A full-automatic cleaning machine for semiconductor wafer manufacturing SIC spare parts

Abstract

This invention provides a fully automated cleaning machine for SiC components in semiconductor wafer manufacturing, including upper and lower product stations. An alkaline solvent immersion station is located on one side of the upper and lower product stations. A first pure water overflow station is located on the side of the alkaline solvent immersion station away from the upper and lower product stations. An acidic solvent immersion station is located on the side of the first pure water overflow station away from the alkaline solvent immersion station. A second pure water overflow station is located on the side of the acidic solvent immersion station away from the first pure water overflow station. This machine can automatically clean SiC components in semiconductor wafer manufacturing, avoiding uneven cleaning of contaminants, preventing damage from impacts, solving the problem of secondary contamination caused by contact between cleaned components, and saving the significant labor costs required for manual cleaning.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a fully automatic cleaning machine for SiC components in semiconductor wafer manufacturing. Background Technology

[0002] SiC components are large, heavy, and of high value. Currently, the market primarily uses manual cleaning to remove contaminants. However, manual cleaning has various drawbacks, especially considering the large size, weight, and high value of SiC components. While the industry generally uses manual cleaning to remove contaminants from these components, this method has a series of serious disadvantages, significantly hindering production efficiency and product quality improvement, and increasing production costs and quality risks.

[0003] First, manual cleaning cannot ensure the uniform removal of contaminants from product components. Due to the limitations of manual operation, it is impossible to guarantee a consistent and thorough cleaning effect for every part when dealing with the complex structure and large surface area of ​​SiC components. Inconsistent operator techniques and fatigue can lead to over-cleaning in some areas, damaging the components, while other areas remain contaminant. For semiconductor wafer manufacturing, which has extremely high cleanliness requirements, this will undoubtedly significantly affect the quality and yield of subsequent wafers, increase the probability of defective products, and thus drive up production costs.

[0004] Secondly, manual handling faces significant challenges in the flow of materials between workstations during the cleaning process. The large size and weight of SiC components make manual handling not only extremely labor-intensive but also highly susceptible to accidents such as parts falling or colliding during transport, leading to damage. Furthermore, manual handling is inefficient and cannot meet the rapid turnaround requirements of large-scale production, resulting in extended production cycles, significantly reduced production efficiency, and a disadvantage for companies in market competition.

[0005] Furthermore, damage to product components from impacts is a common occurrence during manual cleaning. During handling and cleaning operations, collisions between SiC components and surrounding objects are unavoidable. Their hard materials are highly susceptible to scratches, cracks, or chipping upon impact. This not only damages the component's appearance but can also alter its internal structure and performance parameters, reducing its reliability and lifespan. Consequently, this negatively impacts the overall performance and stability of the semiconductor wafer manufacturing equipment, leading to frequent equipment failures and a significant increase in maintenance costs and downtime.

[0006] Furthermore, manually cleaned product components are highly susceptible to secondary contamination upon contact. Due to the lack of automated and standardized protective and isolation measures, cleaned components are easily exposed to unclean external environments or other components during storage and transportation, becoming contaminated with dust, oil, microorganisms, and other pollutants. This renders the previous cleaning work useless, necessitating re-cleaning or additional processing, resulting in significant waste of production time, labor costs, and materials. If secondary contamination is not detected and addressed promptly, it may carry contaminants into subsequent semiconductor wafer manufacturing processes, causing more serious quality problems or even leading to the scrapping of the entire batch of products, resulting in incalculable economic losses for the company.

[0007] Finally, given the large size and heavy weight of SiC components, manual cleaning requires a significant investment of manpower. Multiple operators are often needed to complete the cleaning task, and the work is labor-intensive and involves long hours. This not only means high labor costs but also increases in employee training expenses, occupational safety and health insurance costs, and management costs. With the continuous rise in labor costs, the company's production costs also increase sharply, squeezing profit margins and severely hindering investment in key areas such as technology research and development and equipment upgrades, which is detrimental to the company's sustainable development and market competitiveness. Summary of the Invention

[0008] The purpose of this invention is to address the shortcomings of existing technologies by providing a fully automatic cleaning machine for SiC components in semiconductor wafer manufacturing. This machine can automatically clean SiC components, avoiding uneven cleaning of contaminants, preventing damage from impacts, solving the problem of secondary contamination caused by contact between cleaned components, and saving the significant labor costs required for manual cleaning.

[0009] To achieve the above objectives, the present invention provides the following technical solution: a fully automatic cleaning machine for SiC components in semiconductor wafer manufacturing;

[0010] The system includes upper and lower product stations. An alkaline solvent immersion station is located on one side of the upper and lower product stations. A first pure water overflow station is located on the side of the alkaline solvent immersion station away from the upper and lower product stations. An acidic solvent immersion station is located on the side of the first pure water overflow station away from the alkaline solvent immersion station. A second pure water overflow station is located on the side of the acidic solvent immersion station away from the first pure water overflow station. An automatic rinsing and cleaning station is located on the side of the second pure water overflow station away from the acidic solvent immersion station. An automatic drying station is located on the side of the automatic rinsing and cleaning station away from the second pure water overflow station.

[0011] The surface of the alkaline solvent soaking product station is provided with a filter assembly. The filter assembly includes a water tank set on one side of the alkaline solvent soaking product station, a filter belt set inside the water tank, and a fan, air inlet pipe, drive motor, upper rotating roller and lower rotating roller for filtering dust in the exhaust gas through the filter belt.

[0012] The water storage tank is equipped with a cleaning assembly, which includes a bristle-brushed cleaning roller and a first gear, a second gear, and a first rotating shaft for cleaning the surface of the filter belt by the bristle-brushed cleaning roller.

[0013] As a preferred embodiment of the fully automatic cleaning machine for SiC components in semiconductor wafer manufacturing according to the present invention, the surfaces of the upper and lower product workstations are equipped with a first display screen and an industrial control operation panel. One side of the upper and lower product workstations is provided with a detachable upper maintenance door and a detachable lower maintenance door, with the upper detachable maintenance door located above the lower detachable maintenance door. The interior of the upper and lower product workstations is provided with a fully automatic transfer platform hoisting assembly. The surface of the fully automatic transfer platform hoisting assembly is equipped with a trolley limit fixing device, and a product transfer trolley is provided below the fully automatic transfer platform hoisting assembly.

[0014] As a preferred embodiment of the fully automated cleaning machine for SiC components in semiconductor wafer manufacturing according to the present invention, a second display screen is installed on the surface of the alkaline solvent immersion product station; a third exhaust pipe is installed on the upper surface of the alkaline solvent immersion product station; a fourth removable maintenance door is installed on the front surface of the alkaline solvent immersion product station; a solvent pH value measuring instrument is installed on the surface of the alkaline solvent immersion product station; a first emergency stop button is installed on the surface of the alkaline solvent immersion product station; and an automatic lifting door with a transparent viewing window is installed on the surface of the alkaline solvent immersion product station. The automatic window lift door is located between the second display screen and the fourth detachable maintenance door. The alkaline solvent soaking product station is equipped with a built-in bubble device at the bottom of the tank. The alkaline solvent soaking product station is also equipped with built-in liquid inlet and outlet pipes at the bottom of the tank. A liquid level sensor is located near the side of the alkaline solvent soaking product station. The alkaline solvent soaking product station is equipped with a fully automatic lifting device. The alkaline solvent soaking product station has an overflow tank for holding cleaning solvent. A third tri-color alarm light with a buzzer is installed on the surface of the alkaline solvent soaking product station.

[0015] As a preferred embodiment of the fully automatic cleaning machine for SiC components in semiconductor wafer manufacturing according to the present invention, the upper surface of the automatic rinsing and cleaning product station is provided with a first exhaust pipe, the front surface of the automatic rinsing and cleaning product station is equipped with a third display screen, the front surface of the automatic rinsing and cleaning product station is provided with a first detachable maintenance door near the bottom, the interior of the automatic rinsing and cleaning product station is provided with a cleaning spray system, the front surface of the automatic rinsing and cleaning product station is equipped with a second emergency stop button and a first barcode scanner, the first detachable maintenance door is located between the second emergency stop button and the first barcode scanner, and the surface of the automatic rinsing and cleaning product station is equipped with a first three-color alarm light with a buzzer.

[0016] As a preferred embodiment of the fully automatic cleaning machine for SiC components in semiconductor wafer manufacturing according to the present invention, the upper surface of the automatic drying station is provided with a second exhaust pipe, the front surface of the automatic drying station is equipped with a fourth display screen, the front surface of the automatic drying station is provided with a second detachable maintenance door near the bottom, the interior of the automatic drying station is provided with an air shower drying system, the front surface of the automatic drying station is equipped with a third emergency stop button and a second barcode scanner, the second detachable maintenance door is located between the third emergency stop button and the second barcode scanner, and the surface of the automatic drying station is equipped with a second three-color alarm light with a buzzer.

[0017] As a preferred embodiment of the fully automatic cleaning machine for SiC components in semiconductor wafer manufacturing according to the present invention, an air inlet pipe is fixedly connected to the top end of the third exhaust pipe, a rectangular shell is provided at the end of the air inlet pipe away from the third exhaust pipe, a water tank is fixedly connected to the bottom surface of the rectangular shell, the air inlet pipe is inserted into the surface of the rectangular shell and extends into the interior of the rectangular shell, a fan is installed in the mounting groove opened on the side of the rectangular shell away from the air inlet pipe, and four support plates are installed on the bottom surface of the water tank.

[0018] As a preferred embodiment of the fully automatic cleaning machine for SiC components in semiconductor wafer manufacturing according to the present invention, a top cover plate is fixedly connected to the upper surface of the rectangular housing. An upper rotating roller is installed inside the top cover plate, and both ends of the upper rotating roller's shaft pass through the top cover plate. The upper rotating roller and the top cover plate are rotatably connected. A drive motor is installed on the surface of the top cover plate, and the end of the drive motor's output shaft is fixedly connected to one end of the upper rotating roller. A lower rotating roller is provided inside the water storage tank, and the lower rotating roller is located below the upper rotating roller. Both ends of the lower rotating roller's shaft are inserted into rotating holes opened inside the water storage tank. The lower rotating roller and the water storage tank are rotatably connected. The lower rotating roller is located below the upper rotating roller. A filter screen belt is sleeved on the surface of the upper and lower rotating rollers. The filter screen belt is located in two first rectangular grooves opened on the upper surface of the water storage tank. The filter screen belt is located in a groove opened on the upper surface of the rectangular housing.

[0019] As a preferred embodiment of the fully automatic cleaning machine for SiC components in semiconductor wafer manufacturing according to the present invention, a baffle plate and a filter plate are fixedly connected inside the water storage tank. A guide groove is formed inside the baffle plate. A rectangular box is fixedly connected to the side of the baffle plate away from the filter plate. A square groove is formed on the side of the rectangular box away from the baffle plate. A submersible pump is installed inside the water storage tank. A connecting pipe is installed at the outlet end of the submersible pump. The connecting pipe passes through the filter plate and the baffle plate and is inserted into the inside of the rectangular box. The filter plate is located between the submersible pump and the baffle plate. A first threaded rubber plug and a second threaded rubber plug are respectively inserted into two threads formed on the bottom surface of the water storage tank. The first threaded rubber plug and the second threaded rubber plug are respectively threadedly connected to the water storage tank. The first threaded rubber plug is located on the side of the baffle plate away from the filter plate, and the second threaded rubber plug is located between the baffle plate and the filter plate. An inlet hole is formed on the upper surface of the water storage tank.

[0020] As a preferred embodiment of the fully automatic cleaning machine for SiC components in semiconductor wafer manufacturing according to the present invention, the water tank is provided with a first rotating shaft inside. The first rotating shaft is inserted into two rotating holes opened inside the water tank. The first rotating shaft and the water tank are rotatably connected. A cleaning roller with bristles and a second gear are fixedly sleeved on the surface of the first rotating shaft. The surface of the second gear is meshed with the first gear. The first gear is fixedly sleeved on the surface of the lower rotating roller shaft.

[0021] As a preferred embodiment of the fully automatic cleaning machine for SiC components in semiconductor wafer manufacturing according to the present invention, a scraper is provided between the filter belt and the baffle plate. A second rotating shaft is inserted into a rotating hole opened inside the scraper. The two ends of the second rotating shaft are fixedly connected to a water storage tank. The scraper and the second rotating shaft are rotatably connected. A hollow shell is fixedly connected to the side of the baffle plate near the filter belt. An internal extrusion plate and a spring are provided inside the hollow shell. The internal extrusion plate and the hollow shell are slidably connected. The two ends of the spring are fixedly connected to the internal extrusion plate and the baffle plate, respectively. The side of the internal extrusion plate away from the spring is in contact with the surface of the scraper.

[0022] The beneficial effects of this invention are as follows:

[0023] (1) This invention can perform fully automatic cleaning of SiC components in semiconductor wafer manufacturing, avoid uneven cleaning of contaminants on product components, prevent damage to product components from bumps and knocks, solve the problem of secondary pollution caused by contact of cleaned product components, and save the large labor costs required for manual cleaning.

[0024] (2) By providing a filter assembly, the present invention facilitates the filtering of impurities in the gas discharged from the cleaning machine by allowing the gas to pass through the filter belt and the continuously rotating filter belt to filter the impurities in the gas. Furthermore, the precipitate cleans the impurities adhering to the surface of the filter belt, thus ensuring the effective filtration of the gas discharged from the cleaning machine by the filter belt.

[0025] (3) The present invention is equipped with a cleaning component. The cleaning roller with bristles and the contact position of the filter belt are immersed in the sedimentation liquid. The rotation of the cleaning roller with bristles can clean the surface of the filter belt, ensuring the cleaning effect of the filter belt surface. Under the action of the elastic potential energy of the spring, one end of the scraper can press against the filter belt, avoiding the problem of the filter belt loosening after a period of use. At the same time, it can scrape off the impurities on the surface of the filter belt, further ensuring the cleaning effect of filtering impurities on the surface of the filter belt.

[0026] (4) High-pressure gas is introduced into the pipeline of the present invention. After passing through the flow groove, the high-pressure gas is ejected from the aeration hole a, which impacts the surface of the filter belt and enhances the washing effect on the surface of the filter belt. High-pressure gas is introduced into the ventilation pipe. After entering the arc block, the high-pressure gas is ejected from the aeration hole b and the through hole. In addition to aerating and washing the filter belt, it also cleans the cleaning roller. The linear drive drives the cleaning roller to make linear reciprocating motion along its axis, and rubs the filter belt along the axis of the cleaning roller, which greatly enhances the cleaning effect on the filter belt. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 This is a schematic diagram of the upper and lower product workstations in this invention;

[0029] Figure 3 This is a schematic diagram of the product soaking station in the alkaline solvent of the present invention;

[0030] Figure 4 This is a schematic diagram of the automatic shower cleaning station in this invention;

[0031] Figure 5 This is a schematic diagram of the rectangular shell and water storage tank in this invention;

[0032] Figure 6 This is a schematic diagram of the structure of the baffle plate and the water storage tank in this invention;

[0033] Figure 7 For the present invention Figure 6 Enlarged view of point A in the middle;

[0034] Figure 8 This is a schematic diagram of the structure of the filter belt and the lower rotating roller in this invention;

[0035] Figure 9 This is a schematic diagram of the rectangular box and the baffle plate in this invention;

[0036] Figure 10 This is a schematic diagram of the structure of the first gear and the second gear in this invention;

[0037] Figure 11 This is a schematic diagram of the linear drive component and mounting sleeve structure in this invention;

[0038] Figure 12 This is a schematic diagram of the arc-shaped block structure in this invention;

[0039] Figure 13 This is a schematic diagram of the arc-shaped block and aeration hole b in this invention;

[0040] Figure 14 This is a cross-sectional schematic diagram of the lower rotating roller in this invention.

[0041] In the picture:

[0042] 1. Upper and lower product workstations; 11. First display screen; 12. Industrial control panel; 13. Upper detachable maintenance door; 14. Lower detachable maintenance door; 15. Fully automatic transfer platform hoisting components; 16. Product transport trolley; 17. Transport trolley limit and fixing device; 2. Alkaline solvent immersion product workstation; 21. Second display screen; 22. Third exhaust duct; 23. Fourth detachable maintenance door; 24. Solvent pH value measuring instrument; 25. First emergency stop button; 26. Automatic lifting door with transparent window; 27. Built-in bubbling device at the bottom of the tank; 28. Built-in liquid inlet and outlet pipes at the bottom of the tank; 29. 210. Liquid level sensor; 211. Fully automatic lifting device; 212. Cleaning solvent overflow tank; 213. Third tri-color alarm light with buzzer; 3. First pure water overflow station; 4. Acidic solvent soaking station; 5. Second pure water overflow station; 6. Automatic rinsing and cleaning station; 61. Third display screen; 62. First exhaust duct; 63. First tri-color alarm light with buzzer; 64. Second emergency stop button; 65. First detachable maintenance door; 66. Cleaning spray system; 67. First barcode scanner; 78. Automatic product drying station; 79. Fourth display screen; 70. Second exhaust duct. Piping; 73. Second tri-color alarm light with buzzer; 74. Third emergency stop button; 75. Second detachable maintenance door; 76. Air shower drying system; 77. Second barcode scanner; 8. Filter assembly; 81. Air inlet duct; 82. Water tank; 83. Rectangular housing; 84. Top cover; 85. Upper rotating roller; 86. Lower rotating roller; 860. Through hole; 861. Placement slot; 87. Fan; 88. Filter belt; 89. First rectangular groove; 810. Support plate; 811. First threaded rubber plug; 812. Submersible pump; 813. Connecting pipe; 814. Filter screen; 815. Second 816. Threaded rubber plug; 817. Baffle plate; 818. Flow guide channel; 819. Rectangular box; 820. Square channel; 821. Drive motor; 822. Liquid inlet; 9. Cleaning assembly; 900. Linear drive component; 901. Mounting sleeve; 902. Pipe; 91. First gear; 92. Second gear; 93. First rotating shaft; 931. Flow channel; 932. Aeration hole a; 903. Arc-shaped block; 9031. Aeration hole b; 904. Connecting rod; 94. Cleaning roller with bristles; 95. Scraper; 96. Second rotating shaft; 97. Hollow shell; 98. Internal extrusion plate; 99. Spring. Detailed Implementation

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0045] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0046] Example 1

[0047] like Figures 1-10 As shown, this embodiment provides a fully automated cleaning machine for SiC components in semiconductor wafer manufacturing;

[0048] The system includes an upper and lower product station 1, an alkaline solvent immersion product station 2 on one side of the upper and lower product station 1, a first pure water overflow station 3 on the side of the alkaline solvent immersion product station 2 away from the upper and lower product station 1, an acidic solvent immersion product station 4 on the side of the first pure water overflow station 3 away from the alkaline solvent immersion product station 2, a second pure water overflow station 5 on the side of the acidic solvent immersion product station 4 away from the first pure water overflow station 3, an automatic rinsing and cleaning product station 6 on the side of the second pure water overflow station 5 away from the acidic solvent immersion product station 4, and an automatic drying product station 7 on the side of the automatic rinsing and cleaning product station 6 away from the second pure water overflow station 5.

[0049] The surface of the product loading / unloading station 1 is equipped with a first display screen 11 and an industrial control operation panel 12. A detachable maintenance door upper 13 and a detachable maintenance door lower 14 are provided on one side of the product loading / unloading station 1. The detachable maintenance door upper 13 is located above the detachable maintenance door lower 14. The interior of the product loading / unloading station 1 is equipped with a fully automatic transfer platform hoisting component 15. A trolley limit fixing device 17 is installed on the surface of the fully automatic transfer platform hoisting component 15. A product trolley 16 is provided below the fully automatic transfer platform hoisting component 15. The first display screen 11 is used to display the current station status. The industrial control operation panel 12 is used to operate the device and define the device's mechanical and electrical control parameters. The detachable maintenance door upper 13 and detachable maintenance door lower 14 facilitate the maintenance of the device. The fully automatic transfer platform hoisting component 15 is used for the transfer of products between the stations. The product trolley 16 moves the products to the loading / unloading station. The trolley limit fixing device 17 is used to fix the trolley pushed into the loading / unloading station.

[0050] A second display screen 21 is installed on the surface of the alkaline solvent immersion product station 2. A third exhaust pipe 22 is installed on the upper surface of the alkaline solvent immersion product station 2. A fourth removable maintenance door 23 is installed on the front surface of the alkaline solvent immersion product station 2. A solvent pH value measuring instrument 24 is installed on the surface of the alkaline solvent immersion product station 2. A first emergency stop button 25 is installed on the surface of the alkaline solvent immersion product station 2. An automatic lifting door 26 with a transparent viewing window is installed on the surface of the alkaline solvent immersion product station 2. The automatic lifting door 26 with a transparent viewing window is located at... Between the second display screen 21 and the fourth detachable maintenance door 23, the alkaline solvent immersion product station 2 is equipped with a bottom-mounted bubbling device 27, a bottom-mounted liquid inlet and outlet pipe 28, a liquid level sensor 29 near the side, a fully automatic lifting device 210, and a cleaning solvent overflow tank 211. The surface is equipped with a third tri-color alarm light 212 with a buzzer. The internal structures of the first pure water overflow station 3, the acid solvent immersion product station 4, and the alkaline solvent immersion product station 2 are all identical. The second display screen 21 shows the current station status. The third exhaust pipe 22 connects to the filter assembly 8 and the cleaning assembly 9 to purify air pollution. The fourth detachable maintenance door 23 facilitates equipment maintenance. The solvent pH value detector 24 monitors the pH value of the solvent in the tank. The first emergency stop button 25 is used to immediately stop any abnormal operation of the equipment. The transparent viewing window automatic lifting door 26 is used to observe the operation of the device. The built-in bubbling device 27 at the bottom of the tank is used to bubble the solvent in the tank to promote the soaking effect. The built-in liquid inlet and outlet pipes 28 at the bottom of the tank are used to transport or discharge liquids into or out of the tank, including pure water, cleaning solvent, etc. The liquid level sensor 29 is used to monitor the solvent volume in the tank. The fully automatic lifting device 210 is used to sink and lift the product into and out of the solvent in the tank. The cleaning solvent overflow tank 211 is used to hold the cleaning solvent. The third-generation three-color alarm light with buzzer 212 is used to provide feedback on the current working status of the station.

[0051] The automatic shower cleaning station 6 has a first exhaust duct 62 on its upper surface, a third display screen 61 on its front surface, a first removable maintenance door 65 near the bottom of its front surface, a cleaning spray system 66 inside, a second emergency stop button 64 and a first barcode scanner 67 on its front surface, and the first removable maintenance door 65 located between the second emergency stop button 64 and the first barcode scanner 67. A first belt is also installed on the surface of the automatic shower cleaning station 6. A buzzer with a three-color alarm light 63, a third display screen 61 for displaying the current workstation status, a first exhaust pipe 62 for connecting to the filter assembly 8 and the cleaning assembly 9 to purify air pollution, a first three-color alarm light with a buzzer 63 for feedback on the current workstation status, a second emergency stop button 64 for emergency stopping of abnormal operation of the device, a first detachable maintenance door 65 for convenient maintenance of the device, a cleaning spray system 66 including an infusion pipeline and evenly distributed nozzles for automatic spray cleaning of the product, and a first barcode scanner 67 for scanning the barcode or QR code on the product work order to connect to the MES system.

[0052] The automatic product drying station 7 has a second exhaust pipe 72 on its upper surface, a fourth display screen 71 on its front surface, a second removable maintenance door 75 near the bottom of its front surface, an air shower drying system 76 inside, a third emergency stop button 74 and a second barcode scanner 77 on its front surface, the second removable maintenance door 75 located between the third emergency stop button 74 and the second barcode scanner 77, and a second device with a buzzer installed on its surface. The system includes a color alarm light 73, a fourth display screen 71 for displaying the current workstation status, a second exhaust duct 72 for connecting to the filter assembly 8 and the cleaning assembly 9 to purify air pollution, a second three-color alarm light 73 with a buzzer for feedback on the current workstation status, a third emergency stop button 74 for emergency stopping of abnormal operation of the device, a second detachable maintenance door 75 for convenient maintenance of the device, an air shower drying system 76 including an air supply duct and evenly distributed nozzles for automatic air shower drying of products, and a second barcode scanner 77 for scanning barcodes or QR codes on product work orders to connect to the MES system.

[0053] The surface of the alkaline solvent soaking product station 2 is equipped with a filter assembly 8. The filter assembly 8 includes an air inlet pipe 81, a water storage tank 82, a rectangular shell 83, a top cover plate 84, an upper rotating roller 85, a lower rotating roller 86, a fan 87, a filter belt 88, a support plate 810, a first threaded rubber plug 811, a submersible pump 812, a connecting pipe 813, a filter screen plate 814, a second threaded rubber plug 815, a baffle plate 816, a rectangular box 818, and a drive motor 820. The top end of the third exhaust pipe 22 is fixedly connected to the air inlet pipe 81. The end of the air inlet pipe 81 away from the third exhaust pipe 22 is provided with a rectangular shell 83. The bottom surface of the rectangular shell 83 is fixedly connected to the water storage tank 82. The air inlet pipe 81 is inserted into the surface of the rectangular shell 83 and extends into the interior of the rectangular shell 83. The fan 87 is installed in the mounting groove on the side of the rectangular shell 83 away from the air inlet pipe 81. Four support plates 810 are installed on the bottom surface of the water storage tank 82.

[0054] A top cover plate 84 is fixedly connected to the upper surface of the rectangular shell 83. An upper rotating roller 85 is installed inside the top cover plate 84. The two ends of the rotating shaft of the upper rotating roller 85 pass through the top cover plate 84 respectively. The upper rotating roller 85 and the top cover plate 84 are rotatably connected. A drive motor 820 is installed on the surface of the top cover plate 84. The end of the output shaft of the drive motor 820 is fixedly connected to one end of the upper rotating roller 85. A lower rotating roller 86 is provided inside the water storage tank 82. The lower rotating roller 86 is located below the upper rotating roller 85. The two ends of the rotating shaft of the lower rotating roller 86 are respectively inserted into the rotating holes opened inside the water storage tank 82. The lower rotating roller 86 and the water storage tank 82 are rotatably connected. The lower rotating roller 86 is located below the upper rotating roller 85. A filter screen belt 88 is sleeved on the surface of the upper rotating roller 85 and the lower rotating roller 86. The filter screen belt 88 is located in the two first rectangular grooves 89 opened on the upper surface of the water storage tank 82. The filter screen belt 88 is located in the groove opened on the upper surface of the rectangular shell 83.

[0055] A baffle plate 816 and a filter plate 814 are fixedly connected inside the water storage tank 82. A guide channel 817 is provided inside the baffle plate 816. A rectangular box 818 is fixedly connected to the side of the baffle plate 816 away from the filter plate 814. A square groove 819 is provided on the side of the rectangular box 818 away from the baffle plate 816. A submersible pump 812 is installed inside the water storage tank 82. A connecting pipe 813 is installed at the outlet end of the submersible pump 812. The connecting pipe 813 passes through the filter plate 814 and the baffle plate 816 and is inserted into the rectangular box 818. Inside, the filter plate 814 is located between the submersible pump 812 and the baffle plate 816. The bottom surface of the water storage tank 82 has two threads, in which a first threaded rubber plug 811 and a second threaded rubber plug 815 are respectively inserted. The first threaded rubber plug 811 and the second threaded rubber plug 815 are respectively threadedly connected to the water storage tank 82. The first threaded rubber plug 811 is located on the side of the baffle plate 816 away from the filter plate 814, and the second threaded rubber plug 815 is located between the baffle plate 816 and the filter plate 814. The upper surface of the water storage tank 82 has a liquid inlet hole 821.

[0056] The water tank 82 is equipped with a cleaning assembly 9, which includes a first gear 91, a second gear 92, a first rotating shaft 93, a cleaning roller 94 with bristles, a scraper 95, a second rotating shaft 96, a hollow shell 97, an internal extrusion plate 98, and a spring 99. The first rotating shaft 93 is inserted into two rotating holes inside the water tank 82 and is rotatably connected to the water tank 82. The cleaning roller 94 with bristles and the second gear 92 are fixedly sleeved on the surface of the first rotating shaft 93. The first gear 91 is meshed with the surface of the second gear 92 and is fixedly sleeved on the surface of the lower rotating roller 86 shaft.

[0057] A scraper 95 is provided between the filter belt 88 and the baffle plate 816. A second rotating shaft 96 is inserted into a rotating hole inside the scraper 95. The two ends of the second rotating shaft 96 are fixedly connected to the water storage tank 82. The scraper 95 and the second rotating shaft 96 are rotatably connected. A hollow shell 97 is fixedly connected to the side of the baffle plate 816 near the filter belt 88. An internal squeezing plate 98 and a spring 99 are provided inside the hollow shell 97. The internal squeezing plate 98 and the hollow shell 97 are slidably connected. The two ends of the spring 99 are fixedly connected to the internal squeezing plate 98 and the baffle plate 816 respectively. The side of the internal squeezing plate 98 away from the spring 99 is in contact with the surface of the scraper 95.

[0058] Work steps:

[0059] During use, in the preparation stage, the operator pushes the product transport cart 16 to the upper and lower product workstations 1. The transport cart limit and fixing device 17 automatically fixes the transport cart to ensure its stable position. The operator checks whether the solvent at each workstation is sufficient, whether the pipeline connections are normal, and whether each component of the equipment is in normal working condition. The initial status information of each workstation can be viewed through the first display screen 11, the second display screen 21, the third display screen 61 and the fourth display screen 71. The solvent pH value detection instrument 24 checks whether the acidity or alkalinity of the solvent in the alkaline solvent soaking product workstation 2 and the acidic solvent soaking product workstation 4 meets the requirements. The liquid level sensor 29 monitors whether the solvent capacity in each tank is sufficient.

[0060] Feeding: The product is lifted from the product transport vehicle 16 by the fully automatic transfer platform hoisting component 15 and transferred to the alkaline solvent soaking product station 2. The fully automatic lifting device 210 of the alkaline solvent soaking product station 2 is lowered so that the product is immersed in the alkaline solvent and the alkaline solvent soaking cleaning step begins.

[0061] Alkaline solvent immersion cleaning: The built-in bubbling device 27 at the bottom of the tank is activated to bubble the alkaline solvent, allowing the solvent to fully contact the product surface, enhancing the cleaning effect and removing some contaminants such as oil and organic impurities from the product surface.

[0062] During this process, the solvent pH value detection instrument 24 continuously monitors the pH value of the solvent. If it exceeds the preset range, it will automatically trigger an alarm signal. The third-generation buzzer tri-color alarm light 212 flashes and emits a buzzing sound to remind the operator to adjust or replace the solvent.

[0063] The liquid level sensor 29 monitors the solvent level in real time. When the liquid level is too low, it automatically triggers the built-in liquid inlet and outlet pipes 28 at the bottom of the tank to replenish the alkaline solvent, ensuring that the product is always immersed in the solvent at the appropriate liquid level.

[0064] Post-immersion treatment in alkaline solvent: After immersion in alkaline solvent, the fully automatic lifting device 210 lifts the product and removes it from the alkaline solvent;

[0065] The automatic lifting door 26 with a transparent viewing window opens, and the fully automatic transplanting platform hoisting component 15 transfers the product to the first pure water overflow station 3;

[0066] First pure water overflow cleaning: In the first pure water overflow station 3, pure water flows in from the built-in liquid inlet and liquid outlet pipes 28 at the bottom of the tank, forming an overflow state, which washes away the alkaline solvent residue on the product surface, removes the alkaline solvent residue, and prevents it from affecting the subsequent cleaning steps. After a certain period of overflow cleaning, the fully automatic transfer platform hoisting component 15 transfers the product to the acid solvent soaking product station 4.

[0067] Acidic solvent immersion cleaning: Similar to alkaline solvent immersion cleaning, the product is immersed in an acidic solvent. The built-in bubble device 27 at the bottom of the tank in the acidic solvent immersion station 4 is activated to enhance the cleaning effect and remove contaminants such as metal ions that may be present on the product surface.

[0068] The solvent pH value detection instrument 24 monitors the pH value of acidic solvents, and the liquid level sensor 29 monitors the liquid level to ensure that the cleaning process proceeds normally. If there is any abnormality, the corresponding alarm signal will be triggered. The third-generation buzzer and three-color alarm light 212 will sound an alarm.

[0069] Post-treatment after soaking in acidic solvent: After soaking in acidic solvent, the product is lifted by the fully automatic lifting device 210, and the fully automatic transfer platform hoisting component 15 transfers the product to the second pure water overflow station 5.

[0070] Second pure water overflow cleaning: In the second pure water overflow station 5, pure water overflow cleaning is used again to remove residual acidic solvents on the product surface, preventing acid residue from corroding the product or affecting subsequent processing.

[0071] After cleaning, the fully automatic transplanting platform hoisting component 15 transfers the product to the automatic shower cleaning product station 6;

[0072] Automatic rinsing and cleaning: The cleaning spray system 66 of the automatic rinsing and cleaning product station 6 is started. The liquid delivery pipeline delivers pure water to the evenly distributed nozzles to carry out all-round automatic spray cleaning of the product, further removing residual impurities and small amounts of solvent residues on the product surface.

[0073] The first barcode scanner 67 scans the barcode or QR code on the product work order, connects the product information with the MES system, records the cleaning process data, and facilitates traceability and quality management.

[0074] Automatic drying: After the spray cleaning is completed, the fully automatic transplanting platform hoisting component 15 transfers the product to the automatic drying product station 7;

[0075] The air shower drying system 76 of the automatic product drying station 7 is started. The air supply duct delivers clean air to the evenly distributed nozzles to air shower and dry the products, removing moisture from the product surface.

[0076] The second barcode scanner 77 scans the product work order again to confirm the information recording and processing of the product in the drying process.

[0077] Unloading: After the automatic drying is completed, the fully automatic transfer platform hoisting component 15 lifts the product from the automatic drying product station 7 and transfers it back to the product transport vehicle 16 of the upper and lower product station 1.

[0078] Once the limiting and fixing device 17 of the transport vehicle is released, the operator pushes the product transport vehicle 16 away from the upper and lower product workstations 1, completing the entire cleaning process.

[0079] Throughout the workflow, if any abnormality occurs, such as equipment malfunction, solvent leakage, or abnormal cleaning parameters, the emergency stop buttons at the corresponding workstations (first emergency stop button 25, second emergency stop button 64, and third emergency stop button 74) will immediately stop the equipment operation. Simultaneously, the corresponding tri-color alarm lights (third tri-color alarm light 212, first tri-color alarm light 63, and second tri-color alarm light 73) will emit clear alarm signals to remind operators to troubleshoot and handle the fault. The removable maintenance doors at each workstation will also be equipped with... 13. Detachable maintenance door 14. Fourth detachable maintenance door 23. First detachable maintenance door 65. Second detachable maintenance door 75. This device allows operators to quickly access the equipment for repair when it malfunctions or requires routine maintenance. It can automatically clean SiC components for semiconductor wafer manufacturing, avoiding uneven cleaning of contaminants, preventing damage from impacts, solving the problem of secondary contamination caused by contact between cleaned components, and saving the significant labor costs required for manual cleaning.

[0080] During the operation of the cleaning machine, the gas generated during the cleaning process flows into the air inlet pipe 81 through the interior of the third exhaust pipe 22. Suitable sediment is added into the water storage tank 82 through the liquid inlet hole 821. The sediment flows into the baffle plate 816 away from the filter screen plate 814 through the interior of the guide channel 817 until the coolant level reaches the guide channel 817. This connects the fan 87, drive motor 820, and submersible pump 812 to an external power source, enabling them to operate. The fan 87 draws gas from the third exhaust pipe 22 through the air inlet pipe 81. The gas passes through the filter belt 88 and flows from the inside of the fan 87 to the outside. The drive motor 820 rotates the upper rotating roller 85, which in turn rotates the filter belt 88. As the filter belt 88 rotates, the gas passes through the filter belt... The filter belt 88 can filter impurities in the gas. As the filter belt 88 rotates, when the filter belt 88 with impurities adhering to it comes into contact with the sediment in the water tank 82, the impurities adhering to the surface of the filter belt 88 are separated from the filter belt 88. When the submersible pump 812 is running, the sediment inside the water tank 82 can be sprayed out along the inside of the square groove 819 and sprayed onto the surface of the filter belt 88. The position of the sediment sprayed from the inside of the square groove 819 onto the surface of the filter belt 88 is above the sediment level inside the water tank 82, which can further clean the impurities adhering to the surface of the filter belt 88. This is beneficial for the gas discharged from the cleaning machine to pass through the filter belt 88, and for the impurities in the gas to be filtered by the continuously rotating filter belt 88. The sediment cleans the impurities adhering to the surface of the filter belt 88, ensuring the filtering effect of the gas discharged from the cleaning machine through the filter belt 88.

[0081] During its rotation, the upper rotating roller 85 drives the lower rotating roller 86 to rotate synchronously via the filter belt 88. The rotation of the lower rotating roller 86 drives the first gear 91 to rotate synchronously, which in turn drives the second gear 92 to rotate. The rotation of the second gear 92 drives the first rotating shaft 93 to rotate synchronously, which in turn drives the cleaning roller 94 with bristles to rotate. Since the contact point between the cleaning roller 94 with bristles and the filter belt 88 is immersed in the sediment, the rotation of the cleaning roller 94 with bristles can clean the surface of the filter belt 88, ensuring the cleaning effect of the filter belt 88 surface. Furthermore, under the action of the elastic potential energy of the spring 99, one end of the scraper 95 can press against the filter belt 88, preventing the filter belt 88 from loosening after a period of use. At the same time, it can scrape off the impurities on the surface of the filter belt 88, thereby ensuring the cleaning effect of filtering impurities on the surface of the filter belt 88.

[0082] As the precipitate on the side of the filter plate 814 away from the filter plate 814 is continuously injected into the side of the baffle plate 816 away from the filter plate 814 by the operation of the submersible pump 812, as the liquid on that side of the baffle plate 816 increases, the liquid flows along the inside of the guide channel 817 into the space between the baffle plate 816 and the filter plate 814. Some of the precipitate settles on the side of the baffle plate 816 away from the filter plate 814. The precipitate flowing into the space between the baffle plate 816 and the filter plate 814 passes through the filter plate 814 and flows into the side of the filter plate 814 away from the baffle plate 816, facilitating the circulation of the liquid. The sediment on one side of the filter screen plate 814 is in motion, which allows some impurities to flow into the space between the filter screen plate 814 and the baffle plate 816. Under the action of the filter screen plate 814, the impurities between the baffle plate 816 and the filter screen plate 814 can be filtered again, further ensuring the washing effect of the sediment on the surface of the filter belt 88. By rotating the first threaded rubber plug 811 and the second threaded rubber plug 815, the first threaded rubber plug 811 and the second threaded rubber plug 815 can be screwed out from the inside of the water storage tank 82, thereby allowing the sediment accumulated inside the water storage tank 82 to be discharged, ensuring the effectiveness of the cleaning machine.

[0083] To enhance the rinsing effect on the surface of the filter belt 88, such as Figures 11-14 As shown, a linear drive 900 is provided on one side of the water storage tank 82. The output end of the linear drive 900 is connected to the first rotating shaft 93 (rotational connection). An installation sleeve 901 is provided on the outside of the first rotating shaft 93. A pipe 902 is provided on the installation sleeve 901. A flow channel 931 and multiple aeration holes a932 are opened inside the first rotating shaft 93.

[0084] The lower rotating roller 86 has multiple through holes 860, and a placement groove 861 is provided inside the lower rotating roller 86. An arc-shaped block 903 is provided in the placement groove 861, and an aeration hole b9031 is provided in the arc-shaped block 903. A connecting rod 904 is installed on the arc-shaped block 903, and a vent pipe is provided on the connecting rod 904. The vent pipe and pipeline 902 for introducing high-pressure gas is a conventional technical means in this field and will not be described in detail here.

[0085] High-pressure gas is introduced into pipe 902. After passing through flow channel 931, the high-pressure gas is ejected from aeration hole a932, impacting the surface of filter screen belt 88 and enhancing the washing effect on the surface of filter screen belt 88. High-pressure gas is introduced into vent pipe. After entering arc block 903, the high-pressure gas is ejected from aeration hole b9031 and through hole 860. In addition to aerating and washing the filter screen belt 88, it also cleans the cleaning roller 94. Linear drive component 900 drives the cleaning roller 94 to make linear reciprocating motion along its axis (with a small amplitude of motion). The cleaning roller 94 rubs the surface of filter screen belt 88 along its axis, greatly enhancing the cleaning effect on filter screen belt 88.

[0086] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A fully automated cleaning machine for SiC components in semiconductor wafer manufacturing; characterized in that The system includes an upper and lower product station (1), an alkaline solvent soaking product station (2) is provided on one side of the upper and lower product station (1), a first pure water overflow station (3) is provided on the side of the alkaline solvent soaking product station (2) away from the upper and lower product station (1), an acidic solvent soaking product station (4) is provided on the side of the first pure water overflow station (3) away from the alkaline solvent soaking product station (2), a second pure water overflow station (5) is provided on the side of the acidic solvent soaking product station (4) away from the first pure water overflow station (3), an automatic rinsing and cleaning product station (6) is provided on the side of the second pure water overflow station (5) away from the acidic solvent soaking product station (4), and an automatic drying product station (7) is provided on the side of the automatic rinsing and cleaning product station (6) away from the second pure water overflow station (5). The surface of the alkaline solvent soaking product station (2) is provided with a filter assembly (8). The filter assembly (8) includes a water tank (82) disposed on one side of the alkaline solvent soaking product station (2), a filter belt (88) disposed inside the water tank (82), and a fan (87), an air inlet pipe (81), a drive motor (820), an upper rotating roller (85), and a lower rotating roller (86) for filtering dust in the exhaust gas through the filter belt (88). The water storage tank (82) is provided with a cleaning component (9), which includes a brush-brushed cleaning roller (94) and a first gear (91), a second gear (92) and a first rotating shaft (93) for cleaning the surface of the filter belt (88) by the brush-brushed cleaning roller (94) inside the water storage tank (82). The water storage tank (82) is provided with a first rotating shaft (93) inside. A linear drive (900) is provided on one side of the water storage tank (82). The output end of the linear drive (900) is connected to the first rotating shaft (93). An installation sleeve (901) is provided on the outside of the first rotating shaft (93). A pipe (902) is provided on the installation sleeve (901). A flow channel (931) and multiple aeration holes a (932) are opened inside the first rotating shaft (93). The lower rotating roller (86) has multiple through holes (860), and the lower rotating roller (86) has a placement groove (861) inside. The placement groove (861) has an arc-shaped block (903) inside. The arc-shaped block (903) has an aeration hole b (9031) inside. The arc-shaped block (903) is equipped with a connecting rod (904), and the connecting rod (904) is equipped with an air pipe. High-pressure gas is introduced into the pipe (902). After passing through the flow channel (931), the high-pressure gas is ejected from the aeration hole a (932) to impact the surface of the filter belt (88) and enhance the washing effect on the surface of the filter belt (88). High-pressure gas is introduced into the ventilation pipe. After entering the arc block (903), the high-pressure gas is ejected from the aeration hole b (9031) and the through hole (860) to aerate and wash the filter belt (88) and also to clean the cleaning roller (94). The linear drive (900) drives the cleaning roller (94) to make linear reciprocating motion along its axis and rub the surface of the filter belt (88) along the axis of the cleaning roller (94).

2. The fully automatic cleaning machine for manufacturing SIC parts from semiconductor wafers according to claim 1, characterized in that: The surface of the upper and lower product workstations (1) is equipped with a first display screen (11) and an industrial control operation panel (12). A detachable maintenance door upper (13) and a detachable maintenance door lower (14) are provided on one side of the upper and lower product workstations (1). The detachable maintenance door upper (13) is located above the detachable maintenance door lower (14). The interior of the upper and lower product workstations (1) is equipped with a fully automatic transplanting platform hoisting assembly (15). The surface of the fully automatic transplanting platform hoisting assembly (15) is equipped with a trolley limit fixing device (17). A product trolley (16) is provided below the fully automatic transplanting platform hoisting assembly (15).

3. The fully automatic cleaning machine for SiC components in semiconductor wafer manufacturing according to claim 1, characterized in that: A second display screen (21) is installed on the surface of the alkaline solvent immersion product station (2). A third exhaust pipe (22) is installed on the upper surface of the alkaline solvent immersion product station (2). A fourth detachable maintenance door (23) is installed on the front surface of the alkaline solvent immersion product station (2). A solvent pH value measuring instrument (24) is installed on the surface of the alkaline solvent immersion product station (2). A first emergency stop button (25) is installed on the surface of the alkaline solvent immersion product station (2). An automatic lifting door (26) with a transparent window is installed on the surface of the alkaline solvent immersion product station (2). The automatic lifting door (26) with a transparent window is located between the second display screen (21) and the... Between the fourth detachable maintenance door (23), the alkaline solvent soaking product station (2) is equipped with a built-in bubbling device (27) at the bottom of the tank, the alkaline solvent soaking product station (2) is equipped with built-in liquid inlet and liquid outlet pipes (28) at the bottom of the tank, the alkaline solvent soaking product station (2) is equipped with a liquid level sensor (29) near the side of the alkaline solvent soaking product station (2), the alkaline solvent soaking product station (2) is equipped with a fully automatic lifting device (210), the alkaline solvent soaking product station (2) is equipped with an overflow tank for holding cleaning solvent (211), and the surface of the alkaline solvent soaking product station (2) is equipped with a third tri-color alarm light with a buzzer (212).

4. The fully automatic cleaning machine for manufacturing SIC parts from semiconductor wafer according to claim 1, characterized in that: The automatic shower cleaning station (6) is provided with a first exhaust pipe (62) on its upper surface. The automatic shower cleaning station (6) is provided with a third display screen (61) on its front surface. The automatic shower cleaning station (6) is provided with a first detachable maintenance door (65) near the bottom of its front surface. The automatic shower cleaning station (6) is provided with a cleaning spray system (66) inside its interior. The automatic shower cleaning station (6) is provided with a second emergency stop button (64) and a first barcode scanner (67) on its front surface. The first detachable maintenance door (65) is located between the second emergency stop button (64) and the first barcode scanner (67). The automatic shower cleaning station (6) is provided with a first three-color alarm light with a buzzer (63) on its surface.

5. The fully automatic cleaning machine for SIC components manufactured by semiconductor wafer according to claim 1, characterized in that: The automatic product drying station (7) is provided with a second exhaust pipe (72) on its upper surface. The automatic product drying station (7) is provided with a fourth display screen (71) on its front surface. The automatic product drying station (7) is provided with a second detachable maintenance door (75) near the bottom of its front surface. The automatic product drying station (7) is provided with an air shower drying system (76) inside its interior. The automatic product drying station (7) is provided with a third emergency stop button (74) and a second barcode scanner (77) on its front surface. The second detachable maintenance door (75) is located between the third emergency stop button (74) and the second barcode scanner (77). The automatic product drying station (7) is provided with a second three-color alarm light with a buzzer (73) on its surface.

6. The fully automatic cleaning machine for semiconductor wafer manufacturing SIC parts of claim 3, wherein: The top end of the third exhaust pipe (22) is fixedly connected to an air inlet pipe (81). A rectangular shell (83) is provided at the end of the air inlet pipe (81) away from the third exhaust pipe (22). A water storage tank (82) is fixedly connected to the bottom surface of the rectangular shell (83). The air inlet pipe (81) is inserted into the surface of the rectangular shell (83) and extends into the interior of the rectangular shell (83). A fan (87) is installed in the mounting groove on the side of the rectangular shell (83) away from the air inlet pipe (81). Four support plates (810) are installed on the bottom surface of the water storage tank (82).

7. The fully automatic cleaning machine for SiC components in semiconductor wafer manufacturing according to claim 6, characterized in that: A top cover plate (84) is fixedly connected to the upper surface of the rectangular shell (83). An upper rotating roller (85) is installed inside the top cover plate (84). The two ends of the rotating shaft of the upper rotating roller (85) pass through the top cover plate (84) respectively. The upper rotating roller (85) and the top cover plate (84) are rotatably connected. A drive motor (820) is installed on the surface of the top cover plate (84). The end of the output shaft of the drive motor (820) is fixedly connected to one end of the upper rotating roller (85). A lower rotating roller (86) is provided inside the water storage tank (82). The lower rotating roller (86) is positioned... Below the upper rotating roller (85), the two ends of the rotating shaft of the lower rotating roller (86) are respectively inserted into the rotating holes opened inside the water storage tank (82). The lower rotating roller (86) and the water storage tank (82) are rotatably connected. The lower rotating roller (86) is located below the upper rotating roller (85). The surfaces of the upper rotating roller (85) and the lower rotating roller (86) are fitted with filter screen belts (88). The filter screen belts (88) are located in the two first rectangular grooves (89) opened on the upper surface of the water storage tank (82). The filter screen belts (88) are located in the groove opened on the upper surface of the rectangular shell (83).

8. The fully automatic cleaning machine for SiC components in semiconductor wafer manufacturing according to claim 1, characterized in that: The water storage tank (82) is internally fixedly connected to a baffle plate (816) and a filter screen plate (814). A guide groove (817) is provided inside the baffle plate (816). A rectangular box (818) is fixedly connected to the side of the baffle plate (816) away from the filter screen plate (814). A square groove (819) is provided on the side of the rectangular box (818) away from the baffle plate (816). A submersible pump (812) is installed inside the water storage tank (82). A connecting pipe (813) is installed at the outlet end of the submersible pump (812). The connecting pipe (813) passes through the filter screen plate (814) and the baffle plate (816) and is inserted into the rectangular box (814). Inside the submersible pump (812), the filter screen (814) is located between the submersible pump (812) and the baffle plate (816). The bottom surface of the water storage tank (82) has two threads, in which a first threaded rubber plug (811) and a second threaded rubber plug (815) are respectively inserted. The first threaded rubber plug (811) and the second threaded rubber plug (815) are respectively threadedly connected to the water storage tank (82). The first threaded rubber plug (811) is located on the side of the baffle plate (816) away from the filter screen (814). The second threaded rubber plug (815) is located between the baffle plate (816) and the filter screen (814). The upper surface of the water storage tank (82) has a liquid inlet hole (821).

9. The fully automatic cleaning machine for SIC components manufactured by semiconductor wafer according to claim 1, characterized in that: The first rotating shaft (93) is inserted into two rotating holes inside the water storage tank (82). The first rotating shaft (93) and the water storage tank (82) are rotatably connected. A cleaning roller (94) with brush bristles and a second gear (92) are fixedly sleeved on the surface of the first rotating shaft (93). A first gear (91) is meshed with the surface of the second gear (92). The first gear (91) is fixedly sleeved on the surface of the rotating shaft of the lower rotating roller (86).

10. The fully automatic cleaning machine for SIC components manufactured by semiconductor wafer according to claim 1, characterized in that: A scraper (95) is provided between the filter belt (88) and the baffle plate (816). A second rotating shaft (96) is inserted into a rotating hole inside the scraper (95). The two ends of the second rotating shaft (96) are fixedly connected to the water storage tank (82). The scraper (95) and the second rotating shaft (96) are rotatably connected. A hollow shell (97) is fixedly connected to the side of the baffle plate (816) near the filter belt (88). An internal squeezing plate (98) and a spring (99) are provided inside the hollow shell (97). The internal squeezing plate (98) and the hollow shell (97) are slidably connected. The two ends of the spring (99) are fixedly connected to the internal squeezing plate (98) and the baffle plate (816) respectively. The side of the internal squeezing plate (98) away from the spring (99) is in contact with the surface of the scraper (95).

Images