Portable container

Abstract

The invention discloses a portable container which comprises a first shell and a second shell, the first shell and the second shell are detachably connected together and form a sealed containing cavity, the portable container further comprises a conduction piece, a semiconductor chilling plate and a control circuit for controlling operation of the semiconductor chilling plate are arranged in the first shell, and the conduction piece is arranged in the second shell. The inner end of the conduction piece is arranged in the first shell in a sealed mode and abuts against the cold end of the semiconductor chilling plate, the outer end of the conduction piece extends out of the first shell and then extends into the containing cavity, and the cold end of the semiconductor chilling plate absorbs heat in the containing cavity through the conduction piece. The semiconductor chilling plate makes contact with the containing cavity through the conduction piece, the refrigeration efficiency is high, energy consumption is reduced, meanwhile, the conduction piece extends into the containing cavity, the contact area of the conduction piece and the containing cavity is increased, the refrigeration efficiency can be improved, and the refrigeration speed is higher.

Description

Technical Field

[0001] The present invention relates to the technical field of portable containers, and in particular to a portable container with cooling and heating functions. Background Art

[0002] Existing portable containers, such as the intelligent temperature-controlled double-spout water cup disclosed in CN222149619U, need to be equipped with two cup lids to meet the installation requirements of the refrigeration unit and the heating unit, resulting in a complex overall structure and poor sealing of the cup body. The cup body is cooled by a semiconductor refrigeration chip, but the semiconductor refrigeration chip and the cup body are separated by a first partition, resulting in poor refrigeration efficiency and high overall energy consumption. Moreover, after the semiconductor refrigeration chip cools the cup body, the air pressure inside the cup body becomes smaller, that is, the cup body is in a negative pressure state, and the cup lid cannot be opened. Summary of the invention

[0003] The object of the present invention is to provide a portable container with improved refrigeration efficiency.

[0004] The object of the present invention is achieved in this way.

[0005] The portable container includes a first shell and a second shell, which are detachably connected together to form a sealed cavity, and also includes a conductive member. A semiconductor refrigeration plate and a control circuit for controlling the operation of the semiconductor refrigeration plate are arranged in the first shell. The inner end of the conductive member is sealed in the first shell and abuts against the cold end of the semiconductor refrigeration plate. The outer end of the conductive member extends out of the first shell and then extends into the cavity. The cold end of the semiconductor refrigeration plate absorbs heat in the cavity through the conductive member.

[0006] The semiconductor refrigeration plate of the present invention contacts the cavity through the conductive member, has high refrigeration efficiency and reduces energy consumption. At the same time, the conductive member extends into the cavity to increase the contact area between the conductive member and the cavity, which helps to improve the refrigeration efficiency and achieve a faster refrigeration speed.

[0007] Furthermore, the conductive part includes a first section and a second section, the diameter of the first section is larger than the diameter of the second section, the outer end surface of the first section and the surface of the second section are both exposed in the cavity, and the inner end surface of the first section abuts against the cold end of the semiconductor refrigeration plate.

[0008] The first section has a larger contact area with the semiconductor refrigeration plate, and the volume of the second section is reduced, thereby increasing the actual volume of the cavity.

[0009] Furthermore, a heating element is provided in the conductive member, the heating element is electrically connected to the control circuit, and the heat generated by the heating element is released into the cavity through the conductive member.

[0010] The heating element realizes the heating function of the cavity through the conductive element, and the conductive element increases the contact area of ​​the heating element to the cavity, thereby improving the heating efficiency.

[0011] Furthermore, a vertical fixing hole is provided in the center of the conductive part, the heating element is fixed in the fixing hole, a first clearance channel is provided on one side of the fixing hole in the conductive part, the first clearance channel connects the fixing hole and the inner cavity of the first shell, and the wire of the heating element passes through the first clearance channel and is connected to the control circuit.

[0012] The heating element is easy to install and the control circuit is convenient for supplying power to the heating element.

[0013] Furthermore, the fixing hole is a stepped hole, the fixing hole includes a first hole section and a second hole section, the diameter of the first hole section is larger than that of the second hole section, the second hole section extends out of the outer end of the conductive member, the heating element is limitedly arranged in the first hole section, an NTC temperature sensor is arranged in the second hole section, the NTC temperature sensor seals the second hole section, and the conductive member is provided with a second giveway channel on one side of the fixing hole, one end of the second giveway channel is connected to the first giveway channel, and the other end of the second giveway channel is connected to the second hole section, and the wire of the NTC temperature sensor is electrically connected to the control circuit via the second giveway channel and the first giveway channel.

[0014] The NTC temperature sensor is convenient for detecting the temperature of the chamber, which is convenient for the portable container to achieve accurate temperature control. The second yield channel is convenient for the connection between the NTC temperature sensor and the control circuit.

[0015] Furthermore, a heat dissipation component is provided in the first shell, a groove is provided on the inner end surface of the conductive member, and the heat dissipation component presses the semiconductor cooling plate into the groove.

[0016] The heat dissipation component is convenient for dissipating heat from the hot end of the semiconductor refrigeration chip.

[0017] Furthermore, the heat dissipation component includes heat dissipation fins, a fixed bracket and a fan. The fixed bracket makes the heat dissipation fins close to the hot end of the semiconductor refrigeration plate. A heat dissipation channel is provided in the center of the fixed bracket corresponding to the heat dissipation fins, and the fan is fixed in the heat dissipation channel.

[0018] The heat dissipation components and semiconductor cooling sheets are easy to install, and the heat dissipation fins and fans improve the heat dissipation efficiency.

[0019] Furthermore, a control circuit board is provided near the top of the first shell, the heat dissipation channel faces the control circuit board, a control panel is provided on the top surface of the first shell, the control panel and the control circuit on the control circuit board are electrically connected, a heat dissipation circular ring net is provided on the outer periphery of the first shell, and the heat dissipation channel dissipates heat to the outside through the control circuit board to the heat dissipation circular ring net.

[0020] The heat dissipation channel is also implemented to control the heat dissipation of the circuit board, and the heat dissipation circular ring net improves the heat dissipation efficiency of the first shell.

[0021] Furthermore, the first shell or the conductive part is provided with an air intake valve corresponding to the cavity, and the air intake valve is provided with a normally closed air hole for only gas to pass through. An air path is provided in the first shell, one end of the air path is connected to the outside world, and the other end of the air path is connected to the air hole. When the air pressure of the outside world and the cavity is balanced, the air hole is closed to make the air intake valve in a sealed state. When there is an air pressure difference between the outside world and the cavity, air is discharged or taken in through the air hole.

[0022] The cavity is in a negative pressure state in the cooling state, and air is taken into the cavity through the air intake valve to ensure that the first shell can be normally separated from the second shell; the cavity is in a positive pressure state in the heating state, and air is exhausted from the cavity through the air intake valve to ensure that the first shell is separated from the second shell due to high pressure; under normal conditions, the air intake valve is sealed, and the cavity is sealed and will not leak.

[0023] Furthermore, the first shell is a cover body, the outer end of the conductive member extends out of the bottom surface of the cover body, the second shell is a cup body, the second shell is provided with the said cavity, after the cover body and the cup body are connected, the outer end of the conductive member extends into the cavity.

[0024] The first shell is provided with a conductive member as a cover, and the second shell is provided with a cavity, so that the second shell is convenient for users to use.

[0025] The semiconductor refrigeration plate of the present invention contacts the cavity through the conductive member, which has high refrigeration efficiency and reduces energy consumption. At the same time, the conductive member extends into the cavity to increase the contact area between the conductive member and the cavity, which helps to improve the refrigeration efficiency and achieve faster refrigeration speed. A heating element is installed in the conductive member, and the heating element realizes the heating function of the cavity through the conductive member. The conductive member increases the contact area of ​​the heating element to the cavity, thereby improving the heating efficiency. The cavity is in a negative pressure state in the refrigeration state, and the cavity takes in air through the air intake valve to ensure that the first shell can be normally separated from the second shell; the cavity is in a positive pressure state in the heating state, and the cavity is exhausted through the air intake valve to ensure that the first shell is separated from the second shell due to high pressure; under normal conditions, the air intake valve is sealed, and the cavity is sealed and will not leak. Compared with the prior art, the portable container reduces the possibility of inverted use and reduces the risk of water leakage in the container. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the three-dimensional structure of the first embodiment.

[0027] Figure 2 This is a schematic diagram of the decomposed structure of Example 1.

[0028] Figure 3 It is a schematic cross-sectional structure diagram of the first embodiment.

[0029] Figure 4 for Figure 3 Enlarged view of part A in the middle.

[0030] Figure 5 It is a schematic diagram of the structure of the first shell in the first embodiment.

[0031] Figure 6 This is an electrical schematic diagram of Embodiment 1. DETAILED DESCRIPTION

[0032] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0033] Example 1, see Figure 1-6 As shown, a portable container includes a first shell 1, a second shell 2, a conductive member 3, a semiconductor cooling sheet 41, a heating element 42, an NTC temperature sensor 43, a heat dissipation component 5, an air intake valve 6, a control circuit board 7 and a control panel 71, and the control circuit board 7 is provided with a control circuit.

[0034] The first shell 1 and the second shell 2 are detachably connected together and form a sealed cavity 20. Sealing means that at least six sides of the cavity 20 are blocked and closed to a certain extent. In this embodiment, the first shell 1 is a cover body, and the second shell 2 is a cup body. The cavity 20 is provided in the second shell 2. The top of the cavity 20 is open and provided with an internal thread. A truncated cone 11 extends downward from the bottom of the cover body. The circumferential surface of the truncated cone 11 is provided with an external thread. The first shell 1 covers the second shell 2, and the truncated cone 11 is inserted into the cavity 20. The external thread and the internal thread are threadedly connected to form the detachable connection. Preferably, the second shell 2 includes an outer shell 21 and an inner liner 22. The inner liner 22 forms the cavity 20. The inner liner 22 is placed in the outer shell 21, and an insulation cavity 23 is provided between the inner liner 22 and the outer shell 21.

[0035] The semiconductor cooling sheet 41, the heat dissipation assembly 5 and the control circuit board 7 are all arranged in the first housing 1, and the control panel 71 is arranged on the top surface of the first housing 1. The inner end of the conductive member 3 is placed in the first housing 1 and is sealed and abutted against the cold end of the semiconductor cooling sheet 41, and the outer end of the conductive member 3 extends out of the first housing 1 from the bottom surface of the truncated cone 11. That is, the outer end of the conductive member 3 obviously protrudes from the bottom surface of the truncated cone 11, and the length of the conductive member 3 protruding from the bottom surface of the truncated cone 11 is much greater than the length of the conductive member 3 in the first housing 1. For example, the length of the conductive member 3 protruding from the bottom surface of the truncated cone 11 is more than several times the length of the conductive member 3 in the first housing 1, so that the length of the conductive member 3 protruding from the bottom surface of the truncated cone 11 is at least half of the height of the cavity.

[0036] Specifically, a mounting hole 10 is provided on the bottom surface of the truncated cone 11, and a step portion 12 is provided between the periphery of the mounting hole 10 and the bottom surface of the truncated cone 11. A convex edge 31 is extended outwardly from the inner end of the conductive member 3 in the circumferential direction, and an annular step 32 is formed on the convex edge 31 and the inner end of the conductive member 3 in the circumferential direction. The convex edge 31 is placed on the step portion 12, and the step portion 12 is inserted into the annular step 32. A sealing ring 33 is provided between the bottom surface of the convex edge 31 and the top surface of the step portion 12, and the inner end of the conductive member 3 extends out of the first housing 1 from the mounting hole 10. A groove 34 is provided on the inner end surface of the conductive member 3, and the heat dissipation component 5 presses the semiconductor cooling sheet 41 into the groove 34, and the heat dissipation component 5 also clamps the sealing ring 33 with the convex edge 31 and the step portion 12. Preferably, a non-heat-conductive partition sheet 8 is provided between the heat dissipation component 5 and the convex edge 31, and the partition sheet 8 is provided with a positioning hole 81, and the semiconductor cooling sheet 41 is embedded in the positioning hole 81, and the cold end and the hot end of the semiconductor cooling sheet 41 are exposed. The partition sheet 8 prevents heat from being conducted between the conductive member 3 and the heat dissipation assembly 5 .

[0037] Of course, the first shell 1 may also extend a surrounding wall to form the cavity, and the surrounding wall surrounds the conductive component 3 .

[0038] A battery may be disposed in the first housing 1 , and the battery supplies power to the control circuit board 7 , the semiconductor cooling sheet 41 and the heating element 42 .

[0039] The heat dissipation assembly 5 includes a heat dissipation fin 51, a fixed bracket 52 and a fan 53. The fixed bracket 52 makes the heat dissipation fin 51 close to the hot end of the semiconductor refrigeration plate 41, and the bottom surface of the fixed bracket 52 abuts against the partition plate 8. A heat dissipation channel 50 is provided at the center of the fixed bracket 52 corresponding to the heat dissipation fin 51, and the fan 53 is fixed in the heat dissipation channel 50 and above the heat dissipation fin 51. The control circuit board 7 is arranged near the top in the first shell 1, and the heat dissipation channel 50 faces the control circuit board 7. A heat dissipation circular ring net 13 is provided on the outer periphery of the first shell 1. The inner cavity of the first shell 1 is connected to the outside through the heat dissipation holes 14 of the heat dissipation circular ring net 13. The heat dissipation channel 50 dissipates heat to the outside through the control circuit board 7 to the heat dissipation holes 14 on the heat dissipation circular ring net 13.

[0040] The conductive member 3 includes a first section 35 and a second section 36. The diameter of the first section 35 is larger than that of the second section 36. The first section 35 and the second section 36 are transitioned by an arc surface. The outer end surface of the first section 35 and the surface of the second section 36 are both exposed in the cavity 20. The inner end surface of the first section 35 and the cold end of the semiconductor cooling plate 41 are against each other. A vertical fixing hole 37 is provided at the center of the conductive member 3. The fixing hole 37 extends from the inner end surface of the first section 35 to the outer end surface of the second section 36. The fixing hole 37 is a stepped hole. The fixing hole 37 includes a first hole section 371 and a second hole section 372. The diameter of the first hole section 371 is larger than that of the second hole section 372. The second hole section 372 extends out of the outer end of the conductive member 3. A first clearance channel 38 is provided on one side of the fixing hole 37 in the conductive member 3. The top of the first clearance channel 38 extends to the bottom surface of the groove 34. The first clearance channel 38 connects the fixing hole 37 and the inner cavity of the first shell 1. The conductive member 3 is provided with a second clearance channel 39 on one side of the fixing hole 37, one end of the second clearance channel 39 is connected to the first clearance channel 38, and the other end of the second clearance channel 39 is connected to the second hole section 372. In this embodiment, the first clearance channel 38 is located above the second clearance channel 39, and the bottom of the first clearance channel 38 is connected to the top of the second clearance channel 39. Among them, the heat dissipation fin 51 is aligned with the first clearance channel 38 and is provided with a third clearance channel 54, and a gap 55 for the wire to pass through is left between the fixing bracket 52 and the fan 53. The partition piece 8 is provided with a clearance notch 82 corresponding to the third clearance channel 54, and the groove 34 is connected to the third clearance channel 54 through the clearance notch 82.

[0041] The heating element 42 is fixed in the fixing hole 37. Specifically, the heating element 42 is cylindrical, and the diameter of the heating element 42 is smaller than the diameter of the first hole section 371 and larger than the diameter of the second hole section 372. The heating element 42 is limitedly set within the diameter of the first hole section 371, and the heating element 42 and the semiconductor cooling sheet 41 are spaced apart. The wire of the heating element 42 passes through the first clearance channel 38, the third clearance channel 54 and the gap 55 and is electrically connected to the control circuit board 7.

[0042] The NTC temperature sensor 43 is fixed in the second hole section 372, and the temperature sensing end of the NTC temperature sensor 43 extends out of the conductive member 3. The NTC temperature sensor 43 seals the second hole section 372. The wire of the NTC temperature sensor 43 is electrically connected to the control circuit after passing through the second make way channel 39, the first make way channel 38, the third make way channel 54 and the gap 55. The NTC temperature sensor 43 is used to detect the temperature at the outer end of the conductive member 3. The control panel 71 can adjust the required temperature in the cavity.

[0043] The outer end surface of the first section 35 of the conductive member 3 is provided with a through hole 30 connected to the groove 34, and the air intake valve 6 is arranged in the through hole 30. The top of the air intake valve 6 and the partition plate 8 are abutted against each other for limiting. The top of the air intake valve 6 is provided with an air path 61 connected to the groove 34. One end of the air path 61 is connected to the outside. The air intake valve 6 is provided with a normally closed air hole 60 for only gas to pass through, and the other end of the air path 61 is connected to the air hole 60. In this embodiment, the air intake valve 6 is made of silicone or fluororubber, and the very fine hole in the middle of the air intake valve 6 constitutes the air hole 60. When the air pressure of the outside and the cavity 20 is balanced, the air hole 60 is closed to make the air intake valve 6 in a sealed state. When there is an air pressure difference between the outside and the cavity 20, the air hole 60 opens, and the cavity 20 exhausts or inhales air through the air hole 60.

[0044] Working principle: after the first shell 1 and the second shell 2 are connected, the outer end of the conductive member 3 extends into the cavity 20. In this embodiment, the distance that the conductive member 3 extends into the cavity 20 is at least half of the height of the cavity 20. The control circuit of the control circuit board 7 controls the operation of the semiconductor cooling sheet 41 or the heating element 42 to achieve the cooling or heating function. Generally, the control circuit controls one of the semiconductor cooling sheet 41 and the heating element 42 to operate alone.

[0045] In the cooling state, the semiconductor cooling sheet 41 and the fan 53 are running at the same time, and the cold end of the semiconductor cooling sheet 41 absorbs the heat in the cavity 20 through the conductive member 3, so that the temperature of the liquid in the cavity 20 drops, and the NTC temperature sensor 43 stops after detecting that the temperature reaches the preset value. In this process, the cavity 20 is in a negative pressure state due to the temperature drop in the cavity 20. At this time, the air hole 60 of the air inlet valve 6 opens, and the external gas enters the cavity 20 through the air path 61 and the air hole 60, so that the air pressure in the cavity 20 is restored to balance. After the cooling is completed, the first shell 1 can be separated from the second shell 2 normally and easily, which is convenient for users to use. Generally, boiling water is poured into the cavity. In the cooling state, the cold end of the semiconductor cooling sheet 41 absorbs the heat of the boiling water through the conductive member 3, so that the boiling water is quickly cooled to the preset temperature, which is convenient for drinking.

[0046] In the heating state, when the heating element 42 is running, the heat generated by the heating element 42 is released into the cavity 20 through the conductive element 3, so that the temperature of the liquid in the cavity 20 rises, and the NTC temperature sensor 43 stops after detecting that the temperature reaches the preset value. In this process, the cavity 20 is in a positive pressure state due to the temperature rise in the cavity 20. At this time, the air hole 60 of the air inlet valve 6 opens, and the gas in the cavity 20 flows out to the outside through the air hole 60 and the air path 61, so that the air pressure in the cavity 20 is restored to balance. Avoid high pressure causing the first shell 1 to automatically separate from the second shell 2 and cause unexpected danger. After the heating is completed, the first shell 1 can be separated from the second shell 2 normally and easily, and the user can use it safely.

[0047] The terms first, second, etc. used in the present invention do not indicate any order, quantity or importance, but are only used for distinction.

[0048] As used in the present invention, the terms: one, an, etc., do not indicate a limitation of quantity, but rather indicate the presence of at least one of the mentioned objects.

[0049] As used in the present invention, terms indicating orientation or position: front end, rear end, top, bottom, side, longitudinal, transverse, middle, center, outside, inside, horizontal, vertical, left, right, above, below, etc., are intended to reflect relative positions rather than absolute positions.

[0050] As used in the present invention, the terms: generally, overall, approximately, close, etc., are limiting terms to indicate that a feature exists but a certain deviation is allowed. The amount of a certain deviation can vary depending on the specific context.

Claims

1. A portable container, comprising a first shell (1) and a second shell (2), wherein the first shell (1) and the second shell (2) are detachably connected together to form a sealed container cavity (20), wherein: It also includes a conducting member (3), a semiconductor cooling plate (41) and a control circuit for controlling the operation of the semiconductor cooling plate (41) are provided in the first shell (1), the inner end of the conducting member (3) is sealed and placed in the first shell (1) and abuts against the cold end of the semiconductor cooling plate (41), the outer end of the conducting member (3) extends out of the first shell (1) and then extends into the cavity (20), and the cold end of the semiconductor cooling plate (41) absorbs heat in the cavity (20) through the conducting member (3).

2. The portable container according to claim 1, characterized in that: The conductive member (3) comprises a first section (35) and a second section (36); the diameter of the first section (35) is larger than the diameter of the second section (36); the first section (35) and the second section (36) are transitioned via an arc surface; the outer end surface of the first section (35) and the surface of the second section (36) are both exposed in the cavity (20); and the inner end surface of the first section (35) abuts against the cold end of the semiconductor cooling plate (41).

3. The portable container according to claim 1, characterized in that: A heating element (42) is provided in the conductive member (3); the heating element (42) is electrically connected to the control circuit; and the heat generated by the heating element (42) is released into the containing cavity (20) via the conductive member (3).

4. The portable container according to claim 3, characterized in that: A vertical fixing hole (37) is provided at the center of the conductive member (3), and the heating element (42) is fixed in the fixing hole (37). A first clearance channel (38) is provided inside the conductive member (3) on one side of the fixing hole (37). The first clearance channel (38) communicates with the fixing hole (37) and the inner cavity of the first shell (1), and a wire of the heating element (42) passes through the first clearance channel (38) and is connected to the control circuit.

5. The portable container according to claim 4, characterized in that: The fixing hole (37) is a stepped hole. The fixing hole (37) comprises a first hole section (371) and a second hole section (372). The diameter of the first hole section (371) is larger than that of the second hole section (372). The second hole section (372) extends out of the outer end of the conductive member (3). The heating element (42) is limitedly arranged in the first hole section (371). An NTC temperature sensor (43) is arranged in the second hole section (372). The NTC temperature sensor (43) seals the second hole section (372). The conductive member (3) is provided with a second clearance channel (39) on one side of the fixing hole (37). One end of the second clearance channel (39) is connected to the first clearance channel (38). The other end of the second clearance channel (39) is connected to the second hole section (372). The wire of the NTC temperature sensor (43) is electrically connected to the control circuit via the second clearance channel (39) and the first clearance channel (38).

6. The portable container according to claim 1, characterized in that: A heat dissipation component (5) is provided in the first shell (1), a groove (34) is provided on the inner end surface of the conductive member (3), and the heat dissipation component (5) presses the semiconductor cooling plate (41) into the groove (34).

7. The portable container according to claim 6, characterized in that: The heat dissipation component (5) comprises a heat dissipation fin (51), a fixed bracket (52) and a fan (53); the fixed bracket (52) enables the heat dissipation fin (51) to be in close contact with the hot end of the semiconductor cooling plate (41); a heat dissipation channel (50) is provided at the center of the fixed bracket (52) corresponding to the heat dissipation fin (51); and the fan (53) is fixed in the heat dissipation channel (50).

8. The portable container according to claim 7, characterized in that: A control circuit board (7) is provided near the top of the first shell (1), the heat dissipation channel (50) faces the control circuit board (7), a control panel (71) is provided on the top surface of the first shell (1), the control panel (71) and the control circuit on the control circuit board (7) are electrically connected, a heat dissipation circular ring net (13) is provided on the outer periphery of the first shell (1), and the heat dissipation channel (50) dissipates heat to the outside through the control circuit board (7) toward the heat dissipation circular ring net (13).

9. The portable container according to claim 1, characterized in that: The first shell (1) or the conducting member (3) is provided with an air intake valve (6) corresponding to the cavity (20), and the air intake valve (6) is provided with a normally closed air hole (60) for only gas to pass through. An air path (61) is provided in the first shell (1), one end of the air path (61) is connected to the outside, and one end of the air path (61) is connected to the air hole (60). When the air pressure of the outside and the cavity (20) is balanced, the air hole (60) is closed to put the air intake valve (6) in a sealed state. When there is an air pressure difference between the outside and the cavity (20), the cavity (20) exhausts or inhales air through the air hole (60).

10. The portable container according to claim 1, characterized in that: The first shell (1) is a cover body, the outer end of the conductive member (3) extends out of the bottom surface of the cover body, the second shell (2) is a cup body, the second shell (2) is provided with the containing cavity (20), and after the cover body and the cup body are connected, the outer end of the conductive member (3) extends into the containing cavity (20).

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