Laser cutting optimization control method for intelligent manufacturing of display

Abstract

The invention relates to the technical field of laser cutting, in particular to a laser cutting optimization control method for intelligent manufacturing of a display, which comprises the following steps: predicting a next cutting position according to an interference factor of each cutting position; determining the target power of the supplementing position according to a power adjustment model; correcting the power adjustment model according to the interference factor of the supplementing position before the target position, and determining the target power of the target position; and according to the corrected power adjustment model, obtaining the predicted power of the supplementing position before the target position, and according to the predicted power of the supplementing position before the target position and the initial power of the cutting position, obtaining the predicted power of the target position. And obtaining the power of the target position when the defect line is cut according to the target power of the target position and the predicted power. A large number of defect lines can be closely distributed on the cutting path, the situation of obvious overheating influence is avoided, and all parts of glass assemblies of the glass plate can be easily and neatly separated.

Description

Technical Field

[0001] The present invention relates to the field of laser cutting technology, and in particular to a laser cutting optimization control method for intelligent manufacturing of displays. Background Art

[0002] Glass plates (such as glass substrates, light guide plates, etc.) are important raw materials for making displays. Glass plates often need to be laser cut to obtain glass components suitable for making displays. When laser cutting glass plates, in order to avoid the formation of overheating areas on the glass surface by highly concentrated laser energy, which will cause overheating to the brittle glass material, it is often necessary to cut a large number of defect lines on the glass plates at a certain interval. The defect lines are perpendicular to the upper and lower surfaces of the glass substrate, and then additional separation force is applied to the glass plates to separate the glass components neatly along the defect lines.

[0003] However, in the actual cutting process, it is difficult to accurately control the spacing of the defect lines when cutting the defect lines. If the spacing is too small, an overheating area will still be formed on the glass surface, which will cause overheating to the brittle glass material. When the glass components are separated by applying additional separation force, on the one hand, the glass components may not be separated neatly along the defect lines, and on the other hand, the light transmission effect of the glass material may be affected. When the spacing is too large, when the glass components are separated by applying additional separation force, due to the lack of densely distributed defect lines, the glass components may not be separated neatly along the defect lines, and even the glass components cannot be separated directly or may be slightly damaged, affecting the light transmission effect of the glass material and the subsequent display manufacturing process. Summary of the invention

[0004] In order to solve the above problems, the present invention provides a laser cutting optimization control method for intelligent manufacturing of displays.

[0005] The laser cutting optimization control method for display intelligent manufacturing of the present invention adopts the following technical solutions:

[0006] An embodiment of the present invention provides a laser cutting optimization control method for display intelligent manufacturing, the method comprising the following steps:

[0007] The laser cutter cuts the glass plate for manufacturing the display along a cutting path at a preset initial power, and cuts a defect line at each cutting position on the cutting path, wherein the defect line is perpendicular to the upper and lower surfaces of the glass substrate;

[0008] After a defect line is cut out at each cutting position, an interference factor of each cutting position is obtained according to the interference of two adjacent defect lines on the optical signal, the next cutting position is predicted according to the interference factor, and a defect line is cut out at the predicted next cutting position; and so on, until the first cutting process is completed along the cutting path;

[0009] A supplementary position is determined between every two adjacent cutting positions, and a target power of the first supplementary position is determined according to a power adjustment model; the power adjustment model of the supplementary position is obtained by the interference factor of the cutting position adjacent to the supplementary position and the initial power; the target power determined by the power adjustment model is negatively correlated with the difference in the interference factor of the adjacent cutting position;

[0010] The defect line of the first supplementary position is cut according to the target power, and the supplementary position after the first supplementary position is recorded as the target position; when cutting the defect line at the target position, the power adjustment model is first corrected according to the interference factor of any supplementary position before the target position, and then the target power of the target position is determined using the corrected power adjustment model; the target power of the supplementary position before the target position is re-obtained according to the corrected power adjustment model, and recorded as predicted power, the predicted power of the target position is obtained according to the predicted power of the supplementary position before the target position and the initial power of the cutting position, and finally the power of the target position when cutting the defect line is obtained according to the target power of the target position and the predicted power of the target position.

[0011] Preferably, the step of obtaining the interference factor of each cutting position according to the interference of two adjacent defective lines on the optical signal comprises the following specific steps:

[0012] Before cutting a defect line at each cutting position, the light intensity a1 of the light signal after passing through the glass plate perpendicular to the side of the glass plate is obtained. After cutting a defect line at each cutting position, the light intensity a2 of the light signal after passing through the glass plate perpendicular to the side of the glass plate is obtained. |a1-a2| / (a1+a2) is recorded as the interference factor of each cutting position; || represents the absolute value sign.

[0013] Preferably, the predicting the next cutting position according to the interference factor comprises the following specific steps:

[0014] The cutting position where the defect line is cut most recently is recorded as the current cutting position, and the distance between the current cutting position and the previous cutting position is recorded as D. Assuming that the distance between the next cutting position and the current cutting position is D1, let D1 = (1 + K1) × D;

[0015] The method for obtaining K1 is as follows: the interference factor of the current cutting position is recorded as w1, when w1 is less than the first preset threshold, K1 is linearly correlated with (w1-1); when w1 is greater than or equal to the first preset threshold th1, K1=w1;

[0016] The next cutting position is determined by D1.

[0017] Preferably, the power adjustment model of the supplementary position is obtained by the interference factor of the cutting position adjacent to the supplementary position and the initial power, and includes the following specific steps:

[0018] For any supplementary position x, the power factor w2(x) at the supplementary position x is obtained, and the power factor w2(x) is positively correlated with the difference in interference factors between two cutting positions adjacent to the supplementary position;

[0019] The power adjustment model P1(x) represents the target power at the additional position x, P1(x) = (K2(x) + y) × P0, where P0 represents the initial power; y is the offset coefficient, and the initial value of y is a preset value; K2(x) represents the adjustment amplitude of P0 at the additional position x, and K2(x) is negatively correlated with w2(x).

[0020] Preferably, the power adjustment model is corrected according to the interference factor of any additional position before the target position, and the specific steps include the following:

[0021] The set of all the additional positions before the target position is recorded as S, and any additional position in S is recorded as position x1, x1∈s; the power factor at position x1 is recorded as w2(x1); the laser power used when cutting the defect line at position x1 is recorded as P(x1), and the offset coefficient y in the power adjustment model is regarded as a variable, and w2(x1) is brought into the power adjustment model to obtain the target power of position x1, which is recorded as P1(x1, y), indicating the target power obtained after the power adjustment model is corrected using the offset coefficient y at position x1;

[0022] According to the difference between P1(x1, y) and P(x1) and the interference factor at position x1, the corrected deviation amplitude of the power adjustment model is obtained, and the corrected deviation amplitude is positively correlated with the difference between P1(x1, y) and P(x1), and negatively correlated with the interference factor at position x1; the offset coefficient y with the minimum corrected deviation amplitude is obtained, recorded as the final offset coefficient y0, and the offset coefficient y in the power adjustment model is replaced by y0 to obtain the corrected power adjustment model.

[0023] Preferably, the correction deviation amplitude of the power adjustment model is obtained according to the difference between P1(x1, y) and P(x1) and the interference factor at the position x1, and the specific formula included is as follows:

[0024]

[0025] Where f(x1) represents the interference factor at position x1, F represents the correction deviation amplitude of the power adjustment model, and || represents the absolute value sign.

[0026] Preferably, the step of obtaining the predicted power of the target position according to the predicted power of the supplementary position before the target position and the initial power of the cutting position comprises the following specific steps:

[0027] The additional position before the target position is recorded as the reference position, and the predicted power of the additional position before the target position is recorded as the predicted power of the reference position;

[0028] For the initial powers of all cutting positions in the first cutting process and the predicted powers of all reference positions, the cutting positions and reference positions are called sampling points, each initial power or predicted power is recorded as a first power, and the coordinates of each sampling point and the first power constitute a cutting feature;

[0029] On the cutting path, the sampling points are traversed in sequence until the cutting position before the target position is traversed. The cutting features of all the obtained sampling points form a cutting feature sequence, and the cutting power of the target position is predicted according to the cutting feature sequence, which is recorded as the predicted power of the target position.

[0030] Preferably, the power of the target position when cutting the defect line is equal to the average of the target power of the target position and the predicted power of the target position.

[0031] Preferably, the specific steps for obtaining the power factor w2(x) are as follows:

[0032] The absolute value of the difference between the interference factors of the two adjacent cutting positions of the supplementary position x is obtained, and the ratio of the absolute value to the distance between the two cutting positions is recorded as the initial power factor of the supplementary position x. The initial power factors of all supplementary positions are linearly normalized, and the normalized initial power factor is recorded as the power factor w2(x).

[0033] Preferably, the specific steps for obtaining the adjustment range of P0 at the additional position x are as follows:

[0034] When w2(x) is greater than or equal to the second preset threshold, K2(x)=1-w2(x); when w2 is less than the second preset threshold th2, K2(x)=1-y.

[0035] The beneficial effects of the technical solution of the present invention are:

[0036] After the defect line is cut out at each cutting position, the interference factor of each cutting position is obtained according to the interference of two adjacent defect lines on the optical signal, the next cutting position is predicted according to the interference factor, and a defect line is cut out at the predicted next cutting position; and so on, until the first cutting process is completed along the cutting path. This process allows the laser to cut at a constant initial power, and continuously predicts the next cutting position based on the overheating effect of the last defect line cutting, thus avoiding obvious overheating effects to a certain extent.

[0037] Furthermore, the present invention corrects the power adjustment model according to the interference factor of any additional position before the target position, and then uses the corrected power adjustment model to determine the target power of the target position, so that the target power has appropriate power when cutting the defective line at the additional position, reducing the problem of obvious overheating.

[0038] Furthermore, the target power of the target position is determined using the modified power adjustment model; the predicted power of the additional position before the target position is reacquired according to the modified power adjustment model, the predicted power of the target position is acquired according to the predicted power of the additional position before the target position and the initial power of the cutting position, and finally the power of the target position when cutting the defective line is acquired according to the target power of the target position and the predicted power of the target position. This process obtains the target power of the target position by continuously modifying the power adjustment model, and reacquires the predicted power of the reference position using the modified power adjustment model, and further combines the position-power distribution relationship between the cutting position and the reference position during the first cutting process, and finally obtains the cutting power at the target position, avoiding the problem that the modified power adjustment cannot always approach or stabilize at the appropriate cutting power, and finally makes it possible to distribute a large number of defective lines closely on the cutting path, while avoiding the situation where there is a significant overheating effect. It makes it easy to neatly separate the glass components of the glass plate, and avoids the influence of the cut glass components on the display manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0040] Figure 1 A flowchart of the steps of a laser cutting optimization control method for display intelligent manufacturing provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0041] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following is a detailed description of the laser cutting optimization control method for display intelligent manufacturing proposed by the present invention, its specific implementation method, structure, features and effects, in combination with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "another embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures or characteristics in one or more embodiments may be combined in any suitable form.

[0042] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

[0043] The specific scheme of the laser cutting optimization control method for display intelligent manufacturing provided by the present invention is described in detail below with reference to the accompanying drawings.

[0044] See also Figure 1 , which shows a laser cutting optimization control method for display intelligent manufacturing provided by an embodiment of the present invention, the method comprising the following steps:

[0045] Step S001: A laser cutter cuts a glass plate for manufacturing a display along a cutting path at a preset initial power, and cuts a defect line at each cutting position on the cutting path.

[0046] When manufacturing a display, it is often necessary to perform laser cutting on a glass plate (such as a glass substrate, a light guide plate, etc.) used to manufacture the display, so that the cut glass plate has a desired size or shape.

[0047] The glass plate used in this embodiment is in a rectangular shape, which is easy to process and fix.

[0048] When the laser head of the laser cutter cuts the glass plate along a pre-set cutting path, the highly concentrated laser energy may form an overheated area on the glass surface, causing overheating to the brittle glass material. In order to solve this problem, during laser cutting, it is necessary to cut a defect line at a certain interval on the cutting path, and the defect line is perpendicular to the upper and lower surfaces of the glass substrate; when the cutting is completed, a large number of defect lines are distributed on the cutting path, and then the glass components are separated by applying additional separation force, for example, allowing the CO2 laser to irradiate along the cutting path and generate thermal stress, so that the glass components are separated along the defect lines on the cutting path.

[0049] However, if the spacing of the defect lines on the cutting path is not set properly, for example, if the spacing is too small, the heat generated by the defect lines in the local area will be concentrated, which will still cause overheating to the brittle glass material. When the glass components are subsequently separated by applying additional separation force, the glass components may not be separated neatly along the defect lines, which in turn affects the light transmission effect of the glass material. When the spacing is too large, when the glass components are subsequently separated by applying additional separation force, due to the lack of densely distributed defect lines, the glass components may not be separated neatly along the defect lines, or even the glass components may not be separated directly or may be slightly damaged (such as broken edges or cracks), which affects the light transmission effect of the glass material and the subsequent display manufacturing process.

[0050] In this embodiment, the laser head of the laser cutter cuts a defect line after each movement of a certain distance L0 along the cutting path, wherein the position of the laser head after each movement of the distance L0 is recorded as the cutting position. The laser head emits an ultrashort pulse laser at a certain power, and the ultrashort pulse laser is vertically injected from the upper surface of the glass plate at the cutting position, and forms a defect line in the glass plate. The power used in this embodiment just ensures that the laser can penetrate the upper and lower surfaces of the glass plate, and this power is recorded as the initial power. In other embodiments, the initial power can be set to other values.

[0051] In this embodiment, T0=10 micrometers. In other embodiments, T0 may be set to other values, which are not specifically limited in this embodiment.

[0052] Step S002: After a defect line is cut out at each cutting position, an interference factor of each cutting position is obtained according to interference of two adjacent defect lines on the optical signal.

[0053] In this embodiment, a strip light source (for example, a strip LED light source) is attached to two adjacent edges of the glass plate. The light beam generated by the strip light source is incident into the glass plate perpendicular to the side of the glass plate (the propagation direction of the light beam is parallel to the upper and lower surfaces of the glass plate). At the same time, a strip light intensity sensor is attached to the other two adjacent edges of the glass plate. The light intensity sensor is used to detect the light intensity of the light beam emitted from each position on the strip light source after passing through the glass plate.

[0054] Before each cutting position cuts out a defect line, the sum of the light intensities a1 obtained at all positions of the strip light intensity sensor is obtained. After each cutting position cuts out a defect line, the sum of the light intensities a2 obtained at all positions of the strip light intensity sensor is obtained. |a1-a2| / (a1+a2) is recorded as the interference factor of each cutting position. || indicates the absolute value symbol.

[0055] In other embodiments, each position on the strip light source emits a laser signal of a certain frequency (for example, 10 kHz), and the light signal received at each position on the strip light intensity sensor obtains a receiving frequency through a waveform counter; before each cutting position cuts a defect line, the sum b1 of the receiving frequencies of all positions of the strip light intensity sensor is obtained; after each cutting position cuts a defect line, the sum b2 of the receiving frequencies of all positions of the strip light intensity sensor is obtained, and |b1-b2| / (b1+b2) is recorded as the interference factor of each cutting position.

[0056] The interference factor of each cutting position is used to describe the obstruction of the conduction of the optical signal (such as light intensity or frequency) in the glass plate before and after the defect line is cut. The larger the interference factor, the more serious the obstruction, which means that when cutting the defect line at each cutting position, the overheating effect caused by the small spacing is more serious. When the interference factor is smaller (or equal to 0), it means that the overheating effect is less serious (or the overheating effect can be ignored), and the spacing is more appropriate or may be too large.

[0057] Step S003, predicting the next cutting position according to the interference factor, and cutting a defect line at the predicted next cutting position; and so on, until the first cutting process is completed along the cutting path.

[0058] After at least two defective lines are cut, the cutting position where the defective line was cut most recently is recorded as the current cutting position, and the distance between the current cutting position and the previous cutting position is recorded as D. Assuming that the distance between the next cutting position and the current cutting position is D1, let D1 = (1+K1)×D.

[0059] The method for obtaining K1 is as follows: the interference factor of the current cutting position is recorded as w1, when w1 is less than the first preset threshold th1, K1=0.3×(w1-1); when w1 is greater than or equal to the first preset threshold th1, K1=w1.

[0060] This embodiment is described by taking th1=0.1 as an example. In other embodiments, th1 may be set to other values, which are not specifically limited in this embodiment.

[0061] The above formula uses the interference factor of the current cutting position to predict the next cutting position. When w1 is larger, it means that the overheating effect after cutting the defective line at the current cutting position is more serious and the spacing is too small, so the spacing D1 of the next cutting position is larger. When w1 is smaller, it means that the overheating effect after cutting the defective line at the current cutting position is less serious. If w1 is less than th1, it means that the overheating effect can be ignored. At this time, D1 becomes smaller than D, in order to avoid too large spacing between cutting positions.

[0062] In some other embodiments, the method for obtaining the distance D1 between the next cutting position and the current cutting position further includes:

[0063]

[0064] Wherein n is a preset integer. This embodiment is described by taking n=5 as an example. In other embodiments, n may be set to other values.

[0065] In the other embodiments mentioned above, nonlinearity is introduced to avoid the underfitting problem of the spacing D1. Compared with other embodiments, this embodiment introduces a linear relationship and uses interference factors to predict the next cutting position, which has a faster calculation speed and is suitable for fast cutting scenarios.

[0066] After obtaining D1, the laser head moves a distance of D1 from the current cutting position along the cutting path to the next cutting position, cuts a defect line at the cutting position, and obtains the interference factor at the position.

[0067] According to the method of this step, and so on, the cutting process is completed, and this cutting process is recorded as the first cutting process.

[0068] Step S004, determining a supplementary position between every two adjacent cutting positions, and determining the target power of the first supplementary position according to the power adjustment model; the power adjustment model of the supplementary position is obtained by the interference factor of the cutting position adjacent to the supplementary position and the initial power.

[0069] In the first cutting process mentioned above, cutting is performed at a constant power (i.e., initial power), and the spacing of defect lines is adjusted in real time to avoid serious overheating of the glass sheet during the cutting process. Although cutting at a constant initial power can avoid serious overheating to a certain extent, cutting at a constant initial power will result in the defect lines at all cutting positions being not densely distributed (or in other words, the density of defect line distribution is sacrificed to avoid serious overheating), which affects the subsequent neat separation process of the glass components.

[0070] Furthermore, in this embodiment, a supplementary position is determined between every two adjacent cutting positions. The second cutting process in this embodiment is to cut out defective lines at all the supplementary positions.

[0071] As an example, the additional position is the midpoint between two adjacent cutting positions.

[0072] Furthermore, a power adjustment model is obtained according to the interference factor of the cutting position adjacent to the supplementary position and the initial power, and then the target power of the first supplementary position is determined according to the power adjustment model.

[0073] As a preferred example, the method of determining the target power of the first additional position according to the power adjustment model includes:

[0074] For any additional position x; obtain two adjacent cutting positions on the left and right sides of the additional position x, obtain the absolute value of the difference between the interference factors of the two cutting positions, and record the ratio of the absolute value to the distance between the two cutting positions as the initial power factor of the additional position x. This embodiment linearly normalizes the initial power factors of all additional positions, the purpose of which is to eliminate the dimension of the initial power factor. The normalized initial power factor is recorded as the power factor w2(x). The larger the power factor, the greater the overheating effect after cutting in a smaller local range during the cutting process, which means that the cutting power in this local range (that is, at the additional position x) needs to be adjusted more significantly.

[0075] The target power at the supplementary position x is P1(x)=(K2(x)+y)×P0, where P0 represents the initial power described in step S001. y is an offset coefficient, and its initial value is 0.

[0076] Wherein K2(x) represents the adjustment amplitude of P0 at the additional position x, and the method for obtaining K2(x) is: when w2(x) is greater than or equal to the second preset threshold th2, K2(x)=1-w2(x); when w2 is less than the second preset threshold th2, K2(x)=1-y.

[0077] The above P1(x) represents the power adjustment model. When the power factor w2(x) at the supplementary position x is larger, it means that when the initial power P0 is used for cutting, a larger overheating effect change is more likely to occur in the local range. At this time, the target power at the supplementary position x is adjusted smaller. When the power factor w2(x) at the supplementary position x is smaller, it means that when the initial power P0 is used for cutting, no obvious overheating effect change occurs in the local range. When w2(x) is less than th2, it means that the overheating effect change can be ignored. At this time, the target power P1 = P0, which can make the laser head have enough power to penetrate the glass plate.

[0078] This embodiment is described by taking th2=0.1 as an example. In other embodiments, th2 may be set to other values, which are not specifically limited in this embodiment.

[0079] The target power P1(x) obtained by adding the power factor w2(x) at the position x represents the power adjustment model.

[0080] The target power of the first supplementary position according to the power adjustment model is denoted as P1(1).

[0081] As another example, a method of determining the target power of the first supplementary position according to the power adjustment model includes:

[0082] Let the target power at the additional position x be

[0083] In the above-mentioned another example, nonlinearity is introduced to avoid the under-fitting problem of P1(x). Compared with the other example, the preferred example introduces a linear relationship and uses the power factor to construct a power adjustment model, which has a faster calculation speed and is suitable for fast cutting scenarios.

[0084] Furthermore, after the target power P1(1) of the first supplementary position is obtained, the defective line is cut at the first supplementary position with the target power P1(1).

[0085] Step S005, the supplementary position after the first supplementary position is recorded as the target position; when cutting the defect line at the target position, first correct the power adjustment model according to the interference factor of any supplementary position before the target position, and then use the corrected power adjustment model to determine the target power of the target position.

[0086] The power adjustment model is corrected according to the interference factor of the supplementary position before the target position, with the aim of having appropriate cutting power when cutting the defect line at each subsequent supplementary position (for example, at the second supplementary position or other subsequent supplementary positions), so as to avoid further overheating of the glass sheet when supplementing the defect line.

[0087] As an example, the power adjustment model is modified according to the interference factor of the additional position before the target position, including the method of:

[0088] The set of all the additional positions before the target position is denoted as S, and any additional position in S is denoted as position x1, that is, x1∈S, and the power factor at position x1 is denoted as w2(x1). The laser power P(x1) used when cutting the defect line at position x1 is obtained, and the offset coefficient y in the above power adjustment model is regarded as a variable (that is, as an unknown number), and w2(x1) is substituted into the power adjustment model to obtain the target power of position x1 as P1(x1, y). At this time, the obtained P1(x1, y) is a function model of the offset coefficient y, which represents the target power obtained after the power adjustment model is corrected using the offset coefficient y.

[0089] Let F = ∑ x1∈S(1-f(x1))×|P(x1)-P1(x1, y)|, where F represents the correction deviation amplitude of the power adjustment model, where P1(x1, y) represents the target power obtained after correcting the power adjustment model at position x1 using the offset coefficient y, and |P1(x1)-P1(x1, y)| represents the error between the target power obtained after correction and the target power when cutting the defective line.

[0090] f(x1) represents the interference factor of position x1 (the acquisition method is the same as step S002). The smaller f(x1) is, the smaller the overheating effect caused by cutting the defect line at position x1 with power P1(x1). At this time, more attention should be paid to |P1(x1)-P1(x1, y)|, so as to make the target power obtained after correction approach P1(x1). The larger f(x1) is, the greater the overheating effect caused by cutting the defect line at position x1 with power P1(x1). At this time, less attention should be paid to |P1(x1)-P1(x1, y)|, so as to avoid the target power obtained after correction approaching P1(x1).

[0091] Obtain the offset coefficient y when F is the smallest, and record it as the final offset coefficient y0. Replace the offset coefficient in the above power adjustment model with y0 to obtain a modified power adjustment model.

[0092] The power factor of the target position is obtained, and the power factor of the target position is brought into the modified power adjustment model to obtain the target power of the target position.

[0093] The target power obtained above is obtained based on the laser cutting situation of the previous supplementary position, so that the target position has a higher accuracy when cutting the defect line with the target power, avoiding the existence of a significant overheating affected area due to inaccurate calculation of the target power.

[0094] Step S006, re-obtain the predicted power of the additional position before the target position according to the corrected power adjustment model, obtain the predicted power of the target position according to the predicted power of the additional position before the target position and the initial power of the cutting position, and finally obtain the power of the target position when cutting the defective line according to the target power of the target position and the predicted power of the target position.

[0095] In some other embodiments of the present invention, the target power is used to cut the defective line at the target position, and then the next additional position is recorded as the target position. The power adjustment model is corrected again according to the interference factor of any additional position before the target position, and then the target power of the target position is determined using the corrected power adjustment model, and the target power is used again to cut the defective line at the target position, and so on, after the defective lines are cut at all the additional positions, the laser cutting process is completed.

[0096] In the other embodiments described above, the power adjustment model is continuously modified so that different supplementary positions determine appropriate cutting powers according to the overheating influence of the local area (i.e., the interference factor of the cutting positions adjacent to the left and right of the supplementary position), and the obvious overheating area is avoided to a certain extent while the defect line is added. However, as the cutting proceeds, the modified power adjustment model may not always be able to approach or stabilize at the appropriate cutting power, resulting in the power adjustment process of the laser head during the cutting process being not optimal and unable to further reduce the overheating influence.

[0097] The difference between this embodiment and other embodiments is that:

[0098] After the target power of the target position is obtained in step S005, the additional position before the target position is recorded as the reference position, and the target power of the reference position is re-obtained according to the power factor of the reference position using the revised power adjustment model, and recorded as the predicted power of the reference position. The predicted power represents the cutting power that can significantly eliminate the overheating effect of the reference position (the cutting power may not be equal to the power of the reference position when actually cutting the defective line).

[0099] The initial power of all cutting positions and the predicted power of all reference positions in the first cutting process are obtained. The cutting positions and reference positions are collectively referred to as sampling points. Each initial power or predicted power is collectively recorded as the first power. The coordinates of each sampling point and the first power constitute a cutting feature (in this embodiment, the vector composed of the coordinates and the first power is recorded as a cutting feature). The coordinates of the sampling point refer to the path distance from the sampling point to the cutting starting point along the cutting path.

[0100] On the cutting path, according to the cutting direction of the reference point (for example, in a top-down perspective, when the cutting path is a straight line distributed left and right, the cutting direction is from left to right), the sampling points are traversed in sequence until the cutting position before the target position is traversed. The cutting features of all the sampling points obtained form a cutting feature sequence, and the cutting power of the target position is predicted according to the cutting feature sequence, which is recorded as the predicted power of the target position.

[0101] During the first cutting process, the spacing between the cutting positions is changed and cutting is performed at the cutting position with the initial power, thereby eliminating the effect of overheating to a certain extent. In addition, the predicted power corresponding to the reference position is also the cutting power that can eliminate the effect of overheating to a certain extent. Therefore, the cutting feature sequence describes the position-power distribution that can eliminate or avoid the effect of overheating to a certain extent. The predicted power of the target position obtained based on the cutting feature sequence can describe the cutting power required when no obvious overheating effect is introduced at the target position.

[0102] The cutting power at the target position is predicted according to the cutting feature sequence. The prediction algorithm used is the extended Kalman filter algorithm. In other embodiments, the ARIMA algorithm may also be used, or the LSTM neural network may be used for prediction.

[0103] Furthermore, this embodiment obtains the laser power required for cutting the defect line at the target position according to the target power at the target position and the predicted power at the target position.

[0104] As an example, the laser power required for cutting the defect line at the target position is the average of the target power at the target position and the predicted power at the target position.

[0105] Then the next supplementary position is recorded as the target position. The power adjustment model is corrected again according to the interference factor of any supplementary position before the target position, and then the target power and predicted power of the target position are determined by using the corrected power adjustment model. The target power and predicted power are used again to obtain the cutting power required for cutting the defect line at the target position. After cutting the defect line at all supplementary positions, the second cutting process is completed, which uses different powers to cut the defect line at the supplementary position.

[0106] The process obtains the target power at the target position by continuously modifying the power adjustment model, and uses the modified power adjustment model to re-acquire the predicted power at the reference position, and further combines the position-power distribution relationship between the cutting position and the reference position during the first cutting process, and finally obtains the cutting power at the target position, avoiding the problem that the modified power adjustment cannot always approach or stabilize at the appropriate cutting power, so that a large number of defect lines can be closely distributed on the cutting path, and the situation of obvious overheating can be avoided. It makes it easy to neatly separate the glass components of the glass plate, and avoids the impact of the cut glass components on the display manufacturing.

[0107] The method for making it easy to neatly separate the components of the glass plate is: use a CO2 laser to irradiate along the cutting path. In this embodiment, the CO2 laser generates a 200-watt CO2 laser with a wavelength of 9 microns and a spot size of 8 mm. The defect line generates thermal stress under the irradiation of the CO2 laser, so that the glass plate is separated along the defect line on the cutting path to obtain a glass component of the required size and shape. The glass component can be processed subsequently by chamfering, edge grinding, cleaning and other processes, and then used to manufacture displays.

[0108] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A laser cutting optimization control method for display intelligent manufacturing, characterized in that: The method comprises the following steps: The laser cutter cuts the glass plate for manufacturing the display along a cutting path at a preset initial power, and cuts a defect line at each cutting position on the cutting path, wherein the defect line is perpendicular to the upper and lower surfaces of the glass substrate; After a defect line is cut out at each cutting position, an interference factor of each cutting position is obtained according to the interference of two adjacent defect lines on the optical signal, the next cutting position is predicted according to the interference factor, and a defect line is cut out at the predicted next cutting position; and so on, until the first cutting process is completed along the cutting path; A supplementary position is determined between every two adjacent cutting positions, and a target power of the first supplementary position is determined according to a power adjustment model; the power adjustment model of the supplementary position is obtained by the interference factor of the cutting position adjacent to the supplementary position and the initial power; the target power determined by the power adjustment model is negatively correlated with the difference in the interference factor of the adjacent cutting position; The defect line of the first supplementary position is cut according to the target power, and the supplementary position after the first supplementary position is recorded as the target position; when cutting the defect line at the target position, the power adjustment model is first corrected according to the interference factor of any supplementary position before the target position, and then the target power of the target position is determined using the corrected power adjustment model; the target power of the supplementary position before the target position is re-obtained according to the corrected power adjustment model, and recorded as predicted power, the predicted power of the target position is obtained according to the predicted power of the supplementary position before the target position and the initial power of the cutting position, and finally the power of the target position when cutting the defect line is obtained according to the target power of the target position and the predicted power of the target position.

2. The laser cutting optimization control method for display intelligent manufacturing according to claim 1 is characterized in that: The specific steps of obtaining the interference factor of each cutting position according to the interference of two adjacent defective lines on the optical signal include the following: Before cutting a defect line at each cutting position, the light intensity a1 of the light signal after passing through the glass plate perpendicular to the side of the glass plate is obtained. After cutting a defect line at each cutting position, the light intensity a2 of the light signal after passing through the glass plate perpendicular to the side of the glass plate is obtained. |a1-a2| / (a1+a2) is recorded as the interference factor of each cutting position; || represents the absolute value sign.

3. The laser cutting optimization control method for display intelligent manufacturing according to claim 1 is characterized in that: The specific steps of predicting the next cutting position according to the interference factor are as follows: The cutting position where the defect line is cut most recently is recorded as the current cutting position, and the distance between the current cutting position and the previous cutting position is recorded as D. Assuming that the distance between the next cutting position and the current cutting position is D1, let D1 = (1 + K1) × D; The method for obtaining K1 is as follows: the interference factor of the current cutting position is recorded as w1, when w1 is less than the first preset threshold, K1 is linearly correlated with (w1-1); when w1 is greater than or equal to the first preset threshold th1, K1=w1; The next cutting position is determined by D1.

4. The laser cutting optimization control method for display intelligent manufacturing according to claim 1 is characterized in that: The power adjustment model of the supplementary position is obtained by the interference factor of the cutting position adjacent to the supplementary position and the initial power, and includes the following specific steps: For any supplementary position x, the power factor w2(x) at the supplementary position x is obtained, and the power factor w2(x) is positively correlated with the difference in interference factors of two cutting positions adjacent to the supplementary position; The power adjustment model P1(x) represents the target power at the additional position x, P1(x) = (K2(x) + y) × P0, where P0 represents the initial power; y is the offset coefficient, and the initial value of y is a preset value; K2(x) represents the adjustment amplitude of P0 at the additional position x, and K2(x) is negatively correlated with w2(x).

5. The laser cutting optimization control method for display intelligent manufacturing according to claim 4 is characterized in that: The specific steps of correcting the power adjustment model according to the interference factor of any additional position before the target position are as follows: The set of all the additional positions before the target position is recorded as S, and any additional position in S is recorded as position x1, x1∈S; the power factor at position x1 is recorded as w2(x1); the laser power used when cutting the defect line at position x1 is recorded as P(x1), and the offset coefficient y in the power adjustment model is regarded as a variable, and w2(x1) is brought into the power adjustment model to obtain the target power of position x1, which is recorded as P1(x1, y), indicating the target power obtained after the power adjustment model is corrected using the offset coefficient y at position x1; According to the difference between P1(x1, y) and P(x1) and the interference factor at position x1, the corrected deviation amplitude of the power adjustment model is obtained, and the corrected deviation amplitude is positively correlated with the difference between P1(x1, y) and P(x1), and negatively correlated with the interference factor at position x1; the offset coefficient y with the minimum corrected deviation amplitude is obtained, recorded as the final offset coefficient y0, and the offset coefficient y in the power adjustment model is replaced by y0 to obtain the corrected power adjustment model.

6. The laser cutting optimization control method for display intelligent manufacturing according to claim 5 is characterized in that: The correction deviation amplitude of the power adjustment model is obtained according to the difference between P1(x1, y) and P(x1) and the interference factor at the position x1, and the specific formula included is as follows: Where f(x1) represents the interference factor at position x1, F represents the correction deviation amplitude of the power adjustment model, and || represents the absolute value sign.

7. The laser cutting optimization control method for display intelligent manufacturing according to claim 1 is characterized in that: The step of obtaining the predicted power of the target position according to the predicted power of the supplementary position before the target position and the initial power of the cutting position includes the following specific steps: The additional position before the target position is recorded as the reference position, and the predicted power of the additional position before the target position is recorded as the predicted power of the reference position; For the initial powers of all cutting positions in the first cutting process and the predicted powers of all reference positions, the cutting positions and reference positions are called sampling points, each initial power or predicted power is recorded as a first power, and the coordinates of each sampling point and the first power constitute a cutting feature; On the cutting path, the sampling points are traversed in sequence until the cutting position before the target position is traversed. The cutting features of all the obtained sampling points form a cutting feature sequence, and the cutting power of the target position is predicted according to the cutting feature sequence, which is recorded as the predicted power of the target position.

8. The laser cutting optimization control method for display intelligent manufacturing according to claim 1 is characterized in that: The power of the target position when cutting the defect line is equal to the average of the target power of the target position and the predicted power of the target position.

9. The laser cutting optimization control method for display intelligent manufacturing according to claim 4 is characterized in that: The specific steps for obtaining the power factor w2(x) are as follows: The absolute value of the difference between the interference factors of the two adjacent cutting positions of the supplementary position x is obtained, and the ratio of the absolute value to the distance between the two cutting positions is recorded as the initial power factor of the supplementary position x. The initial power factors of all supplementary positions are linearly normalized, and the normalized initial power factor is recorded as the power factor w2(x).

10. The laser cutting optimization control method for display intelligent manufacturing according to claim 4 is characterized in that: The specific steps for obtaining the adjustment range of P0 at the additional position x are as follows: When w2(x) is greater than or equal to the second preset threshold, K2(x)=1-w2(x); when w2 is less than the second preset threshold th2, K2(x)=1-y.

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