Gull-wing-shaped packaging device dense gap lead shaping device and method

Abstract

The invention relates to a gull-wing-shaped packaging device dense gap lead shaping device and method, and aims to solve the problems that an existing gull-wing-shaped packaging device manual shaping scheme is low in shaping efficiency, poor in shaping effect, poor in welding spot quality after reflow soldering and high in rework rate. The lead shaping device provided by the invention comprises a limiting plate, a first shaping unit and a second shaping unit, a lead hole is formed in the limiting plate and is used for accommodating a lead; the first shaping unit and the second shaping unit have the same structure; the first shaping unit comprises a push block, and the push block can move in a horizontal plane to push the electronic element to move; the first shaping unit and the second shaping unit push the electronic components in opposite directions. The leads are limited through the lead holes, then the electronic element is pushed through the push block, shaping of the multiple leads can be completed through one-time operation, the shaping precision is greatly improved, the shaping efficiency and the shaping effect are remarkably improved, the welding spot quality after reflow soldering is improved, and the rework rate is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic assembly, and in particular to a device and method for shaping dense gap leads of a gull-wing type packaging device. Background Art

[0002] The gullwing lead package is mostly used in CQFP and SOP. As a high-density package type for electronic components, it has the advantages of high density and large number of lead wires on both sides / four sides of the device, which can provide more I / O ports for the chip. Therefore, this package is widely used by devices such as FPGA, DSP, and serial port chips. FPGA, DSP, and serial port chips are the core of data acquisition, processing, logic processing, and bus transceiver in electronic stand-alone machines, and have been widely used in aerospace and military fields.

[0003] The CQFP / SOP package with gull-wing leads has a small center distance of leads (minimum ≤0.5mm, lead spacing is only 0.2mm), the conventional lead width is about 0.2~0.25mm, the number of pins is 48, 64, 208, 240, 352 and other forms, and the leads of CQFP / SOP package components before forming are fixed by ceramic sheets. The general welding process of CQFP / SOP is: removal of the ceramic fixing frame outside the device lead-forming-manual shaping-tinning-reflow / manual welding. Specifically: the first step is to remove the fixing frame outside the device lead. When the ceramic sheet is removed, the internal stress formed during the device shell packaging process is released; the second step is to shape the lead. After forming, the lead is gull-wing shaped. The deformation of the lead during the forming process causes internal stress in the lead; the third step is manual shaping, using tweezers to shape the crooked lead under a microscope; the fourth step is tinning, tinning the formed leads; the fifth step is to reflow or manually solder the device. In addition to the internal stress introduced by the above operations, contact during transportation will aggravate the degree of lead skew. At the same time, the package has a large number of single-side leads, and the lead skew will bring many difficulties to the later welding work and solder joint quality assurance. Taking the commonly used CQFP-208 package as an example, the total number of four-side leads is 208, and the number of single-side leads is 52. The high-reliability welding of aerospace electronic products requires that each lead deviates from the pad and is not allowed to exceed 10% of the lead width, that is, the lead skew must be less than 0.02mm. If no shaping measures are taken, there is no benchmark for the centering of all leads of the device, and the solder joint rework rate after reflow soldering reaches more than 25%, and even the overall lead offset may occur. The manual welding process of CQFP package devices with skewed leads must be assisted by a microscope, and tweezers must be used to correct all skewed leads to ensure that the device leads and pads are aligned. This operation requires extremely high skill levels and extremely low efficiency. In addition, there is internal stress in the leads after welding, and the reliability of the solder joints is difficult to guarantee.

[0004] That is, the existing fine lead shaping scheme using anti-static tweezers manually and with the aid of a microscope has the problems of low shaping efficiency, poor shaping effect, poor solder joint quality after reflow soldering, and high rework rate. Summary of the invention

[0005] The purpose of the present invention is to provide a gull-wing package device with fine-pitch lead shaping device and method, so as to solve the problems of low shaping efficiency, poor shaping effect, poor solder joint quality after reflow soldering and high rework rate in the manual shaping scheme of fine-pitch gull-wing leads.

[0006] In order to solve the above technical problems, the technical solution provided by the present invention is:

[0007] A lead shaping device comprises a limiting plate, a first shaping unit and a second shaping unit; the limiting plate is provided with a lead hole, the lead hole is used to accommodate a lead, and one lead is inserted into one lead hole; the first shaping unit and the second shaping unit have the same structure and are respectively arranged on both sides of an electronic component; the first shaping unit comprises a pushing block, the pushing block can move in a horizontal plane to push the electronic component to move; the first shaping unit and the second shaping unit push the electronic component in opposite directions.

[0008] Furthermore, the lead wire includes a horizontal section, and the lead wire hole is a rectangular hole; the horizontal section is accommodated in the lead wire hole.

[0009] Furthermore, the height of the horizontal section is equal to the height of the lead hole.

[0010] Furthermore, the lower surface of the push block contacts the upper surface of the limit plate, and the lower surface of the push block contacts the upper surface of the horizontal section.

[0011] Furthermore, the first shaping unit also includes a servo slide, which is connected to the push block and is used to drive the push block to move in a horizontal plane.

[0012] Furthermore, the lead shaping device also includes a loading platform, and the loading platform is used to carry the limiting plate, and the limiting plate is used to carry the electronic components.

[0013] Furthermore, the lead shaping device also includes a frame, and the loading platform and the servo slide are detachably connected to the frame.

[0014] Furthermore, the lead shaping device also includes a pressure rod assembly, wherein the pressure rod assembly includes a lower pressure rod, and the lower pressure rod can move in a vertical direction to apply downward pressure to the electronic component.

[0015] Furthermore, the lead shaping device further comprises a third shaping unit and a fourth shaping unit, wherein the third shaping unit and the fourth shaping unit have the same structure as the first shaping unit and are used to push the electronic component to move in a horizontal plane;

[0016] The third shaping unit and the fourth shaping unit are respectively arranged on both sides of the electronic component and push the electronic component in opposite directions;

[0017] The direction in which the third shaping unit and the fourth shaping unit push the electronic component is perpendicular to the direction in which the first shaping unit and the second shaping unit push the electronic component.

[0018] Another aspect of the present invention provides a lead shaping method, using the lead shaping device described above, comprising the following steps:

[0019] Parameter setting: set the threshold of the reaction force that the push block receives when pushing the electronic component;

[0020] Component loading: Place the electronic components on the limiting plate and use tweezers to put the leads into the corresponding lead holes;

[0021] Push block shaping: the direction in which the push block of the first shaping unit pushes the electronic component is taken as the first direction; the push block of the first shaping unit moves along the first direction to push the electronic component, and when the reaction force received by the push block reaches a threshold value, the push block moves in the opposite direction; then the push block of the second shaping unit pushes the electronic component in a direction opposite to the first direction, and when the reaction force received by the push block reaches a threshold value, the push block moves along the first direction.

[0022] Based on the above technical solutions, the technical effects that can be achieved by the present invention are:

[0023] The lead shaping device provided by the present invention comprises a limiting plate, a first shaping unit and a second shaping unit; the limiting plate is provided with a lead hole, the lead hole is used to accommodate the lead, and one lead is inserted into one lead hole; the first shaping unit and the second shaping unit have the same structure and are respectively arranged on both sides of the electronic component; the first shaping unit comprises a pushing block, the pushing block can move in a horizontal plane to push the electronic component to move; the first shaping unit and the second shaping unit push the electronic component in opposite directions.

[0024] The lead shaping device provided by the present invention limits the lead through the lead hole, and then uses a push block to push the electronic component, so that the electronic component is displaced accordingly to drive the lead and the lead hole to move relative to each other. Due to the limit of the lead by the lead hole, the lead eliminates the internal stress and completes the shaping. With the help of the movement of the electronic component and the limit of the lead hole, the shaping of multiple leads can be completed in one operation, and due to the positioning of the lead hole, the shaping accuracy is greatly improved, so that the shaping efficiency and shaping effect are significantly improved, the quality of the solder joints after reflow soldering is improved, and the rework rate is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of the structure of a lead shaping device provided in an embodiment of the present invention;

[0027] Figure 2 for Figure 1 The enlarged view of point A in the middle;

[0028] Figure 3 A schematic diagram of the structure of a limit plate according to an embodiment of the present invention;

[0029] Figure 4 is a schematic structural diagram of a first shaping unit according to an embodiment of the present invention;

[0030] Figure 5 It is a structural schematic diagram of a push block according to an embodiment of the present invention;

[0031] Figure 6 It is a structural schematic diagram of a compression rod assembly according to an embodiment of the present invention;

[0032] Figure 7 A schematic diagram of the structure of a CQFP chip according to an embodiment of the present invention;

[0033] Figure 8 is a schematic structural diagram of a lead wire according to an embodiment of the present invention;

[0034] Fig. 9 Schematic diagram of the shaping action according to an embodiment of the present invention. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0036] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. The following embodiments and features in the embodiments can be combined with each other without conflict. Icon: 100-limiting plate; 110-lead hole; 200-first shaping unit; 210-push block; 211-boss; 201-gap groove; 220-servo slide; 221-connecting plate; 222-slider; 223-servo motor; 300-second shaping unit; 400-loading platform; 500-frame; 600-pressure rod assembly; 610-lower pressure rod; 620-lower pressure cylinder; 630-connecting rod; 700-third shaping unit; 800-fourth shaping unit; 10-lead; 101-horizontal section; 102-vertical section; 103-connecting section.

[0038] The existing fine lead 10 shaping scheme using anti-static tweezers manually and with the aid of a microscope has the problems of low shaping efficiency, poor shaping effect, poor solder joint quality after reflow soldering, and high rework rate.

[0039] In view of this, the present invention provides a lead shaping device, including a limiting plate 100, a first shaping unit 200 and a second shaping unit 300; a lead hole 110 is opened on the limiting plate 100, and the lead hole 110 is used to accommodate a lead 10, and one lead 10 is inserted into one lead hole 110; the first shaping unit 200 and the second shaping unit 300 have the same structure and are respectively arranged on both sides of the electronic component; the first shaping unit 200 includes a pushing block 210, and the pushing block 210 can move in a horizontal plane to push the electronic component to move; the first shaping unit 200 and the second shaping unit 300 push the electronic component in opposite directions.

[0040] The lead shaping device provided by the present invention limits the lead 10 through the lead hole 110, and then uses the push block 210 to push the electronic component, so that the electronic component is displaced accordingly to drive the lead 10 and the lead hole 110 to move relative to each other. Due to the limit of the lead 10 by the lead hole 110, the lead 10 eliminates the internal stress and completes the shaping. With the help of the movement of the electronic component and the limit of the lead hole 110, the shaping of multiple leads 10 can be completed in one operation, and due to the positioning of the lead hole 110, the shaping accuracy is greatly improved, so that the shaping efficiency and shaping effect are significantly improved, the quality of the solder joints after reflow soldering is improved, and the rework rate is reduced.

[0041] The following combination Figure 1-Figure 9 The structure and shape of the lead shaping device provided in this embodiment are described in detail:

[0042] In an optional solution of this embodiment, the lead shaping device includes a limit plate 100, a first shaping unit 200, a second shaping unit 300, a loading platform 400, a frame 500, a pressure rod assembly 600, a third shaping unit 700 and a fourth shaping unit 800. Figure 1 , Figure 2 Specifically, the loading platform 400 is installed on the frame 500, the limiting plate 100 is arranged on the loading platform 400, the first shaping unit 200, the second shaping unit 300, the third shaping unit 700 and the fourth shaping unit 800 are arranged on the four sides of the loading platform 400 and are called a cross arrangement, and the pressure rod assembly 600 is used to press the electronic components onto the loading platform 400.

[0043] In this embodiment, the limiting plate 100 includes four rows of lead holes 110, and the four rows of lead holes 110 are arranged in a rectangular shape and the lead holes 110 are rectangular holes. Figure 3 Correspondingly, the lead 10 includes a horizontal section 101, a vertical section 102 and a connecting section 103, as shown in FIG. Figure 8 As shown, the horizontal section 101 is parallel to the electronic component body and is accommodated in the lead hole 110 to be limited by the lead hole 110; the vertical section 102 is vertically connected to the horizontal section 101 and the connecting section 103, that is, one end of the vertical section 102 is connected to the horizontal section 101, and the other end is connected to the connecting section 103, and the connecting section 103 is parallel to the horizontal section 101 and connected to the electronic component body. That is, the lead 10 is gull-wing-shaped and has a Z-shaped structure.

[0044] In this embodiment, the limiting plate 100 is made of stainless steel, the hole pitch accuracy of the lead hole 110 is ±0.005 mm, the thickness of the lead hole 110 is 0.02 mm to 0.03 mm thicker than the thickness of the lead 10 to ensure that the lead 10 can be loaded into the lead hole 110, and the position of the lead hole 110 corresponds one-to-one to the lead 10.

[0045] In this embodiment, the first shaping unit 200, the second shaping unit 300, the third shaping unit 700 and the fourth shaping unit 800 are all of the same structure and are all used to push the electronic component to move in a horizontal plane.

[0046] The third shaping unit 700 and the fourth shaping unit 800 are respectively arranged on both sides of the electronic component and push the electronic component in opposite directions; at the same time, the direction in which the third shaping unit 700 and the fourth shaping unit 800 push the electronic component is perpendicular to the direction in which the first shaping unit 200 and the second shaping unit 300 push the electronic component.

[0047] The following is an explanation using the first shaping unit 200 as an example. Specifically, the first shaping unit 200 includes a push block 210 and a servo slide 220. The servo slide 220 is connected to the push block 210 and is used to drive the push block 210 to move in a horizontal plane. The lower surface of the push block 210 contacts the upper surface of the limit plate 100. When the push block 210 pushes the electronic component, the lower surface of the push block 210 contacts the upper surface of the horizontal section 101. That is, the loading platform 400 and the push block 210 are respectively arranged on both sides of the limit plate 100 and form a limit space with the lead hole 110, which is convenient for shaping and prevents the horizontal section 101 from escaping from the lead hole 110, thereby ensuring the stability of shaping quality and shaping efficiency. At this time, the height of the horizontal section 101 is equal to the height of the lead hole 110, and the height dimension is the dimension in the vertical direction, so that the push block 210 and the loading platform 400 can limit the horizontal section 101.

[0048] In the optional solution of this embodiment, the servo slide 220 is a micro precision servo slide with force control and displacement control functions, including a connecting plate 221, a slider 222 and a servo motor 223. The connecting plate 221 is detachably connected to the frame 500; the slider 222 is slidably connected to the connecting plate 221 through a linear guide rail, and the push block 210 is installed on the slider 222; the servo motor 223 is installed on the connecting plate 221 and connected to the slider 222 to drive the slider 222 to move along the linear guide rail, thereby driving the push block 210 to move.

[0049] In this embodiment, in order to prevent the push block 210 from squeezing the lead 10, a boss 211 is provided on the push block 210. The two bosses 211 form a clearance groove 201 to avoid the lead 10. When the push block 210 pushes the electronic component, only the boss 211 contacts the electronic component. Figure 5 , Fig. 9 shown.

[0050] In this embodiment, the loading platform 400 is used to carry and fix the limit plate 100, the limit plate 100 is used to carry the electronic components, and the loading platform 400 can constrain the flatness of the lead 10 during the shaping process. Specifically, the loading platform 400 is made of mold steel and is detachably connected to the frame 500, so that it is easy to replace the loading platform 400 of different specifications to adapt to the use of electronic components of different sizes and different lead 10 spacings. In addition, the flatness requirement of the loading platform 400 is less than 0.01mm / 25cm2 to prevent the flatness after shaping from exceeding the standard requirements.

[0051] In this embodiment, a switch button box and a human-machine interface console are provided on the rack 500, and a device PLC controller, a control switch, a gas circuit solenoid valve and other parts are installed to control the action. Among them, the shaping program is programmed on the human-machine interface console, and three buttons are provided on the switch button box.

[0052] In this embodiment, the pressure rod assembly 600 includes a lower pressure rod 610, a lower pressure cylinder 620 and a connecting rod 630. Figure 6 One end of the connecting rod 630 is connected to the pressing rod 610, and the other end is connected to the extended end of the pressing cylinder 620. The pressing cylinder 620 drives the pressing rod 610 to move in the vertical direction through the connecting rod 630, so as to apply downward pressure to the electronic components.

[0053] In this embodiment, in order to facilitate the fixing and placement of electronic components, the lead shaping device is further provided with an upper push rod, which is driven by a cylinder. When fixing the electronic components, the upper push rod and the lower pressure rod 610 cooperate to clamp the electronic components; when taking out the electronic components after shaping, the lower pressure rod 610 moves upward and the upper push rod pushes upward, thereby driving the electronic components to move upward stably for easy removal.

[0054] In this embodiment, when applied to SOP package shaping, two shaping units are used, such as the first shaping unit 200 and the second shaping unit 300, or the third shaping unit 700 and the fourth shaping unit 800. When applied to CQFP package shaping, four shaping units are required.

[0055] Based on the above-mentioned lead shaping device, a lead shaping method is proposed, which adopts the above-mentioned lead shaping device and includes the following steps:

[0056] S100 parameter setting: (1) Set the threshold of the reaction force that the push block 210 receives when pushing the electronic component, that is, set the torque feedback threshold of the servo slide 220. The servo slide 220 has its own force feedback control. When the feedback force value exceeds the set threshold, the servo slide 220 stops pushing the push block 210 forward, and then drives the push block 210 to retreat to its original position. (2) Set the pressing time of the upper pressure rod. After the lead 10 of the electronic component is manually inserted into the lead hole 110, the upper pressure rod needs to apply a certain pressure to the top of the electronic component to prevent the electronic component from tilting as a whole during the subsequent shaping process; at the same time, set the opening time of the upper push rod air valve after the shaping is completed, so that the upper push rod can extend to lift the electronic component. (3) Set the air valve pressure to control the pressure applied by the lower pressure rod 610 and the upper push rod to the electronic component. (4) Set the forward displacement threshold of the push block 210.

[0057] S200 Component loading: electronic components are placed on the limiting plate 100 and tweezers are used to place the leads 10 into the corresponding lead holes 110. Then, each push block 210 moves forward so that the lower surface of the push block 210 limits the horizontal section 101.

[0058] All the leads 10 of the electronic component are placed in the lead holes 110, and the skewed leads 10 are moved into the corresponding lead holes 110 using tweezers. The main body of the electronic component is slightly moved, and the welding part of the lead 10 is confined in the lead hole 110. During the shaping process, the deformation of the unskewed leads 10 is within the elastic range; while the skewed leads 10 have a large deformation, and a small amount of plastic deformation occurs at the standing height and shoulder width, thereby correcting the skewed leads 10 to the appropriate position.

[0059] S300 Shaping by push block 210: The direction in which the push block 210 of the first shaping unit 200 pushes the electronic component is the first direction, and the direction in which the push block 210 of the third shaping unit 700 pushes the electronic component is the second direction. When the push block 210 moves forward, the boss 211 contacts the main body of the electronic component and pushes the main body of the electronic component to produce a slight movement, while the lead 10 is limited by the lead hole 110 and cannot move. The skewed lead 10 produces a slight plastic deformation under the push of the push block 210, while the undeformed lead 10 is elastically deformed. The push block 210 can be restored to its original state after being reset, thereby achieving the purpose of shaping the skewed lead 10. The contact between the push block 210 and the limiting plate 100 can limit the four-side leads 10 of the electronic component in the lead hole 110 during the shaping process, and ensure that the flatness of the lead 10 after shaping is less than 0.1 mm.

[0060] Specifically, the push block 210 of the first shaping unit 200 moves in the first direction to push the electronic component. When the reaction force received by the push block 210 reaches the torque feedback threshold or the displacement of the push block 210 reaches the displacement threshold, the push block 210 moves in the opposite direction. Then, the push block 210 of the second shaping unit 300 pushes the electronic component in the direction opposite to the first direction. When the reaction force received by the push block 210 reaches the torque feedback threshold or the displacement of the push block 210 reaches the displacement threshold, the push block 210 moves in the first direction. At this time, the shaping of the two rows of leads 10 arranged in the first direction is completed.

[0061] The push block 210 of the third shaping unit 700 moves along the second direction to push the electronic component. When the reaction force received by the push block 210 reaches the torque feedback threshold or the displacement of the push block 210 reaches the displacement threshold, the push block 210 moves in the opposite direction. Then, the push block 210 of the fourth shaping unit 800 pushes the electronic component in the direction opposite to the second direction. When the reaction force received by the push block 210 reaches the torque feedback threshold or the displacement of the push block 210 reaches the displacement threshold, the push block 210 moves in the second direction. At this time, the shaping of the two rows of leads 10 arranged in the second direction is completed.

[0062] In order to shorten the cycle, when the push block 210 of the first shaping unit 200 moves in the reverse direction, the push block 210 of the second shaping unit 300 can be put into action.

[0063] S400 Component removal: After the shaping is completed, each push block 210 retreats to the area away from the lead hole 110, so that the lead 10 can be removed from the lead hole 110. At the same time, the lower pressing rod 610 moves up so that the electronic component can be taken out.

[0064] It should be noted that: before shaping, the pressure threshold of CQFP of different electronic components needs to be confirmed. Because the package size, number of leads 10 and size of leads 10 of different CQFP are inconsistent, the feedback force threshold of the servo slide 220 should be checked for electronic components of different sizes before shaping. After the check is completed, the subsequent shaping operation can be carried out. At the same time, if the CQFP package lead 10 is shaped, the cross shaping method should be adopted, that is, the first shaping unit 200, the second shaping unit 300, the third shaping unit 700 and the fourth shaping unit 800 complete their respective actions in sequence, such as Figure 1 As shown, the overall deflection of the electronic component lead 10 after shaping is prevented. If such deflection occurs, the feedback force threshold of the servo slide 220 should be adjusted.

[0065] The lead shaping device provided in this embodiment realizes the simultaneous shaping of the fine leads 10 of the CQFP package on both sides after forming. The high-precision shaping effect of the high-density leads 10 of the CQFP device can be achieved by performing four specified operations. The center-to-center deflection of the leads 10 after shaping is less than 0.01mm, and the coplanarity of the leads 10 is less than 0.04mm. The shaping accuracy is high, which meets the high-reliability welding requirements of aerospace electronic products. Taking CQFP208, CQFP352 and other packaging forms as examples, the shaping efficiency is improved by about 5 times compared with manual shaping. When the reflow soldering method is used, the solder joint rework rate is reduced from more than 25% to less than 2%, which can reduce the production cost of the enterprise and improve the production efficiency of the enterprise.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention belong to the protection scope of the technical solutions of the present invention.

Claims

1. A gull-wing package device fine-pitch lead shaping device, characterized in that: It comprises a limiting plate (100), a first shaping unit (200) and a second shaping unit (300); The limiting plate (100) is provided with a lead hole (110), the lead hole (110) being used to accommodate a lead (10), and one lead (10) is inserted into one lead hole (110); The first shaping unit (200) and the second shaping unit (300) have the same structure and are respectively arranged on both sides of the electronic component; The first shaping unit (200) comprises a push block (210), and the push block (210) can move in a horizontal plane to push the electronic component to move; The second shaping unit (300) and the first shaping unit (200) push the electronic component in opposite directions.

2. The device for shaping fine-pitch leads of a gull-wing package device according to claim 1, characterized in that: The lead wire (10) comprises a horizontal section (101), and the horizontal section (101) is accommodated in the lead wire hole (110).

3. A gull-wing package device fine-pitch lead shaping device according to claim 2, characterized in that: The lead hole (110) is a rectangular hole.

4. The device for shaping fine-pitch leads of a gull-wing package device according to claim 3, characterized in that: The height of the horizontal section (101) is equal to the height of the lead hole (110).

5. The device for shaping fine-pitch leads of a gull-wing package device according to claim 4, characterized in that: The lower surface of the push block (210) contacts the upper surface of the limit plate (100), and the lower surface of the push block (210) contacts the upper surface of the horizontal section (101).

6. The device for shaping fine-pitch leads of a gull-wing package device according to claim 5, characterized in that: The first shaping unit (200) further comprises a servo slide (220), wherein the servo slide (220) is connected to the push block (210) and is used to drive the push block (210) to move in a horizontal plane.

7. The device for shaping fine-pitch leads of a gull-wing package device according to claim 6, characterized in that: It also comprises a loading platform (400), wherein the loading platform (400) is used to carry the limiting plate (100), and the limiting plate (100) is used to carry electronic components. The limiting plate (100) can be changed according to changes in component packaging form, size, and lead density.

8. The device for shaping fine-pitch leads of a gull-wing package device according to claim 7, characterized in that: It also includes a frame (500), and the loading platform (400) and the servo slide (220) are detachably connected to the frame (500).

9. The device for shaping fine-pitch leads of a gull-wing package device according to claim 8, characterized in that: The invention also comprises a pressure rod assembly (600), wherein the pressure rod assembly (600) comprises a lower pressure rod (610), and the lower pressure rod (610) can move in a vertical direction and is used to apply downward pressure to the electronic component.

10. The device for shaping fine-pitch leads of a gull-wing package device according to claim 9, characterized in that: It also comprises a third shaping unit (700) and a fourth shaping unit (800), wherein the third shaping unit (700) and the fourth shaping unit (800) have the same structure as the first shaping unit (200) and are used to push the electronic component to move in a horizontal plane; The third shaping unit (700) and the fourth shaping unit (800) are respectively arranged on two sides of the electronic component and push the electronic component in opposite directions; The direction in which the third shaping unit (700) and the fourth shaping unit (800) push the electronic component is perpendicular to the direction in which the first shaping unit (200) and the second shaping unit (300) push the electronic component.

11. A shaping method for a gull-wing package device fine-gap lead shaping device according to any one of claims 1 to 10, characterized in that: The steps include: Step 1: parameter setting: setting a threshold value of the reaction force received by the push block (210) when pushing the electronic component; Step 2: component loading: placing the electronic component on the limiting plate (100) and inserting the lead wire (10) into the corresponding lead wire hole (110) using tweezers; Step 3, shaping with the push block (210): the direction in which the push block (210) of the first shaping unit (200) pushes the electronic component is taken as the first direction; the push block (210) of the first shaping unit (200) moves along the first direction to push the electronic component, and when the reaction force received by the push block (210) reaches a threshold value, the push block (210) moves in the opposite direction; then the push block (210) of the second shaping unit (300) pushes the electronic component in a direction opposite to the first direction, and when the reaction force received by the push block (210) reaches a threshold value, the push block (210) moves along the first direction.

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