AOI imaging system, AOI detection device and AOI detection equipment

By using a detection solution of a single projection module in the center and multiple 3D imaging modules on the side in the 3D AOI device, combined with the texture information acquisition of the 2D imaging module, the problems of low detection efficiency of existing equipment and limited detection effects on specific objects are solved, and more efficient and accurate detection effects are achieved.

CN119803351APending Publication Date: 2025-04-11GUANGZHOU LEICHEN INTELLIGENT EQUIP TECH CO LTD
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Patent Information

Application Number
CN202311305174.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-10-09
Publication Date
2025-04-11

AI Technical Summary

Technical Problem

The existing 3D AOI equipment requires imaging modules of 4 projectors to image, resulting in low detection efficiency and limited detection effects on multiple reflections, low reflectivity and high devices.

Method used

The detection scheme of a single projection module in the center and multiple 3D imaging modules on the side is adopted. The structured light stripe image is generated through the projection module, and the modulated image is collected by the 3D imaging module. At the same time, the 2D imaging module collects the texture information of the object to be measured through an external light source to achieve the acquisition of multi-angle image information.

Benefits of technology

The detection effect and efficiency are improved, especially in the detection scenarios of multiple reflection, low reflectance and high inverse devices, which significantly improves the detection effect and efficiency of the system.

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Abstract

The invention discloses an AOI imaging system, an AOI detection device and AOI detection equipment, and the system comprises a projection module which is used for generating a structured light stripe image; the 2D imaging module comprises a main lens, is arranged perpendicular to the to-be-measured object, receives light beams reflected by the to-be-measured object due to illumination of an external light source, projects the reflected light beams to the 2D imaging module, and collects texture information and partial height information of the to-be-measured object; the main lens is connected with the projection module so as to project a structured light stripe image to the surface of an object to be detected; and a plurality of 3D imaging modules which are arranged in a central symmetry manner by taking the main lens as the center and are used for collecting structured light stripe images generated by the projection module and modulated by the object to be measured. The to-be-detected object can be detected through the 3D imaging module and the 2D imaging module at the same time, meanwhile, the scheme that the single projection module in the center is matched with the multiple 3D imaging modules on the side face is adopted, and the detection effect and the detection efficiency of the system can be improved.
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Description

Technical Field

[0001] The present invention relates to the field of automatic optical inspection technology, and in particular to an AOI imaging system, an AOI inspection device and an AOI inspection equipment. Background Art

[0002] The 3D AOI equipment used in SMT technology is a complex system involving many fields such as optics, mechanics, electricity, and computing. One of the solutions used by 3D AOI equipment is to project a series of structured light stripes by a projection optical machine, and then the AOI imaging system collects the stripe pattern modulated by the object to be tested, and calculates the three-dimensional contour of the object to be tested through algorithm calculation to complete the test. In the related technology, the existing equipment is to set an imaging module in the center, and then match it with 4 projection optical machines on the side to form a complete detection system. However, since the light stripe information projected by the 4 projection optical machines all needs to be imaged by the imaging module, the detection efficiency of the detection equipment using the above method is low. Summary of the invention

[0003] One purpose of an embodiment of the present invention is to provide an AOI imaging system, an AOI detection device and an AOI detection equipment, which can not only detect the object to be detected through a 3D imaging module and a 2D imaging module at the same time, but also adopt a detection scheme of a single central projection module with multiple 3D imaging modules on the side, which is beneficial to improve the detection effect and detection efficiency of the system.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] On the one hand, an AOI imaging system is provided for detecting an object to be tested, comprising:

[0006] A projection module, used for generating a structured light stripe image;

[0007] The 2D imaging module includes a main lens, which is arranged perpendicular to the object to be tested, receives a light beam reflected by the object to be tested due to being illuminated by an external light source, and projects the reflected light beam to the 2D imaging module to collect texture information and partial height information of the object to be tested;

[0008] The main lens is connected to the projection module to project the structured light stripe image onto the surface of the object to be measured;

[0009] A plurality of 3D imaging modules are arranged centrally and symmetrically with the main lens as the center, and are used to collect the structured light fringe image generated by the projection module and modulated by the object to be measured.

[0010] Optionally, the lens optical axis of the 3D imaging module is arranged at an angle to the optical axis of the main lens.

[0011] Optionally, the 2D imaging module also includes a main camera, and the projection module is located on the side of the main camera.

[0012] Optionally, the main lens includes a beam splitter prism, a shared front objective lens and an imaging rear objective lens;

[0013] The common front objective lens and the imaging rear objective lens are respectively arranged on two sides of the beam splitter prism;

[0014] The main lens projects the structured light fringe image onto the surface of the object to be measured through the beam splitter prism and the common front objective lens in sequence;

[0015] The main lens projects the light beam reflected by the object to be measured due to being illuminated by the external light source to the 2D imaging module through the common front group objective lens, the beam splitter prism and the imaging rear group objective lens in sequence.

[0016] Optionally, the common front group objective lens, the beam splitter prism and the imaging rear group objective lens are located on the same straight line;

[0017] The projection module includes a projection objective lens;

[0018] The projection objective lens is arranged on one side of the beam splitter prism, and a line connecting the projection objective lens and the beam splitter prism and a line connecting the common front objective lens group and the imaging rear objective lens group form an angle;

[0019] A gradient transmittance film is provided on one side of the beam splitter prism close to the imaging rear group objective lens.

[0020] Optionally, each of the 3D imaging modules includes a 3D camera and a 3D lens, wherein a light output end of the 3D lens is arranged at the 3D camera, and a light input end of the 3D lens faces the object to be measured;

[0021] The 3D lens is a Sham lens.

[0022] Optionally, an auxiliary light source is further included, and the auxiliary light source is arranged below the 2D imaging module, and the auxiliary light source is composed of a combination of multiple layers of RGB light sources and white light.

[0023] Optionally, the 3D imaging module can obtain height information of the object to be measured, and the 2D imaging module can obtain partial height information of the object to be measured;

[0024] The height information of the object to be tested obtained by the 3D imaging module is integrated with the partial height information of the object to be tested obtained by the 2D imaging module to improve the stability of the AOI imaging system test.

[0025] On the other hand, an AOI detection device is provided, comprising a processor and the AOI imaging system as described above, wherein the processor is communicatively connected with the AOI imaging system and is used to send a control signal to the AOI imaging system, and receive and process a signal fed back by the AOI imaging system;

[0026] The processor calculates the three-dimensional shape of the object to be tested by comparing the changes in the stripe pattern in the presence or absence of the object to be tested.

[0027] On the other hand, an AOI inspection device is provided, comprising a transmission mechanism and the AOI inspection device as described above, wherein the AOI inspection device is arranged on the transmission mechanism.

[0028] The beneficial effects of the present invention are as follows: on the one hand, a structured light fringe image is generated by a projection module, and the structured light fringe image is projected onto the surface of the object to be tested through a main lens, and then a 3D imaging module collects the structured light fringe image generated by the projection module and modulated by the object to be tested; on the other hand, the object to be tested is illuminated by an external light source, and a light beam reflected from the surface of the object to be tested is projected onto the 2D imaging module through a main lens, so that the 2D imaging module collects texture information of the object to be tested. In this way, not only can the object to be tested be tested and detected by the 3D imaging module and the 2D imaging module at the same time, which is beneficial to improving the detection effect of the system, but also a detection scheme of a single central projection module and four side 3D imaging modules is adopted, which greatly improves the detection effect of multiple reflections, low reflectivity objects and high reflectivity devices, thereby further improving the detection effect and detection efficiency of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0030] Figure 1 A schematic diagram of the three-dimensional structure of an AOI imaging system provided by an embodiment of the present invention;

[0031] Figure 2 A front view of an AOI imaging system provided by an embodiment of the present invention;

[0032] Figure 3 An imaging schematic diagram of multiple 3D imaging modules of an AOI imaging system provided by an embodiment of the present invention;

[0033] Figure 4 A bottom view of an AOI imaging system provided by an embodiment of the present invention;

[0034] Figure 5 A schematic diagram of the working state of a beam splitter prism of an AOI imaging system provided by an embodiment of the present invention;

[0035] Figure 6This is a schematic diagram of the structures of a projection module, a 2D imaging module and a 3D imaging module provided in an embodiment of the present invention.

[0036] In the figure: 100, projection module; 110, projection objective lens; 200, main lens; 210, dichroic prism; 211, gradient transmittance film; 220, shared front group objective lens; 230, imaging rear group objective lens; 300, 2D imaging module; 310, main camera; 400, 3D imaging module; 410, 3D camera; 420, 3D lens. DETAILED DESCRIPTION

[0037] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0038] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0040] AOI (Automated Optical Inspection) is the Chinese full name of automatic optical inspection, which is a device based on optical principles to detect common defects encountered in welding production. AOI is a new test technology that has just emerged, but it has developed rapidly, and many manufacturers have launched AOI test equipment. During automatic inspection, the machine automatically scans the PCB through a camera, collects images, compares the tested solder joints with the qualified parameters in the database, and checks the defects on the PCB through image processing, and displays / marks the defects through a display or automatic mark for maintenance personnel to repair.

[0041] The 3D AOI equipment used in SMT technology is a complex system involving many fields such as optics, mechanics, electricity, and computing. One of the solutions used by 3D AOI equipment is to project a series of structured light stripes by a projection optical machine, and then the AOI imaging system collects the stripe pattern modulated by the object to be tested, and calculates the three-dimensional contour of the object to be tested through algorithm calculation to complete the test. In the related technology, the existing equipment is to set an imaging module in the center, and then match it with 4 projection optical machines on the side to form a complete detection system. However, since the light stripe information projected by the 4 projection optical machines all need to be imaged by the imaging module, the detection equipment using the above method not only has low detection efficiency, but also has limited processing methods for multiple reflections, low reflectivity and high devices.

[0042] Based on the above situation, the embodiment of the present invention provides an AOI imaging system reference Figure 1-6 As shown, it includes a projection module 100 for generating a structured light stripe image, a main lens 200 capable of projecting the structured light stripe image generated by the projection module 100 onto the surface of the object to be measured, a main camera 310 capable of acquiring an image through the main lens 200, and a plurality of side imaging modules located around the main lens 200, wherein the main lens 200 is arranged in a direction in which the optical path direction is perpendicular to the plane where the object to be measured is located, and the main lens 200 participates in the operation of both the projection module 100 and the main camera 310. During the projection process of the projection module 100, the main lens 200 is connected to the projection module 100 to project the structured light stripes onto the surface of the object to be measured, and during the process in which the main camera 310 acquires an image, the main camera 310 uses part of the optical path of the main lens 200 for imaging to obtain the texture information of the object to be measured in a vertical manner.

[0043] During the working process, a structured light stripe image is generated by the projection module 100 and projected onto the surface of the object to be measured in a vertical direction through the main lens 200. The main camera 310 obtains the texture information of the structured light stripes reflected by the object to be measured, and the side imaging module collects the stripes modulated by the object to be measured from the side to image and collect an image with the height information of the object to be measured. The structured light stripe texture information obtained by the main camera 310 and the image with the height information of the object to be measured collected by the side imaging module are fused into one image through an algorithm to obtain the three-dimensional contour of the object to be measured.

[0044] In this solution, by setting up the main camera 310 and the side imaging module for imaging, multi-angle image information can be obtained simultaneously without moving the imaging module, thereby reducing the complexity of the motion mechanism of the AOI imaging system and improving the test efficiency of the AOI imaging system.

[0045] At the same time, the main camera 310 used in this solution can not only collect texture information of the object to be tested in the vertical direction, but also obtain partial height information of the object to be tested to a certain extent. By fusing the height information obtained by the main camera 310 with the height information obtained by the side imaging module, the stability of the system test can be further improved.

[0046] It can be understood that the main camera 310 described in the embodiment of the present application can obtain partial height information of the object to be measured. This means that when used in conjunction with an external light source, different lighting angles will lead to different degrees of reflection on the surface of the object to be measured. This difference is particularly obvious at the tin creeping position. Therefore, in this case, the height information of the object to be measured can be obtained to a certain extent through the main camera 310 according to the different degrees of reflection, so as to be integrated with the information obtained by the side imaging module to improve the stability of the system test.

[0047] See also Figure 1 to Figure 6 In a further optional embodiment of the present application, the AOI imaging system includes a projection module 100, a main lens 200, a main camera 310 which together with the main lens 200 constitutes a 2D imaging module 300, and a plurality of 3D imaging modules 400: the projection module 100 is used to generate a structured light stripe image; the projection module 100 and the 2D imaging module 300 share the main lens 200, and the main lens 200 is connected to the projection module 100 to project the structured light stripe image onto the surface of the object to be measured; a plurality of side imaging modules serving as the 3D imaging module 400 are centrally symmetrical with the main lens 200 as the center, and are used to collect the structured light stripe image generated by the projection module 100 and modulated by the object to be measured; the 2D imaging module 300 is connected to the main lens 200; the main lens 200 receives the light beam reflected by the object to be measured due to being illuminated by an external light source, and projects the reflected light beam to the 2D imaging module 300, so that the 2D imaging module 300 collects the texture information of the object to be measured.

[0048] It should be noted that the object to be tested can be an electronic product such as a PCB board or a display. The AOI imaging system can perform quality control on local details such as surface mount components, plug-in devices, welding points, and screws on the surface of the product during the production and assembly of the electronic product such as a PCB board or a display. The projection module 100 includes a projection optical machine, which can generate different coded stripes and project them onto the surface of the object to be tested. In one embodiment, please refer to Figure 1-Figure 4 , the number of 3D imaging modules 400 is four. The use of four 3D imaging modules 400 can ensure the detection effect while relatively greatly reducing the number of 3D imaging modules 400 to reduce the cost of the entire device. In other embodiments, the number of 3D imaging modules 400 can be two, three, five, six or other numbers. The specific number of 3D imaging modules 400 can be selected according to actual needs.

[0049] During the detection, the present invention generates a structured light stripe image through the projection module 100, and projects the structured light stripe image onto the surface of the object to be tested through the main lens 200, and then the 3D imaging module 400 collects the structured light stripe image generated by the projection module 100 and modulated by the object to be tested. On the other hand, by illuminating the object to be tested with the help of an external light source, the light beam reflected by the surface of the object to be tested is projected to the 2D imaging module 300 through the main lens 200, so that the 2D imaging module 300 can collect the texture information of the object to be tested. In this way, not only can the object to be tested be tested by the 3D imaging module 400 and the 2D imaging module 300 at the same time, which is conducive to improving the detection effect of the system, but also adopts a detection scheme of a single central projection module 100 with four 3D imaging modules 400 on the side, which greatly improves the detection effect of multiple reflections, low reflectivity objects and high reflectivity devices, thereby further improving the detection effect and detection efficiency of the system. In addition, when the AOI imaging system is applied to a production line, it can have a higher detection speed, which greatly improves the production efficiency of the production line.

[0050] Specifically, compared with the traditional solution of one imaging module and four projection optical machines, the AOI imaging system in this application is more efficient, and can avoid the problem of multiple reflections caused by simultaneous projection of multiple projection optical machines, and avoid overexposure that affects the image acquisition quality.

[0051] In addition, since the multi-eye structured light solution improves the projected light energy, it can produce better fringe contrast in the scenario of detecting low-reflectivity objects, thereby improving the detection effect of low-reflectivity objects.

[0052] For devices with larger sizes, traditional detection solutions require moving the object to be detected or the detection equipment in the vertical direction to achieve detection. The multi-eye structured light solution used in this solution improves the depth of field of the 3D Enjoy module. Without relative movement of the object to be detected and the detection equipment in the vertical direction, the detection can be completed in one go, thereby improving detection efficiency and quality.

[0053] See also Figure 1-Figure 4 , the lens optical axis of the 3D imaging module 400 is set at an angle to the optical axis of the main lens 200. Such a setting can ensure that each 3D imaging module 400 can collect the structured light stripe image generated by the projection module 100 and modulated by the object to be tested, while not affecting the main lens 200 from projecting the structured light stripe image onto the surface of the object to be tested, and also does not affect the main lens 200 from receiving the light beam reflected by the object to be tested due to being illuminated by the external light source, and projecting the reflected light beam to the 2D imaging module 300.

[0054] In one embodiment, the projection module 100 and the 2D imaging module 300 share the main lens 200. By sharing the main lens 200, optical paths for 3D imaging and 2D imaging can be formed respectively, which not only meets the requirement that each 3D imaging module 400 can collect the structured light stripe image generated by the projection module 100 and modulated by the object to be measured, but also meets the requirement that the 2D imaging module 300 collects the texture information of the object to be measured.

[0055] In one embodiment, see Figure 5 , 6 As shown, the main lens 200 includes a beam splitter prism 210, a shared front objective lens 220 and an imaging rear objective lens 230; the shared front objective lens 220 and the imaging rear objective lens 230 are respectively arranged on both sides of the beam splitter prism 210; the main lens 200 sequentially projects the structured light stripe image onto the surface of the object to be measured through the beam splitter prism 210 and the shared front objective lens 220; the main lens 200 sequentially projects the light beam reflected by the object to be measured due to being illuminated by the external light source onto the 2D imaging module 300 through the shared front objective lens 220, the beam splitter prism 210 and the imaging rear objective lens 230. This arrangement allows part of the optical path of the main lens 200 to be shared by the projection module 100 and the 2D imaging module 300, specifically, the beam splitter prism 210 inside the main lens 200 realizes the sharing of the two modules, as shown in FIG. Figure 5 As shown, the beam splitter prism 210 reflects the light beam emitted by the projection lens 110 into the common front objective lens 220, and the common front objective lens 220 projects the light beam onto the surface of the object to be measured, thereby participating in 3D imaging. The object to be measured is illuminated by an external light source, and the light beam reflected by the surface of the object to be measured enters the common front objective lens 220, passes through the beam splitter prism 210, and enters the imaging rear objective lens 230, and then the image is captured by the camera of the 2D imaging module 300, thereby completing the acquisition of the 2D image.

[0056] Please note that Figure 5 The projection lens 110, the beam splitter prism 210, and the shared front lens 220 together constitute the path for the projection module 100 to project the structured light stripe image onto the surface of the object to be measured through the main lens 200, that is, Figure 5 The black arrow path in the figure; the shared front objective lens 220, the beam splitter prism 210, and the imaging rear objective lens 230 together constitute the path for the 2D projection module 100 to obtain the texture information of the object to be measured, that is, Figure 5 White arrow path in the.

[0057] Please continue reading Figure 5 , the shared front objective lens 220, the beam splitter prism 210 and the imaging rear objective lens 230 are located on the same straight line. This arrangement allows the 2D imaging module 300 to use part of the optical path of the main lens 200 for imaging, so that the 2D imaging module 300 can obtain the texture information of the object to be measured in a vertical manner, which is conducive to reducing image distortion.

[0058] Please continue reading Figure 5 , the projection module 100 includes a projection lens 110; the projection lens 110 is disposed on one side of the beam splitter prism 210, and the line between the projection lens 110 and the beam splitter prism 210 and the line between the common front objective lens 220 and the imaging rear objective lens 230 have an angle. The projection lens 110 and the imaging rear objective lens 230 arranged in this way do not interfere with each other, which not only meets the requirement of the projection module 100 to project the structured light stripe image onto the surface of the object to be measured along the path of the projection lens 110, the beam splitter prism 210, and the common front objective lens 220, but also meets the requirement of the 2D imaging module 300 to complete the collection of the texture information of the object to be measured along the path of the common front objective lens 220, the beam splitter prism 210, and the imaging rear objective lens 230 with the help of an external light source.

[0059] As an optional implementation, the line between the projection objective lens 110 and the beam splitter prism 210 is perpendicular to the line between the shared front objective lens 220 and the imaging rear objective lens 230. This arrangement allows a relatively short light-guiding distance between the projection objective lens 110 and the beam splitter prism 210 without changing the distance between the main lens 200 and the projection module 100, so that the path from the projection objective lens 110 to the beam splitter prism 210 has a better light-guiding effect, and does not affect the 2D imaging module 300 to complete the acquisition of the texture information of the object to be measured along the path of the shared front objective lens 220, the beam splitter prism 210 and the imaging rear objective lens 230.

[0060] On the premise of setting the beam splitter prism 210 and the imaging rear objective lens 230, please refer to Figure 5A gradient transmittance film 211 is provided on one side of the beam splitter prism 210 close to the imaging rear group objective lens 230. By using the gradient transmittance film 211, it is possible to achieve compensation for illumination uniformity, which is beneficial to avoid the problem of poor illumination uniformity of the beam splitter prism 210 on the imaging rear group objective lens 230 under a large field of view, and greatly improves the detection effect of the 2D imaging module 300, thereby improving the detection effect of the entire device.

[0061] It should be noted that the gradient transmittance film 211 can be coated on the surface of the beam splitter prism 210 close to the imaging rear objective lens 230, and its transmittance shows a linear change, or a certain transmittance change, so that the final overall uniformity meets the test requirements.

[0062] See also Figure 1 to Figure 3 Each 3D imaging module 400 includes a 3D camera 410 and a 3D lens 420. The light-emitting end of the 3D lens 420 is arranged at the 3D camera 410, and the light-incoming end of the 3D lens 420 faces the object to be tested. This arrangement ensures that the 3D imaging modules 400 do not interfere with each other, so that each 3D imaging module 400 can respectively collect the fringe image modulated by the object to be tested, so as to compare the fringe pattern changes with and without the object to be tested to calculate the three-dimensional morphology of the object to be tested.

[0063] As an optional implementation, the 3D lens 420 is a Sham lens. Using the Sham lens as the 3D lens 420 can improve the depth of field of the 3D camera 410, so that it can produce clear images within a larger tilt range.

[0064] It should be noted that the Sham lens creates a fixed angle of non-90° between the camera imaging chip and the lens optical axis, so that there is a fixed angle between the imaging clear surface and the lens optical axis. The structure is set to allow the lens and the camera body to deflect to a certain extent, so that the positional relationship between the three planes of imaging, lens, and measurement satisfies Sham's law, thereby obtaining a deeper depth of field, so that the 3D camera 410 located on the side can clearly image within a larger width range, a larger height range, and a larger depth of field, thereby improving the accuracy and test range of the entire imaging module. The increase in depth of field can improve the control of taller devices.

[0065] The Scheimpflug principle was proposed by Austrian Army Captain Theodor Scheimpflug in 1902. The law states that as long as the three planes of imaging, lens, and measurement intersect on the same straight line (for a non-shifted lens, the three parallel planes are assumed to intersect at infinity), it can be guaranteed that the object on the measurement plane can be imaged clearly, thus playing a role in adjusting the position of the depth of field area.

[0066] In one embodiment, an auxiliary light source is also included. The auxiliary light source can be used to illuminate the defect detection of the 2D imaging module 300 on the one hand, and can also assist the 3D imaging module 400 in detecting the position of solder paste, etc. on the other hand.

[0067] It should be noted that the auxiliary light source can be disposed below the 2D imaging module 300 and above the 3D imaging module 400 .

[0068] As an optional implementation, the auxiliary light source is composed of a combination of multiple layers of RGB light sources and white light. Compared with a monochromatic light source, the RGB light source is more accurate in recognition. Even if the position of the object and the amount of light received have changed, the ratio of the three colors remains unchanged, which is conducive to ensuring the stability of the detection. Of course, the auxiliary light source can also use other light sources, which will not be described in detail in this embodiment.

[0069] In one embodiment, the 3D imaging module 400 can obtain the height information of the object to be tested, and the 2D imaging module 300 can obtain partial height information of the object to be tested; the height information of the object to be tested obtained by the 3D imaging module 400 is integrated with the partial height information of the object to be tested obtained by the 2D imaging module 300 to improve the stability of the AOI imaging system test. The two imaging modules cooperate in practical applications as follows: the 3D imaging module 400 is used to obtain the height information of the object to be tested, and the 2D imaging module 300 uses an external light source to complete the acquisition of the texture of the object to be tested, and the algorithm integrates it into one image. In addition, the partial height information of the object to be tested can also be obtained by the 2D imaging module 300, and integrated with the height information obtained by the 3D imaging module 400, thereby further improving the stability of the system test.

[0070] An embodiment of the present invention further provides an AOI detection device, including a processor and the above-mentioned AOI imaging system, wherein the processor is communicatively connected to the AOI imaging system and is used to send control signals to the AOI imaging system and receive and process signals fed back by the AOI imaging system.

[0071] Specifically, the processor calculates the three-dimensional shape of the object to be tested by comparing the changes in the stripe pattern with and without the object to be tested. The processor can also fuse the height information of the object to be tested obtained by the 3D imaging module 400 with the partial height information of the object to be tested obtained by the 2D imaging module 300 to improve the stability of the AOI imaging system test.

[0072] The embodiment of the present invention also provides an AOI detection device, including a transmission mechanism and the above-mentioned AOI detection device, wherein the AOI detection device is arranged on the transmission mechanism, and is driven by the transmission mechanism to realize movement in three-dimensional space, so as to perform comprehensive image acquisition of boards to be tested of different sizes and heights. The image acquisition efficiency and image acquisition accuracy of the AOI detection device can be improved through the AOI imaging system, and the detection efficiency and detection effect of the AOI detection device can be improved, thereby improving the detection effect and detection efficiency of the AOI detection equipment on the production line, and further improving the production efficiency of the production line.

[0073] In the description of this article, it should be understood that the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0074] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0075] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0076] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. An AOI imaging system for detecting an object to be tested, characterized in that: include: A projection module (100), used for generating a structured light stripe image; The 2D imaging module (300) comprises a main lens (200) which is arranged perpendicular to the object to be tested, receives a light beam reflected by the object to be tested due to being illuminated by an external light source, and projects the reflected light beam to the 2D imaging module (300) to collect texture information and partial height information of the object to be tested; The main lens (200) is connected to the projection module (100) to project the structured light stripe image onto the surface of the object to be measured; A plurality of 3D imaging modules (400) are arranged in a centrally symmetrical manner with the main lens (200) as the center, and are used to collect a structured light stripe image generated by the projection module (100) and modulated by the object to be measured.

2. The AOI imaging system according to claim 1, characterized in that: The lens optical axis of the 3D imaging module (400) is arranged at an angle to the optical axis of the main lens (200).

3. The AOI imaging system according to claim 1, characterized in that: The 2D imaging module (300) further comprises a main camera (310), and the projection module (100) is located on the side of the main lens (200).

4. The AOI imaging system according to claim 3, characterized in that: The main lens (200) comprises a beam splitting prism (210), a shared front objective lens (220) and an imaging rear objective lens (230); The shared front objective lens (220) and the imaging rear objective lens (230) are respectively arranged on two sides of the beam splitting prism (210); The main lens (200) projects the structured light stripe image onto the surface of the object to be measured through the beam splitting prism (210) and the shared front objective lens (220) in sequence; The main lens (200) projects a light beam reflected by the object to be measured due to being illuminated by an external light source to the 2D imaging module (300) through the common front group objective lens (220), the beam splitting prism (210), and the imaging rear group objective lens (230) in sequence.

5. The AOI imaging system according to claim 4, characterized in that: The shared front objective lens (220), the beam splitter prism (210), and the imaging rear objective lens (230) are located on the same straight line; The projection module (100) comprises a projection objective lens (110); The projection objective lens (110) is arranged on one side of the beam splitter prism (210), and a line between the projection objective lens (110) and the beam splitter prism (210) and a line between the common front group objective lens (220) and the imaging rear group objective lens (230) have an included angle; A gradient transmittance film (211) is provided on one side of the beam splitting prism (210) close to the imaging rear group objective lens (230).

6. The AOI imaging system according to claim 1, characterized in that: Each of the 3D imaging modules (400) comprises a 3D camera (410) and a 3D lens (420), wherein the light output end of the 3D lens (420) is arranged on the 3D camera (410), the light input end of the 3D lens (420) faces the object to be measured, and the 3D lens (420) is a Sham lens.

7. The AOI imaging system according to claim 1, characterized in that: It also comprises an auxiliary light source, which is arranged below the 2D imaging module (300) and is composed of a combination of multiple layers of RGB light sources and white light.

8. The AOI imaging system according to any one of claims 1 to 7, characterized in that: The 3D imaging module (400) is capable of obtaining height information of the object to be measured, and the 2D imaging module (300) is capable of obtaining partial height information of the object to be measured; The height information of the object to be tested obtained by the 3D imaging module (400) is integrated with the partial height information of the object to be tested obtained by the 2D imaging module (300) to improve the stability of the AOI imaging system test.

9. An AOI inspection device, characterized in that: The method comprises a processor and the AOI imaging system according to any one of claims 1 to 8, wherein the processor is communicatively connected with the AOI imaging system and is used to send control signals to the AOI imaging system and receive and process signals fed back by the AOI imaging system; the processor calculates the three-dimensional morphology of the object to be measured by comparing the changes in the stripe pattern in the presence or absence of the object to be measured.

10. An AOI inspection device, characterized in that: It comprises a transmission mechanism and the AOI detection device according to claim 9, wherein the AOI detection device is arranged on the transmission mechanism.

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