Supporting module and preparation method thereof, and preparation method of display device

Abstract

The embodiment of the invention discloses a supporting module and a preparation method thereof, and a preparation method of a display device, and relates to but is not limited to a display technology. The supporting module comprises a supporting structure, a bonding layer and a first release layer. One side of the supporting structure is provided with a plurality of bonding areas bonded with the middle frame, and the first release layer is bonded with the other side of the supporting structure through the bonding layer and protects the surface of the supporting structure. The bonding layer comprises a plurality of first bonding patterns and is arranged to be bonded with the first release layer. Orthographic projections of the plurality of bonding areas and the plurality of first bonding patterns on the supporting structure are not overlapped. In this way, it can be avoided that silicon elements and fluorine elements contained in the first release layer are transferred to the multiple bonding areas through the bonding layer, the bonding performance of the supporting structure and the middle frame is deteriorated, and consequently the supporting structure falls off from the middle frame, the silicon elements and the fluorine elements in the multiple bonding areas can be kept low in content, and the service life of the supporting structure is prolonged. Therefore, the dyne values of the plurality of bonding areas are relatively high, the water drop angles are relatively small, and the bonding performance with the middle frame is improved.

Description

Technical Field

[0001] The present disclosure relates to but is not limited to display technology, and in particular to a support module and a preparation method thereof, and a preparation method of a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and Quantum-dot Light Emitting Diode (QLED) are active light-emitting display devices with the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, extremely high response speed, thinness, bendability and low cost. With the continuous development of display technology, flexible display devices (Flexible Display) using OLED or QLED as light-emitting devices and thin film transistors (TFT) for signal control have become the mainstream products in the current display field.

[0003] The display module needs to be bonded to the middle frame of the entire machine through a supporting structure to protect the display module. Summary of the invention

[0004] The embodiment of the present disclosure provides a support module, including a support structure, an adhesive layer and a first release layer; One side of the support structure has a plurality of bonding areas, the plurality of bonding areas are configured to bond with the middle frame, the first release layer is bonded to the other side of the support structure through the bonding layer, and the orthographic projection of the first release layer on the support structure covers the support structure; The bonding layer includes a plurality of first bonding patterns, and the plurality of first bonding patterns are configured to bond with the first release layer; Orthographic projections of the plurality of bonding areas and the plurality of first bonding patterns on the support structure do not overlap.

[0005] In some embodiments of the support module, a first single-sided adhesive layer is provided on a side of the first release layer facing the support structure, and the orthographic projection of the first single-sided adhesive layer on the support structure covers the orthographic projection of the plurality of bonding areas on the support structure; The bonding surface of the first single-sided adhesive layer is bonded to the first release layer.

[0006] In some embodiments of the supporting module, a side of the first single-sided adhesive layer facing away from the first release layer is disposed on the bonding layer.

[0007] In some embodiments of the support module, the bonding layer is provided with a plurality of first hollow patterns, and the first hollow patterns penetrate the bonding layer in a direction perpendicular to the support structure; The orthographic projections of the plurality of first hollow patterns on the support structure cover the orthographic projections of the plurality of bonding areas on the support structure in a one-to-one correspondence; The first single-sided adhesive layer is filled in the plurality of first hollow patterns and is connected to the supporting structure.

[0008] In some embodiments of the support module, the thickness of the adhesive layer and the first single-sided adhesive layer are consistent.

[0009] In some embodiments of the support module, the first single-sided adhesive layer includes a plurality of first single-sided adhesive patterns; The first release layer includes a plurality of protective members, and the plurality of protective members are spliced ​​on a plane parallel to the support structure to form the first release layer; The orthographic projection of each of the protective members on the supporting structure overlaps with at least one orthographic projection of the first single-sided adhesive pattern on the supporting structure.

[0010] In some embodiments of the support module, the support structure includes a support layer and a metal layer; The plurality of bonding areas and the metal layer are respectively located on two sides of the support layer; The metal layer includes a metal pattern and a second release layer; The metal pattern is disposed on a side of the support layer away from the plurality of bonding areas; The second release layer is arranged on a side of the metal pattern away from the support layer, the second release layer is provided with a plurality of second bonding patterns, and the plurality of second bonding patterns are arranged to bond with the metal layer; The orthographic projections of the plurality of second bonding patterns on the support layer cover the orthographic projections of the metal pattern on the support layer, and the orthographic projections of the plurality of bonding areas and the plurality of second bonding patterns on the support layer do not overlap; After the metal layer is disposed on the support layer, the second release layer is peeled off.

[0011] In some embodiments of the support module, the second release layer is provided with a plurality of second hollow patterns, and the second hollow patterns penetrate the second release layer in a direction perpendicular to the support layer; The orthographic projections of the plurality of second hollow patterns on the support layer cover the orthographic projections of the plurality of bonding areas on the support layer in a one-to-one correspondence.

[0012] In some embodiments of the support module, a second single-sided adhesive layer is provided on the side of the second release layer facing the support layer, and the bonding surface of the second single-sided adhesive layer is bonded to the second release layer, and the orthographic projection of the second single-sided adhesive layer on the support layer covers the orthographic projection of the multiple bonding areas on the support layer.

[0013] In some embodiments of the support module, the adhesion between the first release layer and the adhesive layer is greater than the adhesion between the support structure and the adhesive layer.

[0014] In some embodiments of the support module, the bonding strength between the bonding layer and the support structure is 6 gf / inch to 12 gf / inch.

[0015] In some embodiments of the support module, the support layer has a non-bending region and a bending region; The orthographic projection of the metal pattern on the support layer is located in the non-bending area; A portion of the orthographic projections of the plurality of bonding regions on the support layer are located in the bending region, and another portion are located in the non-bending region.

[0016] The present disclosure also provides a method for preparing a support module, including: Providing a support structure, wherein one side of the support structure has a plurality of bonding areas, and the plurality of bonding areas are configured to bond with the middle frame; and A bonding layer is disposed on the other side of the support structure, and a first release layer is disposed on the side of the bonding layer facing away from the support structure; The bonding layer includes a plurality of first bonding patterns, and the plurality of first bonding patterns are configured to bond with the first release layer; Orthographic projections of the plurality of bonding areas and the plurality of first bonding patterns on the support structure do not overlap.

[0017] In some embodiments of the method for preparing the support module, providing the support structure includes: Providing a support layer and a metal layer, the plurality of bonding areas and the metal layer are respectively arranged on both sides of the support layer, the metal layer comprises a metal pattern and a second release layer, the metal pattern is arranged on a side of the support layer away from the plurality of bonding areas, the second release layer is arranged on a side of the metal pattern away from the support layer, the second release layer is provided with a plurality of second bonding patterns, the plurality of second bonding patterns are arranged to bond with the metal layer, the orthographic projections of the plurality of second bonding patterns on the support layer cover the orthographic projections of the metal pattern on the support layer, and the orthographic projections of the plurality of bonding areas and the plurality of second bonding patterns on the support layer do not overlap; The second release layer is peeled off.

[0018] The present disclosure also provides a method for manufacturing a display device, including: Providing a display module; Providing a support module as described above; Peeling off the adhesive layer and the first release layer in the supporting module; Attaching a side of the support structure in the support module away from the plurality of bonding areas to the display module; and The plurality of adhesive areas are attached to the middle frame.

[0019] In summary, the beneficial effects brought about by the technical solution provided by the embodiments of the present disclosure may at least include: Provided are a support module and a preparation method thereof, and a preparation method for a display device. The support module includes a support structure, an adhesive layer, and a first release layer. One side of the support structure has multiple bonding areas bonded to a middle frame, the first release layer is bonded to the other side of the support structure through the adhesive layer, and the orthographic projection of the first release layer on the support structure covers the support structure, so that the surface of the support structure is protected by the first release layer. The adhesive layer includes multiple first bonding patterns, and the multiple first bonding patterns are configured to bond to the first release layer. The orthographic projections of the multiple bonding areas and the multiple first bonding patterns on the support structure do not overlap. In this way, it is possible to avoid the silicon (Si) element and the fluorine (F) element contained in the first release layer from being transferred to the multiple bonding areas through the adhesive layer, deteriorating the bonding performance of the support structure with the middle frame, and causing peeling from the middle frame, so that the silicon element and the fluorine element in the multiple bonding areas can be kept at a low content, thereby making the multiple bonding areas have a higher dyne value and a smaller water drop angle, thereby improving the bonding performance with the middle frame.

[0020] Other features and advantages of the present disclosure will be described in the following description, and partly become apparent from the description, or be understood by implementing the present disclosure. Other advantages of the present disclosure can be realized and obtained by the schemes described in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are used to provide an understanding of the technical solution of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solution of the present disclosure and do not constitute a limitation on the technical solution of the present disclosure.

[0022] Figure 1 This is a schematic diagram of bonding the folding display mechanism and the middle frame in an embodiment of the present disclosure; Figure 2 It is a schematic diagram of the planar structure of a supporting module in the related art; Figure 3 It is a schematic diagram of the planar structure of a metal layer in the related art; Figure 4 This is a schematic diagram of the planar structure of the support module in the embodiment of the present disclosure; Figure 5 In one embodiment of the present disclosure, Figure 4 Sectional view at AA in the middle; Figure 6 In one embodiment of the present disclosure, Figure 4 Sectional view at the middle BB; Figure 7 In another embodiment of the present disclosure, Figure 4 Sectional view at AA in the middle; Figure 8 In another embodiment of the present disclosure, Figure 4 Sectional view at the middle BB; Fig. 9 This is a schematic diagram of the planar structure of the bonding layer in another embodiment of the present disclosure; Fig.10 This is a schematic diagram of the planar structure of a metal layer in one embodiment of the present disclosure; Fig.11 for Fig.10 Middle CC section view; Fig.12 It is a schematic diagram of the planar structure of a metal layer in another embodiment of the present disclosure; Fig.13 for Fig.12 Middle DD section view; Fig.14 This is a flow chart of a method for preparing a support module in an embodiment of the present disclosure; Fig.15 Flow chart of the method for preparing the display device in the embodiment of the present disclosure.

[0023] Description of reference numerals: 10. Folding display mechanism; 20. Support structure; 21. Support layer; 22. Metal layer; 221. Metal pattern; 222. Second release layer; 2221. Second bonding pattern; 30. Middle frame; 40. Adhesive layer; 50. Protective gasket; 61. Adhesive layer; 611. First bonding pattern; 62. First release layer; 621. Protective member; 63. First single-sided adhesive layer; 631. First single-sided adhesive pattern; 70. Copper foil; 80. Release film; 90. Second single-sided adhesive layer; 91. Second single-sided adhesive pattern; 100. First hollow pattern; 200. Second hollow pattern. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in detail in conjunction with the accompanying drawings below. Note that the embodiments can be implemented in multiple different forms. A person of ordinary skill in the art can easily understand the fact that the methods and contents can be transformed into various forms without departing from the purpose and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. In the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other.

[0025] The proportions of the drawings in this disclosure can be used as a reference in the actual process, but are not limited to this. For example: the width-to-length ratio of the channel, the thickness and spacing of each film layer, the width and spacing of each signal line can be adjusted according to actual needs. The number of pixels in the display substrate and the number of sub-pixels in each pixel are not limited to the numbers shown in the figures. The drawings described in this disclosure are only structural schematic diagrams, and one method of this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0026] In the present disclosure, ordinal numbers such as “first”, “second”, and “third” are provided to avoid confusion among constituent elements rather than to limit the number.

[0027] In the present disclosure, for the sake of convenience, the words and phrases indicating the orientation or positional relationship, such as "middle", "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., are used to illustrate the positional relationship of the constituent elements with reference to the drawings. This is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure. The positional relationship of the constituent elements is appropriately changed according to the direction in which each constituent element is described. Therefore, it is not limited to the words and phrases described in the specification, and can be appropriately replaced according to the situation.

[0028] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate, or the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0029] In the present disclosure, "parallel" means a state where the angle formed by two straight lines is greater than -10° and less than 10°, and therefore, also includes a state where the angle is greater than -5° and less than 5°. In addition, "perpendicular" means a state where the angle formed by two straight lines is greater than 80° and less than 100°, and therefore, also includes a state where the angle is greater than 85° and less than 95°.

[0030] In the present disclosure, "film" and "layer" may be interchanged. For example, "conductive layer" may be replaced with "conductive film" in some cases. Similarly, "insulating film" may be replaced with "insulating layer" in some cases.

[0031] In the present disclosure, the shapes of circle, ellipse, rectangle, triangle, trapezoid, pentagon or hexagon are not in a strict sense, but may be approximate to circle, ellipse, rectangle, triangle, trapezoid, pentagon or hexagon, etc. There may be some small deformations caused by tolerance, and there may be chamfers, arc edges and deformations.

[0032] The term "about" in the present disclosure refers to a numerical value that is not strictly limited to allow for process and measurement errors.

[0033] In the description of the present disclosure, “plurality” means at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.

[0034] In the description of the present disclosure, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In the present disclosure, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in the present disclosure and the features of the different embodiments or examples, without contradiction.

[0035] The main layers of the folding display mechanism 10 are as follows: a display module (including a laminated transparent protective layer (Cover), an optical adhesive tape (OCA), a polarizer (Pol), a display substrate (Panel) and a paint protection film layer (U-film)) and a support structure 20 (Bracket, abbreviated as BKT).

[0036] The support structure 20 is used as a protective layer of the display module, and is in direct contact with the middle frame 30 of the whole machine. In the whole machine design, the support structure 20 is bonded to the middle frame 30 through an adhesive layer 40 (back glue or dispensing glue). Figure 1As shown in the figure, the foldable mobile phone is a new type of intelligent terminal, and the bonding performance between the foldable display mechanism 10 and the middle frame 30 is the key to determine the folding performance of the whole device.

[0037] The silicon (Si) and fluorine (F) content on the surface of the support structure 20 is a key factor in determining the bonding performance between the folding display mechanism 10 and the middle frame 30. The lower the silicon and fluorine content on the surface of the support structure 20, the higher the surface dyne value, the smaller the water drop angle, and the better the bonding performance.

[0038] The inventors of the present disclosure have found that the finished product of the support structure 20 of the current mass production project will be covered with a protective gasket 50 (release film) to protect the surface of the support structure 20, such as Figure 2 The above design brings the following problems: In order to make the release film easier to peel off from the adhesive surface or the base film, raw materials containing silicon and fluorine are added during the production of the release film to facilitate peeling, but silicon and fluorine will deteriorate the bonding performance.

[0039] The protective gasket 50 on the surface of the finished support structure 20 will go through transportation, storage, bonding and other processes from the completion of production to the bonding with the middle frame 30 in the whole machine factory. The duration is very long and a large amount of silicon and fluorine elements will be transferred.

[0040] The transfer of silicon and fluorine elements will deteriorate the bonding performance, causing the folding display mechanism 10 to peel off from the middle frame 30 .

[0041] Please combine Figures 4 to 9 In the embodiment of the present disclosure, a support module is disclosed. The support module includes a support structure 20 , an adhesive layer 61 and a first release layer 62 .

[0042] One side of the support structure 20 has a plurality of bonding areas. The plurality of bonding areas are configured to bond with the middle frame 30. That is, the plurality of bonding areas can be bonded with the middle frame 30 by adhesive backing or adhesive dispensing. The plurality of bonding areas can be connected as one or some of the bonding areas can be connected as one, or they can be arranged separately.

[0043] The first release layer 62 is bonded to the other side of the support structure 20 through the adhesive layer 61 , and the orthographic projection of the first release layer 62 on the support structure 20 covers the support structure 20 . In this way, the surface of the support structure 20 can be protected by the first release layer 62 .

[0044] The bonding layer 61 includes a plurality of first bonding patterns 611, and the plurality of first bonding patterns 611 are configured to bond with the first release layer 62, that is, the first release layer 62 is connected to the bonding layer 61 through the plurality of first bonding patterns 611 to ensure the bonding stability between the first release layer 62 and the support structure 20, thereby avoiding separation of the first release layer 62 and the support structure 20 during transportation and storage of the support module.

[0045] The orthographic projections of the multiple bonding areas and the multiple first bonding patterns 611 on the support structure 20 do not overlap. This can prevent the silicon and fluorine elements contained in the first release layer 62 from being transferred to the multiple bonding areas through the bonding layer 61, deteriorating the bonding performance between the support structure 20 and the middle frame 30, and causing it to fall off from the middle frame 30, so that the silicon and fluorine elements in the multiple bonding areas can be kept at a low content, thereby making the multiple bonding areas have a higher dyne value and a smaller water drop angle, thereby improving the bonding performance with the middle frame 30.

[0046] The orthographic projections of the plurality of bonding regions on the support structure 20 may be located outside the circumference of the orthographic projections of the plurality of first bonding patterns 611 on the support structure 20, or the orthographic projections of the plurality of first bonding patterns 611 on the support structure 20 may be located outside the circumference of the orthographic projections of the plurality of bonding regions on the support structure 20. In the embodiment of the present disclosure, the area of ​​the orthographic projections of the plurality of first bonding patterns 611 on the support structure 20 is greater than the area of ​​the orthographic projections of the plurality of bonding regions on the support structure 20. That is, the orthographic projections of the plurality of first bonding patterns 611 on the support structure 20 may be located outside the circumference of the orthographic projections of the plurality of bonding regions on the support structure 20.

[0047] In an exemplary embodiment, the material of the first release layer 62 may be polyethylene terephthalate (PET for short). The first release layer 62 made of PET is light and soft, and will not crush the display module and the support structure 20 after installation, and will not cause damage to the display module and the support structure 20 when bonding or peeling the first release layer 62. The monomer cost of the first release layer 62 made of PET is relatively low. The manufacturing process of the first release layer 62 may be a die-cutting process, which is to cut the first release layer 62 on a PET film with a cutter. The cost of the cutter mold is also relatively low, and the mold opening time is very short.

[0048] In an exemplary embodiment, the thickness d1 of the first release layer 62 may be approximately 0.23 mm to 0.43 mm. For example, the thickness d1 of the first release layer 62 may be approximately 0.33 mm. The thickness is a dimension in a direction perpendicular to the support structure 20.

[0049] In the exemplary embodiment, please combine Figures 4 to 8, a first single-sided adhesive layer 63 is provided on the side of the first release layer 62 facing the support structure 20, and the orthographic projection of the first single-sided adhesive layer 63 on the support structure 20 covers the orthographic projections of multiple bonding areas on the support structure 20. That is, the orthographic projection of the first single-sided adhesive layer 63 on the support structure 20 can completely overlap with the orthographic projections of multiple bonding areas on the support structure 20. Alternatively, the orthographic projections of multiple bonding areas on the support structure 20 can be located within the range of the orthographic projection of the first single-sided adhesive layer 63 on the support structure 20. In this way, by providing the first single-sided adhesive layer 63, it is possible to prevent the silicon element and the fluorine element contained in the first release layer 62 from being transferred to the multiple bonding areas through the adhesive layer 61, thereby deteriorating the bonding performance between the support structure 20 and the middle frame 30. The bonding surface of the first single-sided adhesive layer 63 is bonded to the first release layer 62, so that when the first release layer 62 is peeled off from the support structure 20, the first single-sided adhesive layer 63 can be peeled off from the support structure 20 together with the first release layer 62, so that one peeling action can simultaneously peel the first release layer 62 and the first single-sided adhesive layer 63 from the support structure 20, which is convenient for the subsequent bonding of the support structure 20 with the display module.

[0050] In the exemplary embodiment, please combine Figure 5 and Figure 6 , the first single-sided adhesive layer 63 is disposed on the adhesive layer 61 on the side facing away from the first release layer 62. In this way, the adhesive layer 61, the first single-sided adhesive layer 63 and the first release layer 62 can form a laminated structure in the direction perpendicular to the support structure 20, which facilitates the adhesive layer 61, the first single-sided adhesive layer 63 and the first release layer 62 to be disposed layer by layer.

[0051] The thickness d2 of the first single-sided adhesive layer 63 may be about 0.01 mm to 0.02 mm. For example, the thickness d2 of the first single-sided adhesive layer 63 may be about 0.015 mm. The thickness is the dimension in the direction perpendicular to the support structure 20. In this way, the thickness d2 of the first single-sided adhesive layer 63 is thinner, so that after the first single-sided adhesive layer 63 is arranged between the first release layer 62 and the bonding layer 61, although there is a step difference between the first release layer 62 and the bonding layer 61, the first release layer 62 is still bent to have a larger bonding surface area with the bonding layer 61, thereby ensuring the bonding stability between the first release layer 62 and the bonding layer 61.

[0052] In the exemplary embodiment, please combine Figures 6 to 8 The bonding layer 61 is provided with a plurality of first hollow patterns 100 , and the first hollow patterns 100 penetrate the bonding layer 61 in a direction perpendicular to the support structure 20 .

[0053] The orthographic projections of the plurality of first hollow patterns 100 on the support structure 20 cover the orthographic projections of the plurality of bonding areas on the support structure 20 in a one-to-one correspondence. That is, the orthographic projections of the plurality of first hollow patterns 100 on the support structure 20 may correspond to the orthographic projections of the plurality of bonding areas on the support structure 20 in a one-to-one correspondence and completely overlap. Alternatively, the orthographic projections of the plurality of bonding areas on the support structure 20 may be located in a one-to-one correspondence within the range of the orthographic projections of the plurality of first hollow patterns 100 on the support structure 20.

[0054] The first single-sided adhesive layer 63 is filled in the plurality of first hollow patterns 100 and connected to the support structure 20. The first single-sided adhesive layer 63 may include a plurality of first single-sided adhesive patterns 631. The orthographic projections of the plurality of first single-sided adhesive patterns 631 on the support structure 20 may correspond one-to-one to the orthographic projections of the plurality of first hollow patterns 100 on the support structure 20, and completely overlap. Alternatively, the orthographic projections of the plurality of first single-sided adhesive patterns 631 on the support structure 20 may correspond one-to-one to the range of the orthographic projections of the plurality of first hollow patterns 100 on the support structure 20. In this way, by setting the plurality of first hollow patterns 100, the step size between the first release layer 62 and the bonding layer 61 caused by setting the first single-sided adhesive layer 63 can be reduced, the bending degree of the first release layer 62 can be reduced, the flatness of the first release layer 62 can be improved, and a larger bonding surface area can be ensured between the first release layer 62 and the bonding layer 61, and the bonding stability between the first release layer 62 and the bonding layer 61 can be ensured.

[0055] The thickness of the adhesive layer 61 and the first single-sided adhesive layer 63 are consistent. In this way, the adhesive layer 61 and the side of the first single-sided adhesive layer 63 away from the support structure 20 are located in the same plane parallel to the support structure 20, avoiding the formation of step difference, ensuring the flatness of the first release layer 62, and further improving the bonding stability between the first release layer 62 and the adhesive layer 61. In an exemplary embodiment, the thickness d3 of the adhesive layer 61 can be about 0.04mm to 0.06mm. For example, the thickness d3 of the adhesive layer 61 can be about 0.05mm. Wherein, the thickness is the dimension in the direction perpendicular to the support structure 20. In an exemplary embodiment, the thickness d2 of the first single-sided adhesive layer 63 can be about 0.04mm to 0.06mm. For example, the thickness d2 of the first single-sided adhesive layer 63 can be about 0.05mm. Wherein, the thickness is the dimension in the direction perpendicular to the support structure 20.

[0056] In an exemplary embodiment, the adhesion between the first release layer 62 and the adhesive layer 61 is greater than the adhesion between the support structure 20 and the adhesive layer 61. While ensuring that the first release layer 62 is bonded to the support structure 20 through the adhesive layer 61, it is convenient for the adhesive layer 61 to be separated from the support structure 20 along with the first release layer 62. The adhesive layer 61 can be a strong and weak adhesive layer, including a strong adhesive surface and a weak adhesive surface, and the viscosity of the strong adhesive surface is greater than the viscosity of the weak adhesive surface; the strong adhesive surface adheres to the first release layer 62, and the weak adhesive surface adheres to the support structure 20. The bonding strength between the adhesive layer 61 and the support structure 20 can be about 6 gf / inch to 12 gf / inch. For example, the bonding strength between the adhesive layer 61 and the support structure 20 can be about 9 gf / inch.

[0057] In an exemplary embodiment, the material of the first single-sided adhesive layer 63 can be polyethylene terephthalate (PET for short). The first single-sided adhesive layer 63 made of PET is light and soft, and will not crush the display module and the supporting structure 20 after installation, and will not cause damage to the display module and the supporting structure 20 when bonding or peeling the first single-sided adhesive layer 63. The monomer cost of the first single-sided adhesive layer 63 made of PET is relatively low. The manufacturing process of the first single-sided adhesive layer 63 can be a die-cutting process, which is to cut the first single-sided adhesive layer 63 on a PET film with a cutter. The cost of the cutter mold is also relatively low, and the mold opening time is very short.

[0058] In an exemplary embodiment, Figure 4 As shown, the first single-sided adhesive layer 63 includes a plurality of first single-sided adhesive patterns 631. The first release layer 62 includes a plurality of protective members 621, which are spliced ​​on a plane parallel to the support structure 20 to form the first release layer 62. In this way, the plurality of protective members 621 can be peeled off from the support structure 20 respectively, reducing the peeling resistance and facilitating the separation of the protective members 621 from the support structure 20.

[0059] The orthographic projection of each protective member 621 on the support structure 20 overlaps with the orthographic projection of at least one first single-sided adhesive pattern 631 on the support structure 20. In this way, when a protective member 621 is peeled off from the support structure 20, at least one first single-sided adhesive pattern 631 can be driven to be peeled off from the support structure 20, and another or more protective members 621 can be lifted up by the at least one first single-sided adhesive pattern 631 until they are peeled off from the support structure 20, so that multiple protective members 621 can be connected as a whole through multiple first single-sided adhesive patterns 631, ensuring that multiple protective members 621 can be peeled off from the support structure 20 one by one.

[0060] The inventors of the present disclosure have also found that during the production process of the support structure 20, the copper foil 70 is attached. During the attachment process, the release film 80 attached to the copper foil 70 will contact the surface of the support structure 20. Figure 3 The above design brings the following problems: During the production process of the support structure 20 , the release film 80 will be pressed onto the surface of the support structure 20 . Due to the short duration, a small amount of silicon and fluorine on the release film 80 will be transferred to the surface of the support structure 20 after being pressed into contact with the surface of the support structure 20 .

[0061] In the exemplary embodiment, please combine Figure 4 , Figure 6 , Figure 8 and Figures 10 to 13 The support structure 20 includes a support layer 21 and a metal layer 22. The plurality of bonding regions and the metal layer 22 are respectively located on both sides of the support layer 21. The metal layer 22 includes a metal pattern 221 and a second release layer 222. The metal pattern 221 is disposed on a side of the support layer 21 away from the plurality of bonding regions.

[0062] The second release layer 222 is disposed on the side of the metal pattern 221 away from the support layer 21, and the second release layer 222 is provided with a plurality of second bonding patterns 2221, and the plurality of second bonding patterns 2221 are configured to bond with the metal layer 22. The orthographic projections of the plurality of second bonding patterns 2221 on the support layer 21 cover the orthographic projections of the metal pattern 221 on the support layer 21, so as to ensure the bonding stability between the second release layer 222 and the metal layer 22.

[0063] The orthographic projections of the plurality of bonding areas and the plurality of second bonding patterns 2221 on the support layer 21 do not overlap. This can prevent the silicon and fluorine elements contained in the second release layer 222 from being transferred to the plurality of bonding areas during the process of attaching the metal pattern 221 to the support structure 20, thereby deteriorating the bonding performance of the support structure 20 with the middle frame 30 and causing it to fall off from the middle frame 30, so that the silicon and fluorine elements in the plurality of bonding areas can be kept at a low content, thereby making the dyne values ​​of the plurality of bonding areas higher and the water drop angle smaller, thereby improving the bonding performance with the middle frame 30.

[0064] After the metal layer 22 is disposed on the support layer 21 , the second release layer 222 is peeled off, so that the first release layer 62 is subsequently bonded to the support structure 20 through the adhesive layer 61 to form a support module.

[0065] In an exemplary embodiment, Fig.10 and Fig.11 As shown, the second release layer 222 is provided with a plurality of second hollow patterns 200 , and the second hollow patterns 200 penetrate the second release layer 222 along a direction perpendicular to the support layer 21 .

[0066] The orthographic projections of the multiple second hollow patterns 200 on the support layer 21 cover the orthographic projections of the multiple bonding areas on the support layer 21 one by one. That is, the orthographic projections of the multiple second hollow patterns 200 on the support layer 21 can correspond one by one to the orthographic projections of the multiple bonding areas on the support layer 21, and completely overlap. Alternatively, the orthographic projections of the multiple bonding areas on the support layer 21 can correspond one by one to the range of the orthographic projections of the multiple second hollow patterns 200 on the support layer 21. In this way, by setting up the multiple second hollow patterns 200, the second release layer 222 is partially missing, and in the process of attaching the metal pattern 221 to the support structure 20, the second release layer 222 is prevented from contacting the side of the support structure 20 away from the multiple bonding areas, thereby preventing the silicon element and the fluorine element contained in the second release layer 222 from being transferred to the multiple bonding areas, thereby deteriorating the bonding performance of the support structure 20 and the middle frame 30.

[0067] In an exemplary embodiment, Fig.12 and Fig.13 As shown, a second single-sided adhesive layer 90 is provided on the side of the second release layer 222 facing the support layer 21, and the bonding surface of the second single-sided adhesive layer 90 is bonded to the second release layer 222, and the orthographic projection of the second single-sided adhesive layer 90 on the support layer 21 covers the orthographic projections of multiple bonding areas on the support layer 21. That is, the orthographic projection of the second single-sided adhesive layer 90 on the support layer 21 can completely overlap with the orthographic projections of multiple bonding areas on the support layer 21. Alternatively, the orthographic projections of multiple bonding areas on the support layer 21 can be located within the range of the orthographic projection of the second single-sided adhesive layer 90 on the support layer 21. In this way, by providing the second single-sided adhesive layer 90, it is possible to prevent the silicon element and the fluorine element contained in the second release layer 222 from being transferred to multiple bonding areas, thereby deteriorating the bonding performance of the support structure 20 and the middle frame 30. The bonding surface of the second single-sided adhesive layer 90 is bonded to the second release layer 222, so that when the second release layer 222 is peeled off from the support structure 20, the second single-sided adhesive layer 90 can be peeled off from the support structure 20 together with the second release layer 222, so that one peeling action can simultaneously peel the second release layer 222 and the second single-sided adhesive layer 90 from the support structure 20, which facilitates the subsequent bonding of the first release layer 62 to the support structure 20 through the adhesive layer 61 to form a support module.

[0068] In an exemplary embodiment, the material of the second release layer 222 can be polyethylene terephthalate (PET for short). The second release layer 222 made of PET is light and soft, and will not crush the support structure 20 after installation, and will not cause damage to the support structure 20 when bonding or peeling the second release layer 222. The monomer cost of the second release layer 222 made of PET is relatively low. The manufacturing process of the second release layer 222 can be a die-cutting process, which is to cut the second release layer 222 on a PET film with a cutter. The cost of the cutter mold is also relatively low, and the mold opening time is very short.

[0069] In an exemplary embodiment, the thickness d4 of the second release layer 222 may be approximately 0.065 mm to 0.085 mm. The thickness d4 of the second release layer 222 may be approximately 0.075 mm. The thickness is a dimension in a direction perpendicular to the support structure 20.

[0070] In an exemplary embodiment, the material of the second single-sided adhesive layer 90 may be polyethylene terephthalate (PET for short). The second single-sided adhesive layer 90 made of PET is light and soft, and will not crush the support structure 20 etc. after installation, and will not cause damage to the support structure 20 etc. when bonding or peeling the second single-sided adhesive layer 90. The monomer cost of the second single-sided adhesive layer 90 made of PET is relatively low. The manufacturing process of the second single-sided adhesive layer 90 may be a die-cutting process, which is to cut the second single-sided adhesive layer 90 on a PET film with a cutter. The cost of the cutter mold is also relatively low, and the mold opening time is very short.

[0071] In an exemplary embodiment, the thickness d5 of the second single-sided adhesive layer 90 may be approximately 0.015 mm to 0.035 mm. The thickness d5 of the second single-sided adhesive layer 90 may be approximately 0.025 mm. The thickness is the dimension in the direction perpendicular to the support structure 20.

[0072] In an exemplary embodiment, the metal pattern 221 may be a copper foil pattern. The thickness d6 of the metal pattern 221 may be about 0.02 mm to 0.04 mm. For example, the thickness d6 of the metal pattern 221 may be about 0.03 mm.

[0073] In an exemplary embodiment, Figure 4As shown, the support layer 21 has a non-bending area A1 and a bending area A2. The orthographic projection of the metal pattern 221 on the support layer 21 is located in the non-bending area A1. In this way, the metal pattern 221 can be prevented from hindering the bending of the bending area A2, so that the support structure 20 can be folded together with the display module bonded thereto to obtain a foldable display device. A part of the orthographic projections of the multiple bonding areas on the support layer 21 are located in the bending area A2, and the other part is located in the non-bending area A1, so as to ensure the bonding stability between the bending area A2 and the non-bending area A1 and the middle frame 30. It can be understood that in other embodiments, the positions of the multiple bonding areas on the support layer 21 can also be arranged according to needs to meet the bonding requirements of the support structure 20 and the middle frame 30.

[0074] In an exemplary embodiment, please continue to refer to Figure 4 A plurality of protective members 621 are spliced ​​in a plane parallel to the support structure 20 and in a direction perpendicular to the bending area A2 to form a first release layer 62. The orthographic projection of one of the protective members 621 on the support layer 21 covers the bending area A2 and overlaps with the non-bending areas A1 on both sides of the bending area A2.

[0075] In an exemplary embodiment, please continue to refer to Figure 4 , the orthographic projection of at least one first bonding pattern 611 on the supporting layer 21 overlaps both the bending area A2 and the non-bending area A1.

[0076] In an exemplary embodiment, please continue to refer to Figure 4 The orthographic projection of each bonding area on the supporting layer 21 is only located in one of the bending area A2 and the non-bending area A1.

[0077] In an exemplary embodiment, please continue to refer to Figure 4 The orthographic projection of each first single-sided adhesive pattern 631 on the supporting layer 21 is only located in one of the bending area A2 and the non-bending area A1.

[0078] In an exemplary embodiment, please continue to refer to Figure 4 , the number of non-bending regions A1 is two, and the two non-bending regions A1 are located on both sides of the bending region A2. The number of metal patterns 221 is two, and they are arranged one by one in the two non-bending regions A1. The metal pattern 221 is C-shaped in a plane parallel to the support structure 20, and the mouth of the C-shaped metal pattern 221 faces the bending region A2. It can be understood that in other embodiments, the support layer 21 can also have multiple bending regions A2. Correspondingly, the support layer 21 can also have multiple non-bending regions A1.

[0079] In the exemplary embodiment, please combine Figures 10 to 13There are two second hollow patterns 200, wherein the orthographic projection of one second hollow pattern 200 on the support layer 21 covers the bending area A2 and overlaps with the non-bending areas A1 on both sides of the bending area A2. The orthographic projection of another second hollow pattern 200 on the support layer 21 is located in one of the non-bending areas A1.

[0080] The second single-sided adhesive layer 90 includes two second single-sided adhesive patterns 91. The orthographic projection of one of the second single-sided adhesive patterns 91 on the support layer 21 covers the bending area A2 and overlaps with the non-bending areas A1 on both sides of the bending area A2. The orthographic projection of the other second single-sided adhesive pattern 91 on the support layer 21 is located in one of the non-bending areas A1.

[0081] In an exemplary embodiment, a portion of the support layer 21 may have an etching pattern to make the portion bendable to form a bending area A2 and determine the bending shape of the display device. The support layer 21 is generally assembled by bonding materials such as stainless steel (SUS) / titanium alloy / carbon fiber, pressure-sensitive adhesive, and optical tape.

[0082] like Fig.14 As shown, the embodiment of the present disclosure also discloses a method for preparing a support module, which may include: S110 , providing a support structure 20 .

[0083] One side of the support structure 20 has a plurality of bonding areas, and the plurality of bonding areas are configured to bond with the middle frame 30; and S120 , disposing an adhesive layer 61 on the other side of the support structure 20 , and disposing a first release layer 62 on the side of the adhesive layer 61 facing away from the support structure 20 .

[0084] The bonding layer 61 includes a plurality of first bonding patterns 611, and the plurality of first bonding patterns 611 are configured to bond with the first release layer 62. The orthographic projections of the plurality of bonding regions and the plurality of first bonding patterns 611 on the support structure 20 do not overlap.

[0085] In an exemplary embodiment, providing the support structure 20 may include: A support layer 21 and a metal layer 22 are provided, wherein a plurality of bonding regions and the metal layer 22 are respectively arranged on both sides of the support layer 21, the metal layer 22 comprises a metal pattern 221 and a second release layer 222, the metal pattern 221 is arranged on a side of the support layer 21 away from the plurality of bonding regions, the second release layer 222 is arranged on a side of the metal pattern 221 away from the support layer 21, the second release layer 222 is provided with a plurality of second bonding patterns 2221, the plurality of second bonding patterns 2221 are arranged to bond with the metal layer 22, the orthographic projections of the plurality of second bonding patterns 2221 on the support layer 21 cover the orthographic projections of the metal pattern 221 on the support layer 21, and the orthographic projections of the plurality of bonding regions and the plurality of second bonding patterns 2221 on the support layer 21 do not overlap; The second release layer 222 is peeled off, leaving only the metal pattern 221 disposed on the support layer 21 .

[0086] like Fig.15 As shown, the embodiment of the present disclosure also discloses a method for preparing a display device, which may include: S210, providing a display module; S220, providing a support module; S230, peeling off the adhesive layer 61 and the first release layer 62 in the supporting module; S240, attaching the side of the support structure 20 in the support module away from the plurality of bonding areas to the display module; and S250 , attaching a plurality of adhesive regions to the middle frame 30 .

[0087] In an exemplary embodiment, the display device prepared in the embodiment of the present disclosure can be any product or component with a display function, such as a flexible foldable (organic light emitting diode, OLED) display device, a foldable mobile phone, and a foldable laptop computer.

[0088] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present disclosure. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present disclosure.

Claims

1. A support module, characterized in that: It includes a supporting structure, an adhesive layer and a first release layer; One side of the support structure has a plurality of bonding areas, the plurality of bonding areas are configured to bond with the middle frame, the first release layer is bonded to the other side of the support structure through the bonding layer, and the orthographic projection of the first release layer on the support structure covers the support structure; The bonding layer includes a plurality of first bonding patterns, and the plurality of first bonding patterns are configured to bond with the first release layer; Orthographic projections of the plurality of bonding areas and the plurality of first bonding patterns on the support structure do not overlap.

2. The support module according to claim 1, characterized in that: A first single-sided adhesive layer is provided on a side of the first release layer facing the support structure, and an orthographic projection of the first single-sided adhesive layer on the support structure covers an orthographic projection of the plurality of bonding areas on the support structure; The bonding surface of the first single-sided adhesive layer is bonded to the first release layer.

3. The support module according to claim 2, characterized in that: The first single-sided adhesive layer is disposed on the bonding layer at a side facing away from the first release layer.

4. The support module according to claim 2, characterized in that: The bonding layer is provided with a plurality of first hollow patterns, and the first hollow patterns penetrate the bonding layer in a direction perpendicular to the supporting structure; The orthographic projections of the plurality of first hollow patterns on the support structure cover the orthographic projections of the plurality of bonding areas on the support structure in a one-to-one correspondence; The first single-sided adhesive layer is filled in the plurality of first hollow patterns and is connected to the supporting structure.

5. The supporting module according to claim 4, characterized in that: The thickness of the bonding layer is consistent with that of the first single-sided adhesive layer.

6. The supporting module according to claim 2, characterized in that: The first single-sided adhesive layer includes a plurality of first single-sided adhesive patterns; The first release layer includes a plurality of protective members, and the plurality of protective members are spliced ​​on a plane parallel to the support structure to form the first release layer; The orthographic projection of each of the protective members on the supporting structure overlaps with at least one orthographic projection of the first single-sided adhesive pattern on the supporting structure.

7. The support module according to any one of claims 1 to 6, characterized in that: The support structure comprises a support layer and a metal layer; The plurality of bonding areas and the metal layer are respectively located on two sides of the support layer; The metal layer includes a metal pattern and a second release layer; The metal pattern is disposed on a side of the support layer away from the plurality of bonding areas; The second release layer is arranged on a side of the metal pattern away from the support layer, the second release layer is provided with a plurality of second bonding patterns, and the plurality of second bonding patterns are arranged to bond with the metal layer; The orthographic projections of the plurality of second bonding patterns on the support layer cover the orthographic projections of the metal pattern on the support layer, and the orthographic projections of the plurality of bonding areas and the plurality of second bonding patterns on the support layer do not overlap; After the metal layer is disposed on the support layer, the second release layer is peeled off.

8. The supporting module according to claim 7, characterized in that: The second release layer is provided with a plurality of second hollow patterns, and the second hollow patterns penetrate the second release layer in a direction perpendicular to the support layer; The orthographic projections of the plurality of second hollow patterns on the support layer cover the orthographic projections of the plurality of bonding areas on the support layer in a one-to-one correspondence.

9. The supporting module according to claim 7, characterized in that: A second single-sided adhesive layer is provided on the side of the second release layer facing the support layer, and the bonding surface of the second single-sided adhesive layer is bonded to the second release layer, and the orthographic projection of the second single-sided adhesive layer on the support layer covers the orthographic projections of the multiple bonding areas on the support layer.

10. The supporting module according to claim 7, characterized in that: The adhesion between the first release layer and the adhesive layer is greater than the adhesion between the support structure and the adhesive layer.

11. The support module according to claim 10, characterized in that: The bonding strength between the bonding layer and the supporting structure is 6 gf / inch to 12 gf / inch.

12. The support module according to claim 7, characterized in that: The support layer has a non-bending area and a bending area; The orthographic projection of the metal pattern on the support layer is located in the non-bending area; A portion of the orthographic projections of the plurality of bonding regions on the support layer are located in the bending region, and another portion are located in the non-bending region.

13. A method for preparing a support module, characterized in that: include: Providing a support structure, wherein one side of the support structure has a plurality of bonding areas, and the plurality of bonding areas are configured to be bonded to the middle frame; and A bonding layer is disposed on the other side of the support structure, and a first release layer is disposed on the side of the bonding layer facing away from the support structure; The bonding layer includes a plurality of first bonding patterns, and the plurality of first bonding patterns are configured to bond with the first release layer; Orthographic projections of the plurality of bonding areas and the plurality of first bonding patterns on the support structure do not overlap.

14. The method for preparing a supporting module according to claim 13, characterized in that: Providing a support structure comprises: Providing a support layer and a metal layer, the plurality of bonding areas and the metal layer are respectively arranged on both sides of the support layer, the metal layer comprises a metal pattern and a second release layer, the metal pattern is arranged on a side of the support layer away from the plurality of bonding areas, the second release layer is arranged on a side of the metal pattern away from the support layer, the second release layer is provided with a plurality of second bonding patterns, the plurality of second bonding patterns are arranged to bond with the metal layer, the orthographic projections of the plurality of second bonding patterns on the support layer cover the orthographic projections of the metal pattern on the support layer, and the orthographic projections of the plurality of bonding areas and the plurality of second bonding patterns on the support layer do not overlap; The second release layer is peeled off.

15. A method for preparing a display device, characterized in that: include: Providing a display module; Providing a support module according to any one of claims 1 to 12; Peeling off the adhesive layer and the first release layer in the supporting module; Attaching a side of the support structure in the support module away from the plurality of bonding areas to the display module; and The plurality of adhesive areas are attached to the middle frame.

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