Silicon wafer linear cutting device

Abstract

The invention discloses a silicon wafer wire cutting device which comprises a supporting seat, a diamond wire cutting machine is arranged on the supporting seat, and the diamond wire cutting machine is provided with four wire guide rollers. The mounting seat is arranged on the supporting seat, and a first long-strip hole is formed in the mounting seat; the bottom plate is arranged on the mounting seat, and a second strip hole is formed in the bottom plate in a penetrating manner; the two U-shaped flow guide plates are symmetrically arranged, the two U-shaped flow guide plates are both arranged on the bottom plate, and openings of the U-shaped flow guide plates face the horizontal direction; the cleaning and cooling effects on the diamond wire can be improved, and the situation that the diamond wire is deflected or shaken due to the fact that cutting liquid directly impacts the diamond wire is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer cutting, in particular to a silicon wafer wire cutting device. Background Art

[0002] In the production process of silicon wafers, wire cutting is a common processing method; in the process of wire cutting, it is usually necessary to use cutting fluid to cool and clean the diamond wire; however, the existing method usually sprays the cutting fluid directly onto the diamond wire, and the sprayed cutting fluid can easily cause the diamond wire to deflect or shake, especially when the spraying direction is not parallel to the diamond wire, the deflection or shaking is more obvious, thereby reducing the cutting quality of the silicon ingot. Summary of the invention

[0003] The object of the present invention is to provide a silicon wafer wire cutting device, which can improve the cleaning and cooling effect of the diamond wire and effectively reduce or avoid the deflection or shaking of the diamond wire.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions: a silicon wafer wire cutting device, comprising a support seat, on which a diamond wire cutting machine is arranged, and the diamond wire cutting machine has four wire rollers; further comprising: a mounting seat, which is arranged on the support seat, and a first long hole is arranged on the mounting seat; a bottom plate, which is arranged on the mounting seat, and a second long hole is arranged through the bottom plate; a U-shaped guide plate, which has two U-shaped guide plates, which are symmetrically arranged, and the two U-shaped guide plates are both arranged on the bottom plate, and the openings of the U-shaped guide plates face the horizontal direction; a belt roller, which has two belt rollers, and the two belt rollers are rotatably arranged on the mounting seat; a belt, which is cooperatively arranged on the bottom plate and the two belt rollers The outside of the invention is a housing chamber formed between the belt, the bottom plate and the two U-shaped guide plates; a driving component, which is used to drive the belt to operate; a cutting liquid introduction component, which is used to be connected to an external cutting liquid supply device, and the cutting liquid introduction component is used to spray cutting liquid to the inside of the two U-shaped guide plates; a cutting liquid recovery component, which is used to recover cutting liquid; wherein, when the cutting liquid introduction component is used to spray cutting liquid to the inside of the two U-shaped guide plates and the belt is running, it is used to drive the cutting liquid temporarily stored in the housing chamber to rotate in the horizontal direction; the belt is mounted on the outside of the upward moving part of the diamond wire included in the diamond wire cutting machine, and the upward moving part of the diamond wire included in the diamond wire cutting machine passes through the first long hole and the second long hole.

[0005] Furthermore, the cutting liquid introduction assembly includes: a cover plate, one of which is respectively arranged on the top of each of the U-shaped guide plates; a liquid guide tube, two of which are centrally symmetrically arranged and respectively fixed on the two cover plates; a nozzle, at least one of which is arranged on each of the liquid guide tubes; wherein the liquid guide tube is used to be connected to an external cutting liquid supply device.

[0006] Furthermore, the U-shaped guide plate includes: a straight section, the straight sections have two, the two straight sections are parallel and spaced apart; an arc section, the arc section is arranged between the two straight sections; wherein the nozzle is close to the inner side of one of the straight sections.

[0007] Furthermore, the driving assembly includes: a driving shaft, which is rotatably disposed on the support base, and the bottom end of the driving shaft is fixedly connected to one of the belt rollers; a driving motor, which is disposed on the support base, and the output end of the driving motor is fixedly connected to the driving shaft.

[0008] Furthermore, the cutting liquid recovery assembly includes: a collecting hood, which is arranged on the supporting seat; a drain pipe, which is arranged at the bottom of the collecting hood and is used to connect to an external filtering device.

[0009] Furthermore, two first limiting rollers and two second limiting rollers are rotatably arranged on the mounting seat; the two first limiting rollers are located on both sides of one of the U-shaped guide plates, and the two second limiting rollers are located on both sides of the other U-shaped guide plate; the first limiting rollers and the second limiting rollers are both used to tighten the belt and make the belt fit the outer wall of the U-shaped guide plate.

[0010] Furthermore, baffles are respectively provided on both sides of each of the U-shaped guide plates, and the baffles are adjacent to the belt.

[0011] Furthermore, the first elongated hole and the second elongated hole correspond in position, and the first elongated hole and the second elongated hole have the same width.

[0012] Compared with the prior art, the beneficial effects achieved by the present invention are as follows.

[0013] 1. The cutting fluid discharged from the first long hole of the present invention flows downward by gravity, thus helping to improve the flushing effect of the cutting fluid discharged from the second long hole on the diamond wire. The flushing effect is mainly in the vertical direction, which helps to improve the cooling and cleaning effect of the diamond wire. At the same time, the nozzle does not directly spray the cutting fluid onto the diamond wire, thereby effectively reducing or avoiding the deflection or shaking of the diamond wire.

[0014] 2. By driving the cutting fluid stored in the accommodating chamber to rotate, the rotating flow of the cutting fluid helps to improve the cooling effect on the diamond wire, and also facilitates the removal of silicon powder attached to the diamond wire, effectively improving the cooling and cleaning effect of the diamond wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0016] Figure 1 It is a schematic diagram of the overall structure of the first embodiment of the present invention.

[0017] Figure 2 It is a schematic diagram of the cooperation between the belt and the diamond wire in the first embodiment of the present invention.

[0018] Figure 3 It is a schematic diagram of the coordination of the belt, bottom plate and U-shaped guide plate of the first embodiment of the present invention.

[0019] Figure 4 It is a schematic diagram of the cooperation between the cutting liquid introduction assembly and the U-shaped guide plate in the first embodiment of the present invention.

[0020] Figure 5 It is a schematic diagram of the cooperation between the U-shaped guide plate and the bottom plate of the first embodiment of the present invention.

[0021] Figure 6 It is a schematic diagram of the mounting base structure of the first embodiment of the present invention.

[0022] Figure 7 It is a schematic diagram of the installation of the cutting fluid recovery component of the first embodiment of the present invention.

[0023] Figure 8 It is a schematic diagram of the cooperation between the first limiting roller, the second limiting roller and the belt in the second embodiment of the present invention.

[0024] Fig. 9 It is a schematic diagram of the positions of the first limiting roller and the second limiting roller in the second embodiment of the present invention.

[0025] Fig.10 It is a schematic diagram of the installation of the drive assembly of the third embodiment of the present invention.

[0026] In the figure: 1. support seat; 11. diamond wire cutting machine; 2. mounting seat; 21. first long hole; 22. bottom plate; 221. second long hole; 23. first limit roller; 24. second limit roller; 3. belt; 31. belt roller; 4. cutting liquid recovery assembly; 41. collection cover; 42. drain pipe; 5. drive assembly; 51. drive motor; 52. drive shaft; 6. cutting liquid introduction assembly; 61. cover plate; 62. liquid guide tube; 63. nozzle; 7. U-shaped guide plate; 71. arc segment; 72. straight segment; 8. baffle; 9. accommodating chamber. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] Embodiment 1

[0029] See also Figure 1-Figure 7 The present invention provides a technical solution: a silicon wafer wire cutting device, comprising a support base 1, on which a diamond wire cutting machine 11 is arranged, the diamond wire cutting machine 11 adopts four wire rollers, and the diamond wire used for cutting the silicon ingot is wound on the four wire rollers, and the four wire rollers are neatly arranged in two rows and two columns; a mounting base 2 is arranged on the support base 1, and a first elongated hole 21 is arranged on the mounting base 2; a bottom plate 22 is arranged on the mounting base 2, and a second elongated hole 221 is arranged on the bottom plate 22, the first elongated hole 21 corresponds to the second elongated hole 221 in position, the first elongated hole 21 and the second elongated hole 221 are equal in width, the first elongated hole 21 and the second elongated hole 221 are also equal in length, and the first elongated hole 21 and the second elongated hole 221 are connected.

[0030] Two U-shaped guide plates 7 are arranged on the bottom plate 22, and the two U-shaped guide plates 7 are symmetrically arranged, and the openings of the U-shaped guide plates 7 are facing the horizontal direction; two belt rollers 31 are rotatably arranged on the mounting seat 2, and the outsides of the two belt rollers 31 are jointly wound with the belt 3; at the same time, the belt 3 is sleeved on the bottom plate 22 and the outside of the two U-shaped guide plates 7, and an accommodating cavity 9 is formed between the bottom plate 22, the belt 3 and the two U-shaped guide plates 7; the vertically upward moving part of the diamond wire included in the diamond wire cutting machine 11 passes through the accommodating cavity 9, and this part of the diamond wire passes through the first long hole 21 and the second long hole 221, and the length of this part of the diamond wire is greater than the width of the belt 3.

[0031] The silicon wafer cutting device also includes a driving component 5, a cutting liquid introduction component 6 and a cutting liquid recovery component 4; the driving component 5 is used to drive the belt 3 to operate, and the cutting liquid recovery component 4 is used to recover the cutting liquid; the cutting liquid introduction component 6 is used to be connected to an external cutting liquid supply device, and the cutting liquid introduction component 6 is used to spray cutting liquid onto the inner side of the two U-shaped guide plates 7; when the cutting liquid introduction component 6 is used to spray cutting liquid onto the inner side of the two U-shaped guide plates 7, and the belt 3 is operating, it is convenient to drive the cutting liquid stored in the accommodating cavity 9 to rotate in the horizontal direction.

[0032] The U-shaped guide plate 7 consists of two straight sections 72 and an arc section 71. The two straight sections 72 are parallel and spaced apart, and the arc section 71 is arranged between the two straight sections 72. In addition, the inner walls of the two straight parts of the belt 3 are respectively in contact with the outer walls of the two straight sections 72 included in the U-shaped guide plate 7. The U-shaped guide plate 7 is made of wear-resistant and corrosion-resistant material, and the belt 3 can adopt a wear-resistant and corrosion-resistant conveyor belt.

[0033] The cutting liquid introduction assembly 6 includes two cover plates 61, and the two cover plates 61 are respectively arranged on the top of the two U-shaped guide plates 7; a liquid guide tube 62 is fixedly arranged on each of the two U-shaped guide plates 7, and the two liquid guide tubes 62 pass through the two cover plates 61 respectively; the two liquid guide tubes 62 are centrally symmetrically arranged, and the liquid guide tubes 62 are connected to an external cutting liquid supply device; two nozzles 63 are connected to each of the liquid guide tubes 62, and the two nozzles 63 on one of the liquid guide tubes 62 are centrally symmetrically arranged with the two nozzles 63 on the other liquid guide tube 62; the nozzle 63 is adjacent to the inner side of one of the straight sections 72, and the nozzle 63 is used to spray cutting liquid toward the inner side of the arc section 71, through the guiding effect of the arc section 71, and in coordination with the operation of the belt 3, the cutting liquid stored in the accommodating chamber 9 is driven to rotate in the horizontal direction.

[0034] The cutting liquid recovery assembly 4 includes a collecting hood 41 arranged on the support seat 1, the collecting hood 41 is located below the mounting seat 2, and the lower part of the diamond wire cutting machine 11 is located inside the collecting hood 41. A drain pipe 42 is connected to the bottom of the collecting hood 41, and the drain pipe 42 is used to connect to an external filtering device.

[0035] In this embodiment, the cutting liquid is sprayed toward the arc segment 71 through the nozzle 63, and the amount of cutting liquid introduced into the accommodating chamber 9 per unit time is controlled to be greater than the amount of cutting liquid discharged from the first elongated hole 21, so that the cutting liquid can be stored in the accommodating chamber 9; the portion of the diamond wire passing through the first elongated hole 21 moves upward, and the cutting liquid discharged from the first elongated hole 21 flows downward by gravity, thereby helping to enhance the flushing effect of the cutting liquid discharged from the second elongated hole 221 on the portion of the diamond wire located directly below the first elongated hole 21, and the flushing effect is mainly in the vertical direction, which helps to enhance the flushing of the diamond wire. Cooling and cleaning effects can be achieved, and the impact on the operation of the diamond wire can be reduced. In addition, the belt 3 is driven to rotate in the horizontal direction by cooperating with the driving component 5 to realize the horizontal rotation of the cutting liquid inside the accommodating chamber 9. The pressure of the cutting liquid sprayed out by the nozzle 63 is controlled, and the running speed of the belt 3 is controlled by the driving component 5, so that the rotation speed of the cutting liquid is not easy to be too large, which is used to reduce the impact on the operation of the diamond wire. The nozzle 63 does not directly spray the cutting liquid to the diamond wire, thereby reducing or avoiding the deflection or shaking of the diamond wire, which can effectively ensure the cutting quality of the silicon ingot by the diamond wire cutting machine 11.

[0036] At the same time, the rotating flow of cutting fluid helps to improve the cooling effect on the diamond wire, and also facilitates the removal of silicon powder attached to the diamond wire. Combined with the flushing effect of the cutting fluid discharged from the second long hole 221 on the diamond wire, the cooling and cleaning effect of the diamond wire is effectively improved.

[0037] The cutting liquid overflowing from the upper part of the belt 3, the cutting liquid flowing out from the gap between the belt 3 and the U-shaped guide plate 7 and the bottom plate 22, and the cutting liquid on the diamond wire cutting machine 11 are all recovered into the collecting cover 41 and connected to the external filtering device through the drain pipe 42 to facilitate the recovery and treatment of silicon powder and cutting liquid; in addition, a baffle 8 is provided on the outer wall of each straight section 72, and the baffle 8 is an inverted L-shaped structure, and the baffle 8 is adjacent to the belt 3. By providing the baffle 8, it is used to reduce the cutting liquid overflowing from the upper part of the belt 3 from flowing into the two ends of the belt 3.

[0038] Embodiment 2

[0039] See also Figure 8 , Fig. 9This embodiment is based on the first embodiment, and two first limiting rollers 23 and two second limiting rollers 24 are rotatably arranged on the mounting seat 2; the two first limiting rollers 23 are arranged in parallel, and the two first limiting rollers 23 are located on both sides of one of the U-shaped guide plates 7; the two second limiting rollers 24 are arranged in parallel, and the two second limiting rollers 24 are located on both sides of the other U-shaped guide plate 7; the first limiting rollers 23 and the second limiting rollers 24 are both used to press the belt 3, so that the belt 3 fits the U-shaped guide plate 7 and the outer wall of the bottom plate 22. During the movement of the belt 3, the sealing between the belt 3 and the U-shaped guide plate 7 and the bottom plate 22 can be improved, thereby helping to reduce the cutting fluid flowing out of the gap between the belt 3 and the U-shaped guide plate 7 and the bottom plate 22.

[0040] Embodiment 3

[0041] See also Figure 1 and Fig.10 This embodiment is based on the second embodiment, and the driving component 5 includes a driving shaft 52 rotatably set on the support base 1, and the bottom end of the driving shaft 52 is fixedly connected to one of the belt rollers 31; the driving component 5 also includes a driving motor 51, the driving motor 51 is set on the support base 1, and the output end of the driving motor 51 is fixedly connected to the driving shaft 52, and the belt roller 31 connected to the driving shaft 52, the driving shaft 52 and the output shaft of the driving motor 51 are coaxial; in addition, a protective cover can be set on the outside of the driving motor 51.

[0042] The driving motor 51 drives the driving shaft 52 to rotate, which can drive the belt roller 31 connected to the driving shaft 52 to rotate. Under the action of the other belt roller 31, the belt 3 can be put into operation.

[0043] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A silicon wafer wire cutting device, comprising a support base (1), on which a diamond wire cutting machine (11) is arranged, and the diamond wire cutting machine (11) has four wire rollers; characterized in that: Also includes: A mounting seat (2), the mounting seat (2) being arranged on the supporting seat (1), and the mounting seat (2) being provided with a first elongated hole (21); A bottom plate (22), the bottom plate (22) being arranged on the mounting seat (2), and a second elongated hole (221) penetrating the bottom plate (22); U-shaped guide plates (7), wherein the U-shaped guide plates (7) are provided with two, the two U-shaped guide plates (7) are symmetrically arranged, the two U-shaped guide plates (7) are both arranged on the bottom plate (22), and the openings of the U-shaped guide plates (7) face the horizontal direction; A belt roller (31), wherein the belt roller (31) has two parts, and the two belt rollers (31) are both rotatably arranged on the mounting seat (2); A belt (3), wherein the belt (3) is arranged on the outside of the bottom plate (22) and two belt rollers (31), and a receiving cavity (9) is formed between the belt (3), the bottom plate (22) and the two U-shaped guide plates (7); A driving assembly (5), wherein the driving assembly (5) is used to drive the belt (3) to operate; A cutting liquid introduction component (6), the cutting liquid introduction component (6) is used to be connected to an external cutting liquid supply device, and the cutting liquid introduction component (6) is used to spray cutting liquid onto the inner sides of the two U-shaped guide plates (7); A cutting liquid recovery component (4), wherein the cutting liquid recovery component (4) is used to recover the cutting liquid; Wherein, when the cutting liquid introduction component (6) is used to spray the cutting liquid toward the inner sides of the two U-shaped guide plates (7), and the belt (3) is running, it is used to drive the cutting liquid temporarily stored inside the accommodating chamber (9) to rotate in the horizontal direction; The belt (3) is sleeved on the outside of the diamond wire upward moving portion of the diamond wire cutting machine (11), and the diamond wire upward moving portion of the diamond wire cutting machine (11) passes through the first long strip hole (21) and the second long strip hole (221).

2. A silicon wafer wire cutting device according to claim 1, characterized in that: The cutting fluid introduction component (6) comprises: A cover plate (61), wherein a cover plate (61) is disposed on the top of each of the U-shaped guide plates (7); A liquid guiding tube (62), wherein the number of the liquid guiding tubes (62) is two, the two liquid guiding tubes (62) are centrally symmetrically arranged, and the two liquid guiding tubes (62) are respectively fixed on the two cover plates (61); A nozzle (63), each of the liquid guiding tubes (62) being provided with at least one nozzle (63); Wherein, the liquid guide tube (62) is used to be connected to an external cutting liquid supply device.

3. A silicon wafer wire cutting device according to claim 2, characterized in that: The U-shaped guide plate (7) comprises: A straight section (72), wherein the straight section (72) has two straight sections, and the two straight sections (72) are arranged in parallel and at intervals; An arc segment (71), wherein the arc segment (71) is arranged between the two straight segments (72); The nozzle (63) is located close to the inner side of one of the straight sections (72).

4. A silicon wafer wire cutting device according to claim 1, characterized in that: The driving assembly (5) comprises: A driving shaft (52), the driving shaft (52) being rotatably disposed on the supporting seat (1), and the bottom end of the driving shaft (52) being fixedly connected to one of the belt rollers (31); A drive motor (51), wherein the drive motor (51) is arranged on the support seat (1), and an output end of the drive motor (51) is fixedly connected to the drive shaft (52).

5. The silicon wafer wire cutting device according to claim 1, characterized in that: The cutting fluid recovery component (4) comprises: A collecting cover (41), wherein the collecting cover (41) is arranged on the supporting base (1); A liquid drain pipe (42), the liquid drain pipe (42) is arranged at the bottom of the collecting cover (41), and the liquid drain pipe (42) is used to be connected to an external filtering device.

6. A silicon wafer wire cutting device according to claim 2, characterized in that: Two first limiting rollers (23) and two second limiting rollers (24) are rotatably arranged on the mounting seat (2); The two first limiting rollers (23) are located on both sides of one of the U-shaped guide plates (7), and the two second limiting rollers (24) are located on both sides of the other U-shaped guide plate (7); The first limiting roller (23) and the second limiting roller (24) are both used to press the belt (3) and to cause the belt (3) to fit the outer wall of the U-shaped guide plate (7).

7. The silicon wafer wire cutting device according to claim 1, characterized in that: Baffles (8) are respectively arranged on both sides of each of the U-shaped guide plates (7), and the baffles (8) are adjacent to the belt (3).

8. The silicon wafer wire cutting device according to claim 1, characterized in that: The first elongated hole (21) and the second elongated hole (221) correspond in position, and the first elongated hole (21) and the second elongated hole (221) have the same width.

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