carry and move the circuit board. The camera assembly is arranged above the transfer mechanism. The camera assembly is used to detect the circuit board when the circuit board moves to a preset detection area. The backlight source assembly is arranged below the transfer platform 11. The backlight source is used to backlight the circuit board during the detection process of the camera assembly. Since the backlight source assembly is used in this application, various features on the circuit board, including but not limited to straight edges, arc edges, bosses, blind holes, through holes, expansion holes, and honeycomb holes, can be clearly identified, thereby improving the accuracy of circuit board detection.

[0067] The application also provides a circuit board detection method based on the circuit board detection device. The circuit board detection device comprises a transfer mechanism, a camera assembly and a backlight light source assembly. The camera assembly comprises a line-scan camera 21 and an area-array camera 22. Both the line-scan camera 21 and the area-array camera 22 are movably arranged above the transfer mechanism, and the area-array camera 22 is arranged on the side of the line-scan camera 21 away from the feeding side. The specific structure of the circuit board detection device is referred to the above embodiments. Since the circuit board detection method adopts all the technical solutions of the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0068] In this embodiment, referring to Figure 4 , the circuit board detection method comprises steps S100-S400, wherein:

[0069] In step S100, a plurality of to-be-detected features of a circuit board and the positional relationship between the plurality of to-be-detected features are acquired.

[0070] In this embodiment, the to-be-detected features include at least one of a straight edge, a circular arc edge, a boss, a blind hole, a through hole, an expansion hole and a honeycomb hole. By previously importing the product drawing corresponding to the circuit board into the detection system, these features can be automatically recognized and the positional relationship between them can be established. In this way, the subsequent steps can accurately position, detect and analyze each to-be-detected feature on the circuit board.

[0071] In step S200, the transfer mechanism is controlled to carry the circuit board to move, and the line-scan camera 21 is controlled to work to detect the plurality of to-be-detected features.

[0072] In this embodiment, after the circuit board is placed on the transfer mechanism, the transfer mechanism moves the circuit board according to a predetermined path to ensure that it passes through the detection area of the line-scan camera 21. Optionally, the transfer mechanism comprises a first guide rail 12 and a transfer platform 11. One side of the first guide rail 12 is a feeding side, and the other side of the first guide rail 12 is a turning-back side. The transfer platform 11 is in sliding connection with the first guide rail 12, and the transfer platform 11 is made of transparent material. The transfer platform 11 can carry the circuit board to move along the first guide rail 12 between the feeding side and the turning-back side. The line-scan camera 21 continuously photographs during the movement of the circuit board to acquire image data of the circuit board and analyze the corresponding to-be-detected features.

[0073] In step S300, when a preset number of to-be-detected features are detected by the line-scan camera 21, the positions of the remaining to-be-detected features are calculated according to the to-be-detected features detected by the line-scan camera 21 and the positional relationship between the plurality of to-be-detected features.

[0074] It can be understood that, since the positional relationship of each feature on the circuit board has been pre-set, the line-scan camera 21 can update these position information in real time during the detection process. When the line-scan camera 21 detects a certain number of features, the system will use the known geometric relationship and position information to calculate the approximate position of other features to be detected through an algorithm. This method can significantly improve the detection efficiency and reduce unnecessary detection range, thereby speeding up the entire detection process.

[0075] At step S400, the area array camera 22 is controlled to move to a corresponding position of the position of the remaining features to be detected for detection.

[0076] In this embodiment, after moving to the pre-set position, the area array camera 22 will perform accurate positioning and shooting to capture detailed images of the remaining features to be detected on the circuit board. Since the area array camera 22 has high resolution and imaging quality, it can analyze and identify the tiny defects on the circuit board in detail. For example, for tiny cracks, small scratches or printing errors on the circuit board, the area array camera 22 can provide clear images for further analysis and judgment.

[0077] After step S400 is completed, the circuit board detection method further includes comprehensive analysis of the image data captured by the line-scan camera 21 and the area array camera 22 to determine whether the circuit board meets the quality standard. This step involves image processing algorithms such as edge detection, pattern recognition and machine learning techniques to ensure the accuracy and reliability of the detection results. Through these algorithms, the system can automatically identify defects on the circuit board and compare them with the pre-set quality standard to give the final judgment of whether it is qualified or not. The circuit board detection method can provide a comprehensive, fast and accurate quality detection process to ensure the quality control of the circuit board during the production process. In addition, the detection method can also record the detection data to provide support for subsequent quality tracking and analysis. In this way, manufacturers can timely find problems in the production process and take measures to improve, thereby improving the overall production efficiency and product quality.

[0078] In an embodiment, the circuit board detection device comprises a coaxial linear light source 41, a first ring light source 42 and a second ring light source 43. The coaxial linear light source 41 is arranged between the line-scan camera 21 and the transfer mechanism. The first ring light source 42 is arranged at a first height position above the transfer mechanism. The second ring light source 43 is arranged at a second height position above the transfer mechanism. Figure 5Before the step of controlling the moving mechanism to carry the circuit board and controlling the line-scan camera 21 to work to detect a plurality of the features to be detected, the method further includes a step S0200 of turning on the backlight light source assembly and the coaxial linear light source 41 to provide backlight illumination and coaxial illumination for the circuit board detection; before the step of controlling the area array camera 22 to move to the corresponding positions of the positions of the remaining features to be detected to detect them, the method further includes a step S0400 of turning on the first ring light source 42 and / or the second ring light source 43 to provide ring light illumination for the circuit board detection.

[0079] In this embodiment, the step S0200 of turning on the backlight light source assembly and the coaxial linear light source 41 to provide backlight illumination and coaxial illumination for the circuit board detection; before the step of controlling the area array camera 22 to move to the corresponding positions of the positions of the remaining features to be detected to detect them, the method further includes a step S0400 of turning on the first ring light source 42 and / or the second ring light source 43 to provide ring light illumination for the circuit board detection.

[0080] In this embodiment, the first ring light source 42 is located at a higher position and can provide light rays from above to form high-angle ring light, while the second ring light source 43 is located at a lower position and provides light rays from below to form low-angle ring light. The first ring light source 42 can make the planar part of the object reflect the light rays to form a bright field, while the high and low parts will make the light rays diverge and cannot enter the camera, forming a dark area, so that the camera assembly can accurately capture the uneven surface of the object, such as scratches and defects. The second ring light source 43 can make the planar part of the object form a dark field due to reflection, while the uneven part will reflect the scattered light into the camera, forming a bright area, so that the camera assembly can accurately capture the protrusions or texture changes on the surface of the circuit board. Through the cooperation of the first ring light source 42 and the second ring light source 43, a stereoscopic lighting effect for the features on the surface of the circuit board can be achieved. This stereoscopic lighting technology helps to enhance the contrast of the features on the surface of the circuit board, so that even small defects can be clearly identified. For example, for the solder joints and pads on the circuit board, the first ring light source 42 can highlight their outlines, while the second ring light source 43 can highlight the gloss changes on their surfaces. Through multi-angle lighting, the detection device can more accurately judge the manufacturing quality of the circuit board and ensure the reliability of the final product.

[0081] In this embodiment, the steps S0200 and S0400 can flexibly adjust the lighting conditions according to different detection requirements by turning on and off different light sources at appropriate times, so as to adapt to various complex detection environments and requirements. Through the reasonable configuration and turning on of the coaxial linear light source 41, the first ring light source 42 and the second ring light source 43, the detection efficiency can be improved, and the reliability of the detection result can be enhanced.

[0082] The above merely describes exemplary embodiments of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation made by using the content of the present application specification and drawings, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A method of detecting a circuit board, characterized by, The circuit board detection method is based on a circuit board detection device, the circuit board detection device comprises a transfer mechanism, a camera assembly and a backlight light source assembly, the transfer mechanism is used for carrying and moving the circuit board; the transfer mechanism comprises a transfer platform; The camera assembly is arranged above the transfer mechanism; the camera assembly is used for detecting the circuit board when the circuit board moves to a preset detection area; the camera assembly comprises a line-scan camera and a face array camera, which are movably arranged above the transfer mechanism; the face array camera is arranged on the side of the line-scan camera away from the feeding side; The backlight light source assembly is arranged below the transfer platform; the backlight light source assembly is used for backlighting the circuit board during the detection of the circuit board by the camera assembly; The circuit board detection method comprises: obtaining a plurality of to-be-detected features of the circuit board and a positional relationship between the plurality of to-be-detected features; controlling the transfer mechanism to carry and move the circuit board, and controlling the line-scan camera to work to detect the plurality of to-be-detected features; when a preset number of to-be-detected features are detected by the line-scan camera, calculating the positions of the remaining to-be-detected features according to the to-be-detected features detected by the line-scan camera and the positional relationship between the plurality of to-be-detected features; controlling the face array camera to move to the corresponding positions of the positions of the remaining to-be-detected features to detect the remaining to-be-detected features; The circuit board detection device further comprises: a coaxial linear light source arranged between the line-scan camera and the transfer mechanism; a first ring light source arranged at a first height position above the transfer mechanism to form a high-angle ring light; a second ring light source arranged at a second height position above the transfer mechanism to form a low-angle ring light; Before the step of controlling the transfer mechanism to carry and move the circuit board, and controlling the line-scan camera to work to detect the plurality of to-be-detected features, the circuit board detection method further comprises: turning on the backlight light source assembly and the coaxial linear light source to provide backlighting and coaxial lighting for the circuit board detection; Before the step of controlling the face array camera to move to the corresponding positions of the positions of the remaining to-be-detected features to detect the remaining to-be-detected features, the circuit board detection method further comprises: turning on the first ring light source and / or the second ring light source to provide ring light for the circuit board detection.

2. The circuit board inspection method according to Claim 1, wherein The transfer mechanism comprises: a first guide rail, one side of the first guide rail being a feeding side and the other side of the first guide rail being a turning-back side; the transfer platform is in sliding connection with the first guide rail, and the transfer platform is made of transparent material; the transfer platform is used for carrying the circuit board to move along the first guide rail between the feeding side and the turning-back side.

3. The circuit board inspection method according to claim 2, wherein The circuit board detection device further comprises: a second guide rail in sliding connection with the line-scan camera, the second guide rail being arranged perpendicularly to the first guide rail; the second guide rail is used for moving the line-scan camera in the vertical direction of the first guide rail; a third guide rail in sliding connection with the face array camera, the third guide rail being arranged perpendicularly to the first guide rail; the third guide rail is used for moving the face array camera in the vertical direction of the first guide rail.

4. The circuit board inspection method according to Claim 1, wherein The face array camera is arranged in a plurality of.

5. The circuit board inspection method of claim 1, wherein, The features to be detected include at least one of a straight edge of a circuit board, a circular arc edge, a boss, a blind hole, a through hole, a hole with expansion and contraction, and a honeycomb hole.

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