Micro-LED micro-display device laser mass transfer method and device

Abstract

The present invention relates to a method and device for laser mass transfer of Micro-LED micro-display devices, comprising the following steps: photographing dissociated Micro-LED micro-display devices to obtain Micro-LED micro-display device positions and Micro-LED micro-display device morphological images; picking up the dissociated Micro-LED micro-display devices onto a target substrate based on the Micro-LED micro-display device positions and Micro-LED micro-display device morphological images to obtain a transferred Micro-LED micro-display device array; fixing the transferred Micro-LED micro-display device array to obtain a Micro-LED micro-display device array fixed on the target substrate; performing electrical performance testing on the Micro-LED micro-display device array fixed on the target substrate to obtain electrical performance parameters, and removing Micro-LED micro-display devices whose electrical performance parameters are lower than an electrical performance parameter threshold to obtain a qualified Micro-LED micro-display device array, thereby solving the technical problems that traditional transfer methods such as mechanical transfer and printing transfer are usually inefficient and easily damage tiny Micro-LED micro-display devices during the transfer process.

Description

Technical Field

[0001] The present invention relates to the technical field of micro-display devices, and in particular to a method and device for laser mass transfer of a Micro-LED micro-display device. Background Art

[0002] As the next generation of display technology, Micro-LED micro-display technology has the advantages of high brightness, low energy consumption, fast response and long life, and is widely used in wearable devices, augmented reality (AR) and virtual reality (VR) and other fields. However, there are many challenges in the current manufacturing and transfer process of Micro-LED micro-display devices. First of all, traditional transfer methods such as mechanical transfer and printing transfer are usually inefficient and easy to damage tiny Micro-LED micro-display devices during the transfer process. Laser mass transfer technology came into being, aiming to reduce physical damage to Micro-LEDs and improve transfer efficiency by local heating through high-energy pulsed lasers.

[0003] However, there are still some technical challenges in the research of laser mass transfer technology. One of the key issues is how to accurately control the energy and irradiation time of the laser to ensure that the Micro-LED micro-display device can be safely dissociated from the growth substrate without being damaged by overheating. In addition, after laser transfer, the accurate picking and positioning of the Micro-LED micro-display device is also a challenge, because the size of the micro-display device is extremely small, and position shift or rotation may occur during the transfer process, resulting in inaccurate subsequent array arrangement.

[0004] In addition, the Micro-LED micro-display devices after laser mass transfer need to be tested for electrical performance to ensure their functionality. Existing testing methods and equipment may not meet the needs of large-scale, rapid testing, especially for densely arranged Micro-LED arrays. How to perform effective electrical performance testing without damaging the device is an urgent problem to be solved. At the same time, how to efficiently eliminate unqualified Micro-LED micro-display devices and ensure the array integrity of the remaining devices also puts higher requirements on the production process. Summary of the invention

[0005] The main purpose of the present invention is to provide a method and device for laser mass transfer of Micro-LED micro display devices, which solves the technical problems that traditional transfer methods such as mechanical transfer and printing transfer are usually inefficient and easily damage tiny Micro-LED micro display devices during the transfer process.

[0006] To achieve the above object, the present invention provides a method for laser mass transfer of a Micro-LED micro display device, comprising the following steps:

[0007] Locally heating the Micro-LED micro-display device on the growth substrate by a preset high-energy pulse laser to obtain a dissociated Micro-LED micro-display device;

[0008] Photographing the dissociated Micro-LED micro-display device to obtain a position image of the Micro-LED micro-display device and a morphological image of the Micro-LED micro-display device;

[0009] By using a preset micro-manipulation system, the dissociated Micro-LED micro-display device is picked up onto a target substrate based on the position of the Micro-LED micro-display device and the morphological image of the Micro-LED micro-display device, to obtain a transferred Micro-LED micro-display device array;

[0010] Fixing the transferred Micro-LED micro display device array by a preset die bonding technology to obtain a Micro-LED micro display device array fixed on a target substrate;

[0011] An electrical performance test is performed on the Micro-LED micro display device array fixed on the target substrate to obtain electrical performance parameters, and Micro-LED micro display devices whose electrical performance parameters are lower than the electrical performance parameter threshold are eliminated to obtain a qualified Micro-LED micro display device array.

[0012] Furthermore, the method of locally heating the Micro-LED micro-display device on the growth substrate by a preset high-energy pulse laser to obtain a dissociated Micro-LED micro-display device includes:

[0013] Performing multi-dimensional parameter optimization on a preset high-energy pulse laser through a preset laser parameter optimization algorithm to obtain optimal laser parameters; wherein the multi-dimensional parameters include laser energy, pulse width and repetitive laser frequency;

[0014] Performing surface micro-nanostructuring treatment on the growth substrate by using a preset laser etching technology to obtain a surface-modified growth substrate;

[0015] Based on the optimal laser parameters, the high-energy pulse laser is controlled to locally heat the Micro-LED micro display device on the surface-modified growth substrate to obtain a heated area;

[0016] The temperature distribution of the heating area is simulated by a preset thermodynamic simulation algorithm to obtain a temperature field distribution diagram;

[0017] Based on the temperature field distribution diagram, the high-energy pulse laser output by the high-energy pulse laser is adjusted in real time; wherein the high-energy pulse laser is used to ensure that the temperature in the heating area is stable within a preset dissociation temperature range to obtain a heating area with stable temperature;

[0018] The temperature-stable heating area is used to dissociate the Micro-LED micro display device to obtain a dissociated Micro-LED micro display device.

[0019] Furthermore, photographing the dissociated Micro-LED micro-display device to obtain a Micro-LED micro-display device position and a Micro-LED micro-display device morphology image includes:

[0020] The dissociated Micro-LED micro-display device is photographed at multiple angles by a preset three-dimensional microscopic imaging technology to obtain a three-dimensional morphological image;

[0021] Performing background removal and noise filtering on the three-dimensional morphological image by using a preset image processing algorithm to obtain preprocessed image data;

[0022] Performing image data segmentation on the preprocessed image data to obtain an independent image of a single Micro-LED micro display device;

[0023] Inputting the single independent image into a preset geometric feature extraction algorithm to extract the position and geometric parameters of the micro-display device, and obtaining the two-dimensional coordinate position of the Micro-LED micro-display device and the morphological feature parameters of the Micro-LED micro-display device;

[0024] The two-dimensional coordinate positions and the morphological characteristic parameters at multiple angles are spatially registered by a preset image registration algorithm to obtain a registered micro-display device position and a registered morphological image;

[0025] Through a preset image correction algorithm, the registered micro-display device position and the registered morphological image are optically deformed to obtain a Micro-LED micro-display device position and a Micro-LED micro-display device morphological image; wherein the Micro-LED micro-display device position is a three-dimensional coordinate position.

[0026] Furthermore, the dissociated Micro-LED micro-display device is picked up onto a target substrate based on the position of the Micro-LED micro-display device and the morphological image of the Micro-LED micro-display device by a preset micro-manipulation system to obtain a transferred Micro-LED micro-display device array, including:

[0027] Obtaining a target substrate position corresponding to the target substrate from a preset database, and generating path planning data based on the target substrate position, the Micro-LED micro-display device position, and the Micro-LED micro-display device morphology image through a preset path planning algorithm;

[0028] Controlling a micro-manipulation system based on the path planning data, and picking up the dissociated Micro-LED micro-display device through the micro-manipulation system to obtain a Micro-LED micro-display device in an initial picking state;

[0029] When the Micro-LED micro-display device in the initial picking state is not within the preset picking control range, the path planning data is adjusted in real time through the feedback mechanism in the micro-control system to obtain force feedback data;

[0030] Optimizing the picking process of the micro-manipulation system based on the force feedback data and the path planning data to obtain optimized picking parameters;

[0031] The micro-manipulation system is controlled based on the optimized picking parameters to pick up the dissociated Micro-LED micro-display device onto a target substrate to obtain a transferred Micro-LED micro-display device array.

[0032] Furthermore, the transferred Micro-LED micro display device array is fixed by a preset die bonding technology to obtain a Micro-LED micro display device array fixed on a target substrate, including:

[0033] Searching the material properties of the transferred Micro-LED micro display device and the surface properties of the target substrate from a preset database;

[0034] Selecting a die-bonding material corresponding to the target substrate based on the material properties and the surface properties by using a preset die-bonding material selection algorithm;

[0035] Performing surface modification on the solid crystal material by a preset chemical modification technology to obtain a modified solid crystal material;

[0036] Performing a dispensing operation on the modified die-bonding material through a preset dispensing system to obtain a dispensing pattern of the die-bonding material;

[0037] Through a preset hot-pressing bonding technology, based on the die-bonding material dispensing pattern, the transferred Micro-LED micro-display device array is hot-pressed and cured to obtain a preliminarily cured micro-display device array;

[0038] Performing curing quality inspection and non-destructive inspection on the preliminarily cured microdisplay device array by using a preset laser scanning microscope technology to obtain curing quality evaluation data;

[0039] If the curing quality assessment data shows that curing is incomplete, performing quality assessment analysis on the curing quality assessment data to obtain a curing defect factor;

[0040] Through the preset solid crystal technology, the curing conditions of the transferred Micro-LED micro display device array are adjusted and re-cured based on the curing defect factor until the curing quality evaluation data shows that the curing is complete, thereby obtaining a Micro-LED micro display device array fixed on the target substrate.

[0041] Furthermore, the method of heat-pressing and curing the transferred Micro-LED micro-display device array based on the dispensing pattern of the die-bonding material by using the preset heat-pressing bonding technology to obtain a preliminarily cured micro-display device array includes:

[0042] Determining a crystal bonding material parameter based on the modified crystal bonding material;

[0043] Determining a hot pressing temperature curve based on the material properties, the surface properties and the die-bonding material parameters;

[0044] The target substrate is heated based on the hot pressing temperature curve by a preset preheating device and hot pressing bonding technology to obtain a preheated target substrate;

[0045] Determine the magnitude and distribution of the pressing force based on the hot pressing temperature curve and the die-bonding material dispensing pattern through a preset pressing control algorithm to obtain pressing force parameters;

[0046] Based on the hot pressing temperature curve and the pressing force parameter, hot pressing and curing the transferred Micro-LED micro display device array to obtain a hot pressing and cured micro display device array;

[0047] Through the preset thermal imaging technology, the temperature distribution data of the hot pressing process of the hot pressing curing micro display device array is monitored in real time;

[0048] Determine whether the temperature distribution data is within a preset target temperature distribution data range, and if so, perform heat pressing curing on the transferred Micro-LED micro display device array based on the temperature distribution data to obtain a preliminarily cured micro display device array;

[0049] If not, the hot pressing temperature curve and pressing force parameters are dynamically adjusted through a preset temperature feedback adjustment algorithm to achieve uniform temperature distribution until the temperature distribution data is within the preset target temperature distribution data range, thereby obtaining a preliminarily cured micro display device array.

[0050] Further, the electrical performance test is performed on the Micro-LED micro display device array fixed on the target substrate to obtain electrical performance parameters, and the Micro-LED micro display devices having electrical performance parameters lower than the electrical performance parameter threshold are eliminated to obtain a qualified Micro-LED micro display device array, including:

[0051] Performing parallel electrical testing on the Micro-LED micro-display device array fixed on the target substrate through a preset multi-channel electrical testing device to obtain electrical testing data;

[0052] By using a preset electrical performance parameter extraction algorithm, based on electrical test data, the key electrical performance parameters of each Micro-LED micro display device are extracted; wherein the key electrical performance parameters include threshold voltage, saturation current, and leakage current;

[0053] By using a preset statistical analysis algorithm, statistical analysis and calculation are performed on the key electrical performance parameters to obtain electrical performance distribution statistical data;

[0054] determining electrical performance parameters based on the electrical performance distribution statistical data;

[0055] Using a preset defect detection algorithm, the Micro-LED micro-display device whose electrical performance parameter is lower than a preset electrical performance parameter threshold is identified and marked to obtain the position information of the defective Micro-LED micro-display device;

[0056] Through a preset automatic rejection system, based on the position information of defective micro-display devices, Micro-LED micro-display devices with electrical performance parameter thresholds below a preset threshold are rejected from the Micro-LED micro-display device array fixed on the target substrate to obtain a qualified Micro-LED micro-display device array.

[0057] The present invention also provides a Micro-LED micro display device laser mass transfer device, comprising:

[0058] A heating device, used to locally heat the Micro-LED micro-display device on the growth substrate by a preset high-energy pulse laser to obtain a dissociated Micro-LED micro-display device;

[0059] A photographing device, used to photograph the dissociated Micro-LED micro-display device to obtain a position image of the Micro-LED micro-display device and a morphological image of the Micro-LED micro-display device;

[0060] A picking device, used to pick up the dissociated Micro-LED micro-display device onto a target substrate based on the position of the Micro-LED micro-display device and the morphological image of the Micro-LED micro-display device through a preset micro-manipulation system to obtain a transferred Micro-LED micro-display device array;

[0061] A fixing device, used to fix the transferred Micro-LED micro display device array by a preset die bonding technology to obtain a Micro-LED micro display device array fixed on a target substrate;

[0062] The testing device is used to perform an electrical performance test on the Micro-LED micro display device array fixed on the target substrate to obtain electrical performance parameters, and eliminate the Micro-LED micro display devices whose electrical performance parameters are lower than the electrical performance parameter threshold to obtain a qualified Micro-LED micro display device array.

[0063] The present invention also provides a computer device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of any one of the above methods when executing the computer program.

[0064] The present invention also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of any of the above-mentioned methods are implemented.

[0065] The method for laser mass transfer of Micro-LED micro-display devices provided by the present invention comprises the following steps: locally heating the Micro-LED micro-display devices on the growth substrate by a preset high-energy pulse laser to obtain dissociated Micro-LED micro-display devices; photographing the dissociated Micro-LED micro-display devices to obtain the positions of the Micro-LED micro-display devices and the morphological images of the Micro-LED micro-display devices; picking up the dissociated Micro-LED micro-display devices to a target substrate based on the positions of the Micro-LED micro-display devices and the morphological images of the Micro-LED micro-display devices by a preset micro-manipulation system to obtain a transferred Micro-LED micro-display device array; and The transferred Micro-LED micro-display device array is fixed by using the crystal technology to obtain a Micro-LED micro-display device array fixed on the target substrate; the electrical performance test is performed on the Micro-LED micro-display device array fixed on the target substrate to obtain electrical performance parameters, and the Micro-LED micro-display devices with electrical performance parameters lower than the electrical performance parameter threshold are eliminated to obtain a qualified Micro-LED micro-display device array. Through the above technical means, the technical problems of traditional transfer methods such as mechanical transfer and printing transfer, which are usually inefficient and easy to damage tiny Micro-LED micro-display devices during the transfer process, are solved, and the entire transfer process can be highly automated, reducing manual intervention and improving the stability and repeatability of the production process. At the same time, this method also provides the possibility of large-scale production, which is beneficial to adapt to the future market demand for Micro-LED display devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Figure 1 Schematic diagram of the steps of a laser mass transfer method for a Micro-LED micro display device in one embodiment of the present invention;

[0067] Figure 2 It is a structural block diagram of a laser mass transfer device for a Micro-LED micro display device in one embodiment of the present invention;

[0068] Figure 3 It is a schematic block diagram of the structure of a computer device according to an embodiment of the present invention.

[0069] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0070] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0071] like Figure 1 As shown, Figure 1 This is a schematic diagram of the steps of a laser mass transfer method for a Micro-LED micro display device in one embodiment of the present invention;

[0072] In one embodiment of the present invention, a method for laser mass transfer of a Micro-LED micro display device is provided, comprising the following steps:

[0073] Step S1, locally heating the Micro-LED micro display device on the growth substrate by using a preset high-energy pulse laser to obtain a dissociated Micro-LED micro display device.

[0074] Specifically, the Micro-LED micro-display device on the growth substrate is locally heated by a preset high-energy pulse laser, so that the dissociation of the Micro-LED micro-display device from the growth substrate is achieved. In the specific operation, the position and distribution of the Micro-LED micro-display device on the growth substrate are first determined, because each Micro-LED micro-display device requires precise laser irradiation to ensure its dissociation effect. Next, the laser system accurately projects the high-energy pulse laser onto each Micro-LED micro-display device according to preset parameters such as laser pulse energy, pulse width and repetition frequency. In this process, the energy and time control of the laser are key. Excessive energy may damage the Micro-LED micro-display device, while insufficient energy cannot effectively dissociate the device from the growth substrate. For example, when producing Micro-LED displays for augmented reality (AR) glasses, the laser system locally heats each Micro-LED micro-display device to separate it from the growth substrate. In this way, each pixel in the AR glasses can independently control the emission of light to provide high-resolution and high-brightness display effects. The local heating of the laser not only ensures the dissociation of the Micro-LED micro-display device, but also avoids damage to other surrounding devices or substrates, thereby improving production efficiency and device yield. In this way, Micro-LED micro-display devices can be efficiently and accurately transferred from the growth substrate to the target substrate, and then assembled into a high-quality display array to meet the stringent requirements of AR glasses for display performance.

[0075] Step S2, photographing the dissociated Micro-LED micro-display device to obtain a Micro-LED micro-display device position and a Micro-LED micro-display device morphology image.

[0076] Specifically, the dissociated Micro-LED micro-display devices are photographed to obtain the position and morphological images of each Micro-LED micro-display device for subsequent precise transfer and arrangement. In this step, a high-resolution microscope system or a special optical imaging device is first prepared to clearly observe each Micro-LED micro-display device at a macro scale. Subsequently, all dissociated Micro-LED micro-display devices are scanned and photographed by this system. During the shooting process, the system records the coordinates of each Micro-LED micro-display device in the field of view and its morphological characteristics, such as the shape, size, and any possible defects or anomalies of the device. For example, when producing Micro-LED displays for augmented reality (AR) glasses, the shooting process is crucial. Through shooting, the position information of each Micro-LED micro-display device can help the micro-manipulation system to accurately pick up and place it on the target substrate, while the morphological image can identify any defects or anomalies that may affect the display performance. In this way, not only can the precise arrangement of each pixel be ensured, but also a preliminary screening can be performed before the subsequent electrical performance test to remove obviously unqualified devices. The captured image data is then passed to the preset micro-manipulation system, which calculates the optimal pick-up and placement path based on the data to ensure the efficiency and accuracy of the transfer process. This shooting technology not only improves the production efficiency of Micro-LED micro-display devices, but also ensures the quality and consistency of the display device array, meeting the needs of AR glasses for high-precision display.

[0077] Step S3, using a preset micro-manipulation system, based on the position of the Micro-LED micro-display device and the morphological image of the Micro-LED micro-display device, the dissociated Micro-LED micro-display device is picked up onto a target substrate to obtain a transferred Micro-LED micro-display device array.

[0078] Specifically, through the preset micro-manipulation system, based on the position of the Micro-LED micro-display device and the morphological image of the Micro-LED micro-display device, the dissociated Micro-LED micro-display device is accurately picked up and placed on the target substrate to form a transferred Micro-LED micro-display device array. In this step, the micro-manipulation system first receives the position and morphological image data of the Micro-LED micro-display device taken in the previous step. The system calculates the specific position of each Micro-LED micro-display device based on these data and generates an optimal pick-up and placement path. The micro-manipulation system is usually equipped with a precision robotic arm or pneumatic pick-up device that can move and operate at the micron level to ensure the accuracy and consistency of the pick-up and placement process of each Micro-LED micro-display device. For example, when producing Micro-LED displays for augmented reality (AR) glasses, the micro-manipulation system will pick up the dissociated Micro-LED micro-display devices one by one according to the image data obtained by the shooting. Assuming that a high-resolution display array needs to be arranged on the target substrate, the system will place each Micro-LED micro-display device in a predetermined position in turn to ensure that the spacing and arrangement between each pixel are accurate and correct. This method can not only achieve efficient transfer, but also ensure that the Micro-LED micro-display devices form a tight and uniform array on the target substrate after transfer, thereby providing high-resolution display effects for AR glasses. This precisely controlled micro-manipulation technology not only improves production efficiency, but also ensures the quality and consistency of the final product, meeting the needs of AR glasses for high-precision display.

[0079] Step S4, fixing the transferred Micro-LED micro display device array by a preset die bonding technology to obtain a Micro-LED micro display device array fixed on the target substrate.

[0080] Specifically, the transferred Micro-LED micro-display device array is fixed by a preset solid crystal technology to ensure that each Micro-LED micro-display device is firmly adhered to the target substrate to form a stable display device array. In this step, it is first necessary to select appropriate solid crystal materials and processes, usually conductive adhesives or welding technologies. These materials can not only provide mechanical support, but also achieve electrical connection. Solid crystal technology includes accurately applying adhesives or solders to the electrodes of each Micro-LED micro-display device and the corresponding positions of the target substrate. Subsequently, the adhesive or solder is cured by heating or ultraviolet curing, and the Micro-LED micro-display device is firmly fixed to the target substrate. For example, when producing Micro-LED displays for augmented reality (AR) glasses, solid crystal technology is particularly critical. Assuming that the target substrate has been pre-coated with a conductive adhesive, the micro-manipulation system will accurately place each Micro-LED micro-display device on the corresponding bonding point according to its position. Next, the adhesive is cured by ultraviolet irradiation, or the solder is melted and cured by heating. This die bonding method not only ensures the mechanical stability of the Micro-LED micro-display device, but also achieves electrical connection through adhesive or solder, ensuring the transmission of electrical signals between display devices. In this way, the Micro-LED micro-display device is firmly fixed on the target substrate to form an integrated display array that can meet the requirements of AR glasses for high brightness, fast response and long-life display. This die bonding technology not only improves the production efficiency of Micro-LED displays, but also ensures the performance and reliability of the final product.

[0081] Step S5, performing an electrical performance test on the Micro-LED micro display device array fixed on the target substrate to obtain electrical performance parameters, and removing the Micro-LED micro display devices whose electrical performance parameters are lower than the electrical performance parameter threshold to obtain a qualified Micro-LED micro display device array.

[0082] Specifically, the electrical performance test is performed on the Micro-LED micro-display device array fixed on the target substrate to obtain the electrical performance parameters, and the Micro-LED micro-display devices with the electrical performance parameters lower than the electrical performance parameter threshold are eliminated to obtain a qualified Micro-LED micro-display device array. This process is a key step to ensure the reliability and consistency of the final product. Specifically, after the step of fixing the transferred Micro-LED micro-display device array by the preset solid crystal technology, in order to ensure that each Micro-LED micro-display device can work normally and meet the expected performance standards, it is necessary to further implement electrical performance testing. In this process, a specially designed test device is first used to dock the Micro-LED micro-display device array fixed on the target substrate to apply a predetermined electrical signal to simulate the working state under actual operating conditions. These test devices can accurately measure the electrical performance parameters such as current, voltage response and light output of each Micro-LED micro-display device. For example, when producing Micro-LED displays for augmented reality (AR) glasses, since such applications have extremely high requirements for brightness and color reproduction, the electrical performance test not only checks the basic luminous efficiency of the device, but also evaluates its color purity and uniformity. If the electrical performance parameters of a Micro-LED micro-display device fail to meet the preset threshold, that is, its performance index is lower than the required standard, the device will be identified as a defective product. Such a detection mechanism can effectively prevent defective devices from entering the subsequent assembly process, thereby improving the quality of the overall display screen. Once the Micro-LED micro-display device with substandard electrical performance parameters is identified, measures need to be taken to remove it from the array. This step can be achieved in a variety of ways, such as using laser ablation technology to accurately remove faulty devices, or using physical means such as micro-robotic arms to remove these defective units. During the removal process, care must be taken to avoid affecting the normal Micro-LED micro-display devices around, and it is also necessary to consider how to fill the vacancies left by the removed devices to maintain the integrity and display effect of the entire array. For application scenarios such as AR glasses that have strict requirements on display accuracy, any slight changes may affect the user experience, so it is crucial to ensure high accuracy during the removal process. After completing the above removal steps, the final result is a qualified array consisting of Micro-LED micro-display devices that meet the electrical performance parameter requirements. This screened and optimized array not only improves product reliability, but also enhances display consistency and visual impact. For example, in the actual application of AR glasses, a qualified Micro-LED micro-display device array will provide a clearer and more vivid picture, allowing users to enjoy an immersive visual experience in various environments.In summary, by conducting rigorous electrical performance tests on the Micro-LED micro-display device array fixed on the target substrate and eliminating devices with poor performance, the quality of the final product can be significantly improved, meeting the high-performance display requirements of high-end display devices such as AR glasses.

[0083] In a specific embodiment, the method of locally heating the Micro-LED micro-display device on the growth substrate by a preset high-energy pulse laser to obtain a dissociated Micro-LED micro-display device includes:

[0084] Performing multi-dimensional parameter optimization on a preset high-energy pulse laser through a preset laser parameter optimization algorithm to obtain optimal laser parameters; wherein the multi-dimensional parameters include laser energy, pulse width and repetitive laser frequency;

[0085] Performing surface micro-nanostructuring treatment on the growth substrate by using a preset laser etching technology to obtain a surface-modified growth substrate;

[0086] Based on the optimal laser parameters, the high-energy pulse laser is controlled to locally heat the Micro-LED micro display device on the surface-modified growth substrate to obtain a heated area;

[0087] The temperature distribution of the heating area is simulated by a preset thermodynamic simulation algorithm to obtain a temperature field distribution diagram;

[0088] Based on the temperature field distribution diagram, the high-energy pulse laser output by the high-energy pulse laser is adjusted in real time; wherein the high-energy pulse laser is used to ensure that the temperature in the heating area is stable within a preset dissociation temperature range to obtain a heating area with stable temperature;

[0089] The temperature-stable heating area is used to dissociate the Micro-LED micro display device to obtain a dissociated Micro-LED micro display device.

[0090] Specifically, in the laser mass transfer process of Micro-LED micro-display devices, local heating of the Micro-LED micro-display devices on the growth substrate by a preset high-energy pulsed laser is a key step in achieving device dissociation. First, the high-energy pulsed laser is optimized in multiple dimensions by a preset laser parameter optimization algorithm to obtain the optimal laser parameters. This process involves precise adjustment of laser energy, pulse width, and repetitive laser frequency. The laser parameter optimization algorithm calculates the optimal parameters based on the material properties of the Micro-LED micro-display device, the thickness of the growth substrate, and the target dissociation temperature. For example, when producing Micro-LED displays for augmented reality (AR) glasses, the laser parameters need to take into account the accuracy requirements of AR glasses for display devices to ensure that the dissociation process does not damage the Micro-LED micro-display device. Next, the surface of the growth substrate is treated with micro-nanostructures by a preset laser etching technology to modify its surface. The purpose of this operation is to enhance the adhesion between the growth substrate and the Micro-LED micro-display device, and also to facilitate laser absorption and energy transfer. In the production of AR glasses, the surface-modified growth substrate can better withstand laser irradiation and prevent unnecessary physical damage during the heating process. Based on the optimal laser parameters, the high-energy pulsed laser is controlled to locally heat the Micro-LED micro-display device on the surface-modified growth substrate to obtain a heating area. In this process, the irradiation of the high-energy pulsed laser will cause the temperature of the specific area where the Micro-LED micro-display device is located to rise rapidly, prompting thermal dissociation of the interface between the device and the growth substrate. In order to ensure the dissociation effect, the laser system needs to accurately control the energy and irradiation time of the laser. For example, in the production of Micro-LED displays for AR glasses, the laser must be able to quickly and uniformly dissociate the Micro-LED micro-display device without damaging the device. In order to further optimize the dissociation process, the temperature distribution of the heating area is simulated by a preset thermodynamic simulation algorithm to obtain a temperature field distribution map. This simulation process can help engineers understand the temperature distribution under laser irradiation in advance and ensure that the temperature in the heating area is stable within the preset dissociation temperature range. Through this simulation, the laser system can adjust the laser parameters in real time to ensure the uniformity of the temperature field. For example, in the production of AR glasses, thermodynamic simulation can help ensure that the temperature of each Micro-LED micro-display device is not too high or too low during dissociation, avoiding device damage or incomplete dissociation. Based on the temperature field distribution map, the laser parameters output by the high-energy pulse laser are adjusted in real time to ensure that the temperature in the heating area is stable within the preset dissociation temperature range. The real-time adjustment of the laser parameters can be fine-tuned according to the changes in the temperature field to ensure temperature stability during the dissociation process.This is critical for the production of Micro-LED displays for AR glasses, as temperature instability may lead to inconsistent performance or damage to display devices. Using a temperature-stable heating area, the Micro-LED micro-display device is dissociated to obtain a dissociated Micro-LED micro-display device. At this stage, the laser system has ensured the temperature stability of the heating area through steps such as multi-dimensional parameter optimization, laser etching processing, thermodynamic simulation and real-time adjustment, so that the Micro-LED micro-display device can be safely separated from the growth substrate. For example, in the production of AR glasses, the temperature-stable heating area ensures that the Micro-LED micro-display device maintains integrity and performance after dissociation, thereby meeting the requirements of AR glasses for high-resolution and high-brightness display. Through this comprehensive laser mass transfer method, not only can the dissociation of Micro-LED micro-display devices be achieved efficiently, but also the damage to the device during the transfer process can be minimized. This technology makes it possible to produce high-precision display devices such as AR glasses, improving production efficiency and the quality of display devices. Through multiple means such as optimizing laser parameters, modifying the surface of the growth substrate, thermodynamic simulation and real-time adjustment, the laser transfer process of Micro-LED micro-display devices is precisely controlled, ensuring the high quality and consistency of the final product.

[0091] In a specific embodiment, photographing the dissociated Micro-LED micro-display device to obtain a Micro-LED micro-display device position and a Micro-LED micro-display device morphology image includes:

[0092] The dissociated Micro-LED micro-display device is photographed at multiple angles by a preset three-dimensional microscopic imaging technology to obtain a three-dimensional morphological image;

[0093] Performing background removal and noise filtering on the three-dimensional morphological image by using a preset image processing algorithm to obtain preprocessed image data;

[0094] Performing image data segmentation on the preprocessed image data to obtain an independent image of a single Micro-LED micro display device;

[0095] Inputting the single independent image into a preset geometric feature extraction algorithm to extract the position and geometric parameters of the micro-display device, and obtaining the two-dimensional coordinate position of the Micro-LED micro-display device and the morphological feature parameters of the Micro-LED micro-display device;

[0096] The two-dimensional coordinate positions and the morphological characteristic parameters at multiple angles are spatially registered by a preset image registration algorithm to obtain a registered micro-display device position and a registered morphological image;

[0097] Through a preset image correction algorithm, the registered micro-display device position and the registered morphological image are optically deformed to obtain a Micro-LED micro-display device position and a Micro-LED micro-display device morphological image; wherein the Micro-LED micro-display device position is a three-dimensional coordinate position.

[0098] Specifically, in the process of laser mass transfer of Micro-LED micro-display devices, photographing the dissociated Micro-LED micro-display devices to obtain their position and morphological images is an important step to ensure subsequent precise transfer and arrangement. First, the dissociated Micro-LED micro-display devices are scanned and photographed at multiple angles by a preset three-dimensional microscopic imaging technology to generate a three-dimensional morphological image. This technology can capture the shape, size and position information of Micro-LED micro-display devices from different angles. For example, when producing Micro-LED displays for augmented reality (AR) glasses, three-dimensional microscopic imaging can ensure that the three-dimensional data of each micro-display device is accurately recorded. Next, the three-dimensional morphological image is background removed and noise filtered by a preset image processing algorithm to obtain pre-processed image data. This operation is to improve the clarity of the image and remove interference information that may affect subsequent analysis. In the production of AR glasses, background removal can help identify each independent Micro-LED micro-display device, while noise filtering ensures the quality of the image data and reduces errors. The pre-processed image data is segmented to obtain an independent image of a single Micro-LED micro-display device. Image segmentation technology divides the entire image into multiple parts representing a single Micro-LED micro-display device by identifying edges, color differences or other features in the image. For example, in the production of AR glasses displays, image segmentation can ensure that the position and morphological data of each pixel are extracted independently. A single independent image is input into a preset geometric feature extraction algorithm to extract the position and geometric parameters of the micro-display device, and obtain the two-dimensional coordinate position and its morphological feature parameters of the Micro-LED micro-display device. This step is to analyze the shape features in the image through an algorithm to calculate the specific position and morphological features of each Micro-LED micro-display device on a two-dimensional plane, such as size, shape, angle, etc. For example, in the production of AR glasses, these data are used to determine the exact position and morphology of each pixel in the display array. The two-dimensional coordinate position and morphological feature parameters obtained from multiple angles are spatially registered through a preset image registration algorithm to obtain the registered micro-display device position and morphological image. Image registration technology can unify image data from different angles into a common coordinate system to ensure that the position and morphological information of the Micro-LED micro-display device observed from different viewing angles are consistent. For example, in the production of AR glasses displays, image registration ensures that the precise position and shape of each pixel in three-dimensional space are correctly identified. Finally, through the preset image correction algorithm, the registered micro-display device position and shape image are optically corrected to obtain the final three-dimensional coordinate position and shape image of the Micro-LED micro-display device.In this process, the correction algorithm takes into account the optical distortion that may be introduced by the microscope system or imaging device, such as barrel distortion, pincushion distortion, etc., to ensure the accuracy of the image data. For example, when producing AR glasses, optical distortion correction can ensure that the three-dimensional position and morphological image of each pixel point have no systematic error, thereby ensuring the high precision of the display array. Through this comprehensive shooting and processing method, not only can the three-dimensional position and morphological image of each Micro-LED micro-display device be accurately obtained, but also accurate operation data can be provided for the subsequent micro-manipulation system. This technology makes it possible to produce high-precision display devices such as AR glasses, ensuring that the display devices meet high-precision requirements during the transfer and arrangement process. Through the steps of three-dimensional microscopic imaging, image processing, image segmentation, geometric feature extraction, image registration and optical distortion correction, the shooting and data extraction process of Micro-LED micro-display devices has been fully optimized, ensuring the high quality and consistency of the final product.

[0099] In a specific embodiment, the dissociated Micro-LED micro-display device is picked up onto a target substrate based on the position of the Micro-LED micro-display device and the morphological image of the Micro-LED micro-display device by a preset micro-manipulation system to obtain a transferred Micro-LED micro-display device array, including:

[0100] Obtaining a target substrate position corresponding to the target substrate from a preset database, and generating path planning data based on the target substrate position, the Micro-LED micro-display device position and the Micro-LED micro-display device morphology image through a preset path planning algorithm;

[0101] Controlling a micro-manipulation system based on the path planning data, and picking up the dissociated Micro-LED micro-display device through the micro-manipulation system to obtain a Micro-LED micro-display device in an initial picking state;

[0102] When the Micro-LED micro-display device in the initial picking state is not within the preset picking control range, the path planning data is adjusted in real time through the feedback mechanism in the micro-control system to obtain force feedback data;

[0103] Optimizing the picking process of the micro-manipulation system based on the force feedback data and the path planning data to obtain optimized picking parameters;

[0104] The micro-manipulation system is controlled based on the optimized picking parameters to pick up the dissociated Micro-LED micro-display device onto a target substrate to obtain a transferred Micro-LED micro-display device array.

[0105] Specifically, in the laser mass transfer process of Micro-LED micro-display devices, the dissociated Micro-LED micro-display devices are accurately picked up and placed on the target substrate through a preset micro-manipulation system to form a transferred Micro-LED micro-display device array. This process involves multi-step precision operations, the first of which is to obtain the corresponding position information of the target substrate from a preset database. The position data of each target substrate is known, and the system uses this data to determine the position where the Micro-LED micro-display device should be placed. For example, when producing Micro-LED displays for augmented reality (AR) glasses, the position information of the target substrate is crucial, which determines the arrangement of the display device array. Next, based on the position information of the target substrate position and the Micro-LED micro-display device and the morphological image of the Micro-LED micro-display device, the path planning algorithm generates path planning data. These data include the shortest path from the current position to the target position of each Micro-LED micro-display device, and how to avoid collisions with other devices or substrate edges during movement. For example, in the production of AR glasses, path planning ensures that each pixel can be picked up and placed quickly and safely. Based on the generated path planning data, the micro-control system begins to perform the picking operation of the dissociated Micro-LED micro-display device. The micro-control system is usually equipped with a precision robotic arm or pneumatic picking device that can operate accurately at the micron level. At this stage, the system picks up the Micro-LED micro-display device from the dissociated position and enters the initial picking state. For example, in the production of AR glasses, the micro-control system ensures that each Micro-LED micro-display device maintains its integrity during the picking process. When the Micro-LED micro-display device in the initial picking state is not within the preset picking control range, the feedback mechanism in the micro-control system begins to play a role. The feedback mechanism uses force sensors or other sensing technologies to monitor the force feedback between the Micro-LED micro-display device and the micro-control system during the picking process in real time. For example, if the picking force is too large, the device may be damaged, and if it is too small, the picking may fail. Based on these force feedback data, the system will adjust the path planning data in real time to ensure that the picking operation is carried out within a safe and accurate range. In the production of AR glasses, this feedback mechanism can ensure that the picking process of each pixel is stable and reliable. Based on the force feedback data and path planning data, the micro-manipulation system optimizes its picking process and obtains optimized picking parameters. These parameters include adjusting the picking speed, force, path, etc. to ensure that each Micro-LED micro-display device can be accurately picked up and placed without damage. For example, the production of AR glasses requires high precision and consistency, and the optimized picking parameters can ensure the quality of the display device array.Finally, based on the optimized picking parameters, the micro-manipulation system picks up the dissociated Micro-LED micro-display devices onto the target substrate to form a transferred Micro-LED micro-display device array. At this stage, the micro-manipulation system accurately controls the movement and placement of each Micro-LED micro-display device according to the optimized parameters to ensure that its position and spacing on the target substrate meet the design requirements. For example, in the production of AR glasses, this precise transfer process ensures the accurate arrangement of each pixel in the display array, thereby providing a high-resolution and high-brightness display effect. Through this precise micro-manipulation system operation, not only can efficient Micro-LED micro-display device transfer be achieved, but also each device can be ensured to form a tight and uniform array on the target substrate after transfer. The entire process achieves precise control of Micro-LED micro-display devices through path planning, real-time feedback, parameter optimization and other steps, ensuring the quality and consistency of the final product. This technology makes it possible to produce high-precision display devices such as AR glasses, meeting the stringent requirements for display performance.

[0106] In a specific embodiment, the transferred Micro-LED micro display device array is fixed by a preset die bonding technology to obtain a Micro-LED micro display device array fixed on a target substrate, including:

[0107] Searching the material properties of the transferred Micro-LED micro display device and the surface properties of the target substrate from a preset database;

[0108] Selecting a die-bonding material corresponding to the target substrate based on the material properties and the surface properties by using a preset die-bonding material selection algorithm;

[0109] Performing surface modification on the solid crystal material by a preset chemical modification technology to obtain a modified solid crystal material;

[0110] Performing a dispensing operation on the modified die-bonding material through a preset dispensing system to obtain a dispensing pattern of the die-bonding material;

[0111] Through a preset hot-pressing bonding technology, based on the die-bonding material dispensing pattern, the transferred Micro-LED micro-display device array is hot-pressed and cured to obtain a preliminarily cured micro-display device array;

[0112] Performing curing quality inspection and non-destructive inspection on the preliminarily cured microdisplay device array by using a preset laser scanning microscope technology to obtain curing quality evaluation data;

[0113] If the curing quality assessment data shows that curing is incomplete, performing quality assessment analysis on the curing quality assessment data to obtain a curing defect factor;

[0114] Through the preset solid crystal technology, the curing conditions of the transferred Micro-LED micro display device array are adjusted and re-cured based on the curing defect factor until the curing quality evaluation data shows that the curing is complete, thereby obtaining a Micro-LED micro display device array fixed on the target substrate.

[0115] Specifically, during the laser mass transfer process of Micro-LED micro-display devices, the array of transferred Micro-LED micro-display devices is fixed by a preset die-bonding technology to ensure that each Micro-LED micro-display device is firmly adhered to the target substrate to form a stable array of display devices. First, the material properties of the transferred Micro-LED micro-display devices and the surface properties of the target substrate are consulted from a preset database. This information includes the material and surface treatment of the Micro-LED micro-display device and the surface energy and roughness of the target substrate. For example, when producing Micro-LED displays for augmented reality (AR) glasses, understanding the material properties can help select suitable die-bonding materials to ensure the success of the die-bonding process. Based on the material properties and surface properties, a die-bonding material that matches the target substrate is selected through a preset die-bonding material selection algorithm. This operation takes into account factors such as the chemical compatibility and thermal expansion coefficient matching between the material of the Micro-LED micro-display device and the target substrate. For example, in the production of AR glasses, the selected die-bonding material needs to be able to provide sufficient adhesion without affecting the performance of the display device. Next, the selected solid crystal material is surface modified by a preset chemical modification technology to obtain a modified solid crystal material. Surface modification can enhance the adhesion between the solid crystal material and the Micro-LED micro-display device and the target substrate, and improve the reliability of solid crystal. For example, in the production of AR glasses, surface modification can ensure that the solid crystal material does not produce bubbles or uneven adhesion during the curing process. Through a preset dispensing system, the modified solid crystal material is dispensed to obtain a solid crystal material dispensing pattern. The dispensing system can accurately apply the solid crystal material to the electrodes of each Micro-LED micro-display device and the corresponding positions of the target substrate, ensuring the uniform distribution of the solid crystal material. For example, in the production of AR glasses, the accuracy of the dispensing operation directly affects the quality of the display device array. Through the preset hot-pressing bonding technology, based on the dispensing pattern of the solid crystal material, the transferred Micro-LED micro-display device array is hot-pressed and cured to obtain a preliminary cured micro-display device array. The hot-pressing bonding technology solidifies the solid crystal material and firmly fixes the Micro-LED micro-display device on the target substrate by heating and pressurizing. For example, in the production of AR glasses, hot pressing bonding ensures the electrical connection and mechanical stability between each pixel and the substrate. In order to ensure the quality of the solid crystal, the preliminary solidified micro display device array is subjected to solidification quality inspection and non-destructive inspection by the preset laser scanning microscope technology to obtain the solidification quality evaluation data. The laser scanning microscope can observe the bonding between the solid crystal material and the Micro-LED micro display device and the target substrate at the micron level. For example, in the production of AR glasses, this inspection can ensure that each pixel is firmly adhered to the substrate to prevent display problems caused by incomplete curing.If the curing quality assessment data shows that the curing is incomplete, it is necessary to perform a quality assessment analysis on the curing quality assessment data to obtain a curing defect factor. By analyzing the curing defect factor, problems that may occur during the curing process can be identified, such as improper proportioning of the solid crystal material, inaccurate temperature control, etc. For example, in the production of AR glasses, the curing defect factor can help determine whether the curing conditions need to be adjusted. Through the preset solid crystal technology, based on the curing defect factor, the transferred Micro-LED micro display device array is adjusted for curing conditions and re-cured until the curing quality assessment data shows that the curing is complete. The adjustment may include changing the proportion of the solid crystal material, adjusting the hot pressing temperature or pressure and other parameters. For example, in the production of AR glasses, this adjustment ensures the solid crystal quality of each pixel, thereby ensuring the performance and reliability of the entire display array. Through this comprehensive solid crystal technology, not only can the Micro-LED micro display device be efficiently fixed on the target substrate, but also the quality control during the solid crystal process can be ensured, ensuring the high quality and consistency of the final product. This technology makes it possible to produce high-precision display devices such as AR glasses, meeting the stringent requirements for display performance.

[0116] In a specific embodiment, the transferred Micro-LED micro display device array is subjected to hot pressing curing based on the dispensing pattern of the die-bonding material by using a preset hot pressing bonding technology to obtain a preliminarily cured micro display device array, including:

[0117] Determining a crystal bonding material parameter based on the modified crystal bonding material;

[0118] Determining a hot pressing temperature curve based on the material properties, the surface properties and the die-bonding material parameters;

[0119] The target substrate is heated based on the hot pressing temperature curve by a preset preheating device and hot pressing bonding technology to obtain a preheated target substrate;

[0120] Determine the magnitude and distribution of the pressing force based on the hot pressing temperature curve and the die-bonding material dispensing pattern through a preset pressing control algorithm to obtain pressing force parameters;

[0121] Based on the hot pressing temperature curve and the pressing force parameter, hot pressing and curing the transferred Micro-LED micro display device array to obtain a hot pressing and cured micro display device array;

[0122] Through the preset thermal imaging technology, the temperature distribution data of the hot pressing process of the hot pressing curing micro display device array is monitored in real time;

[0123] Determine whether the temperature distribution data is within a preset target temperature distribution data range, and if so, perform heat pressing curing on the transferred Micro-LED micro display device array based on the temperature distribution data to obtain a preliminarily cured micro display device array;

[0124] If not, the hot pressing temperature curve and pressing force parameters are dynamically adjusted through a preset temperature feedback adjustment algorithm to achieve uniform temperature distribution until the temperature distribution data is within the preset target temperature distribution data range, thereby obtaining a preliminarily cured micro display device array.

[0125] Specifically, in the laser mass transfer process of Micro-LED micro-display devices, curing the transferred Micro-LED micro-display device array through a preset hot-pressing bonding technology is a key step to ensure a reliable connection between the display device and the target substrate. First, the parameters of the solid crystal material are determined based on the solid crystal material. These parameters include the viscosity, curing temperature, and curing time of the solid crystal material. For example, when producing Micro-LED displays for augmented reality (AR) glasses, the parameter selection of the solid crystal material needs to take into account the material properties of the Micro-LED micro-display device and the surface properties of the target substrate to ensure that the performance of the material is optimized during the solid crystal process. Next, based on the material properties, surface properties, and solid crystal material parameters, the hot-pressing temperature curve is determined. The hot-pressing temperature curve refers to the temperature variation law during the hot-pressing process. It takes into account the curing temperature window of the solid crystal material to ensure that the Micro-LED micro-display device can be completely cured within the temperature range without damaging it. For example, in the production of AR glasses, the design of the hot-pressing temperature curve needs to take into account the heat resistance of the display device and the curing requirements of the solid crystal material. Through the preset preheating device and hot-pressing bonding technology, the target substrate is heated based on the hot-pressing temperature curve to obtain a preheated target substrate. Preheating can ensure that during the hot pressing process, the temperature of the substrate and the Micro-LED micro-display device can quickly reach the curing temperature of the solid crystal material to avoid uneven curing caused by temperature differences. For example, in the production of AR glasses, preheating can reduce the hot pressing time and improve production efficiency. Through the preset pressing control algorithm, based on the hot pressing temperature curve and the dispensing pattern of the solid crystal material, the size and distribution of the pressing force are determined to obtain the pressing force parameters. The size and distribution of the pressing force directly affect the fluidity and adhesion of the solid crystal material between the Micro-LED micro-display device and the target substrate. For example, in the production of AR glasses, precise control of the pressing force parameters can ensure that the solid crystal material is evenly distributed and avoid the generation of bubbles or voids. Based on the hot pressing temperature curve and the pressing force parameters, the transferred Micro-LED micro-display device array is hot pressed and cured to obtain a hot pressing cured micro-display device array. At this stage, the hot pressing bonding technology solidifies the solid crystal material and firmly fixes the Micro-LED micro-display device on the target substrate by heating and pressurizing. For example, in the production of AR glasses, hot pressing curing ensures the electrical connection and mechanical stability between each pixel and the substrate. The temperature distribution data of the hot pressing curing microdisplay device array during the hot pressing process is monitored in real time through the preset thermal imaging technology. Thermal imaging technology can observe the temperature distribution of the entire array from a macroscopic perspective to ensure that there are no cold spots or hot spots during the hot pressing process. For example, in the production of AR glasses, this real-time monitoring can help to promptly detect and deal with temperature unevenness during the curing process.It is determined whether the temperature distribution data is within the preset target temperature distribution data range. If so, the transferred Micro-LED micro display device array is hot-pressed and cured based on the temperature distribution data to obtain a preliminarily cured micro display device array. If the temperature distribution is within the set range, it indicates that the solid crystal material has reached the optimal curing condition, and the connection between the Micro-LED micro display device and the target substrate is reliable. For example, in the production of AR glasses, this judgment ensures the performance and display effect of the display device. If the temperature distribution data is not within the preset target temperature distribution data range, the hot pressing temperature curve and the pressing force parameters are dynamically adjusted by the preset temperature feedback adjustment algorithm to achieve uniform temperature distribution until the temperature distribution data is within the preset target temperature distribution data range. This dynamic adjustment can cope with various variables that may occur in the production process, such as ambient temperature changes, equipment performance fluctuations, etc. For example, in the production of AR glasses, the temperature feedback adjustment algorithm can ensure the curing quality of each pixel, thereby ensuring the performance and reliability of the entire display array. Through this comprehensive hot pressing bonding technology, not only can the Micro-LED micro display device be efficiently fixed on the target substrate, but also the quality control during the solid crystal process can be ensured, ensuring the high quality and consistency of the final product. This technology makes it possible to produce high-precision display devices such as AR glasses, meeting the stringent requirements for display performance.

[0126] In a specific embodiment, the electrical performance test is performed on the Micro-LED micro display device array fixed on the target substrate to obtain electrical performance parameters, and the Micro-LED micro display devices having electrical performance parameters lower than the electrical performance parameter threshold are eliminated to obtain a qualified Micro-LED micro display device array, including:

[0127] Performing parallel electrical testing on the Micro-LED micro-display device array fixed on the target substrate through a preset multi-channel electrical testing device to obtain electrical testing data;

[0128] By using a preset electrical performance parameter extraction algorithm, based on electrical test data, the key electrical performance parameters of each Micro-LED micro display device are extracted; wherein the key electrical performance parameters include threshold voltage, saturation current, and leakage current;

[0129] By using a preset statistical analysis algorithm, statistical analysis and calculation are performed on the key electrical performance parameters to obtain electrical performance distribution statistical data;

[0130] determining electrical performance parameters based on the electrical performance distribution statistical data;

[0131] Using a preset defect detection algorithm, the Micro-LED micro-display device whose electrical performance parameter is lower than a preset electrical performance parameter threshold is identified and marked to obtain the position information of the defective Micro-LED micro-display device;

[0132] Through a preset automatic rejection system, based on the position information of defective micro-display devices, Micro-LED micro-display devices with electrical performance parameter thresholds below a preset threshold are rejected from the Micro-LED micro-display device array fixed on the target substrate to obtain a qualified Micro-LED micro-display device array.

[0133] Specifically, in the laser mass transfer process of Micro-LED micro-display devices, electrical performance testing of the Micro-LED micro-display device array fixed on the target substrate is a key step to ensure the performance of each display device. First, the Micro-LED micro-display device array is electrically tested in parallel by a preset multi-channel electrical measuring device to obtain electrical test data. This test method can measure the electrical performance of multiple Micro-LED micro-display devices at the same time, thereby improving the test efficiency. For example, when producing Micro-LED displays for augmented reality (AR) glasses, the multi-channel electrical measuring device can quickly evaluate the electrical performance of each pixel to ensure the overall performance of the display array. Next, the key electrical performance parameters of each Micro-LED micro-display device are extracted based on the electrical test data through a preset electrical performance parameter extraction algorithm. These key electrical performance parameters include threshold voltage, saturation current, leakage current, etc., which directly reflect the working performance of the Micro-LED micro-display device. For example, in the production of AR glasses, extracting these parameters can ensure that the voltage and current characteristics of each pixel when working meet the design requirements. Through a preset statistical analysis algorithm, the key electrical performance parameters are statistically analyzed and calculated to obtain electrical performance distribution statistics. This statistical analysis can identify performance differences and anomalies that may exist in the array of Micro-LED micro-display devices. For example, in the production of AR glasses, statistical analysis can help identify pixels with substandard performance to ensure uniformity and consistency across the display array. Based on the statistical data of electrical performance distribution, the threshold of electrical performance parameters is determined. This threshold is set based on design requirements and statistical analysis results, and Micro-LED micro-display devices below this threshold are considered to have unqualified performance. For example, in the production of AR glasses, the setting of the threshold of electrical performance parameters ensures that the electrical performance of each pixel meets the requirements of high definition and high brightness. Through the preset defect detection algorithm, Micro-LED micro-display devices with electrical performance parameters below the preset electrical performance parameter threshold are identified and marked to obtain the location information of defective Micro-LED micro-display devices. This algorithm can automatically identify unqualified display devices and record their location information. For example, in the production of AR glasses, the defect detection algorithm can accurately locate the pixels that need to be eliminated to avoid human errors. Finally, through the preset automatic rejection system, based on the position information of the defective Micro-LED micro-display devices, the Micro-LED micro-display devices with electrical performance parameter thresholds below the preset threshold are removed from the Micro-LED micro-display device array fixed on the target substrate to obtain a qualified Micro-LED micro-display device array. The automatic rejection system ensures that each unqualified Micro-LED micro-display device is accurately removed without affecting other qualified devices through precise mechanical operations.For example, in the production of AR glasses, the automatic rejection system can ensure that only pixels with unqualified performance are rejected, and qualified pixels are retained to maintain the overall performance of the display array. Through this comprehensive electrical performance testing and rejection process, not only can the electrical performance of the Micro-LED micro-display device array be efficiently evaluated, but it can also ensure that each display device meets the set electrical performance standards, thereby ensuring the high quality and consistency of the final product. This technology makes it possible to produce high-precision display devices such as AR glasses, meeting the stringent requirements for display performance.

[0134] The above describes the method for laser mass transfer of Micro-LED micro display devices in the embodiment of the present invention. The following describes the apparatus for laser mass transfer of Micro-LED micro display devices in the embodiment of the present invention. Figure 2 In one embodiment of the present invention, a laser mass transfer device for a Micro-LED micro display device includes:

[0135] A heating device 21 is used to locally heat the Micro-LED micro display device on the growth substrate by a preset high-energy pulse laser to obtain a dissociated Micro-LED micro display device;

[0136] A photographing device 22 is used to photograph the dissociated Micro-LED micro-display device to obtain a position image of the Micro-LED micro-display device and a morphological image of the Micro-LED micro-display device;

[0137] A picking device 23 is used to pick up the dissociated Micro-LED micro display device to a target substrate based on the position of the Micro-LED micro display device and the morphological image of the Micro-LED micro display device through a preset micro-manipulation system to obtain a transferred Micro-LED micro display device array;

[0138] A fixing device 24 is used to fix the transferred Micro-LED micro display device array by a preset die bonding technology to obtain a Micro-LED micro display device array fixed on the target substrate;

[0139] The testing device 25 is used to perform an electrical performance test on the Micro-LED micro display device array fixed on the target substrate to obtain electrical performance parameters, and eliminate the Micro-LED micro display devices whose electrical performance parameters are lower than the electrical performance parameter threshold to obtain a qualified Micro-LED micro display device array.

[0140] In this embodiment, for the specific implementation of each unit in the above device embodiment, please refer to the above method embodiment, which will not be repeated here.

[0141] Reference Figure 3 The present invention also provides a computer device in an embodiment, wherein the internal structure of the computer device can be as follows: Figure 3 As shown. The computer device includes a processor, a memory, a display screen, an input device, a network interface and a database connected through a system bus. Among them, the processor designed by the computer is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store the corresponding data in this embodiment. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, the above method is implemented.

[0142] Those skilled in the art will understand that Figure 3 The structure shown in the figure is merely a block diagram of a portion of the structure related to the solution of the present invention, and does not constitute a limitation on the computer device to which the solution of the present invention is applied.

[0143] An embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored, and when the computer program is executed by a processor, the above method is implemented. It can be understood that the computer-readable storage medium in this embodiment can be a volatile readable storage medium or a non-volatile readable storage medium.

[0144] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media provided by the present invention and used in the embodiments may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double-speed data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM.

[0145] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0146] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for laser mass transfer of Micro-LED micro display devices, characterized in that: The following steps are involved: Locally heating the Micro-LED micro-display device on the growth substrate by a preset high-energy pulse laser to obtain a dissociated Micro-LED micro-display device; Photographing the dissociated Micro-LED micro-display device to obtain a position image of the Micro-LED micro-display device and a morphological image of the Micro-LED micro-display device; By using a preset micro-manipulation system, the dissociated Micro-LED micro-display device is picked up onto a target substrate based on the position of the Micro-LED micro-display device and the morphological image of the Micro-LED micro-display device, to obtain a transferred Micro-LED micro-display device array; Fixing the transferred Micro-LED micro display device array by a preset die bonding technology to obtain a Micro-LED micro display device array fixed on a target substrate; Performing an electrical performance test on the Micro-LED micro display device array fixed on the target substrate to obtain electrical performance parameters, and removing the Micro-LED micro display devices whose electrical performance parameters are lower than the electrical performance parameter threshold to obtain a qualified Micro-LED micro display device array; The method of locally heating the Micro-LED micro-display device on the growth substrate by a preset high-energy pulse laser to obtain a dissociated Micro-LED micro-display device comprises: Performing multi-dimensional parameter optimization on a preset high-energy pulse laser through a preset laser parameter optimization algorithm to obtain optimal laser parameters; wherein the multi-dimensional parameters include laser energy, pulse width and repetitive laser frequency; Performing surface micro-nanostructuring treatment on the growth substrate by using a preset laser etching technology to obtain a surface-modified growth substrate; Based on the optimal laser parameters, the high-energy pulse laser is controlled to locally heat the Micro-LED micro display device on the surface-modified growth substrate to obtain a heating area; The temperature distribution of the heating area is simulated by a preset thermodynamic simulation algorithm to obtain a temperature field distribution diagram; Based on the temperature field distribution diagram, the high-energy pulse laser output by the high-energy pulse laser is adjusted in real time; wherein the high-energy pulse laser is used to ensure that the temperature in the heating area is stable within a preset dissociation temperature range to obtain a heating area with stable temperature; Using the temperature-stable heating area, dissociating the Micro-LED micro-display device to obtain a dissociated Micro-LED micro-display device; The step of photographing the dissociated Micro-LED micro-display device to obtain a position image of the Micro-LED micro-display device and a morphological image of the Micro-LED micro-display device includes: The dissociated Micro-LED micro-display device is photographed at multiple angles by a preset three-dimensional microscopic imaging technology to obtain a three-dimensional morphological image; Performing background removal and noise filtering on the three-dimensional morphological image by using a preset image processing algorithm to obtain preprocessed image data; Performing image data segmentation on the preprocessed image data to obtain an independent image of a single Micro-LED micro display device; Inputting the single independent image into a preset geometric feature extraction algorithm to extract the position and geometric parameters of the micro-display device, and obtaining the two-dimensional coordinate position of the Micro-LED micro-display device and the morphological feature parameters of the Micro-LED micro-display device; The two-dimensional coordinate positions and the morphological characteristic parameters at multiple angles are spatially registered by a preset image registration algorithm to obtain a registered micro-display device position and a registered morphological image; The registered micro-display device position and the registered morphological image are optically corrected by a preset image correction algorithm to obtain a Micro-LED micro-display device position and a Micro-LED micro-display device morphological image; wherein the Micro-LED micro-display device position is a three-dimensional coordinate position; The method of picking up the dissociated Micro-LED micro-display device onto a target substrate based on the position of the Micro-LED micro-display device and the morphological image of the Micro-LED micro-display device by a preset micro-manipulation system to obtain a transferred Micro-LED micro-display device array includes: Obtaining a target substrate position corresponding to the target substrate from a preset database, and generating path planning data based on the target substrate position, the Micro-LED micro-display device position and the Micro-LED micro-display device morphology image through a preset path planning algorithm; Controlling a micro-manipulation system based on the path planning data, and picking up the dissociated Micro-LED micro-display device through the micro-manipulation system to obtain a Micro-LED micro-display device in an initial picking state; When the Micro-LED micro-display device in the initial picking state is not within the preset picking control range, the path planning data is adjusted in real time through the feedback mechanism in the micro-control system to obtain force feedback data; Optimizing the picking process of the micro-manipulation system based on the force feedback data and the path planning data to obtain optimized picking parameters; The micro-manipulation system is controlled based on the optimized picking parameters to pick up the dissociated Micro-LED micro-display device onto a target substrate to obtain a transferred Micro-LED micro-display device array.

2. The method for laser mass transfer of Micro-LED micro display devices according to claim 1, characterized in that: The method of fixing the transferred Micro-LED micro display device array by a preset die bonding technology to obtain a Micro-LED micro display device array fixed on a target substrate includes: Searching the material properties of the transferred Micro-LED micro display device and the surface properties of the target substrate from a preset database; Selecting a die-bonding material corresponding to the target substrate based on the material properties and the surface properties by using a preset die-bonding material selection algorithm; Performing surface modification on the solid crystal material by a preset chemical modification technology to obtain a modified solid crystal material; Performing a dispensing operation on the modified die-bonding material through a preset dispensing system to obtain a dispensing pattern of the die-bonding material; Through a preset hot-pressing bonding technology, based on the die-bonding material dispensing pattern, the transferred Micro-LED micro-display device array is hot-pressed and cured to obtain a preliminarily cured micro-display device array; Performing curing quality inspection and non-destructive inspection on the preliminarily cured microdisplay device array by using a preset laser scanning microscope technology to obtain curing quality evaluation data; If the curing quality assessment data shows that curing is incomplete, performing quality assessment analysis on the curing quality assessment data to obtain a curing defect factor; Through the preset solid crystal technology, the curing conditions of the transferred Micro-LED micro display device array are adjusted and re-cured based on the curing defect factor until the curing quality evaluation data shows that the curing is complete, thereby obtaining a Micro-LED micro display device array fixed on the target substrate.

3. The method for laser mass transfer of Micro-LED micro display devices according to claim 2, characterized in that: The method of heat-pressing and curing the transferred Micro-LED micro-display device array based on the dispensing pattern of the die-bonding material by using the preset heat-pressing bonding technology to obtain a preliminarily cured micro-display device array includes: Determining a crystal bonding material parameter based on the modified crystal bonding material; Determining a hot pressing temperature curve based on the material properties, the surface properties and the die-bonding material parameters; The target substrate is heated based on the hot pressing temperature curve by a preset preheating device and hot pressing bonding technology to obtain a preheated target substrate; Determine the magnitude and distribution of the pressing force based on the hot pressing temperature curve and the die-bonding material dispensing pattern through a preset pressing control algorithm to obtain pressing force parameters; Based on the hot pressing temperature curve and the pressing force parameter, hot pressing and curing the transferred Micro-LED micro display device array to obtain a hot pressing and cured micro display device array; Through the preset thermal imaging technology, the temperature distribution data of the hot pressing process of the hot pressing curing micro display device array is monitored in real time; Determine whether the temperature distribution data is within a preset target temperature distribution data range, and if so, perform heat pressing curing on the transferred Micro-LED micro display device array based on the temperature distribution data to obtain a preliminarily cured micro display device array; If not, the hot pressing temperature curve and pressing force parameters are dynamically adjusted through a preset temperature feedback adjustment algorithm to achieve uniform temperature distribution until the temperature distribution data is within the preset target temperature distribution data range, thereby obtaining a preliminarily cured micro display device array.

4. The method for laser mass transfer of Micro-LED micro display devices according to claim 1, characterized in that: The electrical performance test is performed on the Micro-LED micro display device array fixed on the target substrate to obtain electrical performance parameters, and the Micro-LED micro display devices having electrical performance parameters lower than the electrical performance parameter threshold are eliminated to obtain a qualified Micro-LED micro display device array, including: Performing parallel electrical testing on the Micro-LED micro-display device array fixed on the target substrate through a preset multi-channel electrical testing device to obtain electrical testing data; By using a preset electrical performance parameter extraction algorithm, based on electrical test data, the key electrical performance parameters of each Micro-LED micro display device are extracted; wherein the key electrical performance parameters include threshold voltage, saturation current, and leakage current; By using a preset statistical analysis algorithm, statistical analysis and calculation are performed on the key electrical performance parameters to obtain electrical performance distribution statistical data; determining electrical performance parameters based on the electrical performance distribution statistical data; Using a preset defect detection algorithm, the Micro-LED micro-display device whose electrical performance parameter is lower than a preset electrical performance parameter threshold is identified and marked to obtain the position information of the defective Micro-LED micro-display device; Through a preset automatic rejection system, based on the position information of defective micro-display devices, Micro-LED micro-display devices with electrical performance parameter thresholds below a preset threshold are rejected from the Micro-LED micro-display device array fixed on the target substrate to obtain a qualified Micro-LED micro-display device array.

5. A laser mass transfer device for Micro-LED micro display device, characterized in that: include: A heating device, used to locally heat the Micro-LED micro-display device on the growth substrate by a preset high-energy pulse laser to obtain a dissociated Micro-LED micro-display device; A photographing device, used to photograph the dissociated Micro-LED micro-display device to obtain a position image of the Micro-LED micro-display device and a morphological image of the Micro-LED micro-display device; A picking device, used to pick up the dissociated Micro-LED micro-display device onto a target substrate based on the position of the Micro-LED micro-display device and the morphological image of the Micro-LED micro-display device through a preset micro-manipulation system to obtain a transferred Micro-LED micro-display device array; A fixing device, used to fix the transferred Micro-LED micro display device array by a preset die bonding technology to obtain a Micro-LED micro display device array fixed on a target substrate; A testing device, used to perform an electrical performance test on the Micro-LED micro display device array fixed on the target substrate to obtain electrical performance parameters, and remove the Micro-LED micro display devices whose electrical performance parameters are lower than the electrical performance parameter threshold to obtain a qualified Micro-LED micro display device array; The method of locally heating the Micro-LED micro-display device on the growth substrate by a preset high-energy pulse laser to obtain a dissociated Micro-LED micro-display device comprises: Performing multi-dimensional parameter optimization on a preset high-energy pulse laser through a preset laser parameter optimization algorithm to obtain optimal laser parameters; wherein the multi-dimensional parameters include laser energy, pulse width and repetitive laser frequency; Performing surface micro-nanostructuring treatment on the growth substrate by using a preset laser etching technology to obtain a surface-modified growth substrate; Based on the optimal laser parameters, the high-energy pulse laser is controlled to locally heat the Micro-LED micro display device on the surface-modified growth substrate to obtain a heating area; The temperature distribution of the heating area is simulated by a preset thermodynamic simulation algorithm to obtain a temperature field distribution diagram; Based on the temperature field distribution diagram, the high-energy pulse laser output by the high-energy pulse laser is adjusted in real time; wherein the high-energy pulse laser is used to ensure that the temperature in the heating area is stable within a preset dissociation temperature range to obtain a heating area with stable temperature; Using the temperature-stable heating area, dissociating the Micro-LED micro-display device to obtain a dissociated Micro-LED micro-display device; The step of photographing the dissociated Micro-LED micro-display device to obtain a position image of the Micro-LED micro-display device and a morphological image of the Micro-LED micro-display device includes: The dissociated Micro-LED micro-display device is photographed at multiple angles by a preset three-dimensional microscopic imaging technology to obtain a three-dimensional morphological image; Performing background removal and noise filtering on the three-dimensional morphological image by using a preset image processing algorithm to obtain preprocessed image data; Performing image data segmentation on the preprocessed image data to obtain an independent image of a single Micro-LED micro display device; Inputting the single independent image into a preset geometric feature extraction algorithm to extract the position and geometric parameters of the micro-display device, and obtaining the two-dimensional coordinate position of the Micro-LED micro-display device and the morphological feature parameters of the Micro-LED micro-display device; The two-dimensional coordinate positions and the morphological characteristic parameters at multiple angles are spatially registered by a preset image registration algorithm to obtain a registered micro-display device position and a registered morphological image; The registered micro-display device position and the registered morphological image are optically corrected by a preset image correction algorithm to obtain a Micro-LED micro-display device position and a Micro-LED micro-display device morphological image; wherein the Micro-LED micro-display device position is a three-dimensional coordinate position; The method of picking up the dissociated Micro-LED micro-display device onto a target substrate based on the position of the Micro-LED micro-display device and the morphological image of the Micro-LED micro-display device by a preset micro-manipulation system to obtain a transferred Micro-LED micro-display device array includes: Obtaining a target substrate position corresponding to the target substrate from a preset database, and generating path planning data based on the target substrate position, the Micro-LED micro-display device position and the Micro-LED micro-display device morphology image through a preset path planning algorithm; Controlling a micro-manipulation system based on the path planning data, and picking up the dissociated Micro-LED micro-display device through the micro-manipulation system to obtain a Micro-LED micro-display device in an initial picking state; When the Micro-LED micro-display device in the initial picking state is not within the preset picking control range, the path planning data is adjusted in real time through the feedback mechanism in the micro-control system to obtain force feedback data; Optimizing the picking process of the micro-manipulation system based on the force feedback data and the path planning data to obtain optimized picking parameters; The micro-manipulation system is controlled based on the optimized picking parameters to pick up the dissociated Micro-LED micro-display device onto a target substrate to obtain a transferred Micro-LED micro-display device array.

6. A computer device comprising a memory and a processor, wherein a computer program is stored in the memory, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 4 are implemented.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 4 are implemented.

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