Method and device for improving processing efficiency of ultra-high-speed scanning galvanometer

Abstract

The application provides a method and device for improving the processing efficiency of an ultrahigh-speed scanning galvanometer, and belongs to the technical field of ultrahigh-speed scanning galvanometers, and comprises the following steps: S1: introducing a sample to-be-processed pattern, a scanning interval, a field lens focal length and a field lens processing width into a system, and the system performs path planning according to the comparison of different sample processing angles; S2: introducing a sample digital model into a system control software of the galvanometer, generating a sample digital model carrying processing path information by selecting a sample outer contour or a positioning feature on the sample in the software; S3: placing and fixing the sample; and S4: performing galvanometer processing on the sample according to the set laser processing parameters. The application has the beneficial effect that a series of processes of visual positioning-algorithm optimization-sample pose adjustment are designed, and high-efficiency processing effect is obtained.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of ultra-high-speed scanning galvanometer, and relates to a method and device for improving the processing efficiency of an ultra-high-speed scanning galvanometer. BACKGROUND

[0002] The ultra-high-speed scanning galvanometer realizes the ultra-high-speed scanning of a light spot through a polygon prism in a high-speed rotating galvanometer, and the scanning speed can exceed 100 meters per second. Due to the principle of the ultra-high-speed scanning galvanometer, the processing mode is to perform parallel line scanning in a fixed direction, and the high-speed scanning can only be obtained in the fixed direction (i.e. the fast axis direction), and in the jump direction of the parallel lines (i.e. the slow axis direction), the movement mode and speed of the mirror are similar to those of an ordinary scanning galvanometer.

[0003] The parallel line processing mode of the ultra-high-speed scanning galvanometer leads to obvious directionality of the processing efficiency, and the feature shape of the workpiece to be processed and the scanning path planning will directly affect the processing efficiency, and the prior art lacks means for improving the processing efficiency of the ultra-high-speed scanning galvanometer. The processing path planning method and processing device of the ultra-high-speed scanning galvanometer have a large room for improvement. SUMMARY

[0004] The application aims at the above problems existing in the prior art, and provides a method and device for improving the processing efficiency of an ultra-high-speed scanning galvanometer.

[0005] The object of the application can be achieved by the following technical scheme: a method for improving the processing efficiency of an ultra-high-speed scanning galvanometer, comprising the steps of:

[0006] S1: importing a sample to-be-processed pattern, a scanning interval and a field lens focal length into a system, planning a path according to the inherent processing mode of a galvanometer in combination with the relative processing posture of the sample and the galvanometer, and calculating the number of scanning lines required by the galvanometer for processing the pattern as N L = W / H+1, judging and recording N L minimum value, obtaining an optimal path, wherein W is the pattern width to be processed by the galvanometer in the current scanning posture, and H is the scanning interval;

[0007] S2: importing a sample digital model into a system control software of the galvanometer, generating a to-be-processed pattern digital model containing optimal path information by selecting a sample outer contour or a positioning feature on the sample in the software, defining the relative positional relationship between the to-be-processed pattern and the sample positioning information, and explicitly defining the positional relationship between the to-be-processed pattern and the sample, and generating a sample digital model carrying processing path information;

[0008] S3: placing and fixing the sample on a processing platform;

[0009] S4: positioning the sample to the optimized processing position by moving the platform according to the sample positioning information and the calculated optimized path, and performing galvanometer processing on the sample according to the set laser processing parameters.

[0010] In the method for improving the processing efficiency of the ultra-high-speed scanning galvanometer, in step S3, the sample is installed with the surface to be processed facing upward, the sample positioning information is recognized by the vision camera, the current position and the placement posture of the sample are obtained, the collected positioning information is compared with the previously generated digital model, and the offset between the optimized processing sample position of the galvanometer and the current sample position is obtained.

[0011] In the method for improving the processing efficiency of the ultra-high-speed scanning galvanometer, in step S4, the system moves the sample according to the calculated position offset, moves the sample to the optimized processing position, adjusts the relative angle between the galvanometer and the sample, and then performs galvanometer processing on the optimized path.

[0012] In the method for improving the processing efficiency of the ultra-high-speed scanning galvanometer, in step S5, when the area of the sample to be processed is larger than the single processing area of the field lens, the displacement platform moves the object, and after processing a region, the sample platform carries the sample to the next processing position for processing until all the regions to be processed are processed.

[0013] In the method for improving the processing efficiency of the ultra-high-speed scanning galvanometer, in step S5, when the sample to be processed needs to be rotated or translated by the displacement platform to process a large area or a cross-shaped pattern, the displacement platform carries the sample to rotate or translate during laser processing to complete the processing of the specific pattern.

[0014] A device for improving the processing efficiency of an ultra-high-speed scanning galvanometer is also provided, comprising:

[0015] a laser;

[0016] a high-speed scanning galvanometer assembly having an entrance and an exit, the laser being aligned with the entrance;

[0017] a processing table aligned with the exit;

[0018] an adjusting assembly connected with the processing table and capable of driving the processing table to move relative to the high-speed scanning galvanometer assembly.

[0019] In the device for improving the processing efficiency of the ultra-high-speed scanning galvanometer, the adjusting assembly comprises a rotating table, the processing table is connected with the rotating table, and the rotating table is capable of driving the processing table to rotate relative to the high-speed scanning galvanometer assembly.

[0020] In the device for improving the processing efficiency of the ultra-high-speed scanning galvanometer, the adjusting assembly further comprises a plane sliding table, the rotating table is connected with the plane sliding table, and the plane sliding table can drive the rotating table to move relative to the ultra-high-speed scanning galvanometer assembly.

[0021] In the device for improving the processing efficiency of the ultra-high-speed scanning galvanometer, the ultra-high-speed scanning galvanometer assembly comprises a polygonal prism, a plane mirror and a field lens, the polygonal prism is provided with a first reflecting surface and a second reflecting surface, the first reflecting surface is symmetrical with the second reflecting surface, the laser is aligned with the first reflecting surface, the plane mirror is provided with a third reflecting surface, the laser emitted by the laser is entered from the light inlet, is reflected in sequence through the first reflecting surface, the second reflecting surface and the third reflecting surface, and is emitted from the light outlet through the field lens.

[0022] In the device for improving the processing efficiency of the ultra-high-speed scanning galvanometer, a visual camera and a control system are further included, the visual camera is used to acquire sample positioning features, the visual camera is electrically connected with the adjusting assembly through the control system and drives the sample to move relative to the ultra-high-speed scanning galvanometer assembly through the control system.

[0023] Compared with the prior art, the device has the following beneficial effects:

[0024] 1. A series of processes of visual positioning, algorithm optimization and sample pose adjustment are designed, the sample contour information in any pose is acquired through visual recognition, the optimized scanning path is matched and positioned with the sample contour through the combination of the optimization algorithm and the vision, and the sample and the scanning mirror processing pose and position are adjusted through the rotation and X-Y plane movement functions of the sample table, so that the high-efficiency processing effect is obtained.

[0025] 2. The adjusting assembly is connected with the processing table and can drive the processing table to move relative to the ultra-high-speed scanning galvanometer assembly, the position and the angle of the workpiece relative to the ultra-high-speed scanning galvanometer assembly are directly adjusted, the workpiece satisfies the optimal path of the parallel line processing in one direction, and manual intervention is not required for the parallel line processing of the workpiece in multiple directions.

[0026] 3. The rotating table can drive the processing table to rotate relative to the ultra-high-speed scanning galvanometer assembly, so as to adjust the angle of the workpiece relative to the ultra-high-speed scanning galvanometer assembly.

[0027] 4. The plane sliding table can drive the rotating table to move relative to the ultra-high-speed scanning galvanometer assembly, so as to adjust the position of the workpiece relative to the ultra-high-speed scanning galvanometer assembly.

[0028] 5, the sample is photographed by a visual camera, the sample positioning information is recognized, the placing angle and the current position of the sample are obtained, the collected positioning information is compared with the previously generated digital model, the offset of the optimized processing sample position and the current sample position of the galvanometer is obtained, the control system moves the sample according to the calculated position offset, the sample is moved to the optimized processing position, and the relative angle between the galvanometer and the sample is adjusted through the adjusting assembly, so that the galvanometer processing of the optimized path is carried out. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is a structure schematic diagram of the improved ultrahigh-speed scanning galvanometer assembly of the application.

[0030] Figure 2 It is a working principle diagram of the ultrahigh-speed scanning galvanometer processing process of the application.

[0031] Figure 3 It is a calculation schematic diagram of step S1 of the application.

[0032] Figure 4 It is a front and back comparison diagram of a single-direction optimized scanning path of the application.

[0033] Figure 5 It is a front and back comparison diagram of another single-direction optimized scanning path of the application.

[0034] Figure 6 It is a working principle diagram of improving the processing efficiency of the ultrahigh-speed scanning galvanometer of the application.

[0035] Figure 7 It is a structure schematic diagram of the device for improving the processing efficiency of the ultrahigh-speed scanning galvanometer of the application.

[0036] In the figure, 1, laser; 2, plane mirror; 3, field lens; 4, ultrahigh-speed scanning galvanometer; 5, polygon prism; 6, processing table; 7, rotating table; 8, plane sliding table; 9, visual camera. DETAILED DESCRIPTION

[0037] The following is a specific embodiment of the application and further describes the technical solutions of the application in combination with the drawings, but the application is not limited to these embodiments.

[0038] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0039] In addition, the descriptions such as "first", "second", "one", etc. in the present application are only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can be explicitly or implicitly included at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0040] In the present application, unless otherwise specifically defined and limited, the terms "connection", "fixation", etc. should be understood broadly, for example, "fixation" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through intermediate medium, can be internal communication of two elements or interaction relationship of two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0041] In addition, the technical solutions of various embodiments of the present application can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the scope of protection required by the present application.

[0042] The specific embodiments described herein are merely illustrative of the spirit of the present application. Those skilled in the art can make various modifications or supplements to the described specific embodiments or replace them with similar ways, but without deviating from the spirit of the present application or exceeding the scope defined by the appended claims.

[0043] Regarding the processing material, the present application is mainly used for the processing of non-homogeneous ceramic matrix composites, resin matrix composites and metal matrix composites; at the same time, it is also suitable for the processing of homogeneous inorganic materials and organic materials.

[0044] Regarding the processable features, the present application can be used for large-area deep controllable processing, and also can be used for through-cutting processing, including but not limited to curved surface, plane, groove, square hole, through hole and blind hole processing.

[0045] As shown in Figures 1-3 , Figure 6 A method for improving the processing efficiency of ultra-high-speed scanning galvanometer, comprising the steps of:

[0046] S1: importing the sample to be processed pattern, scanning pitch and field lens focal length into the system, the system plans the path according to the inherent processing mode of the galvanometer, combined with the relative processing posture of the sample and the galvanometer, the number of scanning lines required by the galvanometer to process the pattern is N L= W / H+1 calculation, software judges and records N L The minimum value of the angle combination of the galvanometer and the object, to obtain the optimal path, wherein W is the width of the pattern to be processed by the galvanometer under the current scanning posture, and H is the scanning pitch;

[0047] S2: Import the sample digital model into the system control software of the galvanometer, generate the to-be-processed pattern digital model containing the optimized path information by selecting the sample outer contour or the positioning feature on the sample in the software, define the relative position relationship between the position of the to-be-processed pattern and the sample positioning information, clarify the position relationship between the to-be-processed pattern and the sample, and generate the sample digital model carrying the processing path information;

[0048] S3: Place and fix the sample on the processing platform;

[0049] S4: Identify the sample positioning information through vision, and combine the calculated optimized path to move the sample to the optimized to-be-processed position through the platform, and the galvanometer processes the sample according to the set laser processing parameters.

[0050] On the basis of the above embodiment, in step S3, the sample is installed with the to-be-processed surface facing up, the sample positioning information is identified through the vision camera, so as to obtain the current position and the placement posture of the sample, the collected positioning information is compared with the previously generated digital model, and the offset amount of the optimized processing sample position of the galvanometer and the current sample position is obtained.

[0051] On the basis of the above embodiment, in step S4, the system moves the sample according to the calculated position offset amount, moves the sample to the optimized to-be-processed position, adjusts the relative angle between the galvanometer and the sample, and then performs the galvanometer processing of the optimized path.

[0052] In the embodiment, a series of processes of visual positioning-algorithm optimization-sample posture adjustment are designed, the sample contour information in any posture is obtained through visual recognition, the optimized scanning path is matched and positioned with the sample contour through the combination of the optimization algorithm and the vision, the sample and the galvanometer processing posture and the position adjustment are realized through the rotation and X-Y plane movement functions of the sample table, and high-efficiency processing effect is obtained.

[0053] Further, as shown in Figure 4 As one of the preferred modes, in step S5, when the area of the to-be-processed pattern of the sample is greater than the single processing width of the field lens, the displacement platform will move the object, after processing a region, the sample platform will carry the sample to move to the next processing position for processing, until all the regions to be processed are processed.

[0054] Further, as shown in Figure 5As shown, as one of the preferred ways, in step S5, when the sample to be processed pattern needs the platform to rotate or translate to achieve the processing of large format or cross scanning track pattern, the displacement platform will move the object, and the displacement platform will carry the sample to rotate or translate during the laser processing to complete the processing of the specific pattern.

[0055] As shown, as one of the preferred ways, in step S5, when the sample to be processed pattern needs the platform to rotate or translate to achieve the processing of large format or cross scanning track pattern, the displacement platform will move the object, and the displacement platform will carry the sample to rotate or translate during the laser processing to complete the processing of the specific pattern. Figure 7 As shown, a device for improving the processing efficiency of ultra-high-speed scanning galvanometer, comprising: a laser 1, an ultra-high-speed scanning galvanometer 4 assembly, a processing table 6, and an adjusting assembly.

[0056] The ultra-high-speed scanning galvanometer 4 assembly has a light inlet (not marked in the figure) and a light outlet (not marked in the figure), and the laser 1 is aligned with the light inlet.

[0057] The processing table 6 is aligned with the light outlet.

[0058] The adjusting assembly is connected with the processing table 6 and can drive the processing table 6 to move relative to the ultra-high-speed scanning galvanometer 4 assembly.

[0059] In this embodiment, the adjusting assembly is connected with the processing table 6 and can drive the processing table 6 to move relative to the ultra-high-speed scanning galvanometer 4 assembly, so that the workpiece satisfies the optimal path of parallel line processing in one direction, and manual intervention is not required for multi-directional parallel line processing of the workpiece.

[0060] On the basis of the above embodiment, the adjusting assembly comprises a rotating table 7, the processing table 6 is connected with the rotating table 7, and the rotating table 7 can drive the processing table 6 to rotate relative to the ultra-high-speed scanning galvanometer 4 assembly.

[0061] In this embodiment, the rotating table 7 can drive the processing table 6 to rotate relative to the ultra-high-speed scanning galvanometer 4 assembly, so as to adjust the angle of the workpiece relative to the ultra-high-speed scanning galvanometer 4 assembly.

[0062] On the basis of the above embodiment, the adjusting assembly further comprises a planar sliding table 8, the rotating table 7 is connected with the planar sliding table 8, and the planar sliding table 8 can drive the rotating table 7 to move relative to the ultra-high-speed scanning galvanometer 4 assembly.

[0063] In this embodiment, the planar sliding table 8 can drive the rotating table 7 to move relative to the ultra-high-speed scanning galvanometer 4 assembly, so as to adjust the position of the workpiece relative to the ultra-high-speed scanning galvanometer 4 assembly.

[0064] On the basis of the above-mentioned embodiment, the ultra-high-speed scanning galvanometer 4 assembly comprises a polygonal prism 5, a plane mirror 2 and a field lens 3, the polygonal prism 5 is provided with a first reflecting surface (not marked in the figure) and a second reflecting surface (not marked in the figure), the first reflecting surface is symmetrical with the second reflecting surface, the laser 1 is aligned with the first reflecting surface, the plane mirror 2 is provided with a third reflecting surface (not marked in the figure), the laser emitted by the laser 1 enters from the light inlet, is reflected by the first reflecting surface, the second reflecting surface and the third reflecting surface in turn, and passes through the field lens 3 and is emitted from the light outlet.

[0065] In the embodiment, the laser emitted by the laser 1 enters from the light inlet, is reflected by the first reflecting surface, the second reflecting surface and the third reflecting surface in turn, and passes through the field lens 3 and is emitted from the light outlet.

[0066] On the basis of the above-mentioned embodiment, a visual camera 9 and a control system (not shown in the figure) are further included, the visual camera 9 is used to acquire sample positioning features, the visual camera 9 is electrically connected with the adjusting assembly through the control system and drives the sample to move relative to the ultra-high-speed scanning galvanometer 4 assembly through the control system.

[0067] In the embodiment, the sample is photographed by the visual camera 9, sample positioning information is recognized, the placement angle and the current position of the sample are obtained, the collected positioning information is compared with the previously generated digital model, the offset amount of the sample position after the galvanometer is optimized and the current sample position is obtained, the control system moves the sample according to the calculated position offset amount, the sample is moved to the optimized position to be processed, the relative angle between the galvanometer and the sample is adjusted through the adjusting assembly, and the galvanometer processing of the optimized path is performed.

Claims

1. A method for improving the processing efficiency of an ultra-high-speed scanning galvanometer, characterized in that, The method comprises the steps of: S1: Import the sample pattern to be processed, scanning interval, and field lens focal length into the system. The system performs path planning based on the inherent processing method of the galvanometer and the relative processing posture of the sample and the galvanometer. The number of scan lines required for the galvanometer to process the pattern is determined by N. L =W / H+1 is calculated, the software judges and records N. L The minimum value is the combination of angles between the galvanometer and the object to obtain the optimal path, where W is the width of the pattern that the galvanometer needs to process under the current scanning posture, and H is the scanning interval; S2: importing the sample digital model into the system control software of the galvanometer, generating a to-be-processed graphical digital model containing optimization path information by selecting a sample outer contour or a positioning feature on the sample in the software, defining the relative position relationship between the position of the to-be-processed graph and the sample positioning information, explicitly defining the position relationship between the processed graph and the to-be-processed sample, and generating a sample digital model carrying the processing path information; S3: placing and fixing the sample on the processing platform; S4: identifying the sample positioning information through vision, combining the calculated optimization path, moving the sample to the optimized to-be-processed position through the platform, and processing the sample through the galvanometer according to the set laser processing parameters.

2. The method of claim 1, wherein the method comprises: In step S3, the sample is installed with the to-be-processed surface facing up, the sample positioning information is identified through a vision camera, the current position and posture of the sample are obtained, the collected positioning information is compared with the previously generated digital model, and the offset amount of the optimized processed sample position of the galvanometer and the current sample position is obtained.

3. The method of claim 2, wherein the method further comprises: In step S4, the system moves the sample according to the calculated position offset amount, moves the sample to the optimized to-be-processed position, adjusts the relative angle between the galvanometer and the sample, and then performs galvanometer processing of the optimized path.

4. The method of claim 1, wherein the method further comprises: In step S5, when the area of the to-be-processed graph of the sample is greater than the single processing width of the field mirror, the displacement platform will move the object, after processing a region, the sample platform will carry the sample to the next processing position for processing, and the processing of all regions to be processed is completed.

5. The method of claim 1, wherein the method further comprises: In step S5, when the sample to-be-processed graph needs to be rotated or translated by the platform to process large-width graphs or cross-shaped scanning tracks, the displacement platform will move the object, and the displacement platform will carry the sample to rotate or translate during laser processing to complete the processing of specific graphs.

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